Position detection apparatus of substrates, bonding appratus of substrates and position detection method of substrates

Abstract

[Task] Reliably detect the positions of both the upper substrate and the lower substrate. [Solution Means] A substrate position detection device (110) comprises a holding portion (30) that holds a substrate (301), a support portion (20) that supports a substrate (302) at a predetermined distance below the substrate (301), an imaging portion (71) that is provided above the substrate (301) and also on the outer side in the diameter direction, and is configured such that an imaging optical axis (71c) is inclined at a predetermined angle (θ) from the upper and lower direction including the outer periphery (301s, 302s) of the substrate (301) or the substrate (302), thereby enabling simultaneous imaging of a portion including the outer periphery (301s) of the substrate (301) and a portion including the outer periphery (302s) of the substrate (302), and a processing portion that detects the horizontal position of the substrate (302) based on the image captured by the imaging portion (71), and a predetermined distance (Z) and a predetermined The angle (θ) is set so that, in the processing unit, information regarding the outer periphery (301s) of the substrate (301) and information regarding the outer periphery (302s) of the substrate (302) can be separated from the image.

Description

Technology Field

[0001] The present invention relates to a substrate position detection device, a substrate overlap device, and a substrate position detection method. Background Technology

[0002] A configuration is disclosed in which a substrate and a lower substrate supporting an upper substrate are overlapped, wherein the upper substrate and the lower substrate are overlapped in a overlap chamber, the upper substrate and the lower substrate are overlapped in a way that the upper substrate and the lower substrate are overlapped in a way that the outer edge of at least one of the upper substrate and the lower substrate are overlapped in a way that Prior art literature

[0003] Japanese Patent Publication No. 6670185 The problem to be solved

[0004] In the configuration disclosed in Patent Document 1, the camera detects the outer edge of the upper substrate and the lower substrate illuminated by the reflector. Because of this, in the overlapping direction of the upper substrate and the lower substrate, if the outer dimension of one of the upper substrate and the lower substrate placed on the side closer to the reflector is larger than the outer dimension of the other of the upper substrate and the lower substrate placed on the side further away from the reflector, the outer edge of the other of the upper substrate and the lower substrate cannot be detected by the camera.

[0005] Taking into account the above circumstances, the present invention aims to provide a substrate position detection device, a substrate overlapping device, and a substrate position detection method capable of reliably detecting the positions of both an upper substrate and a lower substrate. means of solving the problem

[0006] In an embodiment of the present invention, there are a holding member that holds an upper substrate; a supporting member that supports a lower substrate at a predetermined distance below the upper substrate; an imaging member provided above the upper substrate and also outside in the diameter direction, wherein the imaging optical axis is positioned at an angle inclined from the upper / lower direction including the outer periphery of the upper substrate or the lower substrate, and capable of simultaneously imaging a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate without reflecting the imaging optical axis; and a processing member that detects the horizontal position of the lower substrate based on an image captured by the imaging member, wherein the predetermined distance and the predetermined angle satisfy 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sin θ when the predetermined angle is denoted as θ and the predetermined distance as Z, and the processing member is configured to be able to separate information regarding the outer periphery of the upper substrate and information regarding the outer periphery of the lower substrate from the image. A substrate position detection device is provided. In a first embodiment of the present invention, the substrate position detection device is provided, comprising: a holding member that holds an upper substrate; a supporting member that supports a lower substrate at a predetermined distance below the upper substrate; an imaging member that is provided above the upper substrate and also outside in the diameter direction, and is positioned such that an imaging optical axis is tilted at a predetermined angle from an up-down direction including the outer periphery of the upper substrate or the lower substrate, thereby enabling simultaneous imaging of a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate; and a processing member that detects the horizontal position of the lower substrate based on an image captured by the imaging member. The predetermined distance and the predetermined angle are configured such that, in the processing member, information regarding the outer periphery of the upper substrate and information regarding the outer periphery of the lower substrate are separable from the image.

[0007] In an embodiment of the present invention, a substrate position detection device is provided, comprising: a holding member for holding an upper substrate; a support member for supporting a lower substrate at a predetermined distance downward from the upper substrate; an imaging member provided above the upper substrate and also outside in the radial direction, wherein the imaging optical axis is positioned toward the outer periphery of the lower substrate without reflecting the imaging optical axis by tilting it at a predetermined angle from the vertical direction including the outer periphery of the upper substrate or the lower substrate, thereby enabling imaging of a portion including the outer periphery of the lower substrate; and a processing member for detecting the horizontal position of the lower substrate based on the image captured by the imaging member. The predetermined distance and the predetermined angle are set such that, when the predetermined angle is denoted as θ and the predetermined distance as Z, 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sinθ are satisfied. In a second embodiment of the present invention, a holding member for holding an upper substrate and a lower substrate at a predetermined distance downward from the upper substrate A substrate position detection device is provided, comprising: a support member that supports a substrate; an imaging member that is positioned above the upper substrate and also outward in the diameter direction, and is configured such that an imaging optical axis is tilted at a predetermined angle from the upper / lower direction including the outer periphery of the upper substrate or the lower substrate and directed toward the lower substrate, thereby enabling imaging of a portion including the outer periphery of the lower substrate; and a processing member that detects the horizontal position of the lower substrate based on the image captured by the imaging member.

[0008] In a third aspect of the present invention, a substrate overlapping device is provided, comprising the above-described substrate position detection device.

[0009] In an embodiment of the present invention, a substrate overlapping device is provided, comprising: a holding member for holding an upper substrate; a supporting member for supporting a lower substrate at a predetermined distance downward from the upper substrate; an imaging member provided above the upper substrate and also outside in the radial direction, wherein the imaging optical axis is positioned toward the outer periphery of the lower substrate without reflecting the imaging optical axis by tilting it at a predetermined angle from the vertical direction including the outer periphery of the upper substrate or the lower substrate, thereby enabling imaging of a portion including the outer periphery of the lower substrate; and a processing member for detecting the horizontal position of the lower substrate based on the image captured by the imaging member. The predetermined distance and the predetermined angle are set such that, when the predetermined angle is denoted as θ and the predetermined distance as Z, 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sinθ are satisfied. In a fourth embodiment of the present invention, a holding member for holding an upper substrate and a lower substrate at a predetermined distance downward from the upper substrate A substrate overlapping device is provided, comprising: a support member that supports a substrate; an imaging member that is positioned above the upper substrate and also outward in the diameter direction, and is configured such that an imaging optical axis is tilted at a predetermined angle from the upper / lower direction including the outer periphery of the upper substrate or the lower substrate and directed toward the lower substrate, thereby enabling imaging of a portion including the outer periphery of the lower substrate; and a processing member that detects the horizontal position of the lower substrate based on the image captured by the imaging member.

[0010] In an embodiment of the present invention, a substrate position detection method is provided, comprising: supporting an upper substrate; supporting a lower substrate at a predetermined distance below the upper substrate; tilting an imaging optical axis at a predetermined angle from an upper / lower direction including the outer periphery of the upper substrate or the lower substrate from an upper side and also from a radial direction outer side above the upper substrate, so as to simultaneously image a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate without reflecting the imaging optical axis; and detecting the horizontal position of the lower substrate based on the image, wherein the predetermined distance and the predetermined angle satisfy 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sinθ when the predetermined angle is denoted as θ and the predetermined distance as Z, and the information regarding the outer periphery of the upper substrate and the information regarding the outer periphery of the lower substrate are configured to be separable from the image. In a fifth embodiment of the present invention, the method comprises supporting an upper substrate and the upper A substrate position detection method is provided, comprising: supporting a lower substrate at a predetermined interval below the substrate; tilting an imaging optical axis at a predetermined angle from an upper and lower direction including the outer periphery of the upper substrate or the lower substrate, from an upper side of the upper substrate and also from the outer side in the diameter direction, to simultaneously image a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate; and detecting the horizontal position of the lower substrate based on the image, wherein the predetermined interval and the predetermined angle are set so as to separate information regarding the outer periphery of the upper substrate and information regarding the outer periphery of the lower substrate from the image. Effects of the invention

[0011] According to the present invention, it is possible to reliably detect the positions of both the upper substrate and the lower substrate. Brief explanation of the drawing

[0012] FIG. 1 is a figure showing an example of a substrate overlapping device related to an embodiment. FIG. 2 is a figure showing an imaging unit provided in a substrate overlapping device related to an embodiment. Figure 3 is a plan view showing an example of the arrangement of the imaging unit. Figure 4 is a figure showing an example of an image captured by an imaging unit. FIG. 5 is a flowchart illustrating an example of a substrate position detection method related to the present embodiment. FIG. 6 is a flowchart illustrating an example of a substrate position detection method related to the present embodiment, following FIG. 5. FIG. 7 is a flowchart illustrating an example of a substrate position detection method related to the present embodiment, following FIG. 6. FIG. 8 shows an example of the operation of a substrate overlapping device, in which an upper substrate is brought into a chamber and supported by a lift pin. FIG. 9 shows an example of the operation of a substrate overlapping device, in which an upper substrate is placed on a support plate. FIG. 10 shows an example of the operation of a substrate overlapping device and is a diagram showing an alignment operation performed on an upper substrate. FIG. 11 shows an example of the operation of a substrate overlapping device, in which the upper substrate is raised to the lower position of the spacer. FIG. 12 shows an example of the operation of a substrate overlapping device and is a drawing in which the outer periphery of an upper substrate is captured by an imaging unit. FIG. 13 shows an example of the operation of a substrate overlapping device, in which an upper substrate is held by a spacer of a holding portion. FIG. 14 illustrates an example of the operation of a substrate overlapping device related to another embodiment, in which an upper substrate is held by an adsorption pad of a holding portion. FIG. 15 shows an example of the operation of a substrate stacking device, in which a lower substrate is brought into a chamber and supported by a lift pin. FIG. 16 shows an example of the operation of a substrate overlapping device, in which a lower substrate is placed on a support plate. FIG. 17 illustrates an example of the operation of a substrate overlapping device and shows an alignment operation performed on a lower substrate. FIG. 18 illustrates an example of the operation of a substrate overlapping device, in which a lower substrate is positioned downward at a predetermined distance from an upper substrate. FIG. 19 shows an example of the operation of a substrate overlapping device and is a drawing in which the outer periphery of a lower substrate is captured by an imaging unit. FIG. 20 illustrates an example of the operation of a substrate overlapping device related to another embodiment, and is a drawing in which the outer periphery of a lower substrate is captured by an imaging unit. FIG. 21 shows an example of the operation of a substrate overlapping device, in which the upper substrate and the lower substrate are joined by raising the lift pin. FIG. 22 shows an example of the operation of a substrate overlapping device, in which a lift pin is raised to receive an overlapping substrate. FIG. 23 shows an example of the operation of a substrate overlapping device, and is a diagram showing the overlapping substrate being transferred from the lift pin to the arm. Specific details for implementing the invention

[0013] Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the description below. Furthermore, in the drawings, parts may be omitted to make the embodiments easier to understand. Additionally, parts may be depicted by appropriately changing the scale, such as by making parts larger or more emphasized, and the size and shape may differ from the actual product. In each of the drawings below, the directions within the drawings are explained using an XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, a plane parallel to the horizontal plane is called the XY plane. In this XY plane, the direction parallel to the transport direction of the substrate (301) and the substrate (302) is called the X direction, and the direction orthogonal to the X direction is called the Y direction. Additionally, the direction perpendicular to the XY plane is indicated as the Z direction (height direction). Each of the X direction, Y direction, and Z direction is explained by stating that the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

[0014] <Substrate Overlapping Device>

[0015] A substrate overlapping device (100) related to the embodiment will be described. FIG. 1 is a diagram showing an example of a substrate overlapping device (100) related to the embodiment. The substrate overlapping device (100) attaches a substrate (301) having an adhesive layer (F) and a substrate (302) having an adhesive layer (F) by bringing their adhesive layers (F) into contact with each other. In addition, the adhesive layer (F) is not limited to being formed on both the substrate (301) and the substrate (302), but may be formed on either one of the substrate (301) or the substrate (302). The adhesive layer (F) is formed by applying and drying it on the substrate (301) and the substrate (302) by, for example, a coating device, before being introduced into the substrate overlapping device (100). In addition, this coating device may be in the form of being provided in the substrate overlapping device (100). Also, there may be cases where an adhesive layer (F) is formed on either the substrate (301) and the substrate (302), and, for example, a reaction layer is formed on the other.

[0016] In this embodiment, among the two substrates attached, the upper substrate is referred to as substrate (301) and the lower substrate is referred to as substrate (302). The substrate (301) and the substrate (302) are, for example, glass substrates, semiconductor substrates, resin substrates, etc. In this embodiment, for example, the upper substrate (301) is a glass substrate and the lower substrate (302) is a silicon substrate. In addition, the form in which the substrate (301) and the substrate (302) are attached is referred to as substrate (300) (see FIG. 23). The substrate (301) and the substrate (302) are both circular substrates that are circular in shape when viewed from a flat plane (viewed from the Z direction), but they are not limited to circular substrates and may be rectangular substrates (square shape, rectangular shape), elliptical shape, elongated shape, etc. when viewed from a flat plane.

[0017] As shown in FIG. 1, the substrate overlapping device (100) comprises a chamber (10), a support member (20), a holding member (30), a lifting mechanism (50), an alignment mechanism (60), an imaging mechanism (70), and a control member (200).

[0018] In the substrate overlapping device (100), in order to join the substrates (301, 302), first, the substrate (301) is brought into the chamber (10), positioned using the alignment mechanism (60), then the substrate (301) is raised to the support member (20), and the horizontal position of the substrate (301) is detected. After detecting the horizontal position, the substrate (301) is raised and held by the holding member (30). Then, the substrate (302) is brought into the chamber (10), positioned using the alignment mechanism (60), then the substrate (302) is raised to the support member (20), and the horizontal position of the substrate (302) is detected. After detecting the horizontal position, the substrate (302) is raised to the support member (20) and overlapped with the substrate (301) held by the holding member (30).

[0019] The chamber (10) is placed on a base (15) of a substrate overlapping device (100). The chamber (10) is formed in a box shape having a side wall (10a) rising upward from the outer periphery of the base (15) and a ceiling plate (10b) covering the upper part of the side wall (10a). The chamber (10) accommodates a support member (20), a holding member (30), a part of a lifting mechanism (50), and an alignment mechanism (60). The chamber (10) is formed in a box shape and has a side opening (11) in a part of the side wall (10a). The side opening (11) is formed on the -X side surface of the chamber (10) and connects the inside and outside of the chamber (10). The side opening (11) is formed with dimensions that allow a substrate (301, 302) held in the conveying device (90) and an additional substrate (300) to which both are attached to pass through.

[0020] Substrates (301, 302) are each brought into the chamber (10) through the side opening (11) by means of the arm (91) of the transport device (90). Additionally, the substrate (300) is removed from the chamber (10) through the side opening (11). In this embodiment, the transport device (90) is equipped with two flat arms (91), and when bringing the substrate (301) into the chamber (10), it holds the substrate (301) by adsorbing it from the upper side of the substrate (301). When bringing in the substrate (302) and when removing the substrate (300) from the chamber (10), the transport device (90) holds the substrate (302, S) by adsorbing it from the lower side of the substrate (302, S). Additionally, when transporting the substrate (302,S), the arm (91) may be in a form that holds the substrate (302,S) by placing it on the upper surface of the arm (91) without adsorbing it. Also, the arm (91) is not limited to two, but may have three or more.

[0021] The chamber (10) is equipped with a gate valve (12) that opens and closes a side opening (11). The gate valve (12) is positioned on the outside of the side of the chamber (10) on the -X side and can slide, for example, in the up-down direction (Z direction) by means of a driving part not shown. The gate valve (12) opens and closes the side opening (11) by sliding.

[0022] Additionally, the inside of the chamber (10) may be sealed by closing the side opening (11) with the gate valve (12), thereby creating a vacuum atmosphere inside the chamber (10). Even if the side opening (11) is closed, the inside of the chamber (10) may be kept under an atmospheric pressure atmosphere. Furthermore, the ceiling plate (10b) of the chamber (10) is provided with a through-hole (10h) through which the shaft portion (51), described later, passes. The shaft portion (51) is inserted into the through-hole (10h).

[0023] Additionally, the chamber (10) may be connected to a gas supply device not shown. By supplying a specific gas into the chamber (10) from this gas supply device, the atmosphere inside the chamber (10) can be replaced with a specific gas atmosphere. As the specific gas, for example, a gas that is inert to a thin film formed on a substrate (301, 302), such as nitrogen gas, or dry air, may be used. When the chamber (10) is made into a vacuum atmosphere, the chamber (10) is connected to a suction device not shown. By suctioning (exhausting) the chamber (10) with this suction device, the chamber (10) can be made into a vacuum atmosphere. Additionally, the chamber (10) may be equipped with a valve that can be opened to the outside to open the internal vacuum atmosphere.

[0024] The support member (20) supports the substrate (301, 302) introduced into the chamber (10) from below. The support member (20) has a lift pin (21), a moving member (22) connected to the lower end of the lift pin (21) and moving up and down in the Z direction, a lift pin driving member (23) that moves the moving member (22) up and down, and a support plate (alignment support member) (25).

[0025] A lift pin (21) is positioned in the center of the support portion (20). The lift pin (21) supports the substrate (301, 302) by striking it from below. For example, a plurality of lift pins (21) are provided. When viewed from the upper and lower directions, the plurality of lift pins (21) are arranged concentrically at a distance in the circumferential direction, radially outward from the center of the substrate (301, 302). Additionally, only one lift pin (21) may be positioned in the center of the substrate (301, 302). The lift pin (21) may be formed from a non-conductive material (e.g., resin, metal, ceramics, etc.).

[0026] The moving part (22) moves up and down by driving the lift pin drive part (23). The lift pin drive part (23) may utilize, for example, an electric rotary motor, a linear motor, an air cylinder device, a hydraulic cylinder device, etc., and the driving force is transmitted to the moving part (22) by a transmission mechanism not shown.

[0027] Additionally, the support member (20) supports the substrate (301, 302) when the lift pin (21) is lowered. In this embodiment, the support member (20) is formed, for example, of stainless steel, and a support plate (25), for example, made of ceramic, is provided on the upper side. A plate-shaped support plate (25) may also be provided. The support plate (25) is provided above the base (15) by interposing a plurality of support columns (26). In this case, the support plate (25) has a through hole (25h) through which the lift pin (21) passes. The lift pin (21) is configured to pass through the through hole (25h) and be able to move upward from the support plate (25). The support plate (25) may have a built-in heater for heating the substrate (301, 302).

[0028] The support member (20) raises and lowers the substrate (301, 302, 300) supported by the lift pin (21). For this reason, the lift pin (21) can raise and lower the substrates (301, 302) between, for example, a first position (P1) (see FIG. 8, FIG. 15) for receiving each of the substrates (301, 302) brought into the chamber (10), a second position (P2) (see FIG. 10) for aligning with the alignment mechanism (60), a third position (P3) (see FIG. 12, FIG. 18) for detecting the position of the substrates (301, 302), a fourth position (P4) (see FIG. 13, FIG. 19) for holding the substrate (301) with the holding portion (30), and a fifth position (P5) (see FIG. 21) for overlapping the substrate (302) with the substrate (301). The lift pin (21) of the support member (20) supports the substrate (302) at a predetermined distance below the substrate (301) supported by the support member (30).

[0029] The holding portion (30) is provided above the supporting portion (20). In this embodiment, a spacer (31) is used as the holding portion (30). The spacer (31) holds the upper substrate (301). The spacer (31) is a member that holds the substrate (301) until it is overlapped with the substrate (302). The spacers (31) are provided in multiple numbers at intervals along the circumference of the substrate (301), on the outer side of the substrate (301) in the diameter direction.

[0030] A plurality of spacers (31) are supported, for example, by a support member (not shown) extending downward from the ceiling plate (10b) of the chamber (10). A plurality of spacers (31) support a portion of the periphery of the substrate (301) from below. Each of the plurality of spacers (31) can move horizontally between a position supporting the substrate (301) from below and a position retracting outward in the diameter direction of the substrate (301) by means of a driving mechanism not shown. The spacers (31) receive the substrate (301) from the lift pin (21) by entering downward of the substrate (301) raised by the lift pin (21).

[0031] The lifting mechanism (50) lowers the upper plate (52), which will be described later, to press the substrate (301) toward the substrate (302) side (support part (20) side) when joining the substrate (301) and the substrate (302). The lifting mechanism (50) is equipped with a shaft part (51), a driving part (not shown) that drives the shaft part (51), an upper plate (52), and a pressure pin (53). The shaft part (51) is positioned in the center of the upper plate (52) when viewed from above and applies a load (pressure) to the center of the upper plate (52). The shaft part (51) is inserted into the chamber (10) through a penetration part (10h). The shaft portion (51) is a rod-shaped body with a circular cross-section and is formed from an outer diameter and material that does not deform under an applied load or whose deformation is suppressed (e.g., metal, resin, ceramics, etc.). The driving portion drives the shaft portion (51). For example, the driving portion may utilize an air cylinder device, a hydraulic cylinder device, or a ball screw mechanism using an electric rotary motor.

[0032] The upper plate (52) is fixed to the lower end of the shaft portion (51). The upper plate (52) is a circular plate-like body when viewed from above. However, the upper plate (52) is not limited to being circular; for example, it may be square (square shape, rectangular shape), elliptical shape, or oblong shape. Additionally, the upper plate (52) is formed from, for example, metal, resin, ceramics, etc. The upper plate (52) is provided with rigidity so that it does not easily deform when the substrate (301) is pressed against the substrate (302). When attaching the substrate (301) and the substrate (302), the upper plate (52) presses the upper substrate (301) toward the lower substrate (302).

[0033] The upper plate (52) is positioned so that it overlaps with at least the lift pin (21) when viewed from above. With this configuration, when the substrates (301, 302) are overlapped, the substrates (301, 302) can be fitted from above and below by the upper plate (52) and the lift pin (21), and the substrates (301, 302) can be securely overlapped. The upper plate (52) may be in a form that includes a heater (heating part) for heating the substrates (301, 302). In addition, instead of the upper plate (52) being in a form that includes a heater, it may be in a form that includes a heater for heating the inside of the chamber (10).

[0034] A plurality of pressure pins (53) are provided in a state protruding from the lower surface of the upper plate (52). Each of the plurality of pressure pins (53) is supported by an elastic member such as a coil spring and is provided to be immersable with respect to the lower surface of the upper plate (52). When attaching the substrate (301) and the substrate (302), the pressure pins (53) are immersed from the lower surface of the upper plate (52) and press the upper substrate (301) toward the lower substrate (302). Additionally, after attaching the substrate (301) and the substrate (302), the pressure pins (53) can increase the peelability of the upper plate (52) against the substrate (301) by the force protruding from the lower surface of the upper plate (52) by the elastic member.

[0035] The alignment mechanism (60) determines the position of the substrate (301, 302) with respect to the support member (20). The alignment mechanism (60) comprises a plurality of alignment driving members (61) and a plurality of alignment blocks (62). The alignment blocks (62) are used to align (determine the position) the substrate (301, 302) by fitting the substrate (301, 302) from the diameter direction. The plurality of alignment blocks (62) are spaced apart in the circumferential direction around the central axis (Ax) of the support plate (25) on the outer periphery of the support plate (25).

[0036] A plurality of alignment blocks (62) are spaced apart in the circumferential direction around the central axis (Ax), for example, three of them. The number of alignment blocks (62) may be four or more. Each of the plurality of alignment blocks (62) can move in a horizontal direction along the upper surface of the support plate (25) by means of a guide not shown. It is preferable that the alignment blocks (62) be formed of a conductive material to prevent the substrates (301, 302) from becoming charged.

[0037] The alignment drive unit (61) moves each of the plurality of alignment blocks (62) in the diameter direction of the support plate (25). The alignment drive unit (61) has, for example, a driving source of a cylinder device or an electric motor, and a transmission mechanism that transmits the driving force generated from the driving source to each of the alignment blocks (62).

[0038] The alignment mechanism (60) drives the alignment drive unit (61) to advance a plurality of alignment blocks (62) in the diameter direction of the support plate (25), and presses the outer periphery (301s, 302s) of the substrate (301, 302) placed on the support plate (25) in a direction parallel to the upper surface of the support plate (25) to insert the substrate (301, 302). The alignment mechanism (60) drives the alignment drive unit (61) to move the alignment blocks (62) in the diameter direction of the substrate (301, 302), thereby aligning the substrate (301, 302) with respect to the central axis (Ax) of the support unit (20).

[0039] The operation of the alignment mechanism (60) is controlled by the control unit (200). When the alignment block (62) is used, the control unit (200) reads the shape of the substrate (301, 302) obtained from another unit not shown, for example, determines the alignment position for each substrate (301, 302), and then operates the alignment block (62). Furthermore, the alignment mechanism (60) is not limited in its specific configuration in any way as long as it can achieve the required function, and can be appropriately changed to a different configuration.

[0040] FIG. 2 is a drawing showing an imaging unit (71) provided in a substrate overlapping device (100) related to an embodiment. FIG. 3 is a plan view showing an example of the arrangement of the imaging unit (71).

[0041] As shown in FIGS. 1 to 3, the imaging mechanism (70) is equipped with an imaging unit (71) and an illumination (72). The imaging unit (71) can image a portion including the outer periphery (301s, 302s) of the substrate (301, 302). When detecting the horizontal position of each substrate (301, 302), the imaging unit (71) images a portion including the outer periphery (301s, 302s) of each substrate (301, 302) while the substrate (301, 302) is held at a third position (P3) (see FIG. 12, FIG. 19) set at a predetermined height by the lift pin (21). When detecting the horizontal position of the substrate (301), the imaging unit (71) images a portion including the outer periphery (301s) of the substrate (301) while the substrate (301) is positioned at a predetermined position below the spacer (31) using the lift pin (21).

[0042] When detecting the horizontal position of the substrate (302), as shown in FIG. 2, the imaging unit (71) supports the substrate (301) with a spacer (31) and positions the substrate (302) with a lift pin (21) at a predetermined distance below the spacer (31), and then images a portion including the outer periphery (302s) of the substrate (302). Here, the substrate (301) when the imaging unit (71) images the substrate (301) and the substrate (302) when the imaging unit (71) images the substrate (302) are positioned at a third position (P3) at the same height.

[0043] The imaging unit (71) is, for example, a CCD camera. The imaging unit (71) is provided to be positioned above the substrate (301) while the substrate (301) is supported by the spacer (31). In this embodiment, the imaging unit (71) is positioned outside the chamber (10). The imaging unit (71) is supported on the ceiling plate (10b) of the chamber (10) via a bracket not shown. An opening (10s) is formed in the ceiling plate (10b) that penetrates the ceiling plate (10b) vertically. The opening (10s) is provided with a transparent window material (17) made of glass or the like. The imaging unit (71) images a portion of the outer periphery (301s, 302s) of the substrate (301, 302) from the outside of the chamber (10) through the window material (17).

[0044] As shown in FIG. 3, the imaging unit (71) is provided on the outer side of the substrate (301, 302) in the diameter direction when viewed from the vertical direction. In this embodiment, the imaging unit (71) is provided in multiple units spaced apart in the circumferential direction of the substrate (301, 302). For example, three imaging units (71) are provided at equal intervals in the circumferential direction. The three imaging units (71) are arranged at different circumferential positions from the spacer (31) so that their circumferential positions do not overlap with the spacer (31).

[0045] FIG. 4 is a figure showing an example of an image captured by an imaging unit (71).

[0046] As shown in FIG. 2, each imaging unit (71) is positioned with the imaging optical axis (71c) tilted at a predetermined angle (tilt angle (θ)) from the upper and lower direction including the outer periphery (302s) of the substrate (301) or the substrate (302). Each imaging unit (71) is positioned with the substrate (302) supported by the lift pin (21) positioned at a predetermined distance (Z) below the substrate (301) supported by the spacer (31), so as to be able to image a part of the outer periphery (302s) of the substrate (302).

[0047] More specifically, within the allowable tolerance range of the external dimensions of the substrate (301), an imaging unit (71) is provided so that even if the external dimensions of the substrate (301) located above are larger than the external dimensions of the substrate (302) located below, the imaging unit (71) can capture the outer periphery (302s) of the substrate (302) located below. The above spacing (Z) and inclination angle (θ) are set so that, in the processing unit (201) described later, information regarding the outer periphery (301s) of the substrate (301) and information regarding the outer periphery (302s) of the substrate (302) can be separated from the image captured by the imaging unit (71).

[0048] The imaging unit (71) is positioned at an angle from the upper and lower direction so that, when performing position detection of the substrate (302), the substrate (302) supported by the lift pin (21) is positioned below the substrate (301) supported by the spacer (31), and as shown in FIG. 4, both of the outer periphery (301s) of the substrate (301) and the outer periphery (302s) of the substrate (302) can be simultaneously imaged.

[0049] As shown in FIG. 2, each imaging unit (71) is positioned such that the imaging optical axis (71c) is tilted by a predetermined angle of inclination (θ) from the upper and lower directions including the outer periphery (301s) of the substrate (301) or the outer periphery (302s) of the substrate (302). This angle of inclination (θ) is, for example,

[0050] 5°≤θ≤20°

[0051] It is preferable to do so. A more preferable range for the inclination angle (θ) is 8°≤θ≤12°.

[0052] If the inclination angle (θ) falls below the lower limit of the above range, the outer edge (301s) of the substrate (301) and the outer edge (302s) of the substrate (302) may overlap in the image captured by the imaging unit (71). If the inclination angle (θ) exceeds the upper limit of the above range, the imaging unit (71) must be positioned so that it protrudes significantly outward in the diameter direction, which leads to the enlargement of the substrate overlapping device (100).

[0053] In addition, when a substrate (302) supported by a lift pin (21) is positioned below a substrate (301) supported by a spacer (31) and a portion of the outer periphery (302s) of the substrate (302) is captured by an imaging unit (71), the vertical distance (Z) between the substrate (301) and the substrate (302) is, for example,

[0054] 5㎜≤Z≤25㎜

[0055] It is desirable to make it so. A more desirable range of this interval (Z) is, for example,

[0056] 10㎜≤Z≤15㎜

[0057] am.

[0058] The inclination angle (θ) of the imaging optical axis (71c) of the imaging unit (71) is such that when imaging the outer periphery (302s) of the substrate (302) is performed while the substrate (302) supported by the lift pin (21) is positioned below the substrate (301) supported by the spacer (31),

[0059] 0.6 / Z≤sinθ

[0060] It is preferable to provide an imaging unit (71) to satisfy the above. Additionally, if the imaging field diameter of the imaging unit (71) is denoted as D, the imaging unit (71) is configured such that the outer periphery (301s, 302s) of the substrate (301, 302) falls within the range of the imaging field diameter of the imaging unit (71).

[0061] 0.6 / Z≤sinθ≤0.5D / Z

[0062] It is desirable to arrange it to satisfy [the condition]. The imaging unit (71), in particular,

[0063] 1.5 / Z≤sinθ≤2.0 / Z

[0064] It is desirable to arrange it to satisfy [the condition]. In this embodiment, the imaging unit (71),

[0065] sinθ=1.75 / Z

[0066] It is arranged so that... More specifically, in this embodiment, the vertical distance (Z) between the substrate (301) and the substrate (302) is set to 10 mm, and the inclination angle (θ) of the imaging unit (71) is set to 10°.

[0067] Here, in this embodiment, the imaging field of view (D) of the imaging unit (71) is 16 mm in diameter, but it may be in the range of 8 mm to 20 mm. In addition, the imaging unit (71) may have an angle of view (vertical × horizontal) of 8 mm × 8 mm to 20 mm × 20 mm. The imaging unit (71) may have an angle of view (vertical × horizontal) of 16 mm × 16 mm.

[0068] In this way, the imaging unit (71) sets the imaging optical axis (71c) by tilting it at a predetermined angle so that it can simultaneously image a portion including the outer periphery (301s) of the substrate (301) and a portion including the outer periphery (302s) of the substrate (302) from the outer side of the diameter direction of the substrate (301) through the opening (10s). Additionally, as shown in FIG. 4, when a notch (305) is provided on the outer periphery (301s, 302s) of the substrate (301, 302), the imaging unit (71) simultaneously images the notch (305) when imaging the outer periphery (301s, 302s) of the substrate (301, 302).

[0069] As shown in FIGS. 2 and 3, the illumination (72) is positioned near each imaging unit (71). Each illumination (72) illuminates the inside of the chamber (10) through an opening (10s). The illumination (72) is provided on the ceiling plate (10b) of the chamber (10). The illumination (72) is provided in a position that overlaps with the vertical direction including, for example, the outer periphery (301s, 302s) of the substrate (301, 302).

[0070] The control unit (200) shown in FIG. 1 controls the operation of each part in the substrate overlapping device (100). The control unit (200) is equipped with a processing unit (201) that detects the horizontal position of the substrate (301, 302) based on an image captured by each imaging unit (71). The processing unit (201) calculates the center position of the substrate (301, 302) from information regarding the outer periphery (301s, 302s) of the substrate (301, 302) and calculates the amount of deviation relative to a preset reference position.

[0071] The processing unit (201) calculates the center position of the substrate (301, 302) based on the position of the outer periphery (301s, 302s) of the substrate (301, 302) captured by each imaging unit (71). Additionally, the processing unit (201) calculates the positional misalignment in the periphery direction of the substrate (301, 302) from the position of the notch (305) on the outer periphery (301s, 302s) of the substrate (301, 302) captured by each imaging unit (71). The processing unit (201) determines whether the amount of misalignment in the horizontal position and periphery direction of the substrate (301, 302) is within the range of a preset threshold value.

[0072] Additionally, the processing unit (201) may calculate the diameter dimension of the substrate (301, 302) based on information regarding the outer periphery (301s, 302s) of the substrate (301, 302) obtained from images captured by a plurality of imaging units (71). Additionally, the processing unit (201) may obtain information regarding a notch (305) formed on the outer periphery (301s, 302s) of the substrate (301, 302) obtained from images captured by a plurality of imaging units (71), and detect the circumferential position of the substrate (301, 302) in the vertical axis direction including the center of the substrate (301, 302).

[0073] Among the substrate overlapping device (100) described above, a substrate position detection device (110) for detecting the horizontal position of a substrate (301, 302) is configured by means of a holding part (30), a supporting part (20), an imaging part (71), and a processing part (201).

[0074] <Substrate Position Detection Method>

[0075] Next, a substrate position detection method related to the present embodiment will be described. FIG. 5 is a flowchart illustrating an example of a substrate position detection method related to the present embodiment. FIG. 6 is a flowchart illustrating an example of a substrate position detection method related to the present embodiment, following FIG. 5. FIG. 7 is a flowchart illustrating an example of a substrate position detection method related to the present embodiment, following FIG. 6. This substrate position detection method is executed, for example, by instructions from a control unit (200). FIG. 8 to FIG. 23 are process diagrams illustrating an example of the operation of a substrate overlapping device (100). In addition, in these process diagrams, the descriptions are simplified so that the movement of each part is easy to understand. Below, the process will be described following the flowcharts of FIG. 5 to FIG. 7.

[0076] First, the gate valve (12) of the chamber (10) is opened, and the upper substrate (301) is brought in (step S01). As shown in FIG. 8, the control unit (200) drives a driving unit (not shown) to raise the gate valve (12) and open the side opening (11). Then, the substrate (301) (upper substrate) is brought into the chamber (10). At this time, the control unit (200) raises the lift pin (21) to a first position (P1), which is the receiving height of the substrate (301).

[0077] The arm (91) of the conveying device (90) enters the interior of the chamber (10) through the side opening (11) while holding the substrate (301) on the lower side, and places the substrate (301) above the lift pin (21). The arm (91) holds the substrate (301) by suction using an unillustrated suction pad or the like provided on the lower side. After that, the control unit (200) lowers the arm (91) to transfer the substrate (301) from the arm (91) to the lift pin (21) (step S02). The lift pin (21) strikes the substrate (301) from below. After that, the arm (91) is ejected from the chamber (10).

[0078] Next, the substrate (301) is placed on the support plate (25) (step S03). As shown in FIG. 9, the control unit (200) lowers the lift pin (21) supporting the substrate (301) to move the substrate (301) to a second position (P2) and place it on the support plate (25) of the support unit (20). At this time, the lift pin (21) is lowered to a position lower than the support plate (25) (i.e., the lower surface of the substrate (301)) to support the substrate (301) on the support plate (25). Additionally, the substrate (301) may be heated by a heater (not shown) embedded in the support plate (25).

[0079] Next, an alignment operation is performed on the substrate (301) (step S04). As shown in FIG. 10, the control unit (200) drives the alignment drive unit (61) to advance each alignment block (62) toward the inner side in the radial direction, and positions the substrate (301) by fitting the substrate (301) onto the support plate (25) using a plurality of alignment blocks (62). After the alignment operation, the control unit (200) retracts each alignment block (62) toward the outer side in the radial direction.

[0080] Next, the substrate (301) is raised to a third position (P3), which is a predetermined height below the spacer (31) (step S05). As shown in FIG. 11, the control unit (200) raises the lift pin (21) to receive the substrate (301) from the support plate (25). The control unit (200) further raises the lift pin (21) to raise the substrate (301) to a third position (P3), which is a predetermined height.

[0081] Next, an image of the outer periphery (301s) of the substrate (301) is taken (step S06). As shown in FIG. 12, the control unit (200) illuminates the outer periphery (301s) of the substrate (301) through the opening (10s) with each of the plurality of illuminations (72). The control unit (200) takes an image of the outer periphery (301s) of the substrate (301) with each of the plurality of imaging units (71). Each imaging unit (71) outputs the captured image data to the control unit (200).

[0082] Next, the horizontal position of the substrate (301) is detected (step S07). The processing unit (201) of the control unit (200) calculates the center position of the substrate (301) from the position of the outer periphery (301s) at a plurality of positions in the periphery direction of the substrate (301), based on the image of the substrate (301) captured by a plurality of imaging units (71). Additionally, the processing unit (201) calculates the amount of deviation from a preset reference position of the calculated center position of the substrate (301). Furthermore, the processing unit (201) calculates the position deviation in the periphery direction of the substrate (301) from the position of the notch (305) on the outer periphery (301s) of the substrate (301) captured by each imaging unit (71).

[0083] Next, it is determined whether the amount of deviation from the reference position of the substrate (301) is within the range of a threshold value (step S08). The processing unit (201) determines whether the amount of deviation in the horizontal direction and the circumferential direction from the reference position of the center position of the calculated substrate (301) is within the range of a preset threshold value.

[0084] As a result, if the misalignment of the substrate (301) is within the range of the threshold value, the process proceeds to step S11. Meanwhile, if the misalignment of the substrate (301) is outside the range of the threshold value, the control unit (200) returns to step S04 and performs the alignment operation of the substrate (301) again. After performing the alignment operation of the substrate (301) again in step S04, the control unit (200) repeats steps S05 to S08. If, by performing the alignment operation again, the misalignment of the substrate (301) becomes within the range of the threshold value, the process proceeds to step S11.

[0085] Additionally, when returning from step S08 to step S04, the process returns to step S04 to check whether the number of repetitions of the alignment operation of the substrate (301) has reached a predetermined number of times (step S09). As a result, if the amount of misalignment of the substrate (301) is outside the range of the threshold value even after the alignment operation of the substrate (301) in step S04 has been repeated a predetermined number of times, the control unit (200) outputs an alarm to the operator of the substrate overlapping device (100) to indicate the occurrence of an abnormality by outputting an alarm sound, emitting an alarm light, displaying an alarm message, etc. (step S10).

[0086] After detecting the horizontal position of the substrate (301), the substrate (301) is raised to the position of the spacer (31) (step S11). In step S11, the lift pin (21) is raised to raise the substrate (301) to a fourth position (P4) above the spacer (31). Subsequently, the substrate (301) is supported by the spacer (31) of the support part (30) (step S12). As shown in FIG. 13, the control unit (200) raises the lift pin (21) to raise the substrate (301) to a fourth position (P4) above the spacer (31) and supports the substrate (301) from below by the spacer (31) of the support part (30). At this time, the spacer (31) is retracted outward in the radial direction so as not to interfere with the substrate (301) during the raising of the substrate (301). After raising the substrate (301) to the fourth position (P4), the spacer (31) is returned to its original position in the radial direction. Then, by lowering the lift pin (21), the substrate (301) is held by the spacer (31), and the lift pin (21) is lowered from the substrate (301).

[0087] FIG. 14 illustrates an example of the operation of a substrate overlapping device (100A) related to another embodiment, in which an upper substrate (301) is held by an adsorption pad (33) of a holding part (30A). In FIG. 14, the same reference numerals are used for components that are identical to those in the above-described embodiment, and the description is omitted or simplified. As shown in FIG. 14, the substrate overlapping device (100A) is provided with a holding part (30A) instead of the above-described holding part (30). The holding part (30A) is provided with an adsorption pad (33) on the lower side of the upper plate (52). The adsorption pad (33) adsorbs the upper surface of the substrate (301). The adsorption pad (33) adsorbs the upper surface of the substrate (301) supported by the lift pin (21) and receives the substrate (301) from the lift pin (21). The adsorption pad (33) is a so-called vacuum adsorption pad. A plurality of adsorption pads (33) may be provided on the lower side of the upper plate (52). Additionally, the adsorption pads (33) are not limited to vacuum adsorption pads and may be electrostatic adsorption pads or adhesive pads. When using adhesive pads, an adhesive peeling mechanism (not shown) is provided to detach the substrate (301) from the adhesive pad.

[0088] In this substrate overlapping device (100A), in step S12 described above, the substrate (301) is raised by the lift pin (21) until it comes into contact with the suction pad (33). At this time, the suction pad (33) may be lowered while raising the lift pin (21). Subsequently, in step S12 described above, the substrate (301) is adsorbed to the suction pad (33) by suctioning into the suction pad (33). That is, as shown in Figure 13 illustrating step S12 described above, the substrate (301) is held in the suction pad (33) (holding part (30A)).

[0089] Following FIG. 13, the substrate (302) (lower substrate) is brought into the chamber (10) (step S13). As shown in FIG. 15, the control unit (200) lowers the lift pin (21) to a certain height of the substrate (302). Then, the substrate (302) is brought into the chamber (10) by the arm (91) and placed at a first position (P1) above the lift pin (21). The arm (91) holds the substrate (302) by adsorbing it to the lower side.

[0090] Next, the control unit (200) raises the lift pin (21) to transfer the substrate (302) from the arm (91) to the lift pin (21) (step S14). Then, the arm (91) is ejected from the chamber (10). After that, the gate valve (12) is closed, and the inside of the chamber (10) is exhausted by a suction device not shown.

[0091] Next, as shown in FIG. 16, the lift pin (21) is lowered to move the substrate (302) to a second position (P2) and place it on the support member (20). The lift pin (21) is lowered to a position lower than the support plate (25) so that the substrate (302) is supported only by the support plate (25) (step S15). With this configuration, the substrate (302) is not in contact with the lift pin (21) and is supported by the support plate (25). After that, the substrate (302) may be heated by a heater built into the support plate (25).

[0092] Next, an alignment operation is performed on the substrate (302) (step S16). As shown in FIG. 17, the control unit (200) drives the alignment drive unit (61) to advance each alignment block (62) toward the inner side in the radial direction, thereby positioning the substrate (302) by fitting the substrate (302) into the plurality of alignment blocks (62). After the alignment operation, the control unit (200) retracts each alignment block (62) toward the outer side in the radial direction. The alignment operation of step S08 is the same as the alignment operation of step S04. Therefore, the substrate (301) and the substrate (302) are positioned at approximately the same location when viewed from a plane.

[0093] Next, the substrate (302) is raised to a third position (P3), which is a predetermined height below the spacer (31) (step S17). As shown in FIG. 18, the control unit (200) raises the lift pin (21) to receive the substrate (302) from the support plate (25). The control unit (200) further raises the lift pin (21) to raise the substrate (302) to a third position (P3), which is a predetermined height. Here, the third position (P3) where the substrate (302) is raised is the same height as the third position (P3) where the substrate (301) was raised in step S05.

[0094] Next, an image of the outer periphery (302s) of the substrate (302) is taken (step S18). As shown in FIG. 19, the control unit (200) illuminates the outer periphery (302s) of the substrate (302) through the opening (10s) with each of the plurality of illuminations (72). The control unit (200) takes an image of the outer periphery (302s) of the substrate (302) with each of the plurality of imaging units (71). At this time, as shown in FIG. 4, each imaging unit (71) simultaneously takes an image of the outer periphery (302s) of the substrate (302) and the outer periphery (301s) of the substrate (301) located above the substrate (302). Each imaging unit (71) outputs the captured image data to the control unit (200).

[0095] In addition, in the substrate overlapping device (100A) shown in FIG. 14, the outer periphery (302s) of the substrate (302) is captured in step S18 in the same manner as above. FIG. 20 shows an example of the operation of the substrate overlapping device (100A) related to another embodiment, and is a drawing in which the outer periphery (302s) of the lower substrate (302) is captured by the imaging unit (71). As shown in FIG. 20, the upper substrate (301) is held by the suction pad (33) of the holding unit (30A), and the lower substrate (302) is raised to a third position (P3), and the outer periphery (302s) of the substrate (302) is captured by the imaging unit (71).

[0096] Next, the horizontal position of the substrate (302) is detected (step S19). The processing unit (201) of the control unit (200) calculates the center position of the substrate (302) from the position of the outer periphery (302s) at a plurality of positions in the circumferential direction of the substrate (302), based on the image of the substrate (302) captured by a plurality of imaging units (71). At this time, the processing unit (201) separates the information regarding the outer periphery (301s) of the substrate (301) and the information regarding the outer periphery (302s) of the substrate (302) from the image captured by the plurality of imaging units (71).

[0097] The processing unit (201) removes information regarding the outer edge (301s) of the substrate (301) from an image captured by the imaging unit (71) as shown in FIG. 4, and extracts only information regarding the outer edge (302s) of the substrate (302). Specifically, the processing unit (201) identifies the lower edge (302s2) of the outer edge (302s) located at the bottom among the upper edge (301s1) and lower edge (301s2) of the outer edge (301s) of the substrate (301) in the image, and the lower edge (302s2) of the outer edge (302s) of the substrate (302) as the outer edge (302s) of the substrate (302).

[0098] The processing unit (201) calculates the center position of the substrate (302) as the horizontal position of the substrate (302) based solely on information regarding the outer periphery (302s) of the specified substrate (302), and calculates the amount of deviation from a preset reference position of the calculated center position of the substrate (302). Additionally, the processing unit (201) calculates the positional deviation in the periphery direction of the substrate (302) from the position of the notch (305) on the outer periphery (302s) of the substrate (302) captured by each imaging unit (71).

[0099] Next, it is determined whether the amount of deviation from the reference position of the substrate (302) is within the range of a threshold value (step S20). The processing unit (201) determines whether the amount of deviation in the horizontal direction and the circumferential direction from the reference position of the center position of the calculated substrate (302) is within the range of a preset threshold value.

[0100] As a result, if the misalignment of the substrate (302) is within the range of the threshold value, the process proceeds to step S23. Meanwhile, if the misalignment of the substrate (302) is outside the range of the threshold value, the control unit (200) returns to step S16 and performs the alignment operation of the substrate (302) again. After performing the alignment operation of the substrate (302) again in step S16, the control unit (200) repeats steps S17 to S20. If, by performing the alignment operation again, the misalignment of the substrate (302) becomes within the range of the threshold value, the process proceeds to step S23.

[0101] Meanwhile, when returning from step S20 to step S16, it is checked whether the number of repetitions of the alignment operation of the substrate (302) in step S16 has reached a predetermined number of times (step S21). As a result, if the amount of misalignment of the substrate (302) is outside the range of a threshold value even after the alignment operation of the substrate (302) in step S16 has been repeated a predetermined number of times, the control unit (200) outputs an alarm to the operator of the substrate overlapping device (100) to indicate the occurrence of an abnormality by outputting an alarm sound, emitting an alarm light, displaying an alarm message, etc. (step S22).

[0102] After aligning the position of the substrate (302), the control unit (200) raises the substrate (302) to a fifth position (P5) by raising the lift pin (21) as shown in FIG. 21, thereby overlapping the substrate (301) and the substrate (302) (step S23). At this time, the substrate (302) is raised by the lift pin (21) and overlapped with the substrate (301) from below, thereby overlapping the substrate (301) and the substrate (302). In this state, the substrate (301) and the substrate (302) are in contact at a portion. Subsequently, the spacer (31) is retracted to the outer side in the diameter direction of the substrate (301) (step S24). In step S24, the adhesive layer (F) of the substrate (301) and the adhesive layer (F) of the substrate (302) come into contact, thereby joining the substrate (301) and the substrate (302) to form the substrate (300).

[0103] Additionally, when overlapping the substrate (301) and the substrate (302), the upper plate (52) of the support portion (30) is lowered, and the upper surface of the substrate (301) is pressed with the pressure pin (53). The force for bonding the substrate (301) and the substrate (302) is the elastic force of the elastic member that contracts when the pressure pin (53) is embedded in the upper plate (52). In addition, instead of raising the lift pin (21), the upper plate (52) may be lowered, or the upper plate (52) may be lowered while raising the lift pin (21).

[0104] Additionally, in the substrate overlapping device (100A) shown in FIG. 14, in step S23, the substrate (301) and the substrate (302) are joined by raising the lift pin (21) toward the upper substrate (301) held by the adsorption pad (33) and pressing the lower substrate (302) against the substrate (301). The force with which the substrate (301) and the substrate (302) are joined is controlled by the force of the lift pin (21) rising. In addition, instead of raising the lift pin (21), the upper plate (52) may be lowered, or the upper plate (52) may be lowered while raising the lift pin (21).

[0105] Next, the overlapping substrate (300) is lowered (step S25). After joining the substrate (301) and the substrate (302), the control unit (200) lowers the lift pin (21) as shown in FIG. 22 to place the substrate (300), which has finished attaching, at a height for removal. At this time, the spacer (31) is retracted outward in the radial direction so as not to interfere with the substrate (300). Through this process, the substrate (300) is separated from both the support unit (20) and the holding unit (30).

[0106] Next, the gate valve (12) is opened, and the substrate (300) is removed from the chamber (10) (step S26). As shown in FIG. 23, the gate valve (12) is raised to open the side opening (11), and then the arm (91) of the conveying device (90) is moved from the side opening (11) into the interior of the chamber (10) and positioned below the substrate (300) supported by the lift pin (21). After that, the control unit (200) raises the arm (91) and transfers the substrate (300) from the lift pin (21) to the arm (91) by adsorbing and holding the substrate (300) on the upper surface of the arm (91).

[0107] Additionally, the arm (91) may be in a form that holds the substrate (300) by placing it on the upper surface of the arm (91) rather than adsorbing and holding the substrate (300). After that, the arm (91) is withdrawn from the chamber (10), and the substrate (300) is removed from the chamber (10). After that, the control unit (200) closes the gate valve (12) and terminates the series of processes.

[0108] As described above, the substrate overlapping device (100) associated with the present embodiment captures the outer periphery (302s) of a substrate (302) supported at a predetermined distance below the substrate (301) by an imaging unit (71) which is provided above the substrate (301) and also outside in the diameter direction, and has an imaging optical axis positioned at a predetermined angle from the upper and lower direction including the outer periphery (302s) of the substrate (301) or the substrate (302). With this configuration, a portion including the outer periphery (301s) of the substrate (301) and a portion including the outer periphery (302s) of the substrate (302) are captured simultaneously, and information regarding the outer periphery (301s) of the substrate (301) and information regarding the outer periphery (302s) of the substrate (302) can be separated from the captured image. Therefore, it becomes possible to reliably detect the positions of both the substrate (301) and the substrate (302).

[0109] Although embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the embodiments described above. It is clear to those skilled in the art that various modifications or improvements can be added to the embodiments described above. Furthermore, forms with such modifications or improvements added are also included within the technical scope of the present invention. One or more of the requirements described in the embodiments described above may be omitted. Additionally, the requirements described in the embodiments described above may be appropriately combined. Furthermore, the execution order of each operation shown in the embodiments can be realized in any order, provided that the result of the preceding operation is not utilized in the subsequent operation. Moreover, regarding the operations in the embodiments described above, even if terms such as "first," "next," or "following" are used for convenience, it is not mandatory to carry them out in this order.

[0110] In the above-described embodiment, the form in which two substrates (301) and substrate (302) are attached is described as an example, but it is not limited to this form. For example, it may be a form in which another substrate is additionally attached to a substrate (300) to which substrates (301) and substrate (302) are attached.

[0111] Additionally, in the above-described embodiment, when positioning the substrate (301, 302) with the alignment block (62), the substrate (301, 302) is supported by the support plate (25), but the substrate (301, 302) may be positioned by inserting it into the alignment block (62) while remaining in the state supported by the lift pin (21).

[0112] In addition, in the above embodiment, when the substrates (301, 302) overlap, the substrates (301, 302) may be pressed against the holding portion (30) by raising the lift pin (21), or the substrates (301, 302) may be joined by lowering the holding portion (30, 30A) while maintaining the raised position of the lift pin (21).

[0113] In addition, in the above embodiment, the position of the substrate (301, 302) is detected when the substrate (301, 302) overlaps, but the position of the substrate (301, 302) may be detected when the pre-overlapping substrate (301, 302) is attached. Explanation of the symbols

[0114] 10… chamber 10b… ceiling panel 10s… opening 20… support 30, 30A… pussy 60… alignment device 71… Imaging unit 71c… imaging optical axis 100, 100A… Board overlapping device 110… Substrate position detection device 201… Processing Department 301… Substrate (Upper substrate) 301s… Outstanding Performance 302… Substrate (Lower Substrate) 302s… Outstanding Performance 305… Notch Z… fixed interval θ… angle of inclination (specified angle)

Claims

Claim 1 A holding member that holds an upper substrate; a supporting member that supports a lower substrate at a predetermined distance downward from the upper substrate; an imaging member provided above the upper substrate and also on the outer side in the radial direction, wherein the imaging optical axis is positioned at an angle inclined from the vertical direction including the outer periphery of the upper substrate or the lower substrate, and capable of simultaneously imaging a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate without reflecting the imaging optical axis; and a processing member that detects the horizontal position of the lower substrate based on the image captured by the imaging member, wherein the predetermined distance and the predetermined angle satisfy 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sin θ when the predetermined angle is denoted as θ and the predetermined distance as Z, and wherein the processing member is capable of separating information regarding the outer periphery of the upper substrate and information regarding the outer periphery of the lower substrate from the image. A substrate position detection device that is set. Claim 2 A substrate position detection device according to claim 1, wherein the processing unit removes information regarding the outer periphery of the upper substrate from the image and detects the horizontal position of the lower substrate based on information regarding the outer periphery of the lower substrate. Claim 3 In claim 2, the processing unit calculates the center position of the lower substrate from information regarding the outer periphery of the lower substrate and calculates the amount of deviation from a preset reference position, a substrate position detection device. Claim 4 In claim 3, the processing unit determines whether the amount of deviation is within a preset threshold value range or not, a substrate position detection device. Claim 5 A substrate position detection device according to claim 1, wherein the imaging unit captures a portion including the outer periphery of the upper substrate when the upper substrate is held by the holding unit, or when the upper substrate is supported by the support unit before being held by the holding unit, and the processing unit detects the horizontal position of the upper substrate based on the image captured by the imaging unit. Claim 6 A substrate position detection device according to claim 5, wherein the support member supports the upper substrate at the same height as when the lower substrate is imaged by the imaging member, and the imaging member images a portion including the outer periphery of the upper substrate supported by the support member. Claim 7 A substrate position detection device according to claim 1, wherein the imaging unit is provided in multiple units spaced apart along an vertical axis including the center of the upper substrate or the lower substrate. Claim 8 A substrate position detection device according to claim 7, wherein the processing unit calculates the diameter dimension of the lower substrate based on information regarding the outer periphery of the lower substrate obtained from each of the images captured by the plurality of imaging units. Claim 9 A substrate position detection device according to claim 1, comprising a chamber that accommodates the above-mentioned retaining member and the above-mentioned supporting member and has an opening formed in a ceiling plate, wherein the imaging member is disposed outside the chamber and simultaneously images a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate from the outer side in the diameter direction of the upper substrate through the opening. Claim 10 A substrate position detection device according to claim 9, wherein the imaging unit sets the imaging optical axis by tilting it at the predetermined angle in a range in which a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate can be simultaneously imaged from the outer side in the diameter direction of the upper substrate through the opening. Claim 11 A substrate position detection device according to claim 1, wherein the imaging unit images a notch provided on the outer periphery of the lower substrate together with a part of the outer periphery of the lower substrate, and the processing unit acquires information regarding the notch from the image captured by the imaging unit and detects the circumferential position of the lower substrate in the vertical axis direction including the center of the lower substrate. Claim 12 A substrate position detection device comprising: a holding portion for holding an upper substrate; a supporting portion for supporting a lower substrate at a predetermined distance below the upper substrate; an imaging portion provided above the upper substrate and also outside in the diameter direction, wherein the imaging optical axis is positioned toward the outer periphery of the lower substrate without reflecting the imaging optical axis by tilting it at a predetermined angle from the upper / lower direction including the outer periphery of the upper substrate or the lower substrate, and capable of imaging a portion including the outer periphery of the lower substrate; and a processing portion for detecting the horizontal position of the lower substrate based on the image captured by the imaging portion, wherein the predetermined distance and the predetermined angle are set such that, when the predetermined angle is denoted as θ and the predetermined distance as Z, 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sinθ are satisfied. Claim 13 A substrate overlapping device having a substrate position detection device described in any one of claims 1 to 12. Claim 14 A substrate overlapping device according to claim 13, wherein the support member is provided to be vertically movable, and the device comprises an alignment mechanism for adjusting the horizontal position of the lower substrate by inserting the lower substrate in a horizontal direction while the lower substrate is supported by the support member, or while the support member is lowered to support the lower substrate as an alignment support member. Claim 15 A substrate overlapping device comprising: a holding portion for holding an upper substrate; a supporting portion for supporting a lower substrate at a predetermined distance downward from the upper substrate; an imaging portion provided above the upper substrate and also on the outer side in the diameter direction, wherein the imaging optical axis is positioned toward the outer edge of the lower substrate without reflecting the imaging optical axis by tilting it at a predetermined angle from the upper / lower direction including the outer edge of the upper substrate or the lower substrate, thereby enabling imaging of a portion including the outer edge of the lower substrate; and a processing portion for detecting the horizontal position of the lower substrate based on the image captured by the imaging portion, wherein the predetermined distance and the predetermined angle are set such that, when the predetermined angle is denoted as θ and the predetermined distance as Z, 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sinθ are satisfied. Claim 16 A method for detecting a substrate position, comprising: supporting an upper substrate; supporting a lower substrate at a predetermined distance below the upper substrate; tilting an imaging optical axis at a predetermined angle from an upper / lower direction including the outer periphery of the upper substrate or the lower substrate from an upper side and also from the outer side in the diameter direction above the upper substrate, so as to simultaneously image a portion including the outer periphery of the upper substrate and a portion including the outer periphery of the lower substrate without reflecting the imaging optical axis; and detecting the horizontal position of the lower substrate based on the captured image, wherein the predetermined distance and the predetermined angle satisfy 5 mm ≤ Z ≤ 25 mm and 0.6 / Z ≤ sin θ when the predetermined angle is denoted as θ and the predetermined distance as Z, and the information regarding the outer periphery of the upper substrate and the information regarding the outer periphery of the lower substrate are configured to be separable from the image. Claim 17 A substrate position detection method according to claim 16, comprising, before supporting the lower substrate, capturing a portion including the outer periphery of the upper substrate while the upper substrate is supported at a height that supports the lower substrate, and detecting the horizontal position of the upper substrate based on the captured image. Claim 18 A substrate position detection method according to claim 17, comprising calculating an amount of deviation from a preset reference position from a horizontal position of the lower substrate, determining whether the amount of deviation is within a preset threshold value range, and adjusting the horizontal position of the lower substrate when it is determined that the amount of deviation is outside the threshold value range. Claim 19 delete

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