Strong transaction card

Abstract

The transaction card may be manufactured from rigid materials, such as glass, stone, or ceramics. The transaction card may have a first rigid layer having a first outer surface and a first inner surface, and has a pocket within the first outer surface of the first rigid layer. The transaction card may have a second rigid layer having a second outer surface and a second inner surface. A binding layer may be located between the first rigid layer and the second rigid layer and may attach the first rigid layer to the second rigid layer. An integrated circuit chip may be attached within the pocket of the first rigid layer. A rim may extend from the first outer surface of the first rigid layer to the second outer surface of the second rigid layer around the first edge of the first rigid layer and the second edge of the second rigid layer.

Description

Technology Field

[0001] Cross-reference regarding related applications

[0002] This application claims priority and the benefit thereof to co-pending U.S. patent application No. 17 / 494,408, filed October 5, 2021, with the title of the invention “RIGID TRANSACTION CARD”, which is incorporated by reference as set forth herein in its entirety. Background Technology

[0003] Transaction cards are used for payments in a wide variety of situations. For transaction accounts targeting the upscale or luxury markets, companies may offer transaction cards manufactured from unconventional materials or featuring unconventional designs. This allows for marketing and promoting transaction accounts as premier or luxury services. Brief explanation of the drawing

[0004] Many aspects of the present disclosure may be better understood by referring to the following drawings. The components of the drawings are not necessarily drawn to scale, but instead focus on clearly illustrating the principles of the present disclosure. Furthermore, in the drawings, similar reference numbers designate corresponding parts across several drawings. FIG. 1 illustrates an example of an assembled transaction card according to various embodiments of the present disclosure. FIG. 2 illustrates a cross-sectional view of another transaction card according to various embodiments of the present disclosure. Figure 3 shows an exploded view of one exemplary arrangement of transaction cards. Figure 4 illustrates an exploded view of an exemplary array of transaction cards. Figure 5 shows an exploded view of one exemplary array of transaction cards. Figure 6 shows an exploded view of one exemplary arrangement of transaction cards. FIG. 7 is a flowchart providing an example of a process for manufacturing a transaction card according to various embodiments of the present disclosure. FIGS. 8A and FIGS. 8B illustrate examples of metal sheets used in the manufacturing process described by the flowchart of FIG. 7. FIGS. 9a through 9j provide graphic examples of individual parts of the manufacturing process described by the flowchart of FIG. 7 using the metal sheets exemplified in FIGS. 8a and 8b. Specific details for implementing the invention

[0005] Various approaches for creating a trading card using multiple layers of rigid materials are disclosed. The trading card may be assembled from multiple layers of rigid materials. These layers may be bound together using a binder or other binding material (e.g., adhesive, cement, or other adhesive). The edges of the trading card may be surrounded by a rim, such as a metal band. The binder material and the metal band may provide structural integrity in the event that one or more of the layers of rigid materials break, crack, or split. The rim or metal band may also protect the layers of rigid materials from breaking, cracking, or splitting in response to impact (e.g., when the trading card falls onto a hard surface and strikes its edges).

[0006] In the following discussion, a general description of a transaction card and a method for manufacturing the same is provided. While the following discussion provides exemplary examples of various embodiments of the present disclosure, the use of the following exemplary examples does not exclude other embodiments consistent with the disclosed principles.

[0007] FIG. 1 illustrates an example of an assembled transaction card (100) according to various embodiments of the present disclosure. In this example, the transaction card (100) is composed of several transparent layers, allowing it to be seen through the body of the transaction card (100). The transaction card (100) may have a rim (103) along the edge of the transaction card (100), which can help prevent the transaction card from cracking or breaking if the transaction card is dropped or falls onto a hard surface. The rim (103) may also provide additional structural integrity to the transaction card (100) by holding the layers of the transaction card (100) together. The transaction card (100) may also include an antenna (106), a processing chip (109), and / or a magnetic stripe (113).

[0008] The antenna (106) may be used to provide wireless communications between the processing chip (109) and the contactless payment terminal. The antenna (106) may also be used to provide power from the payment terminal to the processing chip (109). In some embodiments, the antenna (106) may be physically coupled to the processing chip (109), whereas in other embodiments, the antenna (106) may be inductively coupled to the processing chip (109). Although shown separately from the processing chip (109), in some embodiments, the antenna may be included in or integrated within the processing chip (109) to form a single unit.

[0009] The processing chip (109) may represent any integrated circuit chip that can be used to secure or process payments using the transaction card (100). Examples of processing chips (109) include integrated circuit chips that implement various versions of the Europay, Mastercard, and VISA (EMV) standards for smart payment cards. In some embodiments, the processing chip (109) is coupled to an antenna (106) to provide contactless payments using near-field communication (NFC), ultrawide band (UWB), or similar low-power, short-range wireless communication standards. However, in other embodiments, the processing chip (109) may include an integrated antenna (106).

[0010] The magnetic stripe (113) may include any band of magnetic material capable of storing data. The data stored in the magnetic stripe (113) may include information such as the account number of a payment account associated with a transaction card (100), the validity period of the payment account, a card verification value (CVV) or card verification code (CSC), a service code, etc.

[0011] FIG. 2 illustrates a cross-sectional view of a transaction card (100) according to various embodiments of the present disclosure. In this cross-sectional view, a plurality of layers are illustrated. These layers may include an upper rigid layer (203) and a lower rigid layer (206). A binding layer (209) is seated between the upper rigid layer (203) and the lower rigid layer (206). A processing chip (109) is seated within a pocket (213) on the outer surface of the upper rigid layer (203), so that the surface of the processing chip (109) is at the same height as the surface of the upper rigid layer (203). The processing chip (109) may be secured within the pocket (213) using any suitable adhesive. An antenna (106) and a magnetic stripe (113) may be seated within the binding layer (209) between the upper rigid layer (203) and the lower rigid layer (206).

[0012] The upper rigid layer (203) and the lower rigid layer (206) may be formed from a number of rigid materials. For example, the upper rigid layer (203) or the lower rigid layer (206) may be formed from chemically strengthened glass having increased strength as a result of a post-production process. Examples of chemically strengthened glasses include glasses marketed under the GORILLA GLASS® brand, alkali-aluminosilicate glasses, etc. . The use of chemically strengthened glasses allows transparent or translucent trading cards (100) to be manufactured when combined with a transparent translucent binding layer (209). As another example, the upper rigid layer (203) or the lower rigid layer (206) may be formed from a ceramic material comprising transparent ceramic materials such as aluminum oxynitride, also known as transparent aluminum. In some embodiments, the upper rigid layer (203) or the lower rigid layer (206) may be formed from stone, such as black onyx, red onyx, or other stones.

[0013] The binding layer (209) is a layer comprising a binding medium that binds the upper rigid layer (203) to the lower rigid layer (206). Any suitable binding medium may be used for the binding layer (209). Examples of binding media include various types of adhesives, such as glues, laminates, cements, etc. Some binding media may be preferred for specific configurations. For example, if a transparent or translucent transaction card (100) is manufactured using transparent or translucent materials for the upper rigid layer (203) and the lower rigid layer (206), then a transparent or translucent adhesive, adhesive laminate, or other adhesive or binding media may be used. If opaque materials are used for the upper rigid layer (203) or the lower rigid layer (206), then other binding media may be used for the binding layer (209).

[0014] The positioning of the binding layer (209) between the upper rigid layer (203) and the lower rigid layer (206) provides additional structural integrity to the transaction card (100). If the transaction card (100) is constructed from a single rigid layer and the single rigid layer cracks, breaks, or splits, then the transaction card (100) may be separated into multiple pieces. If this occurs in a person's hand, wallet, or pocket, such separation may pose a safety risk by cutting the individual. Placing the binding layer (209) between the upper rigid layer (203) and the lower rigid layer (206) allows the card to remain in its whole state even if the upper rigid layer (203) or the lower rigid layer (206) is damaged. For example, rather than breaking, the upper rigid layer (203) or the lower rigid layer (206) may crack but remain attached to the binding layer (209).

[0015] As illustrated in the cross-sectional view of FIG. 2, the rim (103) extends from the outer surface of the upper rigid layer (203) around the edge of the transaction card (100) to the outer surface of the lower rigid layer (206). Consequently, the rim (103) acts as a clamp holding the upper rigid layer (203) and the lower rigid layer (206), preventing the upper rigid layer (203) and the lower rigid layer (206) from separating from the transaction card (100) in the event of failure of the binding medium of the binding layer (209), which may occur due to wear and tear over the life of the transaction card (100). Furthermore, the rim (103) acts as a shock absorber in the event that the transaction card (100) falls or otherwise drops and strikes a surface with its edge, thereby preventing the upper rigid layer (203) or the lower rigid layer (206) from breaking or cracking due to impact.

[0016] FIG. 3 illustrates an exploded view of one exemplary arrangement of a transaction card (100). Starting from the top of FIG. 3 and proceeding to the bottom, the processing chip (109) is illustrated as being placed within a pocket (213) on the outer surface of the upper rigid layer (203). The processing chip (109) may be secured within the pocket (213) using any suitable adhesive. An antenna (106) may be placed below the upper rigid layer (203). The antenna (106) may include a coil below the processing chip (109) so that the antenna (106) is inductively coupled to the processing chip (109). A binding layer (209) is located below the upper rigid layer (203) and the antenna (106). A magnetic stripe (113) may be placed below the binding layer (209). A lower rigid layer (206) is located at the bottom. The upper rigid layer (203) and the lower rigid layer (206) are surrounded by a rim (103). Although the rim (103) is depicted in two parts for exemplary purposes, it is understood that the rim (103) is a single piece as shown in the cross-sectional view of FIG. 2.

[0017] FIG. 4 illustrates an exploded view of another exemplary arrangement of a transaction card (100). Starting from the top and proceeding to the bottom of FIG. 4, a processing chip (109) is depicted as being placed within a pocket (213) on the outer surface of an upper rigid layer (203). The processing chip (109) may be secured within the pocket (213) using any suitable adhesive. The bottom of the pocket (213) of the upper rigid layer (203) may have a plurality of holes (403). An antenna (106) may be placed below the upper rigid layer (203). The antenna (106) may be physically coupled to the processing chip (109) by passing a wire through individual holes among the holes (403) located at the bottom of the pocket. A binding layer (209) is located below the upper rigid layer (203) and the antenna (106). A magnetic stripe (113) may be placed below the binding layer (209). There is a lower rigid layer (206) at the bottom. Surrounding the upper rigid layer (203) and the lower rigid layer (206) is a rim (103). Although the rim (103) is depicted in two parts for exemplary purposes, it is understood that the rim (103) is a single piece as shown in the cross-sectional view of FIG. 2.

[0018] FIG. 5 illustrates an exploded view of another exemplary arrangement of a transaction card (100). Starting from the top of FIG. 5 and proceeding to the bottom, the processing chip (109) is depicted as being placed within a pocket (213) on the outer surface of the upper rigid layer (203). The processing chip (109) may be secured within the pocket (213) using any suitable adhesive. In contrast to the examples shown in FIG. 3 and FIG. 4, the antenna is not placed below the upper rigid layer (203). In examples such as those shown in FIG. 5, the processing chip (109) may include an integrated antenna (106). The binding layer (209) is located below the upper rigid layer (203) and the antenna (106). The magnetic stripe (113) may be placed below the binding layer (209). At the bottom is the lower rigid layer (206). The upper rigid layer (203) and the lower rigid layer (206) are surrounded by a rim (103). Although the rim (103) is depicted in two parts for exemplary purposes, it is understood that the rim (103) is a single piece as shown in the cross-sectional view of FIG. 2.

[0019] FIG. 6 illustrates an exploded view of another exemplary arrangement of a transaction card (100). Starting from the top of FIG. 6 and proceeding to the bottom, the processing chip (109) is depicted as being placed within a pocket (213) on the outer surface of the upper rigid layer (203). The processing chip (109) can be secured within the pocket (213) using any suitable adhesive. The bottom of the pocket (213) of the upper rigid layer (203) may have a plurality of holes (403). An antenna (106) may be placed below the upper rigid layer (203). The antenna (106) may be physically coupled to the processing chip (109) by passing a wire through individual holes among the holes (403) located at the bottom of the pocket. A binding layer (209) is located below the upper rigid layer (203) and the antenna (106). Below the binding layer (209) is a lower rigid layer (206). The magnetic stripe (113) may be placed on the outer surface of the lower rigid layer (206). In some embodiments, the outer surface of the lower rigid layer (206) may include a channel (603). In these embodiments, the magnetic stripe (113) may be present within the channel (603) such that the surface of the magnetic stripe (113) is at the same height as the outer surface of the lower rigid layer (206). Surrounding the upper rigid layer (203) and the lower rigid layer (206) is a rim (103). Although the rim (103) is depicted in two parts for exemplary purposes, it is understood that the rim (103) is a single piece as shown in the cross-sectional view of FIG. 2.

[0020] FIGS. 3 through 6 illustrate examples of embodiments according to various embodiments of the present disclosure, but other arrangements are included within the scope of the present disclosure. For example, the embodiments illustrated in FIG. 3 or FIG. 5 may be modified to place a magnetic stripe (113) on the outside of the transaction card (100) instead of between the upper rigid layer (203) and the lower rigid layer (206). As another example, the relative positions of the magnetic stripe (113), the antenna (106), and the binding layer (209) between the upper rigid layer (203) and the lower rigid layer (206) may be switched without affecting the function of the various embodiments of the present disclosure.

[0021] Next, referring to FIG. 7, a flowchart providing an example of a process for manufacturing a transaction card (100) according to various embodiments of the present disclosure is illustrated. While the flowchart of FIG. 7 illustrates an exemplary sequence of actions, it is understood that the sequence of actions may differ from that illustrated. For example, actions illustrated by two or more blocks illustrated in succession may be performed simultaneously or partially simultaneously. As another example, actions illustrated by two or more blocks may be performed in an alternative sequence compared to that illustrated. Additionally, in some embodiments, one or more of the blocks illustrated in the flowchart of FIG. 7 may be skipped or omitted. It is understood that all such variations are within the scope of the present disclosure.

[0022] Starting from block (703), the lower rigid layer (206) of the transaction card (100) may be placed within a first recess of the first metal sheet. The metal sheet may have multiple recesses according to various embodiments of the present disclosure, thereby allowing the transaction card (100) to be mass-produced on an assembly line.

[0023] Next, in block (706), the magnetic stripe (113) may be placed on the top of the lower rigid layer (206) of the transaction card (100). In some embodiments, the magnetic stripe (113) may be attached to the lower rigid layer (206) using an adhesive. In other embodiments, the magnetic stripe (113) may have an adhesive backing so that the magnetic stripe (113) self-attaches when placed in contact with the lower rigid layer (206). In some embodiments, the placement of the magnetic stripe (113) may be omitted (e.g., in the case of embodiments of the transaction card (100) that are not manufactured to include the magnetic stripe (113)).

[0024] Next, in block (709), the binding layer (209) may be placed on top of the lower rigid layer (206). The binding medium forming the binding layer (209) may be deposited using any number of approaches. For example, an adhesive or similar adhesive may be sprayed onto the lower rigid layer (206). As another example, an adhesive sheet may be placed on top of the lower rigid layer (206).

[0025] When moving onto block (713), the antenna (106) can be placed on the top of the binding layer (209). This step may be omitted in such embodiments using a processing chip (109) that includes the integrated antenna (106). Furthermore, the placement of the antenna on block (713) may occur early. For example, the magnetic stripe (113) and the antenna (106) may be placed between the lower rigid layer (206) and the binding layer (209).

[0026] Proceeding to block (716), the upper rigid layer (203) may be placed on top of the antenna (106) and / or the binding layer (209). For example, if the antenna (109) is not placed on top of the binding layer (209) in block (713) (e.g., because a processing chip (109) having an integrated antenna (106) was being used), then the upper rigid layer (203) may be placed directly on top of the binding layer (209). As another example, if the antenna (109) is placed below the binding layer (209), then the upper rigid layer (203) may be placed directly on top of the binding layer (209). However, if the antenna (109) is previously placed on the top of the binding layer (209), then, some parts of the upper rigid layer (203) are in contact with the antenna (106), while other parts of the upper rigid layer (203) are in contact with the binding layer (209), causing the upper rigid layer (203) to be placed on the top of both the antenna (106) and the binding layer (209).

[0027] Next, in block (719), the processing chip (109) may be attached to the upper rigid layer (203). For example, an adhesive may be deposited in a pocket (213) of the upper rigid layer (203). Then, the processing chip (109) may be placed in the pocket (213). Then, the adhesive within the pocket (213) may cause the processing chip (109) to be attached to the upper rigid layer (203). In some embodiments, the placement of the processing chip (109) may occur before the fusion of the first metal sheet and the second metal sheet to improve the adhesion of the processing chip (109) to the upper rigid layer (203) or to cause the processing chip (109) to be attached to the upper rigid layer (203). However, in other embodiments, attaching the processing chip (109) to the upper rigid layer (203) may occur after the first metal sheet is fused to the second metal sheet.

[0028] Next, in block (723), a second metal sheet may be placed on top of the first metal sheet, and the second metal sheet has a second recess for each of the first recesses of the first metal sheet. As will be discussed later, the first metal sheet and the second metal sheet may be fused together to form a rim (103) of the transaction card (100) that surrounds all layers of the transaction card (100).

[0029] Next, referring to block (726), the first metal sheet and the second metal sheet may be fused together to form a fused metal sheet. For example, heat and pressure may be used to fuse the two metal sheets together. The heat and pressure used to fuse the two metal sheets together may also cause the binding medium of the binding layer (209) to attach the upper rigid layer (203) to the lower rigid layer (206) in such embodiments using a heat or pressure-activated binding medium.

[0030] Next, in block (729), the fused metal sheet can be cut along the edges of the recess to remove the transaction card (100), leaving a rim (103) formed from fusing the metal sheets in block (726). The cutting can be performed using a wide variety of tools, including die cutters, laser cutters, rotary cutters, etc. Once the transaction card (100) is cut from the metal sheet, it can be engraved or embossed as desired by the issuer of the transaction card (100).

[0031] FIG. 8a illustrates an example of a metal sheet (800) used in a manufacturing process described by the flowchart of FIG. 7. As illustrated, the metal sheet (800) may include one or more recesses (803). Each recess (803) corresponds to the shape and dimensions of the upper rigid layer (203) and / or lower rigid layer (206) of the transaction card (100). Each recess (803) also has a lip (806) extending across the outer surface of the upper rigid layer (203) and / or lower rigid layer (206) when the upper rigid layer (203) or lower rigid layer (206) is placed within the recess (803). The bottom of the recess (803) may form a hollow cavity or an opening.

[0032] FIG. 8b illustrates a second view of a metal sheet (800) used in a manufacturing process described by the flowchart of FIG. 7. Here, a partial cross-sectional view illustrating a recess (803) of the metal sheet (800) is illustrated according to various embodiments of the present disclosure. As illustrated, the recess (803) corresponds to the shape and dimensions of the upper rigid layer (203) and / or lower rigid layer (206) of the transaction card (100). The recess (803) also has a lip (806) extending across the outer surface of the upper rigid layer (203) and / or lower rigid layer (206) when the upper rigid layer (203) or lower rigid layer (206) is placed within the recess (803). The bottom of the recess (803) may form a hollow cavity or an opening.

[0033] FIGS. 9a through 9j provide graphic examples of individual parts of a manufacturing process described by the flowchart of FIG. 7 using metal sheets (800) exemplified in FIGS. 8a and 8b to produce a transaction card (100).

[0034] FIG. 9a illustrates a first metal sheet (800a) placed on a conveyor belt (900) of an assembly line in an exemplary embodiment of the present disclosure. As illustrated, an industrial robot or machine can place the metal sheet (800a) on the conveyor belt (900) of the assembly line.

[0035] FIG. 9b illustrates an exemplary approach for placing lower rigid layers (206) within a first metal sheet (800), as previously described in block (703) of FIG. 7. As illustrated, an industrial robot or machine can place individual lower rigid layers (206) in each recess (803) of the first metal sheet (800).

[0036] FIG. 9c illustrates an exemplary approach for placing magnetic stripes (113) on the top of a lower rigid layer (206), as previously described in block (706) of FIG. 7. As illustrated, each magnetic stripe (113) is placed individually by an industrial robot. However, other approaches, such as rollers, may also be used to apply the magnetic stripes (113).

[0037] FIG. 9d illustrates an exemplary approach for placing a binding layer (209) on top of a lower rigid layer (206) and a magnetic stripe (113), as previously described in block (709) of FIG. 7. For example, one or more drops of an adhesive or similar adhesive may be deposited by an industrial robot or machine, which will form the binding layer (209) as the adhesive or adhesive diffuses under pressure. As another example, an industrial robot or machine may be used to deposit individual sheets of a laminate, an adhesive laminate, or other adhesive.

[0038] FIG. 9e illustrates an exemplary approach for placing an antenna (106) on top of a binding layer (209), as previously described in block (713) of FIG. 7. As illustrated, an industrial robot or machine may place the antenna (106) on top of the binding layer (209).

[0039] FIG. 9f illustrates an exemplary approach for placing an upper rigid layer (203) on top of an antenna (106) and / or binding layer (209), as previously described in block (716) of FIG. 7. As illustrated, an industrial robot or machine may place individual upper rigid layers (206) on top of each antenna (106) and / or binding layer (209).

[0040] FIG. 9g illustrates an example of placing a processing chip (109) within a pocket (213) of each upper rigid layer (203), as previously described in block (719) of FIG. 7. As illustrated herein, each processing chip (109) is placed directly into the pocket (213) by an industrial robot or machine without first depositing an adhesive within the pocket (213). This can be done if the processing chip (109) is self-adhesive (e.g., because the processing chip (109) has an adhesive on its back surface). Additional stations along the conveyor belt (900) may be required if the adhesive must first be deposited within the pocket (213).

[0041] FIG. 9h illustrates an example of placing a second metal sheet (800b) on top of a first metal sheet (800a), as previously described in block (723) of FIG. 7. As illustrated, an industrial robot or machine can place the second metal sheet (800b) on top of the first metal sheet (800a) of a conveyor belt (900) of an assembly line.

[0042] FIG. 9i illustrates an example of fusing a first metal sheet (800a) and a second metal sheet (800b) as previously described in block (726) of FIG. 7. As illustrated, a heat press (903) may be used to apply heat and / or pressure to the metal sheets (800), the upper rigid layer (203), and the lower rigid layer (206). This may cause the first metal sheet (800a) to fuse with the second metal sheet (800b). In some embodiments, this may also cause the binding medium of the binding layer (209) to attach the first metal sheet (800a) and the second metal sheet (800b).

[0043] FIG. 9j illustrates an example of cutting a molten metal sheet to remove individual transaction cards (100), as previously described in block (729) of FIG. 7. FIG. 9j illustrates the use of cutout dies, but other cutting tools may be used according to various embodiments of the present disclosure.

[0044] Declarative language, such as the phrase “at least one of X, Y, or Z,” is understood otherwise in the same context as it is generally used to indicate that an item, term, etc. may be X, Y, or Z, or any combination thereof (e.g., X; Y; Z; X or Y; X or Z; Y or Z; X, Y, or Z, etc.), unless otherwise specifically stated. Accordingly, such declarative language is not intended, and should not imply, that certain embodiments generally require the existence of at least one of X, at least one of Y, or at least one of Z, respectively.

[0045] Various embodiments of the present disclosure are described in the following clauses. While the following clauses describe some embodiments of the present disclosure, other embodiments of the present disclosure are also described above.

[0046] Claim 1 - a transaction card comprising: a first rigid layer having a first outer surface and a first inner surface - said first rigid layer comprises a pocket within the first outer surface of the first rigid layer -; a second rigid layer having a second outer surface and a second inner surface; a binding layer between the first rigid layer and the second rigid layer - said binding layer comprises a binding medium that attaches the first inner surface of the first rigid layer to the second inner surface of the second rigid layer -; an integrated circuit chip attached within the pocket of the first rigid layer; and a metal band extending from the first outer surface of the first rigid layer to the second outer surface of the second rigid layer around the first edge of the first rigid layer and the second edge of the second rigid layer.

[0047] Paragraph 2 - A transaction card according to Paragraph 1, further comprising a magnetic stripe attached to the second rigid layer and positioned between the first rigid layer and the second rigid layer.

[0048] Paragraph 3 - A transaction card according to Paragraph 1 or 2, further comprising an antenna positioned between the first rigid layer and the second rigid layer, wherein the antenna is inductively coupled to the integrated circuit chip.

[0049] Clause 4 - A transaction card according to any one of Clauses 1 to 3, further comprising an antenna positioned between the first rigid layer and the second rigid layer, wherein the antenna is connected to the integrated circuit chip through a contact pad.

[0050] Paragraph 5 - A transaction card in which, in any one of Paragraphs 1 to 4, the integrated circuit chip further comprises an antenna.

[0051] Clause 6 - A transaction card in any one of Clauses 1 to 5, wherein the first rigid layer and the second rigid layer comprise chemically strengthened glass.

[0052] Claim 7 - A method comprising: a step of placing a first rigid layer of a transaction card within a first recess of a first metal sheet; a step of placing a binding layer on top of the first rigid layer of the transaction card - the binding layer comprises a binding medium -; a step of placing a second rigid layer on top of the binding layer; a step of placing a second metal sheet on top of the first metal sheet; and a step of fusing the first metal sheet together with the second metal sheet to form a fused metal sheet.

[0053] A method according to claims 8-7, further comprising the step of placing an antenna between the first rigid layer and the second rigid layer.

[0054] A method according to claim 9 - 7 or 8, further comprising the step of attaching an integrated circuit chip within a pocket of the second rigid layer.

[0055] A method comprising, in any one of claims 10 - 7 to 9, further a step of cutting the fused metal sheet on the border of the second recess.

[0056] A method comprising, in any one of claims 11–7 to 10, further a step of attaching a magnetic stripe to the inner surface of the first rigid layer of the transaction card.

[0057] A method comprising, in any one of claims 12-7 to 11, further a step of attaching a magnetic stripe to the outer surface of the first rigid layer.

[0058] A method according to any one of claims 13-7 to 12, wherein the first rigid layer and the second rigid layer comprise chemically strengthened glass.

[0059] Claim 14 - A transaction card manufactured by a process comprising the following, wherein the process comprises: placing a first rigid layer of the transaction card within a first recess of a first metal sheet; placing a binding layer on top of the first rigid layer of the transaction card—the binding layer comprises a binding medium—; placing a second rigid layer on top of the binding layer; placing a second metal sheet on top of the first metal sheet; and fusing the first metal sheet together with the second metal sheet to form a fused metal sheet.

[0060] A transaction card manufactured by a process according to Clauses 15-14, further comprising placing an antenna between the first rigid layer and the second rigid layer.

[0061] A transaction card manufactured by a process according to claim 16 - 14 or 15, further comprising attaching an integrated circuit chip within a pocket of the second rigid layer.

[0062] A transaction card manufactured by a process comprising, in any one of claims 14 to 16, cutting the fused metal sheet on the border of the second recess.

[0063] A transaction card manufactured by a process comprising, in any one of claims 18 to 17, attaching a magnetic stripe to the inner surface of the first rigid layer of the transaction card.

[0064] A transaction card manufactured by a process comprising, in any one of claims 19-14 to 18, attaching a magnetic stripe to the outer surface of the first rigid layer.

[0065] A transaction card manufactured by a process, wherein, in any one of claims 20–14 to 19, the first rigid layer and the second rigid layer comprise chemically strengthened glass.

[0066] It should be emphasized that the foregoing embodiments of this disclosure are merely possible examples of embodiments described for the sake of a clear understanding of the principles of this disclosure. Many variations and modifications may be made to the foregoing embodiments without substantially departing from the spirit and principles of this disclosure. All such modifications and variations are intended to be incorporated herein within the scope of this disclosure and protected by the following claims.

Claims

Claim 1 A transaction card comprising: a first rigid layer having a first outer surface and a first inner surface, wherein the first rigid layer comprises a pocket within the first outer surface of the first rigid layer; a second rigid layer having a second outer surface and a second inner surface; a binding layer between the first rigid layer and the second rigid layer, wherein the binding layer comprises a binding medium that attaches the first inner surface of the first rigid layer to the second inner surface of the second rigid layer; an integrated circuit chip attached within the pocket of the first rigid layer; and a metal band extending from above the first outer surface of the first rigid layer to below the second outer surface of the second rigid layer along the first edge of the first rigid layer and the second edge of the second rigid layer. Claim 2 A transaction card according to claim 1, further comprising a magnetic stripe attached to the second rigid layer and positioned between the first rigid layer and the second rigid layer. Claim 3 A transaction card according to claim 1, further comprising an antenna positioned between the first rigid layer and the second rigid layer, wherein the antenna is inductively coupled to the integrated circuit chip. Claim 4 A transaction card according to claim 1, further comprising an antenna positioned between the first rigid layer and the second rigid layer, wherein the antenna is connected to the integrated circuit chip through a contact pad. Claim 5 In paragraph 1, the transaction card, wherein the integrated circuit chip further includes an antenna. Claim 6 A transaction card according to any one of claims 1 to 5, wherein the first rigid layer and the second rigid layer comprise chemically strengthened glass. Claim 7 A method comprising the steps of: placing a first rigid layer of a transaction card within a first recess of a first metal sheet, wherein the first recess includes a first lip extending above the first rigid layer; placing a binding layer on top of the first rigid layer of the transaction card, wherein the binding layer includes a binding medium; placing a second rigid layer on top of the binding layer; placing a second metal sheet on top of the first metal sheet, wherein the second metal sheet includes a second recess having a second lip extending above the second rigid layer; and fusing the first metal sheet together with the second metal sheet to form a fused metal sheet. Claim 8 A method according to claim 7, further comprising the step of placing an antenna between the first rigid layer and the second rigid layer. Claim 9 A method according to claim 7, further comprising the step of attaching an integrated circuit chip within a pocket of the second rigid layer. Claim 10 A method according to claim 7, further comprising the step of cutting the fused metal sheet on the border of the second recess. Claim 11 A method according to claim 7, further comprising the step of attaching a magnetic stripe to the inner surface of the first rigid layer of the transaction card. Claim 12 A method according to claim 7, further comprising the step of attaching magnetic stripes to the outer surface of the first rigid layer. Claim 13 A method according to any one of claims 7 to 12, wherein the first rigid layer and the second rigid layer comprise chemically strengthened glass. Claim 14 A transaction card manufactured by a process comprising the following, wherein the process comprises: placing a first rigid layer of the transaction card within a first recess of a first metal sheet, wherein the first recess comprises a first lip extending above the first rigid layer; placing a binding layer on top of the first rigid layer of the transaction card, wherein the binding layer comprises a binding medium; placing a second rigid layer on top of the binding layer; placing a second metal sheet on top of the first metal sheet, wherein the second metal sheet comprises a second recess having a second lip extending above the second rigid layer; and fusing the first metal sheet together with the second metal sheet to form a fused metal sheet. Claim 15 A transaction card manufactured by a process, further comprising, in paragraph 14, placing an antenna between the first rigid layer and the second rigid layer. Claim 16 A transaction card manufactured by a process according to claim 14 or 15, further comprising attaching an integrated circuit chip within a pocket of the second rigid layer. Claim 17 A transaction card manufactured by a process comprising, in paragraph 14, further cutting the fused metal sheet on the border of the second recess. Claim 18 A transaction card manufactured by a process according to claim 14, further comprising attaching a magnetic stripe to the inner surface of the first rigid layer of the transaction card. Claim 19 A transaction card manufactured by a process according to claim 14, further comprising attaching a magnetic stripe to the outer surface of the first rigid layer. Claim 20 A transaction card manufactured by a process wherein, in paragraph 14, the first rigid layer and the second rigid layer comprise chemically strengthened glass.

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