Driving apparatus of image sensor and camera module including the same

Abstract

A sensor driving device according to an embodiment includes a fixed part comprising a first substrate including a first lead pattern part; a moving part including an image sensor disposed at a certain distance from the fixed part; and a wire part disposed between the moving part and the fixed part, wherein one end of the wire part is connected to the first lead pattern part and the other end is connected to the moving part to elastically support the moving part with respect to the fixed part, and the wire part includes a first metal layer, and the diameter of the first metal layer has a range between 15㎛ and 35㎛.

Description

Technology Field

[0001] An embodiment relates to a sensor driving device and a camera module including the same. Background Technology

[0002] As the distribution of various mobile devices has become widespread and wireless internet services have been commercialized, consumer demands related to mobile devices are also diversifying, leading to the installation of various types of accessory devices on mobile devices.

[0003] In addition, users of mobile devices desire optical devices that have high resolution, are small in size, and possess various shooting functions. For example, various shooting functions may refer to at least one of optical zoom (zoom-in / zoom-out), auto-focusing (AF), or optical image stabilization (OIS).

[0004] Conventionally, to implement the various shooting functions described above, a method was used in which multiple lenses were combined and the combined lenses were moved directly. However, increasing the number of lenses in this way can increase the size of the optical device.

[0005] Autofocus and image stabilization functions are performed by moving or tilting multiple lenses, which are fixed to a lens holder and aligned with the optical axis, in the direction perpendicular to the optical axis or to this end, and a separate lens driving device is required to shift a lens assembly composed of multiple lenses.

[0006] However, the lens shift used in conventional lens driving devices has limitations in correcting various types of shake. The problem to be solved

[0007] The present embodiment aims to provide a sensor driving device capable of correcting hand shake for x-axis direction shift, y-axis direction shift, and z-axis center rotation, and a camera module including the same.

[0008] In addition, the present embodiment aims to provide a sensor driving device in which hand shake correction through a lens and hand shake correction through an image sensor are performed together, and a camera module including the same.

[0009] In addition, the present embodiment aims to provide a sensor driving device capable of simplifying a spring structure for providing an autofocus function or a hand shake compensation function, and a camera module including the same.

[0010] In addition, the present embodiment aims to provide a sensor driving device comprising a first actuator for an autofocus function and a second actuator for a hand shake compensation function configured separately from the first actuator, and a camera module comprising the same.

[0011] In addition, the embodiment aims to provide a sensor driving device capable of improving image quality through impedance matching of a camera module and a camera module including the same.

[0012] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the proposed embodiments belong from the description below. means of solving the problem

[0013] A sensor driving device according to an embodiment includes a fixed part comprising a first substrate including a first lead pattern part; a moving part including an image sensor disposed at a certain distance from the fixed part; and a wire part disposed between the moving part and the fixed part, wherein one end of the wire part is connected to the first lead pattern part and the other end is connected to the moving part to elastically support the moving part with respect to the fixed part, and the wire part includes a first metal layer, and the diameter of the first metal layer has a range between 15㎛ and 35㎛.

[0014] In addition, the length of the first metal layer of the wire portion has a range between 0.3 mm and 2.0 mm.

[0015] Additionally, the moving part includes an insulating layer and a second lead pattern part disposed on the insulating layer, and the other end of the wire part is connected to the second lead pattern part, and the second lead pattern part includes a body part disposed on the insulating layer, a coupling part coupled to the other end of the wire part, and a connecting part connecting the body part and the coupling part.

[0016] In addition, the coupling portion and the connecting portion of the second lead pattern portion do not overlap with the insulating layer in the optical axis direction.

[0017] In addition, the thickness of the second lead pattern portion satisfies a range between 15㎛ and 35㎛.

[0018] In addition, the line width of the connection portion of the second lead pattern portion satisfies a range between 35㎛ and 55㎛.

[0019] In addition, the outer distance of the coupling portion of the second lead pattern portion satisfies a range between 200㎛ and 380㎛.

[0020] Additionally, the connecting portion includes a first connecting portion disposed on a first side of the coupling portion and a second connecting portion that is bent and extended from the first connecting portion and disposed on a second side of the coupling portion different from the first side.

[0021] In addition, the first separation distance between the center of the joint portion and the outer side of the first connecting portion satisfies a range between 250㎛ and 410㎛.

[0022] In addition, the second separation distance between the center of the joint portion and the outer side of the second connecting portion satisfies a range between 200㎛ and 320㎛.

[0023] In addition, the wire portion includes a first insulating layer disposed on the outside of the first metal layer.

[0024] In addition, the wire portion includes a second metal layer disposed on the outside of the first insulating layer.

[0025] In addition, the wire portion includes a second insulating layer disposed on the outside of the second metal layer.

[0026] In addition, the second insulating layer comprises an insulating material different from that of the first insulating layer, and the dielectric constant of the first insulating layer is smaller than the dielectric constant of the second insulating layer.

[0027] Meanwhile, the sensor driving device according to the embodiment includes a fixed part comprising a first substrate including a first lead pattern part; and a moving part disposed at a certain distance from the fixed part and including an image sensor; and includes a plurality of wires disposed between the fixed part and the movable part, wherein the movable part includes an insulating layer and a second lead pattern part disposed on the insulating layer, and a sensor substrate part disposed between the second lead pattern part and the fixed part and including a pad part, wherein one end of the plurality of wires is connected to the first lead pattern part and the other end is connected to the second lead pattern part, and the pad part is electrically connected to the second lead pattern part, and the second lead pattern part includes a body part disposed on the insulating layer, a coupling part coupled to the other end of the wire part, and a connecting part connecting the body part and the coupling part, wherein the connecting part includes a first connecting part disposed on the first side of the coupling part and a second connecting part bent and extended from the first connecting part and disposed on the second side different from the first side of the coupling part, wherein the thickness of the second lead pattern part satisfies a range between 15㎛ and 35㎛, and the line width of the connecting part of the second lead pattern part satisfies a range between 35㎛ and 55㎛, and the The outer distance of the joint portion satisfies a range between 200㎛ and 380㎛, the first separation distance between the center of the joint portion and the outer side of the first connecting portion satisfies a range between 250㎛ and 410㎛, and the second separation distance between the center of the joint portion and the outer side of the second connecting portion satisfies a range between 200㎛ and 320㎛.

[0028] In addition, the diameter of each of the plurality of wires satisfies a range between 15㎛ and 35㎛, and the length of each of the plurality of wires has a range between 0.3mm and 2.0mm. Effects of the invention

[0029] According to an embodiment, the sensor driving device can improve the operational reliability of the image sensor through impedance matching and further improve the quality of the image obtained through the image sensor.

[0030] Specifically, the embodiment includes a movable substrate for moving the image sensor. Accordingly, in the embodiment, the signal transmission line through which the image sensor is transmitted is transmitted from the output terminal of the image sensor to the lead pattern portion of the movable substrate, then transmitted again from the lead pattern portion to a connecting wire, and then transmitted to the connector of the main substrate through the connecting wire. Accordingly, in the embodiment, impedance matching between the output terminal of the image sensor and the connector of the main substrate is required. In this case, in a typical camera module, impedance matching with a value similar to 100Ω is required. In this case, in the comparative example, the image sensor is directly coupled to the first substrate, and accordingly, the image signal acquired from the image sensor is transmitted to the main board of the optical device through the connector via a single first substrate. Accordingly, the comparative example has a structure in which the image signal is transmitted through a single substrate as described above, and accordingly, the impedance has a value similar to 100Ω. In contrast, in the embodiment, a structure is provided in which a connecting wire and a movable substrate are additionally disposed between the image sensor and the first substrate as described above, and accordingly, the maximum impedance between the output terminal of the image sensor and the connector has a value of 300Ω or more. Accordingly, in the embodiment, the structure of the lead pattern portion disposed on the movable substrate and the structure of the connecting wire are modified. Accordingly, in the embodiment, the impedance between the output terminal of the image sensor and the connector can be matched within the range of 100Ω ± 10%. Accordingly, in the embodiment, the operational reliability of the sensor driving device having a sensor shift structure can be improved through the impedance matching. Furthermore, in the embodiment, the quality of the image signal obtained from the image sensor can be improved through the improvement of the operational reliability of the sensor driving device, and furthermore, the product satisfaction of the camera module can be improved.That is, in the embodiment, noise can be reduced by improving impedance mismatching through changes in the structure of the lead pattern portion and the structure of the connecting wire. Furthermore, in the embodiment, signal loss can be reduced through noise improvement, and communication performance can be improved accordingly.

[0031] Meanwhile, in the embodiment, the structure of the lead pattern portion includes the line width of the second part of the lead pattern portion, the outer length of the third part, a first distance between the outermost part of the second part and the center of the third part in a first direction, and a second distance between the outermost part of the second part and the center of the third part in a second direction. Additionally, the structure of the connecting wire in the embodiment includes the diameter and length of the connecting wire.

[0032] In addition, in determining the structure of the lead pattern portion and the structure of the connecting wire in the embodiment, optimal design values ​​are determined by reflecting not only the impedance matching conditions but also eye diagram conditions including the height and width of the eye diagram. Accordingly, in the embodiment, the eye height and eye width of the eye diagram can be increased, and the performance of MIPI (Mobile Industry Processor Interface) can be improved. Furthermore, in the embodiment, communication quality can be improved due to the improvement in MIPI performance, and thereby, the image quality of the camera module using MIPI communication can be improved.

[0033] In addition, in the embodiment, the connecting wire is configured with a plurality of layers to provide optimal communication performance. Specifically, the connecting wire in the embodiment forms at least one layer surrounding the outside of a first metal layer constituting the wire. For example, the connecting wire may include a first metal layer and a first insulating layer surrounding the outside of the first metal layer. For example, the connecting wire may include a first metal layer, a first insulating layer surrounding the outside of the first metal layer, and a second metal layer surrounding the outside of the first insulating layer. For example, the connecting wire may include a first metal layer, a first insulating layer surrounding the outside of the first metal layer, a second metal layer surrounding the outside of the first insulating layer, and a second insulating layer surrounding the outside of the second metal layer. Accordingly, in the embodiment, the electromagnetic field generated by the current flowing through the wire including the first metal layer can be shielded through at least one of the first insulating layer, the second metal layer, and the second insulating layer. Accordingly, in the embodiment, common mode noise can be reduced compared to a comparative example using a connecting wire containing only the first metal layer, and the communication speed can be improved accordingly.

[0034] In addition, in the embodiment, the impedance matching value between the output terminal of the image sensor and the connector is varied, and the relationship between each impedance matching value and common mode noise is derived using a formula. Accordingly, in the embodiment, the common mode noise value corresponding to each impedance matching value can be easily identified, thereby facilitating the determination of the impedance matching value.

[0035] In addition, according to an embodiment, to implement OIS and AF functions of a camera module, instead of moving a conventional lens barrel, an image sensor is moved relatively to the lens barrel in the X, Y, and Z axis directions. Accordingly, the camera module according to the embodiment can eliminate a complex spring structure for implementing OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor relative to the lens barrel according to the embodiment, a more stable structure can be formed compared to the conventional one.

[0036] In addition, according to an embodiment, a terminal portion electrically connected to an image sensor is configured to have a spring structure and is positioned to float without overlapping within the vertical direction of the insulating layer. Accordingly, the camera module can stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0037] According to the above embodiment, X-axis direction shift, Y-axis direction shift, and Z-axis center rotation corresponding to hand shake can be performed on the image sensor, and accordingly, hand shake correction for the image sensor and hand shake correction for the corresponding lens can be performed together, thereby providing an improved hand shake correction function.

[0038] In addition, according to an embodiment, the overall height of the camera device can be reduced by utilizing the internal space of a second actuator that moves the image sensor relative to the lens barrel to embed electrical components required for the camera circuit.

[0039] In addition, according to an embodiment, the camera assembly process can be simplified by integrating and fusing the camera circuit component and the second actuator component.

[0040] In addition, according to an embodiment, the reliability of the camera device can be improved by performing AF using a first actuator that implements a lens shift method and performing OIS using a second actuator that implements an image sensor shift method. Brief explanation of the drawing

[0041] Figure 1 is a drawing showing a camera module according to a comparative example. FIG. 2 is a perspective view of a camera device according to the present embodiment. Figure 3 is a cross-sectional view taken from AA in Figure 2. FIG. 4 is an exploded perspective view of a camera device according to the present embodiment. FIG. 5 is an exploded perspective view of the first actuator shown in FIG. 4 in the first embodiment. Figure 6 (a) is a plan view of the base of Figure 5. Fig. 6(b) is a plan view of the first actuator of Fig. 5. Figure 6 (c) is a bottom view of the first actuator of Figure 5. FIG. 7 is an exploded perspective view of a second actuator according to an embodiment. FIG. 8 is a cross-sectional view briefly illustrating the connection relationship between the first substrate and the moving part of FIG. 7. Fig. 9 is an exploded perspective view of the fixed part of Fig. 7. FIGS. 10a and FIGS. 10b are bottom views of the fixed part of FIG. 7 according to the first and second embodiments. FIG. 11 is a drawing showing the upper surface of the first substrate in more detail. FIG. 12 is an exploded perspective view of a moving part according to an embodiment. Figure 13 (a) is a top view of the second substrate, and Figure 13 (b) is a bottom view of the second substrate. FIG. 14 (a) is a top view of the third substrate, and FIG. 14 (b) is a bottom view of the third substrate. FIG. 15 is an exploded view of the fourth substrate. Figure 16 is a plan view of the fourth substrate. Figure 17 is an enlarged view of a specific area of ​​Figure 15. Figure 18 is a combined diagram of the third substrate and the fourth substrate. FIG. 19 is an exploded perspective view of an image sensor module (400) according to an embodiment. FIG. 20 is a diagram showing the combination of the third substrate and the image sensor module (400). FIG. 21 is a diagram illustrating x-axis direction shift driving through a part configuration of a camera device according to the present embodiment. FIG. 22 is a diagram illustrating y-axis direction shift driving through a part configuration of a camera device according to the present embodiment. FIG. 23 is a diagram illustrating z-axis center rotational drive through a part configuration of a camera device according to the present embodiment. Figure 24 (a) is a drawing showing the first substrate and the magnet placed in the magnet holder along with the x-axis and y-axis. Figure 24 (b) is a drawing showing the first substrate, magnet holder, magnet, and coil together with z-axis rotational drive. FIG. 25 is a diagram illustrating the magnetic flow and Lorentz force between the magnet and the coil of a camera device according to the present embodiment. FIG. 26 is a drawing for explaining the first variable conditions for optimal design according to an embodiment. FIG. 27 is a diagram illustrating the second variable conditions for optimal design according to an embodiment. FIG. 28 is a diagram illustrating the trend of impedance matching values ​​according to an embodiment. FIG. 29 is a diagram illustrating the trend of the result value of the eye-diagram according to an embodiment. Figures 30a to 30g are graphs showing the impedance matching results for each case in Table 3. Figures 31a to 31h are graphs showing the eye-diagram results for each case in Table 3. Figures 32a to 32h are graphs showing the common mode noise values ​​for each case in Table 3. FIG. 33 is a drawing for explaining the layer structure of a connecting wire according to an embodiment. FIGS. 34a to 34l are graphs showing the result values ​​of common mode noise according to the layer structure of the connecting wire according to the embodiment. FIG. 35 is a graph showing a formula according to the impedance value according to an embodiment. FIGS. 36a to 36i are diagrams showing the relationship between the measured impedance and common mode noise to determine the formula of FIG. 35. FIG. 37 is a mobile terminal (1500) with a camera module applied according to an embodiment. FIG. 38 is a perspective view of a vehicle (700) with a camera module applied according to an embodiment. Specific details for implementing the invention

[0042] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0043] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0044] Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning generally understood by those skilled in the art to which the present invention pertains, unless explicitly and specifically defined otherwise. Terms commonly used, such as those defined in advance, may be interpreted by considering their meaning in the context of the relevant technology. Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0045] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C. Additionally, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention.

[0046] These terms are intended only to distinguish a component from another component and are not limited by the nature, order, or sequence of the component. Furthermore, where it is stated that a component is 'connected,' 'combined,' or 'connected' to another component, this may include not only cases where the component is directly connected, combined, or connected to the other component, but also cases where it is 'connected,' 'combined,' or 'connected' due to another component located between the component and the other component.

[0047] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0051] Figure 1 is a drawing showing a camera module according to a comparative example.

[0052] A camera module equipped with OIS (Optical Image Stabilizer) and AF (Auto Focusing) functions requires at least two spring plates.

[0053] The camera module according to the comparative example may have two spring plates. The camera module according to the comparative example requires at least six spring-like elastic members in the spring plates.

[0055] Referring to FIG. 1, a camera module according to a comparative example includes an optical system comprising a lens assembly, an infrared filter section, and a sensor section. That is, the camera module according to the comparative example includes a lens barrel (10), a lens assembly (20), a first elastic member (31), a second elastic member (32), a first housing (41), a second housing (42), an infrared blocking filter section (50), a sensor section (60), a circuit board (80), and driving sections (71, 72, 73, 74).

[0056] At this time, the lens barrel (10) is connected to the first housing (41). That is, the lens barrel (10) is connected to the first housing (41) through the first elastic member (31). That is, the lens barrel (10) is connected to the first housing (41) so as to be movable by the first elastic member (31). At this time, the first elastic member (31) includes a plurality of springs (not shown). For example, the first elastic member (31) connects the lens barrel (10) and the first housing (41) at a plurality of points on the lens barrel (10).

[0057] The second elastic member (32) is connected to the first housing (41) and the second housing (42) that accommodates the first housing (41). The second elastic member (32) fixes the first housing (41) to the second housing (42) so that it can move. The second elastic member (32) includes a plurality of springs. Specifically, the second elastic member (32) includes plate springs.

[0058] At this time, the first elastic member (31) supports the lens barrel (10) and moves the lens barrel (10) relative to the sensor part (60) in a vertical direction (Z-axis direction). To do this, the first elastic member (31) includes at least four springs.

[0059] Additionally, the second elastic member (32) supports the lens barrel (10) and moves the lens barrel (10) relative to the sensor part (60) in a horizontal direction (X-axis direction and Y-axis direction). To this end, the second elastic member (32) includes at least two springs.

[0060] As described above, in the camera module according to the comparative example, OIS and AF are performed as the lens barrel (10) moves in the X-axis, Y-axis, and Z-axis directions. To this end, the camera module according to the comparative example requires at least six elastic members, such as springs. Additionally, the camera module according to the comparative example requires two spring plates to support the elastic members. Furthermore, the camera module according to the comparative example requires an additional member, such as an elastic wire, to fix the Z-axis of the lens barrel (10). Therefore, the spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis is complex in the camera module according to the comparative example.

[0062] In addition, the camera module according to the comparative example requires manually bonding each elastic member to the lens barrel (10) in order to combine the elastic member with the lens barrel (10). Accordingly, the camera module according to the comparative example has a complex manufacturing process and requires a long manufacturing time.

[0063] In addition, the camera module according to the comparative example has a structure that makes it practically difficult to correct the tilt of the image.

[0065] The 'Optical Axis Direction' used below is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0066] As used below, the 'vertical direction' may be a direction parallel to the optical axis. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0067] As used below, the 'Auto Focus function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through moving the lens along the optical axis according to the distance to the subject, so that a clear image of the subject can be obtained on the image sensor. Meanwhile, 'Auto Focus' corresponds to 'AF (Auto Focus)'.

[0068] As used below, the 'shake correction function' is defined as a function that moves the lens and / or image sensor to counteract vibrations (movements) generated in the image sensor by external forces. Meanwhile, 'shake correction' can correspond to 'OIS (Optical Image Stabilization)'.

[0070] FIG. 2 is a perspective view of a camera device according to the present embodiment, FIG. 3 is a cross-sectional view taken from AA of FIG. 2, and FIG. 4 is an exploded perspective view of a camera device according to the present embodiment.

[0071] The camera device in the embodiment may include a camera module.

[0072] The camera device may include a lens drive device. Here, the lens drive device may be a voice coil motor (VCM). The lens drive device may be a lens drive motor. The lens drive device may be a lens drive actuator. The lens drive device may include an AF module. That is, the lens drive device in the embodiment may be a first actuator for AF.

[0073] Additionally, the camera device may include a sensor driving device. Here, the sensor driving device may be a voice coil motor (VCM). The sensor driving device may be a sensor driving motor. The sensor driving device may be a sensor driving actuator. The sensor driving device may include an OIS module. That is, the sensor driving device in the embodiment may be a second actuator for OIS.

[0075] <Camera device>

[0076] The camera device may include a lens module (100).

[0077] The lens module (100) may include a lens and a lens barrel. The lens module (100) may include one or more lenses and a lens barrel capable of accommodating one or more lenses. However, one configuration of the lens module (100) is not limited to a lens barrel, and any holder structure capable of supporting one or more lenses is possible. The lens module (100) may be coupled to the first actuator (200) and move. As an example, the lens module (100) may be coupled to the inside of the first actuator (200). Accordingly, the lens module (100) may move inside the first actuator (200) in response to the movement of the first actuator (200). The lens module (100) may be screw-coupled to the first actuator (200). The lens module (100) may be joined to the first actuator (200) by an adhesive (not shown) as an example. Meanwhile, light passing through the lens module (100) may be irradiated onto an image sensor. Meanwhile, the lens module (100) may include five lenses as an example, but is not limited thereto.

[0078] The camera device may include an actuator.

[0079] Specifically, the camera device may include a first actuator (200) for shifting a lens module (100). The first actuator (200) may be an AF module. The first actuator (200) can move the lens module (100) in an up-and-down direction (clearly, in the direction of the optical axis). That is, the first actuator (200) can move the lens module (100) in the direction of the optical axis to perform an autofocus function.

[0080] The second actuator (600) can drive the image sensor (430). The second actuator (600) can shift or rotate the image sensor (430). The second actuator (600) can move the image sensor (430). The second actuator (600) can move the image sensor (430) in a first direction perpendicular to the optical axis, move it in a second direction perpendicular to the optical axis and the first direction, and rotate it with respect to the optical axis. At this time, the first direction may be the x-axis direction, the second direction may be the y-axis direction, and the optical axis may be the z-axis direction.

[0082] Meanwhile, the first actuator (200) and the second actuator (600) may each include a driving unit to move the lens module (100) and the image sensor (430), respectively. That is, the first actuator (200) may include a first driving unit (described later). Additionally, the second actuator (600) may include a second driving unit (described later). Each of the first and second driving units may include a coil and a magnet. Furthermore, the coil and the magnet may generate an electromagnetic force between each other to drive the lens module (100) and the image sensor (430), respectively. In one embodiment, the lens module (100) may include a solid lens. And, the first actuator (200) may include a first driving unit including a coil and a magnet for moving the lens module (100) of the solid lens.

[0084] The camera device may include a case (300, 500).

[0085] The case (300, 500) may include a first case (300) and a second case (500). The first case (300) may be an upper case that covers an upper area of ​​a camera device. In this case, the first case (300) may be a shield can.

[0086] The first case (300) may be arranged to surround the side of the first actuator (200), the second actuator (600), and the image sensor module (400) that constitute the camera device. The first case (300) may have a first open area (310) formed on its upper surface. The first open area (310) of the first case (300) may be a hollow hole. A lens module (100) coupled to the first actuator (200) may be placed in the first open area (310) of the first case (300). At this time, the first open area (310) of the first case (300) may have a diameter larger than the diameter of the lens module (100).

[0087] Specifically, the first case (300) may include a top plate and a plurality of side plates that are curved or folded at the edges of the top plate and extend downward. For example, the top plate of the first case (300) may have a square shape and, accordingly, may include four side plates extending downward from four edges of the top plate. For example, the first case (300) may be in the shape of a rectangular prism with a first open area (310) formed on the top surface into which a lens module (100) is inserted, an open bottom surface, and rounded corners.

[0088] Meanwhile, a second open area (320) may be formed on any one of the four side plates of the first case (300). The second open area (320) may be an exposure hole that exposes a part of the first actuator (200) disposed within the first case (300) to the outside. For example, the second open area (320) of the first case (300) may expose a terminal (262) of the flexible circuit board (260) of the first actuator (200). The second open area (320) may be an opening for soldering to be performed for joining the terminal of the flexible circuit board (260) and the first board of the second actuator, which will be described later.

[0089] The second case (500) may be a lower case that covers the lower area of ​​the camera device. The second case (500) may close the open lower area of ​​the first case (300).

[0090] Each of the first actuator (200), the second actuator (600), and the image sensor module (40) constituting the camera device can be placed within the receiving space formed by the first case (300) and the second case (500).

[0091] The image sensor module (400) can be coupled to the second actuator (600). Preferably, the second actuator (600) may be composed of a fixed part (described later) and a moving part (described later). The moving part of the second actuator (600) may be connected to the fixed part via a wire (described later). The moving part of the second actuator (600) may move relative to the fixed part by the electromagnetic force of the second driving part. Here, movement of the fixed part may include movement in the first direction, movement in the second direction, and movement in the optical axis direction of the fixed part.

[0092] Additionally, the image sensor module (400) may be coupled to the moving part of the second actuator (600). The image sensor module (400) may include an image sensor (440). The image sensor (440) may be any one of a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, and a CID.

[0093] In this embodiment, the image sensor (440) can be rotated around the x-axis, y-axis, and z-axis. The image sensor (440) can be moved around the x-axis, y-axis, and z-axis. The image sensor (440) can be tilted around the x-axis, y-axis, and z-axis.

[0094] That is, the image sensor module (400) is coupled to the moving part of the second actuator (600), and when the moving part of the second actuator (600) moves relative to the fixed part of the second actuator (600), the image sensor module (400) can move relative to the fixed part of the second actuator (600) together with the moving part of the second actuator (600). As a result, a hand tremor correction function can be performed.

[0096] As described above, in the embodiment, the first actuator (200) can be used to move the lens module to perform an AF function, and the second actuator (600) can be used to perform a hand shake correction function. Alternatively, the second actuator (600) may perform both the AF function and the hand shake correction function.

[0097] In the present embodiment, the camera device moves the image sensor module (400) relative to the lens module (100) to perform a hand shake correction function and / or an autofocus function.

[0098] In other words, as camera technology has recently advanced, image resolution is increasing, and consequently, the size of the image sensor (440) is also increasing. At this time, as the size of the image sensor (440) increases, the size of the lens module (100) and the actuator components for shifting the lens module (100) are also increasing. As a result, as the weight of the lens module (100) itself, as well as the weight of other actuator components for shifting the lens module (100), increases, it is difficult to stably shift the lens module (100) using existing VCM technology, and many problems are occurring in terms of reliability.

[0099] Accordingly, in this embodiment, AF is performed using a first actuator (200) that implements a lens shift method, and OIS is performed using a second actuator (600) that implements an image sensor shift method, thereby improving the reliability of the camera device.

[0100] Furthermore, there is 5-axis shake in camera devices. For example, 5-axis shake consists of two types of shake that shake by angle, two types of shake that shake by shift, and one type of shake that shakes by rotation. In this case, only 4-axis shake correction is possible with the lens shift method, and it is impossible to correct the shake that shakes by rotation. This is because the shake caused by rotation must be corrected by the rotation of the optical module, but even if the lens module (100) is rotated, the incident light path remains the same, and accordingly, 5-axis shake correction is impossible with the lens shift method. Therefore, in this embodiment, a sensor shift method is applied to enable 5-axis shake correction, thereby resolving the reliability issues regarding the lens shift method due to the advancement of camera technology as described above.

[0101] Accordingly, in the embodiment, a plurality of actuators are provided, and the lens module (100) and image sensor are moved respectively using the plurality of actuators to perform AF and OIS.

[0103] Hereinafter, each component of the camera device according to the embodiment will be described in more detail.

[0104] Actuator 1

[0105] FIG. 5 is an exploded perspective view of the first actuator shown in FIG. 4 in the first embodiment, FIG. 6 (a) is a plan view of the base of FIG. 5, FIG. 6 (b) is a plan view of the first actuator of FIG. 5, and FIG. 6 (c) is a bottom view of the first actuator of FIG. 5. The lens module (100) in the first embodiment may include only a plurality of solid lenses. Accordingly, the first actuator may include a driving unit including a magnet and a coil for moving the lens module (100).

[0106] Specifically, referring to FIGS. 5 and 6, the first actuator (200) may include a base (210), a bobbin (220), a first elastic member (230), a second elastic member (240), and a first driving unit (250).

[0107] In the embodiment, the first actuator (200) allows the bobbin (220) to be elastically supported in the vertical direction on the base (210) through the first elastic member (230) and the second elastic member (240), and the bobbin (220) can move in the vertical direction by electromagnetic interaction with the first driving unit (250) disposed on the bobbin (220). Accordingly, the lens module (100) coupled to the bobbin (220) can move in the direction of the optical axis. And, as the lens module (100) moves in the direction of the optical axis, an autofocus (AF) function can be performed.

[0108] The base (210) may be a fixed member of the first actuator (200). The base (210) may be positioned inside the first case (300) and coupled to the first case (300).

[0109] The base (210) may include a body (211) having a first opening (213) formed in the center. The shape of the body (211) may have a shape corresponding to the first case (300). For example, the shape of the body (211) of the base (210) may have a rectangular shape or a square cross-section shape corresponding to the shape of the first case (300).

[0110] A plurality of first protrusions (212) are formed on the upper surface of the body (211) of the base (210). The plurality of first protrusions (212) may be formed to protrude upward from the upper surface of the body (211). In addition, correspondingly, a plurality of lower protrusions (not shown) may be formed to protrude downward from the lower surface of the body (211). The plurality of first protrusions (212) may be fixing protrusions for fixing a first elastic member (230) placed on the base (210). The plurality of first protrusions (212) may be each placed in four corner areas on the upper surface of the body (211) of the base (210).

[0111] A first opening (213) is formed in the body (211) of the base (210). The first opening (213) may have a shape corresponding to the shape of the bobbin (220). For example, the bobbin (220) may have a square plate shape, and accordingly, the first opening (213) may also have a square shape. However, it is not limited thereto, and the bobbin (220) may have a cylindrical shape, and accordingly, the first opening (213) may also have a circular shape. The size of the first opening (213) may be larger than the size of the bobbin (220). For example, when the bobbin (220) is inserted into the first opening (213), a certain gap may exist between the inner surface of the body (211) of the base (210) and the outer surface of the bobbin (220).

[0112] A step (215) may be formed on the inner surface of the body (211) of the base (210). The step (215) may selectively support the bobbin (220) placed within the first opening (213) and restrict the movement of the bobbin (220). For example, the step (215) may function as a stopper to restrict the downward movement of the bobbin (220). That is, the bobbin (220) in a normal state does not come into contact with the step (215) while placed within the first opening (213), and may come into contact with the step (215) when the bobbin (220) moves to a range that restricts downward movement.

[0113] Meanwhile, a first recess (217) that is recessed outwardly may be formed on the inner surface of the body (211) of the base (210). The first recess (217) may include a first-1 recess (217a) and a first-2 recess (217b) formed on two inner surfaces facing each other among the inner surfaces of the body (211). At least a portion of the bobbin (220) may be disposed in the first-1 recess (217a) and the first-2 recess (217b). For example, a sensor magnet mounting portion (not shown) formed on the bobbin (220) may be disposed in the first-1 recess (217a) and the first-2 recess (217b). The first-1 recess (217a) and the first-2 recess (217b) above may be formed to minimize the gap between the sensor magnet (253, 254) mounted on the sensor magnet mounting portion of the bobbin (220) and the first driver IC (270) mounted on the flexible circuit board (260).

[0114] On the lower surface of the body (211) of the base (210), a first drive magnet mounting groove (216) is formed in an area facing each other with the first opening (213) as the center. That is, a first-1 drive magnet mounting groove (216a) is formed in the first area of ​​the lower surface of the body (211) of the base (210). Then, a first-2 drive magnet mounting groove (216b) is formed in the second area of ​​the lower surface of the body (211) of the base (210) facing the first area. A first-1 drive magnet (252b) may be placed in the first-1 drive magnet mounting groove (216a), and a first-2 drive magnet (252a) may be placed in the first-2 drive magnet mounting groove (216b). At this time, the first actuator (200) in the embodiment is two drive magnets arranged facing each other. The bobbin (220) is moved in the optical axis direction using magnets (252a, 252b). At this time, in order to move the bobbin (220) in the optical axis direction using only the two first driving magnets (252a, 252b), the first driving magnets (252a, 252b) may be arranged to be extended in the longitudinal direction. At this time, the first driving magnets (252a, 252b) may be placed in an area excluding the corner area of ​​the lower surface of the body (211) to minimize the overlap area with the second driving magnet of the second actuator (600) (described later) within the optical axis direction. Additionally, magnetic field interference may occur between the first driving magnets (252a, 252b) and the second driving magnet of the second actuator (600). At this time, the first driving magnet (252a, 252b) is positioned in a fixed state on the body (211) of the base (210). In addition, the second driving magnet of the second actuator (600) is also positioned fixed to a fixed part rather than a moving part. Thus, in this embodiment, the first driving magnet (252a, 252b) and the second driving magnet are each positioned in a fixed location.That is, in the embodiment, a coil is placed in the part that moves according to lens shift and image sensor shift, and accordingly, the driving magnets are kept in a fixed position so as to minimize mutual magnetic field interference.

[0115] Meanwhile, the body (211) of the base (210) includes a substrate groove (214) into which a flexible circuit board (260) is inserted. At this time, the flexible circuit board (260) may be inserted into the substrate groove (214) in a vertically upright position. At this time, the substrate groove (214) may have a bent shape that is bent at least once. That is, the flexible circuit board (260) is inserted into the substrate groove (214). At this time, the flexible circuit board (260) includes a first driver IC (270) disposed on one side. The first driver IC (270) may be a driver with a built-in Hall sensor. Accordingly, the first driver IC (270) detects the position of the lens module (100) by detecting a change in the strength of the electric field that changes according to the position of the sensor magnets (253, 254), and can control the output signal accordingly.

[0116] Preferably, the first driver IC (270) receives gyro data from the gyro sensor (717) and can control an output signal based on the received gyro data and the position data of the detected lens module (100).

[0117] At this time, the first driver IC (270) is positioned facing the sensor magnets (253, 254). At this time, the closer the distance between the sensor magnets (253, 254) and the driver IC, the more the accuracy of the position detection information of the bobbin (220) or lens module (100) obtained through the first driver IC (270) can be improved. Additionally, the flexible circuit board (260) includes a terminal (262) that is electrically connected to the first board (described later) of the second actuator (600). At this time, a process such as soldering must be performed to make an electrical connection between the terminal (262) and the first board. Accordingly, the terminal (262) must be positioned close to the outer surface of the base (210).

[0118] That is, the flexible circuit board (260) includes a first board area (261) where a terminal (262) is placed and a second board area (262) where a first driver IC (270) is placed. In addition, the first board area (261) of the flexible circuit board (260) is located adjacent to the outer surface of the base (210), and the second board area (263) is located adjacent to the inner surface of the base (210). To this end, the area between the first and second board areas may include a folded area.

[0119] A bobbin (220) is placed in the first opening (213) of the base (210).

[0120] A second opening (221) may be formed in the center of the bobbin (220). The second opening (221) may have a shape corresponding to the lens module (100). For example, the second opening (221) may have a circular shape corresponding to the shape of the lens module (100), but is not limited thereto. The bobbin (220) may be coupled with the lens module (100). For example, the lens module (100) may be inserted into the second opening (221) of the bobbin (220) and coupled with the bobbin (220).

[0121] A plurality of second protrusions (223) that contact the first elastic member (230) may be formed on the upper surface of the bobbin (220). The plurality of second protrusions (223) may be stoppers that limit the range of movement of the bobbin (220) in the upward direction while elastically supporting the bobbin (220) on the first elastic member (223). For example, when the bobbin (220) moves out of the range of movement in the upward direction, the second protrusions (223) may contact the inner surface of the upper surface of the first case (300) located on the upper part of the bobbin (220) to limit the movement of the bobbin (220).

[0122] A coil winding section (222) on which a first coil section (251) is wound may be formed on the outer surface of the bobbin (220). For example, a coil winding section (222) in the form of a recess that is recessed inward may be formed on the outer surface of the bobbin (220). And, a first coil section (251) may be wound on the coil winding section (222). The first coil section (251) may be in the form of a "coil block." The first coil section (251) may be an "electromagnet." The first coil section (251) is positioned facing the first driving magnet (252a, 252b), and accordingly, can generate an electromagnetic force by electromagnetically interacting with the first driving magnet (252a, 252b). At this time, the first coil portion (251) can be electrically connected to the second elastic member (240). Accordingly, the first coil portion (251) can generate an electromagnetic force by receiving current from the second elastic member (240). As a result, the bobbin (220) can move in the direction of the optical axis to perform an AF function.

[0123] On the outer surface of the bobbin (220), excluding the outer surface facing the first driving magnet (252a, 252b), a sensor magnet mounting portion (not shown) may be formed that protrudes toward the inner surface of the base (210) and can accommodate a sensor magnet (253, 254). The sensor magnet (253, 254) may be mounted on the sensor magnet mounting portion and positioned within the first-1 recess (217a) and the first-2 recess (217b) of the base (210). The sensor magnet (253, 254) moves together with the bobbin (220) as the bobbin (220) moves. And, depending on the position of the sensor magnet (253, 254), the magnitude of the magnetic field detected by the first driver IC (270) placed on the flexible circuit board (260) changes, and the first driver IC (270) can detect the position of the sensor magnet (253, 254), further the position of the bobbin (220), and further the position of the lens module (100) based on the change in the magnitude of the changing magnetic field.

[0124] The first elastic member (230) is positioned on the upper side of the base (210) and the bobbin (220). The second elastic member (240) is positioned on the lower side of the base (210) and the bobbin (220). Accordingly, the bobbin (220) can be elastically supported in the vertical direction by the first elastic member (230) and the second elastic member (240) within the first opening of the base (210).

[0125] The first elastic member (230) may be a plate spring. The first elastic member (230) may be a metal. Alternatively, the first elastic member (230) may be non-magnetic. Therefore, the first elastic member (230) may not be affected by the magnetic force of the first driving magnet (252a, 252b) and the electromagnetic force of the first coil part (251).

[0126] The first elastic member (230) may be placed on the base (210). Additionally, the first elastic member (230) may be placed on the bobbin (220). The first elastic member (230) may be coupled to the base (210) and the bobbin (220). That is, the first elastic member (230) may include a first-1 elastic part (231) coupled to the base (210) and a first-2 elastic part (233) extending from the first-1 elastic part (231) and coupled to the bobbin (220). The first-1 elastic part (232) may have a coupling groove (232) formed therein that is inserted into a plurality of first protrusions (212) placed on the upper surface of the body (211) of the base (210). Accordingly, the first elastic member (230) can elastically support the upper side of the bobbin (220) while the coupling groove (232) is coupled to the first projection (212). Additionally, the first elastic member (230) may include an opening (234) in the center into which the lens module (100) is inserted.

[0127] The second elastic member (240) may be placed below the base (210). Additionally, the second elastic member (240) may be placed below the bobbin (220). The second elastic member (240) may be coupled to the base (210) and the bobbin (220). That is, the second elastic member (240) may include a second-1 elastic part (241) coupled to the base (210) and a second-2 elastic part (242) coupled to the bobbin (220). Accordingly, the second elastic member (240) may elastically support the lower side of the bobbin (220) while coupled to the base (210). Additionally, the second elastic member (240) may include an opening (243) in the center into which the lens module (100) is inserted.

[0128] The second elastic member (240) can be electrically connected to the first coil portion (251). The second elastic member (240) can be electrically connected to the flexible circuit board (260). The second elastic member (240) can electrically connect the first coil portion (251) and the flexible circuit board (260). Thus, current can be supplied from the flexible circuit board (260) to the first coil portion (251) through the second elastic member (240). In this case, the direction, wavelength, intensity, etc. of the current supplied to the first coil portion (251) can be controlled.

[0129] The first actuator (200) in the first embodiment moves the position of the lens module (100) in the optical axis direction based on the electromagnetic force generated between the first driving magnet (252a, 252b) and the first coil part (251).

[0131] <Second Actuator>

[0132] Below, we will describe the second actuator (600).

[0133] The second actuator (600) is located below the first actuator (200) and operates independently of the first actuator (200) to shift the image sensor module (400).

[0134] To this end, the second actuator (600) may include a fixed part in which the position is fixed, and a moving part in which the position is moved by the electromagnetic force of the driving part while coupled to the fixed part.

[0135] FIG. 7 is an exploded perspective view of a second actuator according to an embodiment, FIG. 8 is a cross-sectional view briefly illustrating the connection relationship between the first substrate and the moving part of FIG. 7, FIG. 9 is an exploded perspective view of the fixed part of FIG. 7, FIG. 10a is a bottom view of the fixed part of FIG. 7 according to a first embodiment, FIG. 10b is a bottom view of the fixed part of FIG. 8 according to a second embodiment, FIG. 11 is a drawing showing the upper surface of the first substrate in more detail, FIG. 12 is an exploded perspective view of the moving part according to an embodiment, FIG. 13(a) is a plan view of the second substrate, FIG. 13(b) is a bottom view of the second substrate, FIG. 14(a) is a plan view of the third substrate, FIG. 14(b) is a bottom view of the third substrate, FIG. 15 is an exploded perspective view of the fourth substrate, FIG. 16 is a plan view of the fourth substrate, FIG. 17 is an enlarged view of a specific area of ​​FIG. 16, and FIG. 18 is a combined view of the third substrate and the fourth substrate.

[0137] Referring to FIGS. 7 to 17, the second actuator (600) may include a fixed substrate part (700), a movable substrate part (900), a connecting wire (800), and a substrate housing (1000).

[0138] The fixed substrate section (700) and the movable substrate section (900) are electrically connected to each other by a connecting wire (800). Here, the length of the connecting wire (800) may be greater than the sum of the thickness of the fixed substrate section (700) and the thickness of the movable substrate section (900). Accordingly, the movable substrate section (900), which is positioned below the fixed substrate section (700), is placed at a position spaced apart from the fixed substrate section (700) by a certain distance. That is, the movable substrate section (900) can move relative to the fixed substrate section (700) by means of the electromagnetic force generated by the magnet section and coil section, which will be described later, while suspended (flying) below the fixed substrate section (700) by the connecting wire (800).

[0140] The connecting wire (800) can connect the fixed substrate part (700) and the movable substrate part (900). The connecting wire (800) may have elasticity. The connecting wire (800) may be an elastic member. The connecting wire (800) may be a wire spring. The connecting wire (800) can connect the circuit pattern part of the fixed substrate part (700) and the circuit pattern part of the movable substrate part (900) while maintaining a certain distance between the fixed substrate part (700) and the movable substrate part (900). The connecting wire (800) may be formed of metal. The connecting wire (800) can elastically support the movement of the movable substrate part (900).

[0141] The connecting wire (800) may include a plurality of wires. Preferably, it may be positioned between the movable substrate part (900) and the fixed substrate part (700). More preferably, the connecting wire (800) may be positioned extending in the optical axis direction around the openings of the movable substrate part (900) and the fixed substrate part (700). The number of connecting wires (800) may correspond to the number of signal channels exchanged between the movable substrate part (900) and the fixed substrate part (700). The connecting wire (800) may include a total of 36 wires, with 9 wires each between adjacent corners among the 4 corners of the fixed substrate part (700) and the movable substrate part (900).

[0142] For example, the connecting wire (800) may include nine first wires (810) disposed in a first area of ​​each of the fixed substrate part (700) and the movable substrate part (900), nine second wires (820) disposed in a second area, nine third wires (830) disposed in a third area, and nine fourth wires (840) disposed in a fourth area.

[0143] As described above, the connecting wire (800) can be evenly distributed and arranged in four regions. That is, the connecting wire (800) can form a mutually symmetrical structure with the opposing region in each of the four regions. At this time, the connecting wire (800) must elastically support the movable substrate (900) with respect to the fixed substrate (700) while transmitting signals. Here, if the connecting wire (800) is arranged asymmetrically, the movable substrate (900) cannot perform normal shift operations, and a difference in the amount of movement occurs between the part where the connecting wire is arranged in large quantities and the other parts, and consequently, a problem with the reliability of the operation may occur. Therefore, in the embodiment, the connecting wire (800) is arranged uniformly in a circular manner in each region to improve the reliability of the image sensor shift operation.

[0145] The substrate housing (1000) is positioned below the fixed substrate part (700) and accommodates the movable substrate part (900) inside.

[0146] The second actuator (600) configured as described above is specifically described as follows.

[0147] The fixed substrate portion (700) may include a first substrate (710), a magnet holder (720), and a magnet portion (730).

[0148] The first substrate (710) may include a first substrate area (711) in which a first opening (712) is formed in the center, and a second substrate area (716) in which a connector extending from the first substrate area (711) and connected to an external device is disposed.

[0149] The first substrate (710) may include a first lead pattern portion (713) disposed in a first substrate area (711). The first substrate (710) may be coupled with a connecting wire (800) at the first lead pattern portion (713). That is, one end of the connecting wire (800) may be coupled to the first lead pattern portion (713) of the first substrate (710). The coupling of the first lead pattern portion (713) and the connecting wire (800) may be achieved through soldering. The first lead pattern portion (713) may be a portion where the solder resist is open for electrical connection with the connecting wire (800).

[0150] Specifically, the first lead pattern portion (713) includes a first hole (713-2) and a first lead pattern portion (713-3) arranged around the first hole (713-2). That is, the first lead pattern portion (713) may be a pad including a first hole (713-2) through which a connecting wire (800) passes. Accordingly, the connecting wire (800) is soldered while passing through the first hole (713-2) and can be electrically connected to the lead pattern portion (713-1) arranged around the first hole (713-2).

[0151] The first lead pattern section (713) is composed of a plurality of parts. That is, the first lead pattern section (713) includes a plurality of first lead patterns. The plurality of first lead patterns are connected to a connecting wire (800). At this time, the number of the first lead patterns may be equal to or less than the number of the connecting wire (800). If the number of the first lead patterns is equal to the number of the connecting wire (800), all of the first lead patterns can be coupled to the connecting wire. If the number of the first lead patterns is less than the number of the connecting wire (800), at least one of the first lead patterns may not be coupled to the connecting wire.

[0152] A connector (not shown) may be disposed in a second substrate area (716) connected to the first substrate area (711). The connector may be a port for electrically connecting to an external device.

[0153] At this time, the first substrate area (711) is positioned inside the camera device, and the second substrate area (716) can be extended from the first substrate area (711) and exposed to the outside of the camera device.

[0154] That is, the first substrate area (711) is placed inside the first case (300), and the second substrate area (716) is placed outside the first case (300) and may include a connector (not shown) connected to an external device.

[0155] The first substrate (710) can transmit signals to the movable substrate unit (900) or receive signals transmitted from the movable substrate unit (900). That is, the first substrate (710) is electrically connected to the movable substrate unit (900) through a connecting wire (800), and accordingly, it can transmit power signals or communication signals to the movable substrate unit (900) through the connecting wire (800) and receive information including image signals obtained from the movable substrate unit (900). The first substrate (710) may also be referred to as a main substrate. Components for controlling the overall operation of the camera device may be placed on the first substrate (710). This will be explained below.

[0156] The first substrate (710) may include a first pad portion (714) disposed in the edge region of the first substrate area (711). The first pad portion (714) may be electrically connected to a flexible circuit board (260) included in the first actuator (200).

[0157] At least one first coupling hole (715) is formed in the corner region of the first substrate region (711) of the first substrate (710). The first coupling hole (715) may be formed to secure the first substrate (710) onto a magnet holder (720).

[0158] Such a first substrate (710) can be positioned in a fixed state within the first case (300) of the camera device. That is, the first substrate (710) can be positioned in a fixed state without moving.

[0159] A magnet holder (720) is disposed below the first substrate (710). The magnet holder (720) may be provided with a substrate mounting portion (721) on its upper surface, on which the first substrate (710) is mounted. Additionally, a first coupling projection (722) that engages with a first coupling hole (715) formed in the first substrate (710) may be formed on the substrate mounting portion (721).

[0160] The first substrate (710) can be seated on the substrate seating portion (721) with the first coupling hole (715) inserted into the first coupling projection (722).

[0161] At this time, the magnet holder (720) may include an open area that overlaps in the optical axis direction with the first opening (712) of the first substrate (710). Additionally, the magnet holder (720) may have an open position that overlaps in the optical axis direction with the first lead pattern portion (713) formed on the first actuator (200).

[0162] The first substrate (710) may include a gyroscope sensor (717) disposed on its lower surface. That is, the gyroscope sensor (717) in the present embodiment may be disposed on the lower surface of the first substrate (710) and accommodated within the first case (300) of the camera device.

[0164] That is, in this embodiment, a gyroscope sensor (717) for implementing a hand shake prevention function is embedded in a mounted state on the lower surface of the first substrate (710), so that angular velocity / linear velocity detection information caused by hand shake can be fed back to the moving substrate (900). Accordingly, in this embodiment, by placing the gyroscope sensor (717) in the space between the first substrate (710) and the moving substrate (900), there is an effect of not having to provide additional space for the placement of the gyroscope sensor (717).

[0165] In the first embodiment, only the gyroscope sensor (717) may be placed on the first substrate (710). Also, the first driver IC (270) that controls the overall operation of the first actuator (200) may be placed on the flexible circuit board (260) included in the first actuator (200) as described above. Additionally, the second driver IC (914) that controls the overall operation of the second actuator (600) may be placed on the second substrate (910) of the moving substrate part (900). Alternatively, the placement positions of the first driver IC (270) and the second driver IC (914) may be changed.

[0166] For example, the first driver IC (270) may be placed together with the gyro sensor (717) on the first substrate (710) rather than on the flexible circuit board (260). Additionally, the second driver IC (914) may be placed together with the gyro sensor (717) on the first substrate (710) rather than on the second substrate (910) of the moving substrate part (900).

[0167] For example, as illustrated in FIG. 10b, in the second embodiment, the first driver IC (270), the second driver IC (914), and the gyroscope sensor (717) may be placed on the first substrate (710). Specifically, the first driver IC (270), the second driver IC (914), and the gyroscope sensor (717) may be placed spaced apart from each other in the respective corner areas of the lower surface of the first substrate (710). However, the embodiment is not limited thereto, and at least one of the first driver IC (270), the second driver IC (914), and the gyroscope sensor (717) may be placed on the upper surface of the first substrate (710). Additionally, the gyroscope sensor (717) may be placed on the first substrate (710), and only one of the first driver IC (270) and the second driver IC (914) may be placed on the first substrate (710).

[0168] In conclusion, each of the first driver IC (270), the second driver IC (914), and the gyro sensor (717) in the embodiment may be placed on any one of the flexible circuit board (260), the first board (710), and the second board (910) of the moving board part (900).

[0170] A magnet mounting groove (not shown) in which a magnet part (730) is disposed may be formed on the lower surface of the magnet holder (720). A magnet part (730) may be disposed in the magnet mounting groove of the magnet holder (720). At this time, the magnet part (730) may be disposed facing the coil part (916) disposed on the movable substrate part (900). At this time, when current is applied to the coil part (916), an electric field may be formed around the coil part (916). When current is applied to the coil part (916), the coil part (916) may move relative to the magnet part (730) through electromagnetic interaction between the coil part (916) and the magnet part (730).

[0171] At this time, the magnet part (730) can be placed at the corners of the lower surface of the magnet holder (720). That is, the magnet part (730) can be placed at each of the four corners of the lower surface of the magnet holder (720). Also, the magnet part (730) can be opposite to the coil. The magnet part (730) may be a flat magnet having a flat shape.

[0172] The magnet portion (730) may include a plurality of magnets. The magnet portion (730) may include four magnets. The magnet portion (730) may include first to fourth magnets (731, 732, 733, 734).

[0173] The first magnet (731) may be positioned opposite the first coil (916-1) placed on the movable substrate (900). The first magnet (731) may be positioned at the first corner located on the upper left side of the magnet holder (720).

[0174] The second magnet (732) may be positioned opposite the second coil (916-2) placed on the movable substrate (900). The second magnet (732) may be positioned at the second corner located on the upper right side of the magnet holder (720).

[0175] The third magnet (733) may be positioned opposite the third coil (916-3) placed on the movable substrate (900). The third magnet (733) may be positioned at the third corner located on the lower right side of the magnet holder (720).

[0176] The fourth magnet (734) may face the fourth coil (916-4) placed on the movable substrate (900). The fourth magnet may be placed at the fourth corner located on the lower left side of the magnet holder (720).

[0177] Each magnet constituting the magnet part (730) can be arranged perpendicularly to an adjacent magnet and parallel to a magnet arranged diagonally.

[0178] Here, the polarity of the surface facing the coil portion (916) of the first magnet (731) may differ between the part closer to one side and the part closer to the other side. Additionally, the polarity of the surface facing the coil portion (916) of the second magnet (732) may differ between the part closer to one side and the part closer to the other side. Furthermore, the polarity of the surface facing the coil portion (916) of the third magnet (733) may differ between the part closer to one side and the part closer to the other side.

[0179] The polarity of the surface facing the coil portion (916) of the fourth magnet (734) may be different between the part closer to one side and the part closer to the other side.

[0180] And, the first magnet (731) and the third magnet (733) may be arranged in the same direction as each other, and the second magnet (732) and the fourth magnet (734) may be arranged in the same direction as each other.

[0181] The first magnet (731) may be positioned perpendicularly to the second magnet (732). The polarity of the first to fourth magnets (731, 732, 733, 734) may be the same in their inner parts. The polarity of the first to fourth magnets (731, 732, 733, 734) may be the same in their outer parts. The polarity of each of the first to fourth magnets (731, 732, 733, 734) may be formed such that the inner part is the N pole. The polarity of each of the first to fourth magnets (731, 732, 733, 734) may be formed such that the outer part is the S pole. However, as a variation example, the polarity of each of the first to fourth magnets (731, 732, 733, 734) may be formed such that the inner part is an S pole and the outer part is an N pole.

[0182] Meanwhile, as shown in FIG. 10a or FIG. 10b, one end of the connecting wire (800) is connected to the first lead pattern portion (713) of the first substrate (710), and can be extended to the lower part of the first substrate (710) by penetrating the first hole (713-2) constituting the first lead pattern portion (713).

[0183] As described above, the fixed substrate part (700) can be configured such that, based on the magnet holder (720), a first substrate (710) is disposed on the upper surface of the magnet holder (720) and a magnet part (730) is disposed on the lower surface thereof. Additionally, a gyroscope sensor for obtaining sensing information necessary to perform hand tremor correction is disposed on the lower surface of the first substrate (710), and the signal obtained through the gyroscope sensor can be transmitted to the movable substrate part (900) via a connecting wire (800).

[0185] A substrate housing (1000) may be disposed below a fixed substrate portion (700). A substrate housing (1000) is coupled below the fixed substrate portion (700). Preferably, the substrate housing (1000) is provided with a mounting portion (not shown) on which a magnet holder (720) constituting the fixed substrate portion (700) is seated, and thus can be coupled with the magnet holder (720). Furthermore, a movable substrate portion (900) is disposed within the substrate housing (1000) coupled with the magnet holder (720).

[0186] The movable substrate part (900) is electrically connected to the fixed substrate part (700) through a connecting wire (800) and can move relative to the fixed substrate part (700) by mutual interaction between the magnet part (730) and the coil part (916).

[0187] To this end, the movable substrate section (900) may include a second substrate (910), a substrate holder (920), a third substrate (930), and a fourth substrate (940). Here, that is, the second substrate (910), the third substrate (930), and the fourth substrate (940) may be the second substrate section constituting the movable substrate (900). And, the first substrate (710) may be the first substrate section constituting the fixed substrate section (700).

[0188] The second substrate (910) may be a main substrate. The second substrate (910) may be a driving substrate for driving the second actuator.

[0189] The second substrate (910) may include a second opening (911). In this case, the second opening (911) may overlap with the first opening (712) formed in the first substrate (710) in the optical axis direction.

[0190] The second substrate (910) may include a coil portion (916) disposed at each of its corner portions. The coil portion (916) may be electrically connected to the second substrate (910). The coil portion (916) may be disposed facing the magnet portion (730) disposed on the first actuator (200). When current is applied to the coil portion (916), an electric field may be formed around it.

[0191] The coil section (916) may include four coils. In this case, current may be applied independently to at least three of the four coils. In the first embodiment, the coil section (916) may be controlled by three channels. Alternatively, in the second embodiment, the coil section (916) may be controlled by four separate channels. The four coils constituting the coil section (916) may be electrically isolated from one another. Either a forward current or a reverse current may be selectively applied to each of the four coils of the coil section (916). In this embodiment, only three of the four coils may be electrically isolated and one coil may be electrically connected to another coil. Alternatively, all four coils may be electrically isolated. When only 3 of the 4 coils are electrically separated, a total of 6 lead wires (3 pairs) come out from the coil section (916), and when all 4 coils are electrically separated, a total of 8 lead wires (4 pairs) can come out from the coil section (916).

[0192] In the case of controlling four coils with three channels as in the first embodiment of this embodiment, the coil part (916) and the magnet part (730) must be driven as one pair in the z-axis center rotation drive, but in the case of controlling four coils with four channels as in the second embodiment, the coil part (916) and the magnet part (730) can be driven as two pairs in the z-axis center rotation drive.

[0193] The coil portion (916) may include first to fourth coils (916-1, 916-2, 916-3, 913-4). And each of the first to fourth coils (916-1, 916-2, 916-3, 913-4) may be positioned opposite to each magnet of the magnet portion (730) disposed on the first substrate (710).

[0194] The first coil (916-1) may be placed at the first corner of the second substrate (910). The second coil (916-2) may be placed at the second corner of the second substrate (910). The third coil (916-3) may be placed at the third corner of the second substrate (910). The fourth coil (916-4) may be placed at the fourth corner of the second substrate (910). The first coil (916-1) and the third coil (916-3) may be placed on the first diagonal direction of the second substrate (910), and the second coil (916-1) and the fourth coil (916-4) may be placed on the second diagonal direction of the second substrate (910).

[0195] In this embodiment, the first coil (916-1) and the third coil (916-3) may be arranged lengthwise in the first direction, and the second coil (916-2) and the fourth coil (916-4) may be arranged lengthwise in the second direction. At this time, the first direction and the second direction may be perpendicular. The long side of the first coil (916-1) and the long side of the third coil (916-3) may be arranged parallel to each other. The long side of the second coil (916-2) and the long side of the fourth coil (916-4) may be arranged parallel to each other. The long side of the first coil (916-1) and the long side of the second coil (916-2) may not be arranged parallel to each other. At this time, the long side of the first coil (916-1) and the long side of the second coil (916-2) may be arranged such that their imaginary extension lines are orthogonal to each other. The arrangement direction of the first coil (916-1) and the arrangement direction of the second coil (916-2) can be orthogonal.

[0196] In this embodiment, current may be applied independently to at least three of the first to fourth coils (916-1, 916-2, 916-3, 916-4). The first to fourth coils (916-1, 916-2, 916-3, 916-4) may be electrically isolated from each other.

[0197] Meanwhile, a Hall sensor (917) may be placed on the inner side of the first to fourth coils (916-1, 916-2, 916-3, 916-4). In this embodiment, the Hall sensor (917) may be placed on the inner side of only three of the first to fourth coils (916-1, 916-2, 916-3, 916-4). This is because, in the first embodiment, the first to fourth coils (916-1, 916-2, 916-3, 916-4) are controlled by three channels, so a Hall sensor does not need to be provided in one of the coils. The Hall sensor (917) can detect the magnetic force of the magnet part (730). The movement of the image sensor module can be detected in real time through the magnetic force of the magnet part (730) detected by the Hall sensor (917). And, through this, OIS feedback control can be enabled.

[0198] The Hall sensor (917) may be composed of multiple units. That is, as described above, the Hall sensor (917) may include three sensors. Through the three sensors, movement in the x-axis direction, movement in the y-axis direction, and rotation around the z-axis center of the image sensor (440) can all be detected. The Hall sensor (917) may include first to third sensors. The first sensor may face the first magnet, the second sensor may face the second magnet, and the third sensor may face the third magnet.

[0199] The Hall sensor (917) may include a first Hall sensor that detects the amount of movement and / or displacement in the x-axis direction of the magnet part (730). The Hall sensor (917) may include a second Hall sensor that detects the amount of movement and / or displacement in the y-axis direction of the magnet part (730). The Hall sensor (917) may include a third Hall sensor that detects the amount of movement and / or displacement in the x-axis direction or the amount of movement and / or displacement in the y-axis direction of the magnet part (730). The movement of the magnet part (730) rotating around the z-axis may be detected through any two or more of the first Hall sensor, the second Hall sensor, and the third Hall sensor.

[0200] A driver IC (914) for controlling the operation of the second actuator may be disposed on the second substrate (910). Additionally, various passive components (915) for operating the second actuator may be disposed on the second substrate (910).

[0201] At this time, the second substrate (910) must connect the coil portion (916), the second driver IC (914), and the passive component (915) to each other and then connect them to the first substrate (710). Here, there may be 12 terminals required for electrical connection from the second substrate (910) to the first substrate (710). The 12 terminals may be terminals connected to the second driver IC (914).

[0203] Accordingly, a plurality of second pad portions (918) connected to the second driver IC (914) are arranged on the lower surface of the second substrate (910). The number of the plurality of second pad portions (918) may be 12 to control the components arranged on the second substrate (910) from the second driver IC (914) and to transmit and receive necessary signals.

[0204] Meanwhile, a second hole (912) may be formed in the edge region of the second substrate (910). At this time, the second hole (912) may be aligned with the first hole (713-2) formed in the first substrate (710) in the direction of the optical axis. The second hole (912) may be a wire penetration hole through which a connecting wire (800) coupled to the first substrate (710) passes.

[0205] In addition, a third coupling hole (913) is formed at the edge of the second substrate (910).

[0206] The second substrate (910) is placed on the substrate holder (920).

[0207] At this time, the substrate holder (920) includes a guide projection (921) extending upward in an edge area. The guide projection (921) may be formed on the upper surface of the substrate holder (920). The guide projection (921) may guide the assembly position of the second substrate (910). The guide projection (921) may contact the side of the second substrate (910) while the second substrate (910) is seated on the substrate holder (920). At this time, the guide projection (921) may be composed of multiple parts, and accordingly, the guide projection (921) may contact all four sides of the second substrate (910).

[0208] A third coupling projection (923) may be formed at the corner of the substrate holder (920). The third coupling projection (923) may be inserted into the third coupling hole (913) formed in the second substrate (910) when the second substrate (910) is seated on the substrate holder (920). At this time, the third coupling projection (923) may be formed in a shape corresponding to the third coupling hole (913). The third coupling projection (923) may be formed at each of the four corners of the substrate holder (920).

[0209] A third hole (922) may be formed in the edge region of the substrate holder (920). At this time, the third hole (922) may be aligned in the optical axis direction with the second hole (912) formed in the second substrate (910) and the first hole (713-2) formed in the first substrate (710). The third hole (922) may be a wire penetration hole through which a connecting wire (800) coupled to the first substrate (710) passes. Meanwhile, an opening may be provided in the center of the substrate holder (920).

[0210] And, a third substrate (930) may be placed within the opening of the substrate holder (920).

[0211] The third substrate (930) can relay the connection between the image sensor module (400), the second substrate (910), and the fourth substrate (940).

[0212] At this time, the third substrate (930) may be included in the image sensor module (400). For example, the image sensor module (400) may include a sensor substrate portion on which an image sensor is placed, and this may include the second substrate (910), the third substrate (930), and the sensor substrate (420).

[0213] The third substrate (930) includes an opening (931) in the center. The opening (931) can be aligned in the optical axis direction with the opening of the first actuator (200) positioned above and the opening of the second substrate (910).

[0214] The third substrate (930) may include a third pad portion (932). The third pad portion (932) may be positioned opposite to the second pad portion (918) included in the second substrate (910). That is, the third pad portion (932) may be aligned with the second pad portion (918) in the optical axis direction. Furthermore, the third pad portion (932) may be composed of 12 pads corresponding to the number of the second pad portion (918). The second pad portion (918) and the third pad portion (932) may be electrically connected to each other through soldering.

[0215] At this time, the substrate holder (920) can facilitate the connection between the second substrate (910) and the third substrate (930). That is, in the embodiment, when the substrate holder (920) is placed between the second substrate (910) and the third substrate (930), the connection between the second substrate (910) and the third substrate (930) can be facilitated while matching the pitch of the second pad portion (918) and the third pad portion (932). However, the substrate holder (920) is not an essential component and may be omitted depending on the case.

[0216] Meanwhile, the third substrate (930) includes a fourth pad portion (934) formed on the inside of the lower surface and a fifth pad portion (935) formed on the edge of the lower surface.

[0217] The above-mentioned fourth pad portion (934) can be connected to the pad portion of an image sensor module (400) disposed in the opening (931) of the substrate holder (920).

[0218] At this time, the fourth pad portion (934) includes a fourth-1 pad portion (934-1) formed in a first area on the lower surface of the third substrate (930), and a fourth-2 pad portion (934-2) formed in a second area facing the first area with the opening (931) in between.

[0219] At this time, the 4-1 pad section (934-1) is a pad for receiving an image signal obtained through the image sensor (440) among the signals exchanged with the image sensor module (400). And, the 4-2 pad section (934-2) is a pad for exchanging signals other than the image signal with the image sensor module (400).

[0220] That is, in this embodiment, the pads connected to the image sensor module (400) are separated into a pad for receiving an image signal and other pads, and are placed in different areas. This is because if the pad for receiving the image signal and the pad for receiving other signals are placed in the same area, the image signal may contain noise signals, and consequently, there is a problem of reduced image quality. Therefore, in this embodiment, by separating and placing the pad for receiving the image signal and other pads in different areas as described above, the quality of the image signal can be improved.

[0221] At this time, the third pad portion (932) and the second pad portion (918) are also placed in an area overlapping with the fourth-second pad portion (935-2) in the optical axis direction, rather than an area overlapping with the fourth-first pad portion (935-1) in the optical axis direction. Accordingly, the inclusion of noise in the image signal by the signal transmitted to the third pad portion (932) and the second pad portion (918) can be minimized.

[0222] Additionally, the second substrate (910) includes a second driver IC (914) and a passive component (915). The second driver IC (914) and the passive component (915) are placed in an area overlapping the optical axis direction with the 4-2 pad section (934-2), rather than an area overlapping the optical axis direction with the 4-1 pad section (934-1). This is to prevent noise from being included in the image signal by ensuring that there are no signal lines or components overlapping with the 4-1 pad section (934-1) within the optical axis direction.

[0223] Meanwhile, the third substrate (930) includes a fifth pad portion (935) disposed in an edge area. The fifth pad portion (935) is a pad connected to the fourth substrate (940). At this time, the fifth pad portion (935) can be connected to each of the plurality of connecting wires (800) in a 1:1 ratio through the fourth substrate (940). Accordingly, the fifth pad portion (935) may include a 5-1 pad portion (935-1) disposed in a first edge area on the lower surface of the third substrate (930), a 5-2 pad portion (935-2) disposed in a second edge area, a 5-3 pad portion (935-3) disposed in a third edge area, and a 5-4 pad portion (935-4) disposed in a fourth edge area. At this time, the 4-1 pad section (935-1) is preferentially connected to the adjacent 5-1 pad section (935-1) to minimize the signal line distance, so that it can be transmitted directly to the 1st substrate (710) through the 4th substrate (940) and the connecting wire (800). That is, in this embodiment, the signal line through which the image signal is transmitted is shortened, and other pads or components are not placed on the signal path through which the image signal is transmitted, thereby maintaining the quality of the image signal at its highest level.

[0224] The fourth substrate (940) enables shifting of the image sensor module (400) and also enables signal transmission.

[0225] The fourth substrate (940) may include an insulating layer (941) and a pattern portion (942) disposed on the insulating layer (941).

[0226] The insulating layer (941) may include an opening (941-2). The opening (941-2) may be aligned in the optical axis direction with the opening of the first substrate (710), the opening of the second substrate (910), the opening of the third substrate (930), and the opening of the substrate holder (920).

[0227] A pattern portion (942) is disposed on the insulating layer (941). At this time, the pattern portion (942) includes a second lead pattern portion (942-1) in which one end is connected to the fifth pad portion (935) of the third substrate (930) and the other end is connected to the connecting wire (800). Additionally, the pattern portion (942) includes a reinforcement pattern (942-2) disposed on the corner area of ​​the insulating layer (941). The second lead pattern portion (942-1) is a signal transmission and reception pattern that is electrically connected to the fifth pad portion (935) of the third substrate (930) and the connecting wire (800). Furthermore, the reinforcement pattern (942-2) is a pattern for reinforcing the rigidity of the fourth substrate (940) by disposing of the insulating layer (941) on the corner area. Accordingly, the reinforcing pattern (942-2) is not electrically connected to other components and is placed only in a corner area on the upper surface of the insulating layer (941) where the second lead pattern portion (942-1) is not placed, thereby improving the rigidity of the fourth substrate (940). At this time, the reinforcing pattern (942-2) may be formed from the same metallic material as the second lead pattern portion (942-1) and may be formed simultaneously in the same process as the second lead pattern portion (942-1).

[0228] The second lead pattern section (942-1) may be composed of multiple parts. For example, the second substrate (910) may include 36 terminal sections, just like the connecting wire (800).

[0229] At this time, the second substrate (910) may include a second-1 lead pattern portion (942-1a) disposed in a first region of the insulating layer (941), a second-3 lead pattern portion (942-1c) disposed in a second region facing the first region of the insulating layer (941), a second-2 lead pattern portion (942-1b) disposed in a third region between the first and second regions of the insulating layer (941), and a second-4 lead pattern portion (942-1d) disposed in a fourth region facing the third region of the insulating layer (941). That is, the second lead pattern portion (942-1) may include a plurality of second lead patterns disposed in different regions. At this time, the number of the second lead patterns may be equal to the number of the connecting wires. Also, the number of the second lead patterns may be less than the number of the connecting wires. At this time, if the number of second lead patterns is less than the number of connecting wires, at least one of the second lead patterns may not be coupled with the connecting wire.

[0230] Additionally, the reinforcement pattern (942-2) includes a first reinforcement pattern (942-2a) disposed in a first corner area between a first area and a third area of ​​the insulating layer (941), a second reinforcement pattern (942-2b) disposed in a second corner area between a third area and a second area of ​​the insulating layer (941), a third reinforcement pattern (942-2c) disposed in a third corner area between a second area and a fourth area of ​​the insulating layer (941), and a fourth reinforcement pattern (942-2d) disposed in a fourth corner area between a first area and a fourth area of ​​the insulating layer (941).

[0231] At this time, the insulating layer (941) includes a first insulating region (941-1) having an opening (941-2) in the center and contacting the second lead pattern portion (942-1) and the reinforcing pattern (942-2), and a second insulating region (941-3) protruding outwardly from the outer surface of the first insulating region (941-1). The second insulating region (941-3) may be formed to increase the contact area with the reinforcing pattern (942-2) and further improve the rigidity of the fourth substrate (940).

[0232] Meanwhile, the above reinforcement pattern (942-2) may further include a coupling hole (943-3) into which a coupling projection (not shown) disposed on the lower surface of the substrate holder (920) is inserted.

[0233] Meanwhile, the second lead pattern portion (942-1) includes a first portion (942-11) disposed on the insulating layer (941), a third portion (942-13) coupled to a connecting wire (800), a second portion (942-12) connecting the first portion (942-11) and the third portion (942-13), and a fourth portion (942-14) extending from the first portion (942-11) toward the inner direction of the insulating layer (941) and coupled to a fifth pad portion (935) of the third substrate (930).

[0234] Here, the first part (942-11) may also be referred to as the body part of the second lead pattern part (942-1). That is, the first part (942-11) may be the body part of the second lead pattern part (942-1) that is disposed on the insulating layer and supports another part thereof. Also, the third part (942-13) may also be referred to as a coupling part that is coupled with the connecting wire (800). Additionally, the second part (942-12) may be a connecting part that connects the first part (942-11) and the third part (942-13). Furthermore, the fourth part (942-14) may be referred to as a coupling part that is coupled with the fifth pad part (935), or alternatively, as a pad part.

[0235] Additionally, a hole through which a connecting wire (800) passes may be formed in the third part (942-13). The third part (942-13) may be joined to the connecting wire (800) by soldering. The second part (942-12) may include a bent portion. The second part (942-12) may be bent multiple times in one direction. The second part (942-12) may have elasticity. Accordingly, the second lead pattern portion (942-1) may have elasticity.

[0236] At this time, if the second part (942-12) does not include a bent portion, the connecting wire (800) may move together with the image sensor module (400) when it moves and bending may occur, and depending on the degree of bending, it may break. Alternatively, in the embodiment, since the second part (942-12) includes a bent portion, it can act as a suspension when the image sensor module (400) moves, and accordingly, elasticity can be imparted to the connecting wire (800) to increase the rigidity of the connecting wire (800).

[0237] The fourth part (942-14) can be electrically connected to the fifth pad part (935) of the third substrate (930). At this time, the insulating layer (941) is disposed only on the lower part of the first part (942-11) of the second lead pattern part (942-1), and the insulating layer (941) is not disposed on the other parts.

[0238] The third part (942-13) may be a bonding pad electrically connected to the connecting wire (800). That is, the third part (942-13) may be a soldering pad that is soldered to the connecting wire (800). To this end, the third part (942-13) may include a fourth hole through which the connecting wire (800) passes. The fourth hole may be aligned in the optical axis direction with the third hole (922) of the substrate holder (920), the second hole (912) of the second substrate (910), and the first hole (713-2) of the first substrate (710).

[0239] The second part (942-12) can connect the first part (942-11) and the third part (942-13). To this end, the second part (942-12) may include a plurality of folded sections. In this case, each of the second lead pattern sections (942-1a, 942-1b, 942-1c, 942-1d) may be folded in the same direction. For example, each of the second lead pattern sections (942-1a, 942-1b, 942-1c, 942-1d) may include a folded section that rotates clockwise. That is, the second part (942-12) may be folded in a direction corresponding to the rotation direction in the z-axis direction of the image sensor module. Accordingly, the second part (942-12) can minimize damage to the second lead pattern part (942-1) when rotated in the z-axis direction, thereby preventing cracks from occurring in the second lead pattern part (942-1) or the second lead pattern part (942-1) from detaching from the insulating layer (941). Meanwhile, in the embodiment, an adhesive member (not shown) may be placed between the insulating layer (941) and the second lead pattern part (942-1). The adhesive member may be interposed between the insulating layer (941) and the second lead pattern part (942-1) to prevent the second lead pattern part (942-1) from detaching from the insulating layer (941). The adhesive member may include a curing adhesive, etc. In addition, the adhesive member may be electroplated to increase adhesion with the second lead pattern portion (942-1), and thus roughness may be imparted to the surface.

[0240] Meanwhile, the second lead pattern portion (942-1) is a wiring that transmits an electrical signal and can be formed from a metal material with high electrical conductivity. To this end, the second lead pattern portion (942-1) can be formed from at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Additionally, the second lead pattern portion (942-1) can be formed from a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which has excellent bonding strength.

[0241] Preferably, the second lead pattern portion (942-1) may be formed of a metallic material having elasticity capable of moving the image sensor module (400) in the X-axis, Y-axis, and Z-axis directions while serving as wiring that transmits electrical signals. To this end, the second lead pattern portion (942-1) may be formed of a metallic material having a tensile strength of 1000 MPa or more. For example, the second lead pattern portion (942-1) may be a binary alloy or a ternary alloy containing copper. For example, the second lead pattern portion (942-1) may be a binary alloy of copper (Cu) and nickel (Ni). For example, the second lead pattern portion (942-1) may be a binary alloy of copper (Cu) and tin (Sn). For example, the second lead pattern portion (942-1) may be a binary alloy of copper (Cu) and beryllium (Be). For example, the second lead pattern portion (942-1) may be a binary alloy of copper (Cu) and cobalt (Co). For example, the second lead pattern portion (942-1) may be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn). For example, the second lead pattern portion (942-1) may be a ternary alloy of copper (Cu), beryllium (Be), and cobalt (Co). In addition to the above metal materials, the second lead pattern portion (942-1) may be formed from an alloy of iron (Fe), nickel (Ni), zinc, etc., which has good electrical properties and elasticity capable of acting as a spring. Additionally, the second lead pattern portion (942-1) may be surface-treated with a plating layer containing metal materials such as gold (Au), silver (Ag), and palladium (Pd), thereby improving electrical conductivity.

[0242] Meanwhile, the second lead pattern section (942-1) can be manufactured using the additive process, subtractive process, MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process) processes, which are conventional manufacturing processes for printed circuit boards.

[0243] Meanwhile, the second part (942-12) may include a buffer pattern section for buffering purposes in the area (A) connected to the first part (942-11). The buffer pattern section may have a shape in which the width gradually decreases as it moves from the first part (942-11) toward the second part (942-12). In this case, the decrease in width has a non-linear characteristic rather than a linear one, and accordingly, the outer surface of the buffer pattern section may have a rounded shape.

[0244] The above buffer pattern section can solve problems such as pattern breakage caused by the difference in pattern width between the first part (942-11) and the second part (942-12), and can stably connect the first part (942-11) and the third part (942-13).

[0245] In addition, the buffer pattern portion may not overlap within the vertical direction with the insulating layer. This prevents pattern breakage caused by the difference in width between the connecting portion and the pattern portion when the substrate is tilted as well as moved along the X, Y, and Z axes, as the point where the connecting portion and the pattern portion are connected does not exist on the insulating layer but is formed outside the insulating layer.

[0246] Additionally, the fourth part (942-14) also has a smaller line width than the first part (942-11), and accordingly, a buffer pattern portion having a rounded outer surface can be placed in the area (B) between the fourth part (942-14) and the first part (942-11).

[0247] Meanwhile, the second part (942-12) may be bent at least once as set above. Accordingly, the second part (942-12) includes a second-1 part (942-12a) that extends in one direction, and a second-2 part (942-12b) that is bent in a direction different from the one direction from the second-1 part (942-12a).

[0248] At this time, the side of the second-2 part (942-12b) may have a rounded shape rather than a straight line. That is, if the side of the second-2 part (942-12b) has a straight shape, stress may be concentrated in this part, and consequently, breakage of the second lead pattern part (942-1) may occur. Therefore, the side of the second-2 part (942-12b) is made to have a rounded shape so as to prevent stress concentration in the second-2 part (942-12b). At this time, the curvature (R) value of the side of the second-2 part (942-12b) is made to have a value between 30 and 100. If the curvature (R) value of the side is less than 30, the stress concentration prevention effect is insufficient, and if it is greater than 100, the elasticity of the second lead pattern part (942-1) may be reduced. At this time, the second-2 portion (942-12b) may include an inner surface and an outer surface depending on the bending direction. Furthermore, the curvature (R) value of the inner surface of the second-2 portion (942-12b) is made different from the curvature (R) of the outer surface of the second-2 portion (942-12b) to maximize the stress relief function.

[0249] Additionally, the second-2 portion (942-12b) may differ from the line width of the second-1 portion (942-12a). For example, the second-2 portion (942-12b) may have a line width greater than that of the second-1 portion (942-12a). This allows stress to be concentrated in the second-2 portion (942-12b), thereby enabling the second-2 portion (942-12b) to be formed with a line width greater than that of the second-1 portion (942-12a).

[0250] Meanwhile, the fifth pad portion (935) of the third substrate (930) is located on the fourth portion (942-14). Additionally, the fourth portion (942-14) and the fifth pad portion (935) of the third substrate (930) can be joined together through soldering.

[0251] Meanwhile, although the second part (942-12) of the second lead pattern part (942-1) has been described above as having a square shape with rounded corners, it is not limited thereto. For example, the second part (942-12) of the second lead pattern part (942-1) may have a circular or polygonal shape and be bent.

[0253] Image Sensor Module

[0254] FIG. 19 is an exploded perspective view of an image sensor module (400) according to an embodiment, and FIG. 20 is a combined view of a third substrate and an image sensor module (400).

[0255] Referring to FIGS. 19 and 20, the image sensor module (400) may include a sensor holder (460), a filter (450), an adhesive member (440), a sensor base (410), an image sensor (430), and an image sensor substrate (420).

[0256] The image sensor module (400) can be coupled to the second substrate (910) and the substrate holder (920) through the sensor holder (460). For example, the image sensor module (400) can be fixed to the substrate holder (920) through the sensor holder (460). Although the image sensor module (400) is said to include the sensor holder (460), the filter (450), the adhesive member (440), the sensor base (410), the image sensor (430), and the image sensor substrate (420), at least one of these components may be omitted.

[0257] The image sensor module (400) may include a sensor holder (460). The sensor holder (460) enables the image sensor module (400) to be stably fixed to the substrate holder (920). At this time, the sensor holder (460) includes an opening (461), and the opening (461) may be aligned with the filter (450) and the image sensor (430) in the optical axis direction.

[0258] The image sensor module (400) includes a sensor base (410).

[0259] The sensor base (410) includes an opening (411), and a step may be provided adjacent to the opening (411) so that a filter (450) can be seated thereon. An adhesive member (440) is placed on the step, and a filter (450) may be fixedly placed on the adhesive member (440). This filter (450) may serve to block light of a specific frequency band from passing through the lens module (100) from entering the image sensor (430). The filter (450) may be positioned parallel to the xy plane. The filter (450) may be placed between the lens module (100) and the image sensor (430). The filter (450) may include an infrared filter. The infrared filter may absorb or reflect infrared light incident on the infrared filter.

[0260] The image sensor substrate (420) may be a package substrate. That is, an image sensor (430) may be mounted in a package form on the image sensor substrate (420). The image sensor substrate (420) may include a printed circuit board (PCB). The image sensor substrate (420) may include a circuit board. An image sensor (430) may be placed on the image sensor substrate (420). The image sensor substrate (420) may be combined with a third substrate (930). To this end, a sixth pad portion (421) electrically connected to the fifth pad portion (935) of the third substrate (930) may be provided on the lower surface of the image sensor substrate (420). At this time, as described above, the sixth pad portion (421) is also placed in opposite edge regions on the lower surface of the image sensor substrate (420), thereby separating the location of the pad to which the image signal is transmitted from the location of other pads. Meanwhile, the image sensor substrate (420) may be located within the opening of the third substrate (930), and within the opening of the third substrate (930), the sixth pad portion (421) may be arranged in a horizontally aligned direction with the fifth pad portion (935) of the third substrate (930). Additionally, the fifth pad portion (935) and the sixth pad portion (421) may be joined together through soldering or the like.

[0261] The image sensor (430) may be configured such that an image is formed when light passing through the lens module (100) and the filter (450) is incident. The image sensor (430) may be mounted on the image sensor substrate (420). The image sensor (430) may be electrically connected to the image sensor substrate (420). For example, the image sensor (430) may be coupled to the image sensor substrate (420) by Surface Mounting Technology (SMT). As another example, the image sensor (430) may be coupled to the image sensor substrate (420) by flip chip technology. The image sensor (430) may be positioned so that its optical axis coincides with that of the lens module (100). That is, the optical axis of the image sensor (430) and the optical axis of the lens module (100) may be aligned. The image sensor (430) can convert light irradiated onto an effective image area of ​​the image sensor (430) into an electrical signal. The converted electrical signal may be an image signal. The image sensor (430) may be any one of a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, and a CID.

[0263] <Image Sensor Module Shift Drive Operation>

[0264] Below, the shift operation of the image sensor module (400) will be described.

[0265] FIG. 21 is a diagram illustrating x-axis direction shift driving through a part configuration of a camera device according to the present embodiment, FIG. 22 is a diagram illustrating y-axis direction shift driving through a part configuration of a camera device according to the present embodiment, FIG. 23 is a diagram illustrating z-axis center rotation driving through a part configuration of a camera device according to the present embodiment, FIG. 24 (a) is a diagram illustrating a magnet placed on a first substrate and a magnet holder together with the x-axis and y-axis, FIG. 24 (b) is a diagram illustrating the first substrate, magnet holder, magnet, and coil together with z-axis direction rotation driving, and FIG. 25 is a diagram illustrating the magnetic flow and Lorentz force between the magnet and the coil of a camera device according to the present embodiment.

[0266] As illustrated in FIG. 21, in this embodiment, when current in the same direction is applied to the first coil (916-1) and the third coil (916-3), the image sensor (430) coupled to the image sensor module (400) can be moved (shifted) in the x-axis direction through electromagnetic interaction with the first magnet (731) and the third magnet (733), respectively. That is, the first coil (916-1) and the first magnet (731), and the third coil (916-3) and the third magnet (733) can be used to drive the x-axis shift of the image sensor (430). At this time, the first coil (916-1) and the first magnet (731) may be the first x-axis shift drive unit (X1), and the third coil (916-3) and the third magnet (733) may be the second x-axis shift drive unit (X2).

[0267] As illustrated in FIG. 22, in this embodiment, when current in the same direction is applied to the second coil (916-2) and the fourth coil (916-4), the image sensor (430) coupled to the image sensor module (400) can be moved (shifted) in the y-axis direction through electromagnetic interaction with the second magnet (732) and the fourth magnet (734), respectively. That is, the second coil (916-2) and the second magnet (732), and the fourth coil (916-4) and the fourth magnet (734) can be used to drive the y-axis shift of the image sensor (430). At this time, the second coil (916-2) and the second magnet (732) may be the first y-axis shift drive unit (Y1), and the fourth coil (916-4) and the fourth magnet (734) may be the second y-axis shift drive unit (Y2).

[0268] As illustrated in FIG. 23, in this embodiment, currents in opposite directions are applied to the first coil (916-1) and the third coil (916-3), and currents in opposite directions are applied to the second coil (916-2) and the fourth coil (916-4). If the direction of rotation of the coil portion (916) is the same as the current applied to the first coil (916-1) and the current applied to the second coil (916-2), then the image sensor (430) coupled to the image sensor module (400) can be rotated (rolled) around the z-axis. The embodiment illustrated in FIG. 23 illustrates a case where the coil section (916) is controlled by 4 channels, and if the coil section (916) is controlled by 3 channels, the image sensor (430) can be rolled through the first coil (916-1) and the third coil (916-3) or the second coil (916-2) and the fourth coil (916-4). This is because if there is a coil connected to one channel among the first coil (916-1) and the third coil (916-3) and the second coil (916-2) and the fourth coil (916-4), current cannot be applied in the opposite direction.

[0269] As illustrated in FIG. 24(b), in this embodiment, a forward current is applied to the first coil (916-1), thereby pushing the first coil (916-1) in a first direction (see FIG. 24(a)) relative to the first magnet (731); a forward current is applied to the second coil (916-2), thereby pushing the second coil (916-2) in a second direction (see FIG. 24(b)) relative to the second magnet (732); a reverse current is applied to the third coil (916-3), thereby pushing the third coil (916-3) in a third direction (see FIG. 24(c)) relative to the third magnet (733); and a reverse current is applied to the fourth coil (916-4), thereby pushing the fourth coil (916-4) in a fourth direction (see FIG. 23(d) relative to the fourth magnet (734). By pushing, the image sensor (430) coupled to the image sensor module (400) can be rotated around the z-axis (see e in FIG. 23). At this time, the first to fourth directions may correspond to the clockwise direction.

[0270] In this embodiment, the magnetic flow of the magnet part (730) is as shown in FIG. 25. Referring to FIG. 25, it can be seen that there is a magnetic force line passing perpendicularly to the coil part (916), and in this state, when current is applied to the coil part (916), the coil part (916) can move relative to the magnet part (730) according to the Lorentz force.

[0272] Meanwhile, the second actuator (600) in the embodiment was described as performing OIS or AF by shifting the image sensor using a coil movement method. However, the embodiment is not limited thereto, and the image sensor can be shifted using a magnet movement method. For example, a coil portion constituting the second actuator (600) may be placed on the first substrate (710) in the embodiment. Additionally, a magnet may be placed on a separate substrate separated from the first substrate (710) by a connecting wire (800). Accordingly, in another embodiment, a magnet is placed on the moving substrate portion (900) and a coil is placed on the fixed substrate portion (700), so that the image sensor can be shifted as the magnet moves around the coil.

[0274] <Optimal Design of Lead Pattern Section and Connecting Wire>

[0275] In the embodiment, the sensor driving device can be designed under optimal conditions by modifying the structure of the lead pattern section and the structure of the connecting wire. Here, the design may include the design of the structure of the second lead pattern section (942-1) constituting the fourth substrate (940) and the structure of the connecting wire (800) connecting the fixed substrate section (700) and the movable substrate section (900). At this time, the structure of the second lead pattern section (942-1) and the structure of the connecting wire (800) can be designed with optimal values ​​by taking into account the impedance value, the height and width values ​​of the eye-diagram, and the common mode noise value overall.

[0276] Before proceeding with the explanation of the present invention, we will describe the characteristics related to impedance matching of the camera device of the comparative example.

[0277] The camera module in the comparative example had a module tilt structure, and accordingly, impedance matching was performed in the module tilt structure. Here, impedance matching may refer to impedance matching between the input terminal of the image signal and the output terminal of the image signal.

[0278] That is, in the comparative example, an image sensor is mounted on a single substrate, and an input terminal that receives an image signal acquired from the mounted image sensor and an output terminal that outputs the image signal to an optical device are connected by wiring lines of a circuit pattern formed on the single substrate. Accordingly, in the comparative example of the module tilt method described above, impedance matching is performed on the single wiring line, and thus, impedance matching at the level required by the camera device was easily achieved. For example, the impedance matching value required by the camera device is approximately 100Ω, and in the comparative example, the impedance matching value was achieved to 100Ω by changing the line width, thickness, and design of the circuit pattern formed on the single substrate. Furthermore, in the comparative example, there was no significant difficulty in matching the impedance matching value to 100Ω.

[0279] However, in the case of a sensor shift method structure as in the embodiment, the input terminal of the image signal and the output terminal of the image signal are interconnected by a plurality of components (e.g., a plurality of components that transmit signals).

[0280] For example, the camera module in the embodiment may largely include a sensor substrate, a fourth substrate (940), a connecting wire (800), and a first substrate (710) based on the line through which the image signal is transmitted.

[0281] The first substrate (710) above can be described as a main substrate part including a connector connected to an external device.

[0282] The sensor substrate portion above refers to a substrate portion on which an image sensor (430) is mounted, and a second substrate (910), a third substrate (930), and a sensor substrate (420) are disposed thereon. Additionally, the fourth substrate (940) of the embodiment is connected to the sensor substrate portion, enabling shifting of the sensor substrate portion and enabling signal transmission.

[0283] Additionally, the connecting wire (800) connects the first substrate (710) and the fourth substrate (940). For example, the connecting wire (800) allows the signal line between the first substrate (710) and the fourth substrate (940) to be electrically connected while elastically supporting the fourth substrate (940) with respect to the first substrate (710).

[0284] Accordingly, in the embodiment, the signal obtained from the image sensor (430) is transmitted to the first substrate (710) via the second lead pattern portion (942-1) of the fourth substrate (940) and the connecting wire (800).

[0285] That is, in the comparative example, the sensor substrate portion is directly disposed on the first substrate (710), whereas in the embodiment, a connecting wire (800) and a fourth substrate (940) are additionally disposed between the first substrate (710) and the sensor substrate portion.

[0286] Accordingly, unlike in the comparative example, there is difficulty in impedance matching because the connecting wire (800) and the second lead pattern portion (942-1) of the fourth substrate (940) are additionally arranged between the input and output terminals of the image signal in the embodiment. For example, compared to the comparative example, the line through which the image signal is transmitted in the embodiment additionally includes the second lead pattern portion (942-1) of the fourth substrate (940) and the connecting wire (800).

[0287] Accordingly, the image signal in the embodiment is transmitted to the first substrate (710) via the second lead pattern section (942-1) and the connecting wire (800), and impedance matching must be performed by designing the optimal structure of the second lead pattern section (942-1) and the connecting wire (800) accordingly. Furthermore, in determining the design conditions of the second lead pattern section (942-1) and the connecting wire (800) in the embodiment, the optimal structure of the second lead pattern section (942-1) and the connecting wire (800) is designed by considering not only the conditions for impedance matching but also conditions for the eye-diagram and conditions for common mode noise.

[0289] FIG. 26 is a drawing for explaining the first variable condition for optimal design according to an embodiment, and FIG. 27 is a drawing for explaining the second variable condition for optimal design according to an embodiment.

[0290] Hereinafter, with reference to FIGS. 26 and FIGS. 27, the optimal design variable conditions of the second lead pattern part (942-1) and the connecting wire (800) according to the embodiment will be described.

[0291] In the embodiment, the second lead pattern part (942-1) and the connecting wire (800) can be designed by considering the optimal impedance, eye-diagram, and common mode noise.

[0292] As shown in FIGS. 26 and 27, various variables must be considered to achieve optimal conditions for the impedance, eye-diagram, and common mode noise as described above.

[0293] At this time, the lead pattern portion or circuit pattern line (not shown) formed on the first substrate (710), and the pad (not shown) or circuit pattern line formed on the sensor substrate portion, etc., are designed to optimize the signal transmission efficiency of the image sensor, and accordingly, it is difficult to optimally match the impedance, eye-diagram, and common mode noise by changing them. Accordingly, in the embodiment, the following variables are considered to optimally match the impedance, eye-diagram, and common mode noise.

[0294] First, as shown in FIG. 26 (a), the variables include the length (L) and diameter (D) of the connecting wire (800). Additionally, as shown in FIG. 26 (b), the variables in the embodiment include the thickness (T) of the second lead pattern portion (942-1) included in the fourth substrate (940).

[0295] Additionally, as illustrated in FIG. 27, the variables also include the second lead pattern portion (942-1). For example, the second lead pattern portion (942-1) includes a first portion (942-11) disposed on the insulating layer (941), a third portion (942-13) coupled to the connecting wire (800), a second portion (942-12) connecting the first portion (942-11) and the third portion (942-13), and a fourth portion (942-14) extending from the first portion (942-11) toward the inner direction of the insulating layer (941) and coupled to the fifth pad portion (935) of the third substrate (930). The second portion (942-12) may be disposed to surround the outer side of the third portion (942-13).

[0296] Additionally, design variables for the second lead pattern portion (942-1) may include the outer diameter or outer distance (OD1) of the third portion (942-13), the line width (W) of the second portion (942-12), a first separation distance (DT1) in a first direction between the center of the third portion (942-13) and the outermost part of the second portion (942-12), and a second separation distance (DT2) in a second direction between the center of the third portion (942-13) and the outermost part of the second portion (942-12).

[0297] In addition, in the embodiment, the diameter (D) of the connecting wire (800) and the length (L) of the connecting wire (800), the thickness (T) of the second lead pattern part (942-1), the outer distance (OD1) of the second lead pattern part (942-1), the first separation distance (DT1) of the second lead pattern part (942-1), and the second separation distance (DT2) of the second lead pattern part (942-1) are determined to have optimal impedance, eye-diagram, and common mode noise.

[0298] First, in the embodiment, multiple conditions are determined by changing the values ​​based on previously designed reference values ​​(ref. or before), and the impedance, eye-diagram, and common mode noise of multiple cases according to the combination of these conditions are analyzed to determine the optimal case.

[0300] In the embodiment, the above variables are classified into the following two conditions, and cases are determined based on the combination of these conditions.

[0301] The two conditions for the above variables may be as shown in Table 1 and Table 2 below.

[0302] condition 2nd lead pattern section (942-1) Line width (W), μm Outer distance (OD1), μm First separation distance (DT1), μm Second separation distance (DT2), μm 1 42 280 301 266 2 48 320 344 304 3 54 360 387 342 4 66 440 473 418 5 72 480 516 456 6 78 520 559 494 ref-1 or before 1 60 400 430 380

[0304] condition Connecting wire (800) 2nd lead pattern section (942-1) Diameter (D), μm Length (L), mm Thickness (T), μm 7 20 0.5 20 8 30 1 30 9 35 1.5 35 10 60.8 3.52 64 ref-2 or before 2 38 2.2 40

[0306] That is, in the embodiment, conditions for each variable were determined as shown in Tables 1 and 2 above, and these were combined into seven cases as shown in Table 3 below, and the state values ​​of impedance, eye-diagram, and common mode noise for each of the seven cases were analyzed.

[0307] case Combinations of the conditions in Table 1 and Table 2 Target impedance value 1 1+7 80Ω 2 1+7 100Ω 3 ref-1 + 7 80Ω 4 ref-2 + 1 80Ω 5 6+10 80Ω 6 6+10 100Ω 7 ref-1 + 10 80Ω

[0309] In the example, as shown in Table 3 above, the combination conditions for each variable were divided into seven cases, and for each case, the state values ​​of impedance, eye-diagram, and common mode noise were analyzed.

[0311] FIG. 28 is a diagram illustrating the trend of impedance matching values ​​according to an embodiment, and FIG. 29 is a diagram illustrating the trend of result values ​​of an eye-diagram according to an embodiment.

[0312] The graph for 'before' in FIG. 28 is a diagram showing the impedance value when the value for ref-1 and the value for ref-2 are applied to the connecting wire (800) and the second lead pattern part (942-1) under the above conditions. And, the graph for 'after' in FIG. 28 is a diagram showing the impedance value when the value for ref-1 is changed to the value for condition 1 of Table 1 while the value for ref-2 is applied as is.

[0313] Looking at the graphs for before and after in Fig. 28, it was confirmed that when the condition for the second lead pattern part (942-1) is changed from ref-1 to condition 1 (for example, when the value for each variable is reduced), the maximum value of the impedance decreases from 120Ω to 108Ω.

[0315] In addition, the graph for 'before' in FIG. 29 is a diagram showing the result of an eye-diagram when the value for ref-1 and the value for ref-2 are applied to the connecting wire (800) and the second lead pattern part (942-1) under the above conditions. And, the graph for 'after' in FIG. 29 is a diagram showing the result of an eye-diagram when the value for ref-1 is changed to the value for condition 1 of Table 1 while the value for ref-2 is applied as is.

[0316] Looking at the graph for before and after in Fig. 29, it can be seen that when the condition for the second lead pattern part (942-1) is changed from ref-1 to condition 1 (for example, when the value for each variable is reduced), the height of the eye-diagram increases.

[0317] In other words, in the embodiment, it was confirmed that when the design value for each of the above variables is reduced to a certain level compared to the existing one, the impedance matching state or the eye-diagram result is improved.

[0318] A detailed examination of this is as follows.

[0319] FIGS. 30a to 30g are graphs showing the impedance matching results for each case in Table 3. Specifically, the blue graph in FIG. 30a shows the impedance matching results before, and the red graph shows the impedance matching results for Case 1 in Table 3. Additionally, the blue graph in FIG. 30b shows the impedance matching results before, and the red graph shows the impedance matching results for Case 2 in Table 3. Additionally, the blue graph in FIG. 30c shows the impedance matching results before, and the red graph shows the impedance matching results for Case 3 in Table 3. Additionally, the blue graph in FIG. 30d shows the impedance matching results before, and the red graph shows the impedance matching results for Case 4 in Table 3. Additionally, the blue graph in FIG. 30e shows the impedance matching results before, and the red graph shows the impedance matching results for Case 5 in Table 3. In addition, the blue graph in Fig. 30f shows the impedance matching result before, and the red graph shows the impedance matching result for Case 6 in Table 3. In addition, the blue graph in Fig. 30g shows the impedance matching result before, and the red graph shows the impedance matching result for Case 7 in Table 3.

[0320] And, the graphs of Figs. 30a to 30g are summarized as shown in Table 4 below.

[0321] case Maximum impedance value before (traditional) 120.7653 Case 1 98.4140 Case 2 109.1991 Case 3 100.0173 Case 4 108.2090 Case 5 118.8524 Case 6 129.4178 Case 7 115.8909

[0323] Summarizing Table 4 above, it was confirmed that when the value for each of the above variables increases compared to the existing value, the increase or decrease in the maximum impedance value compared to the existing value is negligible. Furthermore, it was confirmed that when the value for each of the above variables decreases compared to the existing value, the maximum impedance value decreases.

[0325] Figures 31a to 31h are graphs showing the eye-diagram results for each case in Table 3. Specifically, FIG. 31a is a diagram showing the results of an eye-diagram for the first case of Table 3, FIG. 31b is a diagram showing the results of an eye-diagram for the second case of Table 3, FIG. 31c is a diagram showing the results of an eye-diagram for the third case of Table 3, FIG. 31d is a diagram showing the results of an eye-diagram for the fourth case of Table 3, FIG. 31e is a diagram showing the results of an eye-diagram for the fifth case of Table 3, FIG. 31f is a diagram showing the results of an eye-diagram for the sixth case of Table 3, FIG. 31g is a diagram showing the results of an eye-diagram for the seventh case of Table 3, and FIG. 31h is a conventional eye-diagram This is a diagram showing the results.

[0326] And, the graphs of FIGS. 31a to 31h are summarized as shown in Table 5 below.

[0327] case Height (mV) of the eye diagram Width (ns) of the eye diagram before (traditional) 271.3868 0.5371 Case 1 342.4774 0.5193 Case 2 320.0829 0.5326 Case 3 324.7115 0.5204 Case 4 294.7616 0.5215 Case 5 256.6229 0.5215 Case 6 250.6255 0.5404 Case 7 265.6038 0.5204

[0329] Summarizing Table 5 above, it was confirmed that when the value for each of the above variables increases compared to the existing value, the height or width of the eye-diagram decreases compared to the existing value, or the degree of increase is negligible. Furthermore, when the value for each of the above variables decreases compared to the existing value, it was confirmed that the height or width of the eye-diagram increases compared to the existing value.

[0331] Figures 32a to 32h are graphs showing the common mode noise values ​​for each case in Table 3. Specifically, FIG. 32a is a diagram showing the common mode noise value for the first case of Table 3, FIG. 32b is a diagram showing the common mode noise value for the second case of Table 3, FIG. 32c is a diagram showing the common mode noise value for the third case of Table 3, FIG. 32d is a diagram showing the common mode noise value for the fourth case of Table 3, FIG. 32e is a diagram showing the common mode noise value for the fifth case of Table 3, FIG. 32f is a diagram showing the common mode noise value for the sixth case of Table 3, FIG. 32g is a diagram showing the common mode noise value of Table 3, and FIG. 32h is a diagram showing the conventional common mode noise value. For example, Figures 32a through 32h show the results for common mode noise values ​​appearing at a MIPI transmission rate of 1800 Mbps.

[0332] And, the graphs of FIGS. 32a to 32h are summarized as shown in Table 6 below.

[0333] case Maximum noise value (peak to peak, mV) before (traditional) 86.1211 Case 1 83.6462 Case 2 63.9088 Case 3 84.0911 Case 4 114.4037 Case 5 107.4505 Case 6 97.8760 Case 7 116.5800

[0335] Summarizing Table 6, it was confirmed that when only one of the values ​​for the variable of the second lead pattern part (942-1) and the value for the variable of the connecting wire (800) decreases, the maximum noise value for the common mode noise increases compared to the existing value. Furthermore, it was confirmed that when the value for the variable of the second lead pattern part (942-1) or the value for the variable of the connecting wire (800) increases compared to the existing value, the maximum noise value for the common mode noise increases compared to the existing value. Furthermore, in the embodiment, when both the value for the variable of the second lead pattern part (942-1) and the value for the variable of the connecting wire (800) decrease compared to the existing value, it was confirmed that the maximum noise value for the common mode noise decreases.

[0336] Accordingly, in the embodiment, the second lead pattern part (942-1) and the connecting wire (800) are designed to satisfy the following conditions.

[0337] The diameter (D) of the connecting wire (800) satisfies a range between 15㎛ and 35㎛. For example, the diameter (D) of the connecting wire (800) satisfies a range between 17㎛ and 32㎛. For example, the diameter (D) of the connecting wire (800) satisfies a range between 19㎛ and 30㎛. If the diameter (D) of the connecting wire (800) is smaller than 15㎛, there is a problem that the connecting wire (800) breaks during operation of the sensor driving device according to the embodiment. In addition, if the diameter of the connecting wire (800) is larger than 35㎛, there is a problem that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0338] Additionally, the length (L) of the connecting wire (800) satisfies a range between 0.3 mm and 2.0 mm. For example, the length (L) of the connecting wire (800) satisfies a range between 0.4 mm and 1.8 mm. For example, the length (L) of the connecting wire (800) satisfies a range between 0.5 mm and 1.5 mm. If the length (L) of the connecting wire (800) is less than 0.3 mm, the range of movement (e.g., tilt angle, etc.) of the sensor driving device according to the embodiment may be reduced. If the length (L) of the connecting wire (800) is greater than 2.0 mm, there is a problem in that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0339] The thickness (T) of the second lead pattern portion (942-1) according to the embodiment satisfies a range between 15 μm and 35 μm. For example, the thickness (T) of the second lead pattern portion (942-1) according to the embodiment satisfies a range between 17 μm and 32 μm. For example, the thickness (T) of the second lead pattern portion (942-1) satisfies a range between 19 μm and 28 μm. If the thickness (T) of the second lead pattern portion (942-1) is less than 15 μm, the surface resistance of the second lead pattern portion (942-1) increases, and the signal loss may increase accordingly. If the thickness (T) of the second lead pattern portion (942-1) is greater than 35 μm, there is a problem in that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0340] The line width (W) of the second part (942-12) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 35 μm and 55 μm. For example, the line width (W) of the second part (942-12) of the second lead pattern part (942-1) satisfies a range between 37 μm and 52 μm. For example, the line width (W) of the second part (942-12) of the second lead pattern part (942-1) satisfies a range between 40 μm and 50 μm. If the line width (W) of the second part (942-12) of the second lead pattern part (942-1) is smaller than 35 μm, there is a problem that the second lead pattern part (942-1) breaks during operation of the sensor driving device. In addition, if the line width (W) of the second part (942-12) of the second lead pattern part (942-1) is greater than 55 μm, there is a problem in that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0341] The outer distance (OD1) of the third part (942-13) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 200 µm and 380 µm. For example, the outer distance (OD1) of the third part (942-13) of the second lead pattern part (942-1) satisfies a range between 220 µm and 360 µm. For example, the outer distance (OD1) of the third part (942-13) of the second lead pattern part (942-1) satisfies a range between 250 µm and 320 µm. If the outer distance (OD1) of the third part (942-13) of the second lead pattern part (942-1) is less than 200 µm, the strength may be reduced when connected to the connecting wire (800). In addition, if the outer distance (OD1) of the third part (942-13) of the second lead pattern part (942-1) is greater than 380 μm, there is a problem in that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0342] The first separation distance (DT1) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 250 µm and 410 µm. For example, the first separation distance (DT1) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 270 µm and 380 µm. For example, the first separation distance (DT1) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 300 µm and 350 µm. If the first separation distance (DT1) of the second lead pattern part (942-1) is smaller than 250 µm, the elasticity of the second lead pattern part (942-1) is reduced, and the drivability of the sensor driving device may be reduced. If the first separation distance (DT1) of the second lead pattern part (942-1) is greater than 410 μm, there is a problem in that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0343] The second separation distance (DT2) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 200 µm and 350 µm. For example, the second separation distance (DT2) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 220 µm and 320 µm. For example, the second separation distance (DT2) of the second lead pattern part (942-1) according to the embodiment satisfies a range between 250 µm and 310 µm. If the second separation distance (DT2) of the second lead pattern part (942-1) is smaller than 200 µm, the elasticity of the second lead pattern part (942-1) is reduced, and the drivability of the sensor driving device may be reduced. In addition, if the second separation distance (DT2) of the second lead pattern part (942-1) is greater than 350 μm, there is a problem in that the impedance increases, the height or width of the eye-diagram decreases, or the common mode noise value increases.

[0344] As described above, in the embodiment, the diameter (D) of the connecting wire (800), the length (L) of the connecting wire (800), the thickness (T) of the second lead pattern part (942-1), the outer distance (OD1) of the second lead pattern part (942-1), the first separation distance (DT1) of the second lead pattern part (942-1), and the second separation distance (DT2) of the second lead pattern part (942-1) are designed under optimal conditions, thereby improving the driving performance of the sensor driving device while maintaining the impedance, eye-diagram, and common mode noise at optimal values.

[0346] <Structural change of connecting wire>

[0347] Meanwhile, in the embodiment, the structure of the connecting wire (800) is modified to minimize common mode noise that occurs during the operation of the camera module.

[0348] At this time, the connecting wire (800) includes a first metal layer (801). The first metal layer (801) may include copper. And, a general connecting wire (800) includes only the first metal layer (801). For example, the diameter (D) or length (L) of the connecting wire (800) described above refers to the diameter (D) and length (L) of the first metal layer (801).

[0349] Here, in the embodiment, the connecting wire (800) is configured with a plurality of layers to shield the electromagnetic field generated by the current flowing through the connecting wire (800) and to reduce the common mode noise.

[0350] FIG. 33 is a drawing for explaining the layer structure of a connecting wire according to an embodiment, and FIG. 34a to 34l are graphs showing the result values ​​of common mode noise according to the layer structure of a connecting wire according to an embodiment.

[0351] Referring to FIG. 33, the connecting wire (800) may have a plurality of layer structures.

[0352] As in the first case (or first modified structure of the connecting wire) illustrated in FIG. 33 (a), the connecting wire (800) may include the first metal layer (801) and a first insulating layer (802) disposed surrounding the first metal layer (801). That is, in the first modified structure of the connecting wire (800), a first insulating layer (802) is formed on the outside of the first metal layer (801) and disposed surrounding the first metal layer (801). The first insulating layer (802) may serve to primarily shield the current flowing through the first metal layer (801). The first insulating layer (802) may also be referred to as the inner insulating layer of the connecting wire (800). The first insulating layer (802) may be formed of polyethylene, but is not limited thereto. The first insulating layer (802) may be formed to completely surround the outer surface of the first metal layer (801), but is not limited thereto. For example, the first insulating layer (802) may be positioned to cover a portion of the outer surface of the first metal layer (801). In such a case, the outer surface of the first metal layer (801) may be divided into a portion covered by the first insulating layer (802) and a portion not covered. The first insulating layer (802) may have a dielectric constant between 2.0 and 3.0. The first insulating layer (802) may be positioned on the outer surface of the first metal layer (801) with a thickness in the range of 0.3 μm to 1.2 μm.

[0353] As in the second case (or second modified structure of the connecting wire) illustrated in FIG. 33(b), the connecting wire (800) may include the first metal layer (801), the first insulating layer (802), and the second metal layer (803). That is, in the second modified structure of the connecting wire (800), the second metal layer (803) may be additionally included in the first modified structure. The second metal layer (803) may be arranged to surround the outer side of the first insulating layer (802). The second metal layer (803) may include copper, but is not limited thereto. The second metal layer (803) may be arranged on the outer surface of the first insulating layer (802) with a thickness between 0.2 μm and 1.0 μm.

[0354] As in the third case (or third modified structure of the connecting wire) illustrated in FIG. 33 (c), the connecting wire (800) may include the first metal layer (801), the first insulating layer (802), the second metal layer (803), and the second insulating layer (804). That is, in the third modified structure of the connecting wire (800), the second insulating layer (804) may be additionally included in the second modified structure. The second insulating layer (804) may be arranged to surround the outer side of the second metal layer (803). The second insulating layer (804) may include an insulating material different from the first insulating layer (802). For example, the second insulating layer (804) may include an insulating material having a dielectric constant greater than that of the first insulating layer (802). For example, the second insulating layer (804) may have a dielectric constant in the range of 3.5 to 4.5. For example, the second insulating layer (804) may include PVC (Polyvinyl Chloride), but is not limited thereto. The second insulating layer (804) may be disposed on the outside of the second metal layer (803) with a thickness between 0.1 μm and 0.5 μm.

[0355] As described above, in the embodiment, the results of the common mode noise according to the modified structure of the connecting wire (800) were analyzed.

[0356] FIG. 34a is a graph showing common mode noise occurring in a connection wire (before) including only the first metal layer at a first transmission speed (800 Mbps), FIG. 34b is a graph showing common mode noise occurring in a connection wire (case 1) including the first metal layer and the first insulating layer at a first transmission speed (800 Mbps), FIG. 34c is a graph showing common mode noise occurring in a connection wire (case 2) including the first metal layer, the first insulating layer and the second metal layer at a first transmission speed (800 Mbps), and FIG. 34d is a graph showing common mode noise occurring in a connection wire (case 3) including the first metal layer, the first insulating layer, the second metal layer and the second insulating layer at a first transmission speed (800 Mbps).

[0357] Figures 34a to 34d are summarized as shown in Table 7 below.

[0358] 800Mbps before caes 1 case 2 case 3 Common mode noise peak to peak (mV) 91.1326 88.7879 76.6754 79.5965

[0360] As shown in Table 7, under conditions where a signal is transmitted at a transmission speed of 800 Mbps, it was confirmed that the common mode noise value of each of the first modified structure, the second modified structure, and the third modified structure of the connecting wire of the embodiment was reduced compared to the previous structure (before) which included only the first metal layer (801). Furthermore, it was confirmed that the lowest common mode noise appeared in the second modified structure of the embodiment, which includes the first metal layer (801), the first insulating layer (802), and the second metal layer (803).

[0362] FIG. 34e is a graph showing common mode noise occurring in a connection wire (before) including only the first metal layer at a second transmission speed (1200 Mbps), FIG. 34f is a graph showing common mode noise occurring in a connection wire (case 1) including the first metal layer and the first insulating layer at a second transmission speed (1200 Mbps), FIG. 34g is a graph showing common mode noise occurring in a connection wire (case 2) including the first metal layer, the first insulating layer and the second metal layer at a second transmission speed (1200 Mbps), and FIG. 34h is a graph showing common mode noise occurring in a connection wire (case 3) including the first metal layer, the first insulating layer, the second metal layer and the second insulating layer at a second transmission speed (1200 Mbps).

[0363] Figures 34e to 34h are summarized as shown in Table 8 below.

[0364] 1200Mbps before caes 1 case 2 case 3 Common mode noise peak to peak (mV) 100.7039 99.3599 8132474 85.4103

[0365] As shown in Table 8, under conditions where a signal is transmitted at a transmission speed of 1200 Mbps, it was confirmed that the common mode noise value of each of the first modified structure, the second modified structure, and the third modified structure of the connecting wire of the embodiment was reduced compared to the previous structure (before) which included only the first metal layer (801). Furthermore, it was confirmed that the lowest common mode noise appeared in the second modified structure of the embodiment, which includes the first metal layer (801), the first insulating layer (802), and the second metal layer (803).

[0367] FIG. 34i is a graph showing common mode noise occurring in a connection wire (before) including only the first metal layer at a third transmission speed (1800 Mbps), FIG. 34j is a graph showing common mode noise occurring in a connection wire (case 1) including the first metal layer and the first insulating layer at a third transmission speed (1800 Mbps), FIG. 34k is a graph showing common mode noise occurring in a connection wire (case 2) including the first metal layer, the first insulating layer and the second metal layer at a third transmission speed (1800 Mbps), and FIG. 34l is a graph showing common mode noise occurring in a connection wire (case 3) including the first metal layer, the first insulating layer, the second metal layer and the second insulating layer at a third transmission speed (1800 Mbps).

[0368] Figures 34i to 34l are summarized as shown in Table 9 below.

[0369] 1800Mbps before caes 1 case 2 case 3 Common mode noise peak to peak (mV) 86.9958 83.1724 67.6834 73.3482

[0370] As shown in Table 9, under conditions where a signal is transmitted at a transmission speed of 1800 Mbps, it was confirmed that the common mode noise value of each of the first modified structure, the second modified structure, and the third modified structure of the connecting wire of the embodiment was reduced compared to the previous structure (before) which included only the first metal layer (801). Furthermore, it was confirmed that the lowest common mode noise appeared in the second modified structure of the embodiment, which includes the first metal layer (801), the first insulating layer (802), and the second metal layer (803).

[0372] As described above, in the embodiment, the connecting wire includes only the first metal layer (801), and additionally includes at least one of the first insulating layer (802), the second metal layer (803), and the second insulating layer (804), thereby minimizing the common mode noise.

[0374] <Relationship between Impedance Matching Values ​​and Common Mode Noise>

[0375] Meanwhile, in the embodiment, the relationship between the impedance matching value and the common mode noise is derived and organized into a formula and provided.

[0376] Accordingly, in the embodiment, the common mode noise value in each section corresponding to the impedance matching value can be easily predicted, and the optimal impedance matching value can be determined accordingly.

[0377] FIG. 35 is a graph showing a formula according to an impedance value according to an embodiment, and FIG. 36a to 36i are diagrams showing the relationship between the measured impedance and common mode noise to determine the formula of FIG. 35.

[0378] As illustrated in FIG. 35, in the embodiment, common mode noise values ​​according to impedance matching values ​​are measured according to the signal transmission speed of the MIPI line, and the results are organized into a formula and provided. For example, FIG. 35 shows that when the signal transmission speed is 800 Mbps, the formula representing the relationship between impedance and common mode noise is Y = -0.246X + 119.08. Additionally, FIG. 35 shows that when the signal transmission speed is 1200 Mbps, the formula representing the relationship between impedance and common mode noise is Y = -0.2549X + 130.26.

[0379] This can be derived through the following simulation process.

[0380] FIG. 36a is a diagram showing common mode noise when the impedance is matched to 100Ω at a first transmission speed (800Mbps), FIG. 36b is a diagram showing common mode noise when the impedance is matched to 80Ω at a first transmission speed (800Mbps), and FIG. 36c is a diagram showing common mode noise when the impedance is matched to 80Ω at a first transmission speed (800Mbps).

[0381] Figures 36a to 36c are summarized as shown in Table 10 below.

[0382] 800Mbps 100Ω 80Ω 90Ω Common mode noise peak to peak (mV) 93.3498 99.9421 98.6744

[0384] As shown in Table 10 above, in the embodiment, at the first transmission speed (800 Mbps), the common mode noise value that appears according to each matching impedance value is measured and provided by organizing it into a formula.

[0386] FIG. 36d is a diagram showing common mode noise when the impedance is matched to 100Ω at a second transmission speed (1200Mbps), FIG. 36e is a diagram showing common mode noise when the impedance is matched to 80Ω at a second transmission speed (1200Mbps), and FIG. 36f is a diagram showing common mode noise when the impedance is matched to 80Ω at a second transmission speed (1200Mbps).

[0387] Figures 36d to 36f are summarized as shown in Table 11 below.

[0388] 1200Mbps 100Ω 80Ω 90Ω Common mode noise peak to peak (mV) 102.5092 114.3049 103.8630

[0389] As shown in Table 11 above, in the embodiment, at the second transmission speed (1200 Mbps), the common mode noise value that appears according to each matching impedance value is measured and provided by organizing it into a formula.

[0391] FIG. 36g is a diagram showing common mode noise when the impedance is matched to 100Ω at a third transmission speed (1800Mbps), FIG. 36h is a diagram showing common mode noise when the impedance is matched to 80Ω at a third transmission speed (1800Mbps), and FIG. 36i is a diagram showing common mode noise when the impedance is matched to 80Ω at a third transmission speed (1800Mbps).

[0392] Figures 36g to 36i are summarized as shown in Table 12 below.

[0393] 1800Mbps 100Ω 80Ω 90Ω Common mode noise peak to peak (mV) 86.1211 100.3239 86.8840

[0394] As shown in Table 12 above, in the embodiment, at the third transmission speed (1800 Mbps), the common mode noise value that appears according to each matching impedance value is measured and provided by organizing it into a formula.

[0396] FIG. 37 is a mobile terminal (1500) with a camera module applied according to an embodiment.

[0397] As illustrated in FIG. 37, the mobile terminal (1500) of the embodiment may include a camera module (1000), a flash module (1530), and an autofocus device (1510) provided on the rear. The mobile terminal (1500) of the embodiment may further include a second camera module (1100).

[0398] The above camera module (1000) may include an image capturing function and an autofocus function. For example, the above camera module (1000) may include an autofocus function using an image.

[0399] The above camera module (1000) processes still image or video image frames obtained by an image sensor in shooting mode or video call mode. The processed image frames may be displayed on a predetermined display unit and may be stored in memory. A camera (not shown) may also be placed on the front of the mobile terminal body.

[0400] For example, the camera module (1000) may include a first camera module and a second camera module, and the first camera module may enable the implementation of OIS along with AF or zoom functions.

[0401] The flash module (1530) may include a light-emitting element that emits light inside it. The flash module (1530) may be operated by the operation of the camera of the mobile terminal or by the control of the user.

[0402] The above autofocus device (1510) may include one of the packages of surface light-emitting laser elements as a light-emitting part.

[0403] The above autofocus device (1510) may include an autofocus function using a laser. The above autofocus device (1510) may be mainly used in conditions where the autofocus function using the image of the camera module (1000) is degraded, such as in a close distance of 10m or less or in a dark environment. The above autofocus device (1510) may include a light-emitting part including a vertical cavity surface-emitting laser (VCSEL) semiconductor device and a light-receiving part that converts light energy into electrical energy, such as a photodiode.

[0405] Next, FIG. 38 is a perspective view of a vehicle (700) with a camera module applied according to an embodiment.

[0406] For example, FIG. 38 is an exterior view of a vehicle equipped with a vehicle driving assistance device having a camera module according to an embodiment.

[0407] Referring to FIG. 38, the vehicle (800) of the embodiment may be equipped with wheels (13FL, 13FR) that rotate by a power source and a certain sensor. The sensor may be a camera sensor (2000), but is not limited thereto.

[0408] The above camera (2000) may be a camera sensor to which a camera module (1000) according to an embodiment is applied.

[0409] The vehicle (800) of the embodiment can acquire image information through a camera sensor (2000) that captures a front image or a surrounding image, and can determine a situation where a lane is not identified using the image information and generate a virtual lane when it is not identified.

[0410] For example, a camera sensor (2000) captures the front of a vehicle (800) to obtain a front image, and a processor (not shown) can obtain image information by analyzing objects included in the front image.

[0411] For example, if objects such as a median strip, curb, or roadside tree corresponding to a lane, adjacent vehicle, driving obstruction, and indirect road marking are captured in an image captured by a camera sensor (2000), the processor can detect these objects and include them in the image information.

[0412] At this time, the processor can obtain distance information with respect to the object detected through the camera sensor (2000) to further supplement the image information. The image information may be information regarding the object captured in the image.

[0413] Such a camera sensor (2000) may include an image sensor and an image processing module. The camera sensor (2000) can process a still image or video obtained by an image sensor (e.g., CMOS or CCD). The image processing module can process the still image or video obtained through the image sensor to extract necessary information and transmit the extracted information to a processor.

[0414] At this time, the camera sensor (2000) may include a stereo camera to improve the measurement accuracy of the object and to obtain more information such as the distance between the vehicle (800) and the object, but is not limited thereto.

[0415] The vehicle (800) of the embodiment can provide an advanced driver assistance system (ADAS).

[0416] For example, Advanced Driver Assistance Systems (ADAS) include the Autonomous Emergency Braking (AEB) system, which automatically reduces speed or stops the vehicle without the driver having to apply the brakes in the event of a collision risk; the Lane Keep Assist System (LKAS), which maintains the lane by adjusting the driving direction when the vehicle deviates from the lane; Advanced Smart Cruise Control (ASCC), which automatically maintains a distance from the vehicle ahead while driving at a preset speed; the Active Blind Spot Detection (ABSD) system, which detects blind spot collision risks and assists with safe lane changes; and the Around View Monitor (AVM), which provides a visual representation of the vehicle's surroundings.

[0417] In these advanced driver assistance systems (ADAS), camera modules function as core components alongside radar, and the proportion of camera module applications is gradually expanding.

[0418] For example, the Automatic Emergency Braking (AEB) system uses front camera and radar sensors to detect vehicles or pedestrians ahead, automatically applying emergency braking when the driver is not controlling the vehicle. Alternatively, the Lane Keeping Assist System (LKAS) uses camera sensors to detect if the driver is deviating from the lane without using turn signals, and can automatically steer the wheel to maintain the lane. Furthermore, the Around View Monitoring (AVM) system can visually display the surrounding environment of the vehicle through camera sensors positioned on all sides.

[0419] According to an embodiment, the sensor driving device can improve the operational reliability of the image sensor through impedance matching and further improve the quality of the image obtained through the image sensor.

[0420] Specifically, the embodiment includes a movable substrate for moving the image sensor. Accordingly, in the embodiment, the signal transmission line through which the image sensor is transmitted is transmitted from the output terminal of the image sensor to the lead pattern portion of the movable substrate, then transmitted again from the lead pattern portion to a connecting wire, and then transmitted to the connector of the main substrate through the connecting wire. Accordingly, in the embodiment, impedance matching between the output terminal of the image sensor and the connector of the main substrate is required. In this case, in a typical camera module, impedance matching with a value similar to 100Ω is required. In this case, in the comparative example, the image sensor is directly coupled to the first substrate, and accordingly, the image signal acquired from the image sensor is transmitted to the main board of the optical device through the connector via a single first substrate. Accordingly, the comparative example has a structure in which the image signal is transmitted through a single substrate as described above, and accordingly, the impedance has a value similar to 100Ω. In contrast, in the embodiment, a structure is provided in which a connecting wire and a movable substrate are additionally disposed between the image sensor and the first substrate as described above, and accordingly, the maximum impedance between the output terminal of the image sensor and the connector has a value of 300Ω or more. Accordingly, in the embodiment, the structure of the lead pattern portion disposed on the movable substrate and the structure of the connecting wire are modified. Accordingly, in the embodiment, the impedance between the output terminal of the image sensor and the connector can be matched within the range of 100Ω ± 10%. Accordingly, in the embodiment, the operational reliability of the sensor driving device having a sensor shift structure can be improved through the impedance matching. Furthermore, in the embodiment, the quality of the image signal obtained from the image sensor can be improved through the improvement of the operational reliability of the sensor driving device, and furthermore, the product satisfaction of the camera module can be improved.That is, in the embodiment, noise can be reduced by improving impedance mismatching through changes in the structure of the lead pattern portion and the structure of the connecting wire. Furthermore, in the embodiment, signal loss can be reduced through noise improvement, and communication performance can be improved accordingly.

[0421] Meanwhile, in the embodiment, the structure of the lead pattern portion includes the line width of the second part of the lead pattern portion, the outer length of the third part, a first distance between the outermost part of the second part and the center of the third part in a first direction, and a second distance between the outermost part of the second part and the center of the third part in a second direction. Additionally, the structure of the connecting wire in the embodiment includes the diameter and length of the connecting wire.

[0422] In addition, in determining the structure of the lead pattern portion and the structure of the connecting wire in the embodiment, optimal design values ​​are determined by reflecting not only the impedance matching conditions but also eye diagram conditions including the height and width of the eye diagram. Accordingly, in the embodiment, the eye height and eye width of the eye diagram can be increased, and the performance of MIPI (Mobile Industry Processor Interface) can be improved. Furthermore, in the embodiment, communication quality can be improved due to the improvement in MIPI performance, and thereby, the image quality of the camera module using MIPI communication can be improved.

[0423] In addition, in the embodiment, the connecting wire is configured with a plurality of layers to provide optimal communication performance. Specifically, the connecting wire in the embodiment forms at least one layer surrounding the outside of a first metal layer constituting the wire. For example, the connecting wire may include a first metal layer and a first insulating layer surrounding the outside of the first metal layer. For example, the connecting wire may include a first metal layer, a first insulating layer surrounding the outside of the first metal layer, and a second metal layer surrounding the outside of the first insulating layer. For example, the connecting wire may include a first metal layer, a first insulating layer surrounding the outside of the first metal layer, a second metal layer surrounding the outside of the first insulating layer, and a second insulating layer surrounding the outside of the second metal layer. Accordingly, in the embodiment, the electromagnetic field generated by the current flowing through the wire including the first metal layer can be shielded through at least one of the first insulating layer, the second metal layer, and the second insulating layer. Accordingly, in the embodiment, common mode noise can be reduced compared to a comparative example using a connecting wire containing only the first metal layer, and the communication speed can be improved accordingly.

[0424] In addition, in the embodiment, the impedance matching value between the output terminal of the image sensor and the connector is varied, and the relationship between each impedance matching value and common mode noise is derived using a formula. Accordingly, in the embodiment, the common mode noise value corresponding to each impedance matching value can be easily identified, thereby facilitating the determination of the impedance matching value.

[0425] In addition, according to an embodiment, to implement OIS and AF functions of a camera module, instead of moving a conventional lens barrel, an image sensor is moved relatively to the lens barrel in the X, Y, and Z axis directions. Accordingly, the camera module according to the embodiment can eliminate a complex spring structure for implementing OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor relative to the lens barrel according to the embodiment, a more stable structure can be formed compared to the conventional one.

[0426] In addition, according to an embodiment, a terminal portion electrically connected to an image sensor is configured to have a spring structure and is positioned to float without overlapping within the vertical direction of the insulating layer. Accordingly, the camera module can stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0427] According to the above embodiment, X-axis direction shift, Y-axis direction shift, and Z-axis center rotation corresponding to hand shake can be performed on the image sensor, and accordingly, hand shake correction for the image sensor and hand shake correction for the corresponding lens can be performed together, thereby providing an improved hand shake correction function.

[0428] In addition, according to an embodiment, the overall height of the camera device can be reduced by utilizing the internal space of a second actuator that moves the image sensor relative to the lens barrel to embed electrical components required for the camera circuit.

[0429] In addition, according to an embodiment, the camera assembly process can be simplified by integrating and fusing the camera circuit component and the second actuator component.

[0430] In addition, according to an embodiment, the reliability of the camera device can be improved by performing AF using a first actuator that implements a lens shift method and performing OIS using a second actuator that implements an image sensor shift method.

[0432] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the embodiments.

[0433] Although the above description has focused on the embodiments, this is merely an example and is not intended to limit the embodiments. A person skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For instance, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

Claims

Claim 1 A sensor driving device comprising: a fixed part including a first substrate including a first lead pattern part; a moving part including an image sensor disposed spaced apart from the fixed part at a certain distance; and a wire part disposed between the moving part and the fixed part, wherein one end of the wire part is connected to the first lead pattern part and the other end is connected to the moving part to elastically support the moving part with respect to the fixed part, the wire part includes a first metal layer, the diameter of the first metal layer has a range between 15 μm and 35 μm, the moving part includes an insulating layer and a second lead pattern part disposed on the insulating layer, the other end of the wire part is connected to the second lead pattern part, the second lead pattern part includes a body part disposed on the insulating layer, a coupling part coupled to the other end of the wire part, and a connecting part connecting the body part and the coupling part, wherein the line width of the connecting part of the second lead pattern part satisfies a range between 35 μm and 55 μm. Claim 2 A sensor driving device according to claim 1, wherein the length of the first metal layer of the wire portion has a range between 0.3 mm and 2.0 mm. Claim 3 delete Claim 4 A sensor driving device according to claim 1, wherein the coupling portion and the connecting portion of the second lead pattern portion do not overlap with the insulating layer in the optical axis direction. Claim 5 A sensor driving device according to claim 1, wherein the thickness of the second lead pattern portion satisfies a range between 15㎛ and 35㎛. Claim 6 delete Claim 7 A sensor driving device according to claim 1, wherein the outer distance of the coupling portion of the second lead pattern portion satisfies a range between 200㎛ and 380㎛. Claim 8 A sensor driving device according to claim 1, wherein the connecting portion comprises a first connecting portion disposed on a first side of the coupling portion and a second connecting portion that is bent and extended from the first connecting portion and disposed on a second side of the coupling portion different from the first side. Claim 9 A sensor driving device according to claim 8, wherein the first separation distance between the center of the coupling part and the outer side of the first connecting part satisfies a range between 250㎛ and 410㎛. Claim 10 A sensor driving device according to claim 8, wherein the second separation distance between the center of the coupling part and the outer side of the second connecting part satisfies a range between 200㎛ and 320㎛. Claim 11 A sensor driving device according to claim 1, wherein the wire portion comprises a first insulating layer disposed on the outside of the first metal layer. Claim 12 In claim 11, the wire portion comprises a second metal layer disposed on the outside of the first insulating layer, a sensor driving device. Claim 13 In claim 12, the wire portion comprises a second insulating layer disposed on the outside of the second metal layer, a sensor driving device. Claim 14 In claim 13, the second insulating layer comprises an insulating material different from the first insulating layer, and the dielectric constant of the first insulating layer is smaller than the dielectric constant of the second insulating layer, a sensor driving device. Claim 15 A fixed part including a first substrate including a first lead pattern part; a moving part disposed spaced apart from the fixed part at a certain distance and including an image sensor; The sensor substrate comprises a plurality of wires disposed between the fixed part and the movable part, wherein the movable part comprises an insulating layer and a second lead pattern part disposed on the insulating layer, and a sensor substrate part disposed between the second lead pattern part and the fixed part and including a pad part, wherein one end of the plurality of wires is connected to the first lead pattern part and the other end is connected to the second lead pattern part, and the pad part is electrically connected to the second lead pattern part, wherein the second lead pattern part comprises a body part disposed on the insulating layer, a coupling part coupled to the other end of the wire part, and a connecting part connecting the body part and the coupling part, wherein the connecting part comprises a first connecting part disposed on the first side of the coupling part and a second connecting part bent and extended from the first connecting part and disposed on the second side different from the first side of the coupling part, wherein the thickness of the second lead pattern part satisfies a range between 15㎛ and 35㎛, and the line width of the connecting part of the second lead pattern part satisfies a range between 35㎛ and 55㎛, and the A sensor driving device wherein the outer distance of the coupling portion satisfies a range between 200㎛ and 380㎛, the first separation distance between the center of the coupling portion and the outer side of the first connecting portion satisfies a range between 250㎛ and 410㎛, and the second separation distance between the center of the coupling portion and the outer side of the second connecting portion satisfies a range between 200㎛ and 320㎛. Claim 16 A sensor driving device according to claim 15, wherein the diameter of each of the plurality of wires satisfies a range between 15 μm and 35 μm, and the length of each of the plurality of wires has a range between 0.3 mm and 2.0 mm. Claim 17 A camera module comprising: a lens module; an image sensor; a first actuator for changing the state of the lens module; and a second actuator for changing the state of the image sensor and including a sensor driving device of claim 1 or 15; wherein the first actuator changes the state of the lens module to perform an auto-focusing function, and the second actuator changes the state of the image sensor to perform an OIS (Optical Image Stabilizer) function.

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