Digitizer, and electronic device including the same

Abstract

An electronic device according to various embodiments of the present disclosure comprises a display panel, a digitizer disposed below the display panel and comprising a plurality of layers, a first shielding sheet disposed adjacent to the digitizer, and a structure disposed adjacent to the first shielding sheet, wherein the digitizer comprises a first conductive layer disposed below the display panel and comprising first conductive patterns oriented in a first direction, an insulating layer disposed below the first conductive layer, and a second conductive layer disposed below the insulating layer and comprising second conductive patterns oriented in a second direction different from the first direction, and wherein the structure is spaced apart from the first conductive layer and at least a portion thereof disposed on the same layer as the second conductive layer.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to a digitizer and an electronic device including the same. Background Technology

[0003] A liquid crystal display module is a display device capable of displaying a desired image by adjusting the light transmittance of liquid crystal cells arranged in a matrix form according to image signal information.

[0004] Liquid crystal display (LCD) modules can be equipped with a digitizer to input electrical graphic signals by touching the displayed screen while simultaneously displaying images. Liquid crystal displays equipped with such digitizers are primarily employed in personal portable terminals such as notebook computers, all-in-one PCs, tablet PCs, smartphones, and PMPs (portable multimedia players). Unlike input devices such as keyboards or mice, a digitizer is a device that receives location information indicated by the user on the screen. Accordingly, it is suitable for performing graphic tasks such as CAD and is widely used to provide an intuitive and convenient user interface. Such digitizers are also referred to as touchscreens or EGIPs (electric graphic input panels), and are broadly classified into resistive, capacitive, and electromagnetic resonance (EMR) methods (or electromagnetic methods) depending on the method of detecting the location indicated by the user.

[0005] The electromagnetic resonance method utilizes a digitizer sensor board containing multiple coils. When a user moves the pen, it is driven by an alternating current signal to generate a vibrating magnetic field. The vibrating magnetic field induces a signal in the coil, and the position and pressure of the pen are detected through the signal induced in the coil.

[0006] FIG. 1 is a diagram illustrating the schematic operating principle of a general electromagnetic digitizer. As shown in FIG. 1, the electromagnetic digitizer patterns a plurality of coils (133) on a digitizer sensor substrate (131) and operates to detect the position of the pen by detecting a signal generated in a resonant circuit (117a) configured inside the pen (117). At this time, the position of the pen can be recognized by the detected signal (137) passing through a receiving circuit (139). In this way, the electromagnetic method mounts a plurality of coils on the digitizer substrate and determines the position of the pen by detecting electromagnetic changes caused by the approach of the pen. Therefore, unlike resistive methods, the digitizer does not necessarily need to be placed on the front of the display module and can also be mounted on the back of the display module.

[0007] Nowadays, as thinning of electronic devices becomes a critical factor in the development of electronic devices, securing the rigidity of display modules with minimal thickness and minimal bezel width has become a core technology for display and set development. The problem to be solved

[0009] Generally, digitizer panels consist of multiple layers, and a conductive loop pattern must be formed in the corresponding area to detect the position and pressure of a stylus pen. However, if the digitizer is cut due to reasons such as component placement or radiation, it becomes impossible to design a pattern at that location. If the cutting size is small, the pattern is designed to bypass the area, and if the distortion of the pattern is minimal, normal operation can be achieved by correcting it with software. However, as the size increases, the digitizer pattern becomes significantly distorted, leading to severe pen performance degradation or failure to recognize the pen. Additionally, mounting components on the back of the digitizer increases the thickness of the electronic device.

[0010] According to various embodiments of the present disclosure, when a groove corresponding to the shape and position of a structure is formed in only one of the conductive layers of a digitizer, the thickness of the electronic device is reduced by the thickness of the cut portion, and the performance of the digitizer can be improved compared to cutting the entire digitizer.

[0011] According to various embodiments of the present disclosure, when the conductive pattern directions of the first conductive layer and the second conductive layer are selected considering the mounting position of the structure, unnecessary expansion of the inactive area due to shape deformation of the digitizer can be reduced. means of solving the problem

[0013] An electronic device according to various embodiments of the present disclosure comprises a display panel, a digitizer disposed below the display panel and comprising a plurality of layers, a first shielding sheet disposed adjacent to the digitizer, and a structure disposed adjacent to the first shielding sheet, wherein the digitizer comprises a first conductive layer disposed below the display panel and comprising first conductive patterns oriented in a first direction, an insulating layer disposed below the first conductive layer, and a second conductive layer disposed below the insulating layer and comprising second conductive patterns oriented in a second direction different from the first direction, and wherein the structure may be spaced apart from the first conductive layer and at least a portion thereof may be disposed parallel to the second conductive layer.

[0014] A digitizer comprising a plurality of layers according to various embodiments of the present disclosure comprises: a first conductive layer comprising first conductive patterns oriented in a first direction; an insulating layer disposed below the first conductive layer; and a second conductive layer disposed below the insulating layer and comprising second conductive patterns oriented in a second direction different from the first direction. A structure is spaced apart from the first conductive layer and at least a portion is disposed parallel to the second conductive layer. When the mounting area of ​​the structure overlaps with at least a portion of the second conductive patterns, the second conductive patterns overlapping with the structure are disposed bypassing along the outline of the structure, and the pattern direction of the second conductive layer can be selected according to the mounting position of the structure. Effects of the invention

[0016] According to various embodiments of the present disclosure, when a groove corresponding to the shape and position of a structure is formed in only one of the conductive layers of a digitizer (e.g., a second conductive layer), the thickness of the electronic device is reduced by the thickness of the cut portion, and the performance of the digitizer can be improved compared to cutting the entire digitizer.

[0017] According to various embodiments of the present disclosure, when the conductive pattern directions of the first and second conductive layers are selected considering the mounting position of the structure, the digitizer pattern can avoid extreme distortion or, consequently, severe deterioration in linearity and accuracy performance that makes pen operation impossible. Additionally, unnecessary expansion of the inactive area can be reduced. Brief explanation of the drawing

[0019] Figure 1 is a diagram showing the schematic operating principle of a general electromagnetic digitizer. FIG. 2 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 3 is a drawing showing the stacked state of a structure including a digitizer in a general electronic device according to a comparative embodiment of the present disclosure. FIG. 4a is a rear view of a first conductive layer of a digitizer according to various embodiments of the present disclosure. FIG. 4b is a rear view of a second conductive layer of a digitizer according to various embodiments of the present disclosure. FIG. 4c is a rear view showing the first conductive layer and the second conductive layer of a digitizer stacked according to various embodiments of the present disclosure. FIG. 5 is a drawing showing a stacked state of a structure including a digitizer in an electronic device according to one embodiment of the present disclosure. FIG. 6a is a rear view of a second conductive layer of a grooved digitizer according to one embodiment of the present disclosure. FIG. 6b is a rear view of a digitizer of a second conductive layer having a groove formed therein, according to another embodiment of the present disclosure. FIG. 7a is a diagram showing a stacked state of an electronic device including a digitizer disposed adjacent to a magnetic structure according to one embodiment of the present disclosure. FIG. 7b is a diagram showing a stacked state of an electronic device including a digitizer disposed adjacent to a magnetic structure according to one embodiment of the present disclosure. Specific details for implementing the invention

[0020] FIG. 2 is a block diagram of an electronic device (201) in a network environment (200) according to various embodiments. Referring to FIG. 2, in the network environment (200), the electronic device (201) may communicate with an electronic device (202) through a first network (298) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (204) or a server (208) through a second network (299) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (201) may communicate with the electronic device (204) through a server (208). According to one embodiment, the electronic device (201) may include a processor (220), memory (230), input module (250), sound output module (255), display module (260), audio module (270), sensor module (276), interface (277), connection terminal (278), haptic module (279), camera module (280), power management module (288), battery (289), communication module (290), subscriber identification module (296), or antenna module (297). In some embodiments, at least one of these components (e.g., connection terminal (278)) may be omitted from the electronic device (201), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (276), camera module (280), or antenna module (297)) may be integrated into a single component (e.g., display module (260)).

[0021] The processor (220) can control at least one other component (e.g., a hardware or software component) of the electronic device (201) connected to the processor (220) by executing software (e.g., a program (240)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (220) can store commands or data received from other components (e.g., a sensor module (276) or a communication module (290)) in volatile memory (232), process the commands or data stored in volatile memory (232), and store the resulting data in non-volatile memory (234). According to one embodiment, the processor (220) may include a main processor (221) (e.g., a central processing unit or an application processor) or an auxiliary processor (223) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (201) includes a main processor (221) and an auxiliary processor (223), the auxiliary processor (223) may be configured to use less power than the main processor (221) or to be specialized for a designated function. The auxiliary processor (223) may be implemented separately from the main processor (221) or as part thereof.

[0022] The auxiliary processor (223) may control at least some of the functions or states associated with at least one component of the electronic device (201) (e.g., display module (260), sensor module (276), or communication module (290)) on behalf of the main processor (221) while the main processor (221) is in an inactive (e.g., sleep) state, or together with the main processor (221) while the main processor (221) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (223) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (280) or communication module (290)). According to one embodiment, the auxiliary processor (223) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (201) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (208)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0023] The memory (230) can store various data used by at least one component of the electronic device (201) (e.g., processor (220) or sensor module (276)). The data may include, for example, software (e.g., program (240)) and input or output data for related commands. The memory (230) may include volatile memory (232) or non-volatile memory (234).

[0024] The program (240) may be stored as software in memory (230) and may include, for example, an operating system (242), middleware (244), or an application (246).

[0025] The input module (250) can receive commands or data to be used for a component of the electronic device (201) (e.g., processor (220)) from outside the electronic device (201) (e.g., user). The input module (250) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The sound output module (255) can output a sound signal to the outside of the electronic device (201). The sound output module (255) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0027] The display module (260) can visually provide information to an external (e.g., user) of the electronic device (201). The display module (260) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (260) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0028] The audio module (270) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (270) can acquire sound through the input module (250) or output sound through the sound output module (255) or an external electronic device (e.g., electronic device (202)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (201).

[0029] The sensor module (276) can detect the operating state of the electronic device (201) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (276) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (277) may support one or more specified protocols that can be used for the electronic device (201) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (202)). According to one embodiment, the interface (277) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (278) may include a connector through which the electronic device (201) can be physically connected to an external electronic device (e.g., electronic device (202)). According to one embodiment, the connection terminal (278) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module (279) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (279) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0033] The camera module (280) can capture still images and video. According to one embodiment, the camera module (280) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (288) can manage the power supplied to the electronic device (201). According to one embodiment, the power management module (288) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0035] The battery (289) can supply power to at least one component of the electronic device (201). According to one embodiment, the battery (289) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (290) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (201) and an external electronic device (e.g., electronic device (202), electronic device (204), or server (208)), and the performance of communication through the established communication channel. The communication module (290) may include one or more communication processors that operate independently of the processor (220) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (290) may include a wireless communication module (292) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (294) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (204) via a first network (298) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (299) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (292) can identify or authenticate the electronic device (201) within a communication network such as the first network (298) or the second network (299) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (296).

[0037] The wireless communication module (292) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (292) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (292) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (292) can support various requirements specified in the electronic device (201), external electronic device (e.g., electronic device (204)), or network system (e.g., second network (299)). According to one embodiment, the wireless communication module (292) can support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0038] An antenna module (297) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (297) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (297) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (298) or a second network (299), may be selected from the plurality of antennas, for example, by a communication module (290). A signal or power may be transmitted or received between the communication module (290) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (297).

[0039] According to various embodiments, the antenna module (297) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0040] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (201) and an external electronic device (204) through a server (208) connected to a second network (299). Each of the external electronic devices (202, or 204) may be the same or different type of device as the electronic device (201). According to one embodiment, all or part of the operations performed on the electronic device (201) may be performed on one or more of the external electronic devices (202, 204, or 208). For example, if the electronic device (201) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (201) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (201). The electronic device (201) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (201) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (204) may include an Internet of Things (IoT) device. The server (208) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (204) or the server (208) may be included within the second network (299).The electronic device (201) can be applied to intelligent services (e.g., smart home (H), smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0044] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0045] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0046] Various embodiments of the present document may be implemented as software (e.g., program (240)) comprising one or more instructions stored in a storage medium (e.g., internal memory (236) or external memory (238)) readable by a machine (e.g., electronic device (201)). For example, a processor (e.g., processor (220)) of the machine (e.g., electronic device (201)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0047] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0048] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0050] FIG. 3 is a diagram showing the stacked state of an electronic device including a digitizer in a general electronic device (201) according to a comparative embodiment of the present disclosure.

[0051] Referring to FIG. 3, an electronic device (201) according to one embodiment may include a display panel (260), an EMR sensor substrate (hereinafter referred to as 'digitizer (100)') disposed below the display panel (260) and comprising a plurality of layers, an adhesive layer (400), a first shielding sheet (510), and a structure (600). The display panel (260) of FIG. 3 may have a configuration that is partly or entirely identical to that of the display module (260) of FIG. 2.

[0052] A digitizer (100) according to one embodiment may include a cover layer (110), a conductive layer (120) including conductive patterns, and an insulating layer (130). For example, the digitizer (100) may include a first cover layer (111) disposed below the display panel (260), a first conductive layer (121) disposed below the first cover layer (111), an insulating layer (130) disposed between the first conductive layer (121) and the second conductive layer (122) to be described later, disposed below the first conductive layer (121) and to electrically insulate the first conductive layer (121) and the second conductive layer (122), a second conductive layer (122) disposed below the insulating layer (130), and a second cover layer (112) disposed below the second conductive layer (122). However, the stacked structure of the above-mentioned digitizer (100) is not limited to the above-mentioned embodiment and can be designed in various ways depending on the function of the electronic device (201) and the size or arrangement relationship of the surrounding structure.

[0053] According to various embodiments, the first shielding sheet (510) may be a magnetic sheet composed of a magnetic material. The first shielding sheet (510) may be intended to induce the formation of an electromagnetic field of a digitizer (100) in an electronic device (201). The first shielding sheet (510) may be a sheet fused with metal magnetic powder, for example, copper (Cu)-graphite.

[0054] According to various embodiments, the structure (600) may be at least one component placed below the digitizer (100). The structure (600) may be, for example, any component that does not require optical properties. Since the digitizer (100) is composed of a flexible printed circuit board (FPC) and is not a transparent material, the structure (600) placed below the digitizer (100) may exclude optical components that require transmittance. The structure (600) may be a component that does not require optical properties, such as, for example, a speaker, a receiver, a vibration motor, a mmWave antenna, or a heat dissipation sheet (graphite).

[0056] FIG. 4a is a rear view of a first conductive layer (321) of a digitizer (300) according to various embodiments of the present disclosure. FIG. 4b is a rear view of a second conductive layer (322) of a digitizer (300) according to various embodiments of the present disclosure. The first conductive layer (321) and the second conductive layer (322) of FIG. 4a and FIG. 4b may be partially or entirely identical or similar to the configuration of the first conductive layer (121) and the second conductive layer (122) of FIG. 3.

[0057] In FIG. 4a and FIG. 4b, 'X' may represent the length direction of the digitizer (300). 'Y' may represent the width direction of the digitizer (300). 'Z' may represent the thickness direction of the digitizer (300).

[0058] According to various embodiments, the first conductive layer (321) may include first conductive patterns (321-1) facing a first direction (①), and the second conductive layer (322) may include second conductive patterns (322-1) facing a second direction (②) different from the first direction (①). For example, the first direction (①) of the first conductive layer (321) may be perpendicular to the second direction (②) of the second conductive layer (322). For example, the first conductive pattern (321-1) or the second conductive pattern (322-1) may be a linear pattern. However, the shape of the first conductive pattern (321-1) or the second conductive pattern (322-1) is not limited to the above embodiments and may be designed and modified in various ways depending on the size of the conductive layer (320) and the size or arrangement relationship of the surrounding structure. For example, the first direction (①) may be the y-axis direction. The second direction (②) may be a direction that intersects perpendicularly with the first direction (①), for example, the x-axis direction. However, the first direction (①) or the second direction (②) is not limited to the above embodiment and may be designed in various ways depending on the arrangement relationship of surrounding structures.

[0059] According to one embodiment, the first conductive layer (321) may have a plurality of linear loop (antenna) coils extended in a first direction (①) arranged continuously at regular intervals. Additionally, the second conductive layer (322) may have a plurality of linear loop (antenna) coils extended in a second direction (②) different from the first direction (①) arranged continuously at regular intervals. When the first conductive layer (321) and the second conductive layer (322) are stacked in this manner, the electronic device can determine the x-axis and y-axis coordinates input by the pen and precisely measure the position of the input coordinates.

[0060] According to one embodiment, the first conductive layer (321) may have a plurality of first conductive patterns extending in a first direction (①) arranged continuously at regular intervals or different intervals. For example, the spacing (d1) of at least some of the patterns at the edge of the first conductive layer (321) among the plurality of first conductive patterns may be narrower than the spacing (d2) of at least some of the patterns at the center of the first conductive layer (321). <d2). 이 경우 가장자리에 있는 적어도 일부의 패턴들은 일정한 면적에 복수 개의 코일들이 밀집하도록(예: 빽빽하게) 배치되어 있어 자기장 형성이 활성화되지 않을 수 있다.

[0061] According to various embodiments, the first conductive layer (321) or the second conductive layer (322) may include a first region (A1) which is an active area and a second region (A2) which is a dead area. The second region (A2) may be an edge portion of the first conductive layer (321) or the second conductive layer (322). That is, the second region (A2) may be a portion offset by a certain width (h) from the corner portion of the conductive layer (320). The width (h) of the second region (A2) may be, for example, approximately 3 to 5 mm from the corner portion of the first conductive layer (321) or the second conductive layer (322). The first region (A1) may be a portion of the first conductive layer (321) or the second conductive layer (322) excluding the second region (A2). However, the width (h) of the second region (A2) is not limited to the above embodiment and can be designed in various ways.

[0063] FIG. 5 is a drawing showing the stacked state of a structure including a digitizer (300) in an electronic device (201) according to one embodiment of the present disclosure.

[0064] FIG. 6a is a rear view of a second conductive layer (322) of a digitizer (300) having a groove (H) formed therein according to one embodiment of the present disclosure. FIG. 6b is a rear view of a digitizer (300) of a second conductive layer (322) having a groove (H) formed therein according to another embodiment of the present disclosure.

[0065] Referring to FIG. 5, an electronic device (201) according to one embodiment may include a display panel (260), a digitizer (300) disposed below the display panel (260) and comprising a plurality of layers, an adhesive layer (400), a first shielding sheet (510), and a structure (600).

[0066] A digitizer (300) according to one embodiment may include a cover layer (310), a conductive layer (320) including conductive patterns, and an insulating layer (330). For example, the digitizer (300) may include a first cover layer (311) disposed below the display panel (260), a first conductive layer (321) disposed below the first cover layer (311), an insulating layer (330) disposed between the first conductive layer (321) and the second conductive layer (322) to electrically insulate the first conductive layer (321) and the second conductive layer (322) described later, a second conductive layer (322) disposed below the insulating layer (330), and a second cover layer (312) disposed below the second conductive layer (322). However, the stacked structure of the above-mentioned digitizer (300) is not limited to the above-mentioned embodiment and can be designed in various ways depending on the function of the electronic device (201) and the size or arrangement relationship of the surrounding structure.

[0067] The display panel (260), digitizer (300), first cover layer (311), first conductive layer (321), the first conductive layer (321), insulating layer (330), second conductive layer (322), second cover layer (312), adhesive layer (400), first shielding sheet (510), and structure (600) of FIG. 5 may have a configuration that is partly or entirely identical or similar to the display panel (260), digitizer (100), first cover layer (111), first conductive layer (121), insulating layer (130), second conductive layer (122), second cover layer (112), adhesive layer (400), first shielding sheet (510), and structure (600) of FIG. 3. The second conductive layer (322) of FIG. 6a and FIG. 6b may have a composition that is partly or entirely identical to that of the second conductive layer (322) of FIG. 4a.

[0068] According to various embodiments, when a structure (600) is placed on the back surface of a digitizer (300), a groove (H) corresponding to the shape and position of the structure (600) can be formed in at least a part of the digitizer (300) to thin the electronic device (201).

[0069] According to various embodiments, a groove (H) corresponding to the shape and position of the structure (600) may be formed only in the second conductive layer (322) among the conductive layers (320) of the digitizer (300). The second conductive layer (322) may be positioned to surround at least a portion of the structure (600). In this case, the same groove (H) may also be formed in the layers of the second cover layer (312), adhesive layer (400), and first shielding sheet (510) positioned below the second conductive layer (322). For example, the first shielding sheet (510) positioned below the second conductive layer (322) may have the same shape as the second conductive layer (322). Accordingly, the structure (600) may be spaced apart from the first conductive layer (321), and at least a portion may be positioned on the same layer as the second conductive layer (322). In this way, when a groove (H) corresponding to the shape and position of the structure (600) is formed only in the second conductive layer (322) among the conductive layers (320) of the digitizer (300), the thickness of the electronic device (201) is reduced by the thickness of the cut portion, and the performance of the digitizer (300) can be improved compared to cutting the entire digitizer (300).

[0070] According to various embodiments, the groove (H) may be formed at a location corresponding to where the structure (600) is mounted, with an area corresponding to the area of ​​the structure (600). The second conductive layer (322) in which the groove (H) is formed may not have a general rectangular shape, but may have a shape in which one corner is recessed to the extent of the shape of at least one surface of the structure. The recessed portion may be defined as the groove (H) below. The groove (H) may be formed as a straight line or a curve, for example, depending on the shape of the structure (600). Accordingly, at least one surface of the structure (600) may be positioned overlapping with the first conductive layer (321) when viewed from above, and may not be positioned overlapping with the second conductive layer (322).

[0071] According to various embodiments, the direction of the conductive pattern of the first conductive layer (321) or the second conductive layer (322) can be selected considering the mounting position of the structure (600). The structure (600) may come into contact with at least one corner of the digitizer (300) below the digitizer (300). When the structure (600) comes into contact with the corner of the digitizer (300), the second conductive layer (322) may include a pattern that meets perpendicularly with the corner.

[0072] According to various embodiments, when the mounting area of ​​the structure (600) overlaps with at least some of the second conductive patterns (322-1), the second conductive patterns (322-2) that overlap with the structure (600) may be formed by bypassing along the outline of the groove (H) formed to the extent of the area of ​​the structure (600).

[0073] According to one embodiment, with reference to FIG. 6a, when the mounting area of ​​the structure (600) overlaps with at least some of the patterns at the edge where magnetic field formation is not activated among the second conductive patterns (322-1), the patterns are formed by bypassing along the outline of the groove (H), and a plurality of patterns arranged to be densely packed at the edge are formed spaced apart from the central part of the second conductive layer (322), so that at least a part of the first area (A1), which is the active area, can be deactivated. Accordingly, the deactivated area can be further expanded.

[0074] According to one embodiment, with reference to FIG. 6b, when the mounting area of ​​the structure (600) overlaps with at least some of the patterns in the central part of the second conductive patterns (322-1), the patterns are formed by bypassing along the outline of the groove (H). When the area is the same, the number of overlapping second conductive patterns (322-2) is smaller compared to the above embodiment, and the shape of the ends is formed as broken lines rather than straight lines, so it may not affect the expansion of the inactive area.

[0075] For example, when referring to FIG. 6b, if the structure (600) is in contact with an edge extending in the y-axis direction (e.g., vertical) of the digitizer (300), it may be suitable to select a second conductive pattern (322-1) extending in the x-axis direction (e.g., horizontal). For example, if the structure (600) is in contact with an edge extending in the x-axis direction (e.g., horizontal) of the digitizer (300), it may be suitable to select a second conductive pattern (322-1) extending in the y-axis direction (e.g., vertical).

[0076] In this way, when the conductive pattern direction of the first conductive layer (321) and the second conductive layer (322) is selected considering the mounting position of the structure (600), the expansion of unnecessary inactive areas due to shape deformation of the second conductive layer (322) can be reduced. For example, due to shape deformation of the second conductive layer (322), distortion can become extremely large in the groove (H) portion where the conductive layers do not overlap, and the performance of linearity and accuracy can be severely degraded as a result, thereby reducing the inability to perform pen operation.

[0077] According to one embodiment, the length (w) of one side of the structure (600) may be, for example, approximately 7 mm to 10 mm. If the length (w) of one side of the structure (600) exceeds approximately 10 mm, the performance of the digitizer (300) may be significantly reduced even if the conductive pattern direction of the second conductive layer (322) is selected considering the mounting position of the structure (600).

[0079] FIG. 7a is a drawing showing a stacked state of an electronic device (201) including a digitizer (300) disposed adjacent to a magnetic structure (610) according to one embodiment of the present disclosure. FIG. 7b is a drawing showing a stacked state of an electronic device (201) including a digitizer (300) disposed adjacent to a magnetic structure (610) according to one embodiment of the present disclosure.

[0080] Referring to FIG. 7a and 7b, an electronic device (201) according to one embodiment may include a display panel (260), a digitizer (300) disposed below the display panel (260) and comprising a plurality of layers, an adhesive layer (400), a first shielding sheet (510), a second shielding sheet (520), and a magnetic structure (610).

[0081] A digitizer (300) according to one embodiment may include a cover layer (310), a conductive layer (320) including conductive patterns, and an insulating layer (330). For example, the digitizer (300) may include a first cover layer (311) disposed below the display panel (260), a first conductive layer (321) disposed below the first cover layer (310), an insulating layer (330) disposed between the first conductive layer (321) and the second conductive layer (322) to electrically insulate the first conductive layer (321) and the second conductive layer (322) described later, a second conductive layer (322) disposed below the insulating layer (330), and a second cover layer (312) disposed below the second conductive layer (322). However, the stacked structure of the above-mentioned digitizer (300) is not limited to the above-mentioned embodiment and can be designed in various ways depending on the function of the electronic device (201) and the size or arrangement relationship of the surrounding structure.

[0082] The display panel (260), digitizer (300), first cover layer (311), first conductive layer (321), said first conductive layer (321), insulating layer (330), second conductive layer (322), second cover layer (312), adhesive layer (400), and first shielding sheet (510) of FIG. 7a and 7b may be partly or all identical or similar to the configuration of the display panel (260), digitizer (300), first cover layer (311), first conductive layer (321), said first conductive layer (321), insulating layer (330), second conductive layer (322), second cover layer (312), adhesive layer (400), and first shielding sheet (510) of FIG. 5.

[0083] According to one embodiment, the magnetic structure (610) may be limited to a structure that includes a magnetic component among the structures (600).

[0085] According to one embodiment, when referring to FIG. 7a, a groove (e.g., groove (H) in FIG. 6a) corresponding to the shape and position of a magnetic structure (610) is formed in at least a part of the digitizer (300), a second shielding sheet (520) may be disposed in the part where the groove (e.g., groove (H) in FIG. 6a) is formed. Accordingly, when viewing the electronic device (201) from the right (e.g., when looking toward the side where the second shielding sheet (520) is exposed), the second shielding sheet (520) may be spaced apart from the first conductive layer (321), and at least a part may be disposed parallel to the second conductive layer (322). Additionally, a first shielding sheet (510) may be disposed below the second shielding sheet (520), and a magnetic structure (610) may be disposed below the first shielding sheet (510). In this case, the thickness of the electronic device (201) can be reduced compared to a general electronic device.

[0086] According to one embodiment, when referring to FIG. 7b, a groove (e.g., groove (H) in FIG. 6a) corresponding to the shape and position of a magnetic structure (610) is formed in at least a part of the digitizer (300), a second shielding sheet (520) may be disposed in the part where the groove (e.g., groove (H) in FIG. 6a) is formed. For example, the size of at least one surface of the second shielding sheet (520) and the magnetic structure (610) may match. Additionally, the same groove (e.g., groove (H) in FIG. 6a) may be formed in the first shielding sheet (510) to thin the electronic device (201). Accordingly, when viewing the electronic device (201) from the right, the second shielding sheet (520) is spaced apart from the first conductive layer (321), and at least a part may be disposed on the same layer parallel to the second conductive layer (322). Additionally, a magnetic structure (610) may be placed under the second shielding sheet (520). In this case, the thickness of the electronic device (201) may be reduced compared to a conventional electronic device.

[0088] An electronic device according to various embodiments of the present disclosure (e.g., the electronic device (201) of FIG. 2 to 3) comprises a display panel (e.g., the display panel (260) of FIG. 5), a digitizer (e.g., the digitizer (300) of FIG. 5) disposed below the display panel and comprising a plurality of layers, a first shielding sheet (e.g., the first shielding sheet (510) of FIG. 5) disposed adjacently below the digitizer, and a structure disposed adjacently to the first shielding sheet, wherein the digitizer comprises a first conductive layer (e.g., the first conductive layer (321) of FIG. 5) disposed below the display panel and comprising first conductive patterns oriented in a first direction, an insulating layer (e.g., the insulating layer (330) of FIG. 5) disposed below the first conductive layer, and a second conductive layer (e.g., the second conductive layer (322) of FIG. 5) disposed below the insulating layer and comprising second conductive patterns oriented in a second direction different from the first direction, and wherein A structure (e.g., structure (600) of FIG. 5) is spaced apart from the first conductive layer, and at least a portion may be placed on the same layer as the second conductive layer.

[0089] According to various embodiments, the first direction of the first conductive layer may be perpendicular to the second direction of the second conductive layer.

[0090] According to various embodiments, the spacing of at least some of the patterns at the edge of the first conductive layer among the first conductive patterns may be narrower than the spacing of at least some of the patterns at the center of the first conductive layer.

[0091] According to various embodiments, the first conductive layer or the second conductive layer may include a first region that is an active region (e.g., the first region (A1) of FIG. 4a); and a second region that is an inactive region (e.g., the second region (A2) of FIG. 4a).

[0092] The above second region is an electronic device that is spaced from the edge of the conductive layer by more than 3mm and less than 5mm.

[0093] According to various embodiments, an adhesive layer (e.g., the adhesive layer (400) of FIG. 5) that combines the second conductive layer and the first shielding sheet may be further included.

[0094] According to various embodiments, the first shielding sheet may be a magnetic sheet composed of a magnetic material for inducing the formation of an electromagnetic field of the digitizer.

[0095] According to various embodiments, the structure may be at least one of a speaker, a receiver, a vibration motor, a mmWave antenna, or a heat dissipation sheet.

[0096] According to various embodiments, the electronic device may further include a first cover layer disposed on the upper surface of the first conductive layer (e.g., the first cover layer (311) of FIG. 5); and a second cover layer disposed on the lower surface of the second conductive layer (e.g., the second cover layer (312) of FIG. 5).

[0097] According to various embodiments, the second conductive layer includes a groove (e.g., groove (H) in FIG. 5a) corresponding to the shape of the structure and the position where the structure is mounted, and the second conductive layer may be arranged to surround at least a part of the structure.

[0098] According to various embodiments, at least one surface of the structure may be overlapped with the first conductive layer when viewed from above, and may not be overlapped with the second conductive layer.

[0099] A digitizer comprising a plurality of layers according to various embodiments of the present disclosure comprises: a first conductive layer comprising first conductive patterns oriented in a first direction; an insulating layer disposed below the first conductive layer; and a second conductive layer disposed below the insulating layer and comprising second conductive patterns oriented in a second direction different from the first direction. A structure is spaced apart from the first conductive layer and at least a portion is disposed parallel to the second conductive layer. When the mounting area of ​​the structure overlaps with at least a portion of the second conductive patterns, the second conductive patterns overlapping with the structure are disposed by bypassing along the outline of the structure, and the pattern direction of the second conductive layer can be selected according to the mounting position of the structure.

[0100] According to various embodiments, when the structure contacts the corner of the digitizer, the second conductive layer may include a pattern that meets perpendicularly with the corner.

[0101] According to various embodiments, the length of at least one side of the structure may be 7mm to 10mm.

[0102] According to various embodiments, the structure may come into contact with at least one corner of the digitizer below the digitizer.

[0103] According to various embodiments, if the structure includes a magnetic component, it may further include a second shielding sheet placed on the magnetic structure (e.g., the second shielding sheet (520) of FIG. 7a).

[0104] According to various embodiments, the size of at least one surface of the second shielding sheet and the magnetic structure may match.

[0105] According to various embodiments, the second shielding sheet is spaced apart from the first conductive layer, and at least a portion may be disposed on the same layer as the second conductive layer.

[0106] According to various embodiments, the second shielding sheet may be a magnetic sheet that absorbs the magnetic force of the magnetic structure.

[0107] According to various embodiments, the first shielding sheet disposed below the second conductive layer may have the same shape as the second conductive layer.

[0109] It will be obvious to those skilled in the art that the electronic device including the cover glass of the various embodiments of the present disclosure described above is not limited by the aforementioned embodiments and drawings, and that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. Explanation of the symbols

[0111] 201: Electronic devices 260 : Display panel 300 : Digitizer 310: Cover layer 311: First cover layer 312 : Second cover layer 320 : Challenge Layer 321: 1st Challenge Layer 322 : 2nd Challenge Layer A1: Area 1 A2: Area 2 330 : Insulating layer 400: Adhesive layer 500 : Shielding sheet 510 : 1st shielding sheet 520 : Second shielding sheet 600 : Structure 610: Magnetic structure

Claims

Claim 1 An electronic device comprising: a display panel; a digitizer disposed below the display panel and comprising a plurality of layers; a first shielding sheet disposed adjacently below the digitizer; and a structure disposed adjacently to the first shielding sheet; wherein the digitizer comprises: a first conductive layer disposed below the display panel and comprising first conductive patterns extending along a first direction; an insulating layer disposed below the first conductive layer; and a second conductive layer disposed below the insulating layer and comprising second conductive patterns extending along a second direction different from the first direction; wherein the structure is disposed below the edge of the first conductive layer, at least a portion thereof disposed on the same layer as the second conductive layer, and a portion thereof of the second conductive patterns adjacent to the structure extend along the outline of the structure to bypass the structure, and at least one surface of the structure is disposed overlapping with the first conductive layer and not overlapping with the second conductive layer when viewed from above the digitizer. Claim 2 An electronic device according to claim 1, wherein the first direction of the first conductive layer is perpendicular to the second direction of the second conductive layer. Claim 3 An electronic device according to claim 1, wherein the spacing of at least some of the patterns at the edge of the first conductive layer among the first conductive patterns is narrower than the spacing of at least some of the patterns at the center of the first conductive layer. Claim 4 An electronic device according to claim 1, wherein the first conductive layer or the second conductive layer comprises a first region which is an active region; and a second region which is an inactive region. Claim 5 An electronic device according to claim 4, wherein the second region is a portion spaced 3 mm or more and 5 mm or less from the edge of the conductive layer. Claim 6 delete Claim 7 An electronic device according to claim 1, wherein the first shielding sheet is a magnetic sheet composed of a magnetic material for inducing the formation of an electromagnetic field of the digitizer. Claim 8 In claim 1, the structure is an electronic device that is at least one of a speaker, a receiver, a vibration motor, a mmWave antenna, or a heat dissipation sheet. Claim 9 The electronic device according to claim 1 further comprises: a first cover layer disposed on the upper surface of the first conductive layer; and a second cover layer disposed on the lower surface of the second conductive layer. Claim 10 An electronic device according to claim 1, wherein the second conductive layer includes a groove corresponding to the shape of the structure and the position where the structure is mounted, and the second conductive layer is arranged to surround at least a part of the structure. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

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