Projection exposure device for semiconductor lithography

Abstract

The present invention relates to a projection exposure apparatus (1) for semiconductor lithography, comprising a projection optical unit (9) including a sensor frame (30), a support frame (40), and a module (50), wherein the module (50) has an optical element (52) and an actuator (53) for positioning and orientation of the optical element (52), wherein the module (50) is arranged on the support frame (40) and the sensor frame (30) is implemented as a reference point for positioning the optical element (52), and the module (50) includes a base structure (60). According to the present invention, the base structure (60) is implemented to include an interface (62, 70) for separating the module (50) from the projection optical unit (9). Furthermore, the present invention includes a method for replacing a module (50) of a projection optical unit (9) of a projection exposure device (1) for semiconductor lithography, wherein the module (50) includes an optical element (52). According to the present invention, a reference point (55) for positioning and / or aligning the optical element (52) remains in the projection exposure device (1) during the replacement of the module (50).

Description

Technology Field

[0001] This application claims priority to German patent application DE 10 2019 214 242.7 filed on September 18, 2019, the entire contents of which are fully incorporated herein by reference.

[0002] The present invention relates to a projection exposure apparatus for semiconductor lithography. Background Technology

[0003] These devices are used to produce extremely small structures, particularly semiconductor components or other microstructural component parts. The operating principle of the device is based on generating very small structures down to the nanometer range by generally reducing the imaging of a structure on a mask using a reticle, where a photosensitive material is applied to the provided element to be structured. The minimum dimensions of the generated structure depend directly on the wavelength of the light used. Recently, light sources with emission wavelengths in the nanometer range, e.g., 5 nm to 120 nm, particularly in the 13.5 nm region, are increasingly being used. The described wavelength range is also referred to as the EUV range. Particularly in the EUV range, these highly complex projection lithography devices are implemented as mechatronic systems and thus include an illumination optical unit and a projection optical unit having highly complex actuators, sensors, and cooling and decoupling systems. The projection optical unit typically has 6 to 10 mirrors, most of which are adjustable up to 6 degrees of freedom. As a result, these systems include up to 60 actuators and more than 100 sensors. In addition to highly accurate sensors for mirror positioning, a large number of sensors are used for temperature measurement, system startup, acceleration measurement, and additional detection of physical properties. Due to the large number of systems and subsystems, it is virtually impossible to guarantee the functionality and imaging quality of the entire system over its lifespan. Therefore, it must be assumed that during its lifespan, mirror position control will fail, for example, due to a failed actuator. Due to requirements related to controllability and actual structural spatial conditions, redundant configuration of the system is possible only to a limited extent. An additional requirement for a highly complex projection exposure device is the fundamental capability for modifying functions and components, such as deformable optical elements or optical elements with additional layers developed for the projection optical unit.As a result, first, the quality and imaging characteristics of the projection exposure device can be improved, and second, effects that were not yet known at the time of development can be addressed. A projection exposure device of the prior art already includes the possibility of replacing predefined components, which are generally selected in the initial optical design state, so that good accessibility can be taken into account during the development of the projection exposure device. In this case, only the first and last optical elements of the beam path and a small number of elements within the beam path can be replaced well. In a system of the prior art, the proportion of replaceable optical elements is in the range of 20% or less. All other optical elements cannot be changed further over the lifetime of the system without replacing the projection optical unit, some other system, or the entire system.

[0004] Due to the complex process development and high commissioning costs of the projection exposure device, which also take into account differences between different projection exposure devices within the specification range, so-called fingerprints, and imaging characteristics that are significantly affected by the projection optical unit in particular, the obvious solution for modification, namely the replacement of the entire system such as the projection optical unit, is not permitted. The problem to be solved

[0005] The object of the present invention is to provide an apparatus that solves the disadvantages of the aforementioned prior art. Another object of the present invention is to specify a method for replacing components of a projection lens and a projection exposure apparatus.

[0006] This objective is achieved by an apparatus and method having the features of the independent claim. The dependent claim relates to advantageous further developments and variations of the present invention. means of solving the problem

[0007] A projection exposure device having a projection optical unit according to the present invention for semiconductor lithography comprises a module having a sensor frame, a support frame, an optical element, and an actuator for positioning and / or aligning the optical element. In this case, the module is arranged on the support frame, and the sensor frame is implemented as a reference for positioning and / or aligning the optical element. The module comprises a base structure, and the base structure is implemented to include an interface for separating the module from the projection optical unit according to the present invention. The modular configuration of the projection optical unit has the advantage that individual modules can be replaced on-site, that is, at the location where the end customer has installed them, in which case the so-called fingerprint, that is, the imaging characteristics unique to each projection exposure device, can be maintained to the maximum extent. This is particularly valid insofar as, in addition to the imaging quality of the projection optical unit itself, the exposure process, and in particular the photosensitive coating process, can also have a decisive influence on the quality of the structure during the production of electronic components. Therefore, the unique characteristics of each individual projection exposure device are taken into account in these processes. Furthermore, individual modules can be transported more easily due to their smaller geometric structure, and the complexity of replacement is also advantageously simplified compared to replacing the projection optical unit.

[0008] Furthermore, the infrastructure may include electrical and / or optical lines and / or fluid lines. The module can be separated from all these lines independently of other modules; in other words, only one module can be removed from the projection optical unit without other modules losing their positions in the process.

[0009] Furthermore, the infrastructure of multiple modules can be connected in parallel. Accordingly, the infrastructure lines are implemented in a continuous manner and include branches for each module, so that multiple or all modules can be supplied in parallel by the infrastructure lines.

[0010] Alternatively, the infrastructure of multiple modules may be connected in series. In this case, the infrastructure lines may include at least partially the modules' lines so that the infrastructure lines extend from one module to another and connect them in series. If a module is separated, the interface of the infrastructure between modules is released and the module is removed. The modules and, in particular, the sensors of the modules remaining in the projection exposure device are not mechanically altered upon separation of a module, and thus, after the separated module is reinstalled, it can be operated again without a new setup and / or calibration of the module and / or sensors.

[0011] In one variation of the present invention, at least one module may include a module support frame. In this case, the module support frame may be implemented to determine the rigidity of the module and to function as a central mechanical component of the module.

[0012] Furthermore, the actuator can be arranged on the module support frame. The actuator is separated along with the module support frame when the module is separated. As a result, the actuator can be replaced on the separated module, which advantageously simplifies the replacement of the actuator due to better accessibility.

[0013] In particular, the actuator can be replaced without the module support frame being detached. This has the advantage of minimizing replacement costs, as in the case of a defective actuator, all other parts, especially sensors, are not mechanically moved, and consequently, module commissioning after actuator replacement can also be significantly simplified.

[0014] In a further variation of the present invention, at least one module may include a sensor. The sensor may be configured in a bipartite manner and may include a sensor element and a sensor reference point, and the sensor element may be connected to the module.

[0015] In addition, the sensor's reference points can be arranged on the sensor frame.

[0016] In particular, the sensor's reference point can be implemented so that it does not change due to the module's separation. This has the advantage of favorably simplifying the commissioning of the module and the entire projection lithography unit after module replacement, and minimizing the downtime of the projection lithography unit.

[0017] In this case, the sensor can be implemented specifically as an interferometer or an encoder. It can also be considered that part of the sensor arranged within the module is implemented as an interferometer and another part as an encoder. In this case, the selection of the sensor type depends primarily on the arrangement of the module regarding the sensor frame and generally limited structural space conditions. Furthermore, any other type of sensor suitable for the task can also be considered.

[0018] When the sensor is implemented as an interferometer, the sensor may include sensor reference points and sensor elements arranged at a distance of 10 cm to 200 cm from each other.

[0019] Furthermore, the module support frame may include a mechanical interface for positioning and orientation of the support frame. The support frame may be implemented as a central component of the projection exposure device so that all modules can be mechanically connected.

[0020] In particular, the module support frame can be implemented such that the rigidity of the support frame increases when the module support frame is connected to the support frame. As a result, the support frame and the module support frame can be implemented with low rigidity, and consequently, can be implemented more easily and advantageously. The connection of the module support frame to the support frame can be realized, for example, by a screw connection.

[0021] Furthermore, the module support frame can be connected to the support frame in an over-determined manner (having excessive or redundant connections). For example, as a result of the over-determined mounting of the module support frame, the screw connection force may be increased, and thus the overall rigidity of the module screwed to the support frame may be increased. Force-locking connections generated by friction may also be designed for higher operating loads and / or transport loads, such as impact, for example. Deformation that may be caused by the over-determined mounting is isolated by the actuator and is not transmitted to the optical element.

[0022] In one variant of the present invention, the sensor frame may be arranged within a volume formed by a support frame. This has the advantage that the sensor frame can be configured compactly and consequently have a low moment of inertia, and consequently, vibrations caused by external excitation can be advantageously reduced to a minimum.

[0023] In particular, the sensor frame may include multiple subframes. The multi-part configuration of the sensor frame has the advantage of simplifying, firstly, the manufacturing and assembly of individual parts, and secondly, the transportation of individual parts.

[0024] In this case, the subframes can be referenced to each other by the sensor. This mutual referencing of subframes ensures that the position of individual frames relative to each other, which changes due to the movement of frames relative to each other, is always identified, and as a result, the sensor frame can be used as a common reference point for all modules.

[0025] In one variant of the present invention, each optical element of the projection optical unit may be arranged within a dedicated module. This has the advantage that the projection exposure device can be prepared for operation with minimal downtime, regardless of any optical elements or modules that have become defective or damaged.

[0026] Furthermore, the projection lithography device can be implemented so that the module can be replaced while the projection optical unit is mounted on the projection lithography device. Replacing the module while the projection optical unit is still installed on the projection lithography device reduces replacement costs and thus reduces the downtime of the projection lithography device, which ultimately favorably reduces the production costs of electronic components.

[0027] In a method according to the present invention for replacing a module of a projection optical unit of a projection exposure device for semiconductor lithography, the module comprises an optical element, and according to the present invention, a reference point for positioning and / or orientation of the optical element remains in the projection exposure device during the replacement of the module. This advantageously reduces the cost for replacing the optical element, such as, for example, a mirror, an actuator, or any other component of the module, to a minimum.

[0028] Furthermore, the replacement of a module can be performed without changing any other module. As a result, the reference points of other modules may not change, which favorably reduces the commissioning duration after the replacement.

[0029] Furthermore, the module can be calibrated after replacement. Calibration of the module is less complex compared to calibration of the entire projection optical unit.

[0030] The projection exposure device can be prepared for operation again, particularly after the replacement and calibration of modules. Therefore, there is no need to operate any other module or group of modules of the projection exposure device.

[0031] In one variation of the present invention, the replacement of the module can be performed without altering the sensor frame. As a result, optionally, part of the module calibration is eliminated and the commissioning duration can be more advantageously reduced.

[0032] Furthermore, the mounting portion of the reticle module and / or wafer module can be moved to a parking position for module replacement. To transfer the reticle and / or wafer, it can be moved to a so-called parking position within the reticle module and / or wafer module, and consequently, access to the modules arranged below and / or above each of the reticle and / or wafer can be simplified. As a result, the module can be replaced without additional cost, regardless of the arrangement of optical elements in the reticle module or wafer module and given structural space conditions.

[0033] In addition, the reticle module or wafer module can be detached for module replacement.

[0034] Furthermore, the projection optical unit can be removed from the projection exposure device for module replacement. This is the case whenever access to the module in which the projection optical unit is installed is not possible.

[0035] In one variant of the present invention, the replacement of a module may not affect the process for exposing a wafer optimized for a projection exposure device. During the production of electronic components, in addition to the imaging quality of the projection optical unit, the exposure process, and in particular the photosensitive coating during exposure and subsequent processes, may also affect the quality of the structure. Therefore, these processes are optimized for specific characteristics of each imaging. Since imaging can already be significantly altered by the separation of the projection optical unit and the new mounting of the same optical element, the process must be optimized once again. At the same time, by replacing only one module while maintaining the arrangement of all other modules, the change in individual imaging characteristics can be kept sufficiently small so that the existing process can continue to be used without adaptation.

[0036] In one variant of the present invention, more than 80%, particularly more than 90%, particularly 100% of the optical elements of the projection optical unit can be replaced without changing any other module. Brief explanation of the drawing

[0037] Exemplary embodiments and variations of the present invention are described in more detail below with reference to the drawings. In the drawings: FIG. 1 illustrates the basic configuration of an EUV projection exposure device in which the present invention can be implemented, and FIG. 2 illustrates the basic configuration of an EUV projection optical unit according to the present invention, and FIGS. 3a to 3c illustrate detailed views of the present invention, and FIGS. 4a and 4b illustrate further details of the present invention, and FIGS. 5A and 5B illustrate further details of the present invention, and Figure 6 illustrates a basic example of a tool for module replacement. Specific details for implementing the invention

[0038] FIG. 1 illustrates an example of the basic configuration of a microlithography EUV projection exposure apparatus (1) in which the present invention can be used. The illumination system of the projection exposure apparatus (1) has, in addition to a light source (3), an illumination optical unit (4) for illuminating an objective field (5) within an objective plane (6). EUV radiation (14), which is in the form of optically useful radiation generated by the light source (3), is aligned by a condenser integrated within the light source (3) in such a way that the radiation passes through an intermediate focus in the region of an intermediate focus plane (15) before being incident on a field facet mirror (2). Downstream of the field facet mirror (2), the EUV radiation (14) is reflected by a pupil facet mirror (16). With the help of an optical assembly (17) having a pupil facet mirror (16) and mirrors (18, 19, 20), the field facet of the field facet mirror (2) is imaged into the objective field (5).

[0039] A reticle (7) held by a schematically illustrated reticle holder (8) arranged within an objective field (5) is illuminated. A projection optical unit (9), only schematically illustrated, serves to image the objective field (5) within an image field (10) within an image plane (11). A structure on the reticle (7) is imaged onto a photosensitive layer of a wafer (12) held by a wafer holder (13), which is arranged in an area of ​​the image field (10) within the image plane (11) and likewise partially illustrated. The light source (3) can emit useful radiation in a wavelength range of 5 nm to 120 nm.

[0040] The present invention may be used in a DUV device not likely illustrated. The DUV device is set up on the same principle as the EUV projection exposure device (1) described above, and mirror and lens elements may be used as optical elements in the DUV device, and the light source of the DUV device emits useful radiation in the wavelength range of 100 nm to 300 nm.

[0041] FIG. 2 illustrates a cross-sectional view of the basic configuration of a projection optical unit (9) according to the present invention. The projection optical unit (9) includes six optical modules (50) and is connected to a reticle module (21) and a wafer module (22). The modules (50, 21, 22) are arranged around a central sensor frame (30) and connected to a support frame (40). The modules (50, 21, 22) may also be additionally connected to each other. In this case, the modules (50, 21, 22) are implemented so that they can be separated from the projection optical unit (9) in the direction of the arrow, and consequently, any other modules (50, 21, 22) do not need to be changed. The remaining modules (50, 21, 22) do not need to be recalibrated or oriented after the separated modules (50, 21, 22) or the same replacement modules (50, 21, 22) are reinstalled, and as a result, if appropriate, only the replaced modules (50, 21, 22) need to be recalibrated. The arrangement of the modules (50, 21, 22) can also be considered such that, for example, with respect to the optical modules (50) additionally arranged in the direction of the sensor frame (30) inside the projection optical unit (9), the first module (50, 21, 22) located further outward must be separated first. The modules (50, 21, 22) are implemented so that other modules (50, 21, 22) or the module (50, 22, 11) itself can be separated and reinstalled without being affected.

[0042] The optical module (50) includes at least one sensor (54), and the sensor (54) includes a sensor element (56) and a sensor reference point (55). While the sensor element (56) is arranged on the optical element (52), the sensor reference point (55) is arranged on the sensor frame (30) and thus determines the position and location of the optical element relative to the sensor frame (30), and thus relative to all other optical modules (50), reticle modules (21), and wafer modules (22). In this case, the sensor (54) may be implemented particularly as an interferometer or an encoder.

[0043] When an interferometer sensor (54) is used, the sensor element (56) may include a mirror that reflects optical radiation emitted by a sensor reference point (55), which can be implemented as the sensor head of the interferometer sensor (54). In this case, the sensor reference point (55) and the sensor element (56) can be arranged at a greater distance from each other, particularly from 10 cm to 200 cm. Using an interferometer sensor enables the realization of a more compact sensor frame (30), which is more advantageous in relation to the excitation of vibrations. Furthermore, the more compact sensor frame (30) enables more free installation space. In particular, the more compact sensor frame (30) reduces the complexity of replacing or removing the optical module (50).

[0044] The sensor frame (30) and the support frame (40) are separated from each other (not shown), so that the reaction force of the actuator (not shown) of the optical module (50) cannot dynamically excite the sensor frame (30). The sensor frame (30) and the support frame (40) are also additionally mounted in a separated manner to the projection exposure device (1) (likewise not shown), and as a result, excitation from the ground or other systems of the projection exposure device does not affect the imaging quality of the projection exposure device or only has a negligible small effect.

[0045] EUV radiation (14), emitted by the light source (3) shown in FIG. 1 and guided to the reticle (7) via the illumination optical unit (4) also shown in FIG. 1, is reflected from the reticle (7), reflected by an individual module (50) via an optical element (52) implemented as a mirror (52), and imaged onto a wafer (12). The reticle (7) can be arranged within a reticle holder (8) and moved parallel to the objective plane (6) together with the reticle holder (8). The wafer (12) can be arranged within a wafer holder (13) and likewise moved parallel to the image plane (11).

[0046] FIG. 3a illustrates a detailed view of the present invention and a cross-sectional view of the operation from a support frame (40) having an optical module (50). The optical module (50) is typically implemented as a bipod and includes three actuators (53) capable of positioning an optical element (52) in six degrees of freedom. In the illustrated example, only one actuator (53) is illustrated for clarity. The actuator (53) is connected to a module support frame (51) which is fixed to a flange (41) of the support frame (40) by a screw (23), thereby forming a mechanical interface (42) between the module support frame (51) and the support frame. Due to this arrangement, the optical module (50) can be easily released and separated from the support frame (40). The optical module (50) reinforces the support frame (40) by a screw connection implemented with an over-determined screw connection, and as a result, the intrinsic mode of the support frame (40) is advantageously increased. In this case, the actuator (53) is implemented or arranged within the module support frame (51) so that it can be replaced without separating the optical module (50) (see arrow). The optical element (52) includes a sensor element (56) of a sensor (54) capable of positioning and orienting the optical element (52) with an accuracy of less than 1 nanometer with the actuator (53) and open-loop or closed-loop control (not shown).

[0047] FIG. 3b illustrates further details of the present invention and shows an optical module (50) in cross-sectional view. In addition to the actuator (53) and sensor (54) shown in FIG. 3a, the optical module (50) also includes an end stop (58) that restricts the movement of the optical element, so that the actuator and optical element (52) itself, which are implemented, for example as a Lorentz actuator, are also protected from damage. The actuator and sensor are not shown in FIG. 3b for clarity. The end stop (58) is held in a mounting portion (57) arranged on a module support frame (51), and the end stop (58) is implemented to be easily accessible and replaceable when the module (50) is detached.

[0048] FIG. 3c illustrates further details of the invention and shows the operation from the support frame (40) and the optical module (50) in a cross-sectional view. The actuator, sensor, and end stop shown in FIG. 3b are also shown in FIG. 3c for clarity. The transport fixing means (59) is connected to the module support frame (51) by a screw (23), and the transport fixing means (59) is shown at a transport position, i.e., a position for transporting the optical module (50). The transport fixing means (59) presses the optical element (52) into the end stop (not shown), for example by spring force, and as a result, the optical element (52) is fixed. In this case, the transport fixing means (59) is also implemented so that the optical module (50) can be replaced without being separated.

[0049] All functional elements necessary for positioning and orientation of the optical element (52), namely the actuator, sensor, end stop, and transport fixing means, are arranged on the module and thus can be replaced in a simple manner, and the module can be replaced without disassembling, and in part, even without the module being separated from the projection optical unit.

[0050] FIG. 4a illustrates a further detailed view of the present invention and shows an optical module (50) installed on a support frame (40) from the rear side facing away from an optical element (not shown). The optical module (50) includes three actuators (53) arranged at an angle of 120° in each case, three transport fixing means (59) arranged offset by 60° relative to the actuators (53) in each case, and three interfaces (77) for a replacement device (not shown) for replacing the optical module (50). Furthermore, interfaces (62, 70) for a base structure (60) of the optical module (50) are also arranged on the rear side of the optical module (50). At two of the four corners of the module support frame (51) implemented in a rectangular manner, an interface (70) for a fluid line is implemented in each case, thereby allowing the optical module (50) to be connected to a compressed air line or a hydraulic line. Interfaces (62) for cables, i.e., for electrical or optical lines, are arranged in close proximity, and multiple plug connections are arranged next to each other. Multiple screws (23) (arranged in a row) of screw connections (75) of the optical module (50) to the support frame (40) are arranged on both sides of the module support frame (51). Due to these over-determined connections, the module support frame (51) effectively increases the intrinsic mode of the support frame (40) as a part of the support frame, and the contact rigidity of the module support frame (51) can be designed so that it is prevented from sliding on the support frame (40) as a result of impact events, for example, during transport.

[0051] FIG. 4b illustrates a further detailed view of the present invention and shows a plan view of an optical module (50) having an optical element (52) from the front of the optical module (50). An actuator, a sensor, an end stop, and a transport fixing means are not shown for clarity or are hidden by the optical element (52). Furthermore, three mechanical interfaces (42) are arranged at an angle of 120° relative to each other, and these mechanical interfaces are implemented so that the optical module (50) can be positioned on a support frame (not shown) with an accuracy of less than 50 μm, particularly less than 30 μm, particularly less than 20 μm. In this case, the movement of the actuator (not shown) is designed so that the optical element (52) can be positioned at a desired location and desired orientation after the optical module (50) is screwed to the support frame. After the module support frame (51) is oriented on the support frame (not shown), it is connected to the support frame by a screw connection (75), and only the through hole (43) of the screw connection (75) is shown in FIG. 4B.

[0052] FIG. 5a illustrates a further detailed view of the present invention and illustrates an interface (70) for a fluid line (69). In this case, the interface (70) comprises two adapters (73, 73') respectively arranged in cutouts (76, 76') on the module support frame (51) and the support frame (40). The line (69) is guided to a receptacle (78) within the module support frame (51), and the end of the line is abutted against the adapter (73). The adapter (73) is additionally sealed against the cutout (76) via a seal (74) and secured by a screw (23) within the module support frame (51). A conical tapered tube section (71) is implemented on the side of the adapter (73) toward the corresponding adapter (73') of the support frame (40), and when the module (50) is screwed into the support frame (40), the tube section descends into the corresponding opening (72) within the adapter (73') of the support frame (40), creating a sealed connection due to the conical implementation. A seal (74) is arranged outside the opening (72) and creates an additional seal between the adapters (73'). The adapter (73') is arranged within the cutout (76') of the support frame (40) and is connected to the support frame by a screw (23).

[0053] FIG. 5b illustrates further details of the present invention and shows an interface (62) for a line (61) implemented as an electric or optical cable (61). A socket (64) of a plug connection (79) is arranged within a socket receptacle (65'), and the socket receptacle is eventually arranged within a cutout (76') of a support frame (40) and connected to the support frame (40) by a screw (23). A plug (63) corresponding to the socket (64) is arranged within a plug receptacle (65), and the plug receptacle (65) is connected to the module support frame (51) at the cutout (76) by an elastic mounting part (66) implemented as a spring. To align the plug (63) and socket (64) during the connection of the module support frame (51) and the support frame (40), a recess (67) is formed within the plug receptacle (65), and a pin (68) having a corresponding geometric structure arranged on the socket receptacle (65') can be inserted into the recess. As a result, the plug (63) and socket (64) can be pre-aligned and plugged together in a simple manner. By forming an encoding by the pin (68), the different receptacles (65, 65') can be plugged in the correct orientation only at the provided position, and as a result, errors caused by an incorrect plug connection (79) can be advantageously avoided.

[0054] FIG. 6 illustrates a replacement device (80) for replacing or mounting an optical module (50) of a projection exposure device. The replacement device (80) includes a rack (81) having a guide (84) through which a slide (83) can move along one axis. The slide (83) can be locked with the help of a locking means (85) at the top of the rack (81). A stop (86) is arranged at the bottom of the guide (84), and the stop is implemented so that the slide (83) and the adapter (90) fixed thereto cannot collide with the optical module (50). The replacement device (80) can be attached to a commercially available ceiling crane (not shown), such as one commonly used in a production plant, by means of a link (82). By positioning a pin (87) arranged at an interface (89) of a support frame (40), the rack (81) is positioned on the interface (89). The optical module (50) is connected to the slide (83) by an adapter (90), and both the interface (77) for the optical module (50) and the interface (93) for the floating mounting portion (91) of the adapter (90) are implemented as bayonet catches, and the two bayonet catches (77, 93) are connected to each other by a cable (92). In this case, the bayonet catch (93) connected to the floating mounting portion (91) is implemented so that the length of the adapter (90) is adjustable. In this regard, before the optical module (50) is lowered onto the support frame (40), the optical module (50) can be oriented parallel to the mechanical interface (42) on the support frame (40) with the help of an inclination sensor (88) arranged on the optical module (50). During the replacement process, the mechanical interface (42) is adapted by a washer (not shown), so-called spacer, and thus, the optical module (50) is positioned within a tolerance range with respect to the positioning and orientation plane from the position before replacement. Explanation of the symbols

[0055] 1: Projection exposure device 2: Field Facet Mirror 3: Light source 4: Lighting optical unit 5: Big Game Field 6: Objective flat 7: Reticle 8: Reticle Holder 9: Projection optical unit 10: Image field 11: Image plane 12: Wafer 13: Wafer holder 14: EUV radiation 15: Intermediate field focal plane 16: Pupil Facet Mirror 17: Assembly 18: Mirror 19: Mirror 20: Mirror 21: Reticle Module 22: Wafer Module 23: Screw 30: Sensor frame 40: Support Frame 41: Flange 42: Mechanical interface 43: Through hole 50: Optical module 51: Module support frame 52: Optical element 53: Actuator 54: Sensor 55: Sensor reference point 56: Sensor element 57: Mounting part 58: End stop 59: Transport Fixing Means 60: Infrastructure 61: Cable 62: Cable Interface 63: Plug 64: Socket 65, 65': Receptacle 66: Elastic mounting part 67: Depression 68: Pin 69: Line 70: Line Interface 71: Tube section 72: Frog 73, 73': Adapter 74: Sealing part 75: Support frame screw connection 76, 76': Cutout for adapter 77: Replacement device interface 78: Line receptacle 79: Plug connection 80: Replacement device 81: Rack 82: Crane Link 83: Slide 84: Guide 85: Slide locking mechanism 86: Lower stop 87: Positioning pins for racks on support frames 88: Tilt sensor 89: Support frame interface - Replacement device 90: Adapter 91: Adapter mounting section 92: Cable 93: Interface of the adapter mounting section

Claims

Claim 1 A projection exposure apparatus (1) for semiconductor lithography comprising a projection optical unit (9), wherein the projection optical unit (9) comprises a sensor frame (30), a support frame (40), and a module (50), wherein the module (50) has an optical element (52) and an actuator (53) for positioning or orienting the optical element (52), wherein the module (50) is arranged on the support frame (40), wherein the sensor frame (30) is implemented as a reference point for positioning or orienting the optical element (52), and wherein the module (50) comprises a base structure (60), wherein the base structure (60) is implemented to include an interface (62, 70) for separating the module (50) from the projection optical unit (9), and at least one module (50) comprises a module support frame (51), wherein the module support frame (51) is connected to the support frame (40) in an overdetermined manner. Projection exposure device (1) characterized by Claim 2 A projection exposure device (1), characterized in that, in claim 1, the base structure (60) includes an electric or optical line (61) or a line (69) for fluid. Claim 3 A projection exposure device (1) characterized in that, in claim 1 or 2, the base structure (60) of a plurality of modules (50) is connected in parallel with each other. Claim 4 A projection exposure device (1) characterized in that, in claim 1 or 2, the base structure (60) of a plurality of modules (50) is connected in series with each other. Claim 5 A projection exposure device (1), characterized in that, in claim 1 or 2, the actuator (53) is arranged on the module support frame (51). Claim 6 A projection exposure device (1) characterized in that, in claim 1 or 2, the actuator (53) can be replaced without separating the module support frame (51). Claim 7 A projection exposure device (1) characterized in that, in claim 1 or 2, at least one module (50) includes a sensor (54). Claim 8 A projection exposure device (1) characterized in that, in claim 7, the reference point of the sensor (54) is arranged on the sensor frame (30). Claim 9 A projection exposure device (1) characterized in that, in claim 8, the reference point of the sensor (54) is implemented so as not to change due to the separation of the module (50). Claim 10 In claim 7, the projection exposure device (1) is characterized in that the sensor (54) is implemented as an interferometer. Claim 11 In claim 10, the projection exposure device (1) is characterized in that the sensor (54) includes sensor reference points (55) and sensor elements (56) arranged at a distance of 10 cm to 200 cm from each other. Claim 12 A projection exposure device (1), characterized in that, in claim 1 or 2, the module support frame (51) includes a mechanical interface (42) for positioning and orientation of the support frame (40). Claim 13 A projection exposure device (1), characterized in that, in claim 1 or 2, the module support frame (51) is implemented such that the rigidity of the support frame (40) increases when the module support frame (51) is connected to the support frame (40). Claim 14 A projection exposure device (1) characterized in that, in claim 1 or 2, the sensor frame (30) is arranged within a volume formed by the support frame (40). Claim 15 A projection exposure device (1) characterized in that, in claim 1 or 2, the sensor frame (30) includes a plurality of subframes. Claim 16 A projection exposure device (1) characterized in that, in paragraph 15, the subframes between each other are referenced to each other by a sensor. Claim 17 A projection exposure device (1) characterized in that, in claim 1 or 2, each optical element (52) of the projection optical unit (9) is arranged within a dedicated module (50). Claim 18 A projection exposure device (1) according to claim 1 or 2, characterized in that the projection exposure device (1) is implemented such that the module (50) can be replaced while the projection optical unit (9) is mounted on the projection exposure device (1). Claim 19 A method for replacing a module (50) of a projection optical unit (9) of a projection exposure device (1) for semiconductor lithography, wherein the module (50) includes an optical element (52), and a reference point (55) for positioning or aligning the optical element (52) remains in the projection exposure device (1) during the replacement of the module (50), and the replacement of the module (50) can be performed without changing any other module (50) of the projection optical unit (9), so that the module (50) can be separated and reinstalled without affecting the other module (50). Claim 20 delete Claim 21 A module replacement method according to claim 19, characterized in that the module (50) is corrected after replacement. Claim 22 A module replacement method according to claim 21, characterized in that the projection exposure device (1) is ready to operate again after replacement and calibration of the module (50). Claim 23 A module replacement method according to claim 19, characterized in that the module (50) replacement is performed without changing the sensor frame (30). Claim 24 A module replacement method according to claim 19, characterized in that the mounting portion (8, 13) of the reticle module (21) or wafer module (22) is moved to a parking position for replacement of the module (50). Claim 25 A module replacement method according to claim 24, characterized in that the reticle module (21) or wafer module (22) is separated for replacement of the module (50). Claim 26 A module replacement method according to claim 19, characterized in that the projection optical unit (9) must be removed from the projection exposure device (1) for replacement of the module (50). Claim 27 A module replacement method according to claim 19, characterized in that the replacement of the module (50) does not affect the wafer exposure process optimized for the projection exposure device (1). Claim 28 A module replacement method according to claim 19, characterized in that more than 80%, or more than 90%, or 100% of the optical elements (52) of the projection optical unit (9) can be replaced without changing any other module (50).

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