Electronic device including antenna

Abstract

According to one embodiment of the present document, an electronic device may comprise: a housing that forms the exterior of the electronic device and includes a conductive portion and a non-conductive portion connected to the conductive portion; an antenna structure located in the internal space of the housing, comprising a printed circuit board having a first surface facing the non-conductive portion and a second surface facing in a direction opposite to the first surface; an antenna structure comprising at least one antenna element located on the first surface or located inside the printed circuit board closer to the first surface than the second surface, and forming a beam facing the non-conductive portion; and a dielectric structure located facing the at least one element corresponding to the non-conductive portion, comprising a first dielectric having a first dielectric constant and a second dielectric surrounding the first dielectric having a second dielectric constant different from the first dielectric constant when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces. Various other embodiments may be possible.

Description

Technology Field

[0001] Various embodiments of this document relate to electronic devices including antennas. Background Technology

[0003] With the advancement of wireless communication technology, electronic devices are being universally used in daily life, leading to an increasing trend in content usage. This rapid increase in content usage may necessitate the expansion of network processing capacity. Electronic devices include multiple antennas to support various communication technologies. The problem to be solved

[0005] As the range of available applications expands for electronic devices such as smartphones, the number of antennas included in these devices is increasing. While electronic devices are becoming slimmer, the addition of components for various functions is making it increasingly difficult to position antennas within limited spaces while minimizing electrical interference with various internal elements and ensuring radiation performance or coverage (or communication range) for the desired frequency band.

[0006] Various embodiments of this document may provide an electronic device including an antenna for securing radiation performance or coverage in a limited antenna design space.

[0007] Various embodiments of this document may provide an electronic device including an antenna for improving or securing radiation performance or securing coverage in a limited antenna design space. means of solving the problem

[0009] According to one embodiment of the present document, an electronic device may include a housing that forms the exterior of the electronic device and includes a conductive portion and a non-conductive portion connected to the conductive portion; an antenna structure located in the internal space of the housing, comprising a printed circuit board having a first surface facing the non-conductive portion and a second surface facing in a direction opposite to the first surface; an antenna structure including at least one antenna element located on the first surface or located inside the printed circuit board closer to the first surface than the second surface, and forming a beam facing the non-conductive portion; and a dielectric structure located facing the at least one element corresponding to the non-conductive portion, comprising a first dielectric having a first dielectric constant and a second dielectric surrounding the first dielectric having a second dielectric different from the first dielectric constant when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces. Effects of the invention

[0011] An electronic device including an antenna according to various embodiments of this document can secure radiation performance and / or coverage by using a dielectric structure (e.g., dielectric lens) including a plurality of dielectrics having different dielectric constants.

[0012] Furthermore, other effects that can be obtained or predicted by the various embodiments of this document will be disclosed directly or implicitly in the detailed description of the embodiments of this document. For example, various effects predicted according to the various embodiments of this document will be disclosed in the detailed description that follows. Brief explanation of the drawing

[0014] FIG. 1 is a block diagram of an electronic device in a network environment in one embodiment. FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication in one embodiment. FIG. 3 is a perspective view of the front of an electronic device according to one embodiment. FIG. 4 is a perspective view of the rear of the electronic device of FIG. 3 according to one embodiment. FIG. 5 is an exploded view of the electronic device of FIG. 3 according to one embodiment. FIGS. 6 and 7 are perspective views relating to an antenna module according to one embodiment. FIG. 8 is a yz plan view of an electronic device when viewed in the -x axis direction in FIG. 3 in one embodiment. FIG. 9 is a partial cross-sectional view relating to a part of an electronic device in one embodiment. FIG. 10 illustrates, in one embodiment, a cross-sectional structure of the xz plane regarding a part of the electronic device with respect to the AA' line in FIG. 3. FIG. 11 illustrates, in one embodiment, yz plan views and a cross-sectional structure in the xz plane relating to a dielectric structure, and a yz plan view relating to a part of an antenna structure. FIG. 12 illustrates yz plan views and xz plane cross-sectional structures regarding the dielectric structure in another embodiment. FIG. 13 illustrates yz plan views and xz plane cross-sectional structures regarding the dielectric structure in another embodiment. FIG. 14 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 10. FIG. 15 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 10. FIG. 16 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 14. FIG. 17 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 15. FIG. 18 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 10. FIG. 19 illustrates a cross-sectional structure relating to another embodiment that modifies the embodiment of FIG. 10. FIG. 20 illustrates a cross-sectional structure relating to another embodiment that modifies the embodiment of FIG. 14. FIG. 21 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 15. FIG. 22 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 10. FIG. 23 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 22. FIG. 24 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 10. FIG. 25 illustrates a cross-sectional structure relating to another embodiment that is a modification of the embodiment of FIG. 10. FIG. 26 illustrates a radiation pattern for an electronic device including a plurality of dielectric structures according to one embodiment, and a radiation pattern for an electronic device according to a comparative example including a single dielectric. FIG. 27 illustrates a radiation pattern for an electronic device including a plurality of dielectric structures according to one embodiment, and a radiation pattern for an electronic device according to a comparative example including a single dielectric. Specific details for implementing the invention

[0015] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0016] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) in one embodiment.

[0017] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0018] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0019] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0020] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0021] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0022] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0023] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0024] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0025] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0026] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0030] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0032] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0034] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0035] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0036] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0037] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., commands or data) with each other.

[0038] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0039] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0040] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., via wire), wirelessly, or through a third component.

[0041] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0042] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0043] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0044] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0045] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order).

[0046] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0047] FIG. 2 is a block diagram (200) of an electronic device (101) for supporting legacy network communication and 5G network communication in one embodiment.

[0048] Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first RFIC (radio frequency integrated circuit) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), or an antenna (248). The electronic device (101) may further include a processor (120) and a memory (130). The network (199) may include a first network (292) and a second network (294). According to another embodiment, the electronic device (101) may further include at least one of the components described in FIG. 1, and the network (199) may further include at least one other network. According to one embodiment, a first communication processor (212), a second communication processor (214), a first RFIC (222), a second RFIC (224), a fourth RFIC (228), a first RFFE (232), and a second RFFE (234) may form at least a part of a wireless communication module (192). According to another embodiment, the fourth RFIC (228) may be omitted or included as part of a third RFIC (226).

[0049] The first communication processor (212) can establish a communication channel in a band to be used for wireless communication with the first network (292), and support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), third generation (3G), fourth generation (4G), or long term evolution (LTE) network. The second communication processor (214) can establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network (294), and support 5G network communication through the established communication channel. According to various embodiments, the second network (294) may be a fifth generation (5G) network as defined by 3GPP. Additionally, according to one embodiment, the first communication processor (212) or the second communication processor (214) may support the establishment of a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network (294), and 5G network communication through the established communication channel. According to one embodiment, the first communication processor (212) and the second communication processor (214) may be implemented within a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed within a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0050] The first RFIC (222) can convert a baseband signal generated by the first communication processor (212) during transmission into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network (292) (e.g., legacy network). During reception, the RF signal is acquired from the first network (292) (e.g., legacy network) through an antenna (e.g., first antenna module (242)) and can be preprocessed through an RFFE (e.g., first RFFE (232)). The first RFIC (222) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor (212).

[0051] The second RFIC (224) can convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal of the Sub6 band (e.g., about 6 GHz or less) used in the second network (294) (e.g., 5G network) (hereinafter, 5G Sub6 RF signal). When receiving, the 5G Sub6 RF signal is acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., the second antenna module (244)) and can be preprocessed through an RFFE (e.g., the second RFFE (234)). The second RFIC (224) can convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by the corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0052] The third RFIC (226) can convert a baseband signal generated by the second communication processor (214) into an RF signal of the 5G Above6 band (e.g., approximately 6 GHz to approximately 60 GHz) to be used in the second network (294) (e.g., 5G network) (hereinafter, 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., antenna (248)) and preprocessed through the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that it can be processed by the second communication processor (214). According to one embodiment, the third RFFE (236) may be formed as part of the third RFIC (226).

[0053] According to one embodiment, the electronic device (101) may include a fourth RFIC (228) separately from or at least as part of the third RFIC (226). In this case, the fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network (294) (e.g., a 5G network) through an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) can convert the IF signal into a baseband signal so that the second communication processor (214) can process it.

[0054] According to one embodiment, the first RFIC (222) and the second RFIC (224) may be implemented as at least part of a single chip or a single package. According to one embodiment, the first RFFE (232) and the second RFFE (234) may be implemented as at least part of a single chip or a single package. According to one embodiment, at least one of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

[0055] According to one embodiment, the third RFIC (226) and the antenna (248) may be placed on the same substrate to form a third antenna module (246). For example, a wireless communication module (192) or a processor (120) may be placed on a first substrate (e.g., a main PCB). In this case, the third RFIC (226) may be placed on a portion of a second substrate (e.g., a sub PCB) separate from the first substrate (e.g., a bottom surface), and the antenna (248) may be placed on another portion of a second substrate (e.g., a sub PCB) to form a third antenna module (246). By placing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line between them. This can reduce the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. As a result, the electronic device (101) can improve the quality or speed of communication with the second network (294) (e.g., 5G network).

[0056] According to one embodiment, the antenna (248) may be formed as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (236). During transmission, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device (101) (e.g., a base station of a 5G network) through the corresponding antenna element. During reception, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device (101) and the outside.

[0057] The second network (294) (e.g., 5G network) may be operated independently of the first network (292) (e.g., legacy network) (e.g., Stand-Alone (SA)) or connected to it (e.g., Non-Stand Alone (NSA)). For example, the 5G network may only have an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device (101) can access the access network of the 5G network and then access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., evolved packed core (EPC)). Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in memory (230) and can be accessed by other parts (e.g., processor (120), first communication processor (212), or second communication processor (214)).

[0058] FIG. 3 is a front perspective view of an electronic device (300) according to one embodiment. FIG. 4 is a rear perspective view of the electronic device (300) of FIG. 3 according to one embodiment.

[0059] In various embodiments of this document, for convenience of explanation, the direction in which the display (301) included in the electronic device (300) is visually exposed (e.g., +z axis direction) is defined as the front, and the opposite direction (e.g., -z axis direction) is defined as the rear.

[0060] Referring to FIGS. 3 and 4, an electronic device (300) (e.g., the electronic device (101) of FIG. 1) may include a housing (310). The housing (310) may form, for example, a front (310A) of the electronic device (300), a rear (310B) of the electronic device (300), and a side (310C) of the electronic device (300). In some embodiments, the housing (310) may refer to a structure forming at least a portion of the front (310A), the rear (310B), and the side (310C). In one embodiment, the housing (310) may include a front plate (or a first plate) (301), a rear plate (or a second plate) (302), and a side member (or a side bezel structure) (303). The front (310A) of the electronic device (300) may be formed by the front plate (301). The front plate (301) may be substantially transparent in at least a portion and may include, for example, a glass plate or a polymer plate including various coating layers. The rear (310B) of the electronic device (300) may be formed by a rear plate (302). The rear plate (302) may be substantially opaque and may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. A side member (303) may be combined with the front plate (301) and the rear plate (302) and may form a side (310C) of the electronic device (300). The side member (303) may include metal and / or polymer.

[0061] According to one embodiment, the electronic device (300) may include at least one of a display (401), a first audio module (402), a second audio module (403), a third audio module (404), a sensor module (405), a front camera module (406), a plurality of rear camera modules (e.g., a first rear camera module (4071), a second rear camera module (4072), a third rear camera module (4073), and a fourth rear camera module (4074)), a light-emitting module (408), an input module (409), and a connection terminal module (410). In some embodiments, the electronic device (300) may omit at least one of the components or additionally include other components.

[0062] The display area (e.g., screen display area or active area) of the display (401) may be visually exposed, for example, through the front plate (301). In one embodiment, the electronic device (300) may be implemented so that the display area visible through the front plate (301) appears as large as possible (e.g., large screen or full screen). For example, the display (401) may be implemented to have an outline that is generally the same shape as the outline of the front plate (301). In another example, the gap between the outline of the display (401) and the outline of the front plate (301) may be formed to be generally the same. In one embodiment, the display (401) may include a touch detection circuit. In some embodiments, the display (401) may include a pressure sensor capable of measuring the intensity (pressure) of the touch. In some embodiments, the display (401) may be combined with or positioned adjacent to a digitizer (e.g., an electromagnetic induction panel) that detects a magnetic field-type electronic pen (e.g., a stylus pen).

[0063] The first audio module (402) may include, for example, a microphone located inside the electronic device (300), and a microphone hole formed on the side (310C) of the electronic device (300) corresponding to the microphone. The location or number of the audio module with respect to the microphone may vary and is not limited to the illustrated example. In another example, the electronic device (300) may include a microphone hole formed on the rear (310B) of the electronic device (300) and a microphone located inside the electronic device (300) corresponding to the microphone hole. In some embodiments, the electronic device (300) may include a plurality of microphones used to detect the direction of sound.

[0064] The second audio module (403) may include, for example, a first speaker located inside the electronic device (300), and a first speaker hole formed on the side (310C) of the electronic device (300) corresponding to the first speaker. The third audio module (404) may include, for example, a second speaker located inside the electronic device (300), and a second speaker hole formed on the front (310A) of the electronic device (300) corresponding to the second speaker. In one embodiment, the first speaker may include an external speaker. In one embodiment, the second speaker may include a receiver for calls, and the second speaker hole may be referred to as a 'receiver hole'. The location or number of the second audio module (403) or the third audio module (404) may vary and are not limited to the illustrated examples. In some embodiments, the microphone hole and the speaker hole may be implemented as a single hole. In some embodiments, the second audio module (403) or the third audio module (404) may include a piezo speaker with the speaker hole omitted.

[0065] The sensor module (405) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (300) or an external environmental state. In one embodiment, the sensor module (405) may include an optical sensor located inside the electronic device (300) corresponding to the front (310A) of the electronic device (300). The optical sensor may include, for example, a proximity sensor or an illuminance sensor. The optical sensor may be aligned with an opening formed in the display (401). External light may reach the optical sensor through the front plate (301) and the opening of the display (401). In some embodiments, the optical sensor may be located on the back surface of the display (401) or below or beneath the display (401), and may perform its related function without the location of the optical sensor being visually distinguishable (or exposed). In some embodiments, the optical sensor may be aligned and located in a recess formed on the back surface of the display (401). An optical sensor may be placed overlapping at least a portion of a screen (or display area) to perform a sensing function without being exposed to the outside. In this case, the portion of the display (401) that overlaps at least a portion with the optical sensor may have a different pixel structure and / or wiring structure compared to other areas. For example, the portion of the display (401) that overlaps at least a portion with the optical sensor may have a different pixel density compared to other areas. In some embodiments, multiple pixels may not be placed in the portion of the display (401) that overlaps at least a portion with the optical sensor. In some embodiments, the electronic device (300) may include a biosensor (e.g., a fingerprint sensor) located on the back of the display (401) or below the display (401). The biosensor may be implemented in an optical, capacitive, or ultrasonic manner, and its location or number may vary.The electronic device (300) may further include at least one of various other sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor.

[0066] A front camera module (406) may be located inside the electronic device (300), for example, corresponding to the front (310A) of the electronic device (300). A plurality of rear camera modules (4071, 4072, 4073, 4074) may be located inside the electronic device (300), for example, corresponding to the rear (310B) of the electronic device (300). The front camera module (406) and / or the rear camera modules (4071, 4072, 4073, or 4074) may include one or more lenses, an image sensor, and / or an image signal processor. The location or number of camera modules may vary and is not limited to the illustrated examples.

[0067] According to one embodiment, the display (401) may include an opening aligned with the front camera module (406). External light may reach the front camera module (406) through the opening of the front plate (301) and the display (401). The opening of the display (401) aligned with or overlapping the front camera module (406) may be formed in the shape of a notch. In some embodiments, the opening of the display (401) aligned with or overlapping the front camera module (406) may be formed in the shape of a hole. In some embodiments, the front camera module (406) may be located on the back of the display (401) or below or beneath the display (401), and the location of the front camera module (406) may not be visually distinguishable (or exposed) and may perform related functions (e.g., image capture). The front camera module (406) may include, for example, a hidden display back camera (e.g., an under display camera (UDC)). In some embodiments, the front camera module (406) may be positioned aligned with a recess formed on the back surface of the display (401). The front camera module (406) may be positioned overlapping at least a portion of the screen (or display area) to acquire an image of an external subject without being visually exposed to the outside. In this case, the portion of the display (401) that overlaps at least a portion of the front camera module (406) may have a different pixel structure and / or wiring structure compared to other areas. For example, the portion of the display (401) that overlaps at least a portion of the front camera module (406) may have a different pixel density compared to other areas. The pixel structure and / or wiring structure formed in the portion of the display (401) that overlaps at least a portion of the front camera module (406) may reduce light loss between the outside and the front camera module (406).In some embodiments, pixels may not be placed in some areas of the display (401) that overlap at least partially with the front camera module (406). In some embodiments, the electronic device (300) may further include a light-emitting module (e.g., a light source) located inside the electronic device (300) corresponding to the front (310A) of the electronic device (300). The light-emitting module may, for example, provide state information of the electronic device (300) in the form of light. In some embodiments, the light-emitting module may provide a light source that is coupled with the operation of the front camera module (406). The light-emitting module may include, for example, an LED, an IR LED, or a xenon lamp.

[0068] According to one embodiment, the rear plate (302) may include a plurality of openings corresponding one-to-one with a plurality of rear camera modules (4071, 4072, 4073, 4074) when viewed from above the rear plate (302) (e.g., when viewed in the +z axis direction). The plurality of rear camera modules (4071, 4072, 4073, 4074) may be positioned through the plurality of openings of the rear plate (302). In some embodiments, the rear plate (302) may be implemented to include substantially transparent light-transmitting regions in place of the plurality of openings corresponding to the plurality of rear camera modules (4071, 4072, 4073, 4074). In one embodiment, a plurality of rear camera modules (4071, 4072, 4073, 4074) may have different attributes (e.g., angle of view) or functions and may include, for example, a dual camera or a triple camera. The plurality of rear camera modules (4071, 4072, 4073, 4074) may include a plurality of camera modules including lenses having different angles of view, and the electronic device (300) may control the change of the angle of view of the camera module performed in the electronic device (300) based on the user's selection. The plurality of rear camera modules (4071, 4072, 4073, 4074) may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). In some embodiments, the IR camera may operate as at least part of a sensor module.

[0069] According to one embodiment, the rear plate (302) may include an opening corresponding to a light-emitting module (408) when viewed from above the rear plate (302). The light-emitting module (408) may be positioned through the opening of the rear plate (302). In some embodiments, the rear plate (302) may be implemented to include substantially transparent light-transmitting regions in place of the opening corresponding to the light-emitting module (408). The light-emitting module (408) (e.g., a flash) may include a light source for a plurality of rear camera modules (4071, 4072, 4073, 4074). The light-emitting module (408) may include, for example, an LED or a xenon lamp.

[0070] The input module (409) may include, for example, one or more key input devices. One or more key input devices may be located, for example, in an opening formed on the side (310C) of the electronic device (300). In some embodiments, the electronic device (300) may not include some or all of the key input devices, and the key input devices not included may be implemented as soft keys using the display (401). The location or number of the input module (409) may vary, and in some embodiments, the input module (409) may include at least one sensor module.

[0071] A connection terminal module (e.g., a connector module or an interface terminal module) (410) may include, for example, a connector (or interface terminal) located inside the electronic device (300), and a connector hole formed on the side (310C) of the electronic device (300) corresponding to the connector. The electronic device (300) may transmit and / or receive power and / or data with an external electronic device electrically connected to the connector. In one embodiment, the connector may include a USB (universal serial bus) connector or an HDMI (high definition multimedia interface) connector. In some embodiments, the electronic device (300) may further include another connection terminal module including an audio connector (e.g., a headphone connector or an earset connector). The location or number of connection terminal modules may vary and is not limited to the illustrated examples.

[0072] FIG. 5 is an exploded view of the electronic device (300) of FIG. 3 according to one embodiment. FIG. 6 and 7 are perspective views of an antenna module (6) according to one embodiment.

[0073] Referring to FIGS. 5 and 6, in one embodiment, the electronic device (300) may include a front plate (301), a rear plate (302), a side member (303), a first support member (510), a second support member (520), a third support member (530), a display (401), a first substrate assembly (540), a second substrate assembly (550), a battery (560), an antenna structure (570), a first adhesive member (580), a second adhesive member (590), an antenna module (6), and / or a dielectric array (7). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the second support member (520) or the third support member (530)) or additionally include other components.

[0074] According to one embodiment, the side member (303) may include a first side portion (S1), a second side portion (S2), a third side portion (S3), and / or a fourth side portion (S4). When viewed from above the front plate (301) (e.g., in the -z axis direction), the first side portion (S1) and the second side portion (S2) may be spaced apart from each other in a first direction (e.g., in the x axis direction) and may be substantially parallel. The third side portion (S3) may connect one end of the first side portion (S1) and one end of the second side portion (S2). The fourth side portion (S4) may connect the other end of the first side portion (S1) and the other end of the second side portion (S2). When viewed from above on the front plate (301), the third side portion (S3) and the fourth side portion (S4) are positioned apart from each other in a second direction (e.g., the y-axis direction) perpendicular to the first direction and may be substantially parallel. The corner where the first side portion (S1) and the third side portion (S3) are connected, the corner where the first side portion (S1) and the fourth side portion (S4) are connected, the corner where the second side portion (S2) and the third side portion (S3) are connected, and / or the corner where the second side portion (S2) and the fourth side portion (S4) are connected may be formed as a smooth curve.

[0075] According to one embodiment, the side member (303) may include a plurality of insulating portions (503) and a plurality of conductive portions separated by the plurality of insulating portions (503). The plurality of conductive portions included in the side member (303) may form a portion of the side (310C) (see FIG. 1) of the electronic device (300), and the plurality of insulating portions (503) included in the side member (303) may form a portion of the electronic device (310C). The portion of the side (310C) of the electronic device (300) formed by the plurality of conductive portions included in the side member (303) and the portion of the side (310C) of the electronic device (300) formed by the plurality of insulating portions (503) included in the side member (303) may be smoothly connected without a substantial height difference. A plurality of conductive parts included in the side member (303) may include, for example, titanium, an amorphous alloy, a metal-ceramic composite material (e.g., cermet), or stainless steel. In some embodiments, a plurality of conductive parts included in the side member (303) may include magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy. A plurality of conductive parts included in the side member (303) may include various other metallic materials. Hereinafter, a plurality of conductive parts included in the side member (303) may be referred to by various terms such as 'side conductive structure', 'side metal structure', 'outer conductive structure', 'outer metal structure', 'first conductive structure', or 'first metal structure' of the electronic device (300).

[0076] According to one embodiment, the first support member (510) may be located inside the electronic device (300) and connected to the side member (303), or may be formed integrally with the side member (303). The first support member (510) may be formed, for example, from a metal material and / or a non-metal material (e.g., a polymer). In one embodiment, the first support member (510) may include at least one conductive portion and at least one non-conductive portion connected to the at least one conductive portion. The at least one conductive portion included in the first support member (510) may be connected to or formed integrally with at least a part of the side conductive structure of the electronic device (300) (e.g., a metal structure including a plurality of conductive portions of the side member (303)). The at least one non-conductive portion included in the first support member (510) may be connected to or formed integrally with a plurality of insulating portions (503) included in the side member (303). Hereinafter, at least one conductive portion included in the first support member (510) may be referred to by various terms such as 'internal conductive structure', 'inner conductive structure', 'inner metal structure', 'second conductive structure', or 'second metal structure' of the electronic device (300). Hereinafter, at least one non-conductive portion included in the first support member (510) may be referred to by various terms such as 'internal non-conductive structure', 'inner non-conductive structure', or 'inner polymer structure' of the electronic device (300). The internal conductive structure of the electronic device (300) may include, for example, a metal material different from the lateral conductive structure of the electronic device (300) (e.g., magnesium, magnesium alloy, aluminum, aluminum alloy, zinc alloy, or copper alloy). As another example, the internal conductive structure of the electronic device (300) may include at least some metal material identical to the lateral conductive structure of the electronic device (300).The internal non-conductive structure of the electronic device (300) may include various polymers, for example, engineering plastics (e.g., polycarbonate (PC) or polymethyl methacrylate (PMMA)). The internal non-conductive structure of the electronic device (300) may include polymer resins, for example, polyether ether ketone, polyphenylene sulfide, polybutylene terephthalate, polyimide, or polycarbonate. In some embodiments, the internal non-conductive structure of the electronic device (300) may comprise a material (e.g., fiber reinforced plastic (FRP)) in which engineering plastic is mixed with various reinforcing materials such as glass fiber or carbon fiber. A plurality of insulating portions (503) included in the side member (303) may comprise a non-metallic material identical to the internal non-conductive structure of the electronic device (30). In some embodiments, a plurality of insulating portions (503) included in the side member (303) may comprise a non-metallic material different from the internal non-conductive structure of the electronic device (30).

[0077] According to one embodiment, at least one conductive part (e.g., internal conductive structure) included in the first support member (510) may serve as electromagnetic shielding for the display (401), the first substrate assembly (540), and / or the second substrate assembly (550). In one embodiment, the first support member (510) and the side member (303) may be referred to as a 'front case' (50). Electronic components such as the display (401), the first substrate assembly (540), the second substrate assembly (550), or the battery (560), or various components related to electronic components may be placed in the front case (50) or the first support member (510), or supported by the front case (50) or the first support member (510). The front case (50) or the first support member (510) is included in the electronic device (300) to withstand a load and may contribute to the durability or rigidity (e.g., torsional rigidity) of the electronic device (300). In some embodiments, the front case (50) or the first support member (510) may be referred to by various other terms such as 'first frame', 'first frame structure', or 'first framework'. The first support member (510) is an internal structure located in the internal space of the electronic device (300) and, in some embodiments, may be referred to by various other terms such as 'bracket' or 'support structure'.

[0078] The display (401) may be positioned, for example, between the first support member (510) and the front plate (301) and may be placed on one side of the first support member (510) (e.g., the side facing the front plate (301)). In one embodiment, the display (401) may be bonded to the front plate (301) using an optically clear adhesive member such as OCA (optical clear resin), OCR (optical clear resin), or SVR (super view resin). The first substrate assembly (540) and the second substrate assembly (550) may be positioned, for example, between the first support member (510) and the rear plate (302) and may be placed on the other side of the first support member (510) (e.g., the side facing the rear plate (302)). The battery (560) may be positioned, for example, between the first support member (510) and the rear plate (302), and may be placed on the first support member (510).

[0079] According to one embodiment, the first substrate assembly (540) may include a first printed circuit board (541) (e.g., a printed circuit board (PCB), or a printed circuit board assembly (PBA). The first substrate assembly (540) may include various electronic components electrically connected to the first printed circuit board (541). The electronic components may be placed on the first printed circuit board (541) or may be electrically connected to the first printed circuit board (541) through an electrical path such as a cable or a flexible printed circuit board (FPCB). Referring to FIGS. 3 and 4, the electronic components may include, for example, a second speaker included in the third audio module (404), a sensor module (405), a front camera module (406), a plurality of rear camera modules (4071, 4072, 4073, 4074), a light-emitting module (408), or an input module (409).

[0080] According to one embodiment, the second substrate assembly (550) may be spaced apart from the first substrate assembly (540) with the battery (560) in between when viewed from above the front plate (301) (e.g., when viewed in the -z axis direction). The second substrate assembly (550) may include a second printed circuit board (551) electrically connected to the first printed circuit board (541) of the first substrate assembly (540). The second substrate assembly (550) may include various electronic components electrically connected to the second printed circuit board (551). The electronic components may be placed on the second printed circuit board (551) or may be electrically connected to the second printed circuit board (551) through an electrical path such as a cable or FPCB. Referring to FIGS. 3 and 4, the electronic components may include, for example, a microphone included in the first audio module (402), a first speaker included in the second audio module (403), or a connector included in the connection terminal module (410).

[0081] According to some embodiments, the first substrate assembly (540) or the second substrate assembly (550) may include a primary PCB (or, main PCB or master PCB), a secondary PCB (or slave PCB) disposed partially overlapping with the primary PCB, and / or an interposer substrate between the primary PCB and the secondary PCB.

[0082] The battery (560) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (560) may be integrally disposed inside the electronic device (300) and may be implemented to be detachably attached to the electronic device (300).

[0083] According to one embodiment, the second support member (520) may be positioned between the first support member (510) and the rear plate (302) and may be coupled to the first support member (510) and / or the first substrate assembly (540) using a fastening element such as a screw (or bolt). At least a portion of the first substrate assembly (540) may be positioned between the first support member (510) and the second support member (520), and the second support member (520) may cover and protect the first substrate assembly (540). The third support member (530) may be positioned at least partially spaced apart from the second support member (520) with the battery (560) in between, when viewed from above the rear plate (302) (e.g., in the +z axis direction). The third support member (530) may be positioned between the first support member (510) and the rear plate (302) and may be joined to the first support member (510) and / or the second substrate assembly (550) using fastening elements such as screws (or bolts). At least a portion of the second substrate assembly (550) may be positioned between the first support member (510) and the third support member (530), and the third support member (530) may cover and protect the second substrate assembly (550). The second support member (520) and / or the third support member (530) may be formed of a metal material and / or a non-metal material (e.g., a polymer). In some embodiments, the second support member (520) may serve as electromagnetic shielding for the first substrate assembly (540), and the third support member (530) may serve as electromagnetic shielding for the second substrate assembly (550). In some embodiments, the second support member (520) and / or the third support member (530) may be referred to as a 'rear case'. In some embodiments, the second support member (520) and / or the third support member (530) may be interpreted as part of the housing (310).

[0084] According to some embodiments, an integral substrate assembly comprising a first substrate assembly (540) and a second substrate assembly (550) may be implemented. For example, when viewed from above the rear plate (302) (e.g., in the +z axis direction), the substrate assembly may include a first portion and a second portion spaced apart from each other with the battery (560) in between, and a third portion extending between the battery (560) and the side member (303) and connecting the first portion and the second portion. The third portion may be implemented substantially rigidly. In some embodiments, the third portion may be implemented substantially flexiblely. In some embodiments, an integral support member comprising a second support member (520) and a third support member (530) may be implemented.

[0085] According to one embodiment, the second support member (520) (e.g., rear case) may include a non-conductive member (not shown) formed of a non-metallic material (e.g., polymer) and / or a plurality of conductive patterns (not shown) disposed on the non-conductive member. For example, the conductive patterns may be implemented by laser direct structuring (LDS). LDS may be a method of forming conductive patterns by, for example, using a laser to design a pattern on the non-conductive member and plating a conductive material such as copper or nickel thereon. The plurality of conductive patterns may be electrically connected to a wireless communication circuit (or wireless communication module) included in the first substrate assembly (540) and may operate as antenna radiators. In one embodiment, at least some conductive portions included in the side member (303) may operate as antenna radiators electrically connected to the wireless communication circuit. The wireless communication circuit may process a transmitted signal or a received signal in at least one selected or designated frequency band through at least one antenna radiator. The selected or specified frequency band may include, for example, at least one of LB (low band) (approx. 600 MHz to approx. 1 GHz), MB (middle band) (approx. 1 GHz to approx. 2.3 GHz), HB (high band) (approx. 2.3 GHz to approx. 2.7 GHz), or UHB (ultra-high band) (approx. 2.7 GHz to approx. 6 GHz). The specified frequency band may include various other frequency bands.

[0086] According to one embodiment, the antenna structure (570) may be positioned between the second support member (520) and the rear plate (302). In some embodiments, the antenna structure (570) may be positioned between the battery (560) and the rear plate (302). The antenna structure (570) may be implemented in the form of a film, for example, such as an FPCB. The antenna structure (570) may include at least one conductive pattern that is utilized as a loop-shaped radiator. For example, the at least one conductive pattern may include a planar helical conductive pattern (e.g., a planar coil, or a pattern coil). In one embodiment, the at least one conductive pattern included in the antenna structure (570) may be electrically connected to a wireless communication circuit (or wireless communication module) included in the first substrate assembly (540). For example, the at least one conductive pattern may be utilized for near-field communication, such as NFC. As another example, at least one conductive pattern may be utilized for magnetic secure transmission (MST) that transmits and / or receives magnetic signals. In some embodiments, at least one conductive pattern included in the antenna structure (570) may be electrically connected to a power transmission / reception circuit included in the first substrate assembly (540). The power transmission / reception circuit may wirelessly receive power from an external electronic device or wirelessly transmit power to an external electronic device using at least one conductive pattern. The power transmission / reception circuit may include a power management module, for example, a power management integrated circuit (PMIC) or a charger integrated circuit (CIC). The power transmission / reception circuit may charge the battery (560) using the power received wirelessly using the conductive pattern.

[0087] According to one embodiment, the first adhesive member (580) may be positioned between the front plate (301) and the first support member (510), or between the front plate (301) and the side member (303). The front plate (301) may be joined to the first support member (510) or the side member (303) using the first adhesive member (580). The first adhesive member (580) may be arranged annularly, for example, adjacent to the edge (or border) of the front plate (301). The first adhesive member (580) may be formed in various other shapes, not limited to the illustrated examples. In some embodiments, the first adhesive member (580) may include a plurality of adhesive members separated from each other. In this case, there may be a separate adhesive member or filling member connecting the two separated adhesive members.

[0088] According to one embodiment, the second adhesive member (590) may be positioned between the rear plate (302) and the first support member (510), or between the rear plate (302) and the side member (303). The rear plate (302) may be joined to the first support member (510) or the side member (303) using the second adhesive member (590). The second adhesive member (590) may be arranged annularly, for example, adjacent to the edge (or border) of the rear plate (302). The second adhesive member (590) may be formed in various other shapes, not limited to the illustrated examples. In some embodiments, the second adhesive member (590) may include a plurality of adhesive members separated from each other. In this case, there may be a separate adhesive member or filling member connecting the two separated adhesive members.

[0089] According to one embodiment, the first adhesive member (580) or the second adhesive member (590) may include a heat-reactive adhesive material, a photo-reactive adhesive material, a general adhesive, or a double-sided tape.

[0090] According to one embodiment, the antenna module (6) may include an antenna structure (61), a communication circuit (62), a power management circuit (63), a connector (64), and / or an electrical path (65). The antenna module (6) may be, for example, the third antenna module (246) of FIG. 2.

[0091] According to one embodiment, the antenna structure (61) may include a printed circuit board (611) on which an antenna array (612) is disposed. The printed circuit board (611) may include a first surface (601) and a second surface (602) facing in the opposite direction to the first surface (601). The first surface (601) and the second surface (602) may, for example, be substantially parallel. The antenna array (612) may include a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) located on the first surface (601) or inside the printed circuit board (611) closer to the first surface (601) than to the second surface (602). A plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may be, for example, the antenna (248) of FIG. 2. In one embodiment, the plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may be substantially identical in shape and may be arranged at regular intervals. In one embodiment, the plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may transmit and / or receive signals of substantially the same frequency band. The printed circuit board (611) may include a plurality of conductive layers (e.g., a plurality of conductive pattern layers) and a plurality of non-conductive layers (e.g., insulating layers) stacked alternately with the plurality of conductive layers. A plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may be implemented, for example, as at least some of the plurality of conductive layers. In some embodiments, the number or location of antenna elements included in the antenna array (612) may vary and is not limited to the embodiment shown in FIG. 6.

[0092] According to one embodiment, a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) can operate as a patch antenna. In some embodiments, the shape of the plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may vary and is not limited to the circular shape according to the embodiment of FIG. 6. For example, the plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may be formed as polygons such as squares or ellipses. In one embodiment, the antenna elements (612a, 612b, 612c, 612d, 612e) may be formed as a single-layer structure included in a printed circuit board (611). In some embodiments, the antenna elements (612a, 612b, 612c, 612d, 612e) may be implemented as a stacked structure comprising a plurality of conductive parts (e.g., conductive patches) located on different layers of the printed circuit board (611) and overlapping each other. In some embodiments, the number or location of the antenna array may vary and is not limited to the embodiment illustrated in FIG. 6. Although not illustrated, the antenna structure (61) may further include an antenna array comprising a plurality of antenna elements operating as a dipole antenna. In some embodiments, the plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may operate as a patch antenna or an antenna other than a dipole antenna.

[0093] According to one embodiment, a communication circuit (or wireless communication circuit) (62) may be placed on a second surface (602) of a printed circuit board (611) using a conductive adhesive material such as solder. For example, the communication circuit (62) may be electrically connected to a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) through wiring included in the printed circuit board (611) (e.g., an electrical path consisting of a conductive pattern or a conductive via). As another example, the communication circuit (62) may be placed on a printed circuit board different from the printed circuit board (611) (e.g., a first printed circuit board (541) of FIG. 5 on which components such as the processor (120), memory (130), or communication module (190) of FIG. 1 are placed). In one embodiment, the communication circuit (62) may include a radio frequency integrate circuit (RFIC). For example, the communication circuit (62) may be the third RFIC (226) of FIG. 2.

[0094] According to one embodiment, the communication circuit (62) can transmit and / or receive a signal in at least some frequency band from about 3 GHz to about 100 GHz through the antenna array (612). The communication circuit (62) can up-convert or down-convert the frequency of the transmitted or received signal. The communication circuit (62) can receive an intermediate frequency (IF) signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on another printed circuit board and up-convert the received IF signal into a radio frequency (RF) signal (e.g., millimeter wave). The communication circuit (62) can down-convert the RF signal received through the antenna array (612) into an IF signal, and the IF signal can be provided to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on another printed circuit board.

[0095] According to one embodiment, a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) can be fed directly or indirectly from a communication circuit (62) and operate as antenna radiators.

[0096] According to some embodiments, a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) may be utilized as dummy elements (e.g., dummy antennas or dummy patches, or conductive patches). The dummy elements may be physically separated from other conductive elements and be in an electrically floating state. The antenna module (6) may include a plurality of feed antenna elements (not shown) that, when viewed from above on the first surface (601), overlap at least partially with the plurality of antenna elements (612a, 612b, 612c, 612d, 612e) and are physically separated from the plurality of antenna elements (612a, 612b, 612c, 612d, 612e). Multiple feed antenna elements are electrically connected to a communication circuit (62), and multiple antenna elements (612a, 612b, 612c, 612d, 612e) can be indirectly fed from multiple feed antenna elements and operate as antenna radiators.

[0097] According to one embodiment, the antenna structure (61) may include a ground plane (or ground layer) (not shown) implemented in at least some of the plurality of conductive layers included in the printed circuit board (611). The ground plane may be positioned between the antenna array (612) and the second surface (602) and may overlap at least partially with the antenna array (612) when viewed from above the first surface (601). In some embodiments (not shown), the antenna module (6) may further include an antenna array operating as a dipole antenna. In this case, when viewed from above the first surface (601) (e.g., in the -x axis direction), the ground plane included in the printed circuit board (611) may not overlap with the antenna array operating as a dipole antenna.

[0098] According to one embodiment, the power management circuit (63) may be placed on a second side (602) of the printed circuit board (611) using a conductive adhesive material such as solder. As another example, the power management circuit (63) may be placed on a printed circuit board different from the printed circuit board (611) (e.g., the first printed circuit board (541) of FIG. 5 on which components such as the processor (120), memory (130), or communication module (190) of FIG. 1 are placed). The power management circuit (63) may be electrically connected to the communication circuit (62) or various other components placed on the printed circuit board (611) (e.g., a connector (64) or a passive component) through wiring included in the printed circuit board (611) (e.g., an electrical path consisting of a conductive pattern or a conductive via). In one embodiment, the power management circuit (63) may be a power management integrated circuit (PMIC).

[0099] According to one embodiment, the connector (64) may be placed on a second side (602) of the printed circuit board (611) using a conductive adhesive material such as solder. One end of the electrical path (65), such as a flexible printed circuit board, may be connected to the connector (64) (e.g., an FPCB connector). In some embodiments, one end of the electrical path (65) may be electrically connected to conductive terminals (e.g., lands or copper pads) located on the second side (602) of the printed circuit board (611) using a conductive adhesive material such as solder, in which case the connector (64) may be omitted. The other end of the electrical path (65) may include a connector (651) for electrical connection with another printed circuit board (e.g., the first printed circuit board (541) of FIG. 5 on which components such as the processor (120), memory (130), or communication module (190) of FIG. 1 are placed).

[0100] According to some embodiments, the antenna module (6) is defined or interpreted with at least one component (e.g., electrical path (65)) omitted, or one or more other components may be added to the antenna module (6).

[0101] According to some embodiments, the antenna module (6) may further include a shielding member (or electromagnetic shielding member) (66) located on a second surface (602) to enclose at least one of the communication circuit (62) and / or the second power management circuit (63). The shielding member (66) may electromagnetically shield the communication circuit (62) and / or the power management circuit (63). The shielding member (66) may include a conductive member, for example, such as a shield can. As another example, the shielding member (66) may include a protective member, such as urethane resin, and a conductive paint, such as an electromagnetic interference (EMI) paint, applied to the outer surface of the protective member. In some embodiments, the shielding member (66) may be implemented as various shielding sheets placed to cover the second surface (602).

[0102] According to some embodiments (not shown), the antenna module (6) may further include a frequency adjustment circuit placed on a printed circuit board (611). For example, the frequency adjustment circuit, such as a tuner or a passive element, can adjust the impedance or shift the resonant frequency to a specified frequency or shift it by a specified amount.

[0103] According to one embodiment, the antenna structure (61) may be located inside the electronic device (30) corresponding to the first side portion (S). The antenna structure (61) may be located closer to the first side portion (S1) than to the second side portion (S2). The first surface (601) of the antenna structure (61) may be substantially oriented toward the first side portion (S1). When viewed from above the first surface (601) of the antenna structure (61) (e.g., when viewed in the -x axis direction), the antenna array (612) of the antenna structure (61) may overlap at least partially with the first side portion (S1). For example, when a radiating current (or electromagnetic signal) is provided to the antenna structure (61), the antenna array (612) may radiate the provided (or fed) electromagnetic signal to the outside by substantially passing through the first side portion (S1). The antenna array (612) can receive electromagnetic signals passing through the first side portion (S1) from the outside. The antenna structure (61) may be positioned corresponding to the second side portion (S2), the third side portion (S3), or the fourth side portion (S4), not limited to the illustrated example.

[0104] According to one embodiment, the first side portion (S1) of the side member (303) may include a non-conductive portion (502) positioned corresponding to the antenna structure (61). When viewed from above (e.g., in the -x axis direction) of the first surface (601) of the antenna structure (61), the non-conductive portion (502) may be aligned and overlapped with the antenna array (612) of the antenna structure (61). The side conductive structure of the electronic device (300) may include an opening (not shown), and the non-conductive portion (502) may be positioned in the opening of the side conductive structure. The non-conductive portion (502) of the side member (303) may be formed, for example, by filling the opening formed in the side conductive structure of the electronic device (300) with a non-conductive material (e.g., a polymer). The non-conductive portion (502) of the side member (303) may form a part of the side (310C) of the electronic device (300). The part of the side (310C) of the electronic device (300) formed by the side conductive structure and the part of the side (310C) of the electronic device (300) formed by the non-conductive portion (502) may be smoothly connected without a substantial height difference. The non-conductive portion (502) may refer to an area through which radio waves regarding the frequency signal penetrate when transmitting or receiving a frequency signal through an antenna array (612) included in the antenna structure (61). In one embodiment, the non-conductive portion (502) may be a radio frequency window area. For example, when a radiating current (or electromagnetic signal) is provided to the antenna structure (61), the antenna array (612) can radiate the provided (or fed) electromagnetic signal to the outside by passing through the substantially non-conductive part (502). For example, the antenna array (612) can receive the electromagnetic signal passing through the non-conductive part (502) from the outside.A non-conductive portion (502) (e.g., RF window area) can reduce the effect of a lateral conductive structure of an electronic device (300) formed by a lateral member (303) on the radiation performance (or antenna radiation performance, or radio wave transmission / reception performance) or coverage (or beam coverage) of an antenna structure (61). The non-conductive portion (502) may include, for example, various polymers.

[0105] According to one embodiment, the non-conductive portion (502) may have substantially the same color as the side conductive structure so that the non-conductive portion (502) and the side conductive structure of the electronic device (300) (e.g., a metal structure including a plurality of conductive portions of the side member (303)) are difficult to visually distinguish. In some embodiments, a material having various colors or textures may be applied to the side (310C) of the electronic device (300), thereby obscuring the boundary between the side conductive structure of the electronic device (300) and the non-conductive portion (502).

[0106] According to one embodiment, the dielectric array (7) may be positioned facing the first surface (601) of the antenna structure (61). The dielectric array (7) may be positioned between the non-conductive portion (502) of the side member (303) and the first surface (601) of the antenna structure (61). The dielectric array (7) may include a plurality of dielectric structures positioned in a one-to-one correspondence with a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) between the non-conductive portion (502) of the side member (303) and the antenna array (612) of the antenna structure (61). The plurality of dielectric structures may operate as dielectric lenses (or electromagnetic lenses). A dielectric lens can focus or diverge electromagnetic waves, for example, just as an optical lens refracts light waves, and radiation performance and / or coverage for an antenna structure (61) can be secured due to a plurality of dielectric structures as a dielectric lens.

[0107] FIG. 8 is a yz plan view of an electronic device (300) when viewed in the -x axis direction in FIG. 3 in one embodiment. FIG. 9 is a partial cross-sectional view of a part of the electronic device (300) in one embodiment. FIG. 10 illustrates a cross-sectional structure (1000) in the xz plane of a part of the electronic device (300) with respect to the AA' line in FIG. 3 in one embodiment. FIG. 11 illustrates yz plan views (1111, 1112) and a cross-sectional structure (1113) in the xz plane of a dielectric structure in one embodiment, and a yz plan view (1120) of a part of an antenna structure (61). FIG. 12 illustrates yz plan views (1211, 1212) and a cross-sectional structure (1213) in the xz plane of a dielectric structure in another embodiment. FIG. 13 illustrates yz plan views (1311, 1312) and a cross-sectional structure (1313) of the xz plane relating to the dielectric structure in another embodiment.

[0108] Referring to FIGS. 8, 9, and 10, the electronic device (300) may include a front plate (301), a rear plate (302), a side conductive structure (810), a non-conductive part (502), an internal non-conductive structure (820), an internal conductive structure (830), an antenna module (6), a fourth support member (1010), a dielectric array (7), a display (401), and / or a first printed circuit board (541).

[0109] According to one embodiment, the side conductive structure (810) may be a metal structure comprising a plurality of conductive portions included in the side member (303) (see FIG. 5). A non-conductive portion (502) may be located in an opening (811) formed in the side conductive structure (810). An internal non-conductive structure (820) may be at least one non-conductive portion included in the first support member (e.g., bracket) (510). An internal conductive structure (830) may be at least one conductive portion included in the first support member (510). A first adhesive member (580) may be located between the front plate (301) and the first support member (510), and the front plate (301) may be joined to the first support member (510) using the first adhesive member (580). In the cross-sectional structure (1000) of FIG. 10, the area (hereinafter referred to as the first attachment area) where the first adhesive member (580) of the first support member (510) is disposed is shown as being formed by an internal non-conductive structure (820), but is not limited thereto, and at least a portion of the first attachment area may be formed by an internal conductive structure (830). The display (401) may be positioned between the first support member (510) and the front plate (301). The second adhesive member (590) may be positioned between the rear plate (302) and the first support member (510), and the rear plate (302) may be combined with the first support member (510) using the second adhesive member (590). In the cross-sectional structure (1000) of FIG. 10, the area (hereinafter referred to as the second attachment area) where the second adhesive member (590) is disposed among the first support member (510) is provided as an example formed by an internal non-conductive structure (820) and an internal conductive structure (830), but is not limited thereto; for example, at least a portion of the second attachment area may be formed by an internal non-conductive structure (820) or an internal conductive structure (830). The first printed circuit board (541) may be located between the first support member (510) and the rear plate (302).

[0110] According to one embodiment, the antenna module (6) may be positioned inside the electronic device (300) using a fourth support member (1010). The antenna structure (61) may be connected to the first support member (510), for example, using the fourth support member (1010). The fourth support member (1010) may contribute to the antenna structure (61) being stably positioned in the internal space of the electronic device (300). The fourth support member (1010) may contribute to the durability of the antenna structure (61). In one embodiment, the fourth support member (1010) may be joined to the first support member (510) using bonding including an adhesive member or screw fastening. The fourth support member (1010) may include a seating structure capable of stably positioning the antenna structure (61). The mounting structure may include, for example, a recess structure or a fitting structure that allows the antenna structure (61) to be stably positioned on the fourth support member (1010) without shaking. In one embodiment, the fourth support member (1010) may include an opening or a recess where a component (e.g., communication circuit (62), power management circuit (63), connector (64), or shielding member (66) of FIG. 6) disposed on the second surface (602) of the antenna structure (61) can be positioned. In one embodiment, the fourth support member (1010) may be implemented as a single metal structure including a bend. The fourth support member (1010) may include, for example, titanium, an amorphous alloy, a metal-ceramic composite material (e.g., cermet), or stainless steel. As another example, the fourth support member (1010) may include magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy. The fourth support member (1010) may include various other metallic materials. In one embodiment, the fourth support member (1010) formed of a metallic material may reduce electromagnetic influence (e.g., EMI) on the antenna structure (61).In some embodiments, the fourth support member (1010) may comprise a non-metallic material. The fourth support member (1010) may be modified in various forms, not limited to the illustrated examples, so as to be able to stably or firmly connect the antenna structure (61) and the first support member (510). The fourth support member (1010) may be referred to by various other terms such as 'connecting structure', 'connecting member', 'bracket', 'antenna module support member', 'antenna module support structure', 'antenna module bracket', or 'frame' as an element for stably positioning the antenna structure (61) in the internal space of the electronic device (300).

[0111] According to one embodiment, an adhesive member may be positioned between the fourth support member (1010) and the antenna structure (61). For example, the antenna structure (61) may be bonded to the fourth support member (1010) using a thermal adhesive material, a photoreactive adhesive material, a general adhesive, or double-sided tape. In some embodiments, a flexible member such as rubber may be positioned between the fourth support member (1010) and the antenna structure (61). In some embodiments, a flexible member such as rubber may be positioned between the fourth support member (1010) and the first support member (510). The adhesive member or flexible member between the fourth support member (1010) and the antenna structure (61), and / or the flexible member between the fourth support member (1010) and the first support member (510), can reduce the stress effect on the antenna structure (61), the stress effect between the antenna structure (61) and the fourth support member (1010), or the stress effect between the fourth support member (1010) and the first support member (510) when an external shock is applied to the electronic device (300).

[0112] According to one embodiment, heat emitted from the antenna structure (61) and electronic components (e.g., communication circuit (62) or power management circuit (63) of FIG. 7) placed on the antenna structure (61) can be transferred to the first support member (510) via the fourth support member (1010) by conduction, through which heat flows from a high-temperature portion to a low-temperature portion. The first support member (510) can serve as, for example, a heat spreader. The fourth support member (1010) can serve as a heat transfer path between the antenna structure (61) and the heat spreader (e.g., the first support member (510)). Heat diffusion or heat dispersion using the fourth support member (1010) and the first support member (510) can prevent overheating, thereby reducing performance degradation or damage to the antenna structure (61) and electronic components placed on the antenna structure (61). At least a portion of the fourth support member (1010) may be in physical contact with the first support member (510). In some embodiments, a thermally conductive material (or thermally conductive member), such as a thermal interface material (TIM), may be interposed between at least a portion of the fourth support member (1010) and the first support member (510) to improve heat transfer performance. In some embodiments, a thermally conductive material (or thermally conductive member), such as a TIM, may be interposed between the fourth support member (1010) and the antenna structure (61), or between the fourth support member (1010) and an electronic component disposed on the antenna structure (61) to improve heat transfer performance.

[0113] According to one embodiment, a first surface (601) of the antenna structure (61) may face a non-conductive portion (502). A beam pattern (or radiation pattern) (e.g., beam width, beam direction) formed by combining beams formed from a plurality of antenna elements (612a, 612b, 612c, 612d) (see FIG. 6) included in the antenna structure (61) may be formed. The electronic device (300) may perform beam forming through the antenna array (612) (see FIG. 6). The electronic device (300) may store codebook information regarding beam forming in a memory (e.g., memory (130) of FIG. 1). The electronic device (300) can efficiently control (e.g., assign or place) multiple beams through multiple antenna elements (612a, 612b, 612c, 612d) of the antenna array (612) based on codebook information. The electronic device (300) can form a beam pattern by adjusting the phase of the current supplied to the multiple antenna elements (612a, 612b, 612c, 612d) of the antenna array (612) based on codebook information. In one embodiment, by beamforming, the antenna array (612) can form a beam that radiates relatively more energy in the direction in which the first surface (601) faces (e.g., the +x axis direction). In the illustrated example, the antenna array (612) can form a beam pattern substantially toward the non-conductive portion (502) of the first side portion (S1) (see FIG. 5).

[0114] According to one embodiment, the antenna array (612) of the antenna structure (61) can form a beam pattern toward a non-conductive portion (502) located substantially at the opening (811) of the side conductive structure (810). When viewed from above on the first surface (601) of the antenna structure (61) (e.g., in the -x axis direction), the non-conductive portion (502) can be aligned and overlapped with the antenna array (612) of the antenna structure (61) and can become an RF window area through which radio waves pass. As an RF window area, the non-conductive portion (502) can contribute to securing coverage while reducing the degradation of the radiation performance of the antenna module (6) by the side conductive structure (810) of the electronic device (300), for example. The non-conductive portion (502) as an RF window area can reduce the influence of the side conductive structure (801) of the electronic device (300) on the radio waves radiated from the antenna array (612) (see FIG. 6) to reduce deformation (e.g., distortion) of the beam pattern.

[0115] According to one embodiment, the dielectric array (7) may be positioned between a non-conductive portion (502) and a first surface (601) of an antenna structure (61). The dielectric array (7) may include a plurality of dielectric structures (or dielectric lenses or radio wave lenses) (e.g., a first dielectric structure (71), a second dielectric structure (72), a third dielectric structure (73), a fourth dielectric structure (74), and a fifth dielectric structure (75)) positioned in a one-to-one correspondence with a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) of an antenna array (612) (see FIG. 6) included in the antenna structure (61). Multiple dielectric structures (71, 72, 73, 74, 75) may overlap with the opening (811) or non-conductive portion (502) of the lateral conductive structure (810) when viewed from above (e.g., in the -x axis direction) of the first surface (601) of the antenna structure (61). Multiple dielectric structures (71, 72, 73, 74, 75) may not substantially overlap with the lateral conductive structure (810) when viewed from above (601) of the antenna structure (61).

[0116] According to one embodiment, when looking at the cross-sectional structure (1000) of FIG. 10, at least some of the internal non-conductive structures (820) may be located between the lateral conductive structure (810) and the internal conductive structure (830) and may connect the lateral conductive structure (810) and the internal conductive structure (830). The internal non-conductive structure (820) may include a first opening (821), a second opening (822), a third opening (823), a fourth opening (824), and a fifth opening (825) that overlap with the opening (811) of the lateral conductive structure (810) when viewed from above (e.g., in the -x axis direction) of the first surface (601) of the antenna structure (61). The first opening (821), the second opening (822), the third opening (823), the fourth opening (824), and the fifth opening (825) may be located between the opening (811) of the side conductive structure (810) and the first surface (601) of the antenna structure (61). The first dielectric structure (71) may be located in the first opening (821). The second dielectric structure (72) may be located in the second opening (822). The third dielectric structure (73) may be located in the third opening (823). The fourth dielectric structure (74) may be located in the fourth opening (824). The fifth dielectric structure (75) may be located in the fifth opening (825).

[0117] According to one embodiment, a plurality of dielectric structures (71, 72, 73, 74, 75) may be substantially the same shape. The first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), the fourth dielectric structure (74), or the fifth dielectric structure (75) may include a first dielectric (91), a second dielectric (92) surrounding the first dielectric (91), and / or a third dielectric (93) surrounding the second dielectric (92), when viewed in a cross-section of a plane (e.g., yz plane) perpendicular to the direction (e.g., +x axis direction) in which the first surface (601) of the antenna structure (61) faces. The first dielectric may have a first dielectric constant, and the second dielectric may have a second dielectric constant different from the first dielectric constant. The third dielectric may have a third dielectric constant different from the first dielectric constant or the second dielectric constant. In one embodiment, the first permittivity may be greater than the second permittivity, and the second permittivity may be greater than the third permittivity. For example, the first permittivity (e.g., first relative permittivity) may be about 11, the second permittivity (e.g., second relative permittivity) may be about 7, and the third permittivity (e.g., third relative permittivity) may be about 3.6. The first permittivity, the second permittivity, or the third permittivity may vary and are not limited thereto.

[0118] According to one embodiment, a plurality of dielectric structures (71, 72, 73, 74, 75) may affect at least a portion of the energy (or electromagnetic waves) radiated from the antenna structure (61). In one embodiment comprising a plurality of dielectric structures (71, 72, 73, 74, 75), due to the influence of the plurality of dielectric structures (71, 72, 73, 74, 75), a beam pattern for coverage different from the beam pattern for coverage in a comparative example in which the plurality of dielectric structures (71, 72, 73, 74, 75) are omitted or in a comparative example comprising a single dielectric may be formed. In one embodiment, at least a portion of the energy (or electromagnetic waves) radiated from the antenna structure (61) may be guided and propagated by the plurality of dielectric structures (71, 72, 73, 74, 75). Multiple dielectric structures (71, 72, 73, 74, 75) may contribute to securing radiation performance or coverage (or beam coverage). A beam pattern for coverage (or corresponding to coverage) may include, for example, an effective area in which an antenna array (612) (see FIG. 6) can radiate or detect electromagnetic waves. In one embodiment including multiple dielectric structures (71, 72, 73, 74, 75), the beam pattern for coverage may contribute to securing an effective area in which electromagnetic energy can be concentrated or waves can be transmitted or received in at least one designated direction, compared to a comparative example in which multiple dielectric structures (71, 72, 73, 74, 75) are omitted or a comparative example including a single dielectric.

[0119] According to one embodiment, the dielectric structures (71, 72, 73, 74, or 75) may include a third surface (901) facing a first surface (601) of the antenna structure (61), and a fourth surface (902) located opposite the third surface (901) and facing a non-conductive portion (502). The third surface (901) and the fourth surface (902) may be, for example, planes substantially parallel to the first surface (601) of the antenna structure (61). In one embodiment, the third surface (901) and the fourth surface (902) may be circular planes of the same diameter. Referring to FIG. 11, the first dielectric (91) may be in the form of a circular cylinder having a first bottom surface (or first circular bottom surface) (91A) and a second bottom surface (or second circular bottom surface) (91B) formed in a circle of a first diameter (D1), and a height (H) between a third surface (901) and a fourth surface (902). The first bottom surface (91A) of the first diameter (D1) may face the first surface (601) of the antenna structure (61) as a portion of the third surface (901) included in the first dielectric (91). The second bottom surface (91B) of the first diameter (D1) may face the non-conductive portion (502) as a portion of the fourth surface (902) included in the first dielectric (91). The second dielectric (92) may be in the form of a hollow circular cylinder having a height (H) between the third face (901) and the fourth face (902), for example, an inner diameter of the first diameter (D1) and an outer diameter of the second diameter (D2) which is larger than the first diameter (D1). The first circular bottom (92A) may face the first face (601) of the antenna structure (61) as a portion of the third face (901) included in the second dielectric (92).The second circular bottom surface (92B) may face the non-conductive portion (502) as a portion of the second dielectric (92) included in the fourth surface (902). The third dielectric (93) may be in the form of a hollow circular cylinder containing a hollow, having a height (H) between the third surface (901) and the fourth circular bottom surface (93B), formed, for example, by an inner diameter of the second diameter (D2) and an outer diameter of the third diameter (D3) which is larger than the second diameter (D2). The third circular bottom surface (93A) may face the first surface (601) of the antenna structure (61) as a portion of the third dielectric (93) included in the third surface (901). The fourth circular bottom surface (93B) may face the non-conductive portion (502) as a portion of the third dielectric (93) included in the fourth surface (902). The first boundary (1101) between the first dielectric (91) and the second dielectric (92) may refer to the portion where the outer side surface of the first dielectric (91) and the inner side surface of the second dielectric (92) meet. The second boundary (1102) between the second dielectric (92) and the third dielectric (93) may refer to the portion where the outer side surface of the second dielectric (92) and the inner side surface of the third dielectric (93) meet. In one embodiment, the first boundary (1101) and the second boundary (1102) may be substantially parallel to the outer side surface (1103) of the third dielectric (3).

[0120] According to one embodiment, an antenna element (1121) included in an antenna structure (61) (e.g., any one of a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) corresponding to the dielectric structure illustrated in FIG. 11) may be formed as a circle having a third diameter (D3) when viewed from above the first surface (601) (e.g., when viewed in the -x axis direction). The center (C1) of the antenna element (1121) (e.g., the center of the circle) may be aligned with the center (C2) of the third surface (901) and the center (C3) of the fourth surface (902) and the direction in which the first surface (601) faces (e.g., the +x axis direction). A central axis (E) may be defined that is substantially parallel to the direction in which the first surface (61) of the antenna structure (61) faces and passes through the center (C1) of the antenna element (612d) (see FIG. 6) corresponding to the fourth dielectric structure (74). The center (C1) of the antenna element (1121), the center (C2) of the third surface (901), and the center (C3) of the fourth surface (902) may be located on the central axis (E).

[0121] According to one embodiment, the first boundary (1101) and the second boundary (1102) may be substantially parallel to the central axis (E) when viewed as a cross-section corresponding to the central axis (E). The outer side surface (1103) of the third dielectric (93) may be substantially parallel to the central axis (E) when viewed as a cross-section corresponding to the central axis (E).

[0122] According to some embodiments, the outer side surface (1103) of the first boundary (1101), the second boundary (1102), or the third dielectric (93) may be deformed so as not to be parallel to the central axis (E) when viewed as a cross-section corresponding to the central axis (E). For example, the first bottom surface (91A) included in the first dielectric (91) of the third surface (901) and the second bottom surface (91B) included in the first dielectric (91) of the fourth surface (902) may be formed into similar shapes of different sizes. For example, the first circular bottom surface (92A) included in the second dielectric (92) of the third surface (901) and the second circular bottom surface (92B) included in the second dielectric (92) of the fourth surface (902) may be formed into different shapes. For example, the third circular ring base (93A) included in the third dielectric (93) of the third surface (901) and the fourth circular ring base (93B) included in the third dielectric (93) of the fourth surface (902) can be formed in different shapes.

[0123] According to some embodiments, unlike the illustrated example, the antenna element (1121) may be formed in a shape different from the third surface (901) when viewed from above the first surface (601).

[0124] According to one embodiment, the first diameter (D1) of the first bottom surface (91A) and the second bottom surface (91B) of the first dielectric (91) may be a value corresponding to about 1 / 2 of the third diameter (D3) of the antenna element (1121). In one embodiment, the second diameter (D2) may be a value corresponding to about 3 / 4 of the third diameter (D3) of the antenna element (1121). The first diameter (D1) or the second diameter (D2) may vary and is not limited thereto.

[0125] According to some embodiments, the number of dielectrics included in the dielectric structure may vary and is not limited to the illustrated example. In some embodiments, the dielectric structure may vary and is not limited to the illustrated circular stacked structure when viewed in a cross-section of a plane (e.g., yz plane) perpendicular to the direction (e.g., +x axis direction) in which the first surface (601) of the antenna structure (61) faces.

[0126] FIG. 12 or 13 illustrates a stacked structure of a different form from the embodiment of FIG. 11.

[0127] Referring to FIG. 12, in some embodiments, the first dielectric (91) may be in the shape of a square cylinder having a first base (91A) and a second base (91B) formed in a square (e.g., a rectangle or a square), and a height (H) between a third face (901) and a fourth face (902). The second dielectric (92) may be in the shape of a hollow square cylinder having a first square ring-shaped base (92A) and a second square ring-shaped base (92B), and a height (H) between a third face (901) and a fourth face (902), and may include a hollow. The third dielectric (93) may be in the form of a hollow square cylinder containing a hollow, having, for example, a third square ring-shaped base (93A) and a fourth square ring-shaped base (93B), and a height (H) between the third face (901) and the fourth face (902). In the embodiment of FIG. 12, the antenna element included in the antenna structure (61) may be formed as a square that substantially corresponds to the third face (901) when viewed from above the first face (601) (see FIG. 10) (e.g., when viewed in the -x axis direction). In some embodiments, the antenna element may be formed in a shape different from the third face (901) when viewed from above the first face (601).

[0128] Referring to FIG. 13, in some embodiments, the first dielectric (91) may be in the shape of an elliptical cylinder having a height (H) between a first base (91A) and a second base (91B) formed in an elliptical shape, and a third face (901) and a fourth face (902). The second dielectric (92) may be in the shape of a hollow elliptical cylinder having a height (H) between a first elliptical ring-shaped base (92A) and a second elliptical ring-shaped base (92B), and a third face (901) and a fourth face (902), and may include a hollow. The third dielectric (93) may be in the form of a hollow elliptical cylinder containing a hollow, having, for example, a third elliptical ring-shaped base (93A) and a fourth elliptical ring-shaped base (93B), and a height (H) between the third face (901) and the fourth face (902). In the embodiment of FIG. 13, the antenna element included in the antenna structure (61) may be formed in an ellipse that substantially corresponds to the third face (901) when viewed from above the first face (601) (see FIG. 10) (e.g., when viewed in the -x axis direction). In some embodiments, the antenna element may be formed in a shape different from the third face (901) when viewed from above the first face (601).

[0129] According to some embodiments, although not illustrated, the dielectric structure may be formed in various other forms of stacked structures, not limited to the rectangular stacked structure shown in FIG. 12 or the elliptical stacked structure shown in FIG. 13.

[0130] According to one embodiment, the non-conductive portion (502) (see FIG. 9 and 10) may have a dielectric constant that does not substantially affect the radiation performance and / or coverage based on the antenna structure (61) and the plurality of dielectric structures (71, 72, 73, 74, 75). The non-conductive portion (502) may have a dielectric constant that does not affect the radiation performance and / or coverage based on the antenna structure (61) and the plurality of dielectric structures (71, 72, 73, 74, 75) to the extent that it does not exceed the range to be secured. In one embodiment, the non-conductive portion (502) may be substantially the same as any one of the first dielectric constant of the first dielectric (91), the second dielectric constant of the second dielectric (92), and the third dielectric constant of the third dielectric (93). In some embodiments, the non-conductive portion (502) may differ from the first permittivity of the first dielectric (91), the second permittivity of the second dielectric (92), and the third permittivity of the third dielectric (93).

[0131] According to some embodiments, the dielectric assembly or dielectric combination relating to an antenna structure (61) may be interpreted as including a non-conductive portion (502) and a plurality of dielectric structures (71, 72, 73, 74, 75). The dielectric assembly including the non-conductive portion (502) and the plurality of dielectric structures (71, 72, 73, 74, 75) may affect the antenna structure (61) and contribute to securing radiation performance or coverage (or beam coverage).

[0132] According to some embodiments, a dielectric located between the non-conductive portion (502) and the plurality of dielectric structures (71, 72, 73, 74, 75) may be further included. The dielectric may be, for example, a non-conductive member located between the non-conductive portion (502) and the plurality of dielectric structures (71, 72, 73, 74, 75). In some embodiments, the dielectric located between the non-conductive portion (502) and the plurality of dielectric structures (71, 72, 73, 74, 75) may be an air gap. The dielectric located between the non-conductive portion (502) and the plurality of dielectric structures (71, 72, 73, 74, 75) may have a dielectric constant that does not substantially affect the radiation performance and / or coverage based on the antenna structure (61) and the plurality of dielectric structures (71, 72, 73, 74, 75). In some embodiments, the dielectric assembly or dielectric combination relating to the antenna structure (61) may be interpreted to include the non-conductive portion (502), the plurality of dielectric structures (71, 72, 73, 74, 75), and the dielectric between the non-conductive portion (502) and the plurality of dielectric structures (71, 72, 73, 74, 75). In some embodiments, the non-conductive portion (502) may be formed integrally with one of the first dielectric (91), the second dielectric (92), and the third dielectric (93), and may include the same material.

[0133] According to one embodiment, a plurality of dielectric structures (71, 72, 73, 74, 75) may be positioned spaced apart from the antenna structure (61). For example, an air gap may be formed between the plurality of dielectric structures (71, 72, 73, 74, 75) and the antenna structure (61). The air gap between the plurality of dielectric structures (71, 72, 73, 74, 75) and the antenna structure (61) may contribute to preventing degradation of radiation performance based on the antenna structure (61) and the plurality of dielectric structures (71, 72, 73, 74, 75). An air gap between the plurality of dielectric structures (71, 72, 73, 74, 75) and the antenna structure (61) can contribute to preventing the coverage based on the antenna structure (61) and the plurality of dielectric structures (71, 72, 73, 74, 75) from being deformed (e.g., distorted). In some embodiments, a non-conductive material (or dielectric) may be positioned between the plurality of dielectric structures (71, 72, 73, 74, 75) and the antenna structure (61). The non-conductive material may have a dielectric constant that does not substantially affect the radiation performance and / or coverage based on the antenna structure (61) and the plurality of dielectric structures (71, 72, 73, 74, 75). In some embodiments, it may be interpreted as a dielectric assembly or dielectric combination including a non-conductive portion (502), a plurality of dielectric structures (71, 72, 73, 74, 75), and an air gap or non-conductive material between the plurality of dielectric structures (71, 72, 73, 74, 75) and the antenna structure (61).

[0134] According to one embodiment, the first dielectric (91), the second dielectric (92), and / or the third dielectric (93) may comprise a non-metallic material. According to some embodiments, any one of the first dielectric (91), the second dielectric (92), and the third dielectric (93) may comprise a non-metallic material, and the other may comprise a metallic material.

[0135] According to some embodiments, by modifying the illustrated example, a portion of the internal conductive structure (830) may be implemented to include a first opening (821), a second opening (822), a third opening (823), a fourth opening (824), and / or a fifth opening (825).

[0136] FIG. 14 illustrates a cross-sectional structure (1400) relating to another embodiment modified from the embodiment of FIG. 10.

[0137] Referring to FIG. 14, the fourth surface (902) of the fourth dielectric structure (74) may be deformed into a convex shape in the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the +x axis direction) compared to the embodiment of FIG. 10. For example, the fourth surface (902) may be a convex curved surface that is symmetric on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane), and is not limited to the circular stacked structure shown in FIG. 11. Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a shape substantially identical to the fourth dielectric structure (74). The non-conductive portion (502) may be modified to correspond to the fourth surface (902) of the first dielectric structure (71), the fourth surface (902) of the second dielectric structure (72), the fourth surface (902) of the third dielectric structure (73), the fourth surface (902) of the fourth dielectric structure (74), and the fourth surface (902) of the fifth dielectric structure (75) compared to the embodiment of FIG. 10.

[0138] FIG. 15 illustrates a cross-sectional structure (1500) relating to another embodiment that modifies the embodiment of FIG. 10.

[0139] Referring to FIG. 15, the fourth surface (902) of the fourth dielectric structure (74) may be deformed into a convex shape or a protruding step shape in the direction in which the first surface (601) of the antenna structure (61) faces (e.g., +x axis direction) compared to the embodiment of FIG. 10. For example, a portion of the fourth surface (902) included in the first dielectric (91) may be formed to a first height in the direction in which the first surface (601) faces the third surface (901) of the fourth dielectric structure (74). For example, a portion of the fourth surface (902) included in the second dielectric (92) may be formed to a second height smaller than the first height in the direction in which the first surface (601) faces the third surface (901) of the fourth dielectric structure (74). For example, some regions of the third dielectric (93) included in the fourth surface (902) may be formed with a third height smaller than the second height in the direction in which the first surface (601) faces the third surface (901) of the fourth dielectric structure (74). In one embodiment, the fourth surface (902) may be symmetrical on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, not limited to the circular stacked structure shown in FIG. 11, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane). Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a form substantially identical to the fourth dielectric structure (74).The non-conductive portion (502) can be modified into a shape corresponding to the fourth surface (902) of the first dielectric structure (71), the fourth surface (902) of the second dielectric structure (72), the fourth surface (902) of the third dielectric (73), the fourth surface (902) of the fourth dielectric (74), and the fourth surface (902) of the fifth dielectric (75), compared to the embodiment of FIG. 10.

[0140] FIG. 16 illustrates a cross-sectional structure (1600) relating to another embodiment that modifies the embodiment of FIG. 14.

[0141] Referring to FIG. 16, the third surface (901) of the fourth dielectric structure (74) may be deformed into a convex shape toward the first surface (601) of the antenna structure (61) (e.g., in the -x axis direction) compared to the embodiment of FIG. 14. In one embodiment, the third surface (901) may be a convex curved surface that is symmetric on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane), and is not limited to the circular stacked structure shown in FIG. 11. Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a form substantially identical to the fourth dielectric structure (74).

[0142] According to some embodiments, the third surface (901) according to the embodiment of FIG. 16 can be modified into the third surface (901) according to the embodiment of FIG. 15.

[0143] FIG. 17 illustrates a cross-sectional structure (1700) relating to another embodiment that modifies the embodiment of FIG. 15.

[0144] Referring to FIG. 17, the third surface (901) of the fourth dielectric structure (74) may be formed in a convex shape or a protruding step shape toward the first surface (601) of the antenna structure (61) (e.g., in the -x axis direction) compared to the embodiment of FIG. 15. In one embodiment, a portion of the third surface (901) included in the first dielectric (91) may be positioned protruding toward the first surface (601) with respect to a portion of the third surface (901) included in the second dielectric (92). For example, a portion of the third surface (901) included in the second dielectric (92) may be positioned protruding toward the first surface (601) with respect to a portion of the third dielectric (93) included in the third surface (901). In one embodiment, the third surface (901) may be symmetrical on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated example. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, not limited to the circular stacked structure illustrated in FIG. 11, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane). Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in substantially the same shape as the fourth dielectric structure (74).

[0145] According to some embodiments, the third surface (901) according to the embodiment of FIG. 17 can be modified into the third surface (901) according to the embodiment of FIG. 16.

[0146] According to some embodiments, the fourth surface (902) according to the embodiment of FIG. 17 can be modified into the fourth surface (902) according to the embodiment of FIG. 16.

[0147] FIG. 18 illustrates a cross-sectional structure (1800) relating to another embodiment that modifies the embodiment of FIG. 10.

[0148] Referring to FIG. 18, the third surface (901) of the fourth dielectric structure (74) may be deformed into a convex shape toward the first surface (601) of the antenna structure (61) (e.g., in the -x axis direction) compared to the embodiment of FIG. 10. In one embodiment, the third surface (901) may be a convex curved surface that is symmetric on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane), and is not limited to the circular stacked structure shown in FIG. 11. Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a form substantially identical to the fourth dielectric structure (74).

[0149] FIG. 19 illustrates a cross-sectional structure (1900) relating to another embodiment that modifies the embodiment of FIG. 10.

[0150] Referring to FIG. 19, the third surface (901) of the fourth dielectric structure (74) may be formed in a convex shape or a protruding step shape toward the first surface (601) of the antenna structure (61) (e.g., in the -x axis direction) compared to the embodiment of FIG. 10. For example, a portion of the third surface (901) included in the first dielectric (91) may be formed to a first height toward the first surface (601) with respect to the fourth surface (902) of the fourth dielectric structure (74). For example, a portion of the third surface (901) included in the second dielectric (92) may be formed to a second height smaller than the first height toward the first surface (601) with respect to the fourth surface (902) of the fourth dielectric structure (74). For example, some regions included in the third dielectric (93) of the third surface (901) may be formed with a third height smaller than the second height toward the first surface (601) with respect to the fourth surface (902) of the fourth dielectric structure (74). In one embodiment, the third surface (901) may be symmetrical on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, not limited to the circular stacked structure illustrated in FIG. 11, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane). Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a form substantially identical to the fourth dielectric structure (74).

[0151] FIG. 20 illustrates a cross-sectional structure (2000) relating to another embodiment modified from the embodiment of FIG. 14.

[0152] Referring to FIG. 20, the third surface (901) of the fourth dielectric structure (74) may be deformed into a convex shape in the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the +x axis direction) compared to the embodiment of FIG. 14. For example, the third surface (901) may be a convex curved surface that is symmetrical on both sides with respect to the central axis (E). In one embodiment, the third surface (901) and the fourth surface (902) of the fourth dielectric structure (74) may be substantially the same curved surface. In some embodiments, the third surface (901) may be formed into a curved surface of a different shape from the fourth surface (902), as indicated by the reference numeral '9111'. In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated example. In some embodiments, the fourth dielectric structure (74) is not limited to the circular stacked structure shown in FIG. 11 when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane), but may vary as shown in the example of FIG. 12 or FIG. 13. Although not shown, the first dielectric structure (71), the second dielectric structure (72), the third dielectric (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in substantially the same shape as the fourth dielectric structure (74).

[0153] FIG. 21 illustrates a cross-sectional structure (1700) relating to another embodiment that modifies the embodiment of FIG. 15.

[0154] Referring to FIG. 21, the third surface (901) of the fourth dielectric structure (74) may be formed in a convex shape or a protruding step shape in the direction in which the first surface (601) of the antenna structure (61) faces (e.g., +x axis direction) compared to the embodiment of FIG. 10. For example, a portion of the third dielectric (93) of the third surface (901) may be positioned protruding toward the first surface (601) (e.g., -x axis direction) with respect to a portion of the second dielectric (92) of the third surface (901). For example, a portion of the second dielectric (92) of the third surface (901) may be positioned protruding toward the first surface (601) with respect to a portion of the first dielectric (91) of the third surface (901). In one embodiment, the third surface (901) may be symmetrical on both sides with respect to the central axis (E). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74), when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane), may vary as shown in the example of FIG. 12 or FIG. 13, rather than being limited to the circular stacked structure illustrated in FIG. 11. Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in substantially the same shape as the fourth dielectric structure (74).

[0155] According to some embodiments, the third surface (901) according to the embodiment of FIG. 21 may be modified into the third surface (901) according to the embodiment of FIG. 20.

[0156] According to some embodiments, the fourth surface (902) according to the embodiment of FIG. 21 may be modified into the fourth surface (902) according to the embodiment of FIG. 20.

[0157] FIG. 22 illustrates a cross-sectional structure (2200) relating to another embodiment modified from the embodiment of FIG. 10.

[0158] Referring to FIG. 22, the fourth surface (902) of the fourth dielectric structure (74) may be modified to form part of the side (310C) (see FIG. 2) of the electronic device (300) compared to the embodiment of FIG. 10. In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) may vary as the example of FIG. 12 or FIG. 13, not limited to the circular stacked structure illustrated in FIG. 11, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane). Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in substantially the same shape as the fourth dielectric structure (74). Although not illustrated, the non-conductive portion (502) may be modified to include a plurality of openings in which a plurality of dielectric structures (71, 72, 73, 74, 75) are located, compared to the embodiment of FIG. 10. The side (310C) of the electronic device (300) may include, for example, a portion of the side conductive structure (810), a fourth surface of the plurality of dielectric structures (71, 72, 73, 74, 75), and a portion of the non-conductive portion (502). The fourth surface of the plurality of dielectric structures (71, 72, 73, 74, 75) may be smoothly connected to the portion of the non-conductive portion (502) of the side (310C) of the electronic device (300) without a substantial height difference.

[0159] According to some embodiments, the third surface (901) may be modified into the third surface (901) according to the embodiment of FIG. 18 or the third surface (901) according to the embodiment of FIG. 19.

[0160] According to some embodiments, the third surface (901) may be modified into the third surface (901) according to the embodiment of FIG. 20 or the third surface (901) according to the embodiment of FIG. 21.

[0161] FIG. 23 illustrates a cross-sectional structure (2300) relating to another embodiment modified from the embodiment of FIG. 22.

[0162] Referring to FIG. 23, the fourth surface (902) of the fourth dielectric structure (74) may be deformed into a convex shape in the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the +x axis direction), as in the embodiment of FIG. 15. Compared to the embodiment of FIG. 22, a portion of the fourth surface (902) of the fourth dielectric structure (74) that is included in the first dielectric (91) may be deformed to form part of the side (310C) (see FIG. 2) of the electronic device (300). In some embodiments, the second dielectric (92) or the third dielectric (93) may be deformed to form part of the side (310C) of the electronic device (300). In some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated examples. In some embodiments, the fourth dielectric structure (74) is not limited to the circular stacked structure shown in FIG. 11 when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane), but may vary as shown in the example of FIG. 12 or FIG. 13. Although not shown, the first dielectric structure (71), the second dielectric structure (72), the third dielectric (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in substantially the same shape as the fourth dielectric structure (74).

[0163] According to some embodiments, the third surface (901) may be modified into the third surface (901) according to the embodiment of FIG. 18 or the third surface (901) according to the embodiment of FIG. 19.

[0164] According to some embodiments, the third surface (901) may be modified into the third surface (901) according to the embodiment of FIG. 20 or the third surface (901) according to the embodiment of FIG. 21.

[0165] FIG. 24 illustrates a cross-sectional structure (2400) relating to another embodiment that modifies the embodiment of FIG. 10.

[0166] Referring to FIG. 24, the fourth dielectric structure (74) may be modified such that, compared to the embodiment of FIG. 10, its width increases in the direction perpendicular to the direction in which the first surface (601) faces (e.g., the +x axis direction) in proportion to the distance from the first surface (601) of the antenna structure (61). For example, the fourth surface (902) of the fourth dielectric structure (74) may be a similar shape that is larger than the third surface (901) of the fourth dielectric structure (74). For example, the outer side surface (1103) of the third dielectric (93) may form an obtuse angle with the third surface (901) and an acute angle with the fourth surface (92). In one embodiment, the fourth dielectric structure (74) may be symmetrical on both sides with respect to the central axis (E).

[0167] According to one embodiment, a first boundary (1101) between the first dielectric (91) and the second dielectric (92), and a second boundary (1102) between the second dielectric (92) and / or the third dielectric (93) may be substantially parallel to the outer side surface (1103) of the third dielectric (93). In some embodiments, the first boundary (1101) or the second boundary (1102) may not be parallel to the outer side surface (1103).

[0168] According to one embodiment, the first boundary (1101) and the second boundary (1102) may form an acute angle equal to the center axis (E).

[0169] According to some embodiments, the embodiment of FIG. 24 may be modified such that the first boundary (1101) forms a first angle with the central axis (E), and the second boundary (1102) forms a second angle with the central axis (E) that is different from the first angle.

[0170] According to some embodiments, the embodiment of FIG. 24 may be modified so that one of the first boundary (1101) and the second boundary (1102) is substantially parallel to the central axis (E) and the other is not parallel to the central axis (E).

[0171] According to some embodiments, the embodiment of FIG. 24 may be modified so that the outer side surface (1103) of the first boundary (1101), the second boundary (1102), or the third dielectric (93) includes a curved surface that increases in width in a direction perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the +x axis direction) in proportion to the distance from the first surface (601).

[0172] According to some embodiments, the embodiment of FIG. 24 may be modified so that the first boundary (1101) includes a first region substantially parallel to the central axis (E) and a second region not parallel to the central axis (E) when viewed as a cross-section corresponding to the central axis (E), as indicated by the reference numeral '1104'. The first region may connect the third surface (901) and the second region, and the second region may connect the first region and the fourth surface (902). The second region may be in a form that increases in width in a direction perpendicular to the direction in which the first surface (601) faces, in proportion to the distance from the first surface (601) of the antenna structure (61). In some embodiments, the second region may be implemented to include a curved surface that increases in width in a direction perpendicular to the direction in which the first surface (601) faces, in proportion to the distance from the first surface (601) of the antenna structure (61). In some embodiments, when viewed in a cross-section corresponding to the central axis (E), the first region may not be parallel to the central axis (E), and the second region may be implemented substantially parallel to the central axis (E). In some embodiments, when viewed in a cross-section corresponding to the central axis (E), the first region and the second region may not be parallel to the central axis (E), and the first angle formed by the first region with the central axis (E) and the second angle formed by the second region with the central axis (E) may be implemented differently. In some embodiments, the second boundary (1102), or the outer side surface (1103) of the third dielectric (93), may be deformed in substantially the same way as the first boundary (1101).

[0173] According to some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated example. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, not limited to the circular stacked structure illustrated in FIG. 11, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane).

[0174] Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a form substantially identical to the fourth dielectric structure (74).

[0175] FIG. 25 illustrates a cross-sectional structure (2500) relating to another embodiment modified from the embodiment of FIG. 10.

[0176] Referring to FIG. 25, the fourth dielectric structure (74) may be modified such that its width decreases in the direction perpendicular to the direction in which the first surface (601) faces, in proportion to the distance from the first surface (601) of the antenna structure (61) compared to the embodiment of FIG. 10. For example, the fourth surface (902) of the fourth dielectric structure (74) may be a similar shape that is smaller in size than the third surface (901) of the fourth dielectric structure (74). For example, the outer side surface (1103) of the third dielectric (93) may form an acute angle with respect to the third surface (901) and an obtuse angle with respect to the fourth surface (92). In one embodiment, the fourth dielectric structure (74) may be symmetrical on both sides with respect to the central axis (E).

[0177] According to one embodiment, the first boundary (1101) between the first dielectric (91) and the second dielectric (92), and the second boundary (1102) between the second dielectric (92) and / or the third dielectric (93) may be substantially parallel to the outer side surface (1103) of the third dielectric (93). In some embodiments, the embodiment of FIG. 25 may be modified so that the first boundary (1101) or the second boundary (1102) is not parallel to the outer side surface (1103).

[0178] According to one embodiment, when viewed as a cross-section corresponding to the central axis (E), the first boundary (1101) and the second boundary (1102) may form an acute angle equal to the central axis (E).

[0179] According to some embodiments, the embodiment of FIG. 25 may be modified such that, when viewed as a cross-section corresponding to the central axis (E), the first boundary (1101) forms a first angle with the central axis (E), and the second boundary (1102) forms a second angle with the central axis (E) that is different from the first angle.

[0180] According to some embodiments, the embodiment of FIG. 25 may be modified such that, when viewed as a cross-section corresponding to the central axis (E), one of the first boundary (1101) and the second boundary (1102) may be substantially parallel to the central axis (E), and the other is not parallel to the central axis (E).

[0181] According to some embodiments, the embodiment of FIG. 25 may be modified so that the outer side surface (1103) of the first boundary (1101), the second boundary (1102), or the third dielectric (93) includes a curved surface that decreases in width in a direction perpendicular to the direction in which the first surface (601) faces, in proportion to the distance from the first surface (601) of the antenna structure (61).

[0182] According to some embodiments, the embodiment of FIG. 25 may be modified so that the first boundary (1101) includes a first region substantially parallel to the central axis (E) and a second region not parallel to the central axis (E) when viewed as a cross-section corresponding to the central axis (E), as indicated by the reference numeral '1105'. The first region may connect the fourth surface (902) and the second region, and the second region may connect the first region and the third surface (901). The second region may be in a shape in which the width decreases in the direction perpendicular to the direction in which the first surface (601) faces, in proportion to the distance from the first surface (601) of the antenna structure (61). In some embodiments, the second region may be implemented to include a curved surface that decreases in width with respect to the direction perpendicular to the direction in which the first surface (601) faces in proportion to the distance from the first surface (601) of the antenna structure (61). In some embodiments, when viewed in a cross-section corresponding to the central axis (E), the first region may not be parallel to the central axis (E), and the second region may be implemented substantially parallel to the central axis (E). In some embodiments, when viewed in a cross-section corresponding to the central axis (E), the first region and the second region may not be parallel to the central axis (E), and the first angle formed by the first region with the central axis (E) and the second angle formed by the second region with the central axis (E) may be implemented differently. In some embodiments, the second boundary (1102), or the outer side surface (1103) of the third dielectric (93), may be deformed in substantially the same way as the first boundary (1101).

[0183] According to some embodiments, the number of dielectrics included in the fourth dielectric structure (74) may vary and is not limited to the illustrated example. In some embodiments, the fourth dielectric structure (74) may vary as shown in the example of FIG. 12 or FIG. 13, not limited to the circular stacked structure illustrated in FIG. 11, when viewed as a cross-section of a plane perpendicular to the direction in which the first surface (601) of the antenna structure (61) faces (e.g., the yz plane).

[0184] Although not illustrated, the first dielectric structure (71), the second dielectric structure (72), the third dielectric structure (73), or the fifth dielectric structure (75) of FIG. 8 may be formed in a form substantially identical to the fourth dielectric structure (74).

[0185] FIG. 26 illustrates a radiation pattern for an electronic device (300) comprising a plurality of dielectric structures (71, 72, 73, 74, 75) according to one embodiment, and a radiation pattern for an electronic device according to a comparative example comprising a single dielectric. FIG. 27 illustrates a radiation pattern for an electronic device (300) comprising a plurality of dielectric structures (71, 72, 73, 74, 75) according to one embodiment, and a radiation pattern for an electronic device according to a comparative example comprising a single dielectric.

[0186] The electronic device of the comparative example includes a single dielectric instead of a plurality of dielectric structures (71, 72, 73, 74, 75) compared to the electronic device (300) according to one embodiment, and is presented only to facilitate the explanation of the embodiment of this document and to aid in understanding the embodiment, and for comparison with one embodiment of this document, and does not have prior status with respect to the various embodiments of this document. In one embodiment, the antenna module (6) (see FIG. 6) can transmit or receive at least one signal through a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) using dual feeding. Dual feeding may refer to a method in which, for example, a communication circuit (62) (see FIG. 6) feeds vertical polarization and horizontal polarization to a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) to transmit and / or receive a signal (or radio wave) through the plurality of antenna elements (612a, 612b, 612c, 612d, 612e).

[0187] Referring to FIG. 26, reference numeral '2601' indicates a radiation pattern for an electronic device (300) according to one embodiment when vertical polarization is fed. Reference numeral '2602' indicates a radiation pattern for an electronic device according to a comparative example when vertical polarization is fed. Referring to FIG. 27, reference numeral '2701' indicates a radiation pattern for an electronic device (300) according to one embodiment when horizontal polarization is fed. Reference numeral '2702' indicates a radiation pattern for an electronic device according to a comparative example when horizontal polarization is fed.

[0188] Referring to FIGS. 26 and 27, an electronic device (300) according to one embodiment can form a main beam (e.g., a beam in which energy is relatively more radiated in the maximum radiation direction (boresight) among beam patterns) with improved radio wave transmission and reception performance in a desired direction (e.g., about 60 degrees to about 120 degrees with respect to the direction in which the first surface (601) of the antenna structure (61) faces) compared to an electronic device according to a comparative example.

[0189] Table 1 shows the difference between the performance evaluation using a cumulative distribution function (CDF) for an electronic device (300) according to one embodiment and the performance evaluation using a CDF for an electronic device according to a comparison example, when vertical polarization is fed and when horizontal polarization is fed.

[0190] Operating frequency [GHz] 24.25 28 38.5 Antenna Gain (CDF) 50% Peak 50% Peak 50% Peak V-polarization feed 1.1 1.0 0.8 2.3 1.1 0.8 H-polarization feed 3.1 0.2 2.5 0.1 -0.2 0.1

[0191] Referring to Table 1, the electronic device (200) according to one embodiment can have its CDF 50% performance improved by up to about 3.1dB compared to the electronic device according to the comparative example.

[0192] According to one embodiment of the present document, an electronic device (e.g., the electronic device (300) of FIG. 3) may include a housing (e.g., the housing (310) of FIG. 3) that forms the exterior of the electronic device. The housing may include a conductive portion (e.g., the side conductive structure (810) of FIG. 9 or 10) and a non-conductive portion (e.g., the non-conductive portion (502) of FIG. 9 or 10) connected to the conductive portion. The electronic device may include an antenna structure (e.g., the antenna structure (61) of FIG. 9 or 10) located in the interior space of the housing. The antenna structure may include a printed circuit board (e.g., a printed circuit board of FIG. 6 (611)) comprising a first surface facing the non-conductive portion (e.g., a first surface (601) of FIG. 9 or 10) and a second surface facing in the opposite direction to the first surface (e.g., a second surface (602) of FIG. 10). The antenna structure may include at least one antenna element (e.g., a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) of FIG. 6) located on the first surface or located inside the printed circuit board closer to the first surface than to the second surface. The at least one antenna element may form a beam facing the non-conductive portion. The electronic device may include a dielectric structure (e.g., a plurality of dielectric structures (71, 72, 73, 74, 75) of FIG. 8) positioned facing the at least one element corresponding to the non-conductive portion. The dielectric structure may include a first dielectric with a first permittivity (e.g., the first dielectric (91) of FIG. 9 or 10) when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces.The structure of the above dielectric may include a second dielectric (e.g., the second dielectric (92) of FIG. 9 or 10) surrounding the first dielectric and having a second dielectric constant different from the first dielectric constant when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces.

[0193] According to one embodiment of the present document, the first permittivity may be greater than the second permittivity.

[0194] According to some embodiments of this document, the first permittivity may be smaller than the second permittivity.

[0195] According to one embodiment of the present document, the dielectric structure may further include a third dielectric (e.g., the third dielectric (93) of FIG. 9 or 10) surrounding the second dielectric (e.g., the second dielectric (92) of FIG. 9 or 10) when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces. The third dielectric may have a third dielectric that is different from the first dielectric or the second dielectric.

[0196] According to one embodiment of the present document, the first permittivity may be greater than the second permittivity, and the second permittivity may be greater than the third permittivity.

[0197] According to one embodiment of the present document, the dielectric structure may be in a shape in which the width increases in proportion to the distance from the first plane in the direction perpendicular to the direction in which the first plane faces (see embodiment of FIG. 24).

[0198] According to some embodiments of the present document, the dielectric structure may be in a form in which the width decreases with respect to the direction perpendicular to the direction in which the first plane faces in proportion to the distance from the first plane (see embodiment of FIG. 25).

[0199] According to one embodiment of the present document, one of the first dielectric and the second dielectric may include a metallic material, and the other may include a non-metallic material.

[0200] According to one embodiment of the present document, a portion of the dielectric structure may be positioned in an opening formed in the non-conductive portion to form a portion of the exterior of the electronic device (see embodiment of FIG. 22 or embodiment of FIG. 23).

[0201] According to one embodiment of the present document, the dielectric structure may include a third surface (e.g., the third surface (901) of FIG. 10) facing the first surface (e.g., the first surface (601) of FIG. 10), and a fourth surface (e.g., the fourth surface (902) of FIG. 10) facing in the opposite direction to the third surface. The third surface may include a portion of the first dielectric (e.g., the first dielectric (91) of FIG. 10) and a portion of the second dielectric (e.g., the second dielectric (92) of FIG. 10). The fourth surface may include a portion of the first dielectric and a portion of the second dielectric.

[0202] According to one embodiment of the present document, the third surface (e.g., the third surface (901) of FIG. 10) may be a plane parallel to the first surface (e.g., the first surface (601) of FIG. 10).

[0203] According to one embodiment of the present document, the fourth surface (e.g., the fourth surface (902) of FIG. 10) may be a plane parallel to the first surface (e.g., the first surface (601) of FIG. 10).

[0204] According to one embodiment of the present document, a portion of the first dielectric (e.g., the first dielectric (91) of FIG. 16, 17, 18, or 19) among the third surfaces (e.g., the third surface (901) of FIG. 16, 17, 18, or 19) may protrude toward the first surface (e.g., the first surface (601) of FIG. 16, 17, 18, or 19) with respect to a portion of the second dielectric (e.g., the second dielectric (92) of FIG. 16, 17, 18, or 19) among the third surfaces.

[0205] According to one embodiment of the present document, among the fourth surfaces (e.g., the fourth surface (902) of FIG. 14, 15, 16, 17, 20, 21, 22, or 23), a portion of the first dielectric (e.g., the first dielectric (91) of FIG. 14, 15, 16, 17, 20, 21, 22, or 23) may protrude in the direction toward which the first surface (e.g., the first surface (601) of FIG. 14, 15, 16, 17, 20, 21, 22, or 23) faces, with respect to a portion of the second dielectric (e.g., the second dielectric (92) of FIG. 14, 15, 16, 17, 20, 21, 22, or 23) of FIG. 14, 15, 16, 17, 20, 21, 22, or 23) faces.

[0206] According to one embodiment of the present document, the fourth surface (e.g., the fourth surface (902) of FIG. 14, 16, 20, or 22) may be a curved surface that is convex in the direction in which the first surface (e.g., the first surface (601) of FIG. 14, 16, 20, or 22) faces.

[0207] According to one embodiment of the present document, the third surface (e.g., the third surface (901) of FIG. 16 or 18) may be a curved surface that is convex toward the first surface (e.g., the first surface (601) of FIG. 16 or 18).

[0208] According to one embodiment of the present document, the third surface (e.g., the third surface (901) of FIG. 11) and the fourth surface (e.g., the fourth surface (902) of FIG. 11) may be planes parallel to the first surface (e.g., the first surface (601) of FIG. 10). The third surface and the fourth surface may be identical shapes that coincide with each other when viewed toward the first surface.

[0209] According to one embodiment of the present document, the third surface and the fourth surface may be planes parallel to the first surface. The third surface and the fourth surface may be similar shapes of different sizes.

[0210] According to one embodiment of the present document, the electronic device may further include a display (e.g., display (401) of FIG. 5) located in the internal space of the housing. The housing may include a front plate (e.g., front plate (301) of FIG. 5), a rear plate (e.g., rear plate (302) of FIG. 5), and a side member (e.g., side member (303) of FIG. 5) located between the front plate and the rear plate and including the conductive portion (e.g., side conductive structure (810) of FIG. 10) and the non-conductive portion (e.g., non-conductive portion (502) of FIG. 10). The display may be visible through the front plate.

[0211] According to one embodiment of the present document, the electronic device may further include a communication circuit (e.g., communication circuit of FIG. 7 (62)) disposed on the second surface (e.g., second surface (602) of FIG. 7). The communication circuit may be configured to transmit or receive a signal through the at least one antenna element (e.g., a plurality of antenna elements (612a, 612b, 612c, 612d, 612e) of FIG. 6) using dual feeding including vertical polarization feeding and horizontal polarization feeding.

[0212] The embodiments disclosed in this document and drawings are provided merely as specific examples to facilitate the explanation of the technical content and to aid in understanding the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of the various embodiments of this document should be interpreted to include modified or altered forms in addition to the embodiments disclosed herein. Explanation of the symbols

[0214] 1000: Cross-sectional structure 301: Front plate 302: Rear plate 810: Side Challenge Structure 811: Opening 502: Non-conductive parts 820: Internal non-conductive structure 830: Internal Challenge Structure 401: Display 541: First printed circuit board 6: Antenna Module 61: Antenna structure 62: Communication circuit 601: Page 1 602: Page 2 74: The 4th genome structure 91: Genome 1 92: The Second Genome 93: The Third Genome 901: Page 3 902: Page 4

Claims

Claim 1 An electronic device comprises: a housing forming the exterior of the electronic device and including a conductive portion and a non-conductive portion connected to the conductive portion; an antenna structure located in the internal space of the housing, comprising a printed circuit board including a first surface facing the non-conductive portion and a second surface facing in a direction opposite to the first surface; and an antenna structure comprising at least one antenna element located on the first surface or located inside the printed circuit board closer to the first surface than the second surface, and configured to form at least one beam facing the non-conductive portion. An electronic device comprising a dielectric structure positioned facing at least one element, the dielectric structure comprising, when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces, a first dielectric having a first dielectric constant and a second dielectric surrounding the first dielectric having a second dielectric having a second dielectric constant different from the first dielectric constant, wherein at least a portion of the dielectric structure is positioned in an opening formed in the non-conductive portion, and the dielectric structure comprises a third surface facing the first surface and a fourth surface located opposite the third surface, wherein the third surface comprises a portion of the first dielectric and a portion of the second dielectric, and the fourth surface comprises a portion of the first dielectric and a portion of the second dielectric. Claim 2 An electronic device according to claim 1, wherein the dielectric structure further comprises a third dielectric surrounding the second dielectric when viewed in a cross-section of a plane perpendicular to the direction in which the first surface faces, and the third dielectric having a third dielectric different from the first dielectric or the second dielectric. Claim 3 An electronic device according to claim 1, wherein the dielectric structure is in a form in which the width increases or decreases with respect to a direction perpendicular to the direction in which the first surface faces, in proportion to the distance from the first surface. Claim 4 An electronic device according to claim 1, wherein one of the first dielectric and the second dielectric comprises a metallic material and the other comprises a non-metallic material. Claim 5 delete Claim 6 An electronic device according to claim 1, wherein at least one of the third surface and the fourth surface is a plane parallel to the first surface. Claim 7 An electronic device according to claim 1, wherein a portion of the first dielectric included in the third surface protrudes toward the first surface with respect to a portion of the second dielectric included in the third surface, or a portion of the first dielectric included in the fourth surface protrudes in the direction toward the first surface with respect to a portion of the second dielectric included in the fourth surface. Claim 8 An electronic device according to claim 1, wherein the third surface is a curved surface convex toward the first surface, or the fourth surface is a curved surface convex toward the direction in which the first surface faces. Claim 9 An electronic device according to claim 1, wherein the third surface and the fourth surface are planes parallel to the first surface, and the third surface and the fourth surface are identical shapes that coincide with each other or similar shapes of different sizes when viewed toward the first surface. Claim 10 An electronic device according to claim 1, further comprising a communication circuit disposed on the second surface, wherein the communication circuit is configured to transmit or receive a signal through the at least one antenna element using dual feeding including vertical polarization feeding and horizontal polarization feeding. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

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