Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of performing deposition, etching, and heat treatment on a substrate. The present invention discloses a substrate processing device comprising: a process chamber (100) forming a processing space (S) in which substrate processing is performed; a support base part (200) disposed spaced apart from the process chamber (100) at the bottom of the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) disposed at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position control part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of performing deposition, etching, and heat treatment on a substrate. Background Technology

[0002] Generally, in order to process a substrate, it is necessary to perform the processing while the substrate is supported in a fixed position, and an electrostatic chuck can be used as a configuration to support and fix the substrate at this time.

[0003] For example, the electrostatic chuck supports and fixes the substrate through a chucking process in which electrostatic force is applied to the substrate to secure it to the contact surface, and can remove the processed substrate through a dechucking process in which electrostatic force is released from the substrate after processing is complete to separate the substrate from the contact surface.

[0004] More specifically, a conventional substrate processing device is configured such that substrate processing is performed by supporting an introduced substrate through a substrate support pin, chucking the substrate through an electrostatic chuck, and moving it along a preset movement path.

[0005] In this case, the conventional substrate processing device performs substrate chucking by precisely moving and adjusting the electrostatic chuck through the UVW stage while the substrate is supported via a substrate support pin, thereby performing alignment for substrate chucking.

[0006] However, as a UVW stage for precise alignment with the substrate is additionally installed in the electrostatic chuck, which includes a number of relatively complex components, there is a problem of a complex structure and an increased number of cables.

[0007] In particular, in a configuration where the electrostatic chuck is positioned above the substrate support pin to contact and support the upper surface of the substrate, the relatively heavy UVW stage is located above, and the driving load for operation increases due to the increased weight of the electrostatic chuck, resulting in a problem of reduced efficiency and durability.

[0008] In addition, conventional substrate processing devices have a problem in that various cable connections and UVW stage motor operation are not smooth because the UVW stage is placed within the vacuum environment where substrate processing is performed.

[0009] In addition, conventional substrate processing devices align the substrate by adjusting the position of the electrostatic chuck while the substrate is supported by the substrate support pin. As the position of the electrostatic chuck, which is the target of imaging by the alignment camera positioned below the substrate support pin, changes, there is a problem in that it is difficult to control the precise alignment between the substrate supported by the substrate support pin and the electrostatic chuck. The problem to be solved

[0010] The objective of the present invention is to provide a substrate processing device capable of adjusting the position of a substrate while it is supported by a substrate support pin, in order to solve the above-mentioned problems. means of solving the problem

[0011] The present invention is created to achieve the above-mentioned purpose of the present invention, and the present invention discloses a substrate processing device comprising: a process chamber (100) forming a processing space (S) in which substrate processing is performed; a support base part (200) disposed spaced apart from the process chamber (100) at the bottom of the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) disposed at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position control part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis.

[0012] It may additionally include a first support member (600) installed on the support base member (200) to support the substrate fixing member (300) in the processing space (S) and to form a movement path along which the substrate fixing member (300) moves linearly.

[0013] The first support member (600) may include a plurality of support rods (610) installed on the upper surface of the support base member (200) and penetrating the lower surface of the process chamber (100), and a driving rail member (620) supported on the plurality of support rods (610) to form the movement path.

[0014] The above position adjustment unit (500) can be installed in the processing space (S).

[0015] A second support member (1000) may be additionally included, which is installed on the support base member (200) through the bottom surface of the process chamber (100) to support the position adjustment member (500).

[0016] The above position adjustment unit (500) can be installed on the support base unit (200) outside the process chamber (100).

[0017] The above substrate support member (400) may include a plurality of rod members (410) installed through the bottom surface of the process chamber (100) in the position adjustment member (500), a support plate (420) installed below the substrate fixing member (300) in the processing space (S) through the rod members (410), and a plurality of support members (430) protruding upward from the support plate (420) to contact and support the substrate (1).

[0018] The above substrate support member (400) may additionally include a first bellows (440) installed between the bottom surface of the process chamber (100) and the position adjustment member (500) surrounding the load member (410).

[0019] The above substrate support (400) may additionally include an up-and-down driving unit (700) that moves the substrate support (400) up and down.

[0020] The above-described vertical drive unit (700) may include a drive plate (730) which is installed to be vertically movable and has the position adjustment unit (500) seated and supported on its upper surface, and a drive unit (740) installed on the support base unit (200) to move the drive plate (730) vertically.

[0021] The above vertical drive unit (700) may include a first vertical drive unit (710) that moves the position adjustment unit (500) up and down, and a second vertical drive unit (720) installed on the position adjustment unit (500) that moves the substrate support unit (400) up and down independently of the position adjustment unit (500).

[0022] The above second vertical drive unit (720) may include a second drive plate (721) which is installed to be vertically movable relative to the position adjustment unit (500) and on which the substrate support unit (400) is seated and supported on the upper surface, and a second drive unit (722) which is installed on the position adjustment unit (500) to move the second drive plate (721) vertically.

[0023] It may additionally include an outer support pin portion (800) that is arranged around the substrate support portion (400) and supports the edge of the substrate (1).

[0024] The outer support pin portion (800) may include a plurality of outer rod portions (810) installed through the bottom surface of the process chamber (100), an outer support plate (820) installed below the substrate fixing portion (300) in the processing space (S) through the outer rod portions (810), and a plurality of outer support portions (830) protruding upward from the outer support plate (820) to contact and support the substrate (1).

[0025] The above outer load portion (810) can be installed on the upper surface of the position adjustment portion (500).

[0026] The outer support pin portion (800) may additionally include a second bellows (840) installed between the bottom surface of the process chamber (100) and the position adjustment portion (500) surrounding the outer rod portion (810).

[0027] The alignment verification unit (900) may be additionally included to verify alignment between the substrate (1) and the substrate fixing unit (300) by irradiating light onto the substrate fixing unit (300) through the substrate support unit (400).

[0028] The above alignment verification unit (900) can verify the alignment between the substrate (1) and the substrate fixing unit (300) by capturing the first alignment mark (2) formed on the substrate (1) and the second alignment mark (301) formed on the substrate fixing unit (300).

[0029] The position adjustment unit (500) can adjust the position of the substrate support unit (400) to align the substrate (1) and the substrate fixing unit (300) based on the measurement result according to the alignment verification unit (900).

[0030] The alignment verification unit (900) can be installed on the support base unit (200). Effects of the invention

[0031] The substrate processing device according to the present invention has the advantage of being able to perform precise positional alignment between the electrostatic chuck and the substrate by adjusting the position of the supported substrate through precise positional adjustment of the substrate support pin module.

[0032] In addition, the substrate processing device according to the present invention has the advantage of being able to reduce the weight of the electrostatic chuck and lower the driving load of the electrostatic chuck by eliminating the position adjustment configuration of the electrostatic chuck moving along the movement path, and thereby increasing durability and efficiency.

[0033] In addition, the substrate processing device according to the present invention has the advantage of reducing costs and facilitating installation and maintenance by simplifying and lightening the overall structure of the device by omitting the position adjustment unit configuration in the electrostatic chuck, which has a relatively complex structure, and applying the position adjustment unit configuration to the substrate support, which has a relatively simple structure.

[0034] In particular, the substrate processing device according to the present invention has the advantage of simplifying various cable structures for moving the position adjustment configuration by omitting the position adjustment configuration in the electrostatic chuck that presupposes movement.

[0035] In addition, the substrate processing device according to the present invention has the advantage of enhancing the durability of various driving parts for position adjustment and improving driving precision by omitting the configuration of a position adjustment part within a processing space maintained under vacuum.

[0036] In addition, the substrate processing device according to the present invention has the advantage of easy alignment control, as the electrostatic chuck, which is the target of imaging for the alignment camera placed below the substrate support pin module, is fixed and alignment can be performed by adjusting the position of the substrate while an alignment standard is set. Brief explanation of the drawing

[0037] FIG. 1 is a cross-sectional view showing the interior of a substrate processing apparatus according to the present invention. FIG. 2 is a cross-sectional view showing an embodiment of a substrate support part and a position adjustment part of a substrate processing device according to FIG. 1. FIG. 3 is a cross-sectional view showing another embodiment of the substrate support part and the position adjustment part of the substrate processing device according to FIG. 1. FIG. 4 is a cross-sectional view showing another embodiment of the substrate support part and the position adjustment part of the substrate processing device according to FIG. 1. FIG. 5 is a plan view showing the position adjustment of a substrate through a position adjustment unit in a substrate processing device according to FIG. 1. FIGS. 6a and 6b are drawings showing the position of a substrate being adjusted through a position adjustment unit after confirming alignment status through an alignment confirmation unit in the substrate processing device according to FIG. 1. Specific details for implementing the invention

[0038] The substrate processing apparatus according to the present invention will be described below with reference to the attached drawings.

[0039] A substrate processing device according to the present invention comprises, as illustrated in FIG. 1, a process chamber (100) forming a processing space (S) where substrate processing is performed; a support base part (200) positioned at the bottom of the process chamber (100) and spaced apart from the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) positioned at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position adjustment part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis.

[0040] The substrate processing device according to the present invention may further include a first support member (600) installed on a support base member (200) to support a substrate fixing member (300) in a processing space (S) and forming a movement path along which the substrate fixing member (300) moves linearly.

[0041] In addition, the substrate processing device according to the present invention may further include a second support member (1000) that is installed on a support base member (200) and penetrates the bottom surface of a process chamber (100) to support a position adjustment member (500).

[0042] In addition, the substrate processing device according to the present invention may further include an up-and-down driving unit (700) that moves the substrate support unit (400) up and down.

[0043] In addition, the substrate processing device according to the present invention may further include an outer support pin portion (800) that is arranged around the substrate support portion (400) and supports the edge of the substrate (1).

[0044] In addition, the substrate processing device according to the present invention may further include an alignment verification unit (900) that verifies the alignment between the substrate (1) and the substrate fixing unit (300) by irradiating light onto the substrate fixing unit (300) through the substrate support unit (400).

[0045] Meanwhile, the substrate (1) to be processed according to the present invention can be any substrate that is supported and processed through the substrate fixing part (300) described later, such as a semiconductor substrate, a glass substrate for an LCD panel, a substrate for an AMOLED panel, or a substrate for a solar cell.

[0046] The above process chamber (100) is configured to form a processing space (S) where substrate processing is performed, and various configurations are possible.

[0047] For example, the process chamber (100) may include a chamber body (120) having an opening formed on the upper side, and an upper lead (110) detachably coupled to the opening of the chamber body (120) to form a sealed processing space (S) together with the chamber body (120).

[0048] In addition, as another example, it is also obvious that the process chamber (100) may be configured to form an internal processing space (S) as an integrated configuration.

[0049] Meanwhile, the above process chamber (100) can be configured in various ways depending on the type of substrate processing to be performed, and may include a substrate processing unit for performing substrate processing inside, so that substrate processing is performed while the substrate (1) is fixed by electrostatic adsorption through the substrate fixing unit (300) described later.

[0050] Meanwhile, the process chamber (100) is separated from the support base part (200) and can be supported through the frame part (1100) described later, and as another example, it is also obvious that it can be directly supported by the support base part (200).

[0051] At this time, the frame portion (1100) is installed on the outer side of the support base portion (200) and is configured to support the process chamber (100), and various configurations are possible.

[0052] In particular, the above-mentioned frame portion (1100) is configured to support a process chamber (100) that is spaced apart from and located separately from the support base portion (200). Through this, the process chamber (100) is supported by the frame portion (1100), and the substrate fixing portion (300) and substrate support portion (400) are supported by the support base portion (200), thereby maintaining independent states from each other.

[0053] For example, the frame portion (1100) may include a plurality of vertical frames arranged side by side so as to be similar to the configuration of the support base portion (200) described above, and a pair of horizontal frames arranged side by side so as to be parallel to each other on the upper surface of the vertical frames, and the process chamber (100) may be supported on the horizontal frames.

[0054] The above support base part (200) is configured to be installed at the bottom of the process chamber (100), and various configurations are possible.

[0055] In particular, the support base part (200) is configured to have a first support part (600) installed to support a substrate fixing part (300) that supports and fixes the substrate (1) through electrostatic adsorption, and a heavy granite plate or the like that absorbs external vibrations and minimizes movement can be used for stable processing of the substrate (1).

[0056] For example, the support base portion (200) may include a pair of horizontal supports (210) installed side by side so as to be horizontally parallel to each other at the lower side of the process chamber (100), and a plurality of vertical supports (220) each installed along the pair of horizontal supports (210) to support the pair of horizontal supports (210).

[0057] Additionally, the support base portion (200) may further include a base (230) provided on the bottom surface parallel to the bottom surface of the process chamber (100) so that a plurality of vertical supports (220) are installed.

[0058] The above vertical support members (220) may be provided in multiple numbers, each forming a pair and running parallel to the lower side of the process chamber (100).

[0059] For example, the vertical support members (220) may be provided in multiple numbers parallel to each other along a pair of horizontal support members (210) at the bottom of the process chamber (100).

[0060] That is, the above vertical support members (220) may be arranged in a row with a certain spacing between them on one side, and arranged in a row with a certain spacing between them on the other side parallel to this.

[0061] At this time, the vertical support (220) can be installed on a base (230) that is provided on the bottom surface and arranged parallel to the bottom surface of the process chamber (100).

[0062] The above horizontal support member (210) is a pair of components installed horizontally side by side on the upper part of the vertical support members (220), and can be joined to each other parallel to the upper part of the vertical support members (220) arranged in a row with a certain spacing.

[0063] That is, by installing vertical supports (220) in a row at regular intervals on the bottom surface of the aforementioned base (230) and connecting a pair of horizontal supports (210) to the upper part of the vertical supports (220) so as to be parallel to each other, a configuration in which movement is minimized due to high weight can be manufactured.

[0064] Thus, the configuration of the first support member (600), position adjustment member (500), and upper / lower driving member (700), which will be described later, can be installed on the horizontal support member (210).

[0065] The above substrate fixing part (300) is installed to be linearly movable in the processing space (S) and is configured to fix the substrate (1) by adsorbing it, and various configurations are possible.

[0066] For example, the above substrate fixing part (300) is configured to support and fix the substrate (1) through electrostatic adsorption, and can perform processing on the lower surface of the substrate (1) by moving linearly while in contact with and fixing the upper surface of the substrate (1) as needed.

[0067] At this time, depending on the application of external power to the substrate fixing part (300), the substrate (1) approaching from the bottom surface can be supported and fixed by electrostatic adsorption through the up-and-down movement of the substrate support part (400), and the substrate (1) can be separated by releasing the power.

[0068] The above substrate fixing part (300) has its bottom edge supported by each of the aforementioned pair of driving rail parts (620), so that it can be stably supported by the first support part (600) while electrostatically adsorbing and fixing the substrate (1) at the bottom center side.

[0069] At this time, the substrate fixing part (300) is guided to move linearly along the driving rail part (620) formed in the processing space (S) through the first support part (600) described later so that substrate processing is performed through the substrate processing part, and a flexible cable for applying various power and control signals can be installed.

[0070] More specifically, the substrate fixing part (300) may be installed so as to be linearly movable on a pair of travel rail parts (620) installed on the first support rod (610), wherein the first support rod (610), described later, is installed in the processing space (S) by penetrating the lower surface of the process chamber (100).

[0071] In this process, the substrate fixing part (300) is configured with a relatively low weight and simple structure by omitting the position adjustment configuration capable of horizontal movement and rotational movement for aligning the substrate (1) as in the conventionally provided, thereby enabling stable adsorption and linear movement of the substrate.

[0072] The above substrate support member (400) is configured to support the substrate (1) by being positioned below the substrate fixing member (300) so that the substrate (1) is adsorbed to the substrate fixing member (300), and may have various configurations.

[0073] At this time, the substrate support member (400) is supported by the support base member (200) and can move the substrate (1) up and down, and more specifically, it is positioned on the position adjustment member (500) which is supported on the support base member (200) and can support the substrate (1) while performing precise position adjustment of the substrate (1).

[0074] In addition, by moving up and down through the up and down driving unit (700) described later, the substrate (1) can be moved up and down while being supported so that the substrate (1) is brought closer to the substrate fixing unit (300) and adsorbed, or the substrate (1) can be received from the substrate fixing unit (300) and supported.

[0075] In addition, it can receive and support a substrate (1) introduced from outside the process chamber (100), and can also support the substrate (1) after the substrate processing is completed to be taken out to the outside.

[0076] For example, the substrate support member (400) may include a plurality of rod members (410) installed through the bottom surface of the process chamber (100) in the position adjustment member (500) described later, a support plate (420) installed below the substrate fixing member (300) in the processing space (S) through the rod members (410), and a plurality of support members (430) protruding upward from the support plate (420) to contact and support the substrate (1).

[0077] Additionally, the substrate support member (400) may further include a first bellows (440) installed between the bottom surface of the process chamber (100) and the position adjustment member (500), surrounding the load member (410).

[0078] The above-mentioned load section (410) is configured to be installed by penetrating the bottom surface of the process chamber (100) on the position adjustment section (500), and various configurations are possible.

[0079] The above-mentioned load portion (410) may be configured to support the support plate (420) from the lower side of the support plate (420), and may be positioned through the lower surface of the process chamber (100) so that the support plate (420) can be located inside the processing space (S) while the upper and lower drive portion (700) described later is supported by the support base portion (200).

[0080] That is, the above-mentioned rod portion (410) can be installed by penetrating the lower part of the process chamber (100), and, if necessary, its outer diameter can be formed smaller than the inner diameter of the through hole formed on the lower surface of the process chamber (100) to prevent contact with the process chamber (100).

[0081] At this time, the load portion (410) is provided with at least one to support the support plate (420) within the processing space (S) and can transmit power to the substrate (1) through the upper and lower drive portion (700).

[0082] The above support plate (420) may be configured such that it supports the substrate (1) by directly contacting at least a portion of the substrate (1), or that a plurality of support members (430) described later are installed on the upper surface so that they move up and down in synchronization.

[0083] At this time, the support plate (420) can move up and down through the up and down driving unit (700) described later to bring the substrate (1) closer to the substrate fixing unit (300), and can move through the position adjustment unit (500) to align the substrate (1) with the substrate fixing unit (300).

[0084] At this time, the support plate (420) may have an open curve formed by cutting off a part of the starting point and ending point so that an external transfer robot (not shown) can place the substrate (1) on the upper surface or receive the substrate (1), i.e., a partially open shape.

[0085] The above support member (430) is configured to protrude upward from the support plate (420) and support the substrate (1) by contacting it, and various configurations are possible.

[0086] For example, the above support member (430) may be provided in a plurality of pin-types on the support plate (420) to minimize the contact area with the substrate (1) and to stably support the substrate (1).

[0087] The first bellows (440) is configured to surround the load portion (410) and be installed between the bottom surface of the process chamber (100) and the position adjustment portion (500), and various configurations are possible.

[0088] That is, the first bellows (440) is installed to surround the load portion (410) between the upper surface of the position adjustment portion (500) described later and the lower surface of the process chamber (100), so as to seal the processing space (S) to maintain a sealed state even when the substrate support portion (400) and the position adjustment portion (500) move up and down.

[0089] At this time, the first bellows (440) may be flexible and deformable according to the heat or vacuum of the process chamber (100), and may be provided in multiple numbers corresponding to each of the multiple load portions (410).

[0090] The above position adjustment unit (500) is installed at the bottom of the substrate support unit (400) and is configured to move the substrate support unit (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis, and various configurations are possible.

[0091] That is, the position adjustment unit (500) may be configured to align the substrate (1) to a fixed position relative to the substrate fixing unit (300) by moving the substrate support unit (400), on which the substrate (1) is supported, in at least one of linear movement and rotational movement in the horizontal direction, as shown in FIG. 5.

[0092] To this end, the position adjustment unit (500) may be configured to be capable of linear movement in the horizontal direction and rotational movement around any vertical axis as disclosed in the prior art, and for example, an XY table or an XYθ table may be applied.

[0093] That is, the position adjustment unit (500) may be provided with a combination of a plate, a ball screw, and a motor to enable horizontal linear movement, while the position adjustment unit (500) is installed to support the substrate support unit (400) from below the substrate support unit (400). Furthermore, a rotary motor installed at the center of a plane may be additionally provided to enable rotational movement around a vertical rotation axis.

[0094] At this time, the position adjustment unit (500) can be installed outside the process chamber (100), that is, on the lower support base unit (200) of the process chamber (100), as shown in FIG. 2, for example.

[0095] In addition, as another example, the position adjustment unit (500) may be installed inside the process chamber (100), that is, in the processing space (S), as shown in FIG. 4.

[0096] In this case, the position adjustment part (500) may be installed simply on the bottom surface of the process chamber (100), or more preferably supported and installed on the second support part (1000) so as to be connected to a support base part (200) disposed outside the process chamber (100).

[0097] At this time, the second support member (1000) is configured to support the position adjustment member (500) by being installed on the support base member (200) and penetrating the bottom surface of the process chamber (100). More specifically, at least a portion of the second support member (100) is positioned in the processing space (S) and can support the position adjustment member (500) by penetrating the bottom surface of the process chamber (100) on the support base member (200).

[0098] At this time, the second support member (1000) is provided with an outer diameter smaller than the inner diameter of the through hole (101) provided at the bottom of the process chamber (100), so that it can penetrate the lower surface without contacting the process chamber (100).

[0099] The first support member (600) is installed on the support base member (200) to support the substrate fixing member (300) in the processing space (S) and forms a movement path along which the substrate fixing member (300) moves linearly, and various configurations are possible.

[0100] The first support member (600) is configured to support the substrate fixing member (300) by penetrating the lower surface of the process chamber (100) from the horizontal support member (210) and having at least a portion installed in the processing space (S). Various configurations are possible.

[0101] For example, the first support member (600) may include a plurality of support rods (610) installed on the upper surface of the support base member (200) and penetrating the lower surface of the process chamber (100), and a driving rail member (620) supported on the plurality of support rods (610) to form a movement path.

[0102] Additionally, the first support member (600) may include a bellows (630) installed to wrap around each of a plurality of support rods (610) between the support base member (200) and the bottom surface of the process chamber (100).

[0103] The above support rod (610) can penetrate the lower part of the process chamber (100), with one end connected to the bottom surface of the travel rail part (620) and the other end connected to the horizontal support (210).

[0104] At this time, the support rod (610) can pass through without contacting the process chamber (100) so as not to be affected by deformation due to heat or vacuum of the process chamber (100).

[0105] The above-mentioned driving rail section (620) may be configured to be supported on a plurality of support rods (610) to form a movement path along which the substrate fixing section (300) moves.

[0106] At this time, the above-mentioned driving rail section (620) is provided in pairs to support the substrate fixing section (300) and simultaneously form a movement path for linear movement of the substrate fixing section (300), and can guide the movement of the substrate fixing section (300) when it moves through a separate driving section.

[0107] The above-mentioned driving rail section (620) and support rod (610) may each correspond to a pair of horizontal supports (210) and may be provided in a pair or multiple pairs, and the pair of driving rail sections (620) may be spaced apart so that the substrate (1) can be electrostatically adsorbed to the bottom surface of the substrate fixing section (300).

[0108] The above bellows (630) can be installed between the horizontal support (210) and the bottom surface of the process chamber (100).

[0109] That is, the bellows (630) is configured to be installed between the bottom surface of the process chamber (100) and the top surface of the horizontal support (210) so that a support rod (610) is positioned inside, and can be provided so as to maintain the seal of the processing space (S) even when the lower part of the process chamber (100) is penetrated through the support rod (610).

[0110] Meanwhile, the above bellows (630) may be flexible and deformable according to the heat or vacuum of the process chamber (100), and may be provided in correspondence with the number of support rods (610).

[0111] The above-described vertical drive unit (700) is configured to move the substrate support unit (400) up and down, and various configurations are possible.

[0112] That is, the above-described upper and lower driving unit (700) can raise the substrate support unit (400) so that the substrate (1) approaches the substrate fixing unit (300) while the substrate (1) is supported by the substrate support unit (400), thereby inducing the substrate (1) to be adsorbed to the substrate fixing unit (300).

[0113] To this end, the upper and lower driving unit (700) can drive the substrate support unit (400) to rise and lower.

[0114] For example, the above-described vertical drive unit (700) may include a drive plate (730) that is installed to be vertically movable and has a position adjustment unit (500) mounted on its upper surface as shown in FIG. 3, and a drive unit (740) installed on a support base unit (200) to move the drive plate (730) vertically.

[0115] The above driving plate (730) may be configured to support a position adjustment part (500) and a substrate support part (400) supported on the position adjustment part (500) on its upper surface, and to move up and down through a driving part (740).

[0116] At this time, the drive plate (730) may be configured to be spaced downward from the bottom surface of the process chamber (100) and connected to the support base (200) through the drive unit (740).

[0117] The above-mentioned drive unit (740) is configured to move the drive plate (730) up and down, and any configuration disclosed in the prior art can be applied.

[0118] For example, the drive unit (740) may include a plurality of lifting guides (741) installed vertically on the edge of the drive plate (730) to guide the vertical movement of the drive plate (730), and a power source (742) that drives the drive plate (730) vertically.

[0119] At this time, the power source (742) may be a motor using a ball screw, and as other examples, a cylinder, an electromagnetic motor, and a motor using gears may be used.

[0120] Meanwhile, as another example, the above-described vertical drive unit (700) may include a first vertical drive unit (710) that moves the position adjustment unit (500) up and down, and a second vertical drive unit (720) installed on the position adjustment unit (500) that moves the substrate support unit (400) up and down independently of the position adjustment unit (500).

[0121] To this end, the above-described upper and lower driving unit (700) may have a second upper and lower driving unit (720) installed on the position adjustment unit (500) to drive only the substrate support unit (400) up and down, while the substrate support unit (400) and the position adjustment unit (500) are installed on the first upper and lower driving unit (710).

[0122] Thus, the above-described upper and lower drive unit (700) can drive a wide range of movement of the substrate support unit (400) at a high speed through the first upper and lower drive unit (710), and can perform precise movement during the process of exchanging the substrate (1) with the transfer robot that introduces and removes the substrate (1) from the substrate fixing unit (300) or the outside through the second upper and lower drive unit (720).

[0123] Meanwhile, the first vertical drive unit (710) has the same configuration as the aforementioned drive plate (730) and drive unit (740), and since the first drive plate, the first drive unit, and the first lifting guide are applied respectively, a redundant description is omitted.

[0124] The above second vertical drive unit (720) may include a second drive plate (721) which is installed to be vertically movable relative to the position adjustment unit (500) and on which a substrate support unit (400) is seated and supported on the upper surface, and a second drive unit (722) which is installed on the position adjustment unit (500) to move the second drive plate (721) vertically.

[0125] Additionally, the second vertical drive unit (720) may be provided with a plurality of second lifting guides (723) that guide the vertical movement of the second drive plate (721) by being vertically provided at the edge of the second drive plate (721) among the position adjustment unit (500).

[0126] The above second vertical drive unit (720) is positioned entirely on the position adjustment unit (500), so that it can move together as a whole when the substrate support unit (400) and the substrate (1) are moved horizontally or rotated through the vertical rotation axis via the position adjustment unit (500).

[0127] Additionally, when a second vertical drive unit (720) is provided, the aforementioned first bellows (440) may be installed to surround the load unit (410) between the bottom surface of the process chamber (100) and the second drive plate (721).

[0128] The outer support pin portion (800) is configured to surround the substrate support portion (400) and support the edge of the substrate (1), and various configurations are possible.

[0129] That is, the outer support pin portion (800) is configured to surround the substrate support portion (400) and support the substrate (1) together with the substrate support portion (400), and can support the substrate (1) together with the substrate support portion (400) mainly when processing a large substrate (1).

[0130] At this time, the outer support pin portion (800) can support the edge of the substrate (1), thereby strengthening the stability of the substrate (1) support.

[0131] For example, the outer support pin portion (800) may include a plurality of outer rod portions (810) installed through the bottom surface of the process chamber (100), an outer support plate (820) installed below the substrate fixing portion (300) in the processing space (S) through the outer rod portions (810), and a plurality of outer support portions (830) protruding upward from the outer support plate (820) to contact and support the substrate (1).

[0132] Additionally, the outer support pin portion (800) may further include a second bellows (840) installed between the bottom surface of the process chamber (100) and the position adjustment portion (500) surrounding the outer load portion (810).

[0133] Each component of the outer support pin section (800) above corresponds to each component of the load section (410), support plate (420), and support section (430) of the substrate support section (400), so a redundant description is omitted.

[0134] Meanwhile, the outer load portion (810) can be installed on the upper surface of the position adjustment portion (500), unlike the substrate support portion (400) installed on the second up-down drive portion (720) as shown in FIG. 2, and thus the outer support pin portion (800) can move up and down through the first up-down drive portion (710) and can move independently of the substrate support portion (400) through the second up-down drive portion (720).

[0135] That is, the outer support pin portion (800) is installed on the position adjustment portion (500) which moves up and down through the first up and down driving portion (710), and can move up and down together with the substrate support portion (400) according to the first up and down driving portion (710), and the substrate support portion (400) can move up and down independently of the outer support pin portion (800) through the second up and down driving portion (720).

[0136] The above alignment verification unit (900) is configured to verify alignment between the substrate (1) and the substrate fixing unit (300) by irradiating light onto the substrate fixing unit (300) through the substrate support unit (400), and various configurations are possible.

[0137] That is, the alignment verification unit (900) can verify the alignment between the substrate (1) and the substrate fixing unit (300) by irradiating light toward the substrate fixing unit (300) as shown in FIG. 1, and can be installed on the support base unit (200) for irradiating light at a fixed position.

[0138] Accordingly, a light-transmitting window may be installed on the bottom surface of the process chamber (100) located on the light travel path of the alignment verification unit (900), and separate marks may be formed on the edge of the substrate (1) and on the substrate fixing unit (300), so that when these marks are aligned within a preset range, it can be determined that they are aligned in the correct position.

[0139] More specifically, the alignment verification unit (900) can verify the alignment between the substrate (1) and the substrate fixing unit (300) by capturing the first alignment mark (2) formed on the substrate (1) and the second alignment mark (301) formed on the substrate fixing unit (300) from the bottom side of the substrate (1), as shown in FIGS. 6a and 6b.

[0140] That is, the alignment confirmation unit (900) can determine whether the substrate (1) is aligned in the correct position by determining whether each of the plurality of first alignment marks (2) formed on the substrate (1) corresponds to each of the plurality of second alignment marks (301) formed on the bottom surface of the substrate fixing unit (300), and if alignment is not achieved, the position of the substrate (1) can be adjusted through the position adjustment unit (500).

[0141] Accordingly, the position adjustment unit (500) can adjust the position of the substrate support unit (400) to align the substrate (1) and the substrate fixing unit (300) through a measurement value, i.e., an image, obtained through the alignment confirmation unit (900).

[0142] That is, the positions of the substrate (1) and the substrate fixing part (300) can be aligned by performing at least one of horizontal movement and rotational movement around a vertical rotation axis of the substrate support part (400) so that the first alignment mark (2) and the second alignment mark (301) marked on the aforementioned substrate (1) and substrate fixing part (300) are located within a preset range.

[0144] The foregoing merely describes some preferred embodiments that can be implemented by the present invention. As is well known, the scope of the present invention should not be interpreted as being limited to the above embodiments, and all technical concepts that share the fundamental principles with the technical concept of the present invention described above shall be considered to be included within the scope of the present invention. Explanation of the symbols

[0145] 100: Process chamber 200: Support base 300: Substrate fixing part 400: Substrate support part 500: Position adjustment unit

Claims

Claim 1 A process chamber (100) forming a processing space (S) where substrate processing is performed; a support base part (200) disposed at the bottom of the process chamber (100) and spaced apart from the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) disposed at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position adjustment part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis, and is installed on the support base part (200) to support the substrate fixing part (300) in the processing space (S) and the movement path along which the substrate fixing part (300) moves linearly A substrate processing device characterized by additionally including a first support member (600) that forms. Claim 2 delete Claim 3 A substrate processing apparatus according to claim 1, wherein the first support member (600) comprises a plurality of support rods (610) installed on the upper surface of the support base member (200) and penetrating the lower surface of the process chamber (100), and a driving rail member (620) supported on the plurality of support rods (610) to form the movement path. Claim 4 A substrate processing device comprising: a process chamber (100) forming a processing space (S) in which substrate processing is performed; a support base part (200) disposed spaced apart from the process chamber (100) at the lower part of the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) disposed at the lower part of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position adjustment part (500) installed at the lower part of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis, wherein the position adjustment part (500) is installed in the processing space (S). Claim 5 A substrate processing apparatus according to claim 4, further comprising a second support member (1000) installed on the support base member (200) through the bottom surface of the process chamber (100) to support the position adjustment member (500). Claim 6 A substrate processing apparatus according to claim 1, wherein the position adjustment unit (500) is installed on the support base unit (200) outside the process chamber (100). Claim 7 A substrate processing apparatus according to claim 6, wherein the substrate support member (400) comprises a plurality of rod members (410) installed through the bottom surface of the process chamber (100) in the position adjustment member (500), a support plate (420) installed below the substrate fixing member (300) in the processing space (S) through the rod members (410), and a plurality of support members (430) protruding upward from the support plate (420) to contact and support the substrate (1). Claim 8 A substrate processing apparatus according to claim 7, wherein the substrate support member (400) further comprises a first bellows (440) installed between the bottom surface of the process chamber (100) and the position adjustment member (500) surrounding the load member (410). Claim 9 A substrate processing apparatus according to claim 1, further comprising an up-and-down driving unit (700) for moving the substrate support unit (400) up and down. Claim 10 A substrate processing device according to claim 9, wherein the upper and lower driving unit (700) comprises a driving plate (730) which is installed to be movable up and down and on which the position adjustment unit (500) is seated and supported on the upper surface, and a driving unit (740) which is installed on the support base unit (200) to move the driving plate (730) up and down. Claim 11 A process chamber (100) forming a processing space (S) where substrate processing is performed; a support base part (200) disposed spaced apart from the process chamber (100) at the bottom of the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) disposed at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position adjustment part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis, and additionally includes an up-down driving part (700) that moves the substrate support part (400) up and down, wherein the up-down driving part (700) is the A substrate processing device characterized by including a first vertical driving unit (710) that moves a position adjustment unit (500) up and down, and a second vertical driving unit (720) installed on the position adjustment unit (500) that moves a substrate support unit (400) up and down independently of the position adjustment unit (500). Claim 12 A substrate processing device according to claim 11, wherein the second vertical driving unit (720) comprises a second driving plate (721) which is installed to be vertically movable with respect to the position adjustment unit (500) and on which the substrate support unit (400) is seated and supported on the upper surface, and a second driving unit (722) which is installed on the position adjustment unit (500) to move the second driving plate (721) vertically. Claim 13 A substrate processing device characterized by comprising: a process chamber (100) forming a processing space (S) in which substrate processing is performed; a support base part (200) positioned at the bottom of the process chamber (100) and spaced apart from the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) positioned at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); a position adjustment part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis, and additionally including an outer support pin part (800) positioned around the substrate support part (400) to support the edge of the substrate (1). Claim 14 A substrate processing apparatus according to claim 13, wherein the outer support pin portion (800) comprises a plurality of outer rod portions (810) installed through the bottom surface of the process chamber (100), an outer support plate (820) installed below the substrate fixing portion (300) in the processing space (S) through the outer rod portions (810), and a plurality of outer support portions (830) protruding upward from the outer support plate (820) to contact and support the substrate (1). Claim 15 A substrate processing device according to claim 14, wherein the outer load portion (810) is installed on the upper surface of the position adjustment portion (500). Claim 16 A substrate processing apparatus according to claim 14, wherein the outer support pin portion (800) further comprises a second bellows (840) installed between the bottom surface of the process chamber (100) and the position adjustment portion (500) surrounding the outer load portion (810). Claim 17 A process chamber (100) forming a processing space (S) where substrate processing is performed; a support base part (200) disposed spaced apart from the process chamber (100) at the bottom of the process chamber (100); a substrate fixing part (300) installed to be linearly movable in the processing space (S) and adsorbing and fixing a substrate (1); a substrate support part (400) disposed at the bottom of the substrate fixing part (300) to support the substrate (1) so that the substrate (1) is adsorbed to the substrate fixing part (300); and a position adjustment part (500) installed at the bottom of the substrate support part (400) to move the substrate support part (400) in at least one of linear movement in the horizontal direction and rotational movement around a vertical rotation axis, and by irradiating light through the substrate support part (400) to the substrate fixing part (300), the alignment between the substrate (1) and the substrate fixing part (300) is confirmed. A substrate processing device characterized by additionally including an alignment verification unit (900). Claim 18 A substrate processing apparatus according to claim 17, wherein the alignment verification unit (900) captures a first alignment mark (2) formed on the substrate (1) and a second alignment mark (301) formed on the substrate fixing unit (300) to verify the alignment between the substrate (1) and the substrate fixing unit (300). Claim 19 A substrate processing apparatus according to claim 17, wherein the position adjustment unit (500) adjusts the position of the substrate support unit (400) to align the substrate (1) and the substrate fixing unit (300) based on the measurement result according to the alignment verification unit (900). Claim 20 A substrate processing apparatus according to claim 17, wherein the alignment verification unit (900) is installed on the support base unit (200).

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