Thermoelectric device and thermoelectric system comprising the same

Abstract

A thermoelectric module array according to one embodiment of the present invention comprises a first thermoelectric module and a second thermoelectric module disposed adjacent to the first thermoelectric module, wherein the first thermoelectric module comprises a first lower substrate, a first semiconductor device portion disposed in an effective area of ​​the first lower substrate, and a first upper substrate disposed on the first semiconductor device portion, and the second thermoelectric module comprises a second lower substrate, a second semiconductor device portion disposed in an effective area of ​​the second lower substrate, and a second upper substrate disposed on the second semiconductor device portion, wherein a first groove in the shape of a semicircle is formed on one outer edge of the first lower substrate, and a second groove in the shape of a semicircle is formed on one outer edge of the second lower substrate facing the outer edge of the first lower substrate, wherein the first groove and the second groove form a first hole, and the first hole is formed so as not to penetrate the effective area of ​​the first lower substrate and the effective area of ​​the second lower substrate.

Description

Technology Field

[0001] The present invention relates to a thermoelectric device, and more specifically, to a thermoelectric device utilizing a temperature difference between a low-temperature part and a high-temperature part of a thermoelectric element, and a thermoelectric system including the same. Background Technology

[0002] Thermoelectricity is a phenomenon caused by the movement of electrons and holes within a material, referring to the direct energy conversion between heat and electricity.

[0003] Thermoelectric devices are a general term for devices that utilize the thermoelectric phenomenon, and they have a structure in which a PN junction pair is formed by joining a P-type thermoelectric material and an N-type thermoelectric material between metal electrodes.

[0004] Thermoelectric devices can be classified into devices that utilize the temperature change of electrical resistance, devices that utilize the Seebeck effect, a phenomenon in which an electromotive force is generated by a temperature difference, and devices that utilize the Peltier effect, a phenomenon in which endothermic or exothermic reactions occur due to an electric current.

[0005] Thermoelectric devices are being applied in a wide variety of fields, including home appliances, electronic components, and communication parts. For instance, thermoelectric devices can be used in cooling devices, heating devices, and power generation devices. Consequently, the demand for the thermoelectric performance of thermoelectric devices is steadily increasing.

[0006] Recently, there is a need to generate electricity using high-temperature thermoelectric elements in applications such as automobiles and ships. In this case, a fluid flow section through which a first fluid passes is disposed on the low-temperature side of the thermoelectric element, and a heatsink is disposed on the high-temperature side of the thermoelectric element, allowing a second fluid, which is hotter than the first fluid, to pass through the heatsink. Accordingly, electricity can be generated due to the temperature difference between the low-temperature and high-temperature sides of the thermoelectric element. The problem to be solved

[0007] The technical problem to be solved by the present invention is to provide a thermoelectric device that utilizes the temperature difference between the low-temperature and high-temperature parts of a thermoelectric element and a thermoelectric system including the same. means of solving the problem

[0008] A thermoelectric module array according to one embodiment of the present invention comprises a first thermoelectric module and a second thermoelectric module disposed adjacent to the first thermoelectric module, wherein the first thermoelectric module comprises a first lower substrate, a first semiconductor device portion disposed in an effective area of ​​the first lower substrate, and a first upper substrate disposed on the first semiconductor device portion, and the second thermoelectric module comprises a second lower substrate, a second semiconductor device portion disposed in an effective area of ​​the second lower substrate, and a second upper substrate disposed on the second semiconductor device portion, wherein a first groove in the shape of a semicircle is formed on one outer edge of the first lower substrate, and a second groove in the shape of a semicircle is formed on one outer edge of the second lower substrate facing the outer edge of the first lower substrate, wherein the first groove and the second groove form a first hole, and the first hole is formed so as not to penetrate the effective area of ​​the first lower substrate and the effective area of ​​the second lower substrate.

[0009] A single fastening member may be configured to simultaneously fix the first thermoelectric module and the second thermoelectric module through the first hole.

[0010] The apparatus further includes a frame disposed on the first lower substrate and the second lower substrate, wherein the frame includes a first opening through which the first upper substrate penetrates, a second opening through which the second upper substrate penetrates, and a second hole formed between the first opening and the second opening and smaller than the first opening and the second opening, and the second hole may be vertically superimposed with the first hole.

[0011] The above fastening member can penetrate the first hole and the second hole.

[0012] The head of the above-mentioned fastening member may be positioned on the upper edge of the second hole.

[0013] The first thermoelectric module and the second thermoelectric module are arranged along a first direction, and each of the first thermoelectric module and the second thermoelectric module may have a length in a second direction perpendicular to the first direction that is longer than the length in the first direction.

[0014] The first thermoelectric module comprises a first-1 electrode portion disposed on the first lower substrate, a first-2 electrode portion disposed on the first lower substrate and spaced apart from the first-1 electrode portion along the second direction, and a first connecting electrode extending along the second direction and connecting the first-1 electrode portion and the first-2 electrode portion, and the second thermoelectric module comprises a second-1 electrode portion disposed on the second lower substrate, a second-2 electrode portion disposed on the second lower substrate and spaced apart from the second-1 electrode portion along the second direction, and a second connecting electrode extending along the second direction and connecting the second-1 electrode portion and the second-2 electrode portion, and the first connecting electrode, the first hole, and the second connecting electrode may be disposed to overlap along the second direction.

[0015] The first semiconductor device portion includes first-1 semiconductor devices disposed on the first-1 electrode portion and first-2 semiconductor devices disposed on the first-2 electrode portion, and the second semiconductor device portion includes second-1 semiconductor devices disposed on the second-1 electrode portion and second-2 semiconductor devices disposed on the second-2 electrode portion, and the first upper substrate includes a first-1 upper substrate disposed on the first-1 semiconductor devices and a first-2 upper substrate disposed on the first-1 semiconductor devices, and the second upper substrate includes a second-1 upper substrate disposed on the second-1 semiconductor devices and a second-2 upper substrate disposed on the second-1 semiconductor devices, and the region enclosed by one corner of the first-1 upper substrate, one corner of the first-2 upper substrate, one corner of the second-1 upper substrate and one corner of the second-2 upper substrate may overlap perpendicularly with the first hole.

[0016] The apparatus further comprises a frame disposed on the first lower substrate and the second lower substrate, wherein the frame includes a first opening through which the first-1 upper substrate penetrates, a second opening through which the first-2 upper substrate penetrates, a third opening through which the second-1 upper substrate penetrates, a fourth opening through which the second-2 upper substrate penetrates, and a second hole formed between the first to fourth openings and smaller than the first to fourth openings, wherein the second hole may be vertically superimposed with the first hole.

[0017] A single fastening member may be configured to simultaneously fix the first thermoelectric module and the second thermoelectric module through the first hole and the second hole.

[0018] The head of the above-mentioned fastening member can be positioned at the edge of the second hole.

[0019] The first thermoelectric module further includes a first extension electrode and a second extension electrode extending from the first-2 electrode portion along the second direction, and the second thermoelectric module further includes a third extension electrode and a fourth extension electrode extending from the second-2 electrode portion along the second direction, and a connector may be disposed on each of the first to fourth extension electrodes. Effects of the invention

[0020] According to an embodiment of the present invention, a thermoelectric device can be obtained that has a simple structure, is easy to assemble, and can accommodate a maximum number of thermoelectric elements within a predetermined space.

[0021] According to an embodiment of the present invention, a thermoelectric device with high thermoelectric performance can be obtained by increasing the temperature difference between the high-temperature part and the low-temperature part.

[0022] The thermoelectric device according to an embodiment of the present invention can be applied to a power generation device that generates electricity using the temperature difference between a high-temperature part and a low-temperature part.

[0023] The thermoelectric device according to an embodiment of the present invention can be applied to a Peltier device that cools or heats a specific object, such as a fluid. Brief explanation of the drawing

[0024] FIG. 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of a thermoelectric device according to one embodiment of the present invention. FIGS. 3 to 4 are thermoelectric elements according to one embodiment of the present invention. FIG. 5 is a perspective view of a fluid flow section included in a thermoelectric device according to one embodiment of the present invention. FIG. 6 is a cross-sectional view of a fluid flow section according to one embodiment of the present invention. FIGS. 7 and 8 are partially enlarged views of a cross-section of a fluid flow section according to one embodiment of the present invention. FIG. 9 is a perspective view of a thermoelectric module according to one embodiment of the present invention. FIG. 10 is a plan view of a thermoelectric module according to one embodiment of the present invention. FIG. 11 is an exploded perspective view of a thermoelectric module according to one embodiment of the present invention. FIG. 12 is the shape of an electrode portion disposed on a lower substrate of a thermoelectric module according to one embodiment of the present invention. FIG. 13 is a plan view of a frame included in a thermoelectric module according to one embodiment of the present invention. FIG. 14 is a plan view of an insulating member included in a thermoelectric module according to one embodiment of the present invention. Figure 15 is a graph showing insulation resistance according to insulation distance. FIGS. 16 to 23 are drawings illustrating the process of assembling a shield member to a thermoelectric device according to one embodiment of the present invention. FIG. 24 is a cross-sectional view of a thermoelectric device according to one embodiment of the present invention with a shield member assembled thereto. FIG. 25 is a perspective view of a thermoelectric device according to one embodiment of the present invention with the third shield member removed. FIG. 26 is a thermoelectric system according to one embodiment of the present invention. FIGS. 27 to 29 are drawings illustrating the process of assembling a wiring protection unit into a thermoelectric system according to one embodiment of the present invention. FIG. 30 is a perspective view of an upper structure included in a thermoelectric system according to one embodiment of the present invention. FIG. 31 is a perspective view of a thermoelectric system according to another embodiment of the present invention. FIGS. 32 and 33 are drawings illustrating the process of assembling a wiring protection unit into a thermoelectric system according to another embodiment of the present invention. FIG. 34 is a perspective view of an upper structure included in a thermoelectric system according to another embodiment of the present invention. Specific details for implementing the invention

[0025] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0026] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0027] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0028] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0029] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0030] In addition, terms such as first, second, A, B, (a), (b), etc. may be used to describe the components of the embodiments of the present invention.

[0031] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0032] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0033] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0034] FIG. 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view of a thermoelectric device according to one embodiment of the present invention.

[0035] Referring to FIGS. 1 and 2, the thermoelectric device (1000) includes a fluid flow section (1100) and a thermoelectric module (1200) disposed on the surface of the fluid flow section (1100).

[0036] A thermoelectric device (1000) according to an embodiment of the present invention can generate power by utilizing the temperature difference between a first fluid flowing through the interior of a fluid flow section (1100) and a second fluid passing through the exterior of the fluid flow section (1100). A plurality of thermoelectric devices (1000) may be arranged in parallel so as to be spaced apart at a predetermined interval to form a thermoelectric system. Accordingly, thermoelectric performance or power generation performance per unit area can be maximized. A thermoelectric device may be referred to as a power generation device, and a thermoelectric system may be referred to as a power generation system.

[0037] The first fluid flowing into the fluid flow section (1100) may be water, but is not limited thereto, and may be various types of fluids having cooling performance. The temperature of the first fluid flowing into the fluid flow section (1100) may be less than 100°C, preferably less than 50°C, more preferably less than 40°C, but is not limited thereto, and may be a fluid having a lower temperature than the second fluid. The temperature of the first fluid discharged after passing through the fluid flow section (1100) may be higher than the temperature of the first fluid flowing into the fluid flow section (1100).

[0038] According to an embodiment of the present invention, a thermoelectric module (1200) may be disposed on a first surface (1110) of a fluid flow section (1100) and a second surface (1120) facing the first surface (1110). A first fluid may flow from a side surface (1150) between the first surface (1110) and the second surface (1120) toward another side surface (1160) facing the side surface (1150) between the first surface (1110) and the second surface (1120). To this end, a fluid inlet may be disposed on the first side surface, and a fluid outlet may be disposed on the other side surface. A second fluid may flow from a fourth surface (1140), which is an upper surface between the first surface (1110) and the second surface (1120), toward a third surface (1130), which is a lower surface between the first surface (1110) and the second surface (1120). For convenience of explanation, the direction from the first surface (1110) toward the second surface (1120) may be referred to as the first direction in this specification, the direction through which the first fluid passes may be referred to as the second direction, and the direction through which the second fluid passes may be referred to as the third direction, but is not limited thereto.

[0039] Meanwhile, the second fluid passes through the outside of the fluid flow section (1100), for example, the heat sink of the thermoelectric module (1200) placed outside the fluid flow section (1100). The second fluid may be exhaust heat or intake heat from an automobile, a ship, etc., but is not limited thereto. For example, the temperature of the second fluid may be 100°C or higher, preferably 200°C or higher, more preferably 220°C to 250°C, but is not limited thereto, and may be a fluid having a temperature higher than that of the first fluid.

[0040] In this specification, the temperature of the first fluid flowing through the interior of the fluid flow section (1100) is described as being lower than the temperature of the second fluid passing through the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100). Accordingly, in this specification, the fluid flow section (1100) may be referred to as a duct or a cooling section. However, embodiments of the present invention are not limited thereto, and the temperature of the first fluid flowing through the interior of the fluid flow section (1100) may be higher than the temperature of the second fluid passing through the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100).

[0041] According to an embodiment of the present invention, the thermoelectric module (1200) includes a thermoelectric element and a heat sink (1220) disposed on the thermoelectric element. The thermoelectric element according to an embodiment of the present invention may have the structure of the thermoelectric element (100) illustrated in FIGS. 3 and 4.

[0042] Referring to FIGS. 3 and 4, the thermoelectric element (100) includes a first substrate (110), a first electrode portion (120), a P-type semiconductor element (130), an N-type semiconductor element (140), a second electrode portion (150), and a second substrate (160).

[0043] A first electrode portion (120) is disposed between the first substrate (110) and the lower bottom surface of the P-type semiconductor device (130) and the N-type semiconductor device (140), and a second electrode portion (150) is disposed between the second substrate (160) and the upper bottom surface of the P-type semiconductor device (130) and the N-type semiconductor device (140). Accordingly, a plurality of P-type semiconductor devices (130) and a plurality of N-type semiconductor devices (140) are electrically connected by the first electrode portion (120) and the second electrode portion (150). A pair of P-type semiconductor devices (130) and N-type semiconductor devices (140) disposed between the first electrode portion (120) and the second electrode portion (150) and electrically connected can form a unit cell.

[0044] For example, when voltage is applied to the first electrode part (120) and the second electrode part (150) through the lead wires (181, 182), the substrate through which current flows from the P-type semiconductor device (130) to the N-type semiconductor device (140) absorbs heat and acts as a cooling part due to the Peltier effect, and the substrate through which current flows from the N-type semiconductor device (140) to the P-type semiconductor device (130) heats up and acts as a heating part. Alternatively, if a temperature difference is applied between the first electrode part (120) and the second electrode part (150), charges within the P-type semiconductor device (130) and the N-type semiconductor device (140) move due to the Seebeck effect, and electricity may be generated.

[0045] Here, the P-type semiconductor device (130) and the N-type semiconductor device (140) may be bismuth telluride (Bi-Te) semiconductor devices comprising bismuth (Bi) and tellurium (Te) as main raw materials. The P-type semiconductor device (130) may be a bismuth telluride (Bi-Te) thermoelectric leg comprising at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type semiconductor device (130) may contain 99 to 99.999 wt% of Bi-Sb-Te, which is the main raw material, based on 100 wt% of the total weight, and may contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) in an amount of 0.001 to 1 wt%. The N-type semiconductor device (140) may be a bismuth telluride (Bi-Te) thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the N-type semiconductor device (140) may contain 99 to 99.999 wt% of Bi-Se-Te, which is a main raw material, based on 100 wt% of total weight, and may contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga) and indium (In) in an amount of 0.001 to 1 wt%.

[0046] The P-type semiconductor device (130) and the N-type semiconductor device (140) can be formed in a bulk or stacked form. Generally, the bulk P-type semiconductor device (130) or the bulk N-type semiconductor device (140) can be obtained by a process of heat-treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for thermoelectric legs, sintering the powder, and cutting the sintered body. At this time, the P-type semiconductor device (130) and the N-type semiconductor device (140) may be polycrystalline thermoelectric legs. In this way, when the P-type semiconductor device (130) and the N-type semiconductor device (140) are polycrystalline thermoelectric legs, the strength of the P-type semiconductor device (130) and the N-type semiconductor device (140) can be increased. A stacked P-type semiconductor device (130) or a stacked N-type semiconductor device (140) can be obtained by forming unit members by applying a paste containing a thermoelectric material onto a sheet-shaped substrate, and then stacking and cutting the unit members.

[0047] At this time, a pair of P-type semiconductor devices (130) and N-type semiconductor devices (140) may have the same shape and volume, or different shapes and volumes. For example, since the electrical conductivity characteristics of the P-type semiconductor device (130) and the N-type semiconductor device (140) are different, the height or cross-sectional area of ​​the N-type semiconductor device (140) may be formed differently from the height or cross-sectional area of ​​the P-type semiconductor device (130).

[0048] At this time, the P-type semiconductor device (130) or the N-type semiconductor device (140) may have a cylindrical shape, a polygonal column shape, an elliptical column shape, etc.

[0049] In this specification, the semiconductor device may be referred to as a thermoelectric leg, a thermoelectric structure, a semiconductor structure, etc.

[0050] The performance of a thermoelectric element according to one embodiment of the present invention can be expressed as a figure of merit (ZT). The figure of merit (ZT) can be expressed as Equation 1.

[0051]

[0052] Here, α is the Seebeck coefficient [V / K], σ is the electric conductivity [S / m], and α 2 σ is the power factor (Power Factor, [W / mK 2 ...is. And, T is temperature, and k is thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, and a is thermal diffusivity [cm² 2 / S], cp is specific heat [J / gK], and ρ is density [g / cm³]. 3 ]am.

[0053] To obtain the thermoelectric performance index of a thermoelectric element, the Z value (V / K) is measured using a Z meter, and the thermoelectric performance index (ZT) can be calculated using the measured Z value.

[0054] Here, the first electrode portion (120) disposed between the first substrate (110) and the P-type semiconductor device (130) and the N-type semiconductor device (140), and the second electrode portion (150) disposed between the second substrate (160) and the P-type semiconductor device (130) and the N-type semiconductor device (140) comprise at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and may have a thickness of 0.01 mm to 0.3 mm. If the thickness of the first electrode portion (120) or the second electrode portion (150) is less than 0.01 mm, the function as an electrode is reduced and the electrical conductivity performance may be lowered, and if it exceeds 0.3 mm, the conductivity efficiency may be lowered due to an increase in resistance.

[0055] Additionally, the mutually facing first substrate (110) and second substrate (160) may be metal substrates, and their thickness may be 0.1 mm to 1.5 mm. If the thickness of the metal substrate is less than 0.1 mm or exceeds 1.5 mm, the heat dissipation characteristics or thermal conductivity may become excessively high, which may reduce the reliability of the thermoelectric element. Furthermore, when the first substrate (110) and the second substrate (160) are metal substrates, an insulating layer (170) may be further formed between the first substrate (110) and the first electrode portion (120) and between the second substrate (160) and the second electrode portion (150), respectively. The insulating layer (170) may include a material having a thermal conductivity of 1 to 20 W / mK. At this time, the insulating layer (170) may be a resin composition comprising at least one of epoxy resin and silicone resin and an inorganic material, a layer made of a silicone composite comprising silicone and an inorganic material, or an aluminum oxide layer. Here, the inorganic material may be at least one of oxides, nitrides, and carbides of aluminum, boron, silicon, etc.

[0056] Each insulating layer (170) may be a single insulating layer or multiple insulating layers of different compositions. At least a portion of at least one side of the first electrode portion (120) and the second electrode portion (150) is embedded in the insulating layer (170), and the upper surface of the insulating layer (170) disposed between the multiple electrodes included in each electrode portion may have a concave shape toward each substrate. When each insulating layer (170) is a multiple insulating layer, at least a portion of at least one side of the first electrode portion (120) and the second electrode portion (150) is embedded in the insulating layer (170) disposed at the top relative to each substrate, and the upper surface of the insulating layer (170) disposed between the multiple electrodes included in each electrode portion may have a concave shape toward each substrate.

[0057] At this time, the sizes of the first substrate (110) and the second substrate (160) may be formed differently. That is, the volume, thickness, or area of ​​one of the first substrate (110) and the second substrate (160) may be formed to be larger than the volume, thickness, or area of ​​the other. Here, the thickness may be the thickness in the direction from the first substrate (110) toward the second substrate (160), and the area may be the area in the direction perpendicular to the direction from the first substrate (110) toward the second substrate (160). Accordingly, the heat absorption performance or heat dissipation performance of the thermoelectric element can be increased. Preferably, the volume, thickness, or area of ​​the first substrate (110) may be formed to be larger than at least one of the volume, thickness, or area of ​​the second substrate (160). At this time, when the first substrate (110) is placed in a high-temperature region for the Seebeck effect, when applied as a heat-generating region for the Peltier effect, or when a sealing member for protection from the external environment of the thermoelectric element is placed on the first substrate (110), at least one of the volume, thickness, or area can be made larger than that of the second substrate (160). At this time, the area of ​​the first substrate (110) can be formed in a range of 1.2 to 5 times the area of ​​the second substrate (160). If the area of ​​the first substrate (110) is formed to be less than 1.2 times that of the second substrate (160), the effect on improving heat transfer efficiency is not high, and if it exceeds 5 times, the heat transfer efficiency is significantly reduced, and it may be difficult to maintain the basic shape of the thermoelectric module.

[0058] Additionally, a heat dissipation pattern, such as an uneven pattern, may be formed on at least one surface of the first substrate (110) and the second substrate (160). Accordingly, the heat dissipation performance of the thermoelectric element can be improved. When the uneven pattern is formed on the surface in contact with the P-type semiconductor element (130) or the N-type semiconductor element (140), the bonding characteristics between the semiconductor element and the substrate can also be improved.

[0059] Although not illustrated, a sealing member may be further disposed between the first substrate (110) and the second substrate (160). The sealing member may be disposed on the side of the first electrode portion (120), the P-type semiconductor device (130), the N-type semiconductor device (140), and the second electrode portion (150) between the first substrate (110) and the second substrate (160). Accordingly, the first electrode portion (120), the P-type semiconductor device (130), the N-type semiconductor device (140), and the second electrode portion (150) can be sealed from external moisture, heat, contamination, etc.

[0060] Referring again to FIGS. 1 and 2, a thermoelectric module (1200) may be disposed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively.

[0061] As described above, each thermoelectric element comprises a first substrate (110) disposed to contact a fluid flow portion (1100), a first electrode portion (120) disposed on the first substrate (110), a plurality of semiconductor elements (130, 140) disposed on the first electrode portion (120), a second electrode portion (150) disposed on the plurality of semiconductor elements (130, 140), and a second substrate (160) disposed on the second electrode portion (150), and a heat sink (1220) disposed on the second substrate (160). At this time, the first substrate of the thermoelectric element disposed on the fluid flow portion (1100) may be a metal substrate, and the metal substrate may be bonded to the surface of the fluid flow portion (1100) by a thermal interface material (TIM, not shown). Since the metal substrate has excellent heat transfer performance, heat transfer between the thermoelectric element and the fluid flow section (1100) is facilitated. Additionally, if the metal substrate and the fluid flow section (1100) are bonded by a thermal interface material (TIM), heat transfer between the metal substrate and the fluid flow section (1100) may not be hindered. Here, the metal substrate may be one of a copper substrate, an aluminum substrate, and a copper-aluminum substrate, but is not limited thereto.

[0062] The thermoelectric module (1200) may include a connector for applying electricity to extract the generated electricity to the outside or to use it as a Peltier. According to an embodiment of the present invention, an insulating member (900) may be placed around the connector to maintain a uniform bonding force between the thermoelectric module (1200) and the fluid flow part (1100) and to protect the wiring (W) connected to the connector.

[0063] In addition, according to an embodiment of the present invention, a shield member (1500) may be further disposed to prevent moisture or contaminants from penetrating into the thermoelectric module (1200).

[0064] FIG. 5 is a perspective view of a fluid flow section included in a thermoelectric device according to one embodiment of the present invention, FIG. 6 is a cross-sectional view of a fluid flow section according to one embodiment of the present invention, and FIG. 7 to 8 are partially enlarged views of a cross-section of a fluid flow section according to one embodiment of the present invention.

[0065] Referring to FIGS. 5 to 8, the fluid flow section (1100) includes a flow path area (500) comprising a flow path (502) formed along a second direction perpendicular to a first direction from a first surface (1110) of the fluid flow section (1100) toward a second surface (1120), a fluid inlet area (510) disposed on one side of the flow path area (500) comprising a first hole (512) formed along the second direction, and a fluid outlet area (520) disposed on the other side of the flow path area (500) comprising a second hole (522) formed along the second direction. Here, the fluid flow area (500) includes a plurality of fluid flow paths (502) parallel along the second direction, the fluid inflow area (510) includes a plurality of first holes (512) parallel along the second direction, and the fluid discharge area (520) includes a plurality of second holes (522) parallel along the second direction, and each fluid flow path (502) may be arranged to correspond to each first hole (512) and each second hole (522). A first fluid introduced into the first hole (512) may pass through the fluid flow path (502) along the second direction and then be discharged through the second hole (522). To this end, a connecting member (not shown) is disposed in the first hole (512), and the fluid flow section (1100) may be connected to the outside through the connecting member. The connecting member is in the shape of a hollow tube, a part of which is fitted into the first hole (512), and the remaining part of the fluid flow section (1100). One side (1150) may protrude outside. The first fluid is supplied from the outside through a connecting member and can be delivered to the flow path (502) after passing through the connecting member fitted into the first hole (512). Likewise, a connecting member (not shown) is disposed in the second hole (522), and the fluid flow section (1100) can be connected to the outside through the connecting member. The connecting member is in the shape of a hollow tube, with a portion fitted into the second hole (522) and the remaining portion protruding outside the other side (1160) of the fluid flow section (1100). After passing through the flow path (502), the first fluid can be discharged to the outside through the connecting member fitted into the second hole (522).The connecting member may also be referred to as a connecting pipe. In this way, when the thermoelectric device according to an embodiment of the present invention is connected to an external component through the connecting member, the use of fastening members such as screws can be minimized.

[0066] According to an embodiment of the present invention, the cross-sectional area of ​​each first hole (512) may be larger than the cross-sectional area of ​​each flow path (502). Here, the cross-sectional area may be defined as the area of ​​the cross-section perpendicular to the second direction in which the first fluid flows. Accordingly, when a connecting member is fitted into the first hole (512), the cross-sectional area of ​​the connecting member and the cross-sectional area of ​​the flow path (502) may be 0.8 to 1.2 times, 0.85 to 1.15 times, 0.9 to 1.1 times, 0.95 to 1.05 times, 0.97 to 1.03 times, or 0.99 to 1.01 times, and the resistance of the first fluid flowing along the second direction may be minimized.

[0067] Here, the first hole (512) and the flow path (502) are shown as being matched one-to-one, and the flow path (502) and the second hole (522) are shown as being matched one-to-one, but are not limited thereto. According to another embodiment of the present invention, fluid passing through a plurality of first holes (512) may be collected in one flow path, and fluid passing through one flow path may be dispersed into a plurality of second holes (522).

[0068] According to an embodiment of the present invention, the fluid flow section (1100) further includes a first stepped section (530) disposed between the first hole (512) and the flow path (502). According to an embodiment of the present invention, the first stepped section (530) includes a first stepped surface (532) and a first chamfered surface (534) that extends inclinedly from the first stepped surface (532) toward the flow path (502). Here, the first stepped surface (532) may be a surface parallel to a surface perpendicular to the second direction in which the first fluid flows. That is, the first stepped surface (532) may be a surface protruding from the wall surface of the first hole (512). The first stepped surface (532) may come into contact with the end of a connecting member (not shown) fitted into the first hole (512), and thus may function as a stopper for the connecting member. According to this, when a connecting member is assembled with a fluid flow member (1100) according to an embodiment of the present invention, when the end of the connecting member comes into contact with the first stepped surface (532), the connecting member stops being inserted into the interior of the fluid flow member (1100), thus making assembly easier and increasing the bonding force between the connecting member and the fluid flow member (1100).

[0069] At this time, the height (532h) of the first step surface (532) may be 1mm or more from the wall surface of the first hole (512). The height (532h) of the first step surface (532) may be less than or equal to the thickness of the connecting member, which is a hollow tube shape, for example, 0.5 to 1 times the thickness of the connecting member. According to this, the first step surface (532) can maintain the function of a stopper of the connecting member, while the flow of the first fluid can not be obstructed by the first step surface (532). According to this, the vortex phenomenon of the first fluid caused by the first step surface (532) can be prevented.

[0070] According to an embodiment of the present invention, the first chamfered surface (534) is a surface that extends obliquely from the first stepped surface (532) toward the flow path (502), and the first fluid discharged from the connecting member fitted into the first hole (512) can flow into the flow path (502) without flow path resistance through the first chamfered surface (534). The first chamfer surface (534) can form an angle (θ) of 5 to 85 degrees, 10 to 80 degrees, 15 to 75 degrees, 20 to 70 degrees, 25 to 65 degrees, 30 to 60 degrees, 35 to 55 degrees, 40 to 50 degrees, 40 to 85 degrees, 45 to 85 degrees, 50 to 85 degrees, 55 to 85 degrees, 60 to 85 degrees, 65 to 85 degrees, 70 to 85 degrees, and 75 to 85 degrees with respect to a surface perpendicular to the first step surface (532). According to this, the first fluid discharged from the connecting member can flow into the flow path (502) without a change in flow velocity.

[0071] At this time, the length (534L) of the first chamfered surface (534) may be at least three times the height (532h) of the first stepped surface (532). The length (534L) of the first chamfered surface (534) may be at least 60% of the inner diameter of the connecting member. According to this, the first fluid can flow into the flow path (502) without flow path resistance through the first chamfered surface (534), and the thickness of the first direction of the fluid flow section (1100) in the flow path area (500) can be implemented to be thinner.

[0072] Likewise, the fluid flow section (1100) further includes a second stepped section (540) positioned between the flow path (502) and the second hole (522). Here, although the description focuses on the first stepped section (530), the same structure can be applied to the second stepped section (540). The first stepped section (530) and the second stepped section (540) may be symmetrical to each other. That is, the first stepped section (540) may include a second stepped surface (542) positioned between the second hole (522) and the flow path (502), and a second chamfered surface (544) extended from the second stepped surface (542) toward the flow path (502) at an angle. According to this, a change in the flow velocity of the first fluid in the fluid discharge area (520) can be prevented, and the first fluid can be discharged to the outside without flow path resistance.

[0073] Meanwhile, as described above, the thermoelectric device (1000) according to an embodiment of the present invention is connected to an external component through a connecting member (not shown). One end of the connecting member is connected to the external component, and the other end of the connecting member is connected to a fluid flow unit (1100) according to an embodiment of the present invention. The other end of the connecting member can be inserted into a first hole (512) of the fluid flow unit (1100) according to an embodiment of the present invention and then fixed in the first hole (512).

[0074] To this end, according to an embodiment of the present invention, a first groove (G1) having a predetermined depth is formed on the wall surface of the first hole (512). After inserting the other end of the connecting member into the first hole (512), if force is applied to the inner wall of the connecting member at a position corresponding to the first groove (G1) to expand the diameter, the other end of the connecting member can be pressed into the first hole (512). Accordingly, the gap between the connecting member and the first groove (G1) of the first hole (512) is eliminated, thereby ensuring airtightness. Accordingly, since the thermoelectric device (1000) according to an embodiment of the present invention can be connected to an external component through the connecting member without a fastening member such as a screw, fastening force and durability can be guaranteed.

[0075] At this time, the first hole (512) is circular, like the connecting member, and the diameter of the first hole (512) can be designed to be larger than the diameter of the connecting member. For example, the diameter of the first hole (512) can be designed to be 0.2 to 0.4 mm larger than the diameter of the connecting member. According to this, the connecting member can be easily inserted into the first hole (512), and the airtightness and fastening between the connecting member and the first hole (512) can be increased. To this end, the connecting member may be made of a flexible material and can be bent to fit the shape of the first hole (512) after being inserted into the first hole (512).

[0076] According to an embodiment of the present invention, the distance (512L) from one side of the fluid inflow area (510) to the first step portion (530) on the other side of the fluid inflow area (510), that is, the distance of the first hole (512) extended along the second direction, can be designed to be 40% or more and 70% or less of the total length of the connecting member. Accordingly, a fastening force between the connecting member and the first hole (512) can be secured, and the fastening operation can be easy.

[0077] According to an embodiment of the present invention, the first groove (G1) formed in the first hole (512) can be formed in a continuous ring shape along the wall surface of the first hole (512). Accordingly, fixing between the connecting member and the first groove (G1) can be facilitated.

[0078] Alternatively, according to an embodiment of the present invention, the first groove (G1) formed in the first hole (512) may be formed in a discontinuous ring shape along the wall surface of the first hole (512).

[0079] Alternatively, according to an embodiment of the present invention, the length of the first groove (G1) may be 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, 80% or more, or 90% or more of the perimeter length of the wall surface of the first hole (512). Here, the length of the first groove (G1) may be the distance the first groove (G1) extends along the wall surface of the first hole (512). For example, the length of the first groove (G1) may be 1.5 mm to 4 mm. Accordingly, both fastening force and airtightness between the first groove (G1) and the connecting member can be guaranteed.

[0080] According to an embodiment of the present invention, the first groove (G1) may be formed in a spiral shape along the wall surface of the first hole (512). Accordingly, the possibility of the connecting member detaching from the thermoelectric device (1000) can be minimized even during frequent vibration of the thermoelectric device (1000) according to an embodiment of the present invention.

[0081] Alternatively, according to an embodiment of the present invention, the first groove (G1) may be formed to extend along a second direction from one side of the fluid inflow area (510), i.e., the fluid inlet, to the other side of the fluid inflow area (510), i.e., the first stepped portion (530).

[0082] According to an embodiment of the present invention, the depth (G1D) of the first groove (G1) may be 20% or more and 50% or less of the thickness of the connecting member. Here, the depth (G1D) of the first groove (G1) may be the vertical distance from the wall surface of the first hole (512) to the bottom surface of the first groove (G1). When the depth of the first groove (G1) satisfies this numerical range, fastening force and airtightness with the connecting member can be simultaneously guaranteed.

[0083] At this time, the length of the first groove (G1) may be greater than the depth (G1D) of the first groove (G1). For example, the length of the first groove (G1) may be more than 2 times, more than 5 times, more than 10 times, or 2 to 20 times the depth (G1D) of the first groove (G1). According to this, the work of fixing the connecting member to the first hole (512) is easy, and airtightness between the connecting member and the first hole (512) can be maintained.

[0084] According to an embodiment of the present invention, a second groove (G2) having a predetermined depth may be further formed on the wall surface of the first hole (512), spaced apart from the first groove (G1). When two or more grooves are formed in the first hole (512), the connecting member can fill the space between the first groove (G1) and the second groove (G2), and the fastening force can be further increased in a shape such as a hook.

[0085] At this time, the first groove (G1) and the second groove (G2) are arranged sequentially along the second direction from one side of the fluid inflow area (510), i.e., the fluid inlet, to the other side of the fluid inflow area (510), i.e., the first stepped portion (530), and at least one of the distance (d1) from one side of the fluid inflow area (510) to the first groove (G1) and the distance (d2) from the second groove (G2) to the first stepped portion (530), which is the other side of the fluid inflow area (510), may be greater than or equal to the distance (d3) between the first groove (G1) and the second groove (G2). At this time, the distance between the first groove (G1) and the second groove (G2) may be 6 mm or more. According to this, fastening force and airtightness between the connecting member and the first hole (512) can be simultaneously guaranteed.

[0086] For convenience of explanation, the description focuses on the groove formed in the first hole (512) of the fluid inflow area (510), but is not limited thereto. A groove may also be formed in the second hole (522) of the fluid outflow area (520) with the same or similar structure as the first hole (512).

[0087] Although not shown, a protrusion may be formed on the outer wall of the connecting member to engage with the groove of the first hole (512).

[0088] According to an embodiment of the present invention, the thickness in the first direction of the fluid flow section (1100) may differ in the flow path area (500), the fluid inflow area (510), and the fluid discharge area (520). According to an embodiment of the present invention, the thickness in the first direction of the fluid flow section (1100) may differ in the flow path area (500), the fluid inflow area (510), the fluid discharge area (520), the first step section (530), and the second step section (540). For example, the thickness in the first direction in the flow path area (500) may be thinner than the thickness in the first direction in the fluid inflow area (510) and the fluid discharge area (520). For example, the thickness in the first direction in the flow path area (500) may be thinner than the thickness in the first direction in the first step portion (530) and the second step portion (540), and may be thinner than the thickness in the first direction in the first step portion (530) and the second step portion (540). It may be thinner than the thickness in the first direction in the fluid inflow area (510) and the fluid outflow area (520). When the first step portion (530) and the second step portion (540) each include a first chamfered surface (534) and a second chamfered surface (544), the thickness in the first direction of the flow path area (500) may be implemented to be thinner than the thickness in the first direction in the fluid inflow area (510) and the fluid outflow area (520). Since thermoelectric modules are arranged on both sides of the Euro region (500), the thinner the thickness of the Euro region (500) is implemented, the number of thermoelectric devices accommodated per unit volume can be increased and the thermoelectric performance per unit volume can be improved.

[0089] According to an embodiment of the present invention, a stepped surface (1142, 1144) may be formed on the fluid inflow area (510) of the fluid flow section (1100) or on the fourth surface (1140) of the first stepped section (530) between the fluid inflow area (510). The stepped surface (1142, 1144) may be parallel to the fourth surface (1140) and may be stepped with respect to the fourth surface (1140) with the fourth surface (1140) in between. The stepped surface (1142) may serve to guide wiring connected to a thermoelectric module (1200) placed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100).

[0090] According to an embodiment of the present invention, a protrusion (1112) may be disposed on the first surface (1110) and the second surface (1120) of the flow path area (500) of the fluid flow section (1100). The protrusion (1112) may be a plurality of protrusions spaced apart from each other at a predetermined interval along a second direction on the side closer to the fourth surface (1140) among the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100). The protrusion (1112) may serve as a means for fixing the position of a thermoelectric module (1200) or a shield member (1500) to be described later.

[0091] According to an embodiment of the present invention, a predetermined groove (1114) may be formed on the first surface (1110) and the second surface (1120) of the flow path area (500) of the fluid flow section (1100). The predetermined groove (1114) may serve as a position guide for the thermoelectric module (1200) to be described later.

[0092] According to an embodiment of the present invention, a thermoelectric module (1200) is disposed on a first surface (1110) and a second surface (1120) of a fluid flow section (1100). The fluid flow section (1100) includes a flow path area (500) and flow path inlet areas (510) and flow path outlet areas (520) disposed on both sides of the flow path area (500). According to an embodiment of the present invention, the thermoelectric module (1200) is disposed in the flow path area (500).

[0093] FIG. 9 is a perspective view of a thermoelectric module according to one embodiment of the present invention, FIG. 10 is a plan view of a thermoelectric module according to one embodiment of the present invention, FIG. 11 is an exploded perspective view of a thermoelectric module according to one embodiment of the present invention, FIG. 12 is a shape of an electrode portion disposed on a lower substrate of a thermoelectric module according to one embodiment of the present invention, FIG. 13 is a plan view of a frame included in a thermoelectric module according to one embodiment of the present invention, FIG. 14 is a plan view of an insulating member included in a thermoelectric module according to one embodiment of the present invention, and FIG. 15 is a graph showing insulation resistance according to insulation distance.

[0094] Referring to FIGS. 9 through 14, the thermoelectric module (1200) includes a first thermoelectric module (600) and a second thermoelectric module (700) disposed adjacent to the first thermoelectric module (600). According to an embodiment of the present invention, a plurality of thermoelectric modules (1200) may be disposed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively. The thermoelectric module (1200) includes a thermoelectric element and a heat sink, and redundant descriptions regarding content identical to that described with reference to FIGS. 3 and 4 are omitted.

[0095] According to an embodiment of the present invention, the first thermoelectric module (600) comprises a first lower substrate (610), a plurality of semiconductor elements disposed on the first lower substrate (610), and a first upper substrate (620) disposed on the plurality of semiconductor elements, and the second thermoelectric module (700) comprises a second lower substrate (710), a plurality of semiconductor elements disposed on the second lower substrate (710), and a second upper substrate (720) disposed on the plurality of semiconductor elements. The first and second lower substrates (610, 710) may be the first substrate (110) described with reference to FIGS. 3 and 4, the plurality of semiconductor elements may be P-type semiconductor elements (130) and N-type semiconductor elements (140) described with reference to FIGS. 3 and 4, and the first and second upper substrates (620, 720) may be the second substrate (160) described with reference to FIGS. 3 and 4.

[0096] According to an embodiment of the present invention, the first and second lower substrates (610, 710) are disposed on the first surface (1110) of the fluid flow section (1100). At this time, the first and second lower substrates (610, 710) may be disposed to be in direct contact with the first surface (1110) of the fluid flow section (1100), or may be disposed to be in indirect contact through a thermal interface material (TIM), etc.

[0097] According to an embodiment of the present invention, the first lower substrate (610) includes first to fourth outer peripheries (610S1 to 610S4), and the second lower substrate (710) includes first to fourth outer peripheries (710S1 to 710S4). The first outer periphery (610S1) and the second outer periphery (610S2) of the first lower substrate (610) face each other, the third outer periphery (610S3) and the fourth outer periphery (610S4) of the first lower substrate (610) face each other, the first outer periphery (710S1) and the second outer periphery (710S2) of the second lower substrate (710) face each other, the third outer periphery (710S3) and the fourth outer periphery (710S4) of the second lower substrate (710) face each other, and the first outer periphery (610S1) and the second outer periphery of the first lower substrate (610) The first outer edge (710S1) and the second outer edge (710S2) of the outer edge (610S2) and the second lower substrate (710) can be arranged sequentially along the second direction.

[0098] A plurality of semiconductor devices disposed on a first lower substrate (610) include first-1 semiconductor devices disposed in a first region (611) of the first lower substrate (610) and first-2 semiconductor devices disposed in a second region (612) of the first lower substrate (610), and a plurality of semiconductor devices disposed on a second lower substrate (710) include second-1 semiconductor devices disposed in a third region (711) of the second lower substrate (710) and second-2 semiconductor devices disposed in a fourth region (712) of the second lower substrate (710). A first-1 electrode portion (631) is disposed between the first region (611) of the first lower substrate (610) and the first-1 semiconductor elements, a first-2 electrode portion (632) is disposed between the second region (612) of the first lower substrate (610) and the first-2 semiconductor elements, a second-1 electrode portion (731) is disposed between the third region (711) of the second lower substrate (710) and the second-1 semiconductor elements, and a second-2 electrode portion (732) is disposed between the fourth region (714) of the second lower substrate (710) and the second-2 semiconductor elements. The first electrode part (631) and the first electrode part (632) are connected by a connecting electrode (633), and the second electrode part (731) and the second electrode part (732) are connected by a connecting electrode (733).

[0099] The first upper substrate (620) includes a first-1 upper substrate (621) disposed on first-1 semiconductor devices and a first-2 upper substrate (622) disposed on first-2 semiconductor devices, and the second upper substrate (720) includes a second-1 upper substrate (721) disposed on second-1 semiconductor devices and a second-2 upper substrate (722) disposed on second-2 semiconductor devices. A first-1 heatsink (641) is disposed on the first-1 upper substrate (621), a first-2 heatsink (642) is disposed on the first-2 upper substrate (622), a second-1 heatsink (741) is disposed on the second-1 upper substrate (721), and a second-2 heatsink (742) is disposed on the second-2 upper substrate (722).

[0100] According to an embodiment of the present invention, the length in the direction of the major axis of the connecting electrode (633, 733) may be 2 to 4 times the length in the direction of the major axis of the electrode included in the first-1 electrode part (631), the first-2 electrode part (632), the second-1 electrode part (731), and the second-2 electrode part (732). Accordingly, since the distance between the first-1 heatsink (641) and the first-2 heatsink (642) and the distance between the second-1 heatsink (741) and the second-2 heatsink (742) can be guaranteed to be greater than a predetermined distance, interference between heatsinks can be prevented and work efficiency can be improved.

[0101] A frame (800) may be further disposed on the first lower substrate (610) and the second lower substrate (710). The frame (800) may include an insulating material and may be disposed between the first-1 upper substrate (621), the first-2 upper substrate (622), the second-1 upper substrate (721), and the second-2 upper substrate (722). Accordingly, the frame (800) may separate the first-1 upper substrate (621), the first-2 upper substrate (622), the second-1 upper substrate (721), and the second-2 upper substrate (722).

[0102] According to an embodiment of the present invention, the first thermoelectric module (600) includes a first groove (650), and the second thermoelectric module (700) includes a second groove (750). According to an embodiment of the present invention, the first groove (650) is formed in the first lower substrate (610), and the second groove (750) is formed in the second lower substrate (710). The first groove (650) includes a first-1 groove (651) and a first-2 groove (652), the first-1 groove (651) may be formed in a first outer edge (610S1), which is one outer edge of the first lower substrate (610), and the first-2 groove (652) may be formed in a second outer edge (610S2), which is the other outer edge of the first lower substrate (610). The second groove (750) includes a second-1 groove (751) and a second-2 groove (752). The second-1 groove (751) may be formed on a first outer edge (710S1), which is one outer edge of the second lower substrate (710), and the second-2 groove (752) may be formed on a second outer edge (710S2), which is the other outer edge of the second lower substrate (710). At this time, an imaginary line (V) connecting the center of the first-1 groove (651) and the center of the first-2 groove (652) may be placed in an area that overlaps vertically with the area between the first-1 upper substrate (621) and the first-2 upper substrate (622). An imaginary line connecting the center of the 2-1 groove (751) and the center of the 2-2 groove (752) may be placed in an area that overlaps vertically with the area between the 2-1 upper substrate (721) and the 2-2 upper substrate (722). The 1-1 groove (651) and the 1-2 groove (652) may be arranged so as to overlap each other along a direction perpendicular to the direction in which the connecting electrode (633) connecting the 1-1 electrode part (631) and the 1-2 electrode part (632) extends. The 2-1 groove (751) and the 2-2 groove (752) may be arranged so as to overlap each other along a direction perpendicular to the direction in which the connecting electrode (733) connecting the 2-1 electrode part (731) and the 2-2 electrode part (732) extends.

[0103] At this time, the first-2 groove (652) and the second-1 groove (751) are positioned at corresponding locations, and the first-2 groove (652) and the second-1 groove (751) can form a single hole (h1). The hole (h1) formed by the first-2 groove (652) and the second-1 groove (751) can be a hole through which a fastening member (not shown) passes.

[0104] Additionally, the frame (800) may include a hole (h2) corresponding to a hole (h1) formed by the first-second groove (652) and the second-first groove (751). A fastening member (not shown) may penetrate the hole (h2) and the hole (h1), and accordingly, the first thermoelectric module (600) and the second thermoelectric module (700) according to an embodiment of the present invention may be simultaneously fixed by a single fastening member. According to this, since there is no need to penetrate the fastening member within the effective area where the semiconductor element is placed, the placement of the electrode portion and the semiconductor element is easy, and the thermoelectric performance per unit area can be improved. A plurality of first-second grooves (652) and a plurality of second-first grooves (751) are placed at positions corresponding to each other, and a plurality of first-second grooves (652) and a plurality of second-first grooves (751) may form a plurality of holes (h1).

[0105] At this time, the head portion of the fastening member (not shown) may be positioned on the upper edge of the hole (h2) of the frame (800). To this end, the corner adjacent to the hole (h2) among the four corners of the first-1 upper substrate (621), the corner adjacent to the hole (h2) among the four corners of the first-2 upper substrate (622), the corner adjacent to the hole (h2) among the four corners of the second-1 upper substrate (721), and the corner adjacent to the hole (h2) among the four corners of the second-2 upper substrate (722) may each include first to fourth cutting portions (621C, 622C, 721C, 722C). Here, the cutting portion may refer to a chamfered shape. According to an embodiment of the present invention, the frame (800) may include first to fourth openings (810, 820, 830, 840) surrounding each of the first-1 upper substrate (621), the first-2 upper substrate (622), the second-1 upper substrate (721), and the second-2 upper substrate (722) in order to be placed between the first-1 upper substrate (621), the first-2 upper substrate (622), the second-1 upper substrate (721), and the second-2 upper substrate (722). The first to fourth openings (810, 820, 830, 840) of the frame (800) may each have a shape corresponding to the outer edge of the first-1 upper substrate (621), the first-2 upper substrate (622), the second-1 upper substrate (721), and the second-2 upper substrate (722). That is, among the four corners of each of the first to fourth openings (810, 820, 830, 840) of the frame (800), the corner adjacent to the hole (h2) may have a shape corresponding to the first to fourth cutting portions (621C, 622C, 721C, 722C) of the first-1 upper substrate (621), the first-2 upper substrate (622), the second-1 upper substrate (721), and the second-2 upper substrate (722).

[0106] Although not illustrated, as described with reference to FIGS. 3 and 4, a first insulating layer may be disposed between the first lower substrate (610) and a plurality of semiconductor elements, and a second insulating layer may be disposed between the plurality of semiconductor elements and the first upper substrate (620). A third insulating layer may be further disposed between the first insulating layer and the plurality of semiconductor elements.

[0107] As described above, a first-1 electrode portion (631) and a first-2 electrode portion (632) may be disposed between the first lower substrate (610) and a plurality of semiconductor elements, and a second-1 electrode portion (731) and a second-2 electrode portion (632) may be disposed between the second lower substrate (710) and a plurality of semiconductor elements.

[0108] Additionally, an extension electrode (634) extending toward the fourth outer edge (610S4) of the first lower substrate (610) may be further disposed on the first lower substrate (610). In an embodiment of the present invention, the second fluid may flow from the fourth outer edge (610S4) toward the third outer edge (610S3). That is, the extension electrode (634) may be disposed toward the direction in which the second fluid flows. The area of ​​the extension electrode (634) may be larger than the area of ​​each electrode forming the first-1 electrode portion (631) and the first-2 electrode portion (632). A connector is disposed on the extension electrode (634), and wiring may be connected to the connector.

[0109] According to an embodiment of the present invention, an insulating member (900) is further disposed on the extension electrode (634). Although it is illustrated that one insulating member (900) is disposed on the first thermoelectric module (600) and the second thermoelectric module (700), the embodiment of the present invention is not limited thereto, and each insulating member may be disposed on each thermoelectric module. The insulating member (900) can maintain a uniform bonding force between the first and second thermoelectric modules (600, 700) and the fluid flow part (1100), and can protect the wiring connected to the connector.

[0110] According to an embodiment of the present invention, the insulating member (900) includes an insulating frame (920) having an opening (910) formed therein, the opening (910) may be positioned at a location corresponding to an extension electrode (634), and the opening (910) may be filled with resin. Accordingly, the resin may be placed on the extension electrode (634) to provide insulation, thereby increasing the withstand voltage performance of the first and second thermoelectric modules (600, 700). Here, the resin may include epoxy resin or silicone resin. If the insulating frame (920) includes a plastic material, the insulating frame (920) can be easily molded into various sizes and shapes. For example, the insulating frame (920) may be a plastic material applicable at high temperatures, such as PPS (polyphenylene sulfide). Accordingly, the problem of the shape of the insulating frame (920) being deformed by the second fluid at high temperatures can be prevented.

[0111] According to an embodiment of the present invention, a through hole (930) may be formed between the openings (910) of the insulating frame (920), and a fastening member may be fastened to the through hole (930).

[0112] According to an embodiment of the present invention, an insulating member (900) may be disposed for each of the first thermoelectric module (600) and the second thermoelectric module (700), or one insulating member (900) may be disposed for the first thermoelectric module (600) and the second thermoelectric module (700).

[0113] According to an embodiment of the present invention, a first-third groove (653) and a second-third groove (753) may be further disposed in the fourth outer edge (610S4) of the first lower substrate (610) and the fourth outer edge (710S4) of the second lower substrate (710), respectively, and a groove (940) corresponding to the first-third groove (653) and the second-third groove (753) may be further disposed in the insulating member (900). The first-third groove (653) and the second-third groove (753), respectively, disposed on the fourth outer edge (610S4) of the first lower substrate (610) and the fourth outer edge (710S4) of the second lower substrate (710), and the groove (940) disposed on the insulating member (900) can serve as a position alignment means, and these grooves can be positionally aligned by engaging with the protrusion (1112) of the fluid flow portion (1100).

[0114] Referring to FIG. 15, in order to obtain an insulation resistance of 500 MΩ or more, an insulation distance of 12 mm or more must be ensured. In this specification, the insulation distance may refer to the shortest insulation distance from the effective area where the semiconductor device is placed to the outer edge of the substrate. When an insulation frame (920) is placed on the extension electrode (634) as in an embodiment of the present invention, the insulation distance may be increased by the height of the insulation frame (920), thereby obtaining a higher insulation resistance. For example, the shortest insulation distance may be defined by (2 * height of the insulation frame + length of the insulation frame). Here, the height of the insulation frame may be defined as the height according to the first direction relative to the lower substrate, and the length of the insulation frame may be defined as the length according to the third direction.

[0115] According to an embodiment of the present invention, the ratio of the distance from the fourth outer edge (610S4) of the first lower substrate (610) to the distance from the extension electrode (634) to the fourth outer edge (610S4) of the first lower substrate (610) to the distance from the fourth outer edge (610S4) to the nearest semiconductor element among a plurality of semiconductor elements may be 1.5 times or more and 3.5 times or less. According to an embodiment of the present invention, the ratio of the height of the insulating frame (920) to the distance from the extension electrode (634) to the fourth outer edge (610S4) of the first lower substrate (610) may be 0.25 times or more and 0.7 times or less. For example, the distance from the fourth outer edge (610S4) of the first lower substrate (610) to the nearest semiconductor element among a plurality of semiconductor elements may be 9mm to 21mm, the distance from the extension electrode (634) to the fourth outer edge (610S4) of the first lower substrate (610) may be 3mm to 14mm, and the height of the insulating frame (920) may be 1.5mm to 4mm. That is, even if the distance from the extension electrode (634) to the fourth outer edge (610S4) of the first lower substrate (610) is 3mm, an insulating distance of 12mm can be ensured by the insulating frame (920). According to this, not only can high insulation resistance be satisfied, but the area of ​​the effective region where the semiconductor element is placed can be maximized to obtain thermoelectric performance, and the insulating frame (920) can not obstruct the flow path of the second fluid passing through the heat sink.

[0116] As described above, according to an embodiment of the present invention, the frame (800) may be arranged to surround the first to fourth upper substrates. Since the frame (800) includes an insulating material, the insulation distance of the thermoelectric module may be further increased due to the frame (800).

[0117] Here, the thermoelectric module (1200) is described as including a first thermoelectric module (600) and a second thermoelectric module (700), and the first and second thermoelectric modules (600, 700) are described as including a first and second lower substrate (610, 710), respectively, but is not limited thereto. According to another embodiment of the present invention, the first and second lower substrates (610, 710) are implemented as a single lower substrate, and first to fourth upper substrates (621, 622, 721, 722) are disposed on the single lower substrate, and holes may be formed in the frame (800) and the lower substrate to correspond to the spacing area between the first to fourth upper substrates (621, 622, 721, 722).

[0118] Meanwhile, referring to FIGS. 1 and 2, a shield member (1500) may be further disposed to prevent moisture or contaminants from penetrating into the thermoelectric module (1200). As described above, the fluid flow section (1100) includes a first surface (1110) and a second surface (1120) spaced apart from the first surface (1110) in a first direction, and a thermoelectric module (1200) is disposed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively. The first fluid flows through the first surface (1110) and the second surface (1120) of the fluid flow section (1100) along a second direction perpendicular to the first direction, and the second fluid, which is hotter than the first fluid, flows along the heat sink (1220) of the thermoelectric module (1200) along a third direction perpendicular to the first and second directions. Here, the third direction may be a direction from the fourth surface (1140) of the fluid flow section (1100) toward the third surface (1130).

[0119] FIGS. 16 to 23 are drawings showing the process of assembling a shield member to a thermoelectric device according to one embodiment of the present invention, FIG. 24 is a cross-sectional view of a thermoelectric device according to one embodiment of the present invention with the shield member assembled therein, and FIG. 25 is a perspective view of a thermoelectric device according to one embodiment of the present invention with the third shield member removed.

[0120] Referring to FIGS. 16 and 17, a thermoelectric module (1200) is assembled on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively, and a first shield member (1510) is placed on the third surface (1130) of the fluid flow section (1100).

[0121] The first shield member (1510) is positioned on the third surface (1130) of the fluid flow section (1100), and may extend to cover parts of the first surface (1110) and the second surface (1120) of the fluid flow section (1100). For example, the cross-section of the first shield member (1510) may be in the shape of a “C”. Accordingly, the first shield member (1510) can protect not only the third surface (1130) of the fluid flow section (1100), but also the boundary between the first surface (1110) and the third surface (1130) and the boundary between the second surface (1120) and the third surface (1130).

[0122] At this time, a first insulating member (1610) may be further disposed between the fluid flow section (1100) and the first shield member (1510). According to this, even if a second fluid at a high temperature flows on the surface of the first shield member (1510), the effect on the first fluid within the fluid flow section (1100) can be minimized. A fastening hole (1512) is formed in the first shield member (1510), and through this, it can be fastened to the third surface (1130) of the fluid flow section (1100). Accordingly, the first insulating member (1610) may be disposed between the fastening holes (1512).

[0123] Next, referring to FIGS. 18 and 19, a thermoelectric module (1200) is assembled on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively, and a first shield member (1510) is assembled on the third surface (1130) of the fluid flow section (1100). Then, a second shield member (1520) is placed on the first surface (1110) of the fluid flow section (1100) and the thermoelectric module (1200). At this time, the second shield member (1520) may extend to the third surface (1130) of the fluid flow section (1100) to cover a portion of the first shield member (1510) placed on the third surface (1130) of the fluid flow section (1100). In addition, a fourth shield member (1540) symmetrical to the second shield member (1520) can be disposed on the second surface (1120) of the fluid flow section (1100) and the thermoelectric module (1200), and the fourth shield member (1540) can be extended to the third surface (1130) of the fluid flow section (1100) to cover a portion of the first shield member (1510) disposed on the third surface (1130) of the fluid flow section (1100). According to this, since the gap between the first shield member (1510) and the second shield member (1520) and the gap between the first shield member (1510) and the fourth shield member (1540) are not directly positioned in the direction in which the second fluid flows, the problem of the second fluid flowing through the gap between the first shield member (1510) and the second shield member (1520) and the gap between the first shield member (1510) and the fourth shield member (1540) can be prevented.

[0124] Meanwhile, the second shield member (1520) and the fourth shield member (1540) each include grooves (1522, 1542) arranged to correspond to each other, and the grooves (1522, 1542) are arranged on the third surface (1130) and may be arranged to correspond to the fastening hole (1512) of the first shield member (1510). Accordingly, a fastening member (not shown) may be fixed to the third surface (1130) of the fluid flow portion (1100) by penetrating the hole formed by the grooves (1522, 1542) of the second shield member (1520) and the fourth shield member (1540) and the fastening hole (1512) of the first shield member (1510).

[0125] As described above, the thermoelectric module (1200) includes a thermoelectric element disposed on the fluid flow section (1100) and a heat sink disposed on the thermoelectric element, and the thermoelectric module (1200) may include a first thermoelectric module (600) and a second thermoelectric module (700) disposed adjacent to the first thermoelectric module (600).

[0126] According to an embodiment of the present invention, the second shield member (1520) includes a through hole (1524) through which a heat sink is exposed, and the edge of the through hole (1524) may be disposed on the upper substrate of the first thermoelectric module (600) and the second thermoelectric module (700). Accordingly, a second high-temperature fluid may flow along a third direction through the heat sink.

[0127] Next, referring to FIGS. 20 and 21, a thermoelectric module (1200) is assembled on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), a first shield member (1510) is assembled on the third surface (1130) of the fluid flow section (1100), and a second shield member (1520) and a fourth shield member (1540) are assembled on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), and a third shield member (1530) is placed on the fourth surface (1140) of the fluid flow section (1100).

[0128] The third shield member (1530) is positioned on the fourth surface (1140) of the fluid flow section (1100), and may extend to a portion of the first surface (1110) and the second surface (1120) of the fluid flow section (1100). For example, the cross-section of the third shield member (1530) may be in the shape of a “C”. Accordingly, the third shield member (1530) can protect not only the fourth surface (1140) of the fluid flow section (1100), but also the boundary between the first surface (1110) and the fourth surface (1140) and the boundary between the second surface (1120) and the fourth surface (1140). In addition, in a structure in which a second fluid flows from a fourth surface (1140) toward a third surface (1130) on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), when a third shield member (1530) is disposed on the second and fourth shield members (1520, 1540), the gap between the second and fourth shield members (1520, 1540) and the third shield member (1530) is not directly exposed along the direction in which the second fluid flows, so the problem of the second fluid seeping between the second and fourth shield members (1520, 1540) and the third shield member (1530) can be minimized.

[0129] At this time, a second insulating member (1620) may be further disposed between the fluid flow section (1100) and the third shield member (1530). According to this, even if a second fluid of high temperature flows on the surface of the third shield member (1530), the effect on the first fluid within the fluid flow section (1100) can be minimized. In order to minimize the effect of the second fluid of high temperature on the first fluid within the fluid flow section (1100), the second insulating member (1620) disposed between the fluid flow section (1100) and the third shield member (1530) may also be extended to a part of the first surface (1110) and the second surface (1120) of the fluid flow section (1100). Although not shown, a fastening hole is formed in the third shield member (1530), and through this, it may be fastened to the fourth surface (1140) of the fluid flow part (1100).

[0130] According to an embodiment of the present invention, a sealing member (1532) may be applied to the boundary between the third shield member (1530) and the second shield member (1520) and the boundary between the third shield member (1530) and the fourth shield member (1540). Accordingly, the problem of a high-temperature second fluid penetrating into the boundary between the third shield member (1530) and the second shield member (1520) and the boundary between the third shield member (1530) and the fourth shield member (1540) can be prevented.

[0131] Meanwhile, as described with reference to FIGS. 5 to 8, the fluid flow section (1100) includes a flow path area (500), a fluid inflow area (510), and a fluid outflow area (520). Also, the thermoelectric module (1200) and the first to fourth shield members (1510, 1520, 1530, 1540) are all disposed on the flow path area (500).

[0132] Referring to FIGS. 22 and 23, with the thermoelectric module (1200) and the first to fourth shield members (1510, 1520, 1530, 1540) all disposed on the fluid flow section (1100), a fifth shield member (1550) is further disposed on the fluid inlet area (510), and a sixth shield member (1560) is further disposed on the fluid discharge area (520). At this time, the fifth shield member (1550) and the sixth shield member (1560) may each be extended to cover a portion of the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100). Additionally, a third insulating member (1630) and a fourth insulating member (1640) may be further disposed between the fluid inlet area (510) and the fifth shield member (1550), and between the fluid discharge area (520) and the sixth shield member (1560), respectively.

[0133] Meanwhile, as described with reference to FIGS. 9 to 13, the extension electrode of the thermoelectric module extends toward the direction in which the second fluid flows in, a connector is disposed on the extension electrode, and wiring can be connected to the connector.

[0134] That is, when the second fluid flows from the fourth surface (1140) of the fluid flow section (1100) toward the third surface (1130), the extension electrode, connector, and wiring may be positioned on the fourth surface (1140) side of the fluid flow section (1100). Accordingly, according to an embodiment of the present invention, the fifth shield member (1550) may include a groove (1552) positioned on the fourth surface (1140), and wiring may be drawn out to the outside through the groove (1552).

[0135] Referring to FIG. 24, the second fluid flows along the third direction. That is, in a structure where the third shield member (1530) is placed on the second shield member (1520) and the second shield member (1520) is placed on the first shield member (1510), the second fluid flows sequentially along the third shield member (1530), the second shield member (1520), and the first shield member (1510). Accordingly, the second fluid can pass along the third direction without seeping between the third shield member (1530) and the second shield member (1520) and between the second shield member (1520) and the first shield member (1510).

[0136] Referring to FIG. 25, according to the structure of an embodiment of the present invention, only the third shield member (1530) can be removed from the thermoelectric device (1000), thereby exposing the extension electrode, connector, and wiring. In the event of a failure in the extension electrode, connector, and wiring, repairs can be made by removing only the third shield member (1530) without the need to disassemble or replace the entire thermoelectric device (1000).

[0137] According to an embodiment of the present invention, a plurality of thermoelectric devices may form a thermoelectric system.

[0138] FIG. 26 is a thermoelectric system according to one embodiment of the present invention, FIG. 27 to 29 are drawings showing the process of assembling a wiring protection unit to a thermoelectric system according to one embodiment of the present invention, and FIG. 30 is a perspective view of an upper structure included in a thermoelectric system according to one embodiment of the present invention.

[0139] Referring to FIGS. 26 to 29, the thermoelectric system (2500) includes a first thermoelectric device (1000-1), a second thermoelectric device (1000-2) spaced apart from the first thermoelectric device (1000-1) along a first direction, a third thermoelectric device (1000-3) spaced apart from the second thermoelectric device (1000-2) along a first direction, a wiring section (W) electrically connected to the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3), and a wiring protection section (1700) positioned on one side of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) to surround at least a portion of the wiring section (W).

[0140] The first fluid flows through each of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) along a second direction perpendicular to the first direction, and the second fluid, which is hotter than the first fluid, can flow between the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) along a third direction perpendicular to the first direction and the second direction.

[0141] The first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) may each be a thermoelectric device described with reference to FIGS. 1 to 25.

[0142] As described above, the wiring (W) connected to the thermoelectric module included in each thermoelectric device is drawn out to the top of the fluid inflow area (510) of the fluid flow section (1100), that is, to the fourth side (1140) of the fluid inflow area (510) of the fluid flow section (1100).

[0143] According to an embodiment of the present invention, a wiring protection unit (1700) is positioned on the upper side of one side of a plurality of thermoelectric devices spaced apart along a first direction, such as a first thermoelectric device (1000-1), a second thermoelectric device (1000-2), and a third thermoelectric device (1000-3). Here, one side refers to the fluid inflow area (510) of the fluid flow unit (1100), and the upper side refers to the surface positioned in the direction in which the second fluid flows, i.e., the fourth surface (1140) of the fluid flow unit (1100) when the second fluid flows in a third direction toward the third surface (1130) from the fourth surface (1140) of the fluid flow unit (1100).

[0144] The wiring protection unit (1700) serves to collect wiring drawn from multiple thermoelectric devices and guide it to the outside. When the wiring protection unit (1700) is positioned on one side of the upper part of the fluid flow unit (1100), that is, in the fluid inlet area (510), it does not obstruct the flow of the second fluid passing through the thermoelectric module (1200) positioned in the flow path area (520), thereby increasing thermoelectric performance. Additionally, since the temperature of the fluid inlet area (510) is lower than that of the fluid discharge area (520), the temperature of the wiring passing through the wiring protection unit (1700) can be maintained at a lower state.

[0145] Referring to FIGS. 26 and 27, the wiring protection section (1700) comprises a bottom section (1710) disposed on a plurality of thermoelectric devices (1000-1, …, 1000-3), a first side wall (1720) extending from a first end (1711) of the bottom section (1710) toward the upper direction of the bottom section (1710), a second side wall (1730) extending from a second end (1712) spaced apart from the first end (1711) of the bottom section (1710) along the first direction toward the upper direction of the bottom section (1710), and a third end (1713) disposed between the first side wall (1720) and the second side wall (1730) and extending toward the upper direction of the bottom section (1710) from the third end (1713) between the first end (1711) and the second end (1712) of the bottom section (1710). It includes a third side wall (1740), a first side wall (1720), and a second side wall (1730) positioned between the third end (1713) of the bottom part (1710) and a fourth end (1714) spaced apart along the second direction, extending toward the upper direction of the bottom part (1710); a first tower part (1780) spaced apart from the bottom part (1710) and extending toward the second direction from the third side wall (1740); a second tower part (1790) spaced apart from the bottom part (1710) and extending toward the opposite direction from the fourth side wall (1742); and a fifth side wall (1770, 1772) extending toward the upper direction of the upper bottom part (1710) from the second tower part (1790) and connected to the first tower part (1780). As described, the first end (1711) and the second end (1712) each extend along the second direction, and the first end (1711) and the second end (1712) may be spaced apart from each other along the first direction. The third end (1713) and the fourth end (1714) each extend along the first direction, and the third end (1713) and the fourth end (1714) may be spaced apart from each other along the second direction. At this time, the height of the first tower section (1780) with respect to the bottom section (1710) may be higher than the height of the second tower section (1790).

[0146] According to an embodiment of the present invention, the distance between the third side wall (1740) and the fifth side wall (1771, 1772) gradually decreases along the upward direction of the bottom portion (1710). For example, when the third side wall (1740) is positioned nearly perpendicular to the bottom portion (1710), the fifth side wall (1770, 1772) may be inclined so that it becomes closer to the third side wall (1740) as it moves further away from the bottom portion (1710) in the upward direction. For example, the angle in the second direction between the third side wall (1740) and the fifth side wall (1771, 1772) may be positioned to form 10 to 70 degrees, preferably 15 to 60 degrees, more preferably 20 to 50 degrees, and even more preferably 25 to 40 degrees. According to this, as described below, the second fluid can flow between the first to third thermoelectric devices (1000-1, 1000-2, 1000-3) without flow resistance or loss.

[0147] In an embodiment of the present invention, the third side wall (1740) and the fourth side wall (1742) are arranged parallel to each other, and accordingly, the distance between the third side wall (1740) and the fourth side wall (1742) may be equal along the upper direction of the bottom portion (1710).

[0148] Alternatively, in another embodiment of the present invention not illustrated, the distance between the third side wall (1740) and the fourth side wall (1742) may gradually decrease along the upper direction of the bottom portion (1710). In this case, the fourth side wall (1742) may be arranged parallel to the fifth side wall (1770, 1772). That is, the angle in the second direction between the third side wall (1740) and the fifth side wall (1771, 1772) may be the same as the angle in the second direction between the third side wall (1740) and the fourth side wall (1742). Or, that is, the angle in the second direction between the third side wall (1740) and the fifth side wall (1771, 1772) may be smaller than the angle in the second direction between the third side wall (1740) and the fourth side wall (1742). According to this, the second fluid can flow between the first to third thermoelectric devices (1000-1, 1000-2, 1000-3) without flow resistance or loss.

[0149] According to an embodiment of the present invention, the wiring protection portion (1700) includes a first hole (1750), a second hole (1752), a third hole (1754) formed spaced apart along a first direction from the bottom portion (1710), and a fourth hole (1756) disposed in a third side wall (1740). At this time, the third side wall (1740) may be disposed on the side of the bottom portion (1710) spaced apart along the second direction that is relatively far from the flow path area (520), i.e., the side of the fluid inlet of the first fluid, i.e., the third end (1713) side.

[0150] The first wiring (W1) connected to the first thermoelectric device (1000-1) penetrates the first hole (1750), extends upward along the third side wall (1740), and is drawn out to the outside through the fourth hole (1756). The second wiring (W2) connected to the second thermoelectric device (1000-2) penetrates the second hole (1752), extends upward along the third side wall (1740), and is drawn out to the outside through the fourth hole (1756). The third wiring (W3) connected to the third thermoelectric device (1000-3) penetrates the third hole (1754), extends upward along the third side wall (1740), and is drawn out to the outside through the fourth hole (1756).

[0151] In this way, when the wiring protection unit (1700) collects the wiring connected to a plurality of thermoelectric devices and pulls it out to the outside, the connection and operation of the wiring are easy, and it is easy to protect the wiring from the second fluid at a high temperature.

[0152] At this time, the first hole (1750), the second hole (1752), and the third hole (1754) may be formed at the boundary between the bottom portion (1710) and the third side wall (1740) of the wiring protection portion (1700). Accordingly, the first to third wirings (W1, W2, W3) passing through the first hole (1750), the second hole (1752), and the third hole (1754) may be extended upward along the third side wall (1740) while in contact with the third side wall (1740) and then drawn out to the outside through the fourth hole (1756). Since the third side wall (1740) is positioned on the fluid inlet side, when the first to third wirings (W1, W2, W3) come into contact with the third side wall (1740), the temperature of the first to third wirings (W1, W2, W3) can be maintained at a lower state.

[0153] Referring to FIGS. 27 and 28, according to an embodiment of the present invention, the wiring protection member (1700) may further include an insulating member (1760). The insulating member (1760) may be disposed on the bottom portion (1710) between the first side wall (1720) and the second side wall (1730). At this time, the insulating member (1760) may be disposed to contact the first to third wiring (W1, W2, W3) extending along the third side wall (1740). Accordingly, even if a high-temperature second fluid passes through the surface of the wiring protection member (1700), the problem of heat being applied to the first to third wiring (W1, W2, W3) by the insulating member (1760) can be prevented. At this time, the insulating member (1760) may include a first insulating member disposed between the bottom part (1710) and the first tower part (1780) and a second insulating member disposed between the bottom part (1710) and the second tower part (1790).

[0154] At this time, the space between the first side wall (1720) and the second side wall (1730) and the insulating member (1760) can be sealed by a sealing member (770). Accordingly, the problem of heat from the second fluid being applied to the first to third wiring (W1, W2, W3) through the gap between the first side wall (1720) and the second side wall (1730) and the insulating member (1760) can be prevented.

[0155] Referring to FIG. 29, the wiring protection section (1700) is positioned between the first side wall (1720) and the second side wall (1730) and further includes a shield cover section (780) that covers at least a portion of the first tower section (1780), the second tower section (1790), and the fifth side wall (1770, 1772). To this end, at least one fastening hole (1782, 1784, 1792, 1794) is formed in each of the first tower section (1780) and the second tower section (1790), and can be fastened to the shield cover section (780) using a fastening member through the at least one fastening hole (1782, 1784, 1792, 1794).

[0156] Referring again to FIG. 26, the thermoelectric system (2500) may further include an upper structure (1800) positioned on the other side of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3), spaced apart from the wiring protection part (1700) along the second direction. Here, the other side of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) may refer to the fluid discharge side of the first fluid.

[0157] Referring to FIG. 30, the external shape of the upper structure (1800) may be identical to the external shape of the wiring protection section (1700) and may be arranged symmetrically with respect to the wiring protection section (1700). For example, the upper structure (1800) may include an insulating material and may be molded into an external shape symmetrical to the wiring protection section (1700). Alternatively, the upper structure (1800) may have the same material and structure as the wiring protection section (1700). For example, the upper structure (1800) may also include a bottom section, a first side wall (1820), a second side wall (1830), a third side wall, a fourth side wall (1844), a first tower section (1880), a second tower section (1890), and a fifth side wall (1870) in a shape symmetrical to the wiring protection section (1700). For example, the upper structure (1800) may have the same shape as the shape in which the insulating member (1760) is filled in the wiring protection part (1700). Although not illustrated, a shield cover part is disposed on at least a portion of the first tower part (1880), the second tower part (1890), and the fifth side wall (1870) of the upper structure (1800), and the shield cover part may be fastened to the upper structure (1800) through fastening holes (1882, 1884, 1892, 1894) formed in the first tower part (1880) and the second tower part (1890). According to this, the weight of both sides of the thermoelectric system (2500) can be balanced. The upper structure (1800) may be placed on the fluid discharge area (520) of the fluid flow section (1100) of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3). Accordingly, the wiring protection section (1700) and the upper structure (1800) may serve to guide the flow of the second fluid.

[0158] To this end, the shield cover portion (780) of the wiring protection portion (1700) includes a first inclined surface (782), and the upper structure (1800) may include a second inclined surface corresponding to the first inclined surface (782). The first inclined surface (782) may be arranged along the fifth side wall (1770, 1772) of the wiring protection portion (1700). The second inclined surface may be the fifth side wall (1870) of the upper structure (1800), or may refer to a surface arranged along the fifth side wall (1870) of the shield cover portion of the upper structure (1800).

[0159] As illustrated in FIG. 26, according to an embodiment of the present invention, the distance (D) between the first inclined surface (782) and the second inclined surface may gradually narrow along the direction in which the second fluid flows. Accordingly, the second fluid introduced into the thermoelectric system (2500) may be collected in the central area where the thermoelectric module (1200) is placed and then pass along the third direction.

[0160] Meanwhile, according to another embodiment of the present invention, the thermoelectric system may be arranged in multiple stages.

[0161] FIG. 31 is a perspective view of a thermoelectric system according to another embodiment of the present invention, FIG. 32 to FIG. 33 are drawings showing the process of assembling a wiring protection unit to a thermoelectric system according to another embodiment of the present invention, and FIG. 34 is a perspective view of an upper structure included in a thermoelectric system according to another embodiment of the present invention.

[0162] Referring to FIGS. 31 to 33, the thermoelectric system (3000) includes a first thermoelectric system (3100) and a second thermoelectric system (3200) disposed below the first thermoelectric system (3100) along a third direction in which a second fluid flows, and each thermoelectric system includes a plurality of thermoelectric devices disposed spaced apart in a first direction.

[0163] The contents described with reference to FIGS. 1 to 25 may be applied to each of the plurality of thermoelectric devices included in the first thermoelectric system (3100) and the second thermoelectric system (3200), respectively.

[0164] For each of the first thermoelectric system (3100) and the second thermoelectric system (3200), redundant descriptions are omitted regarding content identical to that described in FIGS. 26 to 30.

[0165] According to an embodiment of the present invention, the external shape of the wiring protection part and the upper structure included in the first thermoelectric system (3100) may be different from the external shape of the upper structure of the wiring protection part included in the second thermoelectric system (3200).

[0166] In the thermoelectric system closest to the inlet of the second fluid, for example, the first thermoelectric system (3100) of FIG. 31, the gap (D1) between the opposing surfaces of the wiring protection part (1700) and the upper structure (1800) can gradually narrow along the direction in which the second fluid flows. Accordingly, the second fluid introduced into the thermoelectric system (3000) can be collected in the central area where the thermoelectric module (1200) is placed and then pass along the third direction.

[0167] In contrast, the shape of the wiring protection part (2700) and the upper structure (2800) in the thermoelectric system positioned at the bottom of the thermoelectric system closest to the inlet of the second fluid, for example, the second thermoelectric system (3200) of FIG. 31, is different from the shape of the wiring protection part (1700) and the upper structure (1800) in the thermoelectric system closest to the inlet of the second fluid, for example, the first thermoelectric system (3100) of FIG. 31.

[0168] According to an embodiment of the present invention, the width of the bottom portion of the wiring protection portion (2700) of the second thermoelectric system (3200) is 0.98 to 1.02 times the width of the top portion. Likewise, the width of the bottom portion of the upper structure (2800) of the second thermoelectric system (3200) is 0.98 to 1.02 times the width of the top portion. Here, the bottom portion and the top portion may be arranged oppositely along a third direction. For example, the bottom portion may be a bottom surface or an area including a bottom surface arranged to face a plurality of thermoelectric devices included in the second thermoelectric system (3200), and the top portion may be a top surface or an area including a top surface that is opposite to the bottom surface. The top surface may be a surface arranged to face the first thermoelectric system (3100).

[0169] According to this, in a thermoelectric system positioned at the bottom of the thermoelectric system closest to the inlet of the second fluid, for example, the second thermoelectric system (3200) of FIG. 31, the opposing surfaces of the wiring protection section (2700) and the upper structure (2800) may be parallel to each other. In this specification, if they are within an error range of ±4%, they may be interpreted as parallel. That is, in the second thermoelectric system (3200) of FIG. 31, the spacing (D2) between the opposing surfaces of the wiring protection section (2700) and the upper structure (2800) may be the same or have a deviation of ±4% along the direction in which the second fluid flows. For example, the deviation between the shortest distance between the bottom of the wiring protection section (2700) and the bottom of the upper structure (2800) and the shortest distance between the top of the wiring protection section (2700) and the top of the upper structure (2800) may be within ±4%. That is, the shortest distance between the bottom of the wiring protection section (2700) and the bottom of the upper structure (2800) may be 0.96 to 1.04 times the shortest distance between the top of the wiring protection section (2700) and the top of the upper structure (2800). According to this, the problem of a second fluid flowing outside the central area where the thermoelectric module (1200) is placed and generating a vortex can be prevented. That is, the opposing surfaces of the wiring protection section (2700) and the upper structure (2800) can serve to control the vortex of the second fluid within the path through which the second fluid flows.

[0170] To this end, the shapes of the first and second side walls (2720, 2730), the insulating member (2760), and the shield cover part (2780) of the wiring protection part (2700) of the second thermoelectric system (3200) may differ from the shapes of the first and second side walls (1720, 1730), the insulating member (1760), and the cover member (1780) of the wiring protection part (1700) of the first thermoelectric system (3100). As described through FIGS. 26 to 30, the shield cover part (2780) includes a first inclined surface, and accordingly, the fifth side wall (1770, 1772) also includes an inclined surface so that the shield cover part (2780) can be positioned. In contrast, the external shape of the wiring protection part (2700) of the second thermoelectric system (3200) may be a rectangular shape, and accordingly, the external shape of the upper structure (2800) of the second thermoelectric system (3200) may also have a rectangular shape that is the same external shape as the wiring protection part (2700).

[0171] That is, the wiring protection portion (2700) of the second thermoelectric system (3200) is positioned on the thermoelectric device and is surrounded by a fifth end (2711), a sixth end (2712), a seventh end, and an eighth end (2714); a sixth side wall (2720) and a seventh side wall (2730) respectively extending toward the upper direction of the bottom portion from the fifth end (2711) and the sixth end (2712) of the bottom portion; an eighth side wall (2740) positioned between the sixth side wall (2720) and the seventh side wall (2730) and extending toward the upper direction from the seventh end of the bottom portion; a ninth side wall (2742) positioned between the sixth side wall (2720) and the seventh side wall (2730) and extending toward the upper direction from the eighth end (2714) of the bottom portion; and a second side wall spaced apart from the bottom portion and extending from the eighth side wall (2740). It includes a third tower section (2790) extended in a direction. At this time, the ninth side wall (2740) extends to the third tower section (2790), and the eighth side wall (2740) and the ninth side wall (2740) are parallel to each other. As illustrated, both ends of the ninth side wall (2740) along the first direction may be extended to meet the third tower section (2790), and accordingly, the ninth side wall (2740) may have a concave shape between both ends along the first direction. When the ninth side wall (2740) has a concave shape between both ends along the first direction, it is easy to assemble the shield cover section (2780) after placing wiring and insulation members in the space between the bottom section, the eighth side wall (2740), and the ninth side wall (2740).

[0172] Likewise, the upper structure (2800) of the second thermoelectric system (3200) may include side walls (2820, 2842) and a top section (2980) symmetrical to the wiring protection section (2700). Although not illustrated, the shield cover section of the upper structure (2800) of the second thermoelectric system (3200) may have the same shape as the shield cover section (2780) of the wiring protection section (2700) of the second thermoelectric system (3200).

[0173] Here, a second thermoelectric system (3200) is shown positioned below the first thermoelectric system (3100), but is not limited thereto, and additional thermoelectric systems may be positioned below the second thermoelectric system (3200).

[0174] Throughout the entire specification, the thermoelectric element (100, 1210) is described as comprising a first substrate (110), a first electrode (120), a P-type thermoelectric leg (130), an N-type thermoelectric leg (140), a second electrode (150), and a second substrate (160); however, the definition of the thermoelectric element (100, 1210) is not limited thereto, and the thermoelectric element (100, 1210) may include a first electrode (120), a P-type thermoelectric leg (130), an N-type thermoelectric leg (140), a second electrode (150), and a second substrate (160), and may mean that it is disposed on the first substrate (110).

[0175] The power generation system can generate electricity using heat sources originating from ships, automobiles, power plants, geothermal energy, etc., and multiple power generation units can be arranged to efficiently converge the heat sources. In this case, each power generation unit can improve the cooling performance of the low-temperature portion of the thermoelectric element by enhancing the bonding force between the thermoelectric module and the fluid flow section. Consequently, the efficiency and reliability of the power generation system can be improved, thereby enhancing the fuel efficiency of transportation devices such as ships and vehicles. Therefore, in the shipping and transportation industries, this enables the reduction of transportation costs and the creation of an eco-friendly industrial environment, while when applied to manufacturing industries such as steel mills, it can reduce material costs.

[0176] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the following claims.

Claims

Claim 1 A first thermoelectric module, a second thermoelectric module disposed adjacent to the first thermoelectric module in a second direction, and a frame are included. The first thermoelectric module includes a first lower substrate, a first semiconductor device portion disposed in an effective area of ​​the first lower substrate, and a first upper substrate disposed on the first semiconductor device portion. The second thermoelectric module includes a second lower substrate, a second semiconductor device portion disposed in an effective area of ​​the second lower substrate, and a second upper substrate disposed on the second semiconductor device portion. A first semicircular groove is formed on one outer edge of the first lower substrate, and a second semicircular groove is formed on one outer edge of the second lower substrate facing the first outer edge of the first lower substrate in the second direction. The first groove and the second groove form a first hole. The first hole is formed so as not to penetrate the effective area of ​​the first lower substrate and the effective area of ​​the second lower substrate. The frame includes an insulating material. The first upper The substrate includes a first-1 upper substrate and a first-2 upper substrate spaced apart along a third direction perpendicular to the first-1 upper substrate and the second direction, and the second upper substrate includes a second-1 upper substrate and a second-2 upper substrate spaced apart along the third direction from the second-1 upper substrate, and the frame is disposed between the first-1 upper substrate, the first-2 upper substrate, the second-1 upper substrate, and the second-2 upper substrate on the first lower substrate and the second lower substrate, and the frame includes a first opening through which the first-1 upper substrate passes, a second opening through which the first-2 upper substrate passes, a third opening through which the second-1 upper substrate passes, and a fourth opening through which the second-2 upper substrate passes, and the frame includes a second hole perpendicularly superimposed with the first hole, and a fastening member passes through the first hole and the second hole, and the A thermoelectric module array that simultaneously fixes a first thermoelectric module and a second thermoelectric module. Claim 2 delete Claim 3 In claim 1, the second hole is formed between the first opening, the second opening, the third opening and the fourth opening, and is a thermoelectric module array smaller than the first opening, the second opening, the third opening and the fourth opening. Claim 4 delete Claim 5 In paragraph 3, the head of the fastening member is a thermoelectric module array disposed on the upper edge of the second hole. Claim 6 In claim 1, each of the first thermoelectric module and the second thermoelectric module is a thermoelectric module array in which the length of the third direction is longer than the length of the second direction. Claim 7 In claim 6, the first thermoelectric module comprises a first-1 electrode portion disposed on the first lower substrate, a first-2 electrode portion disposed on the first lower substrate and spaced apart from the first-1 electrode portion along the third direction, and a first connecting electrode extending along the third direction and connecting the first-1 electrode portion and the first-2 electrode portion, and the second thermoelectric module comprises a second-1 electrode portion disposed on the second lower substrate, a second-2 electrode portion disposed on the second lower substrate and spaced apart from the second-1 electrode portion along the third direction, and a second connecting electrode extending along the third direction and connecting the second-1 electrode portion and the second-2 electrode portion, and the first connecting electrode, the first hole, and the second connecting electrode are arranged to overlap along the second direction, forming a thermoelectric module array. Claim 8 In claim 7, the first semiconductor device portion comprises first-1 semiconductor devices disposed on the first-1 electrode portion and first-2 semiconductor devices disposed on the first-2 electrode portion, and the second semiconductor device portion comprises second-1 semiconductor devices disposed on the second-1 electrode portion and second-2 semiconductor devices disposed on the second-2 electrode portion, wherein the first-1 upper substrate is disposed on the first-1 semiconductor devices and the first-2 upper substrate is disposed on the first-2 semiconductor devices, the second-1 upper substrate is disposed on the second-1 semiconductor devices and the second-2 upper substrate is disposed on the second-2 semiconductor devices, and the region enclosed by one corner of the first-1 upper substrate, one corner of the first-2 upper substrate, one corner of the second-1 upper substrate and one corner of the second-2 upper substrate is a thermoelectric module array that overlaps perpendicularly with the first hole. Claim 9 delete Claim 10 delete Claim 11 delete Claim 12 In claim 7, the first thermoelectric module further comprises a first extension electrode and a second extension electrode extending from the first-2 electrode portion along the third direction, and the second thermoelectric module further comprises a third extension electrode and a fourth extension electrode extending from the second-2 electrode portion along the third direction, wherein a connector is disposed on each of the first to fourth extension electrodes.

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