Wafer Dicing Apparatus Structure

Abstract

The present invention relates to a wafer dicing machine structure, and more specifically, the wafer dicing machine structure includes a support, and on the support, a loading mechanism, a position fixing mechanism, a pre-compressing mechanism, and a correction mechanism are installed. The loading mechanism places a wafer on a wafer table, and the position fixing mechanism is equipped with a support blade that can protrude into the wafer table to support and fix the position of the wafer. The pre-compressing mechanism and the wafer table are installed to correspond to each other, and a pre-compressing crack is created on the wafer by pushing the wafer through a driving knife. The correction mechanism is installed above the pre-compressing mechanism and corrects the corresponding positions of the support blade and the driving knife before the pre-compressing crack occurs through a mounted camera. When pre-compressing dicing occurs, the length of the pre-compressing crack of the wafer is measured. The crushing jig is assembled and installed on the wafer table, and the wafer is diced along the pre-compressing crack to achieve a fast and accurate dicing operation, thereby improving wafer dicing efficiency with a simple structure and easy operation method.

Description

Technology Field

[0001] The present invention relates to the technical field of dicing machines, and in particular to the structure of a wafer dicing machine. Background Technology

[0002] A wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits, and it is called a wafer because of its circular shape. Wafers can usually proceed to the next process only after undergoing a compression crack splitting operation.

[0003] The generally known wafer splitting process is carried out using a splitting device, which is structured to install multiple sensing lenses to accurately align the wafer on a jig, and then perform splitting operations in horizontal and vertical directions. However, since the jig and splitting blades are designed to match predetermined wafer specifications, splitting wafers of different sizes required replacing the jig and blades; this was not only cost-ineffective but also required significant time and effort for the process of readjusting the positions.

[0004] Furthermore, this widely known type of device is mechanically very large, making it impossible for ordinary workers to quickly learn how to operate it, and it can only be operated within a limited space. Additionally, the blades are consumables with high manufacturing costs, and since the design lacked a structure that allowed for more efficient use of these blades, the operating cost inevitably increased as the frequency of blade replacement increased.

[0005] Based on these problems, providing a method to solve the aforementioned problems has become the most important task that the present invention aims to solve. The problem to be solved

[0006] The main objective of the present invention is to provide a wafer dicing machine structure. By using a correction mechanism to correct the support blade of the position fixing mechanism and the splitting blade of the pre-pressing mechanism, the support blade of the position fixing mechanism fixes the wafer in position, and the splitting blade of the pre-pressing mechanism pushes the wafer to apply pressure, thereby causing a compression crack to form on the wafer. Then, a crushing jig applies a constant force to the wafer to dic the wafer along the pre-compression crack, thereby eliminating the need to dic the wafer again along the divided guide line after the wafer is divided. This reduces the processing steps and shortens the time required for dicing. Additionally, the overall structure is densely configured, reducing the required space and making the operation easier.

[0007] Another objective of the present invention is to change the corresponding positions of the support blade and the splitting blade and the wafer slot so that the support blade and the splitting blade come into contact with the wafer at the damaged position, thereby extending the usage time of the support blade and the splitting blade and reducing the usage cost.

[0008] To achieve the aforementioned objectives, the present invention provides a wafer dicing machine structure, wherein the wafer dicing machine structure includes a base, and on the base, a loading mechanism, a position fixing mechanism, a pre-pressing mechanism, and a correction mechanism are installed. The loading mechanism places a wafer on a wafer table, and the position fixing mechanism is equipped with a support blade that can protrude into the wafer table to support and fix the position of the wafer. The pre-pressing mechanism and the wafer table are installed to correspond to each other, and a pre-pressing crack is created on the wafer by pushing the wafer through a splitting blade. The correction mechanism is installed above the pre-pressing mechanism and corrects the corresponding positions of the support blade and the splitting blade before the pre-pressing crack occurs through a mounted camera. When pre-pressing dicing occurs, the length of the pre-pressing crack of the wafer is measured. The crushing jig is assembled and installed on the wafer table, and the wafer is diced along the pre-pressing crack to achieve a fast and accurate dicing operation, thereby improving wafer dicing efficiency through a simple structure and easy operation. Effects of the invention

[0009] When summarizing the above, the wafer dicing machine structure provided by the present invention can achieve the following improvement effects.

[0010] First, the precision and yield rate of the dicing operation are improved. The present invention aligns the tips of the support blade and the split blade on the same straight line by performing position correction on the support blade and the split blade of the camera through a correction mechanism. Simultaneously, by adjusting the pre-compression crack preparation line of the wafer to be aligned with the tips of the support blade and the split blade on the same straight line, the split blade enters along the pre-compression crack preparation line of the wafer and performs linear dicing along the pre-compression crack preparation line of the wafer, thereby achieving the effect of improving the precision of the dicing operation and the yield rate.

[0011] Second, the operation method is simple and the dicing process time is shortened. The present invention weakens the wafer structure by applying pressure to the wafer using a splitting blade, which is a pre-pressing mechanism, to create pre-pressing cracks on the wafer. Subsequently, a crushing jig is used to apply force to the wafer, causing it to proceed with the dicing process along the pre-pressing cracks, thereby completing the wafer dicing process. Compared to traditional dicing methods, since the dicing process can be performed after creating a split line on the wafer without installing separate equipment, the operation method is simple, the dicing process time can be shortened, and personnel can quickly learn the operation method.

[0012] Third, the service life of consumable parts is extended and usage costs are reduced. Both the support blade and the splitting blade of the present invention can move up and down along the Z-axis, and furthermore, since the corresponding positions of the support blade and the first groove, and the corresponding positions of the splitting blade and the second groove can be adjusted, the service life of the support blade and the splitting blade can be extended and the frequency of replacement reduced by bringing the undamaged parts of the support blade and the splitting blade into contact with the wafer, thereby achieving the effect of saving usage costs.

[0013] Fourth, the structure is closely connected, so it occupies less space. The main mechanisms of the present invention are installed on the same base, so the structure is simple and closely connected, and the overall volume is small, so there is no need to occupy a large space, which allows the workers to operate it more conveniently. Brief explanation of the drawing

[0014] FIG. 1 is a perspective view showing the three-dimensional structure of the combined state of the present invention. FIG. 2 is a perspective view showing the three-dimensional structure of the present invention. FIG. 3 is a local enlarged view of the wafer table, the dividing blade, and the lower dividing blade of the present invention. FIG. 4 is a side cross-sectional view of the wafer table, support blade, splitting blade, and lower splitting blade of the present invention. FIG. 5 is an aerial view of the wafer table, support blade, splitting blade, and lower splitting blade of the present invention. FIG. 6 is a perspective view showing the structure when the wafer of the present invention is placed in a wafer slot. FIG. 7 is a perspective view showing the operation of the support blade of the present invention when fixing the position of the wafer. FIG. 8 is a perspective view showing the operation of the dividing blade of the present invention in contact with a wafer. FIG. 9 is a perspective view showing the disassembled structure of the crushing jig of the present invention. FIG. 10 is a perspective view showing the assembly structure of the crushing jig and wafer table of the present invention. FIG. 11 is a perspective view showing the assembly structure before pressure is applied to the crushing jig of the present invention. FIG. 12 is a perspective view showing the assembly structure when pressure is applied to the crushing jig of the present invention. FIG. 13 is a perspective view showing the assembly structure when pressure is applied to the support blade of the present invention. FIG. 14 is a perspective view showing a work interface for correcting the split blade of the present invention. FIG. 15 is a perspective view showing a work interface for correcting the wafer piece position of the present invention. Specific details for implementing the invention

[0015] To further clarify the purpose, effects, and structural features of the present invention, the following description is provided by citing relatively excellent embodiments and drawings.

[0016] As shown in FIGS. 1 and 2, the wafer dicing machine structure provided in the present invention includes a base (1), and a loading mechanism (2), a position fixing mechanism (3), a pre-pressing mechanism (4), and a correction mechanism (5) are installed on the base (1), and a crushing jig (6) is assembled and installed on the loading mechanism (2) in a detachable manner.

[0017] First, for convenience of explanation, the extension direction of the long side (11) of the pedestal (1) is defined as the X-axis, the extension direction of the short side (12) is defined as the Y-axis, and the extension direction perpendicular to the top surface of the pedestal (1) is defined as the Z-axis. As shown in FIGS. 2 to 5, the loading mechanism (2) is installed along the X-axis at one end of the pedestal (1) and is equipped with a wafer table (21). The loading mechanism (2) is also equipped with a first rotating rod device (22) and can adjust the wafer table (21) to move along the Y-axis. The wafer table (21) is equipped with a wafer slot (23) for inserting a wafer (100), and the wafer slot (23) has a first groove (24) and a second groove (25) that are different in two opening directions along the X-axis.

[0018] Among them, as shown in FIG. 5, two round shafts (26) are installed within the wafer slot (23), and their positions are each on both sides of the first groove (24) and the second groove (25). Both of the two round shafts (26) protrude above the upper edges of the first groove (24) and the second groove (25), so that their top ends support the wafer (100). In this embodiment, the height (H1) of the protruding two round shafts (26) occupies 1 / 4 of their outer diameter length®, thereby ensuring that the wafers (100) placed on the two round shafts (26) maintain a constant distance and are positioned above the first groove (24) and the second groove (25), providing a space where the wafer (100) can be bent and deformed under pressure.

[0019] As shown in FIGS. 1 through 5, the position fixing mechanism (3) is installed on the support base (1) along the X-axis and is positioned above the loading mechanism (2). The position fixing mechanism (3) is equipped with a support blade (31) located behind the wafer table (21). The position fixing mechanism (3) is also equipped with a second rotating rod device (32) and a third rotating rod device (33). The second rotating rod device (32) can adjust the support blade (31) to move along the X-axis, and the third rotating rod device (33) can adjust the support blade (31) to move along the Z-axis. As can be seen here, the first rotating rod device (22) and the second rotating rod device (32) are used together to adjust the corresponding positions of the support blade (31) and the first groove (24), thereby allowing the support blade (31) to move along the X-axis and extend into the first groove (24), thereby achieving the effect of supporting and fixing the position of the wafer (100) within the wafer slot (23).

[0020] To elaborate, as shown in FIG. 4, the support blade (31) has a thickness (T3) along the Z-axis, so that the position of the support blade (31) on the Z-axis can be adjusted according to the thickness of the wafer (100) during use. This allows the side of the support blade (31) and the wafer (100) to come into complete contact, thereby ensuring stability of the position fixation. Additionally, if the wafer (100) is supported in the same position for a long period, wear occurs, which reduces the stability of the position fixation. However, by changing the position of the support blade (31) along the Z-axis to correspond to the first groove (24), the worn position is avoided from supporting the wafer (100), thereby extending the service life of the support blade (31). This reduces the frequency of parts replacement, thereby achieving the effect of reducing usage costs.

[0021] Referring further to the contents shown in FIGS. 1 and 2, the pre-pressing mechanism (4) is installed along the X-axis toward the corresponding base (1) and is installed to face and correspond to the corresponding wafer table (21). The pre-pressing mechanism (4) is equipped with a splitting blade (41, driving knife) and a fourth rotating rod device (42), and the splitting blade (41) and the second groove (25) of the corresponding wafer table (21) correspond to each other, and the fourth rotating rod device (42) drives the splitting blade (41) to move it inward or backward along the X-axis. The fourth rotating rod device (42) is equipped with a large wheel (421) for blade feeding and a small wheel (422) for blade feeding, and controls the positional movement speed of the splitting blade (41).

[0022] Furthermore, the pre-pressing mechanism (4) is also equipped with a fifth rotating rod device (43) and a sixth rotating rod device (44). The fifth rotating rod device (43) is adjustable so that the dividing blade (41) moves along the Y-axis, and the sixth rotating rod device (44) is adjustable so that the dividing blade (41) moves along the Z-axis. By doing so, the corresponding positions of the dividing blade (41) and the second groove (25) are adjusted to align the position of the wafer (100) placed in the wafer slot (23).

[0023] Referring further to the contents shown in FIGS. 3 and 4, the dividing blade (41) has a blade edge (411) with one side facing the second groove (25) and has a thickness (T1) along the Z-axis. In this embodiment, the corresponding length (T2) between the blade edge (411) of the dividing blade (41) and the wafer within the wafer slot (23) is within 1 / 2 of the thickness (T1), that is, when the dividing blade (41) enters the second groove (25) along the X-axis, the blade edge (411) occupying within 1 / 2 of the thickness (T1) comes into contact with the wafer (100). When the dividing blade (41) applies force to the wafer (100), a pre-compression crack is created in the wafer (100), weakening its structure, which ensures that the subsequent wafer (100) can perform a linear dividing operation along the pre-compression crack. When the edge of the blade (411) repeatedly contacts and crushes the wafer (100) at the same location for a long time, wear and gouge marks are left, which affects the precision of the wafer (100) crushing operation. Therefore, the structure of the present invention provides a structure that only destroys a local portion of the corresponding dividing blade (41). Thus, by adjusting the dividing blade (41) to move along the Z-axis through the sixth rotating rod device (44), the worn edge of the blade (411) is prevented from contacting the wafer, thereby extending the service life of the dividing blade (41), reducing the frequency of replacement of the dividing blade (41), and further achieving the effect of reducing production costs.

[0024] As shown in FIGS. 1 and 2, the present invention further installs a correction mechanism (5) above the pre-pressing mechanism (4), and the correction mechanism (5) is connected to an operation interface of a control system (not shown in the drawings). Through the operation interface, the correction mechanism (5) helps to adjust the corresponding positions of the support blade (31) and the splitting blade (41), thereby ensuring precise positional alignment of the wafer (100) and causing pre-pressing cracks on the wafer (100). The correction mechanism (5) is equipped with a support (51) on which a camera can be installed, and in this embodiment, the camera is preferably a CCD camera (Charge Coupled Device Camera). The support member (51) receives driving force from the seventh rotating rod device (52) and moves back and forth along the X-axis between the support blade (31) and the split blade (41). The support member (51) is driven by the slide rail mechanism (53) and moves along the Y-axis between the detection position and the standby position, thereby aligning the CCD camera between the support blade (31) or the split blade (41). The support member (51) also receives driving force from the eighth rotating rod device (54) and moves along the Z-axis, adjusting the focal length of the CCD camera to clearly focus the support blade (31) or the split blade (41). This corrects the corresponding positions of the support blade (31) and the split blade (41), so that the blade edge (311) of the support blade (31) and the blade edge (411) of the split blade are placed on the same straight line (L) in a corresponding manner.

[0025] Among other possible embodiments, the wafer table (21) of the loading mechanism (2) described above, the support blade (31) of the position fixing mechanism (3), the dividing blade (41) of the pre-pressing mechanism (4), and the support (51) of the correction mechanism (5) can each receive driving force from at least one electric motor and move along a pre-set movement axis direction. In the embodiments described above, the electric motor drives the first rotating rod device (22), the second rotating rod device (32), the third rotating rod device (33), the fourth rotating rod device (42), the fifth rotating rod device (43), the sixth rotating rod device (44), the seventh rotating rod device (52), and the eighth rotating rod device (54) to realize semi-automatic or fully automatic operation of each of the described mechanisms, thereby completing wafer dicing.

[0026] In the course of actual application, the operating interface provides a correction mode to correct the corresponding positions of the support blade (31) and the split blade (41). Referring to FIGS. 1 and FIGS. 5 together, the correction mode specifically includes the following:

[0027] Step a, move the support (51) to position the camera at the detection position;

[0028] Step b, move the camera along the X-axis up to the support blade (31);

[0029] c. In step c, the camera is adjusted along the Z-axis to focus on the support blade (31), thereby allowing the operation interface to clearly display the support blade (31), and the support blade (31) is aligned through a virtual reference point to obtain a virtual cross alignment line as in FIG. 13;

[0030] Step d, the camera returns to the upper side of the driving knife (41) along the X-axis and adjusts to focus on the corresponding driving knife (41) along the Z-axis;

[0031] Step e, the dividing blade (41) is aligned along the Y-axis such that the blade edge (411) of the dividing blade (41) shown in FIG. 14 is aligned with the corresponding virtual cross alignment line;

[0032] Step f, return the camera to the standby position and secure the split blade.

[0033] Through the aforementioned correction step, the corresponding split blade (41) and the corresponding support blade (31) are corrected so that they can be positioned on the same alignment line, thereby allowing the support blade (31) and the split blade (41) to apply force to the wafer (100) along the same straight line (L), causing the wafer to pre-crack and form a linear crack.

[0034] The operating interface also provides a pre-compression mode, through which force is applied to the wafer to induce pre-cracking. Referring to FIGS. 2 and FIGS. 6 through 8, the specific details of the pre-compression mode are as follows:

[0035] Step S1, as shown in FIG. 6, a wafer (100) is placed in a wafer slot (23), and a support (51) moves the camera to a detection position;

[0036] S2 step, the camera moves along the X-axis to the upper side of the wafer table (21) to locate the pre-compressed crack preparation line of the wafer (100);

[0037] In step S3, the wafer table (21) moves along the Y-axis, and as shown in FIG. 15, the pre-pressing crack preparation line of the wafer (100) is aligned with the virtual cross alignment line of the corresponding operation interface, and at this time, the pre-pressing preparation line of the wafer (100), the support blade (31), and the splitting blade (41) are positioned on the same straight line;

[0038] In step S4, as shown in FIG. 7, the support blade (31) moves along the X-axis into the first groove (24) to support the wafer (100) and fix its position;

[0039] Step S5, the camera retracts along the X-axis to the blade insertion opening of the pre-compression crack preparation line of the wafer (100), and as shown in FIG. 8, the corresponding splitting blade is moved slightly to come into contact with the wafer (100), and then force is applied to form a pre-compression crack on the wafer (100), and through the operation interface, the length of the pre-compression crack is measured to determine whether it has reached a pre-set length;

[0040] In step S6, after the pre-compression crack reaches a preset length, the corresponding splitting blade and the corresponding CCD camera are retracted to complete the pre-cracking of the wafer.

[0041] Weakening the wafer structure using the aforementioned pre-compression cracking method allows the same structural weakening effect to be achieved without the use of separate splitting equipment. Furthermore, since the operation is simple and personnel can quickly become familiar with the operating environment and complete the processing work, it helps improve work efficiency.

[0042] As shown in FIG. 1, after a preliminary cracking operation on the wafer (100), a dicing operation is further performed using a crushing jig (6). Referring to FIG. 9 and FIG. 10, the crushing jig (6) is assembled and installed on the wafer table (21) in a detachable manner and includes a combination support (61), a push block (62), and a pressing part (63). To explain this in detail, the combination support (61) has an upper seat plate (611) and a lower seat plate (612). The upper seat plate (611) has two plates (613) vertically connected integrally on adjacent sides, and the lower seat plate (612) is connected to one of the plates (613) and installed parallel to the other plate (613). The corresponding push block (62) is installed between the corresponding upper seat plate (611) and the corresponding lower seat plate (612) in a state movable along the Z-axis, and the corresponding pressing part (63) is installed by penetrating through the top surface of the corresponding upper seat plate (611) and connecting to the top surface of the corresponding push block (62), and the corresponding pressing part (63) pushes the corresponding push block (62) to move along the Z-axis.

[0043] To explain further, as shown in FIG. 9, a slot (614) is formed inwardly on the top surface of the lower seat plate (612), and a guide groove (615) is installed on the side that is connected to the slot (614). A receiving chamber (622) is installed on the bottom surface of the push block (62), and one end of the return spring (66) supports the inside of the receiving chamber (622), and the other end supports the inside of the slot (614), so that the push block (62), which is pressed down by the pressing part (63), returns to its original position. A guide rod (616) is installed on the diagonal portion of the top surface of the lower seat plate (612), and the two guide rods (616) are inserted into the bottom surface of the push block (62) to limit the assembly position of the push block (62) and the lower seat plate (612), thereby preventing positional deviation when the push block (62) moves.

[0044] A press plate (64) that moves along the guide groove (615) is installed in the corresponding push block (62) at the position of the corresponding guide groove (615). The press plate (64) is equipped with a plate section (641) and two touch pressure axes (642), and the push block (62) is provided with a fitting groove (621) into which the plate section (641) can be inserted, so that the press plate (64) and the push block (62) are joined together. The two touch pressure axes (642) each extend downward and are installed at both ends of the plate section (641) in a symmetrical manner. Referring to FIG. 11, the end portions of the two touch pressure shafts (642) are equipped with pressure planes (643), and the side edges (644) of the two pressure planes (643) and the top portions (261) of the two round shafts (26) are installed in a corresponding manner. In actual use, the push block (62) moves downward by receiving the pressing force of the pressing part (63), and the two pressure planes (643) come into contact with the wafer (100) and apply force, thereby causing the wafer (100) to bend on the arc side (262) where the two round shafts (26) correspond to each other, and furthermore, the wafer (100) dicing operation is performed along the pre-compressed crack.

[0045] In order to stably assemble and install the crushing jig (6) on the wafer table (21), as shown in FIG. 10, the wafer table (21) is provided with two position fixing holes (27) on the diagonal portion, and the two position fixing holes (27) are each located on both sides of the wafer slot (23). Two position fixing rods (617) are installed on the bottom surface of the lower plate (612) corresponding to the position fixing holes (27), and the lower plate (612) is inserted and installed into the two position fixing holes (27) corresponding to each other through the two position fixing rods (617), thereby stably installing the crushing jig (6) on the wafer table (21) so that it does not shake or move. On the top surface of the wafer table (21), at least one side extends and is connected to the outside, and a lower groove (28) is formed concavely, and at least one side extends and is connected to the outside, and an upper groove (618) is formed at a corresponding position on the bottom surface of the plate (613) to which the upper seat plate (611) and the wafer table (21) are connected. In this embodiment, the wafer table (21) has two lower grooves (28), and two corresponding upper grooves (618) are installed on the plate (613) to which the upper seat plate (611) and the wafer table (21) are in contact. The upper groove (618) corresponds to the lower groove (28) and forms an insertion hole into which an insert (65) can be inserted. In this embodiment, the upper groove (618) and the lower groove (28) correspond to each other and form an "8" shaped insertion hole. The shape of the cross-section of the insert (65) and the shape of the opening of the insertion hole match each other, and the insert (65) and the insertion hole are used together to fix the crushing jig (6) onto the wafer table (21).

[0046] Also, referring to FIGS. 3 and 4, a lower split blade (45) is installed at a distance in front of the split blade (41), and when the split blade (41) moves along the X-axis to the second groove (25), the lower split blade (45) extends upward along the Z-axis and protrudes to the top of the second groove (25) to assist in the wafer dicing operation. It is specifically explained here that the blade edge (451) of the lower split blade (45) and the bottom surface of the wafer (100) face each other at a distance, and the blade edge (451) of the lower split blade (45) and the blade edge (411) of the split blade (41) are positioned perpendicularly to each other on the same vertical plane, so that the blade edge (451) of the lower split blade (45) corresponds to the pre-press crack preparation line of the wafer, thereby ensuring the precision of the dicing operation.

[0047] When performing a dicing operation on a wafer that already has pre-compressed cracks formed during actual use, as shown in FIGS. 10 and 12, the crushing jig (6) is installed such that the corresponding position fixing rod (617) is inserted into the corresponding position fixing hole (27), and the corresponding upper groove (618) and the corresponding lower groove (28) correspond to each other to form an insertion hole, and the insert (65) is inserted into the insertion hole to complete the assembly of the crushing jig (6). Subsequently, when force is applied to the corresponding pressing part (63), the corresponding pressing part (63) pushes the push block (62) downward. At this time, when the pressure plane (643) of the two touch pressure shafts (642) contacts the wafer and force is applied to the arc side (262) of the two round shafts (26), the wafer is bent. When the wafer is bent until it comes into contact with the lower splitting blade (45), the wafer has a structure weakened by a pre-cracking, and when the lower splitting blade (45) supports and pushes up the wafer (100), a linear dicing operation can proceed along the pre-compressed crack.

[0048] The above descriptions are relatively excellent embodiments or examples provided by the present invention, and such specific embodiments or examples are by no means intended to limit the scope of the present invention. It should be noted that any additions or modifications made within the scope of the application of the present invention fall within the scope of the present invention. Explanation of the symbols

[0049] Stand 1, long side 11 Short side 12 Loading mechanism 2 Wafer table 21 First rotating rod device 22 Wafer slot 23, 1st groove 24 Second groove 25 Round shaft 26 Top 261, Arc side 262 Position fixing hole 27 Lower groove 28 Position fixing mechanism 3 Support blade 31 Blade edge 311, 411, 451 Second rotating rod device 32 Third rotating rod device 33 Pre-pressing mechanism 4 Dividing blade 41 4th rotating rod device 42 Large wheel 421 for blade feeding Small wheel 422 for blade feeding 5th rotating rod device 43 6th rotating rod device 44 Lower split blade 45 Correction device 5 Support 51 7th rotating rod device 52 Slide rail mechanism 53 8th rotating rod device 54 Shredding Jig 6 Combination Support 61 Upper seat plate 611 Lower seat plate 612 Board 613 Slot 614 Guide Home 615 Guide Bar 616 Position fixing bar 617 Upper groove 618 Push block 62 insertion groove 621 Reception room 622 Pressing part 63 Press plate 64 Plate section 641 Touch pressure axis 642 Pressure plane 643 Side edge 644 Insert 65 Return spring 66 wafer 100 Height H1, outer diameter R Thickness T1, T3, Length T2 Straight line L

Claims

Claim 1 The invention relates to a structure of a wafer dicing machine, wherein the structure of the wafer dicing machine comprises a base, a loading mechanism, a position fixing mechanism, a pre-pressing mechanism, a straightening mechanism, and a crushing jig, wherein the direction of extension of the long side of the base is defined as the X-axis, the direction of extension of the short side is defined as the Y-axis, and the direction of extension perpendicular to the top surface of the base is defined as the Z-axis; wherein the loading mechanism is installed on the base and has a wafer table capable of moving along the Y-axis, wherein the wafer table has a wafer slot capable of inserting a wafer, and the wafer slot has a first groove and a second groove formed spaced apart from each other along the X-axis, and wherein the position fixing mechanism is installed on the base and is installed on the rear side of the wafer table in the X-axis direction and has a support blade that protrudes into the first groove, and wherein the support blade moves along the X-axis and Z-axis and supports and fixes the wafer within the wafer slot by adjusting a position corresponding to the first groove in the X-axis and Z-axis directions. The pre-pressing mechanism is installed at one end along the X-axis direction of the support and positioned to face the wafer table, and has a splitting blade installed to face the second groove, and the splitting blade adjusts its position to correspond to the second groove by moving in the Y-axis and Z-axis directions, and moves into the second groove along the X-axis direction to support and push the wafer located within the wafer slot, thereby causing a pre-pressing crack in the wafer;The calibration device is installed above the pre-compression device and is equipped with a support on which a camera can be installed. The support reciprocates along the X-axis between the support blade and the splitting blade, and moves along the Y-axis between a detection position and a standby position. This allows the installed camera to move to the corresponding support blade or splitting blade that corresponds to the detection position. Additionally, the camera is focused along the Z-axis direction with the support blade or splitting blade. By adjusting the corresponding positions of the support blade and the splitting blade before applying force to the wafer, the length of the pre-compression crack in the wafer is measured when force is applied to the wafer. The crushing jig is installed on the wafer table in a detachable form and is equipped with a combination support. A push block is installed within the combination support, and a pressing component is provided that penetrates the top surface of the combination support and pushes the push block to move it in the Z-axis direction. As the push block moves in the Z-axis direction by the pressing component, the wafer table A wafer dicing machine structure characterized by applying pressure to an upper wafer to cause the wafer to be diced along the pre-formed pre-compressed crack; when using such a wafer dicing machine structure, the support blade protrudes and extends into the wafer slot to support the wafer within the wafer slot, and moves until the splitting blade contacts the wafer to apply force to the wafer along the X-axis, thereby causing a pre-compressed crack to form on the wafer, and subsequently, the crushing jig is assembled and installed on the wafer table to press the push block in the Z-axis direction, thereby causing the wafer to be diced along the pre-compressed crack. Claim 2 In claim 1, the combination support comprises an upper seat plate and a lower seat plate, wherein the upper seat plate comprises two plates vertically connected integrally on adjacent sides, and the lower seat plate is connected to one of the plates and installed parallel to the other plate, and a slot is formed concavely inwardly from the top surface of the lower seat plate, and a guide groove is installed on the side of the lower seat plate and connected to the slot; the push block is installed between the upper seat plate and the lower seat plate, and a receiving chamber is installed on the bottom surface of the push block, and one end of a return spring supports the inside of the receiving chamber, and the other end supports the inside of the slot, so that the push block, which is pressed downward by the pressing component, returns to its original position; and a press plate is coupled to the push block at a position corresponding to the guide groove, and the press plate is guided along the guide groove and moves downward in the Z-axis direction together with the push block to apply pressure to the wafer, thereby causing a dicing operation to proceed on the wafer along the pre-compressed crack. Dicing machine structure. Claim 3 A wafer dicing machine structure according to paragraph 2, characterized in that a guide rod is installed on a diagonal portion of the top surface of the lower seat plate, and the two guide rods are inserted into the bottom surface of the push block to limit the assembly position of the push block and the lower seat plate. Claim 4 A wafer dicing machine structure according to paragraph 2, wherein the press plate has a plate section, and the plate section has two touch pressure axes extending downward along the Z-axis direction in a symmetrical manner, and the ends of the two touch pressure axes have a pressure plane; and the push block is installed in a manner corresponding to the fitting groove of the plate section, so that the press plate is joined to the plate section and the push block. Claim 5 A wafer dicing machine structure according to claim 2, wherein two position fixing holes are installed diagonally on the wafer table and are located on both sides of the wafer slot, respectively, and two position fixing rods are installed on the bottom surface of the lower plate corresponding to the position fixing holes, and the lower plate is inserted and installed into the two position fixing holes corresponding to each other through the two position fixing rods, thereby stably installing the crushing jig on the wafer table; and furthermore, on the top surface of the wafer table, at least one side extends outward and is connected to the outside, and a lower groove is formed concavely, and at least one side extends outward and is connected to the outside, and an upper groove is formed at a corresponding position on the bottom surface of the plate connecting the upper plate and the wafer table, and the upper groove and the lower groove correspond to each other to form an insertion hole into which an insert is inserted and fixed, and the crushing jig is fixed on the wafer table through the insert. Claim 6 A wafer dicing machine structure according to claim 4, wherein two round shafts are installed within the wafer slot, and their positions are respectively on both sides of the first groove and the second groove; both round shafts protrude above the upper edges of the first groove and the second groove, so that their top ends support the wafer; and the top ends of the two round shafts and the side edges of the two pressure planes correspond to each other, and when the two pressure planes contact the wafer, force is applied, thereby causing the wafer to undergo bending deformation by the arc side corresponding to the two round shafts, and dicing proceeds according to the pre-compressed crack. Claim 7 A wafer dicing machine structure according to claim 1, characterized in that the wafer table of the loading mechanism, the support blade of the position fixing mechanism, the dividing blade of the pre-pressing mechanism, and the support of the correction mechanism each move along a preset axial direction of movement through the driving force of at least one electric motor. Claim 8 A wafer dicing machine structure according to claim 1, wherein the dividing blade has a blade edge on one side facing the second groove and also has a thickness along the Z-axis, and the length corresponding to the blade edge of the dividing blade and the wafer within the wafer slot is within 1 / 2 of the thickness; a lower dividing blade is installed at a distance in front of the dividing blade, and the lower dividing blade moves along the X-axis within the second groove along the dividing blade, and the lower dividing blade extends upward along the Z-axis and supports the top of the second groove in a protruding form to perform a dicing operation on a wafer to which downward pressure is applied. Claim 9 A wafer dicing machine structure according to claim 1, wherein the calibration mechanism is connected to an operating interface of a control system, and the operating interface provides a calibration mode, wherein the calibration mode causes the camera to move to a corresponding detection position and to move along the X-axis to the upper side of the support blade of the corresponding position fixing mechanism, and the camera corrects the focus of the corresponding support blade along the Z-axis, and the operating interface aligns the corresponding support blade through a virtual reference point to obtain a virtual cross alignment line, and the camera retracts along the X-axis to the upper side of the splitting blade of the corresponding pre-pressing mechanism and corrects the focus of the corresponding splitting blade along the Z-axis, and the splitting blade is adjusted so that its tip aligns with the virtual cross alignment line along the Y-axis direction, thereby causing the splitting blade and the corresponding support blade to be positioned on the same straight line (L). Claim 10 A wafer dicing machine structure according to claim 9, wherein the operating interface provides a pre-compressing mode, wherein the pre-compressing mode moves the camera to a corresponding detection position and moves it along the X-axis to the upper side of the wafer table to detect the pre-compressing crack preparation line of the wafer; wherein the wafer table moves along the Y-axis, thereby aligning the pre-compressing crack preparation line of the wafer with the virtual cross alignment line of the operating interface; wherein the support blade of the position fixing mechanism moves along the X-axis direction to support the wafer and fix its position, and the camera retracts again along the X-axis to the blade entry entrance of the wafer's compression crack preparation line, and the splitting blade moves in a small width to contact the wafer until a pre-compressing crack occurs on the wafer, and then the splitting blade and the camera retract again.

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