Substrate loading device

Abstract

The present invention relates to a substrate loading device that prevents thermal damage to the substrate loading device and improves the cooling speed of the substrate when a boat on which a substrate is placed is unloaded from a diffusion furnace after a diffusion process. One embodiment of the present invention discloses a substrate loading device comprising: a first transfer unit for moving a paddle carrying a boat on which a plurality of substrates are placed in a first direction toward a diffusion path; a second transfer unit for moving the paddle in a second direction; and a cooling unit comprising a cooling channel through which a cooling fluid flows, which is arranged in the longitudinal direction of the paddle on one side of the first transfer unit.

Description

Technology Field

[0001] The present invention relates to a substrate loading device, and more specifically, to a substrate loading device that prevents thermal damage to the substrate loading device and improves the cooling speed of the substrate when a boat on which a substrate is placed is unloaded from a diffusion furnace after a diffusion process. Background Technology

[0002] A solar cell is a device that converts the light energy of the sun into electrical energy. Solar cells are produced through processes such as texturing, diffusion, oxide removal, anti-reflective coating, electrode printing, and PN junction separation. During the diffusion process in the manufacturing process, multiple substrates are placed into a high-temperature diffusion furnace using a substrate loading device, and a source gas is introduced to induce a PN junction on the substrates.

[0003] After the diffusion process is completed and the boat with the substrate mounted is unloaded from the diffusion furnace, several problems may arise due to the intense heat of the substrate. First, the substrate loading device may be damaged by the heat, preventing normal operation or shortening its lifespan. Another issue is that the prolonged cooling time required for the substrate can reduce the production speed of the solar cells.

[0004] The aforementioned background technology is technical information that the inventor possessed for the derivation of the present invention or acquired during the process of deriving the present invention, and it cannot be considered as publicly known technology disclosed to the general public prior to the filing of the present invention. The problem to be solved

[0005] The present invention aims to solve the aforementioned problems and provides a substrate loading device that prevents thermal damage to the substrate loading device and improves the cooling speed of the substrate when a boat with a substrate placed on it is unloaded from a diffusion furnace after a diffusion process.

[0006] However, these problems are exemplary and the problems to be solved by the present invention are not limited thereto. Problems not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings. means of solving the problem

[0007] One embodiment of the present invention discloses a substrate loading device comprising: a first transfer unit for moving a paddle carrying a boat on which a plurality of substrates are placed in a first direction toward a diffusion path; a second transfer unit for moving the paddle in a second direction; and a cooling unit comprising a cooling channel through which a cooling fluid flows, which is arranged in the longitudinal direction of the paddle on one side of the first transfer unit.

[0008] In this embodiment, the cooling portion is in the shape of a plate, and the cooling channel may be positioned closer to the second surface of the cooling portion, which is in the opposite direction of the first surface, than to the first surface of the cooling portion facing the first transfer portion.

[0009] In the present embodiment, the cooling channel includes a first cooling channel, a second cooling channel, and a third cooling channel, and the cooling unit may include a first region having the first cooling channel, a second region having the second cooling channel and located in the opposite direction of the diffusion channel with respect to the first region, and a third region having the third cooling channel and located in the opposite direction of the diffusion channel with respect to the second region.

[0010] In this embodiment, the first region, the second region, and the third region may all have different cooling characteristics.

[0011] In the present embodiment, the area of ​​the first region is narrower than the area of ​​the second region and the area of ​​the third region, and the area of ​​the second region may be narrower than the area of ​​the third region.

[0012] In the present embodiment, the cooling capacity of the first region is greater than the cooling capacity of the second region and the cooling capacity of the third region, and the cooling capacity of the second region may be greater than the cooling capacity of the third region.

[0013] In the present embodiment, the flow channel arrangement density of the first region is greater than the flow channel arrangement density of the second region and the flow channel arrangement density of the third region, and the flow channel arrangement density of the second region may be greater than the flow channel arrangement density of the third region.

[0014] In the present embodiment, the spacing of the first cooling channel is narrower than the spacing of the second cooling channel and the spacing of the third cooling channel, and the spacing of the second cooling channel may be narrower than the spacing of the third cooling channel.

[0015] In this embodiment, the first cooling channel, the second cooling channel, and the third cooling channel can all be connected in order.

[0016] In the present embodiment, the first cooling channel, the second cooling channel, and the third cooling channel are separated from each other and may each have an inlet and an outlet independently.

[0017] In the present embodiment, the cooling unit may include at least one fourth region in which the cooling channel is not arranged.

[0018] In this embodiment, the spacing of the cooling channels may become narrower as they get closer to the diffusion channel.

[0019] Other aspects, features, and advantages other than those described above will become clear from the specific details, claims, and drawings for implementing the invention below. Effects of the invention

[0020] A substrate loading device according to one embodiment of the present invention includes a cooling unit, thereby improving the cooling rate of a substrate unloaded from a diffusion furnace after a diffusion process and preventing thermal damage to other components of the substrate loading device.

[0021] A substrate loading device according to one embodiment of the present invention can improve overall cooling efficiency and maintain the uniformity characteristics of the substrate by dividing the cooling section into a plurality of regions.

[0022] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from this specification and the accompanying drawings. Brief explanation of the drawing

[0023] FIG. 1 is a perspective view showing a substrate loading device according to one embodiment of the present invention. FIG. 2 is a perspective view of a substrate loading device according to one embodiment of the present invention, viewed from a different side from FIG. 1. FIG. 3 is a diagram showing the location of the cooling channel as viewed from the diffusion furnace of a substrate loading device according to one embodiment of the present invention. FIG. 4 is a drawing showing various embodiments of the present invention regarding the cooling section. FIG. 5 is a drawing showing a cooling unit including a plurality of regions as an embodiment of the present invention. FIG. 6 is a drawing showing a cooling section in which the spacing of the cooling channels differs according to each region, as another embodiment of the present invention. FIG. 7 is a drawing showing a cooling section in which the spacing of the cooling channel arrangement changes continuously, as another embodiment of the present invention. FIG. 8 is a drawing showing a cooling section in which a plurality of cooling channels each have an inlet and an outlet, as another embodiment of the present invention. Specific details for implementing the invention

[0024] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, the same identification numerals are used for identical components, even if they are illustrated in different embodiments.

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0026] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0027] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0028] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0029] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily depicted for convenience of explanation, and therefore the present invention is not necessarily limited to what is illustrated.

[0030] In the following embodiments, the X-axis, Y-axis, and Z-axis are not limited to the three axes in an orthogonal coordinate system but can be interpreted in a broader sense that includes them. For example, the X-axis, Y-axis, and Z-axis may be orthogonal to each other, but they may also refer to different directions that are not orthogonal to each other.

[0031] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0032] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. In this application, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0033] In the following embodiments, when a membrane, region, component, etc. is described as being connected, it includes not only cases where the membrane, region, or component is directly connected, but also cases where other membranes, regions, or components are interposed between them to form an indirect connection. For example, when a membrane, region, component, etc. is described as being electrically connected in this specification, it includes not only cases where the membrane, region, or component, etc. are directly electrically connected, but also cases where other membranes, regions, or components are interposed between them to form an indirect electrical connection.

[0034] A substrate loading device according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 8.

[0035] FIG. 1 is a perspective view showing a substrate loading device (1) according to one embodiment of the present invention. FIG. 2 is a perspective view of a substrate loading device (1) according to one embodiment of the present invention viewed from a different side from FIG. 1.

[0036] The substrate loading device (1) can load or unload a substrate (wafer) into a diffusion furnace (10). The substrate loading device (1) may include a first transfer unit (100), a second transfer unit (200), and a cooling unit (300).

[0037] The first transfer unit (100) can load or unload a paddle (120) carrying a boat (110) on which a substrate is placed into or out of a diffusion furnace (10). Specifically, the first transfer unit (100) can move a paddle (120) carrying a boat (110) on which a plurality of substrates are placed in a first direction (X-axis). The first direction (X-axis) refers to the direction toward the diffusion furnace (10).

[0038] The first transfer unit (100) may include a boat (110), a paddle (120), a first power unit (130), and a first drive unit (140). The boat (110) may serve to transport a plurality of substrates to the diffusion furnace (10). A plurality of substrates may be placed on the boat (110). The paddle (120) may carry the boat (110). Referring to FIG. 1, the paddle (120) may be extended in a first direction (X-axis). The first power unit (130) may provide power for the first transfer unit (100) to move the paddle (120) in the first direction (X-axis). In one embodiment, the first power unit (130) may be a motor. The first drive unit (140) may move the paddle (120) in the first direction (X-axis) using the power provided by the first power unit (130). The driving method of the first driving unit (140) is not particularly limited.

[0039] The second transfer unit (200) can load or unload the paddle (120) carrying the boat (110) with the substrate mounted thereon into the diffusion furnace (10) together with the first transfer unit (100). Specifically, the second transfer unit (200) can move the paddle (120) carrying the boat (110) with the substrate mounted thereon in a second direction (Z-axis). That is, the second direction (Z-axis) refers to the up and down direction.

[0040] The second transfer unit (200) can serve to separate the paddle (120) from the boat (110) that has entered the diffusion path (10) by the first transfer unit (100). The paddle (120) separated from the boat (110) by the second transfer unit (200) can be transported back out of the diffusion path (10) by the first transfer unit (100).

[0041] The second transfer unit (200) may include a second power unit (210) and a second drive unit (220). The second power unit (210) may provide power for the second transfer unit (200) to move the paddle (120) in a second direction (Z-axis). In one embodiment, the second power unit (210) may be a motor. The second drive unit (220) may move the paddle (120) in a second direction (Z-axis) using the power provided by the second power unit (210). The driving method of the second drive unit (220) is not particularly limited.

[0042] The cooling unit (300) can serve to cool the substrate unloaded from the diffusion furnace (10) after the diffusion process is completed. After the diffusion process is completed, the substrate may be in a high-temperature state because heat is applied inside the diffusion furnace (10) by the diffusion process. The substrate after the diffusion process must be cooled before proceeding to the next process. The cooling unit (300) can contribute to improving the productivity of the solar cell by increasing the cooling speed of the substrate after the diffusion process.

[0043] The cooling unit (300) cools the high-temperature substrate and simultaneously cools other components of the substrate loading device (1), thereby preventing thermal damage to the substrate loading device (1) caused by heat emitted by the high-temperature substrate. Accordingly, the substrate loading device (1) can operate smoothly. In addition, the lifespan of the substrate loading device (1) is extended, which can save costs in the solar cell manufacturing process.

[0044] Referring to FIG. 2, the cooling unit (300) can be positioned along the longitudinal direction (X-axis) of the paddle (120) on one side of the first transfer unit (100). The boat (110) on which the substrate is placed can be positioned along the longitudinal direction (X-axis) of the paddle (120). By positioning the cooling unit (300) in the same direction as the boat (110), the cooling efficiency of the substrate can be improved.

[0045] FIG. 3 is a drawing showing the location of the cooling channel (330) as viewed from the diffusion path (10) of a substrate loading device (1) according to one embodiment of the present invention.

[0046] Referring to FIGS. 1 to 3, the cooling portion (300) may be in the shape of a plate having a predetermined thickness, including a first surface (310) facing the first transfer portion (100) and a second surface (320) facing the opposite direction.

[0047] The cooling section (300) may include a cooling channel (330) through which a cooling fluid (CF) flows. The cooling fluid (CF) is not particularly limited. In one embodiment, the cooling fluid (CF) may include water, ethylene glycol, or propylene glycol. The cooling channel (330) may be in the form of a tube having a predetermined inner diameter. The material of the cooling channel (330) may include a material with excellent thermal conductivity. In one embodiment, the material of the cooling channel (330) may include an aluminum alloy.

[0048] The cooling unit (300) can radiatively cool the substrate by flowing a cooling fluid (CF) through the cooling channel (330). By radiatively cooling without the cooling fluid (CF) coming into direct contact with the substrate, the substrate can be protected from friction caused by fine particles that may be contained in the cooling fluid (CF).

[0049] The cooling channel (330) may be positioned parallel to the longitudinal direction (X-axis) of the paddle (120). The cooling channel (330) may be embedded in a plate comprising a first surface (310) and a second surface (320). More specifically, with reference to FIG. 3, the cooling channel (330) may be positioned closer to the second surface (320), which is in the opposite direction of the first surface (310), than to the first surface (310), which is facing the first transfer section (100). In other words, the cooling channel (330) may be positioned in a direction away from the boat (110) on which the substrate is placed, in the cooling section (300) which is in the form of a plate. Accordingly, damage to the cooling channel (330) from a large amount of heat emitted from the substrate may be prevented, and a decrease in the cooling efficiency of the cooling fluid (CF) due to said heat may be prevented.

[0050] FIG. 4 is a drawing showing various embodiments of the present invention for a cooling unit (300).

[0051] The cooling unit (300) may include a flow member (not shown) that allows the cooling fluid (CF) to flow through the cooling channel (330) and a cooling fluid storage tank (not shown) that stores and supplies the cooling fluid (CF).

[0052] The cooling channel (330) may include an inlet (330i) and an outlet (330e) connected to a cooling fluid storage tank. The inlet (330i) may be an inlet where the cooling fluid (CF) enters the cooling channel (330) from the cooling fluid storage tank. The outlet (330e) may be an outlet where the cooling fluid (CF) that has flowed through the cooling channel (330) exits toward the cooling fluid storage tank. The locations of the inlet (330i) and the outlet (330e) may vary depending on the arrangement of the cooling channel (330).

[0053] In one embodiment, referring to FIG. 4(a) and FIG. 4(b), the cooling channel (330) may be arranged in a zigzag shape. As shown in FIG. 4(a), the cooling channel (330A) may be arranged such that the main flow direction of the cooling fluid (CF) is in the Z-axis direction or opposite to the Z-axis direction, and alternately changes direction at the top and bottom.

[0054] At this time, the inlet port (330Ai) may be positioned closer to the diffusion furnace (10) than the outlet port (330Ae) on the X-axis. The closer to the diffusion furnace (10), the higher the temperature of the substrate may be. Therefore, by positioning the inlet port (330Ai) closer to the diffusion furnace (10) than the outlet port (330Ae), the substrate positioned along the length direction (X-axis) of the paddle can be uniformly cooled.

[0055] Meanwhile, the margin width (s) of the portion where the upper or lower cooling channel (330A) is not placed is not specifically limited. In one embodiment, the margin width (s) may be 10% to 15% of the total width in the Z-axis direction of the cooling portion (300A).

[0056] As shown in FIG. 4 (b), the cooling channel (330B) may be arranged such that the main flow direction of the cooling fluid (CF) is in the X-axis direction or the opposite direction of the X-axis, and alternately changes direction at one end in the X-axis direction and the other end in the opposite direction of the X-axis.

[0057] At this time, the inlet (330Bi) and the outlet (330Be) may be positioned on the X-axis in the opposite direction of the diffusion furnace (10). The inlet (330Bi) and the outlet (330Be) may be connected to a flow member and a cooling fluid storage tank. The flow member and the cooling fluid storage tank may be positioned in the opposite direction of the diffusion furnace (10). Thus, by positioning the inlet (330Bi) and the outlet (330Be) in the opposite direction of the diffusion furnace (10), the unnecessary flow distance of the cooling fluid (CF) can be reduced, and accordingly, the overall cooling efficiency can be improved.

[0058] In another embodiment, referring to FIG. 4(c) and FIG. 4(d), the cooling channel (330) may be arranged in a grid shape. The cooling channel (330C) may be arranged in a form in which a plurality of grids, with a length in the Z-axis direction longer than the length in the X-axis direction as shown in FIG. 4(c), are arranged along the length direction (X-axis) of the paddle (120). In this case, the inlet (330Ci) may be positioned closer to the diffusion channel (10) than the outlet (330Ce) on the X-axis.

[0059] Meanwhile, the cooling channel (330D) may be in the form of a plurality of grids arranged in a plurality of columns and a plurality of rows, as shown in (d) of FIG. 4. In this case, the inlet (330Di) may be positioned closer to the diffusion channel (10) than the outlet (330De) on the X-axis.

[0060] FIG. 5 is a drawing showing a cooling unit (300E) including a plurality of regions (A) as an embodiment of the present invention.

[0061] Referring to FIG. 5, the cooling section (300E) may include a first region (A1), a second region (A2), and a third region (A3). The first region (A1) may be located closest to the diffusion furnace (10) on the X-axis. The second region (A2) may be located in the opposite direction of the diffusion furnace (10) relative to the first region (A1) on the X-axis. The third region (A3) may be located in the opposite direction of the diffusion furnace relative to the second region (A2) on the X-axis. That is, the first region (A1), the second region (A2), and the third region (A3) may be located sequentially in the direction away from the diffusion furnace (10) on the X-axis.

[0062] The cooling channel (330E) may include a first cooling channel (331E), a second cooling channel (332E), and a third cooling channel (333E). The first cooling channel (331E) may be placed on a first area (A1). The second cooling channel (332E) may be placed on a second area (A2). The third cooling channel (333E) may be placed on a third area (A3). That is, the first area (A1) may have the first cooling channel (331E). The second area (A2) may have the second cooling channel (332E). The third area (A3) may have the third cooling channel (333E).

[0063] Referring to FIG. 5, the first cooling channel (331E), the second cooling channel (332E), and the third cooling channel (333E) can all be connected in sequence. In other words, the cooling channel (330E) may include only one total inlet (330Ei) and one total outlet (330Ee). Specifically, referring to FIG. 5, one end of the first cooling channel (331E) is connected to the total inlet (330Ei), the other end of the first cooling channel (331E) is connected to the second cooling channel (332E), the other end of the second cooling channel (332E) is connected to one end of the third cooling channel (333E), and the other end of the third cooling channel (333E) is connected to the total outlet (330Ee). Accordingly, the manufacturing of the cooling unit (300E) can be facilitated. In addition, by simplifying the configuration of the cooling unit (300E) so as not to hinder the movement of the paddle (120) by the first transfer unit (100) and the second transfer unit (200), the substrate loading device (1) can smoothly perform the loading and unloading of the boat (110).

[0064] The cooling unit (300E) may further include a fourth region (A4). The fourth region (A4) may be an area where a cooling channel (330E) is not placed, as shown in FIG. 5. The cooling unit (300E) may include at least one fourth region (A4). In one embodiment, the fourth region (A4) may be located at each of the two ends of the cooling unit (300E) based on the X-axis. Referring to FIG. 1 and FIG. 2, a first driving unit (140) or a second driving unit (220) may be located at both ends of the cooling unit (300) based on the X-axis. That is, by ensuring that cooling channels (330E) are not placed at both ends of the X-axis of the cooling unit (300E) in consideration of the locations where other components of the first transfer unit (100) and the second transfer unit (200) are to be placed, the first transfer unit (100) and the second transfer unit (200) can operate smoothly without being affected by the cooling unit (300E).

[0065] The first region (A1), the second region (A2), and the third region (A3) may all have different cooling characteristics. The amount of heat absorbed by the substrate unloaded from the diffusion furnace (10) may vary depending on the X-axis direction. Taking this into account, the cooling characteristics of the first region (A1), the second region (A2), and the third region (A3) are all different, thereby allowing the substrate to be cooled uniformly regardless of its position. Accordingly, the uniformity characteristics of the substrate can be maintained.

[0066] The area of ​​the first region (A1) may be narrower than the area of ​​the second region (A2) and the area of ​​the third region (A3), and the area of ​​the second region (A2) may be narrower than the area of ​​the third region (A3). Referring to FIG. 4, since the lengths in the Z-axis direction of the cooling section (300E) are all the same, the length (L1) of the first region may be shorter than the length (L2) of the second region and the length (L3) of the third region, and the length (L2) of the second region may be shorter than the length (L3) of the third region.

[0067] In one embodiment, the ratio of the length of the first region (L1) to the length in the X-axis direction (L, hereinafter referred to as the total length of the cooling section) of the cooling section (300E) may be 5% to 20%. The ratio of the length of the second region (L2) to the total length (L) of the cooling section may be 25% to 35%. The ratio of the length of the third region (L3) to the total length (L) of the cooling section may be 30% to 40%.

[0068] In one embodiment, the length of the second region (L2) may be 1.5 to 2.5 times the length of the first region (L1). The length of the third region (L3) may be 2 to 3 times the length of the first region (L1).

[0069] The closer to the diffusion path (10), the greater the temperature change of the substrate. Therefore, by subdividing the section where the cooling characteristics change as it gets closer to the diffusion path (10) as described above, the overall cooling efficiency can be improved, and at the same time, the reliability of the uniformity of the substrate can be improved.

[0070] Generally, the closer a substrate is to the diffusion furnace (10), the more heat can be absorbed. That is, the substrate placed at the position corresponding to the first region (A1) closest to the diffusion furnace (10) may be in the highest temperature state. In other words, the substrate placed at the position corresponding to the first region (A1) may be at a higher temperature than the substrate placed at the position corresponding to the second region (A2), and the substrate placed at the position corresponding to the second region (A2) may be at a higher temperature than the substrate placed at the position corresponding to the third region (A3).

[0071] The cooling capacity (R1) of the first region may be greater than the cooling capacity (R2) of the second region and the cooling capacity (R3) of the third region (A3), and the cooling capacity (R2) of the second region may be greater than the cooling capacity (R3) of the third region. In other words, the cooling capacity (R) may be greater the closer the region (A) is to the diffusion furnace (10). That is, the higher the temperature of the substrate, the greater the cooling capacity (R) of the corresponding region (A), thereby improving the overall cooling efficiency and maintaining reliability regarding the uniformity of the substrate.

[0072] The flow channel arrangement density (D1) of the first region may be greater than the flow channel arrangement density (D2) of the second region and the flow channel arrangement density (D3) of the third region, and the flow channel arrangement density (D2) of the second region may be greater than the flow channel arrangement density (D3) of the third region. That is, the flow channel arrangement density (D) may be greater the closer the region (A) is to the diffusion furnace (10). The flow channel arrangement density (D) refers to the length (M) of the cooling flow channel relative to the area of ​​the region.

[0073] In one embodiment, the ratio of the length of the first cooling channel (P1) to the total length (P) of the cooling channel may be 20% to 30%. The ratio of the length of the second cooling channel (P2) to the total length (P) of the cooling channel may be 35% to 45%. The ratio of the length of the third cooling channel (P3) to the total length (P) of the cooling channel may be 25% to 35%.

[0074] In one embodiment, the length (P2) of the second cooling channel may be 1.2 to 2 times the length (P1) of the first cooling channel. The length (P3) of the third cooling channel may be 0.9 to 1.5 times the length (P1) of the first cooling channel.

[0075] As described above, since the lengths in the Z-axis direction of the cooling section (300E) are all the same, the ratio to the length (L) of each region (A) is equal to the ratio to the area of ​​each region (A). For example, according to the above-described embodiment, the area of ​​the second region (A2) is 1.5 to 2.5 times the area of ​​the first region (A1), while the length (P2) of the second cooling channel may be 1.2 to 2 times the length (P1) of the first cooling channel. Since the multiple of the area of ​​the region is greater than the multiple of the length of the cooling channel, the channel arrangement density (D2) of the second region is smaller than the channel arrangement density (D1) of the first region.

[0076] The greater the flow channel arrangement density (D), the greater the cooling capacity (R). Therefore, by increasing the flow channel arrangement density (D) in the region (A) closer to the diffusion furnace (10), the cooling capacity (R) can be increased for high-temperature substrates. Accordingly, the overall cooling efficiency can be improved, and reliability regarding the uniformity of the substrate can be maintained.

[0077] Referring to FIG. 5, the main flow direction of the cooling channel (330E) is the Z-axis direction or the opposite direction of the Z-axis, and the main flow paths can be arranged at a predetermined interval (G, hereinafter referred to as the cooling channel arrangement interval) for each region (A). At this time, the size of the arrangement interval (G) of the cooling channel may differ for each region (A).

[0078] Specifically, referring to FIG. 5, the spacing (G1) of the first cooling channel may be narrower than the spacing (G2) of the second cooling channel and the spacing (G3) of the third cooling channel, and the spacing (G2) of the second cooling channel may be narrower than the spacing (G3) of the third cooling channel. That is, the spacing (G) of the cooling channel may be narrower in the region (A) closer to the diffusion channel (10).

[0079] In one embodiment, the spacing (G2) of the second cooling channel may be 1.5 to 2.5 times the spacing (G1) of the first cooling channel. The spacing (G3) of the third cooling channel may be 3 to 5 times the spacing (G1) of the first cooling channel.

[0080] Referring to FIG. 5, the smaller the spacing (G) of the cooling channels, the greater the channel spacing density (D). As previously mentioned, the greater the channel spacing density (D), the greater the cooling capacity (R). That is, the smaller the spacing (G) of the cooling channels, the greater the cooling capacity (R). Therefore, by making the spacing (G) of the cooling channels narrower in the region (A) closer to the diffusion furnace (10), the overall cooling efficiency can be improved while maintaining reliability regarding the uniformity of the substrate.

[0081] FIG. 6 is a drawing showing a cooling section (300F) in which the spacing (G) of the cooling channels differs according to each region (A), as another embodiment of the present invention.

[0082] In the case of the cooling section (300F), referring to FIG. 6, the cooling channel (330F) has a main flow direction in the X-axis direction or the opposite direction to the X-axis, and the main flow path can be arranged with a spacing (G) of the cooling channel for each region (A). At this time, the size of the spacing (G) of the cooling channel may differ for each region (A).

[0083] Specifically, referring to FIG. 6, the spacing (G4) of the first cooling channel may be narrower than the spacing (G5) of the second cooling channel and the spacing (G6) of the third cooling channel, and the spacing (G5) of the second cooling channel may be narrower than the spacing (G6) of the third cooling channel.

[0084] FIG. 7 is a drawing showing a cooling section (300G) in which the spacing (G) of the cooling channels changes continuously, as another embodiment of the present invention.

[0085] Referring to FIG. 7, the spacing (G) of the cooling channels can be narrowed as they get closer to the diffusion path (10), regardless of the region (A). That is, even within a single region (A), the spacing (G) of the cooling channels can vary depending on the location. Additionally, the spacing (G7) of the cooling channels furthest from the diffusion path (10) along the X-axis within the first region (A1) can be smaller than the spacing (G8) of the cooling channels spanning the boundary between the first region (A1) and the second region (A2), and the spacing (G9) of the cooling channels closest to the diffusion path (10) along the X-axis in the second region (A2). The spacing (G8) of the cooling channels can be smaller than the spacing (G9) of the cooling channels. Additionally, the spacing (G10) of the cooling channel furthest from the diffusion path (10) along the X-axis within the second region (A2) may be smaller than the spacing (G11) of the cooling channel at the boundary between the second region (A2) and the third region (A3), and the spacing (G12) of the cooling channel closest to the diffusion path (10) along the X-axis in the third region (A3). The spacing (G11) of the cooling channel may be smaller than the spacing (G12) of the cooling channel.

[0086] The temperature of the substrate can vary continuously depending on the position away from the diffusion path (10). By making the spacing (G) of the cooling paths continuously narrow as they get closer to the diffusion path (10) regardless of the area (A), the cooling efficiency according to the position can be maximized and the reliability of the uniformity of the substrate can be further increased.

[0087] The degree of change in the spacing (G) of the cooling channels may vary depending on the temperature change trend of the substrate according to the actual X-axis position.

[0088] FIG. 8 is a drawing showing a cooling unit (300H) in which a plurality of cooling channels each have an inlet and an outlet, as another embodiment of the present invention.

[0089] In the cooling section (300H), the first cooling channel (331H), the second cooling channel (332H), and the third cooling channel (333H) are separated from each other and may each have an inlet and an outlet independently. Specifically, the first cooling channel (331H) may have a first inlet (331Hi) and a first outlet (331He) at both ends. The second cooling channel (332H) may have a second inlet (332Hi) and a second outlet (332He) at both ends. The third cooling channel (333H) may have a third inlet (333Hi) and a third outlet (333He) at both ends. In other words, the first outlet (331He) may not be connected to the second inlet (332Hi), and the second outlet (332He) may not be connected to the third inlet (333Hi). Accordingly, by more finely controlling the cooling characteristics for each region (A), the overall cooling efficiency can be further improved and the uniformity of the substrate can be improved.

[0090] The first cooling channel (331H), the second cooling channel (332H), and the third cooling channel (333H) can each be connected to a separate, independent flow member (not shown) and a cooling fluid storage tank (not shown).

[0091] The cooling fluids (CF) flowing in the first cooling channel (331H), the second cooling channel (332H), and the third cooling channel (333H) may all be different. In one embodiment, the first cooling fluid (CF1) flowing in the first cooling channel (331H) may contain a material with a greater cooling capacity than the second cooling fluid (CF2) flowing in the second cooling channel (332H) and the third cooling fluid (CF3) flowing in the third cooling channel (333H), and the second cooling fluid (CF2) may contain a material with a greater cooling capacity than the third cooling fluid (CF3). That is, the closer the region (A) is to the diffusion furnace (10), the greater the cooling capacity of the material contained in the cooling fluid flowing in the cooling channel within that region. Accordingly, the overall cooling efficiency can be further improved, and the uniformity of the substrate can be further improved.

[0092] The flow rates of the first cooling channel (331H), the second cooling channel (332H), and the third cooling channel (333H) may all be different. In one embodiment, the flow rate of the first cooling channel (331H) may be faster than the flow rate of the second cooling channel (332H) and the flow rate of the third cooling channel (333H), and the flow rate of the second cooling channel (332H) may be faster than the flow rate of the third cooling channel (333H). That is, the closer the region (A) is to the diffusion channel (10), the faster the flow rate of the cooling channel within that region may be. The faster the flow rate of the cooling channel, the better the cooling capacity may be. That is, the closer the region (A) is to the diffusion channel (10), the higher the cooling capacity may be. Accordingly, the overall cooling efficiency can be further improved, and the reliability regarding the uniformity of the substrate can be further ensured.

[0093] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative. Those skilled in the art will fully understand that various modifications and equivalent alternative embodiments are possible from the embodiments. Accordingly, the true technical scope of protection of the present invention should be determined based on the appended claims.

[0094] The specific technical details described in the embodiments are merely examples and do not limit the technical scope of the embodiments. To make the description of the invention concise and clear, descriptions of general prior art and configurations may be omitted. Furthermore, the connections of lines or connecting members between components depicted in the drawings are illustrative of functional connections and / or physical or circuit connections, and may be replaced or represented by various additional functional, physical, or circuit connections in actual devices. Additionally, unless specifically stated with terms such as "essential" or "importantly," a component may not be strictly necessary for the application of the present invention.

[0095] The term "the above" or similar designations in the description of the invention and claims may refer to both singular and plural forms unless specifically limited otherwise. Furthermore, where a range is described in the embodiments, it is considered to include the invention with respect to individual values ​​within said range (unless otherwise stated), and is equivalent to describing each individual value constituting said range in the description of the invention. Additionally, regarding the steps constituting the method according to the embodiments, the steps may be performed in a suitable order unless explicitly stated or otherwise stated. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., etc.) in the embodiments is merely for the purpose of describing the embodiments in detail, and the scope of the embodiments is not limited by said examples or exemplary terms unless otherwise limited by the claims. Furthermore, a person skilled in the art will understand that various modifications, combinations, and changes may be made according to design conditions and factors within the scope of the claims or equivalents to which they are added. Explanation of the symbols

[0096] 1: Substrate loading device 10: Diffusion furnace 100: 1st transfer unit 200: 2nd transfer unit 300(300A, 300B, 300C, 300D, 300E, 300F, 300G, 300H): Cooling section 330: Cooling Euro 330i: Inlet 330e: Outlet A1: Area 1 A2: Area 2 A3: Area 3 A4: Area 4 G: Spacing of cooling channels

Claims

Claim 1 A first transfer unit for moving a paddle carrying a boat on which a plurality of substrates are mounted in a first direction toward a diffusion furnace; a second transfer unit for moving the paddle in a second direction; and a cooling unit comprising a cooling channel through which a cooling fluid flows, arranged in the longitudinal direction of the paddle on one side of the first transfer unit; wherein the cooling channel comprises a first cooling channel, a second cooling channel, and a third cooling channel, and the cooling unit comprises a first region having the first cooling channel; and a second region having the second cooling channel and located in the opposite direction of the diffusion furnace relative to the first region. A substrate loading device comprising: a third region having the third cooling channel and located opposite to the diffusion channel with respect to the second region; wherein the area of ​​the first region is narrower than the area of ​​the second region and the area of ​​the third region, the area of ​​the second region is narrower than the area of ​​the third region, the channel arrangement density of the first region is greater than the channel arrangement density of the second region and the channel arrangement density of the third region, and the channel arrangement density of the second region is greater than the channel arrangement density of the third region. Claim 2 A substrate loading device according to claim 1, wherein the cooling portion is plate-shaped, and the cooling channel is positioned closer to the second surface of the cooling portion opposite to the first surface than to the first surface of the cooling portion facing the first transfer portion. Claim 3 delete Claim 4 A substrate loading device according to claim 1, wherein the first region, the second region, and the third region all have different cooling characteristics. Claim 5 delete Claim 6 A substrate loading device according to claim 1, wherein the cooling capacity of the first region is greater than the cooling capacity of the second region and the cooling capacity of the third region, and the cooling capacity of the second region is greater than the cooling capacity of the third region. Claim 7 delete Claim 8 A substrate loading device according to claim 1, wherein the first cooling channel, the second cooling channel, and the third cooling channel are all connected in order. Claim 9 A substrate loading device according to claim 1, wherein the first cooling channel, the second cooling channel, and the third cooling channel are separated from each other and each have an inlet and an outlet independently. Claim 10 A substrate loading device according to claim 1, wherein the spacing of the cooling channels becomes narrower as it approaches the diffusion channel.

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