Probe for probe card

Abstract

A probe (1) for a probe card has a plurality of spaced deformation regions (8) that are circular, elliptical, or polygonal in shape and have a concave groove or protruding shape on a reference plane (1SB) perpendicular to the buckling direction (X), and a frame region (9) provided at the boundary of adjacent deformation regions (8). The plurality of deformation regions (8) are spaced in rows in a predetermined direction with respect to the length direction (Z) of the probe, and the rows are spaced in multiple rows along the length direction (Z) of the probe (1).

Description

Technology Field

[0001] The present invention relates to a probe for a probe card. Background Technology

[0002] A probe card is an electrical connection device used to supply power, input / output signals, and ground by contacting probes to electrode pads of semiconductor devices in order to perform operational tests on individual semiconductor devices formed on a wafer.

[0003] The probe is provided on the surface of the probe card and is configured so that its tip is pressed against the electrode pad of the semiconductor device with a predetermined pressure.

[0004] In order to increase the number of semiconductor devices formed on a wafer, it is necessary to reduce the size of the semiconductor devices. For this reason, the electrode pads of the semiconductor devices are designed to be small, and the distance (pitch) between the electrode pads is also designed to be small.

[0005] With the miniaturization of semiconductor devices, it is necessary to make probes finer. However, there is a problem in that making probes finer weakens their mechanical strength.

[0006] For this reason, in order to ensure good electrical and mechanical contact with the electrode pads of a semiconductor device, for example, Patent Document 1 proposes a configuration using a multilayer metal sheet in the probe. Prior art literature

[0007] Patent Document 1: Japanese Patent Publication No. 2018-501490 The problem to be solved

[0008] A probe disclosed in Patent Document 1 has at least one multilayer structure including an overlap between a core and a first inner coating layer, and an outer coating layer made of a material having a higher hardness than the core and completely covering the multilayer structure.

[0009] As described in Patent Document 1, in order to achieve good electrical and mechanical contact, a configuration in which multiple layers of different materials are overlapped is desirable, but there are limitations in meeting the requirement to reduce the thickness of the probe's cross-section, so an additional breakthrough was required.

[0010] In an inspection process using a probe card, in order to ensure contact with the electrode pad of a semiconductor device, after the probe contacts the electrode pad, the probe is pushed against the electrode pad of the semiconductor device by moving the probe card closer to the semiconductor wafer (overdrive).

[0011] For this reason, the probe requires strength such that it does not mechanically break even when a contact pressure exceeding a predetermined value is applied. In order for the probe not to break, it is necessary to prevent localized stress concentration from occurring on the probe. And, in order to prevent this stress concentration from occurring, a probe with a surface as smooth and flawless as possible was required.

[0012] However, there was a problem that there were limits to making the metal surface smooth, and as the thickness of the probe's cross-section decreased, the mechanical strength, which makes it easier to deform against external forces, decreased.

[0013] The present invention discloses a technology that solves the problem described above, and aims to provide a probe having strength that does not break even when a contact pressure greater than a predetermined value is applied, and which contacts an electrode pad of a semiconductor device with an appropriate stylus pressure even when the probe is made fine.

[0014] In other words, the probe for a probe card of the present invention aims to provide a probe for a probe card capable of withstanding large stress (high mechanical strength) by having a structure that intentionally disperses the locations where stress concentration occurs, rather than preventing stress concentration from occurring. means of solving the problem

[0015] The probe for a probe card disclosed herein is,

[0016] A vertical probe that buckles in a direction perpendicular to the longitudinal direction of a metal plate of a conductive member, having a reference plane included in a plate plane perpendicular to the buckling direction of the metal plate, a plurality of spaced deformation regions having outer edges that are circular, elliptical, or polygonal, and also have a concave groove shape or a protruding shape, and a frame region provided at the boundary of the plurality of deformation regions adjacent to each other, wherein the plurality of deformation regions are spaced in a row in a predetermined direction with respect to the longitudinal direction of the probe, and the row is spaced in multiple rows, and the Nth plurality of deformation regions and the N+1th plurality of deformation regions are spaced apart along the predetermined direction. Effects of the invention

[0017] According to the probe for a probe card disclosed herein, even if the plate thickness is reduced, the location where stress concentration occurs is dispersed, thereby providing a probe for a probe card with high mechanical strength and a method for manufacturing the probe for a probe card. Brief explanation of the drawing

[0018] FIG. 1 is a perspective view showing the schematic configuration of a probe for a probe card according to Embodiment 1. Figure 2 is a diagram showing the relationship between the overdrive amount and the locating pressure of the probe according to Embodiment 1. Figure 3 is a diagram showing the relationship between the amount of overdrive of the probe according to Embodiment 1 and the stress acting on the probe. FIG. 4 is a cross-sectional view showing the frame area when many concave grooves are provided according to Embodiment 1. FIG. 5a is a diagram showing the manufacturing process of a probe by electrocasting according to Embodiment 1. FIG. 5b is a diagram showing the manufacturing process of a probe by electrocasting according to Embodiment 1. FIG. 6 is a drawing showing a method of manufacturing a probe by a press according to Embodiment 1. FIG. 7 is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of the probe according to embodiment 2. FIG. 8 is a drawing showing a surface that provides a deformation area of ​​the probe according to embodiment 2. FIG. 9 is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of the probe according to embodiment 3. FIG. 10 is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of a probe according to embodiment 4. FIG. 11 is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of a probe according to embodiment 5. FIG. 12 is a drawing showing a variation of Embodiment 5. FIG. 13 is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of a probe according to embodiment 6. FIG. 14 is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of the probe according to embodiment 7. FIG. 15a is an enlarged view of a key portion of a plane perpendicular to the buckling direction (X) of a probe according to embodiment 8. Fig. 15b is a cross-sectional view of BB of Fig. 15a. FIG. 16 is a drawing showing a partial cross-sectional shape of a probe according to embodiment 9. Specific details for implementing the invention

[0019] Embodiment 1.

[0020] Hereinafter, a probe for a probe card according to Embodiment 1 is described with reference to the drawings. Also, in the following drawings, the same or substantial parts are given the same reference numerals.

[0021] FIG. 1 is a perspective view showing the structure of a probe (1) for a probe card.

[0022] Figure 2 is a diagram showing the relationship between the overdrive amount and the locating pressure of the probe (1).

[0023] Figure 3 is a diagram showing the relationship between the amount of overdrive of the probe and the stress acting on the probe.

[0024] FIG. 4 is a partial cross-sectional view of the deformation area (8) and the frame area (9).

[0025] The probe (1) is a probe called a so-called vertical probe, and is maintained almost vertically by the upper first guide plate (2) and the lower second guide plate (3). The front end (4) of the probe (1) is guided by the second guide plate (3) to contact the electrode pad (5) of the semiconductor device. The rear end (6) of the probe (1) (upper side of the ground in FIG. 1) is guided by the first guide plate (2) to be connected to an electrode (not shown) connected to the circuit board of the probe card.

[0026] The probe (1) is made of a thin metal plate as a conductive member, and on at least one surface (1S) (surface or back surface) perpendicular to the buckling direction (X) of the central part (7) of the probe (1), a plurality of deformation regions (8) and frame regions (9) are formed. The buckling direction (X) is the direction in which the probe (1) bends during the overdrive of the so-called probe card.

[0027] The deformation area (8) indicates an area where the original plane of the probe card, the reference plane (1SB), is deformed and a concave groove is formed.

[0028] Additionally, the frame area (9) represents an area that connects the multiple deformation areas (8). Also, the boundary between the deformation area (8) and the frame area (9) is represented by a ridge (10).

[0029] FIG. 1 illustrates an example in which a rectangular prism-shaped concave groove is provided on the original plane, the reference plane (1SB), as the deformation area (8). Therefore, when the deformation area (8) is viewed in the buckling direction (X) of the probe (1), its outer edge is a rectangle. Additionally, the frame area (9) corresponds to the portion of the plane between the deformation areas (8). The deformation areas (8) are arranged in a row with a spacing (P) in a predetermined direction (D1) with respect to the length direction (Z) of the probe (1), and this is arranged in multiple rows. The spacing (P) is the width of the frame area (9). In this embodiment 1, the direction (D1) is perpendicular to the length direction (Z) of the probe (1).

[0030] Here, when comparing a probe with a structure in which no deformation region (8) was provided with a probe with a structure in which a deformation region (8) was provided on the surface side and the back side, the following results were obtained. That is, the measurement result of the probe in which no deformation region (8) was provided on the surface was denoted as A, and the measurement result of the characteristic of the probe (1) in which a deformation region (8) was provided was denoted as B. After the tip portion (4) of the probe (1) contacted the electrode pad (5), and an additional load was applied to push the probe (1) against the electrode pad (5) (overdrive state), the relationship of the grooving pressure with respect to the amount of overdrive was as shown in FIG. 2. Also, the relationship of the stress with respect to the amount of overdrive was as shown in FIG. 3.

[0031] As shown in FIG. 2, the stylus pressure when the overdrive amount is 70 μm was 1.72 gf in the probe without a concave groove-shaped deformation region (8), whereas it was 1.19 gf in the probe (1) with a concave groove-shaped deformation region (8). Also, as shown in FIG. 3, the maximum stress when the overdrive amount is 110 μm was 670 MPa in the probe without a concave groove, whereas it was 891 MPa in the probe (1) with a concave groove-shaped deformation region (8), confirming that it is in a state where the mechanical properties of the probe can be satisfied.

[0032] The factors that increased the maximum stress were examined, and as a structural peculiarity, the surface area of ​​the probe (1) can be considered.

[0033] That is, the surface area is increased by providing a deformation area (8) in the shape of a rectangular prism's concave groove on the surface of the probe (1). In the case of a concave groove shape formed by sinking a square plane (i.e., showing a rectangular prism-shaped sinkhole), the surface area of ​​the bottom of the rectangular prism does not change in area because it is only the original surface that has been pressed down. In contrast, the area of ​​the inner wall surface portion created by the sinkhole is increased.

[0034] In FIG. 1, the dimensions of the concave grooves provided on the front and back surfaces of the probe are squares with sides of 20 μm, with the depth of the concave grooves on the surface side being 3.5 μm and the depth of the concave grooves on the back side being 2.5 μm. 429 concave grooves of this size are provided on the surface side and the back side, respectively. As a result, on the surface side, 120 μm 2 The area increases, and on the reverse side, 85,800㎛ 2 The surface area is increased. The surface area increases in proportion to the area of ​​the inner wall surface of the concave groove caused by the sinkhole. Here, since a large concave groove affects the thickness of the probe (1), it is desirable to increase the surface area by providing many small concave grooves. The surface area can be arbitrarily changed by designing the size and arrangement of the shape of this concave groove.

[0035] In addition, an analysis was conducted on what effects can be obtained through the deformation region (8). For probe A, which has no concave grooves (a smooth surface shape), probe B, which has square prism-shaped concave grooves arranged in a matrix shape, probe C, which has square prism-shaped concave grooves arranged in a zigzag pattern, and probe D, which has circular concave grooves arranged in a zigzag pattern, the results of calculating the probe's penetration pressure and maximum stress based on the Finite Element Method (FEM) are as shown in Table 1.

[0036] [Table 1]

[0037]

[0038] As shown in Table 1, for probe A, the locating force was 1.72 gf when the overdrive was 70 µm, and the maximum stress was 670 MPa when the overdrive was 110 µm. In contrast, under the same conditions, probe B had a locating force of 1.19 gf and a maximum stress of 891 MPa, probe C had a locating force of 1.18 gf and a maximum stress of 899 MPa, and probe D had a locating force of 1.18 gf and a maximum stress of 1164 MPa.

[0039] Additionally, for probes A, B, C, and D, a stress contour diagram (a contour diagram is a drawing showing the calculation results as contour lines) was created, and in probe A, the maximum stress was distributed almost uniformly at 670 MPa. In probe B, the stress was 74 MPa in the flat portion of the bottom surface of the deformation area (8) and 668 MPa in the frame area (9), and the maximum stress was 891 MPa. In probe C, the stress was 74 MPa in the flat portion of the bottom surface of the deformation area (8) and 674 MPa in the frame area (9), and the maximum stress was 899 MPa. In probe D, the stress was 97 MPa in the spherical portion of the bottom surface of the deformation area (8) and 873 MPa in the frame area (9), and the maximum stress was 1164 MPa.

[0040] From this result, it is estimated that when external force is applied to probes A, B, C, and D, the stress is concentrated on the ridge (10) at the boundary between the deformation area (8) and the frame area (9). Additionally, by making the bottom surface of the deformation area (8) a planar shape or a spherical shape, the stress is concentrated on the ridge (10) at the boundary between the deformation area (8) and the frame area (9).

[0041] This indicates that when the deformation area (8) is formed as a concave groove of a polygonal column, stress concentration occurs at each vertex of the polygon, so when an external force is applied, the stress is distributed to each vertex.

[0042] Therefore, if the deformation area (8) is formed by a cone-shaped or pyramid-shaped concave groove, the stress can be distributed not only at each vertex of the outer circumference but also at the vertices of the cone or pyramid.

[0043] In this case, stress concentration occurring on the ridge (10) at the boundary between the deformation area (8) and the frame area (9) can be reduced.

[0044] In addition, when the ridge (10) is a polygon, stress concentration occurs at each vertex, but as the number of edges increases, the stress concentration borne by each vertex individually decreases.

[0045] From this, it is estimated that when the periphery of the concave groove is circular, the stress is distributed along the periphery, and thus, as described with probe D, a structure that provides a spherical concave groove shape as a deformation region (8) becomes a structure that distributes stress the most, and thus becomes a probe with a high mechanical strength structure.

[0046] Next, the method for manufacturing the probe (1) shown in Fig. 1 will be explained.

[0047] There are three methods for manufacturing the probe (1). First, the first manufacturing method is a method of manufacturing by electric casting.

[0048] FIGS. 5A and FIGS. 5B are drawings showing the manufacturing process of a probe (1) by electro-casting.

[0049] A protruding shape corresponding to a concave groove shape formed by a conductive layer (42) is formed on the surface of a substrate (41), and then a deformation region (8) is formed by providing a metal layer (43) that serves as a component of the probe (1) on the surface of the conductive layer (42). The formation of this metal layer (43) can be performed, for example, by electrocasting. After that, the surface is processed to be flat, a mask is provided, and etching is performed to create the target probe. After that, the probe (1) is detached from the substrate (41) by removing the conductive layer (42).

[0050] The second manufacturing method is a press-based manufacturing method.

[0051] Figure 6 is a drawing showing the method of manufacturing a probe (1) by a press.

[0052] A metal plate (53) is pressed from both sides by a first mold (51) and a second mold (52), each having a surface corresponding to a concave groove shape, to form a deformation area (8) with a concave groove shape on the surface.

[0053] In this case, compared to forming a metal layer by electrocasting, it has the effect of shortening the production time.

[0054] In addition, although the structure in which the deformation area (8) is shaped like a concave groove in Embodiment 1 was described, the same effect can be obtained even if this shape is shaped like a protruding groove. The manufacturing method is simply to reverse each concave groove and protrusion.

[0055] Embodiment 2.

[0056] Hereinafter, a probe for a probe card according to Embodiment 2 will be described focusing on the parts that differ from Embodiment 1.

[0057] FIG. 7 is an enlarged view of a portion of a plane (1S) perpendicular to the buckling direction (X) of the probe (1), and is a drawing showing another example of the arrangement of the deformation area (8).

[0058] FIG. 8 is a drawing showing a surface that provides a deformation area (8) of the probe (1).

[0059] As in embodiment 1, the deformation area (8) is provided on at least one side of the plane (1S) perpendicular to the buckling direction (X) of the probe (1).

[0060] The deformation area (8) is arranged in a row with a spacing (P) in each predetermined direction (D2) with respect to the longitudinal direction (Z) of the probe (1), and this is arranged in multiple rows. Here, the direction (D2) is inclined with respect to the longitudinal direction (Z) of the probe (1).

[0061] Each deformation area (8) has a ridge (10) (outer edge) that is rectangular when viewed in the buckling direction (X). Therefore, the actual shape is a concave groove or protrusion in the shape of a square prism, a square pyramid, a truncated square, etc. Also, the two opposing sides of the square ridge (10) of the deformation area (8) are arranged to be parallel to a predetermined direction (D2), and the other two sides are arranged in a direction perpendicular to the direction (D2). The spacing between adjacent deformation areas (8) arranged in a direction perpendicular to the direction (D2) is also the same as the spacing (P). Furthermore, in this embodiment 2, the deformation areas (8) are arranged at equal intervals in a straight line along the length direction (Z) of the probe (1). Also, the shape of the deformation areas (8) of the truncated cone, truncated ellipse, and truncated polygon is such that the cross-sectional area increases towards the reference plane (1SB).

[0062] According to the probe for a probe card according to Embodiment 2, just like Embodiment 1, by regularly arranging deformation regions (8) of the same shape, regular distribution of stress is achieved, thereby providing a probe for a probe card with high mechanical strength.

[0063] Embodiment 3.

[0064] Hereinafter, a probe for a probe card according to Embodiment 3 will be described focusing on the parts that differ from Embodiment 1.

[0065] FIG. 9 is an enlarged view of a portion of a plane (1S) perpendicular to the buckling direction (X) of the probe (1), and is a drawing showing another example of the arrangement of the deformation area (8).

[0066] The deformation area (8) is arranged in a row with a spacing (P) in each predetermined direction (D1) with respect to the longitudinal direction (Z) of the probe (1), and this is arranged in a row. Here, the direction (D1) is perpendicular to the longitudinal direction (Z) of the probe (1).

[0067] Each deformation region (8) has a ridge (10) (outer edge) that is circular (a type of ellipse) when viewed in the buckling direction (X). Therefore, the actual shape is a concave groove or protrusion in the shape of a cylinder, cone, frustum of a cone, sphere, etc. Also, the spacing between adjacent deformation regions (8) in the longitudinal direction (Z) of the probe (1) is the same as the spacing (P) above.

[0068] According to the probe for a probe card according to Embodiment 3, just like Embodiments 1 and 2, by regularly arranging deformation regions (8) of the same shape, regular distribution of stress is achieved, thereby providing a probe for a probe card with high mechanical strength.

[0069] Embodiment 4.

[0070] Hereinafter, a probe for a probe card according to Embodiment 4 will be described focusing on the parts that differ from Embodiment 2.

[0071] FIG. 10 is an enlarged view of a portion of a plane (1S) perpendicular to the buckling direction (X) of the probe (1), and is a drawing showing another example of a deformation area (8).

[0072] As in embodiment 2, the deformation area (8) is provided on at least one side of the plane (1S) perpendicular to the buckling direction (X).

[0073] The deformation area (8) is arranged in a row with a spacing (P) in a predetermined direction (D2) with respect to the longitudinal direction (Z) of the probe (1), and this is arranged in a row. Here, the direction (D2) is inclined with respect to the longitudinal direction (Z) of the probe (1).

[0074] Each deformation area (8) has a ridge (10) (outer edge) that is rectangular when viewed in the buckling direction (X). Therefore, the actual shape is a concave groove or protrusion in the shape of a square prism, a square pyramid, a truncated square pyramid, etc. Also, the two opposing sides of the square ridge (10) (outer edge) of the deformation area (8) are arranged so that they are parallel to a predetermined direction (D2) and the other two sides are arranged perpendicular to the direction (D2). The spacing between adjacent deformation areas (8) in the direction perpendicular to the direction (D2) is also the same as the spacing (P). The difference from Embodiment 2 is that in Embodiment 2, the deformation areas (8) were arranged at equal intervals and straight in the longitudinal direction (Z) of the probe (1), but in this Embodiment 4, the deformation areas (8) are not arranged straight in the longitudinal direction (Z) of the probe (1).

[0075] As shown in FIG. 10, the first column (L1), the second column (L2), the third column (L3), and the fourth column (L4) each consist of four (actually more) deformation regions, but the deformation regions (8) of the first column (L1) and the deformation regions (8) of the second column (L2) are arranged staggered along the direction (D2). The same applies to each deformation region of the second column (L2) and the third column (L3). And the center (S) of all deformation regions (8) of the first column (L1) is not aligned straight in the longitudinal direction (Z) of the probe (1) with the center (S) of any deformation region (8) of the second column (L2).

[0076] When the deformation regions (8) are arranged in this manner, the side of the Nth deformation region (8) that is opposite to the ridge (10) of the N+1th deformation region (8), which is one side constituting the ridge (10) of the second deformation region (8) from the Nth leading edge, is parallel to and opposite to each side constituting the ridge (10) of the two deformation regions (8) of the N+1th. That is, the corner portions (K) of the two deformation regions (8) are close together and become adjacent to each other. In addition, the spacing between adjacent deformation regions (8) is all the same as in Embodiment 2.

[0077] According to the probe for a probe card of Embodiment 4, the corners (K) of the deformation region (8) where stress is concentrated are located in close proximity to each other in pairs. Compared to Embodiment 2, where four corners (K) were located in close proximity, the number of places where stress is concentrated can be increased by approximately twofold. By doing so, stress can be further dispersed, thereby providing a probe for a probe card with high mechanical strength.

[0078] Embodiment 5.

[0079] Hereinafter, a probe for a probe card according to Embodiment 5 will be described focusing on the parts that differ from Embodiment 3.

[0080] FIG. 11 is an enlarged view of a portion of a plane (1S) perpendicular to the buckling direction (X) of the probe (1), and is a drawing showing another example of the arrangement of the deformation area (8).

[0081] As in embodiment 3, the deformation area (8) is provided on at least one side of the plane (1S) perpendicular to the buckling direction (X).

[0082] The deformation area (8) is arranged in a row with a spacing (P) in a predetermined direction (D1) with respect to the longitudinal direction (Z) of the probe (1), and this is arranged in a row. Here, the direction (D1) is perpendicular to the longitudinal direction (Z) of the probe (1).

[0083] Each deformation area (8) has a circular ridge (10) (outer edge) when viewed in the buckling direction (X). Therefore, the actual shape is a concave groove or protrusion in the shape of a cylinder, cone, frustum, etc. And the spacing between adjacent deformation areas (8) is all the same as the spacing (P) above. The difference from Embodiment 3 is that in Embodiment 3, the centers of the deformation areas (8) were arranged at equal intervals and straight in the longitudinal direction (Z) of the probe (1), but in this Embodiment 4, the deformation areas (8) are not arranged straight in the longitudinal direction (Z) of the probe (1).

[0084] As shown in FIG. 11, the first column (L1) consists of two deformation regions (actually more), and the second column (L2) consists of three deformation regions (8). The third column (L3) consists of two deformation regions (8). Thus, the number of deformation regions (8) constituting adjacent columns differs. As shown in FIG. 11, the deformation regions (8) of the first column (L1) and the deformation regions (8) of the second column (L2) are arranged alternately along the direction (D1). The same applies to each deformation region of the second column (L2) and the third column (L3). Furthermore, the spacing between adjacent deformation regions (8) is the same as in Embodiment 3, but as can be seen by comparing FIG. 9 and FIG. 11, the present Embodiment 5 can arrange deformation regions (8) at a high density over the same area.

[0085] FIG. 12 is a drawing showing a modified example of Embodiment 5. The deformation area (8) may have an elliptical ridge (10) (outer edge) when viewed in the buckling direction (X).

[0086] According to the probe for a probe card according to embodiment 5, the deformation area (8) can be arranged at a high density, thereby further dispersing the stress and providing a probe for a probe card with high mechanical strength.

[0087] Embodiment 6.

[0088] Hereinafter, a probe for a probe card according to Embodiment 6 will be described focusing on the parts that differ from Embodiments 1 to 5.

[0089] FIG. 13 is an enlarged view of a portion of a plane (1S) perpendicular to the buckling direction (X) of the probe (1), and is a drawing showing another example of the arrangement of the deformation area (8).

[0090] The deformation area (8) is arranged in a row with a spacing (P) in each predetermined direction (D2) with respect to the longitudinal direction (Z) of the probe (1), and this is arranged in a row. Here, the direction (D2) is inclined with respect to the longitudinal direction (Z) of the probe (1).

[0091] In this example, the deformation area (8) of each column has a rectangular ridge (10). Also, the center (S) of the deformation area (8) of each column is also aligned along the length direction (Z) of the probe (1), but there are no more than two adjacent corners (K). In this example, the same effect as in Embodiment 4 is achieved.

[0092] Embodiment 7.

[0093] Hereinafter, a probe for a probe card according to Embodiment 7 will be described focusing on the parts that differ from Embodiments 1 to 6.

[0094] FIG. 14 is an enlarged view of the main part of the plane (1S) perpendicular to the buckling direction (X) of the probe (1) having a concave groove in the shape of a triangular frustum.

[0095] The deformation area (8) is arranged in a row with a spacing (P) in a predetermined direction (D1) with respect to the longitudinal direction (Z) of the probe (1), and this is arranged in a row. Here, the direction (D1) is perpendicular to the longitudinal direction (Z) of the probe (1).

[0096] The deformation area (8) constituting the first column (L1) and the deformation area (8) constituting the second column (L2) are arranged in an inverted manner in the vertical direction of the ground surface of FIG. 14. Additionally, the deformation area (8) is concavely indented in the shape of a truncated triangle from the reference plane (1SB).

[0097] According to the probe for a probe card according to embodiment 7, the deformation area (8) can be arranged at a high density, thereby further dispersing the stress and providing a probe for a probe card with high mechanical strength.

[0098] In addition, the strength of the frame area (9) can be reinforced.

[0099] Embodiment 8.

[0100] FIG. 15a is an enlarged view of a key part of a probe having a truncated cone-shaped protrusion in addition to a truncated cone-shaped concave groove.

[0101] Fig. 15b is a cross-sectional view of BB of Fig. 15a.

[0102] As shown in FIG. 15a and FIG. 15b, the reference plane (1SB) of the probe (1) has a structure in which a first deformation area (91), which is a truncated cone-shaped concave groove of a first diameter of a large diameter, and a second deformation area (92), which is a protruding cone-shaped truncated cone-shaped protrusion of a second diameter of a small diameter, are provided on the reference plane (1SB).

[0103] On the surface of this probe (1), a first deformation region (91) is arranged in a zigzag shape, and a second deformation region (92) is disposed in the space between the first deformation regions (91). By the arrangement of the first deformation region (91) and the second deformation region (92), stress is uniformly distributed, resulting in a probe with a structure of high mechanical strength. In this way, the deformation region may have a shape protruding from the reference plane (1SB), or it may be mixed with a concave groove shape.

[0104] Embodiment 9.

[0105] FIG. 16 shows a partial cross-sectional shape of the probe (1) of embodiment 10. As shown in FIG. 16, in this embodiment 9, a coating layer (13) is provided so that foreign matter does not adhere to the surface of the metal plate of the probe (1) shown in embodiments 1 to 8. In addition, even if foreign matter adheres, the surface of the metal plate is covered smoothly so that it can be easily removed. With this configuration, if the probe has a deformation area with a concave groove shape or a protruding shape on the surface of the metal plate, the problem of foreign matter adhesion can be solved by providing a coating layer in the same way.

[0106] As for the material of the coating layer (13), a resin layer that does not hinder the deformation of the metal plate is preferred. In particular, in embodiments 1 to 5, since a plurality of deformation regions (8) with a concave or protruding shape are provided on the surface, there is a concern about foreign matter adhering; therefore, a coating layer (13) for smoothing the surface is effective to eliminate such concern. By having a plurality of deformation regions (8) with a concave or protruding shape and a frame region (9) on the surface of a conductor and providing a coating layer (13) on the surface, a probe (1) with high mechanical strength and no foreign matter adhering can be obtained. In addition, as a material other than resin, it is acceptable to cover it with a member made of a material different from the material of the structure of the probe (1).

[0107] Although the present invention describes various exemplary embodiments and examples, the various features, modes and functions described in one or more embodiments are not limited to the application of a specific embodiment but can be applied to the embodiments alone or in various combinations.

[0108] Accordingly, countless variations not exemplified herein are conceived within the scope of the technology disclosed herein. For example, this includes cases where at least one component is modified, added, or omitted, and furthermore, cases where at least one component is extracted and combined with components of other embodiments. Explanation of the symbols

[0109] 1 : Probe 1SB : Reference plane 10 : Ridge 101 : Area expansion pattern region 102: Stress concentration zone 13: Cover layer 2 : 1st Guide Edition 3 : 2nd Guide Edition 4 : Tip section 41 : Substrate 42: Conductive layer 43: Metal layer 5 : Electrode pad 51 : First mold 52: Second mold 53: Metal plate 6 : Rear section 7 : Central section 8: Deformation Zone 9: Frame Zone 91: 1st deformation zone 92: 2nd deformation zone 1S : Surface X : Buckling direction L1: Column 1 L2: Column 2 L3: Column 3 L4: Column 4 K: Corner P: Spacing D1, D2: Predetermined directions

Claims

Claim 1 A probe for a probe card, wherein the probe is a vertical probe that buckles in a direction perpendicular to the longitudinal direction of a metal plate of a conductive member, and has a plurality of spaced deformation regions arranged on a reference plane included in a plate plane perpendicular to the buckling direction of the metal plate, the deformation regions having an outer edge that is circular, elliptical, or polygonal, and also having a concave groove shape or a protruding shape, and a frame region provided at the boundary of the plurality of deformation regions adjacent to each other, wherein the plurality of deformation regions are arranged in a spaced row in a predetermined direction with respect to the longitudinal direction of the probe, and the row is arranged in a spaced row, and the Nth plurality of deformation regions and the N+1th plurality of deformation regions are arranged staggered along the predetermined direction. Claim 2 A probe for a probe card according to claim 1, wherein the predetermined direction is an inclined direction with respect to the length direction of the probe. Claim 3 A probe for a probe card according to claim 1, wherein the predetermined direction is a direction perpendicular to the length direction of the probe. Claim 4 A probe for a probe card according to claim 1, wherein the deformation region is any one of a polygonal prism shape, a polygonal pyramid shape, a cylinder shape, an elliptical cylinder shape, a cone shape or an elliptical cone shape, or a truncated polygonal pyramid shape, a truncated cone shape, or a truncated elliptical pyramid shape in which the cross-sectional area increases toward the reference plane. Claim 5 A probe for a probe card, wherein, in any one of claims 1 to 4, the deformation region is covered with a member of a material different from the material of the structure of the probe. Claim 6 delete Claim 7 delete

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