Display device

Abstract

The display device of the present invention comprises: a display panel including a first non-folding area, a second non-folding area, and a folding area disposed between the first non-folding area and the second non-folding area; and a digitizer including a base layer, first conductive lines disposed on the base layer, a first cover layer disposed on the first conductive lines, second conductive lines disposed on the first cover layer, a second cover layer disposed on the second conductive lines, and via holes penetrating the first cover layer; wherein some of the second conductive lines are electrically connected to the first conductive lines through the via holes, and the via holes overlap the folding area.

Description

Technology Field

[0001] The present invention relates to a display device, and more specifically, to a foldable display device. Background Technology

[0002] A display device includes a display area that is activated according to an electrical signal. The display device can detect external inputs applied through the display area and simultaneously display various images to provide information to the user. Recently, as display devices of various shapes have been developed, display areas with various shapes are being implemented. The problem to be solved

[0003] The present invention aims to provide a foldable display device with improved reliability. means of solving the problem

[0004] The display device of the present invention comprises: a display panel including a first non-folding area, a second non-folding area, and a folding area disposed between the first non-folding area and the second non-folding area; and a digitizer including a base layer, first conductive lines disposed on the base layer, a first cover layer disposed on the first conductive lines, second conductive lines disposed on the first cover layer, a second cover layer disposed on the second conductive lines, and via holes penetrating the first cover layer; wherein some of the second conductive lines are electrically connected to the first conductive lines through the via holes, and the via holes overlap the folding area.

[0005] In one embodiment, some of the first conductive lines and some of the second conductive lines connected to the via holes may form a closed curve.

[0006] In one embodiment, the spacing between any two adjacent via holes may be greater than the average size value of the via holes.

[0007] In one embodiment, the number of via holes placed in the same column among the via holes may be two or fewer.

[0008] In one embodiment, when n via holes are arranged in the same row among the via holes, the horizontal distance between any two adjacent via holes among the n via holes is at least n times the average size of the via holes, and n may be an integer greater than or equal to 2.

[0009] In one embodiment, when two of the via holes are placed in the same column, the vertical distance between the two via holes may be at least twice the average size of the via holes.

[0010] In one embodiment, the via holes may be arranged in different columns.

[0011] In one embodiment, the via holes may be arranged in different rows.

[0012] In one embodiment, the via holes include a first via hole, a second via hole, a third via hole, a fourth via hole, and a fifth via hole, wherein the first via hole, the third via hole, and the fifth via hole are arranged in a first row, the second via hole and the fourth via hole are arranged in a second row, and each of the first to fifth via holes may be arranged in a first to fifth column, respectively.

[0013] In one embodiment, the first non-folding region, the folding region, and the second non-folding region are distinguished in the x-axis direction, each of the first conductive lines extends in the x-axis direction in a plane, and each of the second conductive lines may extend in the y-axis direction intersecting the x-axis direction in a plane.

[0014] In one embodiment, the first non-folding region, the folding region, and the second non-folding region are distinguished in the x-axis direction, each of the first conductive lines extends in the y-axis direction intersecting the x-axis direction in a plane, and each of the second conductive lines may extend in the x-axis direction in a plane.

[0015] In one embodiment, the digitizer may include a first part that overlaps the folding area and is foldable around a virtual folding axis, a second part that overlaps the first non-folding area, and a third part that overlaps the second non-folding area.

[0016] In one embodiment, the via hole may be disposed in the first part.

[0017] In one embodiment, the digitizer includes a first digitizer and a second digitizer spaced apart from each other, the first digitizer overlaps at least a portion of the folding area and the second non-folding area, the second digitizer overlaps at least a portion of the folding area and the first non-folding area, and the via holes may be disposed in the first digitizer and the second digitizer.

[0018] In one embodiment, an electromagnetic shielding layer disposed below the digitizer may be further included.

[0019] The display device of the present invention comprises: a window module; and a display module disposed below the window module, comprising a first non-folding area, a folding area, and a second non-folding area defined in order along the x-axis direction; wherein the display module comprises: a display panel; and a digitizer disposed below the display panel, comprising first conductive lines extending in the y-axis direction intersecting the x-axis direction and second conductive lines extending in the x-axis direction and disposed on a different layer from the first conductive lines; wherein the digitizer comprises a plurality of via holes overlapping the folding area, and a portion of the second conductive lines is electrically connected to a portion of the first conductive lines through the plurality of via holes.

[0020] In one embodiment, the number of via holes placed in the same column among the via holes may be two or fewer.

[0021] In one embodiment, when the number of via holes placed in any one of the plurality of rows is n, the distance between any two adjacent via holes among the n via holes is at least n times the average size of the via holes, and n may be an integer greater than or equal to 2.

[0022] In one embodiment, the display module further includes a lower member disposed below the digitizer, and the lower member may include at least one of an electromagnetic shielding layer, a heat dissipation layer, a cushion layer, and a metal plate.

[0023] The display device of the present invention comprises: a display panel including a first non-folding area, a second non-folding area, and a folding area disposed between the first non-folding area and the second non-folding area; and a digitizer disposed overlappingly on the display panel, comprising a plurality of insulating layers, a first conductive line and a second conductive line disposed between the plurality of insulating layers, and via holes penetrating some of the plurality of insulating layers; wherein the digitizer comprises a first part having at least a portion that overlaps the folding area and is flexible, a second part that overlaps the first non-folding area, and a third part that overlaps the second non-folding area, wherein the via holes are disposed in the first part, and some of the second conductive lines are connected to some of the first conductive lines through the via holes to form a closed curve, and the spacing between any two adjacent via holes is greater than or equal to the average size value of the via holes. Effects of the invention

[0024] According to the present invention, cracks occurring in the folding area of ​​a digitizer during folding of a display device can be minimized.

[0025] According to the present invention, a foldable display device with improved reliability can be provided. Brief explanation of the drawing

[0026] FIGS. 1a to 1c are perspective views of an electronic device according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of an electronic device according to one embodiment of the present invention. FIG. 3 is a cross-sectional view of an electronic device according to one embodiment of the present invention. FIG. 4 is a plan view of a display panel according to one embodiment of the present invention. FIG. 5 is a plan view of a digitizer according to one embodiment of the present invention. FIG. 6 is a cross-sectional view of a digitizer according to one embodiment of the present invention. FIG. 7 is a cross-sectional view of a digitizer according to one embodiment of the present invention. FIGS. 8a to 8e are plan views of an embodiment in which the TT region shown in FIG. 5 is enlarged. FIG. 8f is a plan view of a comparative example with an enlarged view of the TT region shown in FIG. 5. FIG. 9a is a cross-sectional view of a digitizer according to one embodiment of the present invention. FIG. 9b is a plan view of a part of a digitizer according to one embodiment of the present invention. FIG. 10 is a plan view of a digitizer according to one embodiment of the present invention. FIG. 11 is a cross-sectional view of a display device according to one embodiment of the present invention. FIG. 12 is a cross-sectional view of a display device according to one embodiment of the present invention. Specific details for implementing the invention

[0027] In this specification, where a component (or region, layer, part, etc.) is described as being “on,” “connected,” or “joined” another component, it means that it may be directly placed / connected / joined on the other component, or that a third component may be placed between them.

[0028] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the effective illustration of the technical content. “And / or” includes all one or more combinations that the associated components may define.

[0029] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0030] Additionally, terms such as “below,” “lower,” “above,” and “upper” are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0031] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0032] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an overly ideal or overly formal sense unless explicitly defined herein.

[0033] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0034] FIGS. 1a to 1c are perspective views of an electronic device (ED) according to an embodiment of the present invention. FIG. 1a shows an unfolded state, and FIGS. 1b and 1c show a folded state.

[0035] Referring to FIGS. 1a through 1c, an electronic device (ED) according to an embodiment of the present invention may include a display surface (DS) defined by a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). The display surface (DS) may correspond to the front surface of the electronic device (ED). An image (IM) may include a still image as well as a dynamic image. The electronic device (ED) may provide the image (IM) to a user through the display surface (DS).

[0036] The display surface (DS) may include a display area (DA) and a non-display area (NDA) surrounding the display area (DA). The display area (DA) may display an image (IM), and the non-display area (NDA) may not display an image (IM). The non-display area (NDA) may surround the display area (DA). However, not limited thereto, the shape of the display area (DA) and the shape of the non-display area (NDA) may be modified. Alternatively, the non-display area (NDA) may be omitted.

[0037] The display area (DA) may include a transmissive area (TA) and a non-transmissive area (NTA). The transmissive area (TA) may be an area through which natural light, infrared light, etc. pass. Through the transmissive area (TA), the electronic device (ED) may detect an external subject or provide sound signals, such as voice, to the outside. The non-transmissive area (NTA) may display an image (IM) in a third direction (DR3).

[0038] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). Additionally, in this specification, "on the plane" may be defined as a state viewed from the third direction (DR3).

[0039] The front (or top) and back (or bottom) surfaces of each component are defined based on the third direction (DR3). The front and back surfaces are opposed to each other in the third direction (DR3), and the normal direction of each of the front and back surfaces may be parallel to the third direction (DR3).

[0040] The distance between the front and back sides in the third direction (DR3) may correspond to the thickness / height of the electronic device (ED) in the third direction (D3). Meanwhile, the directions indicated by the first to third directions (DR1, DR2, DR3) can be converted to other directions as relative concepts.

[0041] The electronic device (ED) can detect external inputs applied from the outside. External inputs may include various forms of inputs provided from outside the electronic device (ED).

[0042] For example, external input may be user input. User input may include various forms of input such as parts of the user's body, an electromagnetic pen (SP), light, heat, or pressure.

[0043] For example, external input may include contact by a part of the body, such as a user's hand, as well as external input applied when in close proximity to the electronic device (ED) or at a predetermined distance (e.g., hovering). Additionally, it may take various forms such as force, pressure, temperature, and light. Furthermore, the electronic device (ED) according to the present invention may also detect external input by an electromagnetic pen (SP) that generates a magnetic field. Additionally, the electronic device (ED) may detect multiple inputs of different forms. For example, the electronic device (ED) may detect external input through the electromagnetic pen (SP) and external input through the user's hand.

[0044] FIG. 1a illustrates an exemplary external input through a user's electromagnetic pen (SP). Although not illustrated, the electromagnetic pen (SP) may be attached to or detached from the inside or outside of the electronic device (ED), and the electronic device (ED) may provide and receive signals corresponding to the attachment and detachment of the electromagnetic pen (SP).

[0045] The electronic device (ED) may include a folding region (FA) and a plurality of non-folding regions (NFA1, NFA2). The non-folding regions (NFA1, NFA2) may include a first non-folding region (NFA1) and a second non-folding region (NFA2). Within a second direction (DR2), the folding region (FA) may be positioned between the first non-folding region (NFA1) and the second non-folding region (NFA2).

[0046] As illustrated in FIG. 1b, the folding region (FA) can be folded with respect to a folding axis (FX) parallel to the first direction (DR1). The folding region (FA) has a predetermined curvature and curvature diameter (R1). The first non-folding region (NFA1) and the second non-folding regions (NFA2) face each other, and the electronic device (ED) can be inner-folded so that the display surface (DS) is not exposed to the outside.

[0047] In one embodiment of the present invention, the electronic device (ED) may be out-folded so that the display surface (DS) is exposed to the outside. In one embodiment of the present invention, the electronic device (ED) may be configured such that in-folding or out-folding operations are alternately repeated from an unfolding operation, but is not limited thereto. In one embodiment of the present invention, the electronic device (ED) may be configured to select any one of an unfolding operation, an in-folding operation, and an out-folding operation.

[0048] As illustrated in FIG. 1b, the distance between the first non-folding region (NFA1) and the second non-folding region (NFA2) may be substantially the same as the curvature diameter (R1). However, the embodiments are not limited thereto. As illustrated in FIG. 1c, the curvature diameter (R2) may be greater than the distance between the first non-folding region (NFA1) and the second non-folding region (NFA2).

[0049] Meanwhile, FIGS. 1b and 1c are illustrated based on the display surface (DS), and the case (EDC, see FIG. 2) forming the exterior of the electronic device (ED) may come into contact at the end regions of the first non-folding region (NFA1) and the second non-folding region (NFA2).

[0050] FIG. 2 is an exploded perspective view of an electronic device (ED) according to one embodiment of the present invention.

[0051] As illustrated in FIG. 2, the electronic device (ED) may include a display device (DD), an electronic module (EM), a power module (PSM), and a case (EDC). Although not separately illustrated, the power module (PSM) may further include a mechanical structure for controlling the folding operation of the display device (DD).

[0052] The display device (DD) generates an image and detects external input. The display device (DD) includes a window module (WM) and a display module (DM). The window module (WM) provides the front of the electronic device (ED).

[0053] The display module (DM) may include at least a display panel (DP). Although only the display panel (DP) among the stacked structures of the display module (DM) is illustrated in FIG. 2, the display module (DM) may substantially include a plurality of additional components positioned above and below the display panel (DP). A detailed description of the stacked structure of the display module (DM) will be provided later.

[0054] The display panel (DP) includes an active area (DP-DA) and a peripheral area (DP-NDA) corresponding to the display area (DA, see FIG. 1a) and non-display area (NDA, see FIG. 1a) of the electronic device (ED). In this specification, "areas / parts correspond to areas / parts" means that they overlap and are not limited to the same area. The display module (DM) may include a driver chip (DIC) disposed on the peripheral area (DP-NDA). The display module (DM) may further include a flexible circuit film (FCB) coupled to the peripheral area (DP-NDA). Although not illustrated, the flexible circuit film (FCB) may be connected to a main circuit board.

[0055] The driving chip (DIC) may include driving elements for driving pixels of a display panel (DP), such as a data driving circuit. Although FIG. 2 illustrates a structure in which the driving chip (DIC) is mounted on a display panel (DP), the present invention is not limited thereto. For example, the driving chip (DIC) may be mounted on a flexible circuit film (FCB).

[0056] The electronic module (EM) includes at least a main controller. The electronic module (EM) may include a wireless communication module, a camera module, a proximity sensor module, an image input module, an audio input module, an audio output module, a memory, and an external interface module, etc. The modules may be mounted on the circuit board or electrically connected through a flexible circuit board. The electronic module (EM) is electrically connected to a power module (PSM).

[0057] The main controller controls the overall operation of the electronic device (ED). For example, the main controller enables or disables the display device (DD) in response to user input. The main controller can control the operation of the display device (DD) and other modules. The main controller may include at least one microprocessor.

[0058] The case (EDC) accommodates a display module (DM), an electronic module (EM), and a power module (PSM). The case (EDC) is illustrated as comprising two separate cases (EDC1, EDC2), but is not limited thereto. Although not illustrated, the electronic device (ED) may further include a hinge structure for connecting the two cases (EDC1, EDC2). The case (EDC) may be coupled with a window module (WM). The case (EDC) protects the components housed in the case (EDC), such as the display module (DM), the electronic module (EM), and the power module (PSM).

[0059] FIG. 3 is a cross-sectional view of an electronic device (ED) according to one embodiment of the present invention.

[0060] FIG. 3 is a cross-sectional view of one embodiment corresponding to the II' cutting line shown in FIG. 2.

[0061] Referring to FIG. 3, the electronic device (ED) may include a window module (WM) and a display module (DM) placed below the window module (WM).

[0062] The window module (WM) may include a window base layer and a window protection layer. The window base layer may include a thin-film glass substrate or a plastic film. The thickness of the thin-film glass substrate may be 15 μm to 45 μm. The thin-film glass substrate may be chemically strengthened glass. The thin-film glass substrate can minimize the occurrence of wrinkles even when folding and unfolding are repeated.

[0063] The thickness of the plastic film may be 50㎛ to 80㎛. The plastic film may include polyimide, polycarbonate, polyamide, triacetylcellulose, polymethylmethacrylate, or polyethylene terephthalate.

[0064] The window protection layer may be a layer for improving the impact resistance of the window module (WM) and preventing shattering upon breakage. The window protection layer may comprise at least one selected from urethane resin, epoxy resin, polyester resin, polyether resin, acrylate resin, ABS resin (acrylonitrile-butadiene-styrene resin), and rubber. In one example of the present invention, the window protection layer may comprise at least one of phenylene, polyethyleneterephthalate (PET), polyimide (PI), polyamide (PAI), polyethylene naphthalate (PEN), and polycarbonate (PC). At least one of a hard coating layer, an anti-fingerprint layer, and an anti-reflective layer may be disposed on the upper surface of the window protection layer.

[0065] An adhesive layer may be disposed between the window base layer and the window protection layer as needed. The adhesive layer may be a pressure-sensitive adhesive film (PSA) or an optically clear adhesive (OCA). The same description may apply to the adhesive layer described below.

[0066] The display module (DM) may include a display panel (DP), an input sensor (IS) disposed on the display panel (DP), an optical film (LF) disposed on the input sensor (IS), a digitizer (ZM) disposed below the display panel (DP), a protective member (PM) disposed between the display panel (DP) and the digitizer (ZM), and a lower member (LM) disposed below the digitizer (ZM). An adhesive layer may be disposed between the members as needed.

[0067] A display panel (DP) may include a base layer, a circuit element layer disposed on the base layer, a display element layer disposed on the circuit element layer, and a thin film encapsulation layer disposed on the display element layer. The base layer may include a plastic film. For example, the base layer may include polyimide. Substantially, the planar shape of the base layer is identical to the planar shape of the display panel (DP) illustrated in FIG. 4, which will be described later.

[0068] The circuit element layer may include an organic layer, an inorganic layer, a semiconductor pattern, a conductive pattern, and a signal line. An organic layer, an inorganic layer, a semiconductor layer, and a conductive layer may be formed on a base layer by means such as coating and deposition. Subsequently, the organic layer, the inorganic layer, the semiconductor layer, and the conductive layer may be selectively patterned through multiple photolithography processes to form a semiconductor pattern, a conductive pattern, and a signal line.

[0069] The semiconductor pattern, conductive pattern, and signal line can form the pixel driving circuit and signal lines (SL1~SLm, DL1~DLn, EL1~ELm, CSL1, CSL2, PL) of the pixels (PX) illustrated in FIG. 4 described below. The pixel driving circuit may include at least one transistor.

[0070] The display element layer includes light-emitting elements of pixels (PX) illustrated in FIG. 4, which will be described later. The light-emitting elements are electrically connected to at least one transistor. A thin film encapsulation layer may be disposed on the circuit element layer to seal the display element layer. The thin film encapsulation layer may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially. The stacked structure of the thin film encapsulation layer is not particularly limited.

[0071] The input sensor (IS) may include a plurality of sensing electrodes (not shown) for detecting an external input, trace lines (not shown) connected to the plurality of sensing electrodes, and an inorganic layer and / or an organic layer for insulating / protecting the plurality of sensing electrodes or trace lines. The input sensor (IS) may be a capacitive sensor, but is not particularly limited.

[0072] The input sensor (IS) can be formed directly on the thin film encapsulation layer through a continuous process during the manufacturing of the display panel (DP). However, it is not limited to this, and the input sensor (IS) may be manufactured as a separate panel from the display panel (DP) and attached to the display panel (DP) by an adhesive layer.

[0073] Multiple sensing electrodes overlap the display area (DP-DA, see FIG. 4). Trace lines are arranged to overlap the surrounding area (DP-NDA). The trace lines can be extended toward the bottom of the second area (AA2) via the bending area (BA, see FIG. 4) adjacent to the pad (PD) shown in FIG. 4. At this time, the trace lines are placed on a different layer from the signal lines (SL1~SLm, DL1~DLn, EL1~ELm, CSL1, CSL2, PL) of the circuit element layer.

[0074] The trace lines can be connected to signal lines (input signal lines) provided for the input sensor (IS) of the display panel (DP) in the first region (AA1) shown in FIG. 4. The input signal lines are different from the signal lines (SL1–SLm, DL1–DLn, EL1–ELm, CSL1, CSL2, PL) shown in FIG. 4, but can be placed on the same layer as any one of them. Each of the input signal lines can be connected to a corresponding pad (PD). Consequently, the trace lines can be electrically connected to the same flexible circuit film (FCB) as the signal lines of the circuit element layer.

[0075] The optical film (LF) can reduce external light reflectivity. The optical film (LF) may include a phase retarder and / or a polarizer. The optical film (LF) may include at least a polarizing film. The optical film (LF) may be omitted or replaced, for example, with an optical structure within the display panel (DP).

[0076] The protective member (PM) may be placed below the display panel (DP) and may support the display panel (DP) or absorb external shocks. A detailed description of the laminated structure of the protective member (PM) will be provided later.

[0077] A digitizer (ZM) can be placed below a display panel (DP). The digitizer (ZM) can detect the position or strength of an electromagnetic pen (SP) input to an electronic device (ED). The digitizer (ZM) can be driven by an Electromagnetic Resonance (EMR) method. The Electromagnetic Resonance (EMR) method is a method in which a magnetic field is generated in a resonant circuit inside the electromagnetic pen (SP), and said magnetic field forms a magnetic field in a plurality of coils included in the digitizer (ZM), and the formed magnetic field is applied again to the resonant circuit inside the electromagnetic pen (SP), causing a magnetic field of resonant frequency to be emitted from the electromagnetic pen (SP). The digitizer (ZM) can detect the position of the electromagnetic pen (PN) through the magnetic field of resonant frequency.

[0078] However, this is described as an example, and the digitizer (ZM) can be designed with various driving methods as long as it can detect input from the electromagnetic pen (SP), and is not limited to any single embodiment.

[0079] The lower member (LM) may be positioned below the digitizer (ZM). The lower member (LM) may include various functional members. It may include a light-blocking layer that blocks light incident on the display panel (DP), a shock-absorbing layer that absorbs external shocks, a support layer that supports the display panel (DP), a heat dissipation layer that releases heat generated from the display panel (DP), and an electromagnetic shielding layer that blocks electromagnetic waves affecting the digitizer (ZM). A detailed description of the laminated structure of the lower member (LM) will be provided later.

[0080] FIG. 4 is a plan view of a display panel (DP) according to one embodiment of the present invention.

[0081] Referring to FIG. 4, the display panel (DP) may include an active area (DP-DA) and a peripheral area (DP-NDA) adjacent to the active area (DP-DA). The active area (DP-DA) and the peripheral area (DP-NDA) are distinguished by the presence or absence of a pixel (PX). A pixel (PX) is placed in the active area (DP-DA). A scanning driver (SDV), a data driver, and an emitting driver (EDV) may be placed in the peripheral area (DP-NDA). The data driver may be a part of the circuit configured in the driver chip (DIC) shown in FIG. 4.

[0082] The display panel (DP) may include a first area (AA1), a second area (AA2), and a bending area (BA) separated on a second direction (DR2). The second area (AA2) and the bending area (BA) may be part of the surrounding area (DP-NDA). The bending area (BA) may be positioned between the first area (AA1) and the second area (AA2).

[0083] FIG. 4 illustrates the unfolded state of the display panel (DP) before it is bent. Assuming the display panel (DP) is installed in the electronic device (ED), the bending area (BA) is bent so that the first area (AA1) and the second area (AA2) of the display panel (DP) face each other when the electronic device (ED) is in the unfolded state as in FIG. 1a.

[0084] Referring again to FIG. 4, the first region (AA1) is a region corresponding to the display surface (DS) of FIG. 1a. The first region (AA1) may include a first non-folding region (NFA10), a second non-folding region (NFA20), and a folding region (FA0). The first non-folding region (NFA10), the second non-folding region (NFA20), and the folding region (FA0) correspond to the first non-folding region (NFA1), the second non-folding region (NFA2), and the folding region (FA) of FIG. 1a to 1c, respectively.

[0085] Within the first direction (DR1), the lengths of the bending region (BA) and the second region (AA2) may be smaller than the length of the first region (AA1). A region with a shorter length in the direction of the bending axis can be bent more easily.

[0086] A display panel (DP) may include a plurality of pixels (PX), a plurality of scan lines (SL1~SLm), a plurality of data lines (DL1~DLn), a plurality of light-emitting lines (EL1~ELm), first and second control lines (CSL1, CSL2), a power line (PL), and a plurality of pads (PD). Here, m and n are natural numbers. The pixels (PX) may be connected to the scan lines (SL1~SLm), data lines (DL1~DLn), and light-emitting lines (EL1~ELm).

[0087] Scan lines (SL1~SLm) can be extended in a second direction (DR2) and connected to a scanning driver (SDV). Data lines (DL1~DLn) can be extended in a second direction (DR2) and connected to a driving chip (DIC) via a bending region (BA). Light emission lines (EL1~ELm) can be extended in a first direction (DR1) and connected to a light emission driver (EDV).

[0088] The power line (PL) may include a portion extending in a second direction (DR2) and a portion extending in a first direction (DR1). The portion extending in the first direction (DR1) and the portion extending in the second direction (DR2) may be placed on different layers. The portion of the power line (PL) extending in the second direction (DR2) may extend to a second region (AA2) via a bending region (BA). The power line (PL) may provide a first voltage to the pixels (PX).

[0089] The first control line (CSL1) is connected to the scanning drive unit (SDV) and can be extended toward the bottom of the second region (AA2) via the bending region (BA). The second control line (CSL2) is connected to the light emission drive unit (EDV) and can be extended toward the bottom of the second region (AA2) via the bending region (BA).

[0090] When viewed in a planar view, the pads (PD) can be positioned adjacent to the bottom of the second region (AA2). The driving chip (DIC), power line (PL), first control line (CSL1), and second control line (CSL2) can be connected to the pads (PD). The flexible circuit film (FCB) can be electrically connected to the pads (PD) through an anisotropic conductive adhesive layer.

[0091] FIG. 5 is a plan view of a digitizer (ZM) according to one embodiment of the present invention.

[0092] Referring to FIG. 5, a digitizer (ZM) of one embodiment includes a plurality of closed curves. The digitizer (ZM) includes closed curves to recognize the input of an electromagnetic pen (SP) in an electromagnetic resonance (EMR) manner and can detect the position of the electromagnetic pen (SP).

[0093] Specifically, the digitizer (ZM) includes first conductive lines (CF) and second conductive lines (RF). The first conductive lines (CF) and the second conductive lines (RF) may be placed on different layers. For the digitizer (ZM) to operate, a portion of the first conductive lines (CF) and a portion of the second conductive lines (RF) may be electrically connected to form a plurality of closed loops.

[0094] A digitizer (ZM) may include a sensing area (SA) and a non-sensing area (NSA). First conductive lines (CF) and second conductive lines (RF) may be disposed in the sensing area (SA). The non-sensing area (NSA) is an area adjacent to the sensing area (SA), and in one embodiment, the non-sensing area (NSA) may surround the sensing area (SA). A flexible circuit film (FCB-ZM) may be disposed in the non-sensing area (NSA). As an example, one flexible circuit film (FCB-ZM) is shown disposed in a second portion (PT2) that overlaps the non-sensing area (NSA). However, the embodiment is not limited thereto, and two or more flexible circuit films (FCB-ZM) may be disposed, and may be disposed in a third portion (PT3) that overlaps the non-sensing area (NSA). The first conductive lines (CF) and the second conductive lines (RF) can be connected to the flexible circuit film (FCB-ZM) through signal lines (not shown).

[0095] In the sensing area (SA) of one embodiment, each of the first conductive lines (CF) extends along the second direction (DR2) and may be spaced apart from each other in the first direction (DR1). In this specification, the second direction (DR2) may be understood as the x-axis direction.

[0096] Each of the second conductive lines (RF) extends along the first direction (DR1) and may be spaced apart from each other in the second direction (DR2). In this specification, the first direction (DR1) may be understood as the y-axis direction. In one embodiment, the second conductive lines (RF) may be spaced apart from the folding axis (FX) by a predetermined distance.

[0097] Meanwhile, via holes (VH) may be formed as needed at the point where the first conductive lines (CF) and the second conductive lines (RF) overlap. Specifically, a portion of the first conductive lines (CF) and a portion of the second conductive lines (RF) may be electrically connected through the via holes (VH) to form a closed loop. A detailed description of the structure of the via holes (VH) will be provided later.

[0098] A digitizer (ZM) of one embodiment may include a first part (PT1), a second part (PT2), and a third part (PT3) that are distinct from each other in a second direction (DR2). The first part (PT1) corresponds to a folding region (FA) of an electronic device (ED, see FIG. 3), the second part (PT2) corresponds to a first non-folding region (NFA1) of an electronic device (ED, see FIG. 3), and the third part (PT3) corresponds to a second non-folding region (NFA2) of an electronic device (ED, see FIG. 3). That is, when the electronic device (ED) is folded, the first part (PT1) of the digitizer (ZM) may be a part that is folded along a folding axis (FX). Hereinafter, the folding area of ​​the digitizer (ZM) can be understood as the first part (PT1), the first non-folding area of ​​the digitizer (ZM) as the second part (PT2), and the second non-folding area of ​​the digitizer (ZM) as the third part (PT3). Meanwhile, the folding axis (FX) may be disposed on the upper surface or the rear surface of the digitizer (ZM).

[0099] FIG. 6 is a cross-sectional view of a digitizer (ZM) according to one embodiment of the present invention.

[0100] FIG. 6 is a cross-sectional view of one embodiment corresponding to the III-III' cutting line shown in FIG. 5.

[0101] Referring to FIG. 6, with respect to the direction opposite to the third direction (DR3), a digitizer (ZM) of one embodiment may include a base layer (BS), first conductive lines (CF) disposed on the base layer (BS), a first cover layer (CM1) disposed on the first conductive lines (CF), second conductive lines (RF) disposed on the first cover layer (CM1), and a second cover layer (CM2) disposed on the second conductive lines (RF). This may be the same as the order in which each component is stacked during the process of manufacturing the digitizer (ZM).

[0102] The base layer (BS) may include an organic material. For example, the base layer (BS) may include at least one of polyimide, polycarbonate, and polyamide, and specifically may include polyimide.

[0103] The first cover layer (CM1) and the second cover layer (CM2) may be insulating layers.

[0104] A first cover layer (CM1) may be disposed on a base layer (BS) to cover first conductive lines (CF). The first cover layer (CM1) according to the present invention may include a material that is relatively more flexible than the base layer (BS). For example, the first cover layer (CM1) may include a flexible rubber comprising synthetic rubber and a crosslinking component, and specifically, the synthetic rubber of the first cover layer (CM1) may include any one of butadiene rubber, styrene-butadiene rubber, and butyl rubber.

[0105] A second cover layer (CM2) may be disposed on a first cover layer (CM1) to cover second conductive lines (RF). The second cover layer (CM2) may include the same material as the first cover layer (CM1) or may include a material having a lower modulus than the first cover layer (CM1).

[0106] However, the stacked structure of the digitizer (ZM) is not limited to this.

[0107] FIG. 7 is a cross-sectional view of a digitizer (ZM-a) according to one embodiment of the present invention.

[0108] FIG. 7 is a cross-sectional view of one embodiment corresponding to the III-III' cutting line shown in FIG. 5.

[0109] Referring to FIG. 7, a digitizer (ZM-a) of one embodiment may include a base layer (BS), second conductive lines (RF) disposed on the base layer (BS), a first cover layer (CM1) covering the second conductive lines (RF), first conductive lines (CF) disposed on the first cover layer (CM1), and a second cover layer (CM2) covering the first conductive lines (CF).

[0110] The following description is based on the digitizer (ZM) described in Fig. 6.

[0111] FIGS. 8a to 8e are plan views of an embodiment that enlarges the TT region shown in FIG. 5. That is, FIGS. 8a to 8e are enlarged views of a part of the first part (PT1) of the digitizer (ZM, see FIG. 5).

[0112] Referring to FIG. 8a, via holes (VH) may be defined in a digitizer (ZM) of one embodiment. In one embodiment, the via holes (VH) may be formed adjacent to a folding axis (FX) and overlapped with a folding region (FA, see FIG. 5).

[0113] The digitizer (ZM) can form a closed curve by connecting a portion of the first conductive lines (CF, see FIG. 5) extended in the second direction (DR2) and a portion of the second conductive lines (RF, see FIG. 5) extended in the first direction (DR1). The first conductive lines (CF, see FIG. 5) and the second conductive lines (RF, see FIG. 5), which are placed on different layers, can be connected to each other by via holes (VH) at specific points as needed.

[0114] In FIG. 8a, a first row line (x1), a second row line (x2), a third row line (x3), a fourth row line (x4), and a fifth row line (x5) are illustrated as examples of first conductive lines (CF, see FIG. 5). The first to fifth row lines (x1, x2, x3, x4, x5) are spaced apart from each other in the first direction (DR1). Each of the first to fifth row lines (x1, x2, x3, x4, x5) extends in the second direction (DR2).

[0115] As an example of the second conductive lines (RF, see FIG. 5), the first heat line (y1), the second heat line (y2), the third heat line (y3), the fourth heat line (y4), and the fifth heat line (y5) are illustrated. The first through fifth heat lines (y1, y2, y3, y4, y5) are spaced apart from each other in the second direction (DR2). Each of the first through fifth heat lines (y1, y2, y3, y4, y5) extends in the first direction (DR1).

[0116] The via holes (VH) may include a first via hole (VH1), a second via hole (VH2), a third via hole (VH3), a fourth via hole (VH4), and a fifth via hole (VH5). In FIGS. 8a to 8f, the via holes (VH) are illustrated as being circular as an example, but the shape of the via holes (VH) is not limited thereto and may be elliptical or polygonal, and may have a shape in which at least a portion includes a curve or at least a portion includes a straight line.

[0117] In FIGS. 8a through 8f, the average size of the via holes (VH) may correspond to the diameter (DI, hereinafter referred to as the first diameter) of the first to fifth via holes (VH1, VH2, VH3, VH4, VH5). In one embodiment, the diameters of the first to fifth via holes (VH1, VH2, VH3, VH4, VH5) may be substantially the same as each other. In this specification, terms such as "substantially the same" should be understood to mean identical, including general errors such as process errors.

[0118] Hereinafter, the average size value of the via holes (VH) is described as the first diameter (DI). However, the embodiments are not limited thereto, and if the shape of the via holes (VH) is changed in other embodiments, the description of the first diameter (DI) may be applied in the same way to the average size value of the changed via holes (VH).

[0119] Each of the first to fifth via holes (VH1, VH2, VH3, VH4, VH5) can electrically connect any one of the first to fifth row lines (x1, x2, x3, x4, x5) and any one of the first to fifth column lines (y1, y2, y3, y4, y5). For example, the first via hole (VH1) can electrically connect the first row line (x1) and the first column line (y1).

[0120] As the first conductive lines (CF) extended in the second direction (DR2) and the second conductive lines (RF) extended in the first direction (DR1) are electrically connected at a specific point by a via hole (VH), the digitizer (ZM, see FIG. 5) may include a plurality of closed curves.

[0121] In one embodiment of the present invention, the spacing between any two adjacent via holes (VH) may be greater than the average size value of the via holes (VH), for example, greater than the first diameter (DI).

[0122] Specifically, the first length (LL1), which is the horizontal distance between the second via hole (VH2) and the third via hole (VH3), may be greater than the first diameter (DI). However, this is exemplary and the first length (LL1) may be equal to the first diameter (DI).

[0123] In one embodiment of the present invention, the number of via holes (VH) arranged in the same column may be two or fewer. For example, as shown in FIG. 8a, each of the first to fifth via holes (VH1, VH2, VH3, VH4, VH5) may be arranged in different columns.

[0124] In one embodiment of the present invention, when n via holes (VH) are arranged in the same row, the horizontal distance between any two adjacent via holes (VH) among the n via holes (VH) is at least n times the average size of the via holes (VH). n is an integer greater than or equal to 2. For example, the first via hole (VH1), the third via hole (VH3), and the fifth via hole (VH5) may be arranged in the first row, and the second via hole (VH2) and the fourth via hole (VH4) may be arranged in the second row. The first row may be a row parallel to the second row line (x2), and the second row may be a row parallel to the fifth row line (x5).

[0125] For example, the second length (LL2), which is the horizontal distance between the third via hole (VH3) and the fifth via hole (VH5) among the via holes (VH) arranged in the first row, may be at least three times the first diameter (DI).

[0126] A conductive material may be further disposed in the via holes (VH) to connect the first conductive line (CF, see FIG. 5) and the second conductive line (RF, see FIG. 5). The conductive material may be the same material as the first conductive line (CF, see FIG. 5) or the second conductive line (RF, see FIG. 5), or it may be a known conductive material. Since a conductive material is disposed in the via holes (VH) instead of an insulating material, the rigidity of the portion overlapping the via holes (VH) may be greater than the portion where the via holes (VH) are not disposed.

[0127] The digitizer (ZM, see FIG. 5) of the present invention includes via holes (VH) in a first part (PT1), and the spacing between the via holes (VH) is greater than or equal to a first diameter (DI). In one column, there are two or fewer via holes (VH), and when n via holes (VH) are arranged in one row, the distance between any two adjacent via holes (VH) among the n via holes (VH) is greater than or equal to n times the first diameter (DI). Accordingly, the first part (PT1) can have uniform rigidity overall. The electronic device (ED) of the present invention can prevent problems such as damage, including cracks, occurring due to non-uniform rigidity in the first part (PT1) of the digitizer (ZM) during a folding operation.

[0128] However, the arrangement of the via hole (VH) of the present invention is not limited thereto.

[0129] Referring to FIG. 8b, the via holes (VH) of one embodiment may be arranged in different rows and different columns.

[0130] In FIG. 8b, a first row line (x1), a second row line (x2), a third row line (x3), a fourth row line (x4), a fifth row line (x5), and a sixth row line (x6) are illustrated as examples of first conductive lines (CF, see FIG. 5). The first through sixth row lines (x1, x2, x3, x4, x5, x6) are spaced apart from each other in the first direction (DR1). Each of the first through sixth row lines (x1, x2, x3, x4, x5, x6) extends in the second direction (DR2).

[0131] As an example of the second conductive lines (RF, see FIG. 5), the first heat line (y1), the second heat line (y2), the third heat line (y3), the fourth heat line (y4), the fifth heat line (y5), and the sixth heat line (y6) are illustrated. The first through sixth heat lines (y1, y2, y3, y4, y5, y6) are spaced apart from each other in the second direction (DR2). Each of the first through sixth heat lines (y1, y2, y3, y4, y5, y6) extends in the first direction (DR1).

[0132] Referring to FIG. 8b, each of the via holes (VH) of one embodiment can be electrically connected to a corresponding one of the first to sixth row lines (x1, x2, x3, x4, x5, x6) and a corresponding one of the first to sixth column lines (y1, y2, y3, y4, y5, y6). Specifically, the rows in which the via holes (VH) are arranged may be different from each other. For example, each of the six via holes (VH) may be arranged in the first to sixth row lines (x1, x2, x3, x4, x5, x6). Additionally, the columns in which the via holes (VH) are arranged may be different from each other. For example, each of the six via holes (VH) may be arranged in the first to sixth column lines (y1, y2, y3, y4, y5, y6).

[0133] The digitizer (ZM, see FIG. 5) of the present invention includes via holes (VH) in a first part (PT1), and the via holes (VH) are arranged in different rows and simultaneously in different columns, thereby maintaining uniform rigidity of the first part (PT1). Therefore, when folding the electronic device (ED), problems such as damage caused by uneven rigidity in the first part (PT1) of the digitizer (ZM) can be prevented.

[0134] Referring to FIG. 8c, the via holes (VH) of one embodiment may be arranged in a zigzag shape on a plane. Alternatively, referring to FIG. 8d, the via holes (VH) of one embodiment may be arranged in a diagonal shape on a plane.

[0135] In FIGS. 8c and 8d, a first row line (x1), a second row line (x2), a third row line (x3), a fourth row line (x4), a fifth row line (x5), a sixth row line (x6), and a seventh row line (x7) are illustrated as examples of first conductive lines (CF, see FIG. 5). The first to seventh row lines (x1, x2, x3, x4, x5, x6, x7) are spaced apart from each other in the first direction (DR1). Each of the first to seventh row lines (x1, x2, x3, x4, x5, x6, x7) extends in the second direction (DR2).

[0136] In FIGS. 8c and 8d, a first column line (y1), a second column line (y2), a third column line (y3), a fourth column line (y4), a fifth column line (y5), a sixth column line (y6), and a seventh column line (y7) are illustrated as examples of second conductive lines (RF, see FIG. 5). The first to seventh columns (y1, y2, y3, y4, y5, y6, y7) are spaced apart from each other in the second direction (DR2). Each of the first to seventh columns (y1, y2, y3, y4, y5, y6, y7) extends in the first direction (DR1).

[0137] In FIG. 8c and FIG. 8d, respectively, each of the via holes (VH) of one embodiment can electrically connect any one of the first to seventh row lines (x1, x2, x3, x4, x5, x6, x7) and any one of the first to seventh column lines (y1, y2, y3, y4, y5, y6, y7).

[0138] Meanwhile, regarding the spacing of the via holes (VH) shown in FIG. 8c and FIG. 8d, the description given above in FIG. 8a and FIG. 8b can be applied in the same way.

[0139] Referring to FIG. 8e, in one embodiment, three via holes (VH) may be arranged in a first row and three may be arranged in a second row. The first row may be understood as a row parallel to the third row line (x3), and the second row as a row parallel to the fourth row line (x4). The third length (LL3), which is the horizontal distance between any two adjacent via holes (VH) in the third row line (x3), is greater than or equal to twice the first diameter (DI).

[0140] In one embodiment of the present invention, up to two via holes (VH) may be arranged in the same column.

[0141] Specifically, via holes (VH) may be arranged in 2 in the first column, 2 in the second column, and 2 in the third column. The first column can be understood as a column parallel to the second column line (y2), the second column as a row parallel to the fourth column line (y4), and the third column as a column parallel to the sixth column line (y6).

[0142] The vertical distance (VL) between two via holes (VH) placed in the same column may be more than twice the first diameter (DI).

[0143] Accordingly, the digitizer (ZM) including the via holes (VH) shown in FIG. 8e can exhibit uniform stiffness in the first part (PT1).

[0144] FIG. 8f is a plan view of a comparative example with an enlarged view of the TT region shown in FIG. 5.

[0145] Referring to FIG. 8f, via holes (VH) can be arranged in three rows in the first row, three rows in the second row, and three rows in the third row. The first row is a row parallel to the second row line (x2), the second row is a row parallel to the fifth row line (x5), and the third row can be understood as the eighth row line (x8). The fourth length (LL4), which is the horizontal distance between any two adjacent via holes (VH) in the fifth row line (x5), is at least three times the first diameter (DI).

[0146] Meanwhile, the via holes (VH) in FIG. 8e are arranged with 3 in the first column, 3 in the second column, and 3 in the third column. The first column can be understood as a column parallel to the second column line (y2), the second column as a row parallel to the fifth column line (y5), and the third column as a column parallel to the eighth column line (y8).

[0147] Unlike the via holes (VH) shown in FIG. 8a to 8e, the via holes (VH) shown in FIG. 8f are arranged in three or more rows, so that non-uniformity of stiffness may appear in the first part (PT1) of the digitizer (ZM).

[0148] Accordingly, in the case of a digitizer including via holes (VH) shown in FIG. 8f, damage such as cracks may occur in the first part of the digitizer when the electronic device is folded.

[0149] The digitizer (ZM, see FIG. 5) of the present invention includes via holes (VH) in a first part (PT1, see FIG. 5), and the via holes (VH) may be arranged in different rows and different columns. Alternatively, if n via holes (VH) are arranged in the same row, the spacing between any two adjacent via holes (VH) among the n via holes (VH) is at least n times the average size of the via holes. Alternatively, if via holes (VH) are arranged in the same column, the number of via holes (VH) arranged in the same column may be two or fewer.

[0150] Accordingly, even if the first part (PT1, see FIG. 5) includes via holes (VH), it can exhibit uniform rigidity throughout the first part (PT1), and the problem of damage such as cracks occurring in the first part (PT1) when the electronic device (ED) is folded can be minimized. In particular, the problem of damage such as cracks occurring in the periphery of the via holes (VH) when the electronic device (ED) is folded can be prevented.

[0151] The structure of the via holes (VH) will be explained with reference to Fig. 9a.

[0152] FIG. 9a is a cross-sectional view of a digitizer (ZM) according to one embodiment of the present invention.

[0153] FIG. 9a is a cross-sectional view of one embodiment corresponding to the IV-IV' cutting line shown in FIG. 8a.

[0154] Referring to FIG. 9a, the via hole (VH) may penetrate a first cover layer (CM1) disposed between a first conductive line (CF) and a second conductive line (RF). The second conductive line (RF) may penetrate the via hole (VH) and be connected to the first conductive line (CF). Accordingly, the second conductive line (RF) may be electrically connected to the first conductive line (CF). As an example, FIG. 9a shows the second conductive line (RF) filling the via hole (VH), but the embodiment is not limited thereto, and the first conductive line (CF) may be disposed in the via hole (VH), or a known conductive material may be disposed therein to electrically connect the first conductive line (CF) and the second conductive line (RF).

[0155] The area where the via hole (VH) is placed may have greater rigidity compared to the area where the via hole (VH) is not placed, because the first cover layer (CM1) is removed and additionally contains a conductive material. That is, the via hole (VH) may have greater rigidity compared to the surrounding area of ​​the via hole (VH).

[0156] The digitizer (ZM) of the present invention has via holes (VH) arranged in a first part (PT1), and the via holes (VH) are spaced apart from each other as described in FIGS. 8a to 8e, so that the rigidity of the first part (PT1) can be maintained uniformly. Accordingly, even if the electronic device (ED, see FIGS. 1b and 1c) is folded, damage such as cracks can be prevented from occurring in the first part (PT1), which is the folding area of ​​the digitizer (ZM).

[0157] Meanwhile, the second part (PT2) corresponding to the first non-folding area (NFA1) and the third part (PT3) corresponding to the second non-folding area (NFA2) may also include via holes. However, since the stress applied to the second part (PT2) and the third part (PT3) when the electronic device (ED) folds is smaller than the stress applied to the first part (PT1), the second part (PT2) and the third part (PT3) are less likely to develop cracks near the via holes due to non-uniformity in rigidity. Therefore, it is sufficient for the via holes placed in the second part (PT2) and the third part (PT3) to connect parts of the first conductive lines (CF) and the second conductive lines (RF) as shown in FIG. 9a, and the placement structure is not particularly limited.

[0158] FIG. 9b is a plan view of a part of a digitizer (ZM) according to one embodiment of the present invention.

[0159] FIG. 9b illustrates some of the closed curves (LP1, LP2) placed in the folding area (FA) of a digitizer (ZM) as an example.

[0160] Referring to FIG. 9b, parts of a plurality of first conductive lines (CF) and parts of second conductive lines (RF) can form a plurality of closed curves (LP1, LP2) that are connected to each other. Specifically, the first conductive lines (CF) and second conductive lines (RF) placed on different layers can be connected to each other by via holes (VH) as needed. As an example, the via holes (VH) are shown to include the first to fifth via holes (VH1, VH2, VH3, VH4, VH5) illustrated in FIG. 8a.

[0161] The closed curves (LP1, LP2) may include the first closed curves (LP1) and the second closed curves (LP2). Each of the first closed curves (LP1) may include a long side parallel to the first direction (DR1) and a short side parallel to the second direction (DR2). Each of the second closed curves (LP2) may include a long side parallel to the second direction (DR2) and a short side parallel to the first direction (DR1).

[0162] The closed curves (LP1, LP2) may include terminals (TL). Through the terminals (TL), an alternating current signal may be sequentially provided to the closed curves (LP1, LP2) from outside the digitizer (ZM). The terminals (TL) of the first closed curve (LP1) are shown in FIG. 9b, and the terminals of the second closed curve (LP2) are omitted. The terminals of the second closed curve (LP2) may be placed at both ends of the digitizer (ZM) in the second direction (DR2).

[0163] Meanwhile, the shape of the closed curves (LP1, LP2) shown in FIG. 9b is an example, and the embodiment is not limited thereto.

[0164] FIG. 10 is a plan view of a digitizer (ZM-b) according to one embodiment of the present invention.

[0165] Referring to FIG. 10, a digitizer (ZM-b) of one embodiment may include a first digitizer (ZM-1) and a second digitizer (ZM-2) spaced apart from each other. A first flexible circuit film (FCB1) and a second flexible circuit film (FCB2) may be electrically connected to the first digitizer (ZM-1) and the second digitizer (ZM-2), respectively. The first flexible circuit film (FCB1) and the second flexible circuit film (FCB2) may be connected to the same external circuit board. For example, the first flexible circuit film (FCB1) and the second flexible circuit film (FCB2) may be connected to a main circuit board to which the flexible circuit film (FCB) described in FIG. 2 is connected. The first flexible circuit film (FCB1) and the second flexible circuit film (FCB2) may be replaced by a single circuit film.

[0166] The first digitizer (ZM-1) and the second digitizer (ZM-2) each include a first detection area (SA1) and a second detection area (SA2), and each include a first non-detection area (NSA1) and a second non-detection area (NSA2). The first non-detection area (NSA1) and the second non-detection area (NSA2) are respectively positioned adjacent to the first detection area (SA1) and the second detection area (SA2). The configurations of the first digitizer (ZM-1) and the second digitizer (ZM-2) may be substantially identical to each other. The description of the aforementioned digitizer (ZM, ZM-a, see FIGS. 5 to 7) may be applied identically to the first digitizer (ZM-1) and the second digitizer (ZM-2). Specifically, the description of the first part (PT1, see FIG. 5) may be applied identically to the portion overlapping the folding area (FA, see FIG. 5) among the first digitizer (ZM-1) and the second digitizer (ZM-2). Specifically, the description of the second part (PT2, see FIG. 5) and the third part (PT3, see FIG. 5) may be applied identically to the portion overlapping the first non-folding area (NFA1, see FIG. 5) and the second non-folding area (NFA2, see FIG. 5) among the first digitizer (ZM-1) and the second digitizer (ZM-2), respectively. In addition, the aforementioned via hole (VH, see FIG. 8a to 8e) may be placed in the portion overlapping the folding area (FA, see FIG. 5) in the first digitizer (ZM-1) and the second digitizer (ZM-2).

[0167] FIG. 11 is a cross-sectional view of a display device (DD) according to one embodiment of the present invention.

[0168] The display device (DD) of FIG. 11 may include the digitizer (ZM) of FIG. 9a.

[0169] Referring to FIG. 11, a display device (DD) of one embodiment includes a window module (WM) and a display module (DM) placed below the window module (WM).

[0170] A window module (WM) of one embodiment may include a window protection layer (PF), a thin film glass substrate (UTG), and a bezel pattern (BP) disposed below the window protection layer (PF). The bezel pattern (BP) may be formed as a colored light-blocking film, for example, by a coating method. The bezel pattern (BP) may include a base material and a dye or pigment mixed in the base material. A first adhesive layer (AL1) may be disposed between the window protection layer (PF) and the thin film glass substrate (UTG).

[0171] The display module (DM) may include an optical film (LF), a display panel (DP), a panel protection layer (PPL), a barrier layer (BRL), a support layer (PLT), a cover layer (SCV), a digitizer (ZM), an electromagnetic shielding layer (EMS), a metal plate (MP), and second to ninth adhesive layers (AL2 to AL9). The second to ninth adhesive layers (AL2 to AL9) may include adhesives such as pressure-sensitive adhesives or optically transparent adhesives. In one embodiment of the present invention, some of the components described above may be omitted. For example, the metal plate (MP) and the associated ninth adhesive layer (AL9) may be omitted.

[0172] An optical film (LF) is placed in the first region (AA1) shown in FIG. 4. The optical film (LF) covers at least the active region (DP-DA). A second adhesive layer (AL2) connects the optical film (LF) with the window module (WM), and a third adhesive layer (AL3) connects the optical film (LF) with the display panel (DP). Although only the display panel (DP) is shown in FIG. 9a, an input sensor (IS) may be further placed between the display panel (DP) and the third adhesive layer (AL3), as shown in FIG. 3.

[0173] A panel protection layer (PPL) may be placed on the lower side of a display panel (DP). The panel protection layer (PPL) may protect the lower part of the display panel (DP). The panel protection layer (PPL) may include a flexible plastic material. For example, the panel protection layer (PPL) may include polyethylene terephthalate. In one embodiment of the present invention, the panel protection layer (PPL) may not be placed in a folding area (FA). The panel protection layer (PPL) may include a first panel protection layer (PPL-1) that protects a first area (AA1) of the display panel (DP) and a second panel protection layer (PPL-2) that protects a second area (AA2).

[0174] The fourth adhesive layer (AL4) bonds the panel protection layer (PPL) and the display panel (DP). The fourth adhesive layer (AL4) may include a first adhesive portion (AL4-1) corresponding to the first panel protection layer (PPL-1) and a second adhesive portion (AL4-2) corresponding to the second panel protection layer (PPL-2).

[0175] As illustrated in FIG. 4, when the bending region (BA) is bent, the second panel protection layer (PPL-2) can be placed below the first region (AA1) and the first panel protection layer (PPL-1) together with the second region (AA2). Since the panel protection layer (PPL) is not placed in the bending region (BA), the bending region (BA) can be bent more easily.

[0176] The bending region (BA) has a predetermined curvature and radius of curvature. The radius of curvature may be about 0.1 mm to 0.5 mm. A bending protective layer (BPL) is disposed on at least the bending region (BA). The bending protective layer (BPL) may overlap the bending region (BA), the first region (AA1), and the second region (AA2). The bending protective layer (BPL) may be disposed on a portion of the first region (AA1) and a portion of the second region (AA2).

[0177] The bending protection layer (BPL) can be bent together with the bending region (BA). The bending protection layer (BPL) protects the bending region (BA) from external impact and controls the neutral plane of the bending region (BA). The bending protection layer (BPL) controls the stress of the bending region (BA) so that the neutral plane is brought closer to the signal lines placed in the bending region (BA).

[0178] The fifth adhesive layer (AL5) combines the panel protection layer (PPL) and the barrier layer (BRL). The barrier layer (BRL) may be positioned below the panel protection layer (PPL). The barrier layer (BRL) can increase resistance to compressive force caused by external pressure. Therefore, the barrier layer (BRL) can serve to prevent deformation of the display panel (DP). The barrier layer (BRL) may include flexible plastic materials such as polyimide or polyethylene terephthalate. Additionally, the barrier layer (BRL) may be a colored film with low light transmittance. The barrier layer (BRL) can absorb light incident from the outside. For example, the barrier layer (BRL) may be a black plastic film. When viewing the display device (DD) from above the window protection layer (WP), components positioned below the barrier layer (BRL) may not be visible to the user.

[0179] The sixth adhesive layer (AL6) combines the barrier layer (BRL) and the support layer (PLT). The sixth adhesive layer (AL6) may include a first adhesive portion (AL6-1) and a second adhesive portion (AL6-2) that are spaced apart from each other. The distance (D6, or gap) between the first adhesive portion (AL6-1) and the second adhesive portion (AL6-2) corresponds to the width of the folding area (FA) and is larger than the gap (GP) described below. In this embodiment, the first adhesive portion (AL6-1) and the second adhesive portion (AL6-2) are defined as different parts of a single adhesive layer, but are not limited thereto. When the first adhesive portion (AL6-1) is defined as one adhesive layer (e.g., the first adhesive layer), the second adhesive portion (AL6-2) may be defined as another adhesive layer (e.g., the second adhesive layer).

[0180] A support layer (PLT) is positioned below a barrier layer (BRL). The support layer (PLT) supports components positioned above the support layer and maintains the unfolded and folded states of the display device (DD). The support layer (PLT) may include a first support portion (PLT-1) corresponding to at least a first non-folding area (NFA1) and having insulating properties, and a second support portion (PLT-2) corresponding to a second non-folding area (NFA2) and having insulating properties. The first support portion (PLT-1) and the second support portion (PLT-2) may be spaced apart from each other within a second direction (DR2).

[0181] The support layer (PLT) corresponds to the folding area (FA) and is disposed between the first support portion (PLT-1) and the second support portion (PLT-2), and may further include a folding portion (PLT-F) having a plurality of openings (OP) defined therein. The folding portion (PLT-F) can prevent foreign substances from penetrating into the area of ​​the barrier layer (BRL) opened from the first support portion (PLT-1) and the second support portion (PLT-2) during the folding operation of the display device (DD). In one embodiment of the present invention, the folding portion (PLT-F) may be omitted.

[0182] The folding portion (PLT-F) has a greater elastic modulus than the first support portion (PLT-1) and the second support portion (PLT-2). The folding portion (PLT-F) may include a material having an elastic modulus of 60 GPa or more, and may include a metallic material such as stainless steel. For example, the folding portion (PLT-F) may include SUS 304, but is not limited thereto, and the folding portion (PLT-F) may include various metallic materials.

[0183] The first support portion (PLT-1) and the second support portion (PLT-2) may comprise plastic, glass fiber reinforced plastic, or glass. The plastic may comprise polyimide or polyethylene terephthalate and is not particularly limited. The first support portion (PLT-1) and the second support portion (PLT-2) may comprise the same material.

[0184] A plurality of openings (OP) may be defined in a portion of the support layer (PLT) corresponding to the folding area (FA). The flexibility of the support layer (PLT) is improved by the openings (OP). The flexibility of the support layer (PLT) can be improved by not placing the sixth adhesive layer (AL6) in the area corresponding to the folding area (FA).

[0185] A seventh adhesive layer (AL7) bonds the support layer (PLT) and the cover layer (SCV), and an eighth adhesive layer (AL8) bonds the cover layer (SCV) and the digitizer (ZM). The cover layer (SCV) can cover the openings (OP) defined in the support layer (PLT). The cover layer (SCV) may have a lower elastic modulus than the support layer (PLT). For example, the cover layer (SCV) may include, but is not limited to, thermoplastic polyurethane, rubber, and silicone.

[0186] The cover layer (SCV) can be manufactured in the form of a sheet and attached to the support layer (PLT). The eighth adhesive layer (AL8) may include a first adhesive portion (AL8-1) and a second adhesive portion (AL8-2) that are spaced apart from each other. The distance between the first adhesive portion (AL8-1) and the second adhesive portion (AL8-2) corresponds to the width of the folding area (FA) and is larger than the gap (GP) described later. Since the eighth adhesive layer (AL8) is not placed in the area corresponding to the folding area (FA), the flexibility of the cover layer (SCV) can be improved. The distance between the first adhesive portion (AL8-1) and the second adhesive portion (AL8-2) of the eighth adhesive layer (AL8) may correspond to the distance (D6) between the first adhesive portion (AL6-1) and the second adhesive portion (AL6-2) of the sixth adhesive layer (AL6).

[0187] Among the aforementioned configurations, the configuration between the display panel (DP) and the digitizer (ZM) may correspond to the protective member (PM) shown in FIG. 3.

[0188] The digitizer (ZM) can detect the position where the electromagnetic pen (SP, see FIG. 1a) is close to the window module (WM). The description above in FIG. 5 to 9a can be applied to the digitizer (ZM) in the same way, and a detailed description is omitted.

[0189] An electromagnetic shielding layer (EMS) is placed on the lower side of the digitizer (ZM). An electromagnetic shielding layer (EMS) may be added to block electromagnetic waves generated from the electronic module (EM) shown in FIG. 2 from affecting the digitizer (ZM) as noise.

[0190] The electromagnetic shielding layer (EMS) may include a first electromagnetic shielding layer (EMS-1) and a second electromagnetic shielding layer (EMS-2). The first electromagnetic shielding layer (EMS-1) and the second electromagnetic shielding layer (EMS-2) may be spaced apart with a predetermined gap (GP). The gap (GP) may be 0.3 mm to 3 mm and may be positioned to correspond to a folding area (FA).

[0191] In this embodiment, the electromagnetic shielding layer (EMS) may include a magnetic metal powder layer (MMP). The magnetic metal powder layer may be formed directly on the lower surface of the digitizer (ZM) through a coating and curing process. In one embodiment of the present invention, the electromagnetic shielding layer (EMS) may be omitted.

[0192] The ninth adhesive layer (AL9) combines the electromagnetic shielding layer (EMS) and the metal plate (MP). The ninth adhesive layer (AL9) may include a first adhesive portion (AL9-1) and a second adhesive portion (AL9-2) that are spaced apart from each other. The metal plate (MP) may include a first metal plate (MP-1) and a second metal plate (MP-2) attached to the first adhesive portion (AL9-1) and the second adhesive portion (AL9-2), respectively. The metal plate (MP) can improve heat dissipation and protect the configuration on the upper side of the metal plate (MP) from external pressure generated during the manufacturing process of the display device.

[0193] Among the aforementioned configurations, the components positioned below the digitizer (ZM) may correspond to the lower member (LM) shown in FIG. 3.

[0194] FIG. 12 is a cross-sectional view of a display device (DD-1) according to one embodiment of the present invention.

[0195] The display device (DD-1) of Fig. 12 differs from the display device (DD) of Fig. 11 in that it includes the digitizer (ZM-b) of Fig. 10.

[0196] Referring to FIG. 12, the digitizer (ZM-b) may include a first digitizer (ZM-1) and a second digitizer (ZM-2). The first digitizer (ZM-1) may be attached to a first adhesive portion (AL8-1) of the eighth adhesive layer (AL8), and the second digitizer (ZM-2) may be attached to a second adhesive portion (AL8-2) of the eighth adhesive layer (AL8). The first digitizer (ZM-1) and the second digitizer (ZM-2) are spaced apart with a predetermined gap (GP). The gap (GP) may be 0.3 mm to 3 mm and may be positioned to correspond to a folding area (FA).

[0197] The first electromagnetic shielding layer (EMS-1) and the second electromagnetic shielding layer (EMS-2) can correspond to the first digitizer (ZM-1) and the second digitizer (ZM-2), respectively.

[0198] The first digitizer (ZM-1) can overlap at least a portion of the folding area (FA) and the second non-folding area (NFA2). The second digitizer (ZM-2) can overlap at least a portion of the folding area (FA) and the first non-folding area (NFA1). The digitizer (ZM-b) includes a predetermined gap (GP) that overlaps the folding area (FA), so as to relieve stress applied to the folding portion when the display device (DD-1) is folded.

[0199] The digitizer (ZM) of the present invention includes via holes (VH) that overlap in a folding region (FA), and the via holes (VH) may be arranged in different rows and different columns. Alternatively, if n via holes (VH) are arranged in the same row, the spacing between any two adjacent via holes (VH) among the n via holes (VH) is at least n times the average size of the via holes. Alternatively, if via holes (VH) are arranged in the same column, the number of via holes (VH) arranged in the same column may be two or fewer. Accordingly, the digitizer (ZM) can exhibit uniform rigidity in the portion overlapping in the folding region (FA).

[0200] The display device (DD) of the present invention includes the digitizer (ZM) of the present invention, so that defects such as cracks occurring around via holes (VH) in the digitizer (ZM) during folding can be minimized. Accordingly, the reliability of the display device (DD) can be improved.

[0201] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the relevant technical field will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0202] Electronic device ED Display device DD Display panel DP 1st non-folding area, 2nd non-folding area, folding area NFA1, NFA2, FA Digitizer ZM Via Hole VH 1st Challenge Lines CF 2nd conductive lines RF

Claims

Claim 1 A display panel comprising a first non-folding area, a second non-folding area, and a folding area disposed between the first non-folding area and the second non-folding area; and a digitizer comprising a base layer, first conductive lines disposed on the base layer, a first cover layer disposed on the first conductive lines, second conductive lines disposed on the first cover layer, a second cover layer disposed on the second conductive lines, and via holes penetrating the first cover layer; wherein some of the second conductive lines are electrically connected to the first conductive lines through the via holes, the first non-folding area, the folding area, and the second non-folding area are distinguished in the x-axis direction, the via holes overlap the folding area, and the minimum length in the x-axis direction of the spacing between all via holes closest to each other is greater than or equal to the average diameter of the via holes. Claim 2 A display device according to claim 1, wherein some of the first conductive lines and some of the second conductive lines connected by the via holes form a closed curve. Claim 3 delete Claim 4 A display device according to claim 1, wherein the number of via holes arranged in the same column among the via holes is two or fewer. Claim 5 A display device according to claim 4, wherein when n via holes among the via holes are arranged in the same row, the horizontal distance between any two adjacent n via holes is at least n times the average size of the via holes, and n is an integer greater than or equal to 2. Claim 6 A display device according to claim 4, wherein when two of the via holes are arranged in the same column, the vertical distance between the two via holes is at least twice the average size of the via holes. Claim 7 In claim 4, the via holes are arranged in different columns in a display device. Claim 8 In claim 7, the via holes are arranged in different rows in a display device. Claim 9 A display device according to claim 4, wherein the via holes include a first via hole, a second via hole, a third via hole, a fourth via hole, and a fifth via hole, wherein the first via hole, the third via hole, and the fifth via hole are arranged in a first row, the second via hole and the fourth via hole are arranged in a second row, and each of the first to fifth via holes is arranged in a first to fifth column, respectively. Claim 10 A display device according to claim 1, wherein each of the first conductive lines extends in the x-axis direction on a plane, and each of the second conductive lines extends in the y-axis direction intersecting the x-axis direction on a plane. Claim 11 A display device according to claim 1, wherein each of the first conductive lines extends in a y-axis direction intersecting the x-axis direction on a plane, and each of the second conductive lines extends in the x-axis direction on a plane. Claim 12 In claim 1, the digitizer is a display device comprising a first part that overlaps the folding area and is foldable around a virtual folding axis, a second part that overlaps the first non-folding area, and a third part that overlaps the second non-folding area. Claim 13 In claim 12, the via hole is a display device disposed in the first part. Claim 14 In claim 1, the digitizer comprises a first digitizer and a second digitizer spaced apart from each other, the first digitizer overlaps at least a portion of the folding area and the second non-folding area, the second digitizer overlaps at least a portion of the folding area and the first non-folding area, and the via holes are disposed in the first digitizer and the second digitizer. Claim 15 A display device according to claim 1, further comprising an electromagnetic shielding layer disposed below the digitizer. Claim 16 A display device comprising: a window module; and a first non-folding area, a folding area, and a second non-folding area defined sequentially in the x-axis direction, and a display module disposed below the window module; wherein the display module comprises: a display panel; and a digitizer disposed below the display panel, comprising first conductive lines extending in the y-axis direction intersecting the x-axis direction and second conductive lines extending in the x-axis direction and disposed on a different layer from the first conductive lines; wherein the digitizer comprises a plurality of via holes overlapping the folding area, and a portion of the second conductive lines is electrically connected to a portion of the first conductive lines through the plurality of via holes, and the minimum length in the x-axis direction of the spacing between all via holes closest to each other is greater than or equal to the average diameter of the via holes. Claim 17 A display device according to claim 16, wherein the number of via holes arranged in the same column among the via holes is two or fewer. Claim 18 A display device according to claim 17, wherein when the number of via holes placed in any one of the plurality of rows is n, the distance between any two adjacent via holes among the n via holes is at least n times the average size of the via holes, and n is an integer greater than or equal to 2. Claim 19 In claim 16, the display module further comprises a lower member disposed below the digitizer, and the lower member comprises at least one of an electromagnetic shielding layer, a heat dissipation layer, a cushion layer, and a metal plate. Claim 20 A display panel comprising a first non-folding region, a second non-folding region, and a folding region disposed between the first non-folding region and the second non-folding region; and a digitizer disposed superimposed on the display panel, comprising a plurality of insulating layers, first conductive lines and second conductive lines disposed between the plurality of insulating layers, and via holes penetrating some of the plurality of insulating layers; A display device comprising, wherein the digitizer includes a first part having flexibility and at least a portion of which overlaps the folding region, a second part overlapping the first non-folding region, and a third part overlapping the second non-folding region, wherein via holes are disposed in the first part, and a portion of the second conductive lines are connected to a portion of the first conductive lines through the via holes to form a closed curve, wherein the first non-folding region, the folding region, and the second non-folding region are distinguished in the x-axis direction, and the minimum length in the x-axis direction of the spacing between all via holes closest to each other among the via holes is greater than or equal to the average diameter of the via holes.

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