Processing apparatus

Abstract

(Problem) Provide a processing device capable of clearly capturing the edges of a workpiece. (Solution) A processing device comprises a holding table having a holding surface smaller than the workpiece holding the workpiece, a processing unit for processing the workpiece held on the holding table, an imaging unit for imaging the workpiece held on the holding table, and a control unit. The holding table has a reflection unit that surrounds the holding surface and can be positioned below the edge of the workpiece held on the holding surface, and at least a portion of the reflection unit is formed of a reflection member, and the edge of the workpiece is positioned above the reflection member and is imaged by the imaging unit.

Description

Technology Field

[0001] The present invention relates to a processing device. Background Technology

[0002] In a processing device that divides a workpiece into individual device chips, there is a method of capturing the edges of a workpiece at multiple points by an imaging unit while the workpiece is held on a holding table, detecting the edges by image processing, and calculating the center of the workpiece from the coordinates of the detected multiple edges. For example, Patent Document 1 discloses a technique for detecting the center by capturing and detecting the outer edge of a wafer at three or more points. Prior art literature

[0003] Japanese Patent Publication No. 2011-249572 The problem to be solved

[0004] Conventional processing devices had difficulty clearly capturing the edge of a workpiece while it was held on a holding table. In particular, when removing the outer circumference of a workpiece with a cutting blade, the processing device formed the holding surface smaller than the workpiece so that the cutting blade and the holding surface did not come into contact. In this case, since the conventional processing device did not have a member to support the lower edge of the workpiece, the image captured of the edge of the workpiece became blurry, and there was a possibility that the edge of the workpiece in the image would become unclear.

[0005] Accordingly, the objective of the present invention is to provide a processing device capable of clearly capturing the edges of a workpiece. means of solving the problem

[0006] According to the present invention, a processing device is provided comprising: a holding table having a holding surface smaller than that of a workpiece for holding a workpiece; a processing unit for processing the workpiece held on the holding table; an imaging unit for imaging the workpiece held on the holding table; and a control unit. The holding table has a reflection unit that surrounds the holding surface and can be positioned below the edge of the workpiece held on the holding surface, and at least a portion of the reflection unit is formed of a reflection member, and the edge of the workpiece is positioned above the reflection member and is imaged by the imaging unit.

[0007] Preferably, the imaging unit captures multiple edges of a workpiece located above the reflective member, and the control unit calculates the coordinates of the edges from the captured images to determine the center position of the workpiece.

[0008] Preferably, the cutting blade of the processing unit may be positioned at a predetermined distance from the edge of the workpiece relative to its center position, and the outer periphery of the workpiece may be removed by rotating the holding table and the cutting blade relative to each other.

[0009] Preferably, the reflection unit is located below the retaining surface.

[0010] Preferably, the workpiece is supported by interposing a sheet in the opening of an annular frame, and the reflection unit is a frame support unit that supports the annular frame. Effects of the invention

[0011] The present invention has the effect of being able to clearly image the edges of a workpiece. Brief explanation of the drawing

[0012] FIG. 1 is a perspective view showing an example of the configuration of a processing device related to an embodiment. FIG. 2 is a perspective view showing a workpiece to be processed by the processing device shown in FIG. 1. FIG. 3 is a perspective view showing an example of a retention table shown in FIG. 1. FIG. 4 is a side schematic diagram illustrating the relationship between the holding table shown in FIG. 3, the workpiece, and the processing unit. FIG. 5 is a cross-sectional schematic diagram illustrating an example of an imaging unit shown in FIG. 1. FIG. 6 is a schematic top view showing an example of the arrangement relationship between a holding table and a workpiece. Figure 7 is a schematic diagram showing an example of the arrangement relationship between the reflection unit and the imaging unit of the holding table. FIG. 8 is a drawing showing an example of an image in which a processing device captures the edge of a workpiece using a reflective part of a reflective unit. FIG. 9 is a drawing showing an example of an image in which a processing device captures the edge of a workpiece without using the reflective part of a reflective unit. FIG. 10 is a cross-sectional view illustrating an example of the relationship between the holding surface of a processing device and a reflection unit related to a modified example of an embodiment. FIG. 11 is a cross-sectional view illustrating another use example of a holding table of a processing device related to a modified example of an embodiment. Specific details for implementing the invention

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the embodiments below. Furthermore, the components described below include those that can be easily conceived by those skilled in the art and are substantially identical. Additionally, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or changes to the configurations may be made within the scope of not departing from the essence of the present invention.

[0014] In the embodiments described below, an XYZ orthogonal coordinate system is established, and the positional relationships of each part are described with reference to this XYZ orthogonal coordinate system. One direction within the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction within the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction is the Z-axis direction. The XY plane containing the X-axis and the Y-axis is parallel to the horizontal plane. The Z-axis direction orthogonal to the XY plane is the vertical direction.

[0015] An example of a processing device for processing a workpiece related to an embodiment is described based on the drawings. FIG. 1 is a perspective view showing an example of the configuration of a processing device related to an embodiment. FIG. 2 is a perspective view showing a workpiece to be processed by the processing device shown in FIG. 1. FIG. 3 is a perspective view showing an example of a holding table shown in FIG. 1. FIG. 4 is a side schematic diagram for explaining the relationship between the holding table shown in FIG. 3, the workpiece, and the processing unit. FIG. 5 is a cross-sectional schematic diagram explaining an example of an imaging unit shown in FIG. 1.

[0016] The processing device (1) shown in FIG. 1 related to the embodiment is a cutting device that cuts a workpiece (200), which is a workpiece shown in FIG. 2, with a cutting blade (21) and divides it into individual devices (204). In the embodiment, the workpiece (200) is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer, with silicon, sapphire, gallium, etc. as the substrate (201). In the workpiece (200), the device (204) is formed in an area divided in a grid shape by a plurality of planned division lines (203) formed in a grid shape on the upper surface (202) of the substrate (201). The upper surface (202) of the substrate (201) is the surface of the substrate (201) of the workpiece (200) held on the holding table (10).

[0017] Additionally, the workpiece (200) related to the embodiment may be a so-called TAIKO (registered trademark) wafer in which the central portion is thinned and the outer portion is thickened, or, in addition to the wafer, may be a rectangular package substrate having multiple devices encapsulated by resin, a ceramic substrate in which the device (204) and the planned division line (203) are not set, a ferrite substrate, a glass plate, or a substrate comprising at least one of nickel and iron. In the embodiment, the workpiece (200) has a sheet (211) attached to the outer edge of the back surface (205) and supported by the annular frame (210). The sheet (211) includes, for example, adhesive tape, adhesive sheet, etc. The work unit (250) supports the workpiece (200) by interposing a sheet (211) in the opening of the annular frame (210).

[0018] (Processing device)

[0019] A processing device (1) related to an embodiment comprises, as shown in FIG. 1, a holding table (10), a processing unit (20), an imaging unit (30), a moving unit (40), and a control unit (100). The holding table (10) holds a workpiece (200) by suctioning it onto a holding surface (11). The processing unit (20) performs cutting processing on the workpiece (200) held by the holding table (10) using a cutting blade (21) mounted on a spindle (22). The imaging unit (30) captures the workpiece (200) held by the holding table (10). The moving unit (40) moves the holding table (10) and the processing unit (20) relative to each other. The control unit (100) controls each component of the processing device (1).

[0020] The moving unit (40) comprises at least an X-axis moving unit (42) that processes and moves the holding table (10) in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit (41) that processes and moves the processing unit (20) and the imaging unit (30) in the Y-axis direction parallel to the horizontal direction and also orthogonal to the X-axis direction, and a Z-axis moving unit (43) that cuts and moves the processing unit (20) and the imaging unit (30) in the Z-axis direction.

[0021] The X-axis movement unit (42) moves the holding table (10) in the X-axis direction, thereby moving the holding table (10) and the processing unit (20) relatively along the X-axis direction. The Y-axis movement unit (41) moves the processing unit (20) in the Y-axis direction, which is the output direction, thereby moving the holding table (10) and the processing unit (20) relatively along the Y-axis direction. The Z-axis movement unit (43) moves the processing unit (20) in the Z-axis direction, which is the cut-and-feed direction, thereby moving the holding table (10) and the processing unit (20) relatively along the Z-axis direction.

[0022] The holding table (10) is a disc-shaped holding surface (11) formed of porous ceramic or the like, which holds the workpiece (200). The holding table (10) is formed to be freely movable in the X-axis direction by an X-axis moving unit (42) and to be freely rotated around an axis parallel to the Z-axis direction by a rotational driving source not shown. The holding table (10) has the holding surface (11) connected to a vacuum suction source not shown. The holding table (10) holds the workpiece (200) that is integrated with the annular frame (210) by means of a sheet (211) interposed thereon, and the workpiece (200) that is integrated with the annular frame (210) is held by suction when the holding surface (11) is sucked by the vacuum suction source.

[0023] As shown in FIGS. 3 and 4, the holding table (10) has a reflective unit (12) that surrounds the holding surface (11) and can be positioned below the edge of the workpiece (200) held on the holding surface (11). In this embodiment, the reflective unit (12) is a support unit that supports the workpiece (200) held on the holding surface (11). A plurality of reflective units (12) may be in contact with the workpiece (200) protruding outward from the holding surface (11) and directly support it from below in the vertical direction, or a plurality of reflective units (12) may be positioned below the edge of the workpiece (200) without directly contacting the workpiece (200). In the example shown in FIG. 3, the holding table (10) is described as having four reflection units (12), but it can be configured to have one or more reflection units (12). For example, in the case of one reflection unit (12), it may be an annular member surrounding the holding surface (11), and in the case of two or more reflection units, it may be a plurality of members arranged along the outer edge of the holding surface (11).

[0024] In the present invention, the reflection unit (12) has a frame support member (120) that supports an annular frame (210) of a workpiece (200) that protrudes outward from the holding surface (11) of the holding table (10). The frame support member (120) has a mounting part (121) on which the annular frame (210) is mounted, and a pressing member (122) that rotates around a horizontal axis of rotation relative to the mounting part (121). The frame support member (120) is configured such that the pressing member (122) rotates to press the annular frame (210) against the mounting part (121) to support the annular frame (210). The frame support member (120) is configured to be positioned below the edge of the workpiece (200) held on the holding surface (11) of the holding table (10). The frame support member (120) is formed to be movable in the diameter direction (horizontal direction) of the holding surface (11) of the holding table (10) on a guide rail (13) extending horizontally from the lower part of the holding surface (11) of the holding table (10). The frame support member (120) may be moved automatically by a driving means not shown, or moved by an operator.

[0025] The reflection unit (12) is formed with at least a portion of a reflection member. The reflection member includes, for example, a metal member such as SUS (Steel Use Stainless), or a paint formed as a reflection layer on the surface of the reflection unit (12). The reflection unit (12) is captured by an imaging unit with the edge of the workpiece (200) positioned above the reflection member. In this embodiment, the reflection unit (12) has a reflection portion (123) in which at least the upper surface is formed of a reflection member. The reflection portion (123) includes, for example, the mounting surface of the mounting portion (121), the surface of the pressing member (122) that is superimposed on the mounting portion (121), etc. The reflective portion (123) includes a surface that can be seen from the upper vertical direction of the processing device (1) and a surface that is captured together with the workpiece (200) in a state where the pressing member (122) is pressed (overlapping) against the mounting portion (121). The reflective portion (123) of the reflective unit (12) is positioned so that the edge (outer circumference) of the workpiece (200) overlaps when viewed from above, even if the size of the annular frame (210) is changed by the frame support portion (120) moving the guide rail (13).

[0026] In the case of a full cut trim that chamfers the outer periphery of a workpiece (200), there are many cases where an annular frame (210) is not used, but the processing device (1) is equipped with a movable frame support (120) so that it can be used in either case where an annular frame (210) is used or where it is not used.

[0027] As shown in FIG. 4, the processing unit (20) is a unit rotatably mounted with a cutting blade (21) for cutting a workpiece (200) held on a holding table (10). The processing unit (20) is configured to position the cutting blade (21) at any position on the holding surface (11) of the holding table (10) by means of a Y-axis moving unit (41) and a Z-axis moving unit (43). The processing unit (20) is equipped with a cutting blade (21) and a spindle (22). The cutting blade (21) is fixed to the tip of the spindle (22) and rotates around an axis parallel to the Y-axis direction in conjunction with the rotational movement of the spindle (22). The spindle (22) is rotatably supported in the spindle housing around an axis parallel to the Y-axis direction with its tip exposed to the outside from the spindle housing, and is housed in the spindle housing.

[0028] As shown in FIG. 1, the imaging unit (30) is fixed to the processing unit (20) so as to move integrally with the processing unit (20). In an embodiment, the imaging unit (30) is positioned in a position aligned with the processing unit (20) in the X-axis direction. As shown in FIG. 5, the imaging unit (30) is equipped with a casing (34) that accommodates an objective lens (31) facing a workpiece (200) held on a holding table (10) and has an opening (33) formed in a bottom portion (32) facing the workpiece (200), a flat protective plate (35) made of a transparent body covering the opening (33), and an imaging device (36).

[0029] The casing (34) accommodates the objective lens (31) within its lower portion. In the embodiment, the casing (34) is formed in a square shape and is attached to the processing unit (20). The opening (33) penetrates the bottom portion (32) of the casing (34), and in the embodiment, is formed in a circular shape and is formed in the center of the bottom portion (32). The flat shape of the protective plate (35) is formed in a square shape identical to the bottom portion (32) of the casing (34). The protective plate (35) is fixed to the lower surface of the bottom portion (32) of the casing (34). In the embodiment, the protective plate (35) is fixed to the lower surface of the bottom part (32) by adhesive to seal the opening (33) and prevent the intrusion of mist, consisting of cutting debris and cutting fluid, into the casing (34) from the opening (33).

[0030] The imaging device (36) is attached to the upper part of the casing (34) and captures the area to be divided of the workpiece (200) held on the holding table (10) before cutting through the objective lens (31), the aperture (33), and the protective plate (35). The imaging device (36) includes, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging device (36) captures the workpiece (200) held on the holding table (10) to obtain an image for performing alignment to align the position of the workpiece (200) and the cutting blade (21), and outputs the obtained image to the control unit (100).

[0031] Additionally, the casing (34) accommodates a light source (38) that emits light to illuminate a workpiece (200) held on a holding table (10) through an objective lens (31), an aperture (33), and a protective plate (35), and a half mirror (39) that reflects the light emitted by the light source (38) toward the objective lens (31) and allows an imaging unit (30) to image the workpiece (200) on the holding table (10) through the objective lens (31), etc. In the embodiment, the light source (38) is a light-emitting element such as an LED (Light Emitting Diode), but in the present invention, it may be an optical fiber that propagates light emitted by a light-emitting element such as an LED.

[0032] Returning to FIG. 1, the control unit (100) controls each of the components described above of the processing device (1) to perform a processing operation on the workpiece (200) in the processing device (1). Additionally, the control unit (100) is a computer. The control unit (100) has an arithmetic processing unit having a microprocessor such as a CPU (Central Processing Unit), a memory device having memory such as ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device. The arithmetic processing unit of the control unit (100) performs arithmetic processing according to a computer program stored in the memory device and outputs a control signal for controlling the processing device (1) to the components described above of the processing device (1) through the input / output interface device. By executing the program, the control unit (100) controls processing, imaging, etc., on the workpiece (200).

[0033] Additionally, the control unit (100) is connected to an unillustrated display unit configured by a liquid crystal display device, etc., that displays the status of a processing operation or an image, and an unillustrated input unit used by an operator to register processing content information, etc. The input unit is configured by at least one of a touch panel formed on the display unit and an external input device such as a keyboard.

[0034] The control unit (100) can provide a function to control the processing of a workpiece (200) held on a holding surface (11). For example, the control unit (100) cuts the workpiece (200) held on the holding table (10) along the planned division line by moving the holding table (10) and the processing unit (20) relative to each other along the planned division line by means of an X-axis moving unit (42), a Y-axis moving unit (41), and a Z-axis moving unit (43). If a driving source not shown is provided in the frame support (120), the control unit (100) performs control to position the reflective part (123) of the reflective unit (12) below the edge (206) of the workpiece (200). Additionally, the control unit (100) can provide a function to position the imaging unit (30) at an imaging position by means of the X-axis movement unit (42), the Y-axis movement unit (41), and the Z-axis movement unit (43), and to calculate the coordinates of the edges of the workpiece (200) from the image captured by the imaging unit (30) to obtain the center of the workpiece (200). For example, the control unit (100) can detect the center of the workpiece (200) by using the technology described in Japanese Patent Publication No. 2011-249572, etc. The control unit (100) performs control to capture the edge (206) of the workpiece (200) on the imaging unit (30) while the edge (206) is positioned above the reflection part (123) of the reflection unit (12).

[0035] The configuration example of the processing device (1) related to the present embodiment has been described above. Furthermore, the above configuration described using FIGS. 1 to 5 is merely an example, and the configuration of the processing device (1) related to the present embodiment is not limited to the related examples. The functional configuration of the processing device (1) related to the present embodiment can be flexibly modified according to specifications or operation.

[0036] (Image capture method of processing device)

[0037] Next, the imaging method performed by the processing device (1) related to the embodiment will be described. FIG. 6 is a top view schematic diagram showing an example of the arrangement relationship between a holding table (10) and a workpiece (200). FIG. 7 is a schematic diagram showing an example of the arrangement relationship between a reflection unit (12) of the holding table (10) and an imaging unit (30). FIG. 8 is a drawing showing an example of an image in which the processing device (1) captures the edge (206) of the workpiece (200) using the reflection part (123) of the reflection unit (12). FIG. 9 is a drawing showing an example of an image in which the processing device (1) captures the edge (206) of the workpiece (200) without using the reflection part (123) of the reflection unit (12).

[0038] In an example shown in FIG. 6, the processing device (1) holds a workpiece (200), the diameter of which is larger than the diameter of the holding surface (11) of the holding table (10), in a state where the edge (206) protrudes outside the holding surface (11) by the holding table (10). The edge (206) of the workpiece (200) includes the edge of the workpiece (200), the outer circumference including a range of surfaces at a certain distance from the edge, etc. Each of the plurality of reflection units (12) is arranged such that the reflection portion (123) is located below the edge (206) of the workpiece (200). The reflection unit (12) is configured to be positioned below the edge (206) of a workpiece (200) of different sizes by moving along the guide rail (13) in the diameter direction of the retaining surface (11). The processing device (1) positions the edge (206) of the workpiece (200) above the reflection portion (123) of the reflection unit (12) by moving the reflection unit (12) along the guide rail (13) by means of a driving means not shown.

[0039] The processing device (1) controls the X-axis movement unit (42), Y-axis movement unit (41), and Z-axis movement unit (43) so that the imaging unit (30) is positioned at an imaging position where the reflection portion (123) of the reflection unit (12) overlaps with the edge (206) of the workpiece (200), as shown in FIG. 7. The imaging position includes, for example, the position, rotation angle, height, etc. of a holding table (10) that is preset for the workpiece (200). The processing device (1) images a portion of an imaging area (301) (see FIG. 6 and FIG. 7) including the edge (206) of the workpiece (200) and the reflection unit (12) by means of the imaging unit (30) positioned at the imaging position.

[0040] In this case, when light accompanying the imaging is incident from the imaging unit (30) (upward) on the surface of the workpiece (200) and reflected, it enters the objective lens (31) of the imaging unit (30); however, when light is incident obliquely on the surface of the workpiece (200) and reflected, it does not enter the objective lens (31) of the imaging unit (30), and the workpiece (200) is imaged black and the outer side of the workpiece (200) is imaged white. The light accompanying the imaging includes, for example, light emitted by the light source (38) of the imaging unit (30), light from the surroundings of the processing device (1), etc. Also, when light accompanying the imaging is diffusely reflected from the reflection portion (123) of the reflection unit (12), some of the diffusely reflected light enters the objective lens (31) of the imaging unit (30). The edge (206) on the surface of the workpiece (200) is chamfered to prevent cracking when the workpiece (200) is created, and a rounded part or slope is formed, so the light accompanying the imaging is diffusely reflected and it is difficult for it to enter the imaging unit (30). Thus, in the image (500) captured by the imaging unit (30) capturing the imaging area (301), as shown in FIG. 8, the first area (510) capturing the workpiece (200) becomes a dark area, and the second area (520) capturing the reflection part (123) of the reflection unit (12) becomes a brighter area than the first area (510). As a result, since the contrast of the boundary (530) between the first area (510) and the second area (520) becomes clear in the image (500), it becomes possible to recognize the boundary (530) as the edge (206) (outer periphery) of the workpiece (200).

[0041] In contrast, the processing device (1) is said to have captured an imaging area (302) (see FIG. 6) including the edge (206) of the workpiece (200) and the outside thereof at a position where the reflection unit (12) does not exist below the workpiece (200), that is, at a position where the lower outer side of the workpiece (200) is a bellows covering the X-axis movement unit (42). In this case, the light accompanying the imaging does not enter the objective lens (31) of the imaging unit (30) toward the bellows portion of the X-axis movement unit (42) located below the holding table (10) because the reflection portion (123) of the reflection unit (12) does not exist when directed toward the outside of the workpiece (200). Also, when the surface of the bellows of the X-axis moving unit (42) is a black material, the light accompanying the imaging is not reflected from the surface of the bellows of the X-axis moving unit (42). Thus, as shown in FIG. 9, the image (500-1) captured by the imaging unit (30) has both the first area (510) capturing the workpiece (200) and the third area (540) capturing the outside of the workpiece (200) where the reflective part (123) of the reflective unit (12) does not exist, becoming dark areas. Because of this, the image (500-1) has a blurry image with the contrast between the boundary (530) of the first region (510) and the third region (540) becoming unclear, and the outer edge (206) of the workpiece (200) becoming blurry.

[0042] The processing device (1) related to the embodiment can improve the precision of calculating the coordinates of the edge (206) of the workpiece (200) based on the clear boundary (530) between the edge (206) of the workpiece (200) and the reflective part (123) of the reflective unit (12) by analyzing an image (500) that captures the edge (206) of the workpiece (200) and the reflective part (123). In addition, since the processing device (1) utilizes the reflective unit (12) provided by the holding table (10), the edge (206) of the workpiece (200) can be captured without adding a new configuration.

[0043] The control unit (100) of the processing device (1) sets each of the four reflection units (12) of the holding table (10) into four imaging areas (301) and images the four imaging areas (301) by an imaging unit (30). The control unit (100) detects four position coordinates on the edge (206) of the workpiece (200) from the four images. The control unit (100) detects the center of the workpiece (200) using, for example, the technology described in Japanese Patent Publication No. 2011-249572. The control unit (100) calculates three or more different position coordinates of the edge (206) of the workpiece (200) by image processing. Multiple position coordinates can be appropriately determined, for example, based on the position of the reflection unit (12) of the holding table (10). The control unit (100) detects the center of the workpiece (200) based on the circumcircle of the triangle represented by the multiple coordinate positions. When the control unit (100) detects the center of the workpiece (200), it stores coordinate information representing the coordinates of the center in a memory device.

[0044] The control unit (100) detects the center of the workpiece (200), positions the cutting blade (21) at a predetermined distance from the edge (206) of the workpiece (200) based on the center position of the workpiece (200), and removes a portion of the outer circumference of the workpiece (200) by rotating the holding table (10) and the cutting blade (21) relative to each other. In addition, the control unit (100) measures the upper surface height of the workpiece (200) based on the detected center position of the workpiece (200), and operates the processing unit (20) according to the upper surface height to process the workpiece (200) along the planned division line (103). Accordingly, the processing device (1) can accurately determine the center position of the workpiece (200) and perform processing on the workpiece (200) based on the center position, thereby improving the processing precision.

[0045] By the above, the processing device (1) can clearly capture the boundary between the edge (206) and the reflection part (123) by bringing the edge (206) of the workpiece (200) close to the reflection part (123) of the reflection unit (12) and capturing it, even if the edge (206) of the workpiece (200) is maintained in a state protruding outward from the holding surface (11) of the holding table (10). As a result, the processing device (1) can accurately identify the edge (206) of the workpiece (200), thereby improving the processing precision of the workpiece (200) maintained in a state protruding from the holding table (10).

[0046] Even if the processing device (1) uses a workpiece (200) larger than the holding surface (11) of the holding table (10) as a work unit (250), it can clearly capture the edge (206) of the workpiece (200) by means of a reflective unit (12) that supports an annular frame (210). Thus, the processing device (1) can obtain an image that clearly captures the edge (206) of the workpiece (200) by effectively utilizing a reflective unit (12) having a frame support part (120) that supports an annular frame (210) without adding a new configuration.

[0047] [Variations of embodiments]

[0048] FIG. 10 is a drawing for explaining an example of the relationship between the holding surface (11) and the reflection unit (12) of a processing device (1) related to a modified example of an embodiment. When the processing device (1) performs full cut trimming of a workpiece (200), it performs processing by positioning a cutting blade (21) next to the edge (206) of the workpiece (200). In this case, the processing device (1) may be configured such that the reflection portion (123) of the reflection unit (12) is positioned below the holding surface (11) of the holding table (10), as shown in FIG. 10. When the processing device (1) performs full cut trimming of the workpiece (200), it may be configured such that the reflection portion (123) does not come into contact with the cutting blade (21). Thus, the processing device (1) can avoid the reflection unit (12) coming into contact with the cutting blade (21) even during full cut trimming where the edge (206) is removed by the cutting blade (21).

[0049] In the above-described embodiment, the processing device (1) is described in the case where the reflective portion (123) of the reflective unit (12) has a supporting portion (121) and a pressing member (122), but is not limited thereto. FIG. 11 is a drawing for explaining another use example of the holding table (10) of the processing device (1) related to a modified example of the embodiment.

[0050] In scene 1001 shown in FIG. 11, the processing device (1) does not use the aforementioned annular frame (210) and holds the workpiece (200) on the holding surface (11) of the holding table (10), and the cutting blade (21) cuts the edge (206) of the workpiece (200). In this case, since the annular frame (210) is not placed on the mounting portion (121) of the processing device (1), the mounting portion (121) and the pressing member (122) are in a non-contact state. A non-contact state is a state in which the pressing member (122) is not pressed against the mounting portion (121). The mounting portion (121) and the pressing member (122) are formed of reflective members.

[0051] In Scene 1002, the processing device (1) keeps the reflection unit (12) in a non-contact state, so the mounting surface (upper surface) of the mounting portion (121) functions as the reflection portion (123) described above. The processing device (1) controls the X-axis movement unit (42), Y-axis movement unit (41), and Z-axis movement unit (43) so that the imaging unit (30) is positioned at an imaging position where it can be captured from above so that the mounting portion (121) of the reflection unit (12) overlaps with the edge (206) of the workpiece (200). The processing device (1) captures a portion of the imaging area (301) including the edge (206) of the workpiece (200) and the reflection unit (12) by means of the imaging unit (30) positioned at the imaging position.

[0052] Thus, the processing device (1) can clearly capture the boundary between the edge (206) and the reflection unit (12) by positioning the edge (206) of the workpiece (200) above the mounting portion (121) of the reflection unit (12) and capturing it, even if the workpiece (200) is maintained in a state protruding from the holding table (10). Thus, the processing device (1) can accurately identify the edge (206) of the workpiece (200), thereby improving the processing precision of the workpiece (200) maintained in a state protruding from the holding table (10).

[0053] Furthermore, the present invention is not limited to the above embodiments. That is, it can be implemented with various modifications within the scope of not departing from the gist of the present invention.

[0054] In the above-described embodiment, the processing device (1) was described in the case where a reflective portion (123) is formed on all of the four reflective units (12), but it is not limited to this. The processing device (1) may be configured to form a reflective portion (123) on at least one of the four reflective units (12).

[0055] In the above-described embodiment, the processing device (1) is described as a case where the reflection unit (12) is a frame support (120) that supports the annular frame (210), but is not limited to this. The reflection unit (12) may be an annular member surrounding the holding surface (11) of the holding table (10), or a member arranged in multiple numbers along the outer circumference of the holding surface (11).

[0056] The processing device (1) may be formed as a single annular member without having a plurality of reflection units (12). The annular member may be formed as a ring-shaped reflection member that surrounds the holding surface (11) of the holding table (10), for example, and may be formed in the processing device (1) so as to be located below the holding surface (11).

[0057] In the above-described embodiment, the processing device (1) is described for the case where the workpiece (200) is larger than the holding surface (11) of the holding table (10), but is not limited to this. For example, when the workpiece (200) is the same size as the holding surface (11), the processing device (1) can obtain a clear image of the edge (206) of the workpiece (200) by positioning the reflective part (123) of the reflective unit (12) so that the workpiece (200) and the reflective part (123) of the reflective unit (12) are adjacent to each other and taking an image, just like in the embodiment.

[0058] In the above-described embodiment, the processing device (1) was described for processing a disc-shaped workpiece (200), but it is not limited to this. The processing device (1) may, for example, use a workpiece such as a square or polygon, and in this case, the imaging target point of the workpiece can be positioned above the reflection part (123) of the reflection unit (12).

[0059] In the above embodiment, the processing device (1) was described as being a cutting device, but it may be a grinding device or a laser processing device other than a cutting device. Explanation of the symbols

[0060] 1 : Processing device 10: Maintenance Table 11 : Oilseed 12: Reflection Unit 13: Guide rail 20: Processing Unit 21: Cutting blade 22 : Spindle 30 : Imaging unit 36 : Imaging device 40: Mobile Unit 41 : Y-axis movement unit 42 : X-axis movement unit 43 : Z-axis movement unit 100 : Control unit 120 : Frame support 121 : Witty Department 122 : Pressurizing member 123 : Reflective part 200 : Workpiece 201 : Substrate 202 : Top surface 203 : Line scheduled for division 204 : Device 206 : Edge 250 : Work Unit 301 : Imaging area 500 : Image 510: Zone 1 520 : Zone 2 530 : Boundary

Claims

Claim 1 A processing device comprising: a holding table having a holding surface smaller than that of a workpiece for holding a workpiece; a processing unit for processing the workpiece held on the holding table; an imaging unit for imaging the workpiece held on the holding table; and a control unit. The holding table has a reflecting unit that surrounds the holding surface and can be positioned below the edge of the workpiece held on the holding surface. At least a portion of the reflecting unit is formed of a reflecting member, and the edge of the workpiece is positioned above the reflecting member and is imaged by the imaging unit. The workpiece is supported by a sheet interposed in the opening of an annular frame, and the reflecting unit is a frame support unit that supports the annular frame. Claim 2 A processing device according to claim 1, wherein the imaging unit captures the edges of the workpiece located above the reflective member at multiple points, and the control unit calculates the coordinates of the edges from the captured images to determine the center position of the workpiece. Claim 3 A processing device according to claim 2, wherein the cutting blade of the processing unit is positioned at a predetermined distance inside from the edge of the workpiece based on its center position, and the holding table and the cutting blade are rotated relative to each other to remove the outer periphery of the workpiece. Claim 4 In claim 3, the reflection unit is a processing device located below the retaining surface. Claim 5 delete

Images