Susceptor including insulating structure against leakage current, and process system including the same

Abstract

According to various embodiments, a structure for processing a substrate may be provided, comprising: a susceptor body on which a substrate is placed and which includes at least one heater inside; a support structure connected to the lower part of the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure; wherein the at least one insulating structure includes at least one contact structure of an insulating material to prevent leakage of current formed in the susceptor body toward the ground, and the at least one contact structure is implemented to include a plurality of parts separated from each other.

Description

Technology Field

[0001] Various embodiments of the present invention relate to a susceptor comprising an insulating structure against leakage current, and a process system comprising the same. Background Technology

[0003] In the process of manufacturing flat panel display devices such as Liquid Crystal Displays (LCDs) and Organic Light Emitting Diodes (OLEDs), a thin film deposition process in which a specific material is deposited on a substrate such as glass to form a thin film, a photolithography process in which a selected portion of the thin film is exposed, and an etching process in which the exposed portion is removed to form a desired shape for patterning are performed repeatedly several times.

[0004] Among these, thin film deposition processes include sputtering, which forms a thin film by physical means by colliding and adsorbing raw materials onto the surface of a substrate, and chemical vapor deposition (CVD), which induces a chemical reaction on the substrate to drop and adsorb thin film particles, which are the reaction products, onto the surface of the substrate. Among the chemical vapor deposition (CVD) methods, a representative example is plasma enhanced chemical vapor deposition (PECVD), which utilizes the high energy of plasma.

[0005] Generally, electronic devices such as semiconductor devices, flat panel displays, solar cells, and light-emitting diodes are fabricated by depositing a thin film on a substrate and etching the film into a desired pattern. During this process, the substrate for fabricating electronic devices is processed in a specific high-temperature atmosphere (e.g., a vacuum environment, or a specific gas environment (e.g., nitrogen, argon)). Therefore, conventionally, substrates were processed in a process chamber under a vacuum atmosphere. Inside this chamber, a susceptor is positioned to heat the substrate to a high temperature. The problem to be solved

[0007] Conventional susceptors may be implemented to include a heater that generates heat based on the application of power (or electricity). In this case, the plasma directed toward the susceptor may be affected by the electromagnetic field formed from (or around) the heater, which may cause a problem of degraded process quality.

[0008] According to various embodiments, a susceptor including an electromagnetic field shielding structure and a process system including the same can improve process quality by reducing the magnitude of the electromagnetic field generated from the heater by forming a structure of shielding material on the susceptor body, the susceptor support structure, and the substructure. In this case, the susceptor including the electromagnetic field shielding structure and the process system including the same are designed with a structure such that shielding structures formed for each part (e.g., susceptor body, support structure, substructure) can be physically connected to each other, thereby enabling the heater to be completely shielded by the shielding structures.

[0009] In a conventional process system, a raw material injection structure functions as a first electrode, and a susceptor functions as a second electrode corresponding to the first electrode, so that plasma can be formed between the raw material injection structure and the susceptor. At this time, as the current generated in the susceptor by the formed plasma leaks to the ground connected to the susceptor, it affects the plasma, which may cause a problem of degraded process quality.

[0010] According to various embodiments, a susceptor including a leakage current insulation structure and a process system including the same may improve the quality of the process by including an insulation structure at the bottom of the susceptor that insulates the current formed in the susceptor from leaking to the ground.

[0011] In a conventional process system, a driving device may be provided to move a susceptor in an up-and-down direction. However, in large-scale processes, as the weight of the susceptor is implemented to be very large, damage to the process system may occur during up-and-down movement by the driving device, and the operational burden on the driving device may increase.

[0012] According to various embodiments, a driving device for moving a raw material injection structure and a process system including the same can improve the stability of the process system and reduce the operational burden by including a driving device to move a raw material injection structure, which is implemented to be lighter and facing the susceptor, in an up-and-down direction. means of solving the problem

[0014] According to various embodiments, a structure for processing a substrate may be provided, comprising: a susceptor body on which a substrate is placed and which includes at least one heater inside; a support structure connected to the lower part of the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure; wherein the at least one insulating structure includes at least one contact structure of an insulating material to prevent leakage of current formed in the susceptor body toward the ground, and the at least one contact structure is implemented to include a plurality of parts separated from each other.

[0015] According to various embodiments, a process system may be provided comprising: a raw material injection structure; a susceptor body on which a substrate is placed and which includes at least one heater inside; a support structure connected to the lower part of the susceptor body; a power supply electrically connected to the raw material injection structure and the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure; wherein the at least one insulating structure includes at least one contact structure of an insulating material to prevent leakage of current formed in the susceptor body toward the ground, and the at least one contact structure is implemented to include a plurality of parts separated from each other, and by the at least one insulating structure, the current formed in the susceptor body by the plasma formed between the raw material injection structure and the susceptor body by the power supply is prevented from leaking toward the ground.

[0016] The means for solving the problem according to various embodiments are not limited to the means for solving the problem described above, and unmentioned means for solving the problem will be clearly understood by those skilled in the art from this specification and the attached drawings. Effects of the invention

[0018] According to various embodiments, a susceptor including an electromagnetic field shielding structure and a process system including the same may be provided, wherein the magnitude of the electromagnetic field generated from the heater is reduced by forming a structure of shielding material on the susceptor body, the susceptor support structure, and the substructure, thereby improving the quality of the process. In this case, the susceptor including the electromagnetic field shielding structure and the process system including the same may be designed with a structure such that shielding structures formed for each part (e.g., susceptor body, support structure, substructure) can be physically connected to each other, so that the heater can be completely shielded by the shielding structures.

[0019] According to various embodiments, a susceptor including a leakage current insulation structure and a process system including the same may be provided, which improves process quality by including an insulation structure at the bottom of the susceptor to insulate the current formed in the susceptor from leaking to the ground.

[0020] According to various embodiments, a driving device for moving a raw material injection structure and a process system including the same may be provided, which improves the stability of the process system and reduces the operational burden by including a driving device for moving a raw material injection structure that is implemented to be lighter and faces a susceptor in an up-and-down direction. Brief explanation of the drawing

[0022] FIG. 1 is a block diagram of a process system according to various embodiments. FIG. 2 is a drawing for illustrating examples of process systems according to various embodiments. FIG. 3 is a drawing for illustrating an example of a shielding structure of a susceptor according to various embodiments. FIG. 4 is a drawing illustrating an example of a heater seated on the upper structure of a susceptor according to various embodiments. FIG. 5 is a cross-sectional view illustrating an example of a shielding structure formed on the upper structure of a susceptor according to various embodiments. FIG. 6 is a drawing for illustrating examples of various structures of a shielding structure according to various embodiments. FIG. 7 is a cross-sectional view illustrating an example of a shielding structure of a susceptor according to various embodiments. FIG. 8 is a drawing for illustrating an example of implementing a shielding structure of a susceptor according to various embodiments. FIG. 9 is a drawing illustrating another example for implementing a shielding structure of a susceptor according to various embodiments. FIG. 10 is a flowchart illustrating the operation of a heating device according to various embodiments. FIG. 11 is a drawing illustrating examples of a heated susceptor according to various embodiments. FIGS. 12a and 12b are cross-sectional views showing examples of insulating structures disposed on the lower part of a susceptor according to various embodiments. FIG. 12c is a cross-sectional view illustrating an example of the arrangement of an insulating structure in a susceptor according to various embodiments. FIG. 13 is a drawing for illustrating examples of flanges according to various embodiments. FIGS. 14 and 15 are drawings for illustrating examples of a first contact structure (e.g., a seal gasket) according to various embodiments. FIG. 16 is a drawing for illustrating examples of a second contact structure according to various embodiments. FIGS. 17a to 17d are cross-sectional views showing examples of insulating structures disposed on the lower part of a susceptor according to various embodiments. FIG. 17e is a drawing for illustrating examples of flanges constituting a second insulating structure according to various embodiments. FIG. 18 is a drawing for illustrating an example of a driving system including at least one driving device according to various embodiments. FIGS. 19 to 20 are cross-sectional views illustrating examples of a second driving device for controlling the up-and-down movement of a raw material injection structure according to various embodiments. FIG. 21 is a flowchart illustrating examples of control operations of a driving device according to various embodiments. FIG. 22 is a cross-sectional view illustrating examples of process systems according to various embodiments. Specific details for implementing the invention

[0023] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0024] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0025] According to various embodiments, a structure for processing a substrate may be provided, comprising: a susceptor body having at least one upper shielding structure inside on which a substrate is placed; a support structure connected to the lower part of the susceptor body and having at least one lower shielding structure inside; and a heater implemented to generate heat based on the application of power, wherein the heater comprises a first heater portion included inside the susceptor body and a second heater portion included inside the support structure, and at least a part of the at least one upper shielding structure and at least a part of the at least one lower shielding structure are physically connected to each other so as to completely cover the first heater portion and the second heater portion so as not to be exposed to the outside of the at least one upper shielding structure and the at least one lower shielding structure.

[0026] According to various embodiments, a structure may be provided in which the material of the at least one upper shielding structure and the material of the at least one lower shielding structure comprise soft iron.

[0027] According to various embodiments, a structure may be provided in which the susceptor body comprises a first body and a second body coupled to the first body, the first body comprises at least one groove structure, the first heater portion is seated in the at least one groove structure, and the at least one upper shielding structure is disposed adjacent to the at least one groove structure.

[0028] According to various embodiments, the structure may be provided such that the at least one upper shielding structure comprises a first portion for covering the upper portion of the first heater portion and a plurality of second portions for covering the side portion of the first heater portion.

[0029] According to various embodiments, the second body may include a through hole, and the second heater portion extends through the through hole and extends in the direction of a heating device. The at least one upper shielding structure may be provided, the structure comprising a third portion for covering the lower part of the first heater portion, a fourth portion for covering the side of the first heater portion, and a fifth portion for covering at least a part of the side of the second heater portion.

[0030] According to various embodiments, a structure may be provided in which the fifth portion of the at least one upper shielding structure is positioned adjacent to the through hole.

[0031] According to various embodiments, a structure may be provided in which each of the plurality of second parts of the first body is physically coupled with the fourth part of the second body or the fifth part of the second body, so that the first heater part and the second heater part are completely covered so as not to be exposed to the outside of the at least one upper shielding structure and the at least one lower shielding structure.

[0032] According to various embodiments, a structure may be provided in which the fifth portion of the second body is physically connected to the at least one lower shielding structure.

[0033] According to various embodiments, a structure may be provided such that when power is applied to the heater, the strength of the electromagnetic field between the at least one upper shielding structure and the outer surface of the susceptor is lower than the strength of the electromagnetic field between the heater and the at least one upper shielding structure.

[0034] According to various embodiments, a process system may be provided comprising: a heating device; a susceptor body having at least one upper shielding structure inside on which a substrate is placed; a support structure connected to the lower part of the susceptor body and having at least one lower shielding structure inside; and a heater implemented to generate heat based on the application of power, wherein the heater comprises a first heater portion included inside the susceptor body and a second heater portion included inside the support structure, and at least a portion of the at least one upper shielding structure and at least a portion of the at least one lower shielding structure are physically connected to each other so as to completely cover the first heater portion and the second heater portion so as not to be exposed to the outside of the at least one upper shielding structure and the at least one lower shielding structure, and the heating device is implemented to apply power to the heater so as to generate heat from the heater.

[0035] According to various embodiments, a structure for processing a substrate may be provided, comprising: a susceptor body on which a substrate is placed and which includes at least one heater inside; a support structure connected to the lower part of the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure; wherein the at least one insulating structure includes at least one contact structure of an insulating material to prevent leakage of current formed in the susceptor body toward the ground, and the at least one contact structure is implemented to include a plurality of parts separated from each other.

[0036] According to various embodiments, a structure may be provided in which the insulating material comprises zirconia ceramics and / or zirconium oxide ceramics.

[0037] According to various embodiments, the at least one contact structure may be provided, comprising a first contact structure disposed along the side of the support structure and a second contact structure for supporting the first contact structure.

[0038] According to various embodiments, a structure may be provided in which the first contact structure comprises a plurality of first parts separated from each other, each of the plurality of first parts has a portion that is recessed inwardly, and when the plurality of first parts are arranged, a plurality of holes are formed based on the recessed portion.

[0039] According to various embodiments, the second contact structure may be provided as a structure comprising a plurality of second parts separated from each other.

[0040] According to various embodiments, a structure may be provided that further comprises an upper flange; and a lower flange; wherein the plurality of first portions of the first contact structure are disposed along the side of the support structure between the upper flange and the lower flange, and the plurality of second portions of the second contact structure are disposed along the side of the support structure between the first contact structure and the lower flange.

[0041] According to various embodiments, a structure may be provided in which the upper flange includes a plurality of first through holes and the lower flange includes a plurality of second through holes.

[0042] According to various embodiments, a structure may be provided in which the plurality of holes, the plurality of first through holes, and the plurality of second through holes formed by the plurality of first parts of the first contact structure are arranged at positions corresponding to each other.

[0043] According to various embodiments, a structure may be provided that further comprises an insert structure in which an insulating material is disposed; and a fastening structure in which an insulating material is disposed; wherein, with the insert structure penetrating the plurality of holes, the plurality of first through holes, and the plurality of second through holes, the upper flange, the lower flange, and the first contact structure are firmly fastened as the fastening structure is fastened.

[0044] According to various embodiments, a process system may be provided comprising: a raw material injection structure; a susceptor body on which a substrate is placed and which includes at least one heater inside; a support structure connected to the lower part of the susceptor body; a power supply electrically connected to the raw material injection structure and the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure; wherein the at least one insulating structure includes at least one contact structure of an insulating material to prevent leakage of current formed in the susceptor body toward the ground, and the at least one contact structure is implemented to include a plurality of parts separated from each other, and by the at least one insulating structure, the current formed in the susceptor body by the plasma formed between the raw material injection structure and the susceptor body by the power supply is prevented from leaking toward the ground.

[0045] According to various embodiments, a structure for processing a substrate may be provided, comprising: a raw material injection structure; a driving device for moving the raw material injection structure in an up-and-down direction; a susceptor body on which a substrate is placed and which includes at least one upper shielding structure inside; a support structure connected to the lower part of the susceptor body and which includes at least one lower shielding structure inside; and a heater implemented to generate heat based on the application of power, wherein the raw material injection structure further includes at least one coupling structure for being coupled to the substrate, and the raw material injection structure and the substrate are physically coupled to each other based on the at least one coupling structure while the raw material injection structure is in contact with the substrate by the driving device, and the substrate is implemented to be separable from the susceptor body based on the vertical movement of the raw material injection structure while the raw material injection structure and the substrate are physically coupled to each other.

[0046] According to various embodiments, a structure may be provided that further comprises a chamber; wherein the raw material injection structure is disposed inside the chamber, and the driving device is implemented to include a cylinder disposed outside the chamber, a cylinder shaft disposed inside the chamber and connected to the cylinder, and a cover structure for covering between the cylinder and the cylinder shaft.

[0047] According to various embodiments, a structure may be provided that further comprises a power supply; and wiring connected to the raw material injection structure; wherein the wiring is implemented in a flexible material so as not to be damaged during the up-and-down movement of the raw material injection structure.

[0048] According to various embodiments, a structure may be provided in which the material of the at least one upper shielding structure and the material of the at least one lower shielding structure comprise soft iron.

[0049] According to various embodiments, a structure may be provided in which the susceptor body comprises a first body and a second body coupled to the first body, the first body comprises at least one groove structure, the first heater portion is seated in the at least one groove structure, and the at least one upper shielding structure is disposed adjacent to the at least one groove structure.

[0050] According to various embodiments, the structure may be provided such that the at least one upper shielding structure comprises a first portion for covering the upper portion of the first heater portion and a plurality of second portions for covering the side portion of the first heater portion.

[0051] According to various embodiments, the second body may include a through hole, and the second heater portion extends through the through hole and extends in the direction of a heating device. The at least one upper shielding structure may be provided, the structure comprising a third portion for covering the lower part of the first heater portion, a fourth portion for covering the side of the first heater portion, and a fifth portion for covering at least a part of the side of the second heater portion.

[0052] According to various embodiments, a structure may be provided in which the fifth portion of the at least one upper shielding structure is positioned adjacent to the through hole.

[0053] According to various embodiments, a structure may be provided comprising at least one insulating structure implemented on the side of the support structure; wherein the at least one insulating structure comprises: at least one contact structure of an insulating material for preventing leakage of current formed in the susceptor body in the direction of the ground, and wherein the at least one contact structure is implemented to include a plurality of parts separated from each other.

[0054] According to various embodiments, a process system may be provided comprising: a chamber; a driving device for moving the raw material injection structure in an up-and-down direction; a susceptor body on which a substrate is placed and which includes at least one upper shielding structure inside; a support structure connected to the lower part of the susceptor body and which includes at least one lower shielding structure inside; a heater implemented to generate heat based on the application of power; and a cover structure for covering between the driving device disposed outside the chamber and the raw material injection structure disposed inside the chamber; wherein the raw material injection structure further comprises at least one coupling structure for being coupled to the substrate, and the raw material injection structure and the substrate are physically coupled to each other based on the at least one coupling structure while the raw material injection structure is in contact with the substrate by the driving device, and the substrate is implemented to be separable from the susceptor body based on the vertical movement of the raw material injection structure.

[0056] 1. Basic components of the process system (1)

[0057] FIG. 1 is a block diagram of a process system (1) according to various embodiments. FIG. 1 will be further explained below with reference to FIG. 2.

[0058] FIG. 2 is a drawing for illustrating examples of a process system (1) according to various embodiments.

[0059] According to various embodiments, the process system (1) may be a system for producing various types of electronic devices and / or electronic components, such as flat panel display devices like light-emitting diodes, semiconductor devices, liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs), solar cells, etc. The types of processes by the process system (1) may include chemical vapor deposition (CVD) and plasma enhanced chemical vapor deposition (PECVD) using high energy of plasma, but are not limited to the examples described and may include various types of processes.

[0060] According to various embodiments, with reference to FIGS. 1 and 2, the process system (1) may include a chamber (10), a power supply (100), a raw material supply storage device (110), a driving device (115), a raw material injection structure (120), a susceptor (210) including a heater (230), a substrate (220) disposed on the susceptor (210), insulating structures (260a, 260b) connected to the susceptor (210), a chiller (240), and a heating device (250), at least one wiring (260), and a driving device (270) for moving the susceptor (210). However, the process system (1) may be implemented to include more or / or fewer configurations, not limited to the illustrated and / or described examples. For example, only one of the driving device (115) for moving the raw material injection structure (120) and the driving device (270) for moving the susceptor (210) may be implemented, but is not limited to the examples described. Also, for example, depending on the movement method, only some of the insulating structures (260a, 260b) may be implemented. For example, if only the driving device (115) is implemented to move only the raw material injection structure (120) (upper movement method), only the first insulating structure (260a) may be implemented, and if the driving device (270) is implemented to move the susceptor (210) (lower movement method), the second insulating structure (260b) may be implemented. Also, for example, depending on the type of process, the power supply device (100), chiller (240), etc. for plasma formation may not be implemented.

[0061] According to various embodiments, with reference to FIG. 2, the chamber (10) may be implemented to have an internal space (i.e., a substrate processing space). The chamber (10) may be manufactured to be separated into a chamber body (not shown) and a chamber lid (not shown). Based on this separation, the chamber (10) and the components installed inside the chamber (10) may be maintained. Additionally, an entrance / exit for a substrate (220) may be provided on one side of the chamber (100), and a separate opening / closing means (e.g., a gate valve, a slot valve, etc.) for opening and closing the entrance / exit may be provided. Referring to FIG. 2, some components of the process system (1) (e.g., raw material injection structure (120), susceptor (210), substrate (220), and heater (230)) are placed inside the chamber (10), and the remaining components (e.g., power supply (100), raw material supply storage device (110), driving device (115), chiller (240), and heating device (250)) may be placed outside the chamber (10), but are not limited to the described and / or illustrated examples. The environment inside the chamber (10) may be implemented differently from the environment outside the chamber (10). For example, the environment inside the chamber (10) may be implemented as a specific environment (e.g., vacuum environment, specific gas environment (e.g., nitrogen, argon)), but are not limited to the described examples.

[0062] According to various embodiments, the power supply (100) may be implemented to apply power (or electricity) (e.g., AC power) to form plasma. For example, the power supply (100) is electrically connected to a raw material injection structure (120) and a susceptor (210), and the raw material injection structure (120) is implemented to include a first electrode (120a), and the susceptor (210) is implemented to function as a second electrode corresponding to the first electrode (120a), so that plasma may be formed between the raw material injection structure (120) and the susceptor (210). Treatment of the substrate (210) may be performed by the material injected from the raw material injection structure (120) and the plasma formed.

[0063] According to various embodiments, with reference to FIGS. 1 and 2, the susceptor (210) may be implemented to serve as an electrode for plasma formation. For example, as described above, the susceptor (210) may include an electrode (not shown).

[0064] Additionally, according to various embodiments, with reference to FIGS. 1 and 2, a susceptor (210) may be implemented to support a substrate (220) and heat it. The susceptor (200) may include a susceptor body on which the substrate (220) is placed and a shaft connected to the susceptor body. A heater (230) may be disposed inside the susceptor body to heat the susceptor body based on the application of power (or electricity). For example, the heater (230) may be implemented as a heating element of various shapes, such as a coil shape or a circle shape, having a resistance greater than or equal to a preset value to generate heat based on the application of power, but is not limited to the described examples. Referring to FIG. 2, the chiller (240) may be implemented to cool the temperature inside the chamber (10) by circulating a gas of the same type as the gas that forms inside the chamber (10) through a fan, but is not limited to the described example.

[0065] According to various embodiments, insulating structures (260a, 260b) may be implemented to prevent current formed based on the generation of the aforementioned plasma from the upper surface of the susceptor (210) from leaking in the direction of ground. Referring to FIGS. 1 and 2, the first insulating structure (260a) may be positioned between the lower part of the susceptor (210) and the lower bottom surface of the chamber (10). The first insulating structure (260a) may be positioned in a manner that contacts the lower bottom surface of the chamber (10), but is not limited to the described examples. The second insulating structure (260b) may be implemented outside the chamber (10). Based on the first insulating structure (260a) and the second insulating structure (260b) disposed outside the chamber (10), the susceptor (210) can be moved up and down by the driving device (270) while maintaining the environment of the chamber (10) and maintaining insulation. The insulating structures (260a, 260b) will be described in detail later with reference to FIGS. 12 to 17.

[0066] According to various embodiments, with reference to FIGS. 1 and 2, a raw material supply storage device (110) for storing and supplying a substrate processing raw material may be disposed outside the chamber (10). The substrate processing raw material may include various materials depending on the substrate processing process (or the type of electronic device produced by the process) performed inside the chamber (10). In this case, the form of the raw material may include gas, metal, liquid, or precursor.

[0067] According to various embodiments, the raw material injection structure (120) may be installed inside the chamber (100) to inject substrate processing raw materials into the substrate processing space. The raw material supply storage device (110) and the raw material injection structure (120) may be connected by a separate supply pipe. A control means, such as an MFC, for controlling the amount of raw materials supplied may be provided in the supply pipe. The raw material injection structure (120) may be manufactured in the form of a showerhead, but is not limited to the described examples and may be manufactured in various shapes.

[0068] According to various embodiments, the driving device (115) may be implemented to control the movement of the raw material injection structure (120) in an upward direction (or vertical direction). Specific examples of the driving device (115) will be described later with reference to FIGS. 18 to 21.

[0070] 2. Electromagnetic field shielding structure of the susceptor (210)

[0071] Hereinafter, embodiments of a shielding structure for shielding a heater (230) formed inside a susceptor (210) according to various embodiments are described. It is obvious to those skilled in the art that at least some of the details described for a specific embodiment among the embodiments described below may be applied to other embodiments.

[0072] Since the matters described in the aforementioned "1. Table of Contents" may be applied by analogy to "2. Table of Contents" unless otherwise specifically stated, redundant explanations among the matters described in "1. Table of Contents" are omitted.

[0074] 2.1. First embodiment

[0075] 2.1.1. First structure of the first embodiment

[0076] According to various embodiments, the susceptor (210) may be implemented to include a shielding structure (300) positioned at a specific distance from a heater (230) positioned inside.

[0077] FIG. 3 is a drawing for illustrating an example of a shielding structure (300) of a susceptor (210) according to various embodiments. FIG. 3 will be further described below with reference to FIG. 4 and FIG. 5.

[0078] FIG. 4 is a drawing for explaining an example of a heater (230) seated on an upper structure (310) of a susceptor (210) according to various embodiments. FIG. 5 is a cross-sectional view for explaining an example of a shielding structure (300) formed on an upper structure (310) of a susceptor (210) according to various embodiments.

[0079] According to various embodiments, with reference to FIG. 3, the susceptor (210) may include a susceptor body (310) on which a substrate (220) is placed, a support structure (320), a lower structure (330), a heater (230), and a shielding structure (300) for shielding the heater (230). However, the examples shown and / or described are not limited to more or fewer configurations.

[0080] According to various embodiments, the susceptor body (310), the support structure (320), and the lower structure (330) may be implemented to include at least a portion of the heater (230) and a shielding structure (300) that shields at least a portion of the heater (230). Accordingly, referring to FIG. 5, the heater (230) may include a first heater portion disposed inside the susceptor body (310) and arranged horizontally, a second heater portion disposed inside the support structure (320) and extended vertically, and a third heater portion disposed inside the lower structure (330). Also, referring to FIG. 5, the shielding structure (300) may include at least one first shielding structure (500) disposed inside the susceptor body (310), at least one second shielding structure (400) disposed inside the support structure (320), and a third shielding structure (not shown) disposed inside the lower structure (330). The material of the shielding structure (300) may be soft iron such as electronic soft iron (SUY-1), but is not limited to the described examples and may be implemented with various types of materials for shielding electromagnetic fields such as ferrite.

[0081] According to various embodiments, with reference to FIGS. 4 and 5, the susceptor body (310) may include a first body (311) and a second body (312). Not limited to the described examples, only one of the two may be implemented. The first body (311) and the second body (312) may be implemented to be connectable to each other. For example, the first body (311) and the second body (312) may each be implemented to include a connecting structure (e.g., a protruding part and a groove or hole corresponding to the protruding part) for connecting to each other, and may be connected to each other based on the connecting structure.

[0082] According to various embodiments, with reference to FIGS. 4 and 5, the susceptor body (310) (e.g., first body (311), second body (312)) may be implemented to include a physical structure for the placement of the heater (230). For example, the first body (311) may include a groove (310a) having a depth greater than the thickness of the heater (230), and the second body (312) may include a through hole (312a) through which the heater (230) passes and is directed toward the heating device (250) through the support structure (320). With the heater (230) seated in the groove (310a) of the first body (311), the heater (230) can be placed in the first body (311) by providing (e.g., filling) a specific material in the remaining space of the groove (310a) after the heater (230) is seated. With the heater (230) placed in the first body (311), the second body (312) is coupled to the first body (311), and another part of the heater (230) extends through the through hole (312a) of the second body (312), so that at least a portion of the heater (230) can be placed in the susceptor body (310).

[0083] According to various embodiments, with reference to FIGS. 4 and 5, at least one shielding structure (511a, 511b, 512a, 512b, 521a, 521b, 522a, 522b, 523a, 523b) implemented in each of the first body (311) and the second body (312) of the susceptor body (310) may be implemented to completely seal (or cover) the heater (230) so that the heater (230) seated inside the susceptor body (310) is not exposed to the outside of the shielding structure (511a, 511b, 512a, 512b, 521a, 521b, 522a, 522b, 523a, 523b).

[0084] According to various embodiments, the shielding structure (510) included in the first body (311) may include at least one shielding structure part (511a, 511b) for covering the upper part and side part of the first heater part so that they are not exposed to the outside of the shielding structure (300). For example, the first upper shielding structure (511a, 511b) may include a first part extending horizontally to cover the upper part of the first heater part extending horizontally so that it is not exposed to the outside, and a second part (512a, 512b) connected to the first part and extending vertically to cover the side part of the first heater part so that it is not exposed to the outside, in order to cover the heater (230) seated in the groove (310a) of the first body (311). The size of the first part (e.g., area, or length) can be implemented to be smaller than the size of the second part (512a, 512b).

[0085] According to various embodiments, the shielding structure (520) included in the second body (312) may include at least one shielding structure part (521a, 521b) for covering the lower part and side part of the first heater part and the second heater part extending in a vertical direction (or in the direction of the heating device (250)) so that they are not exposed to the outside of the shielding structure (300). For example, the lower shielding structure (521a, 521b) may include a third part extending in a horizontal direction to cover the lower part of the first heater part so that it is not exposed to the outside, a fourth part (522a, 522b) connected to one end of the third part to cover the side part of the first heater part so that it is not exposed to the outside, and a fifth part (523a, 523b) connected to the other end of the third part to cover the side part of the second heater part extending along the through hole (312a). The above-mentioned fifth part (523a) can be implemented in the form of a tube of various shapes (e.g., circle, square) that wraps around to cover the side of the second heater part.

[0086] According to various embodiments, when the bodies (311, 312) are combined, at least one shielding structure (e.g., upper shielding structure (511a, 511b) and lower shielding structure (521a, 521b)) implemented in each of the first body (311) and the second body (312) can be implemented to be physically connected to each other so that the heater (230) is not exposed to the outside of the shielding structure (300). For example, a second part (512a, 512b) extending in the vertical direction (or, in the direction of the heating device (250)) of the aforementioned upper shielding structure (511a, 511b) can be formed at a location where it can be physically connected to the fourth part (522a, 522b) and the fifth part (523a, 523b) of the lower shielding structure (521a, 521b).

[0087] According to various embodiments, the support structure (320) may include a support shielding structure (400) that covers each of the second heater portions extending vertically from the heater (230) (or in the direction of the heating device (250)) so as not to be exposed to the outside. Each of the support shielding structures (400a, 400b) may be implemented to be physically connected to a fifth portion (523a, 523b) that covers the second heater portion of the lower shielding structure (521a, 521b) described above. For example, the support shielding structures (400a, 400b) may be implemented as tubular structures of various shapes (e.g., circle, square), and the diameter of the tubular structure may correspond to the diameter of the fifth portion (523a, 523b).

[0088] According to various embodiments, each of the aforementioned shielding structures (e.g., upper shielding structure (511a, 511b), lower shielding structure (521a, 521b), and support shielding structure (400a, 400b)) may be implemented to be spaced apart by a specific distance from a heater (230) placed on the susceptor (210). Accordingly, the susceptor body (310) may be implemented to include a shielding structure (300) inside, spaced apart by a specific distance from a structure (e.g., groove (310a), through hole (312a)) for the heater (230) to be seated. For example, the first body (311) may be implemented to include the upper shielding structure (511a) inside at a specific distance from the groove (310a), and the second body (312) may be implemented to include the lower shielding structure (521a) inside at a specific distance from the through hole (312a).

[0090] 2.1.2. Various structures of the first embodiment

[0091] FIG. 6 is a drawing for illustrating examples of various structures of a shielding structure (500) according to various embodiments.

[0092] Referring to FIG. 6, the aforementioned shielding structure (300) can be implemented in various structures for shielding the heater (230). Descriptions that overlap with the description of the aforementioned shielding structure (300) are omitted.

[0093] Referring to FIG. 6(a), the shielding structure (300) may be implemented to include a portion (500) that covers the entire portion of the heater (230) included in the susceptor body (310) (e.g., the first heater portion), and a portion (400) that covers only a portion of the side of the portion of the heater (230) (e.g., the second heater portion) extending vertically inside the support structure (320).

[0094] Referring to FIG. 6(b), the shielding structure (300) may be implemented to include only a portion (500) that covers all of the portion of the heater (230) included in the susceptor body (310) (e.g., the first heater portion), and not to cover the portion of the heater (230) that extends vertically within the support structure (320) (e.g., the second heater portion).

[0095] Referring to FIG. 6(c), the shielding structure (300) may be implemented to include parts (400, 500) that cover both the part of the heater (230) included in the susceptor body (310) (e.g., first heater part) and the part of the heater (230) extending vertically inside the support structure (320), and a part (600) that covers the part of the heater (230) (e.g., third heater part) within the lower structure (330).

[0096] Referring to FIG. 6 (d), the shielding structure (400, 600) for covering the heater (230) of the support structure (320) and the lower structure (330) may be implemented in a form that is placed (or applied) on the inner surface of the support structure (320) and the lower structure (330).

[0098] 2.2. Second Example

[0099] According to various embodiments, the susceptor (210) may be implemented to include a shielding structure (700) positioned in close proximity (e.g., positioned to be in contact) to a heater (230) positioned inside. For convenience of explanation, the susceptor (210) and the shielding structure (300) described below differ from those described in the first embodiment, and it is obvious to those skilled in the art that any other parts of the first embodiment not described may be applied to the second embodiment.

[0100] FIG. 7 is a cross-sectional view illustrating an example of a shielding structure (700) of a susceptor (210) according to various embodiments. FIG. 7 will be further described below with reference to FIG. 8 and FIG. 9.

[0101] FIG. 8 is a drawing for illustrating one example of implementing a shielding structure (700) of a susceptor (210) according to various embodiments. FIG. 9 is a drawing for illustrating another example of implementing a shielding structure (700) of a susceptor (210) according to various embodiments.

[0102] According to various embodiments, with reference to FIG. 7, the susceptor body (310), support structure (320), and lower structure (330) may include a shielding structure (700) positioned to contact a heater (230) positioned inside.

[0103] In one embodiment, referring to FIG. 8, the shielding structure (700) may be implemented in a state where it is placed on the outer surface of the heater (230). Accordingly, the heater (230) with the shielding structure (700) placed thereon may be placed on the susceptor body (310), the support structure (320), and the lower structure (330). For example, the shielding structure (700) may be implemented as a tube having an internal space of a shielding material (e.g., soft iron), and the shielding structure (700) may be placed on the outer surface of the heater (230) as the heater (230) is placed (or fitted) into the internal space of the shielding structure (700). Also, for example, the shielding structure (700) may be placed on the outer surface of the heater (230) as a shielding material (e.g., soft iron) is applied to the outer surface of the heater (230). Another example is a method of making a heater sheath from double materials, such as using stainless steel and soft iron materials in a double inval to form a heater sheath. A roll-shaped heater (230) can be manufactured by filling it with a heater element and an insulating material.

[0104] In one embodiment, referring to FIG. 8, the shielding structure (700) may be implemented in a state where it is placed on the outer surface of the heater (230). Accordingly, the heater (230) with the shielding structure (700) placed thereon may be placed on the susceptor body (310), the support structure (320), and the lower structure (330). For example, the shielding structure (700) may be implemented as a tube having an internal space of a shielding material, and the shielding structure (700) may be placed on the outer surface of the heater (230) as the heater (230) is placed (or fitted) into the internal space of the shielding structure (700). For example, the shielding structure (700) may be placed on the outer surface of the heater (230) as a shielding material is applied to the outer surface of the heater (230).

[0105] In another embodiment, referring to FIG. 9, the shielding structure (700) may be formed on the inner side of a structure (e.g., a groove (310a) and a through hole (312a)) for which a heater (230) is placed in a susceptor body (310) (e.g., a first body (311), and a second body (312)). With the shielding structure (700) formed, the heater (230) may be covered by the shielding structure (700) as the heater (230) is seated (or placed) inside the susceptor body (310) (e.g., a first body (311), and a second body (312)).

[0107] 2.3. Heater (230) shielding operation based on a shielding structure

[0108] FIG. 10 is a flowchart illustrating the operation of a heating device (250) according to various embodiments. Operations may be performed in a different order than those shown in FIG. 10, some of the shown operations may not be performed, and / or additional operations may be performed. FIG. 10 will be further described below with reference to FIG. 11.

[0109] FIG. 11 is a drawing for illustrating examples of a heated susceptor (210) according to various embodiments.

[0110] According to various embodiments, the heating device (250) may, in operation 1001, supply power to a heater (230) inside the susceptor (210) using a power supply. For example, referring to FIG. 11, as the process begins, the power supply (not shown) of the heating device (250) may control the temperature of the susceptor (210) to be maintained at a specific range of temperature required for the process by supplying power to the heater (230) and controlling heat to be generated from the heater (230). Although not shown, the heating device (250) may control the amount of power supplied to the heater (230) based on the temperature identified using a feedback circuit (e.g., a temperature sensor) for measuring the temperature of the susceptor (210) so that the susceptor (210) is maintained at the specific range of temperature required for the process.

[0111] According to various embodiments, the heating device (250) can control the magnitude of the electromagnetic field induced in the heater (230) by the supplied power to be less than or equal to a preset magnitude based on the shielding structure (300, 700) in operation 1003. For example, referring to FIG. 11, a first electromagnetic field may be formed from the heater (230) (or around the heater (230)) as power is applied to the heater (230). The first electromagnetic field may affect the plasma formed between the aforementioned raw material injection structure (120) and the substrate (220). However, as shown in FIG. 11, the first electromagnetic field may be attenuated into a second electromagnetic field of less than a preset level (e.g., a magnitude close to zero) by the aforementioned shielding structure (300, 700), thereby minimizing the effect on the plasma. Accordingly, the stability and accuracy of the process may be improved.

[0113] 3. Leakage current insulation structure of the susceptor (210)

[0114] According to various embodiments, the susceptor (210) (e.g., susceptor body (310)) may be electrically connected to the power supply (100) via wiring as described above, and the susceptor (210) (e.g., susceptor body (310)) may function as an electrode corresponding to the first electrode (120a) of the raw material injection structure. At this time, as current induced in the upper part of the susceptor (210) by plasma leaks (or is induced) to ground through the ground wiring (G) connected to the body of the susceptor (210) (e.g., susceptor body (310)), the current flow in the upper part of the susceptor (210) changes, and the flow of raw material injected through the raw material injection structure (120) changes, which may degrade the quality of the process.

[0115] Hereinafter, embodiments of a structure (insulating structure) for insulating ground wiring from a current formed based on plasma on the upper part of a susceptor (210) according to various embodiments will be described.

[0116] Since the matters described in the aforementioned "1. Table of Contents" and "2. Table of Contents" may be applied by analogy to "3. Table of Contents" unless otherwise specifically stated, redundant explanations among the matters described in "1. Table of Contents" and "2. Table of Contents" are omitted.

[0118] 3.1 Upper movable structure

[0119] According to various embodiments, an insulating structure for a process system may be formed, comprising a raw material injection structure (120) movable in the vertical direction and a susceptor (310) with a fixed position.

[0120] FIG. 12a is a cross-sectional view illustrating an example of an insulating structure (1200) disposed on the lower part of a susceptor (210) according to various embodiments. FIG. 12b is a cross-sectional view illustrating an example of the combination of the insulating structure (1200) and the chamber according to various embodiments. FIG. 12c is a cross-sectional view illustrating an example of the placement of the insulating structure (1200) on the susceptor (210) according to various embodiments. FIG. 13 is a drawing illustrating an example of flanges according to various embodiments. FIG. 14 and 15 are drawings illustrating an example of a first contact structure (e.g., a seal gasket) according to various embodiments. FIG. 16 is a drawing illustrating an example of a second contact structure according to various embodiments.

[0121] Hereinafter, examples of insulating structures according to various embodiments will be described with reference to FIGS. 12 to 16.

[0123] 3.1.1 First insulating structure (260a)

[0124] According to various embodiments, the first insulating structure (260a) is an insulating structure disposed inside the chamber (10) and may include structures disposed to surround the support structure (320) of the susceptor (310) and structures disposed on the bottom surface of the chamber (10).

[0125] 3.1.1.1 Structures arranged to surround the support structure (320)

[0126] According to various embodiments, with reference to FIG. 12a, the insulating structure (1200) may include a first contact structure (1210) positioned to surround a support structure (320) of a susceptor (210), a second contact structure (1220) for supporting the first contact structure, a first flange (1230) and a second flange (1240) for supporting the first contact structure (1210), an insertion structure (1250) comprising an insulating material (M) (e.g., a high-temperature insulating material such as mica), and at least one fastening structure (1260a, 1260b) comprising an insulating material (M) for fastening the insertion structure (1250). However, the insulating structure (1200) may be implemented to include more or / or fewer configurations, not limited to the illustrated and / or described examples.

[0127] According to various embodiments, contact structures for insulation (e.g., a first contact structure (1210), and a second contact structure (1220)) may be implemented with an insulating material having a hardness greater than a certain level and a toughness greater than a certain level. For example, the insulating material may include zirconia ceramics and / or zirconium oxide ceramics, but is not limited to the examples described. Based on the hardness and toughness, the problem of the contact structures (e.g., a first contact structure (1210), and a second contact structure (1220)) being damaged by external forces can be prevented.

[0128] According to various embodiments, the first contact structure (1210) may be implemented to support (or support) the support structure (320) while insulating it.

[0129] According to various embodiments, with reference to FIGS. 13 and 14, the first contact structure (1210) may be implemented to include a plurality of first parts (1210a, 1210b). As the plurality of first parts (1210a, 1210b) are joined to one another by the aforementioned insertion structure (1250) and fastening structure (1260a, 1260b), the structure may be implemented as a donut-shaped structure with a hollow center. As the first contact structure (120) is implemented in a form separated into a plurality of parts, the problem of the first contact structure (1210) being damaged by the external force applied to the first contact structure (1210) can be prevented due to the effect of dispersing the external force. The plurality of first parts (1210a, 1210b) may be arranged to contact the support structure (320) along the side of the support structure (320).

[0130] In one embodiment, referring to FIG. 13, each of the plurality of first parts (1210a, 1210b) may be implemented to include an upper surface, a lower surface, and a plurality of sides connected to the upper surface and the lower surface. Referring to FIG. 13(a) and FIG. 13(b), among the plurality of sides of one of the plurality of first parts (1210a, 1210b), a portion (1211, 1213) that is recessed in the center may be formed on both sides adjacent to the other remaining portions. When the two sides of the plurality of first parts are arranged to face each other, a through hole (1400) may be formed by the recessed portion (1211, 1213) as shown in FIG. 13(a). The aforementioned insert structure (1250) may be inserted through the through hole (1400). Referring to (b) of FIG. 13 above, the parts (S1, S2) connecting the upper surface and the lower surface, respectively, and the plurality of sides may be implemented as surfaces with a specific slope or / or surfaces having curvature.

[0131] In another embodiment, referring to FIG. 14, the plurality of first parts (1210a, 1210b) may be implemented to include a through hole (1400) in the central part. Other descriptions that overlap with the description of FIG. 13 are omitted.

[0132] According to various embodiments, the second contact structure (1220) may be implemented to insulate the support structure (320) while preventing it from deviating from the central axis (or centering it). For example, referring to FIG. 15, the second contact structure (1220) may be implemented to include a plurality of second parts (1220a, 1220b). The plurality of second parts (1220a, 1220b) may also be implemented with a surface having a specific slope or / or a specific curvature in the area connected to the upper / lower surfaces of each of the two sides to prevent damage by external force. The plurality of second parts (1220a, 1220b) may be arranged to contact the support structure (320) along the side of the support structure (320).

[0133] According to various embodiments, the second contact structure (1220) may be implemented to be positioned below the first contact structure (1210) and to support the first contact structure (1210).

[0134] According to various embodiments, a through hole formed at the center of the contact structure (e.g., the first contact structure (1210), and the second contact structure (1220)) may be implemented with a diameter greater than the circumference of the support structure (320) supporting the susceptor body (310). Additionally, the size of the second contact structure (1220) (e.g., radius from the center to the outer surface) may be implemented to be smaller than the size of the first contact structure (1210) (e.g., radius from the center to the outer surface).

[0135] According to various embodiments, flanges (e.g., a first flange (1230), and a second flange (1240)) may be used to support contact structures (e.g., a first contact structure (1210), and a second contact structure (1220)) and to facilitate the placement of contact structures (e.g., a first contact structure (1210), and a second contact structure (1220)). Referring to FIG. 16, the first flange (1230) may be implemented to include a central through-hole (1231) through which a support structure (320) passes and a plurality of holes (1233) through which an insert structure (1250) passes. The second flange (1240) may be implemented as in the first flange (1230), but a groove structure may be further formed on an inner surface adjacent to the center for the placement of the second contact structure (1220).

[0136] According to various embodiments, the first contact structure (1210) may be disposed between the first flange (1230) and the second flange (1240). With the first contact structure (1210) disposed between the first flange (1230) and the second flange (1240), the position of each of the plurality of holes (1233) of the first flange (1230) and the second flange (1240) may be implemented to correspond to the position of the plurality of holes (1440) formed between the plurality of first parts (1210a, 1210b) of the first contact structure (1210). Accordingly, the insertion structure (1250) is inserted through a plurality of holes (1233) of the flanges (e.g., first flange (1230), and second flange (1240)) and a plurality of holes (1440) of the corresponding first contact structure (1210), and the insertion structure (1250) is fastened by a fastening structure (1260a, 1260b) so that the flanges (e.g., first flange (1230), and second flange (1240)) and the first contact structure (1210) can be firmly fastened.

[0137] According to various embodiments, the second flange (1240) may be provided by being positioned (or fixed, or fastened) on the lower surface of the chamber (10), although not illustrated. As the second flange (1240) is supported by the bottom surface of the chamber (10), the remaining components fastened to the second flange (1240) (e.g., first flange (1230), contact structures (1210, 1220)) may be supported.

[0138] According to various embodiments, the size of the flange (e.g., radius from the center to the outer surface) may be implemented to be larger than the size of each of the first contact structure (1210) and the second contact structure (1220) described above (e.g., radius from the center to the outer surface).

[0139] According to various embodiments, referring to 1201S in FIG. 12c, flanges (1230, 1240) may first be arranged. For example, the support structure (320) may be inserted into the center through hole (1231) of the flanges (1230, 1240). At this time, the second flange (1240) placed below the first flange (1230) may be placed on the bottom surface of the chamber (10) as described above. Referring to 1203S in FIG. 12c, with the flanges (1230, 1240) arranged, a plurality of second parts (1220a, 1220b) of the second contact structure (1220) are inserted into the groove of the second flange (1240), and a plurality of first parts (1210a, 1210b) of the first contact structure (1210) can be inserted and arranged in the space between the first flange (1230) and the second flange (1240). Referring to 1205S to 1207S in FIG. 12c, the insertion structure (1250) is inserted through a plurality of holes (1233) of the flanges (e.g., first flange (1230), and second flange (1240)) and a plurality of holes (1440) of the corresponding first contact structure (1210), and the insertion structure (1250) is fastened by a fastening structure (1260a, 1260b) so that the flanges (e.g., first flange (1230), and second flange (1240)) and the first contact structure (1210) can be firmly fastened.

[0141] 3.1.1.2 Structures placed on the bottom surface of the chamber (10)

[0142] Referring to the aforementioned FIGS. 12a to 12b, an example of an insulating structure (1200) that is fastened to the bottom plate of the chamber (10) will be described.

[0143] According to various embodiments, with reference to FIGS. 12a to 12b, the insulating structure (1200) is positioned to penetrate the lower surface through a through hole formed in the chamber (10), and cover structures may be provided around the insulating structure (1200) to cover the gap of the through hole. For example, the cover structures may include a bellow (1280) for covering the gap, a first bellow flange (1270a) and a second bellow flange (1270b) for supporting the bellow (1280), a counter flange (1290) corresponding to the second bellow flange with the lower wall of the chamber (10) in between, at least one fastening member (1287) (e.g., a bolt) for connecting the second bellow flange and the counter flange (1290), and insulating members (1285, 1287a, 1287b), but are not limited to the described and / or illustrated examples.

[0144] According to various embodiments, the bellow (1210) is positioned to wrap around the side of the insulating structure (1200) while the insulating structure (1200) is penetrated through a through hole formed in the bottom surface of the chamber (10), thereby covering the gap formed between the side of the insulating structure (1200) and the inner surface of the penetration of the chamber (10). The bellow (1210) may be implemented to have a through hole in the center. The bellow (1210) may be positioned on the bottom surface of the chamber (10) and positioned so that the insulating structure (e.g., first flange (1230), first contact structure (1210), and second flange (1240)) is inserted into the through hole.

[0145] According to various embodiments, the bellow flanges (e.g., first bellow flange (1270a), second bellow flange (1270b)) may be implemented to support the bellow (1280). The bellow flanges (1270a, 1270b) may be implemented similarly to the first flange (1230) described above. The first bellow flange (1270a) may be placed on the top of the bellow (1280) and welded to the side of the insulating structure (1200) (e.g., first flange (1230)). The second bellow flange (1270b) may be placed on the bottom surface of the chamber (10) and may be placed to wrap around the side of the bellow (1280). Based on the second bellow flange (1270b) above, the bellow (1280) can be fixed to the bottom surface of the chamber (10).

[0146] According to various embodiments, with reference to FIG. 12b, the counter flange (1290) may be joined to the second bellows flange (1270b) by a fastening member (1287) (e.g., a bolt) with at least a portion thereof positioned outside through the bottom surface of the chamber (10). By means of the fastening, the second bellows flange (1270b) is firmly joined to the bottom surface of the chamber (10), and the bellows (1280) supported by the second bellows flange (1270b) may also be firmly fixed to the bottom surface of the chamber (10).

[0147] According to various embodiments, with reference to FIG. 12b, at least one insulating member may be provided between the counter flange (1290) and the second bellows flange (1270b). For example, a gasket (1285) made of insulating material may be provided.

[0148] According to various embodiments, with reference to FIG. 12b, at least one insulating member may be provided between the fastening member (1287) (e.g., a bolt) and the second bellow flange (1270b). For example, the at least one insulating member may be a washer (1287a) of insulating material disposed between the head of the fastening member (1287) and the upper surface of the second bellow flange (1270b), and a ring (1287b) of insulating material formed between the threaded portion of the fastening member (1287) and the hole of the second bellow flange (1270b) into which the threaded portion is inserted.

[0149] The materials of the aforementioned insulating members (e.g., gasket (1285), washer (1287a), ring (1287b)) may include high-temperature insulating materials (e.g., mica), and may be implemented to withstand high temperatures and provide insulation, but are not limited to the examples described.

[0151] 3.2. Lower moving structure

[0152] According to various embodiments, the insulating structure (260a, 260b) may be implemented so that the susceptor (310) can move in the up and down direction. In this case, the raw material injection structure (120) may be fixed or movable.

[0153] FIGS. 17a to 17d are cross-sectional views illustrating examples of insulating structures (260a, 260b) disposed on the lower portion of a susceptor (210) according to various embodiments. FIG. 17a shows the left portion of one example of an insulating structure of a lower movable structure type, and FIG. 17b shows the right portion of one example of an insulating structure of a lower movable structure type. FIG. 17c shows the left portion of another example of an insulating structure of a lower movable structure type, and FIG. 17d shows the right portion of another example of an insulating structure of a lower movable structure type. FIG. 17a to 17d will be described further below with reference to FIG. 17e.

[0154] FIG. 17e is a drawing for illustrating examples of flanges constituting a second insulating structure (260b) according to various embodiments.

[0155] Descriptions that overlap with the insulating structure (260a) described in the aforementioned "3.1 Table of Contents" are omitted.

[0156] According to various embodiments, with reference to FIGS. 17a to 17d, the insulating structure may include a first insulating structure (260a) disposed on the bottom surface of the chamber (10) while surrounding the support structure (320) of the susceptor (210), and a second insulating structure (260b) disposed between the bottom of the chamber (10) and the driving device (270) while surrounding the support structure (320) of the susceptor (210).

[0158] 3.2.1 First insulating structure (260a)

[0159] According to various embodiments, the first insulating structure (260a) may include structures arranged to surround the support structure (320) of the susceptor (310) and structures arranged on the bottom surface of the chamber (10). Descriptions of the first insulating structure (260a) that overlap with the above-mentioned "3.1" are omitted.

[0160] In one embodiment, with reference to FIGS. 17a and 17b, the first insulating structure (260a) may be further implemented to include a nut (N), a third contact structure (1710a, 1710b) implemented similarly to the second contact structure (122) described above, springs (S) implemented to be placed on the contact structures (1210, 1220, 1710a, 1710b), and a bellow (1720a) connected to the first flange (1230).

[0161] According to various embodiments, the first flange (1230) and the second flange (1240) may each be implemented to include a portion that contacts the side of the support structure (320) so as to be movable in the up and down direction along the support structure (320). At this time, contact structures (1220, 1710a, 1710b) are disposed between the first flange (1230) and the second flange (1240), and a spring (S) may be disposed to contact each of the contact structures (1220, 1710a, 1710b) in the up and down direction. For example, the contact structures (1220, 1710a, 1710b) are positioned on the second flange (1240), and a space may be formed between the positioned contact structures (1220, 1710a, 1710b) and the first flange (123) so that the support structure (320) of the susceptor (310) can move in the up and down direction. At this time, one end of the spring (S) is connected to the contact structures (1220, 1710a, 1710b) and the other end is connected to the lower part of the first flange (1230), so that the contact structures (1220, 1710a, 1710b) can be supported in position by the elasticity of the spring (S) even when the support structure (320) moves.

[0162] According to various embodiments, the bellow (1720a) may be implemented to be connected to the upper part of the first flange (1230) and supported by the bellow flange (1270b). As the bellow (1720a) is implemented to wrap around the support structure (320), it can cover the small gap formed for the movement of the first flange (1230).

[0163] In another embodiment, referring to FIGS. 17c to 17d, unlike the previously described embodiment, the third contact structure (1710a, 1710b) may not be implemented, and redundant descriptions are omitted.

[0165] 3.2.2. Second insulating structure (260b)

[0166] According to various embodiments, the second insulating structure (260b) is positioned at the bottom of the chamber (10) and can perform the function of preventing current leakage to ground (G) in the same way as the first insulating structure (260a). At this time, a large load is applied to the bottom of the susceptor (310), and in order to maintain the verticality of the support structure (320), the second insulating structure (260b) may be designed as an insulating flange structure with a solid bottom structure, low (or no) vibration, and low (or no) tightening and deformation.

[0167] According to various embodiments, with reference to FIGS. 17a to 17d, the second insulating structure (260b) comprises a bellow (1780c) connected to the lower part of the second flange (1240) which is implemented by wrapping around the support structure (320) and penetrating the chamber (10) and the first lower flange (1700a), a plurality of lower flanges (1700a, 1700b, 1700c, 1700d), a plurality of adhesive layers (1710) disposed between the plurality of lower flanges (1700a, 1700b, 1700c, 1700d) of a high-temperature insulating material (e.g., epoxy resin), and bolts (1720a, 1720b) ​​inserted into the through holes (R1, R2) of the plurality of lower flanges (1700a, 1700b, 1700c, 1700d). It may be implemented to include a nut (1721a, 1721b), and a spring (S) connected to one end of a bolt (1720a, 1720b) ​​placed inside.

[0168] According to various embodiments, the plurality of lower flanges (1700a, 1700b, 1700c, 1700d) may be implemented to provide an insulating function while supporting (e.g., supporting a central axis) a support structure (320) of a susceptor (310) located outside the chamber (10). The material of the plurality of lower flanges (1700a, 1700b, 1700c, 1700d) may be implemented as epoxy resin or Teflon, but is not limited to the examples described. Referring to FIG. 17e, the plurality of lower flanges (1700a, 1700b, 1700c, 1700d) may include a plurality of through holes (R1, R2) formed along circumferences of different radii. The plurality of through holes (R1, R2) formed along different circumferences may be arranged to be staggered from each other.

[0169] According to various embodiments, as the plurality of lower flanges (1700a, 1700b, 1700c, 1700d) are arranged, an internal space (IS) may be formed. Based on the formation of the internal space (IS), the support structure (320) of the susceptor (310) may be moved in an up-and-down direction.

[0171] 4. Driving device

[0172] Hereinafter, examples of driving devices implemented in a driving system (10) according to various embodiments will be described.

[0173] Since the matters described in the aforementioned "1. Table of Contents" through "3. Table of Contents" may be applied mutatis mutandis in "4. Table of Contents" unless otherwise specifically stated, redundant explanations among the matters described in "1. Table of Contents" through "4. Table of Contents" are omitted.

[0174] FIGS. 18a and 18b are drawings for illustrating examples of a driving system (10) including at least one driving device (1810, 1820) according to various embodiments.

[0175] According to various embodiments, with reference to FIG. 18a, the driving system (10) may further include a driving device (1820). Since the driving system (10) can be implemented as described above, a redundant description is omitted. For example, the driving device (1820) may be implemented to control the position and / or rotational state of the raw material injection structure (120). Meanwhile, although not illustrated, a driving device implemented to control the vertical movement and / or rotational state of a substrate (220) placed on the susceptor (210), for example, may be implemented in a lower structure (230) placed below the susceptor (210).

[0176] According to various embodiments, with reference to FIGS. 18a and 18b, the raw material injection structure (120) may be implemented to further include a plurality of coupling structures (1820a) for moving the substrate (220) in an upward direction. Each of the coupling structures (1820a) is implemented in an "L" shape and is positioned on the edge portion of the raw material injection structure (120), and can be rotated by a motor (not shown). When the raw material injection structure (120) is in contact with the substrate (220), as the coupling structure (1820a) is rotated by the motor (not shown), the coupling structure (1820a) can be coupled to a groove formed on the edge of the substrate frame (120a) on which the substrate (120) is seated. In the combined state described above, as the raw material injection structure (120) moves upward using the driving device (1820), the substrate frame (120a) on which the substrate (120) is placed can be separated from the susceptor (210). When the substrate frame (120a) is separated from the susceptor (210), the substrate (120) on the substrate frame (210a) can be provided to the outside of the chamber (10).

[0178] 4.1. Example of a driving device for a raw material injection structure

[0179] Hereinafter, with reference to FIGS. 19 and 20, examples of a driving device (1820) (raw material injection structure driving device) for controlling the movement of a raw material injection structure (120) in the up-and-down direction (or vertical direction) according to various embodiments will be described.

[0180] FIGS. 19 to 20 are cross-sectional views illustrating examples of a driving device (1820) for controlling the up-and-down movement of a raw material injection structure (1210) according to various embodiments.

[0181] According to various embodiments, a raw material injection structure (120) disposed inside a chamber (10) can be moved in an up-and-down direction by a driving device (1820).

[0182] According to various embodiments, with reference to FIGS. 19 to 20, the driving device (1820) may include a cylinder (1821), an inlet member (1823), an outlet member (1825), an alignment member (1827), a cylinder shaft (1829), a cover structure (1828), and welding members (1829a, 1829b). However, the driving device (1820) may be implemented to include more or fewer configurations, not limited to the described and / or illustrated examples. For example, depending on the implementation of the cylinder (1821), the inlet member (1823) and the outlet member (1825) may not be implemented.

[0183] According to various embodiments, the cylinder (1821) may be implemented to generate an upward and downward driving force to control the upward and downward (or vertical) movement of a raw material injection structure (120) physically connected to the cylinder shaft (1829) using the cylinder shaft (1829). For example, the cylinder (1821) may be implemented as a pneumatic or hydraulic driving force generating device, and / or may include a mechanical driving force generating device. If the cylinder (1821) is implemented as a pneumatic driving force generating device, an upward and downward driving force may be generated as gas is introduced into the cylinder (1821) through the inlet member (1823) and the gas is introduced through the outlet member (1823). Additionally, if the cylinder (1821) is implemented as a hydraulic driving force generating device, a driving force in the vertical direction can be generated as fluid flows into the cylinder (1821) through the inlet member (1823) and flows out through the outlet member (1823). Meanwhile, as described above, if the cylinder (1821) is implemented as a motor for generating mechanical driving force, the inlet member (1823) and the outlet member (1825) may be omitted.

[0184] According to various embodiments, the cylinder shaft (1829) may be physically connected to the cylinder (1821) and the raw material injection structure (120) (or the shaft (121) of the raw material injection structure (120)) and implemented to move the raw material injection structure (120) in an up-and-down direction based on the driving force generated by the cylinder (1821). For example, the other end of the cylinder shaft (1820) extending from the cylinder (1821) may extend into the interior of the chamber (10) through a through hole of the chamber (10) and be physically connected to the raw material injection structure (120) (or the shaft (121) of the raw material injection structure (120)). The cylinder shaft (1829) may be centered, supported, and aligned by an alignment member (1827).

[0185] According to various embodiments, the cover structure (1828) may be implemented to cover a through hole of the chamber (10) through which the cylinder shaft (1829) extends. For example, the cylinder shaft (1829) may be formed of a tube (or pipe) of the flexible material. The through hole may be covered by being physically connected without gap between the cover structure (1828) and a portion of the cylinder shaft (1829) by the first welding member (1829a), and by being physically connected without gap between the cover structure (1828) and a portion of the chamber (10) by the second welding member (1829b). Accordingly, the environment inside the chamber (10) (e.g., vacuum environment, specific gas environment (e.g., nitrogen, argon)) may be maintained.

[0187] 4.1.1 Flexible Line

[0188] According to various embodiments, with reference to FIG. 22, the chamber (10) may be implemented to include a vacuum connector (2101) for guiding wiring (2103) extending from a power supply (100) into the interior of the chamber (10). In this case, the wiring (2103) may be connected to an electrode portion (120b) included in the raw material injection structure (120).

[0189] According to various embodiments, the wiring (2103) may be implemented with a length greater than a predetermined length, taking into account the vertical movement of the raw material injection structure (120), and / or may be implemented with a flexible material. Accordingly, even when the raw material injection structure (120) moves vertically, the process can be performed without damage to the wiring (2103).

[0191] 4.2. Control operation of the driving device

[0192] FIG. 21 is a flowchart illustrating examples of control operations of a driving device according to various embodiments. Operations may be performed in a different order than those shown in FIG. 21, some of the shown operations may not be performed, and / or additional operations may be performed.

[0193] According to various embodiments, a driving device (e.g., a driving device (1820)) can control the movement (or movement) of the raw material injection structure (120) in the up and down direction in operation 2103. For example, the driving device (1820) can receive information about a target position in the up and down direction of the raw material injection device (120) and generate a driving force corresponding to the received information to move the raw material injection structure (120) in the up and down direction.

[0195] 5. Overall susceptor structure

[0196] A process system (1) that takes into account all the items described in the aforementioned “1. Table of Contents” to “4. Table of Contents” can be implemented.

[0197] FIG. 22 is a drawing for illustrating examples of process systems (10) according to various embodiments.

[0198] According to various embodiments, the process system (10) may include a susceptor (210) comprising a shielding structure (300) for shielding an electromagnetic field generated in a heater (230) disposed inside the susceptor (210), an insulating structure (1200) disposed at the bottom of the susceptor (210) for insulating plasma current leaking to ground, and a driving device (e.g., a driving device (1820)) for moving a raw material injection structure (120) in an up-and-down direction. Since each component has been described in "1. Table of Contents" through "4. Table of Contents," a detailed description is omitted.

Claims

Claim 1 A structure for processing a substrate, comprising: a susceptor body disposed inside a chamber, on which a substrate is placed, and including at least one heater inside; a support structure penetrating the chamber and connected to the lower portion of the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure and formed by penetrating at least a portion of the lower portion of the chamber; wherein the at least one insulating structure comprises: a plurality of flanges inserted into the support structure to contact the side of the support structure; and at least one contact structure having an insulating material to prevent leakage of current formed in the susceptor body toward the ground; wherein the at least one contact structure comprises a plurality of separated portions, and wherein an insertion structure is provided through a hole formed by the plurality of portions while the plurality of portions are disposed between the plurality of flanges, and the insertion structure is fastened by at least one fastening structure, so that the plurality of portions are fastened to the side of the support structure. Claim 2 A structure according to claim 1, wherein the insulating material comprises zirconia ceramics and / or zirconium oxide ceramics. Claim 3 In claim 1, the structure comprises at least one contact structure, a first contact structure disposed along the side of the support structure, and a second contact structure for supporting the first contact structure. Claim 4 In claim 3, the first contact structure comprises a plurality of first parts separated from one another, each of the plurality of first parts has a portion that is recessed inwardly, and when the plurality of first parts are arranged, a plurality of holes are formed based on the recessed portion. Claim 5 In claim 4, the second contact structure comprises a plurality of second parts separated from each other. Claim 6 A structure according to claim 5, wherein the plurality of flanges includes a first flange and a second flange, the plurality of first parts of the first contact structure are arranged along the side of the support structure between the first flange and the second flange, and the plurality of second parts of the second contact structure are arranged along the side of the support structure between the first contact structure and the second flange. Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 A process system comprises: a chamber; a raw material injection structure disposed inside the chamber; a susceptor body disposed inside the chamber, on which a substrate is placed and which includes at least one heater inside; a support structure penetrating the chamber and connected to the lower portion of the susceptor body; a power supply electrically connected to the raw material injection structure and the susceptor body; wiring extending from the susceptor body toward the support structure; a ground connected to the wiring; and at least one insulating structure implemented on the side of the support structure and formed by penetrating at least a portion of the lower surface of the chamber; wherein the at least one insulating structure comprises: a plurality of flanges inserted into the support structure so as to contact the side of the support structure; A process system comprising: at least one contact structure of an insulating material for preventing leakage of current formed in the susceptor body in the direction of the ground; wherein the at least one contact structure is implemented to include a plurality of parts separated from each other, and an insertion structure is provided through a hole formed by the plurality of parts while the plurality of parts are disposed between the plurality of flanges, and the plurality of parts are fastened to the side of the support structure as the insertion structure is fastened by at least one fastening structure, wherein the current formed in the susceptor body by the plasma formed between the raw material injection structure and the susceptor body by the power supply device is prevented from leaking to the ground by the at least one insulating structure.

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