Sensor assembly

Abstract

A sensor assembly is disclosed. A sensor assembly according to an embodiment of the present invention comprises a connector housing, a terminal, a sensor housing, a pressure chip, a substrate, and an inner frame. The sensor housing includes a main body having an internal space and a fastening part having an inlet passage. The pressure chip and the substrate are provided in the internal space. The inner frame is provided in the internal space such that its outer surface is in close contact with the inner surface of the main body, supports the inner housing, and is made to have greater rigidity or strength than the inner housing. In the sensor assembly according to an embodiment of the present invention, the inner frame supports the connector housing inside the sensor housing to prevent damage to the connector housing, and stable support and coupling of the pressure chip and the substrate are achieved.

Description

Technology Field

[0001] The present invention relates to a sensor assembly, and more specifically, to a sensor assembly that is easy to manufacture and can maintain a stable assembly structure. Background Technology

[0002] Pressure sensors are devices that detect external pressure and convert it into an electrical signal for measurement, and they are used in various industrial fields.

[0003] A piezoresistive pressure sensor is configured to measure pressure using a material whose resistance changes when pressure is applied, and a silicon-based strain gauge can be used.

[0004] In a pressure sensor, the diaphragm is a part that receives pressure and deforms according to the pressure, and a strain gauge is coupled to the diaphragm so as to convert the deformation of the diaphragm into an electrical signal.

[0005] The pressure sensor includes a connector, and the connector includes a connection terminal so that electrical connection can be made with an external connector.

[0006] In addition, the pressure sensor includes a pressure chip for measuring pressure and a substrate, etc., and the pressure chip is configured to communicate with a passage through which external fluid flows in, and the pressure chip and connection terminals are electrically connected to the substrate. The problem to be solved

[0007] The problem that the present invention aims to solve is to provide a sensor assembly that can stably support the connector housing and prevent damage to the connector housing when the connector housing and the sensor housing are combined, and stably support the substrate.

[0008] The problem that the present invention aims to solve is to provide a sensor assembly that is easy to manufacture while effectively achieving sealing inside the sensor assembly.

[0009] The problem that the present invention aims to solve is to provide a sensor assembly in which the pressure and temperature of a fluid are measured effectively and stable coupling between each component can be achieved. means of solving the problem

[0010] To achieve the above objective, a sensor assembly according to an embodiment of the present invention may comprise: a connector housing including an inner housing having a connection space inside; a conductive terminal coupled to the connector housing; a sensor housing including a main body coupled to the inner housing and having an internal space inside, and a fastening part having an inlet passage communicating with the internal space; a pressure chip provided in the internal space and configured to measure the pressure of a fluid through the inlet passage; a substrate provided in the internal space and electrically connected to the terminal and the pressure chip; and an inner frame provided in the internal space such that its outer surface is in close contact with the inner surface of the main body, supports the inner housing, and has greater rigidity or strength than the inner housing.

[0011] The inner frame may comprise: an outer wall that is in close contact with the inner circumference of the main body and supports the inner housing; an inner frame formed with a step on the inner side of the outer wall; and a frame penetration hole that penetrates the inner frame.

[0012] The above substrate can be seated and supported on the inner frame on the inner side of the outer wall.

[0013] A concave first fastening portion is formed on the outer wall, and the substrate may be formed to include a second fastening portion inserted into the first fastening portion.

[0014] A third fastening part in the form of a groove or a protrusion is formed on the outer wall, and a fourth fastening part that engages with the third fastening part may be formed on the edge of the inner housing.

[0015] The upper part of the main body can be curled to bend inward and be formed to be in close contact with the inner housing.

[0016] A concave sealing groove may be formed on the outer surface of the inner frame.

[0017] The sensor assembly may comprise an O-ring inserted into the sealing groove to seal the space between the main body and the inner frame.

[0018] The inner frame is made of metal, and the outer diameter of the inner frame is larger than the outer diameter of the inner housing, and the difference between the outer diameter of the inner frame and the outer diameter of the inner housing can be 1 / 30 to 1 / 5 of the thickness of the bottom of the inner housing.

[0019] A frame penetration hole may be provided in the center of the inner frame.

[0020] The above sensor assembly may include a ti package.

[0021] The above TIO package may comprise: a TIO head formed in a disc shape and coupled to the frame through-hole, and including an outer metal and an insulator filled inside the outer metal; a conductive TIO terminal coupled to the insulator through the TIO head, spaced apart from the outer metal, and electrically connected to the substrate; and a package through-hole penetrating the TIO head.

[0022] The outer metal of the above Tiohead can be joined to the inner frame by welding.

[0023] The sensor assembly comprises a ceramic plate having a ceramic through-hole that is coupled to the Tio head on the package through-hole and communicates with the package through-hole; and the pressure chip can be coupled to the ceramic plate while shielding the ceramic through-hole.

[0024] The sensor assembly may comprise a thermistor coupled to the Tio terminal and located in the inlet passage. Effects of the invention

[0025] According to an embodiment of the present invention, when the connector housing and the sensor housing are combined, the inner frame can stably support the connector housing while preventing damage to the connector housing, and can also stably support the substrate.

[0026] According to an embodiment of the present invention, the assembly of the inner frame, substrate, and connector is easily achieved.

[0027] According to an embodiment of the present invention, effective sealing is achieved within the sensor assembly centered on the inner frame and the TI package, while also facilitating manufacturing. Brief explanation of the drawing

[0028] FIG. 1 is a perspective view illustrating a sensor assembly according to one embodiment of the present invention. FIG. 2 is an exploded perspective view illustrating the sensor assembly shown in FIG. 1. FIG. 3 is a drawing showing the connector of the sensor assembly illustrated in FIG. 1. In FIG. 3, the connector housing is indicated by a dotted line. FIGS. 4a and FIGS. 4b are cross-sectional views illustrating the sensor assembly shown in FIGS. 1, respectively. Figure 5 is a cross-sectional view illustrating the sensor assembly shown in Figure 1. FIG. 6 is a drawing illustrating a partial configuration of a sensor assembly according to an embodiment of the present invention. In FIG. 6, the inner frame is shown in a cross-sectional perspective view. FIG. 7 is an exploded perspective view illustrating a part of the configuration of a sensor assembly according to one embodiment of the present invention. FIG. 8 is a drawing illustrating a partial configuration of a sensor assembly according to an embodiment of the present invention. In FIG. 8, the inner frame is shown in a cross-sectional perspective view. FIG. 9 is a perspective view illustrating a terminal according to one embodiment of the present invention. FIG. 10 is a cross-sectional view illustrating the sensor assembly illustrated in FIG. 1. FIG. 11 is a drawing illustrating a part of the configuration of a sensor assembly. In FIG. 11, the connector housing is shown in a cross-sectional form. Fig. 12 is a bottom view of the connector housing. FIG. 13 is a drawing showing a part of the configuration of a sensor assembly so that the connection space is visible. Specific details for implementing the invention

[0029] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, in describing the present invention, descriptions of already known functions or configurations will be omitted in order to clarify the gist of the present invention.

[0030] FIG. 1 is a perspective view illustrating a sensor assembly (1) according to one embodiment of the present invention.

[0031] FIG. 2 is an exploded perspective view showing the sensor assembly (1) illustrated in FIG. 1.

[0032] FIG. 3 is a drawing showing the connector (10) of the sensor assembly (1) illustrated in FIG. 1. In FIG. 3, the connector housing (100) is indicated by a dotted line.

[0033] The sensor assembly (1) according to an embodiment of the present invention may be a sensor assembly (1) configured to measure pressure.

[0034] The sensor assembly (1) may comprise a connector (10), a sensor housing (500), and a pressure chip (600). The sensor assembly (1) may comprise an inner frame (700) and a TIO package (800).

[0035] The connector (10) forms the part that connects to the external terminal.

[0036] The sensor housing (500) is combined with the connector (10) and together with the connector (10) forms the outer shape of the sensor assembly (1).

[0037] The sensor housing (500) is formed by including a main body (510) and a fastening part (520).

[0038] The main body (510) is coupled to surround the inner housing (130) of the connector housing (100), and an internal space (530) is provided therein.

[0039] The connecting portion (520) is provided with an inlet passage (540) through which external fluid flows in along the axial direction. The inlet passage (540) is in communication with the internal space (530). In the sensor housing (500), the inlet passage (540) may be formed on the opposite side of the connector (10). In the sensor housing (500), the inlet passage (540) may be formed parallel to the first direction (X).

[0040] The pressure chip (600) is provided inside the sensor assembly (1) and is configured to measure the pressure of the fluid flowing into the inlet passage (540) of the sensor housing (500). The pressure chip (600) is provided in the internal space of the main body.

[0041] In the sensor assembly (1) according to an embodiment of the present invention, the pressure chip (600) is configured to measure the pressure of a fluid. The pressure chip (600) may be composed of a piezoresistive pressure sensor, a capacitive pressure sensor, a piezoelectric pressure sensor, an electromagnetic pressure sensor, or a strain gauge pressure sensor.

[0042] The pressure chip (600) may be composed of a MEMS (Micro-Electro-Mechanical Systems) pressure sensor. The pressure chip (600) may be composed of a piezoresistive type MEMS pressure sensor or a capacitive type MEMS pressure sensor.

[0043] The pressure chip (600) may be formed to include a diaphragm and may include a piezoresist or an electrode. The diaphragm deforms when external pressure is applied, and pressure can be measured by the piezoresist or the electrode formed on the diaphragm.

[0044] The piezoresistive or electrode of the pressure chip (600) is coupled along the plane direction of the diaphragm so as to convert the deformation of the diaphragm into an electrical signal to measure pressure.

[0045] The sensor assembly (1) comprises a substrate (300). The substrate (300) may be a printed circuit board.

[0046] A substrate (300) according to an embodiment of the present invention is electrically connected to a pressure chip (600) to receive a signal from the pressure chip (600). The terminals of the substrate (300) may be connected to the piezoresistors or electrodes of the pressure chip (600) by wire bonding. The substrate (300) may amplify and compensate for the signal of the pressure chip (600) through mounted electrical components.

[0047] The substrate (300) can be formed flat along a direction orthogonal to the first direction (X).

[0048] A substrate (300) may be provided with a substrate through-hole (310). The substrate through-hole (310) penetrates the substrate (300) in a direction parallel to the first direction (X). A pressure chip (600) may be positioned on the substrate through-hole (310).

[0049] The diaphragm of the pressure chip (600) forms a membrane structure that detects external pressure by blocking the inlet passage (540) at the opposite side of the inlet of the sensor housing (500).

[0050] FIGS. 4a and FIGS. 4b are cross-sectional views illustrating the sensor assembly (1) shown in FIGS. 1, respectively.

[0051] FIG. 5 is a cross-sectional view illustrating the sensor assembly (1) shown in FIG. 1.

[0052] FIG. 6 is a drawing illustrating a partial configuration of a sensor assembly (1) according to an embodiment of the present invention. In FIG. 6, the inner frame (700) is shown in a cross-sectional perspective view.

[0053] FIG. 7 is an exploded perspective view illustrating a part of the configuration of a sensor assembly (1) according to one embodiment of the present invention.

[0054] FIG. 8 is a drawing illustrating a partial configuration of a sensor assembly (1) according to an embodiment of the present invention. In FIG. 8, the inner frame (700) is shown in a cross-sectional perspective view.

[0055] The inner frame (700) is coupled to the inside of the sensor housing (500). In an embodiment of the present invention, the substrate (300) can be seated and coupled to the inner frame (700).

[0056] The outer edge of the inner frame (700) is in close contact with the inner surface of the sensor housing (500), and the space between the inner frame (700) and the sensor housing (500) is sealed.

[0057] The inner frame (700) may be formed by including an outer wall (710), an inner frame (720), and a frame penetration hole (750).

[0058] The outer wall (710) is formed in the shape of a circular wall. The outer wall (710) is in close contact with the inner surface of the main body (510). The outer wall (710) supports the inner housing (130).

[0059] The inner frame (720) is formed on the inner side of the outer wall (710). The inner frame (720) may be formed integrally with the outer wall (710). The inner frame (720) forms the inner part of the inner frame (700).

[0060] The inner frame (720) is formed with a step from the outer wall (710). When viewed from the first direction (X), the inner frame (720) is formed concavely from the outer wall (710), and when viewed from the opposite direction of the first direction (X), the inner frame (720) is formed concavely from the outer wall (710). The upper end of the outer wall (710) is formed higher than the inner frame (720), and the lower end of the outer wall (710) is formed lower than the inner frame (720).

[0061] A frame penetration hole (750) is provided along the axial direction in the center of the inner frame (700). The frame penetration hole penetrates the inner frame (720). The frame penetration hole (750) penetrates the inner frame (720) in a direction parallel to the first direction (X). A Tio package (800) is coupled to the inner frame (700) in close contact on the frame penetration hole (750).

[0062] The central axis (A) of the inner frame (700) may coincide with the central axis (A) of the sensor housing (500). The central axis (A) may be parallel to the first direction (X).

[0063] The substrate (300) is seated and supported on the inner frame (720) on the inner side of the outer wall (710). When the outer wall (710) is formed in a circular shape, the substrate (300) can also be formed in a circular shape overall. By inserting and supporting the substrate (300) in the space formed by the outer wall (710) and the inner frame (720), the connection between the substrate (300) and the inner frame (700) is facilitated, and the protection of the substrate (300) by the inner frame (700) is stably achieved.

[0064] In the sensor assembly (1) according to an embodiment of the present invention, the inner frame (700) is made of a material having greater rigidity or strength than the inner housing (130). The inner frame (700) may be made of a metallic material.

[0065] It is preferable that the connector housing (100) be made of plastic due to its structural and functional characteristics. When the connector housing (100) is combined with the sensor housing (500), a strong load is applied inwardly due to the curling process of the sensor housing (500). In the sensor assembly (1) according to the embodiment of the present invention, an inner frame (700) that is in close contact with the inner surface of the main body (510) supports this load, thereby preventing the load from being applied directly to the inner housing (130) of the connector housing (100) and thus preventing damage to the connector housing (100).

[0066] In an embodiment of the present invention, the outer diameter of the inner frame (700) is made larger than the outer diameter of the inner housing (130), and the difference between the outer diameter of the inner frame (700) and the outer diameter of the inner housing (130) can be made to be 1 / 30 to 1 / 5 of the thickness (t5) of the bottom of the inner housing (130). In this way, by making the outer diameter of the inner frame (700) (outer diameter of the outer wall (710)) slightly larger than the outer diameter of the inner housing (130), most of the load acting during the curling process of the sensor housing (500) can be directed to the inner frame (700), and a stable connection between the sensor housing (500) and the inner housing (130) can be achieved.

[0067] A concave first fastening portion (711) is formed on the outer wall (710) of the inner frame (700). The first fastening portion (711) may be formed at any point along the circumferential direction of the outer wall (710).

[0068] A second fastening part (360) is formed on the edge of the substrate (300), and the second fastening part (360) can be inserted into the first fastening part (711).

[0069] By forming the first fastening part (711) and the second fastening part (360), the coupling position of the substrate (300) with respect to the inner frame (700) is quickly identified, and if rotation of the substrate (300) with respect to the inner frame (700) is prevented, the coupling of the inner frame (700) and the substrate (300) can be easily and stably achieved.

[0070] In an embodiment of the present invention, a third fastening part (712) may be formed on the outer wall (710) of the inner frame (700). The third fastening part (712) may be formed in the shape of a groove or a protrusion on the outer wall (710).

[0071] At this time, a fourth fastening part (132) that engages with a third fastening part (712) may be formed on the edge of the inner housing (130). When the third fastening part (712) is formed in a groove shape, the fourth fastening part (132) may be formed in a protrusion shape that is inserted into the groove (third fastening part (712)), and when the third fastening part (712) is formed in a protrusion shape, the fourth fastening part (132) may be formed in a groove shape into which the protrusion (third fastening part (712)) is inserted.

[0072] In the attached drawings of the present invention, the third fastening part (712) is formed in a groove shape and the fourth fastening part (132) is formed in a projection shape.

[0073] By forming the third connecting part (712) and the fourth connecting part (132), the connection position between the inner frame (700) and the connector (10) can be quickly identified, and the connection between the inner frame (700) and the connector (10) can be easily and stably achieved.

[0074] In addition, the connector housing (100), the substrate (300), and the inner frame (700) can be combined easily and stably, and the electrical connection between the terminal (200), the coil spring (400), and the substrate (300) can be easily and stably formed.

[0075] The inner frame (700) and the Tio head (810) of the Tio package (800) are coupled to the sensor housing (500) in a manner that shields the opposite side of the inlet of the inlet passage (540). The pressure of the fluid introduced into the inlet passage (540) is transmitted toward the Tio head (810) of the Tio package (800), and is transmitted toward the pressure chip (600) through the package penetration hole (811) of the Tio head (810) as described below.

[0076] The Tio package (800) comprises a Tio head (810) and a Tio terminal (820).

[0077] In the sensor assembly (1) according to an embodiment of the present invention, the TIO package (800) can be formed using a conventional TO package (transistor outline package). That is, the TIO package (800) of the present invention can be formed by forming a package through-hole (811) in a commercial TO package.

[0078] Accordingly, the formation of the Tio package (800) is easy, manufacturing costs can be reduced, and the sealing inside the sensor assembly (1) can be achieved stably and effectively.

[0079] The Tiohead (810) forms a predetermined area along a direction orthogonal to the first direction (X). The Tiohead (810) may be formed in the shape of a flat circular plate. The Tiohead (810) is coupled to the frame penetration hole (750). The Tiohead (810) may be coupled in such a way that a part thereof is inserted into the frame penetration hole (750).

[0080] The thiohead (810) may be made of an outer metal (810a) and an insulator (810b) (glassy) filled inside the outer metal (810a).

[0081] The outer metal (810a) can make up most of the outer surface (side, top, bottom) of the tiohead (810).

[0082] The outer edge of the Tiohead (810) is joined to the inner frame (700) in close contact on the frame penetration hole (750), and the frame penetration hole (750) is sealed by the Tiohead (810). The Tiohead (810) can be joined to the inner frame (700) by welding. The Tiohead (810) can be joined to the inner frame (700) by resistance welding.

[0083] Since the tio head (810) is made of an outer metal (810a) and an insulator (810b), the outer metal (810a) of the tio head (810) can be easily joined to the inner frame (700) by welding, and the seal between the tio package (800) and the inner frame (700) is effectively achieved.

[0084] The Tiohead (810) is provided with a package penetration hole (811). The package penetration hole (811) penetrates the Tiohead (810) and communicates with the inflow passage (540). The package penetration hole (811) may be formed parallel to the first direction (X). A pressure chip (600) shields the package penetration hole (811) and is coupled to the Tiohead (810). The pressure chip (600) is coupled to the Tiohead (810) on the opposite side of the inflow passage (540) with the Tiohead (810) at the center. The pressure of the fluid flowing into the inflow passage (540) is transmitted to the pressure chip (600) through the package penetration hole (811).

[0085] The Tio terminal (820) is made of conductive material and is fixed to the Tio head (810). The Tio terminal (820) is coupled to the Tio head (810) in a manner that penetrates the Tio head (810), is fixed to the insulator (810b) of the Tio head (810), and is spaced apart from the outer metal (810a). The Tio terminal (820) is formed lengthwise along the first direction (X). A thermistor (850) is coupled to one end (e.g., bottom) of the Tio terminal (820), and the other end (e.g., top) of the Tio terminal (820) is connected to the substrate (300).

[0086] A sensor assembly (1) according to an embodiment of the present invention may comprise a thermistor cover (900). The thermistor cover (900) is inserted inside a sensor housing (500) and is configured to surround a thermistor (850). The thermistor cover (900) may be made of an insulator.

[0087] The thermistor cover (900) is formed along the first direction (X), and a cover space (910) penetrating the interior is formed along the central axis direction, and a thermistor (850) and a TIO terminal (820) are located in the cover space (910) of the thermistor cover (900).

[0088] The thermistor cover (900) can be fixed to the sensor housing (500) as its outer surface is in close contact with the inner surface of the sensor housing (500).

[0089] The lower end of the thermistor cover (900) may protrude outward from the fastening part (520), and a cover hole (920) may be formed in the lower end of the thermistor cover (900) along a direction perpendicular to the first direction (X).

[0090] A sensor assembly (1) according to an embodiment of the present invention may comprise a ceramic plate (650).

[0091] The ceramic plate (650) is formed in the shape of a flat, small plate. The ceramic plate (650) is coupled to the Tiohead (810) on the package through hole (811). A ceramic through hole (651) is formed in the ceramic plate (650) that penetrates it, and the ceramic through hole (651) is in communication with the package through hole (811).

[0092] The pressure chip (600) can be bonded to the ceramic plate (650) while shielding the ceramic through-hole (651). That is, the pressure chip (600) can be fixed to the Tio package (800) via the ceramic plate (650). The pressure chip (600) can be bonded to the ceramic plate (650) by epoxy bonding. By bonding the pressure chip (600) to the Tio package (800) via the ceramic plate (650), the epoxy adhesive strength is greater than that of metal, allowing for stable bonding of the pressure chip (600).

[0093] In addition, the ceramic plate (650) has a lower coefficient of thermal expansion compared to metal, so stable pressure detection can be achieved.

[0094] The sensor assembly (1) includes an O-ring (790), and a concave sealing groove (715) may be formed on the outer surface of the inner frame (700).

[0095] The sealing groove (715) can be formed along the outer surface of the outer wall (710).

[0096] The O-ring (790) is inserted into the sealing groove (715). The O-ring (790) seals the space between the inner frame (700) and the sensor housing (500).

[0097] As described above, with the inner housing (130) of the connector (10) inserted into the sensor housing (500), the upper part of the sensor housing (500) (the end opposite to the first direction (X)) is curled by a press or lathe and bent inward to be in close contact with the inner housing (130), thereby completing the assembly of the pressure sensor.

[0098] FIG. 9 is a perspective view illustrating a terminal (200) according to one embodiment of the present invention.

[0099] FIG. 10 is a cross-sectional view illustrating the sensor assembly (1) illustrated in FIG. 1.

[0100] The connector (10) comprises a connector housing (100), a terminal (200), a substrate (300), and a coil spring (400).

[0101] The connector (10) is configured to allow an external terminal to be connected, and the external terminal is inserted into the connector (10) and coupled to the connector (10).

[0102] The connector housing (100) is formed by including an outer housing (110) and an inner housing (130).

[0103] The outer housing (110) is provided with an insertion space (111) inside. An external terminal is inserted into the insertion space (111) of the outer housing (110) and is electrically connected to the terminal (200) of the connector (10).

[0104] The inner housing (130) extends from the outer housing (110) in a first direction (X) and is provided with a connecting space (131) inside.

[0105] The first direction (X) described in the embodiment of the present invention may be a straight direction. The first direction (X) described in the embodiment of the present invention may be the direction in which the inner housing (130) is formed with respect to the outer housing (110). The first direction (X) described in the embodiment of the present invention may be parallel to the central axis (A) of the sensor housing (500). When the outer housing (110) is located relatively higher and the inner housing (130) is located relatively lower, the first direction (X) is parallel to the vertical direction.

[0106] In an embodiment of the present invention, the outer housing (110) is formed in a shape that is open to one side (e.g., the upper side), and an external terminal is inserted into the interior (insertion space (111)) of the outer housing (110) through this opening. The outer housing (110) may be opened in the opposite direction to the first direction (X).

[0107] The inner housing (130) is formed in a shape that is open to one side (e.g., the lower side), and the opening of the inner housing (130) is covered when the connector housing (100) and the sensor housing (500) are combined. The inner housing (130) can be opened in a first direction (X).

[0108] The connector housing (100) may be formed to include an internal partition (120). The internal partition (120) extends along a direction that intersects or is orthogonal to the first direction (X) and forms a portion where the outer terminal (210) and the inner terminal (230) are connected.

[0109] The internal partition (120) of the connector housing (100) separates the insertion space (111) and the connection space (131).

[0110] The connector housing (100) can be formed as a whole as a single unit. The connector housing (100) can be formed by injection molding.

[0111] In the sensor assembly (1) and connector (10), the terminal (200) may be provided in multiple numbers. As shown in the attached drawing, the terminal (200) in the sensor assembly (1) and connector (10) may be provided in four numbers.

[0112] Multiple terminals (200) may each have the same structure. Some terminals (200) may have a different orientation from other terminals (200).

[0113] The terminal (200) comprises an outer terminal (210) and an inner terminal (230). A single terminal (200) is formed as a whole as a single unit. The terminal (200) is made of electrically conductive material.

[0114] The outer terminal (210) is formed along the first direction (X) in the insertion space (111). The outer terminal (210) is the part where electrical connection is directly made with an external terminal. The outer terminal (210) is formed parallel to the first direction (X).

[0115] The inner terminal (230) extends from the outer terminal (210). The inner terminal (230) is formed along the first direction (X) and at least a portion is located in the connecting space (131).

[0116] The terminal (200) may be formed including an intermediate terminal (220). By forming the terminal (200) including the intermediate terminal (220), the terminal (200) may be formed in a shape that is folded twice overall.

[0117] The intermediate terminal (220) extends along a direction that intersects or is orthogonal to the first direction (X) and connects the outer terminal (210) and the inner terminal (230).

[0118] The intermediate terminal (220) is embedded in the connector housing (100). The intermediate terminal (220) is embedded and connected within the inner partition (120) of the connector housing (100).

[0119] The substrate (300) is located on the opposite side of the outer housing (110) with respect to the inner housing (130).

[0120] The substrate (300) includes a plurality of connection terminals (320) connected to the terminal (200). The connection terminals (320) are formed on the surface of the substrate (300). The plurality of connection terminals (320) may be spaced apart along the circumferential direction with respect to the central axis (A).

[0121] The position of the substrate (300) is fixed inside the sensor assembly (1). The substrate (300) can be fixed directly to the connector housing (100), or can be fixed to the connector housing (100) via other means. The substrate (300) can be fixed to the inner frame (700).

[0122] The coil spring (400) is made of electrically conductive material. The coil spring (400) is formed so that both ends (the end in the first direction (X) and the end opposite to the first direction (X)) are elastically supported by the inner terminal (230) and the substrate (300). The coil spring (400) mediates the electrical connection between the inner terminal (230) and the substrate (300).

[0123] In an embodiment of the present invention, the width (w2) of the inner terminal (230) may be 2 to 8 times the width (w1) of the outer terminal (210). The width (w2) of the inner terminal (230) may be 3 to 7 times the width (w1) of the outer terminal (210). The width (w2) of the inner terminal (230) may be approximately 5 times the width (w1) of the outer terminal (210).

[0124] In an embodiment of the present invention, at least a portion of the inner terminal (230) is embedded and fixed inside the connector housing (100).

[0125] The thickness (t) of the terminal (200) can be uniform throughout the entire terminal (200). The thickness (t1) of the outer terminal (210) and the thickness (t2) of the inner terminal (230) can be the same.

[0126] The width (w1) and thickness (t1) of the outer terminal (210) can be standardized.

[0127] The width (w2) of the inner terminal (230) is made larger than its thickness (t2). The width (w2) of the inner terminal (230) is made at least twice as large as the thickness (t2) of the inner terminal (230). The width (w2) of the inner terminal (230) can be made 3 to 7 times the thickness (t2) of the inner terminal (230). The width (w2) of the inner terminal (230) can be made about 5 times the thickness (t2) of the inner terminal (230).

[0128] By making the width (w2) of the inner terminal (230) relatively larger than the width (w1) of the outer terminal (210), when the terminal (200) and the connector housing (100) are assembled and combined, the inner terminal (230) portion can be firmly connected to the connector housing (100).

[0129] In one embodiment, the terminal (200) can be coupled to the connector housing (100) by insert injection molding, and even in this case, the width of the inner terminal (230) is made sufficiently large so that the contact area between the inner terminal (230) and the connector housing (100) can be increased and the terminal can be coupled firmly and stably to the connector housing (100).

[0130] As described below, a guide rib (160) and / or a guide projection (150) are integrally formed in the connector housing (100), and the guide rib (160) and / or the guide projection (150) guide the coupling of the coil spring (400) when the coil spring (400) and the connector housing (100) are assembled. In an embodiment of the present invention, the inner terminal (230) does not interfere with the injection molding of the guide rib (160) and / or the guide projection (150) and maintains stable contact between the coil spring (400) and the terminal (200) after the coil spring (400) and the connector housing (100) are assembled.

[0131] In an embodiment of the present invention, the guide rib (160) and the guide projection (150) may be made of the same material and may also be formed simultaneously. Accordingly, the guide rib (160) and the guide projection (150) can be stably formed along directions parallel to each other, can stably maintain a state of parallelism, and can stably maintain a shape along the first direction (X).

[0132] Therefore, the coil spring (400) and the connector housing (100) can be easily combined and the combined state can be maintained stably.

[0133] FIG. 11 is a drawing illustrating a part of the configuration of a sensor assembly (1). In FIG. 11, the connector housing (100) is shown in a cross-sectional shape.

[0134] In an embodiment of the present invention, the inner terminal (230) may be formed to include a seating surface (231) and a support projection (232).

[0135] The seating surface (231) forms a surface to which the end of the coil spring (400) is in contact. The seating surface (231) may be formed along a direction perpendicular to the first direction (X).

[0136] The support projection (232) protrudes in the first direction (X) from both sides in the width direction of the inner terminal (230). As described above, in an embodiment of the present invention, the width of the inner terminal (230) is sufficiently larger than its thickness, and accordingly, the formation of the support projection (232) from both sides in the width direction of the inner terminal (230) can be easily achieved, and the structure of the inner terminal (230) with the support projection (232) formed thereon can be stably maintained.

[0137] When the coil spring (400) and the terminal (200) are combined, a pair of support protrusions (232) are located on both sides of the end of the coil spring (400), so that the end of the coil spring (400) is stably maintained in contact with the inner terminal (230).

[0138] FIG. 12 is a bottom view of the connector housing (100).

[0139] FIG. 13 is a drawing showing a part of the configuration of the sensor assembly (1) so that the connection space (131) is visible.

[0140] In an embodiment of the present invention, the connector housing (100) is formed to include a guide projection (150).

[0141] The guide projection (150) is integrally formed with the inner housing (130). The guide projection (150) protrudes from the inner terminal (230) in a first direction (X). With respect to the first direction (X), the degree of protrusion of the guide projection (150) is greater than the degree of protrusion of the support projection (232).

[0142] In the connector housing (100), guide protrusions (150) may be provided in multiple numbers. Guide protrusions (150) may be formed for each terminal (200).

[0143] The diameter of the guide projection (150) may be equal to or slightly smaller than the inner diameter of the coil spring (400).

[0144] The guide projection (150) is inserted into the coil spring (400). In the sensor assembly (1) and connector (10) according to an embodiment of the present invention, the guide projection (150) facilitates the assembly of the coil spring (400) and the connector housing (100) and ensures that the coupling state of the coil spring (400) is stable.

[0145] The inner terminal (230) may be formed to include a coupling groove (233), and the connector housing (100) may be formed to include a protruding base (140).

[0146] The coupling groove (233) is formed in a shape that is recessed from the center of the seating surface (231) toward the opposite side of the first direction (X). The coupling groove (233) is formed in a shape that penetrates the inner terminal (230) in the second direction (Y) which is orthogonal to the first direction (X).

[0147] The protrusion base (140) forms a portion that fills the inside of the coupling groove (233) in the connector housing (100) and is formed integrally with the inner housing (130) and the guide protrusion (150).

[0148] When the terminal (200) and the connector housing (100) are joined by insert injection, the molten injection material (molten resin) fills the joining groove (233) to form a protrusion base (140) and connects the inner housing (130) and the guide protrusion (150). The protrusion base (140) ensures that the guide protrusion (150) is formed stably and also ensures that the guide protrusion (150) is firmly formed in the connector housing (100).

[0149] The connector housing (100) is formed including guide ribs (160).

[0150] Guide ribs (160) are provided in pairs in corresponding forms. When guide ribs (160) are formed in the connector housing (100), a pair of guide ribs (160) can be formed for each terminal (200). That is, the number of guide ribs (160) can be twice the number of terminals (200).

[0151] The guide rib (160) is integrally formed with the inner housing (130). A pair of guide ribs (160) protrude from the inner terminal (230) in a first direction (X) and are located on both sides of the coil spring (400). The spacing between the pair of guide ribs (160) may be equal to or slightly larger than the outer diameter of the coil spring (400).

[0152] In an embodiment of the present invention, when viewed from the first direction (X), a pair of support protrusions (232) and a pair of guide ribs (160) may be arranged to intersect each other. When viewed from the first direction (X), a pair of support protrusions (232) and a pair of guide ribs (160) may be arranged in a cross shape.

[0153] In an embodiment of the present invention, the protrusion length of the support projection (232) from the inner surface (121) of the inner housing (130) may be smaller than the protrusion length of each of the guide projection (150) and the guide rib (160). In an embodiment of the present invention, the protrusion length of each of the guide projection (150) and the guide rib (160) from the inner surface (121) of the inner housing (130) may be at least 3 times and no more than 10 times the protrusion length of the support projection (232). In an embodiment of the present invention, even if the protrusion length of the support projection (232) is formed to be relatively short, the assembly of the coil spring (400) can be easily and stably performed, and the support of the coil spring (400) can be stably performed.

[0154] In an embodiment of the present invention, the guide projection (150) and guide rib (160) formed on the connector housing (100) allow the coil spring (400) to be assembled stably, and the support projection (232) ensures that the coil spring (400) assembled (together with the guide projection (150) and guide rib (160)) makes stable contact with the terminal (200) without detaching.

[0155] As described above, according to an embodiment of the present invention, when manufacturing the connector (10), the shape of the terminal (200) is stably maintained and is firmly coupled to the connector (10), and accordingly, the electrical connection of the terminal (200), coil spring (400), and substrate (300) can be stably established.

[0156] In addition, a means for guiding and supporting the coil spring (400) in the connector (10) can be stably formed, and the electrical connection between the terminal (200), the coil spring (400), and the substrate (300) is stably formed during the manufacture and use of the connector (10) and the sensor assembly (1).

[0157] As described above, according to the sensor assembly (1) of the embodiment of the present invention, when the connector housing (100) and the sensor housing (500) are combined, the inner frame (700) can stably support the connector housing (100) and prevent damage to the connector housing (100), and can also stably support the substrate (300).

[0158] In addition, the assembly of the inner frame (700), the substrate (300), and the connector (10) can be easily performed, and the electrical connection of each electrical component can be easily and stably performed.

[0159] In addition, sealing can be effectively achieved around the inner frame (700) and the tio package (800) inside the sensor assembly (1), and manufacturing can be easily achieved.

[0160] Although specific embodiments of the present invention have been described and illustrated above, it is obvious to those skilled in the art that the present invention is not limited to the described embodiments and can be modified and varied in various ways without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations should not be understood individually from the technical spirit or perspective of the present invention, and the modified embodiments should be considered to fall within the scope of the claims of the present invention. Explanation of the symbols

[0161] 1 : Sensor assembly 10 : Connector 100 : Connector housing 110 : Outer housing 111 : Insertion space 120 : Internal bulkhead 130 : Inner housing 131 : Connecting space 132: 4th connecting part 140 : Protrusion base 150 : Guide protrusion 160 : Guide rib 200 : Terminal 210 : Outer Terminal 220 : Middle Terminal 230 : Inner Terminal 231 : Landing Surface 232 : Support projection 233 : Connecting groove 300 : Substrate 310 : Substrate through-hole 360: Second connecting part 400 : Coil spring 500 : Sensor housing 510 : Main body 520 : Fastening part 530 : Interior space 540 : Inflow passage 600 : Pressure chip 650 : Ceramic plate 651: Ceramic through-hole 700: Inner frame 710: Outer wall 711: First fastening part 712: Third connecting part 715: Sealing groove 720: Inner frame 750: Frame penetration hole 800 : Tio Package 810 : Tio Head 810a: External metal 810b: Insulator 811 : Package through-hole 820 : TIO terminal 850: Thermistor X: 1st direction Y: 2nd direction

Claims

Claim 1 A sensor assembly comprising: a connector housing including an inner housing made of plastic and having a connection space inside; a conductive terminal coupled to the connector housing; a sensor housing including a main body coupled to the inner housing and having an internal space inside, and a fastening part having an inlet passage communicating with the internal space; a pressure chip provided in the internal space and configured to measure the pressure of a fluid through the inlet passage; a substrate provided in the internal space and electrically connected to the terminal and the pressure chip; and an inner frame provided in the internal space such that its outer surface is in close contact with the inner surface of the main body, supporting the inner housing, and having greater rigidity or strength than the inner housing. Claim 2 In claim 1, the inner frame comprises: an outer wall that is in close contact with the inner circumference of the main body and supports the inner housing; an inner frame formed in a concave and stepped manner on the inner side of the outer wall; and a frame penetration hole penetrating the inner frame, wherein the substrate is seated and supported on the inner frame on the inner side of the outer wall, a sensor assembly. Claim 3 A sensor assembly according to paragraph 2, wherein a concave first fastening portion is formed on the outer wall, and the substrate includes a second fastening portion inserted into the first fastening portion. Claim 4 A sensor assembly according to paragraph 3, wherein a third fastening part in the form of a groove or protrusion is formed on the outer wall, and a fourth fastening part that engages with the third fastening part is formed on the edge of the inner housing. Claim 5 A sensor assembly according to claim 1, wherein the upper end of the main body is curled and bent inward so as to be in close contact with the inner housing. Claim 6 In paragraph 2, a concave sealing groove is formed on the outer surface of the inner frame, and the sensor assembly comprises an O-ring inserted into the sealing groove to seal the space between the main body and the inner frame. Claim 7 A sensor assembly according to claim 1, wherein the inner frame is made of metal, the outer diameter of the inner frame is larger than the outer diameter of the inner housing, and the difference between the outer diameter of the inner frame and the outer diameter of the inner housing is 1 / 30 to 1 / 5 of the thickness of the bottom of the inner housing. Claim 8 In claim 1, a frame penetration hole is provided in the center of the inner frame, and the sensor assembly comprises a TIO package, wherein the TIO package is formed in a disc shape and coupled to the frame penetration hole and comprises a TIO head including an outer metal and an insulator filled inside the outer metal; a conductive TIO terminal coupled to the insulator through the TIO head but spaced apart from the outer metal and electrically connected to the substrate; and a package penetration hole penetrating the TIO head; wherein the outer metal of the TIO head is coupled to the inner frame by welding. Claim 9 In claim 8, the sensor assembly comprises a ceramic plate having a ceramic through-hole that is coupled to the Tiohead on the package through-hole and communicates with the package through-hole; and the pressure chip shielding the ceramic through-hole and coupled to the ceramic plate. Claim 10 In claim 8, the sensor assembly comprises a thermistor coupled to the TIO terminal and located in the inlet passage.

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