Apparatus for molding product

Abstract

The product molding device includes: a lower mold that supports a substrate having a central area on which a product is mounted and a border area formed on the outer side of the central area; an upper mold disposed on the upper surface of the lower mold on which the substrate is disposed, wherein a cavity for molding the product with resin is formed in the central area and a contact portion is formed in a portion corresponding to the border area of ​​the substrate; and a resin leakage prevention module disposed in a portion corresponding to the border area of ​​the substrate, which prevents the resin from leaking through a gap formed between the contact portion and the substrate by adhering the substrate corresponding to the border area to the contact portion.

Description

Technology Field

[0001] The present invention relates to a molding device for molding a product by covering it with molding resin. Background Technology

[0002] Generally, since products such as semiconductor chips are easily damaged by external shocks and vibrations and susceptible to damage from static electricity, the semiconductor chip and substrate are placed between an upper mold and a lower mold while the semiconductor chip is mounted on the substrate, and the semiconductor chip is molded using epoxy resin, which is a molding resin.

[0003] When the substrate on which the semiconductor chip is mounted is a multilayer printed circuit board, the central part of the substrate may have a thick thickness, while the edges of the substrate may have a relatively thin thickness compared to the central part.

[0004] In this manner, when a semiconductor chip and a substrate are placed between an upper mold and a lower mold in which a cavity is formed, and a molding resin is provided in the cavity, the molding resin can leak from the center of the substrate and leak to the edge of the substrate to cover the edge of the substrate.

[0005] Meanwhile, numerous electrical components such as wiring, diodes, and resistors are mounted on the edges of the substrate. However, if molding resin leaks to the edges of the substrate due to variations in substrate thickness and covers the edges, a problem arises in which electrical components cannot be mounted on the substrate. Prior art literature

[0006] Registered Patent No. 10-1246875, Semiconductor Chip Molding Device (Registration Date: March 18, 2013) The problem to be solved

[0007] The present invention provides a product molding device that prevents molding defects in which molding resin leaks from the center to the edge, even when a molding process is performed using molding resin after mounting a product, such as a semiconductor chip, on a substrate having a thickness variation between the center and the edge. means of solving the problem

[0008] As an embodiment, the product molding device includes: a lower mold supporting a substrate having a central area on which a product is mounted and a border area formed on the outer side of the central area; an upper mold disposed on the upper surface of the lower mold on which the substrate is disposed, wherein a cavity for molding the product with resin is formed in the central area and a contact portion is formed in a portion corresponding to the border area of ​​the substrate; and a resin leakage prevention module disposed in a portion corresponding to the border area of ​​the substrate, wherein the substrate corresponding to the border area is brought into contact with the contact portion to prevent the resin from leaking through a gap formed between the contact portion and the substrate.

[0009] The resin leakage prevention module of the product molding device includes a movable block that is raised and lowered and positioned to correspond to the edge area of ​​the substrate, and a pressurizing unit that provides a pressurizing force to the movable block.

[0010] The pressure unit of the product molding device comprises a rod having a column portion with a head portion formed therein, a disc spring having an opening inserted into the column portion, a bushing having a hollow that is inserted into the column portion to prevent the disc spring from coming loose, and a fastening screw that is inserted into the bushing and fastened to a screw tap formed at the end of the column portion to mutually fasten the bushing and the column portion.

[0011] The product molding device further includes a spacer positioned between the disc spring and the bushing and inserted into the column portion.

[0012] The movable block of the product molding device is formed in a rectangular shape, and a plurality of the movable blocks are mounted side by side on the lower mold.

[0013] A damage prevention pad is installed at the end of the movable block that contacts the substrate of the product molding device to prevent damage to the substrate. Effects of the invention

[0014] The product molding device according to the present invention has the effect of preventing defects and improving productivity by preventing molding defects in which the molding resin leaks from the center to the edge, even when a molding process is performed using a molding resin after mounting a product such as a semiconductor chip on a substrate having a thickness variation between the center and the edge. Brief explanation of the drawing

[0015] FIG. 1 is a plan view illustrating a product being molded by a product molding device according to an embodiment of the present invention. Figure 2 is a cross-sectional view taken along line II' of Figure 1. Figure 3 is a cross-sectional view of a product molding device that performs molding of the product shown in Figure 2. Figure 4 is a plan view illustrating the lower mold shown in Figure 3. Figure 5 is a plan view illustrating the upper mold shown in Figure 3. Figure 6 is a drawing illustrating the pressurizing unit of the resin leakage prevention module. Fig. 7 is an exploded perspective view of Fig. 6. FIG. 8 is a cross-sectional view illustrating a comparative example in which molding is performed by a product molding device according to the prior art. FIG. 9 is a cross-sectional view illustrating the molding process carried out by the product molding device according to the present invention. Specific details for implementing the invention

[0016] The present invention described below is capable of various modifications and may have various embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description.

[0017] However, this is not intended to limit the invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the invention, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the invention.

[0018] The terms used in this patent are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this patent, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0019] Additionally, terms such as "first," "second," etc., may be used to distinguish and describe various components, but said components shall not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0020] In addition, if at least two different embodiments are described in this patent, each embodiment may use all or part of its components in combination and mixed with one another without further description, as long as it does not deviate from the technical concept of the present invention.

[0021] FIG. 1 is a plan view illustrating a product being molded by a product molding device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II' of FIG. 1.

[0022] Referring to FIGS. 1 and FIGS. 2, the product (10) may be a semiconductor package including, for example, a semiconductor chip (2) and a substrate (3).

[0023] Although in one embodiment of the present invention, the product (10) is illustrated and described as including a semiconductor package, otherwise, the product (10) may include various electronic components that are molded with a molding resin in addition to a semiconductor chip.

[0024] The substrate (3) includes, for example, a multilayer printed circuit board comprising a plurality of layers. The substrate (3) may be formed in the shape of a square plate or a rectangular plate when viewed in a planar view.

[0025] The substrate (3) includes a central region (CR) on which a semiconductor chip (2) is placed and a border region (ER) formed on the outer edge of the central region (CR). The border region (ER) surrounds the central region (CR).

[0026] The substrate (3) corresponding to the central region (CR) may have a first thickness (t1) as shown in FIG. 2, and the edge of the substrate (3) corresponding to the edge region (ER) may be formed with a second thickness (t2) that is thinner than the first thickness (t1) as shown in FIG. 2.

[0027] Figure 3 is a cross-sectional view of a product molding device that performs molding of the product shown in Figure 2.

[0028] Referring to FIGS. 2 and 3, in order to mold the semiconductor chip (2) mounted on the substrate (3) with a molding resin, the substrate (3) and the semiconductor chip (2) are housed inside a product molding device (400).

[0029] The product molding device (400) includes a lower mold (100), an upper mold (200), and a resin leakage prevention module (300).

[0030] FIG. 4 is a plan view illustrating the lower mold shown in FIG. 3. FIG. 5 is a plan view illustrating the upper mold shown in FIG. 3.

[0031] Referring to FIGS. 3 and FIGS. 4, the lower mold (100) serves to support the substrate (3) of the product (10).

[0032] The lower mold (100) can be formed, for example, in the shape of a thick plate.

[0033] Referring to FIGS. 3 and 5, the upper mold (200) is placed on the upper surface of the lower mold (100) on which the substrate (3) is placed. The upper mold (200) is placed facing the upper surface of the substrate (3).

[0034] The upper mold (200) is formed in the shape of a plate. A cavity (210) is formed on the lower surface of the upper mold (200) facing the upper surface of the lower mold (100), and the cavity (210) is formed at a position corresponding to the central region (CR) of the product (10).

[0035] The cavity (210) is formed in a size that accommodates the semiconductor chip (2) of the product (10), and the cavity (210) is filled with molding resin so that the semiconductor chip (2) is molded by the molding resin.

[0036] Meanwhile, a contact portion (220) corresponding to the edge region (ER) of the substrate (3) is formed on the outer edge of the cavity portion (210) of the upper mold (200), and the contact portion (220) contacts the edge region (ER) of the substrate (3).

[0037] Referring again to FIGS. 3 and FIGS. 4, the resin leakage prevention module (300) is positioned parallel to the side wall of the lower mold (100), and the resin leakage prevention module (300) is positioned at a location corresponding to the edge area (ER) of the substrate (3).

[0038] The resin leakage prevention module (300) prevents the resin from leaking through the gap formed between the attachment part (220) and the edge of the upper surface of the substrate (3) by making the edge of the substrate (3), which is formed with a thinner thickness in the edge area compared to the central area, adhere to the attachment part (220) of the upper mold (200), thereby preventing contamination of the upper surface of the substrate (3) and the upper surface of the substrate (3) from being covered with resin.

[0039] Referring to FIGS. 3 and 4, the resin leakage prevention module (300) includes a movable block (310) and a pressurizing unit (320).

[0040] The movable block (310) is positioned at a location corresponding to the edge area (ER) of the substrate (3), and the movable block (310) is positioned adjacent to the lower mold (100).

[0041] In one embodiment of the present invention, the lower mold (100) is fixed, but the movable block (310) is arranged to be able to move up or down relative to the lower mold (100).

[0042] Although in one embodiment of the present invention, the movable block (310) is shown and described as being disposed on the side wall of the lower mold (100), alternatively, the movable block (310) may form a through hole penetrating the upper and lower surfaces of the lower mold (100) and be disposed so as to be able to move up and down inside the through hole.

[0043] In one embodiment of the present invention, the movable block (310) formed in the portion corresponding to the edge region (ER) of the substrate (3) is formed in the shape of a rectangular block.

[0044] Although in one embodiment of the present invention, the movable block (310) is illustrated and described as having a rectangular block shape, the movable block (310) may have an L-shaped block shape when viewed in a planar view.

[0045] The upper part of the movable block (310) presses the substrate (3) while in contact with the substrate (3). In order to prevent the lower surface of the substrate (3) from being scratched or damaged by the movable block (310), a damage prevention pad (305) that prevents damage to the substrate (3) may be placed at the end of the movable block (310) that is in contact with the substrate (3).

[0046] Meanwhile, the pressure unit (320) provides a pressure so that the movable block (310) can press the edge area (ER) of the substrate (3), thereby preventing a gap from occurring between the contact portion (220) and the upper surface of the substrate (3).

[0047] FIG. 6 is a drawing illustrating a pressurizing unit of a resin leakage prevention module. FIG. 7 is an exploded perspective view of FIG. 6.

[0048] Referring to FIGS. 6 and 7, the pressure unit (320) includes a rod (325), a disc spring (330), a bushing (335), and a fastening screw (340). In addition, the pressure unit (320) may further include a spacer (345) for adjusting the pressure of the pressure unit (320).

[0049] The rod (325) includes a head portion (323) and a column portion (324).

[0050] The column portion (324) is formed in a cylindrical shape, and a head portion (323) larger than the diameter of the column portion (324) is formed at one end of the column portion (324). Meanwhile, a concave screw tap (322) is formed at the other end of the column portion (324).

[0051] The disc spring (330) is formed in the shape of a disc, and multiple disc springs (330) are stacked with a portion bent to generate elastic force. An opening (332) into which a column portion (324) is inserted is formed in the center of the disc spring (330).

[0052] The size of the opening (332) formed in the disc spring (330) is formed to be smaller than the head portion (323), and as a result, the disc spring (330) is caught on the head portion (323) and does not detach.

[0053] The bushing (335) is formed in the shape of a hollow pipe, and a flange portion (336) for supporting a disc spring (330) is formed at one end of the bushing (335). A step is formed at the end of the bushing (335) to catch the head of a fastening screw (340) to be described later.

[0054] The fastening screw (340) is inserted into the hollow of the bushing (335) and then fastened to the screw tap (322) formed at the end of the column portion (324), thereby connecting the disc spring (330) so that it does not detach from the rod (325).

[0055] Meanwhile, a spacer (345) is placed between the disc spring (330) and the bushing (335) to adjust the pressure exerted by the disc spring (330) by adjusting the number of disc springs (330).

[0056] FIG. 8 is a cross-sectional view illustrating a comparative example in which molding is performed by a product molding device according to the prior art. FIG. 9 is a cross-sectional view illustrating molding performed by a product molding device according to the present invention.

[0057] Referring to FIG. 8, in the case of a conventional product molding device (50), when a molding resin (5) is provided in a cavity formed between a lower mold (20) and an upper mold (30) while the thickness of the edge portion of the substrate (3) is thinner than the thickness of the center portion of the substrate (3), and the semiconductor chip (2) placed on the upper portion of the substrate (3) is molded by wrapping, a portion of the molding resin (5) leaks out from the cavity and a leak portion (5a) is formed that leaks out to the upper surface of the substrate (4).

[0058] In this way, the leakage portion (5a) formed on the upper surface of the substrate (4) covers the terminals, etc., where electronic components formed on the substrate (4) are placed, so that the electronic components cannot be mounted.

[0059] Meanwhile, as illustrated in FIG. 9, according to the present invention, when the thickness of the edge portion of the substrate (3) is thinner than the thickness of the central portion of the substrate (3) according to the product molding device (400), the movable block (310) of the resin leakage prevention module (300) coupled to the lower mold (100) presses the substrate (3) by the pressurizing unit (320), and as a result, the upper surface of the substrate (3) is in close contact with the upper mold (200), and in this state, the mold resin (5) is provided to the cavity, so that the mold resin (5) is not leaked to the upper surface of the substrate (3).

[0060] As explained in detail above, even when a product such as a semiconductor chip is mounted on a substrate with thickness variations between the center and the edges and a molding process is performed using molding resin, it prevents molding defects caused by the molding resin leaking from the center to the edges, thereby having the effect of preventing defects and improving productivity.

[0061] Meanwhile, the embodiments disclosed in this drawing are merely specific examples provided to aid understanding and are not intended to limit the scope of the invention. It is obvious to those skilled in the art that other variations based on the technical concept of the invention are possible in addition to the embodiments disclosed herein. Explanation of the symbols

[0062] 100...Lower mold 200...Upper mold 300...Resin leakage prevention module 400...Product molding device

Claims

Claim 1 A lower mold supporting a substrate having a central region on which a product is mounted and a border region formed on the outer side of the central region, wherein the central region has a first thickness and the border region has a second thickness thinner than the first thickness; and an upper mold disposed on the upper surface of the lower mold on which the substrate is placed, wherein a cavity for molding the product with resin is formed in the central region and a contact portion is formed in a portion corresponding to the border region of the substrate. A product molding device comprising: a resin leakage prevention module disposed in a portion corresponding to the edge area of ​​the substrate and preventing the resin from leaking through a gap formed between the contact portion and the substrate by bringing the substrate corresponding to the edge area into contact with the contact portion; wherein the lower mold has a size corresponding to the central area of ​​the substrate and the lower mold is fixedly disposed at a position corresponding to the central area of ​​the substrate; the resin leakage prevention module includes a movable block that is raised and lowered and disposed corresponding to the edge area of ​​the substrate and a pressure unit that provides pressure to the movable block; wherein the movable block is raised and lowered along the side of the lower mold to raise the edge area of ​​the substrate and bring it into contact with the contact portion; wherein the movable block is formed in a rectangular shape and a plurality of movable blocks are mounted side by side of the lower mold. Claim 2 delete Claim 3 A product molding device according to claim 1, wherein the pressurizing unit comprises a rod having a column portion having a head portion formed therein, a disc spring having an opening inserted into the column portion, a bushing having a hollow that is inserted into the column portion to prevent the disc spring from coming loose, and a fastening screw that is inserted into the bushing and fastened to a screw tap formed at the end of the column portion to mutually fasten the bushing and the column portion. Claim 4 A product molding device according to paragraph 3, further comprising a spacer disposed between the disc spring and the bushing and inserted into the column portion. Claim 5 delete Claim 6 A product molding device according to claim 1, wherein the end of the movable block in contact with the substrate is equipped with a damage prevention pad to prevent damage to the substrate.

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