Display device

Abstract

A display device according to one embodiment of the present invention comprises: a lower substrate that is stretchable and includes a display area and a non-display area; a first adhesive layer disposed on the lower substrate; a pattern layer disposed on the first adhesive layer and including a plurality of first plate patterns and a plurality of first wiring patterns that overlap the display area; a plurality of subpixels disposed on the upper portion of each of the plurality of first plate patterns; a plurality of connecting wires disposed on the upper portion of each of the plurality of first wiring patterns; and a filling layer comprising a first filling layer that fills the display area and covers the pattern layer, the plurality of subpixels, and the plurality of connecting wires. The plurality of first wiring patterns includes a groove disposed in a lower portion, so that the first adhesive layer and the plurality of first wiring patterns are spaced apart from each other. Accordingly, the plurality of first wiring patterns and the plurality of connecting wires are separated from the first adhesive layer and configured to float within the filling layer, so that the plurality of first wiring patterns and the plurality of connecting wires can be easily stretched without interfering with other components, and the stretchability reliability can also be improved.

Description

Technology Field

[0001] The present invention relates to a display device, and more specifically, to a stretchable display device that improves the stretching reliability of a stretched wire. Background Technology

[0002] Display devices used in computer monitors, TVs, mobile phones, etc., include Organic Light Emitting Displays (OLEDs) that emit light on their own, and Liquid Crystal Displays (LCDs) that require a separate light source.

[0003] The application range of display devices is expanding to include not only computer monitors and TVs but also personal portable devices, and research is underway on display devices that have a large display area while possessing reduced volume and weight.

[0004] In addition, recently, display devices manufactured by forming display parts, wiring, etc. on a flexible substrate such as plastic, which is a flexible material, and being able to be stretched in a specific direction and changed into various shapes are attracting attention as next-generation display devices. The problem to be solved

[0005] The problem that the present invention aims to solve is to provide a display device with improved elongation reliability of the wiring section.

[0006] Another problem that the present invention aims to solve is to provide a display device that reduces stress in the wiring portion during stretching.

[0007] Another problem that the present invention aims to solve is to provide a display device that minimizes interference applied to the wiring when stretched by wrapping the wiring with a liquid material.

[0008] Another problem that the present invention aims to solve is to provide a display device that improves the deformation section of the wiring section by designing the wiring section with various structures.

[0009] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0010] A display device according to one embodiment of the present invention comprises: a lower substrate that is stretchable and includes a display area and a non-display area; a first adhesive layer disposed on the lower substrate; a pattern layer disposed on the first adhesive layer and including a plurality of first plate patterns and a plurality of first wiring patterns that overlap the display area; a plurality of subpixels disposed on the upper portion of each of the plurality of first plate patterns; a plurality of connecting wires disposed on the upper portion of each of the plurality of first wiring patterns; and a filling layer comprising a first filling layer that fills the display area and covers the pattern layer, the plurality of subpixels, and the plurality of connecting wires. The plurality of first wiring patterns includes a groove disposed in a lower portion, so that the first adhesive layer and the plurality of first wiring patterns are spaced apart from each other. Accordingly, the plurality of first wiring patterns and the plurality of connecting wires are separated from the first adhesive layer and configured to float within the filling layer, so that the plurality of first wiring patterns and the plurality of connecting wires can be easily stretched without interfering with other components, and the stretchability reliability can also be improved.

[0011] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0012] The present invention can improve the elongation reliability of the wiring by floating the wiring within a liquid material.

[0013] The present invention can improve the elongation rate while reducing stress on the wiring by minimizing interference applied to the wiring.

[0014] The present invention can improve the stretchability of a display device by designing the wiring section with various structures to increase the length of the deformed portion relative to the total length of the wiring section.

[0015] The effects according to the present invention are not limited to those exemplified above, and a wider variety of effects are included within the present invention. Brief explanation of the drawing

[0016] FIG. 1 is a plan view of a display device according to one embodiment of the present invention. FIG. 2 is an enlarged plan view of the display area of ​​a display device according to one embodiment of the present invention. Figure 3 is a cross-sectional view along III-III' of Figure 2. Figure 4 is a cross-sectional view according to IVIV' of Figure 2. FIG. 5 is a cross-sectional view according to ⅤⅤ' of FIG. 2. FIGS. 6a to 6d are process diagrams for explaining a method of manufacturing a display device according to an embodiment of the present invention. FIGS. 7a to 7c are process diagrams for explaining a method of manufacturing a display device according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a display device according to one embodiment of the present invention. FIGS. 9 to 12 are enlarged plan views of a display device according to various embodiments of the present invention. FIGS. 13a and FIGS. 13b are drawings showing the deformation section of the wiring section when the display device is stretched according to the comparative example and the embodiment. Specific details for implementing the invention

[0017] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms, and these embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention.

[0018] Shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the depicted details. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if it is determined that a detailed description of related prior art may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in the present invention, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0019] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0020] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0021] When an element or layer is referred to as "on" another element or layer, it includes cases where another layer or element is placed directly on top of or in between.

[0022] Additionally, terms such as first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention.

[0023] Throughout the specification, the same reference numerals refer to the same components.

[0024] The area and thickness of each component shown in the drawings are illustrated for convenience of explanation, and the present invention is not necessarily limited to the area and thickness of the illustrated components.

[0025] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0026] The present invention will be described below with reference to the drawings.

[0027] FIG. 1 is a plan view of a display device according to an embodiment of the present invention. FIG. 2 is an enlarged plan view of a display area of ​​a display device according to an embodiment of the present invention. FIG. 3 is a cross-sectional view along III-III' of FIG. 2. FIG. 4 is a cross-sectional view along IVIV' of FIG. 2. FIG. 5 is a cross-sectional view along VV' of FIG. 2.

[0028] First, a display device (100) according to one embodiment of the present invention is a display device capable of displaying images even when bent or stretched, and may also be referred to as a stretchable display device, an elastic display device, or a stretchable display device. The display device (100) not only has high flexibility compared to conventional general display devices, but can also have stretchability. Accordingly, a user can bend or stretch the display device (100), and the shape of the display device (100) can be freely changed according to the user's operation. For example, if a user grabs and pulls the end of the display device (100), the display device (100) can be stretched in the direction in which the user pulls. Alternatively, if a user places the display device (100) on an uneven outer surface, the display device (100) can be placed to bend along the shape of the outer surface. In addition, when the force applied by the user is removed, the display device (100) can be restored to its original shape.

[0029] Referring to FIGS. 1 to 3 together, the lower substrate (111) is a substrate for supporting and protecting various components of a display device (100). The lower substrate (111) can support a pattern layer (120) on which a pixel (PX), a gate driver (GD), and a power supply (PS) are formed.

[0030] And the upper substrate (112) is a substrate for covering and protecting various components of the display device (100). The upper substrate (112) can cover the pixel (PX), gate driver (GD), and power supply (PS).

[0031] Each of the lower substrate (111) and the upper substrate (112) may be composed of an insulating material that can be bent or stretched as a flexible substrate. For example, each of the lower substrate (111) and the upper substrate (112) may be made of silicone rubber such as polydimethylsiloxane (PDMS), or an elastomer such as polyurethane (PU) and PTFE (polytetrafluoroethylene), and thus may have flexible properties. The materials of the lower substrate (111) and the upper substrate (112) may be the same, but are not limited thereto and may be varied in many ways.

[0032] Each of the lower substrate (111) and the upper substrate (112) is a flexible substrate and can be reversibly expanded and contracted. Accordingly, the lower substrate (111) may also be referred to as a lower stretchable substrate, a lower elastic substrate, a lower elongated substrate, a lower flexible substrate, a lower flexible substrate, a first stretchable substrate, a first elastic substrate, a first elongated substrate, a first flexible substrate, or a first flexible substrate, and the upper substrate (112) may also be referred to as an upper stretchable substrate, an upper elastic substrate, an upper elongated substrate, an upper flexible substrate, an upper flexible substrate, a second stretchable substrate, a second elastic substrate, a second elongated substrate, a second flexible substrate, or a second flexible substrate.

[0033] The modulus of elasticity of the lower substrate (111) and the upper substrate (112) may be several MPa to several hundred MPa. In addition, the ductile breaking rate of the lower substrate (111) and the upper substrate (112) may be 100% or more. Here, the ductile breaking rate refers to the elongation rate at the point when the elongated object is broken or cracked. The thickness of the lower substrate (111) may be 10 µm to 1 mm, but is not limited thereto.

[0034] The lower substrate (111) includes a display area (AA) and a non-display area (NA) surrounding the display area (AA). However, the display area (AA) and the non-display area (NA) are not limited to the lower substrate (111) but may be referred to throughout the display device (100).

[0035] A display area (AA) is an area in a display device (100) where an image is displayed, and a plurality of pixels (PX) are arranged in the display area (AA). Each pixel (PX) may include a display element and various driving elements for driving the display element. The various driving elements may refer to at least one thin film transistor (TFT) and a capacitor, but are not limited thereto. Each of the plurality of pixels (PX) may be driven by being connected to various wiring. For example, each of the plurality of pixels (PX) may be connected to various wiring such as gate wiring, data wiring, high potential voltage wiring, low potential voltage wiring, reference voltage wiring, and initialization voltage wiring.

[0036] The non-display area (NA) is an area where an image is not displayed. The non-display area (NA) may be positioned adjacent to the display area (AA). For example, the non-display area (NA) may be an area surrounding the display area (AA). However, it is not limited thereto, and the non-display area (NA) corresponds to an area of ​​the lower substrate (111) excluding the display area (AA), and this may be modified and separated into various shapes. Components for driving a plurality of pixels (PX) placed in the display area (AA), such as a gate driver (GD) and a power supply (PS), may be positioned in the non-display area (NA). Additionally, a plurality of pads connected to the gate driver (GD) and the data driver (DD) may be positioned in the non-display area (NA), and each pad may be connected to a plurality of pixels (PX) of the display area (AA).

[0037] A pattern layer (120) is disposed on a lower substrate (111). The pattern layer (120) includes a plurality of first plate patterns (121) and a plurality of first line patterns (122) disposed in a display area (AA), and a plurality of second plate patterns (123) and a plurality of second line patterns (124) disposed in a non-display area (NA).

[0038] A plurality of first plate patterns (121) are placed in the display area (AA) of the lower substrate (111), and a plurality of second plate patterns (123) are placed in the non-display area (NA) of the lower substrate (111). A plurality of pixels (PX) are formed on the plurality of first plate patterns (121), and a gate driver (GD) and a power supply (PS) may be formed on the plurality of second plate patterns (123).

[0039] A plurality of first plate patterns (121) and a plurality of second plate patterns (123) may be arranged in an island shape spaced apart from each other. Each of the plurality of first plate patterns (121) and the plurality of second plate patterns (123) may be separated individually. Accordingly, the plurality of first plate patterns (121) and the plurality of second plate patterns (123) may be referred to as a first island pattern and a second island pattern, or a first individual pattern and a second individual pattern, etc.

[0040] Referring to FIG. 1, the size of each of the plurality of second plate patterns (123) may be larger than the size of each of the plurality of first plate patterns (121). A stage of a gate driver (GD) may be placed in each of the plurality of second plate patterns (123). Accordingly, since the area occupied by the various circuit configurations constituting a stage of the gate driver (GD) is relatively larger than the area occupied by a single pixel (PX), the size of each of the plurality of second plate patterns (123) may be larger than the size of each of the plurality of first plate patterns (121).

[0041] Meanwhile, in FIG. 1, a plurality of second plate patterns (123) are shown placed in non-display areas (NA) on both sides of the display area (AA) in the first direction (X), but this is exemplary, and the plurality of second plate patterns (123) may be placed in any area of ​​the non-display area (NA). In addition, although the plurality of first plate patterns (121) and the plurality of second plate patterns (123) are shown in a rectangular shape, they are not limited thereto, and the plurality of first plate patterns (121) and the plurality of second plate patterns (123) can be modified into various shapes.

[0042] Referring to FIGS. 1 and 2, a plurality of first wiring patterns (122) of the pattern layer (120) are placed in a display area (AA). The plurality of first wiring patterns (122) are patterns that connect adjacent first plate patterns (121) and may also be referred to as internal connection patterns. That is, a plurality of first wiring patterns (122) may be placed between a plurality of first plate patterns (121).

[0043] A plurality of second wiring patterns (124) of the pattern layer (120) are placed in a non-display area (NA). The plurality of second wiring patterns (124) are patterns that connect adjacent first plate patterns (121) and second plate patterns (123), or connect adjacent second plate patterns (123), and may also be referred to as external connection patterns. The plurality of second wiring patterns (124) may be placed between adjacent first plate patterns (121) and second plate patterns (123) and between adjacent second plate patterns (123).

[0044] A plurality of first wiring patterns (122) and a plurality of second wiring patterns (124) have a curved shape. For example, a plurality of first wiring patterns (122) and a plurality of second wiring patterns (124) may have a sinusoidal shape. However, the shape of the plurality of first wiring patterns (122) and a plurality of second wiring patterns (124) is not limited thereto, and for example, a plurality of first wiring patterns (122) and a plurality of second wiring patterns (124) may extend in a zigzag shape. Alternatively, the shape of the plurality of first wiring patterns (122) and a plurality of second wiring patterns (124) may have various shapes, such as a shape in which a plurality of rhombus-shaped substrates are connected at vertices and extended, or a shape in which semicircle and quarter-circle-shaped substrates are connected to each other. Additionally, the number and shape of the plurality of first wiring patterns (122) and the plurality of second wiring patterns (124) shown in FIG. 1 are exemplary, and the number and shape of the plurality of first wiring patterns (122) and the plurality of second wiring patterns (124) may be varied according to the design.

[0045] Meanwhile, the plurality of first plate patterns (121), the plurality of first wiring patterns (122), the plurality of second plate patterns (123), and the plurality of second wiring patterns (124) are rigid patterns. That is, the plurality of first plate patterns (121), the plurality of first wiring patterns (122), the plurality of second plate patterns (123), and the plurality of second wiring patterns (124) may have rigid characteristics compared to the lower substrate (111) and the upper substrate (112).

[0046] A plurality of first plate patterns (121), a plurality of first wiring patterns (122), a plurality of second plate patterns (123), and a plurality of second wiring patterns (124), which are rigid substrates, may be made of a plastic material having lower flexibility than the lower substrate (111) and the upper substrate (112). For example, a plurality of first plate patterns (121), a plurality of first wiring patterns (122), a plurality of second plate patterns (123), and a plurality of second wiring patterns (124) may be made of at least one material among polyimide (PI), polyacrylate, and polyacetate. In this case, when the plurality of first plate patterns (121), the plurality of first wiring patterns (122), the plurality of second plate patterns (123), and the plurality of second wiring patterns (124) are made of the same material, the plurality of first plate patterns (121), the plurality of first wiring patterns (122), the plurality of second plate patterns (123), and the plurality of second wiring patterns (124) may be integral. However, the plurality of first plate patterns (121), the plurality of first wiring patterns (122), the plurality of second plate patterns (123), and the plurality of second wiring patterns (124) may be made of different materials and are not limited thereto.

[0047] The modulus of elasticity of the plurality of first plate patterns (121), plurality of first wiring patterns (122), plurality of second plate patterns (123), and plurality of second wiring patterns (124) may be higher than the modulus of elasticity of the lower substrate (111). The modulus of elasticity is a parameter representing the ratio of deformation to stress applied to the substrate, and if the modulus of elasticity is relatively high, the hardness may be relatively high. Accordingly, each of the plurality of first plate patterns (121), plurality of first wiring patterns (122), plurality of second plate patterns (123), and plurality of second wiring patterns (124) may be referred to as a plurality of first rigidity patterns, a plurality of second rigidity patterns, a plurality of third rigidity patterns, and a plurality of fourth rigidity patterns. The elastic modulus of the plurality of first plate patterns (121), plurality of first wiring patterns (122), plurality of second plate patterns (123) and plurality of second wiring patterns (124) may be 1000 times higher than the elastic modulus of the lower substrate (111) and the upper substrate (112), but is not limited thereto.

[0048] Meanwhile, in some embodiments, the lower substrate (111) may be defined as including a plurality of first lower patterns and a plurality of second lower patterns. The plurality of first lower patterns may be areas that overlap with a plurality of first plate patterns (121) and a plurality of second plate patterns (123) among the lower substrate (111). The second lower pattern may be the remaining areas that do not overlap with a plurality of first plate patterns (121) and a plurality of second plate patterns (123).

[0049] Additionally, the upper substrate (112) may be defined as including a plurality of first upper patterns and a plurality of second upper patterns. The plurality of first upper patterns may be areas that overlap with a plurality of first plate patterns (121) and a plurality of second plate patterns (123) among the upper substrate (112), and the second upper pattern may be the remaining areas that do not overlap with a plurality of first plate patterns (121) and a plurality of second plate patterns (123).

[0050] At this time, the elastic modulus of the plurality of first lower patterns and first upper patterns may be greater than the elastic modulus of the second lower pattern and second upper pattern. For example, the plurality of first lower patterns and first upper patterns may be made of the same material as the plurality of first plate patterns (121) and the plurality of second plate patterns (123), and the second lower pattern and second upper pattern may be made of a material having a lower elastic modulus than the plurality of first plate patterns (121) and the plurality of second plate patterns (123).

[0051] For example, the first lower pattern and the first upper pattern may be made of polyimide (PI), polyacrylate, or polyacetate, and the second lower pattern and the second upper pattern may be made of silicone rubber such as polydimethylsiloxane (PDMS), polyurethane (PU), or elastomer such as PTFE (polytetrafluoroethylene).

[0052] A gate driver (GD) may be mounted on a plurality of second plate patterns (123). The gate driver (GD) may be formed on the plurality of second plate patterns (123) using a Gate In Panel (GIP) method when manufacturing various components on the plurality of first plate patterns (121). Accordingly, various circuit configurations constituting the gate driver (GD), such as transistors, capacitors, and wiring, may be arranged on the plurality of second plate patterns (123). A single stage, which is a circuit including transistors, capacitors, etc., and constituting the gate driver (GD), may be arranged on the upper part of each of the plurality of second plate patterns (123). However, the gate driver (GD) may be mounted using a Chip on Film (COF) method, but is not limited thereto.

[0053] A power supply (PS) is disposed on a plurality of second plate patterns (123). The power supply (PS) may be formed on the second plate pattern (123) adjacent to the gate driver (GD). The power supply (PS) may be formed on the second plate pattern (123) as a plurality of power blocks that are patterned during the manufacture of various components on the first plate pattern (121). The power supply (PS) may be electrically connected to the gate driver (GD) in the non-display area (NA) and a plurality of pixels (PX) in the display area (AA) to supply a driving voltage. Specifically, the power supply (PS) may be electrically connected to the gate driver (GD) formed on the second plate pattern (123) and a plurality of pixels (PX) formed on the first plate pattern (121) through the second wiring pattern (124) and the first wiring pattern (122). For example, the power supply (PS) may supply a gate driving voltage and a clock signal to the gate driver (GD). And the power supply (PS) can supply power voltage to each of the multiple pixels (PX).

[0054] A printed circuit board (PCB) is connected to the edge of the lower substrate (111). The printed circuit board (PCB) is configured to transmit signals and voltages from a control unit to a display element for driving the display element. Accordingly, the printed circuit board (PCB) may also be referred to as a driving board. A control unit, such as an IC chip or a circuit unit, may be mounted on the printed circuit board (PCB). Additionally, a memory or processor may be mounted on the printed circuit board (PCB). Furthermore, the printed circuit board (PCB) provided in the display device (100) may include a stretchable area and a non-stretchable area to ensure stretchability. An IC chip, a circuit unit, a memory, a processor, etc., may be mounted in the non-stretchable area, and wiring electrically connected to the IC chip, circuit unit, memory, and processor may be arranged in the stretchable area.

[0055] A data driver (DD) is a component that supplies data voltage to multiple pixels (PX) placed in a display area (AA). The data driver (DD) can be configured in the form of an IC chip and may also be referred to as a data integrated circuit (D-IC). Additionally, the data driver (DD) can be mounted in the non-stretched area of ​​a printed circuit board (PCB). That is, the data driver (DD) can be mounted on the printed circuit board (PCB) in the form of a Chip On Board (COB). However, although FIG. 1 illustrates the data driver (DD) being mounted in the COB method, the data driver (DD) may also be mounted in the form of a Chip on Board (COF), Chip on Glass (COG), Tape Carrier Package (TCP), etc., and is not limited thereto.

[0056] In addition, in FIG. 1, it is illustrated that one data driver (DD) is positioned correspondingly to each of the multiple columns formed by the multiple first plate patterns (121) arranged in the display area (AA), but it is not limited thereto. That is, one data driver (DD) can be positioned correspondingly to the multiple columns formed by the multiple first plate patterns (121).

[0057] Referring to FIGS. 1 and 2, a plurality of first plate patterns (121) are spaced apart from each other and arranged on a display area (AA) of a lower substrate (111). For example, the plurality of first plate patterns (121) may be arranged in a matrix form on the lower substrate (111) as shown in FIG. 1, but are not limited thereto. Additionally, a plurality of first wiring patterns (122) may connect the plurality of first plate patterns (121) to each other. Some of the plurality of first wiring patterns (122) may connect the plurality of first plate patterns (121) adjacent to each other in a first direction (X), and other parts may connect the plurality of first plate patterns (121) adjacent to each other in a second direction (Y).

[0058] Referring to FIGS. 2 and 3, a pixel (PX) is arranged in a plurality of first plate patterns (121), each including a plurality of subpixels (SPX) which are individual units that emit light. Each of the plurality of subpixels (SPX) may include an LED (170) which is a display element, a driving transistor (160) for driving the LED (170), and a switching transistor (150). However, the display element in the subpixel (SPX) is not limited to the LED (170) but may be changed to an organic light-emitting diode. Also, the plurality of subpixels (SPX) may include a red subpixel (SPX), a green subpixel (SPX), and a blue subpixel (SPX), but is not limited thereto, and the colors of the plurality of subpixels (SPX) may be varied as needed.

[0059] Below, the cross-sectional structure of the display area (AA) will be described in detail with reference to FIG. 3.

[0060] Referring to FIG. 3, a first adhesive layer (OCA1) is disposed between the lower substrate (111) and the pattern layer (120). The first adhesive layer (OCA1) is a member that bonds the lower substrate (111) and the pattern layer (120) to each other and may be a transparent adhesive film such as an optically clear adhesive (OCA). The first adhesive layer (OCA1), together with the second adhesive layer (OCA2) to be described later, can seal the space between the lower substrate (111) and the upper substrate (112) to position the filling layer (190) between the lower substrate (111) and the upper substrate (112), and a more detailed description will be provided later with reference to FIG. 6a to FIG. 8.

[0061] A plurality of first plate patterns (121) and a plurality of first wiring patterns (122) are arranged on a first adhesive layer (OCA1). At this time, the lower portions of the plurality of first wiring patterns (122) may be patterned to form grooves (122G). The thickness of the plurality of first wiring patterns (122) with grooves (122G) formed in the lower portions may be smaller than the thickness of the plurality of first plate patterns (121). The plurality of first plate patterns (121) are adhered to the first adhesive layer (OCA1), but the plurality of first wiring patterns (122) may not be adhered to the first adhesive layer (OCA1) due to the grooves (122G). In this case, when the display device (100) is stretched, the plurality of first wiring patterns (122) can be stretched more easily without interfering with the first adhesive layer (OCA1). Accordingly, by forming a groove (122G) on the lower portion of a plurality of first wiring patterns (122) to separate the first adhesive layer (OCA1) and the first wiring pattern (122), the plurality of first wiring patterns (122) and the plurality of connecting wires (180) can be easily stretched when the display device (100) is stretched.

[0062] Next, a plurality of inorganic insulating layers are disposed on a plurality of first plate patterns (121). For example, the plurality of inorganic insulating layers may include a buffer layer (141), a gate insulating layer (142), a first interlayer insulating layer (143), a second interlayer insulating layer (144), and a passivation layer (145). However, other inorganic insulating layers may be additionally disposed in addition to the inorganic insulating layers described above, or one or more of the inorganic insulating layers described above may be omitted, and the configuration of the plurality of inorganic insulating layers is not limited thereto.

[0063] First, a buffer layer (141) is disposed on a plurality of first plate patterns (121). The buffer layer (141) is formed on the plurality of first plate patterns (121) to protect various components of the display device (100) from the penetration of moisture and oxygen, etc., from the lower substrate (111) and the plurality of first plate patterns (121). The buffer layer (141) may be composed of an insulating material. For example, the buffer layer (141) may be composed of a single layer or a multilayer made of at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). However, the buffer layer (141) may be omitted depending on the structure or characteristics of the display device (100).

[0064] At this time, the buffer layer (141) may be formed only in the area where the lower substrate (111) overlaps with the plurality of first plate patterns (121) and the plurality of second plate patterns (123). As described above, since the buffer layer (141) may be made of an inorganic material, it may be easily damaged, such as by cracking, during the process of stretching the display device (100). Accordingly, the buffer layer (141) may not be formed in the area between the plurality of first plate patterns (121) and the plurality of second plate patterns (123), but may be formed only on the upper part of the plurality of first plate patterns (121) and the plurality of second plate patterns (123) by patterning in the shape of the plurality of first plate patterns (121) and the plurality of second plate patterns (123). Accordingly, a display device (100) according to one embodiment of the present invention forms a buffer layer (141) only in the area overlapping with a plurality of first plate patterns (121) and a plurality of second plate patterns (123), which are rigid patterns, thereby preventing damage to various components of the display device (100) even when the display device (100) is deformed, such as by bending or stretching.

[0065] Referring to FIG. 3, a switching transistor (150) including a gate electrode, an active layer, a source electrode, and a drain electrode, and a driving transistor (160) including a gate electrode, an active layer, a source electrode, and a drain electrode are formed on the buffer layer (141).

[0066] First, referring to FIG. 1, a switching active layer (152) of a switching transistor (150) and a driving active layer (162) of a driving transistor (160) are disposed on a buffer layer (141). For example, each of the switching active layer (152) of the switching transistor (150) and the driving active layer (162) of the driving transistor (160) may be formed of an oxide semiconductor, or the switching active layer (152) of the switching transistor (150) and the driving active layer (162) of the driving transistor (160) may be formed of amorphous silicon (a-Si), polycrystalline silicon (poly-Si), or an organic semiconductor, etc.

[0067] A gate insulating layer (142) is disposed on the switching active layer (152) of the switching transistor (150) and the driving active layer (162) of the driving transistor (160). The gate insulating layer (142) is a layer for electrically insulating the switching gate electrode (151) of the switching transistor (150) from the switching active layer (152) and electrically insulating the driving gate electrode (161) of the driving transistor (160) from the driving active layer (162). The gate insulating layer (142) may be made of an insulating material and, for example, may be composed of a single layer of inorganic silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0068] On the gate insulating layer (142), the switching gate electrode (151) of the switching transistor (150) and the driving gate electrode (161) of the driving transistor (160) are disposed. The switching gate electrode (151) and the driving gate electrode (161) are disposed spaced apart from each other on the gate insulating layer (142). Then, the switching gate electrode (151) overlaps with the switching active layer (152), and the driving gate electrode (161) overlaps with the driving active layer (162).

[0069] Each of the switching gate electrode (151) and the driving gate electrode (161) may be any one of various metal materials, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more of these, or a multilayer thereof, but is not limited thereto.

[0070] A first interlayer insulating layer (143) is disposed on the switching gate electrode (151) and the driving gate electrode (161). The first interlayer insulating layer (143) insulates the driving gate electrode (161) from the intermediate metal layer (IM). The first interlayer insulating layer (143) may be made of an inorganic material, just like the buffer layer (141). For example, the first interlayer insulating layer (143) may be composed of a single layer of inorganic silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0071] An intermediate metal layer (IM) is disposed on the first interlayer insulating layer (143). The intermediate metal layer (IM) is an electrode that forms a storage capacitor by overlapping with the gate electrode of the driving transistor (160). Specifically, the driving gate electrode (161) and the intermediate metal layer (IM) may overlap each other with the first interlayer insulating layer (143) in between to form a storage capacitor. However, the intermediate metal layer (IM) may overlap with other electrodes to form various storage capacitors, and is not limited thereto.

[0072] The intermediate metal layer (IM) may be any one of various metallic materials, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more of these, or a multilayer thereof, but is not limited thereto.

[0073] A second interlayer insulating layer (144) is disposed on the intermediate metal layer (IM). The second interlayer insulating layer (144) insulates the switching gate electrode (151) from the switching source electrode (153) and the switching drain electrode (154) of the switching transistor (150). The second interlayer insulating layer (144) also insulates the intermediate metal layer (IM) from the driving source electrode and the driving drain electrode (164) of the driving transistor (160). The second interlayer insulating layer (144) may be made of an inorganic material, just like the buffer layer (141). For example, the second interlayer insulating layer (144) may be composed of a single layer of inorganic silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0074] The switching source electrode (153) and the switching drain electrode (154) of the switching transistor (150) are disposed on the second interlayer insulating layer (144). The driving source electrode and the driving drain electrode (164) of the driving transistor (160) are disposed on the second interlayer insulating layer (144). The switching source electrode (153) and the switching drain electrode (154) of the switching transistor (150) are disposed spaced apart from each other on the same layer. Although the driving source electrode of the driving transistor (160) is omitted in FIG. 3, the driving source electrode of the driving transistor (160) may also be disposed spaced apart from the driving drain electrode (164) on the same layer. The switching source electrode (153) and the switching drain electrode (154) may be electrically connected to the switching active layer (152) through contact holes formed in the gate insulating layer (142), the first interlayer insulating layer (143), and the second interlayer insulating layer (144). The driving source electrode and the driving drain electrode (164) can also be electrically connected to the driving active layer (162) through contact holes formed in the gate insulating layer (142), the first interlayer insulating layer (143), and the second interlayer insulating layer (144). Additionally, the switching drain electrode (154) of the switching transistor (150) can be electrically connected to the driving gate electrode (161) of the driving transistor (160) through contact holes in the first interlayer insulating layer (143) and the second interlayer insulating layer (144).

[0075] The switching source electrode (153) and the switching drain electrode (154) and the driving source electrode and the driving drain electrode (164) may be any one of various metal materials, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more of these, or a multilayer thereof, but are not limited thereto.

[0076] Additionally, although the driving transistor (160) is described in this specification as having a coplanar structure, various transistors such as a staggered structure may also be used. Furthermore, in this specification, the transistor may be formed not only with a top gate structure but also with a bottom gate structure, and is not limited thereto.

[0077] A gate pad (GP), a data pad (DP), and a power pad (VP) are placed on the second interlayer insulation layer (144).

[0078] First, referring to FIG. 4, the gate pad (GP) is a pad for transmitting a gate voltage to a plurality of subpixels (SPX). The gate pad (GP) can be electrically connected to a first connection wire (181) through a contact hole formed in the flattening layer (146) and the passivation layer (145). The gate voltage supplied from the first connection wire (181) can be transmitted from the gate pad (GP) to the switching gate electrode (151) of the switching transistor (150) through a wire formed on the first plate pattern (121).

[0079] Referring to FIG. 3, the data pad (DP) is a pad for transmitting data voltage to a plurality of subpixels (SPX). The data pad (DP) can be electrically connected to a second connection wire (182) through a contact hole formed in the flattening layer (146) and the passivation layer (145). The data voltage supplied from the second connection wire (182) can be transmitted from the data pad (DP) to the switching source electrode (153) of the switching transistor (150) through a wire formed on the first plate pattern (121).

[0080] Referring to FIG. 3, the power pad (VP) is a pad for delivering a low potential voltage to a plurality of subpixels (SPX). The power pad (VP) can be electrically connected to a first connecting wire (181) through a contact hole formed in the flattening layer (146) and the passivation layer (145). The low potential voltage supplied from the first connecting wire (181) can be delivered from the power pad (VP) to an LED (170) through a wire formed on the first plate pattern (121).

[0081] The gate pad (GP), data pad (DP), and power pad (VP) may be made of the same material as the source electrode and drain electrode, for example, any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more of these, or a multilayer thereof, but are not limited thereto.

[0082] Referring to FIG. 3, a passivation layer (145) is formed on a switching transistor (150), a driving transistor (160), a gate pad (GP), a data pad (DP), and a power pad (VP). The passivation layer (145) can protect the components below the passivation layer (145) from moisture and oxygen. The passivation layer (145) may be made of an inorganic material and may be a single layer or a multilayer, but is not limited thereto.

[0083] Meanwhile, the gate insulating layer (142), the first interlayer insulating layer (143), the second interlayer insulating layer (144), and the passivation layer (145) may be patterned in the same way as the buffer layer (141) and formed only in the area overlapping with the plurality of first plate patterns (121). Since the gate insulating layer (142), the first interlayer insulating layer (143), the second interlayer insulating layer (144), and the passivation layer (145) may also be made of inorganic material in the same way as the buffer layer (141), they may be easily damaged, such as by cracks, during the process of stretching the display device (100). Accordingly, the gate insulating layer (142), the first interlayer insulating layer (143), the second interlayer insulating layer (144), and the passivation layer (145) are not formed in the region between the plurality of first plate patterns (121), but are patterned in the shape of the plurality of first plate patterns (121) and may be formed only on the upper portion of the plurality of first plate patterns (121).

[0084] A flattening layer (146) is formed on the passivation layer (145). The flattening layer (146) flattens the upper portion of the switching transistor (150) and the driving transistor (160). The flattening layer (146) may be composed of a single layer or multiple layers and may be made of an organic material. Accordingly, the flattening layer (146) may be referred to as an organic insulating layer. For example, the flattening layer (146) may be made of an acrylic-based organic material, but is not limited thereto.

[0085] Referring to FIG. 3, a flattening layer (146) may be arranged to cover the upper and side surfaces of a buffer layer (141), a gate insulating layer (142), a first interlayer insulating layer (143), a second interlayer insulating layer (144), and a passivation layer (145) on a plurality of first plate patterns (121). The flattening layer (146) surrounds the buffer layer (141), the gate insulating layer (142), the first interlayer insulating layer (143), the second interlayer insulating layer (144), and the passivation layer (145) together with the plurality of first plate patterns (121). Specifically, the flattening layer (146) may be positioned to cover the upper and side surfaces of the passivation layer (145), the side surface of the first interlayer insulating layer (143), the side surface of the second interlayer insulating layer (144), the side surface of the gate insulating layer (142), the side surface of the buffer layer (141), and a portion of the upper surface of a plurality of first plate patterns (121).

[0086] Referring to FIG. 3, the angle of inclination of the side of the flattening layer (146) may be smaller than the angle of inclination formed by the sides of the buffer layer (141), the gate insulating layer (142), the first interlayer insulating layer (143), the second interlayer insulating layer (144), and the passivation layer (145). For example, the side of the flattening layer (146) may have a gentler slope than the slope formed by the side of the passivation layer (145), the side of the first interlayer insulating layer (143), the side of the second interlayer insulating layer (144), the side of the gate insulating layer (142), and the side of the buffer layer (141), respectively. Accordingly, the connecting wire (180) positioned in contact with the side of the flattening layer (146) is positioned with a gentle slope, so that the stress generated in the connecting wire (180) can be reduced when the display device (100) is stretched. Accordingly, the flattening layer (146) can compensate for the step difference on the side of the buffer layer (141), gate insulating layer (142), first interlayer insulating layer (143), second interlayer insulating layer (144), and passivation layer (145).

[0087] Additionally, by having a relatively gentle slope on the side of the flattening layer (146), the phenomenon of the connecting wire (180) cracking or peeling off from the side of the flattening layer (146) can be suppressed. Therefore, the flattening layer (146) can increase the adhesive strength with the connecting wire (180) placed on the side of the flattening layer (146).

[0088] Referring to FIGS. 2 to 4, a plurality of connecting wires (180) refers to wires that electrically connect pads on a plurality of first plate patterns (121). A plurality of connecting wires (180) are arranged on a plurality of first wiring patterns (122). A plurality of connecting wires (180) may extend onto a plurality of first plate patterns (121) to be electrically connected to pads such as a gate pad (GP), a data pad (DP), and a power pad (VP) on a plurality of first plate patterns (121). A plurality of first wiring patterns (122) are not arranged in areas between the plurality of first plate patterns (121) where a plurality of connecting wires (180) are not arranged. Accordingly, a plurality of first wiring patterns (122) and a plurality of connecting wires (180) can be defined as wiring sections.

[0089] A plurality of connecting wires (180) include a first connecting wire (181) and a second connecting wire (182). The first connecting wire (181) and the second connecting wire (182) are arranged between a plurality of first plate patterns (121). Specifically, the first connecting wire (181) refers to a wire extending in a first direction (X) between a plurality of first plate patterns (121) among the connecting wires (180), and the second connecting wire (182) refers to a wire extending in a second direction (Y) between a plurality of first plate patterns (121) among the connecting wires (180).

[0090] A plurality of connecting wires (180) may be made of a metal material such as copper (Cu), aluminum (Al), titanium (Ti), molybdenum (Mo), or a stacked structure of a metal material such as copper / molybdenum-titanium (Cu / Moti), titanium / aluminum / titanium (Ti / Al / Ti), but are not limited thereto.

[0091] In the case of a typical display device, various wirings such as multiple gate wirings and multiple data wirings are arranged to extend in a straight line between multiple subpixels, and multiple subpixels are connected to a single signal wiring. Accordingly, in the case of a typical display device, various wirings such as gate wirings, data wirings, high potential voltage wirings, and reference voltage wirings extend from one side of the display device to the other without interruption on the substrate.

[0092] In contrast, in the case of a display device (100) according to one embodiment of the present invention, various wirings such as straight-shaped gate wiring, data wiring, high-potential voltage wiring, reference voltage wiring, and initialization voltage wiring, which can be seen as used in general display devices, are placed only on a plurality of first plate patterns (121) and a plurality of second plate patterns (123). That is, in the display device (100) according to one embodiment of the present invention, straight-shaped wiring is placed only on a plurality of first plate patterns (121) and a plurality of second plate patterns (123).

[0093] In a display device (100) according to one embodiment of the present invention, pads on two adjacent first plate patterns (121) may be connected by a connecting wire (180). Accordingly, the connecting wire (180) electrically connects a gate pad (GP) or a data pad (DP) on two adjacent first plate patterns (121). Accordingly, a display device (100) according to one embodiment of the present invention may include a plurality of connecting wires (180) to electrically connect various wires, such as gate wires, data wires, high potential voltage wires, reference voltage wires, etc., between a plurality of first plate patterns (121). For example, gate wires may be placed on a plurality of first plate patterns (121) arranged adjacently in a first direction (X), and gate pads (GPs) may be placed at both ends of the gate wires. At this time, each of the plurality of gate pads (GP) on the plurality of first plate patterns (121) arranged adjacently in the first direction (X) can be connected to each other by a first connecting wire (181) that functions as a gate wire. Accordingly, the gate wire arranged on the plurality of first plate patterns (121) and the first connecting wire (181) arranged on the first wiring pattern (122) can function as a single gate wire. In addition, among all the various wires that may be included in the display device (100), the wires extending in the first direction (X), for example, light emission signal wires, low potential voltage wires, and high potential voltage wires, can also be electrically connected by the first connecting wire (181) as described above.

[0094] Referring to FIGS. 2 and FIGS. 4, some of the first connecting wires (181) among the plurality of first connecting wires (181) can connect two gate pads (GP) on the first plate pattern (121) that are arranged side by side among the gate pads (GP) on the plurality of first plate pattern (121) arranged adjacently in the first direction (X). The gate pads (GP) on the plurality of first plate pattern (121) arranged in the first direction (X) can be connected by the first connecting wires (181) that function as gate wires, and a gate voltage can be transmitted. However, the plurality of first connecting wires (181) can function as light emission signal wires, high potential voltage wires, or low potential voltage wires in addition to gate wires, and are not limited thereto.

[0095] Referring to FIGS. 2 and 3, some of the second connecting wires (182) among the plurality of second connecting wires (182) can connect two data pads (DPs) on the first plate pattern (121) that are arranged side by side among the data pads (DPs) on the plurality of first plate pattern (121) arranged adjacently in the second direction (Y). The internal wiring on the plurality of first plate pattern (121) arranged in the second direction (Y) can be connected by the plurality of second connecting wires (182) that function as data wires, and a single data voltage can be transmitted. However, the plurality of second connecting wires (182) may function as data wires, high potential voltage wires, low potential voltage wires, or reference voltage wires, but are not limited thereto.

[0096] Referring to FIG. 4, the first connecting wire (181) may be positioned to be in contact with the upper and side surfaces of the flattening layer (146) placed on the first plate pattern (121). The first connecting wire (181) may be positioned on the upper surface of the first wiring pattern (122), and both ends may be formed to extend upwards toward the first plate pattern (121). Additionally, the second connecting wire (182) may be positioned to be in contact with the upper and side surfaces of the flattening layer (146) placed on the first plate pattern (121). The second connecting wire (182) may also be positioned on the upper surface of the first wiring pattern (122), and both ends may be formed to extend upwards toward the first plate pattern (121).

[0097] Referring to FIG. 5, in the area where the first connecting wire (181) and the second connecting wire (182) are not placed, there is no need to place a rigid pattern, so a plurality of first wiring patterns (122) are not placed.

[0098] Referring again to FIG. 3, a bank (147) is formed on a connection pad (CNT), a connection wire (180), and a flattening layer (146). The bank (147) is a component that separates adjacent subpixels (SPX). The bank (147) is positioned to cover at least a portion of the connection pad (CNT), the connection wire (180), and the flattening layer (146). The bank (147) may be made of an insulating material. Additionally, the bank (147) may include a black material to obscure the wiring that can be seen through the display area (AA). The bank (147) may be made of, for example, a carbon-based mixture, specifically carbon black. However, it is not limited thereto, and the bank (147) may be made of a transparent insulating material. And in the drawing, the height of the bank (147) is shown as being lower than the height of the LED (170), but is not limited thereto, and the height of the bank (147) may be equal to the height of the LED (170).

[0099] An LED (170) is placed on a connection pad (CNT) and a first connection wire (181). The LED (170) includes an n-type layer (171), an active layer (172), a p-type layer (173), an n-electrode (175), and a p-electrode (174). The LED (170) of the display device (100) according to one embodiment of the present invention has a flip-chip structure in which an n-electrode (175) and a p-electrode (174) are formed on one side.

[0100] The n-type layer (171) can be formed by injecting n-type impurities into gallium nitride (GaN) having excellent crystallinity. The n-type layer (171) may be placed on a separate base substrate made of a material capable of emitting light. For example, the n-type impurities may be silicon (Si), germanium, tin (Sn), etc., but are not limited thereto.

[0101] An active layer (172) is disposed on the n-type layer (171). The active layer (172) is a light-emitting layer that emits light from the LED (170) and can be formed as a single layer or a multi-quantum well (MQW) structure, and can be made of a nitride semiconductor such as indium gallium nitride (InGaN) or gallium nitride (GaN), but is not limited thereto.

[0102] A p-type layer (173) is disposed on the active layer (172). The p-type layer (173) can be formed by injecting p-type impurities into gallium nitride (GaN). For example, the p-type impurities may be magnesium, zinc (Zn), beryllium (Be), etc., but are not limited thereto.

[0103] An LED (170) according to one embodiment of the present invention is manufactured by sequentially stacking an n-type layer (171), an active layer (172), and a p-type layer (173) as described above, and then etching a predetermined portion to form an n-electrode (175) and a p-electrode (174). At this time, the predetermined portion is a space to separate the n-electrode (175) and the p-electrode (174), and the predetermined portion is etched so that a part of the n-type layer (171) is exposed. In other words, the surface of the LED (170) on which the n-electrode (175) and the p-electrode (174) are placed may have different height levels rather than being a flattened surface.

[0104] In this way, an n-electrode (175) is disposed in the etched region, and the n-electrode (175) may be made of a conductive material. And, a p-electrode (174) is disposed in the unetched region, and the p-electrode (174) may also be made of a conductive material. For example, an n-electrode (175) is disposed on the n-type layer (171) exposed by the etching process, and a p-electrode (174) is disposed on the p-type layer (173). The p-electrode (174) may be made of the same material as the n-electrode (175).

[0105] A conductive adhesive layer (AD) is disposed between the upper surface of the connection pad (CNT) and the first connection wire (181) and the connection pad (CNT) and the first connection wire (181), so that an LED (170) can be adhered to the connection pad (CNT) and the first connection wire (181). At this time, the n-electrode (175) can be disposed on the first connection wire (181), and the p-electrode (174) can be disposed on the connection pad (CNT).

[0106] The conductive adhesive layer (AD) may be an adhesive layer in which conductive balls are dispersed on an insulating base member. Accordingly, when heat or pressure is applied to the conductive adhesive layer (AD), the conductive balls are electrically connected in the area where heat or pressure is applied, thereby possessing conductive properties, while the area where no pressure is applied may possess insulating properties. For example, the n-electrode (175) is electrically connected to the first connecting wire (181) through the conductive adhesive layer (AD), and the p-electrode (174) is electrically connected to the connecting pad (CNT) through the conductive adhesive layer (AD). After applying a conductive adhesive layer (AD) to the upper surface of the first connecting wire (181) and the connecting pad (CNT) by means such as inkjet, an LED (170) is transferred onto the conductive adhesive layer (AD), and the connecting pad (CNT) and the p-electrode (174) and the first connecting wire (181) and the n-electrode (175) can be electrically connected by applying pressure and heat to the LED (170). Accordingly, other parts of the conductive adhesive layer (AD), excluding the portion of the conductive adhesive layer (AD) placed between the n-electrode (175) and the first connecting wire (181) and the portion of the conductive adhesive layer (AD) placed between the p-electrode (174) and the connecting pad (CNT), are not pressured and can have insulating properties. Meanwhile, the conductive adhesive layer (AD) may be placed entirely on the connection pad (CNT) and the first connection wire (181) as shown in the drawing, but may also be placed separately on each of the connection pad (CNT) and the first connection wire (181), and is not limited thereto.

[0107] The connection pad (CNT) is electrically connected to the driving drain electrode (164) of the driving transistor (160) so that it can receive a driving voltage for driving the LED (170) from the driving transistor (160). Although FIG. 3 illustrates that the connection pad (CNT) and the driving drain electrode (164) are indirectly connected without direct contact, this is not limited thereto, and the connection pad (CNT) and the driving drain electrode (164) may come into direct contact. A low-potential driving voltage for driving the LED (170) is applied to the first connection wire (181). Accordingly, when the display device (100) is turned on, different voltage levels applied to the connection pad (CNT) and the first connection wire (181), respectively, are transmitted to the n-electrode (175) and the p-electrode (174), respectively, causing the LED (170) to emit light.

[0108] Next, a second adhesive layer (OCA2) is disposed on the LED (170) and the lower substrate (111). The second adhesive layer (OCA2) is a material for bonding the lower substrate (111) and the upper substrate (112) on which the filling layer (190) and the LED (170) are formed, and may be a transparent adhesive film such as an optically clear adhesive (OCA). At least a portion of the second adhesive layer (OCA2) may be in contact with a configuration, for example, the LED (170), which is disposed on the upper portion of the first plate pattern (121).

[0109] An upper substrate (112) is placed on the second adhesive layer (OCA2). The upper substrate (112) is a substrate that supports various components placed below the upper substrate (112). For example, the upper substrate (112) can be formed by coating a material constituting the upper substrate (112) onto the lower substrate (111) and the first plate pattern (121) and then curing it.

[0110] The upper substrate (112) may be made of the same material as the lower substrate (111). For example, the upper substrate (112) may be made of silicone rubber such as polydimethylsiloxane (PDMS), polyurethane (PU), or an elastomer such as PTFE (polytetrafluoroethylene), and thus may have flexible properties. However, the material of the upper substrate (112) is not limited thereto.

[0111] Meanwhile, although not shown in FIG. 3, a polarizing layer may be disposed on the upper substrate (112). The polarizing layer may function to reduce external light reflection by polarizing light incident from outside the display device (100). Additionally, an optical film other than the polarizing layer may be disposed on the upper substrate (112).

[0112] A filling layer (190) is disposed between the first adhesive layer (OCA1) and the second adhesive layer (OCA2). The filling layer (190) can fill the entire empty space between the first adhesive layer (OCA1) and the second adhesive layer (OCA2). For example, the filling layer (190) can be filled to surround all components between the first adhesive layer (OCA1) and the second adhesive layer (OCA2), including the groove (122G) below the plurality of first wiring patterns (122), that is, the empty space between the plurality of first wiring patterns (122) and the first adhesive layer (OCA1). In this case, the filling layer (190) filled in the groove (122G) can prevent the plurality of first wiring patterns (122) from being attached to the first adhesive layer (OCA1), and the plurality of connecting wires (180) and the plurality of first wiring patterns (122) can be surrounded by the filling layer (190) and float.

[0113] Specifically, the filling layer (190) includes a first filling layer (191) and a second filling layer (192). The first filling layer (191) and the second filling layer (192) are arranged to fill the space between the first adhesive layer (OCA1) and the second adhesive layer (OCA2) and can be formed integrally.

[0114] The first filling layer (191) is positioned to fill the space between the plurality of connecting wires (180) and the second adhesive layer (OCA2). The first filling layer (191) can cover the plurality of first wiring patterns (122) and the plurality of connecting wires (180). For example, the first filling layer (191) can cover the upper, left, and lower portions of the plurality of connecting wires (180) and the plurality of first wiring patterns (122). The first filling layer (191) can also be positioned to cover components placed on the plurality of first plate patterns (121). For example, the first filling layer (191) can be positioned to fill the space on the plurality of first plate patterns (121) to cover the LED (170), bank (147), connecting pad (CNT), flattening layer (146), etc. placed on the first plate pattern (121).

[0115] The second filling layer (192) is positioned to fill the space between the plurality of first wiring patterns (122) and the plurality of connecting wires (180) and the first adhesive layer (OCA1). The second filling layer (192) may be positioned to fill the groove (122G) below the plurality of first wiring patterns (122). Accordingly, the plurality of first wiring patterns (122) and the plurality of connecting wires (180) can be separated from the first adhesive layer (OCA1) by the second filling layer (192) filling the groove (122G) as described above. Furthermore, the second filling layer (192) may be positioned to surround the plurality of first wiring patterns (122) and the plurality of connecting wires (180) together with the first filling layer (191). Therefore, a plurality of first wiring patterns (122) and a plurality of connecting wires (180) can float surrounded by a first filling layer (191) and a second filling layer (192) which are liquid materials.

[0116] The filling layer (190) is made of a non-conductive liquid material, which can prevent corrosion or electrical failure of conductive materials that come into direct contact with the filling layer (190), such as a plurality of LEDs (170) or a plurality of connecting wires (180). The filling layer (190) may be made of a liquid material having high resistivity to prevent electrical interference such as that of a plurality of connecting wires (180), a plurality of LEDs (170), or a connecting pad (CNT). Additionally, the filling layer (190) may be made of a liquid material in which a cured polymer material layer, such as a first adhesive layer (OCA1) and a second adhesive layer (OCA2), does not dissolve. Furthermore, the filling layer (190) may be made of a material having low viscosity to facilitate deformation of the plurality of connecting wires (180) and the plurality of first wiring patterns (122).

[0117] For example, the filling layer (190) may be composed of silicon oil or a silicone polymer such as polydimethylsiloxane (PDMS) or Ecoflex that does not contain a curing agent. And the filling layer (190) is approximately 3 × 10 14 It may be made of a material having a resistivity of more than Ohm · cm and a viscosity of about 5 Pa·s or less, but is not limited thereto.

[0118] In a display device (100) according to one embodiment of the present invention, a filling layer (190), which is a liquid material, is filled into the space between a first adhesive layer (OCA1) and a second adhesive layer (OCA2) to improve the deformation characteristics of a plurality of first wiring patterns (122) and a plurality of connecting wires (180) and to improve the stretchability of the display device (100). When the display device (100) is stretched, the plurality of first wiring patterns (122) and the plurality of connecting wires (180) can be stretched. At this time, if the plurality of first wiring patterns (122) are attached to the first adhesive layer (OCA1), the stretchability of the plurality of first wiring patterns (122) and the plurality of connecting wires (180) may be reduced by the first adhesive layer (OCA1). Accordingly, a first filling layer (191) covering a plurality of first wiring patterns (122) and a plurality of connecting wires (180) is formed, thereby minimizing interference between the plurality of first wiring patterns (122) and the plurality of connecting wires (180) and the second adhesive layer (OCA2) or other components having rigidity. Additionally, a groove (122G) is formed below the plurality of first wiring patterns (122) to separate the first adhesive layer (OCA1) from the plurality of first wiring patterns (122), and a second filling layer (192), which is a liquid material, is filled into the groove (122G) to minimize the reduction in elongation of the plurality of first wiring patterns (122) by causing them to adhere to the first adhesive layer (OCA1). Additionally, the first filling layer (191) and the second filling layer (192) are arranged to surround the upper, lower, left, and right portions of the plurality of first wiring patterns (122) and the plurality of connecting wires (180), so that the plurality of first wiring patterns (122) and the plurality of connecting wires (180) can float within the filling layer (190), which is a liquid material. Accordingly, the plurality of first wiring patterns (122) and the plurality of connecting wires (180) floating within the filling layer (190) do not interfere with other components during stretching, thereby reducing stress and maximizing stretchability.

[0119] This filling layer (190) can be formed by a coating method or an injection method, and a method for manufacturing a display device (100) according to one embodiment of the present invention will be described in detail with reference to FIGS. 6a to 7.

[0120] FIGS. 6a to 6d are process diagrams for explaining a method of manufacturing a display device according to an embodiment of the present invention. FIGS. 7a to 7c are process diagrams for explaining a method of manufacturing a display device according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. FIGS. 6a to 6d are process diagrams for forming a filling layer (190) by a coating method, and FIGS. 7a to 7c are process diagrams for forming a filling layer (190) by an injection method. For convenience of explanation, FIGS. 6a to 7c only show a part of the display device (100) corresponding to the display area (AA), and FIG. 8 shows an overall cross-sectional view of the display device (100). In FIGS. 6a to 8, the plurality of first plate patterns (121) and the components above the plurality of first plate patterns (121) are defined as pixel sections (PU), and the plurality of first wiring patterns (122) and the plurality of connecting wirings (180) are defined as wiring sections (LU) for explanation.

[0121] First, the filling layer (190), which is a liquid material, can be formed by either a coating method or an injection method. After applying the liquid material forming the filling layer (190) to the front surface of the display device (100), the filling layer (190) may be sealed, or the liquid material forming the filling layer (190) may be injected into the display device (100) through an unsealed area while the display device (100) is partially sealed.

[0122] Referring to FIG. 6a regarding the coating method, a pattern layer (120) including a plurality of first plate patterns (121) and a plurality of first wiring patterns (122) is formed on a temporary substrate (GLS). Subsequently, a pixel section (PU) including a subpixel (SPX) including a driving transistor (160), a switching transistor (150), and an LED (170), and a wiring section (LU) including a plurality of connecting wires (180) are formed on the pattern layer (120). Finally, a second adhesive layer (OCA2) and an upper substrate (112) are formed on the pixel section (PU) and the pattern layer (120).

[0123] Referring to FIG. 6b, a temporary substrate (GLS) is separated from the pattern layer (120), and a groove (122G) is formed in the lower part of the pattern layer (120) to be filled with a filling layer (190). By forming a groove (122G) in the lower part of the pattern layer (120) that overlaps with the wiring portion (LU) of the pattern layer (120), a void space can be formed between the first adhesive layer (OCA1) to be formed thereafter and the plurality of first wiring patterns (122). For example, a laser may be irradiated on the lower part of the plurality of first wiring patterns (122) to pattern a portion of the lower part of the plurality of first wiring patterns (122), or a photolithography process may be used to pattern a portion of the lower part of the plurality of first wiring patterns (122).

[0124] Referring to FIG. 6c, a material forming a filling layer (190) is applied to the front surface of the pixel portion (PU) and the wiring portion (LU). In this case, the upper substrate (112) is positioned downward, and the first filling layer (191) is filled into the empty space between the second adhesive layer (OCA2) and the wiring portion (LU), and the second filling layer (192) is filled into the groove (122G) at the bottom of the pattern layer (120). Thus, the filling layer (190) can be formed by applying a material forming a filling layer (190) to fill all the empty spaces between the second adhesive layer (OCA2) and the bottom surface of the pattern layer (120).

[0125] Next, referring to FIG. 6d and FIG. 8 together, the manufacturing process of the display device (100) can be completed by forming a first adhesive layer (OCA1) and a lower substrate (111) that cover the pattern layer (120) filled with the filling layer (190). The first adhesive layer (OCA1) is formed to cover the pattern layer (120) that is coated up to the second filling layer (192) of the filling layer (190), thereby sealing the display device (100) so that the filling layer (190) does not go outside the display device (100). For example, as shown in FIG. 8, the first adhesive layer (OCA1) and the second adhesive layer (OCA2) can be bonded to each other on the outside of the pattern layer (120), that is, in the non-display area (NA), to seal the display area (AA) filled with the filling layer (190).

[0126] Next, regarding the injection method, referring to FIG. 7a, a pattern layer (120), a pixel portion (PU), a wiring portion (LU), a second adhesive layer (OCA2), and an upper substrate (112) are formed on a temporary substrate (GLS), and the temporary substrate (GLS) is separated. Then, a portion of the lower part of a plurality of first wiring patterns (122) among the pattern layer (120) exposed from the temporary substrate (GLS) is patterned to form a groove (122G) into which a filling layer (190) is filled. That is, the process of forming a groove (122G) in the lower part of a plurality of first wiring patterns (122) is the same as the coating method.

[0127] Next, referring to FIG. 7b, a first adhesive layer (OCA1) and a lower substrate (111) are formed on the lower part of the pattern layer (120). At this time, the first adhesive layer (OCA1) is formed, and in the non-display area (NA), at least a portion of the first adhesive layer (OCA1) and the second adhesive layer (OCA2) are separated from each other to form an injection port into which a filling layer (190) can be filled.

[0128] Next, referring to FIG. 7c, a material forming a filling layer (190) can be injected into the empty space between the first adhesive layer (OCA1) and the second adhesive layer (OCA2) through the injection port. The filling layer (190) is filled into the display area (AA) through the injection port and can fill the empty space between the pixel portion (PU) and the pixel portion (PU), and the empty space between the first adhesive layer (OCA1) and the pattern layer (120). For example, the first filling layer (191) can be filled into the empty space between the pixel portion (PU) and the pattern layer (120) and the second adhesive layer (OCA2), and the second filling layer (192) can be filled into the groove (122G) below the pattern layer (120).

[0129] Finally, referring to FIG. 8, when the injection of the filling layer (190) is completed, the first adhesive layer (OCA1) and the second adhesive layer (OCA2) can both be bonded to the non-display area (NA) to seal the display area (AA).

[0130] Meanwhile, although not shown in the drawing, a plurality of dams may be formed in a portion of the non-display area (NA) between the part where the first adhesive layer (OCA1) and the second adhesive layer (OCA2) are attached to each other and the display area (AA). The plurality of dams can control the filling layer (190) of the display area (AA) so that it does not spread toward the non-display area (NA).

[0131] In a display device (100) according to one embodiment of the present invention, a blank space in a display area (AA) is filled with a filling layer (190), which is a liquid material, so that a plurality of first wiring patterns (122) and a plurality of connecting wires (180) can be stretched more easily. At this time, the filling layer (190) can be formed by a coating method in which the liquid material is applied to the front surface of a second adhesive layer (OCA2) on which a pattern layer (120) and a pixel portion (PU) are formed, or by a filling method in which the liquid material is filled into the display area (AA) through an unsealed injection port after partially sealing the display area (AA). Additionally, the display area (AA) can be sealed by attaching the first adhesive layer (OCA1) and the second adhesive layer (OCA2) in a non-display area (NA) so that the filling layer (190) is placed inside the display area (AA). Accordingly, by filling the filling layer (190) inside the display device (100) in various ways, the plurality of first wiring patterns (122) and the plurality of connecting wires (180) are configured to float without being adhered to the first adhesive layer (OCA1), thereby improving the stretchability of the display device (100).

[0132] FIGS. 9 to 12 are enlarged plan views of display devices according to various embodiments of the present invention. Each of the display devices (900, 1000, 1100, 1200) of FIGS. 9 to 12 differs from the display device (100) of FIGS. 1 to 8 only in the shape of the plurality of first wiring patterns (122) and the plurality of connecting wires (180), and other configurations are substantially the same, so a redundant description is omitted.

[0133] A filling layer (190) of a liquid material can be formed in the display area (AA) to allow the plurality of first wiring patterns (122) and the plurality of connecting wires (180) to be deformed more easily. The plurality of first wiring patterns (122) and the plurality of connecting wires (180) can be stretched without interfering with other components when the display device is stretched, while floating in the filling layer (190) of the liquid material.

[0134] At this time, by forming a filling layer (190), the deformation of a plurality of wiring sections (LU) including a plurality of first wiring patterns (122) and a plurality of connecting wires (180) can be facilitated, and at the same time, the shape of the plurality of wiring sections (LU) can be deformed together to reduce the stress applied to the wiring sections (LU) and increase the elongation rate, thereby improving the elongation reliability.

[0135] For example, referring to FIG. 9, in a display device (900) according to another embodiment of the present invention, a wiring section (LU) including a plurality of first wiring patterns (122) and a plurality of connecting wires (180) is configured with a plurality of semicircular sections (HC) and a plurality of straight sections (LL) to reduce stress on the wiring section (LU) and increase the elongation rate. In particular, the convex arc portions of the plurality of semicircular sections (HC) may be arranged facing the same direction as the elongation direction of the wiring section (LU).

[0136] Specifically, each of the plurality of wiring sections (LU) includes a plurality of semicircular sections (HC) and a plurality of straight sections (LL) arranged alternately. The convex arc portions of the plurality of semicircular sections (HC) may be arranged along the elongation direction. In the wiring section (LU) extended in the first direction (X), the convex arc portions of each of the plurality of semicircular sections (HC) may be arranged toward the first direction (X), and in the wiring section (LU) extended in the second direction (Y), the convex arc portions of each of the plurality of semicircular sections (HC) may be arranged toward the second direction (Y). Additionally, the plurality of straight sections (LL) may connect the plurality of semicircular sections (HC) to each other.

[0137] For example, one of the wiring sections (LU) extended in the first direction (X) may alternately have a straight section (LL) extended in the first direction (X) and a semicircular section (HC) with a convex arc facing to the right or to the left. That is, the wiring section (LU) extended in the first direction (X) may have a structure in which a straight section (LL) is placed between each of the semicircular section (HC) with a convex arc facing to the left and the semicircular section (HC) with a convex arc facing to the right.

[0138] For example, one of the wiring sections (LU) extended in the second direction (Y) may alternately have a straight section (LL) extended in the second direction (Y) and a semicircular section (HC) in which a convex arc portion faces upward or downward.

[0139] Next, referring to FIG. 10, in a display device (1000) according to another embodiment of the present invention, a wiring section (LU) including a plurality of first wiring patterns (122) and a plurality of connecting wires (180) is configured with a plurality of semicircular sections (HC), a plurality of quadrant sections (QC), and a plurality of straight sections (LL) to reduce stress on the wiring section (LU) and increase the elongation rate. Additionally, a portion of the wiring section (LU) adjacent to the first plate pattern (1021) is configured with quadrant sections (QC) and straight sections (LL) to increase the area of ​​the first plate pattern (1021) on which the pixel (PX) is placed.

[0140] Specifically, in each of the plurality of wiring sections (LU), a straight section (LL) is arranged between the semicircle section (HC), between the semicircle section (HC) and the quarter section (QC), and between the quarter section (QC). Additionally, some of the semicircle sections (HC) among the plurality of semicircle sections (HC) may be directly connected without a straight section (LL) between them. In this case, since the ends of each quarter section (QC) face different directions, the straight sections (LL) arranged on both sides of the quarter section (QC) may extend in different directions. For example, the straight section (LL) connected to one side of the quarter section (QC) may extend in the first direction (X), and the straight section (LL) connected to the other side of the quarter section (QC) may extend in the second direction (Y).

[0141] In summary, one end of one quadrant section (QC) can be connected to any one of another quadrant section (QC), a straight section (LL), and a semicircle section (HC), one end of the straight section (LL) can be connected to either the quadrant section (QC) or the semicircle section (HC), and one end of the semicircle section (HC) can be connected to either the straight section (LL) or the quadrant section (QC).

[0142] For example, one of the wiring sections (LU) extended in the first direction (X) may include a straight section (LL) extended toward the first direction (X) from the edge of the first plate pattern (1021), a quadrant section (QC) extended from the straight section (LL) in the first direction (X) with a convex arc portion facing the lower right diagonal direction or the lower left diagonal direction, a straight section (LL) extended toward the second direction (Y) from the quadrant section (QC), a quadrant section (QC) extended from the straight section (LL) in the second direction (Y) with a convex arc portion facing the upper left diagonal direction or the upper right diagonal direction, and a semicircle section (HC) extended from the straight section (LL) in the first direction (X) with a convex arc portion facing the right direction or the left direction.

[0143] For example, one of the wiring sections (LU) extended in the second direction (Y) may include a straight section (LL) extended from the edge of the first plate pattern (1021) toward the second direction (Y), a quadrant section (QC) extended from the straight section (LL) in the second direction (Y) with a convex arc portion facing the upper right diagonal direction or the upper left diagonal direction, a straight section (LL) extended from the quadrant section (QC) toward the first direction (X), and a semicircle section (HC) with a convex arc portion in the second direction (Y) facing the upper or lower direction.

[0144] Meanwhile, when a quadrant section (QC) is connected to the linear section (LL) closest to the first plate pattern (1021) among multiple linear sections (LL), a pair of linear sections (LL) with the quadrant section (QC) in between can form a vertical structure (VS). And the area of ​​the first plate pattern (1021) can be increased by extending the first plate pattern (1021) into the empty space formed through the vertical structure (VS). For example, among the four wiring sections (LU) placed between a pair of adjacent first plate patterns (1021), the two middle wiring sections (LU) can form a symmetrical structure. In this case, the vertical structure (VS) formed at each end of the two wiring sections (LU) can face each other and form a rectangular empty space, and the first plate pattern (1021) can be extended into the empty space. Accordingly, by forming the wiring section (LU) by combining a plurality of straight sections (LL), a plurality of quarter sections (QC), and a plurality of semicircles (HC), a space can be secured to extend and form the first plate pattern (1021).

[0145] Next, referring to FIG. 11, in a display device (1100) according to another embodiment of the present invention, a wiring section (LU) including a plurality of first wiring patterns (122) and a plurality of connecting wires (180) is configured with a plurality of semicircular sections (HC), a plurality of quadrant sections (QC), and a plurality of straight sections (LL) to reduce stress on the wiring section (LU) and increase elongation rate. Additionally, a portion of the wiring section (LU) adjacent to the first plate pattern (1021) is configured with quadrant sections (QC) and straight sections (LL) to increase the area of ​​the first plate pattern (1021) on which a pixel (PX) is placed.

[0146] Specifically, a straight line section (LL) is arranged between a semicircle section (HC) and a quarter circle section (QC) in each of the plurality of wiring sections (LU). In addition, some of the semicircle sections (HC) among the plurality of semicircle sections (HC) are connected to each other without a straight line section (LL) between them, and some of the quarter circle sections (QC) among the plurality of quarter circle sections (QC) can be connected to each other without a straight line section (LL).

[0147] In summary, one end of one quadrant section (QC) can be connected to another quadrant section (QC) or a straight section (LL), one end of the straight section (LL) can be connected to either the quadrant section (QC) or the semicircle section (HC), and one end of the semicircle section (HC) can be connected to either the straight section (LL) or the semicircle section (HC).

[0148] For example, one of the wiring sections (LU) extended in the first direction (X) may include a straight section (LL) extended toward the first direction (X) from the edge of the first plate pattern (1021), a quadrant section (QC) extended from the straight section (LL) or the quadrant section (QC) with a convex arc portion facing the lower right diagonal direction or the upper left diagonal direction, and a semicircle section (HC) extended from the straight section (LL) or another semicircle section (HC) with a convex arc portion facing the right direction or the left direction.

[0149] For example, one of the wiring sections (LU) extended in the second direction (Y) may include a straight section (LL) extended toward the second direction (Y) from the edge of the first plate pattern (1021), a quadrant section (QC) extended from the straight section (LL) or the quadrant section (QC) with a convex arc portion facing the upper right diagonal direction or the lower left diagonal direction, and a semicircle section (HC) extended from the straight section (LL) or another semicircle section (HC) with a convex arc portion facing the upper or lower direction.

[0150] And the display device (1100) of FIG. 11, similar to the display device (1000) of FIG. 10, can form a vertical structure (VS) that can extend the first plate pattern (1021) by configuring both ends of the wiring section (LU) adjacent to the first plate pattern (1021) into a straight section (LL) and a quarter section (QC). The vertical structures (VS) at both ends of each of the two adjacent wiring sections (LU) can face each other and form a rectangular empty space, and the area of ​​the first plate pattern (1021) can be increased by extending the first plate pattern (1021) into the empty space.

[0151] Next, referring to FIG. 12, in a display device (1200) according to another embodiment of the present invention, a wiring section (LU) including a plurality of first wiring patterns (122) and a plurality of connecting wires (180) is configured with a plurality of semicircular sections (HC), a plurality of quadrant sections (QC), and a plurality of straight sections (LL) that are tilted diagonally rather than in the first direction (X) and the second direction (Y), thereby reducing stress on the wiring section (LU) and increasing the elongation rate. Additionally, the elongation rate of the wiring section (LU) can be increased by configuring the radii of the plurality of semicircular sections (HC) and the plurality of quadrant sections (QC) differently.

[0152] Specifically, the multiple semicircles (HC) and the multiple quadrants (QC) may have their ends facing directions other than the first direction (X) and the second direction (Y). Accordingly, the multiple semicircles (HC) may have their ends facing diagonally, and the convex arc portion may also be positioned facing diagonally. Furthermore, the multiple quadrants (QC) may have their ends facing diagonally, and the convex arc portion may be positioned closer to the second direction (Y) or the first direction (X) instead of the diagonal direction.

[0153] In addition, multiple semicircles (HC) and multiple quarter circles (QC) are configured to have different radii, so that the wiring section (LU) can be easily stretched. For example, by forming the radius of the quarter circles (QC) larger than the radius of the semicircles (HC), the total length of the wiring section (LU) can be increased, the elongation rate of the wiring section (LU) can be increased, and the shape of the wiring section (LU) can be designed more diversely.

[0154] For example, one of the wiring sections (LU) extended in the first direction (X) may include a quadrant section (QC) extending from the edge of the first plate pattern (121) with a convex arc portion facing upward or downward, a quadrant section (QC) extending from another quadrant section (QC) or a straight section (LL) with a convex arc portion facing downward or upward, a straight section (LL) extending from the quadrant section (QC) or the semicircle section (HC) toward the upper right diagonal direction and the lower left diagonal direction, and a semicircle section (HC) extending from the straight section (LL) with a convex arc portion facing the upper right diagonal direction or the lower left diagonal direction.

[0155] For example, one of the wiring sections (LU) extended in the second direction (Y) may include a quadrant section (QC) extending from the edge of the first plate pattern (121) with a convex arc portion facing left or right, a quadrant section (QC) extending from another quadrant section (QC) or a straight section (LL) with a convex arc portion facing right or left, a straight section (LL) extending from the quadrant section (QC) or the semicircle section (HC) toward the upper left diagonal direction and the lower right diagonal direction, and a semicircle section (HC) extending from the straight section (LL) with a convex arc portion facing left or right diagonal direction.

[0156] In a display device (900, 1000, 1100, 1200) according to various embodiments of the present invention, a plurality of wiring sections (LU) including a plurality of first wiring patterns (122) and a plurality of connecting wires (180) are configured into a plurality of straight sections (LL), a plurality of semicircular sections (HC), and / or a plurality of quarter sections (QC), thereby increasing the length of the deformation section relative to the total length of the wiring sections (LU), so that the stress on the wiring sections (LU) during stretching can be reduced and the stretching rate can be increased. When the display device (900, 1000, 1100, 1200) is stretched, deformation occurs mainly in the semicircular sections (HC) and quarter sections (QC) of the wiring sections (LU), so that the wiring sections (LU) can be stretched. Accordingly, as the length occupied by multiple semicircles (HC) and multiple quarter circles (QC) in the total length of a wiring section (LU) increases, the wiring section (LU) can be easily extended. At this time, the convex arc portions of the multiple semicircles (HC) can be arranged toward the direction of extension or arranged in a direction inclined with respect to the direction of extension, thereby dispersing the deformation of the multiple semicircles (HC) to the straight section (LL) or quarter circle (QC) adjacent to the multiple semicircles (HC).

[0157] In addition, in the display device (900, 1000, 1100, 1200) according to various embodiments of the present invention, a space can be provided to extend and form a first plate pattern (1021) using the quadrant section (QC) and the straight section (LL) of the wiring section (LU). Accordingly, by securing the area of ​​the first plate pattern (1021), pixels (PX) can be easily formed on the first plate pattern.

[0158] Detailed information regarding this will be explained by referring to the simulation results.

[0159] FIGS. 13a and 13b are drawings showing the deformation section of the wiring section when the display device according to the comparative example and the embodiment is stretched. FIGS. 13a and 13b are simulation results showing the deformation section of the wiring section (LU) when the wiring section is stretched in the stretching direction. The part of the wiring section (LU) where actual deformation occurs is indicated in a light color, and the part that is not deformed is indicated in a dark color.

[0160] The wiring section (LU) of the display device (10) according to the comparative example has a structure in which, excluding the straight sections (LL) at both ends, the remaining part consists of a plurality of semicircular sections (HC) connected in succession, and the convex arc portions of the semicircular sections (HC) are arranged in a direction perpendicular to the elongation direction. In addition, semicircular sections (HC) with arc portions facing one direction and semicircular sections (HC) with arc portions facing the other direction are arranged alternately.

[0161] The display device (900) according to the embodiment is a display device (900) according to another embodiment of the present invention of FIG. 9. The wiring section (LU) of the embodiment has a structure in which a plurality of semicircular sections (HC) and a plurality of straight sections (LL) are alternately arranged, and the convex arc portions of the plurality of semicircular sections (HC) are arranged facing the elongation direction.

[0162] Comparative example Examples Maximum stress 2440 MPa 2161 MPa Ratio of the total length of the wiring section to the width of the wiring section 2.5 2.35 Ratio of the length of the deformed section to the total length of the wiring section 0.59 0.71 Maximum elongation 1.8 % 1.6 %

[0163] First, referring to FIG. 13 and Table 1 together, in the wiring section (LU) of the display device (10) according to the comparative example, a semicircular section (HC) is arranged in a direction perpendicular to the elongation direction, and a straight section (LL) arranged between each of the plurality of semicircular sections (HC) is also arranged in a direction perpendicular to the elongation direction. Accordingly, in the display device (10) according to the comparative example, the stress generated in the semicircular section (HC) is not distributed to the straight section (LL), and it can be confirmed that the maximum stress generated in the wiring section (LU) is approximately 2440 MPa.

[0164] On the other hand, in the wiring section (LU) of the display device (900) according to the embodiment, both ends of a plurality of semicircular sections (HC) spread out toward directions perpendicular to the elongation direction, for example, upward and downward directions, rather than in the elongation direction, and the straight section (LL) connected to both ends of the semicircular sections (HC) rotates. Accordingly, it can be confirmed that the deformation generated in the semicircular sections (HC) is distributed to the straight section (LL) between the semicircular sections (HC) and the semicircular sections (HC), and the maximum stress of the wiring section (LU) is reduced to approximately 2161 MPa.

[0165] Next, the wiring section (LU) according to the comparative example has a ratio of the total length of the wiring section (LU) to the width of the wiring section (LU) of approximately 2.5. That is, the total length of the wiring section (LU) can be approximately 2.5 times the shortest straight length from one end to the other of the wiring section (LU). In other words, because the total length of the wiring is long, the wiring section (LU) can be extended further. However, although the wiring section (LU) according to the comparative example has a large ratio of the total length to the width of the wiring section (LU), it can be confirmed that the ratio of the deformation length to the total length of the wiring section (LU) is approximately 0.59, as deformation mainly occurs only in the semicircular section (HC).

[0166] In contrast, the wiring section (LU) according to the embodiment has a length ratio of approximately 2.35 relative to the width of the wiring section (LU), which is smaller than that of the wiring section (LU) according to the comparative example. That is, when the wiring section (LU) according to the comparative example and the wiring section (LU) according to the embodiment have the same width, the total length of the wiring section (LU) according to the embodiment may be shorter than the total length of the wiring section (LU) according to the comparative example.

[0167] However, in the display device (900) according to the embodiment, the deformation occurring in the plurality of semicircular portions (HC) of the wiring portion (LU) is distributed to the straight portion (LL) around the semicircular portion (HC), so it can be confirmed that the ratio of the deformation length to the total length of the wiring portion (LU) is approximately 0.71. Accordingly, although the total length of the wiring portion (LU) of the embodiment is shorter than that of the wiring portion (LU) of the comparative example, the length of the portion that can be deformed, that is, the portion that can be extended, is greater. Therefore, although the total length of the wiring portion (LU) of the embodiment is shorter than that of the wiring portion (LU) of the comparative example, because the ratio of the portion that deforms during extension is higher, it can be confirmed that it has a similar level of elongation rate, that is, an elongation rate of 1.6% and 1.8%.

[0168] Accordingly, in the display device (900, 1000, 1100, 1200) according to various embodiments of the present invention, the wiring section (LU) can be designed in various shapes by configuring the wiring section (LU) with a plurality of semicircular sections (HC), a plurality of quadrant sections (QC), and a plurality of straight sections (LL). For example, by arranging the plurality of semicircular sections (HC) in various directions regardless of the stretching direction, the stress generated in the plurality of semicircular sections (HC) during stretching can be distributed to the surroundings of the plurality of semicircular sections (HC), and the maximum stress of the wiring section (LU) can be reduced. Accordingly, even if the wiring section (LU) is stretched repeatedly, damage to the wiring section (LU) can be minimized, and the stretching reliability of the display device (900, 1000, 1100, 1200) can be improved. In addition, the stretching rate of the wiring section (LU) can be secured by increasing the proportion of the portion that deforms during stretching instead of forming the total length of the wiring section (LU) long. Accordingly, the wiring portion (LU) can be floated inside the filling layer (190), and at the same time, the shape of the wiring portion (LU) can be designed in various ways to increase the stretching reliability of the display device (900, 1000, 1100, 1200). Explanation of the symbols

[0169] 100, 900, 1000, 1100, 1200: Display device 111: Lower substrate 112: Upper substrate 120: Pattern layer 121, 1021: First edition pattern 122: First wiring pattern 123: 2nd Edition Pattern 124: Second wiring pattern 141: Buffer layer 142: Gate insulation layer 143: First interlayer insulation layer 144: Second interlayer insulation layer 145: Passivation layer 146: Leveling layer 147: Bank 150: Switching transistor 151: Switching gate electrode 152: Switching active layer 153: Switching source electrode 154: Switching drain electrode 160: Driving transistor 161: Driving gate electrode 162: Driving active layer 164: Driving drain electrode 170: LED 171: n-type layer 172: Active layer 173: p-type layer 174: p-electrode 175: n-electrode 180: Connection wiring 181: First connecting wiring 182: Second connecting wiring 190: Packing layer 191: First packing layer 192: Second packing layer AA: Display area NA: Non-display area PX: Pixel SPX: Subpixel GD: Gate Driver DD: Data driver PCB: Printed Circuit Board PS: Power supply GP: Gate Pad DP: Data pad VP: Power Pad IM: Intermediate metal layer CNT: Connection pad AD: Adhesive layer OCA1: First adhesive layer OCA2: Second adhesive layer GLS: Temporary board 122G: Home X: First direction Y: Second direction PU: Pixel unit LU: Wiring section LL: Straight section HC: Semicircle QC: Quadrant section VS: Vertical structure

Claims

Claim 1 A display device comprising: a lower substrate that is stretchable and includes a display area and a non-display area; a first adhesive layer disposed on the lower substrate; a pattern layer disposed on the first adhesive layer and including a plurality of first plate patterns and a plurality of first wiring patterns that overlap the display area; a plurality of subpixels disposed on each of the plurality of first plate patterns; a plurality of connecting wires disposed on each of the plurality of first wiring patterns; and a filling layer comprising a first filling layer that fills the display area and covers the pattern layer, the plurality of subpixels, and the plurality of connecting wires, wherein the plurality of first wiring patterns include a groove disposed in a lower portion, and the first adhesive layer and the plurality of first wiring patterns are spaced apart from each other. Claim 2 A display device according to claim 1, wherein the filling layer further comprises a second filling layer that is filled into the groove and disposed between the first adhesive layer and the plurality of first wiring patterns. Claim 3 A display device according to paragraph 2, wherein the filling layer is made of a non-conductive liquid material. Claim 4 A display device according to paragraph 3, wherein the filling layer is composed of any one of a silicone polymer such as polydimethylsiloxane (PDMS) and Ecoflex, which does not contain silicon oil or a curing agent. Claim 5 A display device according to paragraph 3, wherein the first filling layer and the second filling layer are arranged to surround the plurality of first wiring patterns and the plurality of connecting wires, and the plurality of first wiring patterns and the plurality of connecting wires are configured to float in the filling layer. Claim 6 A display device according to claim 2, further comprising: a second adhesive layer disposed on the filling layer; and an upper substrate disposed on the second adhesive layer, wherein the first adhesive layer and the second adhesive layer are bonded to each other in the non-display area to seal the display area in which the filling layer is filled. Claim 7 In claim 6, the second adhesive layer is in contact with at least some of the plurality of subpixels and is spaced apart from the plurality of connecting wires, forming a display device. Claim 8 A display device comprising: a lower substrate that is stretchable and includes a display area and a non-display area; a plurality of first plate patterns disposed on the lower substrate and overlapping the display area; a plurality of subpixels disposed on the upper portion of each of the plurality of first plate patterns; and a plurality of wiring portions disposed between the plurality of first plate patterns, wherein the plurality of wiring portions include a plurality of straight portions configured in a straight shape and a plurality of semicircular portions configured in a semicircular shape, and at least one of the plurality of straight portions is disposed spaced apart from the plurality of first plate patterns with the plurality of semicircular portions in between. Claim 9 A display device according to claim 8, wherein the plurality of wiring sections comprises: a plurality of first wiring patterns disposed on the lower substrate and connecting the plurality of first plate patterns to each other; and a plurality of connecting wires disposed on the upper portion of the plurality of first wiring patterns and electrically connected to the plurality of subpixels. Claim 10 In paragraph 8, a display device wherein the arc portion of each of the plurality of semicircular portions is arranged facing the same direction as the elongation direction of the plurality of wiring portions. Claim 11 A display device according to claim 8, wherein in a wiring section extending in a first direction among the plurality of wiring sections, the arc portion of the plurality of semicircles is arranged toward the first direction, and in a wiring section extending in a second direction perpendicular to the first direction among the plurality of wiring sections, the arc portion of the plurality of semicircles is arranged toward the second direction. Claim 12 A display device in which, in paragraph 11, some of the plurality of semicircular portions are arranged such that their arc portions face each other. Claim 13 In claim 8, a display device wherein each arc portion of the plurality of semicircular portions is arranged facing a direction inclined with respect to the elongation direction of the wiring portion. Claim 14 A display device according to claim 8, wherein among the plurality of wiring sections, the wiring section extending in a first direction and the wiring section extending in a second direction perpendicular to the first direction are arranged such that the arc portions of the plurality of semicircles are oriented toward a direction different from the first direction and the second direction. Claim 15 A display device in which, in each of the plurality of wiring sections, the plurality of straight sections and the plurality of semicircular sections are alternately connected. Claim 16 In claim 8, a display device wherein each of the plurality of wiring sections is connected to one of the plurality of straight sections and the plurality of semicircular sections. Claim 17 In claim 8, the plurality of wiring sections further include a plurality of quadrant sections configured in a quadrant shape, and each of the plurality of quadrant sections is connected to any one of the plurality of straight sections, the plurality of semicircles and the plurality of quadrant sections, a display device. Claim 18 A display device in which, in each of the plurality of wiring sections, either one of the plurality of quadrant sections or the plurality of semicircles is connected between each of the plurality of straight sections. Claim 19 A display device according to claim 17, wherein one of the plurality of quadrant sections is positioned between the plurality of straight sections to form a vertical structure, and at least a portion of the plurality of first plate patterns extends toward the vertical structure. Claim 20 A display device according to claim 8, wherein the wiring portion extending in the first direction among the plurality of wiring portions includes five or more of the plurality of straight portions and four or more of the plurality of semicircular portions. Claim 21 A display device according to claim 8, wherein each of the plurality of straight sections included in at least some of the plurality of wiring sections has a length longer than the radius of each of the plurality of semicircular sections.

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