A method of alignment for semiconductor device placement and apparatus thereof

Abstract

Alignment method and apparatus for semiconductor device placement The present invention provides an alignment method for placing semiconductor devices using at least one alignment device (103) composed of a dummy or actual unit of a semiconductor device such as a die, wherein the pre-placement alignment method determines reference point positions of the alignment device (103) and the second imaging device (301) when placing the semiconductor device on a second semiconductor device carrier (703) by having at least one data processing device analyze images captured by multiple image capturing devices at the alignment device (103) and alignment pins (405). The present invention also proposes an apparatus for performing the above method.

Description

Technology Field

[0001] The present invention provides an alignment method for placing semiconductor devices using at least one alignment device composed of a dummy or actual unit of a semiconductor device such as a die, wherein the pre-placement alignment method determines reference point positions of the alignment device and the second imaging device when placing the semiconductor device on a second semiconductor device carrier by having at least one data processing device analyze images captured by multiple image capturing devices at the alignment device, alignment pins, and pick-and-place tips. The present invention also proposes an apparatus for performing the method. Background Technology

[0002] Semiconductor packaging machines sort components from input carriers to output carriers. To ensure the semiconductor packaging machine accurately places components at desired locations on the output carrier, a vision-guided positioning system is required, which typically includes a pre-placement vision system and a placement position vision system. The function of the pre-placement vision system is to acquire the component's position when it is held by the semiconductor packaging machine's pick-and-place tip before it is placed on the output carrier. Conversely, the placement position vision system guides the center of the placement position (which may be a location referenced from a reference mark or a pocket) to the center of the component.

[0003] One method of existing technology involves performing manual alignment, where a user or operator must pick up a part, inspect its position under a pre-placement vision system, and then manually place the same part onto a tape placed on an output carrier platform. Subsequently, the position of the same part is inspected by a placement position vision system to calculate the precise center of the placement position vision center relative to the pre-placement position vision system. The part and the tape must be manually placed after the manual alignment method. This manual alignment method is time-consuming and prone to errors.

[0004] Agranat Edward et al. (WO2005008726A2) disclosed a flip-chip assembly machine (FCAM) ​​with a bond head, which picks a good die from a flux well and provides it to an upward-facing camera to perform vision alignment. The vision system determines the X, Y, and 0 offsets from the good die to the bond head before performing positioning of the bond head to ensure that the fluxed good die is accurately placed on the substrate. However, an upward-facing camera alone is not sufficient to ensure that the die is accurately placed on the substrate.

[0005] KOVACS ERNEST et al. (US4029536A) disclose an apparatus for aligning small articles, such as semiconductor chips, to a reference axis and loading them to a predetermined position on a carrier, wherein the article alignment means includes means for centering the articles on a common centerline and orienting the articles in a plane perpendicular to the common centerline. Such a system does not accommodate compensation by pick-and-place tips and alignment pins as proposed in the present invention.

[0006] Another solution for existing technology is to use a pick-and-place tip equipped with an alignment device. However, wear caused by prolonged operation of the pick-and-place tip can lead to dimensional inconsistencies, which affects the accuracy of alignment.

[0007] Another solution in existing technology is to use a mobile jig, such as a dummy part. However, this requires a conversion of the pick-and-place tip used to transport the mobile jig. This conversion results in wasted time required for the alignment.

[0008] Accordingly, it would be advantageous to mitigate the above disadvantages by an alignment method and device for semiconductor device placement, which can automatically pick and / or place at least one alignment device composed of a dummy or actual unit of a semiconductor device such as a die, and determine the reference point position of a second imaging device used when placing the actual semiconductor device by analyzing an image captured by a plurality of image capturing devices. The problem to be solved

[0009] Accordingly, the main objective of the present invention is to provide an alignment method and apparatus for placing semiconductor devices that can automatically pick and / or place at least one alignment device composed of a dummy or actual unit of a semiconductor device such as a die; and determine the reference point position of a second imaging device used when placing the actual semiconductor device by analyzing an image captured by a plurality of image capturing devices in order to reduce the time required to perform alignment and reduce the occurrence of errors caused by manual alignment.

[0010] Another object of the present invention is to provide a semiconductor device placement alignment method and apparatus in which the same semiconductor device of the input carrier can be used as an alignment medium without the need to change the kit (e.g., pick-and-place tip).

[0011] Another objective of the present invention is to provide a semiconductor device placement alignment method and apparatus that is superior to using a pick-and-place tip as an alignment medium in conventional technology, because the semiconductor device generally has consistent dimensions that can guarantee good alignment accuracy.

[0012] Another objective of the present invention is to provide a semiconductor device placement alignment method and apparatus that can further reduce the time required for alignment because no conversion of the pick-and-place tip is required.

[0013] Further objectives of the present invention will become clearer by understanding the detailed description of the present invention below or by actually applying the present invention. means of solving the problem

[0014] According to a preferred embodiment of the present invention, the following is provided:

[0015] The alignment method for semiconductor device placement is:

[0016] (i) picking at least one alignment device from at least one first semiconductor device carrier by at least one pick-and-place tip;

[0017] (ii) transferring the alignment device to a first vision inspection station by means of at least one pick-and-place arm while the alignment device is held by the pick-and-place tip;

[0018] (iii) capturing at least one first image of the alignment device by at least one first imaging device at the first vision inspection station while the alignment device is held by the pick-and-place tip, wherein the first image depicts a side of the alignment device opposite to the side held by the pick-and-place tip;

[0019] (iv) a step of determining the position of the alignment device relative to the reference point of the first imaging device by analyzing the first image using any appropriate data processing device;

[0020] (v) a step of transferring the alignment device to a second vision inspection station by the pick-and-place arm;

[0021] (vi) a step of determining the position of the top surface of at least one alignment pin using at least one second imaging device;

[0022] (vii) a step of determining the position of the alignment device held by the pick-and-place tip with respect to the side of the alignment pin;

[0023] (viii) a step of determining a modified XY position of a reference point of the second imaging device based on the correlation of XY positions obtained from steps (iv), (vi), and (vii), wherein the modified XY position of the reference point of the second imaging device is used to guide the coordinates of a placement point of at least one second semiconductor device carrier to the center of at least one semiconductor device when the semiconductor device is placed on the second semiconductor device carrier;

[0024] Includes

[0025] Another embodiment of the present invention is provided as follows:

[0026] An alignment device for semiconductor device placement is:

[0027] At least one pick-and-place arm having at least one pick-and-place tip;

[0028] At least one first vision inspection station having at least one first imaging device;

[0029] At least one arbitrary suitable data processing device;

[0030] At least one second vision inspection station; and

[0031] At least one second imaging device configured such that a pick-and-place tip is used when placing at least one semiconductor device onto at least one second semiconductor device carrier;

[0032] Includes,

[0033] The above pick-and-place tip is configured to pick or place at least one alignment device;

[0034] Here, the first imaging device is configured to capture at least one first image of the alignment device while the alignment device is held by the pick-and-place tip; the first image depicts a side of the alignment device opposite to the side held by the pick-and-place tip;

[0035] The modified XY position of the reference point of the second imaging device is based on the correlation of the XY position of the alignment device relative to the reference point of the first imaging device, the top surface position of at least one alignment pin, and the position relative to the side of the alignment pin of the alignment device held by the pick-and-place tip. Brief explanation of the drawing

[0036] Other aspects and advantages of the present invention may be discerned from the detailed description together with the accompanying drawings. In the drawings: FIG. 1 illustrates a front view of a pick-and-place tip that picks up an alignment device from a first semiconductor device carrier. FIG. 2a shows a front view of a first imaging device that captures a first image (207) of an alignment device through a first reflection device, and FIG. 2b is a sample of the first image (207) captured by the first imaging device. FIG. 3 shows a front view of a second imaging device that captures a second image of the top view of the alignment pin. FIG. 4 shows a front view of a pick-and-place tip that moves the alignment device so that the alignment device comes closer to the center of the top surface of the alignment pin. FIGS. 5A and 5D illustrate plan views of an alignment device and an alignment pin in which at least one image of one side and another image of a vertical side are captured through at least one second reflector using at least one third imaging device, wherein the third imaging device is repeatedly moved back and forth by a third actuator, and the alignment device and the alignment pin are each illuminated using a backlight and / or a frontlight. FIG. 5B illustrates a second embodiment of the third imaging device of step (vii)(b) of the method of the present invention, while FIG. 5C illustrates a third embodiment of the third imaging device of step (vii)(b) of the method of the present invention. FIG. 6 illustrates a front view of a second imaging device configured so that a pick-and-place tip is used when positioning a semiconductor device on a second semiconductor device carrier. FIG. 7 illustrates a plan view of one embodiment of an alignment device for arranging semiconductor devices according to the present invention. FIG. 8 is a flowchart illustrating the method of the present invention. Specific details for implementing the invention

[0037] In the following detailed description, numerous specific details are presented to provide a thorough understanding of the invention. However, those skilled in the art will understand that the invention may be practiced without these specific details. In other cases, to avoid obscuring the invention, widely known methods, procedures, and / or components have not been described in detail.

[0038] The present invention will be more clearly understood from the following description of embodiments provided by way of example only with reference to the accompanying drawings, and the drawings are not drawn to scale.

[0039] The present invention provides an alignment method for placing semiconductor devices, comprising the following steps. Step (i) is to pick at least one alignment device (103) from at least one first semiconductor device carrier (107) by at least one pick-and-place tip (105). The device carrier (107) may be a wafer, wafer frame, tray, waffle pack, tube, bowl, carrier tape, holder, or any suitable input substrate capable of carrying semiconductor devices.

[0040] Step (ii) is to transfer the alignment device (103) to a first vision inspection station (603) by at least one pick-and-place arm (601) while the alignment device (103) is held by the pick-and-place tip (105).

[0041] Step (iii) is to capture at least one first image (207) of the alignment device (103) by at least one first imaging device (201) while the alignment device (103) is held by the pick-and-place tip (105) at the first vision inspection station (603). Here, the first image (207) depicts the side of the alignment device (103) opposite to the side held by the pick-and-place tip (105). Thus, the capturing of the alignment device (103) depends on whether the alignment device (103) is flipped after the alignment device (103) is picked up from the first semiconductor device carrier (107). Step (iv) is to determine the position of the alignment device (103) relative to the reference point (205) of the imaging device by analyzing the first image (207) using any suitable data processing device. The position may be further defined as the XY position difference or offset between the alignment device (103) and the reference point (205) of the first imaging device (201). Step (v) is to transfer the alignment device (103) to the second vision inspection station (605) by the pick-and-place arm (601).

[0042] Step (vi) is to determine the position of the top surface of at least one alignment pin (405) using at least one second imaging device (301). Step (vi) includes the following sub-steps. Sub-step (vi)(a) is to move at least one alignment pin module (403) in the second vision inspection station (605) along the XY axis by at least one first actuator (not shown), as illustrated in FIG. 4, until the top surface of the alignment pin (405) of the alignment pin module (403) is within the field of view of the second imaging device (301) and the alignment pin (405) is close to the center point of the alignment device (103).

[0043] Substep (vi)(b) is to move the alignment pin module (403) in the second vision inspection station (605) along the Z-axis by at least one second actuator (409) until the top surface of the alignment pin (405) of the alignment pin module (403) is within the depth of field of the second imaging device (301).

[0044] Substep (vi)(c) is to capture at least one second image of the top view of the alignment pin (405) by the second imaging device (301) at the second vision inspection station (605) as illustrated in FIG. 3.

[0045] Sub-step (vi)(d) is to determine the position of the alignment pin (405) by analyzing the second image using any suitable data processing device.

[0046] Step (vii) is to determine the position of the alignment device (103) held by the pick-and-place tip (105) in relation to the side of the alignment pin (405).

[0047] Step (vii) includes the following sub-steps. Sub-step (vii)(a) is to move the alignment device (103), which is held by the pick-and-place tip (105), by the pick-and-place arm (601) to a position where the alignment device (103) is close to the center of the top surface of the alignment pin (405).

[0048] Substep (vii)(b) is to capture at least two third images of a vertical side view of the alignment device (103) and the alignment pin (405) by at least one third imaging device (501) at the second vision inspection station (605) while the alignment device (103) and the alignment pin (405) are illuminated by at least one light-emitting device (503). As illustrated in FIG. 5a, in one embodiment, step (vii)(b) may be performed using a third imaging device (501) that captures at least one image of one side of the alignment device (103) and the alignment pin (405); and the other vertical side of the alignment device (103) and the alignment pin (405) may be captured through at least one second reflector (411) configured to reflect light from the vertical side of the alignment device (103) and the alignment pin (405) to the third imaging device (501); Here, the third imaging device (501) is configured to be repeatedly moved back and forth by at least one third actuator (505) from a first position for capturing an image of a first side of the alignment device (103) and the alignment pin (405) to a second position for capturing an image of a vertical side of the alignment device (103) and the alignment pin (405) through the second reflector (411). In another embodiment, step (vii)(b) may be performed using a third imaging device (501) configured to capture an image of one side of the alignment device (103) and the alignment pin (405), and another third imaging device (501) configured to capture an image of the other vertical side of the alignment device (103) and the alignment pin (405) through the second reflector (411).In a third embodiment, step (vii)(b) may be performed using a third imaging device (501) configured to capture an image of one side of the alignment device (103) and the alignment pin (405), and another third imaging device (501) positioned to directly capture an image of the other vertical side of the alignment device (103) and the alignment pin (405) without any reflective device (411). In a fourth embodiment, step (vii)(b) may be performed using the second imaging device (301), thereby reflecting a plurality of side views of the alignment device (103) and the alignment pin (405) through a set of reflective devices such as prisms, mirrors, or a combination thereof.

[0049] In one embodiment, the light-emitting device (503) of step (vii)(b) is positioned on the side opposite to the side where the third image is captured by the third imaging device (501), as shown in FIG. 5a, to generate backlight for the alignment device (103) and the alignment pin (405). In another embodiment, the light-emitting device (503) of step (vii)(b) emits light toward the side where the third image is captured by the third imaging device (501), as shown in FIG. 5b, wherein the light-emitting device (503) may be positioned at any appropriate angle relative to the alignment device (103) and the alignment pin (405).

[0050] Substep (vii)(c) is to determine the positions of at least two vertical sides of the alignment device (103) held by the pick-and-place tip (105) in relation to the alignment pin (405) by analyzing the third image using any suitable data processing device.

[0051] Step (viii) determines the modified XY position of the reference point of the second imaging device (301) based on the correlation of the XY positions obtained from steps (iv), (vi), and (vii), wherein the modified XY position of the reference point of the second imaging device (301) is used when placing the semiconductor device (103) on the second semiconductor device carrier (703). The modified XY position of the reference point of the second imaging device (301) is obtained after calculating offset data obtained from the first imaging device (201), the second imaging device (301), and the third imaging device (501). When performing the placement of the semiconductor device, it is important to utilize the second imaging device (301) to guide the coordinates of the placement point of the output carrier (second semiconductor device carrier (703)) to the center of the semiconductor device (103).

[0052] An example of a method for calculating the modified XY position of the reference point of the second imaging device (301) is as follows. First, the X-component is calculated, wherein the X-axis offset data (X501.D) of the alignment device (103) is obtained by analyzing the first side third image captured by the third imaging device (501); and the X-axis offset data (X501.P) of the alignment pin (405) is obtained by analyzing the same first side third image. The difference (hereinafter referred to as the first difference) between the X-axis offset data (X501.D) of the alignment device (103) and the X-axis offset data (X501.P) of the alignment pin (405) is calculated. Then, the first upper X-axis offset data (X201) between the center point of the alignment device (103) and the reference point (205) of the first imaging device (201) is obtained by analyzing the first image (207) (shown in FIG. 2b) captured by the first imaging device (201). The difference between the first upper X-axis offset data (X201) and the first difference (hereinafter referred to as the second difference) is calculated. Then, the second upper X-axis offset data (X301) between the alignment pin (405) and the reference point of the second imaging device (301) is obtained by analyzing the second image captured by the second imaging device (301). Finally, as mentioned in step (viii) of the method of the present invention, the modified X-axis position of the reference point of the second imaging device (301) is obtained by calculating the difference between the second upper X-axis offset data (X301) and the second difference.

[0053] Meanwhile, the Y-component is also calculated, wherein the Y-axis offset data (Y501.D) of the alignment device (103) is obtained by analyzing a second side third image captured by the same third imaging device at another third imaging device or at another location (501). Here, the second side is perpendicular to the first side. The Y-axis offset data (Y501.P) of the alignment pin (405) is obtained by analyzing the same second side third image. The difference (hereinafter referred to as the first difference) between the Y-axis offset data (Y501.D) of the alignment device (103) and the Y-axis offset data (Y501.P) of the alignment pin (405) is calculated. Then, the first upper Y-axis offset data (Y(201)) between the center point of the alignment device (103) and the reference point (205) of the first imaging device (201) is obtained by analyzing the first image (207) (shown in FIG. 2b) captured by the first imaging device (201). The difference between the first upper Y-axis offset data (Y201) and the first difference (hereinafter referred to as the second difference) is calculated. Then, the second upper Y-axis offset data (Y301) between the alignment pin (405) and the reference point of the second imaging device (301) is obtained by analyzing the second image captured by the second imaging device (301). Finally, as mentioned in step (viii) of the method of the present invention, the modified Y-axis position of the reference point of the second imaging device (301) is obtained by calculating the difference between the second upper Y-axis offset data (Y301) and the second difference.

[0054] Step (ix) is, after step (viii), optionally disposing of the alignment device (103) used in the alignment method, placing the alignment device in the first semiconductor carrier, or placing the alignment device in the second semiconductor carrier. Disposal may be performed at at least one disposal station (707).

[0055] As illustrated in FIG. 7, the present invention also proposes an alignment device (401) for semiconductor device placement, which comprises at least one pick-and-place arm (601) having at least one pick-and-place tip (105), and at least one first vision inspection station (603) having at least one first imaging device (201). The pick-and-place arm (601) may be a rotary turret, a rotary wheel, or a linear motion actuator.

[0056] The alignment device (401) also includes at least one suitable data processing device, at least one second vision inspection station (605), and at least one second imaging device (301), wherein the second imaging device (301) is configured to be used when a pick-and-place tip (105) places at least one semiconductor device on at least one second semiconductor device carrier (703), as shown in FIG. 6, and wherein the pick-and-place tip (105) is configured to pick-and-place at least one alignment device (103). The alignment device (103) may be an electronic component, a dummy package, or a jig. If a jig is used as the alignment device, the jig will be obtained from a mobile jig carrier instead of the first semiconductor device carrier (107). The second semiconductor device carrier (703) may be a carrier tape, a tray, a waffle pack, a substrate, a tape, or a film.

[0057] The first imaging device (201) is configured to capture at least one first image (207) of the alignment device (103) while the alignment device (103) is held by the pick-and-place tip (105), wherein the first image (207) depicts a side of the alignment device (103) opposite to the side held by the pick-and-place tip (105). As illustrated in FIG. 2a, the first imaging device (201) may capture the first image (207) through at least one first reflection device (203). Additionally, the first imaging device (201) may capture the first image (207) directly without a reflection device. FIG. 2b illustrates a sample of a first image (207) captured by a first imaging device (201), wherein ΔX is an X-axis offset between the center point of the alignment device (103) and the reference point (205) of the first imaging device (201), and ΔY is a Y-axis offset between the center point of the alignment device (103) and the reference point (205) of the first imaging device (201). It is important to note that the reference point of the first imaging device (201) can be set to any location (i.e., corner, center, any other location) that is considered suitable within the field of view of the first imaging device (201).

[0058] The modified XY position of the reference point of the second imaging device (301) is based on the correlation of the XY position of the alignment device (103) with respect to the reference point (205) of the first imaging device (201), the position of the top surface of at least one alignment pin (405), and the position of the alignment device (103) held by the pick-and-place tip (105) with respect to the side of the alignment pin (405).

[0059] The second inspection station (605) includes at least one first actuator configured to move at least one pin alignment pin module (403) including the alignment pin (405) along the XY axis, and at least one second actuator (409) configured to move the alignment pin module (403) including the alignment pin (405) along the Z-axis. The first actuator and the second actuator (409) may be pneumatic cylinders, electric actuators, or electric motors.

[0060] The second inspection station (605) further includes at least one second imaging device (301) configured to capture at least one second image of a top view of the alignment pin (405) as illustrated in FIG. 3. The second inspection station (605) further includes at least one third imaging device (501) configured to capture at least two third images of a vertical side view of the alignment device (103) and the alignment pin (405) while the alignment device (103) and the alignment pin (405) are illuminated by at least one light-emitting device (503); and at least one suitable data processing device configured to determine the position of the alignment pin (405) by analyzing the second image, or to determine the position of at least two vertical sides of the alignment device (103) held by the pick-and-place tip (105) with respect to the alignment pin (405) by analyzing the third image, or to implement a combination thereof.

[0061] A third imaging device (501) is configured to capture at least one image of one side of the alignment device (103) and the alignment pin (405); and to capture the other vertical side of the alignment device (103) and the alignment pin (405) through at least one second reflector (411) configured to reflect light from the vertical side of the alignment device (103) and the alignment pin (405) to the third imaging device (501); and at least one third actuator (505) is configured to repeatedly move the third imaging device (501) back and forth from a first position for capturing an image of the alignment device (103) and the alignment pin (405) to a second position for capturing an image of the vertical side of the alignment device (103) and the alignment pin (405) through the second reflector (411). The third actuator (505) may be a pneumatic cylinder, an electric actuator, or an electric motor.

[0062] In another embodiment, a third imaging device (501) is configured to capture an image of one side of the alignment device (103) and the alignment pin (405), and another third imaging device (501) is configured to capture an image of the other vertical side of the alignment device (103) and the alignment pin (405).

[0063] In one embodiment, the light-emitting device (503) is positioned on the side opposite to the side where the third image is captured by the third imaging device (501) to generate a backlight for the alignment device (103) and the alignment pin (405).

[0064] In another embodiment, the light-emitting device (503) may also be configured to emit light toward the side where the third image is captured by the third imaging device (501).

[0065] The alignment device (401) for placing semiconductor devices also includes at least one disposal station configured to dispose of the alignment device (103). The first vision inspection station (603), the second vision inspection station (605), the placement station, and the disposal station (707) may also be arranged in a linear arrangement instead of the rotary arrangement shown in FIG. 7, which can be easily implemented by a linearly operating pick-and-place arm.

[0066] Although the present invention has been illustrated and described herein with reference to preferred embodiments illustrating superior results and advantages over the prior art obtained through the present invention, the present invention is not limited to these specific embodiments. Accordingly, the forms of the invention illustrated and described herein should be taken merely as illustrative, and other embodiments that do not depart from the scope of the invention may be selected as set forth in the claims appended herein.

[0067] delete

[0068] delete Explanation of the symbols delete

Claims

Claim 1 A method for aligning semiconductor devices, comprising: (i) picking at least one alignment device (103) from at least one first semiconductor device carrier (107) by at least one pick-and-place tip (105); (ii) transferring the alignment device (103) to a first vision inspection station (603) by at least one pick-and-place arm (601) while the alignment device (103) is held by the pick-and-place tip (105); (iii) capturing at least one first image (207) of the alignment device (103) by at least one first imaging device (201) at the first vision inspection station (603) while the alignment device (103) is held by the pick-and-place tip (105), wherein the first image (207) is the alignment opposite to the side held by the pick-and-place tip (105). (iv) describing the side of the device (103); (iv) determining the position of the alignment device (103) relative to the reference point (205) of the first imaging device (201) by analyzing the first image (207) using any data processing device; (v) transferring the alignment device (103) to a second vision inspection station (605) by the pick-and-place arm (601); (vi) determining the position of the top surface of at least one alignment pin (405) using at least one second imaging device (301); (vii) determining the position of the alignment device (103) held by the pick-and-place tip (105) relative to the side of the alignment pin (405);(viii) a step of determining a modified XY position of a reference point of the second imaging device (301) based on the correlation of XY positions obtained from steps (iv), (vi), and (vii), wherein the modified XY position of the reference point of the second imaging device (301) is used to guide the coordinates of a placement point of at least one second semiconductor device carrier (703) to the center of the at least one semiconductor device when placing at least one semiconductor device on the second semiconductor device carrier (703); comprising an alignment method for placing semiconductor devices.; Claim 2 In claim 1, the step (vi) comprises the following substeps: (a) moving at least one alignment pin module (403) along the XY axis by at least one first actuator (not shown) at the second vision inspection station (605) until the top surface of the alignment pin (405) of the alignment pin module (403) is within the field of view of the second imaging device (301) and the alignment pin (405) is close to the center point of the alignment device (103); (b) moving the alignment pin module (403) along the Z-axis by at least one second actuator (409) at the second vision inspection station (605) until the top surface of the alignment pin (405) of the alignment pin module (403) is within the depth of field of the second imaging device (301); (c) the alignment by the second imaging device (301) at the second vision inspection station (605). A method for aligning semiconductor devices, comprising: a step of capturing at least one second image of a top view of a pin (405); and a step of determining the position of the alignment pin (405) by analyzing the second image using any data processing device. Claim 3 In claim 1, the step (vii) comprises the following substeps: (a) moving the alignment device (103), which is held by the pick-and-place tip (105), by the pick-and-place arm (601) to a position where the alignment device (103) is close to the center of the top surface of the alignment pin (405); (b) capturing at least two third images of a vertical side view of the alignment device (103) and the alignment pin (405) by at least one third imaging device (501) at the second vision inspection station (605) while the alignment device (103) and the alignment pin (405) are illuminated by at least one light-emitting device (503); and (c) determining the positions of at least two vertical sides of the alignment device (103) held by the pick-and-place tip (105) with respect to the alignment pin (405) by analyzing the third image using any data processing device; a method for aligning semiconductor devices. Claim 4 In paragraph 3, step (vii)(b) may be performed using a third imaging device (501) that captures at least one image of one side of the alignment device (103) and the alignment pin (405); and the other vertical side of the alignment device (103) and the alignment pin (405) may be captured through at least one second reflector (411) configured to reflect light from the vertical side of the alignment device (103) and the alignment pin (405) to the third imaging device (501); A method for aligning semiconductor devices, wherein the third imaging device (501) is configured to repeatedly move back and forth from a first position for capturing an image of a first side of the alignment device (103) and the alignment pin (405) by means of at least one third actuator (505) to a second position for capturing an image of a vertical side of the alignment device (103) and the alignment pin (405) through the second reflecting device (411). Claim 5 A method for aligning semiconductor devices according to claim 3, wherein step (vii)(b) can be performed using one third imaging device (501) configured to capture an image of one side of the alignment device (103) and the alignment pin (405), and another third imaging device (501) configured to capture an image of the other vertical side of the alignment device (103) and the alignment pin (405) through at least one second reflecting device (411) configured to reflect light from the other vertical side of the alignment device (103) and the alignment pin (405) to the third imaging device (501). Claim 6 A method for aligning semiconductor devices according to claim 3, wherein step (vii)(b) can be performed using one third imaging device (501) configured to capture an image of one side of the alignment device (103) and the alignment pin (405), and another third imaging device (501) positioned to directly capture an image of the other vertical side of the alignment device (103) and the alignment pin (405). Claim 7 In paragraph 3, the step (vii)(b) can be performed using the second imaging device (301), thereby allowing a plurality of side views of the alignment device (103) and the alignment pin (405) to be reflected through a set of reflection devices, for an alignment method for semiconductor device placement. Claim 8 In paragraph 3, the light-emitting device (503) of step (vii)(b) is positioned on the opposite side of the side where the third image is captured by the third imaging device (501), thereby creating a backlight for the alignment device (103) and the alignment pin (405), an alignment method for semiconductor device placement. Claim 9 In paragraph 3, the light-emitting device (503) of step (vii)(b) emits light toward the side where the third image is captured by the third imaging device (501), an alignment method for semiconductor device arrangement. Claim 10 In claim 1, the step of determining the modified XY position of the reference point of the second imaging device (301) in step (viii) comprises the following substeps: a. analyzing a third image captured by one third imaging device (501) to obtain the first lateral alignment device (103) offset data (X501.D) and the alignment pin (405) offset data (X501.P); analyzing another third image captured by the same third imaging device at another third imaging device or at another location (501) to obtain the second lateral alignment device (103) offset data (Y501.D) and the alignment pin (405) offset data (Y501.P), wherein the second lateral side is perpendicular to the first lateral side; b. calculating the first difference between the X-axis offset data (X501.D) of the alignment device (103) and the X-axis offset data (X501.P) of the alignment pin (405); c. A step of calculating a first difference between the Y-axis offset data (Y501.D) of the alignment device (103) and the Y-axis offset data (Y501.P) of the alignment pin (405); d. A step of obtaining first upper XY offset data (X201, Y201) between the center point of the alignment device (103) and the reference point (205) of the first imaging device (201) by analyzing the first image (207) captured by the first imaging device (201); d. A step of calculating a second difference between the first upper X-axis offset data (X201) and the first X-axis difference (X501.D, X501.P); and a step of calculating a second difference between the first upper Y-axis offset data (Y201) and the first Y-axis difference (Y501.D, Y501.P); e. A step of analyzing a second image captured by the second imaging device (301) to obtain second upper XY offset data (X301, Y301) between the alignment pin (405) and the reference point of the second imaging device (301); and f.A method for aligning semiconductor devices, comprising the step of: calculating the difference between the second upper X-axis offset data (X301) and the second X-axis difference; and calculating the difference between the second upper Y-axis offset data (Y301) and the second Y-axis difference, thereby obtaining the modified XY position of the reference point of the second imaging device (301) as in step (viii) of the method of the present invention. Claim 11 A method for aligning semiconductor devices according to claim 1, further comprising, after step (viii), a step of discarding the alignment device (103) used in the alignment method, a step of placing the alignment device in the first semiconductor device carrier (107), or a step of placing the alignment device in the second semiconductor device carrier (703). Claim 12 As an alignment device (401) for semiconductor device placement, at least one pick-and-place arm (601) having at least one pick-and-place tip (105) for picking at least one alignment device (103) from at least one first semiconductor device carrier (107); at least one first vision inspection station (603) having at least one first imaging device (201); at least one arbitrary data processing device; at least one second vision inspection station (605); and at least one second imaging device (301) configured to be used when a pick-and-place tip (105) places at least one semiconductor device on at least one second semiconductor device carrier (703); wherein the pick-and-place tip (105) is configured to pick or place at least one alignment device (103); and wherein the first imaging device (201) is configured to capture at least one first image (207) of the alignment device (103) while the alignment device (103) is held by the pick-and-place tip (105); The first image (207) depicts a side of the alignment device (103) opposite to the side held by the pick-and-place tip (105); and the modified XY position of the reference point of the second imaging device (301) is based on the correlation of the XY position of the alignment device (103) with respect to the reference point (205) of the first imaging device (201), the top surface position of at least one alignment pin (405), and the position of the side of the alignment device (103) held by the pick-and-place tip (105), for a semiconductor device placement alignment device (401). Claim 13 In claim 12, the second vision inspection station (605) comprises: at least one first actuator configured to move at least one alignment pin module (403) including the alignment pin (405) along the XY axis; at least one second actuator (409) configured to move the alignment pin module (403) including the alignment pin (405) along the Z-axis; at least one second imaging device (301) configured to capture at least one second image of a top view of the alignment pin (405); and at least one third imaging device (501) configured to capture at least two third images of a vertical side view of the alignment device (103) and the alignment pin (405) while the alignment device (103) and the alignment pin (405) are illuminated by at least one light-emitting device (503). Alignment device (401) for semiconductor device placement comprising: at least one arbitrary data processing device configured by analyzing the second image to determine the position of the alignment pin (405), analyzing the third image to determine the position of at least two vertical sides of the alignment device (103) held by the pick-and-place tip (105) with respect to the alignment pin (405), or a combination thereof. Claim 14 In claim 12, the first imaging device (201) is an alignment device (401) for semiconductor device placement that captures the first image (207) through at least one first reflection device (203). Claim 15 In claim 13, a third imaging device (501) is configured to capture at least one image of one side of the alignment device (103) and the alignment pin (405); and captures the other vertical side of the alignment device (103) and the alignment pin (405) through at least one second reflecting device (411) configured to reflect light from the vertical side of the alignment device (103) and the alignment pin (405) to the third imaging device (501); and at least one third actuator (505) is configured to repeatedly move the third imaging device (501) back and forth from a first position for capturing an image of the first side of the alignment device (103) and the alignment pin (405) to a second position for capturing an image of the vertical side of the alignment device (103) and the alignment pin (405) through the second reflecting device (411). Claim 16 In paragraph 13, an alignment device (401) for semiconductor device placement, wherein one third imaging device (501) is configured to capture an image of one side of the alignment device (103) and the alignment pin (405), and another third imaging device (501) is configured to capture an image of the other vertical side of the alignment device (103) and the alignment pin (405). Claim 17 In paragraph 13, the light-emitting device (503) is positioned on the opposite side of the side where the third image is captured by the third imaging device (501), and is an alignment device (401) for semiconductor device placement that generates a backlight on the alignment device (103) and the alignment pin (405). Claim 18 In paragraph 13, the light-emitting device (503) is an alignment device (401) for semiconductor device placement configured to emit light toward the side where the third image is captured by the third imaging device (501). Claim 19 In paragraph 13, an alignment device (401) for semiconductor device placement further comprising at least one disposal station configured to dispose of the alignment device (103). Claim 20 In paragraph 12, the alignment device (103) is an alignment device (401) for arranging electronic components, dummy packages, or semiconductor devices in a jig. Claim 21 In paragraph 13, the first actuator and the second actuator (409) are alignment devices (401) for semiconductor device placement, which are pneumatic cylinders, electric actuators, or electric motors. Claim 22 In item 15, the third actuator (505) is an alignment device (401) for semiconductor device placement, which is a pneumatic cylinder, an electric actuator, or an electric motor. Claim 23 In claim 12, the first semiconductor device carrier (107) is an alignment device (401) for semiconductor device placement, which is any input substrate capable of carrying a wafer, tray, waffle pack, tube, ball, or semiconductor device. Claim 24 In claim 12, the second semiconductor device carrier (703) is an alignment device (401) for placing semiconductor devices, which is a carrier tape, tray, waffle pack, substrate, tape, or film. Claim 25 In paragraph 12, the pick-and-place arm (601) is an alignment device (401) for placing semiconductor devices, which is a rotary turret, rotary wheel, or linear motion actuator. Claim 26 In claim 12, the first imaging device (201) is an alignment device (401) for semiconductor device placement configured to directly capture the first image (207) without a reflection device.

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