Showerhead assembly

Abstract

The present invention relates to a showerhead assembly, and more specifically, to a showerhead assembly that prevents the first effect caused by the temperature inside the chamber not reaching an appropriate temperature when a substrate is first introduced into the chamber after the start of the process, and furthermore, can heat the substrate to an appropriate process temperature.

Description

Technology Field

[0001] The present invention relates to a showerhead assembly, and more specifically, to a showerhead assembly that prevents the first effect caused by the temperature inside the chamber not reaching an appropriate temperature when a substrate is first introduced into the chamber after the start of the process, and furthermore, can heat the substrate to an appropriate process temperature. Background Technology

[0002] Generally, in the case of a conventional substrate processing device, processes such as deposition and etching can be performed on the upper surface of the substrate, or processes such as deposition and etching can be performed on the lower surface of the substrate.

[0003] In this case, in the case of a conventional substrate processing apparatus that provides processes such as deposition and etching on the upper surface of a substrate, a so-called 'first effect' may occur in which the temperature inside the chamber does not reach an appropriate temperature when the substrate is first introduced into the chamber, and the processing process for the substrate does not proceed smoothly.

[0004] In addition, in the case of other conventional substrate processing devices that provide processes such as deposition and etching on the lower surface of a substrate, process equipment is provided on the lower surface of the substrate, making it difficult to provide a separate means for heating the substrate. The problem to be solved

[0005] The present invention aims to solve the above-mentioned problems by providing a showerhead assembly that prevents the first effect, which occurs when the temperature inside the chamber does not reach an appropriate temperature when a substrate is first introduced into the chamber after the start of the process, and further enables the substrate to be heated to an appropriate process temperature. means of solving the problem

[0006] The objective of the present invention as described above can be achieved by a showerhead assembly characterized by comprising: a main cover connected to a chamber lid; a showerhead heater connected to the lower part of the main cover, supplying process gas toward the interior of the chamber and heating a substrate, and having a stem connected to the main cover and formed to protrude toward the upper part; an O-ring sealing between the stem and the main cover; and a cooling channel provided on the main cover and disposed adjacent to the O-ring.

[0007] Here, the showerhead heater further comprises a face plate having a spray hole formed therein for spraying process gas toward the substrate, and a back plate connected to the upper part of the face plate and having a plurality of heater parts, and the stem can connect the back plate and the main cover.

[0008] In addition, a process gas supply pipe that supplies process gas between the back plate and the face plate by penetrating the stem, and a power rod that supplies power to the heater unit may be arranged.

[0009] Meanwhile, RF power is supplied to the main cover, and the stem, the backplate, and the faceplate are electrically connected to the main cover so that RF power is supplied to form electrodes.

[0010] Furthermore, a hollow portion may be formed on the inner side of the above stem. Effects of the invention

[0011] According to the present invention having the above-described configuration, the first effect is prevented by providing heat through a showerhead heater, and furthermore, the substrate can be heated to an appropriate process temperature.

[0012] In addition, according to the present invention, by positioning the heater part and the O-ring as far apart as possible and further providing a cooling channel, damage or breakage of the O-ring caused by heat generation in the heater part can be prevented. Brief explanation of the drawing

[0013] FIG. 1 is a perspective view of a shower head assembly according to one embodiment of the present invention, FIG. 2 is an exploded perspective view of a shower head assembly, Figure 3 is a side cross-sectional view of a shower head assembly. Specific details for implementing the invention

[0014] Hereinafter, the structure of a shower head assembly according to an embodiment of the present invention will be examined in detail with reference to the drawings.

[0015] FIG. 1 is a perspective view of a shower head assembly (1000) according to one embodiment of the present invention, FIG. 2 is an exploded perspective view of the shower head assembly (1000), and FIG. 3 is a side cross-sectional view of the shower head assembly (1000).

[0016] Referring to FIGS. 1 to 3, the shower head assembly (1000) may be equipped with a main cover (300) connected to a chamber lid (10) and supplied with RF power, and a shower head heater (500) connected to the lower part of the main cover (300), electrically connected to the main cover (300), and supplying process gas toward the inside of a chamber (not shown) and heating a substrate (not shown).

[0017] The shower head assembly (1000) according to the present invention is largely composed of a main cover (300) and a shower head heater (500), and RF power is supplied to enable substrate processing using plasma. In this case, RF power is supplied to the main cover (300) of the shower head assembly (1000), and the shower head heater (500) is electrically connected to the main cover (300) to supply RF power.

[0018] Accordingly, the shower head heater (500) is electrically connected to the main cover (300) to achieve equipotentiality. Even when plasma is generated between the shower head heater (500) and the lower electrode inside the chamber to process the substrate, so-called 'parasitic plasma' is not generated between the main cover (300) and the shower head heater (500). This will be examined in detail below.

[0019] The main cover (300) may be provided with a main plate (340) that is insulated from and connected to the chamber lid (10), and a cover plate (310) that is connected to the upper part of the main plate (340) and protrudes upward. Although the main plate (340) and the cover plate (310) are depicted as separate components in the drawing, they are not limited thereto, and it is also possible for the main plate (340) and the cover plate (310) to be composed of a single component.

[0020] The main plate (340) may be configured in a circular shape with an opening (344) formed in the center. Here, the term 'circular' is merely an example and can be configured in various shapes.

[0021] As described above, the main plate (340) may be provided with an RF power supply unit (342) to which RF power is supplied. RF power provided from an RF power supply unit (not shown) is supplied to the main plate (340) through the RF power supply unit (342).

[0022] The main plate (340) is insulated from the chamber lid (10). For example, a first insulator (600) may be placed between the main plate (340) and the chamber lid (10) to provide insulation.

[0023] Meanwhile, the main plate (340) may be provided with a first cooling channel (344, 346) through which cooling water flows. Even when the shower head heater (500) heats the substrate, the temperature of the main plate (340) can be cooled by the first cooling channel (344, 346) to prevent overheating.

[0024] The cover plate (310) is connected to the upper surface of the main plate (340). The cover plate (310) may be provided in a shape that protrudes upward. A process gas supply hole (315) through which process gas, etc. is supplied is formed in the central part of the protruding upper surface of the cover plate (310). Process gas, etc. is supplied to the shower head heater (500) through the process gas supply hole (315).

[0025] Meanwhile, the cover plate (310) is provided with a second cooling channel (318) through which cooling water flows. The second cooling channel (318) cools the cover plate (310) while maintaining the temperature of various O-rings (810, 820) to prevent the O-rings (810, 820) from being damaged.

[0026] That is, the cover plate (310) is connected to the shower head heater (500) and the second insulator (100) described later, and various O-rings (810, 820) for sealing are placed between the stem (510) of the shower head heater (500) and between the second insulator (100).

[0027] In this case, the O-ring (810) between the stem (510) and the cover plate (310) may be positioned between the uppermost surface of the protrusion of the stem (510) and the lower surface of the cover plate (310). Additionally, the O-ring (820) between the cover plate (310) and the second insulator (100) may be positioned between the uppermost surface of the cover plate (310) and the lower surface of the second insulator (100).

[0028] If the cover plate (310) is provided in a simply flat shape, the gap between the shower head heater (500) and the O-rings (810, 820) becomes too close, and the O-rings (810, 820) may burn and break due to the heat emitted from the shower head heater (500).

[0029] Accordingly, in order to solve these problems, the cover plate (310) and the stem (510) are configured to protrude upward, and furthermore, by placing an O-ring (810, 820) on the protruding uppermost surface of the cover plate (310) and the stem (510), the distance between the heater part (532) of the shower head heater (500) and the O-ring (810, 820) is placed as far as possible to primarily prevent damage to the O-ring (810, 820).

[0030] In addition, in the case of the present invention, a second cooling channel (318) is arranged in the cover plate (310) to prevent the O-ring (810, 820) from overheating, thereby secondarily preventing damage to the O-ring (810, 820).

[0031] The second insulator (100) may be connected to the upper portion of the cover plate (310). The second insulator (100) is provided for insulating the cover plate (310) from other components.

[0032] A fastening hole (130) is formed in the second insulator (100), and it can be connected to the upper surface of the cover plate (310) through a fastening means (140), such as a bolt. In this case, an opening (110) may be formed in the inner central part of the second insulator (100). Accordingly, as described later, various lines for supplying process gas, etc., can be arranged by passing through the opening (110).

[0033] Meanwhile, the shower head heater (500) may be connected and positioned at the lower part of the aforementioned main cover (300). That is, the shower head heater (500) may be positioned at the lower part of the main plate (340) at a predetermined distance from the main plate (340).

[0034] For example, the shower head heater (500) may have a face plate (550) having a spray hole (552) formed therein for spraying process gas toward the substrate, a back plate (530) connected to the upper part of the face plate (550) and having a plurality of heater parts (532), and a stem (510) formed protruding upward and connecting the back plate (530) and the cover plate (310).

[0035] The above face plate (550) is positioned toward the substrate and supplies process gas, etc. toward the substrate through the injection hole (552).

[0036] The back plate (530) is positioned on the upper part of the face plate (550). In this case, the back plate (530) and the face plate (550) are spaced apart, so that the space between the back plate (530) and the face plate (550) forms a dispersion space (556) in which process gas, etc., is dispersed.

[0037] Meanwhile, in the case of the shower head assembly (1000) according to the present invention, a plurality of heater parts (532) may be provided on the back plate (530) to provide heat.

[0038] In the case of a conventional substrate processing apparatus that provides processes such as deposition on the upper surface of a substrate, a so-called 'first effect' may occur when the substrate is first introduced into the chamber, as the temperature inside the chamber does not reach an appropriate temperature, preventing the processing of the substrate from proceeding smoothly. In the present invention, the aforementioned first effect can be minimized by heating the inside of the chamber with the backplate (530).

[0039] In addition, in the case of other conventional substrate processing devices that provide processes such as deposition on the lower surface of a substrate, deposition equipment is provided on the lower surface of the substrate, making it difficult to provide a separate means for heating the substrate. In the present invention, the substrate can be heated to an appropriate temperature required for the process by the backplate (530), thereby allowing the processing process for the substrate to proceed smoothly.

[0040] Meanwhile, the stem (510) connects the backplate (530) and the cover plate (310) to each other. In this case, the stem (510) physically connects the backplate (530) and the cover plate (310) while simultaneously connecting them electrically. Accordingly, the RF power supplied to the main plate (340) is supplied to the backplate (530) and the face plate (550) via the cover plate (310) and the stem (510).

[0041] The stem (510) has a shape that protrudes upward from the back plate (530). In this case, the external shape of the stem (510) is formed to correspond to the internal shape of the aforementioned cover plate (310).

[0042] As described above, by placing the O-ring (810, 820) on the protruding uppermost surface of the stem (510), it is spaced as far as possible from the heater part (532) of the backplate (530). Since this has already been described above, a repetitive explanation is omitted.

[0043] Meanwhile, a process gas supply pipe (316) may be disposed through the stem (510). The process gas supply pipe (316) may be disposed through the opening (110) of the second insulator (100), the process gas supply hole (315) of the cover plate (310), and the through hole (514) of the stem (510). A process gas for processing a substrate is supplied through the process gas supply pipe (316). In this case, the process gas may include an inert gas. For example, when the showerhead assembly (1000) according to the present invention is used in a substrate processing device that deposits on the lower surface of a substrate, an inert gas may be supplied toward the upper surface of the substrate through the process gas supply pipe (316).

[0044] The lower end of the above process gas supply pipe (316) is connected to the dispersion space (556) between the back plate (530) and the face plate (550), thereby supplying process gas, etc. to the dispersion space (556).

[0045] Meanwhile, a power rod (320) that supplies power to the heater part (532) may be disposed on the inner side of the above stem (510).

[0046] For example, a first connection hole (314) may be formed in the cover plate (310), and a second connection hole (512) corresponding to the first connection hole (314) may be formed in the stem (510). A power rod (320) may be positioned through the first connection hole (314) and the second connection hole (512).

[0047] In this case, a fixing part (322) for fixing the power load (320) may be provided on the inner side of the stem (510). Since RF power is supplied to the stem (510) as described above, it is preferable that the fixing part (322) be made of an insulating material and provided to be insulated from the stem (510).

[0048] The lower part of the power load (320) is connected to the aforementioned heater part (532) to provide the necessary power to the heater part (532).

[0049] Meanwhile, a hollow portion (518) filled with air is provided on the inner side of the stem (510). That is, a hollow portion (518) filled with air is provided on the inner side of the stem (510), excluding the aforementioned process gas supply pipe (316) and power rod (320). This hollow portion (518) can serve as an insulating space to prevent heat from the heater portion (532) from being transferred to and lost to the O-ring (810, 820), etc., on the upper side of the stem (510). Furthermore, even when a hollow portion (518) is provided on the inner side of the stem (510), RF power is supplied along the surface of the stem (510) due to the skin effect, so no loss of RF power occurs.

[0050] Meanwhile, the shower head assembly (1000) according to the present invention can supply a curtain gas composed of an inert gas, etc., along the outer surface of the shower head heater (500). The curtain gas ensures that the process gas supplied from the face plate (550) is supplied only toward the upper surface of the substrate and prevents the process gas from being supplied to other areas.

[0051] When the showerhead assembly (1000) according to the present invention is used in a substrate processing device for depositing a thin film on the lower surface of a substrate, an inert gas can be supplied toward the upper surface of the substrate through the face plate (550) together with the curtain gas. The inert gas supplied from the face plate (550) prevents deposition on the upper surface of the substrate, and the curtain gas can suppress the phenomenon of the process gas flowing backward due to the confluence of the process gas flowing upward around the edge of the substrate and the inert gas flowing downward.

[0052] As shown in FIG. 3, a curtain gas supply channel (312) through which curtain gas is supplied by penetrating the cover plate (310) may be provided to supply the curtain gas.

[0053] Specifically, a curtain gas supply hole (120) is formed in the aforementioned second insulator (100), and the upper portion of the curtain gas supply path (312) of the cover plate (310) is connected to the curtain gas supply hole (120).

[0054] Meanwhile, the lower portion of the curtain gas supply channel (312) is provided through the curtain gas connection channel (700) so that curtain gas is supplied along the outer surface of the shower head heater (500).

[0055] Here, the curtain gas connection channel (700) is not composed of a separate gas pipe or pipe, but is provided by utilizing the space or gap between the components described above. Therefore, the cost and time required for configuring a separate channel can be reduced, and the channel can be formed with a simpler configuration.

[0056] Specifically, the curtain gas connection channel (700) may be composed of a first channel (705) between the lower surface of the cover plate (310) and the upper surface of the main plate (340), a second channel (710) between the outer wall of the stem (510) and the inner wall of the opening (344) of the main plate (340), a third channel (712) between the upper surface of the back plate (530) and the lower surface of the main plate (340), and a fourth channel (714) between the shower head heater (500) and the chamber lid (10).

[0057] The aforementioned curtain gas supply channel (312) can be connected from the upper surface to the lower surface of the cover plate (310). In this case, the lower surface of the cover plate (310) and the upper surface of the main plate (340) are partially spaced apart to form the first channel (705), and the curtain gas supply channel (312) can be connected to the first channel (705).

[0058] Meanwhile, the aforementioned stem (510) may be connected to the cover plate (310) at a predetermined distance from the inner surface of the opening (344) of the main plate (340). In this case, the space between the outer wall of the stem (510) and the inner wall of the opening (344) of the main plate (340) may form a second flow path (710).

[0059] The second flow path (710) can be connected to the third flow path (712) between the upper surface of the back plate (530) and the lower surface of the main plate (340) at the bottom. Additionally, the third flow path (712) is connected to the fourth flow path (714) between the shower head heater (500) and the chamber lid (10). Since the first insulator (600) that insulates the main plate (340) is disposed on the chamber lid (10), the fourth flow path (714) can be formed substantially between the shower head heater (500) and the first insulator (600).

[0060] Accordingly, the curtain gas supplied through the curtain gas supply path (312) can be supplied along the outer surface of the shower head heater (500) via the aforementioned first path (705), second path (710), third path (712) and fourth path (714).

[0061] Meanwhile, if the width of the aforementioned fourth channel (714), that is, the width between the shower head heater (500) and the first insulator (600), becomes too large, a large amount of curtain gas is required to maintain the effect of the curtain gas. Therefore, the width of the fourth channel (714) can be maintained at a distance of approximately 1 to 10 mm, and preferably at a distance of approximately 4 to 8 mm.

[0062] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may modify and change the present invention in various ways without departing from the spirit and scope of the invention as described in the claims below. Therefore, if a modified embodiment basically includes the components of the claims of the present invention, it should be considered to be included within the technical scope of the present invention. Explanation of the symbols

[0063] 10: Chamber Lead 100 : Second insulator 300 : Main Cover 310 : Cover plate 340 : Main plate 500 : Shower head heater 510 : Stem 530 : Backplate 550 : Faceplate 600 : First insulator 700 : Curtain gas connection path

Claims

Claim 1 A showerhead assembly comprising: a main cover connected to a chamber lid; a showerhead heater connected to the lower part of the main cover, supplying process gas toward the interior of the chamber and heating a substrate, and having a stem connected to the main cover and protruding upward; an O-ring sealing between the stem and the main cover; and a cooling channel provided on the main cover and disposed adjacent to the O-ring; wherein the main cover comprises a main plate connected to the chamber lid insulated from the main plate and a cover plate connected to the upper part of the main plate, the O-ring is disposed between the stem and the cover plate, and the cooling channel is provided on the cover plate, and the showerhead heater comprises a face plate having a spray hole formed for spraying process gas toward the substrate and a back plate connected to the upper part of the face plate and having a plurality of heater parts, and the stem connects the back plate and the cover plate. Claim 2 delete Claim 3 A shower head assembly according to claim 1, characterized in that a process gas supply pipe that supplies process gas between the back plate and the face plate by penetrating the stem, and a power rod that supplies power to the heater part are arranged. Claim 4 A shower head assembly according to claim 1, characterized in that RF power is supplied to the main cover, and the stem, the back plate, and the face plate are electrically connected to the main cover so that RF power is conducted to form electrodes. Claim 5 A shower head assembly characterized in that, in claim 1, a hollow portion is formed on the inner side of the stem.

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