RFID tag module

Abstract

The present invention discloses an RFID tag module capable of preventing short circuits in an antenna pattern caused by externally applied torsional or bending stress and increasing durability to improve product reliability. The RFID tag module of the present invention comprises: an RFID tag including a tag body, an antenna pattern, and an IC chip; and an epoxy layer coated on the IC chip; wherein the antenna pattern comprises a helical pattern portion formed in a spiral shape on the tag body and a double-sided pattern portion formed in a continuous planar conductor pattern shape on the upper and lower surfaces of the tag body, respectively, and electrically connecting the helical pattern portion and the IC chip, wherein the end of the double-sided pattern portion overlaps with the epoxy layer.

Description

Technology Field

[0001] The present invention relates to an RFID tag module, and more specifically, to an RFID tag module embedded in a rubber product such as an automobile tire. Background Technology

[0002] Since a car's tires support the weight of the vehicle body and come into direct contact with the ground, they are directly related to driving stability. To ensure the car performs properly, it is advisable to install tires suitable for the season; specifically, it is recommended to install summer tires in the summer and winter tires in the winter.

[0003] Summer tires are primarily used in spring, summer, and autumn due to their excellent grip on dry roads. They utilize soft rubber materials for effective contact with the road surface, offering superior ride comfort and driving performance. However, performance declines in winter as the tire rubber hardens.

[0004] Winter tires incorporate numerous sipes (fine grooves) to increase friction and enhance the drainage performance of the grooves, preventing the formation of hydroplaning between the tire and the road caused by melting snow or ice. These winter tires deliver stable performance on cold asphalt surfaces and snowy roads.

[0005] In Europe, it is essential to switch to summer tires in the summer and winter tires in the winter.

[0006] Since it is difficult to distinguish between summer and winter tires with the naked eye, RFID tags are attached to the inner walls of the tires using adhesive to ensure the correct tires for the season are mounted. The summer and winter tires are then distinguished by sensing the RFID tags with a reader.

[0007] Alternatively, in the tire production and transportation process, as tires pass along a conveyor belt, a reader senses the RFID tag attached to the tire to distinguish between summer and winter tires, enabling them to be packaged and transported separately.

[0008] However, conventionally, since the FPCB RFID tag is attached to the inner wall of the tire using a tape method with an adhesive, there is a problem that it easily falls off because the adhesion between the adhesive and the tire is weak.

[0009] As an alternative to solve this, a method is being applied in which an RFID tag is manufactured with a structure in which an IC is mounted on an FR4 PCB and helical antenna patterns are formed on both sides of the IC, the manufactured RFID tag is wrapped in BR rubber (synthetic rubber), and the RFID tag wrapped in BR rubber is inserted into the side wall of a tire.

[0010] However, in the case of conventional RFID tags with helical antenna patterns, epoxy is coated around the IC to protect it and PSR (Photo Soler Resist) is coated to prevent corrosion of the antenna pattern. When a bending test is performed to test the reliability of the manufactured RFID tag product, cracks occur in the antenna pattern and PCB at the epoxy-coated end points, which lowers the reliability of the RFID tag product. Prior art literature

[0011] Korean Published Patent No. 10-2023-0108890 (July 19, 2023) The problem to be solved

[0012] The technical problem to be solved by the present invention is to provide an RFID tag module that can improve the reliability of an RFID tag product by preventing cracks from occurring in the antenna pattern at the outer epoxy-coated point during a bending test of the RFID tag product.

[0013] Another technical problem to be solved by the present invention is to provide an RFID tag module that can achieve normal operation through the other pattern part even if a crack occurs in one of the antenna patterns formed on both sides of the RFID tag.

[0014] Another technical problem to be solved by the present invention is to provide an RFID tag module that can improve durability against torsional stress and bending stress by improving the bonding strength between the epoxy layers coated on both sides of the RFID tag and stably maintaining the balance of forces through the epoxy layers coated on both sides of the RFID tag. means of solving the problem

[0015] The RFID tag module of the present invention for solving the above-mentioned technical problem comprises: an RFID tag including a tag body, an antenna pattern, and an IC chip; and an epoxy layer coated on the IC chip; wherein the antenna pattern comprises a helical pattern portion formed in a spiral shape on the tag body and a double-sided pattern portion formed in a continuous planar conductor pattern shape on the upper and lower surfaces of the tag body, respectively, and electrically connecting the helical pattern portion and the IC chip, wherein the end portion of the double-sided pattern portion overlaps with the epoxy layer.

[0016] The spiral pattern portion may include a first upper conductor pattern and a first lower conductor pattern formed in the form of discontinuous planar conductor patterns on the upper and lower surfaces of the tag body, respectively, and a via hole formed in the tag body to electrically connect the first upper conductor pattern and the first lower conductor pattern.

[0017] The above-described double-sided pattern portion may include a second upper conductor pattern formed in the form of a continuous planar conductor pattern on the upper surface of the tag body and disposed between the spiral pattern portion and the IC chip, and a second lower conductor pattern formed in the form of a continuous planar conductor pattern on the lower surface of the tag body and disposed between the spiral pattern portion and the IC chip.

[0018] A via hole may be formed in the tag body above to electrically connect the second upper conductor pattern and the second lower conductor pattern.

[0019] At this time, a plurality of via holes may be formed arranged at regular intervals along the second upper conductor pattern or the second lower conductor pattern.

[0020] The pattern line width of the above-mentioned double-sided pattern portion can be formed to be larger than the pattern line width of the spiral pattern.

[0021] The end of the second upper conductor pattern above can overlap with the epoxy layer.

[0022] The above epoxy layer can be formed on both opposing sides of the tag body.

[0023] In the area of ​​the tag body where the above epoxy layer is formed, one or more through holes are formed that penetrate the tag body, and the through holes are filled with epoxy so that the epoxy layers on both sides of the tag body can be interconnected.

[0024] The above-mentioned double-sided pattern portion may include a reinforcing pattern having a line width greater than the pattern line width of the spiral pattern portion and an end that overlaps with the epoxy layer.

[0025] The above reinforcement pattern may have a rectangular shape.

[0026] The above reinforcement pattern can be symmetrically arranged on both opposing sides of the tag body.

[0027] The reinforcing pattern disposed on the upper surface of the above tag body electrically connects the second upper conductor pattern of the double-sided pattern portion and the IC chip, and the reinforcing pattern disposed on the lower surface of the tag body can electrically connect the second lower conductor pattern of the double-sided pattern portion and the IC chip.

[0028] The tag body may have via holes formed therein to electrically connect each reinforcing pattern arranged on the upper and lower surfaces of the tag body.

[0029] In the area of ​​the tag body where the above epoxy layer is formed, one or more through holes penetrating the tag body are formed, and the through holes may be formed in an area overlapping with the reinforcement pattern.

[0030] The above epoxy layer can overlap with the reinforcement pattern up to the midpoint of the width of the reinforcement pattern.

[0031] The above reinforcement pattern includes an extension formed extending away from the IC chip, and via holes may be formed in the tag body to electrically connect each extension of the upper and lower reinforcement patterns of the tag body.

[0032] In the above reinforcement pattern, a slit may be formed at the midpoint of the horizontal width of the reinforcement pattern.

[0033] The above slits can be arranged in pairs symmetrically in the vertical direction perpendicular to the longitudinal direction of the tag body.

[0034] The above antenna pattern can be plated with gold (Au). Effects of the invention

[0035] According to the RFID tag module structure of the present invention, by forming a double-sided pattern portion that has a continuous pattern shape in the antenna pattern portion overlapping with the outer portion of the epoxy layer of the RFID tag and connects the spiral pattern portion and the IC chip in a parallel circuit structure, there is an advantage that normal operation of the RFID tag module can be achieved through the other side of the pattern even if a crack occurs in one side of the double-sided pattern portion.

[0036] In addition, by forming a reinforcing pattern with a larger line width than the spiral pattern portion overlapping the epoxy layer at the outer part of the epoxy layer where torsional or bending stress acts relatively heavily in the RFID tag, it is possible to prevent cracks from occurring in the antenna pattern and improve the reliability of the RFID tag product by increasing durability against torsional and bending stresses.

[0037] In addition, as through holes are formed in the epoxy coating area of ​​the tag body, epoxy is filled into the through holes during epoxy coating, thereby interconnecting the epoxy layers coated on the upper and lower surfaces of the tag body. This significantly strengthens the adhesive strength between the epoxy layers, thereby increasing durability against torsional and bending stresses and improving the reliability of the RFID tag product.

[0038] In addition, since the epoxy layer is formed facing the upper and lower surfaces of the tag body where the IC chip is located, the balance of forces on both sides of the tag body formed with the epoxy layer is stably maintained, thereby significantly improving durability against torsional stress and bending stress.

[0039] In addition, since an open slit is formed in the inner part of the reinforcing pattern where the end of the epoxy layer is located, the reinforcing pattern part with the slit can be bent smoothly when an external force is applied, thus preventing interference with the smooth bending operation of the RFID tag module due to the formation of the reinforcing pattern.

[0040] In addition, as the entire RFID tag is formed with a structure wrapped in a rubber layer, it exhibits excellent bonding to the tire's sidewall during the vulcanization process and integrates with the rubber material constituting the sidewall, thereby preventing damage to the tire's rubber material.

[0041] In addition, the formation of a primer layer between the RFID tag and the rubber layer increases the bonding strength between the RFID tag and the rubber layer during the tire vulcanization process, thereby stably maintaining the RFID tag embedded in the tire and enhancing the operational reliability of the RFID tag.

[0042] In addition, since the primer layer and rubber layer surrounding the tag body are thinly coated on the outer surface of the tag body with a minimum thickness, it is possible to manufacture a miniaturized RFID tag module, which does not affect the appearance or function of the tire. Furthermore, since it can be manufactured through a simple process of sequentially applying a liquid primer and rubber solution to the tag body and then drying it, it has the advantage of reducing manufacturing time and costs.

[0043] In addition, by connecting the conductor pattern formed on the main body of the dielectric and the via hole to form a three-dimensional helical antenna pattern, the maximum antenna length can be secured on a limited dielectric area. Therefore, the RFID tag module can be manufactured in an ultra-small structure, and accordingly, even if the RFID tag module is installed on a tire, it does not affect the appearance or function of the tire at all. In particular, even when attached to a tire with high dielectric constant characteristics, it has the effect of enabling stable operation over a certain distance. Brief explanation of the drawing

[0044] FIG. 1 is a perspective view illustrating an RFID tag module according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of an RFID tag module according to an embodiment of the present invention. FIG. 3 is a perspective view illustrating an RFID tag according to an embodiment of the present invention. FIG. 4 is a plan view showing the shape of an antenna pattern formed on the upper surface of a tag body according to an embodiment of the present invention. FIG. 5 is a rear view showing the shape of an antenna pattern formed on the lower surface of a tag body according to an embodiment of the present invention. FIG. 6 is a perspective view showing the connection structure between an antenna pattern and an IC chip according to an embodiment of the present invention. FIG. 7 is a partially enlarged cross-sectional view showing that the epoxy layer coated on an IC chip according to an embodiment of the present invention partially overlaps with the double-sided pattern portion of an antenna pattern. FIG. 8 is a plan view illustrating a modified example of an antenna pattern formed on a tag body. FIG. 9 is a plan view illustrating another variation of the antenna pattern formed on the tag body. FIG. 10 is a plan view illustrating another variation of an antenna pattern formed on a tag body. FIG. 11 is a flowchart sequentially illustrating the main manufacturing process of an RFID tag module according to the present invention. Specific details for implementing the invention

[0045] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0046] FIG. 1 shows the overall appearance of an RFID tag module according to an embodiment of the present invention, and FIG. 2 shows an enlarged view of the main part of the RFID tag module. FIG. 3 shows the antenna pattern structure formed on the RFID tag, and FIG. 4 and FIG. 5 show the antenna pattern formed on the tag body viewed from the top and bottom, respectively. FIG. 6 shows the connection structure between the antenna pattern and the IC chip, and FIG. 7 shows the epoxy layer coated on the IC chip partially overlapping the double-sided pattern portion of the antenna pattern.

[0047] Referring to FIGS. 1 to 7, an RFID tag module (10) according to an embodiment of the present invention comprises an RFID tag (100) having a tag body (110), an antenna pattern (130), and an IC chip (120), an epoxy layer (210) coated on the IC chip (120) portion, and a primer layer (220) and a rubber layer (230) sequentially coated on the entire outer surface of the RFID tag (100) coated with the epoxy layer (210).

[0048] The RFID (Radio Frequency Identification) tag (100) is a radio frequency identification tag that uses the same frequency band as a contactless IC card and communicates by means of electromagnetic induction without power, and the communication distance can be several tens of centimeters.

[0049] The RFID tag (100) can be formed to have a minimum width, thickness, and length so as not to damage the rubber of the tire. Additionally, it can be formed with a microscopic structure so as not to affect the appearance and function of the tire even when the RFID tag (100) is embedded in the rubber of the tire.

[0050] The RFID tag (100) includes a tag body (110), an IC chip (120), and an antenna pattern (130).

[0051] The tag body (110) is formed of a dielectric. The dielectric may be made of FR-4 PCB or FPCB. FR-4 PCB or FPCB is a high dielectric with respect to air. The dielectric constant (Dk) of the FR4 PCB or FPCB is 2 to 4.4.

[0052] The tag body (110) is formed in a strip shape with a length longer than its width. The thickness of the tag body (110) may be 0.2T to 0.8T (mm), and preferably 0.2T. The width of the tag body (110) may be 3mm or less. In the embodiment, a tag body (110) made of an FR-4 PCB with a thickness of 0.2mm and a length × width of 55×3mm was used. As such, since the tag body (110) is formed as a micro-dielectric with a thin and long strip shape, it is possible to deform freely together with the rubber within the elastic deformation limit of the dielectric while embedded in rubber such as a tire.

[0053] The IC chip (120) is mounted on the center of the upper surface of the tag body (110). The IC chip (120) can be mounted on the tag body (110) in the form of a flip chip. When the IC chip (120) is mounted on the tag body (110) in the form of a flip chip, the wire bonding process is omitted and soldering is not required, thus simplifying the manufacturing process, and the connection portion between the IC chip (120) and the antenna pattern (130) can be connected with a conductor pattern to increase the connection reliability of the connection portion between the IC chip (120) and the antenna pattern.

[0054] The antenna pattern (130) has a pattern shape that is symmetrical with respect to the IC chip (120) and is electrically connected to the IC chip (120). That is, the antenna pattern (130) has one side formed along a first direction (left direction in the drawing) on ​​the tag body (110) and connected to the IC chip (120), and the other side formed along a second direction (right direction in the drawing), which is opposite to the first direction, and connected to the IC chip (120).

[0055] The antenna pattern (130) can be formed by attaching copper foil to the upper and lower surfaces of the tag body (110) and etching it, or by forming a seed layer and a plating layer on the upper and lower surfaces of the tag body (110) and then etching it. If a seed layer is formed on the upper and lower surfaces of the tag body (110) by sputtering, a plating layer is formed by copper plating on the seed layer, and then an antenna pattern is formed by etching, the bonding of the antenna pattern (130) to the tag body (110) is improved.

[0056] The antenna pattern (130) includes a helical pattern portion (134) formed in a helical shape on the tag body (110) and a double-sided pattern portion (135) formed symmetrically on the upper and lower surfaces of the tag body (110).

[0057] The helical pattern portion (134) is formed as a left-right symmetrical three-dimensional helical antenna to secure the maximum antenna length on the tag body (110) of limited size. This is to enable obtaining the maximum frequency characteristics required within the size of the limited tag body (110).

[0058] The spiral pattern portion (134) includes a plurality of first upper conductor patterns (134a), a plurality of first lower conductor patterns (134b), and a plurality of via holes (134c). A connecting plating layer is formed in the via holes (134c) to electrically connect the first upper conductor patterns (134a) and the first lower conductor patterns (134b).

[0059] The first upper conductor pattern (134a) of the spiral pattern portion (134) is formed in the form of a discontinuous planar conductor pattern on the upper surface of the tag body (110), and the first lower conductor pattern (134b) is formed in the form of a discontinuous planar conductor pattern on the lower surface of the tag body (110).

[0060] The via hole (134c) of the spiral pattern portion (134) is formed through the tag body (110), and a plurality of first upper conductor patterns (134a) and a plurality of first lower conductor patterns (134b) are electrically connected to form a spiral helical antenna pattern inside the tag body (110).

[0061] The spiral pattern section (134) has the advantage of reducing the width of the tag body (110) compared to the case where a zigzag pattern is formed on a flat surface by forming a spiral three-dimensional helical antenna pattern inside the tag body (110). When a zigzag pattern is formed on a flat surface, the width of the tag body (110) must be larger than that of the embodiment in order to secure the required antenna length in a limited area. Experimental results show that when a spiral antenna pattern is formed on the tag body (110), it is possible to form the width of the tag body (110) as 3mm, but when a zigzag pattern is formed on the surface where the IC chip is mounted, the width of the tag body must be secured to about 5mm to 10mm.

[0062] The double-sided pattern portion (135) has a continuous planar conductor pattern shape on the upper and lower surfaces of the tag body (110), respectively, and is formed symmetrically with respect to each other. The double-sided pattern portion (135) electrically connects the spiral pattern portion (134) and the IC chip (120) on the upper surface of the tag body (110), and also electrically connects the spiral pattern portion (134) and the IC chip (120) on the lower surface of the tag body (110).

[0063] The double-sided pattern portion (135) is basically formed with the same pattern line width as the spiral pattern portion (134). However, in the RFID tag (100), torsional stress and bending stress act relatively strongly on the outer part of the epoxy layer (210) applied to the IC chip (120), so in order to secure the antenna pattern rigidity in this part, the double-sided pattern portion (135) that partially overlaps with the epoxy layer (210) may be formed with a pattern line width larger than that of the spiral pattern portion (134).

[0064] The double-sided pattern portion (135) is formed at a position where its end overlaps with the epoxy layer (210) coated on the IC chip (120). The epoxy layer (210) is a coating layer formed to strengthen the adhesion between the IC chip (120) and the tag body (110). Since the epoxy layer (210) coated on the IC chip (120) changes into a hard physical property after curing, when an external force is applied to the RFID tag (100), stress is concentrated near the interface where the hard epoxy layer (210) and the relatively flexible tag body (110) meet, which can cause a crack on the antenna pattern.

[0065] For this reason, in the present invention, a double-sided pattern portion (135) is formed to partially overlap with the epoxy layer (210) at the outer end portion of the epoxy layer (210) where cracks are likely to occur, so that the double-sided pattern portion (135) connects the antenna pattern (130) and the IC chip (120) in a parallel circuit structure. This allows the RFID tag module (10) to perform normal operation stably without an electrical short circuit, even if cracks occur near the outer edge of the epoxy layer (210), by providing an electrical bypass path connecting the antenna pattern (130) and the IC chip (120).

[0066] The spiral pattern section (134) is formed in the form of a discontinuous planar conductor pattern on the upper and lower surfaces of the tag body (110), respectively, with the first upper conductor pattern (134a) and the first lower conductor pattern (134b) interconnected through a via hole (134c) to form a spiral antenna pattern structure on the tag body (110), whereas the double-sided pattern section (135) is formed in the form of a continuous planar conductor pattern on the upper and lower surfaces of the tag body (110), respectively, to form a double-sided antenna pattern structure that connects the spiral pattern section (134) and the IC chip (120) on the upper and lower surfaces of the tag body (110).

[0067] Specifically, the double-sided pattern portion (135) includes a second upper conductor pattern (135a) and a second lower conductor pattern (135b) that are connected to the spiral pattern portion (134) on the upper and lower surfaces, respectively, of the tag body (110).

[0068] The second upper conductor pattern (135a) is positioned between the first upper conductor pattern (134a) of the spiral pattern section (134) and the IC chip (120). The second upper conductor pattern (135a) is formed in the form of a continuous planar conductor pattern on the upper surface of the tag body (110) to electrically connect the first upper conductor pattern (134a) of the spiral pattern section (134) and the IC chip (120). At this time, the end of the second upper conductor pattern (135a) overlaps with the epoxy layer (210) coated on the IC chip (120). For example, the epoxy layer (210) can be coated so as to overlap with the reinforcing pattern (135d) up to the midpoint (L / 2) of the horizontal length (L) of the second upper conductor pattern (135a), as shown in FIG. 7.

[0069] The second lower conductor pattern (135b) is positioned between the first lower conductor pattern (134b) of the spiral pattern section (134) and the IC chip (120). The second lower conductor pattern (135b) is formed in the form of a continuous planar conductor pattern on the lower surface of the tag body (110) and electrically connects the first lower conductor pattern (134b) of the spiral pattern section (134) and the IC chip (120) through via holes. At this time, the second upper conductor pattern (135a) and the second lower conductor pattern (135b) form a symmetrical structure facing each other on the upper and lower surfaces of the tag body (110) and connect the spiral pattern section (134) and the IC chip (120) in a parallel circuit structure.

[0070] A plurality of via holes (135c) are formed in the tag body (110) to electrically connect the second upper conductor pattern (135a) and the second lower conductor pattern (135b). That is, the second upper conductor pattern (135a) and the second lower conductor pattern (135b) form a parallel circuit structure electrically connected through the plurality of via holes (135c).

[0071] As such, since the double-sided pattern section (135) has a second upper conductor pattern (135a) and a second lower conductor pattern (135b) having a continuous pattern shape, and these two sections connect the spiral pattern section (134) and the IC chip (120) in a parallel structure on the upper and lower surfaces of the tag body (110), even if a crack occurs due to twisting or bending stress in the conductor pattern section of either the second upper conductor pattern (135a) or the second lower conductor pattern (135b) and causes a short circuit, the spiral pattern section (134) and the IC chip (120) can be electrically connected through the other conductor pattern, so there is no hindrance to the normal operation of the RFID tag module (10).

[0072] In addition, a plurality of via holes (135c) formed on the tag body (110) are arranged at regular intervals along the second upper conductor pattern (135a) or the second lower conductor pattern (135b). Multiple via holes (135c) are formed at each bending point of the second upper conductor pattern (135a) and the second lower conductor pattern (135b), which are formed in a continuous zigzag pattern shape, so that the second upper conductor pattern (135a) and the second lower conductor pattern (135b) are electrically connected at each of the multiple locations where the multiple via holes (135c) are formed, thereby ensuring that the electrical connection between the spiral pattern part (134) and the IC chip (120) is stably maintained even if a short circuit occurs in a specific part of either the second upper conductor pattern (135a) or the second lower conductor pattern (135b), thereby preventing the RFID tag module (10) from being rendered inoperable.

[0073] Meanwhile, the RFID tag (100) includes an epoxy layer (210) that surrounds the portion of the IC chip (120) mounted on the tag body (110). The epoxy layer (210) is a layer formed by applying and curing epoxy to the portion of the IC chip (120) to increase the bonding strength between the tag body (110) and the IC chip (120).

[0074] Thermosetting epoxy resin may be used as the epoxy forming the epoxy layer (210). Thermosetting epoxy resin has adhesive properties that increase the bonding strength between the IC chip (120) and the tag body (110), has excellent thermal durability, is easy to use in high-temperature applications, and has excellent heat resistance and chemical resistance.

[0075] The epoxy layer (210) can be formed to completely surround the IC chip (120) and partially surround the second upper conductor pattern (135a) of the double-sided pattern portion (135) located on the left and right sides. At this time, the epoxy layer (210) can be formed with a length of 8 mm to 12 mm and a thickness of 0.5 mm to 1 mm.

[0076] In this case, cost reduction can be achieved by reducing the amount of epoxy applied and forming an epoxy layer (210) by applying epoxy only to a limited portion of the area around the IC chip (120) instead of applying epoxy to the entire surface of the tag body (110).

[0077] The epoxy layer (210) may be formed only on the upper side of the tag body (110) where the IC chip (120) is located, as shown in FIG. 2, or may be formed on both opposing sides of the tag body (110), as shown in FIG. 7. In this case, the epoxy layer (210) may be symmetrically arranged facing each other on the upper and lower surfaces of the tag body (110) where the IC chip (120) is located, as shown in FIG. 7.

[0078] In this way, when the epoxy layer (210) is formed on the upper and lower surfaces of the tag body (110) in a manner facing each other, the balance of forces on both sides of the epoxy-coated RFID tag (100) is stably maintained, so that even if torsional stress or bending stress is applied in the area where the epoxy layer (210) is formed, it is not easily damaged, thereby greatly improving durability.

[0079] In the area of ​​the tag body (110) where the epoxy layer (210) is formed, one or more through holes (112) that vertically penetrate the tag body (110) may be formed. Unlike via holes (134c, 135c) formed in the antenna pattern (130), the through holes (112) form a simple hole structure in which a connecting plating for electrical connection is not formed inside the hole. The through holes (112) may be formed with a diameter of 0.5 to 3 mm, but preferably, they may be formed to have a small diameter of 0.5 mm.

[0080] In this way, epoxy is filled into the through hole (112) during the coating process of the IC chip (120) to interconnect the epoxy layer (210) located on the upper side of the tag body (110) and the epoxy layer (210) located on the lower side, thereby increasing the adhesive strength of the epoxy layer (210) coated on both sides of the tag body (110). That is, the epoxy filled into the through hole (112) of the tag body (110) hardens to interconnect the epoxy layers (210) on the upper and lower sides of the tag body (110), thereby greatly improving the bonding strength between the tag body (110) and the epoxy layer (210).

[0081] Through holes (112) can be formed in a plurality of symmetrically arranged forms in the area where the IC chip (120) is mounted. For example, as shown in the embodiment of FIGS. 4 and FIGS. 5, four through holes (112) can be formed in a rectangular arrangement in the central area of ​​the tag body (110) where the IC chip (120) is mounted. As a result of forming a plurality of through holes (112) symmetrically arranged in the IC chip (120) mounting area, the force holding the upper and lower epoxy layers (210) together is balanced at multiple locations, thereby making the bonding force between the upper and lower epoxy layers (210) more robust.

[0082] Meanwhile, FIG. 8 is a plan view showing a modified example of an antenna pattern formed on a tag body in an RFID tag module according to the present invention.

[0083] Referring to FIG. 8, the double-sided pattern portion (135) of the RFID tag according to the modified example may further include a reinforcing pattern (135d) having a line width greater than the pattern line width of the spiral pattern portion (134) and an end that overlaps with the epoxy layer (210).

[0084] That is, the double-sided pattern portion (135) forms a structure in which a part of the second upper conductor pattern (135a) shown in the embodiment of FIG. 4 described above is replaced by a reinforcing pattern (135d). Accordingly, the double-sided pattern portion (135) can be formed in a form including the second upper conductor pattern (135a) and the reinforcing pattern (135d).

[0085] The reinforcing pattern (135d) in the double-sided pattern section (135) is formed to reinforce the antenna pattern (130) portion at a location where torsional stress or bending stress acts relatively heavily on the RFID tag module (10).

[0086] As mentioned earlier, the epoxy layer (210) formed by coating the tag body (110) after the antenna pattern (130) is formed hardens after coating. Therefore, when torsional stress or bending stress is applied to the RFID tag (100), a relatively large amount of stress is concentrated near the boundary between the hard epoxy layer (210) and the flexible tag body (110), and a crack may occur in the tag body (110) or the antenna pattern (130).

[0087] For this reason, in order to prevent cracking of the antenna pattern (130), a reinforcing pattern (135d) is formed in a shape that partially overlaps with the epoxy layer (210) at the outer end portion of the epoxy layer (210) where torsional stress or bending stress acts significantly. The reinforcing pattern (135d) is formed with a shape in which the line width of the pattern is greatly expanded compared to the second upper conductor pattern (135a), so that even if torsional stress or bending stress is repeatedly applied to the reinforcing pattern (135d), the reinforcing pattern (135d) does not easily break or short-circuit.

[0088] The reinforcing pattern (135d) can be formed in a rectangular shape as shown in the embodiment of FIG. 8. That is, the reinforcing pattern (135d) can be formed in a rectangular shape with a horizontal width parallel to the length direction of the tag body (110) being larger than the vertical width perpendicular to the length direction of the tag body (110).

[0089] As previously mentioned, since the second upper conductor pattern (135a) and the second lower conductor pattern (135b) constituting the double-sided pattern portion (135) are formed in a parallel structure symmetrically on both sides (upper and lower surfaces) of the tag body (110), the reinforcing pattern (135d) can also be arranged symmetrically on both opposing sides (upper and lower surfaces) of the tag body (110).

[0090] That is, the reinforcing pattern (135d) disposed on the upper surface of the tag body (110) electrically connects the second upper conductor pattern (135a) of the double-sided pattern portion (135) and the IC chip (120), and the reinforcing pattern (135d) disposed on the lower surface of the tag body (110) electrically connects the second lower conductor pattern (135b) of the double-sided pattern portion (135) and the IC chip (120).

[0091] In addition, a plurality of via holes (135c) may be formed in the tag body (110) to electrically connect a reinforcing pattern (135d) formed on the upper surface of the tag body (110) and a reinforcing pattern (135d) formed on the lower surface.

[0092] Additionally, the reinforcement pattern (135d) may include an extension (135e) formed extending away from the IC chip (120). In this case, some of the plurality of via holes (135c) formed in the tag body (110) may electrically connect the extensions (135e) of the upper and lower reinforcement patterns (135d) of the tag body (110).

[0093] In this way, as a reinforcing pattern (135d) having a rectangular tube pattern shape is formed on the outer part of the epoxy layer (210) where torsional stress or bending stress acts relatively strongly in the RFID tag (100), the durability of the antenna pattern (130) and the tag body (110) can be increased even when torsional stress or bending stress is applied, thereby improving the reliability of the RFID tag module (10) product.

[0094] In addition, the reinforcement pattern (135d) has a continuous pattern shape and connects the spiral pattern section (134) and the IC chip (120) in a parallel structure at the top and bottom of the tag body (110), so that even if one of the reinforcement patterns (135d) is damaged, the electrical connection between the spiral pattern section (134) and the IC chip (120) is continuously maintained through the other reinforcement pattern (135d), thereby enabling normal operation of the RFID tag module (10).

[0095] In addition, one or more through holes (112) penetrating the tag body (110) may be formed in the area of ​​the tag body (110) where the epoxy layer (210) is formed. In this case, the through holes (112) may be placed in an area overlapping with the reinforcement pattern (135d) as shown in FIG. 8. That is, the through holes (112) may be placed in the inner area of ​​the reinforcement pattern (135d). In this case, a through hole communicating with the through hole (112) may also be formed in the reinforcement pattern (135d) in correspondence with the through hole (112) formed in the tag body (110). Accordingly, when coating with epoxy, the epoxy seeps in and fills through the through hole of the reinforcing pattern (135d) and the through hole (112) of the tag body (110), thereby connecting the upper and lower epoxy layers (210) of the tag body (110) to each other and increasing the bonding strength between the tag body (110) and the epoxy layers (210).

[0096] In the modified example of FIG. 8, a structure in which a reinforcing pattern (135d) is formed on both the upper and lower surfaces of the tag body (110) is described as an example; however, it is also possible to form the reinforcing pattern (135d) only on the upper surface portion of the tag body (110) where the IC chip (120) is mounted. In this case, the epoxy layer (210) may be formed only on the upper surface of the tag body (110).

[0097] FIG. 9 shows another variation of the antenna pattern formed on the tag body in the RFID tag module according to the present invention.

[0098] An antenna pattern (130) according to another variant example shown in FIG. 9 shows a form in which the second upper conductor pattern (135a) and the second lower conductor pattern (135b) are removed from the double-sided pattern section (135) structure of FIG. 8 described above, and the double-sided pattern section (135) is composed only of the reinforcing pattern (135d).

[0099] That is, the double-sided pattern portion (135) according to another variation example shown in FIG. 9 has a structure in which the spiral pattern portion (134) and the IC chip (120) are connected in parallel only by a pair of reinforcing patterns (135d) formed on the upper and lower surfaces, respectively, of the tag body (110).

[0100] In this case, the reinforcement pattern (135d) may be formed in the shape of a rectangular tube pattern in which the horizontal width parallel to the longitudinal direction of the tag body (110) is smaller than the vertical width perpendicular to the longitudinal direction of the tag body (110). At this time, the reinforcement pattern (135d) may be formed within the range of a horizontal width of 1.5mm to 2.5mm and a vertical width of 2.0mm to 3.0mm, and preferably, the reinforcement pattern (135d) may be formed in the shape of a rectangular tube pattern with a horizontal width of 2mm and a vertical width of 2.6mm.

[0101] A plurality of via holes (135c) may be formed in the tag body (110) to electrically connect the reinforcing pattern (135d) on the upper surface of the tag body (110) and the reinforcing pattern (135d) on the lower surface. At this time, some of the plurality of via holes (135c) may be arranged symmetrically within the reinforcing pattern (135d). For example, as shown in FIG. 9, four via holes (135c) may be arranged symmetrically by being placed in each corner area of ​​the reinforcing pattern (135d) having a square shape.

[0102] Figure 10 illustrates another example of a variation of the antenna pattern shown in Figure 9.

[0103] Referring to FIG. 10, the epoxy layer (210) in the RFID tag can be coated so as to overlap with the reinforcement pattern (135d) up to the midpoint of the width (W) of the reinforcement pattern (135d). That is, the epoxy layer (210) can be coated on the upper surface of the tag body (110) in a manner that is applied up to the midpoint (1 / 2) of the width (W) of the reinforcement pattern (135d) in a direction away from the IC chip (120).

[0104] When formed in this way, even if torsional stress or bending stress is concentrated in the outer part of the hardened epoxy layer (210), the stress can be stably supported at the middle point of the reinforcing pattern (135d) having a solid pattern shape, so the risk of crack occurrence in the reinforcing pattern (135d) area is significantly reduced.

[0105] Additionally, the reinforcement pattern (135d) can be formed symmetrically on both opposing sides of the tag body (110). That is, the reinforcement pattern (135d) is formed symmetrically on the upper and lower surfaces facing each other on the tag body (110) so as to connect the spiral pattern portion (134) and the IC chip (120) in a parallel structure.

[0106] In addition, a plurality of via holes (135c) may be formed in the tag body (110) to interconnect the upper and lower reinforcing patterns (135d). Accordingly, the reinforcing pattern (135d) formed on the upper surface of the tag body (110) can be electrically connected to the reinforcing pattern (135d) formed on the lower surface through the plurality of via holes (135c). In the embodiment, four via holes (135c) are arranged at the corner portions of the square-shaped reinforcing pattern (135d), and a structure is shown in which the holes are arranged in a square shape corresponding to the shape of the reinforcing pattern (135d).

[0107] The reinforcement pattern (135d) may include an extension portion (135e) formed extending a certain distance away from the IC chip (120). The extension portion (135e) of the reinforcement pattern (135d) formed on the upper surface of the tag body (110) may be electrically connected to the extension portion (135e) of the reinforcement pattern (135d) formed on the lower surface through a via hole (135c).

[0108] In this way, reinforcing patterns (135d) are formed symmetrically on the upper and lower surfaces of the tag body (110), and the reinforcing patterns (135d) on both the upper and lower sides are electrically connected through via holes (135c), so that even if damage occurs to one of the reinforcing patterns, stable operation can be achieved through the other reinforcing pattern.

[0109] Additionally, the reinforcement pattern (135d) may have an open slit formed at the midpoint (1 / 2) of the horizontal width (W) parallel to the longitudinal direction of the tag body (110). The slit (135f) refers to a portion formed by cutting out a part of the reinforcement pattern (135d) so that the surface of the tag body (110) is exposed to the outside. This slit (135f) may be formed during the process of forming an antenna pattern (130) by attaching and etching a copper foil to the tag body (110).

[0110] In this case, a pair of slits (135f) may be formed symmetrically with each other in a vertical direction perpendicular to the longitudinal direction of the tag body (110) at the midpoint (1 / 2) of the horizontal width (W) of the reinforcing pattern (135d). For example, the slits (135f) may be formed with a length of 0.5 mm on both opposing sides of the reinforcing pattern (135d).

[0111] In this way, by forming a pair of slits (135f) facing each other at the midpoint of the reinforcing pattern (135d), the RFID tag (100) can bend smoothly by exhibiting more flexible elastic behavior starting from the midpoint (1 / 2) of the reinforcing pattern (135d) where the slits (135f) are formed, so the formation of a reinforcing pattern in the shape of a solid pattern does not hinder the smooth bending operation of the RFID tag module.

[0112] Meanwhile, in the case of conventional RFID tags, it was common practice to coat the area around the IC chip with epoxy to protect it and to apply an additional coating of PSR (Photo Solder Resist) to prevent corrosion of the copper (Cu)-plated antenna pattern.

[0113] However, since PSR coated on RFID tags has the property of hardening like epoxy, cracks occur in the hardened PSR coating layer at the outer edges of the epoxy layer where relatively high stress is applied during a bending test. Consequently, cracks also occur in the antenna pattern bonded to the PSR coating layer, causing the antenna pattern's circuit to short-circuit and thereby degrading the reliability of the RFID tag product.

[0114] For this reason, in the present invention, instead of applying a conventional PSR coating to the tag body (110) on which the antenna pattern (130) is formed, gold (Au) plating is performed through electroplating on the copper (Cu) plated antenna pattern (130) to prevent the antenna pattern (130) from corroding. That is, when torsional stress or bending stress is applied to an RFID tag coated with PSR, the hardened PSR coating layer breaks, and the antenna pattern bonded thereto is also affected, which can cause cracks to occur; therefore, the RFID tag module according to the embodiment of the present invention does not apply a PSR coating to prevent corrosion of the antenna pattern as in the conventional method, but instead applies gold (Au) plating on the antenna pattern (130).

[0115] However, since gold plating of the entire antenna pattern (130) may act as a factor that increases the unit price of the product, only the spiral pattern portion (134) of the antenna pattern (130), which is far from the IC chip (120) where epoxy is coated and where relatively small stress is applied, is coated with PSR, and only the double-sided pattern portion (135) of the antenna pattern (130) that is close to the IC chip (120) is gold (Au) plated, thereby reducing the amount of gold used to plate the antenna pattern (130) and suppressing the increase in the unit price of the product.

[0116] As another method to prevent cracks occurring in the antenna pattern (130), the structural rigidity of the antenna pattern can be improved by increasing the overall thickness and line width of the antenna pattern (130). For example, the antenna pattern (130) can be composed only of a spiral pattern portion (134) without the double-sided pattern portion (135) of the aforementioned type, and the overall thickness of the antenna pattern (130) can be increased by two times compared to the existing one, and the line width of the antenna pattern (130) can be increased by two times compared to the existing one, thereby increasing the overall rigidity of the antenna pattern (130) and preventing cracks from occurring in the antenna pattern (130). For example, by increasing the line width of the antenna pattern (130) from the existing 200㎛ line width to 400㎛ line width and increasing the thickness of the antenna pattern (130) from the existing 1 / 2 oz (35㎛) thickness to 1 oz (70㎛) thickness, the overall rigidity of the antenna pattern (130) can be increased, thereby increasing durability against torsional stress or bending stress.

[0117] Meanwhile, the RFID tag (100) of the present invention having the above-described configuration is wrapped in a rubber material to maintain a strong bonding force with an object without any foreign sensation when embedded in rubber such as a tire, and is manufactured into a final RFID tag module (10).

[0118] To this end, the RFID tag module (10) of the present invention may include a primer layer (220) coated over the entire outer surface of the RFID tag (100) and a rubber layer (230) coated over the entire outer surface of the primer layer (220).

[0119] The primer layer (220) can be coated over the entire outer surface of the RFID tag (100) coated with an epoxy layer (210) after the antenna pattern (130) and IC chip (120) are mounted. The primer layer (220) is formed by applying (or coating) a liquid primer to a certain thickness on the RFID tag (100) before forming the rubber layer (230) to increase the bonding strength between the RFID tag (100) and the rubber layer (230).

[0120] The primer layer (220) may include an adhesion promoter component and forms an adhesive layer coating on the surface of the RFID tag (100) to increase the bonding strength between the RFID tag (100) and the rubber layer (230) and protect the surface of the RFID tag (100) from corrosion or physical impact.

[0121] The rubber layer (230) is coated over the entire RFID tag (100) coated with a primer. That is, the rubber layer (230) is formed by applying (or coating) liquid rubber to a certain thickness over the entire RFID tag (100) coated with a primer. Since the rubber layer (230) is formed from the same material as the tire, which is made of rubber, it can provide high bonding strength without any sense of incompatibility when combined with the tire.

[0122] In this way, the RFID tag module (10) is formed with a structure in which an epoxy layer (210) protecting the IC chip (120) is coated, and a primer layer (220) and a rubber layer (230) are laminated, with a liquid primer and a liquid rubber sequentially coated over the entire RFID tag (100) coated with the epoxy layer (210), thereby increasing the bonding strength when embedded in rubber such as a tire. In this case, the primer layer (220) increases the bonding strength between the RFID tag (100) and the rubber layer (230), and consequently, the bonding strength between the RFID tag (100) and the rubber tire can be increased.

[0123] In addition, by forming a primer layer (220) and / or a rubber layer (230) laminated over the entire RFID tag (100), the surface of the RFID tag (100) is protected from corrosion or physical impact, and the RFID tag module (10) is stably maintained inside the tire, thereby increasing the operational reliability of the RFID tag.

[0124] The rubber layer (230) insulates and protects the RFID tag (100) and improves the bonding strength with the rubber when the RFID tag (100) is embedded in rubber, such as a tire. Additionally, the rubber layer (230) facilitates the insertion of the RFID tag (100) into a rubber material member, such as a tire. For example, the rubber layer (230) covering the entire RFID tag (100) can be topped onto the side wall of the tire during the vulcanization process. Topping means that the rubber layer (230) is molded integrally with the side wall of the tire during the vulcanization process. The side wall of the tire refers to the side portion of the tire between the tread and the bead and is composed of a thick rubber layer.

[0125] The sidewall of the tire is made of a rubber layer, so the molding of the rubber layer (230) surrounding the RFID tag (100) is easy and does not affect radio wave characteristics, making it a location where the RFID tag is easily recognized. In addition, the sidewall of the tire is a location where there is no deformation or damage to the tire caused by the RFID tag (100) when the tire equipped with the RFID tag (100) travels at high speed.

[0126] The rubber layer (230) may be composed of at least one of natural rubber (NR), SBR, MBR, CR, EPDM, or a mixture thereof. For example, since tires use synthetic rubber such as natural rubber (NR), SBR, MBR, CR, and EPDM, the rubber layer (230) may also use synthetic rubber such as natural rubber (NR), SBR, MBR, CR, and EPDM, which are the main raw materials of the tire, to improve bonding with the tire.

[0127] Instead of the rubber layer (230), the RFID tag (100) may be wrapped with various non-conductive polymers. For example, the RFID tag (100) may be wrapped with a non-conductive polymer containing an adhesive, and then the non-conductive polymer may be melted and bonded with the rubber member using a vulcanization process, thereby embedding the RFID tag (100) in the rubber member. However, as in the example, when embedding the RFID tag (100) in a tire, wrapping the RFID tag (100) with a rubber layer (230) of the same material as the tire is effective for improving bonding strength.

[0128] In the embodiment, the RFID tag (100) can be manufactured to be narrow up to 3 mm in width. That is, the RFID tag (100) can be manufactured in the form of an antenna pattern (130) including an IC chip (120) and a double-sided pattern portion (135) formed on an FR-4 PCB tag body (110) having a thickness of 0.2 mm and a width × height of 55 × 3 mm.

[0129] Since the tag body (110) is manufactured with an FR-4 PCB having a thickness of 0.2 mm, it improves flexibility when inserted into a tire, so it does not affect the performance of the tire. Of course, the RFID tag (100) can also be manufactured in the form of an FPCB having an antenna pattern (130) including the aforementioned double-sided pattern portion (135). In addition, the RFID tag module (10) can strengthen the adhesion strength between the RFID tag module (10) and a rubber member such as a tire by applying a primer coating to the outer surface of the RFID tag (100) and then coating liquid rubber on top of it.

[0130] Meanwhile, FIG. 11 is a process diagram sequentially explaining the main manufacturing process of an RFID tag module according to an embodiment of the present invention.

[0131] Referring to FIG. 11, a method for manufacturing an RFID tag module (10) according to an embodiment of the present invention first forms an antenna pattern (130) having a spiral pattern portion (134) and a double-sided pattern portion (135) on a tag body (110). (S1)

[0132] The tag body (110) may be made of an FR-4 PCB or FPCB with a shape in which the length is longer than the width. In the embodiment, the tag body (110) made of an FR-4 PCB was manufactured as an RFID tag (100) with a thickness of 0.2 mm and a length × width of 55 × 3 mm.

[0133] The antenna pattern (130) can be formed as an antenna pattern in which a first upper conductor pattern (134a) and a first lower conductor pattern (134b) having a discontinuous pattern structure are connected through a via hole (134c) to form a helical spiral pattern portion (134), and a second upper conductor pattern (135a) and a second lower conductor pattern (135b) forming a continuous pattern structure are connected through a via hole (135c) to form a double-sided pattern portion (135). At this time, the diameter of the via holes (134c, 135c) can be formed to be 0.1mm.

[0134] In this case, the antenna pattern (130) can be formed by attaching copper foil to the upper and lower surfaces of the tag body (110) and etching it. Alternatively, it can be formed by forming a seed layer and a copper foil plating layer on the upper and lower surfaces of the tag body (110) and then etching them. In this way, the antenna pattern (130) formed on the tag body (110) can be formed into an antenna pattern (130) structure in the form of various embodiments shown in FIGS. 1 to 10.

[0135] When the process of step S1, which involves forming an antenna pattern (130) on the tag body (110), is completed, gold (Au) plating is then performed on the antenna pattern (130) to prevent corrosion. (S2)

[0136] In step S2, instead of applying a conventional PSR coating to the tag body (110) on which the antenna pattern (130) is formed, gold (Au) plating is performed through electroplating on the copper (Cu) plated antenna pattern (130) to form a gold plating film on the antenna pattern, thereby preventing the antenna pattern (130) from corroding.

[0137] In this case, instead of gold-plating the entire antenna pattern (130), only a part of the antenna pattern (130) may be gold-plated. For example, the spiral pattern portion (134) of the antenna pattern (130) may be coated with PSR, and only the double-sided pattern portion (135) may be gold-plated (Au), thereby reducing the amount of gold used to plate the antenna pattern (130) and suppressing the increase in the unit price of the product.

[0138] When the gold (Au) plating process of step S2 is completely finished, next, an IC chip (120) is mounted on the tag body (110) to be connected to the antenna pattern (130) (S3).

[0139] In step S3, the IC chip (120) is mounted on the tag body (110) in the form of a flip chip, and the IC chip (120) and the antenna pattern (130) are connected by a conductor pattern, thereby increasing the connection reliability of the connection portion between the IC chip (120) and the antenna pattern, and simplifying the manufacturing process by omitting the existing wire bonding process.

[0140] When the IC chip (120) mounting process of step S3 above is completed, next, epoxy is applied to the IC chip (120) to form an epoxy layer (210) on the surface of the tag body (110) on which the IC chip (120) is mounted (S4).

[0141] In step S4, the epoxy layer (210) can be formed to partially overlap with the double-sided pattern portion (135) of the antenna pattern (130). For example, the epoxy layer (210) can be formed on the tag body (110) with a size of 10 mm in width and 3 mm in height.

[0142] In this case, the epoxy layer (210) can be formed by applying a thermosetting epoxy resin along the side perimeter of the IC chip (120) mounted on the tag body (110). In this case, the epoxy layer (210) can be formed by applying a liquid epoxy resin onto the IC chip (120) using a dedicated syringe, or by applying a liquid epoxy resin to the outer surface of the IC chip (120) with a certain thickness using a spray and then curing it at 100°C for about 30 minutes.

[0143] The epoxy layer (210) may be formed by applying a thermosetting epoxy resin to the upper surface portion, including the perimeter of the side of the IC chip (120). That is, the epoxy layer (210) can be formed to completely envelop the IC chip (120). By forming the epoxy layer (210) in a way that completely envelops the IC chip (120) by applying epoxy to the upper surface portion, including the side of the IC chip (120), the adhesive strength between the tag body (110) and the IC chip (120) can be significantly improved. In this way, since the RFID tag module (10) forms the epoxy layer by applying epoxy only around the IC chip (120) rather than applying it to the entire tag body (110), the amount of epoxy applied can be reduced, thereby achieving cost savings.

[0144] The epoxy layer (210) is formed to partially overlap with the double-sided pattern portion (135) of the antenna pattern (130). When formed in this way, when an external force is applied, stress is repeatedly applied to the outer edge of the cured epoxy layer (210), so that even if one of the upper and lower conductor patterns of the double-sided pattern portion (135) is short-circuited, the other conductor pattern can normally connect the spiral pattern portion (134) and the IC chip (120), thereby enabling normal operation of the RFID tag module (10).

[0145] In addition, even in the case of a type in which a reinforcing pattern (135d) in the shape of a through pattern that partially overlaps with the epoxy layer (210) is formed on the double-sided pattern portion (135), even if a large stress is repeatedly applied to the outer edge of the epoxy layer (210), the possibility of a crack occurring in the entire reinforcing pattern (135d) in the shape of a through pattern becomes extremely low, thereby suppressing the short circuit of the antenna pattern, and thus, no hindrance is caused to the normal operation of the RFID tag module.

[0146] Additionally, in step S4, the epoxy layer (210) may be formed symmetrically on both the upper and lower surfaces facing each other of the tag body (110). When formed in this manner, the balance of forces on both sides of the RFID tag (100) on which the epoxy layer (210) is formed is stably maintained, so that even if torsional stress or bending stress is applied to the area where the epoxy layer is formed, it does not break easily, thereby greatly improving durability.

[0147] When the process of step S, which involves forming an epoxy layer (210) on the tag body (110), is completed, next, in step S5, a liquid primer is applied (or coated) to the entire outer surface of the RFID tag (100) on which the epoxy layer (210) is formed to form a primer layer (220).

[0148] At this time, prior to forming a primer layer (220) on the RFID tag (100), the outer surface of the RFID tag (100) is washed using a washing machine and then dried using a dryer for a certain period of time. In this case, MEK or ACETONE solution may be used as the washing solution, and after washing is completed, the tag may be dried in a dryer at a temperature of 60°C or higher for 3 minutes.

[0149] In this way, the cleaning and drying of the outer surface of the RFID tag (100) are completed. Next, a liquid primer is applied to the outer surface of the RFID tag (100) to a certain thickness, and then dried in a dryer for a certain period of time to form a primer layer (220) over the entire outer surface of the RFID tag (100). At this time, a liquid primer of the polyolefin type may be used, and the color of the primer may be black, which is the same as the color of rubber.

[0150] A liquid primer can be applied to the upper and lower surfaces of an RFID tag (100) with a thickness of 10 to 25 μm (preferably 10 μm) using a spray or dipping device, and then the RFID tag (100) with the primer applied can be dried at a temperature of 60 to 80°C for at least 10 minutes.

[0151] Next, in step S6, liquid rubber is applied (or coated) over the entire outer surface of the RFID tag (100) on which the primer layer (220) is formed to form a rubber layer (230).

[0152] In step S6, which involves forming a rubber layer (230) on an RFID tag (100), a black liquid synthetic rubber solution is applied to the outer surface of the RFID tag (100) that has been dried after the primer has been applied, using a spray or dipping device to a thickness of 12 to 25 μm (preferably 10 μm), and then the RFID tag (100) with the rubber solution applied is dried at a temperature of 80 to 100°C for at least 24 hours.

[0153] In this way, an RFID tag module (10) can be completed in which a primer layer (220) and a rubber layer (230) are sequentially laminated and formed on the outer surface of the RFID tag (100) through a process of sequentially applying and drying a liquid primer and a liquid rubber on the outer surface of the RFID tag (100).

[0154] When the RFID tag module (10) manufactured through the above steps S1 to S6 is produced in the form of an actual product, multiple RFID tag modules (10) can be produced quickly and easily by performing primer coating and rubber coating operations only once in succession on multiple RFID tags (100) having an epoxy layer (210) formed on the outer surface of the IC chip (120).

[0155] In this way, the RFID tag module (10) finally manufactured can stably protect the antenna pattern and IC chip because the primer layer (220) and rubber layer (230) applied to the RFID tag (100) surround and protect the entire RFID tag (100) in which an epoxy layer (210) is formed around the IC chip (120). In addition, the epoxy layer (210) coated on the IC chip (120) increases the adhesion of the primer layer (220) and the rubber layer (230), thereby stably maintaining the state of being wrapped around the entire RFID tag (100), and further increases the adhesion between the tag body (110) and the IC chip (120) as the epoxy layer (210) hardens by heat during the tire vulcanization process.

[0156] The outermost rubber layer (230) surrounding the RFID tag (100) in the RFID tag module (10) is topped onto and integrated with the side wall of the tire during the vulcanization process. The tire is completed through four main processes: refining, semi-finished product (extrusion, rolling, bead), molding, and vulcanization. In the molding process, it is made into a cylindrical shape like a tire, and through the vulcanization process, which applies heat and pressure, a tread is formed and the tire is completed.

[0157] In the vulcanization process, a flexible tire that has undergone molding is placed between an upper mold and a lower mold, and heat and pressure are applied. During this process, the rubber layer (230) that wraps the RFID tag (100) in the rubber layer of the side wall is melted and bonded, thereby forming a molded state integrated with the rubber layer of the tire and enabling a strong bond.

[0158] The RFID tag module (10) of the present invention described above is mounted on the side wall of a tire and embedded in an integrated form within the side wall of the tire, so that it can be read and recognized in a contact- or contactless manner using an RFID reader. This can be applied to history management and distribution management for summer tires and winter tires.

[0159] In addition, since the RFID tag (100) is manufactured with a micro-structure having a thickness of 0.2 mm and a width × height of 55 × 3 mm, it does not significantly affect the appearance and function of the tire when embedded in the tire.

[0160] Although the RFID tag module (10) of the present invention described above was explained as being integrated and embedded in the sidewall of a tire during the vulcanization process, it can be applied to various rubber products in the case of a structure that is integrated by molding while melting by applying heat and pressure.

[0161] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Explanation of the symbols

[0162] 10: RFID tag module 100: RFID tag 110: Tag body 112: Through hole 120: IC chip 130: Antenna pattern 134: Spiral pattern section 134a: First upper conductor pattern 134b: First lower conductor pattern 134c, 135c: Via holes 135: Double-sided pattern section 135a: Second upper conductor pattern 135b: Second subconductor pattern 135d: Reinforcement pattern 135e: Extension 135f: Slit 137: Through hole 210: Epoxy layer 220: Primer layer 230: Rubber layer

Claims

Claim 1 An RFID tag module comprising: a tag body, an antenna pattern, and an IC chip; and an epoxy layer coated on the IC chip; wherein the antenna pattern comprises a helical pattern portion formed in a helical shape on the tag body and a double-sided pattern portion formed in a continuous planar conductor pattern shape on the upper and lower surfaces of the tag body, respectively, and electrically connecting the helical pattern portion and the IC chip, wherein the planar conductor patterns formed on the upper and lower surfaces of the tag body are electrically connected to each other through a plurality of via holes to connect the helical pattern portion and the IC chip in a parallel circuit structure, and the outer edge portion of the epoxy layer is formed to overlap the double-sided pattern portion. Claim 2 An RFID tag module according to claim 1, wherein the spiral pattern portion comprises a first upper conductor pattern and a first lower conductor pattern formed in the form of discontinuous planar conductor patterns on the upper and lower surfaces of the tag body, respectively, and a via hole formed in the tag body to electrically connect the first upper conductor pattern and the first lower conductor pattern. Claim 3 An RFID tag module according to claim 1, wherein the double-sided pattern portion comprises a second upper conductor pattern formed in the form of a continuous planar conductor pattern on the upper surface of the tag body and disposed between the spiral pattern portion and the IC chip, and a second lower conductor pattern formed in the form of a continuous planar conductor pattern on the lower surface of the tag body and disposed between the spiral pattern portion and the IC chip. Claim 4 An RFID tag module according to paragraph 3, wherein the plurality of via holes electrically connect the second upper conductor pattern formed on the upper surface of the tag body and the second lower conductor pattern formed on the lower surface. Claim 5 An RFID tag module according to claim 4, wherein the plurality of via holes are arranged and formed at regular intervals along the second upper conductor pattern or the second lower conductor pattern. Claim 6 An RFID tag module according to claim 1, wherein the pattern line width of the double-sided pattern portion is formed to be larger than the pattern line width of the spiral pattern. Claim 7 An RFID tag module according to paragraph 3, wherein the outer end portion of the epoxy layer is formed to overlap with the second upper conductor pattern. Claim 8 An RFID tag module according to claim 1, wherein the epoxy layer is formed on both opposing sides of the tag body. Claim 9 An RFID tag module according to claim 8, wherein one or more through holes penetrating the tag body are formed in the region of the tag body where the epoxy layer is formed, and the through holes are filled with epoxy to interconnect the epoxy layers on both sides of the tag body. Claim 10 An RFID tag module according to claim 1, wherein the double-sided pattern portion includes a reinforcing pattern that overlaps with the outer edge portion of the epoxy layer while having a line width greater than the pattern line width of the spiral pattern portion. Claim 11 In item 10, the above reinforcement pattern is an RFID tag module having a square shape. Claim 12 In claim 10, the above reinforcement pattern is an RFID tag module arranged symmetrically on both opposing sides of the tag body. Claim 13 An RFID tag module according to claim 12, wherein a reinforcing pattern disposed on the upper surface of the tag body electrically connects the second upper conductor pattern of the double-sided pattern portion and the IC chip, and a reinforcing pattern disposed on the lower surface of the tag body electrically connects the second lower conductor pattern of the double-sided pattern portion and the IC chip. Claim 14 An RFID tag module according to claim 12, wherein via holes are formed to electrically connect each reinforcing pattern disposed on the upper and lower surfaces of the tag body. Claim 15 An RFID tag module according to claim 10, wherein one or more through holes penetrating the tag body are formed in the area of ​​the tag body where the epoxy layer is formed, and the through holes are formed in an area overlapping with the reinforcing pattern. Claim 16 An RFID tag module according to claim 10, wherein the epoxy layer overlaps with the reinforcing pattern up to the midpoint of the width of the reinforcing pattern. Claim 17 An RFID tag module according to claim 12, wherein the reinforcement pattern includes an extension formed extending away from the IC chip, and the tag body has via holes formed to electrically connect each extension of the upper and lower reinforcement patterns of the tag body. Claim 18 In item 10, the above reinforcement pattern is an RFID tag module having a slit formed at the midpoint of the horizontal width of the above reinforcement pattern. Claim 19 An RFID tag module according to claim 18, wherein the slits are arranged symmetrically with respect to each other in a vertical direction perpendicular to the longitudinal direction of the tag body. Claim 20 In claim 1, the antenna pattern is a gold (Au) plated RFID tag module.

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