Overmolded printed electronic component and method of manufacturing the same

Abstract

The present application relates not only to overmolded printed electronic components but also to a method for manufacturing overmolded printed electronic components using conductive trace inks such as molecular inks and thermosetting resins, and reinforcing materials such as glass microspheres and glass fabrics.

Description

Technology Field

[0001] The present application relates to overmoulded printed electronic components as well as a method for manufacturing overmoulded printed electronic components. Background Technology

[0002] Overmolding was used to manufacture three-dimensional electronic products by incorporating printed ink into a thermoplastic film and then overmolding it with a thermoplastic resin.

[0003] For example, current metal flake inks used in printed electronics may have limited potential for, for instance, moldability (elongation) and high resistivity, or may require significant deposition thickness to achieve adequate conductivity. These metal flake inks may also be susceptible to heat and / or force applied to conductive traces when standard types of molten resin are injected into the cavity of an injection mold. Visual defects such as ghosting or circuit printing may also occur, and connectors and / or light-emitting diodes (LEDs) can leave visual marks on the cosmetic surface of overmolded parts.

[0004] Structural printed electronic components manufactured by known means can be heavier than the desired weight, even if they are thinner than conventional ones. The final thickness of the component is a function of the substrate film layer(s) and the resin. The overall thickness of the component allows for the immersion of electrical features such as LEDs, organic light-emitting diodes (OLEDs), and / or connectors. Designers have used ribs to increase component thickness, thereby enhancing rigidity and creating sufficient space for standoffs of LEDs, OLEDs, and connectors. The resulting thickness of typical structural electronic components is approximately 3 mm or more. Consequently, these components become heavy and may require the use of a significant amount of thermoplastic resin. This results in degraded thermal performance. Consequently, this technology is being considered primarily for internal non-structural applications.

[0005] Therefore, there is a need to provide an alternative to existing methods for manufacturing overmolded printed electronic components.

[0006] Accordingly, the present application is a method for manufacturing an overmolded printed electronic component, wherein

[0007] A step of depositing molecular ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate;

[0008] A step of forming a conductive silver trace on a first surface of the substrate by sintering the non-conductive trace of the ink on the substrate;

[0009] A step of injecting an overmolding resin or precursor onto a conductive silver trace on a first surface of the substrate; and

[0010] The method includes the step of obtaining the overmolded printed electronic component by curing the overmolding resin or curing the precursor.

[0011] In one embodiment, the molecular ink is a low-temperature molecular ink. In another embodiment, the molecular ink is a high-temperature molecular ink. In a further embodiment, the method further includes the step of depositing a nanoparticle ink for use with the molecular ink.

[0012] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0013] A step of injecting a precursor for a thermosetting overmolding resin onto a conductive trace on a first surface of a substrate; and

[0014] The method for manufacturing an overmolded printed electronic component further includes the step of curing a precursor for the thermosetting overmolding resin to obtain the overmolded printed electronic component.

[0015] In one embodiment, a conductive trace on the first surface of the substrate is,

[0016] A step of depositing a conductive trace ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate; and

[0017] It is obtained by a method comprising the step of curing a non-conductive trace of the ink on the substrate to form a conductive trace on a first surface of the substrate.

[0018] In one embodiment, the conductive trace ink is a molecular ink or a nanoparticle ink. In another embodiment, the conductive trace ink is a molecular ink, and the curing includes sintering. In another embodiment, the curing of the conductive trace includes one or more steps. In a related embodiment, the first step includes drying the non-conductive trace, and the second step includes sintering. In another related embodiment, depositing one or more materials or overmolding on the non-conductive trace precedes the second step of the curing. In another related embodiment, the first step of the curing involves thermoforming the substrate and precedes the second step of the curing.

[0019] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0020] As a step of injecting a composition,

[0021] On a conductive trace on the first surface of the substrate,

[0022] Overmolding resin or precursor; and

[0023] A step of injecting the above composition comprising glass microspheres; and

[0024] The method for manufacturing an overmolded printed electronic component further includes the step of curing the overmolding resin or curing the precursor to obtain the overmolded printed electronic component.

[0025] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0026] A step of injecting an overmolding resin or precursor onto a conductive trace on a first surface of a substrate under conditions for obtaining a foamed overmolded resin or a foamed precursor; and

[0027] The method for manufacturing an overmolded printed electronic component further includes the step of curing the foamed overmolding resin or curing the foamed precursor to obtain the overmolded printed electronic component.

[0028] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0029] A step of depositing a conductive trace ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate;

[0030] A step of curing a non-conductive trace of the ink on the substrate to form a conductive trace on a first surface of the substrate;

[0031] A step of introducing a glass fiber reinforcing layer on a first surface of the substrate;

[0032] A step of injecting an overmolding resin or precursor onto the glass fiber reinforcing layer; and

[0033] The method for manufacturing an overmolded printed electronic component further includes the step of curing the overmolding resin or curing the precursor to obtain the overmolded printed electronic component.

[0034] The present application is an overmolded printed electronic component,

[0035] A conductive silver trace bonded to a first surface of a substrate, comprising a conductive silver trace manufactured with a low-temperature molecular ink as defined in an embodiment of the present application; and

[0036] The overmolded printed electronic component further comprises a resin overmolded on a conductive silver trace bonded to a first surface of the substrate.

[0037] The present application is an overmolded printed electronic component,

[0038] A conductive trace bonded to a first surface of a substrate; and

[0039] It further includes an overmolded printed electronic component comprising a thermosetting resin overmolded on a conductive trace bonded to a first surface of the substrate.

[0040] The present application is an overmolded printed electronic component,

[0041] A conductive trace bonded to a first surface of a substrate; and

[0042] The overmolded printed electronic component further comprises a resin in which a plurality of glass microspheres are embedded and overmolded on the conductive trace bonded to the first surface of the substrate.

[0043] The present application is an overmolded printed electronic component,

[0044] A conductive trace bonded to a first surface of a substrate; and

[0045] The overmolded printed electronic component further comprises a foamed resin overmolded on the conductive trace bonded to the first surface of the substrate.

[0046] The present application is an overmolded printed electronic component,

[0047] A conductive trace bonded to the first surface of a substrate;

[0048] A glass fiber reinforcing layer on the conductive trace bonded to the first surface of the substrate; and

[0049] It further includes an overmolded printed electronic component comprising a resin overmolded on the glass fiber reinforcing layer.

[0050] In some embodiments, the overmolded printed electronic component of the present application is manufactured according to the method for manufacturing the overmolded printed electronic component of the present application.

[0051] Other features and advantages of the present application will become apparent from the following detailed description. However, since those skilled in the art will be able to make various changes and modifications within the spirit and scope of the present application from this detailed description, the detailed description and specific embodiments illustrating the embodiments of the present application should be understood as being provided merely as examples. Brief explanation of the drawing

[0052] The present application is now described in more detail with reference to the drawings. FIG. 1 illustrates a three-dimensional profiler image of a printed and sintered trace produced from the low-temperature molecular ink (NRC-848A3a) of the present application, and a resulting cross-section highlighting the line width and line spacing (L / S) achievable with the ink. FIG. 2 illustrates another three-dimensional profiler image of a printed and sintered trace produced from the low-temperature molecular ink (NRC-848A3a), and a resulting cross-section highlighting the line width and line spacing (L / S) achievable with the ink. FIG. 3 illustrates (1) a conductive silver trace (top) having a line width of about 512 μm produced from another ink (NRC-849A1) of the present application processed at a different temperature; and (2) a graph of sheet resistivity (mΩ / □ / mil) versus temperature (°C) for a conductive silver trace (bottom) having a line width of about 444 μm produced from another ink of the present application (NRC-850A) processed at different temperatures. FIG. 4 shows (1) ink NRC-849A1 heat-sintered for 5 minutes at 120°C, showing the effect on the trace shape when the ink is printed at high humidity (>50%) and the thixotropic agent is not included in the ink; and (2) a screen-printed trace produced from ink NRC-850A1 (right image) heat-sintered at 120°C for 5 minutes, showing the effect on the trace shape when a thixotropic agent is included in the ink and the ink is printed at high humidity (>50%). Fig. 5 shows a top view of a trace of ink NRC-850A2, which is printed on a glycol-modified polyethylene terephthalate (PET-G) substrate, dried at 75°C, heat-formed into a trapezoidal shape, and converted into a silver trace by photo-sintering with an energy of 15 J / cm².FIG. 6 shows a top view of an ink NRC-850A3 trace printed on a glycol-modified polyethylene terephthalate (PET-G) substrate, dried at 75°C, sintered at 120°C to be converted into a silver trace, and then thermoformed into a dome-shaped and semi-cylindrical shape. FIG. 7 shows the normalized resistance of silver lines printed from ink NRC-850A and DuPont’s PE873 ink as a function of applied strain, where the lines were printed on ozone-treated polyester polyurethane (American Polyfilm VLM-4001). FIG. 8 shows the normalized resistance of silver lines printed from ink NRC-850A and DuPont’s PE873 ink as a function of applied strain, where the lines were printed on polyurethane soft seam tape (Bemis ST604). FIG. 9 shows (1) the serpentine type used to print ink NRC-850A on polyurethane. A serpentine pattern (top); and a standardized resistance (bottom) as a function of strain applied to a silver line printed using ink NRC-850A, wherein the line was printed on ozone-treated polyester polyurethane (American Polyfilm VLM-4001). For the 'pre-strained' sample, the polyurethane substrate was stretched by 10% in the line direction when the ink was deposited on the substrate. FIG. 10 is a schematic diagram of two single-sided overmolded printed electronic components according to an embodiment of the present application. FIG. 11 is a schematic diagram of a double-sided overmolded printed electronic component according to an embodiment of the present application. FIG. 12 is a schematic diagram of a double-sided overmolded printed electronic component according to an embodiment of the present application showing the integration of venting and gating features (left is a top view; right is a cross-section).FIG. 13 shows the resistance versus line width for 3D linear traces thermoformed after UV treatment using a DYMAX floodlight lamp system (blue circle and blue trend line; see upper trend line) and a UV conveyor system (green circle and green trend line; see lower trend line) compared to traces treated with the same treatment without thermoforming, where the sample treated with the DYMAX floodlight lamp system is indicated by a red circle and the sample treated with the UV conveyor system is indicated by a yellow circle. FIG. 14 is a photograph of a linear trace (a) thermoformed on a dome-shaped top of 1 cm height and an enlarged view of the three widest traces highlighted by a yellow square in the upper right corner of panel 'a'. It is noted that traces generated by thermoforming alone are cracked (bi-iii), whereas traces treated with UV light from a DYMAX floodlight system (ci-iii) and a UV conveyor system (di-iii) are much less susceptible to cracking. Fig. 15 shows SEM images of silver oxalate-based molecular inks that are UV-treated using a DYMAX floodlight system (a) or a UV conveyor system (b) to initiate the formation of nanoparticles. After UV treatment, the traces are thermoformed to produce a conductive silver film containing interconnected silver nanoparticles. The traces generated after processing with the DYMAX floodlight system have slightly larger particles and are less aggregated (c) than those generated from the traces processed with the UV conveyor system (d). Fig. 16 shows a photograph of a linear trace (a) of a thermoformed capacitive touch HMI circuit attached to an Arduino Micro with an MPR121 capacitive touch sensor breakout and an example of illumination (b) of three LEDs attached to the surface of the circuit using conductive silver epoxy. Fig. 17 shows an SEM image of a thermoformed trace generated from direct thermal sintering without UV treatment.It is noted that voids and cracks exist where larger silver nanoparticles exist, and the regions where nanoparticles are smaller are uniform. FIG. 18 is a schematic diagram of a double-sided overmolded printed electronic component according to one embodiment of the present application. Specific details for implementing the invention

[0053] I. Definition

[0054] Unless otherwise specified, the definitions and embodiments described in this section and other sections are intended to be applicable to all embodiments and aspects of the present application described herein as understood by those skilled in the art.

[0055] In understanding the scope of this application, the term “comprising” and its derivatives as used herein are intended to be open terms suggesting the presence of the mentioned features, elements, components, groups, integers, and / or steps, but do not exclude the presence of other unmentioned features, elements, components, groups, integers, and / or steps. The foregoing also applies to words having similar meanings as the terms “comprising” and “having” and their derivatives. The term “constituted” and its derivatives as used herein are intended to be closed terms suggesting the presence of the mentioned features, elements, components, groups, integers, and / or steps, but exclude the presence of other unmentioned features, elements, components, groups, integers, and / or steps. The term “essentially constituted” as used herein is intended to suggest the presence of the mentioned features, elements, components, groups, integers, and / or steps, as well as the presence of the basic and new feature(s) of the features, elements, components, groups, integers, and / or steps.

[0056] Terms of degree used herein, such as “substantially,” “about,” and “approximately,” refer to a reasonable amount of deviation of a modified term so as not to significantly alter the final result. Unless this deviation invalidates the meaning of the word being modified, terms of degree should be interpreted to include a deviation of at least ±5% of the modified term.

[0057] As used herein, the term “and / or” means that the listed items are present or used individually or in combination. In fact, this term means that “at least one” or “one or more” of the listed items are used or present.

[0058] The singular forms of elements and the “here” elements used in this application include plural elements unless otherwise specified. For example, an embodiment comprising “conductive silver trace” should be understood to provide a specific embodiment having one conductive silver trace or two or more additional conductive silver traces.

[0059] In embodiments comprising an "additional" or "second" component, such as an additional or second conductive trace, the second component as used herein is different from other components or the first component. The "third" component is different from other components, the first component, and the second component, and additionally listed or "additional" components are similarly different.

[0060] As used herein, the term “suitable” means that the selection of specific reagents or conditions may vary depending on the reaction or method step in which the action is performed and the desired result, but nevertheless, generally, it can be made by a person skilled in the art once all relevant information is known.

[0061] As used herein, the term “conductive trace ink” refers to an ink that becomes conductive when deposited (e.g., printed) on a substrate, or can be further processed to become conductive using a suitable method known in the art, such as curing (including sintering). Exemplary conductive trace inks include molecular inks and nanoparticle inks.

[0062] In relation to processing conductive trace ink on a substrate, the term “curing” as used herein refers to a means of ultimately making the ink conductive. Curing may be performed in one or more stages, which may or may not be performed sequentially. For example, in a thermoforming process for manufacturing molded electronic parts or components, conductive trace ink deposited on a substrate may be dried in a first stage and sintered in a second stage. After the first stage of curing, there may be other stages of the thermoforming process in which the substrate is coated, overmolded, molded, etc., with the deposited conductive trace ink before performing the second stage (i.e., sintering). Where the term “curing” is used in relation to thermosetting overmolding resins, it similarly refers to processing a precursor of the resin to cure the resin in order to obtain an overmolded part.

[0063] As used herein, the terms “bonded” and “deposited” mean laminating or bonding materials and components within or on an overmolded part. A conductive trace bonded to a substrate or a conductive trace ink deposited on a first surface of a substrate both mean associating this material or component with the substrate, regardless of whether there are other inks and materials bonded or deposited on the substrate. Changing the order of different ink layers, resins, and other materials or components to achieve different design purposes for an overmolded part does not change how a specific material or component is bonded or deposited to the substrate. For example, even if a decorative ink or dielectric layer is interposed between the trace and the surface of the substrate, the conductive trace is still bonded to the substrate. In the case of a double-sided overmolded part, the material or component is again bonded to the substrate, regardless of whether it is attached directly or indirectly to the surface of the substrate, and based on this, the material or component is attached to the surface of the substrate.

[0064] The term “molecular ink” as used in this specification refers to an ink containing metal cations that can be reduced to a zero oxidation state upon sintering.

[0065] As used herein, the term “high-temperature molecular ink” means a molecular ink capable of being sintered in a temperature range of about 125°C to 250°C, e.g., about 150°C to 230°C, such as the molecular ink described in PCT application publication number WO 2015 / 192248. For example, such high-temperature molecular inks containing silver cations can be sintered in a temperature range of about 200°C to 230°C. For example, such high-temperature molecular inks containing copper cations can be sintered in a temperature range of about 125°C to 175°C.

[0066] As used herein, the term “low-temperature molecular ink” refers to a molecular ink capable of being sintered in a lower temperature range than a high-temperature molecular ink containing the same cations. Low-temperature molecular inks containing copper cations are described in PCT application publications WO 2016 / 197234 and WO 2018 / 018136. Low-temperature molecular inks containing silver cations are described in embodiments of this application capable of being sintered in a temperature range of about 80°C to about 140°C, e.g., about 85°C to about 140°C or about 90°C to about 130°C. Other exemplary inks containing silver cations are described in WO 2018 / 146616. Low-temperature inks comprising a thermal protective agent that enables the ink to be printed on a low-temperature / thermoformed substrate and sintered into an electrically conductive trace by broad-spectrum ultraviolet (UV) light may also be provided (see PCT / IB2019 / 056612).

[0067] As used herein, the term “nano-particle ink” means an ink comprising metal nanoparticles in a zero oxidation state that fuse upon curing. The nanoparticles may be in the form of flakes or other shapes.

[0068] The term “silver flake ink” as used in this specification refers to an ink comprising silver nanoparticle flakes in a zero oxidation state that fuse upon curing.

[0069] II. Method

[0070] In multi-stage manufacturing processes designed to produce overmolded electronic components, there are numerous process design considerations that must be taken into account to effectively utilize the various properties of the compositions and components used to manufacture these components, which generally involve laminating materials and integrating electrical components into the overmolded electronic components. Due to the need to address issues arising from the different and often incompatible properties of materials / components and components, and to realize processing efficiency, decisions are made regarding the selection of the materials or substances, processing methods, and sequence of processing steps taken to produce the overmolded electronic components. In one embodiment, a method for manufacturing an overmolded printed electronic component comprises one or more application steps (e.g., deposition, printing, injection shot, etc.) for applying materials or substances, such as inks, dielectrics, adhesives, other coatings, and reinforcing materials, to a substrate. In another embodiment, a method for manufacturing an overmolded printed electronic component comprises one or more processing steps (e.g., drying, heating, UV curing, sintering, etc.).

[0071] For example, the selection of a suitable conductive trace ink is determined by the need to effectively deposit the ink onto a substrate and expose it to heat treatment and mechanical stress during the thermoforming process to obtain suitable conductive traces in the resulting electronic component. Providing alternative material options offers the process and component design flexibility necessary to improve manufacturing methods and the diversity of electronic components that can be made for application in various industries.

[0072] Methods of overmolding electronic components involving printing molecular ink using known injection molding techniques can manufacture components of increased complexity compared to or in combination with flake ink. For example, due to the increased elongation capability of traces produced from molecular ink, it may be desirable to use molecular ink in substrate areas that undergo more molding during the thermoforming process. In other words, increasing the maximum elongation of conductive traces can free up space for manufacturing more complex 3D structures. Conversely, using nanoparticle ink may be desirable in substrate areas that undergo less molding, but this may require maintaining electrical connections between electronic components during the deposition and / or fabrication of the material. In this case, the ability to apply a sintering process to these areas of the substrate may be advantageous for using one or more different types of conductive trace inks. Thus, molecular ink can be used in combination with nanoparticle ink to form circuit connections and other electrical features. There may be areas where nanoparticle ink can be used sparingly, such as at connector pads, LED terminal pads, and intersections, where lower resistance is required and substrate elongation (and consequently mechanical stress) is small. When manufacturing electronic components, if different inks are used and different materials and components must be laminated, dielectrics may need to be used to insulate (wholly or partially) electrical intersections or connection points from the deposited conductive trace ink and other circuit features. This can cause issues regarding the efficiency of sintering traces (after thermoforming) through multiple layers to achieve excellent conductivity while minimizing damage to the electronic component features. Opaque dielectrics can serve as highly effective insulators in areas where curing the deposited conductive trace ink does not require sintering after dielectric deposition.

[0073] When using molecular inks that require sintering, the deposited conductive trace ink may need to be sintered first before applying the dielectric. Alternatively, for manufacturing efficiency, a transparent dielectric may be more suitable for use in areas requiring sintering through the material layer after thermoforming by curing the deposited conductive trace ink. Whether to choose a design that sinters before or after applying the dielectric depends on whether a given area of ​​the substrate on which the conductive trace ink is deposited is expected to undergo significant forming during thermoforming. Sintering the deposited conductive trace ink prior to thermoforming may be performed to prevent cracking of the substrate and loss of adhesion to the substrate if the resulting conductive trace is not subjected to excessive mechanical stress during forming (e.g., if the conductive trace undergoes minimal or no elongation, bending, twisting, etc.).

[0074] For example, Sun Chemical DST 4826C is a transparent dielectric, but its protective function is inferior to that of opaque dielectrics such as DuPont ME778, a solid white material. While white dielectrics provide excellent electrical isolation, they can only be used when there are non-optical or transparent features, as tests suggest that traces beneath this material layer cannot be photo-sintered. By definition, transparent materials are advantageous for transmitting light, which simplifies the screening process, and it is desirable to have the dielectric as the entire surface layer (where sintering after thermoforming is preferred).

[0075] In manufacturing overmolded electronic components, considerations beyond ensuring the integrity of electrical function include ensuring that the produced components are lightweight, resilient, and resistant to damage during manufacturing and normal use for their intended purpose. Using thermosetting resins (such as aliphatic polyurethanes) instead of conventional thermoplastics for overmolding allows for the easy use of inexpensive molds, low-cost injection systems, and / or components with improved surface quality, scratch resistance, and / or mechanical properties. This is due to their harder or tougher characteristics once cured.

[0076] A UV-curing hard coating may also be applied to the opposite side (second surface) of the substrate where the conductive trace ink is deposited to make the resulting electronic component harder. In one embodiment, the hard coating is incorporated as part of the substrate (e.g., a polycarbonate substrate available as Lexan). The coating remains flexible and maintains its integrity during thermoforming and can be cured via UV curing after thermoforming. In another embodiment, the finished thermoformed part is immersed in the coating or sprayed with the coating and then UV-cured.

[0077] Overmolded printed electronic components comprising a foamed overmolded resin (thermoplastic or thermosetting resin) and / or glass microspheres embedded in the overmolded resin (thermoplastic or thermosetting resin) can be significantly lighter than similar overmolded printed electronic components in which the resin is not foamed and the glass microspheres are not included. Foamed thermoplastic and thermosetting polymers can also partially increase circuit complexity and available surface area by reducing damage to electrical traces due to the soft filling effect.

[0078] Overmolded printed electronic components that include a structural reinforcing layer, such as a glass fiber layer, between the substrate and the overmolded resin (thermoplastic or thermosetting resin) can significantly alter the properties of the final component, for example, by significantly altering the thermal and / or mechanical properties compared to a similar component without structural reinforcement, thereby making the component inherently structural or thinner and / or lighter.

[0079] Another process or method design consideration is whether a specific overmolded electronic component will contain light or optical features, for example, when creating a backlit component using LEDs. In this case, the selection of a suitable dielectric and the application of glass fiber reinforcing materials and glass microspheres can be adapted to accommodate the integration of illumination features. The use of glass fibers can be manipulated to leave openings that allow light to pass through by eliminating intermediate materials capable of absorbing light. Similarly, glass microspheres may not be used in areas where illumination features are considered.

[0080] Accordingly, the present application is a method for manufacturing an overmolded printed electronic component, wherein

[0081] A step of depositing a low-temperature molecular ink onto a substrate to form a non-conductive trace of the ink on a first surface of the substrate;

[0082] A step of forming a conductive silver trace on a first surface of a substrate by sintering a non-conductive trace of ink on a substrate;

[0083] A step of injecting an overmolding resin or precursor onto a conductive silver trace on a first surface of a substrate; and

[0084] It includes the step of obtaining an overmolded printed electronic component by curing the overmolding resin or curing the precursor.

[0085] A low-temperature molecular ink is deposited on a substrate by any suitable method to form a non-conductive trace of ink on a first surface of the substrate. In one embodiment, the low-temperature molecular ink is printed on the substrate. In another embodiment, printing includes screen printing, inkjet printing, flexographic printing, gravure printing, offset printing, airbrushing, aerosol printing, typesetting, or stamping. In yet another embodiment of the present application, the low-temperature molecular ink is deposited by screen printing.

[0086] Non-conductive traces are sintered to form conductive silver traces by any suitable method that may depend, for example, on the type of substrate on which the trace is deposited and / or the type of silver salt of the ink. Sintering decomposes the silver salt to form conductive silver particles (e.g., nanoparticles). In one embodiment, sintering comprises heating and / or photosintering using intense pulsed ultraviolet (UV) light. In a further embodiment, sintering comprises the application of broadband UV light.

[0087] In one embodiment, sintering involves heating. In another embodiment, heating the substrate dries and sinters the trace to form a conductive trace. An advantage of the low-temperature molecular ink is that heating can be performed in a relatively low temperature range, for example, from about 80°C to about 140°C, from about 85°C to about 140°C, or from about 90°C to about 130°C, in the case of the silver cation-containing low-temperature molecular ink. While the ability to sinter at low temperatures is an advantage of this ink, heating can alternatively be performed at higher temperatures, for example, at temperatures above about 150°C or up to about 250°C.

[0088] In one embodiment, heating is performed for a time of about 1 hour or less. In another embodiment, heating is performed for a time of about 30 minutes or less, for example, for a time ranging from about 1 minute to about 30 minutes, or from about 2 minutes to about 20 minutes. In a further embodiment, heating is performed for about 5 minutes to about 20 minutes. Heating is performed at a sufficient balance between temperature and time to sinter the trace on the substrate to form a conductive trace. For example, a narrow and highly conductive trace can be formed by sintering at 120°C for 5 minutes or at 90°C for 20 to 40 minutes. The type of heating device also takes into account the temperature and time required for sintering. In one embodiment, sintering is performed on the substrate under an oxidizing atmosphere (e.g., air). In another embodiment, sintering is performed under an inert atmosphere (e.g., nitrogen and / or argon gas).

[0089] In another embodiment, the sintering comprises photo-sintering. In one embodiment, the photo-sintering comprises a photo-sintering system having a high-intensity lamp (e.g., a pulsed xenon lamp) that delivers a broadband optical spectrum. In one embodiment, the lamp delivers energy of about 5 to about 20 J / cm² to the trace. In another embodiment, the pulse width is in the range of about 0.58 to about 1.5 ms. In one embodiment, the photo-sintering is performed under ambient conditions (e.g., in air). Photo-sintering is particularly suitable for polyethylene terephthalate, polycarbonate, and polyimide substrates.

[0090] In additional embodiments of the present application, sintering is performed using a microwave or near-infrared (NIR) method, and this method may be selected by those skilled in the art.

[0091] Conductive silver traces formed by drying and sintering low-temperature molecular ink on a substrate have any suitable thickness and width. An advantage is that the low-temperature molecular ink can be dried and sintered to form relatively thin and / or narrow conductive traces while maintaining relatively high conductivity (i.e., relatively low resistivity). In some embodiments, the conductive traces have an average thickness of about 4 microns or less, or about 1.5 microns or less, or about 1 micron or less, for example, about 0.3 to 1.5 microns or about 0.4 to 1 micron. In some embodiments, the conductive traces have a nominal line width of about 30 mil or less, or about 20 mil or less, for example, about 2 to 20 mil. In some embodiments, the sheet resistivity value is less than about 30 mΩ / □ / mil, or about 20 mΩ / □ / mil or less, for example, about 5 to 20 mΩ / □ / mil. Additionally, the ink can provide conductive traces on a substrate with relatively low line width / spacing (L / S) values, which is advantageously suitable for miniaturization of electronic circuits. For example, the L / S value can be less than about 100 / 70 μm, or even as low as about 42 / 38 μm.

[0092] In some embodiments, after depositing the low-temperature molecular ink and before sintering the non-conductive trace, the method further comprises the step of forming the substrate to obtain the formed substrate. In some embodiments, after sintering the non-conductive trace and before injecting the overmolding resin or precursor, the method further comprises the step of forming the substrate to obtain the formed substrate. Forming the substrate to obtain the formed substrate may include any suitable means, and such means may be selected by a person skilled in the art. In one embodiment, the substrate is formed as a substrate formed by a method including thermoforming, cold forming, extrusion, or blow forming. In another embodiment, the substrate is formed as a substrate formed by a method including thermoforming. Accordingly, in some embodiments, after depositing the low-temperature molecular ink and before sintering the non-conductive trace, the method further comprises the step of thermoforming the substrate to obtain the formed substrate. Accordingly, in some embodiments, after sintering the non-conductive trace and before injecting the overmolding resin or precursor, the method further comprises the step of thermoforming the substrate to obtain a molded substrate.

[0093] In some embodiments, before forming the substrate (e.g., thermoforming), the method further comprises the step of bonding one or more electronic components to a first surface of the substrate. One or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In one embodiment, one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0094] In some embodiments of the present application, after forming the substrate (e.g., thermoforming) and before injecting the overmolding resin or precursor, the method further comprises the step of introducing a glass fiber reinforcement layer onto a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. For example, those skilled in the art will understand that it is advantageous for the reinforcement layer to have a reflective index nearly identical to that of the overmolding resin. In one embodiment, the glass fiber reinforcement layer is introduced via a pre-impregnated tape or a blended woven fabric. In an embodiment where the overmolding resin is a thermosetting resin, the glass fiber reinforcement layer may be further introduced via a dry fabric that is saturated during injection. In one embodiment, the glass fiber reinforcement layer is introduced by a method comprising splatter-coating a UV-curable adhesive between the glass fiber reinforcement layer and the substrate, vacuum-bag-forming the glass fiber reinforcement layer onto the substrate, and curing the adhesive with UV light. A person of ordinary skill in the art will understand that this method can minimize movement within the part by maintaining the glass fiber reinforcement layer in a precise position during the injection of the overmolding resin or precursor. In one embodiment, the UV adhesive is cured through the glass fiber reinforcement layer and the vacuum bag using a high-energy UV system. Any suitable adhesive and system may be used. For example, a Fusion UV V bulb may be used to achieve suitable curing through both materials.

[0095] In some embodiments, prior to depositing the low-temperature molecular ink, the method further comprises the step of depositing one or more decorative inks on a first surface of a substrate. The one or more decorative inks are any suitable decorative inks and are deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the decorative ink is cured prior to thermoforming to remove the solvent.

[0096] In some embodiments, the method further comprises the step of depositing dielectric ink on a first surface of a substrate before or after depositing the low-temperature molecular ink, and before sintering the non-conductive trace or optionally forming the substrate (e.g., thermoforming). The dielectric ink is any suitable dielectric ink and is deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the dielectric ink is cured before thermoforming.

[0097] In some embodiments of the present application, the method includes the step of repeating the deposition of low-temperature molecular ink on a substrate to obtain multiple layers of conductive silver traces.

[0098] In some embodiments, after forming the substrate (e.g., thermoforming), the method further comprises the step of applying a UV-curable hard coating to a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating and is applied using any suitable means, which may be selected by a person skilled in the art.

[0099] In some embodiments, the overmolding resin is a thermoplastic resin. Those skilled in the art will understand that thermoplastic resins soften when heated and harden when cooled. Accordingly, in an embodiment of a method for manufacturing an overmolded printed electronic component involving the use of a thermoplastic resin, the thermoplastic resin is cooled after injection under conditions suitable for obtaining the overmolded printed electronic component. The thermoplastic resin is any suitable thermoplastic resin.

[0100] In some embodiments, the precursor for the overmolding resin is a precursor for the thermosetting resin. In relation to the thermosetting resin, the term “precursor” as used herein refers to a component or combination of components that produce the thermosetting resin by crosslinking or chain extension upon curing. Accordingly, in an embodiment of a method for manufacturing an overmolded printed electronic component comprising the use of a precursor for the thermosetting resin, the thermosetting resin precursor is cured after injection under conditions suitable for obtaining the overmolded printed electronic component. The precursor for the thermosetting resin is any suitable precursor for the thermosetting resin. In one embodiment, the precursor for the thermosetting resin is any suitable precursor for the polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin. In additional embodiments, the precursor comprises an isocyanate, a polyol, and a catalyst.

[0101] In some embodiments, the overmolding resin or precursor is injected together with the glass microspheres. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In further embodiments of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; and 95th percentile, 33 microns.

[0102] In some embodiments, the overmolding resin or precursor is injected under conditions for obtaining a foam. Suitable conditions for obtaining a foam can be easily selected by a person skilled in the art. In some embodiments, conditions for obtaining a foam include introducing a blowing agent into the overmolding resin or precursor capable of producing a microcellular form in the cured or cured overmolded resin. The blowing agent is any suitable blowing agent. In some embodiments, the blowing agent is azodicarbonamide (ADCA) or sodium bicarbonate.

[0103] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the method is for manufacturing an overmolded printed electronic component for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the method is for manufacturing an overmolded printed electronic component for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate comprises polycarbonate.

[0104] In an embodiment of the method for manufacturing an overmolded printed electronic component of the present application, comprising forming (e.g., thermoforming) a substrate, a person skilled in the art will understand that the substrate comprises a moldable substrate and thus a material that can be formed (e.g., thermoforming). Since the low-temperature molecular ink can be dried and sintered at a temperature of less than 100°C to form a conductive trace, the low-temperature molecular ink is compatible with various moldable substrates currently on the market. The moldable substrate may be flexible under specific molding conditions (e.g., bendable, stretchable, twistable, etc.). In some examples, the moldable substrate may maintain the molded shape after molding, whereas in other cases, an external force may be required to maintain the molded substrate in the molded shape.

[0105] In some embodiments, the overmolded printed electronic component is a single side. In some embodiments, the overmolded printed electronic component is double-sided. A person skilled in the art will be able to easily adapt a method for manufacturing an overmolded printed electronic component having a single side or double sides by referring to the disclosure of this application.

[0106] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0107] A step of injecting a precursor for a thermosetting overmolding resin onto a conductive trace on a first surface of a substrate; and

[0108] The method for manufacturing an overmolded printed electronic component further includes the step of curing a precursor for a thermosetting overmolding resin to obtain an overmolded printed electronic component.

[0109] In one embodiment, a conductive trace on a first surface of a substrate is,

[0110] A step of depositing a conductive trace ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate; and

[0111] It is obtained by a method comprising the step of curing a non-conductive trace of ink on a substrate to form a conductive trace on a first surface of the substrate.

[0112] A conductive trace ink is deposited on a substrate by any suitable method to form a non-conductive trace of ink on a first surface of the substrate. In one embodiment, the conductive trace ink is printed on the substrate. In another embodiment, printing includes screen printing, inkjet printing, flexographic printing, gravure printing, offset printing, airbrushing, aerosol printing, typesetting, or stamping. In another embodiment of the present application, the conductive trace ink is deposited by screen printing.

[0113] The conductive trace ink is any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace ink is a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace ink is a molecular ink. In another embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. The conditions for curing the non-conductive trace of the ink on the substrate to form a conductive trace depend on the selection of the conductive trace ink. In one embodiment, the conductive trace ink is a low-temperature molecular ink, and the curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable embodiments for sintering the low-temperature molecular ink described herein. In another embodiment, the sintering of the low-temperature molecular ink involves photo-sintering.

[0114] In one embodiment, the conductive trace ink is a hot molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable conditions for sintering a hot molecular ink, for example, as described in PCT application publication no. WO 2015 / 192248. In another embodiment, the sintering of the hot molecular ink involves photo-sintering.

[0115] In a related embodiment, the high-temperature molecular ink is a metal precursor molecule, specifically, a metal carboxylate, more specifically, C 8- C 12 It includes carboxylates or bis(2-ethyl-1-hexylamine) copper(II) formate, bis(octylamine) copper(II) formate, or tris(octylamine) copper(II) formate. Since the ink does not contain flakes, the conductive trace formed by the ink can form a very thin and narrow conductive trace containing interconnected metal nanoparticles.

[0116] The molecular ink contains about 30 to 60 weight percent of C8-C based on the total weight of the composition. 12 The composition comprises a silver carboxylate or about 5 to 75 weight% of bis(2-ethyl-1-hexylamine) copper(II) formate, bis(octylamine) copper(II) formate, or tris(octylamine) copper(II) formate. Preferably, the composition comprises about 45 to 55 weight%, for example, about 50 weight% of silver carboxylate, or about 65 to 75 weight%, for example, about 72 weight% of bis(2-ethyl-1-hexylamine) copper(II) formate, bis(octylamine) copper(II) formate, or tris(octylamine) copper(II) formate.

[0117] In one embodiment, the silver carboxylate is C8-C 12It is a silver salt of an alkanic acid. The alkanic acid is preferably a decanoic acid, more preferably a neodecanoic acid. The silver carboxylate is most preferably a silver neodecanoate. In a related embodiment, the ink comprises 30 to 60 weight percent of C8-C based on the total weight of the composition. 12 The flake-free printable composition comprises a silver carboxylate, 0.1 to 10 weight percent of a polymer binder, and at least one organic solvent as the remainder. In another related embodiment, the ink comprises 45 to 55 weight percent of silver neodecanoate, all weights based on the total weight of the composition; a mixture of a first ethyl cellulose having a weight average molecular weight in the range of 60,000 to 70,000 g / mol and 2.5 to 5 weight percent of a second ethyl cellulose having a weight average molecular weight in the range of 90,000 to 100,000 g / mol; and an organic solvent comprising at least one aromatic solvent and a mixture of terpineol as the remainder.

[0118] In another embodiment, the high-temperature ink comprises 78 wt% silver neodecanoate, 7.7 wt% octanol, 12.8 wt% ethyl-2 oxazoline, and 1.5% Rokrapol.

[0119] In another embodiment, the metal carboxylate is a copper complex of formic acid and 2-ethyl-1-hexylamine or octylamine. The copper carboxylate is most preferably bis(2-ethyl-1-hexylamine)copper(II)formate. In a related embodiment, the ink comprises a flake-free printable composition comprising 5 to 75 weight% of bis(2-ethyl-1-hexylamine)copper(II)formate, bis(octylamine)copper(II)formate, or tris(octylamine)copper(II)formate, based on the total weight of the composition, 0.25 to 10 weight% of a polymer binder, and the remainder being at least one organic solvent.

[0120] The composition of the molecular ink further comprises about 0.1 to 10 weight%, preferably about 0.25 to 10 weight%, of a polymer binder based on the total weight of the composition. In the case of screen-printable silver ink, the composition preferably comprises about 2.5 to 5 weight%, for example, about 5 weight% of a binder. In the case of copper ink, the composition preferably comprises about 0.5 to 2 weight%, more preferably about 0.5 to 1.5 weight%, for example, about 1 weight% of a binder.

[0121] The amount of polymer binder can also be expressed as the mass of the metal in the metal precursor molecule. Preferably, the polymer binder may be present in the composition in a range of about 2.5 to 52 weight percent based on the weight of the metal in the metal precursor. The weight of the metal in the metal precursor is the total weight of the metal without other elements containing the precursor. More preferably, the polymer binder is in a range of about 6.5 to 36 weight percent based on the weight of the metal in the metal precursor.

[0122] The polymer binder preferably comprises ethyl cellulose, polypyrrolidone, epoxy, phenolic resin, acrylic, urethane, silicone, styrene-allyl alcohol, polyalkylene carbonate, polyvinyl acetal, polyester, polyurethane, polyolefin, fluoroplastic, fluoroelastomer, thermoplastic elastomer, or any mixture thereof. The polymer binder preferably comprises ethyl cellulose or polyurethane, particularly ethyl cellulose.

[0123] The molecular weight of the binder, particularly ethyl cellulose, can play a role in optimizing the properties of the conductive trace formed from the molecular ink. Preferably, the binder has an average weight-average molecular weight (M) in the range of about 35,000 to 100,000 g / mol, more preferably about 60,000 to 95,000 g / mol. wIt has ). The average weight-average molecular weight of the binder can be adjusted to a desired value by using a mixture of binders with different molecular weights. The mixture of binders preferably comprises a first binder having a weight-average molecular weight in the range of about 60,000 to 70,000 g / mol, for example, about 65,000 g / mol, and a second binder having a weight-average molecular weight in the range of about 90,000 to 100,000 g / mol, for example, about 96,000 g / mol. The ratio of the first binder to the second binder in the mixture is preferably about 10:1 to 1:10, or 10:1 to 1:1, or about 7:1 to 5:3. The molecular weight distribution of the binders may be unimode or multimode, for example, dual-mode. In some embodiments, the binders may comprise a mixture of different types of polymers.

[0124] The composition of the molecular ink also includes a solvent. The solvent generally constitutes the remainder of the composition. In some cases, the remainder may be about 15 to 94.75 weight percent. For silver ink, the remainder is preferably 40 to 52.5 weight percent, for example, about 45 weight percent of the solvent. For copper ink, the remainder is preferably 25 to 30 weight percent, for example, about 27 weight percent of the solvent.

[0125] The solvent may include at least one aromatic organic solvent, at least one non-aromatic organic solvent, or any mixture thereof.

[0126] In some embodiments, the solvent preferably comprises at least one aromatic organic solvent. The at least one aromatic organic solvent preferably comprises benzene, toluene, ethylbenzene, xylene, chlorobenzene, benzyl ether, anisole, benzonitrile, pyridine, diethylbenzene, propylbenzene, cumene, isobutylbenzene, p-cymene, tetralin, trimethylbenzene (e.g., mesitylene), durene, p-cumene, or any mixture thereof. The at least one aromatic organic solvent more preferably comprises toluene, xylene, anisole, diethylbenzene, or any mixture thereof. For silver-based inks, the solvent more preferably comprises xylene, diethylbenzene, toluene, or any mixture thereof. For copper-based inks, the solvent preferably comprises anisole.

[0127] In some embodiments, the solvent preferably comprises at least one non-aromatic organic solvent. The at least one non-aromatic organic solvent preferably comprises a terpene-based solvent, an alcohol, or any mixture thereof. Some examples of non-aromatic organic solvents include terpineol, alpha-terpinene, gamma-terpinene, terpinolene, limonene, pinene, karene, methylcyclohexanol, octanol, heptanol, or any mixture thereof. Of particular note are terpineol, α-terpinene, 2-methylcyclohexanol, 1-octanol, and mixtures thereof, particularly 2-methylcyclohexanol. In some embodiments, the solvent preferably comprises a mixture of at least one aromatic organic solvent and at least one non-aromatic organic solvent. The non-aromatic organic solvent is preferably present in the solvent mixture in an amount of about 75% by weight or less, for example, about 50% by weight or less, based on the weight of the solvent. In one embodiment for a silver-based ink, the solvent may include a mixture of xylene and terpineol or diethylbenzene and 1-octanol.

[0128] In another embodiment, the conductive trace ink is a nanoparticle ink (e.g., silver flake ink), and curing involves sintering. The conditions for sintering the nanoparticle ink (e.g., silver flake ink) are any suitable conditions and can be easily selected by a person skilled in the art from known methods. In another embodiment, the nanoparticle ink (e.g., silver flake ink) is sintered by a method involving heating. Sintering is required to optimize conductivity in terms of other non-conductive materials that may be included in the nanoparticle ink formulation, such as polymers and solvents.

[0129] In some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of forming the substrate to obtain the formed substrate. In some embodiments, after curing the non-conductive trace and before injecting a precursor for the thermosetting overmolding resin, the method further comprises the step of forming the substrate to obtain the formed substrate. Forming the substrate to obtain the formed substrate may include any suitable means, which may be selected by a person skilled in the art. In one embodiment, the substrate is formed as a substrate formed by a method including thermoforming, cold forming, extrusion, or blow forming. In another embodiment, the substrate is formed as a substrate formed by a method including thermoforming. Accordingly, in some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of thermoforming the substrate to obtain the formed substrate. Accordingly, in some embodiments, after curing the non-conductive trace and before injecting the precursor for the thermosetting overmolding resin, the method further comprises the step of thermoforming the substrate to obtain a molded substrate.

[0130] In some embodiments, before forming the substrate (e.g., thermoforming), the method further comprises the step of bonding one or more electronic components to a first surface of the substrate. One or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In one embodiment, one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0131] In some embodiments of the present application, after forming (e.g., thermoforming) the substrate and before injecting a precursor for a thermosetting overmolding resin, the method further comprises the step of introducing a glass fiber reinforcement layer onto a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. For example, those skilled in the art will understand that it is advantageous for the reinforcement layer to have a reflectance index nearly identical to that of the overmolding resin. In one embodiment, the glass fiber reinforcement layer is introduced via a pre-impregnated tape, a blended woven fabric, or a dry fabric that is saturated during injection. In one embodiment, the glass fiber reinforcement layer is introduced by a method comprising spatter-coating a UV-curable adhesive between the glass fiber reinforcement layer and the substrate, vacuum-bag-forming the glass fiber reinforcement layer onto the substrate, and curing the adhesive with UV light. Those skilled in the art will understand that such a method can minimize movement within the part by maintaining the glass fiber reinforcement layer in an accurate position during the injection of a precursor for a thermosetting overmolding resin. In one embodiment, the UV adhesive is cured through a glass fiber reinforcement layer and a vacuum bag using a high-energy UV system. Any suitable adhesive and system may be used. For example, a fusion UV V bulb may be used to achieve suitable curing through the two materials.

[0132] In some embodiments, prior to depositing the conductive trace ink, the method further comprises the step of depositing one or more decorative inks on a first surface of a substrate. The one or more decorative inks are any suitable decorative inks and are deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the decorative ink is cured prior to thermoforming to remove the solvent.

[0133] In some embodiments, the method further comprises the step of depositing dielectric ink on a first surface of a substrate before or after depositing conductive trace ink, and before curing the non-conductive trace or optionally forming the substrate (e.g., thermoforming). The dielectric ink is any suitable dielectric ink and is deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the dielectric ink is cured before thermoforming.

[0134] In some embodiments of the present application, the method includes the step of repeating the deposition of conductive trace ink on a substrate to obtain multiple layers of conductive traces.

[0135] In some embodiments, after forming the substrate (e.g., thermoforming), the method further comprises the step of applying a UV-curable hard coating to a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating and is applied using any suitable means, which may be selected by a person skilled in the art.

[0136] The precursor for the thermosetting resin is any suitable precursor for the thermosetting resin. In one embodiment, the precursor for the thermosetting resin is a precursor for the polyurethane resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin. In further embodiments, the precursor comprises an isocyanate, a polyol, and a catalyst.

[0137] In some embodiments, a precursor for a thermosetting resin is injected together with glass microspheres. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In further embodiments of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0138] In some embodiments, a precursor for a thermosetting resin is injected under conditions for obtaining a foam. Suitable conditions for obtaining a foam can be easily selected by a person skilled in the art. In some embodiments, conditions for obtaining a foam include introducing a blowing agent into a precursor for a thermosetting resin capable of forming a micro-cell shape in the cured overmolded resin. The blowing agent is any suitable blowing agent. In some embodiments, the blowing agent is azodicarbonamide (ADCA) or sodium bicarbonate.

[0139] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TM It includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the method is for manufacturing an overmolded printed electronic component for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the method is for manufacturing an overmolded printed electronic component for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate comprises polycarbonate.

[0140] In some embodiments, the overmolded printed electronic component is a single side. In some embodiments, the overmolded printed electronic component is double-sided. A person skilled in the art will be able to easily adapt a method for manufacturing an overmolded printed electronic component having a single side or double sides by referring to the disclosure of this application.

[0141] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0142] As a step of injecting a composition,

[0143] On a conductive trace on the first surface of the substrate,

[0144] Overmolding resin or its precursor; and

[0145] A step of injecting the composition comprising glass microspheres; and

[0146] The method for manufacturing an overmolded printed electronic component further includes the step of curing an overmolding resin or curing a precursor thereof to obtain an overmolded printed electronic component.

[0147] In one embodiment, a conductive trace on a first surface of a substrate is,

[0148] A step of depositing a conductive trace ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate; and

[0149] It is obtained by a method comprising the step of curing a non-conductive trace of ink on a substrate to form a conductive trace on a first surface of the substrate.

[0150] A conductive trace ink is deposited on a substrate by any suitable method to form a non-conductive trace of ink on a first surface of the substrate. In one embodiment, the conductive trace ink is printed on the substrate. In another embodiment, printing includes screen printing, inkjet printing, flexographic printing, gravure printing, offset printing, airbrushing, aerosol printing, typesetting, or stamping. In another embodiment of the present application, the conductive trace ink is deposited by screen printing.

[0151] The conductive trace ink is any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace ink is a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace ink is a molecular ink. In one embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. The conditions for curing the non-conductive trace of the ink on the substrate to form a conductive trace depend on the selection of the conductive trace ink. In one embodiment, the conductive trace ink is a low-temperature molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable embodiments for sintering the low-temperature molecular ink described herein. In another embodiment, the sintering of the low-temperature molecular ink includes photo-sintering or broadband UV sintering. In one embodiment, the conductive trace ink is a high-temperature molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable conditions for sintering a high-temperature molecular ink as described, for example, in PCT application publication no. WO 2015 / 192248. In other embodiments, the sintering of the high-temperature molecular ink involves photo-sintering. In one embodiment, the conductive trace ink is a nanoparticle ink (e.g., silver flake ink), and the curing involves sintering. The conditions for sintering the nanoparticle ink (e.g., silver flake ink) are any suitable conditions and can be easily selected by a person skilled in the art from known methods. In another embodiment, the nanoparticle ink (e.g., silver flake ink) is sintered by a method comprising heating.

[0152] In some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of forming the substrate to obtain the formed substrate. In some embodiments, after curing the non-conductive trace and before injecting the composition, the method further comprises the step of forming the substrate to obtain the formed substrate. Forming the substrate to obtain the formed substrate may include any suitable means, which may be selected by a person skilled in the art. In one embodiment, the substrate is formed as a substrate formed by a method including thermoforming, cold forming, extrusion, or blow forming. In another embodiment, the substrate is formed as a substrate formed by a method including thermoforming. Accordingly, in some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of thermoforming the substrate to obtain the formed substrate. Accordingly, in some embodiments, after curing the non-conductive trace and before injecting the composition, the method further comprises the step of thermoforming the substrate to obtain the formed substrate.

[0153] In some embodiments, before forming the substrate (e.g., thermoforming), the method further comprises the step of bonding one or more electronic components to a first surface of the substrate. One or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In one embodiment, one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0154] In some embodiments of the present application, after forming the substrate (e.g., thermoforming) and before injecting the composition, the method further comprises the step of introducing a glass fiber reinforcement layer onto a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. For example, those skilled in the art will understand that it is advantageous for the reinforcement layer to have a reflectivity index nearly identical to that of the overmolding resin. In one embodiment, the glass fiber reinforcement layer is introduced via a pre-impregnated tape or a blended woven fabric. In an embodiment where the overmolding resin is a thermosetting resin, the glass fiber reinforcement layer may be further introduced via a dry fabric that is saturated during injection. In one embodiment, the glass fiber reinforcement layer is introduced by a method comprising splatter-coating a UV-curable adhesive between the glass fiber reinforcement layer and the substrate, forming the glass fiber reinforcement layer on the substrate in a vacuum bag, and curing the adhesive with UV light. Those skilled in the art will understand that such a method can minimize movement within the part by maintaining the fiber glass reinforcement layer in an accurate position during the injection of the composition. In one embodiment, the UV adhesive is cured through a glass fiber reinforcement layer and a vacuum bag using a high-energy UV system. Any suitable adhesive and system may be used. For example, a fusion UV V bulb may be used to achieve suitable curing through the two materials.

[0155] In some embodiments, prior to depositing the conductive trace ink, the method further comprises the step of depositing one or more decorative inks on a first surface of a substrate. The one or more decorative inks are any suitable decorative inks and are deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the decorative ink is cured prior to thermoforming to remove the solvent.

[0156] In some embodiments, the method further comprises the step of depositing dielectric ink on a first surface of a substrate before or after depositing conductive trace ink and before curing the non-conductive trace or optionally forming the substrate (e.g., thermoforming). The dielectric ink is any suitable dielectric ink and is deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the dielectric ink is cured before thermoforming.

[0157] In some embodiments of the present application, the method includes the step of repeating the deposition of conductive trace ink on a substrate to obtain multiple layers of conductive traces.

[0158] In some embodiments, after forming the substrate (e.g., thermoforming), the method further comprises the step of applying a UV-curable hard coating to a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating and is applied using any suitable means, which may be selected by a person skilled in the art.

[0159] In some embodiments, the overmolding resin is a thermoplastic resin. Those skilled in the art will understand that thermoplastic resins soften when heated and harden when cooled. Accordingly, in an embodiment of a method for manufacturing an overmolded printed electronic component involving the use of a thermoplastic resin, the thermoplastic resin is cooled after injection under conditions suitable for obtaining an overmolded printed electronic component. The thermoplastic resin is any suitable thermoplastic resin.

[0160] In some embodiments, the precursor for the overmolding resin is a precursor for a thermosetting resin. In an embodiment of a method for manufacturing an overmolded printed electronic component comprising the use of a precursor for a thermosetting resin, the thermosetting resin precursor is cured under conditions suitable for obtaining the overmolded printed electronic component after injection. The precursor for the thermosetting resin is any suitable precursor for a thermosetting resin. In one embodiment, the precursor for the thermosetting resin is any suitable precursor for a polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin. In additional embodiments, the precursor comprises an isocyanate, a polyol, and a catalyst.

[0161] The glass microsphere is any suitable glass microsphere. In one embodiment, the glass microsphere comprises, is essentially composed of, or is composed of soda-lime borosilicate glass. In another embodiment, the glass microsphere has an average diameter of 18 microns. In further embodiments, the glass microsphere has the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0162] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the method is for manufacturing an overmolded printed electronic component for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the method is for manufacturing an overmolded printed electronic component for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate comprises polycarbonate.

[0163] In some embodiments, the overmolded printed electronic component is a single side. In some embodiments, the overmolded printed electronic component is double-sided. A person skilled in the art will be able to easily adapt a method for manufacturing an overmolded printed electronic component having a single side or double sides by referring to the disclosure of this application.

[0164] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0165] A step of injecting an overmolding resin or a precursor onto a conductive trace on a first surface of a substrate under conditions for obtaining a foamed overmolding resin or a foamed precursor; and

[0166] The method for manufacturing an overmolded printed electronic component further includes the step of curing a foamed overmolded resin or curing a foamed precursor to obtain an overmolded printed electronic component.

[0167] In one embodiment, a conductive trace on a first surface of a substrate is,

[0168] A step of depositing a conductive trace ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate; and

[0169] It is obtained by a method comprising the step of curing a non-conductive trace of ink on a substrate to form a conductive trace on a first surface of the substrate.

[0170] A conductive trace ink is deposited on a substrate by any suitable method to form a non-conductive trace of ink on a first surface of the substrate. In one embodiment, the conductive trace ink is printed on the substrate. In another embodiment, printing includes screen printing, inkjet printing, flexographic printing, gravure printing, offset printing, airbrushing, aerosol printing, typesetting, or stamping. In another embodiment of the present application, the conductive trace ink is deposited by screen printing.

[0171] The conductive trace ink is any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace ink is a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace ink is a molecular ink. In one embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. The conditions for curing the non-conductive trace of the ink on the substrate to form a conductive trace depend on the selection of the conductive trace ink. In one embodiment, the conductive trace ink is a low-temperature molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable embodiments for sintering the low-temperature molecular ink described herein. In another embodiment, the sintering of the low-temperature molecular ink involves photo-sintering. In one embodiment, the conductive trace ink is a high-temperature molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable conditions for sintering a high-temperature molecular ink as described, for example, in PCT application publication no. WO 2015 / 192248. In other embodiments, the sintering of the high-temperature molecular ink involves photo-sintering. In one embodiment, the conductive trace ink is a nanoparticle ink (e.g., silver flake ink), and the curing involves sintering. The conditions for sintering the nanoparticle ink (e.g., silver flake ink) are any suitable conditions and can be easily selected by a person skilled in the art from known methods. In another embodiment, the nanoparticle ink (e.g., silver flake ink) is sintered by a method comprising heating.

[0172] In some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of forming the substrate to obtain the formed substrate. In some embodiments, after curing the non-conductive trace and before injecting the overmolding resin or precursor, the method further comprises the step of forming the substrate to obtain the formed substrate. Forming the substrate to obtain the formed substrate may include any suitable means, which may be selected by a person skilled in the art. In one embodiment, the substrate is formed as a substrate formed by a method including thermoforming, cold forming, extrusion, or blow forming. In another embodiment, the substrate is formed as a substrate formed by a method including thermoforming. Accordingly, in some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of thermoforming the substrate to obtain the formed substrate. Accordingly, in some embodiments, after curing the non-conductive trace and before injecting the overmolding resin or precursor, the method further comprises the step of thermoforming the substrate to obtain a molded substrate.

[0173] In some embodiments, before forming the substrate (e.g., thermoforming), the method further comprises the step of bonding one or more electronic components to a first surface of the substrate. One or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In one embodiment, one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0174] In some embodiments of the present application, after forming the substrate (e.g., thermoforming) and before injecting the overmolding resin or precursor, the method further comprises the step of introducing a glass fiber reinforcement layer onto a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. For example, those skilled in the art will understand that it is advantageous for the reinforcement layer to have a reflectance index nearly identical to that of the overmolding resin. In one embodiment, the glass fiber reinforcement layer is introduced via a pre-impregnated tape or a blended woven fabric. In an embodiment where the overmolding resin is a thermosetting resin, the glass fiber reinforcement layer may be further introduced via a dry fabric that is saturated during injection. In one embodiment, the glass fiber reinforcement layer is introduced by a method comprising spatter-coating a UV-curable adhesive between the glass fiber reinforcement layer and the substrate, vacuum-bag-forming the glass fiber reinforcement layer onto the substrate, and curing the adhesive with UV light. A person of ordinary skill in the art will understand that this method can minimize movement within the part by maintaining the glass fiber reinforcement layer in a precise position during the injection of the overmolding resin or precursor. In one embodiment, the UV adhesive is cured through the glass fiber reinforcement layer and the vacuum bag using a high-energy UV system. Any suitable adhesive and system may be used. For example, a Fusion UV V bulb may be used to achieve suitable curing through both materials.

[0175] In some embodiments, prior to depositing the conductive trace ink, the method further comprises the step of depositing one or more decorative inks on a first surface of a substrate. The one or more decorative inks are any suitable decorative inks and are deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the decorative ink is cured before thermoforming to remove the solvent.

[0176] In some embodiments, the method further comprises the step of depositing dielectric ink on a first surface of a substrate before or after depositing conductive trace ink and before curing the non-conductive trace or optionally forming the substrate (e.g., thermoforming). The dielectric ink is any suitable dielectric ink and is deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the dielectric ink is cured before thermoforming.

[0177] In some embodiments of the present application, the method includes the step of repeating the deposition of conductive trace ink on a substrate to obtain multiple layers of conductive traces.

[0178] In some embodiments, after forming the substrate (e.g., thermoforming), the method further comprises the step of applying a UV-curable hard coating to a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating and is applied using any suitable means, which may be selected by a person skilled in the art.

[0179] In some embodiments, the overmolding resin is a thermoplastic resin. Those skilled in the art will understand that thermoplastic resins soften when heated and harden when cooled. Accordingly, in an embodiment of a method for manufacturing an overmolded printed electronic component comprising the use of a thermoplastic resin foam, the thermoplastic resin foam is cooled after injection under conditions suitable for obtaining an overmolded printed electronic component. The thermoplastic resin is any suitable thermoplastic resin.

[0180] In some embodiments, the precursor for the overmolding resin is a precursor for the thermosetting resin. In an embodiment of a method for manufacturing an overmolded printed electronic component comprising the use of a precursor for a thermosetting resin foam, the thermosetting resin precursor foam is cured under conditions suitable for obtaining the overmolded printed electronic component after injection. The precursor for the thermosetting resin is any suitable precursor for the thermosetting resin. In one embodiment, the precursor for the thermosetting resin is any suitable precursor for the polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin. In additional embodiments, the precursor comprises an isocyanate, a polyol, and a catalyst.

[0181] In some embodiments, the overmolding resin or precursor is injected together with the glass microspheres. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In further embodiments of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0182] The conditions for obtaining a foamed overmolded resin or a foamed precursor are any suitable conditions, and these conditions can be easily selected by a person skilled in the art. In some embodiments, the conditions for obtaining a foam include introducing a blowing agent into an overmolded resin or precursor capable of forming a microcell-like shape in a cured or cured overmolded resin. The blowing agent is any suitable blowing agent. In some embodiments, the blowing agent is azodicarbonamide (ADCA) or sodium bicarbonate.

[0183] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the method is for manufacturing an overmolded printed electronic component for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the method is for manufacturing an overmolded printed electronic component for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate comprises polycarbonate.

[0184] In some embodiments, the overmolded printed electronic component is a single side. In some embodiments, the overmolded printed electronic component is double-sided. A person skilled in the art will be able to easily adapt a method for manufacturing an overmolded printed electronic component having a single side or double sides by referring to the disclosure of this application.

[0185] The present application relates to a method for manufacturing an overmolded printed electronic component, wherein

[0186] A step of depositing a conductive trace ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate;

[0187] A step of curing a non-conductive trace of ink on a substrate to form a conductive trace on a first surface of the substrate;

[0188] A step of introducing a glass fiber reinforcing layer on a first surface of a substrate;

[0189] A step of injecting an overmolding resin or precursor onto a glass fiber reinforcing layer; and

[0190] The method for manufacturing an overmolded printed electronic component further includes the step of curing an overmolding resin or curing a precursor to obtain an overmolded printed electronic component.

[0191] A conductive trace ink is deposited on a substrate by any suitable method to form a non-conductive trace of ink on a first surface of the substrate. In one embodiment, the conductive trace ink is printed on the substrate. In another embodiment, printing includes screen printing, inkjet printing, flexographic printing, gravure printing, offset printing, airbrushing, aerosol printing, typesetting, or stamping. In another embodiment of the present application, the conductive trace ink is deposited by screen printing.

[0192] The conductive trace ink is any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace ink is a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace ink is a molecular ink. In one embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. The conditions for curing the non-conductive trace of the ink on the substrate to form a conductive trace depend on the selection of the conductive trace ink. In one embodiment, the conductive trace ink is a low-temperature molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable embodiments for sintering the low-temperature molecular ink described herein. In another embodiment, the sintering of the low-temperature molecular ink involves photo-sintering. In one embodiment, the conductive trace ink is a high-temperature molecular ink, and curing involves sintering. The sintering conditions are any suitable conditions and are selected from any suitable conditions for sintering a high-temperature molecular ink as described, for example, in PCT application publication no. WO 2015 / 192248. In other embodiments, the sintering of the high-temperature molecular ink involves photo-sintering. In one embodiment, the conductive trace ink is a nanoparticle ink (e.g., silver flake ink), and the curing involves sintering. The conditions for sintering the nanoparticle ink (e.g., silver flake ink) are any suitable conditions and can be easily selected by a person skilled in the art from known methods. In another embodiment, the nanoparticle ink (e.g., silver flake ink) is sintered by a method comprising heating.

[0193] In some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of forming the substrate to obtain the formed substrate. In some embodiments, before introducing the glass fiber reinforcement layer, the method further comprises the step of forming the substrate to obtain the formed substrate. Forming the substrate to obtain the formed substrate may include any suitable means, which may be selected by a person skilled in the art. In one embodiment, the substrate is formed as a substrate formed by a method including thermoforming, cold forming, extrusion, or blow forming. In another embodiment, the substrate is formed as a substrate formed by a method including thermoforming. Accordingly, in some embodiments, after depositing the conductive trace ink and before curing the non-conductive trace, the method further comprises the step of thermoforming the substrate to obtain the formed substrate. Accordingly, in some embodiments, after introducing the glass fiber reinforcement layer and before injecting the overmolding resin or precursor, the method further comprises the step of thermoforming the substrate to obtain the formed substrate.

[0194] In some embodiments, before forming the substrate (e.g., thermoforming), the method further comprises the step of bonding one or more electronic components to a first surface of the substrate. One or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In one embodiment, one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0195] The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. For example, those skilled in the art will understand that it is advantageous for the reinforcement layer to have a reflectance index nearly identical to that of the overmolding resin. In one embodiment, the glass fiber reinforcement layer is introduced via a pre-impregnated tape or a blended woven fabric. In an embodiment where the overmolding resin is a thermosetting resin, the glass fiber reinforcement layer may be additionally introduced via a dry fabric that is saturated during injection. In one embodiment, the glass fiber reinforcement layer is introduced by a method comprising spatter-coating a UV-curable adhesive between the glass fiber reinforcement layer and the substrate, vacuum-bag-molding the glass fiber reinforcement layer onto the substrate, and curing the adhesive with UV light. Those skilled in the art will understand that this method can minimize movement within the part by maintaining the glass fiber reinforcement layer in an accurate position during the injection of the overmolding resin or precursor. In one embodiment, the UV adhesive is cured through the glass fiber reinforcement layer and the vacuum bag using a high-energy UV system. Any suitable adhesive and system may be used. For example, a fusion UV V bulb can be used to achieve suitable curing through two materials.

[0196] In some embodiments, prior to depositing the conductive trace ink, the method further comprises the step of depositing one or more decorative inks on a first surface of a substrate. The one or more decorative inks are any suitable decorative inks and are deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the decorative ink is cured prior to thermoforming to remove the solvent.

[0197] In some embodiments, the method further comprises the step of depositing dielectric ink on a first surface of a substrate before or after depositing conductive trace ink and before curing the non-conductive trace or optionally forming the substrate (e.g., thermoforming). The dielectric ink is any suitable dielectric ink and is deposited on the substrate by any suitable means, which may be selected by a person skilled in the art. For example, a person skilled in the art will understand that in an embodiment of the method of the present application comprising thermoforming, the dielectric ink is cured before thermoforming.

[0198] In some embodiments of the present application, the method includes the step of repeating the deposition of conductive trace ink on a substrate to obtain multiple layers of conductive traces.

[0199] In some embodiments, after forming the substrate (e.g., thermoforming), the method further comprises the step of applying a UV-curable hard coating to a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating and is applied using any suitable means, which may be selected by a person skilled in the art.

[0200] In some embodiments, the overmolding resin is a thermoplastic resin. Those skilled in the art will understand that thermoplastic resins soften when heated and harden when cooled. Accordingly, in an embodiment of a method for manufacturing an overmolded printed electronic component involving the use of a thermoplastic resin, the thermoplastic resin is cooled after injection under conditions suitable for obtaining the overmolded printed electronic component. The thermoplastic resin is any suitable thermoplastic resin.

[0201] In some embodiments, the precursor for the overmolding resin is a precursor for a thermosetting resin. In an embodiment of a method for manufacturing an overmolded printed electronic component comprising the use of a precursor for a thermosetting resin, the thermosetting resin precursor is cured under conditions suitable for obtaining the overmolded printed electronic component after injection. The precursor for the thermosetting resin is any suitable precursor for a thermosetting resin. In one embodiment, the precursor for the thermosetting resin is any suitable precursor for a polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin. In additional embodiments, the precursor comprises an isocyanate, a polyol, and a catalyst.

[0202] In some embodiments, the overmolding resin or precursor is injected together with the glass microspheres. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In further embodiments of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0203] In some embodiments, a precursor for a thermosetting resin is injected under conditions for obtaining a foam. Suitable conditions for obtaining a foam can be easily selected by a person skilled in the art. In some embodiments, conditions for obtaining a foam include introducing a blowing agent into an overmolding resin or precursor capable of forming a microcell-like shape in a cured or cured overmolded resin. The blowing agent is any suitable blowing agent. In some embodiments, the blowing agent is azodicarbonamide (ADCA) or sodium bicarbonate.

[0204] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the method is for manufacturing an overmolded printed electronic component for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the method is for manufacturing an overmolded printed electronic component for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate comprises polycarbonate.

[0205] In some embodiments, the overmolded printed electronic component is a single side. In some embodiments, the overmolded printed electronic component is double-sided. A person skilled in the art will be able to easily adapt a method for manufacturing an overmolded printed electronic component having a single side or double sides by referring to the disclosure of this application.

[0206] In the method for manufacturing an overmolded printed electronic component of the present application, injection is performed by any suitable means, which may be selected by a person skilled in the art. A person skilled in the art will understand that an object to be overmolded is placed in a suitable mold, and then, depending on the case, an overmolding resin or a precursor is injected onto the surface of the object to be overmolded. In some embodiments where the overmolded resin is a thermosetting resin, the precursor for the thermosetting resin is injected by a method including reaction injection molding (RIM). In one embodiment, the precursor for the thermosetting resin is injected onto a desired surface, and then the mold is separated and the surface is flooded or the electronic component located at the center of the mold is flooded. In some embodiments of the present application, the injection involves a two-shot approach. In some embodiments, the injection involves a one-shot approach. Compared to standard thermoplastic resins, the typical injection temperature for thermosetting resins such as polyurethane resins is significantly lower (e.g., about 60°C compared to about 250°C or higher) and the injection pressure is significantly lower (e.g., about 150 psi compared to about 1500 psi or higher).

[0207] The conditions for cooling the overmolded resin may vary, for example, depending on whether the resin is foamed or contains glass microspheres embedded therein. In these embodiments, the reduction in thermal mass can reduce the cooling time for both thermoplastic and thermosetting resins compared to similar resins that are not foamed and do not contain glass microspheres embedded therein. The cooling time may also vary depending on the type of resin. For example, parts made using thermosetting resins, such as aliphatic polyurethane resins, cool to room temperature more quickly than parts made using thermoplastic resins, but the polymerization (curing) time may be slower.

[0208] In a method for manufacturing overmolded printed electronic components involving the use of molecular ink, any suitable molecular ink is used.

[0209] In a method for manufacturing overmolded printed electronic components including the use of low-temperature molecular ink, the low-temperature molecular ink is any suitable low-temperature molecular ink.

[0210] In some embodiments of the present application, the low-temperature molecular ink comprises copper cations. For example, copper-based low-temperature molecular inks are described in PCT applications No. WO 2016 / 197234 and WO 2018 / 018136.

[0211] In some embodiments of the present application, the low-temperature molecular ink comprises silver cations as disclosed in WO 2018 / 146616. For example, a low-temperature molecular ink suitable for the method of the present application, comprising sintering a non-conductive trace of ink on a substrate to form a conductive silver trace on a first surface of the substrate, comprises silver cations.

[0212] In some embodiments of the present application, the low-temperature molecular ink comprises silver carboxylate; an organic amine compound; an organic polymer binder; a surface tension modifier; and a solvent.

[0213] The silver carboxylate is any suitable silver carboxylate. As used herein, the term “silver carboxylate” means an organic silver salt comprising a silver ion and an organic group containing a carboxylate residue. In one embodiment, the organic group containing the carboxylate comprises 1 to 20 carbon atoms. In another embodiment, the carboxylate is C 1-20 It is an alkanate; that is, the carboxylate is C 1-20It is a silver salt of an alkanic acid. In one embodiment, the silver carboxylate is selected from silver formate, silver acetate, silver oxalate, silver propionate, silver butanoate, silver ethylhexanone salt, silver neodecanoate, silver pentafluoropropionate, silver citrate, silver glycolate, silver lactate, silver benzoate or derivatives thereof, silver trifluoroacetate, silver phenylacetate or derivatives thereof, silver hexafluoroacetyl-acetoneate, silver isobutyryl acetate, silver benzoylacetate, silver propionyl acetate, silver acetoacetate, silver alpha-methylacetoacetate, silver alpha-ethylacetoacetate, and mixtures thereof. In one embodiment, the silver carboxylate is silver oxalate. One or more silver carboxylates may be present in the ink. The silver carboxylate is preferably dispersed in the ink. In one embodiment, the ink does not contain flakes of the silver-containing material.

[0214] Silver carboxylate is present in the low-temperature molecular ink in any suitable amount. In one embodiment, silver carboxylate is present in a range of about 5 wt% to about 75 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 5 wt% to about 60 wt%, or about 5 wt% to about 50 wt%, or about 10 wt% to about 75 wt%, or about 10 wt% to about 60 wt%, or about 10 wt% to about 45 wt%, or about 25 wt% to about 40 wt% based on the total weight of the low-temperature molecular ink. In yet another embodiment, silver carboxylate is present in an amount of about 10 wt% to about 60 wt% based on the total weight of the low-temperature molecular ink. In a further embodiment, this amount is in the range of about 30 wt% to about 35 wt% based on the total weight of the low-temperature molecular ink. With respect to the silver content, in one embodiment, silver itself is present in a range of about 3% by weight to about 30% by weight based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 6% by weight to about 30% by weight, or about 15% by weight to about 25% by weight based on the total weight of the low-temperature molecular ink. In yet another embodiment of the present application, this amount is in the range of about 18% by weight to about 24% by weight based on the total weight of the low-temperature molecular ink.

[0215] The organic amine compound is any suitable organic amine compound. The organic amine compound is an aliphatic and / or aromatic amine, e.g., C 1-20 Alkyl amines and / or C 6-20It may be an aryl amine. In some embodiments, the organic amine compound is substituted with one or more other functional groups. In one embodiment, the other functional group is a polar functional group. In another embodiment, the other functional group is selected from -OH, -SH, =O, -CHO, -COOH, and a halogen (e.g., F, Cl, or Br). In one embodiment, the other functional group is -OH. In one embodiment, the organic amine compound is an amino alcohol. In yet another embodiment, the amino alcohol is a hydroxyalkylamine. In further embodiments, the hydroxyalkylamine comprises 2 to 8 carbon atoms. In one embodiment, the hydroxyalkylamine is selected from 1,2-ethanolamine, amino-2-propanol, 1,3-propanolamine, 1,4-butanolamine, 2-(butylamino)ethanol, 2-amino-1-butanol, and mixtures thereof. In one embodiment, the organic amine is amino-2-propanol. One or more than one organic amine compound may be present in the low-temperature molecular ink. In another embodiment of the present application, the organic amine compound is a mixture of amino-2-propanol and 2-amino-1-butanol.

[0216] Organic amines are present in the low-temperature molecular ink in any suitable amount. In one embodiment, organic amines are present in the low-temperature molecular ink in a range of about 10% by weight to about 75% by weight based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 20% by weight to about 60% by weight, or about 25% by weight to about 55% by weight based on the total weight of the low-temperature molecular ink. In a further embodiment, this amount is in the range of about 40% by weight to about 50% by weight based on the total weight of the low-temperature molecular ink.

[0217] Silver carboxylate and organic amine compounds can form a complex in a low-temperature molecular ink. In one embodiment, the complex comprises a molar ratio of silver carboxylate to organic amine compound of 1:1 to 1:4, for example, 1:1, 1:2, 1:3, or 1:4. The complex of silver carboxylate and organic amine and the interaction between them can provide a silver metal precursor that can be formulated with other components as a low-temperature molecular ink.

[0218] The organic polymer binder is any suitable polymer. In one embodiment, the organic polymer binder is a thermoplastic or elastomeric polymer. The organic polymer binder is advantageously compatible with organic amine compounds, so that a mixture of organic amine compounds in the organic polymer binder does not result in significant phase separation. In one embodiment, the organic polymer binder is selected from cellulose polymers, polyacrylates, polystyrenes, polyolefins, polyvinyl acetals, polyesters, polyimides, polyols, polyurethanes, fluoropolymers, fluoroelastomers, and mixtures thereof. In one embodiment, the organic polymer binder is a homopolymer, a copolymer, or a mixture thereof. In another embodiment, the organic polymer binder is a cellulose polymer. In additional embodiments, the cellulose polymer is selected from methylcellulose, ethylcellulose, ethyl methylcellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, hydroxyethyl methyl cellulose, hydroxypropyl methyl cellulose, ethyl hydroxyethyl cellulose, carboxymethyl cellulose, and mixtures thereof. In other embodiments, the organic polymer binder is hydroxyethyl cellulose.

[0219] An organic polymer binder is present in the low-temperature molecular ink in any suitable amount. In one embodiment, the organic polymer binder is present in the low-temperature molecular ink in a range of about 0.05 wt% to about 10 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 0.1 wt% to about 5 wt%, or about 0.2 wt% to about 2 wt%, or about 0.2 wt% to about 1 wt% based on the total weight of the low-temperature molecular ink. In a further embodiment, the organic polymer binder is present in an amount of about 0.1 wt% to about 5 wt% based on the total weight of the low-temperature molecular ink. In yet another embodiment of the present application, this amount is in the range of about 0.3 wt% to about 0.95 wt% based on the total weight of the low-temperature molecular ink.

[0220] Without a surface tension modifier, the shape retention of traces produced from low-temperature molecular ink is worse than that produced from similar inks with a surface tension modifier, especially in humid environments, which can result in non-uniform characteristics. A surface tension modifier is any suitable additive that improves the flow and smoothness characteristics of the ink. In one embodiment, the surface tension modifier is selected from surfactants (e.g., cationic, nonionic, or anionic surfactants), alcohols (e.g., propanol), glycolic acid, lactic acid, and mixtures thereof. In another embodiment, the surface tension modifier is glycolic acid or lactic acid. In a further embodiment, the surface tension modifier is lactic acid.

[0221] A surface tension modifier is present in the low-temperature molecular ink in any suitable amount. In one embodiment, the surface tension modifier is present in the low-temperature molecular ink in a range of about 0.1 wt% to about 5 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 0.5 wt% to about 4 wt%, or about 0.8 wt% to about 3 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, the surface tension modifier is present in an amount of about 0.5 wt% to about 4 wt% based on the total weight of the low-temperature molecular ink. In a further embodiment of the present application, this amount is in the range of about 1 wt% to about 2.7 wt% based on the total weight of the low-temperature molecular ink.

[0222] The solvent is any suitable aqueous or organic solvent. In one embodiment, the solvent is an organic solvent or a mixture of organic solvents. In some embodiments, the solvent is a mixture of one or more organic solvents and an aqueous solvent. The solvent is advantageously compatible with one or both of an organic amine compound or an organic polymer binder. The solvent is advantageously compatible with both an organic amine compound and an organic polymer binder. In one embodiment, the organic amine compound and / or the organic polymer binder is dispersible in the solvent, for example, soluble. In one embodiment, the organic solvent is an aromatic, non-aromatic, or mixture of an aromatic and non-aromatic solvent. In another embodiment, the aromatic solvent is selected from benzene, toluene, ethylbenzene, xylene, chlorobenzene, benzyl ether, anisole, benzonitrile, pyridine, diethylbenzene, propylbenzene, cumene, isobutylbenzene, p-cymene, tetralin, trimethylbenzene (e.g., mesitylene), durene, p-cumene, and mixtures thereof. In another embodiment, the non-aromatic solvent is selected from terpenes, glycol ethers (e.g., dipropylene glycol methyl ether, methyl carbitol, ethyl carbitol, butyl carbitol, triethylene glycol and derivatives thereof), alcohols (e.g., methylcyclohexanol, octanol, heptanol, isopropanol), and mixtures thereof. In another embodiment of the present application, the solvent is propylene glycol methyl ether.

[0223] A solvent is present in the low-temperature molecular ink in any suitable amount. In one embodiment, the solvent is present in the low-temperature molecular ink in a range of about 1 wt% to about 50 wt% based on the total weight of the low-temperature molecular ink. In one embodiment, the solvent is present in an amount to provide the weight of the remainder of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 2 wt% to about 35 wt%, or about 5 wt% to about 25 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 10 wt% to about 20 wt% based on the total weight of the low-temperature molecular ink.

[0224] In some embodiments, the low-temperature molecular ink further comprises an antifoaming agent. The antifoaming agent is any suitable antifoaming agent. In one embodiment, the antifoaming agent is selected from fluorosilicone, mineral oil, vegetable oil, polysiloxane, ester wax, fatty alcohol, glycerol, stearate, silicone, polypropylene substrate polyether, and mixtures thereof. In another embodiment, the antifoaming agent is selected from glycerol and polypropylene-based polyether. In additional embodiments, the antifoaming agent is glycerol. Without an antifoaming agent, some printed traces tend to retain bubbles after printing, which may result in non-uniform traces.

[0225] An antifoaming agent is present in the low-temperature molecular ink in any suitable amount. In one embodiment, the antifoaming agent is present in the low-temperature molecular ink in a range of about 0.0001 wt% to about 1 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 0.001 wt% to about 0.1 wt%, or about 0.002 wt% to about 0.05 wt% based on the total weight of the low-temperature molecular ink. In a further embodiment, this amount is in the range of about 0.005 wt% to about 0.01 wt% based on the total weight of the low-temperature molecular ink. In an alternative embodiment, the antifoaming agent is present in an amount of about 0.5 wt% to about 8 wt% based on the total weight of the low-temperature molecular ink.

[0226] In some embodiments, the low-temperature molecular ink further comprises a thixotropic modifier. The thixotropic modifier is any suitable thixotropic modifier additive. In one embodiment, the thixotropic modifier is selected from polyhydroxycarboxylic acid amide, polyurethane, acrylic polymer, latex, polyvinyl alcohol, styrene / butadiene, clay, clay derivatives, sulfonates, guar, xanthan, cellulose, locust gum, acacia gum, sugars, sugar derivatives, casein, collagen, modified castor oil, organosilicon, and mixtures thereof. In another embodiment, the thixotropic modifier is polyhydroxycarboxylic acid amide.

[0227] A thixotropic modifier is present in the low-temperature molecular ink in any suitable amount. In another embodiment of the present application, the thixotropic modifier is present in the low-temperature molecular ink in a range of about 0.05 wt% to about 1 wt% based on the total weight of the low-temperature molecular ink. In another embodiment, this amount is in the range of about 0.1 wt% to about 0.8 wt% based on the total weight of the low-temperature molecular ink. In a further embodiment, this amount is in the range of about 0.2 wt% to about 0.5 wt% based on the total weight of the low-temperature molecular ink. In another embodiment of the present application, the thixotropic modifier is present in an amount of about 0.1 wt% to about 0.5 wt% based on the total weight of the low-temperature molecular ink.

[0228] The relative amounts and / or specific compositions of the various components of the ink can play a useful role in optimizing the performance of the ink. A person skilled in the art can adjust the sintering temperature of the ink to accommodate a substrate that is less robust to high temperatures while maintaining high conductivity of the conductive traces formed from the ink by changing the amounts and compositions of the components described herein.

[0229] In a method for manufacturing an overmolded printed electronic component comprising the use of a hot molecular ink, the hot molecular ink is any suitable hot molecular ink. In one embodiment, the hot molecular ink is any suitable hot molecular ink of PCT application publication number WO 2015 / 192248.

[0230] In a method for manufacturing an overmolded printed electronic component comprising the use of a nanoparticle ink (e.g., silver flake ink), the nanoparticle ink (e.g., silver flake ink) is any suitable nanoparticle ink (e.g., any suitable silver flake ink). Nanoparticle inks for printed electronic components (e.g., silver flake ink) are commercially available, and a nanoparticle ink suitable for the method of the present application (e.g., a suitable silver flake ink) can be selected by a person skilled in the art.

[0231] III. Overmolded Printed Electronic Components and Their Uses

[0232] The present application is an overmolded printed electronic component,

[0233] A conductive silver trace bonded to a first surface of a substrate, comprising a conductive silver trace manufactured with a low-temperature molecular ink as defined in an embodiment of the present application; and

[0234] The overmolded printed electronic component further comprises a conductive silver trace bonded to a first surface of a substrate and a resin overmolded on top of it.

[0235] In one embodiment, the substrate was formed into a three-dimensional shape (e.g., thermoforming).

[0236] In one embodiment, the overmolded printed electronic component further comprises one or more electronic components bonded to a first surface of a substrate. The one or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, the one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In another embodiment of the present application, the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0237] In one embodiment, the overmolded printed electronic component further comprises a glass fiber reinforcement layer on a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. In one embodiment, the reinforcement layer has a reflectivity index nearly identical to that of the overmolded resin. In another embodiment, the glass fiber reinforcement layer comprises a pre-impregnated tape or a blended woven fabric. In an embodiment where the overmolded resin is a thermosetting resin, the glass fiber reinforcement layer may further comprise a dry fabric that is saturated during injection.

[0238] In one embodiment, the overmolded printed electronic component further comprises one or more decorative ink layers on a first surface of a substrate. The one or more decorative ink layers are made of any suitable decorative ink, and the ink may be selected by a person skilled in the art.

[0239] In one embodiment, the overmolded printed electronic component further comprises a dielectric ink layer on a first surface of a substrate. The dielectric ink layer is made of any suitable dielectric ink, and the ink may be selected by a person skilled in the art.

[0240] In one embodiment, the overmolded printed electronic component further comprises a UV-curable hard coating on a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating, which can be selected by a person skilled in the art.

[0241] In one embodiment, the overmolded resin is a thermoplastic resin. The thermoplastic resin is any suitable thermoplastic resin.

[0242] In one embodiment, the overmolded resin is a thermosetting resin. The thermosetting resin is any suitable thermosetting resin. In one embodiment, the thermosetting resin is a polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin.

[0243] In one embodiment, the overmolded printed electronic component further comprises a plurality of glass microspheres embedded in the overmolded resin. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In a further embodiment of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0244] In one embodiment, the overmolded resin is in the form of a foam.

[0245] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TM It includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the overmolded printed electronic component is for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the overmolded printed electronic component is for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate is polycarbonate.

[0246] In one embodiment, the overmolded printed electronic component is a single side. In an alternative embodiment of the present application, the overmolded printed electronic component is double-sided.

[0247] The present application is an overmolded printed electronic component,

[0248] A conductive trace bonded to a first surface of a substrate; and

[0249] It further includes an overmolded printed electronic component comprising a thermosetting resin overmolded on a conductive trace bonded to a first surface of a substrate.

[0250] A conductive trace is prepared from any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace is prepared from a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace is prepared from a molecular ink. In another embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. In a further embodiment, the conductive trace is a conductive silver trace prepared from a low-temperature molecular ink as described in the embodiments of this specification in relation to the method of this application.

[0251] In one embodiment, the substrate was formed into a three-dimensional shape (e.g., thermoforming).

[0252] In one embodiment, the overmolded printed electronic component further comprises one or more electronic components bonded to a first surface of a substrate. The one or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, the one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In another embodiment of the present application, the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0253] In one embodiment, the overmolded printed electronic component further comprises a glass fiber reinforcement layer on a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. In one embodiment, the reinforcement layer has a reflectivity index nearly identical to that of a thermosetting resin. In another embodiment, the glass fiber reinforcement layer comprises a pre-impregnated tape, a blended woven fabric, or a dry fabric.

[0254] In one embodiment, the overmolded printed electronic component further comprises one or more decorative ink layers on a first surface of a substrate. The one or more decorative ink layers are made of any suitable decorative ink, and the ink may be selected by a person skilled in the art.

[0255] In one embodiment, the overmolded printed electronic component further comprises a dielectric ink layer on a first surface of a substrate. The dielectric ink layer is made of any suitable dielectric ink, and the ink may be selected by a person skilled in the art.

[0256] In one embodiment, the overmolded printed electronic component further comprises a UV-curable hard coating on a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating, which can be selected by a person skilled in the art.

[0257] The thermosetting resin is any suitable thermosetting resin. In one embodiment, the thermosetting resin is a polyurethane resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin.

[0258] In one embodiment, the overmolded printed electronic component further comprises a plurality of glass microspheres embedded in a thermosetting resin. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In a further embodiment of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0259] In one embodiment, the thermosetting resin is in the form of a foam.

[0260] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM)), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TM It includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the overmolded printed electronic component is for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the overmolded printed electronic component is for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate is polycarbonate.

[0261] In one embodiment, the overmolded printed electronic component is a single side. In an alternative embodiment of the present application, the overmolded printed electronic component is double-sided.

[0262] The present application is an overmolded printed electronic component,

[0263] A conductive trace bonded to a first surface of a substrate; and

[0264] The overmolded printed electronic component further comprises a resin in which a plurality of glass microspheres are embedded and overmolded onto a conductive trace bonded to a first surface of a substrate.

[0265] A conductive trace is prepared from any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace is prepared from a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace is prepared from a molecular ink. In another embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. In a further embodiment, the conductive trace is a conductive silver trace prepared from a low-temperature molecular ink as described in the embodiments of this specification in relation to the method of this application.

[0266] In one embodiment, the substrate was formed into a three-dimensional shape (e.g., thermoforming).

[0267] In one embodiment, the overmolded printed electronic component further comprises one or more electronic components bonded to a first surface of a substrate. The one or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, the one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In another embodiment of the present application, the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0268] In one embodiment, the overmolded printed electronic component further comprises a glass fiber reinforcement layer on a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. In one embodiment, the reinforcement layer has a reflectivity nearly identical to that of the resin. In another embodiment, the glass fiber reinforcement layer comprises a pre-impregnated tape or a blended woven fabric. In an embodiment where the resin is a thermosetting resin, the glass fiber reinforcement layer may further comprise a dry fabric.

[0269] In one embodiment, the overmolded printed electronic component further comprises one or more decorative ink layers on a first surface of a substrate. The one or more decorative ink layers are made of any suitable decorative ink, and the ink may be selected by a person skilled in the art.

[0270] In one embodiment, the overmolded printed electronic component further comprises a dielectric ink layer on a first surface of a substrate. The dielectric ink layer is made of any suitable dielectric ink, and the ink may be selected by a person skilled in the art.

[0271] In one embodiment, the overmolded printed electronic component further comprises a UV-curable hard coating on a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating, which can be selected by a person skilled in the art.

[0272] In one embodiment, the overmolded resin is a thermoplastic resin. The thermoplastic resin is any suitable thermoplastic resin.

[0273] In one embodiment, the overmolded resin is a thermosetting resin. The thermosetting resin is any suitable thermosetting resin. In one embodiment, the thermosetting resin is a polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin.

[0274] The glass microsphere is any suitable glass microsphere. In one embodiment, the glass microsphere comprises, is essentially composed of, or is composed of soda-lime borosilicate glass. In another embodiment, the glass microsphere has an average diameter of 18 microns. In a further embodiment of the present application, the glass microsphere has the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0275] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the overmolded printed electronic component is for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the overmolded printed electronic component is for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate is polycarbonate.

[0276] In one embodiment, the overmolded printed electronic component is a single side. In an alternative embodiment of the present application, the overmolded printed electronic component is double-sided.

[0277] The present application is an overmolded printed electronic component,

[0278] A conductive trace bonded to a first surface of a substrate; and

[0279] The overmolded printed electronic component further comprises a foamed resin overmolded on a conductive trace bonded to a first surface of a substrate.

[0280] A conductive trace is prepared from any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace is prepared from a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace is prepared from a molecular ink. In another embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. In a further embodiment, the conductive trace is a conductive silver trace prepared from a low-temperature molecular ink as described in the embodiments of this specification in relation to the method of this application.

[0281] In one embodiment, the substrate was formed into a three-dimensional shape (e.g., thermoforming).

[0282] In one embodiment, the overmolded printed electronic component further comprises one or more electronic components bonded to a first surface of a substrate. The one or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, the one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In another embodiment of the present application, the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0283] In one embodiment, the overmolded printed electronic component further comprises a glass fiber reinforcement layer on a first surface of the substrate. The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. In one embodiment, the reinforcement layer has a reflectivity nearly identical to that of the resin. In another embodiment, the glass fiber reinforcement layer comprises a pre-impregnated tape or a blended woven fabric. In an embodiment where the resin is a thermosetting resin, the glass fiber reinforcement layer may further comprise a dry fabric.

[0284] In one embodiment, the overmolded printed electronic component further comprises one or more decorative ink layers on a first surface of a substrate. The one or more decorative ink layers are made of any suitable decorative ink, and the ink may be selected by a person skilled in the art.

[0285] In one embodiment, the overmolded printed electronic component further comprises a dielectric ink layer on a first surface of a substrate. The dielectric ink layer is made of any suitable dielectric ink, and the ink may be selected by a person skilled in the art.

[0286] In one embodiment, the overmolded printed electronic component further comprises a UV-curable hard coating on a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating, which can be selected by a person skilled in the art.

[0287] In one embodiment, the foamed resin is a foamed thermoplastic resin. The foamed thermoplastic resin is any suitable foamed thermoplastic resin.

[0288] In one embodiment, the foamed resin is a foamed thermosetting resin. In another embodiment, the foamed thermosetting resin is a foamed polyurethane thermosetting resin. In a further embodiment, the foamed polyurethane resin is a foamed transparent aliphatic polyurethane thermosetting resin.

[0289] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the overmolded printed electronic component is for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the overmolded printed electronic component is for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate is polycarbonate.

[0290] In one embodiment, the overmolded printed electronic component is a single side. In an alternative embodiment of the present application, the overmolded printed electronic component is double-sided.

[0291] The present application is an overmolded printed electronic component,

[0292] A conductive trace bonded to the first surface of a substrate;

[0293] A glass fiber reinforcing layer on a conductive trace bonded to a first surface of a substrate; and

[0294] It further includes an overmolded printed electronic component comprising a resin overmolded on a glass fiber reinforcement layer.

[0295] A conductive trace is prepared from any suitable ink that forms a conductive trace on a first surface of a substrate upon curing. In one embodiment, the conductive trace is prepared from a molecular ink or a nanoparticle ink (e.g., silver flake ink). In one embodiment, the conductive trace is prepared from a molecular ink. In another embodiment, the molecular ink is a low-temperature molecular ink or a high-temperature molecular ink. In a further embodiment, the conductive trace is a conductive silver trace prepared from a low-temperature molecular ink as described in the embodiments of this specification in relation to the method of this application.

[0296] In one embodiment, the substrate was formed into a three-dimensional shape (e.g., thermoforming).

[0297] In one embodiment, the overmolded printed electronic component further comprises one or more electronic components bonded to a first surface of a substrate. The one or more electronic components are bonded to the first surface of the substrate by any suitable means. In one embodiment, the one or more electronic components are bonded to the first surface of the substrate by a conductive adhesive. Any suitable conductive adhesive may be used, and the adhesive may be selected by a person skilled in the art. In another embodiment of the present application, the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors.

[0298] The glass fiber reinforcement layer is any suitable glass fiber reinforcement layer. In one embodiment, the reinforcement layer has a reflectance index nearly identical to that of the overmolded resin. In another embodiment, the glass fiber reinforcement layer comprises a pre-impregnated tape or a blended woven fabric. In an embodiment where the overmolded resin is a thermosetting resin, the glass fiber reinforcement layer may further comprise a dry fabric.

[0299] In one embodiment, the overmolded printed electronic component further comprises one or more decorative ink layers on a first surface of a substrate. The one or more decorative ink layers are made of any suitable decorative ink, and the ink may be selected by a person skilled in the art.

[0300] In one embodiment, the overmolded printed electronic component further comprises a dielectric ink layer on a first surface of a substrate. The dielectric ink layer is made of any suitable dielectric ink, and the ink may be selected by a person skilled in the art.

[0301] In one embodiment, the overmolded printed electronic component further comprises a UV-curable hard coating on a second surface of the substrate. The UV-curable hard coating is any suitable UV-curable hard coating, which can be selected by a person skilled in the art.

[0302] In one embodiment, the overmolded resin is a thermoplastic resin. The thermoplastic resin is any suitable thermoplastic resin.

[0303] In one embodiment, the overmolded resin is a thermosetting resin. The thermosetting resin is any suitable thermosetting resin. In one embodiment, the thermosetting resin is a polyurethane thermosetting resin. In another embodiment, the polyurethane resin is a transparent aliphatic polyurethane thermosetting resin.

[0304] In one embodiment, the overmolded printed electronic component further comprises a plurality of glass microspheres embedded in the overmolded resin. The glass microspheres are any suitable glass microspheres. In one embodiment, the glass microspheres comprise, are essentially composed of, or are composed of soda-lime borosilicate glass. In another embodiment, the glass microspheres have an average diameter of 18 microns. In a further embodiment of the present application, the glass microspheres have the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0305] In one embodiment, the overmolded resin is in the form of a foam.

[0306] The substrate is any suitable substrate having a printable surface. In one embodiment, the substrate is polyethylene terephthalate (PET) (e.g., Melinex TM ), amorphous polyethylene terephthalate (APET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate, polyolefins (e.g., silica-filled polyolefins (Teslin TM )), polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide (e.g., Kapton TMIt includes thermoplastic polyurethane (TPU), acrylonitrile / butadiene / styrene, polystyrene, or silicone membrane. In another embodiment, the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In one embodiment, the overmolded printed electronic component is for low-temperature applications, and the substrate comprises polycarbonate, a polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), or thermoplastic olefin (TPO). In one embodiment, the overmolded printed electronic component is for aerospace applications, and the substrate comprises polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). In a further embodiment, the substrate is polycarbonate.

[0307] In one embodiment, the overmolded printed electronic component is a single side. In an alternative embodiment of the present application, the overmolded printed electronic component is double-sided.

[0308] In some embodiments, the overmolded printed electronic component of the present application is manufactured according to the method for manufacturing the overmolded printed electronic component of the present application.

[0309] The overmolded printed electronic components of the present application may be used, for example, in ground transportation applications and / or the aerospace industry (both for internal and external components). They may also be used, for example, in the medical and consumer electronics sectors.

[0310] The following non-limiting embodiments illustrate the present application:

[0311] Examples

[0312] Embodiment 1: Low-temperature molecular ink formulation

[0313] Molecular inks that can be processed at low temperatures were formulated according to the compositions shown in Tables 1 to 6. Molecular inks that can be processed at low temperatures with favorable and more reliable printability (i.e., improved desaturation and line uniformity) were formulated according to the composition shown in Table 7.

[0314] The ink is preferably used immediately after formulation, but can be stored for a longer period at a temperature range of about -4°C to about 4°C without significant degradation. Additionally, the ink can be recovered from the screen and reused for additional printing if stored within the aforementioned temperature range.

[0315] Embodiment 2: Generation of traces smaller than 100 μm by screen printing low-temperature ink

[0316] Melinex TMInk NRC-848A3a was screen-printed (stainless steel, mesh count / inch = 400; emulsion thickness = 22.5 μm) onto an ST505 sheet and heat-treated at 75°C for 6 minutes and at 120°C for 20 minutes to produce a series of four parallel conductive silver traces on the substrate with a line width of approximately 42 μm and a line spacing of approximately 38 μm as shown in FIG. 1, and a line width of approximately 85 μm and a line spacing of approximately 60 μm as shown in FIG. 2. The pitch, defined by line width and line spacing (L / S), was measured as 42 / 38 and 85 / 65 μm, respectively. 3D profiler images of the traces and corresponding cross-sections measured with an optical profiler are provided in FIG. 1 and FIG. 2.

[0317] Embodiment 3: Electrical properties of a low glass transition temperature substrate and a low-temperature ink processed at a commercially available temperature

[0318] Two inks (NRC-849A1 and NRC-850A) in the manner described in Example 2 Melinex Screen printing was performed on five individual samples of ST505 substrates. The traces on each substrate were heat-treated at five different temperatures (91°C, 102°C, 111°C, 121°C, and 131°C) for 20 minutes to form conductive silver traces on each substrate. The sheet resistivity values ​​of the conductive silver traces generated from NRC-849A1 and NRC-850A were calculated, and the results are presented in the upper and lower graphs of Fig. 3, respectively. The results indicate that sheet resistivity values ​​of less than approximately 40 mΩ / □ / mil can be obtained at a low heat treatment temperature of approximately 90°C. The ability to heat-treat this ink at a low temperature of approximately 90°C while maintaining good to excellent electrical properties is beneficial for generating conductive silver traces on thermoformed substrates using the ink. Conductive traces can also be generated at a low temperature of 81°C, but the sheet resistivity value is significantly higher (approx. 650 mΩ / □ / mil).

[0319] As can be seen in Table 8, by screen printing the ink (NRC-850A) and heat-treating it at 120°C, conductive silver traces can be produced with a measured line width of 2.8 mil (71 µm) and a line thickness of about 0.9 µm or less, while maintaining a sheet resistivity of less than about 20 mΩ / □ / mil. In particular, the measured traces of 5.5 mil (141 µm) to 18.9 mil (408 µm) have a sheet resistivity value of about 10 mΩ / □ / mil.

[0320] Embodiment 4: Printability of ink in a high humidity environment

[0321] Ink NRC-849A1 and NRC-850A1 were prepared in a high humidity environment (humidity > 50%) using Melinex in the manner described in Example 2. TM Screen printing was performed on an ST505 substrate. The traces on each substrate were heat-treated at 121°C for 20 minutes to form conductive silver traces (left and right images in Fig. 4, respectively). In the absence of a thixotropic agent (NRC-849A1, left image in Fig. 4), the ink is significantly dehydrated from the surface, resulting in uneven and broken traces. In contrast, when a thixotropic agent is added (NRC-850A1, right image in Fig. 4), the traces are not dehydrated from the substrate surface and remain uniform.

[0322] Embodiment 5: Refrigerated storage without ink coagulation

[0323] A formulation (NRC-850A4) containing both amino-2-propanol and 2-amino-1-butanol can be stored at -10°C to -4°C without ink coagulation while maintaining electrical properties similar to those of NRC-850A2 and NRC-850A3, which contain only amino-2-propanol. NRC-850A2 and NRC-850A3 coagulate during refrigerated storage, but the liquid state of the ink is restored over time when heated to room temperature.

[0324] Example 6: Thermoforming on a PET-G substrate - Sintering after forming

[0325] Ink NRC-850A2 was screen-printed onto a polyethylene terephthalate glycol modified (PET-G) sheet (508 µm, 20 mil thickness) to produce various traces approximately 10 cm in length with line widths ranging from approximately 100 µm to approximately 590 µm. After printing, the non-conductive traces were dried and thermoformed into various shapes, including trapezoidal, semi-cylindrical, and hemispherical shapes. The thermoformed traces can then be photo-sintered (using a Xenon Sinteron 2000 system) to produce conductive traces. A representative photograph of the thermoformed trace is provided in FIG. 5, and the corresponding resistances measured at both ends of the trace for the conductive feature are provided in Table 9, showing that a continuous silver metal trace was formed without cracking occurring where the non-conductive ink was deformed during thermoforming but before sintering. Table 9 highlights that the resistance measured across the ends of the control trace (i.e., the non-thermoformed trace) is nearly identical to that of the thermoformed trace, suggesting, without wanting to be limited to theory, that the electrical properties of the trace are not affected by the thermoforming process. In some cases, the resistance measured across the ends of the thermoformed trace is actually lower than that of the control trace. Without wanting to be limited to theory, this may be because, for example, a portion of the thermoformed trace is higher than the control sample, and as a result, this portion is closer to the lamp and exposed to stronger pulsed light.

[0326] Example 7: Thermoforming of PET-G substrate - Forming after sintering

[0327] Ink NRC-850A3 was screen-printed onto a PET-G sheet to produce various 10 cm long traces with measured line widths ranging from about 100 µm to about 550 µm. After printing, the traces were heat-sintered at 75°C for 6 minutes and at 125°C for 15 minutes to produce a series of conductive traces. The traces were subsequently thermoformed into various shapes, including semi-cylindrical and dome shapes. Representative thermoformed traces are provided in Fig. 6, and the corresponding resistance of the thermoformed traces compared to the control traces is provided in Table 10. Although the resistance of the traces increased after thermoforming (1.6 to 4.5 times depending on the amount of elongation), the thermoformed traces produced from the molecular ink maintained conductivity.

[0328] Embodiment 8: Stretching of a linear conductive trace derived from a low-temperature molecular ink

[0329] Ink NRC-850A and the commercially available ink DuPont PE873 (formulated for stretchable electronic products) were screen printed onto two thermoplastic polyurethane substrates (Bemis soft seam tape ST604 and American Polyfilm VLM-4001). The VLM-4001 polyurethane substrate was treated with reactive ozone prior to printing. The printed traces were linear and heat-sintered at 150°C for 15 minutes, resulting in a width of 20 mil and a length of 4 cm. Strain was applied to the samples, and the change in resistance was measured in the strained state. Figure 7 shows the normalized resistance (R / R0, where R0 represents the resistance of the sample at zero strain) as a function of strain applied to the two inks on American Polyfilm VLM-4001. Figure 8 shows the normalized resistance as a function of strain applied to the two inks on Bemis soft seam tape ST604. The NRC-850A ink on both substrates exhibits lower normalized resistance as a function of applied strain than DuPont PE873. Additionally, NRC-850A maintains conductivity even under higher strain than DuPont PE873 ink.

[0330] Example 9: Stretching of serpentine conductive traces derived from low-temperature molecular ink

[0331] In another example, an American Polyfilm VLM-4001 polyurethane substrate was ozone-treated. Ink NRC-850A was printed on the polyurethane substrate under two conditions. In one case, the substrate was not deformed. In the second case, the substrate was pre-deformed by 10% in one direction (i.e., the substrate was stretched by 10% during the printing time). The printed pattern included linear and serpentine traces with a width of 20 mil and a length of 4 cm between electrical contact pads. Fig. 9 (top) shows a serpentine line composed of repeating units of a 270° circle. The normalized resistance of the linear and serpentine traces was measured as a function of the applied strain, as shown in Fig. 9 (bottom). The silver serpentine traces printed on the pre-deformed polyurethane maintained conductivity up to a strain of 120%, and at 120% strain, the resistance was 150 times greater than the resistance in the undeformed state. Table 11 compares the normalized resistance for all four conditions (stratum trace, linear trace, pre-strain and no pre-strain) at 40% applied strain.

[0332] Examples 1 to Examples Table related to 9:

[0333]

[0334]

[0335]

[0336]

[0337]

[0338]

[0339]

[0340]

[0341]

[0342]

[0343]

[0344] Example 10: Overmolding of a part printed with molecular and silver flake ink

[0345] Overmolded tests were performed using 4"×4"×0.1" square parts. In these tests, three inks were used: 1) low-temperature molecular ink (NRC-850A2), 2) high-temperature molecular ink (NRC-16), and 3) DuPont TM ME601; Best-in-class silver flake ink for thermoforming was used. NRC-16 is a high-temperature molecular ink described in PCT application publication number WO 2015 / 192248 and comprises silver salt (50%), ethyl cellulose (4%), diethylbenzene (34.5%), and 1-octanol (11.5%). The same pattern was printed onto a 0.020" thick polyethylene terephthalate glycol (PETG) film, and then the printed film was thermoformed and cured. The film formed for overmolding was Engel TM The part was placed on a 43T injection press tool, and enough PETG resin was injected to fill the part. The mold temperature was approximately 100°F (approx. 38°C), and the PETG resin was injected at 245°C at a maximum pressure of 40 bar. Approximately 22 parts were molded. Resistance values ​​were measured before and after overmolding.

[0346] Visually, the low-temperature molecular ink appeared to deliver the best performance. This test was conducted using the worst-case injection strategy with the center injection sprue. In all three inks, there was noticeable damage to the traces near the sprue. The DuPont ink showed signs of trace deformation and smudging. The high-temperature molecular ink, without wishing to be limited to theory, showed that the PETG film had low T g(70°C to 80°C), and it appeared that melting occurred near the sprue due to exposure to the high-temperature, high-pressure resin used in the test. When the resin was injected, secondary hot forming occurred at the sharp part edges of the trace in all samples, breaking continuity and damaging the trace. Without wanting to limit this to theory, this was due to the hot-formed part being slightly under-formed compared to the sharp radius of the injection tool. The final elongation of the trace during injection was thought to cause localized disconnection at the edges of the part.

[0347] Without wishing to be limited to theory, trace damage and smudging were related to the PETG substrate used. Therefore, higher T such as polycarbonate g Using thermoplastic films solves this problem. Additionally, overmolding using thermosetting resins instead of thermoplastic resins resolves this issue by allowing the overmolding process to be subjected to much less stress at significantly lower pressures and temperatures. This opens the door to using a wider range of thermoplastic substrates as surface skin materials, for example, compared to injection molding approaches that apply more than 10 times the pressure to the film substrate at significantly elevated temperatures. Overmolding with thermosetting resins can be performed using tapered cover tools.

[0348] Example 11: Aliphatic polyurethane resin and glass microsphere test

[0349] Transparent aliphatic polyurethane (Sherwin Williams TM Diamond-Clad TM Clear Coat Urethane) and 3M TMTests were performed using iM30K Glass Bubbles microspheres. iM30K is a thin-walled hollow sphere made of soda-lime borosilicate glass. This sphere has an average diameter of 18 microns and a typical density of 0.60 g / cc (minimum density 0.57 g / cc, maximum density 0.63 g / cc), and has the following particle sizes and distributions: 10th percentile, 9 microns; 25th percentile, 12 microns; 50th percentile, 16 microns; 75th percentile, 21 microns; 90th percentile, 28 microns; 95th percentile, 33 microns.

[0350] Part A (transparent - glossy B65T105; 8 parts by weight), Part B (aliphatic isocyanate curing agent B65V105; 4 parts by weight), and Part C (catalyst B65C105; 2 parts by weight) were mixed with glass microspheres in stoichiometric amounts and cured at ambient temperature. Experiments were performed by adding 5 wt% and 10 wt% of glass spheres to the resin system. Control experiments were performed using the same polyurethane without the presence of glass microspheres.

[0351] The experiment investigated the effect of adding glass microspheres on the translucent behavior of polyurethane resin. This is useful, for example, to investigate whether LED light is affected when low-density resin containing glass microspheres is used inside overmolded parts.

[0352] The resin containing 5% glass microspheres slightly reduced the reflectance index of the part. However, light was transmitted through the substrate. The resin containing 10% glass microspheres was significantly affected. However, these experiments were conducted using manual mixing, which introduced additional bubbles, and the bubbles floated during curing. This problem can be solved and the reduction in the reflectance index can be minimized by using mixing conditions that reduce bubbles and resin injection instead of casting.

[0353] Using other glass microspheres, such as 3M iM16, can provide additional weight reduction at lower average densities, but they are susceptible to breakage when compounded, for example, in single or double-screw thermoplastic compounders. iM16 is also a thin-walled hollow sphere made of soda-lime borosilicate glass. Its typical density is 0.46 g / cc (minimum density 0.43 g / cc, maximum density 0.49 g / cc) and it has the following particle sizes and distributions: 10th percentile, 12 microns; 50th percentile, 20 microns; 90th percentile, 30 microns. Without wanting to be limited to theory, adding glass microspheres to thermosetting resins can result in less severe and better preservation of the spheres.

[0354] Similar tests were performed and results were obtained using an alternative aliphatic urethane, namely BJB Industrial Aliphatic Urethane WC-783 A / B, with 100 parts polyol to 90 parts aliphatic isocyanate. This resin is transparent (therefore suitable for cases where optical components are provided), UV stable, and has a high hardness of 80 Shore D. The BJB resin is easy to demold and transparent, but stiffer, producing a rigider part that bonds better with the PC substrate than the transparent aliphatic polyurethane of Example 11 described above.

[0355] Example 12: Single-sided and double-sided overmolded printed electronic components

[0356] An exemplary schematic diagram of a single-sided overmolded printed electronic component (10) of the present application is shown in FIG. 10. Referring to FIG. 10, the overmolded printed electronic component (10) illustrated herein comprises a substrate (12), a conductive trace (14) bonded to a first surface of the substrate (12), and a resin (16) overmolded over the conductive trace (14) bonded to the substrate (12). The overmolded electronic component (10) optionally further comprises a decorative ink layer (18) (e.g., one to three different decorative inks may be used on the overmolded printed electronic component (10)) and a dielectric ink layer (20), wherein the dielectric ink layer may act as a barrier layer to protect the decorative ink layer (18) from the molecular ink used to manufacture the conductive trace (14). For example, one of the roles of the second material over the decorative ink layer (18) may be to create a barrier layer and improve the adhesion of the molecular ink to the component; The dielectric ink layer (20) on the decorative ink layer (18) can also serve as a protective layer to prevent aesthetic printing problems through the surface layer due to the injection and bonding of the hardware. In another embodiment, the dielectric layer may be added between the conductive trace (14) and the electronic component (22) to provide additional protection, except for the area where the electronic component (22) needs to be connected to the conductive trace (14). In a further embodiment, if white decorative ink is used instead of black (carbon) ink, a dielectric layer is not required between the decorative ink (18) and the conductive trace (14).

[0357] In an overmolded printed electronic component (10), optionally multiple ink layers, such as low-temperature molecular ink used to manufacture conductive traces (14), may be applied over the dielectric ink used to manufacture dielectric ink layers (20). Alternatively, a single ink layer, such as low-temperature molecular ink, may be used. In a single-sided overmolded printed electronic component (10), the ink layers are generally overlapped, for example, a decorative ink layer (18) covers most of the surface of the substrate (12) except for a light window; and a dielectric ink layer (20) partially covers the surface of the substrate (12). Referring to FIG. 10, an electrical component (22), including but not limited to a light-emitting diode (LED), an organic light-emitting diode (OLED), and an ultrasonic sensor, is optionally bonded to the substrate (12) using a conductive adhesive prior to thermoforming in the method of the present application. A glass fiber reinforcing layer (24) is also optional and may be used, for example, to increase the rigidity of the overmolded printed electronic component (10) while reducing its weight. FIG. 10 also illustrates an optional ultraviolet (UV) hard coating layer (26) bonded to a second side of a substrate (12) that may be applied, for example, to increase the scratch resistance of the final overmolded printed electronic component (10). In the method of the present application, UV curing is completed after the substrate (12) is thermomolded. In some embodiments of the present application, the overmolding resin (16) may be a thermoplastic resin or a thermosetting resin. In other embodiments of the present application, the overmolding resin (16) is a thermosetting resin. The overmolding resin (16) may optionally be foamed or comprise glass microspheres. Alternatively, the overmolding resin (16) is a pure resin. In some cases, a colored overmolding resin (16) is preferred, for example, when an illumination feature is bonded directly to the substrate (12). Alternatively, if two skins are used, a transparent or opaque resin may allow light transmission through the overmolded printed electronic component (10).

[0358] An exemplary schematic diagram of a double-sided overmolded printed electronic component (110) of the present application is shown in FIG. 11. The double-sided overmolded printed electronic component (110) may be used, for example, when a high-quality lighting effect is required for the component and / or when there is no significant space on one surface for the printed electronic circuit. Referring to FIG. 11, the double-sided overmolded printed electronic component (110) illustrated herein comprises two substrates (112A, 112B), two conductive traces (114A, 114B) respectively bonded to a first surface of each substrate (112A, 112B), and a resin (116) overmolded over the conductive traces (114A, 114B) respectively bonded to the substrates (112A, 112B). The substrate (112A) on the back side of the overmolded printed electronic component (110) may optionally be a different, inexpensive material than the substrate (112B) on the visible surface of the overmolded printed electronic component (110), for example, a material that does not require scratch resistance and / or UV weather resistance. The overmolded electronic component (110) may optionally further include a decorative ink layer (118A, 118B). For example, one to three different decorative inks may be used on the overmolded printed electronic component (110), and a dielectric ink layer (120A, 120B) may be interposed between the conductive trace (114A, 114B) and the decorative ink layer (118A, 118B). In an overmolded printed electronic component (110), optionally a plurality of ink layers, such as low-temperature molecular ink used to manufacture conductive traces (114A, 114B), may be applied over the dielectric ink used to manufacture dielectric ink layers (120A, 120B). Alternatively, a single ink layer, such as low-temperature molecular ink, may be used.In the double-sided overmolded printed electronic component (110) of FIG. 11, a similar lamination approach may be followed for the single-sided overmolded printed electronic component (10) of FIG. 10, but a person of ordinary skill in the art will understand that this surface may not be visible and may function to provide space for other purposes, e.g., for printed electronic circuits or additional lighting. Referring to FIG. 11, electrical components (122A, 122B), including but not limited to light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), and ultrasonic sensors, are optionally bonded to the substrate (112A, 112B) using a conductive adhesive prior to thermoforming in the method of the present application. A glass fiber reinforcing layer (124A, 124B) is also optional and may be used, for example, to increase the rigidity of the overmolded printed electronic component (110) while reducing weight. FIG. 11 also illustrates an optional ultraviolet (UV) hard coating layer (126) bonded to a second side of a substrate (112B) that can be applied, for example, to increase the scratch resistance of the visible surface of the final overmolded printed electronic component (110).

[0359] In another embodiment illustrated in FIG. 18, a single set of immersed electronic products is shown bonded to a back surface (substrate, 182A). Two substrates (182A, 182B) have conductive traces (184A, 184B) bonded thereto and include a decorative ink layer (188A, 188B) and a protective interlayer dielectric layer (180A, 180B). Glass fiber layers (194A, 194B) are also shown on both sides of the resin layer (186). Finally, a UV hard coating (196) is applied to a second surface opposite the substrate (182B), i.e., the non-face of the overmolded part.

[0360] Another advantage of using a two-skin approach (i.e., a double-sided overmolded printed electronic component rather than a single-sided overmolded printed electronic component) with a thermosetting resin system is that it may simplify the molding process and incorporate exhaust and gating features into the thermomolded component. This can, for example, reduce the time required to clean injection tools or facilitate the automated manufacturing of the overmolded component. An exemplary schematic diagram showing the exhaust and gating features of a double-sided overmolded printed electronic component (200) is shown in FIG. 12. Referring to FIG. 12, the schematic diagram on the left is a top view of the double-sided overmolded printed electronic component (200), and the schematic diagram on the right is a cross-section of the double-sided overmolded printed electronic component (200) taken from line (202) of the schematic diagram shown on the left. Referring to FIG. 12, an injection gate (204) and an exhaust section (206) are formed on the substrate film. In the schematic diagram on the right, a lower substrate (208) and an upper substrate (210) are shown.

[0361] Another advantage of using the (dual) double-sided epidermal approach is that it improves surface aesthetics (by moving LEDs and traces to the back epidermal, so they are immersed and invisible on the aesthetic surface / front epidermal side) and allows for more surface area to be utilized for electronic components. Metal ink traces that are less visible on the (aesthetic) surface provide further advantages to the double-sided components shown, for example, in FIGS. 11 and 18.

[0362] Example 13: Cu trace generated from molecular ink

[0363] Low cost, high conductivity, and oxidation resistance are key objectives for inks in printed electronics. Gold and silver are expensive but stable and resistant to oxidation. Compared to gold and silver, copper is cheaper and has similar conductivity; however, similar conductivity is often not achieved through printing, and copper is prone to oxidation, causing its conductivity to decrease over time. The main types of copper inks used are metal nanoparticle-based inks, metal-organic decomposition (MOD) inks, copper flake inks, and silver-coated copper flake inks. Most of these copper conductive inks require a nitrogen or reducing atmosphere during thermal sintering and take longer to sinter.

[0364] Advantageously, printing inks that can be sintered using broad-spectral UV light to create oxidation-resistant electrically conductive Cu traces on a low-temperature substrate while reducing or eliminating damage to the substrate are provided herein. Low-cost copper inks that are screen-printable and UV-sinterable on low-cost plastics, namely PET, offer immediate advantages for industrial or commercial applications. Exemplary copper molecular inks suitable for UV treatment (treatment and sintering) and methods for manufacturing such inks are disclosed in WO2018018136 and Table 12 below.

[0365] The Cu molecular ink comprises copper nanoparticles, copper precursor molecules, and a mixture of polymer binders including polyester, polyimide, polyetherimide, or any mixture thereof, having surface functional groups that make the polymer binder compatible with and / or soluble with the diol.

[0366] Copper nanoparticles (CuNPs) are copper particles having an average size along the longest dimension in the range of about 1 to 1000 nm, preferably about 1 to 500 nm, and more preferably about 1 to 100 nm. Copper nanoparticles may be flakes, nanowires, needles, substantially spherical, or any other shape. Copper nanoparticles can be formed by natural processes or through chemical synthesis and are generally commercially available. Copper nanoparticles are preferably present in the ink in an amount of about 0.04 to 7 wt% based on the total weight of the ink. More preferably, the amount of copper nanoparticles is in the range of about 0.1 to 6 wt%, or about 0.25 to 5 wt%, or about 0.4 to 4 wt%. In one particularly preferred embodiment, this amount is in the range of about 0.4 wt% to about 1 wt%.

[0367] Copper precursor molecules are copper-containing compounds that decompose under sintering conditions to produce additional copper nanoparticles on a conductive copper trace. The copper precursor molecules may be inorganic compounds (e.g., CuSO4, CuCl2, Cu(NO3), Cu(OH)2), copper metal-organic compounds (Copper-MOD), or mixtures thereof. Copper-MODs include, for example, copper carboxylates (copper salts of C1-C12 alkanes such as copper formate, copper acetate, copper propanoate, copper butanate, copper decanate, copper neodecanate, etc.), copper amines (e.g., bis(2-ethyl-1-hexylamine) copper(II) formate, bis(octylamine) copper(II) formate, tris(octylamine) copper(II) formate, etc.), copper ketone complexes (e.g., copper(acetylacetone), copper(trifluoroacetylacetone), copper(hexafluoroacetylacetone), copper(dipivaloylmethane), etc.), copper hydroxide-alkanolamine complexes, copper(II) formate-alkanolamine complexes, and copper:aminediol complexes. Examples of amino diols include 3-diethylamino-1,2-propanediol (DEAPD), 3-(dimethylamino)-1,2-propanediol (DMAPD), 3-methylamino-1-2-propanediol (MPD), 3-amino-1,2-propanediol (APD), and 3-morpholino-1,2-propanediol.

[0368] The organic amine may be present in the ink in any suitable amount based on the total weight of the ink, preferably in the range of about 10 weight% to about 75 weight%. More preferably, this amount is in the range of about 20 weight% to about 60 weight%, or about 25 weight% to about 55 weight%. In one particularly preferred embodiment, this amount is in the range of about 40 weight% to about 45 weight%.

[0369] Copper:aminediol complexes are particularly desirable copper precursor molecules. Many copper:aminediol complexes are liquid at ambient temperature and can act as copper precursor molecules and solvents. Additionally, copper:aminediol complexes interact favorably with polymer binders to produce conductive copper traces with excellent conductivity, mechanical strength, and solderability. A particularly desirable copper:aminediol complex is a copper formate:aminediol complex. In one embodiment, the copper:aminediol complex comprises a compound of the following formula (I):

[0370]

[0371] In the formula, R1, R2, R3 and R4 are the same or different, NR5R6(R'(OH)2) or -O-(CO)-R", and at least one of R1, R2, R3 or R4 is NR5R6(R'(OH)2), where R5 and R6 are independently H, C1-8 straight-chain, branched-chain or cyclic alkyl, C2-8 straight-chain, branched-chain or cyclic alkenyl, or C2-8 straight-chain, branched-chain or cyclic alkynyl; R' is C2-8 straight-chain, branched-chain or cyclic alkyl; and R" is H or C1-8 straight-chain, branched-chain or cyclic alkyl.

[0372] In the compound of formula (I), NR5R6(R'(OH)2) is coordinated to the copper atom through the nitrogen atom of NR5R6(R'(OH)2). On the other hand, -O-(CO)-R" is covalently bonded to the copper atom through the oxygen atom. Preferably, one or two of R1, R2, R3, or R4 are NR5R6(R'(OH)2), and more preferably, two of R1, R2, R3, or R4 are NR5R6(R'(OH)2).

[0373] Preferably, R5 and R6 are independently H or C1-8 straight-chain, branched-chain, or cyclic alkyl, more preferably H or C1-8 straight-chain or branched-chain alkyl, even more preferably H or C1-4 straight-chain or branched-chain alkyl. Examples of C1-4 straight-chain or branched-chain alkyl are methyl, ethyl, n-propyl, i-propyl, n-butyl, s-butyl, and t-butyl. In a particularly preferred embodiment, R5 and R6 are H, methyl, or ethyl.

[0374] Preferably, R' is a C2-8 straight-chain or branched-chain alkyl, more preferably a C2-5 straight-chain or branched-chain alkyl. R' is preferably a straight-chain alkyl. In a particularly preferred embodiment, R' is propyl. In a given R' substituent, the OH group is preferably not bonded to the same carbon atom.

[0375] Preferably R" is H or a C1-4 straight-chain alkyl, more preferably H.

[0376] The copper precursor compound provides the remaining weight of the ink after accounting for copper nanoparticles, polymer binders, and any other inclusions in the ink. The copper precursor compound is preferably present in the ink in an amount of at least about 35 weight percent based on the total weight of the ink. The amount of the copper precursor compound may be at least about 45 weight percent or about 50 weight percent.

[0377] The polymer binder comprises a polyester, polyimide, polyetherimide, or any mixture thereof having a surface functional group that makes the polymer binder compatible with and / or soluble with the diol. Preferably, the surface functional group comprises a polar group capable of participating in hydrogen bonding. The surface functional group preferably comprises one or more of a hydroxyl group, a carboxyl group, an amino group, and a sulfonyl group. The polymer binder may be present in the ink in any suitable amount. Preferably, the polymer binder is present in the ink in an amount of about 0.04 wt% to 0.8 wt% based on the total weight of the ink. More preferably, the amount of the polymer binder is in the range of about 0.08 wt% to 0.6 wt%, much more preferably about 0.25 wt% to 1 wt%, even more preferably about 0.25 wt% to 0.4 wt%, for example, about 0.3 wt%.

[0378] The polymer binder preferably comprises a polyester. Suitable polyesters are commercially available or can be prepared by condensing a polyalcohol with a polycarboxylic acid and its respective anhydride. Preferred polyesters are hydroxyl and / or carboxyl functionalized. The polyester may be linear or branched. Solid or liquid polyesters and various solution forms may be utilized. In a particularly preferred embodiment, the polymer binder is a hydroxyl- and / or carboxyl-terminated polyester, e.g., Rokrapol TM Includes 7075.

[0379] The ink can be formulated by mixing copper nanoparticles, copper precursor molecules, and a polymer binder together. Mixing may be performed with or without an additional solvent. Preferably, the copper precursor molecules are liquid and can act as a solvent as well as a precursor for copper metal formation. However, in some embodiments, an additional solvent may be required. The additional solvent may comprise at least one aqueous solvent, at least one aromatic organic solvent, at least one non-aromatic organic solvent, or any mixture thereof, e.g., water, toluene, xylene, anisole, diethylbenzene, alcohol (e.g., methanol, ethanol), diol (e.g., ethylene glycol), triol (e.g., glycerol), or any mixture thereof. The additional solvent may comprise about 0.5% to 50% by weight, more preferably about 1% to 20% by weight, based on the total weight of the ink.

[0380] The ink can be formulated for any type of deposition, but the ink is particularly suitable for screen printing. In this regard, the ink preferably has a viscosity of about 1,500 cP or more, more preferably about 1,500 cP to 10,000 cP or 4,000 cP to 8,000 cP, for example, about 6,000 cP.

[0381] Referring to Table 12, an exemplary Cu ink comprises Cu formate; an organic amine compound; and fractional amounts of CuNPs (2.4% of the total amount of Cu in the ink) as a filler and a binder. Advantageously, the ink can be printed onto a low-temperature substrate and UV sintered to produce an electrically conductive trace on the low-temperature substrate while reducing or eliminating damage to the substrate. The sintering time is preferably 20 minutes or less, more preferably about 15 minutes or less. In one embodiment, the trace is sintered for about 1 to 15 minutes to obtain a conductive copper trace. In another embodiment, the trace is sintered for about 3 to 10 minutes to obtain a conductive copper trace. In yet another embodiment, the trace is sintered for about 8 to 10 minutes. The conductive trace produced by sintering the ink with broad-spectrum UV light has a trace morphology similar to that of the heat-treated sample and has similar electrical properties.

[0382] In this case, the reagent capable of assisting in the photoreduction of copper formate on PET and Kapton is an aminodiol, specifically (3-(diethylamino)-1,2-propanediol). UV sintering of Cu ink formulated with alkylamines (octylamine or ethyl-hexylamine) does not initiate photoreduction, and the trace turns black at prolonged exposure (about 30 minutes), suggesting oxidation of the Cu trace. These results suggest that aminodiols are particularly suitable for UV sintering (without the need for thermal protectants). The first advantage of aminodiols is that they lower the decomposition temperature of the Cu formate / aminodiol complex. Second, the hydroxyl groups of aminodiols prevent oxygen penetration and oxidation during sintering. Aminodiols exhibit greater tolerance to the presence of trace amounts of oxygen during sintering compared to other amine ligands.

[0383]

[0384] Example 14: UV-treated Ag trace generated from molecular ink

[0385] Thermoformed electronic products utilize an improved existing printing process that can produce final functional, lightweight, and inexpensive "parts" by printing functional ink onto a flat (2D) substrate, thermoforming it into a 3D shape, and then injection molding. The success of this process depends on whether the conductive ink survives thermoforming and whether the conductor withstands an elongation of more than 25% and a drawing depth of up to 1 cm (variation in the "z-direction") without significant loss or change in the measured resistance of the trace. In this example, the advantages of drying or curing a screen printing ink containing silver oxalate, 1-amino-2-propanol or a mixture of 1-amino-2-propanol / 2-aminobutanol (to dissolve the silver oxalate and reduce the decomposition temperature), a cellulose polymer (to act as a rheological modifier and binder), and dipropylene glycol monomethyl ether (to act as a solvent carrier) using broadband UV light are tested.

[0386] After screen printing ink onto an industrially relevant polycarbonate substrate, the resulting trace is treated with UV light and then thermoformed to sinter in situ (e.g., thermally), a conductive trace can be produced with a small increase in resistance to 11%, a low resistivity value of 14 μΩ·cm (5.4 mΩ / □ / mil), and a high local elongation of 25%. The ability to produce a functional trace after thermoforming enabled the development of a proof-of-concept 3D capacitive touch HMI interface driven by an external processor capable of illuminating three individually addressable LEDs (see Fig. 16).

[0387] The ink of Table 13 was prepared according to the method disclosed in WO 2018 / 146616, the full contents of which are incorporated herein. First, a cellulose polymer binder was dissolved in dipropylene glycol monomethyl ether to produce an ink carrier. After dissolving the cellulose polymer, a surface tension modifier, an antifoaming agent, and 1-amino-2-propanol (or a mixture of 1-amino-2-propanol and 2-aminobutanol) were added to the carrier and mixed in a centrifugal mixer for 2 minutes. Finally, silver oxalate was added to the carrier and mixed again in a centrifugal mixer to produce the ink. Thermogravimetric analysis (TGA) of the ink was performed, and the results showed that the silver metal content of the ink was approximately 23%. The viscosity of the ink was measured using a Brookfield DV3T rheometer equipped with an SC4-14 small sample adapter, and it was confirmed that it shears thinly under stress and has a viscosity of approximately 6000 cP.

[0388]

[0389] Molecular ink was screen printed onto an 8.5×11" sheet of Lexan 8010 (referred to as PC-8010) using an S-912M small format screen printer through a pattern optically imaged onto an MIM emulsion (22 to 24 µm) supported on an SS400 stainless steel mesh (MeshTec, Illinois). For samples processed via a DYMAX 5000 to EC series UV curing floodlight lamp system, the printed trace was placed on a platform 20 cm away from the lamp and exposed to UV light as soon as the lamp was turned on. The light energy measured from the lamp with an AccuXX photometer indicated an energy of 3.232 J / cm² per minute. For samples processed via a UV conveyor system, an American UV 6-foot double-lamp conveyor system (C12 / 300 / 2 12") was used. The conveyor is equipped with gallium and iron-doped halogen bulbs, and an intensity passing once under the lamp at 35 feet / min produces the light doses presented in Table 14.

[0390]

[0391] After formulating an oxalate-based molecular ink and screen printing it onto a Lexan 8010, the substrate is formed using a Formech thermoforming machine ( https: / / formechinc.com / product / 300xq / The substrate was mounted on a ) and heated to a temperature of 180°C to 190°C for 60 to 70 seconds to soften it. It is noted that when a silver oxalate-based trace is exposed to this temperature, a conductive trace is generated in place even during this short period of time. After softening, the PC substrate is placed on a template object (in this case, a dome-shaped ellipsoid) supported on a vacuum table and thermoformed, and when the substrate cools, the 3D shape is fixed to the substrate to create a 3D conductive silver trace.

[0392] Conductive traces cannot be produced by printing oxalate-based ink and immediately thermoforming it. In contrast, conductive thermoformed traces are produced by processing the printed traces using UV light from a flood lamp-based system (DYMAX 5000 to EC series UV curing flood lamp systems) or a dual-lamp UV conveyor system (American UV C12 / 300 / 2 12" conveyor equipped with gallium-doped and iron-doped metal halogen lamps).

[0393] Comparing the relative resistance of a thermoformed trace to a control trace exposed to the same conditions without a thermoforming step was performed by thermoforming a portion of the test trace and exposing the control portion of the test trace to the same UV treatment and thermal conditions, but without thermoforming the trace. As highlighted in Fig. 13, the trend line matching the resistance versus line width of the thermoformed trace (blue / darker circle and green / brighter circle) lies significantly above the resistance versus line width of the unthermoformed control trace (red / darker circle and yellow / brighter circle, respectively). The expected change in resistance after thermoforming is approximately 5% for the UV-treated trace (see Fig. 13).

[0394] Microscopic analysis of the traces elongated during the thermoforming process revealed that significant cracking occurred throughout the traces without UV treatment (bi, bii, and biii in Fig. 14), resulting in mostly non-conductive thermoforming traces. When silver oxalate ink is treated with UV light from a flood lamp-based system (ci, cii, and ciii in Fig. 14) or a dual lamp UV conveyor system (di, dii, and diii in Fig. 14), cracking of the traces is minimized, producing conductive 3D silver traces.

[0395] To determine the effect of UV treatment on the thermoforming ability of silver oxalate ink, UV-treated traces were analyzed by XRD. This analysis indicated that treating silver oxalate ink with UV light from both floodlights and UV conveyor systems initiated the conversion of silver salts into metallic silver. Further analysis of the UV-treated traces using a scanning electron microscope (SEM) revealed that UV treatment converted the molecular ink into silver nanoparticles (Fig. 15). The nanoparticles appear to have a smaller diameter when produced using a UV curing machine rather than the DYMAX 5000 to EC series UV curing floodlight system. This may be due to the fact that the UV conveyor system exposes the traces to a much higher dose of energy (UVV: 1.8 J / cm² / s, UVA: 0.9 J / cm² / s) over a shorter period compared to the floodlight system (3.2 J / cm² / min, 0.053 J / cm² / s). Such intense exposure to UV light can generate a large number of silver (0) atoms that nucleate a large number of small silver nanoparticles. SEM analysis of the thermoformed trace also suggests that the smaller silver nanoparticles produced by treating the trace with intense light generated from a UV conveyor are aggregated into a more interconnected network than the larger nanoparticles produced after UV treatment by a DYMAX flood lamp system. SEM analysis of the trace directly thermoformed without UV treatment revealed a non-uniform distribution of silver nanoparticles, with the trace mainly composed of small silver nanoparticles that are well connected to each other, but with many larger diameter particles that are not aggregated. The larger particles act as defects in the trace and are likely the sites where cracks occur when the trace is thermoformed (see Fig. 17). Rapid heating of the ink to 180°C to 190°C may lead to the formation of silver nanoparticles and the evaporation of the solvent / amine.Because silver oxalate salts are less soluble in carrier solvents and have a higher decomposition temperature, silver traces grow unevenly and contain nanoparticles that become cracked and non-conductive.

[0396] This data suggests that initiating the formation of these small nanoparticles through UV treatment is a factor in forming uniform, crack-free, conductive thermoformed traces. Both the DYMAX floodlight lamp system and the UV conveyor system can improve adhesion by exposing the trace to UVA light (320 nm to 395 nm) to cure deep regions of the trace. Additionally, the gallium-doped bulb UV conveyor system exposes the trace to UVV light that penetrates to the deepest regions of the trace near the ink / substrate interface.

[0397] The ability to generate uniform, crack-free, conductive silver circuits using UV treatment was demonstrated by fabricating a 3-button capacitive touch-based HMI (Human-Machine Interface) switch powered by an Arduino Micro with an MPR121 capacitive touch sensor breakout board. The board was designed to be 2D printed and then thermoformed into a 3D structure 1 cm high (Fig. 16). Unlike the linear trace study above, capacitive touch circuits are more complex when traces are printed with vertical and horizontal orientations. While UV treatment of the printed molecular ink can generate functional circuits, untreated traces tend to crack and become non-conductive. A summary of the results is presented in Table 15, where treatment using a UV curing machine and a DYMAX system produced traces with lower measured resistance compared to samples treated with a floodlight system (2.0 Ω / cm and 2.6 Ω / cm). Although subjected to the same processing conditions, the increase in relative resistance of the thermoformed trace compared to the non-thermoformed control trace is 10% and 20% for the UV conveyor and DYMAX systems, respectively. For the conductive thermoformed trace produced from silver oxalate-based ink, an LED was fixed to the trace using conductive silver epoxy and allowed to dry for several hours (Fig. 16a). As a result, a capacitive touch circuit with three individually addressable touch circuits was created, which lights up upon touch and demonstrates how 3D circuits can be generated from this combination of molecular ink, LED, and Arduino micro / capacitive touch breakout board. Thus, it has been proven that HMI switches (touch circuits) can be produced through industrial additive manufacturing processes (screen printing, thermoforming, and pick-and-place technology) and improved using industrial UV processing processes.

[0398] In addition, the performance of the molecular ink was compared with commercially available silver flake ink modified with an elastomeric polymer designed for thermoforming applications. As highlighted in Table 15, the measured resistance and resistivity of UV-treated and thermoformed traces produced from the molecular ink are superior to those of the non-thermoformed commercially available ink exposed to the same treatment conditions. It is also noteworthy that these performances are achieved with the molecular ink despite the fact that the molecular ink is approximately three times thinner than the traces produced from the commercially available flake ink. This is likely due to the fact that commercially available inks for thermoforming contain a large proportion of elastomeric polymer added to the formulation to promote elongation. The presence of this polymer improves the elongation of the trace while simultaneously reducing the resistivity of the resulting trace. In the case of the molecular ink presented here, elongation can be imparted using UV treatment, and since the addition of additional polymer is not required, the resistivity of the thermoformed trace remains low.

[0399]

[0400] In summary, the use of (polycarbonate) PC and commercially available screen-printable silver oxalate molecular ink can be integrated into the development of thermoformed electronics, where a simple UV treatment process enables traces to maintain conductivity even after being stretched up to 1.3 times, thereby allowing the development of 3D circuits from 2D printed sheets through relevant industrial manufacturing processes. The application of UV treatment can also be applied to injection molding processes; specifically, by enabling the sintering of the ink during the thermoforming process—where PC and similar substrates used for thermoforming are heated to higher temperatures to facilitate component forming—it allows the molecular ink to be integrated into injection-molded structures to create thermoformed circuits and other thermoformed electronics. This treatment method enables the development of more structurally complex devices and provides greater design freedom for producing human-machine interfaces in the automotive, aerospace, and consumer electronics industries.

[0401] Additionally, to summarize, Table 16 provides a comparative analysis of the performance of inks containing a mixture of silver-based molecular inks containing a mixture of amino alcohols after UV treatment on a polycarbonate substrate prior to thermoforming, and it is highlighted that without UV treatment, traces crack during the thermoforming process. UV sintering was performed using a DYMAX 5000 to EC series UV curing floodlight lamp system, and curing was performed using an American UV C12 / 300 / 2 12" conveyor with gallium-doped and iron-doped halogen lamps.

[0402]

[0403] Although this application has been described with reference to what is currently considered to be a preferred example, it is understood that this application is not limited to the disclosed example. Otherwise, this application is intended to include various modifications and equivalent arrangements contained within the spirit and scope of the appended claims. All publications, patent documents, and patent application documents are incorporated into this specification as specifically and individually described so that the entire contents of each individual publication, patent document, or patent application document are incorporated herein. Where it is found that a term of this application is defined differently in a document incorporated herein, the definition provided herein shall be used as the definition for such term.

Claims

Claim 1 A method for manufacturing an overmolded printed electronic component, comprising: a step of depositing a low-temperature molecular ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate; a step of sintering the non-conductive trace of the ink on the substrate to form a conductive trace on the first surface of the substrate; a step of injecting an overmolding resin or a precursor onto the conductive trace on the first surface of the substrate; and a step of curing the overmolding resin or curing the precursor to obtain the overmolded printed electronic component. Claim 2 A method for manufacturing an overmolded printed electronic component according to claim 1, wherein, after depositing the low-temperature molecular ink and before sintering the non-conductive trace, the method further comprises the step of thermoforming the substrate to obtain a molded substrate. Claim 3 A method for manufacturing an overmolded printed electronic component according to claim 1, wherein, after sintering the non-conductive trace and before injecting the overmolding resin or precursor, the method further comprises the step of thermoforming the substrate to obtain a molded substrate. Claim 4 A method for manufacturing an overmolded printed electronic component according to claim 2, wherein, prior to thermoforming the substrate, the method further comprises the step of bonding one or more electronic components to a first surface of the substrate, wherein the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors. Claim 5 A method for manufacturing an overmolded printed electronic component, wherein, prior to thermoforming the substrate, the method further comprises the step of bonding one or more electronic components to a first surface of the substrate, wherein the one or more electronic components are selected from diodes, light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), integrated wiring connectors, basic electrical hardware, integrated chips, resistors, capacitors, transistors, and ultrasonic sensors. Claim 6 A method for manufacturing an overmolded printed electronic component according to claim 1, wherein, after thermoforming the substrate and before injecting the overmolding resin or precursor, the method further comprises the step of introducing a glass fiber reinforcing layer on a first surface of the substrate. Claim 7 A method for manufacturing an overmolded printed electronic component according to claim 1, wherein, prior to depositing the low-temperature molecular ink, the method further comprises the step of depositing one or more decorative inks on a first surface of the substrate. Claim 8 A method for manufacturing an overmolded printed electronic component according to claim 1, wherein the method further comprises the step of depositing a dielectric ink on a first surface of the substrate before or after depositing the low-temperature molecular ink and before sintering the non-conductive trace or optionally thermoforming the substrate. Claim 9 A method for manufacturing an overmolded printed electronic component according to claim 1, wherein the method comprises the step of repeating the deposition of the low-temperature molecular ink on the substrate to obtain a plurality of layers of conductive traces. Claim 10 A method for manufacturing an overmolded printed electronic component, wherein, in any one of claims 2 to 9, after thermoforming the substrate, the method further comprises the step of applying a UV-curable hard coating to a second surface of the substrate. Claim 11 A method for manufacturing an overmolded printed electronic component according to any one of claims 1 to 9, wherein the substrate comprises polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), glycol modified polyethylene terephthalate (PET-G), polyolefin, polydimethylsiloxane (PDMS), polystyrene, polycarbonate, polyimide, thermoplastic polyurethane (TPU), silicone film, polycarbonate-acrylonitrile butadiene styrene (ABS) blend, acrylonitrile butadiene styrene (ABS), thermoplastic olefin (TPO), polyphenylene sulfide (PPS), polybenzimidazole (PBI), polypropylene polybenzyl isocyanate (PPI), polyether ether ketone (PEEK), or polyvinylidene fluoride (PVDF). Claim 12 A method for manufacturing an overmolded printed electronic component according to any one of claims 1 to 9, wherein the low-temperature molecular ink comprises a silver carboxylate; an organic amine compound; an organic polymer binder; a surface tension regulator; and a solvent, wherein the overmolding resin is a thermoplastic resin; and the precursor for the overmolding resin is a precursor for a thermosetting resin. Claim 13 A method for manufacturing an overmolded printed electronic component according to any one of claims 1 to 9, wherein the sintering comprises photo-sintering, thermal sintering, or UV sintering. Claim 14 A method for manufacturing an overmolded printed electronic component according to any one of claims 1 to 9, wherein the low-temperature molecular ink or conductive trace ink comprises silver carboxylate or copper carboxylate and an organic amine compound. Claim 15 In paragraph 14, the above silver carboxylate is C 1-10 It is an alkanate, or the copper carboxylate is C 1-12 Method for manufacturing overmolded printed electronic components, which are alkanates. Claim 16 A method for manufacturing an overmolded printed electronic component according to any one of claims 1 to 9, wherein the non-conductive trace is treated with broadband UV light before sintering or curing. Claim 17 An overmolded printed electronic component comprising: a conductive trace bonded to a first surface of a substrate; and a thermosetting resin overmolded over the conductive trace bonded to the first surface of the substrate, wherein the conductive trace is a conductive silver trace made of a low-temperature molecular ink, and the low-temperature molecular ink comprises a silver carboxylate; an organic amine compound; an organic polymer binder; a surface tension modifier; and a solvent. 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