Operating method of electronic device for determining blending ratio of regrind based on degradation index and predicting blended properties for recycling epoxy heat-resistant component for semiconductor inspection equipment

Abstract

A method of operation of an electronic device comprising a processor according to an embodiment of the present invention for determining a recycled component mixing ratio and predicting mixed physical properties based on a degradation index for recycling an epoxy heat-resistant component for semiconductor inspection equipment may include the following operations: the processor acquiring thermal history information and contamination information for a recycled component obtained by crushing an epoxy heat-resistant component classified as defective; the processor calculating a degradation index indicating the degree of degradation of the recycled component based on the acquired thermal history information and contamination information; the processor determining a mixing ratio of the recycled component to a new epoxy material based on the calculated degradation index; the processor calculating a predicted physical property of a mixture of the recycled component and the new epoxy material based on the determined mixing ratio, the physical property of the recycled component, and the physical property of the new epoxy material; and the processor confirming the determined mixing ratio as a recycling blend when the calculated predicted physical property satisfies the specification properties of a target component.

Description

Technology Field

[0001] The present invention relates to a technology for predicting mixed properties for recycling, and more specifically, to a technology for predicting mixed properties based on a degradation index. Background Technology

[0002] Semiconductor inspection equipment is repeatedly exposed to high-temperature environments during the process of precisely measuring the electrical characteristics of wafers and packages, and components placed inside the equipment may need to possess excellent heat resistance to withstand these thermal loads. To meet these requirements, heat-resistant components manufactured from epoxy, a thermosetting resin, are widely used; these epoxy heat-resistant components can maintain dimensional stability even during the repetitive temperature cycles of the inspection process through their high glass transition temperature and low thermal expansion characteristics.

[0003] Epoxy resin is a thermosetting polymer that forms irreversible cross-links between molecular chains during the curing process; once curing is complete, it may not regain fluidity or remelt even upon reheating. This physical characteristic fundamentally distinguishes it from thermoplastic resins, which can be repeatedly melted and molded by heating. Consequently, remelting-based recycling methods established for thermoplastic materials may be difficult to apply directly to heat-resistant epoxy parts. Therefore, the recycling of heat-resistant epoxy parts may require an approach that incorporates recycled material obtained by physically crushing the cured parts into the new material, rather than a method involving melting the material.

[0004] Meanwhile, epoxy heat-resistant parts manufactured to meet the client's drawings and specifications must satisfy strict standards regarding dimensional tolerances, surface condition, and heat resistance performance; parts that do not meet these standards are classified as defective and may be discarded or recyclable. Since defective parts disposed of through the disposal route result in both material cost losses and waste disposal expenses, attempts may be made to improve resource efficiency by recovering defective parts in the form of recycled components and incorporating them into new materials at a certain ratio.

[0005] However, recycled material obtained by crushing defective epoxy heat-resistant parts may not have uniform physical properties depending on the thermal history and contamination status of individual parts. Recycled material subjected to excessive heat during the molding and inspection processes may experience damage to its cross-linking structure or undergo localized oxidation, leading to a decrease in heat resistance performance. Furthermore, recycled material contaminated with foreign substances, such as dust or release agent residues introduced during handling, may cause defects within the molded body. Consequently, if recycled material with varying degrees of degradation is mixed in at a uniform ratio, there is a risk that the physical properties of the final molded body will fail to meet target specifications.

[0006] Conventionally, the mixing ratio of recycled materials has been determined based on operator experience or fixed mixing formulas; however, this method may have limitations in that it fails to quantitatively reflect the varying degradation states of each recycled material. Consequently, inefficiencies may arise, such as the same ratio being applied to severely degraded recycled materials to produce substandard molded bodies, or conversely, an overly conservative ratio being applied to minorly degraded materials to result in the excessive waste of recyclable resources. Therefore, there is a need for technology capable of quantitatively evaluating the degree of degradation of recycled materials, determining the mixing ratio based on this assessment, and predicting physical properties after mixing to determine whether specifications are met. The problem to be solved

[0007] A method of operation of an electronic device for determining the mixing ratio of recycled material and predicting mixed properties based on a degradation index for recycling epoxy heat-resistant parts for semiconductor inspection equipment according to embodiments of the present invention aims to overcome the limitations of conventional methods that relied on operator experience or fixed formulation tables by calculating a degradation index that quantitatively reflects thermal history information and contamination information of recycled material obtained by crushing epoxy heat-resistant parts classified as defective, and to derive a formulation that objectively reflects the different degradation states of each recycled material.

[0008] A method of operation of an electronic device for determining the mixing ratio of recycled components and predicting mixed properties based on a degradation index for recycling epoxy heat-resistant components for semiconductor inspection equipment according to embodiments of the present invention aims to reduce unnecessary molding attempts for formulations expected to fall short of specifications and to reduce material loss and process time by calculating the predicted properties of a mixture of recycled components and new epoxy materials before molding and comparing them with the specification properties of a target component.

[0009] A method of operation of an electronic device for determining a recycled component inclusion ratio and predicting mixed properties based on a degradation index for recycling epoxy heat-resistant components for semiconductor inspection equipment according to embodiments of the present invention aims to maximize the utilization of recyclable recycled components and selectively exclude only recycled components that cannot meet specifications by performing closed-loop recalculation, in which if the predicted properties do not satisfy the specifications, the inclusion ratio is reduced to recalculate the predicted properties, and if the inclusion ratio reaches a lower limit value or lower but the specifications are still not satisfied, the recycled components are routed to a disposal path.

[0010] A method of operation of an electronic device for determining the mixing ratio of recycled material based on a degradation index and predicting mixed physical properties for the recycling of epoxy heat-resistant components for semiconductor inspection equipment according to embodiments of the present invention aims to provide a resource circulation path specialized for thermosetting heat-resistant components to which conventional remelting-based recycling methods were difficult to apply, by adopting a method of mixing crushed recycled material into a new material considering the physical limitations of epoxy materials that cannot be remelted, and determining the mixing ratio in conjunction with the degree of degradation.

[0011] A method of operation of an electronic device for determining the mixing ratio of recycled components and predicting mixed properties based on a degradation index for recycling epoxy heat-resistant components for semiconductor inspection equipment according to embodiments of the present invention aims to improve the overall throughput of the recycling process and reduce variability caused by human intervention by controlling the introduction of recycled components and new epoxy materials into a molding process according to a determined recycling composition, thereby linking a series of processes from degradation evaluation to composition determination, property prediction, and molding introduction into an automated flow.

[0012] The technical problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0013] A method of operation of an electronic device comprising a processor according to an embodiment of the present invention for determining a recycled component mixing ratio and predicting mixed physical properties based on a degradation index for recycling an epoxy heat-resistant component for semiconductor inspection equipment may include the following operations: the processor acquiring thermal history information and contamination information for a recycled component obtained by crushing an epoxy heat-resistant component classified as defective; the processor calculating a degradation index indicating the degree of degradation of the recycled component based on the acquired thermal history information and contamination information; the processor determining a mixing ratio of the recycled component to a new epoxy material based on the calculated degradation index; the processor calculating a predicted physical property of a mixture of the recycled component and the new epoxy material based on the determined mixing ratio, the physical property of the recycled component, and the physical property of the new epoxy material; and the processor confirming the determined mixing ratio as a recycling blend when the calculated predicted physical property satisfies the specification properties of a target component.

[0014] A method of operation of an electronic device including a processor according to an embodiment of the present invention for determining the mixing ratio of recycled material and predicting mixed physical properties based on a degradation index for recycling epoxy heat-resistant components for semiconductor inspection equipment may further include: the operation of the processor controlling a humidity control device to supply humidifying air having a relative humidity of 30% or more and 40% or less and a temperature of 20°C or more and 25°C or less into a chamber containing the recycled material; the operation of the processor acquiring an acoustic emission signal emitted by the recycled material from an ultrasonic sensor while the humidifying air is supplied; the operation of the processor calculating the cumulative occurrence number of a component included in a frequency band of 100 kHz or more and 300 kHz or less among the acquired acoustic emission signals; and the operation of the processor determining that microcracks exist in the recycled material and reflecting this in the thermal history information when the calculated cumulative occurrence number exceeds a preset reference number.

[0015] A method of operation of an electronic device comprising a processor according to an embodiment of the present invention for determining a recycled component incorporation ratio based on a degradation index and predicting mixed properties for recycling an epoxy heat-resistant component for semiconductor inspection equipment, wherein the processor controls a measuring device to perform dynamic mechanical analysis on a specimen of a test mixture of the recycled component and the new epoxy material at a heating rate of 5°C or more and 10°C or less per minute in order to calculate the predicted properties; the processor determines the temperature at which the loss tangent obtained by the dynamic mechanical analysis becomes maximum as the glass transition temperature of the specimen; and the processor stores the determined glass transition temperature in correspondence with the incorporation ratio and corrects the predicted properties using the stored value.

[0016] A method of operation of an electronic device comprising a processor according to an embodiment of the present invention for determining the mixing ratio of recycled material and predicting mixed properties based on a degradation index for recycling epoxy heat-resistant parts for semiconductor inspection equipment may further include the operation of the processor controlling a degassing device to degas the mixture of the recycled material and the new epoxy material introduced into the molding process in a reduced pressure atmosphere with a vacuum level of 0.5 kPa or more and 2 kPa or less; the operation of the processor obtaining the viscosity of the mixture from a viscometer while the degassing is being performed; and the operation of the processor releasing the reduced pressure atmosphere and controlling the supply of the mixture to a molding die when the obtained viscosity reaches a preset target viscosity range. Effects of the invention

[0017] The effects of the operation method of an electronic device for determining the mixing ratio of recycled components based on a degradation index and predicting mixed physical properties for the recycling of epoxy heat-resistant components for semiconductor inspection equipment according to embodiments of the present invention are described as follows.

[0018] According to one embodiment of the present invention, an electronic device calculates a degradation index by quantitatively reflecting thermal history information and contamination level information of the recycled material and determines the mixing ratio based thereon, thereby enabling the derivation of a mixture that objectively reflects the different degradation states of each recycled material, compared to conventional methods that relied on operator experience or fixed mixing tables. This can improve the reproducibility and reliability of the recycling process.

[0019] According to one embodiment of the present invention, an electronic device can determine in advance whether specifications are satisfied before actual molding and inspection by calculating the predicted physical properties of a mixture of recycled and new epoxy materials before molding and comparing them with the specification physical properties of a target part. Accordingly, unnecessary molding attempts for formulations expected to fail to meet specifications are reduced, thereby reducing material loss and process time.

[0020] According to one embodiment of the present invention, an electronic device can recalculate the predicted physical properties by reducing the mixing ratio when the predicted physical properties do not satisfy the standard physical properties, and perform closed-loop reorganization by routing the recycled portion to a disposal path when the mixing ratio reaches a lower limit value or below and the specifications are still not satisfied, thereby maximizing the utilization of recyclable recycled portions and selectively excluding only the recycled portions that cannot meet the specifications. Through this, resource utilization and quality assurance can be achieved simultaneously.

[0021] According to one embodiment of the present invention, an electronic device can provide a recycling pathway specialized for thermosetting heat-resistant components by adopting a method of incorporating crushed recycled material into a new material, taking into account the physical limitations of epoxy materials that cannot be remelted unlike thermoplastic resins, and determining the incorporation ratio in conjunction with the degree of degradation. Accordingly, resource circulation of epoxy heat-resistant components, to which conventional remelting-based recycling methods were difficult to apply, can be made possible.

[0022] According to one embodiment of the present invention, an electronic device controls the introduction of recycled components and new epoxy materials into a molding process according to a determined recycling formulation, thereby linking a series of processes from degradation evaluation to formulation determination, property prediction, and molding input into an automated flow. This improves the throughput of the entire recycling process and reduces variability caused by human intervention. Brief explanation of the drawing

[0023] FIG. 1 is a block diagram showing the components of an electronic device according to one embodiment of the present invention. FIG. 2 is a block diagram showing the components of a system in which an operation method of an electronic device is performed to determine the mixing ratio of recycled components based on a degradation index and predict the mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment according to one embodiment of the present invention. FIG. 3 is a flowchart of the operation method of an electronic device for determining the mixing ratio of recycled components based on a degradation index and predicting mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment according to one embodiment of the present invention. FIG. 4 is a specific operation flowchart included in the operation method of an electronic device for determining the mixing ratio of recycled components based on a degradation index and predicting mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment according to one embodiment of the present invention. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Specific details for implementing the invention

[0024] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that in assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the embodiments of the present invention, if it is determined that a detailed description of related known components or functions would hinder understanding of the embodiments of the present invention, such detailed description is omitted.

[0025] In describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are intended merely to distinguish the components from other components, and the essence, order, or sequence of the components is not limited by such terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4.

[0027] FIG. 1 is a block diagram showing the components of an electronic device according to one embodiment of the present invention.

[0028] According to one embodiment, the electronic device (100) may include a memory (110), a processor (120), a communication interface (130), and / or a display device (140). The configuration of the electronic device (100) illustrated in FIG. 1 is exemplary and the embodiments of the present invention are not limited thereto. For example, the electronic device (100) may further include components not illustrated in FIG. 1 (e.g., a user interface, an input device, a notification unit, a sensor unit, or at least one of any combination thereof).

[0029] According to one embodiment, the memory (110) may store instructions or data. For example, the memory (110) may store one or more instructions that cause the electronic device (100) to perform various operations when executed by the processor (120).

[0030] For example, the memory (110) may be implemented as a single chipset with the processor (120). The processor (120) may include at least one of a communication processor or a modem.

[0031] For example, the memory (110) can store various information related to the electronic device (100). For example, the memory (110) can store information regarding the operation history of the processor (120). For example, the memory (110) can store input data acquired by the electronic device (100), output data output by the electronic device (100), data acquired from an external server, a wearable device, a plurality of cameras and / or user terminals, etc.

[0032] For example, the memory (110) may include multiple storage devices of different types. For example, the memory (110) may include volatile and / or non-volatile storage media. For example, the memory (110) may include at least one of RAM (random-access memory), ROM (read only memory), eMMC (Embedded Multi-Media Card), or any combination thereof.

[0033] The steps of the method or algorithm described in connection with the embodiments disclosed in this specification may be directly implemented in hardware, software modules, or a combination of both, executed by the processor (120). The software modules may reside in a storage medium (i.e., memory (110)) such as RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, a hard disk, a removable disk, or a CD-ROM.

[0034] For example, the memory (110) is coupled to a processor (120), and the processor (120) can read information from a storage medium and write information to a storage medium. Alternatively, the memory (110) may be integrated with the processor (120). The memory (110) and the processor (120) may reside within an application-specific integrated circuit (ASIC). The ASIC may reside within a user terminal. Alternatively, the memory (110) and the processor (120) may reside as separate components within the user terminal.

[0035] According to one embodiment, the processor (120) may be operatively connected to the memory (110), the communication interface (130), and / or the display device (140). For example, the processor (120) may control the operation of the memory (110), the communication interface (130), and / or the display device (140).

[0036] According to one embodiment, the communication interface (130) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (100) and an external device (e.g., user terminal (210) of FIG. 2, external server (220), etc.), and the performance of communication through the established communication channel. The communication interface (130) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication interface (130) may include a wireless communication module (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (e.g., LAN (local area network) communication module, or power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device through a first network (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a long-range communication network such as a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module can identify or authenticate the electronic device (100) within a communication network, such as the first network or the second network, using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in a subscriber identification module.

[0037] According to one embodiment, the display device (140) may include at least one output device that provides various information and a user interface to the user.

[0038] For example, the display device (140) may include a display device, an audio output device, a virtual reality output device, etc.

[0039] For example, the display device (140) can provide the user with various types of user interfaces described in the present invention visually and / or audibly.

[0040] The components of the electronic device (100) illustrated in FIG. 1 are exemplary, and embodiments of the present invention are not limited thereto.

[0041] At least some of the embodiments of the present invention may be implemented as artificial intelligence (AI) through a processor (120) and memory (110) of an electronic device (100). The processor (120) may be composed of one or more processors, and the one or more processors may be general-purpose processors such as a CPU, AP, DSP (digital signal processor), etc., graphics-dedicated processors such as a GPU, VPU (vision processing unit), or artificial intelligence-dedicated processors such as an NPU. The one or more processors may be controlled to process input data according to predefined operation rules or artificial intelligence models stored in memory (110). Alternatively, if the one or more processors are artificial intelligence-dedicated processors, the artificial intelligence-dedicated processors may be designed with a hardware structure specialized for processing a specific artificial intelligence model.

[0042] The predefined operation rules or artificial intelligence models are characterized by being created through learning. Here, being created through learning means that a predefined operation rules or artificial intelligence models are created by a basic artificial intelligence model being trained using multiple learning data by a learning algorithm to perform a desired characteristic (or purpose). Such learning may be performed within the electronic device (100) itself where the artificial intelligence according to the present invention is performed, or through a separate server and / or system. Examples of learning algorithms include supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but are not limited to the examples described above.

[0043] An artificial intelligence model may be composed of multiple neural network layers. Each of the multiple neural network layers has multiple weight values ​​and can perform neural network operations through operations between the results of previous layers and the multiple weights. The multiple weights possessed by the multiple neural network layers can be optimized based on the learning results of the artificial intelligence model. For example, the multiple weights can be updated so that the loss value or cost value obtained from the artificial intelligence model during the learning process is reduced or minimized. Artificial neural networks may include, but are not limited to, deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), or deep Q-networks.

[0044] The electronic device (100) can evaluate the degree of degradation using an artificial intelligence model that takes thermal history information and contamination information of the recycled material as input and outputs a degradation index. This artificial intelligence model may be pre-trained using thermal history data and contamination data measured for multiple recycled material samples, as well as actual physical property measurements of the samples, as training data, and can capture from the data the non-linear relationship in which thermal history and contamination status contribute to the degradation of physical properties. Accordingly, the electronic device (100) can reflect complex degradation patterns that are difficult to reflect with a simple linear weighted sum alone in the degradation index.

[0045] The electronic device (100) can adopt various types of regression models as an artificial intelligence model, such as a multilayer perceptron, support vector regression, and gradient boosting-based regression model, and when the input thermal history information is in the form of a time series such as a temperature profile over time, it can extract time series features using a recurrent neural network or a one-dimensional convolutional neural network. The electronic device (100) can convert the extracted features into an indicator representing the degree of thermal aging and an indicator representing the foreign matter content, and then combine them to calculate a degradation index, thereby optimizing the process from raw data to the degradation index based on data.

[0046] The electronic device (100) can calculate the predicted physical properties of the mixture using an artificial intelligence model that has learned the mixing ratio of recycled components and physical property data. Since heat resistance performance indicators such as the glass transition temperature or heat distortion temperature do not necessarily match the value obtained by simply weighting the physical properties of each component during the curing process of the recycled components and new epoxy materials, and may vary non-linearly depending on the mixing ratio, the electronic device (100) can calculate the predicted physical properties that correct for such non-linearity through an artificial intelligence model learned from the physical property measurements of the actual mixed sample. Accordingly, the prediction accuracy can be improved compared to the case where only the weighted sum method is used.

[0047] The electronic device (100) can perform relearning by comparing the prediction result of the artificial intelligence model with the material property measurement value obtained from actual molding and inspection, calculating the difference as an error, and updating the weights of the artificial intelligence model using the calculated error. Through this relearning, the electronic device (100) can maintain prediction performance even when the characteristic distribution of the recycled material shifts due to changes in the material lot, changes in inspection process conditions, seasonal factors, etc., and can gradually improve the accuracy of calculating the degradation index and predicting material properties by reflecting accumulated production data.

[0048] The electronic device (100) can calculate the reliability or uncertainty of the predicted physical properties calculated by the artificial intelligence model, and if the calculated uncertainty exceeds a preset standard, it can guide the device to refer to the calculated value of a physical model based on weighted summation in parallel, rather than relying solely on the output of the artificial intelligence model, or to perform verification molding for actual physical property measurement. Through this, the electronic device (100) can ensure the stability of the formulation decision even for deteriorated areas where data is insufficient or for regenerated parts that deviate from the distribution of training data.

[0049] FIG. 2 is a block diagram showing the components of a system in which an operation method of an electronic device is performed to determine the mixing ratio of recycled components based on a degradation index and predict the mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment according to one embodiment of the present invention.

[0050] According to one embodiment, a system for performing an operation method of an electronic device that determines the mixing ratio of recycled components based on a degradation index and predicts mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment may include an electronic device (100), a user terminal (210), and an external server (220).

[0051] The electronic device (100) is a device that performs a series of operations ranging from the evaluation of the degradation of recycled material to the determination of the mixing ratio, the prediction of physical properties, and the confirmation of the composition, and may be configured to include a processor and memory. The electronic device (100) may be implemented in the form of a server computer, an industrial control computer, a workstation, etc., and may be deployed at a production site where a recycling process is carried out or deployed at a remote data center and connected to the field equipment through a communication network.

[0052] The processor of the electronic device (100) may include one or more computational units, such as a central processing unit, a graphics processing unit, and a neural network processing unit, and can perform operations such as calculating a degradation index, determining a mixing ratio, calculating predicted physical properties, and determining whether specifications are satisfied by executing instructions stored in memory. When inference computation of an artificial intelligence model is required, the processor of the electronic device (100) can increase processing speed by utilizing a computational unit specialized for parallel computation.

[0053] The memory of the electronic device (100) can store data such as thermal history information, contamination level information, physical properties of recycled and new epoxy materials, standard physical properties of target parts, standard mixing ratios, and lower limits, along with instructions executed by the processor. The electronic device (100) is equipped with both volatile memory and non-volatile memory to manage temporary data from the computation process and mixing history data that requires long-term preservation separately.

[0054] The electronic device (100) includes a communication circuit and can transmit and receive data with a user terminal (210) and an external server (220). It can also be connected to crushing equipment, measuring equipment, molding equipment, etc., at the site via various wired or wireless communication methods to collect measurement data of recycled material and transmit control signals for the molding process. Through these connections, the electronic device (100) can link the process from degradation evaluation to molding input into a single flow.

[0055] The electronic device (100) can generate a control signal to control the introduction of recycled material and new epoxy material into the molding process according to a determined recycling mixture, and if the predicted physical properties do not meet the specifications, it can perform control to reduce the mixing ratio to recalculate or route the recycled material to a disposal path. The electronic device (100) can record each processing result as a log to enable quality tracking and, if necessary, report the processing status to a manager.

[0056] The user terminal (210) is a device used by a worker or manager who manages or supervises the recycling process to interact with the electronic device (100), and can be implemented in various forms such as a desktop computer, laptop, tablet, or smartphone. The user terminal (210) is connected to the electronic device (100) via a communication network to view the degradation evaluation results and the composition determination results, and to input necessary setting values.

[0057] The user terminal (210) can provide visualized information such as the degradation index of the recycled material, the determined mixing ratio, the calculated predicted physical properties, and whether the specifications are satisfied through a display unit, and the operator can intuitively understand the processing status of each recycled lot through this information. The user terminal (210) can provide a warning display to alert the operator when the predicted physical properties approach the lower limit of the specifications or when the recycled material is routed to a disposal path.

[0058] The user terminal (210) can allow the operator to set or change parameters such as the standard mixing ratio, reduction coefficient, standard value of the degradation index, lower limit of the mixing ratio, and the standard physical properties of the target part through the input section. The user terminal (210) can transmit the input setting values ​​to the electronic device (100) so that they are reflected in the mixing determination calculation, and can flexibly respond even when the production item or the ordering party's specifications change.

[0059] The user terminal (210) may provide an interface for receiving approval or rejection from a worker regarding a composition decision presented by the electronic device (100), and may support a semi-automatic operation method that combines a final human confirmation with an automated judgment. The user terminal (210) may respond to exceptional situations by transmitting to the electronic device (100) when a worker issues a separate processing instruction regarding a specific regeneration portion.

[0060] The user terminal (210) can provide a reporting function that allows viewing statistics such as the recycling rate, disposal rate, and standard compliance rate by period by querying the mixing history and quality data stored in the electronic device (100). The user terminal (210) can provide these statistics in the form of graphs or tables so that a manager can use them to evaluate the performance of the recycling process and identify areas for improvement.

[0061] The external server (220) is a device that provides data necessary for the computation of the electronic device (100) or collects and manages data generated by the electronic device (100), and can be implemented in various forms such as a cloud server, an internal data management server of a company, or a server linked with an ordering party. The external server (220) is connected to the electronic device (100) via a communication network and can stably store and provide large amounts of data.

[0062] The external server (220) stores the standard physical properties of the target part, drawings and specifications provided by the ordering party, and a material property database, and can provide them upon request from the electronic device (100). The external server (220) can ensure that the latest information is reflected in the electronic device (100) when the standard or specification is updated, thereby enabling the electronic device (100) to determine whether the standard is satisfied based on a standard that is always valid.

[0063] The external server (220) can accumulate thermal history data, contamination data, and physical property measurements of recycled materials collected from multiple recycling process sites and manage them as training data for an artificial intelligence model. The external server (220) can use the accumulated data to train or retrain a degradation index calculation model or a physical property prediction model, and distribute the parameters of the updated model to the electronic device (100) so that the prediction performance can be continuously improved.

[0064] The external server (220) can collect the formulation determination and processing results performed by the electronic device (100) and manage them as a quality history database, and can also store actual physical property data of the molded body with the recycled formulation applied in subsequent inspections to track the correspondence between the predicted value and the actual value. The external server (220) can analyze this correspondence to evaluate the accuracy of the prediction model and use it to derive directions for improvement.

[0065] The external server (220) may be equipped with functions such as load balancing, data redundancy, and access control management to provide stable service even when multiple electronic devices (100) are connected simultaneously, and may ensure data integrity and security to satisfy traceability requirements demanded by the ordering party or auditing agency. The external server (220) may support the reliability of the quality management system by managing access records for stored data.

[0066] FIG. 3 is a flowchart of the operation method of an electronic device for determining the mixing ratio of recycled components based on a degradation index and predicting mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment according to one embodiment of the present invention.

[0067] According to one embodiment, components of a system in which an operation method of an electronic device is performed to determine the mixing ratio of recycled components based on a degradation index and predict mixed properties for the recycling of epoxy heat-resistant components for semiconductor inspection equipment may perform the operations disclosed in FIG. 3. For example, among the components included in the system in which an operation method of an electronic device is performed to determine the mixing ratio of recycled components based on a degradation index and predict mixed properties for the recycling of epoxy heat-resistant components for semiconductor inspection equipment is performed, at least some of the components included in the electronic device (100) (e.g., memory (110), processor (120), communication interface (130), and display device (140) of FIG. 1) may be configured to perform the operations of FIG. 3.

[0068] In the following embodiments, the operations of S310 to S350 may be performed sequentially, but are not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel. Additionally, content corresponding to or overlapping with the above description in relation to FIG. 3 may be briefly explained or omitted.

[0069] According to one embodiment, a processor (120) can obtain thermal history information and contamination information for a recycled component obtained by crushing an epoxy heat-resistant component classified as defective (S310).

[0070] The processor of the electronic device (100) can obtain thermal history information and contamination information regarding the recycled material obtained by crushing the epoxy heat-resistant parts classified as defective. Here, thermal history information refers to information indicating the accumulated degree of thermal load experienced by individual parts constituting the recycled material from molding to the inspection process, and may include items such as the highest temperature to which the part was exposed, the accumulated time spent above a specific temperature, the number of repetitions of the temperature cycle, and the heating and cooling rates. Contamination information refers to information indicating the type and amount of foreign matter contained in the recycled material, and may include items such as dust, metal fine particles, release agent residue, and moisture absorption amount.

[0071] The processor of the electronic device (100) can obtain thermal history information through various channels. As one example, it can obtain the temperature exposure history for each part by querying from an identification tag attached to an inspection device that records the usage history of individual parts, and as another example, it can obtain the process history of the group of parts from which the recycled material originated by querying from an external server (220) that manages molding lots and inspection process conditions. As yet another example, the processor of the electronic device (100) can receive measurement values ​​such as residual heat, glass transition temperature change, and mass reduction initiation temperature from a measurement facility that performs measurements such as differential scanning calorimetry or thermogravimetric analysis on a recycled material sample, and can obtain the degree of thermal history by inversely estimating it from these measurement values.

[0072] The processor of the electronic device (100) can also obtain contamination information in various ways. As one example, it can be obtained by receiving the number of foreign substances per unit mass or the ratio of the foreign substance area from an inspection facility that performs optical inspection or image analysis on the recycled material, and as another example, the content of inorganic foreign substances can be obtained from an ash analysis result that measures the amount of ash remaining after burning the recycled material. As yet another example, the processor of the electronic device (100) can receive a moisture content measurement value indicating the moisture absorption state of the recycled material and reflect the degree of moisture contamination that may cause bubbles or defects during the molding process in the contamination information.

[0073] The processor of the electronic device (100) can store the acquired thermal history information and contamination information in conjunction with the lot identifier of the recycled material and manage them so that they can be referenced in subsequent operations. At this time, the processor of the electronic device (100) can normalize the units and formats of the information collected from different measuring equipment and integrate them into a single data structure, and if there are missing items, it can ensure the completeness of the data by applying a preset default value or interpolating with the measurement values ​​of other samples from the same lot. As one scenario, recycled material originating from a group of parts that have undergone repetitive high-temperature cycles in a specific inspection line can be recorded as information having a high thermal history value, and recycled material originating from a group of parts that have had a high dust exposure in the handling environment can be recorded as information having a high contamination value.

[0074] The processor of the electronic device (100) can adjust the information acquisition procedure by reflecting the addition of measurement items or changes in the acquisition method for a specific recycled lot when it receives instructions from the user terminal (210). Through this, the processor of the electronic device (100) can respond flexibly even when the thermal factors or contamination factors requiring management change due to changes in production items or ordering specifications, and can reliably secure basic data for determining the degree of degradation.

[0075] According to one embodiment, the processor (120) can calculate a degradation index indicating the degree of degradation of the regenerated component based on the acquired thermal history information and contamination information (S320).

[0076] The processor of the electronic device (100) can calculate a degradation index indicating the degree of degradation of the recycled material based on acquired thermal history information and contamination information. Here, the degradation index is an indicator that combines the magnitude of the negative impact on the physical properties of the final molded body when the recycled material is mixed into the new material into a single numerical value; the higher the value, the greater the possibility that the state of the recycled material is further from the new material and causes a deterioration in physical properties. This degradation index can express the overall quality state of the recycled material as a single measure by reflecting both the components attributable to thermal history and the components attributable to contamination.

[0077] The processor of the electronic device (100) can quantify the effect of thermal load on the crosslinking structure and heat resistance performance of the regenerated material in order to reflect thermal history information in the degradation index. As one example, since regenerated material exposed to excessive heat for a long time tends to have reduced residual reactivity and a lower glass transition temperature due to changes in crosslinking density or local oxidation, the processor of the electronic device (100) can calculate that the component attributable to thermal history increases as the maximum exposure temperature increases, the high temperature holding time increases, and the number of temperature cycle repetitions increases. As another example, the processor of the electronic device (100) can determine that the curing reaction has already progressed significantly and the material has aged as the amount of residual heat obtained from the measuring equipment decreases, and can reflect the corresponding component significantly.

[0078] The processor of the electronic device (100) can quantify the influence of the content and type of foreign matter on the quality of the molded body in order to reflect contamination information in the degradation index. As one example, foreign matter that is prone to causing stress concentration or interfacial defects inside the molded body, such as metal fine particles or hard dust, can be weighted to reflect the component attributable to contamination more significantly even if the content is the same. As another example, contamination factors that cause bubbles during the molding process, such as moisture, can be reflected by adjusting their influence by considering the characteristic that they can be partially removed by preheating and drying. The processor of the electronic device (100) can calculate the contamination component by applying differential weighting according to the nature of the foreign matter in this way.

[0079] The processor of the electronic device (100) can combine components attributable to thermal history and components attributable to contamination into a single degradation index, and can apply weights to reflect the relative importance of the two components. As one scenario, when producing a target component that requires particularly strict heat resistance performance, the degradation index can be calculated by giving greater weight to the thermal history component, and when producing a target component where surface cleanliness is important, the index can be calculated by giving greater weight to the contamination component. The processor of the electronic device (100) can receive the criteria for these weights from an external server (220) or set and reflect them through a user terminal (210).

[0080] The processor of the electronic device (100) can manage the calculated degradation index for each recycled lot and transmit it to the subsequent determination of the mixing ratio. As an example, recycled materials with both minor thermal history and contamination may be calculated with a low degradation index and treated as similar to new materials, while recycled materials with both severe thermal history and contamination may be calculated with a high degradation index and indicated as requiring careful handling. The processor of the electronic device (100) can record the input values ​​used in the calculation process and the intermediate results together so that the basis for a specific recycled material having a specific degradation index can be traced retrospectively.

[0081] According to one embodiment, the processor (120) can determine the mixing ratio of recycled material to the new epoxy material based on the calculated degradation index (S330).

[0082] The processor of the electronic device (100) can determine the mixing ratio of recycled material to the new epoxy material based on the calculated degradation index. Here, the mixing ratio is a value representing the proportion of recycled material in the total mixture when the new epoxy material and recycled material are mixed to form a molding mixture, and it may be a key parameter for determining how much recycled material to be used for recycling. The higher the mixing ratio, the greater the amount of recycled material recycled, thereby increasing resource efficiency; however, the greater the impact of the degradation of recycled material on the physical properties of the molded body.

[0083] The processor of the electronic device (100) can determine the mixing ratio by establishing an inverse relationship between the degradation index and the mixing ratio, such that more is added when the condition of the recycled material is good and less is added when the condition is poor. As an example, a relatively high mixing ratio can be applied to good recycled materials with a low degradation index to maximize resource utilization, and a low mixing ratio can be applied to recycled materials with a high degradation index to suppress the risk of material property degradation. Through this relationship, the processor of the electronic device (100) can individually adjust the balance between the recycling rate and quality for each recycled material.

[0084] The processor of the electronic device (100) can consider both a reference value and a range of adjustment when determining the mixing ratio. As an example, a reference mixing ratio to be applied to an ideal recycled portion with no degradation can be set in advance, and the mixing ratio can be determined by determining how much to reduce from that reference mixing ratio as the degradation index increases. At this time, the processor of the electronic device (100) can apply a coefficient that controls the sensitivity of the reduction, thereby setting whether to reduce the mixing ratio rapidly or gradually for the same increase in the degradation index, in accordance with the characteristics of the target component.

[0085] The processor of the electronic device (100) may apply upper and lower limits so that the determined mixing ratio does not exceed the range permitted by the process. As one scenario, even if the recycled material is excessively good, an upper limit may be set on the mixing ratio to ensure a minimum ratio of new material, thereby preventing the recycled material from being input beyond that limit. If the recycled material is severely degraded and the mixing ratio is calculated to be very low, a lower limit may be set to the minimum mixing ratio that provides a benefit for recycling, thereby preventing recycling from being attempted below that level. The processor of the electronic device (100) may also use this lower limit value as a criterion for determining whether to discard the recycled material in subsequent closed-loop readjustment.

[0086] The processor of the electronic device (100) can store the determined mixing ratio for each lot of recycled material and transmit it to the subsequent calculation of predicted physical properties. As an example, when recycled materials from multiple lots are processed simultaneously, different mixing ratios are determined according to the degradation index of each lot, and differential mixing can be formed for each lot. The processor of the electronic device (100) can provide the determined mixing ratio and the basis for its calculation to the user terminal (210) so that the operator can review the mixing policy and adjust it if necessary.

[0087] According to one embodiment, the processor (120) can calculate the predicted properties of a mixture of recycled material and new epoxy material based on the determined mixing ratio, the properties of recycled material and the properties of new epoxy material (S340).

[0088] The processor of the electronic device (100) can calculate the predicted properties of a mixture of recycled material and new epoxy material based on the determined mixing ratio, the properties of recycled material, and the properties of new epoxy material. Here, the predicted properties are property values ​​expected to appear when a molded body is produced with the corresponding mixture before actual molding and curing are performed, and may include heat resistance performance indicators such as glass transition temperature and heat distortion temperature, as well as property items required for the target part, such as flexural strength and coefficient of linear expansion. By calculating the predicted properties in advance, the processor of the electronic device (100) can evaluate the suitability of the mixture before actual molding.

[0089] The processor of the electronic device (100) can obtain the properties of the recycled material and the properties of the new epoxy material, respectively, in order to calculate the predicted properties. As an example, the properties of the new epoxy material can be obtained by querying data provided by the material supplier or a material properties database stored on an external server (220), and the properties of the recycled material can be obtained by directly measuring the recycled material sample or by estimating them from the correlation with the degradation index. The processor of the electronic device (100) can predict the properties of the mixture by combining the properties of the two materials obtained in this way according to the mixing ratio.

[0090] The processor of the electronic device (100) can calculate the predicted physical properties by reflecting the effect of the mixing ratio on the predicted physical properties, such that as the proportion of recycled material increases, the physical properties of the mixture become closer to the physical properties of the recycled material, and as the proportion of new material increases, the physical properties of the new material become closer to the physical properties of the new material. As one scenario, if a high proportion of recycled material with a low glass transition temperature due to degradation is mixed in, the predicted glass transition temperature of the mixture can be calculated to be lower than when only new material is used, and conversely, if the proportion of recycled material is lowered, the predicted glass transition temperature of the mixture can be calculated to be close to the value of the new material. In this way, the processor of the electronic device (100) can quantitatively express the effect of the change in the mixing ratio on the physical properties.

[0091] The processor of the electronic device (100) can correct and reflect non-linear factors that may occur during the mixing process in addition to the simple ratio aggregation when calculating predicted physical properties. As one example, if the bonding at the interface between the recycled component and the new material is incompletely formed and the physical properties tend to be lower than the value expected by the ratio, the processor of the electronic device (100) can increase the accuracy of the prediction by applying a correction that reflects such interface effects. As another example, the processor of the electronic device (100) can learn the difference between the ratio aggregation value and the actual measured value by referring to actual physical property measurement data of the mixed sample accumulated in the past, and reflect this in the prediction.

[0092] The processor of the electronic device (100) can manage the calculated predicted physical properties by various physical property items and transmit them to determine whether the specifications are satisfied in subsequent processes. As an example, for a single formulation, the predicted glass transition temperature and the predicted heat distortion temperature can be calculated separately and compared individually with various specification items required by the target component. The processor of the electronic device (100) can provide the calculated predicted physical properties and the input values ​​that served as the basis to the user terminal (210) so that the operator can identify the physical property trends of the formulation in advance.

[0093] According to one embodiment, if the calculated predicted physical properties satisfy the standard physical properties of the target part, the processor (120) can determine the determined mixing ratio as a recycled mixture (S350).

[0094] The processor of the electronic device (100) can determine the determined mixing ratio as a recycled mixture if the calculated predicted physical properties satisfy the standard physical properties of the target part. Here, standard physical properties refer to the standard values ​​of physical properties that the target part must satisfy according to the drawings and specifications of the ordering party, and may define minimum conditions for the part to exhibit performance required by inspection equipment, such as a lower limit of glass transition temperature, a lower limit of heat distortion temperature, and a minimum value of strength. Determining the recycled mixture may mean approving the mixture as one that is acceptable to apply the corresponding mixing ratio to actual production.

[0095] The processor of the electronic device (100) can determine whether the predicted physical properties satisfy the standard physical properties for each physical property item. As an example, if the predicted glass transition temperature is greater than or equal to the lower limit of the glass transition temperature specified by the standard and the predicted heat deformation temperature is greater than or equal to the lower limit of the heat deformation temperature specified by the standard, it can be determined that the standard is satisfied; if any one of the items falls short of the standard, it can be determined that the standard is not satisfied. The processor of the electronic device (100) can guarantee the performance of the target component by confirming the composition only when all of the multiple standard items are satisfied in this way.

[0096] The processor of the electronic device (100) can determine whether the specifications are satisfied by adding a margin to the specification standard value. As one scenario, by using a value that adds a certain safety margin to the lower specification limit as the determination standard, taking into account the uncertainty inherent in the prediction or variations in the production process, the risk of a formulation where the predicted physical properties barely meet the lower specification limit deviating from the specifications during actual production can be reduced. The processor of the electronic device (100) can set the size of this safety margin according to the importance of the target part or the level of requirements of the ordering party.

[0097] The processor of the electronic device (100) can determine the mixing ratio as a recycled mixture, store the mixture information, and transmit it to the actual molding process. As an example, the determined mixture may include a lot identifier of the recycled material, an applied mixing ratio, predicted physical properties, and a result of determining compliance with specifications, which can be used for subsequent processes and quality tracking. The processor of the electronic device (100) can control related equipment or generate a signal for control so that the recycled material and the new epoxy material are measured in a predetermined ratio according to the determined mixture and fed into the molding process.

[0098] The processor of the electronic device (100) can transmit the history of the confirmed recycling mixture to an external server (220) to accumulate it and report the results to a user terminal (210). As one scenario, the processor of the electronic device (100) can verify the accuracy of the prediction by comparing the actual physical properties of the molded body to which the confirmed mixture was applied in a subsequent inspection with the predicted physical properties, and accumulate the results to reflect them in subsequent predictions and judgments. By repeating this process of confirmation and verification, the processor of the electronic device (100) can continuously increase the reliability of the recycling mixture determination.

[0099] FIG. 4 is a specific operation flowchart included in the operation method of an electronic device for determining the mixing ratio of recycled components based on a degradation index and predicting mixed properties for recycling epoxy heat-resistant components for semiconductor inspection equipment according to one embodiment of the present invention.

[0100] According to one embodiment, components of a system in which an operation method of an electronic device is performed to determine the mixing ratio of recycled components based on a degradation index and predict mixed properties for the recycling of epoxy heat-resistant components for semiconductor inspection equipment may perform the operations disclosed in FIG. 4. For example, among the components included in the system in which an operation method of an electronic device is performed to determine the mixing ratio of recycled components based on a degradation index and predict mixed properties for the recycling of epoxy heat-resistant components for semiconductor inspection equipment is performed, at least some of the components included in the electronic device (100) (e.g., memory (110), processor (120), communication interface (130), and display device (140) of FIG. 1) may be configured to perform the operations of FIG. 4.

[0101] In the following embodiments, the operations of S410 to S430 may be performed sequentially, but are not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel. Additionally, content corresponding to or overlapping with the above description in relation to FIG. 4 may be briefly explained or omitted.

[0102] According to one embodiment, the processor (120) can determine a smaller mixing ratio as the degradation index increases (S410).

[0103] The processor of the electronic device (100) can determine a smaller mixing ratio as the degradation index increases. This implies establishing a decreasing correlation between the degradation index and the mixing ratio, with the intention of suppressing the deterioration of the physical properties of the final molded body by adding less of the recycled material to the new material as the condition of the recycled material deteriorates. Through this correlation, the processor of the electronic device (100) can automatically reflect the quality variation of the recycled material in the mixing ratio, thereby mitigating quality risks that may occur when non-uniform recycled material is handled at a uniform ratio.

[0104] The processor of the electronic device (100) can control the slope at which the mixing ratio decreases with respect to an increase in the degradation index. As an example, when producing a target component where heat resistance is particularly important, the mixing ratio can be significantly lowered to respond conservatively even if the degradation index increases only slightly, and when producing a target component with a large margin of material properties, the mixing ratio can be lowered gradually even if the degradation index increases to secure a higher recycling rate. The processor of the electronic device (100) can receive criteria for controlling the degree of such reduction from an external server (220) or set and reflect them through a user terminal (210).

[0105] The processor of the electronic device (100) can implement the relationship of decrease between the degradation index and the mixing ratio in various forms. As one example, it can be configured so that the mixing ratio decreases linearly as the degradation index increases, and as another example, different slopes can be applied for each section so that the mixing ratio is gradually lowered up to a certain level of the degradation index and then rapidly lowered once it exceeds that level. As yet another example, the processor of the electronic device (100) can determine the mixing ratio corresponding to the section to which the calculated degradation index belongs by using a reference table that corresponds predetermined mixing ratio values ​​to various sections of the degradation index.

[0106] The processor of the electronic device (100) can manage the mixing ratio determined in this way so that it is applied as a consistent standard across multiple recycled lots. As one scenario, when three recycled lots with different degradation indices are processed simultaneously, the highest mixing ratio is assigned to the lot with the lowest degradation index and the lowest mixing ratio is assigned to the lot with the highest degradation index, respectively, so that the relative order between the lots can be reflected in the mixing ratio. By maintaining this relative order, the processor of the electronic device (100) can derive a reasonable mixture proportional to the condition of the recycled lot.

[0107] The processor of the electronic device (100) can record the basis for the determination of a low mixing ratio based on the degradation index and provide it to the user terminal (210). As an example, if a low mixing ratio is assigned to a specific recycled portion, it can indicate whether the cause lies in high thermal history components or high contamination components, thereby allowing the operator to identify the cause of the quality degradation of the recycled portion and utilize it for subsequent process management. Through this, the processor of the electronic device (100) can ensure transparency in the determination of the mixing ratio.

[0108] According to one embodiment, the processor (120) can compare the calculated degradation index with a reference degradation index (S420).

[0109] The processor of the electronic device (100) can compare the calculated degradation index with a reference degradation index. Here, the reference degradation index is a threshold value that determines whether recycled material can be used as a target for recycling mixtures. Recycled material exceeding this value may indicate a boundary where it is judged that it is difficult to secure the benefits or quality of recycling, no matter how much the mixing ratio is lowered. By comparing the calculated degradation index with this threshold value, the processor of the electronic device (100) can distinguish early on between recycled material to be attempted for recycling and recycled material to be excluded from recycling from the outset.

[0110] The processor of the electronic device (100) can set a reference degradation index in various ways and use it for comparison. As one example, the reference degradation index can be set by back-calculating from the standard physical properties of the target part, to a level of degradation where it is difficult to meet the specifications even when recycled parts are mixed in at a minimum ratio. As another example, the distribution of degradation indices of recycled parts that frequently failed to meet specifications in past production data can be analyzed, and the boundary value can be set as the reference degradation index. The processor of the electronic device (100) can retrieve the reference degradation index set in this way from an external server (220) or receive adjustments through a user terminal (210).

[0111] The processor of the electronic device (100) can perform a differential comparison of the degradation index and the standard degradation index according to the target part or the specifications of the ordering party. As one scenario, when producing a target part with strict heat resistance requirements, a low standard degradation index can be applied to strictly exclude recycled parts that have deteriorated even slightly, and when producing a target part with relaxed requirements, a high standard degradation index can be applied to include recycled parts that have deteriorated somewhat. In this way, the processor of the electronic device (100) can flexibly operate the comparison criteria so that the possibility of recycling varies depending on which target part the same recycled part is used for.

[0112] The processor of the electronic device (100) can calculate the result of the comparison in a clear form and transmit it to a subsequent operation. As an example, if the calculated degradation index is less than or equal to the reference degradation index, the corresponding recycled portion is marked as a target for recycling and the process proceeds to the determination of the mixing ratio and the prediction of physical properties; if it exceeds the reference degradation index, a mark for exclusion is applied and the process proceeds to a subsequent exclusion process. The processor of the electronic device (100) can clearly determine the branching of subsequent processing through such a binary judgment.

[0113] The processor of the electronic device (100) can record the comparison results and the criteria together, provide them to the user terminal (210), and accumulate them on an external server (220). As an example, by statistically managing the ratio of recycled materials excluded from the target because they exceeded the standard degradation index during a specific period, the overall quality trend of the recycled materials or the degradation trend of recycled materials originating from a specific inspection line can be identified. Based on these statistics, the processor of the electronic device (100) can periodically check the appropriateness of the standard degradation index and support adjustments if necessary.

[0114] According to one embodiment, if the deterioration index calculated by the processor (120) exceeds the reference deterioration index, the recycled material may be excluded from the recycling mixture (S430).

[0115] The processor of the electronic device (100) may exclude the recycled material from the recycling mixture if the calculated degradation index exceeds the reference degradation index. This may mean that if the degradation of the recycled material is excessive and it is determined that it is difficult to ensure quality even if a small amount is mixed into the new material, or that there is no benefit to recycling, the recycled material is excluded early from the processing flow without performing subsequent calculations to calculate the mixing ratio and predict physical properties. Through such early exclusion, the processor of the electronic device (100) can reduce unnecessary calculations and process attempts and increase processing efficiency.

[0116] The processor of the electronic device (100) can route the recycled material excluded from the target to a separate processing path. As one example, the excluded recycled material can be sent to a waste treatment path for final disposal such as incineration or landfilling, and as another example, it can be sent to a separate utilization path for use as a filler or auxiliary material for low-grade applications where heat resistance is not required. The processor of the electronic device (100) can guide the selection of an appropriate subsequent path by considering the characteristics and residual value of the excluded recycled material.

[0117] The processor of the electronic device (100) may perform additional verification to increase the reliability of the exclusion judgment before excluding the recycled material from the target. As one scenario, for recycled material on the boundary where the degradation index slightly exceeds the standard, it may reconfirm whether there were any errors in the measurement of thermal history information or contamination information, or recalculate the degradation index by additionally measuring other samples from the same lot. The processor of the electronic device (100) can prevent a situation in which recyclable recycled material is unfairly excluded due to measurement errors by confirming the exclusion only when the degradation index exceeds the standard even after such reconfirmation.

[0118] The processor of the electronic device (100) can operate the process of excluding recycled materials from the target in combination with a verification procedure through the user terminal (210). As an example, if a significant amount of recycled materials is determined to be excluded at once, this can be notified to the user terminal (210) so that the exclusion is confirmed after receiving final approval from the operator. By combining human judgment with automated judgment through this semi-automatic operation, the processor of the electronic device (100) can make prudent decisions in exceptional or critical situations.

[0119] The processor of the electronic device (100) can record information regarding recycled parts excluded from the target, accumulate it on an external server (220), and utilize it for quality control. As an example, the degradation index of the excluded recycled parts, the reason for exclusion, and the process history of the originating part group can be stored together to analyze which molding or inspection conditions the recycled parts originating from are mainly excluded. The processor of the electronic device (100) can feed back these analysis results to upstream molding and inspection processes to support improvement activities that reduce the occurrence of defects.

[0120] According to one embodiment, a method of operation of an electronic device for determining a recycled component incorporation ratio and predicting mixed physical properties based on a degradation index for recycling an epoxy heat-resistant component for semiconductor inspection equipment may further include: an operation in which a processor calculates predicted physical properties by weighted summing the physical properties of the recycled component and the physical properties of the new epoxy material according to the incorporation ratio; an operation in which the processor calculates such that the predicted physical properties include a glass transition temperature and a heat distortion temperature corresponding to the heat resistance performance of the epoxy heat-resistant component; and an operation in which the processor compares the calculated glass transition temperature and heat distortion temperature with the standard physical properties of the target component.

[0121] The processor of the electronic device (100) can calculate predicted properties by weighted summing the properties of the recycled material and the new epoxy material according to the mixing ratio. Here, weighted summing is a method of predicting the properties of a mixture of two materials by multiplying the properties of each material by the ratio that material occupies in the mixture and adding them together. This calculation method may result in the predicted properties becoming closer to the properties of the recycled material as more recycled material is added, and closer to the properties of the new material as more new material is added. Through this weighted summing, the processor of the electronic device (100) can express the effect of changes in the mixing ratio on the properties of the mixture in a continuous and quantitative manner.

[0122] The processor of the electronic device (100) can obtain in advance the properties of the recycled material and the properties of the new epoxy material to be used for weighted summation. As an example, the properties of the new epoxy material can be obtained by querying data from a material supplier or a material property database stored on an external server (220), and the properties of the recycled material can be obtained directly from measurements of the recycled material sample or by estimating them using a correlation with the degradation index. As a scenario, since the recycled material that has undergone degradation has a property value with a lowered glass transition temperature, the processor of the electronic device (100) can reflect this lowered property value in the weighted summation to calculate the predicted property of the mixture to be lowered by that amount.

[0123] The processor of the electronic device (100) can adjust the summing method by considering the characteristics of each physical property item during the weighted summing process. As one example, for physical property items that vary approximately proportionally according to volume ratios, such as glass transition temperature, simple ratio-weighted summing can be applied, and as another example, for physical property items that are sensitive to the bonding state of the interface and are difficult to predict solely by ratios, additional correction can be applied to the result of the weighted summing. In this way, the processor of the electronic device (100) can ensure the reliability of the prediction by selecting appropriate summing and correction methods for each physical property item.

[0124] The processor of the electronic device (100) can manage the quality of the physical property values ​​because the accuracy of the physical property values ​​used in weighted summation determines the reliability of the predicted physical property. As an example, if the physical properties of the recycled material are obtained by relying on estimation, the uncertainty of the estimation is managed together and reflected in the predicted physical property, and the accuracy of the estimation can be checked by comparing it with the actual measured value at regular intervals. Through such management, the processor of the electronic device (100) can prevent a situation in which the predicted physical property is distorted due to incorrect physical property values.

[0125] The processor of the electronic device (100) can organize the predicted physical properties calculated by weighted summation into various physical property items and transmit them for subsequent comparison. As one scenario, the predicted glass transition temperature and the predicted heat distortion temperature are calculated for a single mixture, respectively, and can be prepared so that they can be individually compared with various specification items required by the target component. The processor of the electronic device (100) can record the calculated predicted physical properties together with the physical property values ​​and mixing ratios used in the calculation, so that the basis for deriving a specific predicted value can be traced subsequently.

[0126] The processor of the electronic device (100) can calculate the predicted physical properties to include a glass transition temperature and a heat distortion temperature corresponding to the heat resistance performance of the epoxy heat-resistant component. Here, the glass transition temperature is the temperature at which the epoxy material transitions from a hard state like glass to a flexible state like rubber; since the rigidity and dimensional stability of the material decrease rapidly when this temperature is exceeded, it may serve as an indicator for gauging the upper temperature limit that the heat-resistant component can withstand. The heat distortion temperature is the temperature at which a specified deformation occurs when the temperature is raised while a constant load is applied to the material; it may serve as an indicator for the temperature limit at which the component can maintain its shape in an environment where a load is applied.

[0127] The processor of the electronic device (100) can include these two temperature indicators in the predicted physical properties, taking into account the characteristic that the epoxy heat-resistant component for semiconductor inspection equipment is repeatedly used in a high-temperature environment. In one scenario, since the glass transition temperature must be sufficiently higher than the maximum temperature to which the component is exposed during the inspection process so that the component does not soften and maintains its dimensions, the processor of the electronic device (100) can calculate the predicted glass transition temperature to evaluate in advance whether the corresponding composition can withstand the temperature of the inspection environment. In another scenario, when the component is used in a location subjected to loads such as fastening force or self-weight, the predicted heat deformation temperature can serve as an important basis for judgment.

[0128] The processor of the electronic device (100) can calculate the glass transition temperature and the heat distortion temperature by treating them as independent physical property items. As an example, the predicted glass transition temperature of the mixture can be calculated from the glass transition temperatures of the recycled material and the new material, respectively, and the predicted heat distortion temperature of the mixture can be calculated from the respective heat distortion temperatures, so that the two indicators yield different values. By expressing the heat resistance performance as multiple indicators in this way, the processor of the electronic device (100) can capture weaknesses in physical properties that are not revealed by any single indicator alone.

[0129] The processor of the electronic device (100) can check the consistency of the prediction by utilizing the relationship between two temperature indicators. As an example, since the glass transition temperature and the heat distortion temperature generally tend to increase together as the heat resistance performance of the material improves, if the two calculated indicators deviate significantly from this trend, the processor of the electronic device (100) can examine the possibility that there is an error in the input material property value or the calculation process. The processor of the electronic device (100) can increase the reliability of the predicted material property through such cross-checking.

[0130] The processor of the electronic device (100) may include additional heat-resistant physical property items in addition to the two temperature indicators in the predicted physical properties, depending on the application of the target component. As an example, the coefficient of linear expansion indicating dimensional change due to temperature change or the strength retention rate at high temperatures may be additionally calculated to complement the heat resistance characteristics that are not sufficiently expressed by the glass transition temperature and heat distortion temperature alone. The processor of the electronic device (100) may transmit these expanded physical property items together in a subsequent specification comparison to enable a multi-faceted quality evaluation.

[0131] The processor of the electronic device (100) can compare the calculated glass transition temperature and heat distortion temperature with the standard physical properties of the target part. Here, the standard physical properties of the target part are reference values ​​for heat resistance performance specified in the drawings and specifications of the ordering party, and may include the lower limit that the glass transition temperature must satisfy and the lower limit that the heat distortion temperature must satisfy. By comparing the two predicted temperature indicators with these standard criteria, the processor of the electronic device (100) can determine in advance whether the molded body to be produced with the corresponding mixture can satisfy the heat resistance performance required for the target part.

[0132] The processor of the electronic device (100) can determine the two temperature indicators by comparing them according to the specifications and items. As an example, if the predicted glass transition temperature is above the lower limit of the glass transition temperature specified by the specifications and the predicted heat deformation temperature is above the lower limit of the heat deformation temperature specified by the specifications, it can be determined that the heat resistance performance specifications are satisfied; if either indicator falls below the lower limit of the specifications, it can be determined that the specifications are not satisfied. The processor of the electronic device (100) can ensure that partial performance deficiencies are not overlooked by treating heat resistance performance as secured only when both indicators are satisfied in this way.

[0133] The processor of the electronic device (100) may apply different reference values ​​for specification comparison depending on the target part and the ordering party. As one scenario, even if the parts have the same shape, the lower limit of the glass transition temperature and the lower limit of the heat distortion temperature may be defined differently depending on the usage environment required by the ordering party. Therefore, the processor of the electronic device (100) may query the specification properties corresponding to the target part to be processed from an external server (220) and apply them to the comparison. When the specifications are updated, the processor of the electronic device (100) may reflect the latest reference values ​​so that the comparison is always performed based on valid standards.

[0134] The processor of the electronic device (100) can calculate the result of the specification comparison, including the degree of margin. As an example, by calculating how much the predicted glass transition temperature exceeds the lower specification limit, it is possible to distinguish between formulations with a small margin and formulations with a large margin, even if they satisfy the specifications. The processor of the electronic device (100) can indicate that there is a risk of deviating from the specifications due to variations in the production process for formulations with a small margin, and indicate that formulations with a large margin stably satisfy the specifications, thereby allowing the operator to consider the stability of the formulation.

[0135] The processor of the electronic device (100) can transmit the results of the specification comparison to subsequent processing and record related information. As an example, if both temperature indicators satisfy the specifications, the process proceeds to confirm the corresponding mixing ratio as a recycled mixture, and if either indicator falls short of the specifications, the process proceeds to reduce the mixing ratio and recalculate. The processor of the electronic device (100) can record the predicted physical property values ​​used in the comparison, the specification reference values, and the judgment results together, provide them to the user terminal (210), and accumulate them on an external server (220), thereby enabling transparent management of the basis for the mixture determination and making quality tracking possible.

[0136] According to one embodiment, a method of operation of an electronic device for determining the mixing ratio of recycled material and predicting mixed physical properties based on a degradation index for recycling epoxy heat-resistant parts for semiconductor inspection equipment may further include: a processor calculating a first index indicating the degree of thermal aging of recycled material from thermal history information; a processor calculating a second index indicating the content of foreign matter contained in recycled material from contamination information; and a processor calculating a degradation index by weighted summing the calculated first index and the second index.

[0137] The processor of the electronic device (100) can calculate a first indicator representing the degree of thermal aging of the recycled material from thermal history information. Here, the first indicator is a value that expresses in a single numerical value how much the thermal load experienced by the recycled material has degraded the heat resistance performance of the material, and may be the result of converting information on various items of thermal history into a single scale suitable for use in calculating a degradation index. Through this first indicator, the processor of the electronic device (100) can comprehensively reflect thermal factors of different nature, such as the maximum exposure temperature, high temperature holding time, and the number of temperature cycle repetitions.

[0138] The processor of the electronic device (100) can calculate a first index by considering how individual items of the thermal history contribute to thermal aging. As one example, the damage to the cross-linking structure increases as the maximum exposure temperature of the regenerated material approaches the glass transition temperature of the material, so the first index can be calculated to be larger as the maximum exposure temperature increases. As another example, even at the same temperature, oxidation or post-curing proceeds as the cumulative time spent at that temperature increases, so the first index can be calculated to be larger as the high temperature holding time increases. As yet another example, since microcracks due to differences in thermal expansion accumulate when heating and cooling are repeated, the first index can be calculated to be larger as the number of temperature cycle repetitions increases.

[0139] The processor of the electronic device (100) can indirectly calculate the first indicator from the measured value when it is difficult to directly obtain thermal history information. In one scenario, if the residual heat is small in the differential scanning calorimetry measurement of the recycled sample, it can be considered that the curing reaction has already progressed significantly and the material has aged; therefore, the processor of the electronic device (100) can calculate the first indicator to be larger as the residual heat is smaller. In another scenario, if the measured glass transition temperature is lower than that of the new material, the extent of the drop can be interpreted as the degree of thermal aging and reflected in the first indicator.

[0140] The processor of the electronic device (100) can normalize thermal history items having different units and ranges into a comparable form when calculating the first indicator. As an example, since the units are different—for example, temperature is expressed in Celsius, time in minutes or hours, and the number of repetitions in times—the processor of the electronic device (100) can calculate the first indicator by converting each item into a relative size relative to a predetermined standard range and then combining them. Through this normalization, the processor of the electronic device (100) can prevent distortion in which a specific item dominates the indicator solely by the size of its unit.

[0141] The processor of the electronic device (100) can manage the calculated first indicator for each recycled lot and transmit it to the calculation of the degradation index. As an example, recycled parts originating from a group of parts that had a minor thermal load may be calculated as having a low first indicator, and recycled parts originating from a group of parts that underwent repeated high-temperature cycles may be calculated as having a high first indicator, thereby revealing the difference in thermal aging between lots. The processor of the electronic device (100) can record the thermal history items used in the calculation of the first indicator together so that the cause of a specific recycled part having high thermal aging can be traced retrospectively.

[0142] The processor of the electronic device (100) can calculate a second indicator representing the content of foreign matter contained in the recycled material from the contamination level information. Here, the second indicator is a value that expresses as a single numerical value how much the foreign matter mixed in the recycled material can impair the quality of the molded body, and may be the result of converting it into a single scale suitable for use in calculating the deterioration index by reflecting not only the amount of foreign matter but also the harmfulness of the type of foreign matter. Through this second indicator, the processor of the electronic device (100) can comprehensively reflect different contamination factors such as dust, metal fine particles, release agent residues, and moisture.

[0143] The processor of the electronic device (100) can calculate a second index from a measurement value indicating the content of foreign matter. As one example, the second index can be calculated to be larger as the number of foreign matter per unit mass or the ratio of foreign matter area obtained from optical inspection or image analysis of the recycled material increases, and as another example, the second index can be calculated to be larger as the amount of ash remaining after burning the recycled material increases, as it is considered that a large amount of inorganic foreign matter is contained. The processor of the electronic device (100) can use the measurement value quantifying the contamination in this way as the basis for calculating the second index.

[0144] The processor of the electronic device (100) can reflect in the second indicator the fact that the impact on the quality of the molded body varies depending on the type of foreign matter. In one scenario, foreign matter that is prone to causing stress concentration or interfacial defects inside the molded body, such as metal fine particles or hard dust, can be reflected in the second indicator by giving it a greater weight even if the content is the same, and in another scenario, contaminants such as moisture, which can be largely removed by preheating and drying, can be reflected with a lower impact by considering the possibility of removal. Through such differential weighting, the processor of the electronic device (100) can capture in the second indicator the harmfulness of foreign matter that is not expressed by the simple total amount alone.

[0145] The processor of the electronic device (100) can synthesize contamination information obtained from different measurement methods when calculating a second indicator. As an example, surface foreign matter information obtained from image analysis, internal inorganic matter information obtained from ash analysis, and moisture information obtained from moisture absorption measurement can each be converted into a comparable form and combined to produce a single second indicator. Through this synthesis, the processor of the electronic device (100) can capture the contamination status of the recycled material from various perspectives, ensuring that contamination factors not revealed by a specific measurement method are not overlooked.

[0146] The processor of the electronic device (100) can manage the calculated second indicator for each lot of recycled material and transmit it to the calculation of the degradation index. As an example, recycled material originating from a group of parts handled in a clean environment may be calculated as having a low second indicator, while recycled material originating from an environment with high dust exposure may be calculated as having a high second indicator, thereby revealing the difference in contamination between lots. The processor of the electronic device (100) can record the contamination items used in the calculation of the second indicator together so that the cause of a specific recycled material having a high level of contamination can be traced retrospectively and utilized for contamination management in upstream processes.

[0147] The processor of the electronic device (100) can calculate a degradation index by weighted summing the calculated first indicator and second indicator. Here, weighted summing is a method of deriving a single comprehensive degradation index by multiplying the first indicator representing thermal aging and the second indicator representing foreign matter content by weights reflecting their respective relative importance and adding them together; it may be a calculation method that combines two degradation factors of different natures into a single measure. Through this weighted summing, the processor of the electronic device (100) can obtain a comprehensive recycled component quality index that considers both thermal factors and contamination factors.

[0148] The processor of the electronic device (100) can set the weights to be assigned to the first and second indicators according to the characteristics of the target component. In one scenario, when producing a target component where heat resistance performance is particularly important, a greater weight can be assigned to the first indicator representing thermal aging so that the influence of thermal history is strongly reflected in the degradation index, and in another scenario, when producing a target component where surface cleanliness or internal defects are particularly important, a greater weight can be assigned to the second indicator representing foreign matter content. The processor of the electronic device (100) can receive and reflect the criteria for these weights by querying from an external server (220) or by setting them through a user terminal (210).

[0149] The processor of the electronic device (100) can adjust the two indicators to have a comparable scale before weighted summing the two indicators. As an example, if the first indicator and the second indicator are calculated in different ways and have different ranges of values, the processor of the electronic device (100) can convert each indicator to a common reference range and then weighted sum them to prevent distortion in which the numerical range of one indicator is excessively large and dominates the degradation index. Through this adjustment, the processor of the electronic device (100) can ensure that the two factors are reflected in the degradation index according to their intended weights.

[0150] The processor of the electronic device (100) can apply a weighted summation method by extending or modifying it depending on the situation. As an example, in a recycled material where thermal aging and contamination are severe simultaneously, if a tendency for the two factors to synergistically degrade physical properties is observed, the processor of the electronic device (100) can reflect such complex degradation by adding an interaction term corresponding to the product of the two indices to the weighted summation. By reinforcing the calculation formula as needed in this way, the processor of the electronic device (100) can include degradation aspects in the degradation index that are not captured by simple summation alone.

[0151] The processor of the electronic device (100) can manage the degradation index calculated by weighted summation for each recycled lot and transmit it to the subsequent determination of the mixing ratio. As an example, recycled lots with both a first indicator and a second indicator low may be calculated as having a low degradation index and assigned a high mixing ratio, while recycled lots with either of the two indicators high may be calculated as having a correspondingly high degradation index and assigned a low mixing ratio or excluded from recycling. The processor of the electronic device (100) can record the first indicator, the second indicator, and the weights used in calculating the degradation index together so that the basis for a specific recycled lot having a specific degradation index can be traced retrospectively.

[0152] According to one embodiment, a method of operation for an electronic device that determines the mixing ratio of recycled material and predicts mixed properties based on a degradation index for recycling epoxy heat-resistant parts for semiconductor inspection equipment may further include: an operation in which a processor reduces the mixing ratio and recalculates the predicted properties when the calculated predicted properties do not satisfy the specification properties of the target parts; an operation in which the processor routes the recycled material to a disposal path when the recalculated predicted properties do not satisfy the specification properties and the mixing ratio is below a lower limit value; and an operation in which the processor controls the introduction of the recycled material and the new epoxy material into a molding process according to a determined recycling mixture.

[0153] The processor of the electronic device (100) can recalculate the predicted physical properties by reducing the mixing ratio if the calculated predicted physical properties do not satisfy the specification physical properties of the target part. This may mean that when it is determined that it is difficult to obtain a molded body that satisfies the specification of the target part with the initially determined mixing ratio, the recycled material is not immediately abandoned, but the mixing ratio is lowered and the physical properties are predicted again to reconfirm the possibility of satisfying the specification. Through this recalculation, the processor of the electronic device (100) can secure the possibility of finding a formulation that satisfies the specification by sequentially testing multiple mixing ratio candidates for a single recycled material.

[0154] The processor of the electronic device (100) can determine the range for reducing the mixing ratio in various ways. As one example, the mixing ratio can be lowered stepwise by a predetermined constant reduction range while recalculating the predicted physical properties at each step, and as another example, the reduction range can be adjusted according to how much the predicted physical properties fall short of the lower specification limit, so that the mixing ratio is lowered more significantly as the degree of shortfall increases, thereby reducing the number of recalculations. By determining the reduction range according to the situation in this way, the processor of the electronic device (100) can quickly reach a mixing ratio that satisfies the specification.

[0155] The processor of the electronic device (100) can utilize the effect of the reduction in the mixing ratio on the predicted physical properties during the process of recalculating by reducing the mixing ratio. As one scenario, if the ratio of the degraded recycled material decreases, the ratio of the new material increases relatively, so the predicted glass transition temperature and predicted heat distortion temperature of the mixture may show a tendency to rise as they approach the values ​​of the new material. By utilizing this trend, the processor of the electronic device (100) can cause the recalculation to proceed in a direction where the predicted physical properties improve toward the lower specification limit as the mixing ratio is lowered.

[0156] The processor of the electronic device (100) can determine whether to repeat the process by comparing the recalculated predicted physical properties with the standard physical properties again. As an example, if the predicted physical properties recalculated with the reduced mixing ratio satisfy the standard, the process can be stopped and the procedure can proceed to confirm the mixing ratio as a recycled mixture; if the specifications are still not satisfied, the mixing ratio can be further reduced and the recalculation can be repeated. The processor of the electronic device (100) can perform a closed-loop readjustment such that this repetition continues until a mixture satisfying the specifications of the target part is found or until a condition is reached where further progress is impossible.

[0157] The processor of the electronic device (100) can record and manage the mixing ratio used at each stage of recalculation and the predicted physical properties accordingly. As an example, if a history of how the predicted physical properties changed while lowering the mixing ratio for a single recycled portion is kept, it is possible to verify later at which mixing ratio the specifications were met or failed to be met. The processor of the electronic device (100) can provide this recalculation history to a user terminal (210) so that an operator can review the process of adjusting the mixture, and can accumulate it on an external server (220) to be used to improve the criteria for determining the mixing ratio in the future.

[0158] The processor of the electronic device (100) may route the recycled material to a disposal path if the recalculated predicted material does not satisfy the standard material and the mixing ratio is below the lower limit value. Here, the lower limit value of the mixing ratio is the minimum input ratio at which the benefit of recycling the recycled material is maintained. If the mixing ratio is lowered further than this value, the amount of recycled material being recycled becomes excessively small, which may indicate a boundary where the meaning of recycling disappears or process management becomes difficult. If the predicted material does not satisfy the standard even after lowering the mixing ratio to the lower limit value, the processor of the electronic device (100) may determine that a molded body satisfying the standard of the target part cannot be obtained with the recycled material and send it to a disposal path.

[0159] The processor of the electronic device (100) can check two conditions together to determine the disposal routing. As an example, it may be routed to a disposal path only when the condition that the predicted physical properties do not meet the specifications and the condition that the mixing ratio is below the lower limit value are simultaneously satisfied, and may not be disposed of if neither of the two conditions is satisfied. As a scenario, if the mixing ratio is still higher than the lower limit value and does not meet the specifications, it may not be disposed of, and the mixing ratio may be lowered further and recalculated, and disposal may be confirmed only when the mixing ratio reaches the lower limit value and still does not meet the specifications. Through this combination of conditions, the processor of the electronic device (100) can prevent recyclable recycled materials from being hastily disposed of.

[0160] The processor of the electronic device (100) can perform control to separate recycled materials routed to a disposal path from the actual processing flow. As an example, the transfer equipment can be controlled to switch recycled materials that have been confirmed for disposal to a waste collection path so that they are not fed into the molding process, or an identification mark can be applied to a container containing recycled materials to be disposed of so that they can be distinguished in a subsequent disposal process. By ensuring that the disposal determination leads to the control of the actual physical flow in this way, the processor of the electronic device (100) can fundamentally prevent a situation in which recycled materials that do not meet specifications are mixed into the final molded body.

[0161] The processor of the electronic device (100) can perform a verification to increase the validity of the judgment before routing to the disposal path. As one scenario, for recycled materials that do not meet specifications near the lower limit, it can check whether there were any errors in the calculation of the physical property values ​​or degradation index used in the prediction, or if a significant amount is determined to be subject to disposal, it can notify the user terminal (210) and confirm disposal after obtaining final approval from the operator. Through this verification procedure, the processor of the electronic device (100) can combine human review with the automated judgment to reduce the risk of recyclable resources being disposed of due to an incorrect judgment.

[0162] The processor of the electronic device (100) can record information regarding recycled materials routed to a disposal path and utilize it for management. As an example, the degradation index of the recycled materials discarded, the last attempted mixing ratio, predicted physical properties, and the process history of the originating part group can be stored together to analyze under what conditions recycled materials are mainly discarded. The processor of the electronic device (100) can accumulate these analysis results in an external server (220) and feed them back to the upstream molding and inspection processes to support improvement activities that reduce the occurrence of defects leading to disposal.

[0163] The processor of the electronic device (100) can control the introduction of recycled and new epoxy materials into the molding process according to a determined recycling mixture. This is a step in which the determined mixing ratio is applied to actual production as the predicted physical properties satisfy the specifications, and it may mean controlling the relevant equipment so that the recycled and new materials are measured and mixed according to the determined ratio and supplied to the molding equipment. Through this control, the processor of the electronic device (100) can link a series of processes from degradation evaluation to mixture determination and physical property prediction to actual molding into a single automated flow.

[0164] The processor of the electronic device (100) can calculate the input amounts of recycled and new materials according to the determined mixing ratio and control the weighing equipment. As an example, once the total amount of material required for one molding batch is determined, the amount of recycled material corresponding to the determined mixing ratio and the amount of new material corresponding to the remainder can be calculated separately, and the weighing equipment can be controlled to accurately supply the corresponding amounts. During the weighing process, the processor of the electronic device (100) can check whether the actual supply amount matches the target amount, and if the error exceeds the allowable range, it can correct it or notify the operator.

[0165] The processor of the electronic device (100) can control the mixing and transfer equipment so that the recycled material and the new material are uniformly mixed and fed into the molding process. As one scenario, the operating time or conditions of the mixing equipment can be controlled so that the recycled material and the new material are mixed evenly without being locally concentrated, thereby ensuring that the determined mixing ratio is uniformly implemented throughout the entire mixture. The processor of the electronic device (100) can control the transfer path so that the mixture thus mixed is supplied to the molding equipment in a timely manner, thereby ensuring that the mixing conditions that served as the basis for the predicted physical properties are reflected exactly in the actual molded body.

[0166] The processor of the electronic device (100) can manage a situation in which multiple recycled lots are processed during the process of controlling input into the molding process. As an example, if the confirmed mixing ratios for each lot are different, the mixing conditions can be switched so that the mixing ratio confirmed for the lot is applied at the time each lot is input into the molding process, thereby ensuring that the difference in mixing ratios between lots is reflected without confusion. Through such lot-by-lot management, the processor of the electronic device (100) can ensure that recycled lots of different deterioration states are molded into a suitable mixture for each.

[0167] The processor of the electronic device (100) can record the results of controlling the input of the molding process and related information, which can be used for quality tracking and verification. As an example, it can store which recycled lot was input into which molding batch at which mixing ratio, along with the predicted physical properties and specification judgment results, so that the molded body produced from that batch can be compared with the actual physical properties shown in the inspection. The processor of the electronic device (100) can accumulate the results of the comparison between the actual physical properties and the predicted physical properties on an external server (220) and report them to a user terminal (210), which can be used to verify the accuracy of the prediction and continuously increase the reliability of subsequent formulation decisions.

[0168] Meanwhile, the processor of the electronic device (100) determines the mixing ratio of the recycled part to the new epoxy material based on the calculated degradation index, and may use the following mathematical formula 1 for the determination.

[0169] <Mathematical Formula 1>

[0170]

[0171] Here, the letter r represents the mixing ratio of recycled material, the letter r0 represents the standard mixing ratio, the letter k represents the reduction factor, and the letter h represents the deterioration index. In this case, the letter k representing the reduction factor may be a positive value such that the letter r representing the mixing ratio becomes smaller as the letter h representing the deterioration index increases.

[0172] The processor of the electronic device (100) may treat each parameter of Equation 1 with the following meanings. The letter r, representing the mixing ratio, is a value representing the proportion of the recycled material in the total mixture when a molding mixture is formed by mixing the new epoxy material and the recycled material, and may be a result value that determines the amount of recycled material to be finally introduced into the molding process. The letter r0, representing the reference mixing ratio, is a value corresponding to the upper limit of the mixing ratio that can be assigned when assuming an ideal state where there is no deterioration of the recycled material, and may be a value that serves as the starting point before the reduction due to deterioration is applied. The letter k, representing the reduction coefficient, is a value that controls the sensitivity of the mixing ratio decreasing with respect to an increase in the deterioration index, and may be a value that determines the intensity of the influence of deterioration on the mixing ratio. The letter h, representing the deterioration index, may be a value representing the degree of deterioration of the recycled material calculated by combining the thermal aging and contamination of the recycled material.

[0173] The processor of the electronic device (100) can obtain each parameter used in Equation 1 through different paths. The character h, representing the degradation index, can be used by receiving the value calculated from thermal history information and contamination information as is. The character r0, representing the standard mixing ratio, is a value predetermined according to the type of target part or the ordering company's specifications, and can be obtained by querying the mixing standards stored in the external server (220) or by setting it through the user terminal (210). The character k, representing the reduction factor, is a value determined according to the heat resistance requirement level of the target part, and can be set to a large value for parts with strict heat resistance requirements and a small value for parts with a large margin of physical properties, and the processor of the electronic device (100) can determine this value by querying the external server (220) or analyzing past production data.

[0174] The processor of the electronic device (100) can define the relationship between the degradation index and the mixing ratio in a quantitative and reproducible form through Equation 1. According to Equation 1, when the letter h representing the degradation index is zero, the letter r representing the mixing ratio becomes equal to the letter r0 representing the reference mixing ratio, and as the degradation index increases, the mixing ratio can be linearly reduced from the reference mixing ratio by the product of the letter k representing the reduction factor and the degradation index. This relationship clearly expresses the mixing principle in a single formula that more is added when the condition of the recycled material is good and less is added when it is poor, and through this, the processor of the electronic device (100) can calculate the mixing ratio based on a consistent standard without relying on the operator's subjectivity or experience.

[0175] The processor of the electronic device (100) can obtain differential effects from the structure of the multiplication form of mathematical formula 1. Since the product of the letter k representing the reduction factor and the letter h representing the degradation index acts together with the letter r0 representing the reference mixing ratio, the reduction range of the mixing ratio can vary proportionally depending on the magnitude of the reduction factor even with the same degradation index. Accordingly, the processor of the electronic device (100) can easily switch the degree of response of the mixing ratio to degradation for each target part by adjusting only one reduction factor, and can provide suitable maintenance for each part while processing various parts with different heat resistance requirements using the same calculation system.

[0176] The processor of the electronic device (100) can ensure a monotonic relationship in which an increase in the degradation index necessarily leads to a decrease in the mixing ratio by limiting the character k, which represents the reduction factor, to a positive value. When the reduction factor has a positive value, the product of the reduction factor and the degradation index increases as the character h, which represents the degradation index, increases, and as a result, the amount subtracted from the character r0, which represents the reference mixing ratio, increases, so that the character r, which represents the mixing ratio, can decrease. Through these sign conditions, the processor of the electronic device (100) can clearly define the behavior of the calculation formula so that contradictory results are not produced in which a large mixing ratio is assigned to the regenerated portion that has severe degradation. The processor of the electronic device (100) can set the size of the character k, which represents the reduction factor, to match the heat resistance requirement level of the target part, but can increase sensitivity to degradation by setting it to a larger positive value for parts with strict heat resistance requirements.

[0177] The processor of the electronic device (100) may apply post-processing so that the mixing ratio calculated by Equation 1 does not exceed the range allowed in the process. As an example, if the degradation index is very high and the result of the calculation of Equation 1 reaches a negative number or becomes an excessively small value, the processor of the electronic device (100) may replace the calculated value with a predetermined lower limit value or link it to a process that excludes the corresponding recycled portion from recycling. In addition, if the calculated mixing ratio exceeds the upper limit for guaranteeing the minimum ratio of new material, it may be limited to that upper limit. Through such post-processing, the processor of the electronic device (100) can ensure that the result of the calculation of Equation 1 becomes a valid mixing ratio applicable to the actual process.

[0178] Meanwhile, the processor of the electronic device (100) calculates the predicted properties by weighting the properties of the recycled material and the properties of the new epoxy material according to the mixing ratio, and may use the following mathematical formula 2 for the calculation.

[0179] <Mathematical Formula 2>

[0180]

[0181] Here, the letter P represents the predicted physical properties, the letter r represents the incorporation ratio, the letter Pr represents the physical properties of the recycled component, and the letter Pv represents the physical properties of the new epoxy material.

[0182] The processor of the electronic device (100) may treat each parameter of Equation 2 as having the following meaning. The letter P, representing the predicted physical property, is a physical property value expected to be exhibited by a mixture in which recycled material and new epoxy material are mixed according to the mixing ratio, and may be a value corresponding to a heat resistance performance indicator such as glass transition temperature or heat distortion temperature. The letter r, representing the mixing ratio, is the ratio of recycled material to the total mixture, and may be a value that determines the degree to which the physical property of the recycled material is reflected in the predicted physical property. The letter Pr, representing the physical property of the recycled material, is a physical property value exhibited by the recycled material alone, and the letter Pv, representing the physical property of the new epoxy material, may be a physical property value exhibited by the new epoxy material alone.

[0183] The processor of the electronic device (100) can obtain each parameter used in Equation 2 through different paths. The character r, representing the mixing ratio, can be used by receiving the value determined based on the degradation index as is. The character Pv, representing the physical properties of the new epoxy material, can be obtained by querying data provided by the material supplier or a material property database stored on an external server (220). The character Pr, representing the physical properties of the recycled material, can be obtained by directly measuring the glass transition temperature or heat distortion temperature of the recycled material sample, or, if measurement is difficult, by estimating it using the correlation between the degradation index and the physical properties. As an example, the processor of the electronic device (100) can reflect the effect of degradation on the physical properties by estimating that the character Pr, representing the physical properties of the recycled material, becomes lower than that of the new material as the degradation index increases.

[0184] The processor of the electronic device (100) can define the physical properties of the mixture in an internal division form based on the mixing ratio of the physical properties of the two materials through Equation 2. According to Equation 2, the letter r representing the mixing ratio is multiplied by the letter Pr representing the physical properties of the recycled component, and the value obtained by subtracting the mixing ratio from one is multiplied by the letter Pv representing the physical properties of the new epoxy material, and the two terms are added together. Thus, when the mixing ratio is zero, the letter P representing the predicted physical properties becomes equal to the physical property value of the new material, and when the mixing ratio is one, it becomes equal to the physical property value of the recycled component. For mixing ratios in between, the predicted physical properties can continuously change in proportion to the mixing ratio between the two physical property values. Through this internal division structure, the processor of the electronic device (100) can express the effect of the change in the ratio of the recycled component on the physical properties of the mixture in a physically valid manner.

[0185] The processor of the electronic device (100) can obtain differential effects from the structure of Equation 2. Equation 2 is configured such that the sum of the two weights always equals one, using the letter r representing the mixing ratio and the value obtained by subtracting the letter r from the corresponding complement set, which is one. Therefore, the contributions of the recycled and new materials can be divided and reflected throughout the entire mixture without omission or overlap. Accordingly, the processor of the electronic device (100) can simultaneously determine the relative contributions of the two materials based on the mixing ratio alone, and even when recalculating predicted physical properties by changing the mixing ratio, the two weights are automatically adjusted together, allowing for consistent prediction without separate normalization.

[0186] The processor of the electronic device (100) can independently apply Equation 2 to various physical property items. As an example, if the letter P representing the predicted physical property corresponds to the glass transition temperature, the glass transition temperature of each material is substituted into the letter Pr representing the physical property of the recycled material and the letter Pv representing the physical property of the new material to calculate the predicted glass transition temperature, and if the predicted physical property corresponds to the heat deformation temperature, the heat deformation temperature of each material is substituted to calculate the predicted heat deformation temperature. The processor of the electronic device (100) can predict multiple indicators constituting heat resistance performance as a single consistent calculation system by repeatedly applying Equation 2 of the same form for each physical property item.

[0187] The processor of the electronic device (100) can increase the accuracy of the prediction by adding a correction as needed to the value calculated by simple internal division of Equation 2. As one example, if a tendency is observed where the actual physical properties are lower than the internal division value because the bond is incompletely formed at the interface between the recycled component and the new material, the processor of the electronic device (100) can calculate the final predicted physical properties by adding or multiplying a correction term that reflects the interface effect to the value obtained by Equation 2. Through such correction, the processor of the electronic device (100) can ensure consistency in the calculation by maintaining Equation 2 as the basic framework while reflecting the non-linear characteristics of the mixture that are not captured by simple internal division alone.

[0188] Meanwhile, the processor of the electronic device (100) calculates a degradation index by weighted summing the first indicator and the second indicator, and may use the following mathematical formula 3 for the calculation.

[0189] <Mathematical Formula 3>

[0190]

[0191] Here, the letter h represents the degradation index, the letter d represents the first indicator, the letter c represents the second indicator, the letter w1 represents the weight for the first indicator, and the letter w2 represents the weight for the second indicator.

[0192] The processor of the electronic device (100) may treat each parameter of Equation 3 with the following meanings. The character h, representing the degradation index, is a value that combines the thermal aging and contamination of the recycled material into one, and the larger the value, the greater the likelihood that the recycled material will move away from the new material and cause a deterioration in physical properties. The character d, representing the first index, is a value representing the degree of thermal aging calculated from the thermal history, and the character c, representing the second index, is a value representing the degree of foreign matter content calculated from the contamination level. The character w1, representing the weight for the first index, and the character w2, representing the weight for the second index, are values ​​that determine the relative importance of thermal aging and contamination contributing to the degradation index, respectively.

[0193] The processor of the electronic device (100) can obtain each parameter used in Equation 3 through different paths. The character d representing the first indicator and the character c representing the second indicator can be used by receiving the values ​​calculated from the thermal history information and the contamination information, respectively, as they are. The character w1 representing the weight for the first indicator and the character w2 representing the weight for the second indicator are values ​​determined according to the characteristics of the target component; for a target component where heat resistance performance is important, the weight for the first indicator can be set to be large, and for a target component where surface cleanliness or internal defects are important, the weight for the second indicator can be set to be large. The processor of the electronic device (100) can obtain these weights by querying from an external server (220) or receiving them through a user terminal (210), and can also derive weights by analyzing the extent to which each indicator contributed to the actual degradation of physical properties in past production data.

[0194] The processor of the electronic device (100) can clearly define a rule for combining two degradation factors of different natures into a single measure through mathematical formula 3. According to mathematical formula 3, the letter d representing the first indicator is multiplied by the letter w1 representing the weight for the first indicator, and the letter c representing the second indicator is multiplied by the letter w2 representing the weight for the second indicator, and then the two terms are added, so that thermal aging and contamination can be reflected in the degradation index in proportion to their respective weights. Through this linear combination, the processor of the electronic device (100) can express the comprehensive degradation state of the regeneration component, which is not revealed by either factor alone, as a single value that sums the contributions of the two factors.

[0195] The processor of the electronic device (100) can obtain differential effects by adjusting the weights of Equation 3. By changing the relative size of the character w1, which represents the weight for the first indicator, and the character w2, which represents the weight for the second indicator, the degradation index can be different even for the same first and second indicators. Therefore, the processor of the electronic device (100) can switch the tendency of the degradation index calculation to match which factor—thermal aging or contamination—the target component is more sensitive to. Accordingly, while processing multiple target components with different quality requirements using a single calculation formula, it is possible to ensure that the critical degradation factor for each component is more strongly reflected in the degradation index.

[0196] The processor of the electronic device (100) can manage the scale of the parameters so that the degradation index calculated by Equation 3 is consistently linked to the subsequent determination of the mixing ratio. As an example, if the character d representing the first indicator and the character c representing the second indicator are calculated in different ways and have different ranges of values, the processor of the electronic device (100) can convert each indicator to a common reference range and then perform weighted summation to prevent distortion in which the numerical range of one indicator dominates the degradation index. In addition, by normalizing the sum of the character w1 representing the weight for the first indicator and the character w2 representing the weight for the second indicator to be one, the degradation index can have a scale corresponding to the weighted average of the two indicators, thereby ensuring consistency with the value used to calculate the mixing ratio.

[0197] The processor of the electronic device (100) can extend and apply the linear combination of Equation 3 as needed. As an example, in a recycled material where thermal aging and contamination are both severe, if a tendency for the two factors to synergistically degrade physical properties is observed, the processor of the electronic device (100) can add an interaction term to Equation 3, which is the product of the letter d representing the first indicator and the letter c representing the second indicator, multiplied by a separate weight, to reflect this in the degradation index. By reinforcing the necessary terms while maintaining the basic linear combination as a framework, the processor of the electronic device (100) can include complex degradation patterns that are not captured by simple summation alone in the degradation index.

[0198] Meanwhile, if the calculated predicted physical properties do not satisfy the specification physical properties of the target part, the processor of the electronic device (100) may reduce the mixing ratio and recalculate the predicted physical properties, and the reduced mixing ratio can be calculated using the following mathematical formulas 4 and 5.

[0199] <Mathematical Formula 4>

[0200]

[0201] <Mathematical Formula 5>

[0202]

[0203] Here, the letter rn represents the mixing ratio calculated in the nth recalculation step, the letter r0 represents the standard mixing ratio, the letter kn represents the reduction factor applied in the nth recalculation step, the letter h represents the deterioration index, the letter kn+1 represents the reduction factor applied in the next recalculation step, and the letter Δk may represent the increment added to the reduction factor each time the recalculation is repeated.

[0204] When a recalculation is required because the predicted physical properties do not satisfy the standard physical properties, the processor of the electronic device (100) can apply the value obtained by adding the letter Δk, which represents an increment, to the letter kn, which represents a reduction factor of the current stage, as the letter kn+1, which represents a reduction factor of the next stage, while keeping the letter r0, which represents the standard mixing ratio, and the letter h, which represents the degradation index, as they are, to the letter kn, which represents a reduction factor of the current stage. When the reduction factor increases from the letter kn to the letter kn+1, the product of the reduction factor and the degradation index increases, and as a result, the amount subtracted from the standard mixing ratio increases, so that the mixing ratio calculated in the next stage can be smaller than the mixing ratio of the previous stage.

[0205] The processor of the electronic device (100) can obtain the range for increasing the character kn, which represents the reduction factor in mathematical formulas 4 and 5, in various ways. As one example, the processor of the electronic device (100) can gradually lower the mixing ratio by increasing the reduction factor by a predetermined constant increment for each recalculation, and as another example, by increasing the increment of the reduction factor in proportion to how much the predicted physical properties fall short of the lower specification limit, the mixing ratio can be lowered more quickly as the degree of failure increases, thereby reducing the number of recalculations. The processor of the electronic device (100) can obtain the criteria for such increments by querying from an external server (220) or by receiving them through a user terminal (210).

[0206] The processor of the electronic device (100) can define the iterative reduction of the mixing ratio of closed-loop readjustment as a single calculation formula through mathematical formulas 4 and 5. By limiting the value that changes during the recalculation process to a single character kn representing the reduction coefficient and fixing the character r0 representing the reference mixing ratio and the character h representing the degradation index, the processor of the electronic device (100) can clearly track on what basis and by how much the mixing ratio has decreased at each stage of readjustment. Since this structure is a method of increasing only the intensity of the reflection while continuously reflecting the character h representing the degree of degradation of the recycled component, rather than arbitrarily lowering the mixing ratio, it can ensure that the recalculated mixing ratio is not determined independently of the state of the recycled component.

[0207] The processor of the electronic device (100) can obtain differential effects from the structure of increasing the reduction factor of mathematical formulas 4 and 5. As the character kn representing the reduction factor increases, the influence of the character h representing the degradation index on the mixing ratio becomes stronger, so the mixing ratio can decrease more rapidly for recycled parts with severe degradation as recalculation is repeated. Accordingly, the processor of the electronic device (100) can reach a mixing ratio that satisfies the specifications with a small number of recalculations for recycled parts with minor degradation, and for recycled parts with severe degradation, the mixing ratio can rapidly approach the lower limit value, thereby efficiently selecting recycled parts that can satisfy the specifications and recycled parts that cannot.

[0208] The processor of the electronic device (100) can link the condition that the mixing ratio calculated by mathematical formulas 4 and 5 reaches a lower limit value with a disposal determination. By repeating recalculations that increase the character kn representing the reduction factor, the character r representing the mixing ratio gradually decreases so that it eventually reaches a predetermined lower limit value or is calculated to be lower than that. If the result of calculating mathematical formulas 4 and 5 falls below the lower limit value and the predicted physical properties do not satisfy the specifications, the processor of the electronic device (100) routes the corresponding recycled portion to a disposal path, and if the specifications are satisfied before reaching the lower limit value, the mixing ratio at that point in time can be determined as a recycled mixture. By combining the reduction of the mixing ratio and the determination of the lower limit value according to mathematical formulas 4 and 5 in this way, the processor of the electronic device (100) can implement a closed-loop readjustment leading to recalculation and disposal routing as a procedure having a quantitative termination condition.

[0209] Additionally or generally, according to one embodiment, a method of operation of an electronic device for determining the mixing ratio of recycled material and predicting mixed physical properties based on a degradation index for recycling epoxy heat-resistant parts for semiconductor inspection equipment may further include: a processor controlling a humidity control device to supply humidifying air having a relative humidity of 30% or more and 40% or less and a temperature of 20°C or more and 25°C or less into a chamber containing recycled material; a processor acquiring an acoustic emission signal emitted by the recycled material from an ultrasonic sensor while the humidifying air is supplied; a processor calculating the cumulative occurrence number of components included in a frequency band of 100 kHz or more and 300 kHz or less among the acquired acoustic emission signals; and a processor determining that microcracks exist in the recycled material and reflecting this in thermal history information when the calculated cumulative occurrence number exceeds a preset reference number.

[0210] The processor of the electronic device (100) can control a humidity control device to supply humidified air with a relative humidity of 30% or more and 40% or less and a temperature of 20°C or more and 25°C or less into a chamber containing the regenerated material. Here, humidified air refers to air in which humidity and temperature are controlled to a predetermined range, and a humidity control device may refer to equipment that maintains the air condition inside the chamber to a target condition using a humidifying element, a dehumidifying element, a heating element, and a cooling element. The processor of the electronic device (100) can set the humidity and temperature inside the chamber to a specified range prior to measurement so that subsequent acoustic measurement for detecting microcracks can be performed in a stable environment.

[0211] The processor of the electronic device (100) can set the conditions of the humidified air according to the characteristics of the regenerated particles and the purpose of measurement. As one scenario, if the humidity is excessively low, static electricity accumulates on the surface of the regenerated particles, causing fine particles to float and potentially inducing noise in acoustic measurement; conversely, if the humidity is excessively high, the regenerated particles absorb moisture, filling the crack area with water, which may cause the acoustic signal generated from the crack to be attenuated. Accordingly, the processor of the electronic device (100) can set the humidity to a range of 30% or more and 40% or less relative humidity, where the suppression of static electricity and the suppression of moisture absorption are balanced, so that the acoustic signal originating from the micro-crack can be measured without distortion.

[0212] The processor of the electronic device (100) may also set temperature conditions to ensure the reproducibility of the measurement. As an example, if the temperature is low, the epoxy material may become relatively brittle, which may alter the characteristics of the acoustic signal generated in the microcracks, and if the temperature is high, the material may soften, which may slow down the crack behavior. Therefore, the processor of the electronic device (100) may set the temperature to a room temperature range of 20°C or higher and 25°C or lower, which maintains the stable behavior of the material. By measuring multiple regenerated lots under the same conditions within this temperature range, the processor of the electronic device (100) can secure a consistent standard that allows the measurement results between lots to be compared with each other.

[0213] The processor of the electronic device (100) can maintain target conditions by continuously monitoring the humidity and temperature inside the chamber during the process of controlling the humidity control device. As an example, it can receive measurement values ​​from a humidity sensor and a temperature sensor placed inside the chamber and compare them with a target range, and if the humidity falls below the lower limit, it can operate a humidification element, and if it exceeds the upper limit, it can operate a dehumidification element; similarly, for the temperature, it can operate a heating element and a cooling element to return the conditions to within the target range. The processor of the electronic device (100) can prevent measurement from taking place before the composition is completed by initiating subsequent acoustic measurement only after the measurement value has been stably maintained within the target range for a predetermined period of time.

[0214] The processor of the electronic device (100) can record and manage the composition conditions of the humidified air and the maintenance history thereof for each lot of the regenerated material. As an example, by storing the humidity and temperature at which the measurement of a specific regenerated material was performed along with the measurement results, it can be referenced later when evaluating the reliability of the measurement results or analyzing the cause of anomalies. The processor of the electronic device (100) can query the composition conditions from an external server (220) or receive and reflect them via a user terminal (210), and can adjust the humidity conditions accordingly if the type of regenerated material to be measured changes.

[0215] The processor of the electronic device (100) can acquire an acoustic emission signal emitted by the regenerated material from an ultrasonic sensor while humidified air is supplied. Here, an acoustic emission signal refers to an elastic wave emitted when a crack latent within the material progresses finely due to stress or environmental changes, or when crack surfaces rub against each other, which is converted into an electrical signal. An ultrasonic sensor may refer to a sensing element based on a piezoelectric element that detects such elastic waves and outputs them as electrical signals. The processor of the electronic device (100) can collect such acoustic emission signals to non-destructively detect the presence of microcracks latent in the regenerated material.

[0216] The processor of the electronic device (100) can create measurement conditions to induce an acoustic emission signal from the regenerated material. As one scenario, when humidifying air is supplied and a fine humidity gradient is formed between the interior and the surface of the regenerated material, local stress changes occur at the crack site, causing latent microcracks to behave finely, at which time elastic waves may be emitted from the cracks. In addition to this humidity-induced behavior, the processor of the electronic device (100) can, if necessary, apply a small load to the regenerated material or gradually change the temperature to promote crack behavior, thereby ensuring that a sufficient acoustic emission signal is generated.

[0217] The processor of the electronic device (100) can ensure the quality of signal acquisition by managing the placement and coupling state of the ultrasonic sensor. As one example, the ultrasonic sensor can be placed in close contact with the wall of a container containing the recycled material or a sample stand supporting the recycled material, and an acoustic binder can be interposed between the sensor and the contact surface so that elastic waves are transmitted to the sensor without loss. Prior to the start of measurement, the processor of the electronic device (100) can apply a reference signal to check the coupling state and sensitivity of the sensor, and if the coupling is insufficient and the sensitivity falls below the reference, it can notify the user terminal (210) to induce repositioning.

[0218] The processor of the electronic device (100) can perform processing to distinguish between crack-derived components and background noise in the acquired acoustic emission signal. As an example, since ambient vibrations or electrical noise unrelated to the behavior of the regenerated component may be mixed into the signal, the processor of the electronic device (100) can treat only signals exceeding a predetermined threshold amplitude as valid acoustic emission events and exclude signals below that level by considering them as background noise. The processor of the electronic device (100) can prevent noise from being mistaken for a crack signal by measuring the background noise level of the measurement environment in advance and setting the threshold amplitude sufficiently higher than that level.

[0219] The processor of the electronic device (100) can store the acquired acoustic emission signal along with time information and transmit it for subsequent analysis. As an example, features such as the time, amplitude, and duration of each acoustic emission event can be recorded together and subsequently used to calculate the number of occurrences of specific frequency band components or to track the progression of cracks in chronological order. The processor of the electronic device (100) can manage the stored signals by lot of regeneration so that the potential degree of cracks can be compared for each lot.

[0220] The processor of the electronic device (100) can calculate the cumulative occurrence of a component included in a frequency band of 100 kHz or more and 300 kHz or less among the acquired acoustic emission signals. Here, the cumulative occurrence refers to the sum of how many times an acoustic emission event belonging to the corresponding frequency band occurred during the measurement period, and may be an indicator that quantitatively represents the degree of activity of a microcrack latent in the regenerated signal. The processor of the electronic device (100) can determine the presence and activity of the crack by counting the occurrence of events in that band using the characteristic that signals originating from the crack are concentrated in a specific frequency band.

[0221] The processor of the electronic device (100) can set a frequency band of 100 kHz or more and 300 kHz or less based on the characteristics of the crack signal. As one scenario, elastic waves emitted when microcracks propagate in a curable resin such as epoxy exhibit characteristic components in a specific frequency band, whereas frictional sounds or mechanical vibrations generated during the handling or transport of recycled materials may be mainly distributed in a lower frequency band. The processor of the electronic device (100) can selectively capture the crack signal by taking the band of 100 kHz or more and 300 kHz or less, which is distinguished from low-frequency mechanical noise while the crack-derived components are concentrated, as the measurement target.

[0222] The processor of the electronic device (100) can perform processing to separate components of the corresponding frequency band from the acquired signal. As an example, the acoustic emission signal can be converted into frequency components to determine which band each event belongs to, or a band-pass filter that passes only components from 100 kHz to 300 kHz can be applied to the signal to extract only the events of the corresponding band. The processor of the electronic device (100) can calculate the cumulative number of occurrences by counting each of the extracted events as one occurrence and summing them over the measurement period.

[0223] The processor of the electronic device (100) can manage the process so that a single crack event is not counted redundantly when calculating the cumulative occurrence count. As an example, if a single crack progression is detected by multiple adjacent signals, the processor of the electronic device (100) can prevent the occurrence count from being overcalculated by grouping signals that occur consecutively within a predetermined time interval into a single event and counting them. The processor of the electronic device (100) can ensure consistency in calculation by adjusting these event definition criteria to match the characteristics of the regenerated portion being measured.

[0224] The processor of the electronic device (100) can record the calculated cumulative occurrence count along with measurement conditions and transmit it to subsequent judgments. As an example, by storing the cumulative occurrence count in conjunction with measurement conditions such as measurement period, humidity conditions, and threshold amplitude, it is possible to compare the occurrence counts obtained at different points in time or from different lots under the same conditions. The processor of the electronic device (100) can provide the managed occurrence count to a user terminal (210) so that an operator can identify the crack activity of the recycled material, and can accumulate it on an external server (220) to be used for analyzing the relationship between crack activity and actual material property degradation.

[0225] The processor of the electronic device (100) can determine that microcracks exist in the regenerated portion and reflect this in the thermal history information if the calculated cumulative occurrence count exceeds a preset reference count. Here, the reference count is a value that serves as a boundary for determining whether significant microcracks are latent in the regenerated portion, and the occurrence count exceeding this value may be a threshold indicating that crack activity is at a level that cannot be ignored. By comparing the cumulative occurrence count with this reference count, the processor of the electronic device (100) can determine whether cracks exist in the regenerated portion through a clear binary determination.

[0226] The processor of the electronic device (100) can utilize the relationship between cracks and thermal load by reflecting the presence of microcracks in the thermal history information. As one scenario, microcracks in the regenerated material may be caused mainly by differences in thermal expansion occurring during repetitive temperature cycles or by thermal shock caused by rapid heating and cooling; therefore, the presence of cracks can serve as evidence suggesting that the regenerated material has undergone a significant thermal load. Based on this relationship, the processor of the electronic device (100) can reflect an upward degree of thermal aging indicated by the thermal history information for the regenerated material determined to have microcracks.

[0227] The processor of the electronic device (100) can implement various methods for reflecting the presence of microcracks in the thermal history information. As one example, if it is determined that microcracks exist, a value indicating the presence of cracks can be added to the items included in the thermal history information, or a value indicating the degree of thermal aging can be increased by a predetermined amount. As another example, the processor of the electronic device (100) can adjust the size of the reflection in proportion to the extent that the cumulative number of occurrences exceeds a reference number, so that greater thermal aging is reflected in the thermal history information as crack activity becomes more severe.

[0228] The processor of the electronic device (100) can set a reference count to match the characteristics of the recycled material and the required level of the target part. As an example, when targeting a target part where heat resistance and crack resistance are particularly important, the reference count can be set low to apply strict criteria that determine the presence of a crack even with minimal crack activity, and when targeting a target part where the required level is relaxed, the reference count can be set high. The processor of the electronic device (100) can retrieve such a reference count from an external server (220) or adjust it through a user terminal (210), and can also derive a boundary value as the reference count by analyzing the distribution of occurrence counts of recycled materials in which cracks were confirmed in the past.

[0229] The processor of the electronic device (100) can utilize thermal history information reflecting the micro-crack determination result in conjunction with the subsequent calculation of the degradation index. As an example, recycled material that is determined to have micro-cracks and has increased thermal aging may be calculated with a correspondingly high degradation index, which may result in a low mixing ratio or be excluded from recycling. Through this, potential defects that are not revealed by visual inspection or conventional measurement can be reflected in the composition decision. The processor of the electronic device (100) can record the cumulative occurrence count, reference count, and measurement conditions that served as the basis for the crack determination together, provide them to the user terminal (210), and accumulate them on an external server (220), thereby verifying the validity of the determination retrospectively and supporting improvement activities to reduce crack occurrence in upstream molding and inspection processes.

[0230] Additionally or generally, according to one embodiment, a method of operation of an electronic device for determining the mixing ratio of recycled material and predicting mixed properties based on a degradation index for recycling epoxy heat-resistant components for semiconductor inspection equipment may further include: a processor controlling a measuring device to perform dynamic mechanical analysis on a specimen of a test mixture of recycled material and new epoxy material mixed in order to calculate predicted properties under conditions where the heating rate is 5°C or more and 10°C or less per minute; a processor determining the temperature at which the loss tangent obtained by dynamic mechanical analysis is maximum as the glass transition temperature of the specimen; and a processor storing the determined glass transition temperature in correspondence with the mixing ratio and correcting the predicted properties using the stored value.

[0231] The processor of the electronic device (100) can control a measuring device to perform dynamic mechanical analysis on a specimen of a test mixture of recycled powder and new epoxy material at a heating rate of 5°C or more and 10°C or less per minute in order to calculate predicted physical properties. Here, dynamic mechanical analysis refers to an analysis technique that measures the mechanical response of a specimen by changing the temperature while applying periodic deformation or load to the specimen, and the test mixture may refer to a mixture prepared in a small amount by mixing recycled powder and new material at a specific mixing ratio to verify physical properties prior to actual molding. The processor of the electronic device (100) can perform this analysis to secure actual physical properties that serve as the basis for the predicted physical properties.

[0232] The processor of the electronic device (100) can control or manage the process of preparing a specimen of a test mixture. As one scenario, when a specimen is prepared by mixing recycled and new materials at a specific mixing ratio and curing it, the processor of the electronic device (100) can guide the specimen to be mounted on a measuring device or control an automated transport facility to transport the specimen to a measurement location. By managing the mixing ratio at which the specimen was produced in conjunction with a specimen identifier, the processor of the electronic device (100) can clearly track which mixing ratio the subsequent measurement result corresponds to.

[0233] The processor of the electronic device (100) can control the heating rate to be between 5°C and 10°C per minute to ensure both accuracy and efficiency of the measurement. As one scenario, if the heating rate is excessively slow, the entire specimen reaches a uniform temperature, allowing for precise measurement, but the time required for measurement may become excessively long. If the heating rate is excessively fast, a temperature difference may occur between the surface and the interior of the specimen, causing distortion where the transition temperature appears higher than the actual temperature. The processor of the electronic device (100) controls the heating rate to be within a range between 5°C and 10°C per minute, which balances temperature uniformity and measurement time, thereby enabling reliable measurement results to be obtained within a reasonable time.

[0234] The processor of the electronic device (100) can set measurement conditions for dynamic mechanical analysis and control the measuring device. As an example, the frequency of periodic deformation applied to the specimen, the magnitude of the deformation, the initial temperature at which measurement begins, and the final temperature at which measurement ends can be set and instructed to the measuring device, and the heating unit can be controlled so that the temperature rises according to the set heating rate. The processor of the electronic device (100) monitors whether the actual heating rate maintains the set value while the measurement is in progress, and if a deviation occurs, the heating output can be adjusted to maintain the heating rate within the target range.

[0235] The processor of the electronic device (100) can collect measurement data obtained from dynamic mechanical analysis along with time and temperature information and transmit it to subsequent processing. As an example, data indicating how the storage modulus, loss modulus, loss tangent, etc. of a specimen change with temperature while the temperature rises can be received and stored from a measuring device. By managing measurement conditions and measurement data in conjunction with a specimen identifier, the processor of the electronic device (100) can ensure the reproducibility of measurement results and enable the comparison of results from different specimens under the same conditions.

[0236] The processor of the electronic device (100) can determine the temperature at which the loss tangent obtained by dynamic mechanical analysis becomes maximum as the glass transition temperature of the specimen. Here, the loss tangent is the ratio of the component in which the specimen stores energy and the component in which it dissipates energy with respect to the periodic deformation applied to the specimen, and may be a value that has the characteristic of increasing significantly in the region where the material transitions from a glass state to a rubber state and then decreasing again. The processor of the electronic device (100) can determine the glass transition temperature by finding the temperature corresponding to the peak in the curve where the loss tangent changes with temperature.

[0237] The processor of the electronic device (100) can define the transition temperature clearly and reproducibly by using the temperature at which the loss tangent is maximum as the glass transition temperature. As one scenario, since the glass transition does not occur instantaneously at a specific temperature but proceeds gradually over a certain temperature range, a clear criterion may be required for determining where to set the transition temperature. By using a distinct and unique characteristic point, the peak of the loss tangent, as a criterion, the processor of the electronic device (100) can obtain a consistent glass transition temperature by eliminating the ambiguity where the transition temperature varies depending on the measurer or the time of measurement.

[0238] The processor of the electronic device (100) can perform processing to find a peak in the loss tangent curve. As an example, the temperature at a point where the value increases and then changes to decrease can be searched from the data of the loss tangent value according to temperature, and the temperature at that point can be determined as the peak temperature. The processor of the electronic device (100) can search for the peak after smoothing the data or fit the curve to the data near the peak and calculate the temperature corresponding to the maximum value of the curve as the peak temperature so that minute fluctuations included in the measurement data do not disturb the determination of the peak. Through this, the processor of the electronic device (100) can stably determine the glass transition temperature even in the presence of measurement noise.

[0239] The processor of the electronic device (100) can check the validity of the determined glass transition temperature. As an example, if two or more peaks appear in the loss tangent curve, there is a possibility that the phases have separated because the recycled component and the new material were not sufficiently commercialized. Therefore, the processor of the electronic device (100) can detect the appearance of such multiple peaks and apply criteria such as notifying the user terminal (210) or selecting a peak of a higher temperature as the representative glass transition temperature. By managing exceptions in the determination process in this way, the processor of the electronic device (100) can ensure the reliability of the glass transition temperature determination.

[0240] The processor of the electronic device (100) can record the determined glass transition temperature along with measurement conditions and a specimen identifier and transmit it for subsequent processing. As an example, the glass transition temperature determined for a specific specimen can be stored in conjunction with measurement conditions such as the heating rate and strain frequency of that specimen, thereby enabling direct comparison with the glass transition temperature of another specimen measured under the same conditions. The processor of the electronic device (100) can provide the glass transition temperature managed in this way to a user terminal (210) and accumulate it on an external server (220) to be used as a history of physical property data.

[0241] The processor of the electronic device (100) can store the determined glass transition temperature in correspondence with the incorporation ratio and correct the predicted physical properties using the stored value. Here, storing in correspondence with the incorporation ratio means recording the glass transition temperature measured in a specimen produced with a specific incorporation ratio by pairing it with that incorporation ratio, and correcting the predicted physical properties may mean adjusting the predicted physical properties calculated by calculation to be closer to reality based on these measured values. The processor of the electronic device (100) can increase the accuracy of the prediction by accumulating the measured data and feeding it back into the prediction.

[0242] The processor of the electronic device (100) can determine the actual relationship between the mixing ratio and the physical properties by accumulating actual values ​​of the glass transition temperature corresponding to various mixing ratios. As one scenario, if the glass transition temperatures of various specimens produced with different mixing ratios for the same combination of recycled and new materials are measured and stored, data showing how the glass transition temperature actually changes as the mixing ratio changes can be obtained. Through this data, the processor of the electronic device (100) can verify to what extent the calculated prediction matches or deviates from the actual behavior.

[0243] The processor of the electronic device (100) can correct the predicted physical properties by utilizing the difference between the actual measured value and the calculated predicted value. As an example, the difference between the predicted glass transition temperature calculated by calculation and the actual measured glass transition temperature at a specific mixing ratio can be calculated as a correction amount, and subsequently, when calculating the predicted physical properties under similar conditions, the predicted value can be adjusted to match the actual measurement trend by reflecting that correction amount. If the calculated prediction systematically deviates from the actual due to interfacial bonding or compatibility between the recycled component and the new material, the processor of the electronic device (100) can improve the accuracy of the prediction by offsetting this deviation with a correction based on actual measurements.

[0244] The processor of the electronic device (100) can correct the prediction for a range of incorporation ratios where accumulated actual values ​​are insufficient by using the actual values ​​of adjacent incorporation ratios. As an example, if actual values ​​for a specific incorporation ratio have not yet been secured, the processor of the electronic device (100) can estimate the values ​​between them by using the glass transition temperatures measured at lower and higher incorporation ratios, and correct the predicted physical properties with the estimated values. In this way, the processor of the electronic device (100) can efficiently utilize limited actual data to ensure the reliability of the prediction without having to manufacture specimens for all incorporation ratios.

[0245] The processor of the electronic device (100) can continuously update and manage the correspondence relationship between the incorporation ratio and the glass transition temperature and the correction results. As an example, whenever the actual measured value of a new specimen is added, the glass transition temperature data by incorporation ratio is updated and the correction amount is recalculated, so that the prediction correction can reflect the latest actual behavior even when the material lot changes or process conditions change. The processor of the electronic device (100) can accumulate the correspondence relationship and correction results managed in this way on an external server (220) to share them at various production sites and provide them to a user terminal (210) so that an operator can check the degree of agreement between the prediction and the actual measurement.

[0246] Additionally or generally, according to one embodiment, a method of operation of an electronic device for determining the mixing ratio of recycled material and predicting the mixing properties based on a degradation index for recycling epoxy heat-resistant parts for semiconductor inspection equipment may further include the operation of a processor controlling a degassing device to degas a mixture of recycled material and new epoxy material introduced into a molding process in a reduced pressure atmosphere with a vacuum level of 0.5 kPa or more and 2 kPa or less; the operation of the processor obtaining the viscosity of the mixture from a viscometer while degassing is being performed; and the operation of the processor releasing the reduced pressure atmosphere and controlling the supply of the mixture to a molding die when the obtained viscosity reaches a preset target viscosity range.

[0247] The processor of the electronic device (100) can control a degassing device to degas the mixture of recycled and new epoxy materials introduced into the molding process in a reduced pressure atmosphere with a vacuum level of 0.5 kPa or more and 2 kPa or less. Here, degassing refers to a process of removing bubbles or dissolved gases trapped inside the mixture, and a degassing device may refer to equipment that reduces the pressure inside a container containing the mixture so that bubbles expand and rise and are discharged to the surface. The processor of the electronic device (100) can perform this degassing before supplying the mixture to the molding die in order to prevent bubbles from remaining inside the molded body and leading to defects.

[0248] The processor of the electronic device (100) can control degassing in consideration that degassing may be particularly important in a mixture containing recycled material. As one scenario, since crushed recycled material is prone to containing air in irregularities on the particle surface or in the voids between particles, a mixture containing recycled material may contain more bubbles than a mixture consisting only of new material. The processor of the electronic device (100) can create a reduced pressure atmosphere to remove even these bubbles originating from the recycled material and continue degassing until the bubbles inside the mixture are sufficiently discharged.

[0249] The processor of the electronic device (100) can control the vacuum level to between 0.5 kPa and 2 kPa to ensure both degassing effect and process stability. As one scenario, if the vacuum level is higher than this range and the pressure becomes excessively low, the curing agent or low-boiling point component contained in the mixture may volatilize, or the mixture may boil violently, causing the composition to change or overflow. Conversely, if the vacuum level is lower than this range and the pressure is not sufficiently low, the bubbles may not expand sufficiently, resulting in incomplete degassing. The processor of the electronic device (100) can stably perform degassing by controlling the vacuum level to a range between 0.5 kPa and 2 kPa, which allows for effective discharge of bubbles while suppressing component volatilization and overflow.

[0250] The processor of the electronic device (100) can monitor the depressurization state of the degassing device and maintain the vacuum level within a target range. As an example, the internal pressure measurement value is received from a pressure sensor connected to the degass container and compared with the target vacuum level. If the pressure is higher than the target, the exhaust volume of the vacuum pump is increased, and if it is lower than the target, a small amount of air is introduced to adjust the pressure. The processor of the electronic device (100) can prevent the mixture from suddenly boiling over and overflowing by lowering the pressure in stages rather than rapidly when depressurizing, and can ensure that bubbles are discharged sequentially.

[0251] The processor of the electronic device (100) can record and manage the progress status and conditions of degassing for each lot of the mixture. As an example, for a specific mixture, the degree of vacuum at which degassing was performed and for how long can be recorded so that it can be referenced to analyze the cause if bubble defects are subsequently found in the molded body. The processor of the electronic device (100) can query the degassing conditions from an external server (220) or receive and reflect them via a user terminal (210), and can adjust the degassing conditions according to the characteristics of the mixing ratio or the recycled component.

[0252] The processor of the electronic device (100) can obtain the viscosity of the mixture from a viscometer while degassing is being performed. Here, viscosity is a physical property value indicating the degree to which the mixture resists flow, and may be an indicator for determining whether the mixture is sufficiently fluid to fill even the fine shape of the mold, and a viscometer may refer to a measuring element that measures the flow resistance of the mixture and outputs a viscosity value. The processor of the electronic device (100) can collect the viscosity in real time to determine how the fluidity of the mixture changes while degassing is in progress.

[0253] The processor of the electronic device (100) can monitor the viscosity by taking into account the characteristic of the viscosity changing during the degassing process. As one scenario, as degassing proceeds, the apparent viscosity changes as bubbles escape from the mixture, and at the same time, the epoxy mixture, which is a curable resin, undergoes a curing reaction gradually over time, causing the viscosity to gradually increase. By continuously measuring these changes in viscosity, the processor of the electronic device (100) can capture the point in time when the mixture is in a flow state suitable for mold filling without missing.

[0254] The processor of the electronic device (100) can ensure the reliability of viscosity measurement by managing the placement and measurement method of the viscometer. As an example, a method of measuring viscosity from the rotational resistance of a rotor immersed inside a degassing container, or a method of measuring viscosity from the pressure difference in the flow path by circulating a portion of the mixture, may be adopted. The processor of the electronic device (100) selects a measurement location so that bubbles generated in a reduced pressure atmosphere do not accumulate around the viscometer and disturb the measurement, and can stably identify the trend of viscosity by excluding any instantaneous abnormal fluctuations in the measurement value.

[0255] The processor of the electronic device (100) can acquire and interpret viscosity measurement values ​​along with the temperature of the mixture. As one scenario, since viscosity is sensitive to temperature—decreasing when the temperature is high and increasing when the temperature is low—the processor of the electronic device (100) can measure the temperature of the mixture along with the viscosity value to distinguish whether the viscosity is due to temperature or due to the progress of curing. By using this temperature information to convert the measured viscosity into a value at a reference temperature, the processor of the electronic device (100) can compare viscosities at different points in time on the same standard.

[0256] The processor of the electronic device (100) can store the measured viscosity along with time information and transmit it for subsequent judgment. As an example, data indicating how the viscosity has changed over time since the start of degassing can be recorded and used to determine the time required for the mixture to reach a target viscosity range or the rate of viscosity increase. The processor of the electronic device (100) can provide the managed viscosity data to a user terminal (210) so that an operator can check the progress status of degassing and supply, and can accumulate it on an external server (220) to be used for analyzing the viscosity behavior of the mixture.

[0257] The processor of the electronic device (100) can control the release of the depressurized atmosphere and the supply of the mixture to the molding die when the acquired viscosity reaches a preset target viscosity range. Here, the target viscosity range may refer to a range of viscosity corresponding to a flow state in which the mixture completely fills the shape of the mold without overflowing or failing to maintain its shape. The processor of the electronic device (100) can capture the optimal moment when the viscosity of the mixture enters this range and start the supply for molding.

[0258] The processor of the electronic device (100) can determine the supply time by determining whether the viscosity has reached the target viscosity range. As one scenario, immediately after the start of degassing, bubbles may remain in the mixture and the viscosity may be outside the target range, and as degassing proceeds, the bubbles may be removed and the viscosity may enter the target range. The processor of the electronic device (100) can continuously compare the measured viscosity with the target viscosity range and determine the point at which the viscosity enters that range as the supply start time. Through this, the processor of the electronic device (100) can prevent both premature supply when degassing is insufficient and supply after the viscosity has risen due to excessive curing.

[0259] The processor of the electronic device (100) can prepare for supply by controlling the process of releasing the reduced pressure atmosphere. As an example, when it is determined that the viscosity has reached a target range, the operation of the vacuum pump can be stopped and air or an inert gas can be slowly introduced into the degassing container to restore the internal pressure to atmospheric pressure. Since releasing the reduced pressure abruptly can cause residual microbubbles to be drawn back into the mixture, the processor of the electronic device (100) can restore the pressure gradually to maintain the bubble-free state secured by degassing.

[0260] The processor of the electronic device (100) can control the transfer of the mixture to the molding die after depressurization is released. As an example, the valve of the supply path connecting the degassing vessel and the molding die can be opened, and the mixture can be controlled to be injected into the mold through pressurization or pump transfer. The processor of the electronic device (100) can control the injection pressure or injection speed while the mixture is being injected into the mold so that it is uniformly filled down to the fine shape of the mold, and can manage the condition of the path and the injection port so that new bubbles are not introduced during the injection process.

[0261] The processor of the electronic device (100) can record the viscosity and related conditions at the time of supply and use them for quality tracking. As an example, it can store which mixture was supplied to which mold at which viscosity, along with degassing conditions and mixing ratios, so that if unfilled or bubble defects are found in the molded body later, it can be referenced to analyze whether the cause lies in the viscosity or degassing. The processor of the electronic device (100) can accumulate the managed supply history in an external server (220) and report it to a user terminal (210) to check the suitability of the target viscosity range and use it to improve molding quality.

[0262] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention.

[0263] Accordingly, the embodiments disclosed in this invention are intended to illustrate, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments. The scope of protection of this invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of this invention.

Claims

Claim 1 A method of operation of an electronic device including a processor for determining a recycled component mixing ratio and predicting mixed physical properties based on a degradation index for recycling epoxy heat-resistant components for semiconductor inspection equipment, wherein the processor performs the operation of obtaining thermal history information and contamination information for recycled components obtained by crushing epoxy heat-resistant components classified as defective; the processor performs the operation of calculating a degradation index indicating the degree of degradation of the recycled components based on the obtained thermal history information and contamination information; the processor performs the operation of determining a mixing ratio of the recycled components to a new epoxy material based on the calculated degradation index; and the processor performs the operation of calculating predicted physical properties of a mixture of the recycled components and the new epoxy material based on the determined mixing ratio, the physical properties of the recycled components, and the physical properties of the new epoxy material. A method of operation of an electronic device for determining a recycled component mixing ratio and predicting mixed properties based on a degradation index, comprising: an operation in which, if the calculated predicted properties satisfy the specification properties of a target component, the processor determines the determined mixing ratio as a recycled composition. Claim 2 A method of operation of an electronic device for determining a recycled component mixing ratio and predicting mixed properties based on a degradation index, wherein, in claim 1, the processor determines the mixing ratio as the degradation index increases; the processor compares the calculated degradation index with a reference degradation index; and the processor excludes the recycled component from the recycling mixture when the calculated degradation index exceeds the reference degradation index. Claim 3 A method of operation of an electronic device for determining a recycled component mixing ratio and predicting mixed properties based on a degradation index, wherein, in claim 1, the processor calculates the predicted properties by weighted summing the properties of the recycled component and the properties of the new epoxy material according to the mixing ratio; the processor calculates the predicted properties to include a glass transition temperature and a heat deformation temperature corresponding to the heat resistance performance of the epoxy heat-resistant component; and the processor compares the calculated glass transition temperature and the heat deformation temperature with the standard properties of the target component. Claim 4 A method of operation of an electronic device for determining the mixing ratio of a recycled component and predicting mixed physical properties based on a degradation index, wherein, in claim 1, the processor further comprises: an operation of calculating a first index indicating the degree of thermal aging of the recycled component from the thermal history information; an operation of calculating a second index indicating the content of foreign matter contained in the recycled component from the contamination information; and an operation of calculating a degradation index by weighted summing the calculated first index and the second index. Claim 5 A method of operation of an electronic device for determining a recycled component mixing ratio and predicting mixed properties based on a degradation index, wherein, in claim 1, the processor reduces the mixing ratio and recalculates the predicted properties when the calculated predicted properties do not satisfy the standard properties of the target component; the processor routes the recycled components to a disposal path when the recalculated predicted properties do not satisfy the standard properties and the mixing ratio is below a lower limit value; and the processor controls the recycled components and the new epoxy material to be fed into a molding process according to the determined recycling composition.

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