Display device

Abstract

The present invention relates to a display device capable of preventing organic light-emitting elements of light-emitting parts adjacent to an inorganic encapsulation region from being damaged by air or moisture. A display device according to one embodiment comprises a substrate including a display region and a non-display region, a pixel electrode disposed on the display region of the substrate, an organic light-emitting layer disposed on the pixel electrode, a common electrode disposed on the organic light-emitting layer, a first encapsulation inorganic film disposed on the common electrode, an encapsulation organic film disposed on the first encapsulation inorganic film, a second encapsulation inorganic film disposed on the encapsulation organic film, a dam disposed on the non-display region of the substrate, a bank disposed on the non-display region of the substrate and disposed outside the dam, an inorganic encapsulation region disposed between the dam and the bank in the non-display region of the substrate, a dam region where the dam is disposed in the non-display region of the substrate, a bank region where the bank is disposed, and a first power line disposed in the inorganic encapsulation region. The first power wiring comprises a first sub-power wiring and a plurality of moisture-proof patterns protruding from one side of the first sub-power wiring and disposed in the inorganic bag area. The length of the plurality of moisture-proof patterns per unit area in the inorganic bag area is different from the length of the plurality of moisture-proof patterns per unit area in the bank area.

Description

Technology Field

[0001] The present invention relates to a display device. Background Technology

[0002] As the information society develops, the demand for display devices to show images is increasing in various forms. For example, display devices are being applied to a wide range of electronic devices, such as smartphones, digital cameras, laptop computers, navigation systems, and smart televisions.

[0003] The display device may be a flat panel display device such as a Liquid Crystal Display Device, a Field Emission Display Device, or a Light Emitting Display Device. The Light Emitting Display Device includes an organic light-emitting display device comprising an organic light-emitting element, an inorganic light-emitting display device comprising an inorganic light-emitting element such as an inorganic semiconductor, and a micro-light-emitting display device comprising an ultra-solid light-emitting element.

[0004] Recently, display devices minimize the bezel area or non-display area excluding the display area to expand the display area where light-emitting elements that display images are placed. If the display device is an organic light-emitting display device containing organic light-emitting elements, an inorganic encapsulation area for encapsulating the organic light-emitting elements of the light-emitting elements may be placed in the non-display area. However, as the bezel area or non-display area is minimized, the width of the inorganic encapsulation area may be reduced. Consequently, if air gaps occur in the inorganic encapsulation area, the path for air or moisture permeation is shortened, making the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation area susceptible to damage by air or moisture. Organic light-emitting elements of the light-emitting parts damaged by air or moisture may appear as black spots. The problem to be solved

[0005] The problem that the present invention aims to solve is to provide a display device capable of preventing organic light-emitting elements of light-emitting parts adjacent to the inorganic encapsulation region from being damaged by air or moisture, even if the width of the inorganic encapsulation region is reduced.

[0006] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0007] A display device according to one embodiment for solving the above problem comprises a substrate including a display area and a non-display area, a pixel electrode disposed on the display area of ​​the substrate, an organic light-emitting layer disposed on the pixel electrode, a common electrode disposed on the organic light-emitting layer, a first encapsulating inorganic film disposed on the common electrode, an encapsulating organic film disposed on the first encapsulating inorganic film, a second encapsulating inorganic film disposed on the encapsulating organic film, a dam disposed on the non-display area of ​​the substrate, a bank disposed on the non-display area of ​​the substrate and disposed outside the dam, an inorganic encapsulating area disposed between the dam and the bank in the non-display area of ​​the substrate, a dam area where the dam is disposed in the non-display area of ​​the substrate, a bank area where the bank is disposed, and a first power wiring disposed in the inorganic encapsulating area. The first power wiring includes a first sub-power wiring and a plurality of moisture-permeability prevention patterns protruding from one side of the first sub-power wiring and disposed in the inorganic encapsulating area. The length of the plurality of moisture-proof patterns per unit area in the above-mentioned inorganic bag region is different from the length of the plurality of moisture-proof patterns per unit area in the above-mentioned bank region.

[0008] The above plurality of moisture-proof patterns have a planar shape of a circle, ellipse, or polygon.

[0009] The total length of the perimeter of the plurality of moisture-proof patterns disposed in the above-mentioned weapon bag area is 540㎛ or more.

[0010] The first power wiring extends in one direction, and the length of each of the plurality of moisture-permeability prevention patterns in the one direction is equal to the length of the other direction intersecting the one direction.

[0011] The first power wiring extends in one direction, and the length of each of the plurality of moisture-permeability prevention patterns in the one direction is smaller than the length of the other direction intersecting the one direction.

[0012] The above plurality of moisture-proof patterns are placed in the bank area.

[0013] The size of any one of the plurality of moisture-proof patterns placed in the above weapon bag area is different from the size of any one of the plurality of moisture-proof patterns placed in the above bank area.

[0014] The above bank includes a first bank disposed on the substrate, a second bank disposed on the first bank, a third bank disposed on the second bank, and a fourth bank disposed on the third bank.

[0015] The above plurality of moisture-proof patterns are placed on the first bank.

[0016] The above plurality of moisture-proof patterns do not overlap with the second bank, the third bank, and the fourth bank.

[0017] The above plurality of moisture-proof patterns do not overlap with the first bank, the second bank, the third bank, and the fourth bank.

[0018] The above plurality of moisture-proof patterns are placed in the dam area.

[0019] The above plurality of moisture-proof patterns are placed in a first non-display area between the dam and the display area.

[0020] The size of any one of the plurality of moisture-proof patterns placed in the above-mentioned weapon bag area is different from the size of any one of the plurality of moisture-proof patterns placed in the above-mentioned first non-display area.

[0021] The length of the plurality of moisture-proof patterns per unit area in the above-mentioned inorganic bag region is different from the length of the plurality of moisture-proof patterns per unit area in the first non-displayed region.

[0022] The first power wiring further includes a second sub-power wiring connected to the first sub-power wiring through a first power contact hole in the first non-display area.

[0023] The first power contact hole is placed in the dam area.

[0024] A display device according to one embodiment for solving the above problem comprises a substrate including a display area and a non-display area, a pixel electrode disposed on the display area of ​​the substrate, an organic light-emitting layer disposed on the pixel electrode, a common electrode disposed on the organic light-emitting layer, a first encapsulating inorganic film disposed on the common electrode, an encapsulating organic film disposed on the first encapsulating inorganic film, a second encapsulating inorganic film disposed on the encapsulating organic film, a dam disposed on the non-display area of ​​the substrate, a bank disposed on the non-display area of ​​the substrate and disposed outside the dam, an inorganic encapsulating area disposed between the dam and the bank in the non-display area of ​​the substrate, a dam area where the dam is disposed in the non-display area of ​​the substrate, a bank area where the bank is disposed, and a first power wiring disposed in the inorganic encapsulating area. The first power wiring includes a first sub-power wiring and a plurality of first moisture-permeable prevention patterns that are indented from one side of the first sub-power wiring and disposed in the inorganic encapsulating area.

[0025] The total length of the perimeter of the plurality of first moisture-proof patterns disposed in the above-mentioned weapon bag area is 540㎛ or more.

[0026] The first power wiring extends in one direction, and the length of each of the plurality of first moisture-permeable patterns in the one direction is smaller than the length of the other direction intersecting the one direction.

[0027] The first power wiring includes a plurality of second moisture-proof patterns that protrude from one side of the first sub-power wiring and are disposed in the weapon bag area.

[0028] A display device according to one embodiment for solving the above problem comprises a substrate including a display area and a non-display area, a pixel electrode disposed on the display area of ​​the substrate, an organic light-emitting layer disposed on the pixel electrode, a common electrode disposed on the organic light-emitting layer, a first encapsulating inorganic film disposed on the common electrode, an encapsulating organic film disposed on the first encapsulating inorganic film, a second encapsulating inorganic film disposed on the encapsulating organic film, a dam disposed on the non-display area of ​​the substrate, an inorganic encapsulating area disposed outside the dam in the non-display area of ​​the substrate where the first encapsulating inorganic film and the second encapsulating inorganic film are in contact, a dam area where the dam is disposed in the non-display area of ​​the substrate, a first non-display area disposed between the display area and the dam area, and a first power wiring disposed in the inorganic encapsulating area and including a plurality of moisture-permeability prevention patterns. The plurality of moisture-permeability prevention patterns include a first moisture-permeability prevention pattern disposed in the first non-display area and a second moisture-permeability prevention pattern disposed in the inorganic encapsulating area. The planar shape of the first moisture-permeable pattern is different from the planar shape of the second moisture-permeable pattern.

[0029] The first power wiring further includes a first sub-power wiring, and the second moisture-proof pattern is indented from one side of the first sub-power wiring.

[0030] The first power wiring further includes a first sub-power wiring, and the first moisture-proof pattern protrudes from one side of the first sub-power wiring.

[0031] The above plurality of moisture-proof patterns further include a third moisture-proof pattern disposed in the inorganic bag area, and the planar shape of the third moisture-proof pattern is different from the planar shape of the second moisture-proof pattern.

[0032] The planar shape of the third moisture-permeable-preventing pattern is the same as the planar shape of the first moisture-permeable-preventing pattern.

[0033] The first power wiring further includes a first sub-power wiring, and the third moisture-proof pattern protrudes from one side of the first sub-power wiring.

[0034] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0035] According to the display device of the embodiments, since the power wiring in the inorganic encapsulation area includes a plurality of moisture-preventing patterns, even if a void is formed along the side of the power wiring, the path for external air or moisture to pass through the void can be extended. Therefore, due to the plurality of moisture-preventing patterns, the passage of external air or moisture can be delayed or prevented.

[0036] According to the display device of the embodiments, the total circumference of a plurality of moisture-prevention patterns in an inorganic encapsulation area can be controlled by adjusting the number of moisture-prevention patterns and the lengths of the moisture-prevention patterns in one direction and the other direction. That is, the number of moisture-prevention patterns decreases as the width of the inorganic encapsulation area decreases, but if the length of each of the first moisture-prevention patterns in one direction and / or the other direction is increased, the path for external air or moisture to pass through the pores in the inorganic encapsulation area can be maintained at 540 μm or more. Therefore, even if the width of the inorganic encapsulation area decreases as the non-display area is reduced due to the expansion of the display area, the passage of external air or moisture can be delayed or prevented due to the plurality of moisture-prevention patterns. Accordingly, even if the width of the inorganic encapsulation area decreases, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation area from being damaged by air or moisture.

[0037] The effects according to the embodiments are not limited to those exemplified above, and a wider variety of effects are included in this specification. Brief explanation of the drawing

[0038] FIG. 1 is a perspective view showing a display device according to one embodiment. FIGS. 2 and FIGS. 3 are plan views showing a display device according to one embodiment. FIG. 4 is a side view showing a display device according to one embodiment. FIG. 5a is a circuit diagram showing pixels of a display area of ​​a display panel according to one embodiment. FIG. 5b is a circuit diagram showing the pixels of the display area of ​​a display panel according to another embodiment. FIG. 5c is a layout diagram showing the display area of ​​a display panel according to one embodiment. FIG. 6 is a cross-sectional view showing an example of a display panel cut along A-A' of FIG. 5c. FIG. 7a is a layout diagram showing a non-display area of ​​a display panel according to one embodiment. FIG. 7b is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to one embodiment. Figure 8 is a layout diagram showing the first power wiring of the weapon bag area of ​​Figure 7b. Figure 9 is a layout diagram showing the first power wiring of the bank area of ​​Figure 7b. FIG. 10 is a cross-sectional view showing an example of a display panel cut along B-B' of FIG. 7b. FIG. 11 is a cross-sectional view showing an example of a display panel cut along C-C' of FIG. 7b. FIG. 12a is a cross-sectional view showing an example of a display panel cut along G-G' of FIG. 7b. FIG. 12b is a cross-sectional view showing an example of a display panel cut along D-D' of FIG. 8. Fig. 12c is an enlarged view of region H of Fig. 12b. FIG. 13 is a cross-sectional view showing an example of a display panel cut along E-E' of FIG. 9. FIG. 14 is a cross-sectional view showing another example of a display panel cut along E-E' of FIG. 9. FIG. 15 is a cross-sectional view showing another example of a display panel cut along E-E' of FIG. 9. FIG. 16 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment. FIG. 17 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment. FIG. 18 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment. FIG. 19 is a layout diagram showing the first power wiring of the bank area of ​​FIG. 18. FIG. 20 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment. FIG. 21 is a layout diagram showing the first power wiring of the weapon bag area of ​​FIG. 20. FIG. 22 is a cross-sectional view showing an example of a display panel cut along F-F' of FIG. 21. Figure 23 is a layout diagram showing the dam area, weapon bag area, and bank area in detail. Figure 24 is a layout diagram showing the dam area, weapon bag area, and bank area in detail. Specific details for implementing the invention

[0039] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0040] When elements or layers are referred to as being "on" another element or layer, this includes cases where another layer or element is interposed directly on or in the middle of another element. Throughout the specification, the same reference numerals refer to the same components. Shapes, sizes, ratios, angles, numbers, etc., disclosed in the drawings for describing embodiments are exemplary and the invention is not limited to the depicted details.

[0041] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may also be the second component within the technical scope of the present invention.

[0042] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0043] Specific embodiments will be described below with reference to the attached drawings.

[0044] FIG. 1 is a perspective view showing a display device according to one embodiment.

[0045] Referring to FIG. 1, the display device (10) is a device for displaying video or still images and can be used as a display screen for various products such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT), as well as portable electronic devices such as mobile phones, smartphones, tablet PCs, smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, PMPs (portable multimedia players), navigation systems, and UMPCs (Ultra Mobile PCs).

[0046] The display device (10) may be a light-emitting display device such as an organic light-emitting display device using an organic light-emitting diode, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, and a micro light-emitting display device using a micro or nano light-emitting diode (micro LED or nano LED). Although the following description focuses on the display device (10) being an organic light-emitting display device, the present invention is not limited thereto.

[0047] The display device (10) includes a display panel (100), a display driving circuit (200), and a circuit board (300).

[0048] The display panel (100) may be formed as a rectangular plane having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction) that intersects the first direction (X-axis direction). The corner where the short side in the first direction (X-axis direction) and the long side in the second direction (Y-axis direction) meet may be formed rounded to have a predetermined curvature or formed at a right angle. The planar shape of the display panel (100) is not limited to a rectangle and may be formed as other polygons, circles, or ellipses. The display panel (100) may be formed flat, but is not limited thereto. For example, the display panel (100) may include curved surfaces formed at the left and right ends that have a constant curvature or a changing curvature. In addition, the display panel (100) may be formed flexibly so that it can be bent, curved, folded, or rolled.

[0049] The display panel (100) may include a main area (MA) and a sub area (SBA).

[0050] The main area (MA) may include a display area (DA) that displays an image and a non-display area (NDA) which is a surrounding area of ​​the display area (DA). The display area (DA) may include pixels (PX in FIG. 5a and FIG. 5b) that display an image. A sub-area (SBA) may protrude in a second direction (Y-axis direction) from one side of the main area (MA).

[0051] In FIG. 1, the sub-region (SBA) is illustrated as being unfolded, but the sub-region (SBA) can be bent, in which case it can be placed on the lower surface of the display panel (100). When the sub-region (SBA) is bent, it can overlap with the main region (MA) in the thickness direction (Z-axis direction) of the substrate (SUB). A display driving circuit (200) can be placed in the sub-region (SBA).

[0052] The display driving circuit (200) can generate signals and voltages to drive the display panel (100). The display driving circuit (200) may be formed as an integrated circuit (IC) and attached to the display panel (100) using a COG (chip on glass) method, a COP (chip on plastic) method, or an ultrasonic bonding method, but is not limited thereto. For example, the display driving circuit (200) may be attached to the circuit board (300) using a COF (chip on film) method.

[0053] A circuit board (300) can be attached to one end of a sub-region (SBA) of a display panel (100). As a result, the circuit board (300) can be electrically connected to the display panel (100) and the display driving circuit (200). The display panel (100) and the display driving circuit (200) can receive digital video data, timing signals, and driving voltages through the circuit board (300). The circuit board (300) may be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip-on-film.

[0054] FIGS. 2 and FIGS. 3 are plan views showing a display device according to one embodiment. FIG. 4 is a side view showing a display device according to one embodiment.

[0055] Figure 2 illustrates a sub-region (SBA) that is unfolded without being bent. Figures 3 and 4 illustrate a sub-region (SBA) that is bent.

[0056] Referring to FIGS. 2 to 4, the display panel (100) may include a main area (MA) and a sub area (SBA).

[0057] The main area (MA) may include a display area (DA) for displaying an image and a non-display area (NDA) which is the surrounding area of ​​the display area (DA). The display area (DA) may occupy most of the main area (MA). The display area (DA) may be positioned in the center of the main area (MA).

[0058] The non-display area (NDA) may be positioned adjacent to the display area (DA). The non-display area (NDA) may be an outer area of ​​the display area (DA). The non-display area (NDA) may be positioned to surround the display area (DA). The non-display area (NDA) may be an edge area of ​​the display panel (100).

[0059] The non-display area (NDA) may include a dam area (DAMA). The dam area (DAMA) may be positioned to surround the display area (DA). The dam area (DAMA) may be an area where a dam (DAM in FIG. 10) is positioned to prevent the encapsulating organic film (TFE2) of the encapsulating layer (TFEL in FIG. 6) for encapsulating the light-emitting elements of the display area (DA) from overflowing.

[0060] The non-display area (NDA) may include a first non-display area (NDA1) positioned between the display area (DA) and the dam area (DAMA), and a second non-display area (NDA2) positioned on the outer edge of the dam area (DAMA). That is, the first non-display area (NDA1) may be positioned on the inner side of the dam area (DAMA), and the second non-display area (NDA2) may be positioned on the outer side of the dam area (DAMA).

[0061] A sub-region (SBA) may protrude in a second direction (Y-axis direction) from one side of a main region (MA). The length of the sub-region (SBA) in the second direction (Y-axis direction) may be smaller than the length of the main region (MA) in the second direction (Y-axis direction). The length of the sub-region (SBA) in the first direction (X-axis direction) may be smaller than the length of the main region (MA) in the first direction (X-axis direction) or substantially equal to the length of the main region (MA) in the first direction (X-axis direction). The sub-region (SBA) may be bent and may be placed on the back surface of the display panel (100). In this case, the sub-region (SBA) may overlap with the main region (MA) in a third direction (Z-axis direction).

[0062] The sub-region (SBA) may include a first region (A1), a second region (A2), and a bending region (BA).

[0063] The first area (A1) is an area protruding in the second direction (Y-axis direction) from one side of the main area (MA). One side of the first area (A1) is in contact with the non-display area (NDA) of the main area (MA), and the other side of the first area (A1) may be in contact with the bending area (BA).

[0064] The second area (A2) is an area where display pads (DPs) and a display driving circuit (200) are placed. The display driving circuit (200) can be attached to the driving pads of the second area (A2) using a low-resistance, high-reliability material such as an anisotropic conductive film or SAP (Self Assembly Anisotropic Conductive Paste). The circuit board (300) can be attached to the display pads (DPs) of the second area (A2) using a low-resistance, high-reliability material such as an anisotropic conductive film or SAP. One side of the second area (A2) may be in contact with a bending area (BA).

[0065] The bending area (BA) is a bending area. When the bending area (BA) is bent, the second area (A2) may be positioned below the first area (A1) and below the main area (MA). The bending area (BA) may be positioned between the first area (A1) and the second area (A2). One side of the bending area (BA) is in contact with the first area (A1), and the other side of the bending area (BA) may be in contact with the second area (A2).

[0066] FIG. 5a is a circuit diagram showing pixels of a display area of ​​a display panel according to one embodiment.

[0067] Referring to FIG. 5a, each pixel (PX) can be connected to any two of the scan lines (SL), any one of the light-emitting lines (EL), and any one of the data lines. For example, as in FIG. 5a, a pixel (PX) can be connected to a write scan line (GWL), an initial scan line (GIL), a control scan line (GCL), a light-emitting line (EL), and a data line (DL).

[0068] As shown in FIG. 5a, the pixel (PX) includes a driving transistor (DT), a light-emitting element (LE), switching elements, and a capacitor (C1). The switching elements include first to sixth transistors (ST1, ST2, ST3, ST4, ST5, ST6).

[0069] The driving transistor (DT) includes a gate electrode, a first electrode, and a second electrode. The driving transistor (DT) controls the drain-source current (Ids, hereinafter referred to as “driving current”) flowing between the first electrode and the second electrode according to the data voltage applied to the gate electrode.

[0070] The light-emitting element (LEL) emits light according to the driving current (Ids). The amount of light emitted by the light-emitting element (LEL) can be proportional to the driving current (Ids).

[0071] The light-emitting element (LEL) may be an organic light-emitting diode comprising an anode electrode, a cathode electrode, and an organic light-emitting layer disposed between the anode electrode and the cathode electrode. Alternatively, the light-emitting element (LEL) may be an inorganic light-emitting element comprising an anode electrode, a cathode electrode, and an inorganic semiconductor disposed between the anode electrode and the cathode electrode. Alternatively, the light-emitting element (LEL) may be a quantum dot light-emitting element comprising an anode electrode, a cathode electrode, and a quantum dot light-emitting layer disposed between the anode electrode and the cathode electrode. Alternatively, the light-emitting element (LEL) may be a micro light-emitting diode.

[0072] The anode electrode of the light-emitting element (LEL) is connected to the first electrode of the fourth transistor (ST4) and the second electrode of the sixth transistor (ST6), and the cathode electrode can be connected to the first power wiring (VSL). A parasitic capacitance (Cel) may be formed between the anode electrode and the cathode electrode of the light-emitting element (LEL).

[0073] A capacitor (C1) is formed between the second electrode of the driving transistor (DT) and the second power line (VSL). One electrode of the capacitor (C1) is connected to the second electrode of the driving transistor (DT), and the other electrode can be connected to the second power line (VSL).

[0074] If the first electrode of each of the first to sixth transistors (ST1, ST2, ST3, ST4, ST5, ST6) and the driving transistor (DT) is a source electrode, the second electrode may be a drain electrode. Alternatively, if the first electrode of each of the first to sixth transistors (ST1, ST2, ST3, ST4, ST5, ST6) and the driving transistor (DT) is a drain electrode, the second electrode may be a source electrode.

[0075] The active layer of each of the first to sixth transistors (ST1, ST2, ST3, ST4, ST5, ST6) and the driving transistor (DT) may be formed of any one of polysilicon, amorphous silicon, and oxide semiconductor. When the semiconductor layer of each of the first to sixth transistors (ST1, ST2, ST3, ST4, ST5, ST6) and the driving transistor (DT) is formed of polysilicon, the process for forming it may be a low-temperature polysilicon (LTPS) process.

[0076] In addition, in FIG. 5a, the first to sixth transistors (ST1, ST2, ST3, ST4, ST5, ST6) and the driving transistor (DT) are described as being formed as P-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), but are not limited thereto and may be formed as N-type MOSFETs.

[0077] Furthermore, the first power supply voltage of the first power supply line (VSL), the second power supply voltage of the second power supply line (VSL), and the third power supply voltage of the third power supply line (VIL) can be set by considering the characteristics of the driving transistor (DT), the characteristics of the light-emitting element (LEL), etc.

[0078] FIG. 5b is a circuit diagram showing the pixels of the display area of ​​a display panel according to another embodiment.

[0079] The embodiment of FIG. 5b differs from the embodiment of FIG. 5a in that the driving transistor (DT), the second transistor (ST2), the fourth transistor (ST4), the fifth transistor (ST5), and the sixth transistor (ST6) are formed as P-type MOSFETs, and the first transistor (ST1) and the third transistor (ST3) are formed as N-type MOSFETs.

[0080] Referring to FIG. 5b, the active layers of the driving transistor (DT), the second transistor (ST2), the fourth transistor (ST4), the fifth transistor (ST5), and the sixth transistor (ST6), each formed by a P-type MOSFET, are formed of polysilicon, and the active layers of the first transistor (ST1) and the third transistor (ST3), each formed by an N-type MOSFET, can be formed of an oxide semiconductor. In this case, since the transistors formed by polysilicon and the transistors formed by oxide semiconductors can be placed on different layers, the area of ​​the pixel (PX) can be reduced.

[0081] In FIG. 5b, the gate electrode of the second transistor (ST2) and the gate electrode of the fourth transistor (ST4) are connected to the write scan line (GWL), and the gate electrode of the first transistor (ST1) is connected to the control scan line (GCL), which is different from the embodiment of FIG. 6a. Additionally, in FIG. 5b, since the first transistor (ST1) and the third transistor (ST3) are formed as N-type MOSFETs, a scan signal of gate high voltage can be applied to the control scan line (GCL) and the initialization scan line (GIL). In contrast, since the second transistor (ST2), the fourth transistor (ST4), the fifth transistor (ST5), and the sixth transistor (ST6) are formed as P-type MOSFETs, a scan signal of gate low voltage can be applied to the write scan line (GWL) and the light-emitting line (EL).

[0082] FIG. 5c is a layout diagram showing the display area of ​​a display panel according to one embodiment.

[0083] In FIG. 5c, the first to fourth light-emitting parts (EA1, EA2, EA3, EA4), driving electrodes (TE), and sensing electrodes (RE) of the display area (DA) are illustrated. FIG. 5c describes a touch driving method that is a mutual capacitance method comprising two types of sensor electrodes, namely driving electrodes (TE) and sensing electrodes (RE), to detect a user's touch. For convenience of explanation, FIG. 5c illustrates two sensing electrodes (RE) adjacent in the first direction (X-axis direction) and two driving electrodes (TE) adjacent in the second direction (Y-axis direction).

[0084] Referring to FIG. 5c, the driving electrodes (TE) and the sensing electrodes (RE) can be electrically separated from each other. Since the driving electrodes (TE) and the sensing electrodes (RE) are formed on the same layer, they can be placed apart from each other. A gap can be formed between the driving electrode (TE) and the sensing electrode (RE).

[0085] Sensing electrodes (RE) can be electrically connected in a first direction (X-axis direction). Driving electrodes (TE) can be electrically connected in a second direction (Y-axis direction). In order for the sensing electrodes (RE) and driving electrodes (TE) to be electrically separated at their intersections, driving electrodes (TE) adjacent to each other in the second direction (Y-axis direction) can be connected through first connections (BE1). The sensing electrodes (RE) can be connected to sensing wires, and the driving electrodes (TE) can be connected to driving wires. The sensing wires and driving wires can be collectively referred to as touch wires (TL in FIG. 10 and FIG. 11).

[0086] The first connection portions (BE1) are formed on a different layer from the driving electrodes (TE) and the sensing electrodes (RE) and can be connected to the driving electrodes (TE) through the first sensor contact holes (TCNT1). One end of each of the first connection portions (BE1) can be connected to any one of the driving electrodes (TE) adjacent to each other in the second direction (Y-axis direction) through the first sensor contact holes (TCNT1). The other end of each of the first connection portions (BE1) can be connected to another driving electrode (TE) adjacent to each other in the second direction (Y-axis direction) through the first sensor contact holes (TCNT1). The first connection portions (BE1) can overlap with the sensing electrode (RE) in the third direction (Z-axis direction). Since the first connection portions (BE1) are formed on a different layer from the driving electrodes (TE) and the sensing electrodes (RE), they can be electrically separated from the sensing electrodes (RE) even if they overlap with the sensing electrodes (RE) in the third direction (Z-axis direction).

[0087] The LEL display area (DA) of FIGS. 5a and FIGS. 5b may include a plurality of light-emitting parts (EA1, EA2, EA3, EA4) for displaying an image. Each of the plurality of light-emitting parts (EA1, EA2, EA3, EA4) may be defined as an area where the light-emitting element (LEL) of FIGS. 5a and FIGS. 5b emits light.

[0088] For example, the display area (DA) may include first to fourth light-emitting parts (EA1, EA2, EA3, EA4). In this case, the first light-emitting part (EA1) may refer to the light-emitting part of a light-emitting element (LEL in FIG. 5a and 5b) that emits a first light, and the second light-emitting part (EA2) may refer to the area of ​​a light-emitting element (LEL in FIG. 5a and 5b) that emits a second light. Additionally, the third light-emitting part (EA3) may refer to the area of ​​a light-emitting element (LEL in FIG. 5a and 5b) that emits a third light, and the fourth light-emitting part (EA4) may refer to the area of ​​a light-emitting element (LEL in FIG. 5a and 5b) that emits a fourth light.

[0089] The first light-emitting unit (EA1), the second light-emitting unit (EA2), the third light-emitting unit (EA3), and the fourth light-emitting unit (EA4) may emit different colors. Alternatively, any two of the first light-emitting unit (EA1), the second light-emitting unit (EA2), the third light-emitting unit (EA3), and the fourth light-emitting unit (EA4) may emit the same color. For example, the first light-emitting unit (EA1) may emit red light, the second light-emitting unit (EA2) and the fourth light-emitting unit (EA4) may emit green light, and the third light-emitting unit (EA3) may emit blue light.

[0090] Each of the first light-emitting part (EA1), the second light-emitting part (EA2), the third light-emitting part (EA3), and the fourth light-emitting part (EA4) has been exemplified as having a rectangular planar shape, such as a rhombus, but is not limited thereto. For example, the first light-emitting part (EA1), the second light-emitting part (EA2), the third light-emitting part (EA3), and the fourth light-emitting part (EA4) may have a planar shape other than a rectangle, such as a polygon, a circle, or an ellipse. Additionally, among the first light-emitting part (EA1), the second light-emitting part (EA2), the third light-emitting part (EA3), and the fourth light-emitting part (EA4), the third light-emitting part (EA3) has been exemplified as having the largest size, the first light-emitting part (EA1) has the second largest size, and the second light-emitting part (EA2) and the fourth light-emitting part (EA4) have the smallest sizes, but is not limited thereto.

[0091] Since the driving electrodes (TE), sensing electrodes (RE), and connecting portions (BE1) are formed as a planar mesh structure or a net structure, the light-emitting portions (EA1, EA2, EA3, EA4) may not overlap with the driving electrodes (TE), sensing electrodes (RE), and connecting portions (BE1) in the third direction (Z-axis direction). Accordingly, the light emitted from the light-emitting portions (EA) is blocked by the driving electrodes (TE), sensing electrodes (RE), and connecting portions (BE1), thereby preventing or reducing the decrease in light brightness.

[0092] FIG. 6 is a cross-sectional view showing an example of a display panel cut along A-A' of FIG. 5c.

[0093] Referring to FIG. 6, the substrate (SUB) may be made of an insulating material such as a polymer resin or glass. For example, the substrate (SUB) may include polyimide. In this case, the substrate (SUB) may be a flexible substrate capable of bending, folding, rolling, etc.

[0094] A thin film transistor layer (TFTL) including thin film transistors (TFTs) may be disposed on a substrate (SUB). The thin film transistor layer (TFTL) may include a thin film transistor (TFT), a capacitor (C1), a first anode connection electrode (ANDE1), a second anode connection electrode (ANDE2), a buffer film (BF), a gate insulating film (130), a first interlayer insulating film (141), a second interlayer insulating film (142), a first organic film (160), and a second organic film (161).

[0095] A buffer film (BF) may be disposed on a substrate (SUB). The buffer film (BF) may be formed of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0096] A thin-film transistor (TFT) may be disposed on the buffer film (BF). The thin-film transistor (TFT) may include an active layer (ACT), a gate electrode (G), a source electrode (S), and a drain electrode (D).

[0097] The active layer (ACT), source electrode (S), and drain electrode (D) of a thin-film transistor (TFT) may be disposed on the buffer film (BF). The active layer (ACT) may include a silicon semiconductor such as polycrystalline silicon, single-crystal silicon, low-temperature polycrystalline silicon, or amorphous silicon. The source electrode (S) and drain electrode (D) may have conductivity by doping the silicon semiconductor with ions or impurities. The active layer (ACT) overlaps with the gate electrode (G) in the third direction (Z-axis direction), which is the thickness direction of the substrate (SUB), while the source electrode (S) and drain electrode (D) may not overlap with the gate electrode (G) in the third direction (Z-axis direction).

[0098] A gate insulating film (130) may be disposed on the active layer (ACT), source electrode (S), and drain electrode (D) of a thin film transistor (TFT). The gate insulating film (130) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0099] A gate electrode (G) of a thin-film transistor (TFT) may be disposed on the gate insulating film (130). The gate electrode (G) may overlap with the active layer (ACT) in a third direction (Z-axis direction). The gate electrode (G) may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0100] A first interlayer insulating film (141) may be disposed on the gate electrode (G). The first interlayer insulating film (141) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0101] A capacitor electrode (CAE) may be disposed on the first interlayer insulating film (141). The capacitor electrode (CAE) may overlap with the gate electrode (G) in the third direction (Z-axis direction). Since the first interlayer insulating film (141) has a predetermined dielectric constant, a capacitor may be formed by the capacitor electrode (CAE), the gate electrode (G), and the first interlayer insulating film (141) disposed between the capacitor electrode (CAE) and the gate electrode (G). The capacitor electrode (CAE) may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0102] A second interlayer insulating film (142) may be disposed on the capacitor electrode (CAE). The second interlayer insulating film (142) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film (142) may include a plurality of inorganic films, and the thickness of the second interlayer insulating film (142) in the third direction (Z-axis direction) may be greater than the thickness of the first interlayer insulating film (141) in the third direction (Z-axis direction).

[0103] A first anode connection electrode (ANDE1) may be disposed on the second interlayer insulating film (142). The first anode connection electrode (ANDE1) may be connected to the drain electrode (D) through a first anode contact hole (ANCT1) that penetrates the first interlayer insulating film (141) and the second interlayer insulating film (142) to expose the drain electrode (D) of the thin-film transistor (TFT). The first anode connection electrode (ANDE1) may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0104] A first organic film (160) for planarization may be disposed on the first anode connecting electrode (ANDE1). The first organic film (160) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0105] A second anode connecting electrode (ANDE2) may be disposed on the first organic film (160). The second anode connecting electrode (ANDE2) may be connected to the second anode connecting electrode (ANDE2) through a second anode contact hole (ANCT2) that penetrates the first organic film (160) and exposes the first anode connecting electrode (ANDE1). The second anode connecting electrode (ANDE2) may be formed as a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0106] A second organic film (161) may be disposed on the second anode connecting electrode (ANDE2). The second organic film (161) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0107] Figure 6 illustrates a thin-film transistor (TFT) formed in a top-gate configuration where the gate electrode is located on the upper side of the active layer, but it should be noted that this is not limited thereto. The thin-film transistor (TFT) may be formed in a bottom-gate configuration where the gate electrode is located on the lower side of the active layer, or in a double-gate configuration where the gate electrode is located on both the upper and lower sides of the active layer.

[0108] A light-emitting element layer (EML) may be disposed on the second organic film (161). The light-emitting element layer (EML) may include light-emitting elements (LELs) and a light-emitting part defining film (180). Each of the light-emitting elements (LELs) includes a pixel electrode (171), a light-emitting layer (172), and a common electrode (173). The common electrode (173) may be commonly connected to a plurality of light-emitting elements (LELs).

[0109] A pixel electrode (171) may be formed on a second organic film (161). The pixel electrode (171) may be connected to a second anode connection electrode (ANDE2) through a third anode contact hole (ANCT3) that penetrates the second organic film (161) and exposes the second anode connection electrode (ANDE2).

[0110] In a top emission structure that emits light in the direction of a common electrode (173) based on a light-emitting layer (172), the pixel electrode (171) can be formed of a highly reflective metallic material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0111] The light-emitting part defining film (180) may be formed to partition the pixel electrode (171) on the second organic film (161) to serve to define the light-emitting parts (EA1, EA2, EA3, EA4). The light-emitting part defining film (180) may be formed to cover the edges of the pixel electrode (171). The light-emitting part defining film (180) may be formed from an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0112] Each of the light-emitting parts (EA1, EA2, EA3, EA4) represents a region in which a pixel electrode (171), a light-emitting layer (172), and a common electrode (173) are sequentially stacked, and holes from the pixel electrode (171) and electrons from the common electrode (173) combine with each other in the light-emitting layer (172) to emit light.

[0113] A light-emitting layer (172) is formed on the pixel electrode (171) and the light-emitting part defining film (180). The light-emitting layer (172) may include an organic material and emit a predetermined color. For example, the light-emitting layer (172) includes a hole transporting layer, an organic material layer, and an electron transporting layer.

[0114] A common electrode (173) is formed on the light-emitting layer (172). The common electrode (173) may be formed to cover the light-emitting layer (172). The common electrode (173) may be a common layer formed commonly on all light-emitting parts (EA1, EA2, EA3, EA4). A capping layer may be formed on the common electrode (173).

[0115] In the upper light-emitting structure, the common electrode (173) can be formed from a transparent conductive oxide (TCO, Transparent Conductive Oxide) such as Indium Tin Oxide (ITO) and Indium Zinc Oxide (IZO) that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode (173) is formed from a semi-transmissive conductive material, the light emission efficiency can be increased by the micro cavity.

[0116] An encapsulation layer (TFEL) may be disposed on the common electrode (173). The encapsulation layer (TFEL) includes at least one inorganic film to prevent oxygen or moisture from penetrating the light-emitting element layer (EML). Additionally, the encapsulation layer (TFEL) includes at least one organic film to protect the light-emitting element layer (EML) from foreign substances such as dust. For example, the encapsulation layer (TFEL) may include a first encapsulation inorganic film (TFE1), an encapsulation organic film (TFE2), and a second encapsulation inorganic film (TFE3).

[0117] A first encapsulating inorganic film (TFE1) may be disposed on a common electrode (173), an encapsulating organic film (TFE2) may be disposed on the first encapsulating inorganic film (TFE1), and a second encapsulating inorganic film (TFE3) may be disposed on the encapsulating organic film (TFE2). The first encapsulating inorganic film (TFE1) and the second encapsulating inorganic film (TFE3) may be formed as a multilayer film in which one or more inorganic films selected from a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The encapsulating organic film (TFE2) may be formed from an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc.

[0118] A sensor electrode layer (SENL) may be disposed on the encapsulation layer (TFEL). The sensor electrode layer (SENL) may include driving electrodes (TE), sensing electrodes (RE), and a connection portion (BE1).

[0119] A first sensor insulating film (TINS1) may be disposed on the second encapsulating inorganic film (TFE3). The first sensor insulating film (TINS1) may be formed as a multilayer film in which one or more inorganic films selected from a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. Alternatively, the first sensor insulating film (TINS1) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0120] A connection portion (BE1) may be disposed on the first sensor insulating film (TINS1). The connection portion (BE1) may not overlap with the first light-emitting portion (EA1), the second light-emitting portion (EA2), the third light-emitting portion (EA3), and the fourth light-emitting portion (EA4) in the third direction (Z-axis direction). The connection portion (BE1) may overlap with the light-emitting portion defining film (180) in the third direction (Z-axis direction). The connection portion (BE1) may be formed as a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0121] A second sensor insulating film (TINS2) may be disposed on the connection portion (BE1). The second sensor insulating film (TINS2) may be formed as a multilayer film in which one or more inorganic films among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. Alternatively, the second sensor insulating film (TINS2) may be formed as an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0122] Driving electrodes (TE) and sensing electrodes (RE) may be disposed on the second sensor insulating film (TINS2). The driving electrodes (TE) and sensing electrodes (RE) may not overlap with the first light-emitting part (EA1), the second light-emitting part (EA2), the third light-emitting part (EA3), and the fourth light-emitting part (EA4) in the third direction (Z-axis direction). The driving electrodes (TE) and sensing electrodes (RE) may overlap with the light-emitting part defining film (180) in the third direction (Z-axis direction). The driving electrode (TE) may be connected to the first connection part (BE1) through the first sensor contact hole (TCNT1) penetrating the second sensor insulating film (TINS2). The driving electrodes (TE) and sensing electrodes (RE) can be formed as a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0123] A third sensor insulating film (TINS3) may be disposed on the driving electrodes (TE) and the sensing electrodes (RE). The third sensor insulating film (TINS3) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0124] FIG. 7a is a layout diagram showing a non-display area of ​​a display panel according to one embodiment. FIG. 7a is a layout diagram showing in detail an example of area A of FIG. 2.

[0125] In FIG. 7a, for convenience of explanation, a scan drive unit (SDU), scan control wires (SCL), a first power wire (VSL), a first power pad wire (VSPL), and a first power bending wire (VSBL), a second power wire (VDL), a second power pad wire (VDPL), and a second power bending wire (VDBL) are illustrated.

[0126] Referring to FIG. 7a, the scan driver (SDU) may be positioned on the left side of the display area (DA). The scan driver (SDU) may be connected to the display driving circuit (200) via scan control wires (SCL). The scan driver (SDU) may receive a scan timing signal from the display driving circuit (200) via scan control wires (SCL). The scan driver (SDU) may generate scan signals according to the scan timing signal. The scan driver (SDU) may output the scan signals to the scan wires (GWL, GIL, GCL) of the display area (DA).

[0127] Each of the scan control wires (SCL) may include a scan fan-out wire (SFL), a scan pad wire (SPL), and a scan bending wire (SBL).

[0128] The scan fan-out wiring (SFL) can be placed in the first area (A1) of the non-display area (NDA) and sub-area (SBA). The scan fan-out wiring (SFL) can be placed between the scan drive unit (SDU) and the scan bending wiring (SBL). One end of the scan fan-out wiring (SFL) is connected to the scan drive unit (SDU), and the other end can be connected to the scan bending wiring (SBL) through the second scan contact hole (SCH2). The scan fan-out wiring (SFL) can overlap with the dam area (DAMA).

[0129] Scan bending wiring (SBL) can be placed in the first area (A1), the second area (A2), and the bending area (BA) of the sub-area (SBA). Scan bending wiring (SBL) can be placed between the scan fan-out wiring (SFL) and the scan pad wiring (SPL). One end of the scan bending wiring (SBL) can be connected to the scan fan-out wiring (SFL) through the second scan contact hole (SCH2) in the first area (A1), and the other end can be connected to the scan pad wiring (SPL) through the first scan contact hole (SCT1) in the second area (A2).

[0130] The scan pad wiring (SPL) can be placed in the second area (A2). The scan pad wiring (SPL) can be placed between the scan bending wiring (SBL) and the display driving circuit (200). One end of the scan pad wiring (SPL) is connected to the scan bending wiring (SBL) through the first scan contact hole (SCT1), and the other end can be connected to the display driving circuit (200).

[0131] Meanwhile, in FIG. 7a, for convenience of explanation, data connection lines (not shown) placed between the data lines (DL) of the display area (DA) and the display driving circuit (200) are omitted, but the data connection lines (not shown) can be similar to the scan control lines (SCL). The data lines (DL) can receive data voltages from the display driving circuit (200) through the data connection lines. Each of the data connection lines (not shown) may include a data fan-out line (not shown), a data pad line (not shown), and a data bending line (not shown). The data fan-out line (not shown) may be substantially the same as the scan fan-out line (SFL), the data pad line (not shown) may be substantially the same as the scan pad line (SPL), and the data bending line (not shown) may be substantially the same as the scan bending line (SBL).

[0132] Additionally, in FIG. 7a, touch wires (TL in FIG. 10 and FIG. 11) have been omitted for convenience of explanation, but each of the touch wires (TL in FIG. 10 and FIG. 11) can be connected to a corresponding touch bending wire among the touch bending wires (not shown) placed in the bending area (BA).

[0133] The first power line (VSL) may be placed in the non-display area (NDA). The first power line (VSL) may overlap with the dam area (DAMA). The first power line (VSL) may overlap with the scan fan-out lines (SFL). The first power line (VSL) may be placed between the scan drive unit (SDU) and the display area (DA). Alternatively, the first power line (VSL) may overlap with the scan drive unit (SDU).

[0134] First power bending wires (VSBLs) may be placed in the first area (A1), the second area (A2), and the bending area (BA) of the sub-area (SBA). Each of the first power bending wires (VSBLs) may be placed between the first power wire (VSL) and the corresponding first power pad wire (VSPL). The first power bending wires (VSBLs) may extend from the first power wire (VSL). The first power bending wires (VSBLs) may be formed integrally with the first power wire (VSL). That is, the first power bending wires (VSBLs) may be formed of the same material as the first power wire (VSL). Each of the first power bending wires (VSBLs) may be connected to the corresponding first power pad wire (VSPL) through the first power contact hole (VSH).

[0135] The first power pad wires (VSPL) can be placed in the second area (A2). Each of the first power pad wires (VSPL) can be placed between the corresponding first power bending wire (VSBL) and the display driving circuit (200). One end of each of the first power pad wires (VSPL) is connected to the corresponding first power bending wire (VSBL) through the corresponding first power contact hole (VSH), and the other end can be connected to the display driving circuit (200).

[0136] The second power line (VDL) may be placed in the non-display area (NDA). The second power line (VDL) may overlap with the dam area (DAMA). The second power line (VDL) may overlap with data connection lines (not shown).

[0137] The second power bending wires (VDBL) may be placed in the first area (A1), the second area (A2), and the bending area (BA) of the sub-area (SBA). Each of the second power bending wires (VDBL) may be placed between the second power wire (VDL) and the corresponding second power pad wire (VDPL). The second power bending wires (VDBL) may extend from the second power wire (VDL). The second power bending wires (VDBL) may be formed integrally with the second power wire (VDL). That is, the second power bending wires (VDBL) may be formed of the same material as the second power wire (VDL). Each of the second power bending wires (VDBL) may be connected to the corresponding second power pad wire (VDPL) through the second power contact hole (VDH).

[0138] The second power pad wires (VDPL) can be placed in the second area (A2). Each of the second power pad wires (VDPL) can be placed between the corresponding second power bending wire (VDBL) and the display driving circuit (200). One end of each of the second power pad wires (VDPL) is connected to the corresponding second power bending wire (VDBL) through the corresponding second power contact hole (VDH), and the other end can be connected to the display driving circuit (200).

[0139] FIG. 7b is a layout diagram showing in detail a dam area, an inorganic encapsulation area, and a bank area according to one embodiment. FIG. 8 is a layout diagram showing the first power wiring of the inorganic encapsulation area of ​​FIG. 7b. FIG. 9 is a layout diagram showing the first power wiring of the bank area of ​​FIG. 7b. FIG. 7b shows an enlarged layout diagram showing area B of FIG. 7a in detail. FIG.

[0140] Referring to FIGS. 7b, FIGS. 8, and FIGS. 9, the non-marked area (NDA) may include a first non-marked area (NDA1), a dam area (DAMA), a weapon encapsulation area (CVD), and a bank area (BNKA).

[0141] The dam region (DAMA) may be an area where a dam (DAM in FIG. 10) is placed to prevent the encapsulating organic film (TFE2) of the encapsulating layer (TFEL in FIG. 6) for encapsulating the light-emitting elements of the display region (DA) from overflowing. The dam region (DAMA) may be placed in a first direction (X-axis direction) in a non-display region (NDA) located below the display region (DA). A detailed description of the dam (DAM in FIG. 10) will be provided later in conjunction with FIG. 10.

[0142] The bank area (BNKA) may be an area where a bank (BANK in FIG. 10) is placed to support a mask when manufacturing a display panel (100). The bank area (BNKA) may be placed in a first direction (X-axis direction) from a non-display area (NDA) located below a display area (DA). A detailed description of the bank (BANK in FIG. 10) will be described in detail later in conjunction with FIG. 10.

[0143] The first non-display area (NDA1) may be an area positioned between the dam area (DAMA) and the display area (DA) in the non-display area (NDA) as shown in FIG. 2. The first non-display area (NDA1) may be positioned inside the dam area (DAMA), and the second non-display area (NDA2) may be positioned outside the dam area (DAMA).

[0144] The inorganic encapsulation region (CVD) may be positioned between the dam region (DAMA) and the bank region (BNKA). The inorganic encapsulation region (CVD) may be an area where the first encapsulation inorganic film (TFE1) and the second encapsulation inorganic film (TFE2) of the encapsulation layer (TFEL in FIG. 6) come into contact with each other to encapsulate the display panel (100). The inorganic encapsulation region (CVD) may be an area where only an inorganic film is positioned and no organic film is positioned. The inorganic encapsulation region (CVD) may be positioned in the first direction (X-axis direction) from the non-display region (NDA) positioned below the display region (DA).

[0145] A first power line (VSL) for supplying a first power voltage to a common electrode (173 in FIG. 6) may be disposed in the non-display area (NDA). The first power line (VSL) may include a first sub-power line (VSL1), a second sub-power line (VSL2 in FIG. 10), and a plurality of first moisture-proof patterns (TP1). Since the second sub-power line (VSL2 in FIG. 10) is disposed below the first sub-power line (VSL1), the illustration of the second sub-power line (VSL2 in FIG. 10) is omitted in FIG. 7b.

[0146] The first sub-power wiring (VSL1) can be positioned in the second direction (Y-axis direction). The first sub-power wiring (VSL1) can be positioned in the first non-display area (NDA1), dam area (DAMA), inorganic encapsulation area (CVD), and bank area (BNKA). The first sub-power wiring (VSL1) can be connected to the second sub-power wiring (VSL2) through the first power contact hole (VSCT1). As a result, the resistance of the first power wiring (VSL) can be lowered, so a more uniform first power voltage can be supplied regardless of the position of the light-emitting parts (EA1, EA2, EA3, EA4 in FIG. 5c) positioned in the display area (DA).

[0147] In the inorganic encapsulation region (CVD), due to the lateral slope of the first sub-power wiring (VSL1), the first sub-power wiring (VSL1) may not be properly covered by the first encapsulation inorganic membrane (TFE1) and the second encapsulation inorganic membrane (TFE2). That is, in the inorganic encapsulation region (CVD), due to the lateral slope of the first sub-power wiring (VSL1), a void (OP in FIG. 12c) may occur in the first encapsulation inorganic membrane (TFE1) and the second encapsulation inorganic membrane (TFE2). The void (OP in FIG. 12c) may become a passage for external air or moisture.

[0148] A plurality of first moisture-permeability prevention patterns (TP1) may protrude in a first direction (X-axis direction) from one side of the first sub-power wiring (VSL1). A plurality of first moisture-permeability prevention patterns (TP1) may be arranged in a second direction (Y-axis direction).

[0149] In the inorganic encapsulation region (CVD), a void (OP in FIG. 12c) may be formed along the side of the first sub-power wiring (VSL1). Therefore, a path (MP1) for external air or moisture to pass through the void (OP in FIG. 12c) in the inorganic encapsulation region (CVD) may be formed along the side of the first sub-power wiring (VSL1). If the first power wiring (VSL) includes a plurality of first moisture-proof patterns (TP1), the length of the side of the first power wiring (VSL) may include the sum of the lengths of the perimeters of the plurality of first moisture-proof patterns (TP1). Therefore, if the first power wiring (VSL) includes a plurality of first moisture-proof patterns (TP1), the length of the side of the first power wiring (VSL) may be longer than if the first power wiring (VSL) does not include a plurality of first moisture-proof patterns (TP1). Accordingly, due to the plurality of first moisture-preventing patterns (TP1), the path (MP1) for external air or moisture to pass through the pore (OP in FIG. 12c) can be extended. Therefore, due to the plurality of first moisture-preventing patterns (TP1), the passage of external air or moisture can be delayed or prevented. Thus, even if the width of the inorganic encapsulation area is reduced, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation area from being damaged by air or moisture.

[0150] A plurality of first moisture-permeability prevention patterns (TP1) may be placed in an inorganic bag region (CVD). Additionally, a plurality of first moisture-permeability prevention patterns (TP1) may be placed in a first non-marking region (NDA1), a dam region (DAMA), and a bank region (BNKA), but the embodiments of this specification are not limited thereto. A plurality of first moisture-permeability prevention patterns (TP1) may be omitted in at least one of the first non-marking region (NDA1), the dam region (DAMA), and the bank region (BNKA).

[0151] Each of the plurality of first moisture-permeable prevention patterns (TP1) may have an elliptical planar shape as shown in FIG. 8, but the embodiments of the present specification are not limited thereto. Each of the plurality of first moisture-permeable prevention patterns (TP1) may have a planar shape of a polygon such as a circle, triangle, or square.

[0152] As the length (a) in the first direction (X-axis direction) and the length (b) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1) increase, the perimeter length of each of the plurality of first moisture-permeability prevention patterns (TP1) may increase. Recently, the non-display area (NDA) is being reduced to expand the display area (DA), and as a result, the width of the inorganic encapsulation area (CVD) is being reduced. However, while the number of first moisture-permeability prevention patterns (TP1) decreases as the width of the inorganic encapsulation area (CVD) decreases, if the length (a) in the first direction (X-axis direction) and / or the length (b) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1) is increased, the path (MP1) for external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation area (CVD) may not be reduced. Meanwhile, according to experiments by the inventors, if the passage of external air or moisture (MP1) through the pores (OP in Fig. 12c) in the inorganic bag region (CVD) is 540 μm or larger, the passage of external air or moisture can be delayed or prevented.

[0153] Table 1 shows the width of the inorganic bag region (CVD), the number of first moisture-proof patterns (TP1), the length (a) in the first direction (X-axis direction) and the length (b) in the second direction (Y-axis direction) of the first moisture-proof pattern (TP1), the perimeter of the first moisture-proof pattern (TP1), and the total perimeter of the plurality of first moisture-proof patterns (TP1) in the inorganic bag region (CVD).

[0154] 1 2 3 4 5 Width of the weapon bag area (CVD) 125㎛ 88㎛ 50㎛ 50㎛ 25㎛ Number of first moisture-permeable patterns (TP1) (n) 5 3.5 2 2 1 Length (a) of the first direction (X-axis direction) of the first moisture-permeable pattern (TP1) 25㎛ 25㎛ 25㎛ 63㎛ 150㎛ Length (b) of the second direction (Y-axis direction) of the first moisture-permeable pattern (TP1) 25㎛ 25㎛ 25㎛ 25㎛ 25㎛ Circumference (s) of the first moisture-proof pattern (TP1) 157㎛ 157㎛ 157㎛ 276.3㎛ 549.5㎛ Total perimeter of multiple first moisture-proof patterns (TP1) in the weapon bag area (CVD) 785㎛ 549.5㎛ 314㎛ 552.6㎛ 549.5㎛

[0156] In Table 1, the perimeter of the first moisture-proof pattern (TP1) is defined as “π×(a+b)”, and the total perimeter of the plurality of first moisture-proof patterns (TP1) in the inorganic encapsulation area (CVD) can be defined as “s×n”.

[0157] Referring to Table 1, when five first moisture-permeability prevention patterns (TP1) are arranged, the width of the inorganic encapsulation area (CVD) is 125 μm, the length (a) in the first direction (X-axis direction) is 25 μm, and the length (b) in the second direction (Y-axis direction) is 25 μm, the total perimeter of the multiple first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation area (CVD) may be approximately 785 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation area (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0158] When 3.5 first moisture-permeability prevention patterns (TP1) are arranged, with a width of 88 μm in the inorganic encapsulation area (CVD), a length (a) in the first direction (X-axis direction) of 25 μm, and a length (b) in the second direction (Y-axis direction) of 25 μm, the total perimeter of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation area (CVD) may be approximately 549.5 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation area (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0159] When two first moisture-permeability prevention patterns (TP1) are arranged, with a width of 50 μm in the inorganic encapsulation region (CVD), a length (a) in the first direction (X-axis direction) of 25 μm, and a length (b) in the second direction (Y-axis direction) of 25 μm, the total perimeter of the multiple first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation region (CVD) may be approximately 314 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation region (CVD) is smaller than 540 μm, it is difficult to delay or prevent the permeation of external air or moisture. Therefore, when the width of the inorganic encapsulation region (CVD) is 50 μm, it is necessary to increase the length (a) in the first direction (X-axis direction) or the length (b) in the second direction (Y-axis direction).

[0160] When two first moisture-permeability prevention patterns (TP1) are arranged, with a width of 50 μm in the inorganic encapsulation region (CVD), a length (a) in the first direction (X-axis direction) of 63 μm, and a length (b) in the second direction (Y-axis direction) of 25 μm, the total perimeter of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation region (CVD) may be approximately 552.6 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation region (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0161] When one first moisture-permeability prevention pattern (TP1) is arranged such that the width of the inorganic encapsulation area (CVD) is 25 μm, the length (a) in the first direction (X-axis direction) is 150 μm, and the length (b) in the second direction (Y-axis direction) is 25 μm, the total perimeter of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation area (CVD) may be approximately 549.5 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation area (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0162] As shown in Table 1, even if the width of the inorganic encapsulation area (CVD) is reduced, the total circumference of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation area (CVD) can be controlled by adjusting the number of first moisture-permeability prevention patterns (TP1) and the length (a) in the first direction (X-axis direction) and the length (b) in the second direction (Y-axis direction) of each of the first moisture-permeability prevention patterns (TP1). For example, if the number of first moisture-permeability prevention patterns (TP1) is reduced as much as the width of the inorganic encapsulation area (CVD) is reduced, but the length (a) in the first direction (X-axis direction) and / or the length (b) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1) is increased, the moisture permeability path (MP1) of external air or moisture through the pore (OP in FIG. 12c) in the inorganic encapsulation area (CVD) may be 540 μm or more. Therefore, due to the plurality of first moisture-preventing patterns (TP1), the penetration of external air or moisture can be delayed or prevented. Thus, even if the width of the inorganic encapsulation area is reduced, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation area from being damaged by air or moisture.

[0163] Each of the plurality of first moisture-permeability prevention patterns (TP1) can be connected to the first sub-power wiring (VSL1) by a first connection pattern (CP1) as shown in FIG. 8. The first connection pattern (CP1) can be positioned between the first moisture-permeability prevention pattern (TP1) and the first sub-power wiring (VSL1). The first sub-power wiring (VSL1), the plurality of first connection patterns (CP1), and the plurality of first moisture-permeability prevention patterns (TP1) can be formed integrally.

[0164] Meanwhile, since the plurality of first moisture-permeability prevention patterns (TP1) placed in the bank area (BNKA) shown in FIG. 9 are substantially identical to the plurality of first moisture-permeability prevention patterns (TP1) placed in the inorganic bag area (CVD) shown in FIG. 8, the description of the plurality of first moisture-permeability prevention patterns (TP1) placed in the bank area (BNKA) shown in FIG. 9 is omitted.

[0165] The second power wiring (VDL) may be spaced apart from the first power wiring (VSL). The second power wiring (VDL) may supply a second power voltage having a potential higher than the first power voltage to the display area (DA). The second power wiring (VDL) may include a third sub-power wiring (VDL1), a fourth sub-power wiring (VDL2), and a fifth sub-power wiring (VDL3), and a plurality of second moisture-proof patterns (TP2).

[0166] The third sub-power wiring (VDL1) and the fourth sub-power wiring (VDL2) may be arranged in the second direction (Y-axis direction). The third sub-power wiring (VDL1) may be arranged in the dam area (DAMA), the weapon encapsulation area (CVD), and the bank area (BNKA). The fourth sub-power wiring (VDL2) may be arranged in the first non-marking area (NDA1) and the dam area (DAMA). The third sub-power wiring (VDL1) may be connected to the fourth sub-power wiring (VDL2) through the second power contact hole (VDCT1).

[0167] The fifth sub-power wiring (VDL3) can be placed in the first non-display area (NDA1). The fifth sub-power wiring (VDL3) can be connected to the fourth sub-power wiring (VDL2) through the third power contact hole (VDCT2). As a result, the resistance of the second power wiring (VDL) can be lowered, so a more uniform second power voltage can be supplied regardless of the position of the light-emitting parts (EA1, EA2, EA3, EA4 in FIG. 5c) placed in the display area (DA).

[0168] In the inorganic encapsulation region (CVD), due to the lateral slope of the third sub-power wiring (VDL1), the third sub-power wiring (VDL1) may not be properly covered by the first encapsulation inorganic membrane (TFE1) and the second encapsulation inorganic membrane (TFE2). That is, in the inorganic encapsulation region (CVD), due to the lateral slope of the third sub-power wiring (VDL1), voids may occur in the first encapsulation inorganic membrane (TFE1) and the second encapsulation inorganic membrane (TFE2). These voids may serve as passages for external air or moisture.

[0169] A plurality of second moisture-permeability prevention patterns (TP2) may protrude in a first direction (X-axis direction) from one side of the third power wiring (VDL1). A plurality of second moisture-permeability prevention patterns (TP2) may be arranged in a second direction (Y-axis direction). A plurality of second moisture-permeability prevention patterns (TP2) may be arranged to face a plurality of first moisture-permeability prevention patterns (TP1).

[0170] In the inorganic encapsulation region (CVD), a void may be formed along the side of the third sub-power wiring (VDL1). Therefore, a path (MP2) for external air or moisture to pass through the void in the inorganic encapsulation region (CVD) may be formed along the side of the third sub-power wiring (VDL1). If the second power wiring (VDL) includes a plurality of second moisture-proof patterns (TP2), the length of the side of the second power wiring (VDL) may include the sum of the lengths of the perimeters of the plurality of second moisture-proof patterns (TP2). Therefore, if the second power wiring (VDL) includes a plurality of second moisture-proof patterns (TP2), the length of the side of the second power wiring (VDL) may be longer than if the second power wiring (VDL) does not include a plurality of second moisture-proof patterns (TP2). Accordingly, due to the multiple second moisture-permeability prevention patterns (TP2), the moisture penetration path (MP2) of external air or moisture through the pores can be extended. Therefore, due to the multiple second moisture-permeability prevention patterns (TP2), the penetration of external air or moisture can be delayed or prevented.

[0171] A plurality of second moisture-permeability prevention patterns (TP2) may be placed in the inorganic bag region (CVD). Additionally, a plurality of second moisture-permeability prevention patterns (TP2) may be placed in the dam region (DAMA) and the bank region (BNKA), but the embodiments of this specification are not limited thereto. A plurality of second moisture-permeability prevention patterns (TP2) may be omitted in at least one of the dam region (DAMA) and the bank region (BNKA).

[0172] As shown in FIGS. 7b, 8, and 9, in the inorganic encapsulation region (CVD), the first power line (VSL) includes a plurality of first moisture-permeability prevention patterns (TP1), and the second power line (VDL) includes a plurality of second moisture-permeability prevention patterns (TP2). As a result, even if a void is formed along the side of the first power line (VSL) in the inorganic encapsulation region (CVD), the path (MP1) for external air or moisture to pass through the void can be extended. Additionally, even if a void is formed along the side of the second power line (VDL) in the inorganic encapsulation region (CVD), the path (MP2) for external air or moisture to pass through the void can be extended. Therefore, due to the plurality of first moisture-permeability prevention patterns (TP1) and the plurality of second moisture-permeability prevention patterns (TP2), the passage of external air or moisture can be delayed or prevented.

[0173] Additionally, by adjusting the number of first moisture-permeability prevention patterns (TP1) and the length (a) in the first direction (X-axis direction) and the length (b) in the second direction (Y-axis direction) of the first moisture-permeability prevention patterns (TP1), the total circumference of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation area (CVD) can be controlled. For example, if the number of first moisture-permeability prevention patterns (TP1) is reduced as much as the width of the inorganic encapsulation area (CVD) is reduced, but the length (a) in the first direction (X-axis direction) and / or the length (b) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1) is increased, the moisture permeability path (MP1) of external air or moisture through the pore (OP in FIG. 12c) in the inorganic encapsulation area (CVD) can be maintained at 540 μm or more. Therefore, even if the width of the inorganic encapsulation area (CVD) is reduced as the non-display area (NDA) is reduced due to the expansion of the display area (DA), the penetration of external air or moisture can be delayed or prevented due to the plurality of first moisture-preventing patterns (TP1). Accordingly, even if the width of the inorganic encapsulation area is reduced, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation area from being damaged by air or moisture.

[0174] FIG. 10 is a cross-sectional view showing an example of a display panel cut along B-B' of FIG. 7b.

[0175] Referring to FIG. 10, the first power wiring (VSL) may include a first sub-power wiring (VSL1) and a second sub-power wiring (VSL2). The dam (DAM) may include a first sub-dam (DAM1), a second sub-dam (DAM2), a third sub-dam (DAM3), and a fourth sub-dam (DAM4). The dam (DAM) may be placed in a dam area (DAMA). FIG. 10 illustrates the placement of a single dam (DAM) in the dam area (DAMA), but is not limited thereto. Multiple dams (DAM) may be placed in the dam area (DAMA). The valley structure (ADAM) is a structure for forming a valley (VAL) between the valley structure (ADAM) and the first organic membrane (160) and may be placed in the first non-display area (NDA1). The valley structure (ADAM) may include a first valley structure (ADAM1) and a second valley structure (ADAM2). The bank (BNK) may include a first sub-bank (BNK1), a second sub-bank (BNK2), a third sub-bank (BNK3), and a fourth sub-bank (BNK4).

[0176] The second sub-power wiring (VSL2) may be placed on the second interlayer insulating film (142). The second sub-power wiring (VSL2) may be placed in the first non-display area (NDA1) and the dam area (DAMA). The second sub-power wiring (VSL2) may overlap with the dam (DAM) and the valley structure (ADAM) in the third direction (Z-axis direction). The second sub-power wiring (VSL2) is formed of the same material as the first anode connection electrode (ANDE1) and may be placed in the same layer.

[0177] A first sub-dam (DAM1) may be placed on the second sub-power wiring (VSL2). A first sub-bank (BNK1) may be placed on the interlayer insulating film (142). The first sub-dam (DAM1) and the first sub-bank (BNK1) are formed of the same material as the first organic film (160) and may be placed on the same layer.

[0178] The first sub-power wiring (VSL1) may be placed on the first organic film (160), the first sub-dam (DAM1), and the first sub-bank (BNK1). The first sub-power wiring (VSL1) may be connected to the second sub-power wiring (VSL2) through the first power contact hole (VSCT). The first power contact hole (VSCT) may be placed in the dam area (DAMA) and the first non-display area (NDA1). The first sub-power wiring (VSL1) is formed of the same material as the second anode connection electrode (ANDE2) and may be placed on the same layer.

[0179] A second organic film (161), a second sub-dam (DAM2), a first valley structure (ADAM1), and a second sub-bank (BNK2) may be disposed on the first sub-power wiring (VSL1). The second sub-dam (DAM2), the first valley structure (ADAM1), and the second sub-bank (BNK2) are formed of the same material as the second organic film (161) and may be disposed on the same layer.

[0180] The thickness of the second sub-dam (DAM2) and the thickness of the second sub-bank (BNK2) may be smaller than the thickness of the first valley structure (ADAM1) and the second organic membrane (161). The first valley structure (ADAM1) and the second organic membrane (161) may be connected. The thickness of the connection portion connecting the first valley structure (ADAM1) and the second organic membrane (161) may be smaller than the thickness of the first valley structure (ADAM1) and the second organic membrane (161).

[0181] A third sub-dam (DAM3) may be placed on the second sub-dam (DAM2), a second valley structure (ADAM2) may be placed on the first valley structure (ADAM1), and a third sub-bank (BNK3) may be placed on the second sub-bank (BNK2). The third sub-dam (DAM3), the second valley structure (ADAM2), and the third sub-bank (BNK3) may be formed of the same material as the light-emitting part defining film (180) and may be placed in the same layer.

[0182] The third sub-dam (DAM3) can cover the second sub-dam (DAM2). For example, the third sub-dam (DAM3) can be placed on the top surface and sides of the second sub-dam (DAM2). Additionally, the second valley structure (ADAM2) can cover the first valley structure (ADAM1). For example, the second valley structure (ADAM2) can be placed on the top surface and sides of the first valley structure (ADAM1). Additionally, the third sub-bank (BNK3) can cover the second sub-bank (BNK2). For example, the third sub-bank (BNK3) can be placed on the top surface and sides of the second sub-bank (BNK2).

[0183] A fourth sub-dam (DAM4) may be placed on the third sub-dam (DAM3), and a fourth sub-bank (BNK4) may be placed on the third sub-bank (BNK3). The fourth sub-dam (DAM4) and the fourth sub-bank (BNK4) may be formed of the same material and may be placed on the same layer. The fourth sub-dam (DAM4) and the fourth sub-bank (BNK4) may be structures for supporting a mask when manufacturing a display panel (100). Due to the fourth sub-dam (DAM4) and the fourth sub-bank (BNK4), the mask can be stably supported without sagging. The fourth sub-dam (DAM4) may be omitted.

[0184] The first encapsulating inorganic film (TFE1) may be placed in the first non-display area (NDA1), the dam area (DAMA), the inorganic encapsulating area (CVD), and the bank area (BNKA). The first encapsulating inorganic film (TFE1) may be placed on the light-emitting part defining film (180), the valley structure (ADAM), the dam (DAM), the first sub-power wiring (VSL1), and the bank (BNK). The encapsulating organic film (TFE2) may be placed in the first non-display area (NDA1) and the dam area (DAMA). Since the encapsulating organic film (TFE2) cannot extend beyond the dam (DAM) and the valley structure (ADAM), the first encapsulating inorganic film (TFE1) and the second encapsulating inorganic film (TFE3) may come into contact with each other in the inorganic encapsulating area (CVD). As a result, an inorganic encapsulating structure may be formed in the inorganic encapsulating area (CVD). The second encapsulating inorganic membrane (TFE3) can be placed in the first non-marking area (NDA1), dam area (DAMA), inorganic encapsulating area (CVD), and bank area (BNKA).

[0185] FIG. 11 is a cross-sectional view showing an example of a display panel cut along C-C' of FIG. 7b.

[0186] Referring to FIG. 11, the second power wiring (VDL) may include a third sub-power wiring (VDL1), a fourth sub-power wiring (VDL2), and a fifth sub-power wiring (VDL3).

[0187] The fourth sub-power wiring (VDL2) may be placed on the second interlayer insulating film (142). The fourth sub-power wiring (VDL2) may be placed in the first non-display area (NDA1) and the dam area (DAMA). The fourth sub-power wiring (VDL2) may overlap with the dam (DAM) and the valley structure (ADAM) in the third direction (Z-axis direction). The fourth sub-power wiring (VDL2) is formed of the same material as the second sub-power wiring (VSL2) and may be placed in the same layer.

[0188] The third sub-power wiring (VDL1) may be placed on the first sub-dam (DAM1) and the first sub-bank (BNK1). The third sub-power wiring (VDL1) may be connected to the fourth sub-power wiring (VDL2) through the second power contact hole (VDCT1). The second power contact hole (VDCT1) may be placed in the dam area (DAMA).

[0189] The fifth sub-power wiring (VDL3) may be placed on the first sub-dam (DAM1) and the first organic film (160). The fifth sub-power wiring (VDL3) may be connected to the fourth sub-power wiring (VDL2) through the third power contact hole (VDCT2). The third power contact hole (VDCT2) may be placed in the first non-display area (NDA1).

[0190] The third sub-power wiring (VDL1) and the fifth sub-power wiring (VDL3) are formed of the same material as the first sub-power wiring (VSL1) and can be placed on the same layer.

[0191] A second sub-dam (DAM2) and a second sub-bank (BNK2) may be placed on the third sub-power wiring (VDL1). A first valley structure (ADAM1) and a second organic membrane (161) may be placed on the fifth sub-power wiring (VDL3).

[0192] In addition, the descriptions of the dam (DAM), valley structure (ADAM), bank (BNK), and bag layer (TFEL) are substantially the same as those described in conjunction with Fig. 11, so the descriptions of these are omitted.

[0193] FIG. 12a is a cross-sectional view showing an example of a display panel cut along G-G' of FIG. 7b.

[0194] Referring to FIG. 12a, the third sub-bank (BNK3) may be omitted in a portion of the bank area (BNKA). For example, in the bank area (BNKA), the first sub-power wiring (VSL1) of the first power wiring (VSL) may overlap with the third sub-bank (BNK3), whereas the third sub-power wiring (VDL1) of the second power wiring (VDL) may not overlap with the third sub-bank (BNK3). When the third sub-bank (BNK3) is omitted, the height of the contact hole for connecting the touch wiring (TL in FIG. 10 and FIG. 11) placed on the second encapsulating inorganic film (TFE3) to the touch bending wiring (not shown) placed in the bending area (BA) may be reduced. Therefore, the formation of the contact hole for connecting the touch wiring (TL in FIG. 10 and FIG. 11) and the touch bending wiring (not shown) may be easier.

[0195] FIG. 12b is a cross-sectional view showing an example of a display panel cut along D-D' of FIG. 8. FIG. 12c is an enlarged view of area H of FIG. 12b.

[0196] Referring to FIGS. 12b and 12c, in the inorganic encapsulation region (CVD), a first sub-power wiring (VSL1) and a plurality of first moisture-permeability prevention patterns (TP1) can be disposed on a second interlayer insulating film (142). The first sub-power wiring (VSL1) and the plurality of first moisture-permeability prevention patterns (TP1) can be formed integrally. That is, the first sub-power wiring (VSL1) and the plurality of first moisture-permeability prevention patterns (TP1) can be formed of the same material and disposed on the same layer.

[0197] Meanwhile, as shown in FIG. 12c, an organic film is not placed between the first sub-power wiring (VSL1) and the first encapsulated inorganic film (TFE1) in the inorganic encapsulation region (CVD). Because the step coverage of the first encapsulated inorganic film (TFE1) and the second encapsulated inorganic film (TFE2) is poor, if the slope of the side of the first sub-power wiring (VSL1) is large, the first sub-power wiring (VSL1) may not be properly covered by the first encapsulated inorganic film (TFE1) and the second encapsulated inorganic film (TFE2). That is, due to the slope of the side of the first sub-power wiring (VSL1), a void (OP) may occur in the first encapsulated inorganic film (TFE1) and the second encapsulated inorganic film (TFE2). Step coverage refers to a film formed by a predetermined deposition method that is formed so as to be continuous without being broken at the part where a step is formed.

[0198] In this case, a void (OP) in the inorganic encapsulation region (CVD) may be formed along the side of the first sub-power wiring (VSL1). Therefore, a path (MP1) for external air or moisture to pass through the void (OP) in the inorganic encapsulation region (CVD) may be formed along the side of the first sub-power wiring (VSL1). If the first power wiring (VSL) includes a plurality of first moisture-prevention patterns (TP1), the length of the side of the first power wiring (VSL) may include the sum of the lengths of the perimeters of the plurality of first moisture-prevention patterns (TP1). Therefore, if the first power wiring (VSL) includes a plurality of first moisture-prevention patterns (TP1), the length of the side of the first power wiring (VSL) may be longer than if the first power wiring (VSL) does not include a plurality of first moisture-prevention patterns (TP1). Accordingly, due to the plurality of first moisture-permeability prevention patterns (TP1), the moisture penetration path (MP1) of external air or moisture through the pore (OP) can be extended. Therefore, due to the plurality of first moisture-permeability prevention patterns (TP1), the penetration of external air or moisture can be delayed or prevented. Thus, even if the width of the inorganic encapsulation region is reduced, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation region from being damaged by air or moisture.

[0199] FIG. 13 is a cross-sectional view showing an example of a display panel cut along E-E' of FIG. 9.

[0200] Referring to FIG. 13, in the bank region (BNKA), a first sub-power wiring (VSL1) and a plurality of first moisture-permeability prevention patterns (TP1) can be placed on a first sub-bank (BNK1), which is an organic film. The first sub-power wiring (VSL1) and the plurality of first moisture-permeability prevention patterns (TP1) can be formed integrally. That is, the first sub-power wiring (VSL1) and the plurality of first moisture-permeability prevention patterns (TP1) are formed of the same material and can be placed on the same layer.

[0201] Meanwhile, the first sub-power wiring (VSL1) and a plurality of first moisture-proof patterns (TP1) in the first non-display area (NDA1) are arranged on the first organic film (160), which is an organic film, and thus differ from the bank area (BNKA), so the description thereof is omitted.

[0202] FIG. 14 is a cross-sectional view showing another example of a display panel cut along E-E' of FIG. 9.

[0203] The embodiment of FIG. 14 differs from the embodiment of FIG. 13 in that a second sub-bank (BNK2) is placed on the first sub-power wiring (VSL1) in the bank area (BNKA), but the second sub-bank (BNK2) is not placed on the plurality of first moisture-proof patterns (TP1).

[0204] Referring to FIG. 14, in the bank region (BNKA), the first sub-power wiring (VSL1) is placed on the first sub-bank (BNK1), and the second sub-bank (BNK2) may be placed on the first sub-power wiring (VSL1). In contrast, a plurality of first moisture-permeability prevention patterns (TP1) may be placed on the second interlayer insulating film (142), and the second sub-bank (BNK2) may not be placed on the plurality of first moisture-permeability prevention patterns (TP1). That is, the plurality of first moisture-permeability prevention patterns (TP1) may not overlap with the bank (BNK). As a result, the pores (OP) of the inorganic encapsulation region (CVD) are not connected to the second sub-bank (BNK2), which is an organic film serving as a moisture permeability path, so the permeation of external air or moisture may be further delayed or prevented. Therefore, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation region from being damaged by air or moisture. At this time, the area from which the bank (BNK) has been removed may have a planar shape such as a polygon, circle, or ellipse, like a triangle and a square.

[0205] FIG. 15 is a cross-sectional view showing another example of a display panel cut along E-E' of FIG. 9.

[0206] The embodiment of FIG. 15 differs from the embodiment of FIG. 13 in that a second sub-bank (BNK2) is placed on the first sub-power wiring (VSL1) in the bank area (BNKA), but the second sub-bank (BNK2) is not placed on the plurality of first moisture-permeable prevention patterns (TP1).

[0207] Referring to FIG. 15, in the bank area (BNKA), a first sub-power wiring (VSL1) and a plurality of first moisture-permeability prevention patterns (TP1) may be placed on the first sub-bank (BNK1). At this time, a second sub-bank (BNK2) may be placed on the first sub-power wiring (VSL1) in the bank area (BNKA), but the second sub-bank (BNK2) may not be placed on the plurality of first moisture-permeability prevention patterns (TP1). That is, the plurality of first moisture-permeability prevention patterns (TP1) may not overlap with the second sub-bank (BNK2), the third sub-bank (BNK3), and the fourth sub-bank (BNK4). As a result, since the pores (OP) of the inorganic encapsulation area (CVD) are not connected to the second sub-bank (BNK2), which is an organic film serving as a moisture permeability path, the permeation of external air or moisture may be further delayed or prevented. Therefore, it is possible to prevent organic light-emitting elements of light-emitting parts adjacent to the inorganic encapsulation region from being damaged by air or moisture. At this time, the region from which the second sub-bank (BNK2), third sub-bank (BNK3), and fourth sub-bank (BNK4) have been removed may have a planar shape such as a polygon, circle, or ellipse, like a triangle and a square.

[0208] FIG. 16 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment.

[0209] The embodiment of FIG. 16 differs from the embodiment of FIG. 7b only in that the plurality of first moisture-permeability prevention patterns (TP1) and the plurality of second moisture-permeability prevention patterns (TP2) have a triangular planar shape, so the description of FIG. 16 is omitted.

[0210] FIG. 17 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment.

[0211] The embodiment of FIG. 17 differs from the embodiment of FIG. 7b only in that the plurality of first moisture-permeability prevention patterns (TP1) and the plurality of second moisture-permeability prevention patterns (TP2) have a rectangular planar shape, so the description of FIG. 17 is omitted.

[0212] Meanwhile, the plurality of first moisture-permeability prevention patterns (TP1) and the plurality of second moisture-permeability prevention patterns (TP2) are illustrated in FIG. 8 as having an elliptical planar shape, in FIG. 16 as having a triangular planar shape, and in FIG. 17 as having a square planar shape, but the embodiments of the present specification are not limited thereto. That is, the plurality of first moisture-permeability prevention patterns (TP1) and the plurality of second moisture-permeability prevention patterns (TP2) may have polygonal, circular, or irregular planar shapes other than triangles and squares.

[0213] FIG. 18 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment. FIG. 19 is a layout diagram showing the first power wiring of the bank area of ​​FIG. 18.

[0214] The embodiments of FIGS. 18 and 19 differ from the embodiments of FIGS. 7b and 9 in that the size of each of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation region (CVD) is different from the size of each of the plurality of first moisture-permeability prevention patterns (TP1) in the bank region (BNKA). FIGS. 18 and 19 will be described primarily in terms of the differences from the embodiments of FIGS. 7b and 9.

[0215] Referring to FIGS. 18 and 19, the size of each of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic bag region (CVD) may be larger than the size of each of the plurality of first moisture-permeability prevention patterns (TP1”) in the bank region (BNKA). For example, as shown in FIG. 8, the length (a) in the first direction (X-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic bag region (CVD) may be longer than the length (c) in the first direction (X-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1”) in the bank region (BNKA) as shown in FIG. 19. Additionally, as shown in FIG. 8, the length (b) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic bag region (CVD) may be longer than the length (d) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1”) in the bank region (BNKA) as shown in FIG. 19.

[0216] Since the size of each of the multiple first moisture-permeability prevention patterns (TP1) in the inorganic bag region (CVD) is different from the size of each of the multiple first moisture-permeability prevention patterns (TP1”) in the bank region (BNKA), the length of the first moisture-permeability prevention patterns (TP1) per unit area in the inorganic bag region (CVD) may be different from the length of the multiple first moisture-permeability prevention patterns (TP1”) per unit area in the bank region (BNKA). Additionally, since the size of each of the multiple first moisture-permeability prevention patterns (TP1) in the inorganic bag region (CVD) is different from the size of each of the multiple first moisture-permeability prevention patterns (TP1”) in the first non-display region (NDA1), the length of the first moisture-permeability prevention patterns (TP1) per unit area in the inorganic bag region (CVD) may be different from the length of the multiple first moisture-permeability prevention patterns (TP1”) per unit area in the first non-display region (NDA1). The unit area may be a predetermined area, for example, an area corresponding to x㎛ in the first direction (X-axis direction) and y㎛ in the second direction (Y-axis direction).

[0217] When the width of the inorganic encapsulation area (CVD) decreases as the non-display area (NDA) is reduced due to the expansion of the display area (DA), the moisture penetration path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation area (CVD) may be 540 μm or more by increasing the size of the plurality of first moisture penetration prevention patterns (TP1) in the inorganic encapsulation area (CVD). That is, the size of each of the plurality of first moisture penetration prevention patterns (TP1) in the inorganic encapsulation area (CVD) varies according to the width of the inorganic encapsulation area (CVD), but the size of each of the plurality of first moisture penetration prevention patterns (TP1”) in the bank area (BNKA) does not need to be. Therefore, the size of each of the plurality of first moisture penetration prevention patterns (TP1) in the inorganic encapsulation area (CVD) may be larger than the size of each of the plurality of first moisture penetration prevention patterns (TP1”) in the bank area (BNKA).

[0218] Additionally, the size of each of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic bag area (CVD) may be larger than the size of each of the plurality of first moisture-permeability prevention patterns (TP1”) in the dam area (DAMA) and the non-marked area (NDA1). In this case, the size of each of the plurality of first moisture-permeability prevention patterns (TP1”) in the dam area (DAMA) and the non-marked area (NDA1) may be substantially the same as the size of each of the plurality of first moisture-permeability prevention patterns (TP1”) in the bank area (BNKA), but the embodiments of this specification are not limited thereto.

[0219] Furthermore, the size of each of the plurality of second moisture-permeability prevention patterns (TP2) in the inorganic bag region (CVD) may be larger than the size of each of the plurality of second moisture-permeability prevention patterns (TP2”) in the bank region (BNKA). Additionally, the size of each of the plurality of second moisture-permeability prevention patterns (TP2) in the inorganic bag region (CVD) may be larger than the size of each of the plurality of second moisture-permeability prevention patterns (TP2”) in the dam region (DAMA) and the non-display region (NDA1). In this case, the size of each of the plurality of second moisture-permeability prevention patterns (TP1”) in the dam region (DAMA) and the non-display region (NDA1) may be substantially the same as the size of each of the plurality of second moisture-permeability prevention patterns (TP2”) in the bank region (BNKA), but the embodiments of this specification are not limited thereto.

[0220] In this case, since the size of each of the multiple second moisture-permeability prevention patterns (TP2) in the inorganic bag area (CVD) is different from the size of each of the multiple first moisture-permeability prevention patterns (TP2”) in the bank area (BNKA), the length of the second moisture-permeability prevention patterns (TP2) per unit area in the inorganic bag area (CVD) may be different from the length of the multiple second moisture-permeability prevention patterns (TP2”) per unit area in the bank area (BNKA). Additionally, since the size of each of the multiple second moisture-permeability prevention patterns (TP2) in the inorganic bag area (CVD) is different from the size of each of the multiple second moisture-permeability prevention patterns (TP2”) in the first non-display area (NDA1), the length of the second moisture-permeability prevention patterns (TP2) per unit area in the inorganic bag area (CVD) may be different from the length of the multiple second moisture-permeability prevention patterns (TP2”) per unit area in the first non-display area (NDA1). The unit area may be a predetermined area, for example, an area corresponding to x㎛ in the first direction (X-axis direction) and y㎛ in the second direction (Y-axis direction).

[0221] FIG. 20 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment. FIG. 21 is a layout diagram showing the first power wiring of the inorganic bag area of ​​FIG. 20.

[0222] The embodiments of FIGS. 20 and 21 differ from the embodiments of FIGS. 7b and 8 in that each of the plurality of first moisture-permeable patterns (TP1') in the inorganic encapsulation region (CVD) is indented from one side of the first sub-power wiring (VSL1). FIGS. 20 and 21 will be described primarily in terms of the differences from the embodiments of FIGS. 7b and 8.

[0223] Referring to FIGS. 20 and 21, each of the plurality of first moisture-proof patterns (TP1') in the inorganic encapsulation region (CVD) may have a shape such as a groove indented in a first direction (X-axis direction) from one side of the first sub-power wiring (VSL1). The groove may have a rectangular planar shape, but the embodiments of this specification are not limited thereto. In addition to a rectangle, the groove may have a planar shape of a circle or an ellipse, or a polygon such as a triangle.

[0224] In the inorganic bag region (CVD), a void (OP in FIG. 12c) may be formed along the side of the first sub-power wiring (VSL1). Therefore, a path (MP3) for external air or moisture to pass through the void (OP in FIG. 12c) in the inorganic bag region (CVD) may be formed along the side of the first sub-power wiring (VSL1). If the first power wiring (VSL) includes a plurality of first moisture-proof patterns (TP1'), the length of the side of the first power wiring (VSL) may include the sum of the lengths of the perimeters of the plurality of first moisture-proof patterns (TP1'). Therefore, if the first power wiring (VSL) includes a plurality of first moisture-proof patterns (TP1'), the length of the side of the first power wiring (VSL) may be longer than if the first power wiring (VSL) does not include a plurality of first moisture-proof patterns (TP1'). Accordingly, due to the multiple first moisture-preventing patterns (TP1'), the path (MP3) for external air or moisture to pass through the pore (OP in FIG. 12c) can be extended. Therefore, due to the multiple first moisture-preventing patterns (TP1'), the passage of external air or moisture can be delayed or prevented. Thus, even if the width of the inorganic encapsulation area is reduced, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation area from being damaged by air or moisture.

[0225] The length (e) in the first direction (X-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1') may be longer than the length (f) in the second direction (Y-axis direction), but the embodiments of this specification are not limited thereto. As the length (e) in the first direction (X-axis direction) and the length (f) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1') become longer, the perimeter length of each of the plurality of first moisture-permeability prevention patterns (TP1') may become longer. Recently, the non-display area (NDA) is being reduced to expand the display area (DA), and as a result, the width of the inorganic encapsulation area (CVD) is being reduced. However, as the width of the inorganic bag region (CVD) is reduced, the number of first moisture-permeability prevention patterns (TP1') is reduced, but if the length (e) in the first direction (X-axis direction) and / or the length (f) in the second direction (Y-axis direction) of each of the multiple first moisture-permeability prevention patterns (TP1') is increased, the path (MP3) for external air or moisture through the pores (OP in FIG. 12c) in the inorganic bag region (CVD) may not be reduced. Meanwhile, according to experiments by the inventors, when the path (MP1) for external air or moisture through the pores (OP in FIG. 12c) in the inorganic bag region (CVD) is 540 μm or more, the transmission of external air or moisture can be delayed or prevented.

[0226] Table 2 shows the width of the inorganic bag region (CVD), the number of first moisture-proof patterns (TP1), the length (a) in the first direction (X-axis direction) and the length (b) in the second direction (Y-axis direction) of the first moisture-proof pattern (TP1), and the total circumference of the plurality of first moisture-proof patterns (TP1) in the inorganic bag region (CVD).

[0227] 1 2 3 4 Width of the weapon bag area (CVD) 50㎛ 25㎛ 50㎛ 25㎛ Number of first moisture-permeable patterns (TP1) (n) 2 2 2 2 Length (a) of the first direction (X-axis direction) of the first moisture-permeable pattern (TP1) 125㎛ 132㎛ 135㎛ 137㎛ Length (b) of the second direction (Y-axis direction) of the first moisture-permeable pattern (TP1) 20㎛ 10㎛ 10㎛ 5㎛ Total perimeter of multiple first moisture-proof patterns (TP1) in the weapon bag area (CVD) 540㎛ 548㎛ 560㎛ 558㎛

[0229] In Table 2, the total perimeter of the plurality of first moisture-proof patterns (TP1) in the inorganic bag region (CVD) can be defined as “2(a+b)×n”.

[0230] Referring to Table 2, when two first moisture-permeability prevention patterns (TP1) are arranged, the width of the inorganic encapsulation area (CVD) is 50 μm, the length (a) in the first direction (X-axis direction) is 125 μm, and the length (b) in the second direction (Y-axis direction) is 20 μm, the total perimeter of the multiple first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation area (CVD) may be approximately 540 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation area (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0231] When two first moisture-permeability prevention patterns (TP1) are arranged, with a width of 25 μm in the inorganic encapsulation region (CVD), a length (a) in the first direction (X-axis direction) of 132 μm, and a length (b) in the second direction (Y-axis direction) of 10 μm, the total perimeter of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation region (CVD) may be approximately 548 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation region (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0232] When two first moisture-permeability prevention patterns (TP1) are arranged, with a width of 50 μm in the inorganic encapsulation region (CVD), a length (a) in the first direction (X-axis direction) of 135 μm, and a length (b) in the second direction (Y-axis direction) of 10 μm, the total perimeter of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation region (CVD) may be approximately 560 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation region (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0233] When two first moisture-permeability prevention patterns (TP1) are arranged, with a width of 25 μm in the inorganic encapsulation region (CVD), a length (a) in the first direction (X-axis direction) of 137 μm, and a length (b) in the second direction (Y-axis direction) of 5 μm, the total circumference of the plurality of first moisture-permeability prevention patterns (TP1) in the inorganic encapsulation region (CVD) may be approximately 558 μm. In this case, since the moisture permeability path (MP1) of external air or moisture through the pores (OP in FIG. 12c) in the inorganic encapsulation region (CVD) is 540 μm or more, the permeability of external air or moisture can be delayed or prevented.

[0234] As shown in Table 2, even if the width of the inorganic encapsulation area (CVD) is reduced, the total circumference of the plurality of first moisture-permeability prevention patterns (TP1') in the inorganic encapsulation area (CVD) can be controlled by adjusting the number of first moisture-permeability prevention patterns (TP1') and the length (a) in the first direction (X-axis direction) and the length (b) in the second direction (Y-axis direction) of each of the first moisture-permeability prevention patterns (TP1'). For example, if the number of first moisture-permeability prevention patterns (TP1') is reduced as much as the width of the inorganic encapsulation area (CVD) is reduced, but the length (a) in the first direction (X-axis direction) and / or the length (b) in the second direction (Y-axis direction) of each of the plurality of first moisture-permeability prevention patterns (TP1') is increased, the moisture permeability path (MP3) of external air or moisture through the pore (OP in FIG. 12c) in the inorganic encapsulation area (CVD) may be 540 μm or more. Therefore, due to the plurality of first moisture-preventing patterns (TP1'), the penetration of external air or moisture can be delayed or prevented. Thus, even if the width of the inorganic encapsulation region is reduced, it is possible to prevent the organic light-emitting elements of the light-emitting parts adjacent to the inorganic encapsulation region from being damaged by air or moisture.

[0235] Furthermore, in the inorganic bag region (CVD), each of the plurality of second moisture-permeable patterns (TP2') may have a shape such as a groove indented in a first direction (X-axis direction) from one side of the third sub-power wiring (VDL1). The groove may have a rectangular planar shape, but the embodiments of this specification are not limited thereto. In addition to a rectangle, the groove may have a planar shape of a polygon such as a triangle, a circle, or an ellipse. Furthermore, since the plurality of second moisture-permeable patterns (TP2') are substantially identical to the plurality of first moisture-permeable patterns (TP1'), a description of the plurality of second moisture-permeable patterns (TP2') is omitted.

[0236] FIG. 22 is a cross-sectional view showing an example of a display panel cut along F-F' of FIG. 21.

[0237] Referring to FIG. 22, the first sub-power wiring (VSL1) can be placed on the first sub-bank (BNK1). The first sub-power wiring (VSL1) can be spaced apart by the first moisture-proof pattern (TP1') by the length (f) of the second direction (Y-axis direction) of the first moisture-proof pattern (TP1').

[0238] FIG. 23 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment.

[0239] The embodiment of FIG. 23 differs from the embodiment of FIG. 20 only in that the groove formed by the plurality of first moisture-permeability prevention patterns (TP1') and the plurality of second moisture-permeability prevention patterns (TP2') has a triangular planar shape, so the description of FIG. 23 is omitted.

[0240] FIG. 24 is a layout diagram showing in detail a dam area, an inorganic bag area, and a bank area according to another embodiment.

[0241] The embodiment of FIG. 24 differs from the embodiment of FIG. 7b only in that a plurality of first moisture-proof patterns (TP1') indented from one side of the first sub-power wiring (VSL1) in the inorganic encapsulation region (CVD), as well as a plurality of first moisture-proof patterns (TP) protruding from one side of the first sub-power wiring (VSL1), are arranged, so the description of FIG. 24 is omitted.

[0242] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0243] 10: Display device 100: Display panel 200: Display driving circuit 300: Circuit board

Claims

Claim 1 A substrate comprising a display area and a non-display area; a pixel electrode disposed on the display area of ​​the substrate; an organic light-emitting layer disposed on the pixel electrode; a common electrode disposed on the organic light-emitting layer; a first encapsulating inorganic film disposed on the common electrode; an encapsulating organic film disposed on the first encapsulating inorganic film; a second encapsulating inorganic film disposed on the encapsulating organic film; a dam disposed on the non-display area of ​​the substrate; a bank disposed on the non-display area of ​​the substrate and disposed outside the dam; an inorganic encapsulating area disposed between the dam and the bank in the non-display area of ​​the substrate, wherein the first encapsulating inorganic film and the second encapsulating inorganic film are in contact; and a dam area where the dam is disposed, a bank area where the bank is disposed, and a first power wiring disposed in the inorganic encapsulating area in the non-display area of ​​the substrate, wherein the first power wiring comprises a first sub-power wiring; A display device comprising a plurality of moisture-proof patterns that protrude from one side of the first sub-power wiring when viewed in a planar view and are disposed in the inorganic bag area, wherein the length of the plurality of moisture-proof patterns per unit area in the inorganic bag area is different from the length of the plurality of moisture-proof patterns per unit area in the bank area. Claim 2 In claim 1, the plurality of moisture-permeability prevention patterns are a display device having a planar shape of a circle, ellipse, or polygon. Claim 3 A display device according to claim 1, wherein the total length of the perimeter of the plurality of moisture-permeability prevention patterns disposed in the inorganic bag area is 540㎛ or more. Claim 4 A display device according to claim 1, wherein the first power wiring extends in one direction, and the length of each of the plurality of moisture-permeability prevention patterns in the one direction is equal to the length of the other direction intersecting the one direction. Claim 5 A display device according to claim 1, wherein the first power wiring extends in one direction, and the length of each of the plurality of moisture-permeability prevention patterns in the one direction is smaller than the length of the other direction intersecting the one direction. Claim 6 In claim 1, the plurality of moisture-permeability prevention patterns are a display device disposed in the bank area. Claim 7 In claim 6, the size of any one of the plurality of moisture-permeability prevention patterns disposed in the weapon bag area is different from the size of any one of the plurality of moisture-permeability prevention patterns disposed in the bank area. Claim 8 A display device according to claim 7, wherein the bank comprises: a first bank disposed on the substrate; a second bank disposed on the first bank; a third bank disposed on the second bank; and a fourth bank disposed on the third bank. Claim 9 In claim 8, the plurality of moisture-permeability prevention patterns are a display device disposed on the first bank. Claim 10 In claim 8, the plurality of moisture-permeability prevention patterns are a display device that does not overlap with the second bank, the third bank, and the fourth bank. Claim 11 In claim 8, the plurality of moisture-permeability prevention patterns are a display device that does not overlap with the first bank, the second bank, the third bank, and the fourth bank. Claim 12 In claim 1, the plurality of moisture-permeability prevention patterns are a display device disposed in the dam area. Claim 13 In claim 1, the plurality of moisture-permeability prevention patterns are a display device disposed in a first non-display area between the dam and the display area. Claim 14 In claim 13, the size of any one of the plurality of moisture-proof patterns disposed in the weapon bag area is different from the size of any one of the plurality of moisture-proof patterns disposed in the first non-display area. Claim 15 In claim 13, a display device wherein the length of the plurality of moisture-proof patterns per unit area in the inorganic bag region is different from the length of the plurality of moisture-proof patterns per unit area in the first non-display region. Claim 16 In claim 13, the display device further comprises a first power wiring that is connected to the first sub-power wiring through a first power contact hole in the first non-display area. Claim 17 In claim 16, the first power contact hole is a display device disposed in the dam area. Claim 18 A substrate comprising a display area and a non-display area; a pixel electrode disposed on the display area of ​​the substrate; an organic light-emitting layer disposed on the pixel electrode; a common electrode disposed on the organic light-emitting layer; a first encapsulating inorganic film disposed on the common electrode; an encapsulating organic film disposed on the first encapsulating inorganic film; a second encapsulating inorganic film disposed on the encapsulating organic film; a dam disposed on the non-display area of ​​the substrate; a bank disposed on the non-display area of ​​the substrate and disposed outside the dam; an inorganic encapsulating area disposed between the dam and the bank in the non-display area of ​​the substrate, wherein the first encapsulating inorganic film and the second encapsulating inorganic film are in contact; and a dam area where the dam is disposed, a bank area where the bank is disposed, and a first power wiring disposed in the inorganic encapsulating area in the non-display area of ​​the substrate, wherein the first power wiring comprises a first sub-power wiring; A display device comprising a plurality of first moisture-proof patterns that are indented from one side of the first sub-power wiring when viewed in a planar view and disposed in the inorganic encapsulation area. Claim 19 A display device according to claim 18, wherein the total length of the perimeter of the plurality of first moisture-permeable patterns disposed in the inorganic bag area is 540 μm or more. Claim 20 In claim 18, the first power wiring extends in one direction, and the length of each of the plurality of first moisture-permeable patterns in the one direction is smaller than the length of the other direction intersecting the one direction. Claim 21 In claim 18, the display device comprises a plurality of second moisture-proof patterns that protrude from one side of the first sub-power wiring and are disposed in the inorganic encapsulation area. Claim 22 A substrate comprising a display area and a non-display area; a pixel electrode disposed on the display area of ​​the substrate; an organic light-emitting layer disposed on the pixel electrode; a common electrode disposed on the organic light-emitting layer; a first encapsulating inorganic film disposed on the common electrode; an encapsulating organic film disposed on the first encapsulating inorganic film; a second encapsulating inorganic film disposed on the encapsulating organic film; a dam disposed on the non-display area of ​​the substrate; and an inorganic encapsulating area disposed outside the dam in the non-display area of ​​the substrate, wherein the first encapsulating inorganic film and the second encapsulating inorganic film are in contact. A display device comprising a dam area in which the dam is disposed in a non-display area of ​​the substrate, a first non-display area disposed between the display area and the dam area, and a first power wiring disposed in the inorganic encapsulation area and including a plurality of moisture-preventing patterns, wherein the plurality of moisture-preventing patterns include a first moisture-preventing pattern disposed in the first non-display area and a second moisture-preventing pattern disposed in the inorganic encapsulation area, and the planar shape of the first moisture-preventing pattern is different from the planar shape of the second moisture-preventing pattern. Claim 23 In claim 22, the first power wiring further includes a first sub-power wiring, and the second moisture-proof pattern is a display device intruded from one side of the first sub-power wiring. Claim 24 In claim 22, the first power wiring further includes a first sub-power wiring, and the first moisture-proof pattern is a display device protruding from one side of the first sub-power wiring. Claim 25 In claim 22, the plurality of moisture-permeability prevention patterns further include a third moisture-permeability prevention pattern disposed in the inorganic bag area, and the planar shape of the third moisture-permeability prevention pattern is different from the planar shape of the second moisture-permeability prevention pattern. Claim 26 In claim 25, the planar shape of the third moisture-permeability prevention pattern is the same as the planar shape of the first moisture-permeability prevention pattern. Claim 27 In claim 25, the first power wiring further includes a first sub-power wiring, and the third moisture-proof pattern is a display device protruding from one side of the first sub-power wiring.

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