Device for Chucking Mask

Abstract

The present invention relates to a mask fixing device capable of reducing shadowing by more effectively fixing a mask positioned for substrate deposition. According to one embodiment of the present invention, a mask fixing device is disclosed comprising: a substrate electrostatic chuck that fixes a substrate to be deposited using electrostatic force from the upper side; a metal support that supports a mask positioned on the lower side of the substrate; a metal support frame that is positioned on the edge of the metal support and welded to the metal support; a mask electrostatic chuck that fixes the mask from the lower side of the mask; and a mask chuck stage on which the metal support frame and the mask electrostatic chuck are positioned.

Description

Technology Field

[0001] The present invention relates to a mask fixing device, and more specifically, to a mask fixing device capable of reducing shadow phenomena by more effectively fixing a mask placed for substrate deposition. Background Technology

[0002] When manufacturing a flat panel display, a film formation process is generally performed by deposition on the surface of a substrate (10).

[0003] At this time, a mask (20) for forming a pattern of a film formed on a substrate (10) is placed, and the substrate (10) and the mask (20) can be fixed by an electrostatic chuck, etc.

[0004] FIG. 1 is a drawing illustrating a fixing structure of a conventional substrate (10) and a mask (20). As shown in FIG. 1, a substrate electrostatic chuck (40) is provided on the upper side of the substrate (10) on which deposition is to be performed, for fixing the substrate (10) by electrostatic force. In addition, a magnet (30) is provided on the upper side of the substrate electrostatic chuck (40).

[0005] A mask (20) is placed on the lower side of the substrate (10). A support (50) for supporting the mask (20) is provided on the lower side of the mask (20). The support (50) is pulled by a magnet (30) provided on the upper side, so that it can support the mask (20) from the lower side, which is sagging due to gravity.

[0006] Recently, there has been a growing need to apply masks made of thinner silicon materials for higher resolution deposition. However, since these silicon masks are thin and lightweight, they are prone to vibration and sagging due to gravity. Consequently, high-resolution deposition is difficult due to these movements and sagging, leading to a need for a mask fixing device that can solve these problems. The problem to be solved

[0007] The present invention aims to solve the above-mentioned problems and provides a mask fixing device capable of increasing the resolution and effective yield area of ​​a deposition pattern.

[0008] The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0009] In order to solve the above-mentioned problem, according to one embodiment of the present invention, a mask fixing device is disclosed comprising: a substrate electrostatic chuck for fixing a substrate to be deposited using electrostatic force from the upper side; a metal support for supporting a mask disposed on the lower side of the substrate; a metal support frame disposed on the edge of the metal support and welded to the metal support; a mask electrostatic chuck for fixing the mask on the lower side of the mask; and a mask chuck stage on which the metal support frame and the mask electrostatic chuck are disposed.

[0010] The metal support frame can be placed on a mask chuck stage at a position corresponding to the outer circumference of the mask.

[0011] The metal support is extended to the top of the metal support frame and welded to the top of the metal support frame, and the mask electrostatic chuck on the lower side of the metal support can be positioned inside the rim of the metal support frame.

[0012] The above mask electrostatic chuck has a chucking surface in contact with the mask that is exposed discontinuously spaced apart from the perimeter of the metal support, and the metal support and the metal support frame may be formed to be interconnected through the spaced-apart chucking surface of the mask electrostatic chuck.

[0013] The above mask electrostatic chuck and the above metal support frame can be formed in a circular shape.

[0014] The above mask electrostatic chuck may include a plurality of chucking surfaces that are in contact with the mask and are spaced apart from each other; and a groove formed between the chucking surfaces that are spaced apart.

[0015] The metal support may include a net portion formed in a grid shape to support the mask; and a rib extending from the outer side of the net portion through the groove of the mask electrostatic chuck to a metal support frame disposed around the outer circumference of the mask electrostatic chuck. Effects of the invention

[0016] According to the mask fixing device of the present invention, since the part where the metal support and the metal support frame are welded is located on the outer side of the mask, it does not hinder the close contact between the mask and the metal support, so the close contact between the mask and the metal support can be maintained even to the outer part of the mask, thereby reducing the shadow phenomenon and increasing the resolution of the enlarged pattern and the effective yield area.

[0017] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims. Brief explanation of the drawing

[0018] The summary described above, as well as the detailed description of the preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings. Preferred embodiments are illustrated in the drawings for the purpose of illustrating the invention. However, it should be understood that the present application is not limited to the exact arrangements and means illustrated. FIG. 1 is a drawing illustrating the structure of a conventional mask fixing device; FIG. 2 is a drawing illustrating the structure of a mask fixing device according to an embodiment of the present invention; FIG. 3 is a perspective view illustrating a metal support, a metal support frame, and a mask electrostatic chuck among a mask fixing device according to an embodiment of the present invention; FIG. 4 is a perspective view illustrating a mask electrostatic chuck according to one embodiment of the present invention; FIG. 5 is a perspective view illustrating a metal support and a metal support frame according to one embodiment of the present invention. Specific details for implementing the invention

[0019] Preferred embodiments of the present invention, in which the objectives of the present invention can be specifically realized, will be described below with reference to the attached drawings. In describing these embodiments, the same names and reference numerals are used for identical components, and additional explanations thereof will be omitted.

[0020] Hereinafter, an embodiment of the mask (20) fixing device of the present invention will be described.

[0021] As shown in FIGS. 2 and 3, the mask (20) fixing device according to the present embodiment may include a substrate electrostatic chuck (140), a metal support (150), a metal support frame (160), a mask electrostatic chuck (170), and a mask chuck stage (180).

[0022] The above-described substrate electrostatic chuck (140) is a component that fixes the substrate (10) on which deposition is to be performed from the upper side using static electricity. Accordingly, the substrate (10) is placed on the lower side of the above-described substrate electrostatic chuck (140). Additionally, a magnet (130) may be provided on the upper side of the above-described substrate electrostatic chuck (140).

[0023] A mask (20) is disposed on the lower side of the substrate (10). The mask (20) may be made of silicon material and can form a deposition pattern of a deposition material deposited on the substrate (10). Since a silicon mask (20) can support higher resolution, its use has recently increased.

[0024] And, a metal support (150) is provided to support the mask (20) from the lower side of the mask (20).

[0025] The metal support (150) is formed in the shape of a grid net and is a component that supports the mask (20) from sagging due to gravity.

[0026] In addition, a metal support frame (160) is provided, which is positioned on the outer edge of the metal support (150) and welded to the metal support (150) to support the metal support (150).

[0027] And, the mask electrostatic chuck (170) may be provided to fix the mask (20) by electrostatic force from the lower side of the mask (20).

[0028] Then, a mask chuck stage (180) is arranged on which the metal support frame (160) and the mask electrostatic chuck (170) are placed. The mask electrostatic chuck (170) and the metal support frame (160) can be placed on the mask chuck stage (180).

[0029] At this time, as shown in FIG. 2, the metal support frame (160) is placed on a mask chuck stage (180) at a position corresponding to the outer circumference of the mask (20), and the metal support (150) can be extended to the top of the metal support frame (160) and welded to the top of the metal frame.

[0030] Since the metal support (150) is extended to a metal support frame (160) positioned outside the mask (20) and then welded, a weld bead (165) created by welding can be formed on the outside of the mask (20).

[0031] Therefore, the welding bead (165) may not interfere with the metal support (150) supporting the mask (20).

[0032] At this time, the mask electrostatic chuck (170) must be provided on the lower side of the mask (20), so it is located on the inner side of the edge of the metal support frame (160). However, when the mask electrostatic chuck (170) is located on the inner side of the edge of the metal support frame (160) in this way, the mask electrostatic chuck (170) is positioned on the lower side of the metal support (150), and if the metal support (150) is positioned between the mask electrostatic chuck (170) and the mask (20), chucking using electrostatic force may be hindered.

[0033] Accordingly, a portion of the metal support (150) can be opened so that the mask electrostatic chuck (170) comes into direct contact with the mask (20), thereby allowing the mask electrostatic chuck (170) and the mask (20) to come into direct contact.

[0034] As illustrated in FIG. 3, the mask electrostatic chuck (170) and the metal support frame (160) are formed in a circular shape, and the chucking surface (172) of the mask electrostatic chuck (170) that contacts the mask (20) is exposed toward the mask (20) by being spaced apart discontinuously around the metal support (150), and the metal support (150) and the metal support frame (160) can be formed to be interconnected between the spaced-apart chucking surfaces (172) of the mask electrostatic chuck (170).

[0035] The above mask electrostatic chuck (170) may have a plurality of chucking surfaces (172) that are spaced apart from each other and contact the lower surface of the mask (20). The chucking surfaces (172) refer to parts that are in direct contact with the mask (20) and fix the mask (20) by electrostatic force.

[0036] And, a groove (174) may be formed between the chucking surface (172) and the chucking surface (172) that are spaced apart.

[0037] The metal support (150) is formed in a circular shape overall, as shown in FIG. 5, and may include a net portion (152) and a rib (154).

[0038] The net portion (152) is formed in a grid shape to support the mask (20), and the rib (154) extends from the outer side of the net portion (152) through a groove (174) formed between the chucking surface (172) of the mask electrostatic chuck (170) and extends to a metal support frame (160) placed on the outer circumference of the mask electrostatic chuck (170) and is welded to the metal support frame (160).

[0039] That is, since the metal support (150) is extended to the metal support frame (160) placed on the outside of the mask (20) and then welded, the weld bead (165) created by the welding is formed on the outside of the mask (20), so the weld bead (165) does not interfere with the metal support (150) supporting the mask (20), so the mask (20) can be supported more flatly, and the gap between the metal support (150) and the magnet (130) becomes narrower, so the amount of displacement of the metal support (150) being pulled upward becomes greater, thereby suppressing the increase in shadow and increasing the effective yield area.

[0040] Additionally, a rib (154) connecting the net portion (152) of the metal support (150) and the metal support frame (160) is extended and welded through the groove (174) of the chucking surface (172) of the mask electrostatic chuck (170), and since the chucking surface (172) of the mask electrostatic chuck (170) is exposed toward the mask (20), the mask electrostatic chuck (170) can smoothly chuck the mask (20) with electrostatic force.

[0041] As described above, preferred embodiments according to the present invention have been examined. It is obvious to those skilled in the art that, in addition to the embodiments described above, the present invention may be embodied in other specific forms without departing from the spirit or scope thereof. Therefore, the embodiments described above should be regarded as illustrative rather than restrictive, and accordingly, the present invention is not limited to the description above but may be modified within the scope of the appended claims and their equivalents. Explanation of the symbols

[0042] 10: Substrate 20: Mask 130: Magnet 140: Substrate electrostatic chuck 150: Metal support 152: Net part 154: Rib 160: Metal support frame 170: Mask electrostatic chuck 172: Chucking surface 174: Liv 180: Mask Chuck Stage

Claims

Claim 1 A mask fixing device comprising: a substrate electrostatic chuck for fixing a substrate on which deposition is to be performed using electrostatic force from the upper side; a metal support for supporting a mask disposed on the lower side of the substrate; a metal support frame disposed on the edge of the metal support and welded to the metal support; a mask electrostatic chuck for fixing the mask on the lower side of the mask; and a mask chuck stage on which the metal support frame and the mask electrostatic chuck are disposed; wherein the metal support frame is disposed on a mask chuck stage at a position corresponding to the outer perimeter of the mask, the metal support is extended to the upper end of the metal support frame and then welded to the upper end of the metal support frame, the chucking surface of the mask electrostatic chuck that contacts the mask is exposed discontinuously spaced apart from the perimeter of the metal support, and the metal support and the metal support frame are formed to be interconnected through the spaced-apart chucking surface of the mask electrostatic chuck. Claim 2 delete Claim 3 A mask fixing device according to claim 1, wherein the mask electrostatic chuck on the lower side of the metal support is disposed on the inner side of the edge of the metal support frame. Claim 4 delete Claim 5 A mask fixing device according to claim 1, wherein the mask electrostatic chuck and the metal support frame are formed in a circular shape. Claim 6 A mask fixing device according to claim 1, wherein the mask electrostatic chuck comprises: a plurality of chucking surfaces formed spaced apart from each other and in contact with the mask; and a groove formed between the chucking surfaces spaced apart. Claim 7 A mask fixing device according to claim 6, wherein the metal support comprises: a net portion formed in a grid shape to support the mask; and a rib extending from the outer side of the net portion through the groove of the mask electrostatic chuck to a metal support frame disposed on the outer periphery of the mask electrostatic chuck.

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