Display module, display apparatus and method for manufacturing the same

Abstract

A display module according to one embodiment comprising a plurality of pixels arranged in two dimensions comprises: a backplate comprising a transparent substrate, a pixel circuit layer disposed on the transparent substrate, and a plurality of power electrode layers; a display panel comprising a plurality of inorganic light-emitting elements disposed on the backplate; and an image sensor disposed behind the display panel; wherein each of the plurality of pixels is composed of two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and the display panel comprises a plurality of transparent regions formed in an area corresponding to the position of the image sensor and arranged so that external light is incident on the image sensor; and each of the plurality of transparent regions comprises a plurality of pinholes formed in each of the plurality of power electrode layers and overlapped in one direction, which are provided between the apertures of two or more of the plurality of pixels.

Description

Technology Field

[0001] The present invention relates to a display module that implements an image using an inorganic light-emitting element, a display device, and a method for manufacturing the same. Background Technology

[0002] Display devices can be classified into self-emissive displays, where each pixel emits light on its own, and light-emitting displays, which require a separate light source.

[0003] Liquid Crystal Displays (LCDs) are representative light-emitting displays that require a backlight unit to supply light from the back of the display panel, a liquid crystal layer that acts as a switch to pass or block light, and a color filter to convert the supplied light into the desired color. Because of this, they are structurally complex and have limitations in achieving thin thicknesses.

[0004] On the other hand, self-emissive displays, in which each pixel is equipped with a light-emitting element to emit light independently, do not require components such as backlight units and liquid crystal layers, and can also omit color filters. This results in a structurally simple design that offers high design freedom. Furthermore, not only can a thin thickness be achieved, but excellent contrast ratio, brightness, and viewing angle can also be realized.

[0005] Among self-emissive displays, micro LED displays are flat-panel displays composed of multiple LEDs with a size of approximately 100 micrometers. Compared to LCDs that require a backlight, micro LED displays can provide excellent contrast, response time, and energy efficiency.

[0006] In addition, inorganic light-emitting diodes (Micro LEDs) are brighter, have superior luminous efficiency, and a longer lifespan than OLEDs, which require a separate encapsulation layer to protect organic materials. The problem to be solved

[0007] A display module and a display device are provided that realize an under-display camera (UDC) function while maintaining resolution by placing an image sensor behind a back plate and forming a transparent area through which light passes between the pixel openings of the back plate. means of solving the problem

[0008] A display module according to one embodiment comprising a plurality of pixels arranged in two dimensions comprises: a backplate comprising a transparent substrate, a pixel circuit layer disposed on the transparent substrate, and a plurality of power electrode layers; a display panel comprising a plurality of inorganic light-emitting elements disposed on the backplate; and an image sensor disposed behind the display panel; wherein each of the plurality of pixels is composed of two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and the display panel comprises a plurality of transparent regions formed in an area corresponding to the position of the image sensor and arranged so that external light is incident on the image sensor; and each of the plurality of transparent regions comprises a plurality of pinholes formed in each of the plurality of power electrode layers and overlapped in one direction, which are provided between the apertures of two or more of the plurality of pixels.

[0009] The display panel further comprises a black matrix (BM) layer disposed on the backplate and blocking light in an area excluding the opening of each of the plurality of pixels; and each of the plurality of transparent areas may include a pinhole in the black matrix layer that overlaps in one direction with the pinhole of each of the plurality of power electrode layers.

[0010] Each of the above plurality of transparent regions can be formed in an area where the pixel circuit of the pixel circuit layer is not located.

[0011] Each of the above plurality of transparent regions can be formed in an area where the signal wiring of the pixel circuit layer is not located.

[0012] The display module further includes a driver IC that transmits a driving signal to a pixel circuit of the pixel circuit layer; and an FPCB on which the driver IC is mounted and which is electrically connected to the back surface of the backplate; and each of the plurality of transparent areas may be formed in an area where the FPCB is not located.

[0013] Each of the above plurality of transparent regions may have a diameter of the same size.

[0014] The above plurality of transparent regions may include transparent regions having different diameters.

[0015] The plurality of transparent regions may include at least one first transparent region having a first diameter; at least one second transparent region having a second diameter larger than the first diameter; and at least one third transparent region having a third diameter smaller than the first diameter.

[0016] In the above display panel, a transparent area with a smaller diameter closer to the center of the area corresponding to the position of the image sensor may be formed.

[0017] In the above display panel, a transparent area with a larger diameter the closer it is to the center of the area corresponding to the position of the image sensor may be formed.

[0018] Each of the above plurality of transparent regions may have a diameter different from that of an adjacent transparent region.

[0019] The image sensor can acquire image data by detecting external light incident through each of the plurality of transparent regions.

[0020] A display device according to one embodiment comprises: a plurality of display modules including a plurality of pixels arranged in two dimensions; and a frame supporting the plurality of display modules; wherein at least one of the plurality of display modules comprises: a backplate including a transparent substrate, a pixel circuit layer disposed on the transparent substrate, and a plurality of power electrode layers; and a display panel including a plurality of inorganic light-emitting elements disposed on the backplate; and an image sensor disposed behind the display panel; wherein each of the plurality of pixels is composed of two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and the display panel comprises a plurality of transparent regions formed in an area corresponding to the position of the image sensor and arranged so that external light is incident on the image sensor; and each of the plurality of transparent regions comprises a plurality of pinholes formed in each of the plurality of power electrode layers and overlapped in one direction, which are provided between the apertures of two or more of the plurality of pixels.

[0021] The display panel further comprises a black matrix (BM) layer disposed on the backplate and blocking light in an area excluding the opening of each of the plurality of pixels; and each of the plurality of transparent areas may include a pinhole in the black matrix layer that overlaps in one direction with the pinhole of each of the plurality of power electrode layers.

[0022] Each of the above plurality of transparent regions can be formed in an area where the pixel circuit of the pixel circuit layer is not located.

[0023] Each of the above plurality of transparent regions can be formed in an area where the signal wiring of the pixel circuit layer is not located.

[0024] The display module further includes a driver IC that transmits a driving signal to a pixel circuit of the pixel circuit layer; and an FPCB on which the driver IC is mounted and which is electrically connected to the back surface of the backplate; and each of the plurality of transparent areas may be formed in an area where the FPCB is not located.

[0025] The above plurality of transparent regions may include transparent regions having different diameters.

[0026] The plurality of transparent regions may include at least one first transparent region having a first diameter; at least one second transparent region having a second diameter larger than the first diameter; and at least one third transparent region having a third diameter smaller than the first diameter.

[0027] In the above display panel, a transparent area with a smaller diameter closer to the center of the area corresponding to the position of the image sensor may be formed. Effects of the invention

[0028] According to a display module and display device of one embodiment, an image sensor is placed behind a back plate, and a transparent area through which light passes is formed between the pixel openings of the back plate, thereby enabling the realization of an under-display camera (UDC) function while maintaining resolution. Brief explanation of the drawing

[0029] FIG. 1 is a perspective view showing an example of a display module according to one embodiment of the present invention and a display device including the same. FIG. 2 is a diagram showing an example of a pixel array constituting a unit module of a display device according to one embodiment of the present invention. FIG. 3 is a control block diagram of a display device according to one embodiment of the present invention. FIG. 4 is a control block diagram showing the configuration of a display module included in a display device according to one embodiment of the present invention. FIG. 5 is a diagram conceptually illustrating the method of driving each pixel in a display module according to one embodiment of the present invention. FIG. 6 is a simplified circuit diagram illustrating a pixel circuit that controls a single subpixel in a display module according to one embodiment of the present invention. FIG. 7 illustrates an example of a pixel circuit that controls a single subpixel in a display module according to an embodiment of the present invention. FIG. 8 is a diagram showing an example of a transparent area arrangement of a display module according to one embodiment of the present invention. FIG. 9 is a side cross-sectional view illustrating a case where light passes through a transparent region and is irradiated onto an image sensor in a display module according to one embodiment of the present invention. FIG. 10 is a side cross-sectional view schematically showing the formation of a transparent area in a display module according to one embodiment of the present invention. FIG. 11 is a side cross-sectional view showing a portion of a display panel including a transparent area according to one embodiment of the present invention. FIG. 12 is a diagram showing an example of a method of electrically connecting a display panel and a driver IC in a display module according to one embodiment of the present invention. FIG. 13 is a diagram showing the arrangement relationship between pixels and transparent areas in a display module according to one embodiment of the present invention. FIG. 14 is a drawing showing a case in which a display module according to one embodiment of the present invention includes transparent regions having different diameters. FIGS. 15 and FIGS. 17 are drawings illustrating an example of a transparent area arrangement of a display module according to an embodiment of the present invention. FIGS. 18 and 19 are drawings illustrating examples of signals transmitted to a plurality of tiled display modules in a display device according to one embodiment. FIG. 20 is a drawing showing an example of a method in which a plurality of display modules are coupled to a housing in a display device according to an embodiment of the present invention. FIG. 21 is a flowchart of a method for manufacturing a display module according to one embodiment of the present invention. Specific details for implementing the invention

[0030] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and various modifications that may replace the embodiments and drawings of this specification may exist at the time of filing this application.

[0031] Throughout this specification, when a part is described as being "connected" to another part, this includes not only cases where they are directly connected but also cases where they are indirectly connected, and indirect connection includes being connected via a wireless communication network.

[0032] Furthermore, the terms used in this specification are for describing embodiments and are not intended to limit or / or restrict the disclosed invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0033] Additionally, terms including ordinal numbers, such as "first," "second," etc., used in this specification may be used to describe various components, but said components are not limited by said terms, and said terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0034] In addition, terms such as "~part," "~unit," "~block," "~part," and "~module" may refer to a unit that processes at least one function or operation. For example, the above terms may refer to at least one piece of hardware such as an FPGA (field-programmable gate array) or ASIC (application specific integrated circuit), at least one piece of software stored in memory, or at least one process processed by a processor.

[0035] The symbols attached to each step are used to identify each step and do not indicate the order of the steps relative to one another; the steps may be performed differently from the specified order unless a specific order is clearly indicated in the context.

[0036] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0037] FIG. 1 is a perspective view showing an example of a display module and a display device including the same according to an embodiment of the present invention, and FIG. 2 is a drawing showing an example of a pixel array constituting a unit module of a display device according to an embodiment of the present invention.

[0038] A display device (1) according to one embodiment is a self-emissive display device in which a light-emitting element is arranged for each pixel, so that each pixel can emit light on its own. Therefore, unlike a liquid crystal display device, it does not require components such as a backlight unit or a liquid crystal layer, so a thin thickness can be achieved, and various design changes are possible due to the simple structure.

[0039] In addition, the display device (1) according to one embodiment may employ an inorganic light-emitting element, such as an inorganic light-emitting diode, as a light-emitting element placed in each pixel. The inorganic light-emitting element has a faster response speed compared to an organic light-emitting element, such as an OLED (Organic Light-Emitting Diode), and can achieve high brightness with low power consumption.

[0040] In addition, unlike organic light-emitting diodes, which are vulnerable to exposure to moisture and oxygen, require an encapsulation process, and have poor durability, it does not require an encapsulation process and has strong durability. Hereinafter, the inorganic light-emitting diode mentioned in the embodiments described below refers to an inorganic light-emitting diode.

[0041] The inorganic light-emitting element employed in the display device (1) according to one embodiment may be a micro LED having a short side length of approximately 100 μm. In this way, by employing a micro LED, the pixel size can be reduced and high resolution can be achieved even within the same screen size.

[0042] In addition, manufacturing LED chips in micro-sized units can solve the problem of inorganic materials breaking when bent due to their characteristics. That is, if micro LED chips are transferred onto a flexible substrate, the LED chips do not break even if the substrate is bent, making it possible to realize flexible display devices.

[0043] A display device employing micro LEDs can be applied in various fields by utilizing ultra-small pixel size and thin thickness. For example, as shown in FIG. 1, a large-area screen can be realized by tiling a plurality of display modules (10) on which a plurality of micro LEDs are transferred and fixing them to a housing (20), and such a large-area screen display device can be used as signage, an electronic display board, etc.

[0044] Meanwhile, the three-dimensional coordinate system of the XYZ axes shown in FIG. 1 is based on the display device (1), and the plane where the screen of the display device (1) is located is the XZ plane, and the direction in which the image is output or the direction of light emission of the inorganic light-emitting element is the +Y direction. Since the coordinate system is based on the display device (1), the same coordinate system can be applied whether the display device (1) is lying down or standing up.

[0045] Generally, the display device (1) is used in an upright position, and the user views the image from the front of the display device (1), so the +Y direction in which the image is output can be called the front, and the opposite direction can be called the rear.

[0046] In addition, the display device (1) is generally manufactured in a lying position. Therefore, it is possible to refer to the -Y direction of the display device (1) as the lower direction and the +Y direction as the upper direction. That is, in the embodiment described below, the +Y direction may be referred to as the upper direction or the front, and the -Y direction may be referred to as the lower direction or the rear.

[0047] The remaining four sides, excluding the top and bottom surfaces of the flat-panel display device (1) or display module (10), are all referred to as sides regardless of the orientation of the display device (1) or display module (10).

[0048] In the example of FIG. 1, a case is illustrated in which a display device (1) includes a plurality of display modules to implement a large-area screen, but the embodiment of the display device (1) is not limited thereto. It is also possible for the display device (1) to include a single display module (10) to be implemented as a TV, a wearable device, a portable device, a PC monitor, etc.

[0049] Referring to FIG. 2, the display module (10) may include a plurality of pixels (P) arranged in two dimensions, i.e., a pixel array of M x N (M, N are two or more integers). FIG. 2 conceptually illustrates a pixel array, wherein one pixel (P) may include an aperture (AP) where an inorganic light-emitting element is located to emit light, and a black matrix (BM) that blocks light in an area other than the aperture (AP).

[0050] In the embodiments thereof, the fact that certain components are arranged in two dimensions may include not only cases where the components are placed on the same plane, but also cases where they are placed on different planes parallel to each other. Additionally, when the components are placed on the same plane, the tops of the placed components must not necessarily be located on the same plane, and may include cases where the tops of the placed components are located on different planes parallel to each other.

[0051] A unit pixel (P) may consist of at least three subpixels that output light of different colors. For example, a unit pixel (P) may consist of three subpixels (SP(R), SP(G), SP(B)) corresponding to R, G, and B, respectively. Here, the red subpixel (SP(R)) may output red light, the green subpixel (SP(G)) may output green light, and the blue subpixel (SP(B)) may output blue light.

[0052] However, the pixel arrangement of FIG. 2 is merely an example that can be applied to a display module (10) and a display device (1) according to one embodiment, and it is possible for the subpixels to be arranged along the Z-axis direction, not arranged in a row, and for the sizes of the subpixels to be different. It is sufficient for a single pixel to include multiple subpixels to implement multiple colors, and there are no restrictions on the size or arrangement method of each subpixel.

[0053] In addition, a unit pixel (P) is not necessarily composed of a red subpixel (SP(R)) that outputs red light, a green subpixel (SP(G)) that outputs green light, and a blue subpixel (SP(B)) that outputs blue light; it is also possible to include subpixels that output yellow light or white light. In other words, there are no restrictions on the color or type of light output from each subpixel, or on the number of subpixels.

[0054] However, for the sake of specific explanation in the embodiments described below, the case in which a unit pixel (P) is composed of a red subpixel (SP(R)), a green subpixel (SP(G)), and a blue subpixel (SP(B)) will be described as an example.

[0055] As previously mentioned, the display module (10) and the display device (1) according to one embodiment are self-emissive display devices in which each pixel can emit light on its own. Accordingly, an inorganic light-emitting element emitting light of a different color may be disposed in each subpixel. For example, a red inorganic light-emitting element may be disposed in the red subpixel (SP(R)), a green inorganic light-emitting element may be disposed in the green subpixel (SP(G)), and a blue inorganic light-emitting element may be disposed in the blue subpixel (SP(B)).

[0056] Accordingly, in the present embodiment, the pixel (P) may represent a cluster including a red inorganic light-emitting element, a green inorganic light-emitting element, and a blue inorganic light-emitting element, and the subpixel may represent each inorganic light-emitting element.

[0057] FIG. 3 is a control block diagram of a display device (1) according to one embodiment of the present invention.

[0058] As previously described with reference to FIG. 1, a display device (1) according to one embodiment may include a plurality of display modules (10-1, 10-2, ..., 10-n, where n is two or more integers), a main control unit (300) and a timing control unit (500) that control the plurality of display modules (10), a communication unit (430) that communicates with an external device, a source input unit (440) that receives source images, a speaker (410) that outputs sound, and an input unit (420) that receives commands from a user to control the display device (1).

[0059] The input unit (420) may include a button or a touch pad provided in one area of ​​the display device (1), and if the display panel (100, see FIG. 4) is implemented as a touch screen, the input unit (420) may include a touch pad provided on the front of the display panel (100). Additionally, the input unit (420) may include a remote controller.

[0060] The input unit (420) can receive various commands from the user to control the display device (1), such as turning the power on / off, adjusting the volume, adjusting the channel, adjusting the screen, and changing various settings.

[0061] The speaker (410) may be provided in one area of ​​the housing (20), and it is also possible to provide a separate speaker module that is physically separated from the housing (20).

[0062] The communication unit (430) can communicate with a relay server or other electronic device to exchange necessary data. The communication unit (430) may adopt at least one of various wireless communication methods such as 3G (3rd Generation), 4G (4th Generation), Wireless LAN, Wi-Fi, Bluetooth, Zigbee, WFD (Wi-Fi Direct), UWB (Ultra wideband), Infrared Data Association (IrDA), BLE (Bluetooth Low Energy), NFC (Near Field Communication), and Z-Wave. In addition, it is also possible to adopt wired communication methods such as PCI (Peripheral Component Interconnect), PCI-express, and USB (Universe Serial Bus).

[0063] The source input unit (440) can receive a source signal input from a set-top box, USB, antenna, etc. Accordingly, the source input unit (440) may include at least one selected from a group of source input interfaces including an HDMI cable port, a USB port, an antenna, etc.

[0064] The source signal received by the source input unit (440) can be processed by the main control unit (300) and converted into a form that can be output to the display panel (100) and the speaker (410).

[0065] The main control unit (300) and the timing control unit (500) may include at least one memory for storing a program and various data for performing the operation described below, and at least one processor for executing the stored program.

[0066] The main control unit (300) can process the source signal input through the source input unit (440) to generate an image signal corresponding to the input source signal.

[0067] For example, the main control unit (300) may include a source decoder, a scaler, an image enhancer, and a graphics processor. The source decoder can decode a source signal compressed in a format such as MPEG, and the scaler can output image data of a desired resolution through resolution conversion.

[0068] An image enhancer can improve the image quality of the image data by applying corrections of various techniques. A graphics processor can separate the pixels of the image data into RGB data and output them together with control signals, such as a syncing signal for display timing on a display panel (100). That is, the main control unit (300) can output image data and control signals corresponding to the source signal.

[0069] The operation of the main control unit (300) described above is merely an example applicable to the display device (1), and it is also possible to perform other operations or omit some of the operations described above.

[0070] The image data and control signal output from the main control unit (300) can be transmitted to the timing control unit (500).

[0071] The timing control unit (500) can convert image data transmitted from the main control unit (300) into image data that can be processed by the driver IC (200, see FIG. 4) and generate various control signals, such as timing control signals, necessary to display the image data on the display panel (100).

[0072] Although the display device (1) according to one embodiment does not necessarily have to include a plurality of display modules (10), for the sake of specific explanation in the embodiments described below, a display device (1) including a plurality of display modules (10) will be described as an example.

[0073] FIG. 4 is a control block diagram showing the configuration of a display module (10) included in a display device (1) according to an embodiment of the present invention, FIG. 5 is a diagram conceptually explaining the method of driving each pixel (P) in a display module (10) according to an embodiment of the present invention, FIG. 6 is a circuit diagram briefly illustrating a pixel circuit controlling a single sub-pixel (SP) in a display module (10) according to an embodiment of the present invention, and FIG. 7 illustrates an example of a pixel circuit controlling a single sub-pixel (SP) in a display module (10) according to an embodiment of the present invention.

[0074] Referring to FIG. 4, each of the plurality of display modules (10-1, 10-2, ..., 10-n) may include a display panel (100) for displaying images and a driver IC (200) for driving the display panel (100).

[0075] The display panel (100) may include a plurality of pixels (P) arranged in two dimensions as described above, and each pixel (P) may be composed of a plurality of sub-pixels (SP) to implement various colors.

[0076] In addition, as previously mentioned, the display device (1) according to one embodiment is a self-emissive display device in which each pixel (P) can emit light on its own. Accordingly, an inorganic light-emitting element (120) may be disposed in each sub-pixel (SP). That is, each of the plurality of pixels (P) may be composed of two or more inorganic light-emitting elements (120).

[0077] Each inorganic light-emitting element (120) can be driven by an AM (Active Matrix) method or a PM (Passive Matrix) method, but for the sake of specific explanation in the embodiments described below, the case where the inorganic light-emitting element (120) is driven by an AM method will be explained as an example.

[0078] In a display module (10) according to one embodiment, each inorganic light-emitting element (120) can be individually controlled by a pixel circuit (130), and the pixel circuit (130) can operate based on a driving signal output from a driver IC (200).

[0079] Referring together with FIG. 5, the driver IC (200) may include a scan driver (210) and a data driver (220). The scan driver (210) may output a gate signal for turning subpixels on / off, and the data driver (220) may output a data signal for implementing an image.

[0080] The scan driver (210) can generate a gate signal based on a control signal transmitted from the timing control unit (500), and the data driver (220) can generate a data signal based on image data transmitted from the timing control unit (500).

[0081] The pixel circuit (130) can individually control each inorganic light-emitting element (120), and a gate signal output from the scan driver (210) and a data signal output from the data driver (220) can be input to the pixel circuit (130). To this end, the pixel circuit (130) may include at least one thin film transistor (TFT).

[0082] For example, the gate voltage (V) to the pixel circuit (130) GATE ), data voltage (V DATA ) and power supply voltage (V DD When ) is input, the pixel circuit (130) provides a driving current (C) for driving the inorganic light-emitting element (120). D Can output ).

[0083] Driving current (C) output from pixel circuit (130) D) can be input to the inorganic light-emitting element (120), and the inorganic light-emitting element (120) has an input driving current (C D It can create an image by emitting light through ).

[0084] Referring to the example in FIG. 6, the pixel circuit (130) comprises thin-film transistors (TR1, TR2) and a capacitor (C) that switch or drive an inorganic light-emitting element (120). st It may include ). As described above, the inorganic light-emitting element (120) may be a micro LED.

[0085] For example, thin-film transistors (TR1, TR2) may include a switching transistor (TR1) and a driving transistor (TR2), and the switching transistor (TR1) and the driving transistor (TR2) may be implemented as PMOS type transistors. However, embodiments of the display module (10) and the display device (1) are not limited thereto, and it is also possible for the switching transistor (TR1) and the driving transistor (TR2) to be implemented as NMOS type transistors.

[0086] The gate electrode of the switching transistor (TR1) is connected to the scan driver (210), the source electrode is connected to the data driver (220), and the drain electrode is connected to the capacitor (C st It is connected to one end of ) and the gate electrode of the driving transistor (TR2). Capacitor (C st The other end of ) can be connected to the first power source (610).

[0087] In addition, the source electrode of the driving transistor (TR2) is at the power supply voltage (V DD It is connected to a first power source (610) that supplies ), and the drain electrode is connected to the anode of the inorganic light-emitting element (120). The cathode of the inorganic light-emitting element (120) is connected to a reference voltage (V SS It can be connected to a third power source (620) that supplies ). Reference voltage (V SS ) is the power supply voltage (V DDAs a voltage level lower than ), ground voltage, etc., can be used to provide grounding.

[0088] The pixel circuit (130) of the above-described structure can operate as follows. First, the gate voltage (V) from the scan driver (210) GATE When ) is applied and the switching transistor (TR1) is turned on, the data voltage (V) applied from the data driver (220) DATA ) this capacitor (C st It can be delivered to one end of the and the gate electrode of the driving transistor (TR2).

[0089] Capacitor (C st The gate-source voltage (V) of the driven transistor (TR2) by ) GS A voltage corresponding to ) can be maintained for a certain period of time. The driving transistor (TR2) has a driving current (C) corresponding to the gate-source voltage (VGS). D By applying ) to the anode of the inorganic light-emitting element (120), the inorganic light-emitting element (120) can be made to emit light.

[0090] However, the structure of the pixel circuit (130) described above is merely an example applicable to a display module (10) according to one embodiment, and various circuit structures for switching and driving a plurality of inorganic light-emitting elements (120) in addition to the example described above may be applied.

[0091] In addition, in this embodiment, there are no restrictions on the brightness control method of the inorganic light-emitting element (120). The brightness of the inorganic light-emitting element (120) can be controlled by one of various methods, such as a Pulse Amplitude Modulation (PAM) method, a Pulse Width Modulation (PWM) method, and a hybrid method combining the PAM and PWM methods.

[0092] For example, the pixel circuit (130) can control the brightness of the inorganic light-emitting element (120) in a hybrid manner including both a PWM circuit (136) and a PAM circuit (137), as shown in FIG. 7. The PWM circuit (136) controls the driving current (C) based on the applied PWM data voltage. D The pulse width of ) can be controlled, and the PAM circuit (137) can control the driving current (C) based on the applied PAM data voltage. D The amplitude of ) can be controlled.

[0093] At this time, the first power supply voltage (V) of the PAM circuit (137) is applied to the PAM circuit (137). DD_PAM ) may be provided, and a second power supply voltage (V) to the PWM circuit (136) DD_PWM ) may be provided. In this case, the first power supply voltage (V DD_PAM ) and the second power supply voltage (V DD_PWM ) can be supplied to the PAM circuit (137) and the PWM circuit (136), respectively, through different lines. That is, the first power supply (610) is, the first power supply voltage (V DD_PAM It can output ), and the second power supply (620) is the second power supply voltage (V DD_PWM Can output ).

[0094] Below, the power supply voltage (V DD Although the power supply supplying the power is described as being composed of two power sources, a first power source (610) and a second power source (620), according to the embodiment, it is also possible to include only the first power source (610).

[0095] FIG. 8 is a diagram showing an example of the arrangement of transparent regions of a display module (10) according to one embodiment of the present invention, FIG. 9 is a side cross-sectional view illustrating the case where light passes through the transparent regions and is irradiated onto an image sensor in a display module (10) according to one embodiment of the present invention, and FIG. 10 is a side cross-sectional view schematically showing the formation of transparent regions in a display module (10) according to one embodiment of the present invention.

[0096] Referring to FIGS. 8 to 10, a display module (10) according to one embodiment includes a display panel (100) in which pixels (P) are arranged in two dimensions, and an image sensor (900) disposed behind the display panel (100).

[0097] The image sensor (900) is a semiconductor that converts incident light into a digital signal to acquire image data, and may be a CMOS image sensor using CMOS (Complementary Metal-Oxide Semiconductor). However, there are no restrictions on the type of image sensor (900), and a known type of image sensor may be used.

[0098] At this time, the display panel (100) may include a plurality of transparent regions (850) formed in an area (800) corresponding to the location of the image sensor (900) and arranged so that external light is incident on the image sensor (900). Depending on the embodiment, the plurality of transparent regions (850) may be formed with the same diameter as shown in FIG. 8.

[0099] Light incident from the front of the display panel (100) can pass through each of the plurality of transparent regions (850) and be incident on the image sensor (900), thereby allowing the image sensor (900) to acquire image data of an object located in front of the display panel (100).

[0100] That is, a display module (10) according to one embodiment can realize an under-display camera (UDC) function by providing an image sensor (900) at the rear of a display panel (100) and providing a plurality of transparent areas (850) through which light can pass on the display panel (100).

[0101] Each of the plurality of transparent areas (850) may be provided between the openings (AP) of each of two or more pixels (P). For example, as shown in FIG. 8, the transparent areas (850) may be provided between the openings (AP) of each of four pixels (P).

[0102] At this time, the transparent area (850) can be provided with a diameter smaller than the pixel spacing (PP) between pixels (P), for example, with a diameter smaller than the inorganic light-emitting element (120) which is approximately 100 micrometers.

[0103] Pixel spacing (PP) may be referred to as pixel pitch, and in the present embodiment, pixel spacing (PP) is defined as representing the distance from the center of one pixel to the center of an adjacent pixel.

[0104] Thus, the transparent area (850) is provided between the openings (AP) of the pixels (P) and is provided with a size smaller than the pixel spacing (PP) between the pixels (P), so as not to affect the two-dimensional arrangement of the pixels (P), the resolution of the display panel (100) can be maintained as when there is no transparent area (850). In other words, the display panel (100) of the present invention allows the pixel spacing (PP) between the pixels (P) to be maintained at a constant level even when including the transparent area (850).

[0105] The display panel (100) includes a pixel circuit (130) and a driving current (C) to an inorganic light-emitting element (120). D It includes a backplate (110) that supplies ) and an inorganic light-emitting element (120) formed on the backplate (110).

[0106] Additionally, the backplate (110) may include a transparent substrate (110a) and a signal electrode layer (110b) formed on the transparent substrate (110a) and including a pixel circuit layer and a plurality of electrode layers to transmit a control signal to an inorganic light-emitting element (120).

[0107] The transparent region (850) may include a pinhole (851) formed in the signal electrode layer (110b) as shown in FIG. 9, and a region (852) of the transparent substrate (110a) that overlaps with the pinhole (851) in one direction (y direction).

[0108] The diameter of the transparent area (850) can correspond to the diameter of the pinhole (851) formed in the signal electrode layer (110b), and as previously described, it can be provided with a diameter smaller than the pixel spacing (PP) between pixels (P).

[0109] In this way, the transparent area (850) can be formed with a diameter the size of a pinhole (851), and light emitted from an external object can pass through the transparent area (850) having a diameter the size of a pinhole (851) and produce an inverted image of the external object on the image sensor (900).

[0110] In other words, the display module (10) includes a transparent area (850) the size of a pinhole (851), thereby enabling the acquisition of image data of an external object through an image sensor (900) without a lens, such as a pinhole camera. In this way, the display module (10) of the present invention can reduce product costs by acquiring image data of an external object using only an image sensor (900) without a lens.

[0111] As illustrated in FIG. 10, when a black matrix layer (102) is formed on a backplate (110), the transparent region (850) may include a pinhole (853) of the black matrix layer (102), a pinhole (851) of the signal electrode layer (110b) that overlaps in one direction (y direction) with the pinhole (853) of the black matrix layer (102), and a region (852) of the transparent substrate (110a) that overlaps in one direction (y direction) with the pinhole (853) of the black matrix layer (102) and the pinhole (851) of the signal electrode layer (110b).

[0112] That is, light incident from the front of the display panel (100) can pass through the protective film (103) and be incident on the image sensor (900) through the transparent area (850). Specifically, light incident from the front of the display panel (100) can sequentially pass through the protective film (103), the pinhole (853) of the black matrix layer (102), the pinhole (851) of the signal electrode layer (110b), and the area (852) of the transparent substrate (110a), and finally be transmitted to the image sensor (900).

[0113] FIG. 11 is a side cross-sectional view showing a part of a display panel (100) including a transparent area (850) according to one embodiment of the present invention, FIG. 12 is a diagram showing an example of a method of electrically connecting a display panel (100) and a driver IC (200) in a display module (10) according to one embodiment of the present invention, and FIG. 13 is a diagram showing the arrangement relationship between a pixel (P) and a transparent area (850) in a display module (10) according to one embodiment of the present invention.

[0114] Referring to FIG. 11, a display panel (100) according to one embodiment includes a backplate (110) comprising a transparent substrate (110a) and a signal electrode layer (110b) formed on the transparent substrate (110a) to transmit a control signal to an inorganic light-emitting element (120), as previously described.

[0115] The transparent substrate (110a) can be implemented as one of a transparent material substrate, such as a glass substrate or a silicon substrate. Additionally, the signal electrode layer (110b) comprises a pixel circuit layer (112) on which a pixel circuit (130) is provided, and a power supply voltage (V DD ) or reference voltage (V SS It may include a plurality of electrode layers (611, 621, 631) that supply ).

[0116] A pixel circuit layer (112) can be formed on a transparent substrate (110a). Specifically, the pixel circuit layer (112) can be formed on the upper surface of the transparent substrate (110a) and can be provided on the upper surface of a buffer layer (111). The buffer layer (111) can provide a flat surface on the upper surface of the transparent substrate (110a) and can block foreign substances or moisture from penetrating through the transparent substrate (110a). For example, the buffer layer (111) may contain inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride, or organic materials such as polyimide, polyester, or acrylic, and may be formed as a plurality of laminates among the materials exemplified.

[0117] As previously described, the pixel circuit layer (112) may be provided with a pixel circuit (130), and the pixel circuit (130) may include a thin-film transistor (130a) disposed on the buffer layer (111). The thin-film transistor (130a) may include an active layer (131), a gate electrode (132), a drain electrode (133), and a source electrode (134). The active layer (131) may be made of a semiconductor material and may include a source region (131a), a drain region (131b), and a channel region (131c) between the source region (131a) and the drain region (131b).

[0118] The gate electrode (132) may be disposed on the upper part of the active layer (131) in correspondence with the channel region (131c). The source electrode (132) and the drain electrode (133) may be electrically connected to the source region (131a) and the drain region (131b) of the active layer (131), respectively. In this embodiment, the thin-film transistor (130a) is exemplified as a Top Gate Type in which the gate electrode (132) is disposed on the upper part of the active layer (131), but it is also possible for the gate electrode (132) to be disposed on the lower part of the active layer (131).

[0119] A first insulating layer (112b) made of an inorganic insulating material may be disposed between the active layer (131) and the gate electrode (132), and a second insulating layer (113a) may be disposed on the gate electrode (132). The first insulating layer (112b) may be a gate insulating layer, and the second insulating layer (113a) may be an interlayer insulating layer. In the present embodiment, the placement of one component on another component may include not only a structure in which the entirety of one component is located on top of another component, but also a structure in which one component surrounds or covers all or part of another component. Furthermore, the covering of one component by another component may include not only a structure in which one component completely covers another component, but also a case in which a hole is formed in one component and a part of the other component is exposed through said hole.

[0120] Accordingly, the gate insulating layer (112b) can be formed on the buffer layer (112a) on which the active layer (131) is disposed to cover the active layer (131), and the interlayer insulating layer (113a) can be formed on the gate insulating layer (112b) on which the gate electrode (132) is disposed to cover the gate electrode (132).

[0121] A source electrode (134) and a drain electrode (133) may be disposed on the interlayer insulating layer (113a). A hole may be formed at the location of the interlayer insulating layer (113a) and the gate insulating layer (112b) covering the source electrode (134) and the drain electrode (133), that is, at the location corresponding to the source electrode (134) and the drain electrode (133), and the source electrode (134) and the drain electrode (133) may be electrically connected to the source region (131a) and the drain region (131b) of the active layer (131), respectively, through the hole. In this embodiment, being electrically connected includes not only cases where electrically conductive materials are directly soldered, but also cases where they are connected via separate wiring, or cases where a current-carrying layer, such as an anisotropic conductive film (ACF), is placed between them. As long as current flows between the two connected components, there are no restrictions on the specific method of connection. In addition, in the embodiments described below, the connection of certain components may include being electrically connected.

[0122] A fourth insulating layer (113b) may be disposed on an interlayer insulating layer (113a) on which a source electrode (134) and a drain electrode (133) are disposed. The fourth insulating layer (113b) may be a flattening layer. The flattening layer (113b) may be disposed on an interlayer insulating layer (113a) on which a source electrode (134) and a drain electrode (133) are disposed, and may cover the source electrode (134), the drain electrode (133), and the interlayer insulating layer (113a).

[0123] A first power electrode layer (611) connected to a first power source (610) may be disposed on the flattening layer (113b). The first power electrode layer (611) is made of a conductive material such as metal and may be exposed from an insulating layer to be electrically connected to another electrode. For example, the first power electrode layer (611) may be electrically connected to the drain electrode (133) of a thin-film transistor (130a) and may be connected to the second power electrode layer (621) described later. That is, a hole may be formed at the location of the interlayer insulating layer (113a) corresponding to the drain electrode (133), and the first power electrode layer (611) may be electrically connected to the drain electrode (133) through the hole.

[0124] A fifth insulating layer (114a) covering the electrode pad of the first power electrode layer (611) may be disposed on the first power electrode layer (611), and a sixth insulating layer (114b) may be disposed on the fifth insulating layer (114a). For example, the fifth insulating layer (114a) may correspond to an interlayer insulating layer formed of an organic insulating material, and the sixth insulating layer (114b) may correspond to a flattening layer formed of an inorganic insulating material.

[0125] Additionally, a second power electrode layer (621) connected to a second power source (620) may be disposed on the flattening layer (114b). The second power electrode layer (621) is made of a conductive material such as metal and may be exposed from the insulating layer to be electrically connected to another electrode. For example, the second power electrode layer (621) may be electrically connected to the first power electrode layer (611) and may be connected to the third power electrode layer (631) described later. That is, a hole may be formed at the location of the interlayer insulating layer (114a) corresponding to the drain electrode (133), and the second power electrode layer (621) may be electrically connected to the first power electrode layer (611) through the hole.

[0126] A seventh insulating layer (115a) covering the electrode pad of the second power electrode layer (621) may be disposed on the second power electrode layer (621), and an eighth insulating layer (115b) may be disposed on the seventh insulating layer (115a). For example, the seventh insulating layer (115a) may correspond to an interlayer insulating layer formed of an organic insulating material, and the eighth insulating layer (115b) may correspond to a flattening layer formed of an inorganic insulating material.

[0127] Additionally, a third power electrode layer (631) connected to a third power source (630) may be disposed on the flattening layer (115b). The third power electrode layer (631) is made of a conductive material such as metal and may be exposed from the insulating layer and electrically connected to another electrode. For example, the second power electrode layer (631) may be electrically connected to the second power electrode layer (631) and may be electrically connected to the electrode pads (118a, 118b). That is, a hole may be formed at the location of the interlayer insulating layer (115a) corresponding to the drain electrode (133), and the second power electrode layer (621) may be electrically connected to the second power electrode layer (621) through the hole.

[0128] A ninth insulating layer (116a) covering the electrode pad of the third power electrode layer (631) may be disposed on the third power electrode layer (631), and a tenth insulating layer (116b) may be disposed on the ninth insulating layer (116a). For example, the ninth insulating layer (116a) may correspond to an interlayer insulating layer formed of an organic insulating material, and the tenth insulating layer (116b) may correspond to a flattening layer formed of an inorganic insulating material.

[0129] At this time, the ninth insulating layer (116a) may not be placed in the area corresponding to the opening (AP) where the inorganic light-emitting element (120) is located, and a hole may be formed in the tenth insulating layer (116b) so that the electrode pad (118a, 118b) to which the inorganic light-emitting element (120) can be electrically connected and the third power electrode layer (631) may be electrically connected.

[0130] According to the embodiment, if the second power source (620) is omitted, the second power source electrode layer (621) may be omitted, and only the first power source electrode layer (611) and the third power source electrode layer (631) may be provided.

[0131] Additionally, the display panel (100) may include an inorganic light-emitting element (120) that is electrically connected through electrode pads (118a, 118b) on a backplate (110). The anode (120a) and cathode (120b) of the inorganic light-emitting element (120) may be electrically connected to the corresponding electrode pads (118a, 118b).

[0132] Additionally, the display panel (100) may include a black matrix layer (102) that blocks light in an area excluding the opening (AP) of each of the plurality of pixels (P), which is disposed on a backplate (110).

[0133] Additionally, the display panel (100) may include a plurality of transparent areas (850) formed in an area corresponding to the location of the image sensor (900) and arranged so that external light is incident on the image sensor (900).

[0134] At this time, the transparent region (850) may include a plurality of pinholes (851a, 851b, 851c) formed in each of the plurality of power electrode layers (611, 621, 631) and overlapping in one direction (Y direction).

[0135] In addition, the transparent region (850) may include pinholes (851a, 851b, 851c) of each of the plurality of power electrode layers (611, 621, 631) and pinholes (853) of the black matrix layer (102) that overlap in one direction (Y direction).

[0136] That is, the first power electrode layer (611) may include a pinhole (851a) where no electrode is formed, and the second power electrode layer (621) may include a pinhole (851b) where no electrode is formed at a position corresponding to the pinhole (851a) of the first power electrode layer (611).

[0137] Additionally, the third power electrode layer (631) may include a pinhole (851c) in which no electrode is formed at a position corresponding to the pinhole (851b) of the second power electrode layer (621), and the black matrix layer (102) may include a pinhole (853) in which no black matrix is ​​formed at a position corresponding to the pinhole (851c) of the third power electrode layer (631).

[0138] Through this, light incident from the front of the display panel (100) can sequentially pass through the pinhole (853) of the black matrix layer (102) constituting the transparent area (850), the pinhole (851c) of the third power electrode layer (631), the pinhole (851b) of the second power electrode layer (621), and the pinhole (851a) of the first power electrode layer (631) to reach the image sensor (900).

[0139] At this time, the transparent region (850) may include a region of an insulating layer (111, 112a, 112b, 113a, 113b, 114a, 114b, 115a, 115b, 116a, 116b) that overlaps with the pinhole (851a, 851b, 851c, 853) in one direction (Y direction) and a region (852) of a transparent substrate (110a). That is, light incident from the front of the display panel (100) can pass through the pinholes (851a, 851b, 851c, 853) constituting the transparent area (850), the area of ​​the insulating layer (111, 112a, 112b, 113a, 113b, 114a, 114b, 115a, 115b, 116a, 116b), and the area (852) of the transparent substrate (110a) to reach the image sensor (900).

[0140] Additionally, the transparent region (850) may be formed in an area where the pixel circuit (130) of the pixel circuit layer (112) is not located. That is, the transparent region (850) may be formed in an area where the thin-film transistor (130a) is not provided, as shown in FIG. 11.

[0141] Additionally, the transparent area (850) may be formed in an area where the driver IC (200) is mounted as shown in FIGS. 11 and 12, and where the FPCB (201) electrically connected to the back plate (110) is not located.

[0142] An electrode layer (119) capable of being electrically connected to a driver IC (200) may be provided on the back surface of the transparent substrate (110a) of the backplate (110), and a first insulating layer (117a) covering an electrode pad may be disposed on the back surface of the electrode layer (119), and a second insulating layer (117b) may be disposed on the back surface of the first insulating layer (117a). For example, the first insulating layer (117a) may correspond to an interlayer insulating layer formed of an organic insulating material, and the second insulating layer (117b) may correspond to a flattening layer formed of an inorganic insulating material.

[0143] At this time, the 11th insulating layer (117a) may not be disposed in the area corresponding to the location of the FPCB (201), and a hole may be formed in the 12th insulating layer (117b) to provide an electrode pad (118c, 118d) that can be electrically connected to the electrode (201c, 201d) of the FPCB (201).

[0144] The transparent area (850) is formed in an area on the backplate (110) where the FPCB (201) is not located in the Y direction, thereby preventing light from being transmitted to the image sensor (900) by the FPCB (201).

[0145] To this end, as shown in FIG. 12, the image sensor (900) can also be provided in a rear area of ​​the backplate (110) that does not overlap with the FPCB (201).

[0146] However, depending on the embodiment, unlike as shown in FIG. 11 and FIG. 12, it is also possible to form a pinhole that overlaps with a transparent area (850) in one direction (Y direction) in the FPCB (201).

[0147] Additionally, the transparent area (850) may be formed in an area where the signal wiring of the pixel circuit layer (112) is not located, as illustrated in FIG. 13. Specifically, the transparent area (850) may be formed in an area where the scan line (1210) which is connected to the scan driver (210) and transmits a gate signal, and the data line (1220) which is connected to the data driver (220) and transmits a data signal, are not located. Additionally, as previously described, the transparent area (850) may be formed in an area (135) where the pixel circuit (130) is not located.

[0148] In this way, the transparent area (850) is provided in an area within the backplate (110) where the signal wiring (1210, 1220) and the pixel circuit (130) are not located, so that light incident from the front of the display panel (100) can pass through the backplate (110) and be transmitted to the image sensor (900).

[0149] FIG. 14 is a drawing showing a case in which a display module (10) according to one embodiment of the present invention includes transparent areas (850) having different diameters, and FIG. 15 and FIG. 17 are drawings showing an example of the arrangement of transparent areas (850) of a display module (10) according to one embodiment of the present invention.

[0150] Referring to FIG. 14, a display module (10) according to one embodiment may include a plurality of transparent areas (850) formed in an area (800) corresponding to the location of an image sensor (900) and arranged so that external light is incident on the image sensor (900).

[0151] A plurality of transparent regions (850) may include transparent regions (850a, 850b, 850c) having different diameters, as shown in FIG. 14, according to an embodiment.

[0152] For example, a plurality of transparent regions (850) may include at least one first transparent region (850a) having a first diameter, at least one second transparent region (850b) having a second diameter larger than the first diameter, and at least one third transparent region (850c) having a third diameter smaller than the first diameter.

[0153] Through this, the display module (10) can acquire high-precision image data with higher brightness. Specifically, the amount of light passing through the display panel (100) can be increased by the second transparent area (850b) which has a relatively large diameter, and the brightness of the image data can be increased. In addition, the precision of the image formed on the image sensor (900) can be increased by the third transparent area (850c) which has a relatively small diameter, and thus the precision of the image data can be increased.

[0154] In FIG. 14, transparent regions (850a, 850b, 850c) having three different diameters are described as an example, but the number of diameter types is not limited to three, and depending on the embodiment, it is also possible to provide three or more diameter types.

[0155] Additionally, a transparent area (850) with a smaller diameter closer to the center of an area (800) corresponding to the position of an image sensor (900) may be formed on the display panel (100). Through this, the display module (10) can acquire high-precision image data in the central area.

[0156] For example, as illustrated in FIG. 15, a third transparent area (850c) with a relatively small diameter may be provided at the center of the area (800) corresponding to the position of the image sensor (900), a second transparent area (850b) with a relatively large diameter may be provided at the boundary of the area (800) corresponding to the position of the image sensor (900), and a first transparent area (850a) may be provided between the center and the boundary of the area (800).

[0157] Additionally, a transparent area (850) with a larger diameter closer to the center of an area (800) corresponding to the position of an image sensor (900) may be formed on the display panel (100). Through this, the display module (10) can acquire image data with high brightness in the central area.

[0158] For example, as shown in FIG. 16, a second transparent area (850b) with a relatively large diameter may be provided at the center of the area (800) corresponding to the position of the image sensor (900), a third transparent area (850c) with a relatively small diameter may be provided at the boundary of the area (800) corresponding to the position of the image sensor (900), and a first transparent area (850a) may be provided between the center and the boundary of the area (800).

[0159] Additionally, on the display panel (100), a plurality of transparent areas (850) may be provided within an area (800) corresponding to the location of the image sensor (900), such that each of them has a diameter different from that of an adjacent transparent area. Through this, the display module (10) can acquire image data with constant brightness and precision across the entire area.

[0160] For example, as illustrated in FIG. 17, a first transparent area (850a) and a third transparent area (850c) may be alternately arranged in an area (800) corresponding to the location of the image sensor (900). In this case, one of the first transparent areas (850a) may be arranged between the third transparent areas (850c), and one of the third transparent areas (850c) may be arranged between the first transparent areas (850a), so that each of the plurality of transparent areas (850) may have a diameter of a different size from that of an adjacent transparent area.

[0161] FIGS. 18 and 19 are drawings illustrating examples of signals transmitted to a plurality of tiled display modules (10) in a display device (1) according to one embodiment.

[0162] Referring to FIG. 18, a plurality of display modules (10-1, 10-2, ..., 10-n) can be tiled to realize a display device (1) having a large-area screen. FIG. 18 and FIG. 19 are drawings illustrating a display device (1) on an XY plane, so only a one-dimensional arrangement of display modules (10-1, 10-2, ..., 10-P) is shown; however, as explained above with reference to FIG. 1, it is of course possible for a plurality of display modules (10-1, 10-2, ..., 10-n) to be arranged in two dimensions.

[0163] Referring again to FIG. 12 described above, the display panel (100) can be connected to an FPCB (205) on which a driver IC (200) is mounted. The FPCB (205) is connected to a driving board (501) to electrically connect the display module (10) to the driving board (501).

[0164] A timing control unit (500) may be provided in the driving board (501). Accordingly, the driving board (501) may be referred to as a T-con board. A plurality of display modules (10-1, 10-2, ..., 10-n) may receive image data, timing control signals, etc. from the driving board (501).

[0165] Referring to FIG. 19, the display device (1) may further include a main board (301) and a power board (601). The main board (301) is provided with the aforementioned main control unit (300), and the power board (601) may be provided with a power circuit necessary to supply power to a plurality of display modules (10-1, 10-2, ..., 10-n).

[0166] The power board (601) can be electrically connected to a plurality of display modules (10-1, 10-2, ..., 10-n) through an FPCB, and the power voltage (V) to the plurality of display modules (10-1, 10-2, ..., 10-n) connected through the FPCB. DD ), reference voltage (V SS It can supply ) etc.

[0167] In the example described above, it was explained that multiple display modules (10-1, 10-2, ..., 10-P) share a driving board (501), but it is also possible to have a separate driving board (501) connected to each individual display module (10). Alternatively, it is possible to group multiple display modules (10-1, 10-2, ..., 10-P) and connect one driving board (501) per group.

[0168] Additionally, in FIG. 18 and FIG. 18, an image sensor (900) is provided in each of the plurality of display modules (10) included in the display device (1), but this is not limited thereto, and according to the embodiment, there is no limit to the number of display modules (10) in which the image sensor (900) is provided, such as in one of the plurality of display modules (10) included in the display device (1).

[0169] FIG. 20 is a drawing showing an example of a method in which a plurality of display modules (10) are coupled to a housing in a display device (1) according to one embodiment.

[0170] As described above, a plurality of display modules (10) can be arranged in a two-dimensional matrix form and fixed to a housing (20). Referring to the example of FIG. 20, a plurality of display modules (10) can be installed on a frame (21) located below them, and the frame (21) may have a two-dimensional mesh structure in which some areas corresponding to the plurality of display modules (10) are open.

[0171] Specifically, the frame (21) may have openings (21H) equal to the number of display modules (10), and the openings (21H) may have the same arrangement as the plurality of display modules (10).

[0172] Meanwhile, a plurality of display modules (10) may be mounted on the frame (21) by using magnetic force from a magnet, by being joined by a mechanical structure, or by being bonded by an adhesive. There are no restrictions on the method by which the display modules (10) are mounted on the frame (21).

[0173] The driving board (501), main board (301), and power board (601) can be placed at the bottom of the frame (21) and can be electrically connected to each of the multiple display modules (10) through an opening (21H) formed in the frame (21).

[0174] A lower cover (22) is attached to the lower part of the frame (21), and the lower cover (22) can form the lower surface of the display device (1).

[0175] In the example above, the case where the display module (10) is arranged in two dimensions was given as an example, but it is also possible for the display module (10) to be arranged in one dimension, and in this case, the structure of the frame (21) can also be transformed into a one-dimensional mesh structure.

[0176] FIG. 21 is a flowchart of a method for manufacturing a display module (10) according to one embodiment of the present invention.

[0177] Referring to FIG. 21, a pixel circuit layer (112) is formed on a transparent substrate (110a) (2110).

[0178] The transparent substrate (110a) can be implemented as one of the substrates of a transparent material, such as a glass substrate, a silicon substrate, etc.

[0179] The pixel circuit layer (112) can be formed on a transparent substrate (110a). Specifically, the pixel circuit layer (112) can be formed on the upper surface of the transparent substrate (110a) and can be provided on the upper surface of the buffer layer (111).

[0180] As previously described, the pixel circuit layer (112) may be provided with a pixel circuit (130), and the pixel circuit (130) may include a thin-film transistor (130a) disposed on the buffer layer (111). The thin-film transistor (130a) may include an active layer (131), a gate electrode (132), a drain electrode (133), and a source electrode (134).

[0181] In addition, a backplate (110) can be manufactured by forming a plurality of power electrode layers (611, 621, 631) having pinholes (851a, 851b, 851c) formed on the pixel circuit layer (112) (2120).

[0182] That is, during the manufacturing process of the display module (10), a transparent area (850) is formed by forming pinholes (851a, 851b, 851c) in which no electrodes are formed on each of the power electrode layers (611, 621, 631).

[0183] Additionally, an inorganic light-emitting element (120) can be transferred onto the backplate (110) (2130), a black matrix layer (102) with a pinhole (853) formed on the backplate (110) can be formed (2140), and an image sensor (900) can be placed behind the backplate (110) (2150).

[0184] At this time, the transparent region (850) may include a plurality of pinholes (851a, 851b, 851c) formed in each of the plurality of power electrode layers (611, 621, 631) and overlapping in one direction (Y direction).

[0185] In addition, the transparent region (850) may include pinholes (851a, 851b, 851c) of each of the plurality of power electrode layers (611, 621, 631) and pinholes (853) of the black matrix layer (102) that overlap in one direction (Y direction).

[0186] That is, the first power electrode layer (611) may include a pinhole (851a) where no electrode is formed, and the second power electrode layer (621) may include a pinhole (851b) where no electrode is formed at a position corresponding to the pinhole (851a) of the first power electrode layer (611).

[0187] Additionally, the third power electrode layer (631) may include a pinhole (851c) in which no electrode is formed at a position corresponding to the pinhole (851b) of the second power electrode layer (621), and the black matrix layer (102) may include a pinhole (853) in which no black matrix is ​​formed at a position corresponding to the pinhole (851c) of the third power electrode layer (631).

[0188] Through this, light incident from the front of the display panel (100) can sequentially pass through the pinhole (853) of the black matrix layer (102) constituting the transparent area (850), the pinhole (851c) of the third power electrode layer (631), the pinhole (851b) of the second power electrode layer (621), and the pinhole (851a) of the first power electrode layer (631) to reach the image sensor (900).

[0189] At this time, the transparent region (850) may include a region of an insulating layer (111, 112a, 112b, 113a, 113b, 114a, 114b, 115a, 115b, 116a, 116b) that overlaps with the pinhole (851a, 851b, 851c, 853) in one direction (Y direction) and a region (852) of a transparent substrate (110a). That is, light incident from the front of the display panel (100) can pass through the pinholes (851a, 851b, 851c, 853) constituting the transparent area (850), the area of ​​the insulating layer (111, 112a, 112b, 113a, 113b, 114a, 114b, 115a, 115b, 116a, 116b), and the area (852) of the transparent substrate (110a) to reach the image sensor (900).

[0190] Additionally, a driver IC (200) can be connected to the backplate (110) (2160). Specifically, an FPCB (201) with a driver IC (200) mounted on it can be connected to the backplate (110).

[0191] The transparent area (850) is formed in an area on the backplate (110) where the FPCB (201) is not located in the Y direction, thereby preventing light from being transmitted to the image sensor (900) by the FPCB (201).

[0192] Meanwhile, the disclosed embodiments may be implemented in the form of a recording medium that stores instructions executable by a computer. The instructions may be stored in the form of program code and, when executed by a processor, may generate a program module to perform the operation of the disclosed embodiments. The recording medium may be implemented as a computer-readable recording medium.

[0193] Computer-readable recording media include all types of recording media that store instructions that can be decoded by a computer. Examples include ROM (read-only memory), RAM (random access memory), magnetic tape, magnetic disk, flash memory, optical data storage devices, etc.

[0194] As described above, the disclosed embodiments have been explained with reference to the attached drawings. Those skilled in the art will understand that the present invention may be practiced in forms different from the disclosed embodiments without changing the technical spirit or essential features of the invention. The disclosed embodiments are illustrative and should not be interpreted restrictively. Explanation of the symbols

[0195] 1: Display device 10: Display module 100: Display panel 110: Backplate 120: Inorganic light-emitting element 130: Pixel circuit 200: Driver IC 201: FPCB 850: Transparent area 900: Image sensor

Claims

Claim 1 A display module comprising: a display panel having a plurality of pixels arranged thereon; and an image sensor provided on one side of the display panel; wherein each of the plurality of pixels is composed of two or more inorganic light-emitting elements, and the display panel comprises a transparent substrate, a signal electrode layer provided on the transparent substrate and transmitting a control signal to each of the plurality of pixels, and a plurality of transparent regions provided in an area between at least two of the plurality of pixels, corresponding to the position of the image sensor, and provided so that external light is incident on the image sensor; wherein each of the plurality of transparent regions includes a pinhole provided on the signal electrode layer and a region provided on the transparent substrate at a position overlapping with the pinhole. Claim 2 In claim 1, the display panel further comprises a black matrix (BM) layer provided on the transparent substrate, wherein the black matrix layer is provided in an area excluding the arrangement area of ​​the plurality of pixels and blocks light emitted from the plurality of pixels; and each of the plurality of transparent areas comprises a pinhole provided in the black matrix layer and positioned at a location corresponding to a pinhole of the signal electrode layer. Claim 3 In claim 1, the signal electrode layer comprises a pixel circuit layer having a pixel circuit that outputs a driving current for input to each of the plurality of pixels, and each of the plurality of transparent regions is provided in a region where the pixel circuit of the pixel circuit layer is not located. Claim 4 In claim 1, the signal electrode layer comprises a pixel circuit layer having a pixel circuit that outputs a driving current for inputting to each of the plurality of pixels, and each of the plurality of transparent regions is provided in a region where the signal wiring of the pixel circuit layer is not located. Claim 5 In claim 4, the display module further comprises: a driver IC that transmits a driving signal to a pixel circuit of the pixel circuit layer; and an FPCB on which the driver IC is mounted and which is electrically connected to the transparent substrate, wherein each of the plurality of transparent regions is provided in a region where the FPCB is not located. Claim 6 In claim 1, the diameters of the plurality of transparent regions are the same for the display module. Claim 7 In claim 1, the diameters of the plurality of transparent regions are different from each other in the display module. Claim 8 A display module according to claim 7, wherein the plurality of transparent regions comprises: at least one first transparent region having a first diameter; at least one second transparent region having a second diameter larger than the first diameter; and at least one third transparent region having a third diameter smaller than the first diameter. Claim 9 In claim 7, the plurality of transparent regions are a display module having a smaller diameter the closer they are to the center of the region corresponding to the position of the image sensor. Claim 10 In claim 7, the plurality of transparent regions are a display module having a larger diameter the closer they are to the center of the region corresponding to the position of the image sensor. Claim 11 In claim 7, each of the plurality of transparent regions is a display module having a diameter of a different size from that of an adjacent transparent region. Claim 12 In claim 1, the image sensor is a display module that acquires image data by detecting external light incident through each of the plurality of transparent regions. Claim 13 A display device comprising: a plurality of display modules including a plurality of pixels; and a frame supporting the plurality of display modules; wherein at least one of the plurality of display modules comprises a display panel having a plurality of pixels arranged thereon and an image sensor provided on one side of the display panel; wherein each of the plurality of pixels is composed of two or more inorganic light-emitting elements; and wherein the display panel comprises a transparent substrate, a signal electrode layer provided on the transparent substrate and transmitting a control signal to each of the plurality of pixels, and a plurality of transparent regions provided in an area between at least two of the plurality of pixels, corresponding to the position of the image sensor, and provided so that external light is incident on the image sensor; and wherein each of the plurality of transparent regions comprises a pinhole provided on the signal electrode layer and a region provided on the transparent substrate at a position overlapping with the pinhole. Claim 14 In claim 13, the display panel further comprises a black matrix (BM) layer provided on the transparent substrate, excluding the area where the plurality of pixels are arranged, and which blocks light emitted from the plurality of pixels; and each of the plurality of transparent areas comprises a pinhole provided on the black matrix layer and positioned at a location corresponding to a pinhole of the signal electrode layer. Claim 15 In claim 13, the signal electrode layer comprises a pixel circuit layer having a pixel circuit that outputs a driving current for inputting to each of the plurality of pixels, and each of the plurality of transparent regions is provided in a region where the pixel circuit of the pixel circuit layer is not located. Claim 16 In claim 13, the signal electrode layer comprises a pixel circuit layer having a pixel circuit that outputs a driving current for inputting to each of the plurality of pixels, and each of the plurality of transparent regions is provided in a region where the signal wiring of the pixel circuit layer is not located. Claim 17 In claim 16, the at least one display module further comprises: a driver IC that transmits a driving signal to a pixel circuit of the pixel circuit layer; and an FPCB on which the driver IC is mounted and which is electrically connected to the transparent substrate; and each of the plurality of transparent regions is provided in a region where the FPCB is not located. Claim 18 In paragraph 13, the diameters of the plurality of transparent regions are different from each other in the display device. Claim 19 A display device according to claim 18, wherein the plurality of transparent regions comprises: at least one first transparent region having a first diameter; at least one second transparent region having a second diameter larger than the first diameter; and at least one third transparent region having a third diameter smaller than the first diameter. Claim 20 In claim 18, the plurality of transparent regions are a display device having a smaller diameter the closer they are to the center of the region corresponding to the position of the image sensor.

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