Test Board for Testing Chip on Film

Abstract

A chip-on-film test board on which a chip-on-film is mounted according to one embodiment of the present invention is characterized by comprising: a main board having a test circuit portion that outputs a test pattern signal; and a chip-on-film fixing portion that fixes the position of the chip-on-film.

Description

Technology Field

[0001] This specification relates to a chip-on-film test board. Background Technology

[0002] Among the manufacturing processes of various semiconductors, High-Temperature Operating Life (HTOL) testing is a test designed to verify the reliability of a device at high temperatures within its operating range. By operating the semiconductor device under test at high temperatures, this high-temperature operating life test can predict the product defect rate and the average lifespan of the product.

[0003] In particular, high-temperature operating life testing can only be performed on semiconductor devices that are distinguishable from actual semiconductor devices due to the structure of the test board used to conduct the test. The problem to be solved

[0004] The present invention is intended for testing a chip-on-film, and its technical objective is to provide a chip-on-film test board for conducting tests on a chip-on-film more quickly and efficiently. means of solving the problem

[0005] A chip-on-film test board on which a chip-on-film is mounted according to one embodiment of the present invention is characterized by comprising: a main board having a test circuit portion that outputs a test pattern signal; and a chip-on-film fixing portion that fixes the position of the chip-on-film. Effects of the invention

[0006] Since the chip-on-film fixing portion of the chip-on-film test board according to the present invention does not occupy a large area, the test circuit portion can be embedded in the main board, allowing a larger number of chips-on-films to be tested using a single test board. Furthermore, because the test circuit portion is located on the main board rather than on a separate board, the total thickness of the test board is reduced, allowing a larger number of test boards to be mounted on the test equipment, thereby enabling testing of a larger number of chips-on-films. In other words, testing can be performed more quickly and efficiently using the chip-on-film test board according to the present invention.

[0007] In addition, the chip-on-film test board according to the present invention can perform tests not only on chip-on-films for testing but also on chip-on-films for actual use, thereby enabling quality assurance and quality improvement of chip-on-films.

[0008] The chip-on-film test board according to the present invention can automate testing using a handler of automatic test equipment, thereby improving the speed of test progress. Brief explanation of the drawing

[0009] FIG. 1 is a plan view of a chip-on-film test board according to one embodiment of the present invention. FIG. 2 is a plan view of a chip-on-film test board according to another embodiment of the present invention. FIG. 3 is an enlarged perspective view of one chip-on-film fixing part of a chip-on-film test board according to one embodiment of the present invention. Figure 4 is a cross-sectional view taken according to II' of Figure 3. Figure 5 is a cross-sectional view taken along II-II' of Figure 3. FIG. 6 is an enlarged perspective view of one chip-on-film fixing part of a chip-on-film test board according to another embodiment of the present invention. Specific details for implementing the invention

[0010] Throughout the specification, identical reference numbers denote substantially identical components. In the following description, detailed descriptions of components and functions known in the art may be omitted if they are not related to the core components of the invention. The meanings of the terms described in this specification should be understood as follows.

[0011] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0012] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the depicted details. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if it is determined that a detailed description of related known technology may unnecessarily obscure the essence of the present invention, such detailed description is omitted.

[0013] Where terms such as 'comprising,' 'having,' 'consisting of,' etc. are used in this specification, other parts may be added unless 'only' is used. Where a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0014] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0015] Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention.

[0016] The term “at least one” should be understood to include all combinations that can be presented from one or more related items. For example, the meaning of “at least one of the first item, the second item and the third item” may mean not only the first item, the second item or the third item individually, but also all combinations of items that can be presented from two or more of the first item, the second item and the third item.

[0017] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0019] Hereinafter, a chip-on-film test board according to the present invention will be described in detail with reference to FIGS. 1 to 6.

[0020] FIG. 1 is a plan view of a chip-on-film test board according to one embodiment of the present invention, and FIG. 2 is a plan view of a chip-on-film test board according to another embodiment of the present invention. FIG. 3 is an enlarged perspective view of one chip-on-film fixing part of a chip-on-film test board according to one embodiment of the present invention, FIG. 4 is a cross-sectional view cut along II' of FIG. 3, and FIG. 5 is a cross-sectional view cut along II-II' of FIG. 3. FIG. 6 is an enlarged perspective view of one chip-on-film fixing part of a chip-on-film test board according to yet another embodiment of the present invention.

[0021] Referring to FIG. 1, in order to perform a test on a chip-on-film, a chip-on-film (2000) is mounted on a chip-on-film test board (100) according to the present invention, and the chip-on-film test board according to the present invention includes a chip-on-film fixing part (200) that fixes the position of the main board (100) and the mounted chip-on-film (2000) and electrically connects the chip-on-film (2000) and the main board (100).

[0022] The main board (100) may be made of a printed circuit board (PCB). Specifically, the main board (100) may be made of a printed circuit board having an area that can include a plurality of chip-on-films (2000) and a test circuit section (110) so as to be able to simultaneously test a plurality of chip-on-films (2000) that are the subject of the test.

[0023] The main board (100) includes a test circuit section (110), a connection circuit section (not shown), and a pad section (120) to test the chip-on-film (2000).

[0024] As shown in FIGS. 1 and 2, the main board (100) includes a first surface (101) and a second surface (102) facing the first surface (101).

[0025] According to one embodiment of the present invention, as illustrated in FIG. 1, both the chip-on-film fixing part (200) and the test circuit part (110) may be disposed on either the first surface (101) and the second surface (102) of the main board (100). That is, the chip-on-film fixing part (200) and the test circuit part (110) may be disposed on one surface of the main board (100). The test circuit part (110) may be electrically connected to a plurality of chip-on-films (2000) disposed on the main board (100) through a connection circuit part formed on one surface of the main board (100).

[0026] Alternatively, according to another embodiment of the present invention, as shown in FIG. 2, a chip-on-film fixing part (200) may be disposed on a first surface (101) of the main board (100), and a test circuit part (110) may be disposed on a second surface (102). That is, the chip-on-film fixing part (200) and the test circuit part (110) may be disposed on different surfaces of the main board (100). Although not shown, the test circuit part (110) may be connected to the chip-on-film (2000) to be tested through a connection circuit part including a connection hole penetrating the main board (100) and a conductor pin located within the connection hole.

[0027] The test circuit section (110) supplies power to the chip-on-film (2000) and outputs a test pattern signal to perform a test on the chip-on-film (2000).

[0028] According to one embodiment of the present invention, the test circuit section (110) may be formed by being embedded in the main board (100) rather than on a separate board. Since the test circuit section (110) is embedded in the main board (100), the thickness of the chip-on-film test board (1000) is reduced, allowing a larger number of chip-on-film test boards (1000) to be mounted on the test equipment. Accordingly, a larger number of chip-on-films (2000) can be tested during a single test, thereby improving the speed of the test process.

[0029] The test circuit section (110) is connected to the chip-on-film (2000) to be tested through the connection circuit section, and can supply power to the chip-on-film (2000) and output a test pattern signal. For example, the test circuit section (110) can generate a test pattern signal including any clock signal, any address signal, any control signal, any command signal, any data, etc., and apply it to the chip-on-film (2000). In addition, the test circuit section (110) can receive test result signals output from the chip-on-film (2000) that received the test pattern signal, and can determine the state of the chip-on-film (2000), the pad section of the chip-on-film (2000), the pad section (120) of the main board (100), or the connection circuit section of the main board (100) using the received test result signals.

[0030] The connection circuit section electrically connects the test circuit section (110) embedded in the main board (100) and the pad section (120) to be described later. The connection circuit section may be a wiring line printed on the main board (100).

[0031] The pad portion (120 in FIG. 5) can be electrically connected by contacting the pad portion of the chip-on-film (2000) to be tested by the chip-on-film fixing portion (200) to be described later. According to one embodiment of the present invention, the pad portion (120) is in close contact with the pad portion of the chip-on-film (2000) by the chip-on-film fixing portion (200) to be described later. Specifically, as the upper fixing portion (210) and the lower fixing portion (220) are connected, pressure is applied to the mounted chip-on-film (2000), and the pad portion (120) is in close contact with the pad portion of the chip-on-film (2000). Accordingly, the pad portion (120) can be electrically connected to the test circuit portion (110) of the main board (100) and the chip-on-film (2000) by contacting the pad portion of the chip-on-film (2000).

[0032] The chip-on-film fixing part (200) can fix the position of a plurality of chip-on-films (2000) to be tested and apply pressure to the plurality of chip-on-films (200) to make contact with the pad part (120) of the main board (100), thereby electrically connecting each chip-on-film (2000) and the test circuit part (110).

[0033] When a chip-on-film (2000) with a plurality of chips mounted thereon is extended and arranged along a second direction (D2), the chip-on-film fixing part (200) may be arranged in a plurality along a first direction (D1) and positioned extended along the second direction (D2), as shown in FIGS. 1 and 2. Alternatively, it may be arranged in a plurality according to each of the first direction (D1) and the second direction (D2), and positioned extended along the first direction (D1) or the second direction (D2). However, the chip-on-film fixing part (200) may be formed with different lengths for the first direction (D1) and the second direction (D2) so as to correspond to the direction in which the chip-on-film (2000) is extended. However, one embodiment of the present invention is not limited thereto, and the chip-on-film fixing part (200) may have the same length for the first direction (D1) and the second direction (D2) depending on the size of the chip mounted on the chip-on-film (2000).

[0034] As shown in FIG. 3, the chip-on-film fixing part (200) may include an upper fixing part (210), a lower fixing part (220), and an auxiliary fixing part (270).

[0035] The upper fixing part (210) is combined with the lower fixing part (220) to fix the position of the chip-on-film (2000) to be tested.

[0036] The upper fixing part (210) can be arranged at regular intervals along the second direction (D2) in which the chip-on-film (2000) is extended.

[0037] The upper fixing part (210) may have different lengths for the first direction (D1) and the second direction (D2). Specifically, the upper fixing part (210) may have a shape that extends along the first direction (D1) which is perpendicular to the second direction (D1) in a plane, and, for example, as shown in FIG. 3, the length of the upper fixing part (210) for the first direction (D1) may have a greater value than the length of the upper fixing part (210) for the second direction (D2). However, one embodiment of the present invention is not limited thereto, and the upper fixing part (210) may have the same length for the first direction (D1) and the second direction (D2) depending on the size of the chip mounted on the chip-on-film (2000).

[0038] Additionally, the upper fixing part (210) can be extended along the first direction (D1) to a position overlapping with the lower fixing part (220) on a plane, and can be fastened to the lower fixing part (220) at the position overlapping with the lower fixing part (220).

[0039] The upper fixing part (210) may include a first housing (211), a pressing part (212), and a first fastening part (213).

[0040] The first housing (211) may have a shape that accommodates and protects the pressure part (212) and the first fastening part (213) to be described later, and facilitates the fastening and unfastening of the first fastening part (213) and the second fastening part (222) to be described later. For example, as described above, the first housing (211) may be a rectangular shape having a longer length in the first direction (D1) than in the second direction (D2) on a plane, and may include an auxiliary housing such as a button to facilitate the fastening or unfastening of the first fastening part (213) and the second fastening part (222).

[0041] The pressure member (212) applies pressure to the chip-on-film (2000) inside the first housing (211) to fix the position of the chip-on-film (2000) and electrically connects the test circuit member (110) of the main board (100) with the chip-on-film (2000). Specifically, as the upper fixing member (210) is fastened to the lower fixing member (220), the pressure member (212) can apply pressure to the chip-on-film (2000) mounted between the upper fixing member (210) and the main board (100) to fix the position of the chip-on-film (2000) as shown in FIGS. 3 to 5. To this end, the pressure member (212) may be made of an elastic material and shape. For example, the pressurizing part (212) may be a sheet-shaped member having elasticity, may be made of rubber or silicone having elasticity due to the inherent properties of the material itself, may be made of a structure made of foamed polymer resin having elasticity in terms of structure or shape, a structure including a spring, etc. However, it is not limited thereto, and the pressurizing part (212) may be made of a material that exerts elastic pressurizing force.

[0042] Accordingly, the pressure unit (212) electrically connects the pad portion (not shown) of the chip-on-film (2000) and the pad portion (120) of the main board (100) by bringing them into contact with each other. Accordingly, the pressure unit (212) can electrically connect the test circuit portion (110) and the chip-on-film (2000) through the electrically connected pad portion (120) of the main board (100) and the pad portion of the chip-on-film (2000).

[0043] As described above, the first fastening part (213) is fastened to the second fastening part (222) of the lower fixing part (220) at a position overlapping with the lower fixing part (220). The first fastening part (213) may include a structure that is coupled to the second fastening part (222) by magnetic force, including a permanent magnet or an electromagnet. Alternatively, the first fastening part (213) may be coupled to the second fastening part (222) by including a fastening structure such as a bolt, rivet, fastening groove, fastening member, or fastening ball. According to one embodiment of the present invention, the structure of the first fastening part (213) is not limited thereto and may include any structure capable of being coupled to the second fastening part (222).

[0044] The lower fixing part (220) is combined with the upper fixing part (210) to fix the position of the chip-on-film (2000) to be tested.

[0045] As shown in FIG. 3, the lower fixing part (220) may be positioned facing the first direction (D1) which is perpendicular to the second direction (D2) in which the chip-on-film (2000) is extended. Specifically, when the chip-on-film (2000) is mounted along the second direction (D2), the lower fixing part (220) may be positioned in a plane facing the first direction (D1) with the chip-on-film (2000) in between.

[0046] According to one embodiment of the present invention, each lower fixing part (220) can be connected to one upper fixing part (210).

[0047] The lower fixing part (220) can be arranged at regular intervals along the second direction (D2) in which the chip-on-film (2000) is extended.

[0048] The lower fixing part (220) may include a second housing (221) and a second fastening part (222).

[0049] The second housing (221) may have a shape that accommodates and protects the second fastening part (222), which will be described later, and facilitates the fastening or unfastening of the first fastening part (213) and the second fastening part (222). For example, as described above, the second housing (221) may include an auxiliary housing, such as a button, to facilitate the fastening or unfastening of the first fastening part (213) and the second fastening part (222).

[0050] The second fastening part (222) is fastened to the first fastening part (213) of the upper fixing part (210). The second fastening part (222) may include a structure that is coupled to the first fastening part (213) by magnetic force, including a permanent magnet or an electromagnet. Alternatively, the second fastening part (222) may be fastened to the first fastening part (213) by including a fastening structure such as a bolt, rivet, fastening groove, or fastening ball. According to one embodiment of the present invention, the structure of the second fastening part (222) is not limited thereto and may include any structure that can be coupled to the first fastening part (213).

[0051] According to one embodiment of the present invention, the upper fixing part (210) and the lower fixing part (220) can fix the position of the chip-on-film (2000) as shown in FIGS. 2 to 4. Specifically, the upper fixing part (210) fixes the position of the chip-on-film (2000) in the second direction (D2) and the third direction (D3), and the lower fixing part (220) fixes the position of the chip-on-film (2000) in the first direction (D1). The chip-on-film (2000) is positioned between the two lower fixing parts (220) to fix the position of the chip-on-film (2000) in the first direction (D1), and the upper fixing part (210) is combined or fixed with the lower fixing part (220) to press the chip-on-film (2000) to fix the position of the chip-on-film (2000) in the second direction (D2) and the third direction (D3).

[0052] According to one embodiment of the present invention, when the connection between the upper fixing part (210) and the lower fixing part (220) is released, the chip-on-film (2000) can be automatically moved along the second direction (D2) by a handler of the automatic test equipment. For example, the chip-on-film (2000) can be automatically moved like a conveyor belt by the handler of the test equipment, thereby automating the process of a user manually fixing the position of the chip-on-film to repeat the test, so that the test can be performed more quickly and efficiently using the test board according to the present invention.

[0053] According to one embodiment of the present invention, the upper fixing part (210) may be an upper jig, and the lower fixing part (220) may be a lower jig. Since the upper fixing part (210) and the lower fixing part (220), which fix the chip-on-film (2000) through the jig structure, do not occupy a large area, a test circuit part (110) can be formed on the main board (100), and a larger number of chip-on-films (2000) can be tested using a single test board (1000). In addition, since the test circuit part (110) is located on the main board (100) rather than on a separate board, the total thickness of the test board (100) is reduced, allowing a larger number of test boards to be mounted on the test equipment, thereby enabling a larger number of chip-on-films (2000) to be tested. Therefore, testing can be performed more quickly and efficiently using the test board according to the present invention.

[0054] In addition, depending on the length and size of the chip-on-film fixing part (200) of the test board (1000) according to the present invention, the position of the chip-on-film to be used as well as the chip-on-film (2000) can be fixed. That is, according to one embodiment of the present invention, testing can be performed on the chip-on-film (2000) to be used as well as the chip-on-film of a predetermined specification, thereby enabling quality assurance and quality improvement of the chip-on-film (2000).

[0055] As illustrated in FIG. 3, the auxiliary fixing part (270) can fix the position of the chip-on-film (2000) together with the upper fixing part (210), the lower fixing part (220), and the pressing part (212). Specifically, the auxiliary fixing part (270) is positioned between a plurality of upper fixing parts (210) arranged along the second direction (D2) or between a plurality of lower fixing parts (220) arranged along the second direction (D2), and is positioned to face each other with respect to the first direction (D1) so as to fix the position of the chip-on-film (2000) in the first direction (D1), the second direction (D2), and the third direction (D3). In addition, the auxiliary fixing part (270) electrically connects the test circuit part (110) of the main board (100) and the chip-on-film (2000) by bringing the pad part (120) of the main board (100) into contact with the pad part of the chip-on-film (2000).

[0056] According to another embodiment of the present invention, as illustrated in FIG. 6, the lower fixing part (220) may have a shape that extends along the second direction (D2). Specifically, the lower fixing part (220) extends along the second direction (D2) in which the chip-on-film (2000) is extended and mounted, and is positioned facing the chip-on-film (2000) with the chip-on-film (2000) in between. Accordingly, the position of the chip-on-film (2000) can be fixed with respect to the first direction (D1) by two lower fixing parts (220) positioned facing each other with the chip-on-film (2000) in between.

[0057] Additionally, the lower fixing part (220) has a shape extended along the second direction (D2) and can be positioned at a location intersecting in a plane with the upper fixing part (210) which has a shape extended along the first direction (D1).

[0058] The lower fixing part (220) can be connected to a plurality of upper fixing parts (210). That is, a plurality of upper fixing parts (210) each extended according to the first direction (D1) and two lower fixing parts (220) extended according to the second direction (D2) are connected to fix the position of the chip-on-film (2000), and the test circuit part (110) of the main board (100) and the chip-on-film (2000) are electrically connected.

[0059] Those skilled in the art to which the present invention pertains will understand that the above-described invention may be implemented in other specific forms without altering its technical concept or essential features.

[0060] Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The scope of the invention is defined by the claims set forth below rather than by the detailed description above, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the invention. Explanation of the symbols

[0061] 1000: Chip-on-film test board 100: Mainboard 110: Test circuit 120: Pad section 200: Chip-on-film fixing section 210: Upper fixing part 211: First housing 212: Pressurizing part 213: First fastening part 220: Lower fixing part 221: Second housing 222: Second connecting part

Claims

Claim 1 A chip-on-film test board in which a chip-on-film is mounted, comprising: a main board having a test circuit unit that outputs a test pattern signal; and a chip-on-film fixing unit that fixes the position of the chip-on-film and electrically connects the chip-on-film to the test circuit unit; wherein the main board comprises: a pad unit electrically connected to the test circuit unit; and a connecting circuit unit that connects the pad unit and the test circuit unit. Claim 2 A chip-on-film test board according to claim 1, wherein the chip-on-film fixing member comprises: a lower fixing member positioned on a plane with the chip-on-film in between to fix the position of the chip-on-film in a first direction; and an upper fixing member to fix the position of the chip-on-film in a second direction perpendicular to the first direction and a third direction perpendicular to the first direction and the second direction. Claim 3 A chip-on-film test board according to paragraph 2, wherein the main board further includes a pad portion electrically connected to the test circuit portion, and when the upper fixing portion and the lower fixing portion are fastened together while the chip-on-film is mounted, the pad portion comes into contact with the pad portion of the chip-on-film and the test circuit portion and the chip-on-film are electrically connected. Claim 4 A chip-on-film test board according to paragraph 2, characterized in that the upper fixing part includes a first fastening part, and the lower fixing part includes a second fastening part that is fastened to the first fastening part. Claim 5 A chip-on-film test board characterized in that, in paragraph 2, the lower fixing part is connected to one upper fixing part. Claim 6 A chip-on-film test board according to paragraph 2, wherein the chip-on-film is mounted by extending along the second direction, the upper fixing part has a shape extended along the first direction, and the lower fixing part is arranged to overlap with the upper fixing part and is connected to one upper fixing part. Claim 7 A chip-on-film test board characterized in that, in paragraph 2, each of the lower fixing parts is connected to a plurality of upper fixing parts. Claim 8 A chip-on-film test board according to paragraph 2, wherein the chip-on-film is mounted by extending along the second direction, the upper fixing part has a shape extended along the first direction, the lower fixing part has a shape extended along the second direction, is positioned at an intersecting position with the upper fixing part on a plane, and is coupled to a plurality of upper fixing parts. Claim 9 A chip-on-film test board according to paragraph 2, further comprising: an upper fixing part that fixes the chip-on-film by applying pressure between the upper fixing part and the chip-on-film, and electrically connects the test circuit and the chip-on-film. Claim 10 A chip-on-film test board according to claim 9, characterized in that the above-mentioned pressure part is made of an elastic material and has a shape. Claim 11 A chip-on-film test board characterized in that, in paragraph 2, the length of the upper fixed part in the first direction has a different value from the length of the upper fixed part in the second direction. Claim 12 A chip-on-film test board according to claim 2, wherein the chip-on-film fixing member further comprises an auxiliary fixing member positioned between a plurality of upper fixing members or between a plurality of lower fixing members in a plane with respect to the second direction to fix the position of the chip-on-film with respect to the first direction. Claim 13 A chip-on-film test board characterized in that, in paragraph 2, the upper fixing part and the lower fixing part are jig structures. Claim 14 A chip-on-film test board according to claim 1, wherein the main board comprises a first surface and a second surface facing the first surface, and the test circuit portion and the chip-on-film fixing portion are located on either the first surface or the second surface. Claim 15 A chip-on-film test board according to claim 1, wherein the main board comprises a first surface and a second surface facing the first surface, the chip-on-film fixing portion is located on the first surface, and the test circuit portion is located on the second surface. Claim 16 delete

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