Wafer processing apparatus

Abstract

An embodiment of the present invention provides a wafer processing device, wherein the wafer processing device comprises a table unit having a plurality of adsorption pads spaced apart from each other and a table body to which the adsorption pads are fastened, on which a mold wafer having a plurality of chip devices and a mold resin supporting the chip devices is seated, and a cutting unit for cutting the mold resin located in an area between the plurality of chip devices, wherein the area between the adsorption pads and the mold wafer and the table unit may be spaced apart from each other when viewed from one direction in which the mold wafer and the table unit are stacked.

Description

Technology Field

[0001] Embodiments of the present invention relate to a wafer processing apparatus. Background Technology

[0002] Generally, a wafer is a substrate on which semiconductor elements or chip devices are formed or mounted, and it constitutes the basic unit of electronic components through various manufacturing processes.

[0003] Among these, a mold wafer is a wafer in which multiple chip devices are mounted or embedded on a mold resin layer, and the mold resin plays a role in mechanically supporting the chip devices to enable subsequent packaging processes.

[0004] After a chip device is formed or mounted on a mold resin, a singulation process is required to separate each chip device into individual packages.

[0005] Typically, a singulation process refers to a process of separating a wafer into multiple individual chips by using a cutting device to cut or dic along a predetermined cutting line on the wafer.

[0006] To perform this singulation process, the wafer is fixed on a supporting table, and a cutting mechanism moves along the boundary of the chip device to perform the cutting operation.

[0007] However, cutting forces or vibrations generated during cutting may cause the wafer to slightly detach or displace from the table, which raises concerns about reduced cutting precision or chip damage; therefore, there is a need for the development of technology regarding a table structure capable of stably supporting the wafer during cutting.

[0008] In addition, as the cutting line of singulation is set differently depending on the shape of the chip and / or the chip array structure, there is an increasing need for support table technology that can efficiently fix and handle various types of wafers.

[0009] The aforementioned background technology is technical information that the inventor possessed for the derivation of the present invention or acquired during the process of deriving the present invention, and it cannot be considered as prior art disclosed to the general public prior to the filing of the present invention. The problem to be solved

[0010] Embodiments of the present invention can provide a wafer processing device that firmly supports the wafer during the wafer cutting process.

[0011] The problems that the present invention aims to solve are not limited to those mentioned above, and other problems and advantages of the present invention not mentioned can be understood from the following description and will be more clearly understood by the embodiments of the present invention. Furthermore, it will be understood that the problems and advantages that the present invention aims to solve can be realized by the means and combinations thereof set forth in the claims. means of solving the problem

[0012] One embodiment of the present invention provides a wafer processing apparatus comprising: a table unit having a table body on which a mold wafer, comprising a plurality of chip devices and a mold resin supporting the chip devices, is seated, and which has a plurality of adsorption pads spaced apart from each other and to which the adsorption pads are connected; and a cutting unit for cutting the mold resin located in an area between the plurality of chip devices, wherein when viewed from one direction in which the mold wafer and the table unit are stacked, the area between the mold wafer and the adsorption pads are spaced apart from each other.

[0013] In this embodiment, on one surface of the table body facing the mold wafer, a cutting groove may be located that is concave inward and extends along a preset path, into which one side of the cutting unit is inserted.

[0014] In this embodiment, the cutting unit can move along the path where the cutting groove is extended.

[0015] In the present embodiment, when viewed from one direction, the path along which the cutting groove extends may overlap with the intermediate area.

[0016] In this embodiment, on one surface of the table body, a vacuum channel may be provided that extends along a preset path, is inwardly concave, is spaced apart from the cutting groove, and provides a fluid discharge path located between the mold wafer and the table body.

[0017] In this embodiment, the width of the vacuum channel may be relatively smaller than the width of the cutting groove.

[0018] In this embodiment, the depth of the vacuum channel may be relatively shallower than the width of the cutting groove.

[0019] In this embodiment, a pressure regulating unit for regulating the pressure in the space between the mold wafer and the table unit may be further included.

[0020] In this embodiment, the pressure regulating unit is,

[0021] A first exhaust unit communicating with the adsorption pad and regulating the pressure in the space between the adsorption pad and the mold wafer; and

[0022] It may include a second exhaust unit that communicates with the vacuum channel and regulates the internal pressure of the vacuum channel.

[0023] In this embodiment, the first exhaust unit and the second exhaust unit can be driven independently to sequentially adjust the pressure in the space between the adsorption pad and the mold wafer and the internal pressure of the vacuum channel.

[0024] In this embodiment, the adsorption pad can be detachably coupled to the table body.

[0025] In the present embodiment, a plurality of fastening holes into which one side of the suction pad is inserted are formed in the table body, a screw thread is formed on the outer surface of one side of the suction pad, and a screw groove may be formed on the inner surface of the fastening hole.

[0026] In the present embodiment, when viewed from one direction, the plurality of fastening hole portions and the adsorption pads that overlap with the intermediate area may be spaced apart from each other.

[0027] In this embodiment, the cutting unit can move along an area where a plurality of the fastening holes are spaced apart from the adsorption pad.

[0028] In the present embodiment, when viewed from one direction, at least one of the adsorption pads may be disposed in an inner region of the chip device. Effects of the invention

[0029] The wafer processing device according to the embodiments of the present invention has the effect of firmly supporting the wafer and securing a movement path for the cutting unit by providing an adsorption pad spaced apart from the area between a plurality of chip devices.

[0030] However, the effects obtainable through the present invention are not limited to those described above, and other unmentioned technical effects will be clearly understood by those skilled in the art from the description of the invention below. Brief explanation of the drawing

[0031] The following drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further enhance understanding of the technical concept of the present invention together with the detailed description of the invention provided below; therefore, the present invention should not be interpreted as being limited only to the matters described in such drawings. FIG. 1 is a schematic diagram illustrating a wafer processing apparatus according to one embodiment of the present invention. Figure 2 is a top view of the mold wafer shown in Figure 1. FIG. 3 is a perspective view of a table unit according to one embodiment of the present invention. Figure 4 is a side cross-sectional view of the table unit shown in Figure 3. Figure 5 is a diagram illustrating the state in which a mold wafer is adsorbed to an adsorption pad in the table unit shown in Figure 4. FIG. 6 is a diagram illustrating the state in which a pressure is applied to a mold wafer in the table unit shown in FIG. 5. Figure 7 is a diagram illustrating the state in which a mold wafer adsorbed to the table unit in Figure 6 is cut. FIG. 8 is a perspective view of a table unit according to another embodiment of the present invention. FIG. 9 is an exploded perspective view of the table unit shown in FIG. 8. FIG. 10 is a drawing for explaining the first usage state of the table unit illustrated in FIG. 8. FIG. 11 is a drawing for explaining the second usage state of the table unit illustrated in FIG. 8. FIG. 12 is a drawing for explaining the first cutting line of the first chip device and the second cutting line of the second chip device. FIG. 13 is a drawing for explaining how to cut the second cutting line of FIG. 12. Specific details for implementing the invention

[0032] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0033] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0034] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0035] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0036] In the following embodiments, when a part such as a unit, area, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another unit, area, or component is interposed in between.

[0037] In the following embodiments, terms such as "connect" or "combine" do not necessarily imply a direct and / or fixed connection or combination of two members unless the context clearly indicates otherwise, nor do they exclude the interposition of another member between the two members.

[0038] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and / or thickness of each component shown in the drawings are arbitrarily depicted for convenience of explanation, and therefore the present invention is not necessarily limited to what is illustrated.

[0039] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0040] FIG. 1 is a schematic diagram illustrating a wafer processing apparatus (1) according to one embodiment of the present invention.

[0041] Referring to FIG. 1, a wafer processing device (1) according to one embodiment of the present invention may include a table unit (100), a cutting unit (200), a pressure control unit (300), and a pressurizing unit (400) (see FIG. 6).

[0042] A wafer processing device (1) can perform a singulation process of a mold wafer (MW). For example, a table unit (100) of the wafer processing device (1) can fix the mold wafer (MW) by means such as vacuum suction, and a cutting unit (200) can perform a singulation process of separating each chip device (CD) individually by cutting the mold resin (MR) along the boundary of the chip device (CD) on the mold wafer (MW).

[0043] The cutting unit (200) can cut the mold resin (MR) located in the area (AB) between the plurality of chip devices (CD).

[0044] In one embodiment, the cutting unit (200) may include a cutting mechanism for cutting the mold resin (MR) and / or a grinding mechanism for grinding / polishing the cut surface of the mold resin (MR).

[0045] The cutting unit (200) may be a contact-type cutting mechanism that cuts the mold resin (MR) while in contact with the mold resin (MR). However, it is not limited thereto, and the cutting unit (200) may be a non-contact-type cutting mechanism, such as a laser, that cuts the mold resin (MR) without contacting the mold resin (MR).

[0046] In one embodiment, the cutting unit (200) may be made of a cemented carbide or diamond material.

[0047] In one embodiment, the cutting unit (200) may be cylindrical and may have a diamond coating portion located on its outer surface.

[0048] In one embodiment, a plurality of spiral grooves intersecting at a preset angle may be formed on the outer surface of the cutting unit (200), and the plurality of spiral grooves may form a rhombic lattice.

[0049] The spacing between multiple spiral grooves may be constant. However, this is not limited to this, and the spacing between multiple spiral grooves may differ from one another.

[0050] The sizes of the multiple rhombuses formed by the multiple spiral grooves may be identical, but are not limited thereto, and the sizes of the multiple rhombuses may be different.

[0051] In one embodiment, the outer diameter of one side of the cutting unit (200) in contact with the mold wafer (MW) may be 2 mm or more and 5 mm or less.

[0052] Figure 2 is a top view of the mold wafer (MW) shown in Figure 1.

[0053] Referring to FIG. 2, the mold wafer (MW) may include at least one chip device (CD) and a mold resin (MR) that supports the chip device (CD).

[0054] A chip device (CD) is a device with a circuit pattern formed thereon, such as a semiconductor chip, memory device, sensor, or integrated circuit (IC), and can perform electrical functions.

[0055] The mold resin (MR) can be made of an epoxy-based or silicone-based resin and can protect the chip device (CD) from external shocks or moisture, and support the chip device (CD) to maintain it in a wafer shape.

[0056] Referring to FIG. 2, in this specification, one region of mold resin (MR) located between a plurality of chip devices (CD) is referred to as the ‘intermediate region (AB)’.

[0057] Additionally, the ‘cutting line (CL)’ is defined as the boundary line of the chip device (CD) that the cutting unit (200) cuts for the singulation process of the mold wafer (MW).

[0058] The cutting unit (200) can move along the cutting line (CL) and thereby separate the chip device (CD) from the mold resin (MR).

[0059] FIG. 3 is a perspective view of a table unit (100) according to one embodiment of the present invention, and FIG. 4 is a side cross-sectional view of the table unit (100) shown in FIG. 3.

[0060] Referring to FIGS. 3 and 4, a table unit (100) according to one embodiment of the present invention may include an adsorption pad (110) and a table body (120).

[0061] The adsorption pad (110) can come into contact with one side of the mold wafer (MW), and the mold wafer (MW) can be vacuum adsorbed to the adsorption pad (110).

[0062] Referring to FIG. 4, the first exhaust unit (310) of the pressure control unit (300) is connected to the adsorption pad (110) and can exhaust the fluid located between the adsorption pad (110) and the mold wafer (MW). Through this, the first exhaust unit (310) can form a space between the adsorption pad (110) and the mold wafer (MW) at low pressure or a vacuum, thereby fixing the mold wafer (MW) to the adsorption pad (110).

[0063] A plurality of suction pads (110) are provided, and the plurality of suction pads (110) can be spaced apart at equal intervals on the table body (120).

[0064] Through this, multiple adsorption pads (110) can apply a uniform adsorption force to the mold wafer (MW).

[0065] Referring to FIG. 4, the suction pad (110) can be attached to the table body (120). For example, one side of the suction pad (110) can be inserted into the inside of the table body (120).

[0066] The other side opposite to one side of the adsorption pad (110) inserted into the table body (120) may protrude from one side of the table body (120) facing the mold wafer (MW).

[0067] Specifically, one end of the adsorption pad (110) in contact with the mold wafer (MW) can protrude to the outside of the table body (120).

[0068] As a result, the mold wafer (MW) comes into contact with the adsorption pad (110) first before coming into contact with the table body (120), so that the adsorption pad (110) can provide vacuum pressure to the mold wafer (MW) first.

[0069] In this specification, 'first direction' is defined as the direction in which the mold wafer (MW) and the table unit (100) are stacked.

[0070] For example, the 'first direction' may be the up and down direction based on Fig. 4.

[0071] The length of the first direction of the adsorption pad (110) can be variable.

[0072] For example, when a first directional pressure is applied to a mold wafer (MW) adsorbed on the adsorption pad (110), the first directional length of the adsorption pad (110) may be reduced, thereby allowing the mold wafer (MW) adsorbed on the adsorption pad (110) to come into contact with one side of the table body (120).

[0073] The height at which one end of the adsorption pad (110) in contact with the mold wafer (MW) protrudes from one side of the table body (120) may be equal to or relatively smaller than the maximum value of the first direction length change amount of the adsorption pad (110).

[0074] As a result, when the suction pad (110) is reduced in length in the first direction by receiving force from the outside, the suction surface of the suction pad (110) can descend parallel to one side of the table body (120) facing the mold wafer (MW), and through this, the vacuum channel (122) described later can provide a second vacuum pressure to the mold wafer (MW).

[0075] When viewed from the first direction, the adsorption pad (110) can be placed only in the area spaced apart from the inter-region (AB).

[0076] As a result, the adsorption pad (110) and the intermediate area (AB) that overlaps with the movement path of the cutting unit (200) are separated, thereby preventing collision between the cutting unit (200) and the adsorption pad (110) while the cutting unit (200) is cutting the mold wafer (MW).

[0077] In one embodiment, the adsorption pad (110) may be made of an elastic material capable of changing length, and the adsorption pad (110) may be made in the shape of a bellows.

[0078] Referring to FIGS. 3 and 4, a table body (120) according to one embodiment of the present invention supports an adsorption pad (110), and a cutting groove (121) and / or a vacuum channel (122) may be formed in the table body (120).

[0079] In this specification, one side of the table body (120) facing the mold wafer (MW) is referred to as the ‘adsorption surface of the table body (120).’

[0080] A cutting groove (121) with an inwardly concave shape that extends along a preset path may be located on the suction surface of the table body (120).

[0081] When viewed from the first direction, the cutting groove (121) may overlap with the intermediate area (AB).

[0082] The cutting groove (121) can be extended along the cutting line (CL).

[0083] In one embodiment, the preset path may be a shape that extends along the perimeter of a plurality of rectangles.

[0084] For example, the above-mentioned preset path may be a perimeter line of five squares connected in a '+' shape.

[0085] One side of the cutting unit (200) can be inserted into the cutting groove (121).

[0086] Specifically, one side of the cutting unit (200) can be positioned inside the cutting groove (121) by penetrating the mold resin (MR).

[0087] As a result, a cutting groove (121) having an inward depth is positioned on the adsorption surface of the table body (120) corresponding to the cutting line (CL), thereby preventing the cutting unit (200) and the table body (120) from colliding.

[0088] The cutting groove (121) can be spaced apart from the suction pad (110) and the vacuum channel (122), respectively.

[0089] As a result, the cutting groove (121) can provide a movement path for the cutting unit (200) while maintaining the suction force of the suction pad (110) and the vacuum channel (122).

[0090] The width of the cutting groove (121) may be wider than the width of the vacuum channel (122).

[0091] As a result, the cutting groove (121) has sufficient width, so that the cutting unit (200) and the table body (120) can be effectively prevented from colliding.

[0092] The depth of the cutting groove (121) can be wider than the width of the vacuum channel (122).

[0093] As a result, the cutting groove (121) has sufficient depth, so that the cutting unit (200) and the table body (120) can be effectively prevented from colliding.

[0094] Referring to FIGS. 3 and 4, a vacuum channel (122) with an inwardly concave shape may be located on the suction surface of the table body (120), extending along a preset path spaced apart from the cutting groove (121).

[0095] The vacuum channel (122) can provide a fluid discharge path located between the mold wafer (MW) and the table body (120).

[0096] For example, the vacuum channel (122) can form a vacuum / low pressure space between the mold wafer (MW) and the table body (120) in an area spaced apart from the adsorption pad (110).

[0097] As a result, the vacuum channel (122) provides a secondary vacuum pressure to the mold wafer (MW) adsorbed on the adsorption pad (110), thereby allowing the mold wafer (MW) to be firmly fixed to the table body (120).

[0098] The vacuum channel (122) can be formed in the shape of a groove that extends along a preset path.

[0099] The second exhaust section (320) of the pressure control section (300) is connected to the vacuum channel (122) and can exhaust the internal fluid of the vacuum channel (122), thereby creating a low pressure or vacuum in the space between the mold wafer (MW) and the table body (120), so that the mold wafer (MW) can be brought into close contact with the table body (120).

[0100] The width of the vacuum channel (122) is thinner than the width of the cutting groove (121), and the depth of the vacuum channel (122) may be shallower than the depth of the cutting groove (121).

[0101] As a result, the second exhaust section (320) has the effect of efficiently reducing the internal area of ​​the vacuum channel (122).

[0102] The vacuum channel (122) can pass between multiple suction pads (110).

[0103] As a result, the vacuum channel (122) can provide vacuum pressure to the mold wafer (MW) between the multiple adsorption pads (110), and thereby the mold wafer (MW) and the table body (120) can be firmly attached even in areas where the adsorption pads (110) are not located.

[0104] The vacuum channel (122) can pass between the cutting groove (121) and the suction pad (110).

[0105] The vacuum channel (122) may be positioned adjacent to the cutting groove (121), and the vacuum channel (122) may extend parallel to the cutting groove (121).

[0106] As a result, even if the cutting unit (200) applies force to the mold wafer (MW) as it passes through the cutting groove (121), the vacuum channel (122) provides adsorption force to the mold wafer (MW) in the area adjacent to the cutting groove (121), thereby effectively preventing the position of the mold wafer (MW) from changing.

[0107] When viewed from the first direction, the vacuum channel (122) can be positioned to surround the outer periphery of the adsorption pad (110).

[0108] In one embodiment, the vacuum channel (122) may extend along a closed loop, and the adsorption pad (110) may be located inside the closed loop formed by the vacuum channel (122).

[0109] As a result, the vacuum channel (122) provides vacuum pressure to the mold wafer (MW) around the adsorption pad (110), thereby effectively assisting the adsorption force of the adsorption pad (110).

[0110] Referring to FIG. 1 and FIG. 4, a pressure control unit (300) according to one embodiment of the present invention controls the pressure in the space between a mold wafer (MW) and a table unit (100) and may include a first exhaust unit (310) and a second exhaust unit (320).

[0111] The first exhaust section (310) regulates the pressure in the space between the adsorption pad (110) and the mold wafer (MW) and can be in communication with the adsorption pad (110).

[0112] The second exhaust section (320) regulates the internal pressure of the vacuum channel (122) and can be in communication with the vacuum channel (122).

[0113] The first exhaust unit (310) and the second exhaust unit (320) can be driven independently, for example, the second exhaust unit (320) can be driven after the first exhaust unit (310) is driven.

[0114] In one embodiment, the first exhaust unit (310) and the second exhaust unit (320) can be driven independently so that the pressure in the space between the adsorption pad (110) and the mold wafer (MW) and the internal pressure of the vacuum channel (122) are controlled sequentially and chronologically.

[0115] The explanation regarding this will be detailed below.

[0116] FIG. 5 is a drawing for explaining the state in which a mold wafer (MW) is adsorbed to an adsorption pad (110) in the table unit (100) shown in FIG. 4.

[0117] Referring to FIG. 5, the mold wafer (MW) can be placed on the table unit (100).

[0118] In this case, the mold wafer (MW) can come into contact with the adsorption pad (110), and the mold wafer (MW) can be spaced apart from the table body (120) by a preset distance.

[0119] When the mold wafer (MW) comes into contact with the adsorption pad (110) and is separated from the table body (120), the first exhaust unit (310) can provide a primary adsorption force to the mold wafer (MW) through the adsorption pad (110).

[0120] When the mold wafer (MW) and the table body (120) are separated, the operation of the second exhaust unit (320) may be limited.

[0121] Specifically, when the mold wafer (MW) and the table body (120) are separated and the vacuum channel (122) is exposed to the outside, the operation of the second exhaust unit (320) may be limited.

[0122] FIG. 6 is a drawing for explaining the state in which pressure is applied to a mold wafer (MW) in the table unit (100) shown in FIG. 5.

[0123] Referring to FIG. 6, a pressurizing unit (400) according to one embodiment of the present invention can apply a first directional pressurizing force to a mold wafer (MW) adsorbed on an adsorption pad (110).

[0124] In one embodiment, after the mold wafer (MW) is adsorbed to the adsorption pad (110), the pressurizing unit (400) can apply a first directional pressurizing force to the mold wafer (MW), thereby reducing the first directional length of the adsorption pad (110).

[0125] The suction pad (110) can have its length reduced in the first direction by receiving pressure from the pressure member (400), and accordingly, the suction surface of the suction pad (110) can be lowered to a level parallel to the suction surface of the table body (120).

[0126] As a result, the mold wafer (MW) descends toward the adsorption surface of the table body (120) and can cover the vacuum channel (122), thereby forming the internal space of the vacuum channel (122) into a sealed area.

[0127] When the distance between the mold wafer (MW) and the table body (120) is reduced, the second exhaust unit (320) can reduce the internal pressure of the vacuum channel (122).

[0128] As a result, the second exhaust unit (320) can provide a secondary adsorption force to the mold wafer (MW) through the vacuum channel (122).

[0129] When the mold wafer (MW) and the adsorption pad (110) are in contact and the mold wafer (MW) and the table body (120) are separated, the first exhaust unit (310) can primarily provide adsorption force to the mold wafer (MW) through the adsorption pad (110).

[0130] Additionally, when the mold wafer (MW) is lowered toward the table body (120) by receiving force from the pressurizing unit (400) and the mold wafer (MW) comes into contact with the table body (120), the second exhaust unit (320) can provide a secondary adsorption force to the mold wafer (MW) through the vacuum channel (122).

[0131] FIG. 7 is a drawing for explaining the state in which a mold wafer (MW) adsorbed to the table unit (100) in FIG. 6 is cut.

[0132] Referring to FIG. 7, the mold wafer (MW) can receive double adsorption force from the adsorption pad (110) and the vacuum channel (122), and in this state, the cutting unit (200) can cut the mold wafer (MW) while moving along the cutting groove (121).

[0133] The wafer processing device (1) may further be equipped with a shooting device (not shown).

[0134] The imaging device can capture a preset area of ​​a chip device (CD) of a mold wafer (MW) mounted on a table unit (100) to detect the position and / or orientation of the chip device (CD), and can control the operation of a cutting unit (200) based on the detected position and / or orientation of the chip device (CD).

[0135] For example, the imaging device can detect the location of at least one point located on the outer edge of the chip device (CD), and can align and / or correct the cutting line (CL) based on the location of the detected point.

[0136] A processor provided in a wafer processing device (1) can store information regarding an aligned and / or corrected cutting line (CL), and the processor can precisely perform a singulation process of a chip device (CD) by controlling the operation of a cutting unit (200) based on the stored information.

[0138] Hereinafter, a table unit (100') according to another embodiment of the present invention will be described.

[0139] FIG. 8 is a perspective view of a table unit (100') according to another embodiment of the present invention, and FIG. 9 is an exploded perspective view of the table unit (100') shown in FIG. 8.

[0140] Referring to FIGS. 8 and 9, a table unit (100') according to another embodiment of the present invention may include an adsorption pad (110') and a table body (120').

[0141] The suction pad (110') can be detachably attached to the table body (120').

[0142] Specifically, a plurality of fastening holes (120'h) into which one side of the suction pad (110') is inserted may be formed in the table body (120'), and the suction pad (110') may be detachably coupled to the fastening holes (120'h).

[0143] Multiple fastening holes (120'h) can be positioned at equal intervals, and the adsorption pad (110') can be fixed or separated from the appropriate fastening holes (120'h) depending on the shape and position of the chip device (CD).

[0144] A screw thread (110'a) may be formed on the outer surface of the suction pad (110'), and a screw groove may be formed on the inner surface of the fastening hole (120'h), thereby allowing one side of the suction pad (110') and the fastening hole (120'h) to be screw-coupled.

[0145] When viewed from the first direction, the multiple fastening holes (120`h) and the suction pad (110`) that overlap with the intermediate area (AB) can be spaced apart from each other.

[0146] Specifically, the attachment of the adsorption pad (110') may be restricted in the fastening hole portion (120'h) corresponding to the inter-region (AB).

[0147] When viewed from the first direction, the multiple fastening holes (120`h) and the suction pad (110`) that overlap with the cutting line (CL) can be spaced apart from each other.

[0148] Specifically, the attachment of the adsorption pad (110') may be restricted in the fastening hole portion (120'h) corresponding to the cutting line (CL).

[0149] The cutting unit (200) can move along an area where a plurality of fastening holes (120'h) are spaced apart from the suction pad (110').

[0150] When viewed from the first direction, at least one adsorption pad (110') can be placed in the inner region of the chip device (CD).

[0151] As a result, the adsorption pad (110') is not located in the area corresponding to the cutting line (CL), thereby preventing the cutting unit (200) from colliding with the adsorption pad (110') while cutting the mold wafer (MW).

[0152] FIG. 10 is a drawing for explaining the first usage state of the table unit (100') illustrated in FIG. 8, and FIG. 11 is a drawing for explaining the second usage state of the table unit (100') illustrated in FIG. 8.

[0153] Referring to FIGS. 10 and 11, the cutting line (CL) can be set differently depending on the shape or arrangement structure of the chip device (CD) of the mold wafer (MW).

[0154] The suction pad (110') can be attached to the table body (120') so as not to overlap with the setting cutting line (CL), thereby allowing the suction pad (110') to firmly support the mold wafer (MW) while avoiding interference with the cutting unit (200).

[0155] A wafer processing device (1) according to embodiments of the present invention has the effect of firmly supporting the wafer and securing a movement path for the cutting unit (200) by providing an adsorption pad (110') spaced apart from the area (AB) between a plurality of chip devices (CD).

[0157] Hereinafter, a wafer processing method according to one embodiment of the present invention will be described.

[0158] FIG. 12 is a drawing for explaining the first cutting line (CL1) of the first chip device (CD1) and the second cutting line (CL2) of the second chip device (CD2), and FIG. 13 is a drawing for explaining the method of cutting the second cutting line (CL2) of FIG. 12.

[0159] Hereinafter, 'wafer' or 'mold wafer' may be interpreted as a mold wafer (MW) processed by the wafer processing device (1) according to the embodiments of the present invention described above, but is not limited thereto.

[0160] Referring to FIG. 12, the mold wafer (MW) may include a plurality of chip devices (CD) and a mold resin (MR) that supports the chip devices (CD).

[0161] In one embodiment, a plurality of chip devices (CD) may include a first chip device (CD1) and a second chip device (CD2) spaced apart from each other.

[0162] The cutting unit (200) can separate the first chip device (CD1) from the mold resin (MR) by cutting along a first cutting line (CL1) that extends along the outer periphery of the first chip device (CD1), and the cutting unit (200) can separate the second chip device (CD2) from the mold resin (MR) by cutting along a second cutting line (CL2) that extends along the outer periphery of the second chip device (CD2).

[0163] The first cutting line (CL1) and the second cutting line (CL2) may overlap with the area where the mold resin (MR) is located, but may be spaced apart from the area where the chip device is located.

[0164] A wafer processing method according to one embodiment of the present invention may include the step of a cutting unit (200) that cuts a mold resin (MR) cutting a first cutting line (CL1) that extends along the outer periphery of a first chip device (CD1), and the step of the cutting unit (200) cutting a second cutting line (CL2) that extends along the outer periphery of a second chip device (CD2).

[0165] The step of cutting the second cutting line (CL2) extending along the outer periphery of the second chip device (CD2) can be performed after the step of cutting the first cutting line (CL1) extending along the outer periphery of the first chip device (CD1).

[0166] That is, after the cutting unit (200) separates the first chip device (CD1) from the mold resin (MR), the second chip device (CD2) can be separated from the mold resin (MR).

[0167] Referring to FIG. 13, the second cutting line (CL2) may have a first line (L1) spaced apart from the area between the first chip device (CD1) and the second chip device (CD2), and a second line (L2) that overlaps with the area between them.

[0168] The second cutting line (CL2) may be formed in a closed loop shape surrounding the second chip device (CD2), and the first line (L1) may be formed in a closed loop shape surrounding the second chip device (CD2) together with the second line (L2).

[0169] Both ends of the first line (L1) can meet both ends of the second line (L2).

[0170] The point in time when the cutting of the first line (L1) by the cutting unit (200) is finished may be after the point in time when the cutting of the second line (L2) is finished.

[0171] That is, the cutting of the second line (L2) adjacent to the first cutting line (CL1) that has already been cut can be completed before the cutting of the first line (L1) is completed.

[0172] After the first chip device (CD1) is separated from the mold resin (MR), the force supporting the second chip device (CD2) by the mold resin (MR) located in the inter-regional area may decrease.

[0173] As a result, if the first line (L1) is completely cut before the second line (L2) is cut, when the second line (L2) is cut, only the vacuum channel (122) where the device (CD2) is located on the table body (120) and the suction pad (110) or the suction pad (110') support the second chip device (CD2).

[0174] Accordingly, when cutting the second line (L2) in this state, the second chip device (CD2) may vibrate excessively or the second chip device (CD2) may detach from the table body (120, 120') before the second line (L2) is completely cut, which may reduce the precision of the cutting process of the second chip device (CD2).

[0175] A wafer processing method according to one embodiment of the present invention can improve the precision of the cutting process of the second chip device (CD2) by performing the cutting of the first line (L1) after the cutting of the second line (L2) is completed.

[0176] The second cutting line (CL2) may have a termination point where the cutting of the cutting unit (200) ends.

[0177] The end point may be located on the second cutting line (CL2), and the separation process of the second chip device (CD2) may be terminated when the cutting unit (200) processing along the second cutting line (CL2) reaches the end point.

[0178] In one embodiment, the starting point where the cutting of the cutting unit (200) begins may be the same point as the ending point.

[0179] Specifically, the cutting unit (200) enters the starting point on the second cutting line (CL2), performs cutting on the second cutting line (CL2), and then returns to the ending point, thereby terminating the separation process of the second chip device (CD2).

[0180] In one embodiment, the end point may be spaced apart from the second line (L2). For example, the end point may be placed on the first line (L1).

[0181] In this case, the time when the first cutting unit (200) starts cutting the first line (L1) may be before the time when the cutting unit (200) starts cutting the second line (L2).

[0182] Specifically, the cutting unit (200) can cut the remainder of the first line (L1) after cutting a portion of the first line (L1) and after finishing cutting the second line (L2).

[0183] In an optional embodiment, the end point may be located on the second line (L2). For example, the end point may overlap with the second line (L2).

[0184] In this case, the time when the first cutting unit (200) starts cutting the first line (L1) may be after the time when the cutting unit (200) starts cutting the second line (L2).

[0185] Specifically, the cutting unit (200) can start cutting the first line (L1) after finishing cutting the second line (L2), and the cutting unit (200) that started cutting the first line (L1) can move along the first line (L1) to the end point.

[0186] As a result, while the second line (L2) adjacent to the already separated first chip device (CD1) is being cut, the second chip device (CD2) can be stably supported through the mold resin (MR) on the first line (L1), so that the cutting of the second line (L2) can be performed stably.

[0187] Each of the embodiments described above can be implemented independently, but it goes without saying that the structure of each embodiment can be applied in combination to other embodiments.

[0188] As such, the present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims.

[0189] The specific practices described in the embodiments are examples and do not limit the scope of the embodiments in any way. Furthermore, unless specifically stated as "essential," "importantly," etc., components may not be strictly necessary for the application of the present invention.

[0190] In the specification of the embodiments (particularly the claims), the use of the term "above" and similar descriptive terms may be in both singular and plural.

[0191] In addition, where a range is described in the embodiments, it includes an invention applying individual values ​​belonging to said range (unless otherwise stated), and is equivalent to describing each individual value constituting said range in the detailed description.

[0192] Finally, regarding the steps constituting the method according to the embodiment, unless the order is explicitly stated or contradicted, said steps may be performed in a suitable order. The embodiments are not necessarily limited to the order in which said steps are described.

[0193] In the embodiments, the use of all examples or exemplary terms is merely for the purpose of describing the embodiments in detail, and the scope of the embodiments is not limited by said examples or exemplary terms unless limited by the claims.

[0194] In addition, those skilled in the art will understand that various modifications, combinations, and changes may be configured according to design conditions and factors within the scope of the patent claims or equivalents to which they are added. Explanation of the symbols

[0195] 1: Wafer processing device MW: Mold wafer CD: Chip device MR: Mold resin CL: Cutting line AB: Intermediate area 100: Table unit 110: Suction pad 120: Table body 121: Cutting groove 122: Vacuum Channel 200: Cutting Unit 300: Pressure regulating unit 310: First exhaust unit 320: Second exhaust section 400: Pressurization section

Claims

Claim 1 A wafer processing apparatus comprising: a table unit having a plurality of adsorption pads spaced apart from each other and a table body to which the adsorption pads are connected, wherein a mold wafer having a plurality of chip devices and a mold resin supporting the chip devices is seated thereon; and a cutting unit for cutting the mold resin located in an area between the plurality of chip devices; wherein, when viewed from one direction in which the mold wafer and the table unit are stacked, the area between and the adsorption pads are spaced apart from each other, and on one surface of the table body facing the mold wafer, a cutting groove is located that is concave inwardly while extending along a preset path and into which one side of the cutting unit is inserted, and on one surface of the table body, a vacuum channel is located that is concave inwardly while extending along a preset path, is spaced apart from the cutting groove, and provides a fluid discharge path located between the mold wafer and the table body. Claim 2 delete Claim 3 In claim 1, the cutting unit is a wafer processing device that moves along a path in which the cutting groove extends. Claim 4 A wafer processing device according to claim 1, wherein, when viewed from the above-mentioned direction, the path along which the cutting groove extends overlaps with the above-mentioned intermediate area. Claim 5 delete Claim 6 A wafer processing device according to claim 1, wherein the width of the vacuum channel is relatively smaller than the width of the cutting groove. Claim 7 A wafer processing device according to claim 6, wherein the depth of the vacuum channel is relatively shallower than the width of the cutting groove. Claim 8 A wafer processing apparatus according to claim 1, further comprising a pressure regulating unit for regulating the pressure in the space between the mold wafer and the table unit. Claim 9 A wafer processing apparatus according to claim 8, wherein the pressure regulating unit comprises: a first exhaust unit communicating with the adsorption pad and regulating the pressure in the space between the adsorption pad and the mold wafer; and a second exhaust unit communicating with the vacuum channel and regulating the internal pressure of the vacuum channel. Claim 10 A wafer processing device according to claim 9, wherein the first exhaust unit and the second exhaust unit are driven independently to sequentially control the pressure in the space between the adsorption pad and the mold wafer and the internal pressure of the vacuum channel. Claim 11 A wafer processing device according to claim 1, wherein the adsorption pad is detachably coupled to the table body. Claim 12 A wafer processing device according to claim 11, wherein a plurality of fastening holes into which one side of the adsorption pad is inserted are formed in the table body, a screw thread is formed on the outer surface of one side of the adsorption pad, and a screw groove is formed on the inner surface of the fastening holes. Claim 13 A wafer processing device according to claim 12, wherein, when viewed from the above-mentioned direction, a plurality of the above-mentioned fastening hole portions and the above-mentioned adsorption pads are spaced apart from each other and overlap with the above-mentioned intermediate area. Claim 14 In claim 12, the wafer processing device wherein the cutting unit moves along an area in which a plurality of fastening holes spaced apart from the adsorption pad are arranged. Claim 15 A wafer processing device according to claim 12, wherein, when viewed from the above-mentioned direction, at least one of the adsorption pads is disposed in an inner region of the chip device. Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

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