Substrate processing method

Abstract

A substrate processing method comprising: a dismantling process for dismantling a temporary batch lot by dividing the substrates into a first group and a second group so that two opposing substrates among the substrates constituting the temporary batch lot become different groups, and moving the first group and the second group relatively in a direction orthogonal to the arrangement direction of the substrates; a half-rotation process for turning the second group half-rotating so that the substrates constituting the second group face the reverse direction of the first direction; and a rearrangement process for creating a batch lot by combining the first group and the second group to alternately arrange the substrates facing the first direction and the substrates facing the reverse direction.

Description

Technology Field

[0001] The present invention relates to a substrate processing method related to a semiconductor substrate, a substrate for a Flat Panel Display (FPD) such as a liquid crystal display or an organic EL (Electroluminescence) display device, a glass substrate for a photomask, a substrate for an optical disc, etc. Background Technology

[0002] Patent Document 1 describes a substrate processing apparatus that extracts an equal number of substrates from each of two carriers to form a first substrate group and a second substrate group, inserts the second substrate group into the gap between each substrate of the first substrate group to change the pitch to 1 / 2 and forms a substrate group with twice the number of substrates, and processes this collectively. Prior art literature

[0003] Japanese Patent Publication No. Hei 5-175179 The problem to be solved

[0004] Recently, there has been a demand for further efficiency improvements in substrate processing devices. In order to increase the number of substrates processed at once through batch processing, it is necessary to narrow the arrangement pitch of the substrates. At this point, the orientation of the substrates becomes an issue. That is, for batch processing, it is more suitable from the perspective of preventing contamination of the device surfaces to arrange substrates in a face-to-face manner to generate batch lots. To arrange substrates in a face-to-face manner with the device surfaces of the substrates facing each other, it is necessary to combine the substrate arrangement obtained from the first carrier with the substrate arrangement obtained from the second carrier rotated halfway. Therefore, according to the conventional configuration, although the arrangement pitch of the substrates can be halved, the arrangement pitch of the substrates cannot be narrowed any further. If a batch lot is generated by inserting a substrate obtained from the second carrier into the gap of the substrate arrangement obtained from the first carrier, the arrangement pitch of the substrates in the batch lot is automatically determined to be half of the original.

[0005] The present invention is made in consideration of such circumstances and aims to provide a substrate processing method that efficiently performs substrate processing by narrowing the arrangement pitch of the substrate. means of solving the problem

[0006] The present invention takes the following configuration to solve the above problem.

[0007] The present invention takes the following configuration to solve the above problem.

[0008] That is, the present invention relates to a substrate processing method for processing a plurality of substrates having directions defined on the surface and the back surface in a batch, wherein

[0009] A substrate group acquisition process for acquiring a substrate group formed by arranging substrates facing in one direction at predetermined intervals, and

[0010] A first arrangement formed by arranging the first substrates facing in one direction at the predetermined interval, and a first assembly process of combining the substrate group to position the first substrate at the first position among the first position and the second position that divide the predetermined interval in the substrate group into three;

[0011] A second arrangement formed by arranging the second substrates facing in the above-mentioned unidirectional manner at the above-mentioned predetermined intervals, and a second assembly process for configuring a temporary batch lot by combining the substrate group and the first substrate to position the second substrate at the above-mentioned second position, and

[0012] A dismantling process for dismantling the temporary batch lot by dividing the substrates into a first group and a second group so that two opposing substrates among the substrates constituting the temporary batch lot become different groups, and by moving the first group and the second group relatively in a direction orthogonal to the arrangement direction of the substrates; and

[0013] A half-rotation process of orienting the substrate constituting the second set toward the reverse direction of the one direction by half-rotating the second set, and

[0014] A rearrangement process for generating a batch lot by combining the above Article 1 and the above Article 2 to alternately arrange the substrate facing the unidirectional direction and the substrate facing the reverse direction, and

[0015] It is characterized by having a processing process in which the above batch lot is immersed in a processing solution.

[0016] [Operation and Effect] According to the configuration described above, a temporary batch lot is formed in which substrates are oriented in the same direction. Then, the substrates are divided into a first group and a second group so that two opposing substrates among the substrates constituting the temporary batch lot become different groups, and the second group rotates halfway. Then, by combining the first group and the second group, a batch lot is created by alternately arranging substrates oriented in one direction and substrates oriented in the reverse direction. With this configuration, the substrates can be arranged face-to-face while making the arrangement pitch of the substrates narrower than that of conventional methods.

[0017] In addition, in the configuration described above, the dismantling process is preferably performed by dismantling the temporary batch lot such that the substrate located at one end of the temporary batch lot and the substrate located at the other end of the temporary batch lot are divided into different groups.

[0018] [Operation / Effect] According to the configuration described above, the dismantling process dismantles the lot such that the substrate located at one end of the temporary batch lot and the substrate located at the other end of the temporary batch lot are divided into different groups. By configuring it in this way, the orientation of the substrates constituting the batch lot can be made desired. In short, according to the configuration described above, since the orientation of the substrate at one end of the batch lot and the orientation of the substrate at the other end can be made different, the arrangement of the substrates can be made more reliably face-to-face.

[0019] In addition, in the configuration described above, it is preferable that the number of substrates constituting the batch lot is three times the number of substrates in the substrate group acquisition process.

[0020] [Operation / Effect] According to the configuration described above, the number of substrates constituting a batch lot is three times the number of substrate groups in the substrate group acquisition process. With this configuration, there is no remaining substrate in the substrate group when constituting a batch lot. Since the substrate group is not divided into two batch lots, the history of substrate processing for the substrates constituting the substrate group can be reliably matched.

[0021] In addition, in the configuration described above, a first process of acquiring each substrate collectively from a carrier that accommodates substrates arranged at predetermined intervals in the vertical direction, wherein substrates in a horizontal position are arranged at predetermined intervals, and

[0022] A second process for collectively converting the orientation of each of the above substrates from a horizontal orientation to a vertical orientation, and

[0023] It is preferable to perform the above-mentioned first process and the above-mentioned second process before each assembly process.

[0024] [Operation and Effect] According to the configuration described above, a first process of collectively acquiring each substrate from a carrier that accommodates substrates arranged at a predetermined interval in a vertical direction, and a second process of collectively converting the orientation of each substrate from a horizontal orientation to a vertical orientation, are provided, and the first and second processes are performed before each assembly process. By configuring it in this way, a substrate processing method can be provided by receiving a first set of substrates or a second set of substrates arranged in a unidirectional manner from a carrier.

[0025] In addition, in the configuration described above, it is preferable that the predetermined spacing is the same as the arrangement pitch of the substrate housed in the carrier.

[0026] [Operation / Effect] According to the configuration described above, the predetermined spacing is identical to the arrangement pitch of the substrates housed in the carrier. With this configuration, changing the pitch of the substrates becomes easy.

[0027] In addition, in the configuration described above, the distance from the first position to the second position is preferably 1 / 3 times the arrangement pitch of the substrate housed in the carrier.

[0028] [Operation / Effect] According to the configuration described above, the distance from the first position to the second position is 1 / 3 of the arrangement pitch of the substrate housed in the carrier. By configuring it in this way, the pitch of the generated substrate arrangement can be reduced to 1 / 2 or less of the arrangement pitch of the substrate housed in the carrier.

[0029] In addition, in the configuration described above, it is preferable that the first position and the second position divide the predetermined interval into three equal parts.

[0030] [Operation / Effect] According to the configuration described above, the first position and the second position divide the predetermined interval into three equal parts. By configuring it in this way, the substrate can be arranged more neatly. Effects of the invention

[0031] According to the present invention, a substrate processing method can be provided to efficiently perform substrate processing by narrowing the arrangement pitch of the substrate. Brief explanation of the drawing

[0032] FIG. 1 is a plan view illustrating the overall configuration of a substrate processing device related to an embodiment. FIG. 2 is a schematic diagram illustrating the configuration of a carrier related to an embodiment. FIG. 3 is a perspective view illustrating each part constituting a transfer block related to an embodiment. Figure 4 is a diagram comparing the configuration of a carrier and a handling robot related to an embodiment. FIG. 5 is a perspective view illustrating the configuration of an HVC attitude conversion unit related to an embodiment. FIG. 6 is a schematic diagram illustrating the configuration of the latching rod and the clamping rod related to the embodiment. FIG. 7 is a plan view illustrating the configuration of each rod related to the embodiment. FIG. 8 is a cross-sectional view illustrating a groove having a clamp rod related to an embodiment. FIG. 9 is a schematic diagram illustrating a pusher related to an embodiment. FIG. 10 is a schematic diagram illustrating a pusher related to an embodiment. FIG. 11A is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11B is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11C is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11D is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11E is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11F is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11G is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11H is a schematic diagram illustrating a batch composition related to an example. FIG. 11I is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 11J is a schematic diagram illustrating a batch composition related to an example. FIG. 12 is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 13 is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 14 is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 15 is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 16 is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 17A is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 17B is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 17C is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 17D is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 17E is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 17F is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 18 is a schematic diagram illustrating a batch composition related to an embodiment. FIG. 19 is a flowchart illustrating the flow of a substrate related to an example. Specific details for implementing the invention

[0033] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The substrate processing apparatus of the embodiment introduces substrates arranged at a pitch of 10 mm and converts the arrangement pitch of the substrates to 10 / 3 mm to form a batch lot. Various substrate treatments, such as chemical treatment, are performed on the formed batch lot. By performing substrate processing with a narrow arrangement pitch of the substrates in this way, the amount of required chemical solution is reduced, thereby lowering running costs and enabling environmentally conscious substrate processing.

[0034] The present invention relates to a substrate processing method for processing a plurality of substrates having directions defined on the surface and the back side in a batch. The surface of the substrate is the device surface on which film deposition or photolithography is performed. The back side is the surface opposite to the device surface. When the substrate is maintained in a horizontal position, the surface of the substrate faces upward.

[0035] Examples

[0036] 1. Overall Structure

[0037] A substrate processing device (1) related to the present invention has a case body (1A) that accommodates each block constituting the substrate processing device (1) as a configuration for performing batch processing. The case body (1A) has a load port (9) protruding from a first wall surface that is orthogonal to the Y direction from the processing block (6) toward the material block (5). A carrier (C) that accommodates a substrate array arranged vertically with a specific pitch of a substrate (W) in a horizontal position can be placed in the load port (9).

[0038] In this specification, for convenience, the direction in which the stoker block (3), the material block (5), and the processing block (6) are arranged in the substrate processing device (1) is referred to as the "front-back direction (X)." The front-back direction (X) extends horizontally. Among the front-back direction (X), the direction from the material block (5) to the stoker block (3) in the substrate processing device (1) is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontally extending direction orthogonal to the front-back direction (X) is referred to as the "width direction (Y)." One direction of the "width direction (Y)" is referred to as the "right side" for convenience, and the other direction is referred to as the "left side" for convenience. The direction orthogonal to the front-back direction (X) and the width direction (Y) (height direction) is referred to as the "vertical direction (Z)" for convenience. In each drawing, the front, back, right, left, up, and down are appropriately indicated for reference.

[0039] 2. Stalker Block

[0040] As shown in FIG. 1, the stoker block (3) is provided with a load port (9) which is an inlet when a carrier (C) that stores a plurality of substrates (W) in a horizontal position at a predetermined distance in a vertical direction is inserted into the block. The load port (9) is configured to protrude from the outer wall of the stoker block (3) that extends in the width direction (Y direction).

[0041] Multiple substrates (W) (e.g., 25) are stacked and stored in a horizontal position at regular intervals within a carrier (C). The carrier (C) containing the unprocessed substrates (W) brought into the substrate processing device (1) is first placed in the load port (9).

[0042] FIG. 2 illustrates the configuration of the carrier (C) of the present invention. The carrier (C) has a plurality of slots (S) formed in a horizontal direction that maintain the surfaces of the substrates (W) separated from each other. The slots (S) are arranged vertically at a specific pitch (e.g., 10 mm), and a substrate (W) is received in each of the slots (S). Twenty-five slots (S) are formed in one carrier (C). Accordingly, 25 substrates (W) are arranged vertically at a specific pitch in the carrier (C). A mounting plate (7) is positioned at a location that divides each slot (S) and supports both ends of the substrate (W) together with a pair of mounting plates (7). Accordingly, the mounting plates (7) are arranged such that one is formed on the side of the carrier (C) and one is formed on a surface parallel to that side. As a carrier (C), for example, a sealed FOUP (Front Opening Unify Pod) is used. In the present invention, an open container may be used as the carrier (C).

[0043] The internal structure of the stocker block (3) is described. The stocker block (3) is equipped with a return storage unit (ACB) for stocking and managing carriers (C). The return storage unit (ACB) is equipped with a carrier return mechanism (11) for returning carriers (C) and a shelf (13) for placing carriers (C). The number of carriers (C) that can be stocked in the stocker block (3) is 1 or more.

[0044] The stocker block (3) has a plurality of shelves (13) for storing carriers (C). The shelves (13) are formed in a partition wall between the stocker block (3) and the transfer block (5). The shelves (13) include a stock shelf (13b) for simply temporarily storing carriers (C), and a carrier storage shelf (13a) for substrate extraction accessed by the first handling robot (HTR) of the transfer block (5).

[0045] The carrier storage shelf (13a) is configured to accommodate a carrier (C). The carrier storage shelf (13a) is configured to accommodate a carrier (C) intended for ejecting a substrate (W). In this embodiment, one carrier storage shelf (13a) is formed, but multiple carrier storage shelves (13a) may be formed. The carrier transport mechanism (11) introduces a carrier (C) containing an unprocessed substrate (W) from the load port (9) and places it on the carrier storage shelf (13a) for ejecting the substrate. At this time, the carrier transport mechanism (11) may temporarily place the carrier (C) on a shelf (13b) for stocking before placing it on the carrier storage shelf (13a). The number of carrier storage shelves (13a) in the stocker block (3) is one or more.

[0046] Additionally, the carrier storage shelf (13a) is configured to store an empty carrier (C) for storing a processed substrate (W). The processed substrate (W) is stored in a carrier (C) waiting on the carrier storage shelf (13a). The carrier transport mechanism (11) takes the carrier (C) containing the processed substrate (W) from the carrier storage shelf (13a) and transports it to the load port (9). When transporting the carrier (C) to the load port (9), the carrier transport mechanism (11) may temporarily place the carrier (C) on a stock shelf (13b).

[0047] 3. Lee Jae Block

[0048] The transfer block (5) is adjacent to the carrier storage shelf (13a). The transfer block (5) is positioned adjacent to the rear of the stocker block (3). The transfer block (5) is equipped with a handling robot (HTR) capable of accessing a carrier (C) placed on the carrier storage shelf (13a) for substrate extraction, an HVC posture conversion unit (23) that converts multiple substrates (W) from a horizontal posture to a vertical posture in batches, and a pusher mechanism (25). The HVC posture conversion unit (23) converts multiple substrates (W) from a horizontal posture to a vertical posture in batches. Additionally, the transfer block (5) has a substrate receiving position (PP) set for receiving multiple substrates (W) to a forward / backward conveying mechanism (WTR) formed in a batch conveying area (R2).

[0049] As shown in FIG. 3, the handling robot (HTR), the HVC posture conversion unit (23), and the pusher mechanism (25) are arranged in this order in the Y direction. The handling robot (HTR) has a hand (211) capable of gripping a substrate (W) in a horizontal position. The hand (211) can grip one substrate (W). The handling robot (HTR) has the hand (211) arranged in a vertical direction. The handling robot (HTR) can transport multiple substrates (W) at once by gripping the substrate with each of the hands (211). The moving support mechanism (213) is a mechanism that constitutes the handling robot (HTR) and is configured to rotate the hand (211) around a vertical axis, raise and lower the hand (211), move the hand (211) forward and backward in the forward direction (X), or move it laterally in the left and right direction (Y).

[0050] FIG. 4 shows the appearance when a handling robot (HTR) receives a substrate (W) inside a carrier (C) using a hand (211). As shown in FIG. 4, the hand (211) is arranged vertically at an arrangement pitch of slots (S) formed in the carrier (C). In short, the hand (211) is arranged at a pitch of 10 mm. 10 mm corresponds to a predetermined spacing of the present invention and is represented as an arrangement pitch (Da) in each figure. The handling robot (HTR) conveys all the substrates (W) arranged at 10 mm intervals in the carrier (C) at once. Since the surface of the substrate (W) received in the carrier (C) is all facing upward, the substrates (W) released by the handling robot (HTR) are all facing upward. Additionally, a guide (214) is formed in each of the hands (211) to contact the peripheral portion of the substrate. The guide is formed at the tip and base portions of a pair of blades constituting the hands (211). Thus, four guides (214) are formed in the hands (211).

[0051] The handling robot (HTR) has 25 hands (211). The handling robot (HTR) conveys 25 substrates stored in the carrier (C) in batches by these hands.

[0052] The HVC posture conversion unit (23) shown in FIG. 3 is configured to convert a substrate (W) extracted from a carrier (C) by a handling robot (HTR) from a horizontal posture to a vertical posture. The HVC posture conversion unit (23) is equipped with a pair of mounting rods (231) and a pair of clamping rods (232) extending in the vertical direction (Z direction). A support (237) has a support surface that expands in the XY plane to support the mounting rods (231) and clamping rods (232). A rotational driving mechanism (238) is configured to rotate the mounting rods (231) and clamping rods (232) along with the support (237) by 90°. Due to this rotation, the mounting rods (231) and clamping rods (232) are configured to extend in the left-right direction (Y direction).

[0053] The support rod (231) is equipped with a rod driving mechanism (235) that rotates around a rotation axis along its extending direction. A pair of support rods (231) can rotate synchronously by means of a pair of rod driving mechanisms (235). Additionally, the rod driving mechanism (235) can extend and retract the support rod (231). Specific examples of when the support rod (231) is driven by the rod driving mechanism (235) will be described later.

[0054] The clamping rod (232) is equipped with a rod rotation mechanism (236) that rotates around a rotation axis along its extending direction. By means of a pair of rod rotation mechanisms (236), a pair of clamping rods (232) can rotate synchronously.

[0055] FIG. 5 describes the flat plates (233) and (239) having a support rod (231). The flat plates (233) are arranged in the direction in which the support rod (231) extends at a pitch of 10 mm in the support rod (231). Each flat plate (233) is a plate that expands in a plane orthogonal to the arrangement direction of the flat plates (233), and the substrate (W) is supported by the support rod (231) by placing the end of the substrate (W) on the upper surface of the flat plate (233). In addition, since the entire substrate (W) cannot be supported by only supporting one end of the substrate (W), two support rods (231) are formed in the HVC position conversion unit (23). The configuration is such that one end of the substrate (W) is supported by the flat plate (233) of one support rod (231), and the other end of the substrate (W) is supported by the flat plate (233) of the other support rod (231). The one end and the other end are separated by a distance equal to the diameter of the substrate (W). Thus, the pair of support rods (231) are separated by a distance equal to the diameter of the substrate (W), as shown in FIG. 7 (a). By doing so, the substrate (W) supported by the flat plate (233) does not rise from the flat plate (233). This is because the weight of the substrate (W) is applied to the flat plate (233) symmetrically, so the weight of the substrate (W) on the flat plate (233) is balanced left and right. Also, the pair of support rods (231) are parallel to each other.

[0056] The flat plate (239) is arranged in the direction in which the support rod (231) extends at a pitch of 20 / 3 mm in the support rod (231). The pitch of 20 / 3 mm is called the arrangement pitch (Db). The flat plate (239) is a plate that expands in a plane orthogonal to the arrangement direction of the flat plate (233). In the same way as the flat plate (233), the end of the substrate (W) is placed on the upper surface of the flat plate (233), thereby supporting the substrate (W) on the support rod (231). Two support rods (231) are formed in the HVC position conversion part (23). It is a configuration in which one end of the substrate (W) is held by the flat plate (239) of one support rod (231), and the other end of the substrate (W) is held by the flat plate (239) of the other support rod (231).

[0057] In this way, the support rod (231) has one side on which a flat plate (233) is arranged and the other side on which a flat plate (239) is arranged. The support rod (231) can rotate around a rotation axis along the direction of extension and can switch the side facing the substrate (W) between one side related to the flat plate (233) and the other side related to the flat plate (239). In the initial state of the support rod (231), as shown in FIG. 5, the side related to the flat plate (233) faces the substrate (W). Accordingly, the initial state HVC attitude changer (23) holds the substrate (W) with the flat plate (233).

[0058] FIG. 5 describes the clamping plate (234) and clamping plate (230) having a clamping rod (232). The clamping plate (234) has an arc side (234a) that follows the curve of the substrate (W), and a V-groove (234b) for clamping the substrate (W) is formed in the arc side (234a). Since the substrate (W) has a shape that follows the curve of the arc side (234a), the substrate (W) is clamped in the V-groove (234b) of the arc side (234a). The clamping plate (234) is arranged in the direction in which the clamping rod (232) extends at a pitch of 10 mm in the clamping rod (232). Each clamping plate (234) is a plate that expands in a plane orthogonal to the arrangement direction of the clamping plates (234), and the substrate (W) is clamped by the clamping rod (232) by fitting a part of the substrate (W) into the V groove (234b) of the arc side (234a).

[0059] Additionally, since the entire substrate (W) cannot be clamped by only clamping a part of the substrate (W), two clamping rods (232) are formed in the HVC position conversion unit (23). The configuration is such that a part of the substrate (W) is clamped by the clamping plate (234) of one clamping rod (232), and a part of the substrate (W) is clamped by the clamping plate (234) of the other clamping rod (232). A pair of clamping rods (232) are separated by a distance shorter than the diameter of the substrate (W). Since a pair of clamping rods (232) is configured to clamp the substrate (W) in a vertical position, it is sufficient to clamp the lower edge of the substrate (W), and there is no need to be separated by the diameter of the substrate (W) as with the mounting rod (231). Even so, as shown in FIG. 10, the clamping rod (232) is positioned offset from the bottom of the substrate (W) in a vertical position, so two rods are required: one that clamps the right portion when viewed from the bottom of the substrate (W) and one that clamps the left portion when viewed from the bottom of the substrate (W). The two clamping rods (232) clamp the substrate (W) from both sides by means of the V-groove (234b) of the clamping plate (234) as shown in FIG. 5(c). Also, a pair of clamping rods (232) are parallel to each other. The two clamping rods (232) clamp the substrate (W) from both sides by means of the V-groove (234b) of the clamping plate (234) as shown in FIG. 8. Also, a pair of narrow rods (232) are parallel to each other.

[0060] The clamping plate (230) is arranged in the direction in which the clamping rod (232) extends at a pitch of 20 / 3 mm in the clamping rod (232). The clamping plate (230) is a plate that expands in a plane perpendicular to the arrangement direction of the clamping plate (230). The clamping plate (230) has an arc side (230a) that follows the curve of the substrate (W), just like the clamping plate (234), and a V-groove (230b) for clamping the substrate (W) is formed in the arc side (230a).

[0061] In this way, the clamping rod (232) has one side on which the clamping plate (234) is arranged and the other side on which the clamping plate (230) is arranged. The clamping plate (234) can rotate around a rotation axis along the direction of extension and can switch between one side related to the clamping plate (234) and the other side related to the clamping plate (230) on which the surface facing the substrate (W) is opposed. In the initial state of the clamping rod (232), as shown in FIG. 5, the one side related to the clamping plate (234) faces the substrate (W). Accordingly, the initial state HVC attitude conversion unit (23) holds the substrate (W) with the clamping plate (234).

[0062] FIG. 6 illustrates the arrangement pitch of the flat plates (233) and flat plates (239) of the support rod (231). The arrangement pitch (Da) of the flat plates (233) is 10 mm, and the arrangement pitch (Db) of the flat plates (239) is 20 / 3 mm. Thus, between a pair of flat plates (233) spaced apart in the elongation direction of the support rod (231) with a width of 20 mm, one flat plate (233) is positioned. Meanwhile, between a pair of flat plates (239) spaced apart in the elongation direction of the support rod (231) with a width of 20 mm, two flat plates (239) are positioned.

[0063] FIG. 6 also explains the arrangement pitch of the clamping plates (234) and clamping plates (230) of the clamping rod (232). The arrangement pitch (Da) of the clamping plates (234) is 10 mm, and the arrangement pitch (Db) of the clamping plates (230) is 20 / 3 mm. Accordingly, one clamping plate (234) is positioned between a pair of clamping plates (234) spaced apart in the elongation direction of the clamping rod (232) with a width of 20 mm. Meanwhile, two clamping plates (230) are positioned between a pair of clamping plates (230) spaced apart in the elongation direction of the clamping rod (232) with a width of 20 mm.

[0064] The pusher mechanism (25) in FIG. 3 is equipped with a pusher (251) capable of arranging a substrate (W) in a vertical position in a horizontal direction. The pusher (251) is a half-pipe type that follows the curve of the bottom of the substrate (W). In the initial state, the U-groove (251a) constituting the half-pipe extends in the left-right direction (Y). The pusher (251) in this state is capable of receiving the substrate (W) from the HVC position conversion unit (23).

[0065] FIG. 9 is a cross-sectional view illustrating the configuration of a pusher (251). The pusher (251) has a plurality of V-shaped clamping grooves (252). The clamping grooves (252) are arranged in a direction in which the U-groove described in FIG. 3 extends. The arrangement pitch of the clamping grooves (252) is 10 / 3 mm. In each of the clamping grooves (252), one substrate (W) is clamped as shown in FIG. 9.

[0066] FIG. 10 illustrates the relationship between a pair of clamping rods (232) and a pusher (251). Unlike the state in FIG. 3, the pair of clamping rods (232) in FIG. 10 are tilted 90° along with the support (237) by a rotary drive mechanism (238). Therefore, the clamping rods (232) in FIG. 10 extend in the horizontal direction. As can be seen by referring to FIG. 10, the pusher (251) is positioned between the pair of clamping rods (232) with respect to the front-rear direction (X). Therefore, the pair of clamping rods (232) and the pusher (251) can cooperate to clamp a vertically positioned substrate (W) without interfering with each other.

[0067] The pusher rotation mechanism (253) in FIG. 3 can rotate the pusher (251) by at least 180°. The pusher rotation mechanism (253) can rotate the pusher (251) in its initial state to make the pusher (251) face in the reverse direction, or rotate the pusher (251) facing in the reverse direction to return the pusher (251) to its initial state.

[0068] The pusher shift mechanism (254) can move the pusher (251) in an initial state back and forth in the left and right direction (Y). The pusher shift mechanism (254) can move the pusher (251) closer to the HVC attitude conversion unit (23) and can move the pusher (251) closer to the forward / backward conveying mechanism (WTR).

[0069] The pusher lifting mechanism (255) can raise the pusher (251) from its initial position to an upper position. Additionally, the pusher lifting mechanism (255) can return the pusher (251) from its upper position to its initial position.

[0070] 4. Pitch change in the material block

[0071] Since the substrate processing apparatus of the present embodiment can change the arrangement pitch of the substrate (W) in the material block (5), this point will be explained. The substrate (W) arranged at a pitch of 10 mm in the carrier (C) is rearranged at a pitch of 10 / 3 mm in the material block (5). The temporary lot formed in this way becomes a batch lot in which the substrates are arranged in a face-to-face manner by the operation of the pusher mechanism (25). This configuration will be explained in detail below.

[0072] FIG. 11A compares the arrangement pitch of the substrates in each configuration. In the carrier (C), the mounting plates (7) constituting each slot (S) are arranged at a pitch of 10 mm. These mounting plates (7) have the same configuration as the flat plate (233) in the mounting rod (231). Therefore, the mounting plates (7) are formed by being arranged vertically on one side of the carrier (C), as well as being arranged vertically on the other side of the carrier (C). By mounting both ends of the substrate (W) on a pair of mounting plates (7) facing each other, the retention of the substrate (W) in the carrier (C) is realized.

[0073] In the loading load (231) of the HVC orientation conversion unit (23), flat plates (233) are arranged at a pitch of 10 mm. Accordingly, 25 substrates (W) held by the carrier (C) are conveyed to the HVC orientation conversion unit (23) in bulk. This conveyance is realized by a handling robot (HTR).

[0074] FIG. 11B briefly illustrates the arrangement of 25 substrates (W) on a carrier (C). Since three separate carriers (C) appear in the following description, the carrier (C) in FIG. 11B is referred to as the first carrier (C1). On the first carrier (C1), 25 substrates (W) are arranged at a pitch of 10 mm.

[0075] FIG. 11C shows the state when the substrate (W) held by the first carrier (C1) is transferred to the HVC attitude conversion unit (23) by the handling robot (HTR). FIG. 7(a) shows the state in which both ends of the substrate (W) are supported by a pair of support rods (231) at this time.

[0076] At this time, the periphery of the substrate (W) is in contact with each of the clamping plates (234) of the pair of clamping rods (232). Specifically, the periphery of the substrate (W) is fitted into the V-groove of the clamping plate (234). Therefore, even if the support (237) is rotated 90° in this state, the substrate (W) is clamped by the V-groove (234b) of the clamping plate (234), so the substrate (W) does not slide off from the HVC position conversion part (23).

[0077] In addition, in FIG. 11C, the support rod (231) is shown supporting the substrate (W) by the flat plate (233). Likewise, in FIG. 11C, the clamping rod (232) is shown clamping the substrate (W) by the clamping plate (234).

[0078] FIG. 11D shows the state when the rotational driving mechanism (238) in the HVC position conversion unit (23) is operated. By this operation, the support (237) is rotated 90°, and the mounting rod (231) and the clamping rod (232) are extended horizontally. Then, the load of the substrate (W) is transferred from the mounting rod (231) to the clamping rod (232), and the flat plate (233) of the mounting rod (231) is in a state where it only contacts the substrate (W). FIG. 11D shows the state when the mounting rod (231) is retracted by the rod driving mechanism (235). When the mounting rod (231) is retracted, the flat plate (233) is separated from the substrate (W). Even when performing such an operation, the substrate (W) is supported by the clamping rod (232), so the substrate (W) does not move along with the movement of the flat plate (233).

[0079] If the flat plate (233) is detached from the substrate (W), even if the substrate (W) held by the clamping rod (232) is lifted by the pusher (251), the flat plate (233) does not damage the back side of the substrate (W).

[0080] FIG. 11E shows the state when the mounting rod (231) is rotated 90° by the rod driving mechanism (235). The flat plate (233) on the mounting rod (231) faces upward due to the rotation of the mounting rod (231). The movement of the flat plate (233) is carried out above the pusher (251). The mounting rod (231) approaches the pusher (251) together with the substrate (W) held by the clamping rod (232), but at that time, the flat plate (233) does not collide with the substrate (W) held by the pusher (251). In addition, since the pusher (251) of FIG. 11E does not clamp the substrate (W), the rotational movement of the flat plate (233) can be omitted.

[0081] FIG. 11F shows the state when the pusher (251) is raised thereafter. Then, the bottom part of the substrate (W) that is being gripped by the gripping rod (232) is inserted into the gripping groove (252) of the pusher (251). In this state, when the pusher (251) is raised further, the substrate (W) is released from the gripping plate (234) of the gripping rod (232). In this way, the substrate (W) is transferred from the HVC position changer (23) to the pusher mechanism (25).

[0082] After that, the pusher (251) rises to an upper position (UR) set above the support rod (231). The pusher (251) at the upper position (UR) does not collide with the support rod (231) that is returned to an upright state. FIG. 11F also illustrates the support rod (231) and the gripping rod (232) being moved to a virtual position (IR) indicated by a dashed line by a rotary drive mechanism (238). At this time, the support rod (231), which was retracted, returns to its original extended state. Additionally, the support rod (231) rotates in reverse and returns to the original state described in FIG. 11C.

[0083] In this way, the substrate (W) arranged at a pitch of 10 mm is transferred from the HVC position conversion unit (23) to the pusher mechanism (25). At this time, the clamping groove (252) in the pusher (251) has a groove that clamps the substrate (W) and an empty groove that does not clamp the substrate (W). The grooves that clamp the substrate (W) are spaced apart by three times the arrangement pitch of the clamping groove (252). This is because the arrangement pitch of the clamping groove (252) is 10 / 3 mm. The arrangement pitch of the substrate (W), 10 mm, corresponds to exactly three times the arrangement pitch of the clamping groove (252). At this time, the substrate (W) arranged in the pusher (251) is referred to as the original substrate group for convenience of explanation. The original substrate group corresponds to the substrate group of the present invention. The original substrate group is formed by arranging substrates facing in one direction at intervals of 10 mm. 10 mm corresponds to a predetermined interval of the present invention.

[0084] FIG. 11G illustrates, by means of dashed lines, the conveying of a substrate (W) (first substrate) from a second carrier (C2) to an HVC orientation changer (23). The second carrier (C2) is a new carrier that the carrier conveying mechanism (11) conveys to the carrier storage shelf (13a) in place of the emptied first carrier (C1). This substrate conveying process corresponds to the first process of the present invention. In the first process, each substrate is collectively acquired from the second carrier (C2) which stores the first substrates arranged at intervals of 10 mm in the vertical direction (Z), with the substrates (W) in a horizontal orientation.

[0085] FIG. 11H shows the appearance when the substrate (W) held by the HVC position conversion unit (23) is subsequently handed over to the pusher (251). Among the clamping grooves (252) in the pusher (251), the clamping groove (252) into which the substrate (W) associated with the first carrier (C1) is already inserted can no longer clamp the substrate (W). Therefore, the substrate (W) held by the HVC position conversion unit (23) is returned to a position offset by 1 pitch in the arrangement of the clamping grooves (252) from the substrate (W) associated with the first carrier (C1), and is inserted into the clamping groove (252) at that position. This alignment of the position between the substrate (W) and the pusher (251) is realized by the pusher shift mechanism (254).

[0086] At that time, the hardness of the support rod (231) and the clamping rod (232) described in FIG. 11D, and the contraction of the support rod (231) are performed, but the specifics have already been fully explained. By the hardness operation of the clamping rod (232), the posture of each substrate (W) is collectively changed from a horizontal posture to a vertical posture. This operation corresponds to the second process of the present invention. Likewise, in FIG. 11H, the rotation of the support rod (231) described in FIG. 11E, the insertion of the substrate (W) into the pusher (251) described in FIG. 11F, the raising and lowering of the pusher (251), the standing operation of the support rod (231) and the clamping rod (232), the extension operation of the support rod (231), and the reverse rotation operation of the support rod (231) are also omitted.

[0087] In this way, the substrate (W) associated with the second carrier (C2) is transferred from the HVC position conversion unit (23) to the pusher mechanism (25). At this time, the pusher (251) has two consecutive areas of clamping grooves (252) that clamp the substrate (W) and areas of empty grooves that do not clamp the substrate (W) arranged alternately. In short, by combining the first arrangement formed by arranging first substrates facing in one direction at intervals of 10 mm with the original substrate group, the first substrate is positioned at a predetermined position (first position (P1)) in the pusher (251). For the first position (P1), reference can be made to FIG. 12.

[0088] FIG. 11I illustrates, by means of dashed lines, the conveying of a substrate (W) (second substrate) from a third carrier (C3) to an HVC orientation changer (23). The third carrier (C3) is a new carrier that is conveyed to the carrier storage shelf (13a) by the carrier conveying mechanism (11) in place of the emptied second carrier (C2). This substrate conveying process corresponds to the first process of the present invention. In the first process, each substrate is collectively acquired from the third carrier (C3) which houses the second substrates arranged at intervals of 10 mm in the vertical direction (Z), with the substrate (W) in a horizontal orientation.

[0089] FIG. 11J shows the appearance when the substrate (W) held by the HVC position conversion unit (23) is subsequently handed over to the pusher (251). Among the clamping grooves (252) in the pusher (251), the clamping groove (252) into which the substrate (W) related to the first carrier (C1) and the second carrier (C2) is already inserted can no longer clamp the substrate (W). Therefore, the substrate (W) held by the HVC position conversion unit (23) is returned to a position offset by 1 pitch in the arrangement of the clamping grooves (252) from the substrate (W) related to the second carrier (C2), and is inserted into the clamping groove (252) at that position. This alignment of the position between the substrate (W) and the pusher (251) is realized by the pusher shift mechanism (254).

[0090] At that time, the hardness of the support rod (231) and the clamping rod (232) described in FIG. 11D, and the contraction of the support rod (231) are performed, but the specifics have already been fully explained. By the hardness operation of the clamping rod (232), the posture of each substrate (W) is collectively changed from a horizontal posture to a vertical posture. This operation corresponds to the second process of the present invention. Likewise, in FIG. 11H, the rotation of the support rod (231) described in FIG. 11E, the insertion of the substrate (W) into the pusher (251) described in FIG. 11F, the raising and lowering of the pusher (251), the standing operation of the support rod (231) and the clamping rod (232), the extension operation of the support rod (231), and the reverse rotation operation of the support rod (231) are also omitted.

[0091] In this way, the substrate (W) associated with the third carrier (C3) is transferred from the HVC attitude conversion unit (23) to the pusher mechanism (25). At this time, the clamping grooves (252) in the pusher (251) all clamp the substrate (W). In this way, 75 substrates (W) are arranged in the pusher (251) at a pitch of 10 / 3 mm.

[0092] The substrate row generated in this way is called a temporary batch lot (TL). In the case of the substrate (W) held in the carrier (C), which was arranged at a pitch of 10 mm, the arrangement pitch of the substrate (W) in the carrier (C) is changed from 10 mm to 10 / 3 mm in the material block (5). In short, by combining the original substrate group with a second arrangement formed by arranging the second substrates facing in one direction at a distance of 10 mm, the second substrate is positioned at a predetermined position (second position (P2)) in the pusher (251). For the second position (P2), reference can be made to FIG. 12.

[0093] FIG. 12 illustrates a temporary batch lot (TL). The temporary batch lot (TL) is arranged with a repeating sequence of substrates (W) originating from a third carrier (C3), substrates (W) originating from a second carrier (C2), and substrates originating from a first carrier (C1), arranged at a pitch of 10 / 3 mm. All of these substrates (W) face in one direction. Thus, the temporary batch lot (TL) is formed by arranging the substrates (W) in a face-to-back manner.

[0094] Next, the relationship between the clamping groove (252) of the pusher (251) and the substrate (W) is explained. There are three types of locations where the clamping groove (252) is formed: a reference location (P) where the substrate (W) related to the first carrier (C1) is located, a first location (P1) where the substrate (W) related to the second carrier (C2) is located, and a second location (P2) where the substrate (W) related to the third carrier (C3) is located. The reference location (P) is arranged at a pitch of 10 mm in the pusher (251), and the first location (P1) and the second location (P2) divide the 10 mm between the reference locations (P) into three. Specifically, the 10 mm between the reference locations (P) is divided into three equal parts by the first location (P1) and the second location (P2). Therefore, the distance from the first position (P1) to the second position (P2) is 1 / 3 times the arrangement pitch of the substrate (W) housed in the carrier (C).

[0095] 5. Rearrangement of temporary batch lots

[0096] In the temporary batch lot (TL) configured in this way, the orientation of the arranged substrates (W) is constant. This arrangement pattern is not optimal when performing batch chemical treatment. The material block (5) of this embodiment can change the arrangement pattern of the substrates (W) from face-to-back to face-to-face by performing disassembly and rearrangement operations on the temporary batch lot (TL).

[0097] FIG. 13 shows the state of the pusher (251) in FIG. 11J when it rises to an upper position (UR) set above the load (231). In this way, when changing the arrangement pattern for the substrate (W) held by the pusher (251), the rising movement of the pusher (251) is involved. This is because, in changing the arrangement pattern, it is necessary to transfer a part of the substrate (W) held by the pusher (251) to the HVC attitude changer (23).

[0098] FIG. 13 also shows the clamping rod (232) in an upright state rotating halfway around a rotation axis parallel to its elongation direction. Before halfway rotation, the clamping rod (232) was configured to clamp the substrate (W) by the clamping plate (234), but after halfway rotation, the clamping rod (232) clamps the substrate (W) by the clamping plate (230). FIG. 14 explains how the arrangement pitch of the clamping plate changes as the clamping rod (232) rotates. Before halfway rotation, the clamping rod (232) can clamp the substrate (W) arranged at a 10 mm pitch all at once. After halfway rotation, the clamping rod (232) can clamp the substrate (W) arranged at a 20 / 3 mm pitch all at once.

[0099] However, since the clamping rod (232) clamps the substrate (W) in cooperation with the pair of clamping rods (232), the half-rotation operation is performed on one pair of clamping rods (232). Before the half-rotation, the pair of clamping rods (232) had their clamping plates (234) facing each other, but after the half-rotation, the pair of clamping rods (232) have their clamping plates (230) facing each other.

[0100] FIG. 15 illustrates that thereafter, the HVC posture conversion unit (23) operates, causing the standing support rod (231) and the gripping rod (232) to rotate 90°. Through this operation, the HVC posture conversion unit (23) is prepared to receive the substrate (W) from the pusher (251).

[0101] FIG. 16 (a) shows the upper position pusher (251) starting to descend to hand over the substrate (W) to the HVC attitude conversion unit (23). As can be seen by referring to the figure, the arrangement pitch of the clamping plate (230) is longer than the arrangement pitch of the substrate (W) in the temporary batch lot (TL). Therefore, the number of clamping plates (230) is less than the number of substrates (W) in the temporary batch lot (TL).

[0102] FIG. 16(b) shows the appearance when a temporary batch lot (TL) held by a pusher (251) is handed over to a clamping rod (232). The clamping rod (232) cannot clamp all of the substrates (W) of the temporary batch lot (TL). This is because the number of clamping plates (230) is less than the number of substrates (W) in the temporary batch lot (TL). As a result, half of the substrates (W) constituting the temporary batch lot (TL) are clamped by the corresponding clamping plates (230), and the other half are not clamped by the clamping plates (230) and remain held by the pusher (251). FIG. 16 (b) illustrates a configuration in which a substrate (W) held in place by a clamping plate (230) and a substrate (W) held in place by a pusher (251) are alternately arranged.

[0103] The pusher (251) continues to descend even after the substrate (W) is passed to the clamp rod (232).

[0104] FIG. 17A shows the state after the pusher (251) has exited the clamping rod (232). In this way, the temporary batch lot (TL) is divided into a first batch of substrates (W1) arranged at a pitch of 20 / 3 mm and a second batch of substrates (W2) arranged at the same pitch of 20 / 3 mm. If the first batch of substrates (W1) is designated as the first batch and the second batch of substrates (W2) as the second batch, the temporary batch lot (TL) is divided into the first batch and the second batch. The substrates of the first batch are clamped by the clamping rod (232), and the substrates of the second batch are held by the pusher (251).

[0105] FIG. 17A describes rotation around the left and right axes in the mounting rod (231). When inserting a flat plate into the gap of the first set of substrates (W1), the arrangement pitch of the first set of substrates (W1) and the arrangement pitch of the flat plate must match. The arrangement pitch of the first set of substrates (W1) is 20 / 3 mm, and the arrangement pitch of the flat plate (233) described in FIG. 5 is 10 mm. Therefore, when attempting to position the flat plate (233) in the gap of the first set of substrates (W1), the arrangement pitches do not match, and the first set of substrates (W1) and the flat plate (233) collide.

[0106] Assuming such a situation, the mounting rod (231) of the present example has an arrangement in which flat plates (239) are arranged at a pitch of 20 / 3 mm. When the mounting rod (231) is rotated to position the flat plates (239) in the gap of the first set of substrates (W1), the first set of substrates (W1) and the flat plates (239) do not collide because their arrangement pitches match.

[0107] Additionally, this rotational movement is performed by making the support rod (231) retracted. If the same movement is to be performed with the support rod (231) in an extended state, the flat plate (239) collides with the first set of substrates (W1). This is because the position in the left-right direction (Y) of the flat plate (239) placed on the support rod (231) in an extended state coincides with the position in the left-right direction (Y) of the first set of substrates (W1) that are clamped by the clamping rod (232). Therefore, when inserting the flat plate (239) into the gap of the first set of substrates (W1), it is necessary to make the flat plate (239) shifted in the left-right direction (Y) relative to the first set of substrates (W1).

[0108] When the support rod (231) rotates and the flat plate (239) is inserted into the gap of the first set of substrates (W1), the support rod (231) is then extended. By doing so, the flat plate (239) comes into contact with the back surface of the first set of substrates (W1), and even when the support rod (231) is in an upright position, the substrate (W) is securely held by the support rod (231).

[0109] FIG. 17B shows the state when the HVC posture conversion unit (23) operates and the mounting rod (231) is in an upright state. At this time, the clamping rod (232) is merely clamping the end of the first set of substrates (W1), so it cannot maintain the first set of substrates (W1) in a horizontal position with this alone. In this regard, the flat plate (239) in the mounting rod (231) can maintain the center of the first set of substrates (W1), so even if the clamping rod (232) is in an upright state, the first set of substrates (W1) in a horizontal position is reliably maintained by the pair of mounting rods (231).

[0110] FIG. 17B shows the pusher (251) rising. The support rod (231) and the clamping rod (232) in the HVC attitude conversion unit (23) have already rotated 90° and are evacuated from the pusher (251). Therefore, even when the pusher (251) rises, it does not collide with the clamping rod (232) or the support rod (231).

[0111] FIG. 17C shows the pusher (251) rotating halfway in an overhead position of the HVC attitude conversion unit (23). The pusher (251) rotates around a vertical axis by the operation of the pusher rotation mechanism (253). By performing this operation, the second set of substrates (W2) that were facing in one direction all face in the reverse direction.

[0112] FIG. 17D shows the pusher (251) descending after a half-rotation operation. The pusher (251) passes through the array of the first set of substrates (W1) and stops at a downward position relative to the first set of substrates (W1).

[0113] FIG. 17E illustrates that thereafter, the HVC position conversion unit (23) operates, causing the standing support rod (231) and the clamping rod (232) to rotate 90°. Through this operation, the HVC position conversion unit (23) is prepared to hand over the first set of substrates (W1) to the pusher (251). Additionally, before reaching the state of FIG. 17E, the support rod (231) performs the contraction and rotation movements described in FIG. 11D and FIG. 11E, thereby ejecting the clamping plate (230) from the gap of the first set of substrates (W1). By performing these operations in advance, the clamping plate (230) does not collide with the pusher (251) appearing from below and the second set of substrates (W2) supported by it.

[0114] FIG. 17E also shows the appearance when the pusher (251) begins to rise after the sling rod (231) and the clamp rod (232) have hardened.

[0115] FIG. 17F (a) shows the state when the pusher (251) receives the first set of substrates (W1) from the clamping rod (232). At this time, a batch lot (BL) is created in the pusher (251) in which the first set of substrates (W1) facing one direction and the second set of substrates (W2) facing the reverse direction are alternately arranged.

[0116] The pusher (251) continues to rise even after the first substrate (W1) is taken from the clamping rod (232).

[0117] Figure 17F (b) shows the state after the pusher (251) has removed the first batch substrate (W1) from the clamping rod (232). In this way, the batch lot (BL) of the present example is created.

[0118] The creation of a batch lot (BL) is carried out in the following order. First, the substrates (W) constituting the temporary batch lot (TL) are divided into a first group and a second group so that two opposing substrates (W) form different groups. Then, the temporary batch lot (TL) is dismantled by moving the first group and the second group relative to the arrangement direction of the substrates (left-right direction (Y)) in a direction orthogonal to it (vertical direction (Z)). Then, the second group substrate (W2) is rotated halfway. As a result, the second group substrate (W2) faces the reverse direction from its original direction. Finally, the first group substrate (W1) and the second group substrate (W2) are combined so that the first group substrate (W1) facing one direction and the second group substrate (W2) facing the reverse direction are arranged alternately. A batch lot (BL) is formed by arranging substrates (W) in a face-to-face manner like this.

[0119] The number of substrates (W) constituting the batch lot (BL) is 75, which is the same as the number of substrates (W) related to the temporary batch lot (TL). Therefore, the number of substrates constituting the batch lot (BL) is three times the original substrate group.

[0120] FIG. 18 illustrates a batch lot (BL). In the batch lot (BL), a first set of substrates (W1) facing in one direction and a second set of substrates (W2) facing in the reverse direction are arranged repeatedly at a pitch of 10 / 3 mm. Thus, the batch lot (BL) is formed by arranging substrates (W) in a face-to-face manner.

[0121] 6. Maintenance of batch lots in material blocks

[0122] In the material block (5), there are two parts capable of holding a batch lot (BL). One of them is a pusher (251). The pusher (251) can move back and forth between an initial position where the substrate (W) can be exchanged with the HVC position changer (23) and a receiving position (PP) where the batch lot (BL) can be handed over to the forward / backward conveyor mechanism (WTR). This back-and-forth movement is realized by a pusher shift mechanism (254).

[0123] In the material block (5), there is a lot support part (33) that can hold the batch lot (BL) separately from the pusher (251). This lot support part (33) is a batch lot holding part for temporarily evacuating the batch lot (BL) when a blockage of the batch lot (BL) occurs between the material block (5) and the processing block (6).

[0124] 7. Processing Block

[0125] Next, the configuration of the processing block (6) described in FIG. 1 will be explained. The processing block (6) is adjacent to the material block (5). The processing block (6) performs batch processing on the batch lot (BL) described above. The processing block (6) is divided into a batch processing area (R1) arranged in the width direction (Y direction) and a batch return area (R2). Each area extends in the front-back direction (X direction). Specifically, the batch processing area (R1) is located inside the processing block (6). The batch return area (R2) is located adjacent to the batch processing area (R1) and is positioned at the far left of the processing block (6).

[0126] The batch processing area (R1) in the processing block (6) is a rectangular area extended in the front-back direction (X direction). One end of the batch processing area (R1) (front side) is adjacent to the material block (5). The other end of the batch processing area (R1) is extended in a direction spaced apart from the material block (5) (rear side). When transporting a batch lot (BL) from the material block (5) to the processing block (6), the forward and backward transport mechanism (WTR) of the processing block (6) is used.

[0127] The forward and backward conveying mechanism (WTR) conveys multiple substrates (W) in a vertical position in a batch between the material block (5), the batch processing unit (BPU1 to BPU6), and the batch drying chamber (DC). The forward and backward conveying mechanism (WTR) can hold a batch lot (BL) consisting of substrates (W) arranged at a pitch of 10 / 3 mm.

[0128] The batch processing area (R1) is equipped with a batch processing unit that performs batch processing. Specifically, the batch processing area (R1) has a batch drying chamber (DC) that dries a plurality of substrates (W) in batches, and a plurality of batch processing units (BPU1 to BPU6) arranged in the direction in which the batch processing area (R1) extends to immerse a plurality of substrates (W) in batches. The batch processing units (BPU1 to BPU6) immerse a plurality of substrates in a vertical position in batches. The arrangement of the batch drying chamber (DC) and the batch processing units (BPU1 to BPU6) will be described in detail. The batch drying chamber (DC) is adjacent to the material block (5) from the rear. The first batch processing unit (BPU1) is adjacent to the batch drying chamber (DC) from the rear. The second batch processing unit (BPU2) is adjacent to the first batch processing unit (BPU1) from the rear. The third batch processing unit (BPU3) is adjacent to the rear of the second batch processing unit (BPU2). The fourth batch processing unit (BPU4) is adjacent to the rear of the third batch processing unit (BPU3). The fifth batch processing unit (BPU5) is adjacent to the rear of the fourth batch processing unit (BPU4). The sixth batch processing unit (BPU6) is adjacent to the rear of the fifth batch processing unit (BPU5). Accordingly, the batch drying chamber (DC), the first batch processing unit (BPU1), the second batch processing unit (BPU2), the third batch processing unit (BPU3), the fourth batch processing unit (BPU4), the fifth batch processing unit (BPU5), and the sixth batch processing unit (BPU6) are arranged to be spaced apart from the material block (5) in this order.

[0129] The batch processing unit (BPU1 to BPU6) has a batch processing tank capable of holding a liquid. The batch processing tank is a liquid tank that holds a chemical solution or pure water. As for the chemical solution, it may be an acidic aqueous solution, for example, an aqueous phosphoric acid solution. In this specification, the chemical solution and pure water are collectively referred to as the processing liquid. The batch processing tank that holds the chemical solution is called the batch chemical solution processing tank (CHB2 to CHB6), and the batch processing tank that holds pure water is called the batch rinse processing tank (ONB).

[0130] The second batch processing unit (BPU2) specifically comprises a batch chemical treatment tank (CHB2) that processes batch lots (BL) in a batch, and a lifter (LF2) that raises and lowers the batch lot (BL) between a substrate receiving position and a chemical treatment position (see FIG. 2). The substrate receiving position is a position set above the batch chemical treatment tank (CHB2) where a forward / backward conveying mechanism (WTR) can access, and the chemical treatment position is a position set within the tank of the batch chemical treatment tank (CHB2) where the batch lot (BL) can be immersed in the chemical. The batch chemical treatment tank (CHB2) performs acid treatment on the batch lot (BL). The acid treatment may be phosphoric acid treatment, but may also be treatment using other acids. Phosphoric acid treatment performs etching treatment on multiple substrates (W) constituting the batch lot (BL). The etching process chemically etches the nitride film on the surface of the substrate (W), for example.

[0131] A lifter (LF2) can hold a batch lot (BL) consisting of substrates (W) arranged at a pitch of 10 / 3 mm. A lifter formed in another processing tank can also hold this batch lot (BL) in the same way as the lifter (LF2). A batch drying chamber (DC) can receive this batch lot (BL).

[0132] The batch chemical treatment tank (CHB2) contains an acid solution such as a phosphoric acid solution. A lifter (LF2) is installed in the batch chemical treatment tank (CHB2) to move the batch lot (BL) up and down. The lifter (LF2) moves up and down in the vertical direction (Z direction). Specifically, the lifter (LF2) moves up and down between a processing position corresponding to the inside of the batch chemical treatment tank (CHB2) and a receiving position corresponding to the upper part of the batch chemical treatment tank (CHB2). The lifter (LF2) holds the batch lot (BL) consisting of a substrate (W) in a vertical position. At the receiving position, the lifter (LF2) transfers the batch lot (BL) between a forward and backward conveying mechanism (WTR). When the lifter (LF2) descends from the receiving position to the processing position while holding the batch lot (BL), the entire surface of the substrate (W) is located below the liquid level of the chemical solution. When the lifter (LF2) rises from the processing position to the receiving position while holding the batch lot (BL), the entire surface of the substrate (W) is located above the liquid level of the chemical solution. The lifter (LF2) can immerse the batch lot (BL) in the batch processing tank in a batch. At this time, the lifter (LF2) descends from the receiving position to the processing position.

[0133] The third batch processing unit (BPU3) specifically comprises a batch chemical treatment tank (CHB3) and a lifter (LF3) that raises and lowers a batch lot (BL) between a substrate receiving position and a chemical treatment position. The batch chemical treatment tank (CHB3) has the same configuration as the batch chemical treatment tank (CHB2) described above. In short, the batch chemical treatment tank (CHB3) contains the chemical described above and is equipped with a lifter (LF3). The batch chemical treatment tank (CHB3) performs the same treatment on the batch lot (BL) as the batch chemical treatment tank (CHB2). The substrate processing device (1) of the present example is equipped with a plurality of treatment tanks capable of performing the same chemical treatment. This is because phosphoric acid treatment requires more time than other treatments. Phosphoric acid treatment requires a long time (e.g., 60 minutes). Therefore, the device of this example is designed to allow acid treatment to be carried out in parallel by multiple batch chemical treatment tanks.

[0134] The 4th batch processing unit (BPU4) to the 6th batch processing unit (BPU6) have the same configuration as the 2nd batch processing unit (BPU2) and the 3rd batch processing unit (BPU3). That is, the 4th batch processing unit (BPU4) is equipped with a batch chemical treatment tank (CHB4) and a lifter (LF4) that raises and lowers a batch lot (BL) between a substrate receiving position and a chemical treatment position. Likewise, the 5th batch processing unit (BPU5) is equipped with a batch chemical treatment tank (CHB5) and a lifter (LF5) that raises and lowers a batch lot (BL) between a substrate receiving position and a chemical treatment position. And the 6th batch processing unit (BPU6) is equipped with a batch chemical treatment tank (CHB6) and a lifter (LF6) that raises and lowers a batch lot (BL) between a substrate receiving position and a chemical treatment position. Accordingly, the batch lot (BL) is acid-treated in any of the batch chemical treatment tanks (CHB2) to the batch chemical treatment tank (CHB6). By performing chemical treatment in parallel by five treatment units in this way, the throughput of the device is increased.

[0135] Specifically, the first batch processing unit (BPU1) comprises a batch rinse processing tank (ONB) that receives rinse liquid and a lifter (LF1) that raises and lowers a batch lot (BL) between a substrate receiving position and a rinse position. The substrate receiving position is a position set above the batch rinse processing tank (ONB) where a forward / backward conveying mechanism (WTR) can access, and the rinse position is a position set within the tank of the batch rinse processing tank (ONB) where the batch lot (BL) can be immersed in rinse liquid. The batch rinse processing tank (ONB) has the same configuration as the batch chemical processing tank (CHB2) described above. In short, the batch rinse processing tank (ONB) receives rinse liquid and is equipped with a lifter (LF1). Unlike other treatment tanks, the batch rinse treatment tank (ONB) contains pure water and is formed for the purpose of cleaning a chemical solution attached to multiple substrates (W). In the batch rinse treatment tank (ONB), when the resistivity of the pure water in the tank rises to a predetermined value, the cleaning treatment is terminated.

[0136] In this way, the batch rinse treatment tank (ONB) in this embodiment is located closer to the material block (5) than the batch chemical treatment tank (CHB2) to the batch chemical treatment tank (CHB6). By configuring it in this manner, the various mechanisms constituting the material block (5) and the batch chemical treatment tank (CHB2) to the batch chemical treatment tank (CHB6) are kept as far apart as possible, so that the pusher mechanism (25), etc., are not adversely affected by acids such as phosphoric acid. In addition, by arranging the material block (5) and the batch drying chamber (DC) in close proximity, the batch lot (BL) that has finished rinsing is conveyed over a short distance and immediately returned to the material block (5).

[0137] 8. Batch return area in the processing block

[0138] The batch return area (R2) in the processing block (6) is a rectangular area extended in the front-rear direction (X direction). The batch return area (R2) is formed along the outer edge of the batch processing area (R1), and one end extends to the material transfer block (5), while the other end extends in a direction separated from the material transfer block (5).

[0139] In the batch transport area (R2), a forward and backward transport mechanism (WTR) is formed to transport multiple substrates (W) in batches. The forward and backward transport mechanism (WTR) transports multiple substrates (W) (specifically batch lots (BL)) in batches between the substrate receiving position (PP) within the material block (5), the lot support (33), the batch drying chamber (DC), and each batch processing unit (BPU1 to BPU6). The forward and backward transport mechanism (WTR) is configured to be reciprocating in the forward and backward direction (X direction) across the material block (5) and the processing block (6). In addition to the batch transport area (R2) in the processing block (6), the forward and backward transport mechanism (WTR) can also enter the substrate receiving position (PP) and the lot support (33) within the material block (5).

[0140] The forward and backward conveying mechanism (WTR) is equipped with a pair of chucks (29) for conveying a batch lot (BL). The pair of chucks (29) can change between a closed state where they are close to each other and an open state where they are separated from each other. The chucks (29) are members extending in the Y direction, with grooves for gripping substrates (W) arranged at a pitch of 10 / 3 mm. The pair of chucks (29) are in a closed state and receive multiple substrates (W) constituting the batch lot (BL). Then, the pair of chucks (29) are in an open state and transfer the multiple substrates (W) constituting the batch lot (BL) to another member (lifter (LF1), etc.). The forward and backward transfer mechanism (WTR) transfers batch lots (BL) between the substrate receiving position (PP) and the lot support (33) in the material block (5). In addition to this, the forward and backward transfer mechanism (WTR) transfers batch lots (BL) between each lifter (LF1 to LF6) belonging to the batch processing unit (BPU1 to BPU6) in the processing block (6) and the batch drying chamber (DC).

[0141] In the batch return area (R2), a guide rail (31) extending in the X direction is provided to guide the forward and backward return mechanism (WTR). The forward and backward return mechanism (WTR) can move forward and backward in the X direction along the guide rail (31). Accordingly, the guide rail (31) extends from the processing block (6) to the material transfer block (5). More specifically, the guide rail (31) faces the substrate receiving position (PP) in the material transfer block (5) from the Y direction and faces the 6th batch processing unit (BPU6) in the processing block (6) from the Y direction. In addition to these, the guide rail (31) faces the lot support (33) in the material block (5), the batch drying chamber (DC) in the processing block (6), and the first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) from the Y direction.

[0142] 9. Other configurations in the processing block

[0143] A batch drying chamber (DC) is positioned between a first batch processing unit (BPU1) and a material block (5). The batch drying chamber (DC) has a drying chamber that accommodates a batch lot (BL) formed by arranging substrates (W) in a vertical position. The drying chamber has an inert gas supply nozzle that supplies inert gas into the chamber and a steam supply nozzle that supplies vapor of an organic solvent into the chamber. The batch drying chamber (DC) first supplies inert gas to the batch lot (BL) supported within the chamber and replaces the atmosphere within the chamber with inert gas. Then, depressurization within the chamber is initiated. While the chamber is under depressurization, vapor of an organic solvent is supplied into the chamber. The organic solvent is discharged out of the chamber along with moisture attached to the substrates (W). In this way, the batch drying chamber (DC) performs drying of the batch lot (BL). The inert gas at this time may be, for example, nitrogen, and the organic solvent may be, for example, IPA (isopropyl alcohol).

[0144] In the substrate processing device (1), the carrier stacking shelf (13a), the batch drying chamber (DC), and the batch processing units (BPU1 to BPU6) are arranged in the front-rear direction. That is, the carrier stacking shelf (13a) is arranged in the front, and the batch drying chamber (DC) is arranged behind it. The batch processing units (BPU1 to BPU6) are also arranged behind it. In the substrate processing device (1) of this embodiment, the layout within the device is optimized so that the travel distance of the forward-reverse conveying mechanism (WTR) is reduced.

[0145] 10. Control unit

[0146] Refer to FIG. 1 for the control unit (131) of the substrate processing device (1). Also, although not shown in FIG. 1, a corresponding memory unit is formed in the control unit (131). The control unit (131) is composed of, for example, a CPU (Central Processing Unit). The specific configuration of the control unit is not limited, and, for example, each control unit may be composed of a single processor or each control unit may be composed of individual processors.

[0147] Controls for the control unit (131) include, for example, a carrier conveying mechanism (11), a handling robot (HTR), an HVC posture conversion unit (23), a pusher mechanism (25), a forward / backward conveying mechanism (WTR), a batch processing unit (BPU1 to BPU6), and a batch drying chamber (DC).

[0148] 11. Substrate Processing Flow

[0149] Next, the flow of the substrate processing of this example will be explained with reference to the flowchart in Fig. 19.

[0150] Step S11: A substrate (W) arranged at a pitch of 10 mm, which is returned from the first carrier (C1) by a handling robot (HTR), is acquired by a pusher (251) after a change in orientation. Step S11 corresponds to the substrate group acquisition process of the present invention.

[0151] Step S12: The handling robot (HTR) acquires the substrate (W) from the second carrier (C2) and hands it over to the HVC attitude conversion unit (23). Step S12 corresponds to the first process of the present invention.

[0152] Step S13: A substrate (W) arranged at a pitch of 10 mm, obtained from the second carrier (C2), is transferred to a pusher (251) after a change in orientation. Since the substrate (W) associated with the first carrier (C1) is already arranged in the pusher (251), the substrate (W) associated with the first carrier (C1) and the substrate (W) associated with the second carrier (C2) are arranged in the pusher (251). Step S13 corresponds to the first assembly process of the present invention. Between Step S12 and Step S13, the second process described above is executed.

[0153] Step S14: The handling robot (HTR) acquires the substrate (W) from the third carrier (C3) and hands it over to the HVC attitude conversion unit (23). Step S14 corresponds to the first process of the present invention.

[0154] Step S15: A substrate (W) arranged at a pitch of 10 mm, obtained from the third carrier (C3), is transferred to a pusher (251) after orientation change. Since the substrate (W) related to the first carrier (C1) and the substrate (W) related to the second carrier (C2) are already arranged in the pusher (251), the substrate rows related to the first carrier (C1) and the second carrier (C2) and the substrate (W) related to the third carrier (C3) become a batch group in the pusher (251). In this way, a temporary batch lot (TL) is created. Step S15 corresponds to the second assembly process of the present invention. Between Step S14 and Step S15, the second process described above is executed.

[0155] Step S16: The substrates (W) constituting the temporary batch lot (TL) are divided into a first batch and a second batch. A pusher (251) holding the temporary batch lot (TL) hands the first batch substrate (W1) associated with the first batch to a clamping rod (232) to separate it from the second batch substrate (W2) associated with the second batch. Step S16 corresponds to the dismantling process of the present invention.

[0156] Step S17: A half-rotation of the second substrate (W2) is performed. As a result, the second substrate (W2), which was facing one direction, is oriented in the reverse direction. Step S17 corresponds to the half-rotation process of the present invention.

[0157] Step S18: The pusher (251) moves up and down to acquire the first set of substrates (W1) from the clamping rod (232). The pusher (251) has a clamping groove (252) for clamping the second set of substrates (W2) and an empty clamping groove (252) arranged alternately. When each of the first set of substrates (W1) is inserted into the corresponding empty clamping groove (252), the creation of the batch lot (BL) is completed. Step S18 corresponds to the rearrangement process of the present invention.

[0158] Step S19: The generated batch lot (BL) is returned from the material block (5) to the processing block (6) by the forward and backward return mechanism (WTR).

[0159] Step S20: Chemical treatment is performed on the batch lot (BL). Step S20 corresponds to the processing process of the present invention.

[0160] Step S21: Rinse treatment is performed on the batch lot (BL).

[0161] Step S22: Drying treatment is performed on the batch lot (BL).

[0162] In this way, substrate processing is realized on a batch lot basis.

[0163] Step S23: The batch lot (BL) that has undergone substrate processing is transported from the processing block (6) to the material block (5) by the forward and backward transport mechanism (WTR).

[0164] Step S24: The pusher (251) passes the first substrate (W1) to the clamping rod (232) while holding the second substrate (W2).

[0165] Step S25: A half-rotation of the second plate (W2) is performed. As a result, the second plate (W2), which was facing in the reverse direction, is oriented in one direction.

[0166] Step S26: The pusher (251) takes the first set of substrates (W1) from the clamping rod (232). The pusher (251) has a clamping groove (252) for clamping the second set of substrates (W2) and an empty clamping groove (252) arranged alternately. When each of the first set of substrates (W1) is inserted into the corresponding empty clamping groove (252), the creation of the temporary batch lot (TL) is completed.

[0167] Step S27: In the pusher (251), substrates (W) associated with the third carrier (C3) are arranged at a pitch of 10 mm. The pusher (251) moves up and down to transfer the substrates (W) associated with the third carrier (C3) to the clamping rod (232). In this way, the temporary batch lot (TL) is dismantled.

[0168] Step S28: The substrate (W) handed to the clamping rod (232) is returned to the third carrier (C3) by the handling robot (HTR) after the orientation change.

[0169] Step S29: In the pusher (251), substrates (W) associated with the second carrier (C2) are arranged at a pitch of 10 mm. The pusher (251) moves up and down to transfer the substrates (W) associated with the second carrier (C2) to the clamping rod (232). In this way, the dismantling of the temporary batch lot (TL) proceeds.

[0170] Step S30: The substrate (W) handed to the clamping rod (232) is returned to the second carrier (C2) by the handling robot (HTR) after the orientation change.

[0171] Step S31: In the pusher (251), substrates (W) associated with the first carrier (C1) are arranged at a pitch of 10 mm. The pusher (251) moves up and down to pass the substrates (W) associated with the first carrier (C1) to the clamping rod (232). After changing the position, the passed substrates (W) are returned to the first carrier (C1) by the handling robot (HTR).

[0172] 12. Effects of the present example

[0173] According to the present example, a temporary batch lot (TL) is formed in which substrates (W) are oriented in the same direction. Then, the substrates (W) are divided into a first group and a second group so that two opposing substrates (W) among the substrates (W) constituting the temporary batch lot (TL) become different groups, and the second group is rotated halfway. Then, by combining the first group and the second group, a batch lot (BL) is created by alternately arranging substrates (W) oriented in one direction and substrates (W) oriented in the reverse direction. By configuring it in this way, the substrates (W) can be arranged face-to-face while making the arrangement pitch of the substrates (W) narrower than that of the conventional method.

[0174] According to the present example, the number of substrates (W) constituting the batch lot (BL) is three times the number of substrate groups in step S11. By configuring it in this way, there is no remaining substrate (W) in the substrate group when constituting the batch lot (BL). Since the substrate group is not divided into two batch lots (BL), the history of substrate processing in the substrates constituting the substrate group can be reliably matched.

[0175] According to the present example, a first process of collectively acquiring each substrate (W) from a carrier (C) that receives substrates (W) arranged at a predetermined interval in a vertical direction in a horizontal position, and a second process of collectively changing the position of each substrate (W) from a horizontal position to a vertical position, wherein the first process and the second process are performed before step S13 and step S15. By configuring it in this way, a substrate processing method can be provided by receiving a first set of first substrates (W) arranged in a unidirectional direction from a carrier (C) or a second set of second substrates (W2).

[0176] According to the present example, the predetermined spacing is the same as the arrangement pitch of the substrate (W) housed in the carrier (C). By configuring it in this way, changing the pitch of the substrate (W) becomes easy.

[0177] According to the present example, the distance from the first position (P1) to the second position (P2) is 1 / 3 of the arrangement pitch of the substrate (W) housed in the carrier (C). By configuring it in this way, the pitch of the resulting substrate arrangement can be reduced to 1 / 2 or less of the arrangement pitch of the substrate (W) housed in the carrier.

[0178] According to the present example, the first position (P1) and the second position (P2) divide the predetermined interval into three equal parts. By configuring it in this way, the substrate (W) can be arranged more neatly.

[0179] 13. Variation Example

[0180] The present invention is not limited to the configuration of the embodiments and can be modified as follows.

[0181] <Variation Example 1>

[0182] In the substrate processing method of the embodiment, the substrate (W) was obtained from a carrier (C) that accommodates an odd number of substrates (W), but the present invention is not limited to this configuration. The substrate may also be obtained from a carrier (C) that accommodates an even number of substrates (W). By making such a configuration, the number of substrates (W) constituting the temporary batch lot (TL) becomes an even number. Then, the number of first batch substrates (W1) and second batch substrates (W2) becomes equal. By making such a configuration, the temporary batch lot (TL) is disassembled so that the substrate (W) located at one end of the temporary batch lot (TL) and the substrate (W) located at the other end of the temporary batch lot (TL) are divided into different batches. By making such a configuration, the orientation of the substrates (W) constituting the batch lot (BL) can be made desired. In short, according to the present variation, the direction of one end of the substrate (W) in the batch lot (BL) and the direction of the other end of the substrate (W) can be made different, so the arrangement of the substrates (W) can be made more reliably face-to-face.

[0183] <Variation Example 2>

[0184] In the substrate processing method of the embodiment, the temporary batch lot (TL) was composed of an odd number of substrates (W), but by adding a dummy wafer to the temporary batch lot (TL), the number of first batch substrates (W1) and second batch substrates (W2) can be made equal. By configuring it in this way, the direction of one end of the substrate (W) in the batch lot (BL) can be made different from the direction of the other end of the substrate (W), so the arrangement of the substrates (W) can be made more reliably face-to-face.

Claims

Claim 1 A substrate processing method for processing multiple substrates in a batch having directions defined on the surface and the back side, comprising: a substrate group acquisition process for acquiring a substrate group formed by arranging substrates facing in a unidirectional manner at a predetermined interval; a first arrangement formed by arranging the first substrates facing in the unidirectional manner at the predetermined interval; a first assembly process for positioning the first substrate at the first position among the first position and the second position, which divide the predetermined interval in the substrate group into three by combining the substrate group; a second arrangement formed by arranging the second substrates facing in the unidirectional manner at the predetermined interval; a second assembly process for forming a temporary batch lot by positioning the second substrate at the second position by combining the substrate group and the first substrate; and dividing the substrates into a first group and a second group such that two opposing substrates among the substrates constituting the temporary batch lot become different groups, and arranging the first group and the second group relatively in a direction orthogonal to the arrangement direction of the substrates. A substrate processing method characterized by comprising: a dismantling process for dismantling the temporary batch lot by moving it; a half-rotation process for orienting the substrate constituting the second set toward the reverse direction of the unidirectional direction by half-rotating the second set; a rearrangement process for creating a batch lot by alternately arranging the substrate facing the unidirectional direction and the substrate facing the reverse direction by combining the first set and the second set; and a processing process for immersing the batch lot in a processing solution. Claim 2 A substrate processing method according to claim 1, wherein the dismantling process is characterized by dismantling the temporary batch lot such that the substrate located at one end of the temporary batch lot and the substrate located at the other end of the temporary batch lot are divided into different groups. Claim 3 A substrate processing method according to claim 1, characterized in that the number of substrates constituting the batch lot is three times the number of substrates in the substrate group acquisition process. Claim 4 A substrate processing method according to claim 1, comprising a first process of collectively acquiring each substrate from a carrier that accommodates substrates arranged at predetermined intervals in a vertical direction, wherein the substrates in a horizontal position are collectively converted from a horizontal position to a vertical position, and a second process of collectively converting the position of each substrate to a horizontal position, wherein the first process and the second process are performed before each assembly process. Claim 5 A substrate processing method according to claim 4, wherein the predetermined spacing is the same as the arrangement pitch of the substrate housed in the carrier. Claim 6 A substrate processing method according to claim 4, characterized in that the distance from the first position to the second position is 1 / 3 times the arrangement pitch of the substrate housed in the carrier. Claim 7 A substrate processing method according to claim 1, wherein the first position and the second position divide the predetermined interval into three equal parts.

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