Camera module

Abstract

A substrate for an image sensor according to an embodiment includes an insulating layer comprising a first open region; and The first lead pattern portion is disposed on the insulating layer, wherein the first lead pattern portion comprises: a first pattern portion disposed on the insulating layer; a connecting portion extending from the first pattern portion; and a second pattern portion connected to the first pattern portion through the connecting portion, and the second pattern portion and the connecting portion are disposed flying on an area that does not overlap within a vertical direction with respect to the insulating layer.

Description

Technology Field

[0001] The embodiment relates to a substrate for an image sensor, and in particular to a substrate for an image sensor capable of relative movement around a lens barrel and a camera module including the same. Background Technology

[0002] In general, camera devices are installed in electronic equipment such as automobiles, endoscopes, and CCTVs, as well as portable devices like mobile communication terminals and MP3 players. These camera devices are gradually developing with a focus on high pixel counts, while also becoming smaller and thinner. Furthermore, current camera devices are evolving to enable the implementation of various additional functions at a low manufacturing cost.

[0003] The camera device described above includes a lens barrel that accommodates a lens, a lens holder coupled to the lens barrel, an image sensor disposed within the lens holder, and a driving board on which the image sensor is mounted. At this time, the lens transmits an image signal of a subject to the image sensor. The image sensor then converts the image signal into an electrical signal.

[0004] Here, the accuracy of the image signal in the camera device is determined by the focal length, which is defined as the distance between the lens and the image sensor.

[0005] Accordingly, the camera device provided focus compensation or shake compensation by moving the lens barrel relative to the image sensor. That is, the camera device moved the lens barrel, which accommodates the lens, relative to the image sensor along the X, Y, and Z axes. At this time, the camera device required at least six elastic members, such as springs, to move the lens barrel relative to the image sensor. Each of the elastic members was joined to the lens barrel by a method such as bonding.

[0006] However, a camera device according to the conventional technology described above is composed of structures such as an upper spring plate positioned at the top of the lens barrel, a lower spring plate positioned at the bottom of the lens barrel, and an elastic wire for fixing the Z-axis as the lens barrel moves relative to it, and accordingly, there is a problem with the module structure of the camera device being complex.

[0007] In addition, camera devices according to the prior art require a plurality of elastic members to move the lens barrel, and there is a problem that the number of assembly steps for said plurality of elastic members increases. The problem to be solved

[0008] In the embodiment, a substrate for an image sensor with a new structure and a camera module including the same can be provided.

[0009] In addition, the embodiment provides a substrate for an image sensor that allows the image sensor to move relative to a lens barrel, and a camera module including the same.

[0010] In addition, the embodiment provides a substrate for an image sensor capable of tilt correction as well as movement along the X-axis, Y-axis, and Z-axis, and a camera module including the same.

[0011] In addition, the embodiment provides a substrate for an image sensor and a camera module including the same, which can simplify the spring structure for providing an autofocus function or a hand shake compensation function.

[0012] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the proposed embodiments belong from the description below. means of solving the problem

[0013] A camera module according to an embodiment includes a fixed part comprising a first driving part; a movable part comprising a second driving part corresponding to the first driving part and an image sensor that moves relative to the fixed part; and a wire disposed between the fixed part and the movable part and elastically supporting the movement of the movable part relative to the fixed part, wherein the movable part moves relative to the fixed part by a driving force provided by the interaction of the first driving part and the second driving part.

[0014] In addition, it further includes a lens portion disposed on the fixed portion.

[0015] Additionally, each of the fixed part and the movable part includes a plurality of corner regions and a plurality of side regions provided between the plurality of corner regions, and the wire is coupled to the fixed part and the movable part in the plurality of outer regions.

[0016] In addition, the first driving unit is disposed in each of the plurality of corner areas of the fixed unit, and the second driving unit is disposed in each of the plurality of corner areas of the movable unit.

[0017] Additionally, either of the first driving unit and the second driving unit comprises a plurality of magnets, and the other of the first driving unit and the second driving unit comprises a plurality of coil units, and the actuator moves relative to the fixed unit by means of interaction between the plurality of magnets and the plurality of coil units.

[0018] In addition, the plurality of magnets are fixed, and the plurality of coil units move relative to the plurality of magnets.

[0019] Additionally, the corner regions of each of the fixed part and the movable part include first to fourth corner regions sequentially located along the perimeter direction, the plurality of magnets include first to fourth magnets disposed in the first to fourth corner regions of the fixed part or the movable part, and the plurality of coil units include first to fourth coil units disposed in the first to fourth corner regions of the fixed part or the movable part.

[0020] Additionally, the plurality of magnets and the plurality of coil units each include a long side and a short side, and among the plurality of magnets and the plurality of coil units, the long side and the short side of the magnets and coil units that overlap each other along the vertical direction are arranged in a direction parallel to each other.

[0021] Additionally, the movement of the above-mentioned actuator includes a first movement in a first direction perpendicular to the optical axis of the lens portion, and the plurality of coil units includes a first group of coil units driven for the first movement.

[0022] Additionally, the movement of the above-mentioned actuator includes a second movement in a second direction perpendicular to the optical axis and the first direction, and the plurality of coil units includes a second group of coil units separated from the first group of coil units driven for the second movement.

[0023] Additionally, the movement of the above-mentioned actuator includes a third movement rotating around the optical axis, and at least one of the first group of coil units and the second group of coil units is driven for the third movement.

[0024] In addition, it further includes a position sensor disposed inside at least one of the plurality of coil units and detecting the magnetic field of the magnet.

[0025] Additionally, the above-mentioned actuator includes a first circuit board on which the second driving unit is disposed, and the image sensor is disposed on the first circuit board.

[0026] In addition, the image sensor moves relative to the lens portion.

[0027] Additionally, the fixed part includes a second circuit board spaced apart from the first circuit board with respect to the optical axis of the lens part.

[0028] In addition, the upper end of the wire is connected to the fixed part, and the lower end of the wire is connected to the movable part.

[0029] In addition, the wires are provided in multiple numbers spaced apart from each other along the circumferential direction of the lower surface of the fixed part or the upper surface of the movable part.

[0030] In addition, the plurality of wires electrically connect the image sensor and the fixed part.

[0031] Additionally, the coil units of the first group are arranged offset from each other along the first direction and the second direction, and the coil units of the second group are arranged offset from each other along the first direction and the second direction. Effects of the invention

[0032] According to an embodiment, to implement OIS and AF functions of a camera module, instead of moving a conventional lens barrel, an image sensor is moved relatively to the lens barrel in the X, Y, and Z axis directions. Accordingly, the camera module according to the embodiment can eliminate a complex spring structure for implementing OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor relative to the lens barrel according to the embodiment, a more stable structure can be formed compared to the conventional one.

[0033] In addition, according to an embodiment, a terminal portion electrically connected to an image sensor is configured to have a spring structure and is positioned to float without overlapping within the vertical direction of the insulating layer. Accordingly, the camera module can stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0034] According to the above embodiment, X-axis direction shift, Y-axis direction shift, and Z-axis center rotation corresponding to hand shake can be performed on the image sensor, and accordingly, hand shake correction for the image sensor and hand shake correction for the corresponding lens can be performed together, thereby providing an improved hand shake correction function. Brief explanation of the drawing

[0035] Figure 1 is a drawing showing a camera module according to a comparative example. FIG. 2 is a perspective view of a camera device according to the present embodiment. Figure 3 is a cross-sectional view taken from AA in Figure 2. Figure 4 is a cross-sectional view taken from BB of Figure 2. FIG. 5 is an exploded perspective view of a part of the components of a camera device according to the present embodiment. FIG. 6 is an exploded perspective view of a part of the components of a camera device according to the present embodiment. FIG. 7 is a bottom perspective view of a part of a camera device according to the present embodiment. FIG. 8 is a perspective view of a part of the configuration of a camera device according to the present embodiment. FIG. 9a is an exploded perspective view of a substrate module for an image sensor of a camera device according to the present embodiment. FIG. 9b is a cross-sectional view taken from CC of the combined state of the substrate module for the image sensor of the camera device of FIG. 9a. FIG. 9c is a cross-sectional view taken from DD of the combined state of the substrate module for the image sensor of the camera device of FIG. 9a. FIGS. 10 and FIGS. 11 are exploded perspective views of a part of a camera device according to the present embodiment, viewed from a different direction than FIG. 9a. FIG. 12 is an exploded view of an image sensor module of a camera device according to the present embodiment. FIG. 13 is an exploded perspective view of an image sensor module of a camera device according to the present embodiment, viewed from a different direction than FIG. 12. FIG. 14 is a diagram illustrating x-axis direction shift driving through a part configuration of a camera device according to the present embodiment. FIG. 15 is a diagram illustrating y-axis direction shift driving through a part configuration of a camera device according to the present embodiment. FIG. 16 is a diagram illustrating z-axis center rotational drive through a part configuration of a camera device according to the present embodiment. Figure 17 (a) is a drawing showing a magnet placed on a substrate holder along with the x-axis and y-axis. Figure 17 (b) is a drawing showing a substrate holder, a magnet, and a coil with rotational drive in the z-axis direction. FIG. 18 is a diagram illustrating the magnetic flow and Lorentz force between the magnet and the coil of a camera device according to the present embodiment. FIG. 19 is a perspective view of an optical device according to the present embodiment. FIG. 20 is a configuration diagram of the optical device shown in FIG. 19. Specific details for implementing the invention

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0037] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0038] Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning generally understood by those skilled in the art to which the present invention pertains, unless explicitly and specifically defined otherwise. Terms commonly used, such as those defined in advance, may be interpreted by considering their meaning in the context of the relevant technology. Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0039] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C. Additionally, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention.

[0040] These terms are intended only to distinguish a component from another component and are not limited by the nature, order, or sequence of the component. Furthermore, where it is stated that a component is 'connected,' 'combined,' or 'connected' to another component, this may include not only cases where the component is directly connected, combined, or connected to the other component, but also cases where it is 'connected,' 'combined,' or 'connected' due to another component located between the component and the other component.

[0041] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0043] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0044] Figure 1 is a drawing showing a camera module according to a comparative example.

[0045] A camera module equipped with OIS (Optical Image Stabilizer) and AF (Auto Focusing) functions requires at least two spring plates.

[0046] The camera module according to the comparative example may have two spring plates. The camera module according to the comparative example requires at least six spring-like elastic members in the spring plates.

[0047] Referring to FIG. 1, a camera module according to a comparative example includes an optical system comprising a lens assembly, an infrared filter section, and a sensor section. That is, the camera module according to the comparative example includes a lens barrel (10), a lens assembly (20), a first elastic member (31), a second elastic member (32), a first housing (41), a second housing (42), an infrared blocking filter section (50), a sensor section (60), a circuit board (80), and driving sections (71, 72, 73, 74).

[0048] At this time, the lens barrel (10) is connected to the first housing (41). That is, the lens barrel (10) is connected to the first housing (41) through the first elastic member (31). That is, the lens barrel (10) is connected to the first housing (41) so as to be movable by the first elastic member (31). At this time, the first elastic member (31) includes a plurality of springs (not shown). For example, the first elastic member (31) connects the lens barrel (10) and the first housing (41) at a plurality of points on the lens barrel (10).

[0049] The second elastic member (32) is connected to the first housing (41) and the second housing (42) that accommodates the first housing (41). The second elastic member (32) fixes the first housing (41) to the second housing (42) so that it can move. The second elastic member (32) includes a plurality of springs. Specifically, the second elastic member (32) includes plate springs.

[0050] At this time, the first elastic member (31) supports the lens barrel (10) and moves the lens barrel (10) relative to the sensor part (60) in a vertical direction (Z-axis direction). To do this, the first elastic member (31) includes at least four springs.

[0051] Additionally, the second elastic member (32) supports the lens barrel (10) and moves the lens barrel (10) relative to the sensor part (60) in a horizontal direction (X-axis direction and Y-axis direction). To this end, the second elastic member (32) includes at least two springs.

[0052] As described above, in the camera module according to the comparative example, OIS and AF are performed as the lens barrel (10) moves in the X-axis, Y-axis, and Z-axis directions. To this end, the camera module according to the comparative example requires at least six elastic members, such as springs. Additionally, the camera module according to the comparative example requires two spring plates to support the elastic members. Furthermore, the camera module according to the comparative example requires an additional member, such as an elastic wire, to fix the Z-axis of the lens barrel (10). Therefore, the spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis is complex in the camera module according to the comparative example.

[0053] In addition, the camera module according to the comparative example requires manually bonding each elastic member to the lens barrel (10) in order to combine the elastic member with the lens barrel (10). Accordingly, the camera module according to the comparative example has a complex manufacturing process and requires a long manufacturing time.

[0054] In addition, the camera module according to the comparative example provides a tilt function of the lens barrel (10), but is structured in such a way that it is difficult to actually correct the tilt of the image. That is, even if the lens barrel (10) rotates relative to the sensor unit (60), there is no change in the image incident on the sensor unit (60), so it is difficult to correct the tilt of the image, and furthermore, the tilt function itself is unnecessary.

[0056] Hereinafter, a substrate for an image sensor, a camera module, and a camera device including the same according to an embodiment are described.

[0057] The 'Optical Axis (see OA in FIG. 5) direction' used below is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0058] The 'vertical direction' used below may be a direction parallel to the optical axis direction. The vertical direction may correspond to the 'z-axis direction (see FIG. 5)'. The 'horizontal direction' used below may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction' (see FIG. 5).

[0059] As used below, the 'Auto Focus function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through moving the lens along the optical axis according to the distance to the subject, so that a clear image of the subject can be obtained on the image sensor. Meanwhile, 'Auto Focus' corresponds to 'AF (Auto Focus)'.

[0060] As used below, the 'shake correction function' is defined as a function that moves the lens and / or image sensor to counteract vibrations (movements) generated in the image sensor by external forces. Meanwhile, 'shake correction' can correspond to 'OIS (Optical Image Stabilization)'.

[0061] FIG. 2 is a perspective view of a camera device according to the present embodiment, FIG. 3 is a cross-sectional view taken from AA in FIG. 2, FIG. 4 is a cross-sectional view taken from BB in FIG. 2, FIG. 5 is an exploded perspective view of a part of a camera device according to the present embodiment, FIG. 6 is an exploded perspective view of a part of a camera device according to the present embodiment, FIG. 7 is a bottom perspective view of a part of a camera device according to the present embodiment, FIG. 8 is a perspective view of a part of a camera device according to the present embodiment, FIG. 9a is an exploded perspective view of a substrate module for an image sensor of a camera device according to the present embodiment, FIG. 9b is a cross-sectional view taken from CC showing the state in which the substrate module for an image sensor of the camera device of FIG. 9a is coupled, FIG. 9c is a cross-sectional view taken from DD showing the state in which the substrate module for an image sensor of the camera device of FIG. 9a is coupled, FIG. 10 and FIG. 11 are exploded perspective views of a part of a camera device according to the present embodiment taken from a direction different from FIG. 9a, and FIG. 12 is an image sensor of a camera device according to the present embodiment. FIG. 13 is an exploded perspective view of the module, FIG. 13 is an exploded perspective view of the image sensor module of the camera device according to the present embodiment viewed from a different direction than FIG. 12, FIG. 14 is a diagram explaining the x-axis direction shift drive through a part configuration of the camera device according to the present embodiment, FIG. 15 is a diagram explaining the y-axis direction shift drive through a part configuration of the camera device according to the present embodiment, FIG. 16 is a diagram explaining the z-axis center rotation drive through a part configuration of the camera device according to the present embodiment, FIG. 17 (a) is a diagram showing a magnet placed on a substrate holder together with the x-axis and y-axis, FIG. 17 (b) is a diagram showing the substrate holder, magnet, and coil together with the z-axis direction rotation drive, and FIG. 18 is a diagram showing the magnetic flow and Lorentz force between the magnet and the coil of the camera device according to the present embodiment.

[0062] The camera device (100A) may include a camera module. The camera device (100A) may include a lens driving device. The lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

[0063] The camera device (100A) may include an actuator. The actuator can drive an image sensor (444). The actuator can tilt the image sensor (444). The actuator can move the image sensor (444). The actuator can rotate the image sensor (444). The actuator can move the image sensor (444) in a first direction perpendicular to the optical axis, move it in a second direction perpendicular to the optical axis and the first direction, and rotate it about the optical axis. At this time, the first direction may be the x-axis direction, the second direction may be the y-axis direction, and the optical axis may be the z-axis direction. The actuator may include a coil (310) and a magnet (320). The actuator can move the image sensor (444) through electromagnetic force.

[0065] That is, the actuator of the camera device (100A) can move the image sensor (444) relative to the lens barrel. The actuator will be described in more detail below.

[0066] The camera device (100A) may include a holder (110). The holder (110) may be placed on the lower surface of a flexible circuit board (150). The holder (110) may include a projection for fitting into a groove of the flexible circuit board (150). The holder (110) may be placed on the upper surface of a driving board (120). The holder (110) may be placed between the flexible circuit board (150) and the driving board (120). A lens module (210) may be placed on the holder (110). An optical module may be placed on the holder (110). The holder (110) may be coupled with a housing (600). At this time, the driving board (120) may be a component of an image sensor actuator electrically connected to an image sensor (444). One end of the driving board (120) is connected to the image sensor board (430), and accordingly, can receive an image signal transmitted from an image sensor (444) coupled to the image sensor board (430). Additionally, the other end of the driving board (120) is connected to the flexible circuit board (150), and accordingly, can transmit an image signal provided from the image sensor (444) to the outside. That is, the driving board (120) can transmit an image signal obtained from the image sensor (444) to the main board.

[0067] To this end, the flexible circuit board (150) can connect between the camera module and the main board of an external device. Specifically, the flexible circuit board (150) can connect between the image sensor board of the camera module and the main board of an optical device (e.g., a mobile terminal).

[0068] To this end, the flexible circuit board (150) is positioned inside the camera device and connected to the driving board (120) of the image sensor actuator, and the remaining part is positioned outside the camera device and connected to the main board of the optical device.

[0069] The holder (110) may include a step (111). The step (111) may be formed around the perimeter of the insertion portion (112) of the holder (110). A lens module (210) may be placed on the step (111). The step (111) may support the lower surface of a portion of the lens module (210). By doing so, it is possible to prevent the lens module (210) from moving downward while seated on the step (111).

[0070] The holder (110) may include an insertion portion (112). The insertion portion (112) may be a hollow hole. The insertion portion (112) may be an opening. A lens module (210) may be placed in the insertion portion (112). A portion of the lens module (210) may extend below the step (111) through the insertion portion (112).

[0071] The holder (110) may include a first hole (113). The first hole (113) may be formed to expose a portion of the driving substrate (120) for coupling with the wire (510). There may be multiple first holes (113). For example, there may be two first holes (113).

[0072] The holder (110) may include a second hole (114). The second hole (114) may be formed to expose a sensor (520) coupled to a driving substrate (120). There may be multiple second holes (114). For example, there may be four second holes (114).

[0073] The holder (110) may include a first groove (115). The first groove (115) may be formed to expose a portion of the driving substrate (120) for coupling with the wire (510). The first groove (115) may be formed on the side of the holder (110). The first groove (115) may be formed on each side of the holder (110). There may be multiple first grooves (115). For example, the first groove (115) may include two grooves each disposed on opposite sides of the holder (110).

[0074] The holder (110) may include a second groove (116). The second groove (116) may be formed in a shape corresponding to a protrusion of the housing (600) and may be fitted with the protrusion of the housing (600). However, the second groove (116) may not be provided in a shape corresponding to a protrusion of the housing (600). The second groove (116) may be formed on the side of the holder (110). The second groove (116) may be formed on each of the two sides of the holder (110). There may be multiple second grooves (116). For example, there may be three second grooves (116). The second groove (116) may include two grooves disposed on one side of the holder (110), and on the other side, may be formed as a single groove in which the two grooves are connected as one.

[0075] The camera device (100A) may include a driving substrate (120). The driving substrate (120) may be placed in a holder (110). The driving substrate (120) may be placed on the lower surface of the holder (110). The upper surface of the driving substrate (120) may be in contact with the lower surface of the holder (110).

[0076] The driving board (120) may be placed below the flexible circuit board (150). The driving board (120) may be coupled with a wire (510). The driving board (120) may be a rigid flexible PCB (RFPCB). The driving board (120) may include first to fourth corners. At this time, the driving board (120) may be coupled with an image sensor substrate (430) on which an image sensor (444) is placed, and may be a component of an image sensor actuator that moves the position of the image sensor substrate (430).

[0077] The driving substrate (120) may include a fourth open region (121). The fourth open region (121) may be formed in the center of the driving substrate (120). The fourth open region (121) may be a hollow hole penetrating the upper and lower surfaces of the driving substrate (120). The fourth open region (121) may be an opening. The fourth open region (121) of the driving substrate (120) may be aligned on the optical axis (OA) with the image sensor (444) positioned at the bottom and the lens module (210) positioned at the top.

[0078] Preferably, the fourth open area (121) can be aligned on the optical axis (OA) with the image sensor (444) placed at the bottom, the first open area (433) of the substrate (430) for the image sensor, the second open area (424) of the reinforcing member (420), and the third open area (411) of the substrate holder (410). A lens module (210) can be placed in the fourth open area (121). The fourth open area (121) of the driving substrate (120) can be formed with a width greater than the insertion part (112) of the holder (110).

[0079] The driving substrate (120) may include a coupling portion. The driving substrate (120) may be coupled to the wire (510) at the coupling portion. That is, the driving substrate (120) may include a lead pattern portion coupled to the wire (510). For example, the driving substrate (120) may include a second lead pattern portion (122) that is electrically connected to one end of the wire (510). The second lead pattern portion (122) of the driving substrate (120) and the wire (510) may be coupled through soldering. The second lead pattern portion (122) may be a portion where a solder resistor is open to be electrically connected to the wire (510). A third insertion hole (123) into which the wire is inserted may be formed in the second lead pattern portion (122) and the driving substrate (120). Accordingly, one end of the wire (510) can be inserted into the second lead pattern portion (122) and the third insertion hole (123) of the driving substrate (120). Preferably, one end of the wire (510) can penetrate the second lead pattern portion (122) and the driving substrate (120) and protrude over the surface of the second lead pattern portion (122), and can be electrically connected to the second lead pattern portion (122) by solder (not shown).

[0080] That is, a portion of the third insertion hole (123) may be formed on the driving substrate (120), and the remaining portion may be formed on the second lead pattern portion (122). And, a portion of the third insertion hole formed on the second lead pattern portion (122) may be filled with solder by soldering a wire (510) protruding over the surface of the second lead pattern portion (122).

[0081] The driving board (120) may include a connector (124). The connector (124) may be electrically connected to a flexible circuit board (150). A connector corresponding to the connector (124) of the driving board (120) may be disposed on the flexible circuit board (150). The connector (124) may include a port for electrically connecting to an external device.

[0082] The driving board (120) may include a terminal (125). The terminal (125) may be formed on the lower surface of the driving board (120). The terminal (125) may be electrically connected to the coil (310). The terminal (125) may be joined to a pair of lead wires of the coil (310) by soldering or Ag epoxy. The terminal (125) may include a plurality of terminals. The terminal (125) may include a total of eight terminals, two for each of the four coils. The driving board (120) generates a magnetic field on the image sensor substrate (430) using the coil (310), and allows the position of the image sensor substrate (430) to be moved by the generated magnetic field.

[0083] That is, the driving substrate (120) is electrically connected to the lower image sensor substrate (430) via a wire (510), and the image sensor substrate (430) can be moved using the wire (510). In other words, the driving substrate (120) is coupled in a fixed state to the holder (110), and the image sensor substrate (430) can move relative to the driving substrate (120). The movement of the image sensor substrate (430) can be achieved by a magnetic force generated from a coil (310) connected to the terminal (125). This will be explained below.

[0084] The camera device (100A) may include a lens module (210). The lens module (210) may be placed in a holder (110). The lens may be placed at a position corresponding to the image sensor (444). The lens module (210) may include at least one lens. The lens module (210) may include a plurality of lenses. The lens module (210) may include five lenses. The lens module (210) may include first to fifth lenses (211, 212, 213, 214, 215). The lens module (210) may include a barrel (216). A plurality of lenses may be placed within the barrel (216). The lens module (210) may include a hole (217). An optical module may be placed in the hole (217) of the lens module (210). A hole (217) in the lens module (210) can be formed to penetrate the lens module (210) horizontally between a plurality of lenses. Through this, the optical axis of the plurality of lenses and the optical axis of the optical module can be aligned. A hole (217) in the lens module (210) can be formed between the second lens (212) and the third lens (213).

[0085] The camera device (100A) may include an optical module. The optical module may perform an optical image stabilization (OIS) function. The optical module may perform an autofocus (AF) function. The optical module may be aligned with a plurality of lenses and an image sensor (444). The optical module may be placed between a plurality of lenses. The optical module may be placed between a second lens (212) and a third lens (213). The optical module may include a MEMS actuator (220).

[0086] As illustrated in FIG. 8, the camera device (100A) may include a MEMS actuator (220). The MEMS actuator (220) can use a silicon wafer to move a moving lens to perform an autofocus function and / or image stabilization function.

[0087] The MEMS actuator (220) can be connected to a lens substrate (221). The lens substrate (221) may include a terminal (222). The terminal (222) may include a plurality of terminals. The terminal (222) may include six terminals. The terminal (222) of the lens substrate (221) can be connected to a terminal (150a) of a flexible circuit board (150).

[0088] The camera device (100A) may include a coil (310). That is, the actuator that moves the image sensor (444) may include a coil (310).

[0089] The coil (310) can be placed on the driving substrate (120).

[0090] The coil (310) can be electrically connected to the driving substrate (120). The coil (310) can be positioned facing the magnet (320) located below. When current is applied to the coil (310), an electric field can be formed around the coil (310). When current is applied to the coil (310), either the coil (310) or the magnet (320) can move relative to the other through the electromagnetic interaction between the coil (310) and the magnet (320).

[0091] The coil (310) may include four coils. Current may be applied independently to at least three of the four coils. In the first embodiment, the coil (310) may be controlled by three channels. Or, in the second embodiment, the coil (310) may be controlled by four channels. The four coils (310) may be electrically isolated from each other. Either a forward current or a reverse current may be selectively applied to each of the four coils (310). In this embodiment, only three of the four coils may be electrically isolated and one coil may be electrically connected to another coil. Or, all four coils may be electrically isolated. When only three of the four coils are electrically isolated, a total of six lead wires (three pairs) may come out of the coil (310), and when all four coils are electrically isolated, a total of eight lead wires (four pairs) may come out of the coil (310).

[0092] In the case of controlling four coils with three channels as in the first embodiment of this embodiment, the z-axis center rotation drive must be driven with one pair of coils (310) and magnets (320), but in the case of controlling four coils with four channels as in the second embodiment, the z-axis center rotation drive can be driven with two pairs of coils (310) and magnets (320).

[0093] The coil (310) may include first to fourth coils (311, 312, 313, 314). The first coil (311) may be positioned opposite the first magnet (321). The second coil (312) may be positioned opposite the second magnet (322). The third coil (313) may be positioned opposite the third magnet (323). The fourth coil (314) may be positioned opposite the fourth magnet (324). The first coil (311) may be positioned at the first corner of the driving substrate (120). The second coil (312) may be positioned at the second corner of the driving substrate (120). The third coil (313) may be positioned at the third corner of the driving substrate (120). The fourth coil (314) may be placed at the fourth corner of the driving substrate (120). The first coil (311) and the third coil (313) may be placed on the first diagonal direction of the driving substrate (120), and the second coil (312) and the fourth coil (314) may be placed on the second diagonal direction of the driving substrate (120).

[0094] In this embodiment, the first coil (311) and the third coil (313) may be arranged lengthwise in the first direction, and the second coil (312) and the fourth coil (314) may be arranged lengthwise in the second direction. At this time, the first direction and the second direction may be perpendicular. The long side of the first coil (311) and the long side of the third coil (313) may be arranged parallel to each other. The long side of the second coil (312) and the long side of the fourth coil (314) may be arranged parallel to each other. The long side of the first coil (311) and the long side of the second coil (312) may not be arranged parallel to each other. At this time, the long side of the first coil (311) and the long side of the second coil (312) may be arranged such that their imaginary extension lines are orthogonal to each other. The arrangement direction of the first coil (311) and the arrangement direction of the second coil (312) can be orthogonal.

[0095] In this embodiment, current may be applied independently to at least three of the first to fourth coils (311, 312, 313, 314). The first to fourth coils (311, 312, 313, 314) may be electrically isolated from each other.

[0096] The camera device (100A) may include a magnet (320). The magnet (320) may be placed in a substrate holder (410). The magnet (320) may be placed at a corner of the substrate holder (410). The magnet (320) may be placed at each of the four corners of the substrate holder (410). The magnet (320) may be opposite to the coil (310). The magnet (320) may have electromagnetic interaction with the coil (310). The magnet (320) may move through electromagnetic interaction with the coil (310). That is, when current is applied to the coil (310), the magnet (320) may move. The magnet (320) may be a flat magnet having a flat plate shape. In this embodiment, the coil (310) is fixed and the magnet (320) may move. However, as a variation example, the placement positions of the coil (310) and the magnet (320) can be swapped.

[0097] The magnet (320) may include a plurality of magnets. The magnet (320) may include four magnets. The magnet (320) may include first to fourth magnets (321, 322, 323, 324). The first magnet (321) may be positioned opposite the first coil (311). The first magnet (321) may be positioned at the first corner (410e) of the substrate holder (410). The second magnet (322) may be positioned opposite the second coil (312). The second magnet (322) may be positioned at the second corner (410f) of the substrate holder (410). The third magnet (323) may be positioned opposite the third coil (313). The third magnet (323) may be placed at the third corner (410g) of the substrate holder (410). The fourth magnet (324) may be positioned opposite the fourth coil (314). The fourth magnet (324) may be placed at the fourth corner (410h) of the substrate holder (410). Each of the plurality of magnets may be positioned perpendicular to an adjacent magnet and parallel to a magnet positioned diagonally.

[0098] The polarity of the surface facing the coil (310) of the first magnet (321) may differ between the part closer to the first side and the part closer to the second side. The polarity of the surface facing the coil (310) of the second magnet (322) may differ between the part closer to the third side and the part closer to the fourth side. The polarity of the surface facing the coil (310) of the third magnet (323) may differ between the part closer to the first side and the part closer to the second side. The polarity of the surface facing the coil (310) of the fourth magnet (324) may differ between the part closer to the third side and the part closer to the fourth side. That is, the first magnet (321) and the third magnet (323) may be arranged in the same direction, and the second magnet (322) and the fourth magnet (324) may be arranged in the same direction. The first magnet (321) may be positioned perpendicularly to the second magnet (322). The polarity of the first to fourth magnets (321, 322, 323, 324) may be the same in their inner parts. The polarity of the first to fourth magnets (321, 322, 323, 324) may be the same in their outer parts. The polarity of each of the first to fourth magnets (321, 322, 323, 324) may be formed with the inner part as the N pole. The polarity of each of the first to fourth magnets (321, 322, 323, 324) may be formed with the outer part as the S pole. However, as a variation, the polarity of each of the first to fourth magnets (321, 322, 323, 324) may be formed such that the inner part is an S pole and the outer part is an N pole.

[0099] As illustrated in FIG. 14, in this embodiment, when current in the same direction is applied to the second coil (312) and the fourth coil (314), the image sensor (444) coupled to the substrate holder (410) can be moved (shifted) in the x-axis direction through electromagnetic interaction with the second magnet (322) and the fourth magnet (324), respectively. That is, the second coil (312) and the second magnet (322), and the fourth coil (314) and the fourth magnet (324) can be used to drive the x-axis shift of the image sensor (444). At this time, the second coil (312) and the second magnet (322) may be the first x-axis shift drive unit (X2), and the fourth coil (314) and the fourth magnet (324) may be the second x-axis shift drive unit (X1).

[0100] As illustrated in FIG. 15, in this embodiment, when current in the same direction is applied to the first coil (311) and the third coil (313), the image sensor (444) coupled to the substrate holder (410) can be moved (shifted) in the y-axis direction through electromagnetic interaction with the first magnet (321) and the third magnet (323), respectively. That is, the first coil (311) and the first magnet (321), and the third coil (313) and the third magnet (323) can be used to drive the y-axis shift of the image sensor (444). At this time, the first coil (311) and the first magnet (321) may be the first y-axis shift drive unit (Y1), and the third coil (313) and the third magnet (323) may be the second y-axis shift drive unit (Y2).

[0101] As illustrated in FIG. 16, in this embodiment, currents in opposite directions are applied to the first coil (311) and the third coil (313), and currents in opposite directions are applied to the second coil (312) and the fourth coil (314). If the direction in which the magnet (320) rotates is the same as the current applied to the first coil (311) and the current applied to the second coil (312), then the image sensor (444) coupled to the substrate holder (410) can be rotated (rolled) around the z-axis. The embodiment illustrated in FIG. 17 illustrates the case where the coil (310) is controlled by 4 channels, and if the coil (310) is controlled by 3 channels, the image sensor (444) can be rolled through the first coil (311) and the third coil (313) or the second coil (312) and the fourth coil (314). This is because if there is a coil connected to one channel among the first coil (311), the third coil (313), the second coil (312), and the fourth coil (314), current cannot be applied in the opposite direction.

[0102] As illustrated in FIG. 17(b), in this embodiment, a forward current is applied to the first coil (311), thereby causing the first coil (311) to push the first magnet (321) in the first direction (see FIG. 17(a)), a forward current is applied to the second coil (312), thereby causing the second coil (312) to push the second magnet (322) in the second direction (see FIG. 17(b)), a reverse current is applied to the third coil (313), thereby causing the third coil (313) to push the third magnet (323) in the third direction (see FIG. 17(c)), and a reverse current is applied to the fourth coil (314), thereby causing the fourth coil (314) to push the fourth magnet (324) in the fourth direction (see FIG. 17(d)), so that the image coupled to the substrate holder (410) The sensor (444) can be rotated around the z-axis (see e in FIG. 17). At this time, the first to fourth directions may correspond to clockwise directions with respect to the center of the substrate holder (410).

[0103] In this embodiment, the magnetic flow of the magnet (320) is as shown in FIG. 18. Referring to FIG. 18, it can be seen that there is a magnetic force line passing perpendicularly to the coil (310), and in this state, when current is applied to the coil (310), the coil (310) can move relative to the magnet (320) according to the Lorentz force.

[0104] The camera device (100A) may include a substrate holder (410) which is a component of the substrate module. The substrate holder (410) may be spaced apart from the holder (110). The substrate holder (410) may be a mover, a part that moves together with the magnet (320) when current is applied to the coil (310). Additionally, the substrate holder (410) may be a sensor PCB holder. The substrate holder (410) may be shifted in the x-axis direction. The substrate holder (410) may be shifted in the y-axis direction. The substrate holder (410) may be rotated around the z-axis (optical axis).

[0105] The substrate holder (410) may include a third open region (411). The third open region (411) may be a hollow hole. The third open region (411) may be an opening. Preferably, the third open region (411) may be aligned on the optical axis (OA) with the fourth open region (121) of the driving substrate (120), the image sensor (444), the first open region (433) of the substrate for the image sensor (430), and the second open region (424) of the reinforcing member (420).

[0107] The substrate holder (410) may include a magnet receiving groove (412). The groove (412) may be formed on the upper surface of the substrate holder (410). The magnet receiving groove (412) may receive at least a portion of the magnet (320).

[0108] A magnet (320) may be placed in a magnet receiving groove (412) of a substrate holder (410). The magnet receiving groove (412) may be formed in a shape corresponding to the magnet (320). However, the depth of the magnet receiving groove (412) may be smaller than the thickness in the corresponding direction of the magnet (320). In this case, a portion of the magnet (320) placed in the magnet receiving groove (412) may protrude from the substrate holder (410). The magnet receiving groove (412) may include a plurality of grooves. The magnet receiving groove (412) may be formed in a number corresponding to the number of magnets (320). The magnet receiving groove (412) may include four grooves. However, the magnet receiving groove (412) of the substrate holder (410) may be replaced with a coil receiving groove, and accordingly, a coil may be placed instead of the magnet. At this time, a magnet may be placed on a driving substrate facing the coil placed in the substrate holder (410).

[0109] The substrate holder (410) may include a second insertion hole (413) through which a wire passes. The second insertion hole (413) may be formed through the substrate holder (410) in a direction parallel to the optical axis. A wire (510) may be inserted into the second insertion hole (413). The wire (510) may pass through the second insertion hole (413). The second insertion hole (413) may include a plurality of holes. The second insertion hole (413) may be formed in a number corresponding to the number of wires (510). The second insertion hole (413) may include 24 holes. The second insertion hole (413) of the substrate holder (410) may be aligned within a vertical direction with the third insertion hole (123) of the driving substrate (120). That is, the wire (510) can pass through the third insertion hole (123) of the driving substrate (120) and the second insertion hole (413) of the substrate holder (410) in common.

[0110] The substrate holder (410) may include a first projection (414). The first projection (414) may be formed on the lower surface of the substrate holder (410). The first projection (414) may be inserted into the first hole (421) of the reinforcing member (420) and the hole (431-1) of the substrate (430) for the image sensor. The first projection (414) may be formed in a shape corresponding to the first hole (421) of the reinforcing member (420) and the hole (431-1) of the substrate (430) for the image sensor. The first projection (414) may include a plurality of projections. The first projection (414) may include four projections. The four projections may each be formed at the four corners of the substrate holder (410).

[0111] The substrate holder (410) may include a second projection (415). The second projection (415) may be formed on the lower surface of the substrate holder (410). The second projection (415) may be spaced apart from the first projection (414). The second projection (415) may extend from the side of the substrate holder (410). The lower surface of the second projection (415) may be positioned lower than the lower surface of the reinforcing plate (445) of the image sensor module (440). The second projection (415) may include a plurality of projections. The second projection (415) may include four projections. The four projections may each be formed at the four corners of the substrate holder (410).

[0112] The substrate holder (410) may include a guide projection (416). The guide projection (416) may be formed on the lower surface of the substrate holder (410). The guide projection (416) may guide the assembly position of the image sensor module (440). The guide projection (416) may contact the cover (441) of the image sensor module (440). The guide projection (416) may contact four sides of the cover (441) of the image sensor module (440).

[0113] The substrate holder (410) may include a plurality of sides. The substrate holder (410) may include four sides. The substrate holder (410) may include first to fourth sides. The substrate holder (410) may include a first side and a second side positioned opposite each other, and a third side and a fourth side positioned opposite each other between the first side and the second side.

[0114] The substrate holder (410) may include corners formed between a plurality of sides. The substrate holder (410) may include a plurality of corners. The substrate holder (410) may include four corners. The substrate holder (410) may include first to fourth corners. The first corner of the substrate holder (410) may be positioned between the first side and the third side. The second corner of the substrate holder (410) may be positioned between the third side and the second side. The third corner of the substrate holder (410) may be positioned between the second side and the fourth side. The fourth corner of the substrate holder (410) may be positioned between the fourth side and the first side. That is, the substrate holder (410) may include four sides and four corners positioned between each of the four sides. In addition, a second insertion hole (413) through which a wire (510) passes is formed on the four sides, and a groove (412) into which a magnet is inserted can be formed on the four corners.

[0115] The camera device (100A) may include a reinforcing member (420). The reinforcing member (420) may be formed of stainless steel (SUS). The reinforcing member (420) may reinforce the substrate (430) for the image sensor. The reinforcing member (420) may be combined with the substrate (430) for the image sensor. The reinforcing member (420) may be bonded to the substrate (430) for the image sensor by an adhesive. The reinforcing member (420) may be placed on the lower surface of the substrate holder (410).

[0116] The reinforcing member (420) may include a first coupling hole (421). The first coupling hole (421) may be coupled with the first projection (414) of the substrate holder (410). The reinforcing member (420) may include a second coupling hole (422). An adhesive may be applied to the second coupling hole (422). The second coupling hole (422) may be formed on a protruding part of the reinforcing member (420). The second coupling hole (422) may include a plurality of holes. The second coupling hole (422) may be formed with two holes each at each of the four corners of the reinforcing member (420), for a total of 16 holes, with two holes each at the eight protruding parts.

[0117] The reinforcing member (420) may include a protrusion (423). The protrusion (423) may be formed to protrude inward from the corner of the reinforcing member (420). In the reinforcing member (420), a space may be secured for the first coupling hole (421) to be formed through the protrusion (423). The first coupling hole (421) may be formed in the protrusion (423).

[0118] The reinforcing member (420) may include a second open area (424). The second open area (424) may be aligned on the optical axis (OA) with the fourth open area (121) of the driving substrate (120), the image sensor (444), the first open area (433) of the substrate for the image sensor (430), and the third open area (411) of the substrate holder (410).

[0119] The camera device (100A) may include a substrate (430) for an image sensor. The substrate (430) for an image sensor may be placed on the lower surface of a substrate holder (410). The substrate (430) for an image sensor may be combined with a reinforcing member (420). The substrate (430) for an image sensor may be combined with an image sensor module (440). The substrate (430) for an image sensor may be an image sensor mounting substrate on which an image sensor is mounted. The substrate (430) for an image sensor is provided in a state of being suspended from the lower part of a driving substrate (120) by means of a wire, and may move relative to the driving substrate (120) by means of the coil and magnet.

[0120] That is, a substrate holder (410), an image sensor substrate (430), and an image sensor module (440) are placed below the driving substrate (120).

[0121] Here, a structure in which a driving substrate (120), a substrate holder (410), a substrate for an image sensor (430), and an image sensor module (440) are combined can be called an image sensor actuator.

[0122] At this time, the driving substrate (120) and the image sensor substrate (430) are electrically connected to each other by a wire (510). Here, the length of the wire (510) may be greater than the sum of the thickness of the driving substrate (120), the thickness of the substrate holder (410), the thickness of the reinforcing member (420), and the thickness of the image sensor substrate (430). Accordingly, the substrate holder (410) placed below the driving substrate (120) is positioned at a certain distance from the driving substrate (120). Furthermore, the substrate holder (410), the image sensor substrate (430), and the image sensor module (440) may be fixed by the wire (510) at a position spaced at a certain distance from the driving substrate (120). That is, the substrate holder (410), the substrate for the image sensor (430), and the image sensor module (440) are supported by a wire (510) and can be arranged in a flying structure below the driving substrate (120).

[0123] A substrate (430) for an image sensor may include an insulating layer (431). The insulating layer (431) may be coupled to the lower surface of a substrate holder (410). The insulating layer (431) may be coupled to a reinforcing member (420). The insulating layer (431) may be coupled to an image sensor module (440). The insulating layer (431) may include a coupling hole (431-1). The coupling hole (431-1) may be coupled to a first projection (414) of the substrate holder (410). The insulating layer (431) may include a protrusion (431-2). The protrusion (431-2) may be formed to protrude inward from a corner of the insulating layer (431). Through the protrusion (431-2), a space for the coupling hole (431-1) to be formed may be secured. A coupling hole (431-1) may be formed in the protrusion (431-2).

[0124] Additionally, the insulating layer (431) may include a first open region (433).

[0125] Preferably, the first open area (433) can be aligned on the optical axis (OA) with the fourth open area (121) of the driving substrate (120), the image sensor (444) positioned below, the second open area (424) of the reinforcing member (420), and the third open area (411) of the substrate holder (410).

[0126] A substrate (430) for an image sensor may include an insulating layer (431) and a first lead pattern portion (432) disposed on the insulating layer (431).

[0127] The first lead pattern section (432) can be electrically connected to the terminals of the image sensor (444). The first lead pattern section (432) may be composed of multiple parts. For example, the first lead pattern section (432) may include a total of 24 terminal sections.

[0128] At this time, the first lead pattern section (432) may include a first-1 lead pattern section (432a) disposed in a first region of the insulating layer (431), a first-2 lead pattern section (432b) disposed in a second region facing the first region of the insulating layer (431), a first-3 lead pattern section (432c) disposed in a third region between the first and second regions of the insulating layer (431), and a first-4 lead pattern section (432d) disposed in a fourth region facing the third region of the insulating layer (431).

[0129] Additionally, each of the 1-1 to 1-4 lead pattern sections (432a, 432b, 432c, 432d) may include a first pattern section (432-1) disposed on an insulating layer (431), a second pattern section (432-2) coupled with a wire (510), and a connecting section (432-3) connecting the first pattern section (432-1) and the second pattern section (432-2). A hole through which the wire (510) passes may be formed in the second pattern section (432-2). The second pattern section (432-2) may be coupled with the wire (510) by soldering. The connecting section (432-3) may include a bent portion. The connecting section (432-3) may be bent multiple times in one direction. The connecting section (432-3) may have elasticity. The first lead pattern part (432) can have elasticity.

[0130] The first pattern section (432-1) can be electrically connected to an image sensor module. That is, the first pattern section (432) may be a mounting pad for mounting an image sensor (444) or an image sensor module.

[0131] The second pattern portion (432-2) may be a bonding pad electrically connected to the wire (510). That is, the second pattern portion (432-2) may be a soldering pad that is soldered to the wire (510). To this end, the second pattern portion (432-2) may include a first insertion hole through which the wire (510) passes. Furthermore, the first insertion hole may be aligned in a vertical direction with the second insertion hole formed within the substrate holder and the third insertion hole formed in the driving substrate.

[0132] The connecting portion (432-3) can connect the first pattern portion (432-1) and the second pattern portion (432-2) to each other. To this end, the connecting portion (432-3) may include a plurality of folded portions. At this time, the connecting portions (432-3) of each first lead pattern portion (432a, 432b, 432c, 432d) may be folded in the same direction. For example, as shown in FIG. 12b, the connecting portions (432-3) of each first lead pattern portion (432a, 432b, 432c, 432d) may include a folded portion that rotates clockwise. That is, the connecting portion (432-3) may be folded in a direction corresponding to the rotation direction in the z-axis direction of the image sensor module. Accordingly, the connecting portion (432-3) can minimize damage to the first lead pattern portion (432) when rotated in the z-axis direction, thereby preventing cracks or detachment from the insulating layer in the first lead pattern portion (432). Meanwhile, in the embodiment, an adhesive member (not shown) may be placed between the insulating layer (431) and the first lead pattern portion (432). The adhesive member may be interposed between the insulating layer (431) and the first lead pattern portion (432) to prevent detachment of the first lead pattern portion (432) on the insulating layer (431). The adhesive member may include a curing adhesive, etc.

[0133] Meanwhile, the first lead pattern portion (432) is a wiring that transmits an electrical signal and can be formed from a metal material with high electrical conductivity. To this end, the first lead pattern portion (432) can be formed from at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Additionally, the first lead pattern portion (432) can be formed from a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which has excellent bonding strength.

[0134] Preferably, the first lead pattern portion (432) may be formed of a metallic material having elasticity capable of moving the image sensor substrate (430) relative to the driving substrate (120) in the X-axis, Y-axis, and Z-axis directions while serving as wiring for transmitting electrical signals. To this end, the first lead pattern portion (432) may be formed of a metallic material having a tensile strength of 1000 MPa or more. For example, the first lead pattern portion (432) may be a binary alloy or a ternary alloy containing copper. For example, the first lead pattern portion (432) may be a copper (Cu)-nickel (Ni) binary alloy. For example, the first lead pattern portion (432) may be a copper (Cu)-tin (Sn) binary alloy. For example, the first lead pattern portion (432) may be a copper (Cu)-beryllium (Be) binary alloy. For example, the first lead pattern portion (432) may be a binary alloy of copper (Cu) and cobalt (Co). For example, the first lead pattern portion (432) may be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn). For example, the first lead pattern portion (432) may be a ternary alloy of copper (Cu), beryllium (Be), and cobalt (Co). In addition to the above metal materials, the first lead pattern portion (432) may be formed from an alloy of iron (Fe), nickel (Ni), zinc, etc., which has good electrical properties and elasticity capable of acting as a spring. Additionally, the first lead pattern portion (432) may be surface-treated with a plating layer containing metal materials such as gold (Au), silver (Ag), and palladium (Pd), thereby improving electrical conductivity.

[0135] Meanwhile, the first lead pattern section (432) can be manufactured using the additive process, subtractive process, MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process) processes, which are conventional manufacturing processes for printed circuit boards.

[0136] With reference to FIGS. 11b, FIGS. 11c and FIGS. 11d, the substrate (430) for the image sensor will be described in more detail.

[0137] As shown in FIG. 11b, a first lead pattern portion (432a, 432b, 432c, 432d) is disposed in each region of the insulating layer (431).

[0138] At this time, the placement positions of the first lead pattern parts (432a, 432b, 432c, 432d) are not aligned on the same vertical extension line or horizontal extension line, but may be shifted at a certain interval.

[0139] For example, the first-1 lead pattern section (432a) and the first-2 lead pattern section (432b) may be respectively placed on the first and second regions facing each other of the insulating layer (431). The placement positions of the first-1 lead pattern section (432a) and the first-2 lead pattern section (432b) may not be aligned on the same horizontal extension line and may be shifted by a first interval (d1). For example, the center (X1) of the first-1 lead pattern section placed at the uppermost position of the first-1 lead pattern section (432a) may be spaced by a first interval (d1) from the center (X2) of the first-2 lead pattern section placed at the uppermost position of the first-2 lead pattern section (432b).

[0140] Additionally, the first-3 lead pattern section (432c) and the first-4 lead pattern section (432d) may be respectively placed on the third and fourth regions facing each other of the insulating layer (431). The placement positions of the first-3 lead pattern section (432c) and the first-4 lead pattern section (432d) may not be aligned on the same vertical extension line but may be shifted by a second interval (d2). For example, the center (Y1) of the first-3 lead pattern section placed on the far left of the first-3 lead pattern section (432c) may be spaced by a second interval (d2) from the center (Y2) of the first-4 lead pattern section placed on the far left of the first-4 lead pattern section (432d).

[0141] That is, in the embodiment, the first lead pattern portion (432) is disposed in each of a plurality of regions of the insulating layer (431), and in order to facilitate rotation along the z-axis, it may be disposed at a position offset in one direction from the center of each region. For example, the first lead pattern portion (432a) may be disposed offset in the first direction from the center of the first region of the insulating layer (431). That is, the first lead pattern portion (432a) may be disposed offset downward from the first region of the insulating layer (431). For example, the first lead pattern portion (432b) may be disposed offset in the second direction opposite to the first direction from the center of the second region. That is, the first lead pattern portion (432b) may be disposed shifted upward from the center of the second region. The first lead pattern portion (432c) may be disposed offset in the third direction from the center of the third region of the insulating layer (431). For example, the first-third lead pattern section (432c) may be positioned shifted to the left from the center of the third region. The first-fourth lead pattern section (432d) may be positioned offset from the center of the fourth region of the insulating layer (431) in a fourth direction opposite to the third direction. For example, the first-fourth lead pattern section (432d) may be positioned shifted to the right from the center of the fourth region.

[0142] Meanwhile, the first pattern section (432-1) may include a mounting section (432-11) on which the image sensor (444) or image sensor module (440) is mounted, and an extension section (432-12) extending from the mounting section (432-11). At this time, the mounting section (432-11) may have a flat surface in the shape of a square pad so that the image sensor (444) or image sensor module (440) is stably mounted. The extension section (432-12) may extend from the mounting section (432-11) and be connected to a connection section (432-3).

[0143] At this time, the extension portion (432-12) can be bent from the mounting portion (432-11). Accordingly, the centerline of the extension portion (432-12) can be spaced apart from the centerline of the mounting portion (432-11) by a third distance (d3).

[0144] Additionally, the extension portion (432-12) may include a buffer pattern portion for buffering purposes in the area (A) connected to the connection portion (432-3). The buffer pattern portion may have a shape in which the width gradually decreases as it moves toward the direction in which the connection portion (432-3) is positioned. That is, the extension portion (432-12) may include a bent portion that is bent and extended from the mounting portion (432-11), and a buffer portion in an area that extends from the bent portion and whose width gradually decreases as it moves away from the bent portion. The buffer portion can resolve problems such as pattern breakage caused by the difference in pattern width between the first pattern portion (432-1) and the connection portion (432-3), and can stably connect the connection portion (432-3) and the mounting portion (432-11).

[0145] In addition, the buffer portion may not overlap within the vertical direction with the insulating layer. Through this, when the substrate is tilted as well as moved along the X, Y, and Z axes, the point where the connection portion and the pattern portion are connected does not exist on the insulating layer but is formed outside the insulating layer, thereby efficiently reducing pattern breakage caused by the width difference between the connection portion and the pattern portion.

[0146] Meanwhile, the center of the second pattern section (432-2) and the center of the first pattern section (432-1) may be placed on the same vertical or horizontal extension line. That is, the center of the second pattern section (432-2) and the center of the first pattern section (432-1) may be aligned on the same vertical or horizontal line. To this end, the first pattern section (432-1) may include an extension section (432-12) that is bent from the mounting section (432-11). According to this, the wire (510) connected to the second pattern section (432-2) and the terminal of the image sensor (444) placed on the first pattern section (432-1) may be aligned on the same vertical or horizontal line, thereby improving the accuracy of the movement position of the image sensor (444).

[0147] Meanwhile, among the first lead pattern sections (432), the first pattern section (432-1) is placed on the insulating layer (431), and the second pattern section (432-2) and the connecting section (432-3) are flying lead pattern sections extending horizontally from the insulating layer (431). That is, the first pattern section (432-1) is placed at a position that overlaps within the vertical direction with the insulating layer (431). And, the second pattern section (432-2) and the connecting section (432-3) are placed at a position that does not overlap within the vertical direction with the insulating layer (431). That is, the insulating layer (431) may be placed below the first pattern section (432-1), and the insulating layer (431) may not be placed below the second pattern section (432-2) and the connecting section (432-3).

[0148] The manufacturing process for the first lead pattern part (432) to have a flying structure as described above is briefly explained as follows.

[0149] As shown in FIG. 11d, an insulating layer (431), which is a basic material for a substrate (430) for an image sensor, can be prepared. At this time, the insulating layer (431) may include a main insulating part (431a), a dummy insulating part (431b), and a connecting insulating part (431c) between the main insulating part (431a) and the dummy insulating part (431b) to form a flying structure pattern.

[0150] That is, when the insulating layer (431) is prepared, the insulating layer (431) is punched or etched to remove the area excluding the dummy insulating portion (431b) and the connecting insulating portion (431c). The dummy insulating portion (431b) and the connecting insulating portion (431c) may serve to support a metal layer (not shown) that is placed to form the first lead pattern portion (432).

[0151] When the area excluding the dummy insulation part (431b) and the connecting insulation part (431c) is removed, a metal layer (not shown) is placed on the insulation layer (431). At this time, the metal layer may include an area placed on the dummy insulation part (431b), an area placed on the connecting insulation part (431c), and an area placed on the main insulation part (431a). Then, the placed metal layer may be etched to form a first lead pattern part (432) so that the first lead pattern part (432) has a flying structure. At this time, when the manufacturing of the first lead pattern part (432) is completed, the space between the main insulation part (431a) and the connecting insulation part (431c) may be diced to separate the dummy insulation part (431b) from the main insulation part (431a).

[0152] Meanwhile, the camera device (100A) may include an image sensor module (440). The image sensor module (440) may be coupled to a substrate holder (410). The image sensor module (440) may be fixed to the substrate holder (410). The image sensor module (440) may move integrally with the substrate holder (410). The image sensor module (440) may include a cover (441), a filter (442), a substrate (443), an image sensor (444), and a reinforcing plate (445). However, one or more of the cover (441), filter (442), package substrate (443), image sensor (444), and reinforcing plate (445) of the image sensor module (440) may be omitted.

[0153] The image sensor module (440) may include a cover (441). The cover (441) may cover the filter (442) and the image sensor (444). The cover (441) may include a top plate and a side wall. The cover (441) may include a hole (441a). The hole (441a) may be a hollow hole. The hole (441a) may be an opening. The cover (441) may include a protrusion (441b). The protrusion (441b) may protrude from the lower surface of the cover (441). The protrusion (441b) may be inserted into the second hole (443b) of the substrate (4430) and the hole (445a) of the reinforcing plate (445).

[0154] The image sensor module (440) may include a filter (442). The filter (442) may serve to block light of a specific frequency band from passing through the lens module (210) from entering the image sensor (444). The filter (442) may be positioned parallel to the xy plane. The filter (442) may be positioned between the lens module (210) and the image sensor (444). The filter (442) may be positioned between the cover (441) and the package substrate (443). As a variation, the filter (442) may be positioned in a hole (441a) of the cover (441). The filter (442) may include an infrared filter. The infrared filter may absorb or reflect infrared light incident on the infrared filter.

[0155] The image sensor module (440) may include a package substrate (443). The package substrate (443) may be a substrate for mounting an image sensor (444) in a package form. The package substrate (443) may include a printed circuit board (PCB). The package substrate (443) may include a circuit board. An image sensor (444) may be placed on the package substrate (443). The package substrate (443) may be coupled to an image sensor substrate (430). The package substrate (443) may include a first hole (443a) having a shape and size corresponding to the image sensor (444). An image sensor (444) may be inserted and placed in the first hole (443a) of the package substrate (443). The package substrate (443) may include a second hole (443b). A projection (441b) of the cover (441) may be inserted into the second hole (443b) of the package substrate (443). The package substrate (443) may include a terminal (443c). The terminal (443c) of the package substrate (443) may be disposed on each of the four side portions on the lower surface of the package substrate (443). The terminal (443c) of the package substrate (443) may be connected to the first lead pattern portion (432) of the image sensor substrate (430). More specifically, the terminal (443c) of the package substrate (443) may be connected to the first pattern portion (432-1) of the first lead pattern portion (432) of the image sensor substrate (430).

[0156] The package substrate (443) may include a groove (443d). The groove (443d) of the package substrate (443) may be formed at each of the four corners of the package substrate (443). The first projection (414) of the substrate holder (410) may be avoided by the groove (443d) of the package substrate (443).

[0157] The image sensor module (440) may include an image sensor (444). The image sensor (444) may be coupled to a substrate holder (410). The image sensor (444) may move integrally with the substrate holder (410). However, the image sensor (444) may not be directly coupled to the substrate holder (410), but rather a package substrate (443) to which the image sensor (444) is coupled may be coupled to the substrate holder (410). As a variation, the image sensor (444) may be directly coupled to the substrate holder (410). The image sensor (444) may be aligned with the optical module. The image sensor (444) may be configured such that an image is formed by light passing through a lens and a filter (442) being incident. The image sensor (444) may be mounted on the package substrate (443). The image sensor (444) may be electrically connected to the package substrate (443). For example, the image sensor (444) can be coupled to the package substrate (443) by surface mounting technology (SMT). As another example, the image sensor (444) can be coupled to the substrate (443) by flip chip technology. The image sensor (444) can be positioned so that the optical axis of the lens aligns with the optical axis. That is, the optical axis of the image sensor (444) and the optical axis of the lens can be aligned. The image sensor (444) can convert light incident on the effective image area of ​​the image sensor (444) into an electrical signal. The image sensor (444) can be any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID.

[0158] In this embodiment, the image sensor (444) can be rotated around the x-axis, y-axis, and z-axis. The image sensor (444) can be moved around the x-axis, y-axis, and z-axis. The image sensor (444) can be tilted around the x-axis, y-axis, and z-axis.

[0159] The image sensor module (440) may include a reinforcing plate (445). The reinforcing plate (445) may be placed on the lower surface of the image sensor (444) and the package substrate (443). The reinforcing plate (445) may be formed of stainless steel (SUS). The reinforcing plate (445) may reinforce the image sensor (444) and the package substrate (443). The reinforcing plate (445) may include a hole (445a). The hole (445a) may be coupled with a projection (441b) of the cover (441). The reinforcing plate (445) may include a groove (445b). The groove (445b) may be formed at each of the four corners of the reinforcing plate (445). The groove (445b) may be formed by the corner of the reinforcing plate (445) being recessed inward.

[0160] The camera device (100A) may include a wire (510). The wire (510) may connect a driving substrate (120) and an image sensor substrate (430). The wire (510) may have elasticity. The wire (510) may be an elastic member. The wire (510) may be a wire spring. At this time, the wire (510) may electrically connect the second lead pattern portion (122) of the driving substrate (120) and the first lead pattern portion (432) of the image sensor substrate (430) while maintaining a certain distance between the driving substrate (120) and the image sensor substrate (430).

[0161] The wire (510) may be formed of metal. The wire (510) may be electrically connected to the image sensor (444). The wire (510) may be used as a conductive line of the image sensor (444). One end of the wire (510) may be connected to the driving substrate (120), and the other end of the wire (510) may be connected to the first lead pattern portion (432). The wire (510) may elastically support the movement of the substrate holder (410).

[0162] The wire (510) may include a plurality of wires. The plurality of wires may include a number of wires corresponding to the number of terminals of the image sensor (444). The plurality of wires may include a total of 24 wires, with 6 wires between adjacent corners among the 4 corners of the substrate holder.

[0163] The camera device (100A) may include a sensor (520). The sensor (520) may be placed on the upper surface of the driving board (120). The sensor (520) may include a Hall sensor (Hall IC). The sensor (520) may detect the magnetic force of the magnet (320). The movement of the image sensor (444) can be detected in real time through the magnetic force of the magnet (320) detected by the sensor (520). Through this, OIS feedback control may be possible.

[0164] The sensor (520) may include a plurality of sensors. The sensor (520) may include three sensors. Through the three sensors, movement in the x-axis direction, movement in the y-axis direction, and rotation around the z-axis of the image sensor (444) can all be detected. The sensor (520) may include first to third sensors. The first sensor may be opposite to the first magnet (321), the second sensor may be opposite to the second magnet (322), and the third sensor may be opposite to the third magnet (323).

[0165] The camera device (100A) may include a housing (600). The housing (600) may be coupled with a holder (110). The housing (600) may provide an internal space through coupling with the holder (110). The exterior of the camera device (100A) may be formed by the housing (600) and the holder (110). The housing (600) may accommodate components such as a coil (310) and a magnet (320) inside. The housing (600) may include a shield can.

[0166] The housing (600) may include a side wall (610). The side wall (610) may include a plurality of side walls. The side wall (610) may include four side walls. The housing (600) may include a lower portion (620). The lower portion (620) may extend inward from the bottom of the side wall (610). The lower portion (620) may include a hole. The lower surface of the housing (600) may be formed by a separate lower plate (630). The lower plate (630) may be understood as a component of the housing (600) or as a separate component. The lower plate (630) may include a groove (631) that fits with a projection (622) protruding from the lower surface of the lower portion (620) of the housing (600).

[0167] The camera device (100A) may include a flexible circuit board (150). The flexible circuit board (150) may be electrically connected to a coil (310). The flexible circuit board (150) may include a terminal (150a) that is coupled to a terminal (222) of a MEMS actuator (220). The flexible circuit board (150) may include a hole through which a lens module (210) passes.

[0168] The camera device (100A) may include a connector (190). The connector (190) may be electrically connected to a flexible circuit board (150). The connector (190) may include a port for electrically connecting to an external device.

[0169] The camera device (100A) may include a motion sensor. The motion sensor may be mounted on a flexible circuit board (150). The motion sensor may be electrically connected to a control unit through a circuit pattern provided on the flexible circuit board (150). The motion sensor may output rotational angular velocity information based on the movement of the camera device (100A). The motion sensor may include one or more of a 2-axis gyro sensor, a 3-axis gyro sensor, and an angular velocity sensor.

[0170] The camera device (100A) may include a control unit. The control unit may be placed on a flexible circuit board (150). The control unit may be electrically connected to a coil (310). The control unit may individually control the direction, intensity, and amplitude of the current supplied to the first to fourth coils (311, 312, 313, 314). The control unit may perform an autofocus function and / or a hand shake correction function by controlling the current applied to the coil (310) and the current applied to the MEMS actuator (220). Furthermore, the control unit may perform autofocus feedback control and / or hand shake correction feedback control.

[0171] The camera device (100A) according to the present embodiment may be for mobile camera application. That is, it can be distinguished from a camera device for digital camera application. When miniaturized for mobile camera application, the driving force of the VCM is relatively reduced, so there is a problem that the current consumed to implement three operations (X-Shift, Y-Shift, Z-Rotation (Roll)) increases.

[0172] The magnet (320) and the coil (310) are rotated 90 degrees at each corner (corner) of the substrate holder (410) so that the magnet (320) and the coil (310) located diagonally can be assembled in the same direction. In this case, when shifting the image sensor (444), a Lorentz force in the same direction is generated, and when rotating the z-axis, two pairs of rotational forces can be generated as forces in opposite directions.

[0173] In this embodiment, since the four coils located at the corners require independent current inputs, the power terminals of the coils (310) can be separated to have a system that controls them into four channels. That is, this embodiment may include a diagonal arrangement structure of magnets in the same magnetic flux direction and a structure for individual current inputs for the four coils.

[0174] This embodiment may include two pairs of torque generating structures (increasing rotational moment). With a structure that generates two pairs of torque, it can generate a higher rotational moment compared to conventional methods and can reduce the total current consumption when driving in three modes: X-Shift, Y-Shift, and Z-Rotation (Roll).

[0175] The simulation results for the camera device according to the present embodiment are as follows. When 'rotational moment = torque * distance between torques = (electromagnetic force * input current) * distance between centers of magnets (320)', it was confirmed that when 50mA is applied as an input current to the coil (310) of the camera device (100A) according to the present embodiment, a rotational moment of {(0.094mN / mA x 50mA) x 12.14mm} x 2 = 114.1 mN.mm is generated.

[0176] In this embodiment, image stabilization for the image sensor (444) and image stabilization for the corresponding lens can be performed together. For example, if image stabilization is performed only by the MEMS actuator (220), positive (+) distortion may occur at the edges of the image obtained from the image sensor (444). On the other hand, if image stabilization is performed by moving only the image sensor (444), negative (-) distortion may occur at the edges of the image obtained from the image sensor (444). In this embodiment, image stabilization for the image sensor (444) and image stabilization in the MEMS actuator (220) are performed together, so that distortion occurring at the edges of the image can be minimized. In this embodiment, the image stabilization function is performed on the lens side through the MEMS actuator (220), and the image sensor (444) can also be moved accordingly. Through this, it is possible to provide a level of shake correction corresponding to a module movement method in which the lens and the image sensor (444) move as a single unit. However, in this embodiment, the MEMS actuator (220) may only provide an AF function and may also perform an OIS function through the movement of the image sensor (444).

[0178] Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

[0179] FIG. 19 is a perspective view of an optical device according to the present embodiment, and FIG. 20 is a configuration diagram of the optical device shown in FIG. 19.

[0180] The optical device (100B) may be any one of a mobile phone, a smartphone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), and a navigation device. However, the type of optical device (100B) is not limited to these, and any device for taking images or photos may be included in the optical device (100B).

[0181] The optical device (100B) may include a main body (850). The main body (850) may be in the form of a bar. Alternatively, the main body (850) may have various structures such as a slide type, folder type, swing type, or swivel type in which two or more sub-bodies are combined to move relative to each other. The main body (850) may include a case (casing, housing, cover) forming the exterior. For example, the main body (850) may include a front case (851) and a rear case (852). Various electronic components of the optical device (100B) may be embedded in the space formed between the front case (851) and the rear case (852). A display (751) may be placed on one side of the main body (850). A camera (721) may be placed on one or more sides of the main body (850), including one side and the other side opposite to that side.

[0182] The optical device (100B) may include a wireless communication unit (710). The wireless communication unit (710) may include one or more modules that enable wireless communication between the optical device (100B) and a wireless communication system or between the optical device (100B) and a network where the optical device (100B) is located. For example, the wireless communication unit (710) may include one or more of a broadcast reception module (711), a mobile communication module (712), a wireless internet module (713), a short-range communication module (714), and a location information module (715).

[0183] The optical device (100B) may include an A / V input unit (720). The A / V (Audio / Video) input unit (720) is for inputting an audio signal or a video signal and may include one or more of a camera (721) and a microphone (722). In this case, the camera (721) may include a camera device (100A) according to the present embodiment.

[0184] The optical device (100B) may include a sensing unit (740). The sensing unit (740) can detect the current state of the optical device (100B), such as the open / closed state of the optical device (100B), the position of the optical device (100B), whether there is user contact, the orientation of the optical device (100B), and the acceleration / deceleration of the optical device (100B), and generate a sensing signal to control the operation of the optical device (100B). For example, if the optical device (100B) is in the form of a slide phone, it can sense whether the slide phone is open or closed. In addition, it can perform sensing functions related to whether power is supplied by the power supply unit (790) and whether an external device is connected to the interface unit (770).

[0185] The optical device (100B) may include an input / output unit (750). The input / output unit (750) may be configured to generate input or output related to sight, hearing, or touch. The input / output unit (750) may generate input data for controlling the operation of the optical device (100B) and may also output information processed by the optical device (100B).

[0186] The input / output unit (750) may include one or more of a keypad unit (730), a display (751), an audio output module (752), and a touch screen panel (753). The keypad unit (730) may generate input data by keypad input. The display (751) may output an image captured by the camera (721). The display (751) may include a plurality of pixels whose color changes according to an electrical signal. For example, the display (751) may include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display. The sound output module (752) can output audio data received from the wireless communication unit (710) in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or output audio data stored in the memory unit (760). The touch screen panel (753) can convert a change in capacitance caused by a user's touch on a specific area of ​​the touch screen into an electrical input signal.

[0187] The optical device (100B) may include a memory unit (760). A program for processing and controlling the control unit (780) may be stored in the memory unit (760). Additionally, the memory unit (760) may store one or more of input / output data, such as a phone book, messages, audio, still images, photos, and videos. The memory unit (760) may store images captured by the camera (721), such as photos or videos.

[0188] The optical device (100B) may include an interface section (770). The interface section (770) serves as a passage connecting to an external device connected to the optical device (100B). The interface section (770) may receive data from an external device, receive power and transmit it to each component inside the optical device (100B), or allow data inside the optical device (100B) to be transmitted to an external device. The interface section (770) may include one or more of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port.

[0189] The optical device (100B) may include a control unit (780). The control unit (controller, 780) may control the overall operation of the optical device (100B). The control unit (780) may perform related control and processing for voice calls, data communication, video calls, etc. The control unit (780) may include a multimedia module (781) for multimedia playback. The multimedia module (781) may be provided within the control unit (180) or may be provided separately from the control unit (780). The control unit (780) may perform pattern recognition processing capable of recognizing handwriting input or drawing input performed on a touchscreen as characters and images, respectively.

[0190] The optical device (100B) may include a power supply unit (790). The power supply unit (790) may receive external power or internal power under the control of the control unit (780) and supply power necessary for the operation of each component.

[0192] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

[0193] According to an embodiment, to implement OIS and AF functions of a camera module, instead of moving a conventional lens barrel, an image sensor is moved relatively to the lens barrel in the X, Y, and Z axis directions. Accordingly, the camera module according to the embodiment can eliminate a complex spring structure for implementing OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor relative to the lens barrel according to the embodiment, a more stable structure can be formed compared to the conventional one.

[0194] In addition, according to an embodiment, a terminal portion electrically connected to an image sensor is configured to have a spring structure and is positioned to float without overlapping within the vertical direction of the insulating layer. Accordingly, the camera module can stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0195] According to the above embodiment, X-axis direction shift, Y-axis direction shift, and Z-axis center rotation corresponding to hand shake can be performed on the image sensor, and accordingly, hand shake correction for the image sensor and hand shake correction for the corresponding lens can be performed together, thereby providing an improved hand shake correction function.

Claims

Claim 1 A camera module comprising: a fixed part including a first driving part; a second driving part corresponding to the first driving part; and an movable part including an image sensor that moves relative to the fixed part; and a wire disposed between the fixed part and the movable part and elastically supporting the movement of the movable part relative to the fixed part, wherein the movable part moves relative to the fixed part by a driving force provided by the interaction of the first driving part and the second driving part. Claim 2 A camera module according to claim 1, further comprising a lens portion disposed on the fixed portion. Claim 3 In paragraph 2, the fixed part and the movable part each include a plurality of corner regions and a plurality of side regions provided between the plurality of corner regions, and the wire is coupled to the fixed part and the movable part in the plurality of outer regions, a camera module. Claim 4 A camera module according to paragraph 3, wherein the first driving unit is disposed in each of the plurality of corner areas of the fixed part, and the second driving unit is disposed in each of the plurality of corner areas of the movable part. Claim 5 In paragraph 2, either of the first driving unit and the second driving unit comprises a plurality of magnets, and the other of the first driving unit and the second driving unit comprises a plurality of coil units, and the actuator is a camera module that moves relative to the fixed unit by the interaction between the plurality of magnets and the plurality of coil units. Claim 6 In paragraph 5, the plurality of magnets are fixed, and the plurality of coil units move relative to the plurality of magnets, a camera module. Claim 7 A camera module according to claim 5, wherein each corner area of ​​the fixed part and the movable part comprises first to fourth corner areas sequentially located along the periphery direction, the plurality of magnets comprises first to fourth magnets disposed in the first to fourth corner areas of the fixed part or the movable part, and the plurality of coil units comprises first to fourth coil units disposed in the first to fourth corner areas of the fixed part or the movable part. Claim 8 A camera module according to claim 7, wherein the plurality of magnets and the plurality of coil units each include a long side and a short side, and among the plurality of magnets and the plurality of coil units, the long side and the short side of the magnets and coil units that overlap each other along the vertical direction are arranged in a direction parallel to each other. Claim 9 A camera module according to claim 6, wherein the movement of the above-mentioned actuator includes a first movement in a first direction perpendicular to the optical axis of the lens portion, and the plurality of coil units includes a first group of coil units driven for the first movement. Claim 10 A camera module according to claim 9, wherein the movement of the actuator includes a second movement in a second direction perpendicular to the optical axis and the first direction, and the plurality of coil units includes a second group of coil units separated from the first group of coil units driven for the second movement. Claim 11 In claim 10, the movement of the above-mentioned actuator includes a third movement rotating around the optical axis, and at least one of the first group of coil units and the second group of coil units is driven for the third movement, a camera module. Claim 12 A camera module according to claim 5, further comprising a position sensor disposed inside at least one of the plurality of coil units and detecting the magnetic field of the magnet. Claim 13 In paragraph 2, the actuator includes a first circuit board on which the second driving unit is disposed, and the image sensor is disposed on the first circuit board, forming a camera module. Claim 14 In Clause 13, the image sensor is a camera module that moves relative to the lens portion. Claim 15 A camera module according to claim 13, wherein the fixed part comprises a second circuit board spaced apart from the first circuit board with respect to the optical axis of the lens part. Claim 16 A camera module according to claim 1, wherein the upper end of the wire is connected to the fixed part and the lower end of the wire is connected to the movable part. Claim 17 In paragraph 13, the camera module is provided with a plurality of wires spaced apart from each other along the circumferential direction of the lower surface of the fixed part or the upper surface of the movable part. Claim 18 In claim 17, the camera module, wherein the plurality of wires electrically connect the image sensor and the fixed part. Claim 19 A camera module according to claim 10, wherein the coil units of the first group are arranged offset from each other along the first direction and the second direction, and the coil units of the second group are arranged offset from each other along the first direction and the second direction.

Images