Apparatus for processing substrate

Abstract

The present invention provides a substrate processing apparatus comprising: a chamber; a plurality of sub-boats loaded with a plurality of wafers inside and connected in parallel along the longitudinal direction to enter and exit the chamber; a gas supply unit positioned along the longitudinal direction of the sub-boats on one side inside the chamber to supply gas toward one side of the sub-boats; a gas discharge unit on the other side inside the chamber to discharge gas discharged from the other side of the sub-boats to the outside; and a guide unit that guides the gas supplied from the gas supply unit to flow into the sub-boats.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of guiding gas supplied from a gas supply unit to be supplied intact toward a sub-boat loaded with a wafer inside a chamber. Background Technology

[0002] Generally, Atomic Layer Deposition (ALD) is a technology for depositing a thin film that serves as a protective layer on semiconductor memory devices. It involves depositing atomic layers by thermally decomposing gases introduced into a vacuum chamber, and continuous efforts are being made to improve the equipment or processes for forming high-quality thin films on substrates.

[0003] Recently, a technology has been developed to reduce the processing time per wafer through batch-type deposition equipment that processes multiple wafers simultaneously with a single deposition machine.

[0004] In the case of an atomic layer deposition apparatus, it may include a sub-boat for loading a plurality of wafers, a vacuum chamber responsible for atomic layer deposition in a vacuum region, a gas supply unit for supplying gas inside the chamber, a gas discharge unit for discharging gas after the reaction, and a door unit for opening and closing the opening of the vacuum chamber.

[0005] In this way, when the sub-boat is supplied into the chamber, gas is supplied toward the wafer within the set temperature range.

[0006] However, a problem has been raised regarding the gas supply unit supplying gas into the vacuum chamber; the gas discharged from the unit is not fully delivered to the sub-boat and leaks out around the sub-boat. Furthermore, this leakage is currently resulting in the unnecessary consumption of a large amount of gas. Prior art literature

[0007] Korean Patent Publication No. 10-1661097 (Registered September 23, 2016) The problem to be solved

[0008] The present invention aims to solve such problems, and more specifically, to provide a substrate processing device capable of guiding gas supplied from a gas supply unit to be supplied intact toward a sub-boat loaded with a wafer inside a chamber.

[0009] The problems of the present invention are not limited to those mentioned above, and other unmentioned objectives will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0010] To achieve the above objective, the present invention provides a substrate processing apparatus comprising: a chamber; a plurality of sub-boats loaded with a plurality of wafers inside and connected in parallel along the longitudinal direction to enter and exit the chamber; a gas supply unit positioned along the longitudinal direction of the sub-boats on one side inside the chamber to supply gas toward one side of the sub-boats; a gas discharge unit on the other side inside the chamber to discharge gas discharged from the other side of the sub-boats to the outside; and a guide unit that guides the gas supplied from the gas supply unit to flow into the sub-boats.

[0011] The guide portion may include an upper plate extending adjacent to the upper surface of the sub-boat from the upper side of the chamber, and a lower plate extending adjacent to the lower surface of the sub-boat from the lower side of the chamber.

[0012] The above guide portion may include a connecting plate connecting the starting areas of the upper plate and the lower plate on the inner side of the chamber.

[0013] The chamber may include a guide groove formed to face the connecting plate along the longitudinal direction of the sub-boat.

[0014] The above chamber may be formed so that the coupling part having the guide groove formed therein is detachable.

[0015] The above connecting plate may include a protrusion that is slidably coupled onto the guide groove.

[0016] The above guide portion may include an upper protrusion that connects the upper plate to one side of the interior of the chamber, and a lower protrusion that connects the lower plate to one side of the interior of the chamber.

[0017] The chamber may include an upper guide groove formed to allow the upper protrusion to be slidably coupled, and a lower guide groove formed parallel to the upper guide groove to allow the lower protrusion to be slidably coupled.

[0018] The above guide section may include a bulkhead that partitions the space between the upper plate and the lower plate to correspond to the gap of the sub-boat.

[0019] The above guide portion may include an inclined plate that is bent at the leading edge of the bulkhead to correspond to the width of the sub-boat.

[0020] The above guide section may include inclined plates that are bent to both sides to correspond to the gap between the sub-boat and another adjacent sub-boat at the leading edge of the bulkhead.

[0021] The guide portion includes an overlapping portion disposed to overlap with the upper or lower surface of the sub-boat, respectively, from the upper plate or lower plate, and the overlapping portion may be spaced apart from the sub-boat.

[0022] The above-mentioned overlapping portion may have a protrusion or a recess formed to correspond to the recess or protrusion formed in the sub-boat.

[0023] The above sub-boat may include an inclined member that deflects gas supplied from the gas supply unit into the sub-boat from the inside of the overlapping portion.

[0024] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0025] According to the substrate processing apparatus according to an embodiment of the present invention,

[0026] First, the gas can be fully guided from the gas supply unit to the sub-boat inside the chamber, and

[0027] Second, the guide part is detachable, making replacement easy, and

[0028] Third, by minimizing gas leakage around the sub-boat, gas consumption can be reduced while preventing deposition from occurring inside the chamber, and

[0029] Fourth, the guide part can be attached and detached, which has the effect of shortening cleaning time.

[0030] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims. Brief explanation of the drawing

[0031] The summary described above, as well as the detailed description of the preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings. Preferred embodiments are illustrated in the drawings for the purpose of illustrating the present invention. However, it should be understood that the present application is not limited to the exact arrangements and means illustrated. FIG. 1 is a perspective view schematically illustrating a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating the AA' region of the substrate processing device shown in FIG. 1. FIG. 3 is a reference diagram illustrating another embodiment of the guide portion of the substrate processing device shown in FIG. 1. FIG. 4 is a perspective view schematically illustrating a substrate processing apparatus according to a second embodiment of the present invention. Figure 5 is a cross-sectional view illustrating the BB' region of the substrate processing device shown in Figure 4. Figure 6 is a top view of the substrate processing apparatus shown in Figure 4. FIGS. 7 and 8 are plan views illustrating other embodiments of the plate of the substrate processing device shown in FIG. 6. FIG. 9 is a reference diagram illustrating a substrate processing apparatus according to a third embodiment of the present invention. FIG. 10 is a reference diagram illustrating another embodiment of the chamber of the substrate processing device shown in FIG. 9. FIG. 11 is a reference diagram illustrating another embodiment of the gas supply unit of the substrate processing device shown in FIG. 9. FIG. 12 is a reference diagram illustrating another embodiment of the guide portion of the substrate processing device shown in FIG. 11. FIGS. 13 to 15 are reference drawings illustrating various embodiments according to the shape of the guide portion of a substrate processing device according to the present invention. Specific details for implementing the invention

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0033] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated and described in the drawings.

[0034] However, this is not intended to limit the invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0035] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms.

[0036] The above terms are used solely for the purpose of distinguishing one component from another.

[0037] For example, without departing from the scope of the present invention, the second component may be named the first component, and similarly, the first component may be named the second component.

[0038] The term "and / or" includes a combination of multiple related listed items or any of the multiple related listed items.

[0039] When it is stated that one component is "connected" or "joined" to another component, it should be understood that while it may be directly connected or joined to that other component, there may also be other components in between.

[0040] On the other hand, when it is stated that one component is "directly connected" or "directly coupled" to another component, it should be understood that there are no other components in between.

[0041] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention.

[0042] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0043] In this application, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0044] Hereinafter, embodiments will be described in detail with reference to the attached drawings, provided that identical or corresponding components are given the same reference number regardless of the drawing symbols, and redundant descriptions thereof will be omitted.

[0045] FIG. 1 is a perspective view schematically illustrating a substrate processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating the AA' region of the substrate processing apparatus shown in FIG. 1.

[0046] Referring to FIGS. 1 and 2, a substrate processing device (100) according to an embodiment of the present invention may include a chamber (110), a subboat (120), a gas supply unit (130), a gas discharge unit (140), and a guide unit (150).

[0047] First, the chamber (110) can be applied, for example, as a deposition chamber where an atomic layer deposition (ALD) process is performed. Here, atomic layer deposition is a technology for depositing a thin film, which serves as a protective layer on a semiconductor memory device, and is a technology for forming a high-quality thin film on a substrate by thermally decomposing a gas introduced into the deposition chamber and depositing it as an atomic layer.

[0048] The chamber (110) is formed in a roughly rectangular shape, and in some cases, may be provided in a cylindrical shape.

[0049] Additionally, the sub-boat (120) can accommodate multiple wafers (W) inside and move in and out of the chamber (110). Although not shown in the drawing, the sub-boat (120) is equipped with a mother boat (not shown) that moves in and out of the chamber (110), and multiple sub-boats (120) are mounted on the mother boat to move in and out of the chamber (110) simultaneously. At this time, wafers can be loaded in parallel within the sub-boat (120) to correspond to the direction of gas flow (e.g., x-axis direction) within the chamber (110). For example, the wafers can be arranged parallel to the ground (e.g., z-axis direction) within the sub-boat (120) and loaded in multiple layers in a vertical direction (e.g., y-axis direction), or arranged to stand upright in a direction perpendicular to the ground (e.g., along the y-axis direction) to form multiple layers in a horizontal direction (e.g., z-axis direction). Of course, each wafer inside the sub-boat (120) can be arranged side by side with respect to the ground or the direction of gas flow (x-axis direction) and can be arranged with a certain inclination.

[0050] Additionally, a gas supply unit (130) may be provided on one side of the chamber (110), and a gas discharge unit (140) may be provided on the other side facing it. In this embodiment, the gas supply unit (130) and the gas discharge unit (140) are shown as being spaced apart from each other in the longitudinal direction (z-axis direction) and the orthogonal direction (x-axis direction) of the chamber (110) as an example. At this time, the gas supply unit (130) may have gas nozzles or gas holes (131) formed in a pattern set toward the sub-boat (120). In this embodiment, the gas holes (131) are shown as being formed as an example, and the gas holes (131) may be formed to spray gas uniformly in correspondence with the height of each wafer (W) or the spacing or width between wafers.

[0051] Additionally, the gas discharge section (140) may be configured such that a plurality of discharge holes (not shown) are formed along the longitudinal direction (z-axis direction) of the sub-boat (120) on the other side of the chamber (110), and gas introduced into each discharge hole is collected and discharged along a single discharge pipe (141).

[0052] Therefore, the distance the gas travels from the gas supply unit (130) to the gas discharge unit (140) can be reduced, so that the distribution and density of the gas inside the chamber (110) can be maintained uniformly, and the flow of the gas can also be controlled smoothly.

[0053] And, the guide section (150) can provide a function of guiding the gas supplied from the gas supply section (130) inside the chamber (110) to flow entirely into the sub-boat (120).

[0054] The guide portion (150) may include an upper plate (151) and a lower plate (152).

[0055] The upper plate (151) may be positioned on the upper side of one side of the chamber (110) where the gas supply unit (130) is located inside the chamber (110). Additionally, the lower plate (152) may be positioned relatively lower and spaced apart from the upper plate (151) so as to face it with the gas supply unit (130) at the center.

[0056] The upper plate (151) may be positioned adjacent to the upper side of one side of the sub-boat (120), and the lower plate (152) may be positioned adjacent to the lower side of one side of the sub-boat (120). At this time, the tip of the upper plate (151) may be positioned parallel to the upper surface of one side of the sub-boat (120) or positioned below the upper surface, and the tip of the lower plate (152) may be positioned parallel to the lower surface of one side of the sub-boat (120) or positioned above the lower surface. Accordingly, the guide portion (150) can guide the gas discharged from the gas supply portion (130) so that it does not leak out to the outer periphery of the sub-boat (120) but flows entirely into the interior of the sub-boat (120).

[0057] Additionally, the guide section (150') may be provided on the other side of the chamber (110) between the sub-boat (120) and the gas discharge section (140). Of course, the guide section (150') provided on the side of the gas discharge section (140) may provide the function of guiding the gas from the sub-boat (120) to the discharge pipe (141) so that it is fully delivered.

[0058] FIG. 3 is a reference diagram illustrating another embodiment of the guide portion of the substrate processing device shown in FIG. 1.

[0059] Referring to FIG. 3, the substrate processing device (100) has a difference in the structure of the guide part (150).

[0060] The guide portion (150) may include an upper plate (151), a lower plate (152), and a connecting plate (153).

[0061] The upper plate (151) and the lower plate (152) are identical to those described above, so a redundant description is omitted.

[0062] The connecting plate (153) can be positioned to connect the starting regions of the upper plate (151) and the lower plate (152) to each other. That is, the connecting plate (153) can be positioned parallel to one side of the chamber (110), with the upper plate (151) positioned on top and the lower plate (152) positioned on the bottom. Of course, the upper plate (151) and the lower plate (152) can be assembled around the connecting plate (153) or processed as a single unit.

[0063] When the connecting plate (153) is provided in this manner, the guide portion (150) can be coupled to one side of the chamber (110) with the connecting plate (153) as the center. The connecting plate (153) can be installed on the chamber (110) by forming a hole (153a) on the back surface facing one side of the chamber (110) and inserting an assembly pin (153b) fixed to one side of the chamber (110) into the hole (153a).

[0064] Although not shown in the drawing, the assembly pin (153b) may be configured to be joined to the starting area of ​​the upper plate (151) or lower plate (152).

[0065] FIG. 4 is a perspective view schematically illustrating a substrate processing apparatus according to a second embodiment of the present invention, FIG. 5 is a cross-sectional view illustrating the BB' region of the substrate processing apparatus shown in FIG. 4, and FIG. 6 is a top view of the substrate processing apparatus shown in FIG. 4.

[0066] Referring to FIGS. 4 to 6, the guide portion (150) may include an upper plate (151), a lower plate (152), a connecting plate (153), and an overlapping portion (154).

[0067] The upper plate (151) and the lower plate (152) may each include an overlapping portion (154) positioned in an area corresponding to the upper and lower surfaces of the sub-boat (120). The overlapping portion (154) may be spaced apart from the sub-boat (120). That is, the upper plate (151) may have an upper overlapping portion (154a) formed that is extended further by the area facing the upper surface of the sub-boat (120), and the lower plate (152) may have a lower overlapping portion (154b) formed that is extended further by the area facing the lower surface of the sub-boat (120).

[0068] The connecting plate (153) is identical to the one described above, so a redundant description is omitted.

[0069] Additionally, the overlapping portion (154) may have a protrusion or a protrusion formed to correspond to the protrusion or protrusion formed on the sub-boat (120). In this embodiment, a protrusion (154a) is formed on the overlapping portion (154), and a protrusion (121) is formed on the sub-boat (120) as an example.

[0070] The upper overlapping portion (154a) may be provided with a protrusion (155) that protrudes from the tip toward the upper surface of the sub-boat (120), and the lower overlapping portion (154b) may be provided with a protrusion (155) that protrudes from the tip toward the lower surface of the sub-boat (120). Additionally, the sub-boat (120) may have a recess (121) formed on its upper surface and a recess (121) formed on its lower surface, so that as the sub-boat (120) enters the chamber (110), the protrusion (155) can be inserted into the recess (121) between the upper overlapping portion (154a) and the lower overlapping portion (154b) to facilitate entry and exit.

[0071] Of course, the overlapping portion (154) and the protrusion (155) may be arranged to maintain a predetermined gap (G) without contacting each other with the sub-boat (120). For example, if the overlapping portion (154) and the protrusion (155) come into contact with the sub-boat (120), contact friction may occur between the sub-boat (120) and the guide portion (150) during the insertion or discharge movement of the sub-boat (120). In this case, particles may be generated due to contact friction, which may degrade the deposition quality on the wafer. However, since the protrusion (155) on each overlapping portion (154) maintains a folded area with the recess (121), gas leakage through the overlapping portion (154) can be minimized.

[0072] Additionally, the sub-boat (120) may include an inclined member (122) extending inwardly into each overlapping portion (154) from one side upper and lower surfaces.

[0073] The inclined member (122) can provide the function of deflecting gas supplied from the gas supply unit (130) into the sub-boat (120) by forming an inclined surface (122a) corresponding to the thickness of the upper or lower surface of the sub-boat (120). The inclined surface (122a) can be formed so that its height gradually increases from the gas supply unit (130) toward the sub-boat (120). At this time, the inclined member (122) can be positioned between the upper plate (151) and the upper overlapping part (154) or between the lower plate (152) and the lower overlapping part (154).

[0074] Of course, although not shown in the drawing, the same guide section (150) and inclined member may also be provided between the sub-boat (120) and the gas discharge section (140).

[0075] Additionally, the guide section (150) may include a plurality of partitions (156) that partition between the upper plate (151) and the lower plate (152).

[0076] Multiple partitions (156) are spaced apart from each other at set intervals and can be spaced at equal intervals.

[0077] The bulkhead (156) can be formed to a size capable of shielding the interior of the longitudinal section of the guide section (150). Of course, the gas supply section (130) can be positioned to penetrate each bulkhead (156). Additionally, a reinforcement function can be additionally secured through the bulkhead (156) to more firmly support the upper plate (151) and the lower plate (152).

[0078] FIGS. 7 and 8 are plan views illustrating other embodiments of the plate of the substrate processing device shown in FIG. 6.

[0079] Referring to FIG. 7, the guide section (150) may include a plurality of partitions (156) that partition between the upper plate (151) and the lower plate (152).

[0080] In this embodiment, the bulkhead (156) differs in the position and shape of the leading edge adjacent to the sub-boat (120). An inclined plate (157) may be provided at the leading edge of the bulkhead (156).

[0081] The inclined plate (157) is positioned to be inclined from the bulkhead (156) toward the sub-boat (120), and the ends of the inclined plate (157) can be bent to correspond to the loading spacing of the wafers or the spacing between the sub-boats (120).

[0082] Referring to FIG. 8, a plurality of sub-boats (120) are arranged, and an inclined plate (157) may be bent in both directions along the length of the sub-boat (120) to correspond to the gap between the sub-boat (120) and another adjacent sub-boat (120'). For example, a bulkhead (156) may have one cross-section formed in a "Y" shape together with the inclined plate (157). Here, the inclination range (θ) of the inclined plate (157) relative to the bulkhead (156) may be about 45 degrees or less. Specifically, the inclination angle (θ) may be about 10 degrees to about 45 degrees. If the inclination angle exceeds 45 degrees, the inclination angle is too large and a vortex may be generated between the guide section (150) and the sub-boat (120). In addition, if the angle of inclination is less than 10 degrees, the required length of the inclined plate (157) for deriving the guide effect increases, which may reduce mechanical reliability and the guide effect of the fluid may be negligible.

[0083] Therefore, since gas leakage to the outside of the sub-boat (120) through the inclined plate (157) can be minimized, unnecessary consumption of gas can be prevented, and the flow of gas can be further concentrated in the direction of the wafer inside the sub-boat (120).

[0084] FIG. 9 is a reference diagram illustrating a substrate processing apparatus according to a third embodiment of the present invention, and FIG. 10 is a reference diagram illustrating another embodiment of the chamber of the substrate processing apparatus shown in FIG. 9.

[0085] Referring to FIG. 9 and FIG. 10, the substrate processing device (200) according to the third embodiment has a difference in the coupling relationship between the chamber (110) and the guide part (250).

[0086] Referring to FIG. 9(a), a guide groove (251) may be formed on one side of the chamber (110).

[0087] The guide groove (251) can be formed to be recessed inward along the longitudinal direction of the sub-boat (120).

[0088] Accordingly, the guide portion (250) includes an upper plate (151), a lower plate (152), and a connecting plate (153), and the connecting plate (153) may include a protrusion (252).

[0089] The protrusion (252) can be inserted into the guide groove (251) and slide-couple the guide part (150) onto the chamber (110).

[0090] Additionally, the guide groove (251) may include an inner groove (251a) formed on the inner side and an outer groove (251b) formed on the outer side.

[0091] The inner groove (251a) may be formed in a shape in which one cross section becomes smaller from one side of the chamber (110) toward the sub-boat (120).

[0092] And, the outer groove (251b) is arranged to communicate with the inner groove (251a), but is formed with a cross-section larger than that of the inner groove (251a) and can be formed to support the protrusion (252) in the vertical direction.

[0093] Accordingly, the protrusion (252) may include a coupling protrusion (252a) inserted into an inner groove (251a) and a supporting protrusion (252b) inserted into an outer groove (251b).

[0094] Accordingly, the guide portion (150) can be mounted with the protrusion (252) slidingly coupled to the guide groove (251), thereby preventing removal in a direction different from the sliding coupling direction. That is, the coupling protrusion (252a) can prevent the guide portion (150) from being removed from the inner groove (251a), and since the supporting protrusion (252b) is supported in the vertical direction through the outer groove (251b), the guide portion (150) can be installed more securely. Of course, this can also have the effect of simplifying the method of coupling the guide portion (150) onto the chamber (110) and making the coupling process easier.

[0095] Referring to FIG. 9(b), the guide portion (250) includes an upper plate (151), a lower plate (152), and a connecting plate (153), and the connecting plate (153) may include a protrusion (252).

[0096] Here, the guide portion (250) may further be provided with a partition wall (253) that shields the ends of the upper plate (151) and the lower plate (152).

[0097] The bulkhead (253) is provided to shield both ends of the guide section (150) between the upper plate (151) and the lower plate (152), and additionally, a plurality of them may be provided in the central area. Of course, the bulkhead (253) can provide a function of minimizing gas loss by guiding the gas injected from the gas supply section (130) toward the sub-boat (120) and preventing the gas from leaking out to the outside of the sub-boat (120).

[0098] Referring to FIG. 10(a), the chamber (110) may include a coupling portion (254).

[0099] The connecting portion (254) is arranged along the longitudinal direction of the guide groove (251) and can be detachable from the chamber (110). At this time, the connecting portion (254) has a block shape and can be selectively detached from the chamber (110) using a fastener or a separate mounting means.

[0100] This is because, when a deposition process performed inside the chamber (110) is carried out more than a certain number of times, unnecessary deposition occurs on the inside of the chamber (110) or on the internal structure, requiring cleaning. At this time, cleaning can be performed more easily by detaching the connecting part during the cleaning process of the inside of the chamber (110) or on the internal structure. In addition, since the guide part (250) is also detachable, cleaning of the guide part (250) becomes easier, and at the same time, the guide part (250) can be replaced with various types of guide parts (250) corresponding to the size or shape of the sub-boat (120).

[0101] Of course, when the coupling part (254) is removed from the chamber (110), a coupling groove (254a) corresponding to the size or shape of the coupling part (254) may be formed in the chamber (110).

[0102] FIG. 11 is a reference diagram illustrating another embodiment of the gas supply unit of the substrate processing device shown in FIG. 9.

[0103] Referring to FIG. 11, the guide portion (150) includes an upper plate (151), a lower plate (152), and a connecting plate (153), and the connecting plate (153) may include a protrusion.

[0104] Here, the guide portion (150) may further be provided with a partition wall (253) that shields the ends of the upper plate (151) and the lower plate (152).

[0105] In addition, a plurality of gas supply units (130) may be provided inside the guide unit (150).

[0106] This allows for a uniform distribution of gas flowing into the sub-boat (120) by arranging multiple gas supply units (130) along the vertical direction while forming gas nozzles or gas holes in a pattern set in one gas supply unit (130), and also has the effect of supplying gas evenly to the entire area inside the sub-boat (120) even with low injection pressure from the gas supply unit (130).

[0107] FIG. 12 is a reference diagram illustrating another embodiment of the guide section (150) of the substrate processing device shown in FIG. 11.

[0108] Referring to FIG. 12, a plurality of guide grooves (251) may be formed in the chamber (110).

[0109] That is, an upper guide groove (251a) and a lower guide groove (251b) positioned lower and parallel to the upper guide groove (251a) may be formed on one side of the interior of the chamber (110). Of course, the upper guide groove (251a) and the lower guide groove (251b) may also be positioned parallel to the longitudinal direction of the sub-boat (see FIG. 4, 120) and may be formed with only their positions differing according to height.

[0110] Accordingly, the guide portion (250) may include an upper protrusion (255a) that connects the upper plate (151) to the upper guide groove (251a) and a lower protrusion (255b) that connects the lower plate (152) to the lower guide groove (251b). At this time, the upper protrusion (255a) and the lower protrusion (255b) may be separated from each other and spaced apart.

[0111] By separating the upper plate (151) and the lower plate (152) and connecting them to the guide groove (251) respectively, it is possible to prevent sagging in the guide portion (150) even when the number of sub-boats (see FIG. 4, 120) increases or the size increases.

[0112] In addition, by adjusting the gap between the upper plate (151) and the lower plate (152), it may also have the effect of responding to changes in the height of the sub-boat (120). Of course, responding to changes in the height of the sub-boat (120) may be achieved by making the gap between the upper guide groove (251a) and the lower guide groove (251b) different, or by forming three or more guide grooves (251) side by side, and also by providing the gap between the upper plate (151) and the upper protrusion (255a) or the gap between the lower plate (152) and the lower protrusion (255b) in different sizes.

[0113] FIGS. 13 to 15 are reference drawings illustrating various embodiments according to the shape of the guide portion of a substrate processing device according to the present invention.

[0114] FIG. 13 is a top view of the chamber (110).

[0115] Referring to FIG. 13, the guide section (150) may be positioned adjacent to one side end (E) of the sub-boat (120), or may be short in length so as not to reach one side end (E) of the sub-boat (120), or may be long in length so as to form an overlapping section (154) beyond one side end (E) of the sub-boat (120).

[0116] Thus, the guide section (150) can be manufactured in various lengths within a length range of approximately -50(-d1) to 50(+d1) mm based on one side end (E) of the sub-boat (120).

[0117] FIGS. 14(a) and FIGS. 14(b) are longitudinal cross-sectional views of the chamber viewed from the front.

[0118] Referring to FIG. 14(a), the guide portion (150) can be adjusted so that the upper plate (151) and the lower plate (152) are positioned at various heights from the upper and lower surfaces of the sub-boat (120), respectively.

[0119] Thus, the guide section (150) can be manufactured at various heights in the range of approximately -30 (-d2) to 30 (+d2) mm based on the upper surface (123) or lower surface (124) of one side of the sub-boat (120).

[0120] Referring to FIG. 14(b), the guide portion (150) can be positioned so as to have a gap of up to 50 mm or less from the upper surface (123) or lower surface (124) of the sub-boat (120), respectively, with an overlapping portion (154) formed on the upper plate (151) and the lower plate (152).

[0121] Of course, in this embodiment, the length range d1 and the height range d2 are described as being adjusted based on the upper surface (123) or lower surface (124) of one side of the sub-boat (120), but the length range (d1) and the height range (d2) are not limited to this and may be adjusted to other length ranges or height ranges.

[0122] FIG. 15 is a cross-sectional view of the chamber (110) viewed from the front.

[0123] Referring to FIG. 15, the guide portion (150) can be positioned such that the upper plate (151) and the lower plate (152) are each inclined with respect to the upper surface (123) or lower surface (124) of the sub-boat (120) by an angle range (θ) set. The angle range (θ) set at this time can be -30 to 30°.

[0124] Accordingly, the guide section (150) can be formed with various lengths and angles, and thus has the advantage of being replaceable and detachable to correspond to various sizes or shapes of the sub-boat (120).

[0125] Accordingly, according to the substrate processing device of the embodiment of the present invention, gas can be fully guided from the gas supply unit to the sub-boat direction inside the chamber, the guide unit can be detached and replaced for easy installation, gas leakage around the sub-boat can be minimized to reduce gas usage, and deposition can be prevented inside the chamber, and the cleaning time can be shortened because the guide unit can be detached.

[0126] Although specific embodiments have been illustrated and described above to exemplify the technical concept of the present invention, the present invention is not limited to the configuration and operation identical to the specific embodiments described above, and various modifications may be implemented within the scope of the present invention. Accordingly, such modifications should also be considered to fall within the scope of the present invention, and the scope of the present invention should be determined by the claims set forth below. Explanation of the symbols

[0127] 100: Substrate processing device 110: Chamber 120: Sub boat 130: Gas supply unit 140: Gas exhaust part 150, 250: Guide Section

Claims

Claim 1 A substrate processing apparatus comprising: a chamber; a plurality of sub-boats loaded with a plurality of wafers inside and connected in parallel along the longitudinal direction to enter and exit the chamber; a gas supply unit positioned along the longitudinal direction of the sub-boat on one side inside the chamber and supplying gas toward one side of the sub-boat; a gas discharge unit that discharges gas discharged from the other side of the sub-boat to the outside on the other side inside the chamber; and a guide unit that guides the gas supplied from the gas supply unit to flow into the sub-boat; wherein the guide unit comprises an upper plate extending adjacent to the upper surface of the sub-boat from the upper side of the chamber, a lower plate extending adjacent to the lower surface of the sub-boat from the lower side of the chamber, and a partition wall that partitions the space between the upper plate and the lower plate to correspond to the gap of the sub-boat. Claim 2 delete Claim 3 A substrate processing apparatus according to claim 1, wherein the guide portion comprises a connecting plate connecting the starting regions of the upper plate and the lower plate on the inner side of the chamber. Claim 4 A substrate processing apparatus comprising: a chamber; a plurality of sub-boats loaded with a plurality of wafers inside and connected in parallel along the longitudinal direction to enter and exit the chamber; a gas supply unit positioned along the longitudinal direction of the sub-boat on one side inside the chamber and supplying gas toward one side of the sub-boat; a gas discharge unit that discharges gas discharged from the other side of the sub-boat to the outside on the other side inside the chamber; and a guide unit that guides the gas supplied from the gas supply unit to flow into the sub-boat; wherein the guide unit includes an upper plate extending adjacent to the upper surface of the sub-boat from the upper side of the chamber, a lower plate extending adjacent to the lower surface of the sub-boat from the lower side of the chamber, and a connecting plate connecting the starting areas of the upper plate and the lower plate on the inner side of the chamber; and wherein the chamber includes a guide groove formed to face the connecting plate along the longitudinal direction of the sub-boat. Claim 5 In paragraph 4, the above chamber is a substrate processing device in which the coupling part having the guide groove formed therein is formed to be detachable. Claim 6 In paragraph 4, the substrate processing device wherein the connecting plate includes a protrusion that is slidably coupled onto the guide groove. Claim 7 A substrate processing apparatus according to claim 1, wherein the guide portion comprises an upper protrusion that connects the upper plate to one side of the interior of the chamber and a lower protrusion that connects the lower plate to one side of the interior of the chamber. Claim 8 A substrate processing device according to claim 7, wherein the chamber comprises an upper guide groove formed to allow the upper protrusion to be slidably coupled, and a lower guide groove formed parallel to the upper guide groove to allow the lower protrusion to be slidably coupled. Claim 9 delete Claim 10 A substrate processing device according to claim 1, wherein the guide portion comprises an inclined plate that is bent at the leading edge of the bulkhead to correspond to the width of the sub-boat. Claim 11 A substrate processing device according to claim 1, wherein the guide portion comprises an inclined plate that is bent in both directions to correspond to the gap between the sub-boat and another adjacent sub-boat at the leading end of the bulkhead. Claim 12 A substrate processing device comprising: a chamber; a plurality of sub-boats loaded with a plurality of wafers inside and connected in parallel along the longitudinal direction to enter and exit the chamber; a gas supply unit positioned along the longitudinal direction of the sub-boat on one side inside the chamber and supplying gas toward one side of the sub-boat; a gas discharge unit that discharges gas discharged from the other side of the sub-boat to the outside on the other side inside the chamber; and a guide unit that guides the gas supplied from the gas supply unit to flow into the sub-boat; wherein the guide unit comprises an upper plate extending adjacent to the upper surface of the sub-boat from the upper side of the chamber, a lower plate extending adjacent to the lower surface of the sub-boat from the lower side of the chamber, and an overlapping unit positioned to overlap the upper surface or lower surface of the sub-boat from the upper plate or the lower plate, respectively, and wherein the overlapping unit is spaced apart from the sub-boat. Claim 13 In Clause 12, the above-mentioned overlapping portion is a substrate processing device in which a protrusion or a recess is formed to correspond to a recess or a protrusion formed in the above-mentioned sub-boat. Claim 14 In paragraph 13, the substrate processing device comprises a sub-boat including an inclined member that deflects gas supplied from the gas supply unit into the sub-boat from the inside of the overlap portion.

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