Substrate bonding device and substrate bonding method

Abstract

[Problem] When performing alignment of substrates, damage to the functional surface of the substrate, occurrence of foreign matter, chip scattering, etc. are suppressed, and substrates are bonded together with good quality. [Solution] A substrate bonding device (100) comprises a lower plate (20) on the lower side, a lift pin (41) provided on the lower plate (20) that supports and raises the incoming substrates (S1, S2), a holding part that receives and holds the first incoming substrate (S1) from the lift pin (41), an upper pressing part (30A) disposed above the lower plate (20) and capable of contacting the upper surface of the upper substrate (S1) among the two substrates (S1, S2) to be bonded, and a lower pressing part (30A) provided on the lower plate (20) that contacts the lower outer periphery (F1) of the substrate (S1, S2) when the lift pin (41) descends, thereby bonding the substrates (S1, S2). The apparatus comprises a supporting member (80) and an alignment mechanism (60) for positioning substrates (S1, S2) supported by the supporting member (80) by fitting them in a direction along the surface of the substrates (S1, S2).

Description

Technology Field

[0001] The present invention relates to a substrate bonding device and a substrate bonding method. Background Technology

[0002] A substrate bonding device for bonding multiple substrates in an overlapping state is known. As such a substrate bonding device, a configuration is disclosed in which a first wafer is placed on a second wafer held on a stage, and a pressing force applied from a pressing mechanism is applied to the first wafer, thereby pressurizing and bonding the first wafer and the second wafer (for example, see Patent Document 1). Prior art literature

[0003] Japanese Patent Publication No. 2007-301593 The problem to be solved

[0004] In the substrate bonding device disclosed in Patent Document 1, alignment of the first wafer and the second wafer is performed prior to pressurizing and bonding the first wafer and the second wafer. At this time, alignment is performed by an alignment mechanism while the first wafer and the second wafer are supported from below by a support member. Then, in the case of the first wafer with the functional surface facing downward, if the first wafer is moved for alignment, the support member and the functional surface may rub against each other, leading to damage to the functional surface, the generation of foreign matter, chip scattering, etc.

[0005] The present invention aims to provide a substrate bonding device and a substrate bonding method that enable bonding of substrates with good quality by suppressing damage to the functional surface of the substrate, the occurrence of foreign matter, and chip scattering when aligning the substrates. means of solving the problem

[0006] In a first embodiment of the present invention, a substrate bonding device for bonding two substrates comprises: a lower plate on the lower side; a lift pin provided on the lower plate that supports and raises an incoming substrate; a holding part that receives and holds the first incoming substrate from the lift pin; an upper pressing part disposed above the lower plate and capable of contacting the upper surface side of the upper substrate among the two substrates to be bonded; a support member provided on the lower plate that contacts the lower outer periphery of the upper substrate among the two substrates to be bonded when the lift pin is lowered to support the substrate; and an alignment mechanism that positions the substrate by inserting the substrate supported by the support member in a direction along the surface of the substrate, and positions the substrate by inserting the lower substrate among the two substrates to be bonded in a direction along the surface of the substrate while the lower substrate is supported by the lift pin; wherein the holding part is among the two substrates to be bonded A substrate bonding device is provided, comprising a vacuum suction pad that vacuum suctions the upper surface of the substrate on the upper side.

[0007] In a second aspect of the present invention, a method for bonding two substrates is provided, comprising supporting an introduced substrate by means of a lift pin, transferring the substrate from the lift pin to a support member that contacts the outer periphery of the lower surface of the substrate and supporting the substrate by means of the support member, and positioning the substrate by fitting the substrate supported by the support member in a direction along the surface of the substrate. Effects of the invention

[0008] According to an embodiment of the present invention, when aligning the substrate, contact is not made with the functional surface of the substrate, thereby suppressing damage to the functional surface of the substrate and the occurrence of foreign matter, so that the substrates can be bonded together with good quality. Brief explanation of the drawing

[0009] FIG. 1 is a figure showing an example of a substrate bonding device related to a first embodiment. Figure 2 is a view of the upper substrate seen from below. Figure 3 is a cross-sectional view of the upper substrate. Figure 4 is a top view of the lower plate. Figure 5 is a cross-sectional view taken in the direction of the AA arrow in Figure 4. FIG. 6 is a flowchart illustrating an example of a substrate bonding method related to an embodiment. FIG. 7 is a flowchart illustrating an example of a substrate bonding method related to an embodiment, following FIG. 6. FIG. 8 shows an example of the operation of a substrate bonding device, in which an upper substrate is brought into a chamber and supported by a lift pin. FIG. 9 illustrates an example of the operation of a substrate bonding device, in which an upper substrate is placed on a support member. FIG. 10 shows an example of the operation of a substrate bonding device and is a diagram showing an alignment operation performed on an upper substrate. FIG. 11 shows an example of the operation of a substrate bonding device, in which an upper substrate is held by a holding part (adsorption pad). FIG. 12 shows an example of the operation of a substrate bonding device, in which a substrate on the lower side is brought into the chamber and supported by a lift pin. FIG. 13 illustrates an example of the operation of a substrate bonding device, and shows a bending-inhibiting bake treatment being performed on a substrate on the lower side. FIG. 14 shows an example of the operation of a substrate bonding device, in which a lower substrate is supported by a lower plate. FIG. 15 shows an example of the operation of a substrate bonding device and is a diagram showing an alignment operation performed on a substrate on the lower side. FIG. 16 shows an example of the operation of a substrate bonding device, in which an upper substrate and a lower substrate are bonded by raising a lift pin. FIG. 17 illustrates an example of the operation of a substrate bonding device, wherein the lift pin is lowered after releasing the holding by the holding member to lower the bonded upper substrate and lower substrate. FIG. 18 shows an example of the operation of a substrate bonding device, and is a diagram showing the bonded upper substrate and lower substrate being transferred from the lift pin to the arm. FIG. 19 is a figure showing an example of a substrate bonding device related to a second embodiment. FIG. 20 is a flowchart illustrating another example of a substrate bonding method related to an embodiment. FIG. 21 is a flowchart illustrating another example of a substrate bonding method related to an embodiment, following FIG. 7. FIG. 22 shows an example of the operation of a substrate bonding device, in which an upper substrate is brought into a chamber and supported by a lift pin. FIG. 23 illustrates an example of the operation of a substrate bonding device, in which an upper substrate is placed on a support member. FIG. 24 shows an example of the operation of a substrate bonding device and is a diagram showing an alignment operation performed on an upper substrate. FIG. 25 shows an example of the operation of a substrate bonding device, in which an upper substrate is held by a holding part (spacer). FIG. 26 illustrates an example of the operation of a substrate bonding device, in which a substrate on the lower side is brought into the chamber and supported by a lift pin. FIG. 27 illustrates an example of the operation of a substrate bonding device, and shows a bending suppression bake treatment being performed on a lower substrate. FIG. 28 shows an example of the operation of a substrate bonding device, in which a lower substrate is supported by a lower plate. FIG. 29 illustrates an example of the operation of a substrate bonding device and shows an alignment operation performed on a substrate on the lower side. FIG. 30 illustrates an example of the operation of a substrate bonding device, wherein the upper substrate and the lower substrate are bonded by lowering the upper pressing part and pressing the upper substrate with a pusher pin. FIG. 31 shows an example of the operation of a substrate bonding device, and is a diagram in which a spacer is retracted. FIG. 32 shows an example of the operation of a substrate bonding device, and is a diagram in which the bonded upper substrate and lower substrate are lowered by lowering the lift pin. FIG. 33 shows an example of the operation of a substrate bonding device, and is a diagram showing the bonded upper substrate and lower substrate being transferred from the lift pin to the arm. Specific details for implementing the invention

[0010] Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the description below. Furthermore, in the drawings, parts may be omitted to make the embodiments easier to understand. Additionally, the scale may be appropriately changed to make parts larger or emphasized, and the size and shape may differ from the actual product. In each of the drawings below, the directions within the drawings are explained using an XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, a plane parallel to the horizontal plane is called the XY plane. In this XY plane, the direction parallel to the transport direction of the substrate (S1) and the substrate (S2) is called the X direction, and the direction orthogonal to the X direction is called the Y direction. Additionally, the direction perpendicular to the XY plane is indicated as the Z direction (height direction). Each of the X direction, Y direction, and Z direction is explained by stating that the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

[0011] [First Embodiment]

[0012] <Substrate bonding device>

[0013] A substrate bonding device (100) related to the first embodiment will be described. FIG. 1 is a diagram showing an example of a substrate bonding device (100) related to the first embodiment. The substrate bonding device (100) bonds a substrate (S1) having an adhesive layer (F) and a substrate (S2) having an adhesive layer (F) by bringing their adhesive layers (F) into contact with each other. Furthermore, the adhesive layer (F) is not limited to being formed on both the substrate (S1) and the substrate (S2), but may be formed on either one of the substrates (S1) or the substrate (S2). The adhesive layer (F) is formed by applying and drying it on the substrate (S1) and the substrate (S2) by, for example, a coating device, before being introduced into the substrate bonding device (100). In addition, this coating device may be provided in the substrate bonding device (100).

[0014] In this embodiment, among the two substrates attached, the upper substrate is referred to as substrate (S1) and the lower substrate is referred to as substrate (S2). The substrate (S1) and the substrate (S2) are, for example, glass substrates, semiconductor substrates, resin substrates, etc. In this embodiment, for example, the upper substrate (S1) is a glass substrate and the lower substrate (S2) is a silicon substrate. In addition, the form in which the substrate (S1) and the substrate (S2) are attached is referred to as substrate (S) (see FIG. 18). Both substrate (S1) and the substrate (S2) are circular substrates that are circular in shape when viewed from a flat plane (viewed from the Z direction), but they are not limited to circular substrates and may be rectangular substrates that are square (square, rectangular), elliptical, or oblong substrates when viewed from a flat plane.

[0015] FIG. 2 is a view of the upper substrate (S1) from below. FIG. 3 is a cross-sectional view of the upper substrate (S1). As shown in FIG. 2 and FIG. 3, the lower substrate (S1) has an outer circumference (F1) and an inner circumference (F2) formed on the lower surface facing downward when brought into the chamber (10). The inner circumference (F2) is formed on the inner circumference side of the lower surface of the substrate (S1). The outer circumference (F1) is formed on the outer circumference side of the inner circumference (F2). The outer circumference (F1) is formed in an annular region that continues along the outer circumference of the lower surface of the substrate (S1) when viewed from below. When the functional area (Af) of the substrate (S1) faces downward, the functional area (Af) is formed in the inner circumference (F2). When a device such as a semiconductor chip is mounted on the lower surface of a substrate (S1) by means of an adhesive, the area where the device is mounted forms a functional area (Af). When an adhesive layer (F) is formed on the substrate (S1), this adhesive layer (F) forms a functional area (Af).

[0016] As shown in FIG. 1, the substrate bonding device (100) comprises a chamber (10), a lower plate (20), an upper pressing part (30A), a lift part (40), an axis part (51), an alignment mechanism (60), and a control part (C). The control part (C) controls the operation of each part in the substrate bonding device (100).

[0017] In the substrate bonding device (100), in order to bond substrates (S1, S2), first, the substrate (S1) is brought into the chamber (10), positioned using an alignment mechanism (60), then the substrate (S1) is raised using a lift part (40) and held by an adsorption pad (32), which is a holding part provided in the upper pressing part (30A). Additionally, the adsorption pad (32) will be described later. After that, the substrate (S2) is brought into the chamber (10), positioned using an alignment mechanism (60), then the substrate (S2) is raised using a lift part (40) and bonded with the substrate (S1) held by the adsorption pad (32). When the substrate (S1) is brought into the chamber (10), the substrate (S1) is transported with the functional area (Af) facing downward (-Z direction). Additionally, when a substrate (S2) is introduced into the chamber (10), the substrate (S2) is introduced with the adhesive layer (F) facing upward (+Z direction).

[0018] The chamber (10) is placed on a base (15) of a substrate bonding device (100). The chamber (10) is formed in a box shape having a side wall (10a) rising upward from the outer periphery of the base (15) and a ceiling plate (10b) covering the upper part of the side wall (10a). The chamber (10) accommodates a lower plate (20), an upper pressing part (30A), a lift part (40), a part of an axis part (51), and an alignment mechanism (60). The chamber (10) is formed in a box shape and has an opening (11) in a part of the side wall (10a). The opening (11) is formed on the -X side surface of the chamber (10) and connects the inside and outside of the chamber (10). The opening (11) is formed with dimensions that allow a substrate (S1, S2) held in a conveying device (90) (see FIG. 8), and further a substrate (S) to which both are attached, to pass through.

[0019] Substrates (S1, S2) are each brought into the chamber (10) through the opening (11) by means of the arm (91) of the conveying device (90). Additionally, substrates (S) are removed from the chamber (10) through the opening (11). In this embodiment, the conveying device (90) is equipped with two flat arms (91), and when bringing substrate (S1) into the chamber (10), it holds the substrate (S1) by adsorbing it from the upper side of the substrate (S1), and when bringing in substrate (S2) and removing substrates (S) from the chamber (10), it holds the substrates (S2, S) by adsorbing them from the lower side of the substrates (S2, S). Additionally, when transporting the substrate (S2,S), the arm (91) may be in a form that holds the substrate (S2,S) by placing it on the upper surface of the arm (91) without adsorbing it. Also, the arm (91) is not limited to two, but may have three or more.

[0020] The chamber (10) is equipped with a gate valve (12) that opens and closes an opening (11). The gate valve (12) is positioned on the outer side of the -X side of the chamber (10) and can slide, for example, in the up and down direction (Z direction) by means of a driving part not shown. The gate valve (12) opens and closes the opening (11) by sliding. Furthermore, even when the opening (11) is closed by the gate valve (12), the chamber (10) remains open to the atmosphere. Additionally, by closing the opening (11), the inside of the chamber (10) may be sealed, thereby creating a vacuum atmosphere inside the chamber (10). Furthermore, a through-hole (10h) through which a shaft part (51), described later, passes is provided on the upper surface of the chamber (10). The shaft part (51) is inserted into the through-hole (10h). Additionally, the shaft part (51) may be provided to be vertically movable.

[0021] Additionally, the substrate bonding device (100) may be optionally equipped with a chamber (10) and may be in a form without a chamber (atmosphere open type). When the chamber (10) is to be in a vacuum atmosphere, the chamber (10) is connected to a suction device not shown. By suctioning (exhausting) the chamber (10) with this suction device, the chamber (10) can be made into a vacuum atmosphere. Additionally, the chamber (10) may be equipped with a valve that can be opened to the outside to open the internal vacuum atmosphere. Furthermore, the chamber (10) may be connected to a gas supply device not shown. By supplying a predetermined gas into the chamber (10) from this gas supply device, the chamber (10) can be made into a predetermined gas atmosphere. As the predetermined gas, for example, a gas that is inert to the thin film formed on the substrate (S1, S2), such as nitrogen gas, or dry air, is used.

[0022] The lower plate (20) supports the substrates (S1, S2) introduced into the chamber (10) from below. The lower plate (20) is circular in shape when viewed from above, but is not limited to this shape; for example, it may be rectangular (square, rectangular), elliptical, or oblong. The lower plate (20) is set with an outer diameter larger than that of the substrates (S1, S2).

[0023] The lower plate (20) has a support plate (21), a heater (heating part) (22), and a base plate (23). The support plate (21), the heater (22), and the base plate (23) are stacked in this order from the lower side (-Z side). The lower plate (20) is supported by a plurality of support columns (24) provided on the lower side of the support plate (21). The space between the support plate (21) and the heater (22), and the space between the heater (22) and the base plate (23) are fixed by fastening members, such as bolts. The support plate (21), the heater (22), and the base plate (23) have a plurality of through holes provided in the vertical direction to pass through the lift pin (41) of the lift part (40) described later. Additionally, whether or not a heater (heating part) (22) is provided is optional, and the lower plate (20) may be in a form that does not have a heater (heating part) (22).

[0024] The support plate (21) is a plate-shaped body formed from a material such as metal, resin, or ceramics. The heater (22) is an example of a heating part and is, for example, a hot plate having a heating mechanism (heat source) such as an electric heating wire inside. The substrates (S1, S2) are heated by the heater (22) through the base plate (23). Additionally, the heater (22) may be a laminated structure formed by inserting a sheet-shaped heat source. The substrates (S1, S2) and the substrate (S) are arranged on the upper surface (23f), which is the +Z side of the base plate (23). The base plate (23) is a plate-shaped body formed from ceramics, for example, but may be formed from metal, resin, etc. The upper surface (23f) of the base plate (23) may be a surface that contacts the substrate (S2). Therefore, it is desirable that the upper surface (23f) has high flatness and also has low surface roughness (or is mirror-like).

[0025] Support columns (24) are provided in plurality on the lower surface of the support plate (21). The plurality of support columns (24) are used to support the lower plate (20) on the base (15) of the chamber (10). In addition, the number and arrangement of the support columns (24) are not limited to the above-described form, and any configuration capable of supporting the lower plate (20) is applied.

[0026] As shown in FIG. 1, the upper pressing part (30A) presses the upper substrate (S1) toward the substrate (S2) side (lower plate (20) side) when attaching the substrate (S1) and the substrate (S2). The upper pressing part (30A) is provided with a base (31) provided at the lower part of the shaft part (51) and an adsorption pad (support part) (32) provided on the lower side of the base (31). The base (31) and the adsorption pad (32) are, for example, circular in shape when viewed from above, but are not limited to this shape; for example, they may be rectangular (square, rectangular), elliptical, or oblong shapes. The base (31) and the adsorption pad (32) are set with an outer diameter dimension smaller than that of the substrates (S1, S2). Additionally, the outer diameter dimensions of the base (31) and the adsorption pad (32) can be set arbitrarily.

[0027] The upper pressing part (30A) is provided at the bottom of the shaft part (51) and is fixed in position in the vertical direction. However, if the shaft part (51) is capable of vertical movement, the upper pressing part (30A) may be in a form that moves vertically together with the shaft part (51). The suction pad (32) has its lower surface as the suction surface (32a) and can hold the substrate (S1) by suctioning the upper surface of the substrate (S1) that has been raised and supported by the lift pin (41). The suction pad (32) is fixed to the base (31) by, for example, a fastening member such as a bolt. The configuration of the suction pad (32) is arbitrary, and, for example, a vacuum suction pad, an electrostatic suction pad, etc. are used. In addition, the upper pressing part (30A) may be in a form that is equipped with a heater (heating part). In addition, instead of the upper pressing part (30A) being equipped with a heater, it may be in a form where a heater is provided to heat the inside of the chamber (10).

[0028] The lift unit (40) is provided below the lower plate (20). The lift unit (40) supports the substrate (S1, S2, S) above the lower plate (20) and raises and lowers the substrate (S1, S2, S). The lift unit (40) lowers the supported substrate (S1, S2) and places it on the lower plate (20) in order to align each of the substrates (S1, S2) brought into the chamber (10) with the alignment mechanism (60). The lift unit (40) raises the supported substrate (S1) in order to hold the substrate (S1) aligned with the alignment mechanism (60) on the adsorption pad (32). The lift unit (40) raises the substrate (S2) in order to bond the substrate (S2) aligned with the alignment mechanism (60) to the substrate (S1).

[0029] The lift unit (40) has a plurality of lift pins (41), a moving unit (42) connected to the lower end of the lift pins (41) and moving up and down in the Z direction, and a lift pin driving unit (43) for moving the moving unit (42). The plurality of lift pins (41) are arranged in the center of the lower plate (20). The plurality of lift pins (41) support the substrates (S1, S2) by coming into contact with the center of the substrates (S1, S2) from below. When the functional area (Af) of the substrate (S1) is facing downward, the lift pins (41) come into contact with the functional area (Af) to support the substrate (S1). Additionally, after the substrates (S1, S2) are placed on the lower plate (20), the upper end of the lift pins (41) becomes non-contact with the substrates (S1, S2).

[0030] FIG. 4 is a top view of the lower plate (20). As shown in FIG. 4, the lift pins (41) are positioned by passing through each of the multiple through holes provided in the lower plate (20). The upper heights of the multiple lift pins (41) are uniformly equal or nearly equal. The lift pins (41) may be formed from a non-conductive material (e.g., resin, metal, ceramics, etc.).

[0031] The moving part (42) moves up and down by driving the lift pin drive part (43). A plurality of lift pins (41) move up and down simultaneously in conjunction with the moving part (42). The lift pin drive part (43) may utilize, for example, an electric rotary motor, a linear motor, an air cylinder device, a hydraulic cylinder device, etc., and the driving force is transmitted to the moving part (42) by a transmission mechanism not shown.

[0032] The alignment mechanism (60) determines the position of the substrates (S1, S2) with respect to the lower plate (20). As shown in FIGS. 1 and 4, the alignment mechanism (60) comprises a plurality of alignment driving units (61) and a plurality of alignment blocks (62). The alignment blocks (62) are used to align (determine the position) the substrates (S1, S2) by fitting them in the diameter direction. The plurality of alignment blocks (62) are spaced apart in the circumferential direction around the central axis (AX) of the lower plate (20) on the outer periphery of the base plate (23) of the lower plate (20). For example, five of the plurality of alignment blocks (62) are spaced apart in the circumferential direction around the central axis (AX). Each of the plurality of alignment blocks (62) can be moved along the surface of the substrate (S1, S2) by means of a guide not shown. It is preferable that the alignment blocks (62) be formed of a conductive material to prevent the substrate (S1, S2) from becoming charged.

[0033] The alignment drive unit (61) moves each of the plurality of alignment blocks (62) in the diameter direction of the base plate (23). The alignment drive unit (61) has, for example, a driving source of a cylinder device or an electric motor, and a transmission mechanism that transmits the driving force generated from the driving source to each of the alignment blocks (62).

[0034] The alignment mechanism (60) drives the alignment drive unit (61) to advance the alignment block (62) in the diameter direction of the base plate (23) and presses the outer periphery of the substrates (S1, S2) in a direction parallel to the upper surface (23f) of the base plate (23) to insert the substrates (S1, S2). The alignment mechanism (60) drives the alignment drive unit (61) to move the alignment block (62) back and forth in the diameter direction of the base plate (23), thereby positioning the substrates (S1, S2) relative to the lower plate (20) and the upper pressing unit (30A).

[0035] The operation of the alignment mechanism (60) is controlled by the control unit (C). When the alignment block (62) is used, the control unit (C) reads the shape of the substrate (S1, S2) acquired by, for example, another unit not shown, determines the alignment position for each substrate (S1, S2), and then operates the alignment block (62). Furthermore, as long as the alignment mechanism (60) can achieve the required function, its specific configuration is not limited in any way and can be appropriately changed to a different configuration. For example, among the five alignment mechanisms (60) provided in FIG. 4, the upper two alignment mechanisms (60) may be fixed, and the lower three alignment mechanisms (60) may be configured to be movable and capable of moving back and forth. In this case, the three movable alignment mechanisms (60) drive the alignment drive unit (61) to advance the alignment block (62) and perform alignment by pressing the outer periphery of the substrate (S1, S2) toward the direction of the two fixed alignment mechanisms (60). Additionally, among the plurality of alignment blocks (62) in the alignment mechanism (60), the number of movable ones or fixed ones can be appropriately set.

[0036] FIG. 5 is a cross-sectional view taken in the direction of the arrow AA in FIG. 4. As shown in FIG. 4 and FIG. 5, the lower plate (20) is provided with a support member (80). The support member (80) supports the lower outer periphery (F1) of the substrate (S1) from below when the position of the substrate (S1) is determined by the alignment mechanism (60). As shown in FIG. 5, when the substrate (S1) with the functional area (Af) facing downward is received from the lift pin (41), a plurality of pins (81) contact the lower outer periphery (F1) which is outside the functional area (Af) and support the substrate (S1). The support member (80) is provided on the base plate (23) of the lower plate (20).

[0037] The support member (80) supports the substrate (S1) by contacting the lower outer periphery (F1) of the substrate (S1) when the lift pin (41) supporting the substrate (S1, S2) descends. The support member (80) is provided at three or more locations spaced apart in the circumferential direction of the lower plate (20). For example, the support member (80) is provided at four locations spaced apart in the circumferential direction of the lower plate (20). The support member (80) is, for example, a pin (81) protruding from the upper surface of the lower plate (20). By contacting the pin (81) with the lower outer periphery (F1) of the substrate (S1, S2), the substrate (S1, S2) can be stably supported with a simple configuration.

[0038] The tip of the pin (81) is hemispherical in shape, with the outer diameter gradually decreasing upward. Since the tip of the pin (81) is hemispherical, the tip of the pin (81) and the lower outer periphery (F1) of the substrate (S1) can be brought into contact by point contact. Therefore, when moving the substrate (S1) along the surface of the substrate (S1) for positioning purposes, friction between the substrate (S1) and the tip of the pin (81) can be suppressed to a small extent. Furthermore, since the tip of the pin (81) is in contact with the lower outer periphery (F1), there is no damage to the functional area (Af), and furthermore, the occurrence of chip scattering can be avoided. Additionally, the shape of the tip of the pin (81) is not limited to a hemispherical shape and may be of an appropriately different shape.

[0039] As shown in FIG. 4, each of the plurality of alignment blocks (62) is arranged in a state offset in the circumferential direction of the lower plate (20) with respect to the plurality of pins (81). With this configuration, when positioning the substrates (S1, S2) with the alignment mechanism (60), when moving the plurality of alignment blocks (62) in a direction along the surface of the substrates (S1, S2) to insert the substrates (S1, S2), interference between the alignment blocks (62) and the pins (81) can be suppressed.

[0040] <Substrate Bonding Method>

[0041] Next, a substrate bonding method related to the present embodiment will be described. FIG. 6 is a flowchart illustrating an example of a substrate bonding method related to the present embodiment. FIG. 7 is a flowchart illustrating an example of a substrate bonding method related to the present embodiment, following FIG. 6. This substrate bonding method is executed, for example, by instructions from a control unit (C). FIG. 8 to FIG. 18 are process diagrams illustrating an example of the operation of a substrate bonding device (100). Furthermore, in these process diagrams, the descriptions are simplified so that the movement of each part is easy to understand. The following will be explained following the flowcharts of FIG. 6 and FIG. 7.

[0042] First, the gate valve (12) of the chamber (10) is opened, and a substrate is brought in (step S01). As shown in FIG. 8, the control unit (C) drives a driving unit (not shown) to raise the gate valve (12) and open the opening (11). Then, the substrate (S1) (upper substrate) is brought into the chamber (10). At this time, the control unit (C) raises the lift pin (41) to the receiving height of the substrate (S1).

[0043] The arm (91) of the conveying device (90) enters the interior of the chamber (10) from the opening (11) while holding the substrate (S1) on the lower side, and places the substrate (S1) above the lift pin (41). The arm (91) holds the substrate (S1) by suction using an unillustrated suction pad or the like provided on the lower side. After that, the control unit (C) lowers the arm (91) to transfer the substrate (S1) from the arm (91) to the lift pin (41) (step S02). The lift pin (41) strikes the center of the lower inner circumference (F2) of the substrate (S1) from below. After that, the arm (91) is withdrawn from the chamber (10). In addition, when the substrate (S1) is provided with an adhesive layer (F), the adhesive layer (F) is positioned downward when the substrate (S1) is introduced into the chamber (10).

[0044] Next, the control unit (C) lowers the lift pin (41) supporting the substrate (S1) as shown in FIG. 9, and places the substrate (S1) on a plurality of support members (80) (pin (81)) of the lower plate (20) (step S03). At this time, the lift pin (41) is lowered to a position lower than the plurality of support members (80) (i.e., the lower surface of the substrate (S1)) so that the substrate (S1) is supported by the plurality of support members (80). With this configuration, the substrate (S1) is not in contact with the lift pin (41) and is supported only by the plurality of support members (80) that contact the lower outer periphery (F1) from below. Additionally, the substrate (S1) may be heated by the heater (22).

[0045] Next, an alignment operation is performed on the substrate (S1) (step S04). As shown in FIG. 10, the control unit (C) drives the alignment drive unit (61) to advance each alignment block (62) toward the inner side in the radial direction, thereby positioning the substrate (S1) by fitting the substrate into the plurality of alignment blocks (62). At this time, the substrate (S1) is supported at the outer periphery (F1) of the lower surface by a plurality of support members (80). Therefore, when positioning the substrate (S1) with the plurality of alignment blocks (62), if the substrate (S1) is moved within the plane along the lower surface of the substrate (S1), friction occurs only between the plurality of support members (80) and the outer periphery (F1) of the lower surface of the substrate (S1). After the alignment operation, the control unit (C) moves each alignment block (62) outward in the radial direction and then raises the lift pin (41) to position the substrate (S1) above the alignment block (62).

[0046] Next, the substrate (S1) is held by the suction pad (32) (step S05). As shown in FIG. 11, the control unit (C) raises the lift pin (41) to receive the substrate (S1) from the support member (80), and raises the substrate (S1) to make contact with the suction surface (32a) of the suction pad (32) of the upper pressing part (30A). When the substrate (S1) makes contact, the control unit (C) drives the suction pad (32) to a state where it can be suctioned in advance. As a result, the substrate (S1) is held by the suction pad (32). After that, by lowering the lift pin (41), the lift pin (41) is separated from the substrate (S1).

[0047] Next, the substrate (S2) (lower substrate) is brought into the chamber (10) (step S06). As shown in FIG. 12, the control unit (C) lowers the lift pin (41) to a height of the substrate (S2). Then, the substrate (S2) is brought into the chamber (10) by the arm (91) and positioned above the lift pin (41). The arm (91) holds the substrate (S2) by adsorbing it to the lower side. Then, the control unit (C) lowers the arm (91) to transfer the substrate (S2) from the arm (91) to the lift pin (41). Then, the arm (91) is withdrawn from the chamber (10). Additionally, when the substrate (S2) is brought into the chamber (10), the adhesive layer (F) is positioned on the upper side.

[0048] Next, the gate valve (12) is closed, and a warping suppression bake treatment is performed to suppress warping of the substrate (S2) (step S07). As shown in FIG. 13, after closing the gate valve (12), the substrate (S2) is heated by, for example, a heater (22) to perform the warping suppression bake treatment. By baking the substrate (S2), the shape of the substrate (S2) is stabilized, and warping of the substrate (S2) can be suppressed. This warping suppression bake treatment is performed by maintaining the temperature inside the chamber (10) at, for example, 150°C to 250°C. Furthermore, steps S02 through S07 described above are performed with the inside of the chamber (10) open to the atmosphere, even though the gate valve (12) is closed. However, for example, steps S03, S04, S07, etc., may be performed with the inside of the chamber (10) in a vacuum atmosphere.

[0049] Next, as shown in FIG. 14, the lift pin (41) is lowered to place the substrate (S2) on the lower plate (20). The lift pin (41) is lowered to a position lower than the plurality of support members (80) so that the substrate (S2) is supported only by the plurality of support members (80). With this configuration, the substrate (S2) is not in contact with the lift pin (41) and is supported by the plurality of support members (80) that contact the lower outer periphery (F1) from below. After that, the substrate (S2) is heated by the heater (22), and a warping suppression bake treatment may be performed in an open state, or a warping suppression bake treatment may be performed in a vacuum state inside the chamber (10). This warping suppression bake treatment is performed by setting the temperature of the heater (22) to, for example, 150°C to 250°C.

[0050] Next, an alignment operation is performed on the substrate (S2) (step S08). As shown in FIG. 15, the control unit (C) drives the alignment drive unit (61) to advance each alignment block (62) toward the inner side in the radial direction, thereby positioning the substrate (S2) by fitting the substrate (S2) into the plurality of alignment blocks (62). At this time, the substrate (S2) is supported at the outer periphery (F1) of the lower surface by a plurality of support members (80). Therefore, in order to position the substrate (S2) with the plurality of alignment blocks (62), if the substrate (S2) is moved within the plane along the lower surface of the substrate (S2), a friction occurs only between the plurality of support members (80) and the outer periphery (F1) of the lower surface of the substrate (S2). The alignment operation of step S08 is the same as the alignment operation of step S04. Therefore, substrate (S1) and substrate (S2) are located at approximately the same position when viewed from a plane.

[0051] Next, the control unit (C) raises the substrate (S2) by raising the lift pin (41) as shown in FIG. 16, thereby joining the substrate (S1) and the substrate (S2) (step S09). At this time, the adsorption pad (32) of the upper pressing unit (30A) presses the upper surface side of the substrate (S1), and the substrate (S2) is raised by the lift pin (41) and overlapped with the substrate (S1), thereby joining the substrate (S1) and the substrate (S2). That is, the adsorption pad (32) functions as a holding unit that holds the substrate (S1), and also has the function of pressing the upper surface of the substrate (S1) by coming into contact with it. In step S09, the substrate (S1) and the substrate (S2) are joined by the adhesive layer (F) of the substrate (S1) and the adhesive layer (F) of the substrate (S2) coming into contact. Additionally, the force with which the substrate (S1) and the substrate (S2) are joined is controlled by the force of the lift pin (41) rising. Also, instead of raising the lift pin (41), the upper pressing part (30A) holding the substrate (S1) may be lowered, or the lift pin (41) may be raised and the upper pressing part (30A) may be lowered.

[0052] Next, the adsorption of the adsorption pad (32) onto the substrate (S1) is released (step S10). The control unit (C) releases the adsorption of the substrate (S1) by the adsorption pad (32) after bonding the substrate (S1) and the substrate (S2). Next, as shown in FIG. 17, the lift pin (41) is lowered to place the substrate (S), which has finished bonding, at a height for ejection. Through this process, the substrate (S) is separated from both the lower plate (20) and the upper pressing part (30A). Next, the gate valve (12) is opened and the substrate (S) is ejected from the chamber (10) (step S11). As shown in FIG. 18, after opening the opening (11) by raising the gate valve (12), the arm (91) of the conveying device (90) is moved from the opening (11) into the interior of the chamber (10) and the arm (91) is positioned below the substrate (S) supported by the lift pin (41). Then, the control unit (C) raises the arm (91) and transfers the substrate (S) from the lift pin (41) to the arm (91) by adsorbing and holding the substrate (S) on the upper surface of the arm (91). Alternatively, the arm (91) may be in a form where it does not adsorb and hold the substrate (S) but rather places and holds the substrate (S) on the upper surface of the arm (91). After that, the arm (91) is withdrawn from the chamber (10), and the substrate (S) is removed from the chamber (10). After that, the control unit (C) closes the gate valve (12) and terminates the series of processes.

[0053] [Second Embodiment]

[0054] <Substrate bonding device>

[0055] A substrate bonding device (200) related to the second embodiment will be described. FIG. 19 is a diagram showing an example of a substrate bonding device (200) related to the second embodiment. In addition, in each figure after FIG. 19, the same reference numerals are used for components identical to those in the first embodiment described above, and their descriptions are omitted or simplified. The substrate bonding device (200) bonds a substrate (S1) having an adhesive layer (F) and a substrate (S2) having an adhesive layer (F) by bringing their adhesive layers (F) into contact with each other. As shown in FIG. 19, the substrate bonding device (200) is equipped with a chamber (10), a lower plate (20), an upper pressing part (30B), a lift part (40), a lifting mechanism (50), an alignment mechanism (60), a spacer mechanism (70), and a control part (C). The control unit (C) controls the operation of each part in the substrate bonding device (200) in an overall manner.

[0056] In the substrate bonding device (200), in order to bond substrates (S1, S2), first, the substrate (S1) is brought into the chamber (10), positioned using the alignment mechanism (60), then the substrate (S1) is raised using the lift part (40) and held by the spacer mechanism (70). After that, the substrate (S2) is brought into the chamber (10), positioned using the alignment mechanism (60), then the substrate (S2) is raised using the lift part (40) and bonded with the substrate (S1) held by the spacer mechanism (70). The chamber (10) accommodates the lower plate (20), the upper pressing part (30B), the lift part (40), a part of the lifting mechanism (50), the alignment mechanism (60), and the spacer mechanism (70).

[0057] In the through-hole (10h) on the upper surface of the chamber (10), an axial member (51) is inserted in a manner that allows for vertical movement, and the chamber (10) is maintained in a sealed state by a seal member not shown. The chamber (10) can be sealed by closing the opening (11) with a gate valve (12). The chamber (10) can be made into a vacuum atmosphere by sucking (exhausting) the chamber (10) with a suction device not shown. Additionally, the chamber (10) may be equipped with a valve that can be opened to the outside to open the internal vacuum atmosphere. Furthermore, the chamber (10) may be connected to a gas supply device not shown. Additionally, the substrate bonding device (200) may be optional in whether or not it has a chamber (10), and may be in a form that does not have a chamber (10) (atmosphere open type).

[0058] The lower plate (20), support plate (21), heater (22), base plate (23), and support column (24) are omitted from description as they are the same as those in the first embodiment described above.

[0059] As shown in FIG. 19, the upper pressing part (30B) presses the upper substrate (S1) toward the substrate (S2) side (lower plate (20) side) when attaching the substrate (S1) and the substrate (S2). The upper pressing part (30B) is provided with a base (31) and a plurality of pusher pins (33) provided on the lower side of the base (31). The plurality of pusher pins (33) are provided to extend downward from the base (31) at a distance from each other. Each of the plurality of pusher pins (33) has a pin (33a) at its lower end that can be pushed upward by an elastic member not shown. The upper pressing part (30B) is provided at the lower end of the shaft part (51) and its position is fixed in the vertical direction. However, if the shaft portion (51) is capable of moving up and down, the upper pressing portion (30B) may be in a form that moves up and down integrally with the shaft portion (51).

[0060] The lift unit (40) lowers the supported substrates (S1, S2) and places them on the lower plate (20) in order to align each of the substrates (S1, S2) brought into the chamber (10) with the alignment mechanism (60). The lift unit (40) raises the supported substrate (S1) in order to hold the substrate (S1) aligned with the alignment mechanism (60) on the spacer (72). The lift unit (40) raises the substrate (S2) in order to bond the substrate (S2) aligned with the alignment mechanism (60) to the substrate (S1). Additionally, the lift pin (41), the moving unit (42), the lift pin driving unit (43), and the alignment mechanism (60) are omitted from the description as they are the same as those in the first embodiment described above.

[0061] The lifting mechanism (50) lowers the upper pressing part (30B) to press the substrate (S1) toward the substrate (S2) side (lower plate (20) side) when bonding the substrate (S1) and the substrate (S2). The lifting mechanism (50) is equipped with the above-mentioned shaft part (51) and a driving part (52) that drives the shaft part (51). The shaft part (51) is positioned in the center of the base (31) when viewed from above. The driving part (52) raises the shaft part (51). For example, the driving part (52) may use an air cylinder device, a hydraulic cylinder device, a ball screw mechanism using an electric rotary motor, etc.

[0062] The driving unit (52) is controlled by the control unit (C). The load applied to the shaft unit (51) by the driving unit (52) and the driving timing for applying the load are collectively controlled by the control unit (C) based on a preset program, etc. Additionally, some or all of the operation of the driving unit (52) may be performed by operation by an operator. By raising and lowering the shaft unit (51) by the driving unit (52), the upper pressing unit (30B) is raised and lowered as a single unit with the shaft unit (51).

[0063] As shown in FIG. 19, the spacer mechanism (70) first receives and supports the substrate (S1) that has been brought in from the lift pin (41). The spacer mechanism (70) is equipped with a plurality of spacer driving units (71) and a plurality of spacers (holding units) (72). The spacer driving units (71) are provided within the chamber (10). The spacer driving units (71) move the spacers (72) in the X direction or the Y direction. The spacer driving units (71) have, for example, a driving source of a cylinder device or an electric motor, and a transmission mechanism that transmits the driving force generated from the driving source to the spacers (72).

[0064] The spacer (72) can move in a diameter direction centered on the central axis (AX) within a plane orthogonal to the Z direction by means of a guide not shown. It is preferable that the spacer (72) be formed of a conductive material to prevent the substrates (S1, S2) from becoming charged. The spacer mechanism (70) supports the substrate (S1) placed on the lift pin (41) by driving the spacer drive unit (71) to advance the spacer (72) and position it below the outer periphery of the substrate (S1). The operation of the spacer mechanism (70) is controlled by the control unit (C).

[0065] <Substrate Bonding Method>

[0066] Next, a substrate bonding method related to the present embodiment will be described. FIG. 20 is a flowchart illustrating another example of a substrate bonding method related to the present embodiment. FIG. 21 is a flowchart illustrating another example of a substrate bonding method related to the present embodiment, following FIG. 20. This substrate bonding method is executed, for example, by instructions from a control unit (C). FIG. 22 to FIG. 33 are process diagrams illustrating an example of the operation of a substrate bonding device (200). In addition, in these process diagrams, the descriptions are simplified so that the movement of each part is easy to understand. Below, the process will be described following the flowcharts of FIG. 20 and FIG. 21.

[0067] First, the gate valve (12) of the chamber (10) is opened, and a substrate is brought in (step S101). As shown in FIG. 22, the control unit (C) raises the gate valve (12) to open the opening (11). Next, the arm (91) of the conveying device (90) brings the substrate (S1) from the opening (11) into the interior of the chamber (10) and transfers it to the lift pin (41) (step S102). Next, as shown in FIG. 23, the control unit (C) lowers the lift pin (41) to place the substrate (S1) on a plurality of support members (80) (pin (81)) of the lower plate (20) (step S103). Additionally, the substrate (S1) may be heated by the heater (22).

[0068] Next, the control unit (C) performs an alignment operation on the substrate (S1) as shown in FIG. 24 (step S104). Since step S104 is the same as step S04 shown in FIG. 6, the description is omitted. After the alignment operation, the control unit (C) retracts each alignment block (62) outward in the radial direction and then raises the lift pin (41) to position the substrate (S1) above the spacer (72). Then, the substrate (S1) is supported by the spacer (72) (step S105). As shown in FIG. 25, the control unit (C) raises the lift pin (41) to receive the substrate (S1) from the support member (80), and after raising the substrate (S1), drives the spacer drive unit (71) to advance the spacer (72) and places the spacer (72) on the lower side of the substrate (S1). Then, by lowering the lift pin (41), the substrate (S1) is held by the spacer (72).

[0069] Next, the substrate (S2) is brought into the chamber (10) (step S106). As shown in FIG. 26, the lift pin (41) is lowered to a height of the substrate (S2), and then the substrate (S2) is transferred from the arm (91) to the lift pin (41) by the arm (91). Next, the gate valve (12) is closed, and a warping suppression bake treatment is performed to suppress warping of the substrate (S2) (step S107). As shown in FIG. 27, after closing the gate valve (12), the inside of the chamber (10) is exhausted by, for example, a suction device not shown, and the substrate (S2) is heated by a heater (22) to perform the warping suppression bake treatment. Additionally, the warping suppression bake treatment can be performed with the gate valve (12) open (i.e., in an open state).

[0070] Next, the inside of the chamber (10) is made into a vacuum atmosphere (step S108). The inside of the chamber (10) is made into a vacuum atmosphere by exhausting the inside of the chamber (10) by a suction device not shown. Then, as shown in FIG. 28, the lift pin (41) is lowered to place the substrate (S2) on the lower plate (20). Then, the substrate (S2) is heated by the heater (22), and a warping suppression bake treatment may be performed under a vacuum atmosphere or a warping suppression bake treatment may be performed in an open state. Next, the control unit (C) performs an alignment operation on the substrate (S2) as shown in FIG. 29 (step S109). Step S109 is the same as step S08 shown in FIG. 7, so the description is omitted. The alignment operation of step S109 is the same as the alignment operation of step S104.

[0071] Next, the control unit (C) raises the substrate (S2) by raising the lift pin (41) so that the substrate (S2) is brought close to the lower surface of the spacer (72) (step S110). The upper surface of the substrate (S2) may be separated from the lower surface of the spacer (72) or may be in contact with the lower surface of the spacer (72). In this state, the spacer (72) is fitted between the substrate (S1) and the substrate (S2). Additionally, the substrate (S1) and the substrate (S2) may be in contact in the part where the spacer (72) is not present. Next, the control unit (C) drives the driving unit (52) as shown in FIG. 30 to lower the upper pressing unit (30B) together with the shaft unit (51), and presses the substrate (S1) against the substrate (S2) with the pusher pin (33) of the upper pressing unit (30B) to overlap the substrate (S1) and the substrate (S2) (step S111).

[0072] In step S111, the pin (33a) provided at the bottom of the pusher pin (33) is pushed into the pusher pin (33) while resisting the elastic force of the elastic member. With this configuration, the substrate (S1) can be pressed against the substrate (S2) in a balanced manner by a plurality of pusher pins (33).

[0073] Next, the control unit (C) retracts the spacer (72) back to its original position as shown in FIG. 31 (step S112). As the spacer (72) is retracted, the part that was holding the spacer (72) is removed, and the substrate (S1) is pressed by the pusher pin (33), thereby joining the substrate (S1) and the substrate (S2). Next, as shown in FIG. 32, the lift pin (41) is lowered to place the substrate (S), which has finished joining, at a height for ejection. Through this process, the substrate (S) is separated from both the lower plate (20) and the upper pressing part (30B). After that, the chamber (10) is opened to the atmosphere by opening a valve (not shown), or the chamber (10) is purged by supplying a predetermined gas into the chamber (10) (step S113). As the specified gas, for example, nitrogen gas, dry air, etc. are used.

[0074] Next, as shown in FIG. 33, the gate valve (12) is opened and the substrate (S) is removed from the chamber (10) (step S114). After opening the opening (11), the substrate (S) is removed by the arm (91) of the transport device (90). Then, the control unit (C) closes the gate valve (12) and terminates the series of processes.

[0075] As described above, in the substrate bonding device (100, 200) related to the embodiment, the support member (80) supports the substrate (S1) by contacting the outer periphery (F1) of the lower surface of the substrate (S1, S2), so that when positioning the substrate (S1), the support member (80) can be suppressed from rubbing against the inner periphery (F2) of the lower surface of the substrate (S1). Accordingly, according to the substrate bonding device (100, 200) related to the embodiment, when performing alignment, damage to the functional surface of the substrate (S1), occurrence of foreign matter, chip scattering, etc., can be suppressed, and the substrates (S1, S2) can be bonded together with good quality.

[0076] Although embodiments and variations have been described above, the present invention is not limited to the descriptions above, and various modifications are possible within the scope of not departing from the gist of the present invention. In the above embodiments, a form in which two substrates (S1) and substrate (S2) are attached is described as an example, but the invention is not limited to this form. For example, another substrate may be attached to a substrate (S) to which substrates (S1) and substrate (S2) are attached.

[0077] In the above-described embodiment, when positioning the substrate (S2) with the alignment block (62), the substrate (S2) is supported by a plurality of support members (80), but in the case of the substrate (S2), the substrate (S2) may be positioned by inserting it into the alignment block (62) while remaining in a state supported by the lift pin (41).

[0078] In addition, to the extent permitted by law, the contents of all literature cited in Japanese Patent Application No. 2022-052820 and the embodiments described above shall be incorporated as part of the description in this text. Explanation of the symbols

[0079] 10… chamber 20… lower plate 23f… top surface 30A, 30B… upper pressing part 32… Suction pad (vagina) 33… Pusher pin 41… Lift pin 50… Elevator equipment 60… alignment device 62… Alignment Block 72… Spacer (vagina) 80… Lack of support 81… pin 100, 200… Substrate bonding device Af… function area F1… means outsourcing S… board

Claims

Claim 1 A substrate bonding device for bonding two substrates comprises: a lower plate on the lower side; a lift pin provided on the lower plate that supports and raises an incoming substrate; a holding part that receives and holds the first incoming substrate from the lift pin; an upper pressing part disposed above the lower plate and capable of contacting the upper surface side of the upper substrate among the two substrates to be bonded; a support member provided on the lower plate that supports the substrate by contacting the lower outer periphery of the upper substrate among the two substrates to be bonded when the lift pin is lowered; and an alignment mechanism that positions the substrate by inserting the substrate supported by the support member in a direction along the surface of the substrate, and positions the substrate by inserting the lower substrate among the two substrates to be bonded in a direction along the surface of the substrate while the lower substrate is supported by the lift pin; wherein the holding part is the bonding A substrate bonding device having a vacuum suction pad that vacuum suctions the upper surface of the upper substrate among the two substrates. Claim 2 A substrate bonding device according to claim 1, wherein the support member is provided at three or more locations spaced apart in the circumferential direction of the lower plate and is a pin protruding from the upper surface of the lower plate. Claim 3 In claim 2, the alignment mechanism comprises a plurality of alignment blocks capable of advancing and retracting along the surface of the substrate to insert the substrate, and each of the plurality of alignment blocks is arranged in a state offset in the circumferential direction of the lower plate with respect to the pin, a substrate bonding device. Claim 4 A substrate bonding device according to any one of claims 1 to 3, wherein the lift pin supports the substrate by contacting the functional area when the functional area of ​​the substrate is facing downward, and the support member supports the substrate by contacting the outer periphery of the lower surface, which is outer than the functional area, among the substrates received from the lift pin. Claim 5 A substrate bonding device according to any one of claims 1 to 3, wherein the upper pressing part is vertically movable and has a lifting mechanism for raising and lowering the upper pressing part. Claim 6 A substrate bonding device according to any one of claims 1 to 3, wherein one or both of the lower plate and the upper pressing part are equipped with a heating part for heating the substrate. Claim 7 A substrate bonding device according to any one of claims 1 to 3, comprising a chamber that accommodates the lower plate and the upper pressing part. Claim 8 In claim 2, the tip of the pin is a hemispherical substrate bonding device. Claim 9 A method for bonding two substrates, comprising: supporting the introduced substrate by means of a lift pin; receiving the first introduced substrate from the lift pin and holding it in a holding member; transferring the upper substrate among the two substrates to be bonded from the lift pin to a support member that contacts the outer periphery of the lower surface of the substrate, thereby supporting the upper substrate among the two substrates to be bonded by means of the support member; positioning the substrate by inserting the substrate supported by the support member in a direction along the surface of the substrate; and later introducing the lower substrate among the two substrates to be bonded, and positioning the substrate by inserting it in a direction along the surface of the substrate while the substrate is supported by the lift pin, wherein the holding member is a vacuum suction pad that vacuum suctions the upper surface of the upper substrate among the two substrates to be bonded.

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