Driving apparatus of image sensor

Abstract

An image sensor substrate according to an embodiment comprises: an image sensor including a plurality of connection pins; and a substrate having an open area formed in an area where the image sensor is disposed and a terminal connected to the plurality of connection pins of the image sensor, wherein the number of connection pins of the image sensor is greater than the number of terminals of the substrate, and one surface of the substrate includes a first area and a second area facing in a first direction with the open area in between, and a third area and a fourth area facing in a second direction different from the first direction with the open area in between, and the number of terminals disposed in each of the first to fourth areas is the same.

Description

Technology Field

[0001] An embodiment relates to an image sensor driving device and a camera device including the same. Background Technology

[0002] As the distribution of various mobile devices has become widespread and wireless internet services have been commercialized, consumer demands related to mobile devices are also diversifying, leading to the installation of various types of accessory devices on mobile devices.

[0003] A representative example among these is a camera device that captures subjects as photos or videos. Meanwhile, recent camera devices are equipped with image stabilization functions to prevent video shaking caused by the photographer's hand.

[0004] However, the x-axis / y-axis lens shift used in conventional image stabilization modules has limitations in correcting various types of shake. The problem to be solved

[0005] The present embodiment aims to provide a camera device capable of correcting hand shake for x-axis direction shift, y-axis direction shift, and z-axis center rotation.

[0006] In addition, the present embodiment aims to provide a camera device in which hand shake correction through a lens and hand shake correction through an image sensor are performed together.

[0007] In addition, the present embodiment enables the provision of a camera device capable of simplifying the spring structure for providing an autofocus function or a hand shake compensation function.

[0008] In addition, the embodiment enables the provision of a camera device that can drastically reduce the number of wires required for moving the image sensor.

[0009] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the proposed embodiments belong from the description below. means of solving the problem

[0010] An image sensor substrate according to an embodiment comprises: an image sensor including a plurality of connection pins; and a substrate having an open area formed in an area where the image sensor is disposed and a terminal connected to the plurality of connection pins of the image sensor, wherein the number of connection pins of the image sensor is greater than the number of terminals of the substrate, and one surface of the substrate includes a first area and a second area facing in a first direction with the open area in between, and a third area and a fourth area facing in a second direction different from the first direction with the open area in between, and the number of terminals disposed in each of the first to fourth areas is the same.

[0011] Additionally, the substrate includes a plurality of first terminals connected to an image signal output pin of the image sensor, and the plurality of first terminals are spaced apart from each other within the same region among the first to fourth regions of the substrate, or are spaced adjacent to each other in other adjacent regions among the first to fourth regions of the substrate.

[0012] Additionally, the plurality of first terminals include a first-1 terminal and a first-2 terminal spaced apart from each other in the first region, a first-3 terminal positioned adjacent to the first region in the third region, and a first-4 terminal positioned adjacent to the first region in the fourth region.

[0013] Additionally, the substrate includes a second terminal connected to a monitoring pin of the image sensor, and the second terminal is positioned between the first-1 terminal and the first-2 terminal positioned in the same area.

[0014] Additionally, the substrate includes a plurality of third terminals connected to a clock signal output pin of the image sensor, and the plurality of third terminals are arranged in the third region spaced apart from the first-third terminals.

[0015] Additionally, the substrate includes a fourth terminal connected to the master clock input pin of the image sensor, and the fourth terminal is positioned between the first-third terminals and the third terminal, and the signal voltage level of the fourth terminal is lower than the signal voltage level of the second terminal.

[0016] Additionally, the substrate includes a plurality of fifth terminals connected to the power input pin of the image sensor, and the plurality of fifth terminals include a 5-1 terminal disposed in the third region facing the first region and a 5-2 terminal disposed in the fourth region spaced apart from the 1-4 terminal, and the power input level of the 5-1 terminal is greater than the power input level of the 5-2 terminal.

[0017] Additionally, the substrate includes a sixth terminal connected to the initial synchronization communication pin of the image sensor and a seventh terminal connected to the reset pin of the image sensor, and the sixth terminal and the seventh terminal are disposed in the second region together with the fifth-1 terminal.

[0018] In addition, the respective signal voltage levels of the 6th and 7th terminals are greater than the respective signal voltage levels of the 2nd terminal and the 4th terminal.

[0019] In addition, the substrate includes an 8th terminal connected to the ground pin of the image sensor, and the 8th terminal is positioned between the 1st-4th terminal and the 5th-2nd terminal.

[0020] Additionally, the 8th terminal includes one 8-1 terminal for grounding the power input through the 5-1 terminal and one 8-2 terminal for grounding the plurality of 1 terminals.

[0021] Meanwhile, the sensor driving device according to the embodiment includes a fixed part comprising a second substrate and a coil disposed on the second substrate and a first lead pattern part; a moving part disposed spaced apart from the fixed part at a certain distance and comprising an image sensor; and a wire part disposed between the moving part and the fixed part, wherein one end of the wire part is connected to the first lead pattern part and the other end is connected to the moving part to elastically support the moving part, and the moving part includes the image sensor substrate.

[0022] At this time, the wire portion includes a plurality of wires, and the number of the plurality of wires is smaller than the number of input pins included in the image sensor.

[0023] In addition, the moving part includes a second lead pattern part, and the other end of the wire part is connected to the second lead pattern part, and the number of the second lead pattern parts is smaller than the number of input pins included in the image sensor. An image sensor substrate according to an embodiment includes an image sensor comprising a plurality of connection pins; The substrate includes an open area formed in an area where the image sensor is disposed and a plurality of terminals connected to a plurality of connection pins of the image sensor, wherein the number of connection pins of the image sensor is greater than the number of terminals of the substrate, and one surface of the substrate includes a first area and a second area facing each other in a first direction with the open area in between, and a third area and a fourth area facing each other in a second direction different from the first direction with the open area in between, and the plurality of terminals include first to fifth terminals disposed in the first area, wherein the first terminal is connected to a first-1 image signal output pin among the plurality of connection pins of the image sensor, the second terminal is disposed adjacent to the first terminal and is connected to a first-2 image signal output pin among the plurality of connection pins of the image sensor, the third terminal is connected to a monitoring pin among the plurality of connection pins of the image sensor, the fourth terminal is connected to a second-1 image signal output pin among the plurality of connection pins of the image sensor, and the fifth terminal is disposed adjacent to the fourth terminal and among the plurality of connection pins of the image sensor It is connected to the 2-2 image signal output pin, and the 1-1 image signal output pin and the 1-2 image signal output pin output a differential signal for the 1 image signal, and the 2-1 image signal output pin and the 2-2 image signal output pin output a differential signal for the 2 image signal, and the 3 terminal is positioned between the 2 terminal and the 4 terminal.In addition, the plurality of terminals includes terminals 6 through 10 disposed in the second region, terminals 11 through 15 disposed in the third region, and terminals 16 through 20 disposed in the fourth region, and the number of terminals disposed in each of the first through fourth regions is equal to each other. In addition, terminal 11 is disposed adjacent to terminal 1 in the third region and is connected to the 3-1 image signal output pin among the plurality of connection pins of the image sensor, terminal 12 is disposed adjacent to the 3-1 image signal output pin and is connected to the 3-2 image signal output pin among the plurality of connection pins of the image sensor, and the 3-1 image signal output pin and the 3-2 image signal output pin output a differential signal for the 3 image signal. In addition, terminal 16 is disposed adjacent to terminal 4 in the fourth region and is connected to the 4-1 image signal output pin among the plurality of connection pins of the image sensor, and terminal 17 is disposed adjacent to terminal 16 and the image sensor Among the plurality of connection pins, it is connected to the 4-2 image signal output pin, and the 4-1 image signal output pin and the 4-2 image signal output pin output a differential signal for the 4th image signal. Additionally, the plurality of connection pins of the image sensor include a 1st clock signal output pin and a 2nd clock signal output pin, the 14th terminal is connected to the 1st clock signal output pin, the 15th terminal is connected to the 2nd clock signal output pin, and the 14th terminal is spaced apart from the 12th terminal in the 3rd region with the 13th terminal in between. Additionally, the plurality of connection pins of the image sensor include a master clock input pin, the 13th terminal is connected to the master clock input pin, and the signal voltage level of the 13th terminal is lower than the signal voltage level of the 3rd terminal.Additionally, the sixth terminal is connected to the clock communication pin of the I2C communication line among the plurality of connection pins of the image sensor, the seventh terminal is connected to the data communication pin of the I2C communication line among the plurality of connection pins of the image sensor, the eighth terminal is connected to the reset pin that transmits a reset signal among the plurality of connection pins of the image sensor, the ninth terminal is connected to the first analog power input pin among the plurality of connection pins of the image sensor, and the tenth terminal is connected to the second analog power input pin among the plurality of connection pins of the image sensor. Additionally, the twenty-sixth terminal is connected to the digital power input pin among the plurality of connection pins of the image sensor and is spaced apart from the 17th terminal with a ground terminal in between. Additionally, the eighth terminal is connected to the second ground pin for grounding the image signal output line among the plurality of connection pins of the image sensor, and the ninth terminal is connected to the first ground pin for grounding the power signal among the plurality of connection pins of the image sensor. Effects of the invention

[0024] According to an embodiment, to implement OIS and AF functions of a camera module, instead of moving a conventional lens barrel, an image sensor is moved relatively to the lens barrel in the X, Y, and Z axis directions. Accordingly, the camera module according to the embodiment can eliminate a complex spring structure for implementing OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor relative to the lens barrel according to the embodiment, a more stable structure can be formed compared to the conventional one.

[0025] In addition, according to an embodiment, a terminal portion electrically connected to an image sensor is configured to have a spring structure and is positioned to float without overlapping within the vertical direction of the insulating layer. Accordingly, the camera module can stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0026] According to the above embodiment, X-axis direction shift, Y-axis direction shift, and Z-axis center rotation corresponding to hand shake can be performed on the image sensor, and accordingly, hand shake correction for the image sensor and hand shake correction for the corresponding lens can be performed together, thereby providing an improved hand shake correction function.

[0027] In addition, according to an embodiment, the overall height of the camera device can be reduced by utilizing the internal space of a second actuator that moves the image sensor relative to the lens barrel to embed electrical components required for the camera circuit.

[0028] In addition, according to an embodiment, the camera assembly process can be simplified by integrating and fusing the camera circuit component and the second actuator component.

[0029] In addition, according to the embodiment, the number of terminals connected to the image sensor can be drastically reduced. In this case, according to the embodiment, by arranging the terminals connected to the image sensor to minimize mutual interference, a level of reliability similar to that of the existing one can be secured even with a reduced number of terminals. In addition, according to the embodiment, by reducing the number of terminals connected to the image sensor, the number of parts required for shifting the image sensor can be reduced. Furthermore, according to the embodiment, due to such a reduction in the number of parts, the unit cost of the product can be reduced and the overall height of the camera device can be reduced. Brief explanation of the drawing

[0030] Figure 1 is a drawing showing a camera module according to a comparative example. FIG. 2 is a perspective view of a camera device according to the present embodiment. Figure 3 is a cross-sectional view taken from AA in Figure 2. Figure 4 is a cross-sectional view taken from BB of Figure 2. FIG. 5 is an exploded perspective view of a part of the components of a camera device according to the present embodiment. FIG. 6 is an exploded perspective view of a part of the components of a camera device according to the present embodiment. FIG. 7 is a bottom perspective view of a part of a camera device according to the present embodiment. FIG. 8 is a perspective view of a part of the configuration of a camera device according to the present embodiment. FIG. 9a is an exploded perspective view of a substrate module for an image sensor of a camera device according to the present embodiment. FIG. 9b is a cross-sectional view taken from CC of the combined state of the substrate module for the image sensor of the camera device of FIG. 9a. FIG. 9c is a cross-sectional view taken from DD of the combined state of the substrate module for the image sensor of the camera device of FIG. 9a. FIGS. 10 and FIGS. 11 are exploded perspective views of a part of a camera device according to the present embodiment, viewed from a different direction than FIG. 9a. FIG. 12 is an exploded view of an image sensor module of a camera device according to the present embodiment. FIG. 13 is an exploded perspective view of an image sensor module of a camera device according to the present embodiment, viewed from a different direction than FIG. 12. FIG. 14 is a plan view of an image sensor substrate according to an embodiment. FIG. 15 is a diagram illustrating x-axis direction shift driving through a part configuration of a camera device according to the present embodiment. FIG. 16 is a diagram illustrating y-axis direction shift driving through a part configuration of a camera device according to the present embodiment. FIG. 17 is a diagram illustrating z-axis center rotational drive through a part configuration of a camera device according to the present embodiment. Figure 18 (a) is a drawing showing a magnet placed on a substrate holder along with the x-axis and y-axis. Figure 18 (b) is a drawing showing a substrate holder, a magnet, and a coil with rotational drive in the z-axis direction. FIG. 19 is a diagram illustrating the magnetic flow and Lorentz force between the magnet and the coil of a camera device according to the present embodiment. FIG. 20 is a perspective view of an optical device according to the present embodiment. FIG. 21 is a configuration diagram of the optical device shown in FIG. 20. Specific details for implementing the invention

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0033] Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning generally understood by those skilled in the art to which the present invention pertains, unless explicitly and specifically defined otherwise. Terms commonly used, such as those defined in advance, may be interpreted by considering their meaning in the context of the relevant technology. Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0034] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C. Additionally, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention.

[0035] These terms are intended only to distinguish a component from another component and are not limited by the nature, order, or sequence of the component. Furthermore, where it is stated that a component is 'connected,' 'combined,' or 'connected' to another component, this may include not only cases where the component is directly connected, combined, or connected to the other component, but also cases where it is 'connected,' 'combined,' or 'connected' due to another component located between the component and the other component.

[0036] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0039] Figure 1 is a drawing showing a camera module according to a comparative example.

[0040] A camera module equipped with OIS (Optical Image Stabilizer) and AF (Auto Focusing) functions requires at least two spring plates.

[0041] The camera module according to the comparative example may have two spring plates. The camera module according to the comparative example requires at least six spring-like elastic members in the spring plates.

[0042] Referring to FIG. 1, a camera module according to a comparative example includes an optical system comprising a lens assembly, an infrared filter section, and a sensor section. That is, the camera module according to the comparative example includes a lens barrel (10), a lens assembly (20), a first elastic member (31), a second elastic member (32), a first housing (41), a second housing (42), an infrared blocking filter section (50), a sensor section (60), a circuit board (80), and driving sections (71, 72, 74).

[0043] At this time, the lens barrel (10) is connected to the first housing (41). That is, the lens barrel (10) is connected to the first housing (41) through the first elastic member (31). That is, the lens barrel (10) is connected to the first housing (41) so as to be movable by the first elastic member (31). At this time, the first elastic member (31) includes a plurality of springs (not shown). For example, the first elastic member (31) connects the lens barrel (10) and the first housing (41) at a plurality of points on the lens barrel (10).

[0044] The second elastic member (32) is connected to the first housing (41) and the second housing (42) that accommodates the first housing (41). The second elastic member (32) fixes the first housing (41) to the second housing (42) so that it can move. The second elastic member (32) includes a plurality of springs. Specifically, the second elastic member (32) includes plate springs.

[0045] At this time, the first elastic member (31) supports the lens barrel (10) and moves the lens barrel (10) relative to the sensor part (60) in a vertical direction (Z-axis direction). To do this, the first elastic member (31) includes at least four springs.

[0046] Additionally, the second elastic member (32) supports the lens barrel (10) and moves the lens barrel (10) relative to the sensor part (60) in a horizontal direction (X-axis direction and Y-axis direction). To this end, the second elastic member (32) includes at least two springs.

[0047] As described above, in the camera module according to the comparative example, OIS and AF are performed as the lens barrel (10) moves in the X-axis, Y-axis, and Z-axis directions. To this end, the camera module according to the comparative example requires at least six elastic members, such as springs. Additionally, the camera module according to the comparative example requires two spring plates to support the elastic members. Furthermore, the camera module according to the comparative example requires an additional member, such as an elastic wire, to fix the Z-axis of the lens barrel (10). Therefore, the spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis is complex in the camera module according to the comparative example.

[0048] In addition, the camera module according to the comparative example requires manually bonding each elastic member to the lens barrel (10) in order to combine the elastic member with the lens barrel (10). Accordingly, the camera module according to the comparative example has a complex manufacturing process and requires a long manufacturing time.

[0049] In addition, the camera module according to the comparative example provides a tilt function of the lens barrel (10), but is structured in such a way that it is difficult to actually correct the tilt of the image. That is, even if the lens barrel (10) rotates relative to the sensor unit (60), there is no change in the image incident on the sensor unit (60), so it is difficult to correct the tilt of the image, and furthermore, the tilt function itself is unnecessary.

[0051] Hereinafter, a substrate for an image sensor, a camera module, and a camera device including the same according to an embodiment are described.

[0052] The 'Optical Axis Direction' used below is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0053] As used below, the 'vertical direction' may be a direction parallel to the optical axis. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0054] As used below, the 'Auto Focus function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through moving the lens along the optical axis according to the distance to the subject, so that a clear image of the subject can be obtained on the image sensor. Meanwhile, 'Auto Focus' corresponds to 'AF (Auto Focus)'.

[0055] As used below, the 'shake correction function' is defined as a function that moves the lens and / or image sensor to counteract vibrations (movements) generated in the image sensor by external forces. Meanwhile, 'shake correction' can correspond to 'OIS (Optical Image Stabilization)'.

[0057] FIG. 2 is a perspective view of a camera device according to the present embodiment, FIG. 3 is a cross-sectional view taken from AA in FIG. 2, FIG. 4 is a cross-sectional view taken from BB in FIG. 2, FIG. 5 is an exploded perspective view of a part of a camera device according to the present embodiment, FIG. 6 is an exploded perspective view of a part of a camera device according to the present embodiment, FIG. 7 is a bottom perspective view of a part of a camera device according to the present embodiment, FIG. 8 is a perspective view of a part of a camera device according to the present embodiment, FIG. 9a is an exploded perspective view of a substrate module for an image sensor of a camera device according to the present embodiment, FIG. 9b is a cross-sectional view taken from CC showing the state in which the substrate module for an image sensor of the camera device of FIG. 9a is coupled, FIG. 9c is a cross-sectional view taken from DD showing the state in which the substrate module for an image sensor of the camera device of FIG. 9a is coupled, FIG. 10 and FIG. 11 are exploded perspective views of a part of a camera device according to the present embodiment taken from a direction different from FIG. 9a, and FIG. 12 is an image sensor of a camera device according to the present embodiment. FIG. 13 is an exploded perspective view of an image sensor module of a camera device according to the present embodiment, viewed from a different direction than FIG. 12, FIG. 14 is a plan view of an image sensor substrate according to the embodiment, FIG. 15 is a diagram explaining x-axis direction shift driving through a part configuration of a camera device according to the present embodiment, FIG. 16 is a diagram explaining y-axis direction shift driving through a part configuration of a camera device according to the present embodiment, FIG. 17 is a diagram explaining z-axis center rotation driving through a part configuration of a camera device according to the present embodiment, FIG. 18 (a) is a diagram showing a magnet placed on a substrate holder together with the x-axis and y-axis, FIG. 18 (b) is a diagram showing the substrate holder, magnet, and coil together with z-axis direction rotation driving, and FIG. 19 is a diagram showing the magnetic flow and Lorentz force between the magnet and the coil of a camera device according to the present embodiment.

[0058] The camera device (100A) may include a camera module. The camera device (100A) may include a lens driving device. The lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

[0059] The camera device (100A) may include an actuator. The actuator can drive an image sensor (444). The actuator can tilt the image sensor (444). The actuator can move the image sensor (444). The actuator can rotate the image sensor (444). The actuator can move the image sensor (444) in a first direction perpendicular to the optical axis, move it in a second direction perpendicular to the optical axis and the first direction, and rotate it about the optical axis. At this time, the first direction may be the x-axis direction, the second direction may be the y-axis direction, and the optical axis may be the z-axis direction. The actuator may include a coil (310) and a magnet (320). The actuator can move the image sensor (444) through electromagnetic force.

[0061] That is, the actuator of the camera device (100A) can move the image sensor (444) relative to the lens barrel. The actuator will be described in more detail below.

[0062] The actuator of the camera device (100A) may include a fixed part (described later) and a moving part (described later). The moving part of the actuator may be connected to the fixed part via a wire (described later). The moving part of the actuator may move relative to the fixed part by means of an electromagnetic force applied through a driving part. The movement of the moving part may include movement of the moving part in a first direction, movement in a second direction, and movement in the direction of the optical axis of the fixed part.

[0064] The camera device (100A) may include a holder (110). The holder (110) may be disposed on the lower surface of the first substrate (150). The holder (110) may include a projection for fitting into a groove of the first substrate (150). The holder (110) may be disposed on the upper surface of the second substrate (120).

[0065] Here, the first substrate (150) may be a fixed part of the actuator. That is, the first substrate (150) can maintain a fixed state even when the image sensor (444) moves. That is, the image sensor (444) can move relative to the first substrate (150).

[0066] A holder (110) may be placed between a first substrate (150) and a second substrate (120). A lens module (210) may be placed in the holder (110). An optical module may be placed in the holder (110). The holder (110) may be coupled with a housing (600). At this time, the second substrate (120) may be a component of an image sensor actuator electrically connected to an image sensor (444). One end of the second substrate (120) is connected to a third substrate (430), and accordingly, can receive an image signal transmitted from an image sensor (444) coupled to the third substrate (430). Additionally, the other end of the second substrate (120) is connected to the first substrate (150), and accordingly, can transmit an image signal provided from the image sensor (444) to the outside. That is, the second substrate (120) can transmit an image signal obtained from the image sensor (444) to the main substrate.

[0067] To this end, the first substrate (150) can connect between the camera module and the main substrate of the external device. Specifically, the first substrate (150) can connect between the second substrate (120) of the camera module and the main substrate of the optical device (e.g., a mobile terminal).

[0068] To this end, the first substrate (150) is positioned inside the camera device and connected to the second substrate (120) of the image sensor actuator, and the remaining part is positioned outside the camera device and connected to the main substrate of the optical device.

[0069] The holder (110) may include a step (111). The step (111) may be formed around the perimeter of the insertion portion (112) of the holder (110). A lens module (210) may be placed on the step (111). The step (111) may support the lower surface of a portion of the lens module (210). By doing so, it is possible to prevent the lens module (210) from moving downward while seated on the step (111).

[0070] The holder (110) may include an insertion portion (112). The insertion portion (112) may be a hollow hole. The insertion portion (112) may be an opening. A lens module (210) may be placed in the insertion portion (112). A portion of the lens module (210) may extend below the step (111) through the insertion portion (112).

[0071] The holder (110) may include a first hole (113). The first hole (113) may be formed to expose a portion of the second substrate (120) for coupling with the wire (510). There may be multiple first holes (113). For example, there may be two first holes (113).

[0072] The holder (110) may include a second hole (114). The second hole (114) may be formed to expose a sensor (520) coupled to the second substrate (120). There may be multiple second holes (114). For example, there may be four second holes (114).

[0073] The holder (110) may include a first groove (115). The first groove (115) may be formed to expose a portion of the second substrate (120) for coupling with the wire (510). The first groove (115) may be formed on the side of the holder (110). The first groove (115) may be formed on each side of the holder (110). There may be multiple first grooves (115). For example, the first groove (115) may include two grooves each disposed on opposite sides of the holder (110).

[0074] The holder (110) may include a second groove (116). The second groove (116) may be formed in a shape corresponding to a protrusion of the housing (600) and may be fitted with the protrusion of the housing (600). However, the second groove (116) may not be provided in a shape corresponding to a protrusion of the housing (600). The second groove (116) may be formed on the side of the holder (110). The second groove (116) may be formed on each of the two sides of the holder (110). There may be multiple second grooves (116). For example, there may be three second grooves (116). The second groove (116) may include two grooves disposed on one side of the holder (110), and on the other side, may be formed as a single groove in which the two grooves are connected as one.

[0075] The camera device (100A) may include a second substrate (120). The second substrate (120) may be placed on a holder (110). The second substrate (120) may be placed on the lower surface of the holder (110). The upper surface of the second substrate (120) may be in contact with the lower surface of the holder (110). Here, the second substrate (120) and the holder (110) may be fixed parts of an actuator. That is, the position of the second substrate (120) and the holder (110) may be fixed even when the image sensor (444) moves.

[0076] The second substrate (120) may be placed below the first substrate (150). The second substrate (120) may be coupled with a wire (510). The second substrate (120) may be a rigid flexible PCB (RFPCB). The second substrate (120) may include first to fourth corners. At this time, the second substrate (120) may be coupled with a third substrate (430) on which an image sensor (444) is placed, and may be a component of an image sensor actuator that moves the position of the third substrate (430).

[0077] The second substrate (120) may include a fourth open region (121). The fourth open region (121) may be formed in the center of the second substrate (120). The fourth open region (121) may be a hollow hole penetrating the upper and lower surfaces of the second substrate (120). The fourth open region (121) may be an opening. The fourth open region (121) of the second substrate (120) may be aligned on the optical axis (OA) with the image sensor (444) positioned at the bottom and the lens module (210) positioned at the top.

[0078] Preferably, the fourth open area (121) can be aligned on the optical axis (OA) with the image sensor (444) placed at the bottom, the first open area (433) of the third substrate (430), the second open area (424) of the reinforcing member (420), and the third open area (411) of the substrate holder (410). A lens module (210) can be placed in the fourth open area (121). The fourth open area (121) of the second substrate (120) can be formed with a width greater than the insertion part (112) of the holder (110).

[0079] The second substrate (120) may include a coupling portion. The second substrate (120) may be coupled to the wire (510) at the coupling portion. That is, the second substrate (120) may include a lead pattern portion coupled to the wire (510). For example, the second substrate (120) may include a second lead pattern portion (122) that is electrically connected to one end of the wire (510). The second lead pattern portion (122) of the second substrate (120) and the wire (510) may be coupled through soldering. The second lead pattern portion (122) may be a portion where the solder resistor is open to be electrically connected to the wire (510). A third insertion hole (123) into which the wire is inserted may be formed in the second lead pattern portion (122) and the second substrate (120). Accordingly, one end of the wire (510) can be inserted into the second lead pattern portion (122) and the third insertion hole (123) of the second substrate (120). Preferably, one end of the wire (510) can penetrate the second lead pattern portion (122) and the second substrate (120) and protrude over the surface of the second lead pattern portion (122), and can be electrically connected to the second lead pattern portion (122) by solder (not shown).

[0080] That is, a portion of the third insertion hole (123) may be formed on the second substrate (120), and the remaining portion may be formed on the second lead pattern portion (122). And, a portion of the third insertion hole formed on the second lead pattern portion (122) may be filled with solder by soldering a wire (510) protruding over the surface of the second lead pattern portion (122).

[0081] The second substrate (120) may include a connector (124). The connector (124) may be electrically connected to the first substrate (150). A connector corresponding to the connector (124) of the second substrate (120) may be disposed on the first substrate (150). The connector (124) may include a port for electrically connecting to an external device.

[0082] The second substrate (120) may include a terminal (125). The terminal (125) may be formed on the lower surface of the second substrate (120). The terminal (125) may be electrically connected to the coil (310). The terminal (125) may be joined to a pair of lead wires of the coil (310) by soldering or Ag epoxy. The terminal (125) may include a plurality of terminals. The terminal (125) may include a total of eight terminals, two for each of the four coils. The second substrate (120) generates a magnetic field on the third substrate (430) using the coil (310), and allows the position of the third substrate (430) to be moved by the generated magnetic field.

[0083] That is, the second substrate (120) is electrically connected to the lower third substrate (430) via a wire (510). Additionally, the third substrate (430) can move relative to the first substrate (150) and the second substrate (120) via the wire (510).

[0084] In other words, the second substrate (120) is coupled in a fixed state to the holder (110), and the third substrate (430) can move relative to the second substrate (120). The movement of the third substrate (430) can be achieved by a magnetic force generated from a coil (310) connected to the terminal (125). This will be explained below.

[0085] The camera device (100A) may include a lens module (210). The lens module (210) may be placed in a holder (110). The lens may be placed at a position corresponding to the image sensor (444). The lens module (210) may include at least one lens. The lens module (210) may include a plurality of lenses. The lens module (210) may include five lenses. The lens module (210) may include first to fifth lenses (211, 212, 213, 214, 215). The lens module (210) may include a barrel (216). A plurality of lenses may be placed within the barrel (216). The lens module (210) may include a hole (217). An optical module may be placed in the hole (217) of the lens module (210). A hole (217) in the lens module (210) can be formed to penetrate the lens module (210) horizontally between a plurality of lenses. Through this, the optical axis of the plurality of lenses and the optical axis of the optical module can be aligned. A hole (217) in the lens module (210) can be formed between the second lens (212) and the third lens (213).

[0086] The camera device (100A) may include an optical module. The optical module may perform an optical image stabilization (OIS) function. The optical module may perform an autofocus (AF) function. The optical module may be aligned with a plurality of lenses and an image sensor (444). The optical module may be placed between a plurality of lenses. The optical module may be placed between a second lens (212) and a third lens (213). The optical module may include a MEMS actuator (220).

[0087] As illustrated in FIG. 8, the camera device (100A) may include a MEMS actuator (220). The MEMS actuator (220) can use a silicon wafer to move a moving lens to perform an autofocus function and / or image stabilization function.

[0088] The MEMS actuator (220) can be connected to a lens substrate (221). The lens substrate (221) may include a terminal (222). The terminal (222) may include a plurality of terminals. The terminal (222) may include six terminals. The terminal (222) of the lens substrate (221) may be connected to a terminal (150a) of the first substrate (150).

[0090] The camera device (100A) may include a coil (310). That is, the actuator that moves the image sensor (444) may include a coil (310).

[0091] The coil (310) can be placed on the second substrate (120).

[0092] The coil (310) can be electrically connected to the second substrate (120). The coil (310) can be positioned facing the magnet (320) located at the bottom. When current is applied to the coil (310), an electric field can be formed around the coil (310). When current is applied to the coil (310), either the coil (310) or the magnet (320) can move relative to the other through electromagnetic interaction between the coil (310) and the magnet (320). At this time, the coil (310) may also be a component of the fixed part of the actuator.

[0093] The coil (310) may include four coils. Current may be applied independently to at least three of the four coils. In the first embodiment, the coil (310) may be controlled by three channels. Or, in the second embodiment, the coil (310) may be controlled by four channels. The four coils (310) may be electrically isolated from each other. Either a forward current or a reverse current may be selectively applied to each of the four coils (310). In this embodiment, only three of the four coils may be electrically isolated and one coil may be electrically connected to another coil. Or, all four coils may be electrically isolated. When only three of the four coils are electrically isolated, a total of six lead wires (three pairs) may come out of the coil (310), and when all four coils are electrically isolated, a total of eight lead wires (four pairs) may come out of the coil (310).

[0094] In the case of controlling four coils with three channels as in the first embodiment of this embodiment, the z-axis center rotation drive must be driven with one pair of coils (310) and magnets (320), but in the case of controlling four coils with four channels as in the second embodiment, the z-axis center rotation drive can be driven with two pairs of coils (310) and magnets (320).

[0095] The coil (310) may include first to fourth coils (311, 312, 313, 314). The first coil (311) may be positioned opposite the first magnet (321). The second coil (312) may be positioned opposite the second magnet (322). The third coil (313) may be positioned opposite the third magnet (323). The fourth coil (314) may be positioned opposite the fourth magnet (324). The first coil (311) may be positioned at the first corner of the second substrate (120). The second coil (312) may be positioned at the second corner of the second substrate (120). The third coil (313) may be positioned at the third corner of the second substrate (120). The fourth coil (314) may be placed at the fourth corner of the second substrate (120). The first coil (311) and the third coil (313) may be placed on the first diagonal direction of the second substrate (120), and the second coil (312) and the fourth coil (314) may be placed on the second diagonal direction of the second substrate (120).

[0096] In this embodiment, the first coil (311) and the third coil (313) may be arranged lengthwise in the first direction, and the second coil (312) and the fourth coil (314) may be arranged lengthwise in the second direction. At this time, the first direction and the second direction may be perpendicular. The long side of the first coil (311) and the long side of the third coil (313) may be arranged parallel to each other. The long side of the second coil (312) and the long side of the fourth coil (314) may be arranged parallel to each other. The long side of the first coil (311) and the long side of the second coil (312) may not be arranged parallel to each other. At this time, the long side of the first coil (311) and the long side of the second coil (312) may be arranged such that their imaginary extension lines are orthogonal to each other. The arrangement direction of the first coil (311) and the arrangement direction of the second coil (312) can be orthogonal.

[0097] In this embodiment, current may be applied independently to at least three of the first to fourth coils (311, 312, 313, 314). The first to fourth coils (311, 312, 313, 314) may be electrically isolated from each other.

[0098] The camera device (100A) may include a magnet (320). The magnet (320) may be placed in a substrate holder (410). The magnet (320) may be placed at a corner of the substrate holder (410). The magnet (320) may be placed at each of the four corners of the substrate holder (410). The magnet (320) may be opposite to the coil (310). The magnet (320) may have electromagnetic interaction with the coil (310). The magnet (320) may move through electromagnetic interaction with the coil (310). That is, when current is applied to the coil (310), the magnet (320) may move. The magnet (320) may be a flat magnet having a flat plate shape. In this embodiment, the coil (310) is fixed and the magnet (320) may move. However, as a variation example, the placement positions of the coil (310) and the magnet (320) may be swapped. In this case, the magnet (320) and the substrate holder (410) may be moving parts of the actuator. That is, the magnet (320) and the substrate holder (410) may move together with the image sensor (444) when the image sensor (444) moves.

[0099] The magnet (320) may include a plurality of magnets. The magnet (320) may include four magnets. The magnet (320) may include first to fourth magnets (321, 322, 323, 324). The first magnet (321) may be positioned opposite the first coil (311). The first magnet (321) may be positioned at the first corner (410e) of the substrate holder (410). The second magnet (322) may be positioned opposite the second coil (312). The second magnet (322) may be positioned at the second corner (410f) of the substrate holder (410). The third magnet (323) may be positioned opposite the third coil (313). The third magnet (323) may be placed at the third corner (410g) of the substrate holder (410). The fourth magnet (324) may be positioned opposite the fourth coil (314). The fourth magnet (324) may be placed at the fourth corner (410h) of the substrate holder (410). Each of the plurality of magnets may be positioned perpendicular to an adjacent magnet and parallel to a magnet positioned diagonally.

[0100] The polarity of the surface facing the coil (310) of the first magnet (321) may differ between the part closer to the first side and the part closer to the second side. The polarity of the surface facing the coil (310) of the second magnet (322) may differ between the part closer to the third side and the part closer to the fourth side. The polarity of the surface facing the coil (310) of the third magnet (323) may differ between the part closer to the first side and the part closer to the second side. The polarity of the surface facing the coil (310) of the fourth magnet (324) may differ between the part closer to the third side and the part closer to the fourth side. That is, the first magnet (321) and the third magnet (323) may be arranged in the same direction, and the second magnet (322) and the fourth magnet (324) may be arranged in the same direction. The first magnet (321) may be positioned perpendicularly to the second magnet (322). The polarity of the first to fourth magnets (321, 322, 323, 324) may be the same in their inner parts. The polarity of the first to fourth magnets (321, 322, 323, 324) may be the same in their outer parts. The polarity of each of the first to fourth magnets (321, 322, 323, 324) may be formed with the inner part as the N pole. The polarity of each of the first to fourth magnets (321, 322, 323, 324) may be formed with the outer part as the S pole. However, as a variation, the polarity of each of the first to fourth magnets (321, 322, 323, 324) may be formed such that the inner part is an S pole and the outer part is an N pole.

[0101] As illustrated in FIG. 13, in this embodiment, when current in the same direction is applied to the second coil (312) and the fourth coil (314), the image sensor (444) coupled to the substrate holder (410) can be moved (shifted) in the x-axis direction through electromagnetic interaction with the second magnet (322) and the fourth magnet (324), respectively. That is, the second coil (312) and the second magnet (322), and the fourth coil (314) and the fourth magnet (324) can be used to drive the x-axis shift of the image sensor (444). At this time, the second coil (312) and the second magnet (322) may be the first x-axis shift drive unit (X2), and the fourth coil (314) and the fourth magnet (324) may be the second x-axis shift drive unit (X1).

[0102] As illustrated in FIG. 15, in this embodiment, when current in the same direction is applied to the first coil (311) and the third coil (313), the image sensor (444) coupled to the substrate holder (410) can be moved (shifted) in the y-axis direction through electromagnetic interaction with the first magnet (321) and the third magnet (323), respectively. That is, the first coil (311) and the first magnet (321), and the third coil (313) and the third magnet (323) can be used to drive the y-axis shift of the image sensor (444). At this time, the first coil (311) and the first magnet (321) may be the first y-axis shift drive unit (Y1), and the third coil (313) and the third magnet (323) may be the second y-axis shift drive unit (Y2).

[0103] As illustrated in FIG. 16, in this embodiment, currents in opposite directions are applied to the first coil (311) and the third coil (313), and currents in opposite directions are applied to the second coil (312) and the fourth coil (314). If the direction in which the magnet (320) rotates is the same as the current applied to the first coil (311) and the current applied to the second coil (312), then the image sensor (444) coupled to the substrate holder (410) can be rotated (rolled) around the z-axis. The embodiment illustrated in FIG. 17 illustrates the case where the coil (310) is controlled by 4 channels, and if the coil (310) is controlled by 3 channels, the image sensor (444) can be rolled through the first coil (311) and the third coil (313) or the second coil (312) and the fourth coil (314). This is because if there is a coil connected to one channel among the first coil (311), the third coil (313), the second coil (312), and the fourth coil (314), current cannot be applied in the opposite direction.

[0104] As illustrated in FIG. 17(b), in this embodiment, a forward current is applied to the first coil (311), thereby causing the first coil (311) to push the first magnet (321) in the first direction (see FIG. 17(a)), a forward current is applied to the second coil (312), thereby causing the second coil (312) to push the second magnet (322) in the second direction (see FIG. 17(b)), a reverse current is applied to the third coil (313), thereby causing the third coil (313) to push the third magnet (323) in the third direction (see FIG. 17(c)), and a reverse current is applied to the fourth coil (314), thereby causing the fourth coil (314) to push the fourth magnet (324) in the fourth direction (see FIG. 17(d)), so that the image coupled to the substrate holder (410) The sensor (444) can be rotated around the z-axis (see e in FIG. 17). At this time, the first to fourth directions may correspond to clockwise directions with respect to the center of the substrate holder (410).

[0105] In this embodiment, the magnetic flow of the magnet (320) is as shown in FIG. 18. Referring to FIG. 18, it can be seen that there is a magnetic force line passing perpendicularly to the coil (310), and in this state, when current is applied to the coil (310), the coil (310) can move relative to the magnet (320) according to the Lorentz force.

[0107] The camera device (100A) may include a substrate holder (410) which is a component of a substrate module. The substrate holder (410) may be spaced apart from the holder (110). The substrate holder (410) may be a mover, a part that moves together with the magnet (320) when current is applied to the coil (310). Additionally, the substrate holder (410) may be a sensor PCB holder. The substrate holder (410) may be shifted in the x-axis direction. The substrate holder (410) may be shifted in the y-axis direction. The substrate holder (410) may be rotated around the z-axis (optical axis). Accordingly, the substrate holder (410) may be a moving part of an actuator.

[0108] The substrate holder (410) may include a third open region (411). The third open region (411) may be a hollow hole. The third open region (411) may be an opening. Preferably, the third open region (411) may be aligned on the optical axis (OA) with the fourth open region (121) of the second substrate (120), the image sensor (444), the first open region (433) of the third substrate (430), and the second open region (424) of the reinforcing member (420).

[0110] The substrate holder (410) may include a magnet receiving groove (412). The groove (412) may be formed on the upper surface of the substrate holder (410). The magnet receiving groove (412) may receive at least a portion of the magnet (320).

[0111] A magnet (320) may be placed in a magnet receiving groove (412) of a substrate holder (410). The magnet receiving groove (412) may be formed in a shape corresponding to the magnet (320). However, the depth of the magnet receiving groove (412) may be smaller than the thickness in the corresponding direction of the magnet (320). In this case, a portion of the magnet (320) placed in the magnet receiving groove (412) may protrude from the substrate holder (410). The magnet receiving groove (412) may include a plurality of grooves. The magnet receiving groove (412) may be formed in a number corresponding to the number of magnets (320). The magnet receiving groove (412) may include four grooves. However, the magnet receiving groove (412) of the substrate holder (410) may be replaced with a coil receiving groove, and accordingly, a coil may be placed instead of the magnet. At this time, a magnet may be placed on a driving substrate facing the coil placed in the substrate holder (410).

[0112] The substrate holder (410) may include a second insertion hole (413) through which a wire passes. The second insertion hole (413) may be formed through the substrate holder (410) in a direction parallel to the optical axis. A wire (510) may be inserted into the second insertion hole (413). The wire (510) may pass through the second insertion hole (413). The second insertion hole (413) may include a plurality of holes. The second insertion hole (413) may be formed in a number corresponding to the number of wires (510). The second insertion hole (413) may include 20 holes. That is, the wires (510) in the embodiment may consist of 20. Accordingly, the second insertion hole (413) may include 20 holes so that each of the 20 wires (510) can pass through. At this time, the number of terminals of the wire (510) or the second insertion hole (413) may be fewer than the number of terminals of the image sensor (444) described later. For example, the image sensor (444) may include 36 terminals. And, the wire (510) may be composed of 20 terminals, which is fewer than the number of terminals of the image sensor (444). Accordingly, some of the terminals of the image sensor (444) may not be electrically connected to the wire (510).

[0113] The second insertion hole (413) of the substrate holder (410) can be aligned within a vertical direction with the third insertion hole (123) of the second substrate (120). That is, the wire (510) can pass through the third insertion hole (123) of the second substrate (120) and the second insertion hole (413) of the substrate holder (410) in common. The number of the third insertion holes (123) can be the same as the number of the wire (510) and the second insertion holes (413).

[0114] The substrate holder (410) may include a first projection (414). The first projection (414) may be formed on the lower surface of the substrate holder (410). The first projection (414) may be inserted into the first hole (421) of the reinforcing member (420) and the hole (431-1) of the third substrate (430). The first projection (414) may be formed in a shape corresponding to the first hole (421) of the reinforcing member (420) and the hole (431-1) of the third substrate (430). The first projection (414) may include a plurality of projections. The first projection (414) may include four projections. The four projections may each be formed at the four corners of the substrate holder (410).

[0115] The substrate holder (410) may include a second projection (415). The second projection (415) may be formed on the lower surface of the substrate holder (410). The second projection (415) may be spaced apart from the first projection (414). The second projection (415) may extend from the side of the substrate holder (410). The lower surface of the second projection (415) may be positioned lower than the lower surface of the reinforcing plate (445) of the image sensor module (440). The second projection (415) may include a plurality of projections. The second projection (415) may include four projections. The four projections may each be formed at the four corners of the substrate holder (410).

[0116] The substrate holder (410) may include a guide projection (416). The guide projection (416) may be formed on the lower surface of the substrate holder (410). The guide projection (416) may guide the assembly position of the image sensor module (440). The guide projection (416) may contact the cover (441) of the image sensor module (440). The guide projection (416) may contact four sides of the cover (441) of the image sensor module (440).

[0117] The substrate holder (410) may include a plurality of sides. The substrate holder (410) may include four sides. The substrate holder (410) may include first to fourth sides. The substrate holder (410) may include a first side and a second side positioned opposite each other, and a third side and a fourth side positioned opposite each other between the first side and the second side.

[0118] The substrate holder (410) may include corners formed between a plurality of sides. The substrate holder (410) may include a plurality of corners. The substrate holder (410) may include four corners. The substrate holder (410) may include first to fourth corners. The first corner of the substrate holder (410) may be positioned between the first side and the third side. The second corner of the substrate holder (410) may be positioned between the third side and the second side. The third corner of the substrate holder (410) may be positioned between the second side and the fourth side. The fourth corner of the substrate holder (410) may be positioned between the fourth side and the first side. That is, the substrate holder (410) may include four sides and four corners positioned between each of the four sides. In addition, a second insertion hole (413) through which a wire (510) passes is formed on the four sides, and a groove (412) into which a magnet is inserted can be formed on the four corners.

[0119] The camera device (100A) may include a reinforcing member (420). The reinforcing member (420) may be formed of stainless steel (SUS). The reinforcing member (420) may reinforce the third substrate (430). The reinforcing member (420) may be combined with the third substrate (430). The reinforcing member (420) may be bonded to the third substrate (430) by an adhesive. The reinforcing member (420) may be placed on the lower surface of the substrate holder (410).

[0120] The reinforcing member (420) may include a first coupling hole (421). The first coupling hole (421) may be coupled with the first projection (414) of the substrate holder (410). The reinforcing member (420) may include a second coupling hole (422). An adhesive may be applied to the second coupling hole (422). The second coupling hole (422) may be formed on a protruding part of the reinforcing member (420). The second coupling hole (422) may include a plurality of holes. The second coupling hole (422) may be formed with two holes each at each of the four corners of the reinforcing member (420), for a total of 16 holes, with two holes each at the eight protruding parts.

[0121] The reinforcing member (420) may include a protrusion (423). The protrusion (423) may be formed to protrude inward from the corner of the reinforcing member (420). In the reinforcing member (420), a space may be secured for the first coupling hole (421) to be formed through the protrusion (423). The first coupling hole (421) may be formed in the protrusion (423).

[0122] The reinforcing member (420) may include a second open area (424). The second open area (424) may be aligned on the optical axis (OA) with the fourth open area (121) of the second substrate (120), the image sensor (444), the first open area (433) of the third substrate (430), and the third open area (411) of the substrate holder (410).

[0123] The camera device (100A) may include a third substrate (430). The third substrate (430) may be placed on the lower surface of the substrate holder (410). The third substrate (430) may be coupled with a reinforcing member (420). The third substrate (430) may be coupled with an image sensor module (440). The third substrate (430) may be an image sensor mounting substrate on which an image sensor is mounted. The third substrate (430) is provided in a state of being suspended below the second substrate (120) by means of a wire, and may move relative to the second substrate (120) by means of the coil and magnet.

[0124] That is, a substrate holder (410), a third substrate (430), and an image sensor module (440) are placed under the second substrate (120).

[0125] Here, a structure in which a second substrate (120), a substrate holder (410), a third substrate (430), and an image sensor module (440) are combined can be referred to as an image sensor actuator or a sensor driving device. Additionally, among these, the second substrate (120) and the substrate holder (410) may be fixed parts. Additionally, the third substrate (430) may be a movable part.

[0126] At this time, the second substrate (120) and the third substrate (430) are electrically connected to each other by a wire (510). Here, the length of the wire (510) may be greater than the sum of the thickness of the second substrate (120), the thickness of the substrate holder (410), the thickness of the reinforcing member (420), and the thickness of the third substrate (430). Accordingly, the substrate holder (410) placed below the second substrate (120) is positioned at a certain distance from the second substrate (120). Furthermore, the substrate holder (410), the third substrate (430), and the image sensor module (440) can be fixed by the wire (510) at a position spaced at a certain distance from the second substrate (120). That is, the substrate holder (410), the third substrate (430), and the image sensor module (440) are supported by a wire (510) and can be arranged in a flying structure below the second substrate (120).

[0127] The third substrate (430) may include an insulating layer (431). The insulating layer (431) may be coupled to the lower surface of the substrate holder (410). The insulating layer (431) may be coupled to a reinforcing member (420). The insulating layer (431) may be coupled to an image sensor module (440). The insulating layer (431) may include a coupling hole (431-1). The coupling hole (431-1) may be coupled to a first projection (414) of the substrate holder (410). The insulating layer (431) may include a protrusion (431-2). The protrusion (431-2) may be formed to protrude inward from a corner of the insulating layer (431). Through the protrusion (431-2), a space for the coupling hole (431-1) to be formed may be secured. A coupling hole (431-1) may be formed in the protrusion (431-2).

[0128] Additionally, the insulating layer (431) may include a first open region (433).

[0129] Preferably, the first open area (433) can be aligned on the optical axis (OA) with the fourth open area (121) of the second substrate (120), the image sensor (444) placed below, the second open area (424) of the reinforcing member (420), and the third open area (411) of the substrate holder (410).

[0130] The third substrate (430) may include an insulating layer (431) and a first lead pattern portion (432) disposed on the insulating layer (431).

[0131] The first lead pattern section (432) can be electrically connected to the terminals of the image sensor (444). The first lead pattern section (432) may be composed of multiple units. For example, the first lead pattern section (432) may include a total of 20 terminal sections. That is, the number of terminals of the first lead pattern section (432) may correspond to the number of wires (510).

[0132] At this time, the first lead pattern section (432) may include a first-1 lead pattern section (432a) disposed in a first region of the insulating layer (431), a first-2 lead pattern section (432b) disposed in a second region facing the first region of the insulating layer (431), a first-3 lead pattern section (432c) disposed in a third region between the first and second regions of the insulating layer (431), and a first-4 lead pattern section (432d) disposed in a fourth region facing the third region of the insulating layer (431).

[0133] Additionally, each of the 1-1 to 1-4 lead pattern sections (432a, 432b, 432c, 432d) may include a first pattern section (432-1) disposed on an insulating layer (431), a second pattern section (432-2) coupled with a wire (510), and a connecting section (432-3) connecting the first pattern section (432-1) and the second pattern section (432-2). A hole through which the wire (510) passes may be formed in the second pattern section (432-2). The second pattern section (432-2) may be coupled with the wire (510) by soldering. The connecting section (432-3) may include a bent portion. The connecting section (432-3) may be bent multiple times in one direction. The connecting section (432-3) may have elasticity. The first lead pattern part (432) can have elasticity.

[0134] The first pattern section (432-1) can be electrically connected to an image sensor module. That is, the first pattern section (432) may be a mounting pad for mounting an image sensor (444) or an image sensor module.

[0135] The second pattern portion (432-2) may be a bonding pad electrically connected to the wire (510). That is, the second pattern portion (432-2) may be a soldering pad that is soldered to the wire (510). To this end, the second pattern portion (432-2) may include a first insertion hole through which the wire (510) passes. Furthermore, the first insertion hole may be aligned in a vertical direction with the second insertion hole formed within the substrate holder and the third insertion hole formed in the driving substrate.

[0136] The connecting portion (432-3) can connect the first pattern portion (432-1) and the second pattern portion (432-2) to each other. To this end, the connecting portion (432-3) may include a plurality of folded portions. At this time, the connecting portions (432-3) of each first lead pattern portion (432a, 432b, 432c, 432d) may be folded in the same direction. For example, as shown in FIG. 11b, the connecting portions (432-3) of each first lead pattern portion (432a, 432b, 432c, 432d) may include a folded portion that rotates clockwise. That is, the connecting portion (432-3) may be folded in a direction corresponding to the rotation direction in the z-axis direction of the image sensor module. Accordingly, the connecting portion (432-3) can minimize damage to the first lead pattern portion (432) when rotated in the z-axis direction, thereby preventing cracks or detachment from the insulating layer in the first lead pattern portion (432). Meanwhile, in the embodiment, an adhesive member (not shown) may be placed between the insulating layer (431) and the first lead pattern portion (432). The adhesive member may be interposed between the insulating layer (431) and the first lead pattern portion (432) to prevent detachment of the first lead pattern portion (432) on the insulating layer (431). The adhesive member may include a curing adhesive, etc.

[0137] Meanwhile, the first lead pattern portion (432) is a wiring that transmits an electrical signal and can be formed from a metal material with high electrical conductivity. To this end, the first lead pattern portion (432) can be formed from at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Additionally, the first lead pattern portion (432) can be formed from a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which has excellent bonding strength.

[0138] Preferably, the first lead pattern portion (432) may be formed of a metallic material having elasticity capable of moving the third substrate (430) relative to the second substrate (120) in the X-axis, Y-axis, and Z-axis directions while serving as wiring for transmitting electrical signals. To this end, the first lead pattern portion (432) may be formed of a metallic material having a tensile strength of 1000 MPa or more. For example, the first lead pattern portion (432) may be a binary alloy or a ternary alloy containing copper. For example, the first lead pattern portion (432) may be a copper (Cu)-nickel (Ni) binary alloy. For example, the first lead pattern portion (432) may be a copper (Cu)-tin (Sn) binary alloy. For example, the first lead pattern portion (432) may be a copper (Cu)-beryllium (Be) binary alloy. For example, the first lead pattern portion (432) may be a binary alloy of copper (Cu) and cobalt (Co). For example, the first lead pattern portion (432) may be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn). For example, the first lead pattern portion (432) may be a ternary alloy of copper (Cu), beryllium (Be), and cobalt (Co). In addition to the above metal materials, the first lead pattern portion (432) may be formed from an alloy of iron (Fe), nickel (Ni), zinc, etc., which has good electrical properties and elasticity capable of acting as a spring. Additionally, the first lead pattern portion (432) may be surface-treated with a plating layer containing metal materials such as gold (Au), silver (Ag), and palladium (Pd), thereby improving electrical conductivity.

[0139] Meanwhile, the first lead pattern section (432) can be manufactured using the additive process, subtractive process, MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process) processes, which are conventional manufacturing processes for printed circuit boards.

[0140] Referring to FIGS. 11b and FIGS. 11c, the third substrate (430) will be described in more detail.

[0141] As shown in FIG. 11b, a first lead pattern portion (432a, 432b, 432c, 432d) is disposed in each region of the insulating layer (431).

[0142] At this time, the placement positions of the first lead pattern parts (432a, 432b, 432c, 432d) may be aligned on the same vertical extension line or horizontal extension line.

[0143] For example, the first-1 lead pattern section (432a) and the first-2 lead pattern section (432b) may be respectively placed on the first and second regions facing each other of the insulating layer (431). The placement positions of the first-1 lead pattern section (432a) and the first-2 lead pattern section (432b) may be aligned on the same horizontal extension line. For example, the first-1 lead pattern section (432a) and the first-2 lead pattern section (432b) may have a symmetrical structure with respect to each other.

[0144] Additionally, the first-3 lead pattern section (432c) and the first-4 lead pattern section (432d) may be respectively placed on the third and fourth regions facing each other of the insulating layer (431). The placement positions of the first-3 lead pattern section (432c) and the first-4 lead pattern section (432d) may be aligned on the same vertical extension line. The first-3 lead pattern section (432c) and the first-4 lead pattern section (432d) may have a symmetrical structure with respect to each other.

[0145] Meanwhile, the first pattern section (432-1) may include a mounting section (432-11) on which the image sensor (444) or image sensor module (440) is mounted, and an extension section (432-12) extending from the mounting section (432-11). At this time, the mounting section (432-11) may have a flat surface in the shape of a square pad so that the image sensor (444) or image sensor module (440) is stably mounted. The extension section (432-12) may extend from the mounting section (432-11) and be connected to a connection section (432-3).

[0146] At this time, the extension portion (432-12) can be bent from the mounting portion (432-11). Accordingly, the centerline of the extension portion (432-12) can be spaced apart from the centerline of the mounting portion (432-11) by a third distance (d3).

[0147] Additionally, the extension portion (432-12) may include a buffer pattern portion for buffering purposes in the area (A) connected to the connection portion (432-3). The buffer pattern portion may have a shape in which the width gradually decreases as it moves toward the direction in which the connection portion (432-3) is positioned. That is, the extension portion (432-12) may include a bent portion that is bent and extended from the mounting portion (432-11), and a buffer portion in an area that extends from the bent portion and whose width gradually decreases as it moves away from the bent portion. The buffer portion can resolve problems such as pattern breakage caused by the difference in pattern width between the first pattern portion (432-1) and the connection portion (432-3), and can stably connect the connection portion (432-3) and the mounting portion (432-11).

[0148] In addition, the buffer portion may not overlap within the vertical direction with the insulating layer. Through this, when the substrate is tilted as well as moved along the X, Y, and Z axes, the point where the connection portion and the pattern portion are connected does not exist on the insulating layer but is formed outside the insulating layer, thereby efficiently reducing pattern breakage caused by the width difference between the connection portion and the pattern portion.

[0149] Meanwhile, the center of the second pattern section (432-2) and the center of the first pattern section (432-1) may be placed on the same vertical or horizontal extension line. That is, the center of the second pattern section (432-2) and the center of the first pattern section (432-1) may be aligned on the same vertical or horizontal line. To this end, the first pattern section (432-1) may include an extension section (432-12) that is bent from the mounting section (432-11). According to this, the wire (510) connected to the second pattern section (432-2) and the terminal of the image sensor (444) placed on the first pattern section (432-1) may be aligned on the same vertical or horizontal line, thereby improving the accuracy of the movement position of the image sensor (444).

[0150] Meanwhile, the first pattern section (432-1) of the first lead pattern section (432) is disposed on the insulating layer (431), and the second pattern section (432-2) and the connecting section (432-3) are flying lead pattern sections extending horizontally from the insulating layer (431). That is, the first pattern section (432-1) is disposed at a position that overlaps within the vertical direction with the insulating layer (431). And, the second pattern section (432-2) and the connecting section (432-3) are disposed at a position that does not overlap within the vertical direction with the insulating layer (431). That is, the insulating layer (431) may be disposed below the first pattern section (432-1), and the insulating layer (431) may not be disposed below the second pattern section (432-2) and the connecting section (432-3).

[0152] Meanwhile, the camera device (100A) may include an image sensor module (440). The image sensor module (440) may be coupled to a substrate holder (410). The image sensor module (440) may be fixed to the substrate holder (410). The image sensor module (440) may move integrally with the substrate holder (410). The image sensor module (440) may include a cover (441), a filter (442), a fourth substrate (443), an image sensor (444), and a reinforcing plate (445). However, one or more of the cover (441), filter (442), fourth substrate (443), image sensor (444), and reinforcing plate (445) of the image sensor module (440) may be omitted.

[0153] The image sensor module (440) may include a cover (441). The cover (441) may cover the filter (442) and the image sensor (444). The cover (441) may include a top plate and a side wall. The cover (441) may include a hole (441a). The hole (441a) may be a hollow hole. The hole (441a) may be an opening. The cover (441) may include a protrusion (441b). The protrusion (441b) may protrude from the lower surface of the cover (441). The protrusion (441b) may be inserted into the second hole (443b) of the substrate (4430) and the hole (445a) of the reinforcing plate (445).

[0154] The image sensor module (440) may include a filter (442). The filter (442) may serve to block light of a specific frequency band from passing through the lens module (210) from entering the image sensor (444). The filter (442) may be positioned parallel to the xy plane. The filter (442) may be positioned between the lens module (210) and the image sensor (444). The filter (442) may be positioned between the cover (441) and the fourth substrate (443). As a variation, the filter (442) may be positioned in the hole (441a) of the cover (441). The filter (442) may include an infrared filter. The infrared filter may absorb or reflect infrared light incident on the infrared filter.

[0155] The image sensor module (440) may include a fourth substrate (443). The fourth substrate (443) may be a substrate for mounting an image sensor (444) in a package form. The fourth substrate (443) may include a printed circuit board (PCB). The fourth substrate (443) may include a circuit board. An image sensor (444) may be placed on the fourth substrate (443). The fourth substrate (443) may be coupled to the third substrate (430). The fourth substrate (443) may include a first hole (443a) having a shape and size corresponding to the image sensor (444). An image sensor (444) may be inserted and placed in the first hole (443a) of the fourth substrate (443). The fourth substrate (443) may include a second hole (443b). A projection (441b) of the cover (441) may be inserted into the second hole (443b) of the fourth substrate (443). The fourth substrate (443) may include a terminal (443c). The terminal (443c) of the fourth substrate (443) may be placed at each of the four side ends on the lower surface of the fourth substrate (443). The terminal (443c) of the fourth substrate (443) may be connected to the first lead pattern portion (432) of the third substrate (430). More specifically, the terminal (443c) of the fourth substrate (443) may be connected to the first pattern portion (432-1) of the first lead pattern portion (432) of the third substrate (430).

[0156] The fourth substrate (443) may include a groove (443d). The groove (443d) of the fourth substrate (443) may be formed at each of the four corners of the fourth substrate (443). The first projection (414) of the substrate holder (410) may be avoided by the groove (443d) of the fourth substrate (443).

[0157] The image sensor module (440) may include an image sensor (444). The image sensor (444) may be coupled to a substrate holder (410). The image sensor (444) may move integrally with the substrate holder (410). However, the image sensor (444) may not be directly coupled to the substrate holder (410), but rather a fourth substrate (443) to which the image sensor (444) is coupled may be coupled to the substrate holder (410). As a variation, the image sensor (444) may be directly coupled to the substrate holder (410). The image sensor (444) may be aligned with the optical module. The image sensor (444) may be configured such that an image is formed when light passing through a lens and a filter (442) is incident. The image sensor (444) may be mounted on the fourth substrate (443). The image sensor (444) may be electrically connected to the fourth substrate (443). For example, the image sensor (444) may be coupled to the fourth substrate (443) by surface mounting technology (SMT). As another example, the image sensor (444) may be coupled to the fourth substrate (443) by flip chip technology. The image sensor (444) may be positioned so that the optical axis of the lens aligns with the optical axis. That is, the optical axis of the image sensor (444) and the optical axis of the lens may be aligned. The image sensor (444) may convert light incident on the effective image area of ​​the image sensor (444) into an electrical signal. The image sensor (444) may be any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID.

[0158] In this embodiment, the image sensor (444) can be rotated around the x-axis, y-axis, and z-axis. The image sensor (444) can be moved around the x-axis, y-axis, and z-axis. The image sensor (444) can be tilted around the x-axis, y-axis, and z-axis.

[0159] The image sensor module (440) may include a reinforcing plate (445). The reinforcing plate (445) may be placed on the lower surface of the image sensor (444) and the fourth substrate (443). The reinforcing plate (445) may be formed of stainless steel (SUS). The reinforcing plate (445) may reinforce the image sensor (444) and the fourth substrate (443). The reinforcing plate (445) may include a hole (445a). The hole (445a) may be coupled with a projection (441b) of the cover (441). The reinforcing plate (445) may include a groove (445b). The groove (445b) may be formed at each of the four corners of the reinforcing plate (445). The groove (445b) may be formed by the corner of the reinforcing plate (445) being recessed inward.

[0160] The camera device (100A) may include a wire (510). The wire (510) may connect the second substrate (120) and the third substrate (430). The wire (510) may have elasticity. The wire (510) may be an elastic member. The wire (510) may be a wire spring. At this time, the wire (510) may electrically connect the second lead pattern portion (122) of the second substrate (120) and the first lead pattern portion (432) of the third substrate (430) while maintaining a certain distance between the second substrate (120) and the third substrate (430).

[0161] The wire (510) may be formed of metal. The wire (510) may be electrically connected to the image sensor (444). The wire (510) may be used as a conductive line of the image sensor (444). One end of the wire (510) may be connected to the second substrate (120), and the other end of the wire (510) may be connected to the first lead pattern portion (432). The wire (510) may elastically support the movement of the substrate holder (410).

[0162] The wire (510) may include a plurality of wires. The plurality of wires may include a number of wires corresponding to the number of terminals of the image sensor (444). The plurality of wires may include a total of 20 wires, with 6 wires between adjacent corners among the 4 corners of the substrate holder.

[0163] The camera device (100A) may include a sensor (520). The sensor (520) may be placed on the upper surface of the second substrate (120). The sensor (520) may include a Hall sensor (Hall IC). The sensor (520) may detect the magnetic force of the magnet (320). The movement of the image sensor (444) can be detected in real time through the magnetic force of the magnet (320) detected by the sensor (520). Through this, OIS feedback control may be possible.

[0164] The sensor (520) may include a plurality of sensors. The sensor (520) may include three sensors. Through the three sensors, movement in the x-axis direction, movement in the y-axis direction, and rotation around the z-axis of the image sensor (444) can all be detected. The sensor (520) may include first to third sensors. The first sensor may be opposite to the first magnet (321), the second sensor may be opposite to the second magnet (322), and the third sensor may be opposite to the third magnet (323).

[0165] The camera device (100A) may include a housing (600). The housing (600) may be coupled with a holder (110). The housing (600) may provide an internal space through coupling with the holder (110). The exterior of the camera device (100A) may be formed by the housing (600) and the holder (110). The housing (600) may accommodate components such as a coil (310) and a magnet (320) inside. The housing (600) may include a shield can.

[0166] The housing (600) may include a side wall (610). The side wall (610) may include a plurality of side walls. The side wall (610) may include four side walls. The housing (600) may include a lower portion (620). The lower portion (620) may extend inward from the bottom of the side wall (610). The lower portion (620) may include a hole. The lower surface of the housing (600) may be formed by a separate lower plate (630). The lower plate (630) may be understood as a component of the housing (600) or as a separate component. The lower plate (630) may include a groove (631) that fits with a projection (622) protruding from the lower surface of the lower portion (620) of the housing (600).

[0167] The camera device (100A) may include a first substrate (150). The first substrate (150) may be electrically connected to a coil (310). The first substrate (150) may include a terminal (150a) that is coupled to a terminal (222) of a MEMS actuator (220). The first substrate (150) may include a hole through which a lens module (210) passes.

[0168] The camera device (100A) may include a connector (190). The connector (190) may be electrically connected to the first substrate (150). The connector (190) may include a port for electrically connecting to an external device.

[0169] The camera device (100A) may include a motion sensor. The motion sensor may be mounted on a first substrate (150). The motion sensor may be electrically connected to a control unit through a circuit pattern provided on the first substrate (150). The motion sensor may output rotational angular velocity information based on the movement of the camera device (100A). The motion sensor may include one or more of a 2-axis gyro sensor, a 3-axis gyro sensor, and an angular velocity sensor.

[0170] The camera device (100A) may include a control unit. The control unit may be placed on a first substrate (150). The control unit may be electrically connected to a coil (310). The control unit may individually control the direction, intensity, and amplitude of the current supplied to the first to fourth coils (311, 312, 313, 314). The control unit may perform an autofocus function and / or a hand shake correction function by controlling the current applied to the coil (310) and the current applied to the MEMS actuator (220). Furthermore, the control unit may perform autofocus feedback control and / or hand shake correction feedback control.

[0171] The camera device (100A) according to the present embodiment may be for mobile camera application. That is, it can be distinguished from a camera device for digital camera application. When miniaturized for mobile camera application, the driving force of the VCM is relatively reduced, so there is a problem that the current consumed to implement three operations (X-Shift, Y-Shift, Z-Rotation (Roll)) increases.

[0172] The magnet (320) and the coil (310) are rotated 90 degrees at each corner (corner) of the substrate holder (410) so that the magnet (320) and the coil (310) located diagonally can be assembled in the same direction. In this case, when shifting the image sensor (444), a Lorentz force in the same direction is generated, and when rotating the z-axis, two pairs of rotational forces can be generated as forces in opposite directions.

[0173] In this embodiment, since the four coils located at the corners require independent current inputs, the power terminals of the coils (310) can be separated to have a system that controls them into four channels. That is, this embodiment may include a diagonal arrangement structure of magnets in the same magnetic flux direction and a structure for individual current inputs for the four coils.

[0174] This embodiment may include two pairs of torque generating structures (increasing rotational moment). With a structure that generates two pairs of torque, it can generate a higher rotational moment compared to conventional methods and can reduce the total current consumption when driving in three modes: X-Shift, Y-Shift, and Z-Rotation (Roll).

[0175] The simulation results for the camera device according to the present embodiment are as follows. When 'rotational moment = torque * distance between torques = (electromagnetic force * input current) * distance between centers of magnets (320)', it was confirmed that when 50mA is applied as an input current to the coil (310) of the camera device (100A) according to the present embodiment, a rotational moment of {(0.094mN / mA x 50mA) x 12.14mm} x 2 = 114.1 mN.mm is generated.

[0176] In this embodiment, image stabilization for the image sensor (444) and image stabilization for the corresponding lens can be performed together. For example, if image stabilization is performed only by the MEMS actuator (220), positive (+) distortion may occur at the edges of the image obtained from the image sensor (444). On the other hand, if image stabilization is performed by moving only the image sensor (444), negative (-) distortion may occur at the edges of the image obtained from the image sensor (444). In this embodiment, image stabilization for the image sensor (444) and image stabilization in the MEMS actuator (220) are performed together, so that distortion occurring at the edges of the image can be minimized. In this embodiment, the image stabilization function is performed on the lens side through the MEMS actuator (220), and the image sensor (444) can also be moved accordingly. Through this, it is possible to provide a level of shake correction corresponding to a module movement method in which the lens and the image sensor (444) move as a single unit. However, in this embodiment, the MEMS actuator (220) may only provide an AF function and may also perform an OIS function through the movement of the image sensor (444).

[0178] In the following, a second substrate (120), a third substrate (430), a fourth substrate (443) according to an embodiment, and a wire (510) electrically connecting them to each other may be included.

[0179] Here, a second lead pattern portion (122) is formed on the second substrate (120). And, a first lead pattern portion (432) is formed on the third substrate (430). An image sensor (444) is mounted on the fourth substrate (443). In addition, the second lead pattern portion (122) and the first lead pattern portion (432) are interconnected through a wire (510).

[0180] Additionally, the terminal (443c) of the fourth substrate (443) is connected to the first lead pattern portion (432) of the third substrate (430).

[0181] Accordingly, the first lead pattern portion (432) of the third substrate (430) and the second lead pattern portion (122) of the second substrate (120) are aligned and arranged in the direction of the optical axis. Additionally, the first lead pattern portion (432) of the third substrate (430) and the terminal (443c) of the fourth substrate (443) are aligned and arranged in a direction perpendicular to the direction of the optical axis.

[0182] At this time, in the above embodiment, the wire (510) may be composed of 20 wires.

[0183] Accordingly, the first lead pattern portion (432) of the third substrate (430) may also include 20 lead patterns. Additionally, the second lead pattern portion (122) of the second substrate (120) may also include 20 lead patterns. Furthermore, the terminal (443c) of the fourth substrate (443) may also be composed of 20 terminals.

[0184] Accordingly, the terminal (443c) of the fourth substrate (443) can be connected in a 1:1 manner with one end of the first lead pattern portion (432) of the third substrate (430).

[0185] Additionally, one end of the wire (510) can be connected in a 1:1 manner to the other end of the first lead pattern portion (432) of the third substrate (430).

[0186] Additionally, the other end of the wire (510) can be connected in a 1:1 manner with the second lead pattern portion (122) of the second substrate (120).

[0187] Meanwhile, in the embodiment, the image sensor (444) may include a plurality of connection pins. In this case, the number of connection pins of the image sensor (444) may be greater than the number of wires (510), the first lead pattern part (432), the second lead pattern part (122), and the terminals (443c).

[0188] For example, the image sensor (444) may include at least 24 connection pins. For example, the image sensor (444) may include at least 30 connection pins. For example, the image sensor (444) may include at least 36 connection pins.

[0189] Below, the number of connection pins of an image sensor (444) of one specification and their functions are as shown in Table 1.

[0190] NO Symbol function 1 VDDH 1st analog power supply pin (2.8V) 2 VDDM 2nd analog power supply pin (1.8V) 3 VSSL Digital ground (for power) 4 VDDL 1st digital power supply pin (1.05V) 5 GND Digital Ground (for MIPI lines) 6 D3P 3-1 Image Signal Output Pin 7 D3N 3-2 Image Signal Output Pin 8 GND Digital Ground (for MIPI lines) 9 GND Digital Ground (for MIPI lines) 10 D1P 1-1 Image signal output pin 11 D1N 1-2 Image Signal Output Pin 12 GND Digital Ground (for MIPI lines) 13 GND Digital Ground (for MIPI lines) 14 CKP 1-1 Clock signal output pin 15 CKN 1st-2nd clock signal output pin 16 GND Digital Ground (for MIPI lines) 17 GND Digital Ground (for MIPI lines) 18 D2P 2-1 Image signal output pin 19 D2N 2-2 Image Signal Output Pin 20 GND Digital Ground (for MIPI lines) 21 GND Digital Ground (for MIPI lines) 22 D4P 4-1 Image Signal Output Pin 23 D4N 4-2 Image Signal Output Pin 24 GND Digital Ground (for MIPI lines) 25 VSSH Analog ground (for power) 26 XCLR Digital Input Pin (CHIP CLEAR) 27 SDA Digital I / O (I2C pins) 28 SCL Digital I / O (I2C pins) 29 INCK Digital Input Pin (CLOCK INPUT) 30 GPO MONITOR SIGNAL OUT pin 31 SLASEL I2C slave address change pin 32 TENABLE TEST ENABLE pin 33 TESTOUT MONITOR SIGNAL OUT pin 34 FSTROBE Digital output pin (FLASH STROBE) 35 XVS Digital I / O (DUAL SYNC) 36 AGND Analog ground

[0192] Before describing Table 1, the second lead pattern portion (122) in the second substrate (120) may be arranged with five portions each in four side sections centered around the central opening area. That is, the second lead pattern portion (122) may be arranged with five portions each in a first area and a second area facing each other in a first direction with the opening area of ​​the second substrate (120) in between, and in a third area and a fourth area facing each other in a second direction perpendicular to the first direction.

[0193] Additionally, the first lead pattern portion (432) in the third substrate (430) may be arranged in groups of five on each of the four side portions centered around the central opening area. That is, the first lead pattern portion (432) may be arranged in groups of five on each of the first area and the second area facing each other in the first direction with the opening area of ​​the third substrate (430) in between, and the third area and the fourth area facing each other in the second direction perpendicular to the first direction.

[0194] Additionally, the terminals (443c) of the fourth substrate (443) may be arranged in groups of five on each of the four side sections centered around the central opening area. That is, the terminals (443c) may be arranged in groups of five on each of the first and second regions facing each other in a first direction with the opening area of ​​the fourth substrate (443) in between, and the third and fourth regions facing each other in a second direction perpendicular to the first direction.

[0195] And, lead pattern portions or terminals placed at the same location on each substrate can be connected to each other.

[0196] For example, a terminal (443c) of the fourth substrate (443) positioned at the uppermost side of the first region can be connected to a first lead pattern portion (432) of the third substrate (430) positioned at the uppermost side of the first region. Additionally, a first lead pattern portion positioned at the uppermost side of the first region of the first lead pattern portion (432) of the third substrate (430) can be connected to a second lead pattern portion (122) of the second substrate (120) positioned at the uppermost side of the first region of the second substrate (120).

[0197] Accordingly, the arrangement of the terminal (443c) of the fourth substrate (443) substantially corresponds to the arrangement of the first lead pattern portion (432) of the third substrate (430), and also corresponds to the arrangement of the second lead pattern portion (122) of the second substrate (120).

[0198] Hereinafter, the arrangement of the terminal (443c) of the fourth substrate (443) will be described. In addition, the arrangement of the second lead pattern portion (122) of the second substrate (120) and the arrangement of the first lead pattern portion (432) of the third substrate (430) may be made corresponding to the arrangement of the terminal (443c) described below.

[0199] As shown in Table 1 above, a typical image sensor has a total of 36 connection pins.

[0200] Therefore, the fourth substrate (443) must have terminals for connection with the 36 connection pins.

[0201] In this embodiment, terminals (443c) are formed on the fourth substrate (443) to be connected to only 20 of the 36 connection pins present in the image sensor (444). In this case, reducing the 36 terminals to 20 can be achieved by removing terminals connected to unnecessary connection pins among the connection pins. However, if the unnecessary connection pins are simply removed, noise may occur in the signal transmitted from the image sensor (444), or problems may arise with signal transmission reliability.

[0202] Accordingly, in the embodiment, the arrangement design for the 20 terminals minimizes the noise effect on the image signal and thereby improves reliability.

[0203] Among the 36 connection pins mentioned above, there are a total of 10 digital grounds (for MIPI lines). This is to minimize noise in the image signal caused by connection pins such as power signals during the transmission of the image signal, and accordingly, noise is blocked by using the digital grounds (for MIPI lines).

[0204] However, in the embodiment, 10 digital grounds (for MIPI lines) are integrated into one, and accordingly, through the arrangement design of the terminal (443c) of the fourth board (443) connected to each connection pin, the noise influence level is substantially the same as that of having 10 digital grounds (for MIPI lines).

[0205] In addition, among the 36 connection pins mentioned above, there are a total of 3 power grounds. That is, the power grounds include analog grounds (AGND, VSSH) and digital grounds (VSSL). In addition, in the embodiment, this is reduced to one, and by arranging the terminal (443c), the noise effect caused by the power signal can be minimized even if only one power ground is used.

[0206] In addition, the 36 connection pins mentioned above include pins for adding additional functions or for verification. For example, there are connection pins for synchronization when using two image sensors simultaneously, or connection pins for providing various verification or functions.

[0207] That is, among the 36 connection pins mentioned above, connection pins for additional functions or verification include 'SLASEL', 'TENABLE', 'TESTOUT', 'FSTROBE', 'XVS', etc. Here, 'SLASEL' is a connection pin for changing the slave address, 'TENABLE' is a pin for test enable, 'TESTOUT' is a pin for monitoring the image sensor, 'FSTROBE' is a pin for flash light control, and 'XVS' is a pin for synchronization when using two image sensors. Accordingly, in the embodiment, since it is possible to monitor the status of the image sensor using the 'GPO' connection pin, the terminal (443c) connected to the five connection pins ('SLASEL', 'TENABLE', 'TESTOUT', 'FSTROBE', 'XVS') is removed.

[0208] Accordingly, in the past, 36 terminals were required on the fourth substrate (443) to connect with the 36 connection pins of the image sensor. In contrast, in the embodiment, terminals connected to 9 digital ground connection pins, 1 analog ground connection pin, and 6 additional / verification connection pins among the 36 connection pins are removed, and accordingly, only terminals (443c) connected to the remaining 20 connection pins are formed on the fourth substrate (443).

[0209] At this time, depending on the arrangement of the 20 terminals (443c), noise may be included in the image signal, and reliability issues may occur due to synchronization errors. Therefore, in the embodiment, to minimize these problems, the terminals (443c) are arranged within a range that does not affect each other.

[0210] In the embodiment, there may be 20 terminals (443c). That is, in the embodiment, the first lead pattern portion (432) and the second lead pattern portion (122) may be included, which are electrically connected to 20 of the connection pins provided in the image sensor (444).

[0211] Among the connection pins provided in the image sensor (444), the connection pins electrically connected to the first substrate (150), the second substrate (120), the third substrate (430), and the fourth substrate (443) may include the first to 20th connection pins.

[0212] The first to 20 connection pins may include a data output pin for transmitting an image signal according to the MIPI (Mobile Industry Processor Interface) protocol, a power supply pin for power supply, an analog ground pin for grounding the power, a digital ground pin for grounding the data transmission line of the data output pin, and a communication pin for communication with a master.

[0213] The image sensor (444) can output an image signal through four channels. Accordingly, among the first to 20 connection pins of the image sensor (444), four data output pins may be included to transmit an image signal through four channels.

[0214] At this time, the image sensor (444) can transmit the image signal through the transmission of a differential signal. Accordingly, the data output pins of the four channels each include a positive pin and a negative pin. Accordingly, among the first to 20 connection pins of the image sensor (444), a total of eight data output pins may be included. That is, the eight data output pins are image signal output pins, and can also be called MIPI pins.

[0215] Additionally, the image sensor (444) can transmit a clock signal for an image signal transmitted through the eight data output pins. Accordingly, the first to 20th connection pins of the image sensor (444) may include a clock output pin for the image signal. At this time, the clock signal of the image signal may also be transmitted using a differential voltage. Therefore, the first to 20th connection pins of the image sensor (444) may include two clock output pins.

[0216] Additionally, the image sensor (444) may receive power through three power supply lines. Accordingly, among the first to 20th connection pins of the image sensor (444), three power pins may be included for receiving power. For example, the first to 20th connection pins of the image sensor (444) may include a first analog power supply pin (VDDH of Table 1), a second analog power supply pin (VDDM of Table 1), and a digital power supply pin (VDDL of Table 1). The first analog power supply pin may be a pin for receiving 2.8V of power. The second analog power supply pin may be a pin for receiving 1.8V of power. Additionally, the digital power supply pin may be a pin for receiving 1.05V of power.

[0217] Additionally, among the first to 20 connection pins of the image sensor (444), a ground pin may be included. The image sensor (444) may include a first ground pin (VSSH in Table 1) for the ground of the analog power supply. Additionally, the image sensor (444) may include a ground (GND in Table 1) for the MIPI line.

[0218] Additionally, among the first to twentieth connection pins of the image sensor (444), there is a communication pin for communication with the master. The communication pin may be a pin for transmitting signals for operational reliability. For example, the communication pin may include a pin for performing a synchronization sequence for initial operation. For example, the communication pin may include a pin for transmitting data for initial synchronization (SDA in Table 1) and a pin for transmitting a clock (SCL in Table 1). Additionally, the communication pin may include a master clock pin (INCK in Table 1) for transmitting a clock from the master to the image sensor (444). Additionally, the communication pin may include a reset pin (XCLR in Table 1) for resetting the image sensor (444). Additionally, the communication pin may include a monitoring pin (GPO in Table 1) for monitoring the image sensor (444).

[0219] As described above, the image sensor (444) includes a plurality of connection pins, of which only 20 connection pins can be connected to the terminal (443c) of the fourth substrate (443).

[0220] In addition, the 20 connection pins may include 8 image signal output pins, 2 clock output pins for image signals, 3 power signal input pins, 2 ground pins, and 5 communication pins.

[0221] The above eight image signal output pins include first to fourth image signal transmission pins. And, the first to fourth image signal transmission pins each include a first sub-image signal transmission pin and a second sub-image signal transmission pin for differential signal transmission.

[0222] Accordingly, the first to fourth image signal transmission pins may include a first-1 image signal transmission pin, a first-2 image signal transmission pin, a second-1 image signal transmission pin, a second-2 image signal transmission pin, a third-1 image signal transmission pin, a third-2 image signal transmission pin, a fourth-1 image signal transmission pin, and a fourth-4 image signal transmission pin.

[0223] The clock output pins for the two image signals are pins that output a clock signal for the image signal output through the eight image signal output pins. In addition, the clock output pins for the image signals are also configured with two for differential signal transmission.

[0224] In addition, the power signal input pin includes a first analog power input pin, a second analog power input pin, and a digital power input pin.

[0225] In addition, the ground pin includes a first ground pin for grounding the power signal and a second ground pin for grounding the line for the image signal output.

[0226] Additionally, the communication pin includes a monitoring pin for monitoring the status of the image sensor (444), two synchronization communication pins for initial synchronization, one reset pin for reset, and a mask clock input pin for the clock input of the master.

[0227] In this embodiment, the terminal (443c) included on the fourth substrate (443) is connected to each of the 20 connection pins. Here, among the 20 connection pins, there are connection pins that are resistant to noise, and there are connection pins that are sensitive to noise or are of high importance that must not contain noise.

[0228] Accordingly, in the embodiment, the terminal (443c) connected to the 20 connection pins is arranged with consideration of the above matters, thereby resolving the reliability problem that occurs as the ground pin is reduced.

[0229] As shown in FIG. 14, the fourth substrate (443) has an open area formed in the center.

[0230] One surface of the fourth substrate (443) includes a first region (443-1) and a second region (443-2) arranged facing each other in a first direction with the open region in between. Additionally, one surface of the fourth substrate (443) includes a third region (443-3) and a fourth region (443-4) arranged facing each other in a second direction with the open region in between.

[0231] And, five terminals are arranged in each of the first to fourth regions (443-1, 443-2, 443-3, 443-4).

[0232] For example, the first to fifth terminals (443-11, 443-12, 443-13, 443-14, 443-15) are disposed in the first region (443-1) of the fourth substrate (443). For example, the sixth to tenth terminals (443-21, 443-22, 443-23, 443-24, 443-25) are disposed in the second region (443-2) of the fourth substrate (443). For example, the eleventh to fifteenth terminals (443-31, 443-32, 443-33, 443-34, 443-35) are disposed in the third region (443-3) of the fourth substrate (443). For example, the 16th to 20th terminals (443-41, 443-42, 443-43, 443-44, 443-45) are disposed in the 4th region (443-4) of the 4th substrate (443).

[0233] Here, in the embodiment, the following matters are considered regarding the terminal arrangement.

[0234] (1) The terminal connected to the image signal output pin is placed far away from the terminal connected to the power signal input pin. This is to prevent noise from being included in the image signal by the power signal, as the power signal may contain noise.

[0235] (2) The terminal connected to the clock signal output pin for the image signal is placed far from the terminal connected to the power signal input pin. This is to prevent noise from being included in the clock signal by the power signal, as the power signal may contain noise.

[0236] (3) The terminals connected to the differential signal pins of the same signal at each connection pin are placed adjacent to each other. This is because the differential signal pins of the same signal must be placed adjacent to each other to achieve the effect of differential signal transmission.

[0237] (4) Around the terminal connected to the clock signal output pin for the most important image signal, a terminal connected to a connection pin having the lowest voltage level and no noise generation is placed. This is because the clock signal transmitted through the clock signal output pin is most important for the reliability of image signal transmission, and thus the reliability of the clock signal is increased.

[0238] (5) The terminals connected to the image signal output pins are each placed in adjacent areas. This is to ensure that the image signals are placed adjacent to each other and to minimize the length of the transmission path of the image signals, thereby improving the quality of the image signals.

[0239] (6) Among the terminals connected to the image signal output pins, terminals of different channels are spaced apart from each other. This is to minimize mutual interference between each image signal.

[0241] Accordingly, the first region (443-1) may include a terminal connected to an image signal output pin. At this time, according to considerations (2), (3), (5), and (6) among the above considerations, the terminals connected to two-channel image signal output pins may be spaced apart from each other in the first region (443-1).

[0242] For example, the first terminal (443-11) may be connected to the first-1 image signal output pin of the image sensor (444). Additionally, the second terminal (443-12) may be connected to the first-2 image signal output pin of the image sensor (444). Additionally, the fourth terminal (443-14) may be the second-1 image signal output pin. Additionally, the fifth terminal (443-15) may be the second-2 image signal output pin. That is, terminals connected to image signal output pins that transmit differential signals of the same signal are placed adjacent to each other, and terminals connected to image signal output pins that transmit differential signals of different signals are placed spaced apart.

[0243] Accordingly, the third terminal (443-13), located between the second terminal (443-12) and the fourth terminal (443-14), can be connected to a pin other than the image signal output pin and the power signal input pin. At this time, in order to reduce noise in the image signal transmitted through each of the image signal output pins, the third terminal (443-13) can be connected to a monitoring pin. The monitoring pin transmits a signal with a voltage level of about 1.6V, and accordingly, the third terminal (443-13) is connected to the monitoring pin, which has a lower voltage level compared to other pins.

[0244] A terminal connected to a power signal input pin may be disposed in the second area (443-2). That is, the terminal connected to the power signal input pin must be far away from the terminal connected to the image signal output pin or the clock signal output pin, and accordingly, the power signal input pin is included in the second area (443-2) which is spaced apart from the first area (443-1). However, to satisfy all of the above considerations, only the power signal input pin cannot be disposed in the second area (443-2). Therefore, the power signal input pin and a portion of the communication pin may be disposed in the second area (443-2).

[0245] Accordingly, the 6th to 10th terminals (443-21, 443-22, 443-23, 443-24, 443-25) can be connected to a power signal input pin and a communication pin.

[0246] For example, the sixth terminal (443-21) may be connected to one of the synchronization communications. For example, the sixth terminal (443-21) may be connected to the clock communication pin (SCL in Table 1) of the I2C communication line. The seventh terminal (443-22) may be connected to the data communication pin (SDA in Table 1) of the I2C communication line. Additionally, the eighth terminal (443-23) may be connected to the reset pin for transmitting a reset signal. Additionally, the ninth terminal (443-24) may be connected to the first analog power input pin (e.g., VDDH in Table 1 having 2.8V). Additionally, the tenth terminal (443-25) may be connected to the second analog power input pin (e.g., VDDM in Table 1 having 1.8V).

[0247] At this time, the terminals connected to the clock communication pin, the data communication pin, and the reset pin of the I2C communication line are placed in the second area (443-2), which is the same area as the terminal connected to the power input pin.

[0248] This is because the communication speed of the signal transmitted through the clock communication pin and the data communication pin of the I2C communication line is low, ranging from 200K to 400K, and is therefore resistant to noise characteristics. In addition, this is because the signal transmitted through the clock communication pin and the data communication pin of the I2C communication line has a voltage level of 1.8V, which is higher than other signals.

[0249] In the third region (443-3) above, a terminal connected to an image signal output pin, a clock signal output pin, and a clock signal input pin may be disposed.

[0250] That is, considering the above considerations, a terminal connected to an image signal output pin is placed in the area adjacent to the first area (443-1) among the third area (443-3). For example, the 11th terminal (443-31) can be connected to the 3-1 image signal output pin. For example, the 12th terminal (443-32) can be connected to the 3-2 image signal output pin. Also, the 14th terminal (443-34) can be connected to the 1st clock signal output pin (CKP in Table 1). Also, the 15th terminal (443-35) can be connected to the 2nd clock signal output pin (CKN in Table 1). At this time, as described in the above considerations, in order to ensure the transmission reliability of the image signal, the reliability of the signal transmitted through the 1st clock signal output pin and the 2nd clock signal output pin must be ensured.

[0251] Accordingly, the 13th terminal (443-33) is connected to the master clock input pin (INCK in Table 1) having the lowest voltage level among the communication pins. That is, terminals connected to the clock signal output pin, the master clock input pin, and the monitoring pin may be arranged around the terminals connected to the image signal output pins as described above. At this time, the terminal connected to the image signal output pins must be spaced apart from the terminal connected to the clock signal output pin. Therefore, a terminal connected to the master clock input pin or a terminal connected to the monitoring pin may be arranged between the terminals connected to the image signal output pins. At this time, the monitoring pin transmits a signal with a voltage level of 1.6V, and the master clock input pin transmits a signal with a voltage level of 1.17V. Accordingly, the terminal connected to the relatively lower master clock input pin is placed between the terminal connected to the image signal output pin and the terminal connected to the clock signal output pin. Accordingly, in the embodiment, the quality of the signal transmitted through the clock signal output pin can be improved, and reliability can be ensured.

[0252] Terminals connected to an image signal output pin, a power signal input pin, and a ground pin may be arranged in the above-mentioned fourth region (443-4).

[0253] That is, taking into account the above considerations, a terminal connected to an image signal output pin is placed in the area of ​​the fourth region (443-4) adjacent to the first region (443-1). For example, the 16th terminal (443-41) can be connected to the 4-1 image signal output pin. For example, the 17th terminal (443-42) can be connected to the 4-2 image signal output pin. Additionally, the 20th terminal (443-45) can be connected to a power signal input pin. For example, the 20th terminal (443-45) can be connected to a digital power input pin (VDDL in Table 1). At this time, the fourth region (443-4) includes both the terminal connected to the image signal output pin and the terminal connected to the power signal input pin. Accordingly, to minimize noise influence between them, the embodiment places a terminal connected to a ground pin between them. For example, the 18th terminal (443-43) may be connected to a second ground pin for grounding the image signal output line. Additionally, the 19th terminal (443-44) may be connected to a first ground pin for grounding the power signal. As described above, in the embodiment, even if the 16th terminal (443-41) connected to the image signal output pin and the 20th terminal (443-45) connected to the power signal input pin are placed within the same area, the noise effect can be minimized by continuously arranging terminals connected to the first ground pin and the second ground pin between them.

[0254] Meanwhile, the terminals were individually classified into terminals 1 through 20 in the above.

[0255] Alternatively, the above terminals can be classified by type.

[0256] For example, among the above terminals, the terminal connected to the image signal output pin of the image sensor (444) may be referred to as the first terminal.

[0257] Accordingly, the first terminals may be divided into a first-1 terminal, a first-2 terminal, a first-3 terminal, and a first-4 terminal depending on the area in which they are placed. Additionally, the first-1 terminal, the first-2 terminal, the first-3 terminal, and the first-4 terminal may each be composed of two terminals.

[0258] Additionally, among the above terminals, the terminal connected to the monitoring pin of the image sensor (444) can also be referred to as the second terminal.

[0259] In addition, among the above terminals, the terminal connected to the clock signal output pin of the image sensor may also be referred to as the third terminal.

[0260] In addition, among the above terminals, the terminal connected to the master clock input pin of the image sensor can be referred to as the fourth terminal.

[0261] In addition, among the above terminals, the terminal connected to the power input pin of the image sensor can be referred to as the fifth terminal.

[0262] Additionally, among the above terminals, the terminal connected to the initial synchronization communication pin of the image sensor can be called the 6th terminal, and the terminal connected to the reset pin of the image sensor can be called the 7th terminal.

[0263] Additionally, among the above terminals, the terminal connected to the ground pin of the image sensor may be referred to as the 8th terminal. Accordingly, the 8th terminal may include one 8-1 terminal for grounding the power input through the 5-1 terminal and one 8-2 terminal for grounding the plurality of 1 terminals.

[0265] Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

[0266] FIG. 20 is a perspective view of an optical device according to the present embodiment, and FIG. 21 is a configuration diagram of the optical device shown in FIG. 20.

[0267] An optical device may be any one of a mobile phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), and navigation system. However, the types of optical devices are not limited thereto, and any device for capturing images or photographs may be included in the definition of an optical device.

[0268] The optical device may include a main body (1250). The main body (1250) may be in the form of a bar. Alternatively, the main body (1250) may have various structures such as a slide type, folder type, swing type, or swivel type in which two or more sub-bodies are combined to move relative to each other. The main body (1250) may include a case (casing, housing, cover) forming the exterior. For example, the main body (1250) may include a front case (1251) and a rear case (1252). Various electronic components of the optical device may be embedded in the space formed between the front case (1251) and the rear case (1252). A display (1151) may be placed on one side of the main body (1250). A camera (1121) may be placed on one or more sides of the main body (1250) and the other side placed opposite the main body.

[0269] The optical device may include a wireless communication unit (1110). The wireless communication unit (1110) may include one or more modules that enable wireless communication between the optical device and a wireless communication system or between the optical device and a network where the optical device is located. For example, the wireless communication unit (1110) may include one or more of a broadcast reception module (1111), a mobile communication module (1112), a wireless internet module (1113), a short-range communication module (1114), and a location information module (1115).

[0270] The optical device may include an A / V input section (1120). The A / V (Audio / Video) input section (1120) is for inputting an audio signal or a video signal and may include one or more of a camera (1121) and a microphone (1122). In this case, the camera (1121) may include a camera device according to the present embodiment.

[0271] The optical device may include a sensing unit (1140). The sensing unit (1140) can generate a sensing signal to control the operation of the optical device by detecting the current state of the optical device, such as the open / closed state of the optical device, the position of the optical device, whether there is user contact, the orientation of the optical device, and the acceleration / deceleration of the optical device. For example, if the optical device is in the form of a slide phone, it can sense whether the slide phone is open or closed. In addition, it can perform sensing functions related to whether power is supplied by the power supply unit (1190) and whether an external device is connected to the interface unit (1170).

[0272] The optical device may include an input / output unit (1150). The input / output unit (1150) may be configured to generate input or output related to sight, hearing, or touch. The input / output unit (1150) may generate input data for controlling the operation of the optical device and may also output information processed by the optical device.

[0273] The input / output unit (1150) may include one or more of a keypad unit (1130), a display (1151), an audio output module (1152), and a touch screen panel (1153). The keypad unit (1130) may generate input data by keypad input. The display (1151) may output an image captured by the camera (1121). The display (1151) may include a plurality of pixels whose color changes according to an electrical signal. For example, the display (1151) may include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display. The sound output module (1152) can output audio data received from the wireless communication unit (1110) in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or output audio data stored in the memory unit (1160). The touch screen panel (1153) can convert a change in capacitance caused by a user's touch on a specific area of ​​the touch screen into an electrical input signal.

[0274] The optical device may include a memory unit (1160). A program for processing and controlling the control unit (1180) may be stored in the memory unit (1160). Additionally, the memory unit (1160) may store one or more of input / output data, such as a phone book, messages, audio, still images, photos, and videos. The memory unit (1160) may store images captured by the camera (1121), such as photos or videos.

[0275] The optical device may include an interface section (1170). The interface section (1170) serves as a passage connecting to an external device connected to the optical device. The interface section (1170) may receive data from an external device, receive power and transmit it to each component inside the optical device, or allow data inside the optical device to be transmitted to an external device. The interface section (1170) may include one or more of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port.

[0276] The optical device may include a control unit (1180). The control unit (controller, 1180) can control the overall operation of the optical device. The control unit (1180) can perform related control and processing for voice calls, data communication, video calls, etc. The control unit (1180) may include a multimedia module (1181) for multimedia playback. The multimedia module (1181) may be provided within the control unit (1180) or provided separately from the control unit (1180). The control unit (1180) can perform pattern recognition processing to recognize handwriting input or drawing input performed on a touchscreen as characters and images, respectively.

[0277] The optical device may include a power supply unit (1190). The power supply unit (1190) may receive external power or internal power under the control of the control unit (1180) and supply power necessary for the operation of each component.

[0278] According to an embodiment, to implement OIS and AF functions of a camera module, instead of moving a conventional lens barrel, an image sensor is moved relatively to the lens barrel in the X, Y, and Z axis directions. Accordingly, the camera module according to the embodiment can eliminate a complex spring structure for implementing OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor relative to the lens barrel according to the embodiment, a more stable structure can be formed compared to the conventional one.

[0279] In addition, according to an embodiment, a terminal portion electrically connected to an image sensor is configured to have a spring structure and is positioned to float without overlapping within the vertical direction of the insulating layer. Accordingly, the camera module can stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0280] According to the above embodiment, X-axis direction shift, Y-axis direction shift, and Z-axis center rotation corresponding to hand shake can be performed on the image sensor, and accordingly, hand shake correction for the image sensor and hand shake correction for the corresponding lens can be performed together, thereby providing an improved hand shake correction function.

[0281] In addition, according to an embodiment, the overall height of the camera device can be reduced by utilizing the internal space of a second actuator that moves the image sensor relative to the lens barrel to embed electrical components required for the camera circuit.

[0282] In addition, according to an embodiment, the camera assembly process can be simplified by integrating and fusing the camera circuit component and the second actuator component.

[0283] In addition, according to an embodiment, the reliability of the camera device can be improved by performing AF using a first actuator that implements a lens shift method and performing OIS using a second actuator that implements an image sensor shift method.

[0284] In addition, according to an embodiment, the operation of the first actuator and the second actuator is performed using a gyro sensor that supports a 6-axis (e.g., a 3-axis accelerometer and a 3-axis gyroscope) dual interface. Specifically, the first actuator and the second actuator must receive gyro data from the gyro sensor to implement an autofocus function and a hand shake correction function. In this embodiment, gyro data acquired from a single gyro sensor that supports a dual interface is provided to the first and second actuators. Accordingly, in the embodiment, as the operation of the first actuator and the second actuator is performed based on gyro data acquired at the same time and at the same location, the mutual compensation operation of the autofocus function and the hand shake correction function can be synchronized, and the reliability can be improved accordingly. In addition, in the embodiment, the accuracy of the autofocus function and the hand shake correction function can be improved as the operation of the first actuator and the second actuator is performed based on gyro data acquired at the same time and at the same location.

[0285] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

Claim 1 An image sensor including a plurality of connection pins; The substrate includes an open area formed in the area where the image sensor is disposed and a plurality of terminals connected to a plurality of connection pins of the image sensor, wherein the number of connection pins of the image sensor is greater than the number of terminals of the substrate, and one surface of the substrate includes a first area and a second area facing each other in a first direction with the open area in between, and a third area and a fourth area facing each other in a second direction different from the first direction with the open area in between, wherein the plurality of terminals includes first to fifth terminals disposed in the first area, wherein the first terminal is connected to a first-1 image signal output pin among the plurality of connection pins of the image sensor, the second terminal is disposed adjacent to the first terminal and is connected to a first-2 image signal output pin among the plurality of connection pins of the image sensor, the third terminal is connected to a monitoring pin among the plurality of connection pins of the image sensor, the fourth terminal is connected to a second-1 image signal output pin among the plurality of connection pins of the image sensor, and the fifth terminal is disposed adjacent to the fourth terminal and among the plurality of connection pins of the image sensor An image sensor substrate connected to a second-2 image signal output pin, wherein the first-1 image signal output pin and the first-2 image signal output pin output a differential signal for a first image signal, the second-1 image signal output pin and the second-2 image signal output pin output a differential signal for a second image signal, and the third terminal is disposed between the second terminal and the fourth terminal. Claim 2 An image sensor substrate according to claim 1, wherein the plurality of terminals includes 6 to 10 terminals disposed in the second region, 11 to 15 terminals disposed in the third region, and 16 to 20 terminals disposed in the fourth region, and the number of terminals disposed in the first to fourth regions is the same. Claim 3 In paragraph 2, the image sensor substrate, wherein the 11th terminal is positioned adjacent to the 1st terminal in the 3rd region and is connected to the 3-1 image signal output pin among the plurality of connection pins of the image sensor, the 12th terminal is positioned adjacent to the 3-1 image signal output pin and is connected to the 3-2 image signal output pin among the plurality of connection pins of the image sensor, and the 3-1 image signal output pin and the 3-2 image signal output pin output a differential signal for the 3rd image signal. Claim 4 In paragraph 3, the 16th terminal is positioned adjacent to the 4th terminal in the 4th region and is connected to the 4-1 image signal output pin among the plurality of connection pins of the image sensor, the 17th terminal is positioned adjacent to the 16th terminal and is connected to the 4-2 image signal output pin among the plurality of connection pins of the image sensor, and the 4-1 image signal output pin and the 4-2 image signal output pin output a differential signal for the 4th image signal, image sensor substrate. Claim 5 In claim 4, the plurality of connection pins of the image sensor include a first clock signal output pin and a second clock signal output pin, the 14th terminal is connected to the first clock signal output pin, the 15th terminal is connected to the second clock signal output pin, and the 14th terminal is spaced apart from the 12th terminal in the third region with the 13th terminal in between. Claim 6 In claim 5, a plurality of connection pins of the image sensor include a master clock input pin, the 13th terminal is connected to the master clock input pin, and the signal voltage level of the 13th terminal is lower than the signal voltage level of the 3rd terminal, an image sensor substrate. Claim 7 An image sensor substrate according to claim 6, wherein the 6th terminal is connected to a clock communication pin of an I2C communication line among a plurality of connection pins of the image sensor, the 7th terminal is connected to a data communication pin of an I2C communication line among a plurality of connection pins of the image sensor, the 8th terminal is connected to a reset pin that transmits a reset signal among a plurality of connection pins of the image sensor, the 9th terminal is connected to a first analog power input pin among a plurality of connection pins of the image sensor, and the 10th terminal is connected to a second analog power input pin among a plurality of connection pins of the image sensor. Claim 8 In claim 7, the image sensor substrate, wherein the 20th terminal is connected to a digital power input pin among a plurality of connection pins of the image sensor and is spaced apart from the 17th terminal with a ground terminal in between. Claim 9 An image sensor substrate according to claim 8, wherein the 18th terminal is connected to a second ground pin for grounding an image signal output line among a plurality of connection pins of the image sensor, and the 19th terminal is connected to a first ground pin for grounding a power signal among a plurality of connection pins of the image sensor. Claim 10 delete Claim 11 delete Claim 12 A sensor driving device comprising: a fixed part including a second substrate and a coil disposed on the second substrate and a first lead pattern part; a moving part disposed spaced apart from the fixed part at a certain distance and including an image sensor; and a wire part disposed between the moving part and the fixed part, wherein one end of the wire part is connected to the first lead pattern part and the other end is connected to the moving part to elastically support the moving part, and the moving part includes an image sensor substrate included in any one of claims 1 to 9. Claim 13 In claim 12, the wire portion comprises a plurality of wires, and the number of the plurality of wires is smaller than the number of input pins included in the image sensor. Claim 14 In claim 12, the moving part includes a second lead pattern part, the other end of the wire part is connected to the second lead pattern part, and the number of the second lead pattern parts is smaller than the number of input pins included in the image sensor.

Images