Manufacturing apparatus for bracket of semiconductor chip inspection machine

Abstract

A bracket manufacturing apparatus for a semiconductor chip inspection apparatus according to one embodiment of the present invention comprises: a fixed plate body formed by opening a fixed plate cavity in the shape of a bracket; a movable plate body formed by opening a movable plate cavity that forms a bracket cavity in the shape of a bracket together with the fixed plate cavity, and which is joined to the fixed plate body to injection mold the bracket; an insert pin provided to protrude from the movable plate body and into which an insert is inserted; an insert projection provided to protrude from the fixed plate body and which supports the insert inserted into the insert pin when the movable plate body is joined to the fixed plate body; and a jig in which the insert is received at a position corresponding to the insert pin and the insert is inserted into the insert pin.

Description

Technology Field

[0001] The present invention relates to a bracket manufacturing apparatus for a semiconductor chip inspection device capable of manufacturing a bracket for a semiconductor chip inspection device by integrally injection molding an insert into an insert groove. Background Technology

[0002] In the back-end process, after the wafer is diced and separated into individual chips, a chip-level inspection is conducted. During this inspection, defective chips are sorted out; only good chips are transferred to the packaging process, while the defective chips are separated.

[0003] The inspection process takes place in a semiconductor chip inspection device, where diced individual chips are transferred to a bracket that accommodates the individual chips using pick and place equipment.

[0004] Each semiconductor chip is individually accommodated in a bracket for a semiconductor chip inspection device, and the semiconductor chip inspection device performs appearance inspection, electrical characteristic and functional inspection, and burn-in inspection on each semiconductor chip accommodated in the bracket.

[0005] A bracket for a semiconductor chip inspection device, in which individual chips are accommodated, has a chip coupling groove formed by opening for accommodating individual chips, and various grooves and insert grooves for coupling with the semiconductor chip inspection device are formed by opening.

[0006] At this time, an insert with a screw thread machined on its inner surface is inserted into the insert groove, and the insert and the semiconductor chip inspection device are screw-coupled so that the bracket is firmly fixed to the semiconductor chip inspection device.

[0007] When manufacturing brackets for such semiconductor chip inspection devices, if insert grooves are individually machined and inserts are inserted after injection molding the bracket, machining errors regarding the diameter, straightness, and depth of the insert grooves may occur. Furthermore, since the assembly of inserts into each groove is performed manually, productivity decreases and the defect rate increases.

[0008] Therefore, in order to reduce productivity decline and defect rates, there is a need to develop a semiconductor chip inspection device bracket manufacturing machine capable of manufacturing the bracket by integrally injection molding the insert into the insert groove. Prior art literature

[0009] Korean Registered Patent No. 10-1534107 (June 30, 2015) The problem to be solved

[0010] The problem that the present invention aims to solve is to provide a bracket manufacturing device for a semiconductor chip inspection device capable of manufacturing a bracket for a semiconductor chip inspection device by integrally injection molding an insert into an insert groove. means of solving the problem

[0011] A bracket manufacturing apparatus for a semiconductor chip inspection device according to an embodiment of the present invention for solving the above problem comprises: a fixed plate body formed by opening a fixed plate cavity in the shape of a bracket; a movable plate body formed by opening a movable plate cavity that forms a bracket cavity in the shape of a bracket together with the fixed plate cavity, and which is joined to the fixed plate body to injection mold the bracket; an insert pin provided to protrude from the movable plate body and into which an insert is inserted; an insert projection provided to protrude from the fixed plate body and which supports the insert inserted into the insert pin when the movable plate body is joined to the fixed plate body; and a jig in which the insert is received at a position corresponding to the insert pin and the insert is inserted into the insert pin.

[0012] Additionally, the fixed plate body comprises: an ejector pin that is slidably provided on the fixed plate body and is provided to be inserted into the fixed plate cavity, and pushes the bracket to detach it from the fixed plate cavity when the injection molding of the bracket is completed; a slide bar that is slidably provided on the side of the fixed plate body and is provided to be inserted into the fixed plate cavity, and forms a side groove of the bracket; and a chip projection formed to protrude from the fixed plate cavity and form a chip coupling groove in the bracket.

[0013] In addition, the chip protrusions include: a first chip protrusion formed to protrude to the upper right side relative to the center; a second chip protrusion formed to protrude to the lower right side relative to the center; a third chip protrusion formed to protrude to the lower left side relative to the center; and a fourth chip protrusion formed to protrude to the upper left side relative to the center.

[0014] Additionally, the movable plate body comprises: a right upper cavity formed on the right upper side relative to the center and facing the fourth chip protrusion; a first insert pin provided on the left upper side relative to the right upper cavity; a second insert pin provided at a position rotated 180 degrees clockwise from the first insert pin; a right lower cavity formed on the right lower side relative to the center and facing the third chip protrusion; a third insert pin provided on the left upper side relative to the right lower cavity; and a fourth insert pin provided at a position rotated 180 degrees clockwise from the third insert pin.

[0015] Additionally, the movable plate body comprises: a left lower cavity formed on the left lower side relative to the center and facing the second chip protrusion; a fifth insert pin provided on the right lower side relative to the left lower cavity; a sixth insert pin provided at a position rotated 180 degrees clockwise from the fifth insert pin; a left upper cavity formed on the left upper side relative to the center and facing the first chip protrusion; a seventh insert pin provided on the right lower side relative to the left upper cavity; and an eighth insert pin provided at a position rotated 180 degrees clockwise from the seventh insert pin.

[0016] Additionally, the jig comprises: a fixed plate forming an exterior; a movable plate spaced apart from the fixed plate and movably provided on the fixed plate, having an insert jig groove formed by being recessed into which the insert is inserted; a guide pin formed protruding from the movable plate and in contact with the movable plate body; a guide rod provided on the fixed plate and slidably provided on the movable plate to guide the movable plate when the movable plate moves; an elastic member provided on the outer circumference of the guide rod and supported by the fixed plate to provide elastic force to the movable plate; and an insert rod provided on the fixed plate and inserted into the insert jig groove, which inserts the insert inserted into the insert jig groove into the insert pin when the movable plate approaches the fixed plate.

[0017] In addition, the insert jig groove is formed at a position opposite to the insert pin.

[0018] In addition, the insert jig grooves are formed at positions opposite to the first insert pin to the eighth insert pin. Effects of the invention

[0019] According to a bracket manufacturing device for a semiconductor chip inspection device according to one embodiment of the present invention, an insert (13) is integrally injection molded into an insert groove (14) to manufacture a bracket (10) for a semiconductor chip inspection device, thereby improving productivity and reducing the defect rate. Brief explanation of the drawing

[0020] FIG. 1 is a perspective view of a semiconductor chip inspection device bracket (10). FIGS. 2 and FIGS. 3 are perspective views of a fixed plate body (21) and a movable plate body (31) of a bracket manufacturing device for a semiconductor chip inspection device according to one embodiment of the present invention. FIG. 4 is a perspective view of a fixed plate body (21) according to one embodiment of the present invention. FIG. 5 is a plan view of a fixed plate body (21) according to one embodiment of the present invention. FIG. 6 is a perspective view of a movable plate body (31) according to one embodiment of the present invention. FIG. 7 is a plan view of a movable plate body (31) according to one embodiment of the present invention. FIG. 8 is a perspective view of a jig (40) according to one embodiment of the present invention. FIG. 9 is a plan view of a jig (40) according to one embodiment of the present invention. FIGS. 10 and FIGS. 11 are operation diagrams of a jig (40) according to one embodiment of the present invention. Specific details for implementing the invention

[0021] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0022] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. Identical reference numerals in each drawing indicate identical components.

[0023] Hereinafter, a bracket manufacturing apparatus for a semiconductor chip inspection device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 11.

[0024] FIG. 1 is a perspective view of a semiconductor chip inspection device bracket (10).

[0025] FIGS. 2 and FIGS. 3 are perspective views of a fixed plate body (21) and a movable plate body (31) of a bracket manufacturing device for a semiconductor chip inspection device according to one embodiment of the present invention.

[0026] FIG. 4 is a perspective view of a fixed plate body (21) according to one embodiment of the present invention.

[0027] FIG. 5 is a plan view of a fixed plate body (21) according to one embodiment of the present invention.

[0028] FIG. 6 is a perspective view of a movable plate body (31) according to one embodiment of the present invention.

[0029] FIG. 7 is a plan view of a movable plate body (31) according to one embodiment of the present invention.

[0030] First, referring to FIG. 1, a bracket (10) for a semiconductor chip inspection device comprises: a bracket body (11) forming an exterior; a side groove (12) formed by being recessed on the side of the bracket body (11); a chip coupling groove (15) formed by being opened in the bracket body (11) and having a semiconductor chip placed therein; and an insert groove (14) formed by being opened in the bracket body (11), formed around the chip coupling groove (15), and having an insert (13) with screw threads formed on its inner surface inserted therein.

[0031] The bracket body (11) forms the exterior. The bracket body (11) can be coupled to a semiconductor chip inspection device. The bracket body (11) is injection molded from plastic resin.

[0032] The side groove (12) is formed by being recessed into the side of the bracket body (11). A fixing mechanism (not shown) provided in a semiconductor chip inspection device can be coupled to the side groove (12).

[0033] A chip coupling groove (15) is formed by opening in the bracket body (11). A diced semiconductor chip is placed in the chip coupling groove (15). Multiple chip coupling grooves (15) may be formed in the bracket body (11), and in the case of the present invention, four may be formed by opening. Various inspections can be performed on the semiconductor chip placed in the chip coupling groove (15) using a semiconductor chip inspection device.

[0034] The insert groove (14) is formed by opening in the bracket body (11) and around the chip coupling groove (15). An insert (13) that is screw-coupled to a semiconductor chip inspection device is inserted into the insert groove (14).

[0035] The insert (13) has screw threads formed on its inner surface and is screw-coupled to a semiconductor chip inspection device. The insert (13) can be implemented in a cylindrical shape.

[0036] As described above, when manufacturing a semiconductor chip inspection device bracket (10) (hereinafter referred to as 'bracket (10)'), if the bracket body (11) is injection molded with plastic resin and then the insert grooves (14) are individually machined and the inserts (13) are inserted therein, machining errors may occur regarding the diameter, straightness, and depth of the insert grooves (14), and productivity may be reduced and the defect rate may increase due to the assembly process of assembling the inserts (13) into each insert groove (14).

[0037] Referring hereto to FIGS. 2 through 7, a bracket manufacturing apparatus for a semiconductor chip inspection apparatus according to one embodiment of the present invention comprises: a fixed plate body (21) formed by opening a fixed plate cavity (22) in the shape of a bracket (10); a movable plate body (31) formed by opening a movable plate cavity (32) that forms a bracket cavity in the shape of the bracket (10) together with the fixed plate cavity (22), and which is joined to the fixed plate body (21) to injection mold the bracket (10); an insert pin (34) provided to protrude from the movable plate body (31) and into which an insert (13) is inserted; and an insert projection (24) provided to protrude from the fixed plate body (21) and which supports the insert (13) inserted into the insert pin (34) when the movable plate body (31) is joined to the fixed plate body (21). The insert (13) is received at a position corresponding to the insert pin (34), and the jig (40) inserts the insert (13) into the insert pin (34).

[0038] The fixed plate body (21) forms the upper side of the injection mold. The fixed plate body (21) can be fixedly mounted to a plastic injection molding machine.

[0039] A fixed plate cavity (22) formed in the shape of a bracket (10) is formed by opening in the fixed plate body (21). In this case, the fixed plate cavity (22) may be formed by being recessed in the same shape as a part of the bracket body (11). The fixed plate cavity (22) forms a bracket cavity where the bracket (10) is formed together with the movable plate cavity (32) described later.

[0040] The fixed plate body (21) is provided with a gate (not shown) communicating with a bracket cavity. Molten plastic resin is injected into the gate. The plastic resin injected into the gate is injected into the fixed plate cavity (22) and the movable plate cavity (32) described later to form a bracket (10).

[0041] The movable plate body (31) forms the lower side of the injection mold. The movable plate body (31) can be mounted on a plastic injection molding machine and configured to move to the fixed plate body (21).

[0042] The movable plate body (31) can be moved to the fixed plate body (21) and combined with the fixed plate body (21). The movable plate body (31) can be separated from the fixed plate body (21) and detached from the fixed plate body (21).

[0043] A fixed plate cavity (22) formed in the shape of a bracket (10) is formed by opening in the movable plate body (31). In this case, the movable plate cavity (32) may be formed by being recessed in the same shape as the remaining part of the bracket (10).

[0044] When the movable plate body (31) is joined to the fixed plate body (21), the movable plate cavity (32) together with the fixed plate cavity (22) forms a bracket cavity identical in shape to the bracket (10). At this time, as described above, when plastic resin is injected into the gate of the fixed plate body (21), the bracket (10) is injection molded in the bracket cavity. When the bracket (10) is completely solidified in the bracket cavity, a bracket (10) for a semiconductor chip inspection device is manufactured.

[0045] The insert pin (34) is provided to protrude from the movable plate body (31). An insert (13) is inserted into the insert pin (34). In this case, the insert (13) is inserted by sliding into the insert pin (34). As described above, the insert (13) is screw-coupled to the semiconductor chip inspection device and is firmly fixed to the semiconductor chip inspection device. The insert (13) can be inserted into the insert pin (34) by the jig (40) described later.

[0046] A plurality of inserts (13) may be inserted into the bracket (10). In this case, a plurality of inserts (13) are inserted into the insert grooves (14). At this time, a plurality of insert pins (34) may be provided corresponding to the number of inserts (13).

[0047] The insert projection (24) is provided to protrude from the fixed plate body (21). The insert projection (24) is positioned opposite the insert pin (34). When the movable plate body (31) is joined to the fixed plate body (21), the insert projection (24) supports the insert (13) inserted into the insert pin (34).

[0048] An insert (13) is received in the jig (40) at a position corresponding to the insert pin (34). The jig (40) inserts the insert (13) into the insert pin (34).

[0049] First, when the movable plate body (31) is detached from the fixed plate body (21) and the bracket cavity is opened, the insert pin (34) of the movable plate body (31) is exposed. In this case, the jig (40) inserts the insert (13) received in the jig (40) into the insert pin (34). At this time, the jig (40) can be moved by a transfer hand (not shown) to insert the insert (13) into the insert pin (34). Accordingly, the insert (13) can be inserted as a single unit in an accurate position without having to manually insert it into multiple insert pins (34) one by one.

[0050] At this time, when molten plastic resin is injected into the fixed plate body (21) as described above, a bracket (10) is injection molded in the bracket cavity formed by the movable plate cavity (32) and the fixed plate cavity (22). In this case, the insert (13) inserted into the insert pin (34) is supported by the insert projection (24).

[0051] Accordingly, when the bracket (10) is injection molded in the bracket cavity, the insert pin (34) can be injection molded integrally with the bracket (10), so there is no need to injection mold the bracket (10) first, then separately machine the insert groove (14) and insert the insert (13), thereby significantly reducing production time and eliminating the problem of machining error that may occur during the machining of the insert groove (14).

[0052] Here, according to one embodiment of the present invention, the fixed plate body (21) is slidably provided on the fixed plate body (21) and is provided to be inserted into the fixed plate cavity (22), and when the injection molding of the bracket (10) is completed, it includes an ejector pin (27) that pushes the bracket (10) to detach it from the fixed plate cavity (22); a slide bar (26) that is slidably provided on the side of the fixed plate body (21) and is provided to be inserted into the fixed plate cavity (22), and forms a side groove (12) of the bracket (10); and a chip protrusion (28) that is formed to protrude from the fixed plate cavity (22) and forms a chip coupling groove (15) in the bracket (10).

[0053] The ejector pin (27) is slidably provided on the fixed plate body (21). The ejector pin (27) is positioned to be inserted into the fixed plate cavity (22).

[0054] When the bracket (10) solidifies in the bracket cavity, the movable plate body (31) is detached from the fixed plate body (21) as described above. When the injection molding of the bracket (10) is completed, the ejector pin (27) slides on the fixed plate body (21) and moves toward the bracket (10) to push the bracket (10), thereby detaching the bracket (10) from the fixed plate cavity (22). In this case, the fixed plate body (21) may be equipped with a pushing device (not shown) for pushing the ejector pin (27).

[0055] A slide bar (26) is slidably provided on the side of the fixed plate body (21). Based on FIGS. 6 and 7, the slide bar (26) may be provided on the upper and lower sides of the fixed plate body (21), but may also be provided on the right and left sides. The slide bar (26) is positioned to be inserted into the fixed plate cavity (22).

[0056] When the movable plate body (31) is joined to the fixed plate body (21), the slide bar (26) is inserted into the bracket cavity. Subsequently, when molten plastic resin is injected into the gate, a side groove (12) is formed in the bracket (10) that is recessed in the same shape as the end of the slide bar (26).

[0057] When the bracket (10) solidifies in the bracket cavity, the slide bar (26) slides and detaches from the bracket (10). Accordingly, a side groove (12) can be formed in the bracket (10).

[0058] The chip protrusion (28) is formed to protrude from the fixed plate cavity (22). The chip protrusion (28) is formed with the same shape as the chip coupling groove (15) of the bracket (10). Multiple chip protrusions (28) may be formed. When the bracket (10) solidifies in the bracket cavity, the chip protrusion (28) forms the chip coupling groove (15) in the bracket (10) to open.

[0059] Here, the chip protrusion (28) according to one embodiment of the present invention includes: a first chip protrusion (281) formed to protrude to the upper right side based on the center (C1); a second chip protrusion (282) formed to protrude to the lower right side based on the center (C1); a third chip protrusion (283) formed to protrude to the lower left side based on the center (C1); and a fourth chip protrusion (284) formed to protrude to the upper left side based on the center (C1).

[0060] A plurality of chip protrusions (28) forming the chip coupling groove (15) may be formed. The center (C1) may be implemented as the center of the fixed plate cavity (22).

[0061] A chip protrusion (28) formed to protrude from the upper right side relative to the center (C1) is defined as the first chip protrusion (281). A chip coupling groove (15) is formed in the bracket (10) by the first chip protrusion (281), so that a semiconductor chip can be placed therein.

[0062] A chip protrusion (28) formed to protrude from the lower right side relative to the center (C1) is defined as a second chip protrusion (282). A chip coupling groove (15) is formed in the bracket (10) by the second chip protrusion (282), so that a semiconductor chip can be placed therein.

[0063] A chip protrusion (28) formed to protrude from the lower left side relative to the center (C1) is defined as a third chip protrusion (283). A chip coupling groove (15) is formed in the bracket (10) by the third chip protrusion (283), so that a semiconductor chip can be placed therein.

[0064] A chip protrusion (28) formed to protrude from the upper left side relative to the center (C1) is defined as the fourth chip protrusion (284). A chip coupling groove (15) is formed in the bracket (10) by the fourth chip protrusion (284), so that a semiconductor chip can be placed therein.

[0065] Referring to FIGS. 6 and 7, according to one embodiment of the present invention, the movable plate body (31) includes a bracket support projection (33) formed to protrude from the movable plate body (31) and supporting the bracket (10) when injection molding the bracket (10).

[0066] The bracket support projection (33) is formed to protrude from the movable plate body (31). Multiple bracket support projections (33) are formed. The bracket support projection (33) is formed to protrude from the movable plate cavity (32) and can be formed along a straight line. The bracket support projection (33) supports the bracket (10) so that after the bracket (10) is injection molded and solidified, the bracket (10) moves inside the movable plate cavity (32) and its shape is not distorted or crushed.

[0067] Referring hereto to FIGS. 6 and 7, according to one embodiment of the present invention, the movable plate body (31) comprises: a right upper cavity (321) formed on the right upper side relative to the center and facing the fourth chip protrusion (284); a first insert pin (341) provided on the left upper side relative to the right upper cavity (321); a second insert pin (342) provided at a position rotated 180 degrees clockwise from the first insert pin (341); a right lower cavity (322) formed on the right lower side relative to the center and facing the third chip protrusion (283); a third insert pin (343) provided on the left upper side relative to the right lower cavity (322); and a fourth insert pin (344) provided at a position rotated 180 degrees clockwise from the third insert pin (343). It includes: a left lower cavity (323) formed on the lower left side relative to the center and facing the second chip protrusion (282); a fifth insert pin (345) provided on the lower right side relative to the left lower cavity (323); a sixth insert pin (346) provided at a position rotated 180 degrees clockwise from the fifth insert pin (345); a left upper cavity (324) formed on the upper left side relative to the center and facing the first chip protrusion (281); a seventh insert pin (347) provided on the lower right side relative to the left upper cavity (324); and an eighth insert pin (348) provided at a position rotated 180 degrees clockwise from the seventh insert pin (347).

[0068] The center (C2) can be implemented as the center of the movable plate cavity (32). The right upper cavity (321) is formed in the lower right side relative to the center (C2). In this case, the right upper cavity (321) occupies the first of the four divided sides of the movable plate cavity (32).

[0069] The upper right cavity (321) faces the fourth chip protrusion (284) when the fixed plate body (21) and the movable plate body (31) are joined. Accordingly, a chip coupling groove (15) is formed in the bracket (10).

[0070] The first insert pin (341) may be provided in the upper left side relative to the upper right cavity (321). The second insert pin (342) is provided at a position obtained by rotating the first insert pin (341) clockwise 180 degrees relative to the upper right cavity (321). In this case, the second insert pin (342) is provided at a diagonal position relative to the first insert pin (341) relative to the upper right cavity (321).

[0071] Accordingly, since the first insert pin (341) and the second insert pin (342) are provided in diagonal positions, the bracket (10) is manufactured so that the insert (13) is positioned in a diagonal position, and the bracket (10) is firmly supported when the insert (13) is screw-coupled to the semiconductor chip inspection device.

[0072] The right lower cavity (322) is formed in the lower right side relative to the center (C2). In this case, the right lower cavity (322) occupies the second side of the four divided surfaces of the movable plate cavity (32).

[0073] The right lower cavity (322) faces the third chip protrusion (283) when the fixed plate body (21) and the movable plate body (31) are joined. Accordingly, a chip coupling groove (15) is formed in the bracket (10).

[0074] The third insert pin (343) may be provided in the upper left side relative to the lower right cavity (322). The fourth insert pin (344) is provided at a position where the third insert pin (343) is rotated 180 degrees clockwise relative to the lower right cavity (322). In this case, the fourth insert pin (344) is provided at a diagonal position relative to the third insert pin (343) relative to the lower right cavity (322).

[0075] Accordingly, the third insert pin (343) and the fourth insert pin (344) are provided in diagonal positions, and the bracket (10) is manufactured so that the insert (13) is positioned in a diagonal position, thereby firmly supporting the bracket (10) when the insert (13) is screw-coupled to the semiconductor chip inspection device.

[0076] The left lower cavity (323) is formed in the lower left side relative to the center (C). In this case, the left lower cavity (323) occupies the third side of the four divided surfaces of the movable plate cavity (32).

[0077] The left lower cavity (323) faces the second chip protrusion (282) when the fixed plate body (21) and the movable plate body (31) are joined. Accordingly, a chip coupling groove (15) is formed in the bracket (10).

[0078] The fifth insert pin (345) may be provided in the lower right side relative to the lower left cavity (323). The sixth insert pin (346) is provided at a position obtained by rotating the fifth insert pin (345) clockwise 180 degrees relative to the lower left cavity (323). In this case, the sixth insert pin (346) is provided at a diagonal position relative to the fifth insert pin (345) relative to the lower left cavity (323).

[0079] Accordingly, the fifth insert pin (345) and the sixth insert pin (346) are provided in diagonal positions, and the bracket (10) is manufactured so that the insert (13) is positioned in a diagonal position, thereby firmly supporting the bracket (10) when the insert (13) is screw-coupled to the semiconductor chip inspection device.

[0080] The left upper cavity (324) is formed on the upper left side relative to the center (C). In this case, the left upper cavity (324) occupies the fourth side of the four divided surfaces of the movable plate cavity (32).

[0081] The left upper cavity (324) faces the second chip protrusion (282) when the fixed plate body (21) and the movable plate body (31) are joined. Accordingly, a chip coupling groove (15) is formed in the bracket (10).

[0082] The seventh insert pin (347) may be provided in the lower right side relative to the upper left cavity (324). The eighth insert pin (348) is provided at a position obtained by rotating the seventh insert pin (347) clockwise 180 degrees relative to the upper left cavity (324). In this case, the eighth insert pin (348) is provided at a diagonal position relative to the seventh insert pin (347) relative to the upper left cavity (324).

[0083] Accordingly, the seventh insert pin (347) and the eighth insert pin (348) are formed in diagonal positions, and the bracket (10) is manufactured so that the insert (13) is positioned in a diagonal position, thereby firmly supporting the bracket (10) when the insert (13) is screw-coupled to the semiconductor chip inspection device.

[0084] A jig (40) according to one embodiment of the present invention will be described in detail below with reference to FIGS. 8 to 11.

[0085] FIG. 8 is a perspective view of a jig (40) according to one embodiment of the present invention.

[0086] FIG. 9 is a plan view of a jig (40) according to one embodiment of the present invention.

[0087] FIGS. 10 to 11 are operation diagrams of a jig (40) according to one embodiment of the present invention.

[0088] Referring to FIGS. 8 to 11, the jig (40) according to one embodiment of the present invention comprises: a fixed plate (42) forming an exterior; a movable plate (41) spaced apart from the fixed plate (42), movably provided on the fixed plate (42), and having an insert jig groove (47) formed by being recessed into which the insert (13) is inserted; a guide pin (48) formed protruding from the movable plate (41) and in contact with the movable plate body (31); a guide rod (44) provided on the fixed plate (42) and slidably provided on the movable plate (41) to guide the movable plate (41) when the movable plate (41) moves; and an elastic member (46) provided on the outer surface of the guide rod (44) and supported by the fixed plate (42) to provide elastic force to the movable plate (41). and an insert rod (43) provided on the fixed plate (42) and inserted into the insert jig groove (47), and inserting the insert (13) inserted into the insert jig groove (47) into the insert pin (34) when the movable plate (41) approaches the fixed plate (42).

[0089] The fixed plate (42) forms the exterior. The fixed plate (42) may be equipped with components described later. The fixed plate (42) can be transferred to the movable plate body (31) when the movable plate body (31) is opened from the fixed plate body (21) by a transfer hand (not shown).

[0090] The moving plate (41) is spaced apart from the fixed plate (42) and is movably provided on the fixed plate (42) to approach or be spaced apart from the fixed plate (42).

[0091] An insert jig groove (47) into which an insert (13) is inserted is formed by being recessed on the upper surface of the movable plate (41). In this case, the insert (13) can be inserted into and seated in the insert jig groove (47). Multiple insert jig grooves (47) may be formed. At this time, an insert (13) can be received in each insert jig groove (47).

[0092] A guide pin (48) is formed to protrude from the movable plate (41) and comes into contact with the movable plate body (31) when the jig (40) moves to the movable plate body (31). In this case, the guide pin (48) separates the movable plate (41) from the movable plate cavity (32) by a certain distance.

[0093] A guide rod (44) is provided on a fixed plate (42). The guide rod (44) is slidably provided on a movable plate (41) so as to guide the movable plate (41) in a straight direction when the movable plate (41) moves relative to the fixed plate (42).

[0094] A guide screw (45) is attached to the end of the guide rod (44) to prevent the movable plate (41) from detaching from the guide rod (44). In this case, a receiving groove for accommodating the guide screw (45) may be formed in the movable plate (41).

[0095] An elastic member (46) is provided on the outer surface of the guide rod (44). The elastic member (46) is supported by a fixed plate (42) and provides elastic force to the movable plate (41).

[0096] When the moving plate (41) approaches the fixed plate (42), the elastic member (46) is compressed, pushing the moving plate (41) away from the fixed plate (42). In this case, the guide rod (44) guides the fixed plate (42) in a straight direction.

[0097] The insert rod (43) is fixedly provided on the fixed plate (42). The end of the insert rod (43) is positioned to be inserted into the insert jig groove (47).

[0098] The insert rod (43) is slidably provided in the insert jig groove (47). When the movable plate (41) approaches the fixed plate (42), the insert rod (43) protrudes from the insert jig groove (47). In this case, the insert rod (43) pushes the insert (13) inserted into the insert jig groove (47) and inserts it into the insert pin (34).

[0099] First, when the movable plate body (31) is separated from the fixed plate body (21) and the bracket cavity is opened, the jig (40) is transferred to the movable plate body (31) by a transfer hand, etc., while the insert (13) is inserted into the insert jig groove (47).

[0100] Subsequently, when the fixed plate (42) is pushed toward the movable plate body (31) while the movable plate (41) is in contact with the movable plate body (31), the movable plate (41) approaches the fixed plate (42). At this time, the guide rod (44) guides the movable plate (41) in a straight direction.

[0101] The insert (13) inserted into the insert jig groove (47) is pushed by the insert rod (43) and inserted into the insert pin (34) provided in the movable plate body (31). Accordingly, the insert (13) can be automatically inserted into the insert pin (34) at the correct position without being inserted manually.

[0102] At this time, the insert jig groove (47) is formed at a position opposite to the insert pin (34). As described above, the insert pin (34) provided in the movable plate body (31) (31) is formed in multiple numbers and is positioned in a complex manner in multiple places. In this case, if a worker manually inserts the insert (13) into the insert pin (34) one by one, the production speed decreases, and an accident may occur as the worker's hand may be positioned between the movable plate body (31) and the fixed plate body (21).

[0103] The insert jig groove (47) of the present invention is formed at a position opposite to the insert pin (34) and is formed in multiple numbers corresponding to the multiple insert pins (34).

[0104] Accordingly, when inserts (13) are inserted into the insert jig groove (47) in the same number as the insert pins (34), the jig (40) inserts the inserts (13) into the insert pins (34) all at once. As a result, multiple inserts (13) can be automatically inserted into the correct position all at once without having to manually insert them into the multiple insert pins (34).

[0105] Multiple insert jig grooves (47) may be formed. As described above, in order for each insert (13) to be inserted into each insert pin (34), multiple insert jig grooves (47) must be formed facing each insert pin (34).

[0106] When the insert pin (34) is implemented as the first insert pin (341) to the eighth insert pin (348), the insert jig groove (47) is formed at a position opposite to the first insert pin (341) to the eighth insert pin (348). In this case, the insert jig groove (47) is implemented as the first insert jig groove (47) to the eighth insert jig groove (47) corresponding to the first insert pin (341) to the eighth insert pin (348), and an insert (13) can be inserted into each insert jig groove (47). Accordingly, multiple inserts (13) can be automatically inserted into the correct position at once without being inserted into multiple insert pins (34) manually.

[0107] For the time being, those skilled in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

[0108] The scope of the present invention is defined by the claims set forth below rather than by the detailed description above, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the present invention. Explanation of the symbols

[0109] 10 : Bracket 20 : Fixing plate 30 : Movable plate 40 : Jig

Claims

Claim 1 A fixed plate body formed by opening a fixed plate cavity in the shape of a bracket; a movable plate body formed by opening a movable plate cavity that forms a bracket cavity in the shape of the bracket together with the fixed plate cavity, and which is coupled to the fixed plate body to injection mold the bracket; an insert pin provided to protrude from the movable plate body and into which an insert is inserted; an insert projection provided to protrude from the fixed plate body and which supports the insert inserted into the insert pin when the movable plate body is coupled to the fixed plate body; and a jig in which the insert is received at a position corresponding to the insert pin and the insert is inserted into the insert pin; wherein the fixed plate body comprises an ejector pin that is slidably provided on the fixed plate body and is provided to be inserted into the fixed plate cavity, and which pushes the bracket to detach it from the fixed plate cavity when the injection molding of the bracket is completed. and a chip projection formed to protrude from the fixed plate cavity to form a chip coupling groove in the bracket; wherein the chip projection comprises: a first chip projection formed to protrude from the upper right relative to the center; a second chip projection formed to protrude from the lower right relative to the center; a third chip projection formed to protrude from the lower left relative to the center; and a fourth chip projection formed to protrude from the upper left relative to the center; and wherein the movable plate body comprises: an upper right cavity formed on the upper right relative to the center and facing the fourth chip projection; a first insert pin provided on the upper left relative to the upper right cavity; a second insert pin provided at a position rotated 180 degrees clockwise from the first insert pin; a lower right cavity formed on the lower right relative to the center and facing the third chip projection; and a third insert pin provided on the upper left relative to the lower right cavity. A fourth insert pin provided at a position obtained by rotating the third insert pin 180 degrees clockwise;A left lower cavity formed in the lower left relative to the center and facing the second chip protrusion; a fifth insert pin provided in the lower right relative to the left lower cavity; a sixth insert pin provided at a position rotated 180 degrees clockwise from the fifth insert pin; a left upper cavity formed in the upper left relative to the center and facing the first chip protrusion; a seventh insert pin provided in the lower right relative to the left upper cavity; and an eighth insert pin provided at a position rotated 180 degrees clockwise from the seventh insert pin; wherein the jig comprises: a fixed plate forming an exterior; a movable plate spaced apart from the fixed plate, movably provided on the fixed plate, and having an insert jig groove formed by being recessed into which the insert is inserted; a guide pin formed protruding from the movable plate and in contact with the movable plate body; and a guide rod provided on the fixed plate and slidably provided on the movable plate to guide the movable plate when the movable plate moves. A bracket manufacturing apparatus for a semiconductor chip inspection device comprising: an elastic member provided on the outer surface of the guide rod and supported by the fixed plate to provide elastic force to the movable plate; and an insert rod provided on the fixed plate and inserted into the insert jig groove, wherein when the movable plate approaches the fixed plate, the insert inserted into the insert jig groove is inserted into the insert pin; and wherein a guide screw is coupled to the end of the guide rod to prevent the movable plate from detaching from the guide rod. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 A bracket manufacturing device for a semiconductor chip inspection device, wherein, in claim 1, the insert jig groove is formed at a position opposite to the insert pin. Claim 8 A bracket manufacturing device for a semiconductor chip inspection device according to claim 7, wherein the insert jig groove is formed at a position opposite to the first insert pin to the eighth insert pin.

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