Inductively coupled plasma processing apparatus

Abstract

The present invention relates to an inductively coupled plasma processing apparatus. The present invention comprises: a chamber body (100) having an opening formed on the upper side; a window assembly (200) including one or more windows (210) that cover the opening to form a processing space (S) together with the chamber body (100) and a support frame (220) that supports the windows (210); a substrate support member (300) installed on the chamber body (100) to support a substrate (10); and a gas injection member that injects gas into the processing space (S). The window assembly (200) includes an antenna unit (500) installed in a reference plane area corresponding to the planar shape of the substrate (10) on the upper part of the window assembly (200) to form an induced electric field in the processing space (S); the antenna unit (500) includes one or more corner antenna groups (700) arranged adjacent to the vertex of the reference plane area to control the plasma density of the corner portion; the corner antenna group (700) includes a plurality of lower antenna members (711, 712, 713) arranged at intervals from the center of the reference plane area toward the vertex, to which power is applied such that the current direction is the same, and to which the first normal (Lp) of the plate surface is parallel to the upper surface of the window (210); An inductive electric field plasma processing apparatus is disclosed, comprising one or more upper antenna members (731, 732) positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), and having power applied such that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713), and the second normal (Lh) of the plate surface forms an angle of 0 to 90° with the first normal (Lp).

Description

Technology Field

[0001] The present invention relates to an inductively coupled plasma processing apparatus. Background Technology

[0002] An inductively coupled plasma processing device is a device that performs substrate processing such as deposition and etching processes. It comprises a chamber body that forms a sealed processing space, a window installed on the ceiling of the chamber body, and a high-frequency (RF) antenna installed above the window. Power is applied to the antenna to form an induced electric field in the processing space, and the processing gas is plasmafied by the induced electric field to perform substrate processing.

[0003] Here, the substrate subject to processing by the inductively coupled plasma processing device described above can be any substrate requiring substrate processing, such as LCD panel substrates or wafers, including deposition and etching.

[0004] Meanwhile, in response to the increasing demand for large substrates and the need for increased production speed through the processing of a larger number of substrates, inductively coupled plasma processing units that perform substrate processing are also becoming larger.

[0005] Accordingly, as the above-mentioned inductively coupled plasma processing device becomes larger, the planar arrangement size of the components installed in the inductively coupled plasma processing device and the antenna also needs to be increased.

[0006] Specifically, as antenna planar arrangement patterns for an inductively coupled plasma processing apparatus for large substrate processing, patterns such as those in Patent Documents 1 and 2 are presented.

[0007] However, for good substrate processing, it is important to form a uniform plasma within the processing space; yet, as substrates have recently become larger, the uniformity of the plasma formed within the processing space of the inductively coupled plasma processing device has decreased, and there is a problem in that it is difficult to control the plasma uniformity.

[0008] Specifically, in the case of conventional technology such as Patent Documents 1 and 2, there is a problem in that it is difficult to control plasma near the vertex, which limits the improvement of the uniformity of substrate processing.

[0009] In particular, referring to Patent Documents 1 and 2, there is a problem in that it is impossible to independently perform plasma control near the vertices of a rectangular shape as the antenna located near the edge of the substrate, that is, at the outermost edge, is positioned along the edge of the substrate.

[0010] In addition, when multiple antennas are branched and installed to improve plasma uniformity, the low inductance at each antenna results in a decrease in plasma density, which poses a problem in that it is impossible to perform good substrate processing.

[0011] Accordingly, Patent Documents 3 and 4 proposed a method of installing one or more corner antenna members that are positioned adjacent to the vertices of a rectangular substrate to control the plasma density of the corner portions, thereby enabling local plasma control and enabling good substrate processing.

[0012] However, in the case of the methods according to Patent Documents 3 and 4, the installation of the antenna member near the vertex increases the number of surfaces facing the support frame supporting the window, and power loss occurs due to the formation of parasitic capacitance between the support frame and the antenna member, which lowers process efficiency.

[0013] Furthermore, there are problems such as damage to the antenna member due to arcing occurring between the support frame and the antenna member, or the generation of particles acting as a cause of contamination, or increased operating costs due to the need for device maintenance.

[0014] (Patent Document 1) KR 10-2055371 B1

[0015] (Patent Document 2) KR 10-2020622 B1

[0016] (Patent Document 3) KR 10-2022-0151461 A

[0017] (Patent Document 4) KR 10-2023-0059442 A The problem to be solved

[0018] The objective of the present invention is to provide an inductively coupled plasma processing apparatus that can significantly improve the uniformity and efficiency of substrate processing by enabling plasma control without reducing plasma density in corner portions, in order to solve the above-mentioned problems. means of solving the problem

[0019] The present invention is created to achieve the purpose of the present invention as described above, and the present invention comprises: a chamber body (100) having an opening formed on the upper side; a window assembly (200) including one or more windows (210) that cover the opening to form a processing space (S) together with the chamber body (100), and a support frame (220) that supports the windows (210); a substrate support member (300) installed on the chamber body (100) to support a substrate (10); and a gas injection member that injects gas into the processing space (S). The above window assembly (200) includes an antenna unit (500) installed in a reference plane area corresponding to the planar shape of the substrate (10) on the upper part of the above window assembly (200) to form an induced electric field in the processing space (S); the antenna unit (500) includes one or more corner antenna groups (700) arranged adjacent to the vertex of the reference plane area to control the plasma density of the corner portion; the corner antenna groups (700) are arranged at intervals from the center of the reference plane area toward the vertex, power is applied such that the current direction is the same, and the first normal (L) of the plate surface p) a plurality of lower antenna members (711, 712, 713) that are parallel to the upper surface of the window (210); and a second normal (L) of the plate surface that is positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), and to which power is applied so that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713). h An inductive electric field plasma processing apparatus is disclosed, characterized by including one or more upper antenna members (731, 732) that form an angle of 0 to 90° with the first normal (Lp).

[0020] The planar shape of the chamber body (100), the substrate (10), and the reference plane area can be rectangular.

[0021] It is preferable that the gap formed by the lower antenna members (711, 712, 713) in the direction of the first normal (Lp) with the adjacent lower antenna members (711, 712, 713) is smaller than the gap formed by the upper end of the lower antenna members (711, 712, 713) in the direction of the normal of the window (210) with the lower end of the adjacent upper antenna members (731, 732).

[0022] The upper antenna members (731, 732) are installed in multiple numbers spaced apart in the normal direction of the window (210), and it is preferable that the spacing between the upper antenna members (731, 732) and adjacent upper antenna members (731, 732) is smaller than the spacing between the upper antenna members (731, 732) and the upper antenna members (711, 712, 713).

[0023] The window assembly (200) may additionally have a ceramic cover member installed to protect the surface facing the processing space (S).

[0024] The corner antenna group (700) may include first connecting antenna members (721, 722) connecting the other end of each of the lower antenna members (711, 712, 713) and the one end of each of the upper antenna members (731, 732), and second connecting antenna members (723, 724) connecting the other end of each of the upper antenna members (731, 732) and the one end of each of the lower antenna members (711, 712, 713).

[0025] The first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) may have a plurality of second connecting parts (792) formed at predetermined intervals to allow for a change in the connection height of the lower antenna members (711, 712, 713) and the upper antenna members (731, 732) being connected.

[0026] The first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) may be extended vertically or at an angle upward from the upper surface of the window (210).

[0027] The first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) may have a plate surface that is perpendicular to the side of the support frame (220).

[0028] The above corner antenna group (700) can form a three-dimensional spiral structure.

[0029] The free end of the lower antenna member (711) located furthest from the vertex among the plurality of lower antenna members (711, 712, 713) is connected to an RF power source (150), and the free end of the lower antenna member (713) located closest to the vertex among the plurality of lower antenna members (711, 712, 713) can be grounded.

[0030] The above upper antenna members (731, 732) may be arranged in multiple numbers spaced apart in the vertical direction.

[0031] The plurality of upper antenna members (731, 732) may be arranged so that at least a portion overlaps in the vertical direction with the upper antenna members (731, 732) that are adjacent vertically.

[0032] The upper antenna members (731, 732) may be installed to overlap vertically with at least some of the lower antenna members (711, 712, 713).

[0033] The upper antenna member (731, 732) may be formed concavely in the portion facing the vertex.

[0034] The two ends of the plurality of lower antenna members (711, 712, 713) can be perpendicular to the side of the support frame (220).

[0035] The above plurality of lower antenna members (711, 712, 713) may form a straight line that is bent two or more times when viewed from above, a curve, or a combination of a straight line and a curve.

[0036] It may include edge antenna groups (510) spaced apart from the sides of the reference plane area and the one or more corner antenna groups (700).

[0037] The corner antenna group (700) and the edge antenna group (510) can be installed such that the current direction in adjacent parts is the same.

[0038] In order for the above windows (210) to be arranged in a plurality of m×n (m and n are natural numbers greater than or equal to 2) arrangements in the horizontal and vertical directions, the support frame (220) may have a plurality of installation openings (211) of a grid structure formed therein.

[0039] The above corner antenna group (700) can be installed in correspondence with a vertex installation opening (211) that is positioned corresponding to a vertex of the reference plane area among the plurality of installation openings (211).

[0040] The antenna section (500) may additionally include one or more inner antenna groups (520, 530) arranged concentrically with the edge antenna group (510) inside the edge antenna group (510). Effects of the invention

[0041] The inductively coupled plasma processing apparatus according to the present invention has the advantage of being able to significantly improve the uniformity of substrate processing by enabling plasma control at the corner portions without reducing plasma density, as a group of corner antennas for controlling plasma density is installed corresponding to the vertices, i.e., corner portions, of a rectangular substrate.

[0042] In particular, the inductively coupled plasma processing apparatus according to the present invention can significantly improve power efficiency for forming an inductive electric field by forming a corner antenna group consisting of a plurality of lower antenna members arranged perpendicularly to the upper surface of a window and an upper antenna member positioned higher than the lower antenna members and forming a three-dimensional helical structure with the plurality of lower antenna members, thereby forming an inductive electric field of sufficient strength while minimizing the formation of parasitic capacitors between the sides of the support frame near the vertex.

[0043] Furthermore, by minimizing the formation of parasitic capacitors, damage to the antenna member and / or support frame can be prevented, and by minimizing the formation of particles, maintenance costs of the inductively coupled plasma processing device can be minimized.

[0044] In particular, the upper antenna member is positioned horizontally with respect to the upper surface of the window, thereby minimizing the formation of parasitic capacitors between the sides of the support frame near the point, which can significantly improve the power efficiency for forming an induced electric field.

[0045] In addition, the inductively coupled plasma processing device according to the present invention can minimize maintenance costs of the device by forming a relatively weak electric field toward the window through the upper antenna member being formed relatively higher than the lower antenna member, thereby minimizing particle generation on the bottom surface of the window, i.e., the surface facing the processing space.

[0046] Furthermore, the maintenance costs of the device can be minimized by extending the replacement cycle of the ceramic cover member, which protects against particle formation on the bottom surface of the window. Brief explanation of the drawing

[0047] FIG. 1 is a cross-sectional view showing an inductively coupled plasma treatment apparatus according to the present invention. FIG. 2 is a plan view showing the window assembly and antenna part of the inductively coupled plasma processing apparatus of FIG. 1. FIG. 3a is a conceptual diagram showing the RF power supply and grounding of the antenna section of FIG. 2, and FIG. 3b is an enlarged view of section A in FIG. 3a. Figure 4 is a circuit diagram showing the equivalent circuit of the antenna section of Figure 2. FIG. 5 is a cross-sectional view in the V-V' direction of FIG. 2. FIGS. 6a to 6e are drawings showing an example of a corner antenna group among the antenna parts shown in FIG. 2, where FIG. 6a is a perspective view of the corner antenna group, FIG. 6b is an exploded perspective view of the corner antenna group, FIG. 6c is a front view of the corner antenna group, and FIG. 6d is a plan view showing horizontal antenna members among the corner antennas. FIG. 7 is a side view showing the connection structure between the antenna member of the corner antenna shown in FIG. 6a and the power connection overall. FIG. 8 is a conceptual diagram showing the formation of a magnetic field at a corner portion among the magnetic fields formed by the antenna portion shown in FIG. 2. FIG. 9a is a simulation conceptual diagram showing the formation of an electric field at a corner portion among the electric fields formed by the prior art, namely Patent Document 4, and FIG. 9b is a simulation conceptual diagram showing the formation of an electric field at a corner portion among the electric fields formed by the antenna portion shown in FIG. 2. Specific details for implementing the invention

[0048] The inductively coupled plasma treatment apparatus according to the present invention will be described in detail below with reference to the attached drawings.

[0049] An inductively coupled plasma processing apparatus according to the present invention comprises, as illustrated in FIGS. 1 and 2, a chamber body (100) having an opening formed on the upper side; a window assembly (200) including one or more windows (210) that cover the opening to form a processing space (S) together with the chamber body (100) and a support frame (220) that supports the windows (210); a substrate support member (300) installed on the chamber body (100) to support a substrate (10); a gas injection member that injects gas into the processing space (S); and an antenna member (500) installed on the upper part of the window assembly (200) in a reference plane area corresponding to the planar shape of the substrate (10) to form an induced electric field in the processing space (S).

[0050] The above chamber body (100) has an opening formed on its upper side and is configured to form a processing space (S) together with the window assembly (200) described later; any configuration capable of withstanding a predetermined vacuum pressure required for process execution is possible.

[0051] The above chamber body (100) preferably has a planar shape corresponding to the planar shape of the substrate (10) being processed, for example, the planar shape is a rectangular shape.

[0052] And the above chamber body (100) may have one or more gates (110) formed for the input and output of a substrate (10), and may be connected to an exhaust pipe (180) connected to a vacuum pump (not shown) to control pressure and remove by-products within the processing space (S).

[0053] In addition, the chamber body (100) may be detachably coupled with a cover member (140) installed to cover the antenna part (500) for the purpose of supporting the antenna part (500) and shielding the induced electric field formed in the antenna part (500).

[0054] The above gas injection unit (not shown) is configured to inject gas into a processing space (S), and can be configured in various ways depending on the gas injection structure and can be installed on a support frame (220) described later.

[0055] Specifically, the gas injection unit (not shown) may be configured to include one or more flow paths formed in the support frame (220) through which gas flows, and a plurality of injection ports connected to the flow paths and formed up to the bottom surface of the support frame (220).

[0056] In addition, the above gas injection unit (not shown) can be configured in various ways, such as being installed separately from the support frame (220), being formed in a window, or being installed on the side wall of the process chamber (100).

[0057] The above substrate support member (300) is configured such that the substrate (10) is seated thereon, and any configuration capable of supporting the substrate (10) is possible. Depending on the process, an RF power source (150) may be applied or grounded, and a heat transfer member for cooling or heating may be installed.

[0058] The above window assembly (200) is configured to include one or more windows (210) that cover an opening of the chamber body (100) to form a processing space (S) together with the chamber body (100), and a support frame (220) that supports the windows (210), and various configurations are possible depending on the installation structure of the windows (210) and the support frame (220).

[0059] The above window (210) can have various structures as a configuration interposed between the processing space (S) and the antenna part (500) so as to form an induced electric field in the processing space (S) by the antenna part (500), and the material used may be quartz, ceramic, metal, etc.

[0060] The above window (210) may not be composed of a single window (210) for processing a large substrate, but may be composed of multiple windows (210).

[0061] Here, when the above-mentioned windows (210) are installed in multiple numbers, they may have various shapes such as polygons like triangles and squares, circles, and ellipses, taking into consideration the formation of an induced electric field for substrate processing.

[0062] In addition, the planar shape of the window (210) can have various combinations, such as having a single shape like a rectangle, or being composed of a combination of multiple planar shapes of different shapes and sizes.

[0063] The above support frame (220) can be any configuration that supports the window (210) and can stably support the window (210).

[0064] For example, the support frame (220) is preferably made of a metal material so as to stably support the heavy window (210), but can be made of various materials such as a combination of metal and non-metal materials, or non-metal materials, as long as it can provide sufficient rigidity.

[0065] Here, the support frame (220) is preferably made of a metal material as it requires sufficient rigidity to support the window (210). In this case, if the window (210) is also made of a metal material, an insulating member (not shown) may be provided for electrical insulation to support the window (210).

[0066] Meanwhile, in order to support each window (210) when the above-mentioned windows (210) are installed in multiple numbers, the support frame (220) may have multiple installation openings (221) formed with a shape corresponding to the planar shape of the supported windows (210).

[0067] That is, the support frame (220) has a plurality of installation openings (221) formed therein, and each of the plurality of installation openings (221) can have a window (210) installed therein having a shape corresponding to the planar shape of the installation opening (221).

[0068] For example, the support frame (220) may have a plurality of installation openings (211) of a grid structure formed so that a plurality of windows (210) can be arranged in an m×n (m and n are natural numbers greater than or equal to 2) arrangement in the horizontal and vertical directions.

[0069] To this end, the support frame (220) may include a rectangular outer frame (222) installed on the top of the chamber body (100) and an inner frame (223) that forms grid-structured installation openings (211) on the inside of the outer frame (222).

[0070] The above outer frame (222) has an upper planar shape, i.e., a rectangular shape, of the chamber body (100) and is configured to be installed on the upper part of the chamber body (100), and various configurations are possible.

[0071] Here, the outer frame (222) can be sealedly coupled with the chamber body (100) by interposing an O-ring (not shown) between the upper part of the chamber body (100).

[0072] The inner frame (223) is configured to form installation openings (211) arranged in a grid structure, for example, in the horizontal and vertical directions in an m×n (m and n are natural numbers greater than or equal to 2) on the inner side of the outer frame (222), and may be composed of (m-1) horizontal frames and (n-1) vertical frames corresponding to the number of grids.

[0073] The inner frame (223) and outer frame (222) are preferably made of a material with high rigidity, such as metal, considering the load of the window (210), but are not necessarily limited thereto.

[0074] In addition, the inner frame (223) and outer frame (222) may be formed from a plurality of frame members, but considering rigidity, it is preferable to form them as a single unit with a minimum number of members.

[0075] Meanwhile, the installation opening (211) formed in the support frame (220) may have various structures depending on the support structure of the window (210).

[0076] For example, the support frame (220) may have a step formed on the inner circumference of the installation opening (211) so as to support the window (210) in correspondence with the step formed on the edge side of the window (210), as shown in FIG. 1.

[0077] Meanwhile, the window assembly (200) may additionally have a ceramic cover member (not shown) installed to protect the surface facing the processing space (S).

[0078] The above cover member is a member installed to cover the side of the bottom surface of the window assembly (200) that is exposed to the processing space (S) in order to protect the side facing the processing space (S), and can be configured in various ways, such as a plate member.

[0079] The material of the above cover member may be ceramic.

[0080] The above antenna unit (500) is configured to form an induced electric field in a processing space (S) by being installed in a reference plane area corresponding to the planar shape of the substrate (10) on the upper part of the window assembly (200). Various configurations are possible depending on the size of the substrate (10) to be processed, the substrate processing conditions, etc.

[0081] In particular, the antenna section (500) includes one or more corner antenna groups (700) that are positioned adjacent to the vertex of the reference plane region to control the plasma density of the corner portion.

[0082] And, in order to solve the problems of Patent Documents 3 and 4, the above-mentioned corner antenna group (700) is arranged at a distance from the center of the reference plane region toward the vertex direction as shown in FIGS. 2 to 6d, power is applied such that the current direction is the same, and the first normal (L) of the plate surface p ) a plurality of lower antenna members (711, 712, 713) that are parallel to the upper surface of the window (210); a second normal (L) of the plate surface that is positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), and to which power is applied so that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713). h ) may include one or more upper antenna members (731, 732) that form an angle of 0 to 90° with the first normal (Lp).

[0083] Here, the reference plane area is defined as a plane area corresponding to the plane shape of the substrate (10) to be processed, and can form a rectangular shape when the plane shape of the substrate (10) is rectangular, and is defined as an area that is set larger than the edge of the substrate (10).

[0084] For example, the reference plane area may be defined as an area that is larger than the plane size of the substrate (10) and smaller than the opening formed by the outer frame (222) described above.

[0085] At this time, the above window (210) is positioned so that its upper surface is horizontal, that is, the normal is vertical (Z-axis direction).

[0086] The plurality of lower antenna members (711, 712, 713) are spaced apart from the center of the reference plane region in the direction of the vertex, power is applied such that the current direction is the same, and the first normal (L) of the plate surface p Various configurations are possible, as this is a configuration that is parallel to the upper surface of the window (210).

[0087] Specifically, the plurality of lower antenna members (711, 712, 713) may be formed as plate-shaped conductors having a predetermined width and thickness and having a conductive metal material such as copper.

[0088] In particular, the plurality of lower antenna members (711, 712, 713) are, the first normal (L) of the plate surface p ) can be positioned parallel to the upper surface of the window (210), that is, perpendicular to the upper surface of the window (210).

[0089] And the above plurality of lower antenna members (711, 712, 713) may form a straight line that is bent two or more times when viewed from above, a curve, or a combination of a straight line and a curve.

[0090] For example, the plurality of lower antenna members (711, 712, 713) may include a straight section (711a, 712a, 713a) parallel to the first diagonal section (511d) of the edge antenna group (510) described later, and a pair of diagonal sections (711b, 712b, 713b, 711c, 712c, 713c) parallel to each of the two sides forming the vertices at both ends of the straight section (711a, 712a, 713a).

[0091] That is, the plurality of lower antenna members (711, 712, 713) may be formed concavely in the portion facing the vertex.

[0092] The above straight sections (711a, 712a, 713a) are sections parallel to the first diagonal section (511d) of the edge antenna group (510) and can be spaced apart from the center of the reference plane area in the direction of the vertex.

[0093] The above pair of diagonal sections (711b, 712b, 713b, 711c, 712c, 713c) are sections parallel to each of the two sides forming the vertices at both ends of the straight sections (711a, 712a, 713a), and their ends may be arranged to form a first gap (D1) that is predetermined with the side of the outer frame (222), as shown in FIG. 6c and FIG. 7.

[0094] In addition, it is preferable that both ends of the plurality of lower antenna members (711, 712, 713) be perpendicular to the side of the support frame (220), i.e., the outer frame (222), in order to minimize the area facing the support frame (220), i.e., the outer frame (222), and to minimize the formation of parasitic co-occurrence with the outer frame (222).

[0095] The upper antenna members (731, 732) are positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), and power is applied so that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713), and the second normal (L) of the plate surface h Various configurations are possible, in which ) forms an angle of 0 to 90° with the above-mentioned first normal (Lp).

[0096] Specifically, the upper antenna member (731, 732) may be formed as a plate-shaped conductor having a predetermined width and thickness and having a conductive metal material such as copper.

[0097] And the above upper antenna members (731, 732) are the second normal (L) of the plate surface h) can be positioned at an angle of 0 to 90° with the above-mentioned first normal (Lp).

[0098] In particular, the upper antenna members (731, 732) can be arranged perpendicular to the upper surface of the window (210), that is, parallel to the upper surface of the window (210).

[0099] And the upper antenna members (731, 732) may form a straight line that is bent two or more times when viewed from the top, a curve, or a combination of a straight line and a curve.

[0100] For example, the upper antenna member (731, 732) may have a shape similar to that of the lower antenna members (711, 712, 713) described above, and may include a straight section (731a, 732a) parallel to the straight section (711a, 712a, 713a) of the lower antenna member (711, 712, 713), and a pair of diagonal sections (731b, 732b, 731c, 732c) parallel to each of the two sides forming the vertices at both ends of the straight section (731a, 732a).

[0101] That is, the upper antenna member (731, 732) may be formed concavely in the portion facing the vertex.

[0102] The above straight portions (731a, 732a) are portions that are parallel to the straight portions (711a, 712a, 713a) of the lower antenna member (711, 712, 713) and can be arranged with a gap in the vertical direction.

[0103] The above pair of diagonal sections (731b, 732b, 731c, 732c) are sections parallel to each of the two sides forming the vertices at both ends of the straight sections (731a, 732a), and their ends can be arranged to form a pre-set second gap (D2) with the side of the outer frame (222), as shown in FIG. 6d.

[0104] For example, the first interval (D1) and the second interval (D2) can be set identically.

[0105] Meanwhile, the upper antenna members (731, 732) and the lower antenna members (711, 712, 713) are characterized by forming a single three-dimensional helical structure together with the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) described later.

[0106] Accordingly, corresponding to the number of the lower antenna members (711, 712, 713), that is, when the number of installed lower antenna members (711, 712, 713) is n (n is a natural number greater than or equal to 2), the number of installed upper antenna members (731, 732) is composed of n-1.

[0107] In the case of the corner antenna group (700) illustrated in FIGS. 2 to 6d, the number of lower antenna members (711, 712, 713) installed is 3, and the number of upper antenna members (731, 732) installed can be 2.

[0108] In this case, when the upper antenna members (731, 732) are installed in multiple numbers, the multiple upper antenna members (731, 732) may be spaced apart in the vertical direction to maintain a sufficient horizontal distance from the outer frame (222) corresponding to the vertex of the reference rectangle.

[0109] In particular, the plurality of upper antenna members (731, 732) may be arranged so that at least a portion overlaps in the vertical direction with the upper antenna members (731, 732) that are adjacent vertically.

[0110] Meanwhile, it is preferable that the upper antenna members (731, 732) are positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210).

[0111] This allows the upper antenna members (731, 732) to be positioned higher than the lower antenna members (711, 712, 713) relative to the window (210) in consideration of the fact that the induced electric field for substrate processing is formed by the lower antenna members (711, 712, 713), thereby preventing it from affecting the formation of the induced electric field.

[0112] Furthermore, the lower antenna members (711, 712, 713) are positioned higher than the lower antenna members (711, 712, 713) relative to the window (210), thereby minimizing the magnetic flux of the electric field on the bottom side of the window (210) at a corresponding position, which can minimize particle generation.

[0113] Meanwhile, the gap formed between the lower antenna members (711, 712, 713) and the adjacent lower antenna members (711, 712, 713) in the direction of the first normal (Lp) can be formed to be smaller than the gap formed between the upper end of the lower antenna members (711, 712, 713) and the lower end of the adjacent upper antenna members (731, 732) in the direction of the upper surface normal of the window (210).

[0114] That is, the upper antenna members (731, 732) may be installed higher than the lower antenna members (711, 712, 713) in order to minimize the influence on the electric and magnetic fields formed by the lower antenna members (711, 712, 713).

[0115] And in order to maintain a sufficient horizontal distance from the outer frame (222) corresponding to the vertex of the reference plane area, the upper antenna member (731, 732) may be installed to overlap vertically with at least some of the lower antenna members (711, 712, 713).

[0116] Meanwhile, the corner antenna group (700) may include first connecting antenna members (721, 722) that connect the other end of each of the lower antenna members (711, 712, 713) and the one end of each of the upper antenna members (731, 732) so that RF power is applied to one end and grounded to the other end, and second connecting antenna members (723, 724) that connect the other end of each of the upper antenna members (731, 732) and the one end of each of the lower antenna members (711, 712, 713).

[0117] The first connecting antenna members (721, 722) can be configured in various ways to connect the other end of each of the lower antenna members (711, 712, 713) and the one end of each of the upper antenna members (731, 732).

[0118] For example, the first connecting antenna members (721, 722) may be composed of a plate-shaped conductor made of metal material having the same width and thickness as the lower antenna members (711, 712, 713).

[0119] The second connecting antenna members (723, 724) can be configured in various ways as a configuration connecting the other end of each of the upper antenna members (731, 732) and one end of each of the lower antenna members (711, 712, 713).

[0120] For example, the second connecting antenna members (723, 724) may be composed of a plate-shaped conductor made of metal material having the same width and thickness as the lower antenna members (711, 712, 713).

[0121] Meanwhile, the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) may have a plurality of second connecting parts (792) formed at predetermined intervals to allow for a change in the connection height of the lower antenna members (711, 712, 713) and the upper antenna members (731, 732) being connected.

[0122] At this time, the lower antenna members (711, 712, 713) may have a first coupling part (791) into which a bolt is inserted so that they can be coupled by a bolt (not shown) inserted into the second coupling part (792).

[0123] Meanwhile, the configuration of the first coupling part (791) and the second coupling part (792) can be various, such as through holes into which bolts are inserted, depending on the coupling structure such as bolting coupling.

[0124] And the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) may be extended vertically or at an angle upward from the upper surface of the window (210).

[0125] At this time, it is preferable that the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) extend vertically upward from the upper surface of the window (210) in order to maintain a sufficient horizontal distance from the outer frame (222) corresponding to the vertex of the reference rectangle.

[0126] This allows the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) to be spaced sufficiently apart horizontally from the outer frame (222) corresponding to the vertices of the reference rectangle, thereby making the spacing between the first connecting antenna members (721, 722), the second connecting antenna members (723, 724), and the outer frame (222) relatively large, thereby minimizing parasitic co-occurrence and greatly improving the efficiency of inductive electric field formation.

[0127] Furthermore, to minimize the formation of parasitic coffee oscillation, it is preferable that the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) have a plate surface that is perpendicular to the side of the support frame (220), that is, the outer frame (222).

[0128] That is, by minimizing the area of ​​the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) facing the outer frame (222), the formation of parasitic co-occurrence can be minimized, thereby greatly improving the efficiency of inductive electric field formation.

[0129] Meanwhile, the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) can, of course, be formed integrally with at least one of the lower antenna members (711, 712, 713) and the upper antenna members (731, 732).

[0130] And the corner antenna group (700) having the above configuration can form a three-dimensional spiral structure in which an RF power supply (150) is applied to one end and the other end is grounded.

[0131] Here, the three-dimensional helical structure is formed by the lower antenna members (711, 712, 713) and the upper antenna members (731, 732), the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) connecting them, and depending on the arrangement of the lower antenna members (711, 712, 713) and the upper antenna members (731, 732), the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724), various three-dimensional helical structures can be formed.

[0132] Meanwhile, in the corner antenna group (700) having the above configuration, the free end of the lower antenna member (711) located furthest from the vertex among the plurality of lower antenna members (711, 712, 713) is connected to an RF power source (150), and the free end of the lower antenna member (713) located closest to the vertex among the plurality of lower antenna members (711, 712, 713) can be grounded.

[0133] That is, the antenna members of the corner antenna group (700) can be electrically connected by various methods such as welding, bolting, etc., to each power supply member (613) and ground member (623).

[0134] Specifically, the free end of the lower antenna member (711) of the corner antenna group (700) can be connected to a power supply member (613) by one or more power connection conductors (643, 644).

[0135] Here, the power supply member (613) is a member that supplies RF power to each antenna member through a matching network from the RF power source (150), and may have the same material as the antenna member.

[0136] The above power connection conductor (643, 644) is a conductor that connects the free end of the lower antenna member (711) of the corner antenna group (700) and the power supply member (613), and can be configured in various ways, such as being formed integrally with the power supply member (613).

[0137] Meanwhile, when connecting the free end of the lower antenna member (711) of the corner antenna group (700) and the power supply member (613), if it is close to an adjacent outer frame (222), parasitic capacitance may be formed. To prevent this, the power supply member (613) can be connected by a horizontal and vertical separation conductor (644) that is spaced apart inwardly from the side of the outer frame (222) and extends upward, and an extension conductor (643) that is electrically connected to the horizontal and vertical separation conductor (644), extends parallel to the outer frame (222), and is connected to the power supply member (613).

[0138] The above horizontal and vertical separation conductor (644) is a conductor that extends upward while being separated by a third interval (D3) in a direction moving inward from the side of the outer frame (222), and as shown in FIG. 7, it may be composed of a first connecting conductor portion (644a) that is electrically connected to the free end of the lower antenna member (711), a second connecting conductor portion (644b) that is electrically connected to the extension conductor (643), and a diagonal extension portion (644c) that extends diagonally from the first connecting conductor portion (644a) to connect the first connecting conductor portion (644a) and the second connecting conductor portion (644b).

[0139] The above-mentioned extension conductor (643) is a conductor in which one end is electrically connected to the above-mentioned horizontal and vertical separation conductor (644) and the other end is extended parallel to the above-mentioned outer frame (222) and connected to the above-mentioned power supply member (613). Various configurations are possible, such as being formed integrally with the above-mentioned power supply member (613) or being formed as a separate member.

[0140] Meanwhile, among the plurality of lower antenna members (711, 712, 713), the free end of the lower antenna member (713) located closest to the vertex can be combined with the ground member (623) in various ways, such as being directly or indirectly combined.

[0141] For example, the free end of the lower antenna member (713) located closest to the vertex among the plurality of lower antenna members (711, 712, 713) can be connected to the ground member (623) by one or more ground connection conductors (633, 634).

[0142] Meanwhile, as shown in FIG. 4, when the corner antenna group (700) is grounded, variable capacitors (V21~V24) may be interposed to ground it.

[0143] Accordingly, the free end of the lower antenna member (713) is electrically connected to one end of the first ground connection conductor (633) formed by extending upward, and one end of the variable capacitor (V21~V24) is electrically connected to the other end of the first ground connection conductor (633), and can be grounded by being connected to the ground member (623) by the second ground connection conductor (634) which is electrically connected to the other end of the variable capacitor (V21~V24).

[0144] Meanwhile, since the installation height of some of the antenna members of the corner antenna group (700) from the upper surface of the window (210) can be varied, it is preferable that the power supply member (613) and the grounding member (623) be connected to the antenna member by bolt connection to adjust the installation height of the antenna member.

[0145] And, considering the adjustment of the installation height of the antenna member, the horizontal and vertical separation conductor (644) and the first ground connection conductor (633) can be electrically connected to the lower antenna member (711, 713) formed with the first connection part (791), by forming a plurality of bolt connection holes (793, 794) for bolt connection at predetermined intervals as plate-shaped conductive members.

[0146] Meanwhile, the corner antenna group (700) having the above configuration can be installed in correspondence with the vertex installation opening (211) located in correspondence with the vertex of the reference plane area among the plurality of installation openings (211).

[0147] By installing a corner antenna group (700) having the above configuration, the voltage applied to the part where the RF power is applied is independently controlled, thereby enabling plasma control in the corner part without reducing the plasma density according to the process, and thus the uniformity of the substrate processing can be greatly improved.

[0148] Furthermore, the antenna members constituting the corner antenna group (700) can be sufficiently spaced apart from the side of the support frame (220), particularly the outer frame (222), or the area of ​​the portion facing the side of the outer frame (222) can be minimized to minimize the formation of parasitic capacitors between the outer frames (222), thereby minimizing power loss and significantly improving the power efficiency for forming an induced electric field.

[0149] FIG. 9a is a simulation conceptual diagram showing the formation of an electric field at a corner portion among the electric fields formed by the prior art, namely Patent Document 4, and FIG. 9b is a simulation conceptual diagram showing the formation of an electric field at a corner portion among the electric fields formed by the antenna portion shown in FIG. 2.

[0150] As shown in FIGS. 9a and 9b, in the case of the antenna structure shown in FIGS. 2 to 6d, which is the structure of the present invention, it can be confirmed that the electric field concentration effect in the part adjacent to the corner antenna member is significantly mitigated.

[0151] In addition, it can be seen that the electric field concentration effect between the corner antenna member and the adjacent support frame, i.e., the outer frame (222), is also significantly mitigated.

[0152] In addition, it was confirmed that when an etching process was performed on a SiOx film using the inductive field plasma treatment device according to the present invention and the inductive field plasma treatment device according to Patent Document 4, the etching rate was significantly improved from 2232.9 Å / min and uniformity from 10.67% to 2596.6 Å / min and uniformity from 5.91%.

[0153] Although there are some differences in other parts, such as the installation height of each antenna member and the remaining antenna groups excluding the corner antenna group, the etching target film, etching gas, and process time are performed identically. It can be confirmed that the etching speed and uniformity are significantly improved by the installation of the corner antenna group as described above.

[0154] Meanwhile, the corner antenna group (700) having the above configuration can be utilized by combining it with antenna structures of various patterns and structures in the remaining parts excluding the corner parts.

[0155] In particular, the antenna section (500) including the corner antenna group (700) may include an edge antenna group (510) spaced apart from the sides of a semi-rectangular area and one or more corner antenna groups (700).

[0156] The above edge antenna group (510) is an antenna group arranged at a distance from the side of the reference plane area and one or more corner antenna groups (700), and may include a plurality of edge antenna members (511).

[0157] And the edge antenna member (511) is an antenna member that is installed in one or more places and is spaced apart from the side of the reference plane area and one or more corner antenna groups (700) to form an edge antenna group (510), and can be installed in a preset pattern by a plate-shaped conductor such as copper.

[0158] In particular, the edge antenna group (510) may have one or more loops, preferably multiple loops, lateral loop structures by means of the edge antenna member (511).

[0159] In addition, it is preferable that the corner antenna group (700) and the edge antenna group (510) have the same current direction in adjacent parts.

[0160] As described above, if the direction of current flowing through the lower antenna members (711, 712, 713) of the corner antenna group (700) is made the same, a stronger induced electric field can be formed.

[0161] Additionally, the corner antenna group (700) may be positioned at the same height from the edge antenna group (510) and the upper surface of the window (210) in a portion adjacent to the edge antenna group (510).

[0162] As described above, if the corner antenna group (700) is positioned at the same height from the edge antenna group (510) and the upper surface of the window (210) in a portion adjacent to the edge antenna group (510), the enhancement effect of the induced electric field formed by the corner antenna group (700) and the edge antenna group (510) can be maximized.

[0163] Meanwhile, the number and length of the above edge antenna members (511) can be determined according to the length and number of other antenna members constituting the antenna section, such as the antenna members of the corner antenna group (700).

[0164] Here, the lengths of the edge antenna members (511) are preferably the same as the length of other antenna members or have a preset allowable deviation for the convenience of controlling the impedance of the entire antenna part (500).

[0165] And each loop angle of the edge antenna member (511) can have a loop angle of 90°×k (where k is a natural number greater than or equal to 1), such as 90°, 180°, 270°, 360°, etc. from the center of the reference plane area.

[0166] Here, the loop angle is defined as the rotation angle extending from one end to the other with respect to the center of the reference plane region.

[0167] Meanwhile, the edge antenna member (511) of the edge antenna group (510) is arranged with a gap between the side of the reference plane area, as shown in FIGS. 2 to 3b, as an example, and one end may be connected to an RF power source (150) and the other end may be grounded.

[0168] Additionally, the edge antenna group (510), particularly the edge antenna member (511), may have one or more straight sections on the sides excluding the vertices of the rectangle of the substrate (10) and one or more lateral radiation sections (511d) opposite the corner sections in order to form a loop structure.

[0169] Additionally, when the edge antenna group (510) has one or more lateral radiation portions (511d), the corner antenna group (700), in order to form an enhanced induced electric field together with the lateral radiation portions (511d), the lateral radiation portions (511d) of the edge antenna group (510) are, in an adjacent portion, straight portions (711a, 712a, 713a) of the lower antenna members (711, 712, 713) and It is desirable to be in parallel.

[0170] Furthermore, the edge antenna group (510) and corner antenna group (700) can form an enhanced induced electric field by making the current direction the same in adjacent parts.

[0171] Specifically, as shown in FIG. 5, an enhanced induced electric field can be formed by making the direction of current flowing in the lateral radiation portion (511d) of the edge antenna group (510) and the lower antenna member (711, 712, 713) of the corner antenna group (700) parallel thereto the same.

[0172] Meanwhile, the lower antenna members (711, 712, 713) of the corner antenna group (700), particularly the straight portions (711a, 712a, 713a) that have the same current direction as the lateral radiation portion (511d) of the edge antenna group (510), are preferably installed such that they include the vertex of the substrate (10) when viewed from above or are installed further inward than the vertex of the substrate (10) in order to control the plasma density near the vertex of the substrate (10).

[0173] Meanwhile, the above edge antenna group (510) may include four edge antenna members (511) such that one end (a circle marked in black in the drawing) is positioned at the center of each of the four sides of the reference plane area to form a loop structure.

[0174] And each of the above edge antenna members (511) may include one or more parallel parts.

[0175] The above parallel section is defined as a section in which a single conductor branches into two or more and then combines back into a single conductor in order to partially expand the range of inductive electric field formation.

[0176] Meanwhile, the above edge antenna group (510) was described as an embodiment composed of four, but various combinations are possible, such as being composed of two or more depending on the length of the antenna member, etc.

[0177] However, it is preferable that the edge antenna group (510) has a diagonal portion facing the corner antenna group (700) to form a relatively concentrated magnetic field together with the corner antenna group (700) described later.

[0178] The above-mentioned diagonal portion is a part for forming a relatively concentrated magnetic field that is installed adjacent to the corner antenna group (700) described later, and it is preferable that power is applied so that current flows in the same direction as the current flowing from the corner antenna group (700), and it can be formed in various patterns such as straight lines and curves facing the corner antenna group (700).

[0179] Meanwhile, when the size of the substrate (10) to be processed is large, in order to form an induced electric field suitable for processing a large substrate, the antenna unit (500) may have an inner antenna group (520, 530) of various patterns installed inside the edge antenna group (510) together with the edge antenna group (510) or without the edge antenna group (510).

[0180] In order to form an induced electric field suitable for processing a large substrate, the antenna section (500) is an antenna group installed inside the edge antenna group (510), and can be arranged in various patterns such as being arranged concentrically with the edge antenna group (510) or having one or more small loop structure antenna groups arranged.

[0181] For example, the antenna section (500) may additionally include one or more inner antenna groups (520, 530) arranged concentrically with the edge antenna group (510).

[0182] In particular, the inner antenna group (520, 530) may include a middle antenna group (520) located at the center of the reference plane area, and one or more middle antenna groups (540) positioned between the middle antenna group (520) and the edge antenna group (510) and positioned concentrically with the middle antenna group (520).

[0183] The above middle antenna group (520) is an antenna group arranged in a circular, polygonal, preferably square pattern at the center of a reference plane area by one or more antenna members, and can be configured in various ways depending on the number of antenna members, loop angle, and pattern.

[0184] For example, the middle antenna group (520) may have a planar shape with a rectangular pattern and may be composed of two antenna members and arranged at a loop angle of about 810˚.

[0185] The above middle antenna group (520) can have a triple loop structure based on the loop angle and number of installations as described above.

[0186] Meanwhile, one end of each of the above antenna members may be disposed on opposite sides.

[0187] And the above middle antenna group (520) can be located within the central installation opening (221) located in the center among the plurality of installation openings (221) described above.

[0188] Meanwhile, the middle antenna group (520) is installed relatively further inward than the middle antenna group (540) and the edge antenna group (510), and it is preferable that it has the largest loop angle relatively when an antenna member of substantially the same length is installed.

[0189] The above middle antenna group (540) may be arranged between the middle antenna group (520) and the edge antenna group (510) in one or more places and may be arranged concentrically with the middle antenna group (520).

[0190] And the middle antenna group (540) may have the same or similar pattern as the edge antenna group (510) described above.

[0191] For example, the middle antenna group (540) may be composed of four antenna members, having a rectangular pattern in planar shape as shown in FIG. 2, and may be arranged at a loop angle of about 270˚.

[0192] The above middle antenna group (540) can have a triple loop structure based on the loop angle and number of installations as described above.

[0193] Meanwhile, one end of each of the above antenna members can be placed on each of the four sides.

[0194] And the middle antenna group (540) can be installed to surround the central installation opening (221) located in the center among the plurality of installation openings (221) described above.

[0195] Meanwhile, the middle antenna group (540) is installed relatively further inward than the edge antenna group (510), and when an antenna member of substantially the same length is installed, it is preferable that it have a smaller loop angle than the edge antenna group (510).

[0196] And, similar to the edge antenna group (510) described above, it is preferable that the middle antenna group (540) has a diagonal portion facing the corner antenna group (700) to form a partially reinforced induced electric field.

[0197] The above-mentioned diagonal portion is a portion for forming a partially reinforced magnetic field near the corner antenna group (700) described later, and it is preferable that power be applied so that current flows in the same direction as the current flowing from the corner antenna group (700), and it can be formed in various patterns such as straight lines and curves facing the corner antenna group (700).

[0198] The inner antenna group (520, 530) may have one or more loops, preferably multiple loops, inner loop structures by means of inner antenna members (521, 531).

[0199] In Figure 2, the solid and hollow points represent examples of parts where the RF power is connected and parts where it is grounded, respectively.

[0200] Meanwhile, regarding the installation of the corner antenna group (700) described above, the corner antenna group (700) may be installed in correspondence with a vertex installation opening (211) located in correspondence with a vertex of a reference plane area among a plurality of installation openings (211).

[0201] As described above, when the corner antenna group (700) is installed corresponding to a single vertex installation opening (211), distortion by the support frame (220) can be prevented when a relatively strong induced electric field is formed.

[0202] Additionally, a portion of the edge antenna group (510) may be positioned at a vertex installation opening (211) to prevent distortion by the support frame (220) when a relatively strong induced electric field is formed.

[0203] Furthermore, a portion of the inner antenna group (520, 530) may be installed in correspondence with the vertex installation opening (211) to prevent distortion by the support frame (220) when a relatively strong induced electric field is formed.

[0204] Meanwhile, at least some of the other ends of the antenna members (511, 521, 531, 541) constituting the antenna section (500) may be connected to a voltage-variable capacitor (VVC; V30, V41~V44, V21~V24, V11~V14) for adjusting the impedance, as shown in FIG. 4, and grounded.

[0205] And one end of the antenna members (511, 521, 531, 541) constituting the antenna section (500) is connected to an RF power source (150) of a preset frequency through a matching network (not shown).

[0206] The above RF power supply (150) may be an RF power supply of a frequency suitable for performing the required process, which applies RF power to the antenna part (500) to form an induced electric field near the window (210).

[0207] The above variable capacitors (V30, V41~V44, V21~V24, V11~V14) are connected to and grounded at the ground terminals of at least some of the antenna members (511, 521, 531, 541) constituting the antenna section (500), and can be configured in various ways as a configuration for impedance adjustment for plasma density control.

[0208] For example, the middle antenna group (520) may be connected to two antenna members (531) connected in parallel and one variable capacitor (V30) for controlling the plasma density of the central portion.

[0209] And the above middle antenna group (540) may have variable capacitors (V41~44) connected to each of the four antenna members (531) connected in parallel to control the plasma density of the middle portion surrounding the central portion.

[0210] And the above edge antenna group (510) may have variable capacitors (V11~14) connected to each of the four antenna members (511) connected in parallel to control the plasma density of the edge portion surrounding the middle portion.

[0211] And, each of the above one or more corner antenna groups (700) may have a variable capacitor (V21~24) connected to it to control the plasma density of the rectangular corner portion formed by the edge portion.

[0212] Meanwhile, in the embodiment of the present invention, although an example was described in which all variable capacitors (V21~24) are connected, it is obvious that only some variable capacitors (V21~24) may be installed, or that fixed capacitors with a constant capacitance may be installed wholly or partially.

[0213] As described above, the antenna unit (500) including the edge antenna group (510) and the corner antenna group (700) can control independent plasma density in the central part and the corner part as described in Patent Document 4, thereby enabling more uniform substrate processing, such as an etching process.

[0214] The foregoing merely describes some preferred embodiments that can be implemented by the present invention. As is well known, the scope of the present invention should not be interpreted as being limited to the above embodiments, and all technical concepts that share the fundamental principles with the technical concept of the present invention described above shall be considered to be included within the scope of the present invention. Explanation of the symbols

[0215] 100 : Chamber body 200 : Window assembly 300 : Substrate support 500 : Antenna part

Claims

Claim 1 A chamber body (100) having an opening formed on the upper side; a window assembly (200) comprising one or more windows (210) that cover the opening to form a processing space (S) together with the chamber body (100), and a support frame (220) that supports the windows (210); and a substrate support member (300) installed on the chamber body (100) to support a substrate (10). It includes a gas injection unit that injects gas into the processing space (S); and an antenna unit (500) that is installed in a reference plane area corresponding to the planar shape of the substrate (10) on the upper part of the window assembly (200) and forms an induced electric field in the processing space (S); the antenna unit (500) includes one or more corner antenna groups (700) that are arranged adjacent to the vertex of the reference plane area and control the plasma density of the corner portion; the corner antenna groups (700) are arranged at intervals from the center of the reference plane area toward the vertex, power is applied such that the current direction is the same, and the first normal (L) of the plate surface p An inductive electric field plasma processing apparatus characterized by comprising: a plurality of lower antenna members (711, 712, 713) that are parallel to the upper surface of the window (210); and one or more upper antenna members (731, 732) that are positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), have power applied to them so that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713), and have a plate surface arranged parallel to the upper surface of the window (210). Claim 2 An inductive electric field plasma processing apparatus according to claim 1, characterized in that the planar shape of the chamber body (100), the substrate (10), and the reference plane region is rectangular. Claim 3 An inductive electric field plasma processing apparatus according to claim 1, characterized in that the gap formed by the lower antenna member (711, 712, 713) with the adjacent lower antenna member (711, 712, 713) in the direction of the first normal (Lp) is smaller than the gap formed by the upper end of the lower antenna member (711, 712, 713) with the lower end of the adjacent upper antenna member (731, 732) in the direction of the normal of the window (210). Claim 4 An inductive electric field plasma processing apparatus according to claim 1, wherein the upper antenna members (731, 732) are installed in a plurality at intervals in the normal direction of the window (210), and the distance between the upper antenna members (731, 732) and adjacent upper antenna members (731, 732) is smaller than the distance between the upper antenna members (731, 732) and the upper antenna members (711, 712, 713). Claim 5 An induction field plasma processing apparatus according to claim 1, wherein the window assembly (200) is further equipped with a ceramic cover member for protecting the surface facing the processing space (S). Claim 6 An inductive electric field plasma processing apparatus according to claim 1, wherein the corner antenna group (700) comprises first connecting antenna members (721, 722) connecting the other end of each of the lower antenna members (711, 712, 713) and one end of each of the upper antenna members (731, 732), and second connecting antenna members (723, 724) connecting the other end of each of the upper antenna members (731, 732) and one end of each of the lower antenna members (711, 712, 713). Claim 7 An inductive electric field plasma processing apparatus according to claim 6, wherein the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) are formed with a plurality of second connecting parts (792) formed at predetermined intervals to enable a change in the coupling height of the lower antenna members (711, 712, 713) and the upper antenna members (731, 732). Claim 8 An inductive electric field plasma processing apparatus according to claim 6, wherein the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) extend vertically or obliquely upward from the upper surface of the window (210). Claim 9 An inductive electric field plasma processing apparatus according to claim 8, wherein the first connecting antenna members (721, 722) and the second connecting antenna members (723, 724) have a plate surface that is perpendicular to the side of the support frame (220). Claim 10 An inductive electric field plasma processing apparatus according to claim 6, wherein the corner antenna group (700) forms a three-dimensional helical structure. Claim 11 An inductive electric field plasma processing apparatus according to claim 6, wherein the free end of the lower antenna member (711) located furthest from the vertex among the plurality of lower antenna members (711, 712, 713) is connected to an RF power source (150), and the free end of the lower antenna member (713) located closest to the vertex among the plurality of lower antenna members (711, 712, 713) is grounded. Claim 12 A chamber body (100) having an opening formed on the upper side; a window assembly (200) comprising one or more windows (210) that cover the opening to form a processing space (S) together with the chamber body (100), and a support frame (220) that supports the windows (210); and a substrate support member (300) installed on the chamber body (100) to support a substrate (10). It includes a gas injection unit that injects gas into the processing space (S); and an antenna unit (500) that is installed in a reference plane area corresponding to the planar shape of the substrate (10) on the upper part of the window assembly (200) and forms an induced electric field in the processing space (S); the antenna unit (500) includes one or more corner antenna groups (700) that are arranged adjacent to the vertex of the reference plane area and control the plasma density of the corner portion; the corner antenna groups (700) are arranged at intervals from the center of the reference plane area toward the vertex, power is applied such that the current direction is the same, and the first normal (L) of the plate surface p ) a plurality of lower antenna members (711, 712, 713) that are parallel to the upper surface of the window (210); a second normal (L) of the plate surface that is positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), and to which power is applied so that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713). h An inductive electric field plasma processing apparatus comprising one or more upper antenna members (731, 732) that form an angle of 0 to 90° with the first normal (Lp), wherein the upper antenna members (731, 732) are arranged in a plurality with spacing in the vertical direction. Claim 13 An inductive electric field plasma processing apparatus according to claim 12, wherein the plurality of upper antenna members (731, 732) are arranged such that at least a portion of them overlap in the vertical direction with an upper antenna member (731, 732) that is adjacent vertically. Claim 14 A chamber body (100) having an opening formed on the upper side; a window assembly (200) comprising one or more windows (210) that cover the opening to form a processing space (S) together with the chamber body (100), and a support frame (220) that supports the windows (210); and a substrate support member (300) installed on the chamber body (100) to support a substrate (10). It includes a gas injection unit that injects gas into the processing space (S); and an antenna unit (500) that is installed in a reference plane area corresponding to the planar shape of the substrate (10) on the upper part of the window assembly (200) and forms an induced electric field in the processing space (S); the antenna unit (500) includes one or more corner antenna groups (700) that are arranged adjacent to the vertex of the reference plane area and control the plasma density of the corner portion; the corner antenna groups (700) are arranged at intervals from the center of the reference plane area toward the vertex, power is applied such that the current direction is the same, and the first normal (L) of the plate surface p ) a plurality of lower antenna members (711, 712, 713) that are parallel to the upper surface of the window (210); a second normal (L) of the plate surface that is positioned higher than the lower antenna members (711, 712, 713) with respect to the window (210), and to which power is applied so that current flows in a direction opposite to the current direction of the lower antenna members (711, 712, 713). h An inductive electric field plasma processing apparatus comprising one or more upper antenna members (731, 732) that form an angle of 0 to 90° with the first normal (Lp), wherein the upper antenna members (731, 732) are installed to overlap vertically with at least some of the lower antenna members (711, 712, 713). Claim 15 An inductive electric field plasma processing apparatus according to claim 14, wherein the upper antenna member (731, 732) is formed concavely in the portion facing the vertex. Claim 16 An inductive electric field plasma processing apparatus according to any one of claims 1 to 11, wherein both ends of the plurality of lower antenna members (711, 712, 713) are perpendicular to the side of the support frame (220). Claim 17 An inductive electric field plasma processing apparatus according to claim 16, wherein the plurality of lower antenna members (711, 712, 713) form a straight line bent two or more times when viewed from above, a curve, or a combination of a straight line and a curve. Claim 18 An inductive electric field plasma processing apparatus according to any one of claims 1 to 11, characterized by including an edge antenna group (510) spaced apart from the side of the reference plane region and the one or more corner antenna groups (700). Claim 19 An inductive electric field plasma processing apparatus according to claim 18, wherein the corner antenna group (700) and the edge antenna group (510) have the same current direction in adjacent portions. Claim 20 An inductive electric field plasma processing apparatus according to claim 18, wherein the support frame (220) is characterized by having a plurality of installation openings (211) of a grid structure formed therein, so that the windows (210) can be arranged in a plurality of m×n (m and n are natural numbers greater than or equal to 2) in the horizontal and vertical directions. Claim 21 An inductive electric field plasma processing apparatus according to claim 20, wherein the corner antenna group (700) is installed corresponding to a vertex installation opening (211) positioned corresponding to a vertex of the reference plane region among the plurality of installation openings (211). Claim 22 An inductive electric field plasma processing apparatus according to claim 18, wherein the antenna portion (500) further comprises one or more inner antenna groups (520, 530) arranged concentrically with the edge antenna group (510) inside the edge antenna group (510).

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