Method of manufacturing the mask mask and deposition apparatus including the mask

Abstract

A deposition apparatus comprises a chamber, a deposition source disposed inside the chamber, a frame having a plurality of frame openings defined therein, a mask disposed on the frame having a plurality of deposition holes defined therein, a mask assembly including a welding stick disposed on the mask, and a base substrate disposed on the mask assembly, wherein the frame has a welding groove defined along the edge of the frame in the thickness direction of the frame with a portion removed, and the welding stick overlaps with the welding groove.

Description

Technology Field

[0001] The present invention relates to a method for manufacturing a mask and a deposition apparatus including a mask, and more specifically, to a method for manufacturing a mask with an improved aperture ratio and a deposition apparatus including a mask. Background Technology

[0002] Generally, in a light-emitting display device, a light-emitting element is disposed for each pixel. The light-emitting element includes a light-emitting layer disposed between spaced electrodes. The light-emitting layers included in the pixels can be divided into multiple groups.

[0003] A mask assembly is used to deposit multiple groups of light-emitting layers on a working substrate. The mask assembly may include a frame, a support, and a mask. Patterned light-emitting layers can be formed by placing a working substrate on the mask and then depositing a light-emitting material onto the working substrate. The problem to be solved

[0004] The present invention relates to a method for manufacturing a mask comprising a base layer containing an organic material and a metal layer containing a metal, and aims to provide a method for manufacturing a mask and a mask assembly with an improved aperture ratio by removing a tip portion generated during the process of patterning the metal layer. means of solving the problem

[0005] A deposition apparatus according to the present invention comprises a chamber, a deposition source disposed inside the chamber, a frame having a plurality of frame openings defined therein, a mask disposed on the frame having a plurality of deposition holes defined therein, a mask assembly including a welding stick disposed on the mask, and a base substrate disposed on the mask assembly, wherein the frame has a welding groove defined along the edge of the frame in the thickness direction of the frame, and the welding stick overlaps with the welding groove.

[0006] The mask may be characterized in that it includes a base layer in which first openings are defined, a first surface in contact with the base substrate and a second surface opposite to the first surface, and a metal layer disposed on the second surface in which second openings are defined, wherein one of the deposition holes is defined by a first opening and a second opening that overlap each other among the first openings and the second openings, and the width of the first opening is smaller than the width of the second opening.

[0007] A portion of the second surface may be characterized as being exposed from the metal layer by the second opening.

[0008] The first side of the base layer defining the first opening may be inclined from the first side, and the second side of the metal layer defining the second opening may be inclined from the second side in the same direction as the first side.

[0009] In cross-section, each of the first openings and the second openings may be characterized as having a trapezoidal shape.

[0010] The welding stick is welded to the frame with the mask in between, and the welding stick may be characterized by being positioned inside the welding groove and providing a flat surface on which the base substrate is positioned together with the first surface.

[0011] When the welding stick and the frame are welded, the mask among the masks that overlaps with the welding stick may be characterized by being placed inside the welding groove.

[0012] The above mask may be characterized by further including an inorganic layer disposed between the base layer and the metal layer, with openings defined between them.

[0013] One of the deposition holes may be defined by a first opening, an intermediate opening, and a second opening that overlap each other among the first openings, the intermediate openings, and the second openings, and the width of the intermediate opening may be larger than the first opening and smaller than the second opening.

[0014] The above deposition equipment may be characterized by further including a magnetic plate disposed on the mask assembly that forms a magnetic force with the mask.

[0015] The above frame includes a first bulkhead section and a second bulkhead section extending in directions intersecting each other, and

[0016] The above frame openings may be characterized by being partitioned by the first bulkhead and the second bulkhead.

[0017] The above deposition source may be characterized by including an organic material, and by vaporizing the organic material and spraying it into the frame openings.

[0018] The above base layer may be characterized by comprising an organic material, and the metal layer may be characterized by comprising any one of aluminum, copper, and a transparent conductive oxide.

[0019] The above masks may be provided in plurality and arranged along a first direction, each extending along a second direction intersecting the first direction, and the welding stick may be characterized by extending in the first direction and being positioned to overlap with one end and the end of each of the masks.

[0020] A mask manufacturing method according to the present invention comprises the steps of: providing a working substrate having an initial base layer comprising an organic material and an initial metal layer formed on the initial base layer and comprising a metal; patterning the initial metal layer through a first photolithography process to form an initial opening; etching the initial base layer to form a base layer having a first opening defined therein that overlaps with the initial opening; and patterning the initial metal layer adjacent to the initial opening through a second photolithography process to form a metal layer having a second opening defined therein that overlaps with the first opening, wherein in one direction, the width of the first opening is formed to be greater than the width of the initial opening and smaller than the width of the second opening.

[0021] The base layer may be characterized by including a first surface and a second surface facing the second surface and having the metal layer formed thereon, and a portion of the base layer adjacent to the first opening being exposed from the metal layer by the second opening.

[0022] The first side of the base layer defining the first opening may be inclined from the first side, and the second side of the metal layer defining the second opening may be inclined from the second side in the same direction as the first side.

[0023] The first aspect above may be characterized as being a curved surface.

[0024] The above base layer may be characterized by comprising an organic material, and the metal layer may be characterized by comprising any one of aluminum, copper, and a transparent conductive oxide.

[0025] The first opening and the second opening may form a single deposition hole, and the deposition hole may be provided in multiple numbers having different shapes. Effects of the invention

[0026] The welding groove defined in the frame according to the present invention provides a space to accommodate the welding stick and the mask even when the welding stick is placed on the mask and welded to the frame with the base substrate in between, thereby allowing one side of the mask in contact with the base substrate and one side of the welding stick to provide a flat surface. Accordingly, the base substrate can be stably seated on the frame to perform a uniform deposition process.

[0027] In addition, the mask manufacturing method according to the present invention can provide a mask manufacturing method with increased deposition efficiency by adding a process of removing the tip portion. Brief explanation of the drawing

[0028] FIG. 1 is a plan view illustrating a deposition facility according to one embodiment of the present invention. FIG. 2a is a plan view illustrating a mask assembly according to one embodiment of the present invention. FIG. 2b is an exploded perspective view of a mask assembly according to one embodiment of the present invention. FIG. 3 is a plan view of a mask according to one embodiment of the present invention. FIG. 4 is a cross-sectional view of a display panel according to one embodiment of the present invention. FIG. 5 is a plan view of a deposition area according to one embodiment of the present invention. Figure 6 is a cross-sectional view of a mask cut along I-I' of Figure 3. FIG. 7 is a cross-sectional view of a mask according to one embodiment of the present invention. FIG. 8a is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 8b is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 8c is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 8d is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 8e is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 9a is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 9b is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. FIG. 9c is a cross-sectional view of a mask manufacturing method according to one embodiment of the present invention. Specific details for implementing the invention

[0029] In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "combined" with another component, it means that it may be directly placed / connected / combined with the other component, or that a third component may be placed between them.

[0030] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the effective illustration of the technical content.

[0031] "And / or" includes all one or more combinations that the associated configurations can define.

[0032] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0033] Additionally, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0034] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Additionally, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and are explicitly defined herein unless interpreted in an ideal or overly formal sense.

[0035] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0036] FIG. 1 is a plan view illustrating a deposition apparatus according to an embodiment of the present invention. FIG. 2a is a plan view illustrating a mask assembly according to an embodiment of the present invention. FIG. 2b is an exploded perspective view of a mask assembly according to an embodiment of the present invention. FIG. 3 is a plan view of a mask according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0037] Referring to FIGS. 1 to 2b, a deposition apparatus (EA) according to the present invention may include a chamber (CH), a deposition source (ES), a mounting unit (HM), a mask assembly (MSA), a base substrate (BS), a pressurizing unit (PM), and a transfer unit (DM). The deposition apparatus (EA) may be an apparatus for depositing an organic material or a conductive material, etc., on a base substrate (BS).

[0038] The chamber (CH) provides an internal space where a deposition process can be performed. In the internal space of the chamber (CH), a deposition source (ES), a mounting section (HM), a mask assembly (MSA), a base substrate (BS), a pressurizing section (PM), and a transfer rod (ML) of a transfer section (DM) can be arranged.

[0039] A deposition source (ES) provides a deposition material to a base substrate (BS). For example, the deposition source (ES) can evaporate a predetermined deposition material, such as an organic material or a conductive material, in a direction toward a mask (MS). At this time, the deposition material can pass through a mask assembly (MSA) and be deposited on the base substrate (BS). At this time, the deposition source (ES) can be implemented by heating the deposition material to a high temperature to evaporate it.

[0040] Although not shown, the deposition equipment (EA) may further include a transfer means for moving the deposition source (ES) in a horizontal direction (D1, D2) or a vertical direction (D3).

[0041] The mounting portion (HM) may be positioned on the side wall of the chamber (CH) to support the mask assembly (MSA). However, it is not limited thereto, and the shape, position, and number of the mounting portion (HM) are not limited to any one embodiment as long as they support the mask assembly (MSA).

[0042] The mask assembly (MSA) may be supported on a seating portion (HM). The mask assembly (MSA) may include a frame (SP), a mask (MS), and a welding stick (WB).

[0043] The frame (SP) can be seated on the seating portion (HM). The frame (SP) can be seated on the seating portion (HM) to support the mask (MS). The frame (SP) is positioned at the bottom of the mask (MS) to prevent sagging caused by the load of the mask (MS).

[0044] The frame (SP) according to the present embodiment may include a body portion (SP-B), a first partition portion (SP-1), and a second partition portion (SP-2). The body portion (SP-B) may have a rectangular frame extending in a first direction (D1) and a second direction (D2).

[0045] The first bulkhead section (SP-1) is provided in multiple numbers, and each can extend in a first direction (D1). The first bulkhead sections are arranged in a second direction (D2), and the first bulkhead sections can be connected to a body section (SP-B).

[0046] The second bulkhead section (SP-2) is provided in multiple numbers, each of which can extend in the second direction (D2). The second bulkhead sections are arranged in the first direction (D1), and the first bulkhead sections can be connected to the body section (SP-B).

[0047] The space formed by the intersection of the first partition section (SP-1) and the second partition section (SP-2) is defined as a frame opening (SP-OP). The frame opening (SP-OP) may correspond to a deposition area (VA) of one of the base substrates (BS). The deposition area (VA) on the base substrate (BS) where the deposition material is deposited may provide a single display cell unit.

[0048] In the frame (SP) according to the present invention, a welding groove (SP-H) can be defined along the edge of the frame (SP) in a third direction (D3) where a part of the frame (SP) is removed. The welding groove (SP-H) may overlap with the welding stick (WB). The welding groove (SP-H) may be formed in the body portion (SP-B) of the frame (SP).

[0049] In this embodiment, the welding groove (SP-H) may be formed as a square-shaped groove extending along the first direction (D1). However, it is not limited thereto, and the shape of the welding groove (SP-H) in cross-section may be circular, elliptical, or polygonal, and is not limited to any one of these.

[0050] The welding groove (SP-H) is positioned at both ends along the second direction (D2) and may extend in the first direction (D1). However, it is not limited thereto, and the welding groove (SP-H) may be formed in the body part (SP-B) to correspond to the shape and number of welding sticks (WB), and is not limited to any one.

[0051] As illustrated in FIG. 2a, a welding stick (WB) can be welded and joined to a frame (SP) with a base substrate (BS) in between. At this time, a welding stick (WB) and a mask (MS) overlapping with the welding stick (WB) can be accommodated in the welding groove (SP-H). The mask (MS) according to the present invention may include a flexible material.

[0052] The welding groove (SP-H) provides a space to accommodate the welding stick (WB) and the mask (MS) even when the welding stick (WB) is placed on the mask (MS) and welded to the frame (SP) with the base substrate (BS) in between, thereby allowing one side of the mask (MS) in contact with the base substrate (BS) and one side of the welding stick (WB) to provide a flat surface (FS). Accordingly, the base substrate (BS) can be stably seated on the frame (SP), enabling a uniform deposition process.

[0053] A welding stick (WB) can be placed on a mask (MS). The welding stick (WB) can overlap with multiple provided masks and can be placed overlapping with a welding groove (SP-H) to be welded to the frame (SP) with the masks in between. The material, shape, and number of welding sticks (WB) can generally be varied as required for welding, and accordingly, the shape and position of the welding groove (SP-H) can also be varied.

[0054] A plurality of masks (MS) may be provided, each extending in a second direction (D2) and arranged in a first direction (D1). A plurality of deposition holes (MS-OP) may be defined in each of the masks (MS). A deposition material supplied from a deposition source (ES) may be provided on one side of a base substrate (BS) through the deposition holes (MS-OP).

[0055] The mask (MS) according to the present invention may include a flexible material. The mask (MS) may be provided in multiple layers. One layer of the mask (MS) may include an organic material and the other layer may include a metal. Accordingly, depending on the flexible nature of the mask (MS), it may be accommodated in the welding groove (SP-H) together with the welding stick (WB). A detailed description of the layer structure of the mask (MS) will be provided later.

[0056] Referring to FIG. 3, the mask (MS) may include an upper surface (MS-B) in contact with a base substrate (BS) and a back surface (MS-U) in contact with a frame (SP). Deposition holes (MS-OP) formed in the region overlapping with the partitions (SP-1, SP-2) of the frame (SP) may not allow the deposition material to pass through.

[0057] Figure 3 illustrates deposition holes (MS-OP) arranged in a square shape as an example, but is not limited thereto. The deposition holes (MS-OP) may have the same shape and different shapes, or different shapes and different areas, and are not limited to any one embodiment.

[0058] The base substrate (BS) may be a parent substrate to be deposited. The base substrate (BS) may include deposition regions (VA). A plurality of deposition regions (VA) are a first method incense They can be arranged in a matrix shape along (D1) and the second direction (D2). Multiple deposition regions (VA) can be partitioned by partitions (SP-1, SP-2) of the frame (SP). Multiple deposition regions (VA) can be cut into individual display cell units in a subsequent process.

[0059] Again, referring to FIG. 1, the pressurizing part (PM) may include a magnetic plate (MP) and a support plate (YK). Although not shown, the pressurizing part (PM) may further include a cooling plate disposed between the base substrate (BS) and the support plate (YK).

[0060] A cooling plate (not shown) may be placed between a base substrate (BS) and a support plate (YK). The cooling plate provides a function of cooling the base substrate (BS) or the mask (MS) so as to prevent the base substrate (BS) or the mask (MS) from overheating during the deposition process. Accordingly, deformation of the base substrate (BS) can be prevented. The cooling plate may be equipped with a cooling line through which cooling water or cooled air is injected.

[0061] The magnetic plate (MP) may be placed inside the support plate (YK). However, it is not limited thereto, and as long as the magnetic plate (MP) is placed on the mask (MS) and magnetically combines the mask (MS) and the base substrate (BS), its position, shape, and number are not limited to any one.

[0062] The magnetic plate (MP) forms a magnetic force when the base substrate (BS) and the mask (MS) are in close contact, thereby attracting the mask (MS) containing metal. Accordingly, the bonding force between the base substrate (BS) and the mask (MS) can be increased.

[0063] The magnetic plate (MP) can prevent lifting caused by the difference in curvature between the base substrate (BS) and the mask (MS), thereby preventing shadowing, which is a deposition defect. The magnetic plate (MP) can be provided as either a permanent magnet or an electromagnet.

[0064] The support plate (YK) can accommodate the magnetic plate (MP). The support plate (YK) is combined with the transfer unit (DM) to bring the magnetic plate (MP) into contact with or separate it from the base substrate (BS).

[0065] The transfer unit (DM) is connected to the pressurizing unit (PM). The transfer unit (DM) may include a transfer rod (ML) and a transfer body (MC). The transfer body (MC) can transfer the pressurizing unit (PM) in a third direction (D3), i.e., an upward / downward direction, via the transfer rod (ML).

[0066] For example, the transfer body (MC) may be positioned outside the chamber (CH). The transfer body (MC) may be implemented as either a cylinder or a motor. For example, if the transfer body (MC) is a cylinder, the transfer rod (ML) may be a piston. If the transfer body (MC) is a motor, the transfer rod (ML) may be implemented as a ball screw shaft that can move up and down according to the rotation of the motor. However, it is not limited thereto, and is not limited to either one as long as the transfer part (DM) is a device capable of moving the pressurizing part (PM).

[0067] FIG. 4 is a cross-sectional view of a display panel according to an embodiment of the present invention. Some of the components of the display panel (DP) shown in FIG. 4 may be components formed through the deposition equipment (EA) described in FIG. 1 to 3. For example, the base substrate (BS) described in FIG. 1 to 3 may be a component included in the base substrate (BS) of the display panel (DP).

[0068] A grayscale display layer of a display panel (DP) according to one embodiment may include an organic light-emitting layer. Accordingly, the display panel (DP) may be an organic light-emitting display panel.

[0069] An organic light-emitting display panel comprises a base substrate (BS) and an encapsulation substrate (US). The base substrate (BS) comprises a first substrate (BL1), a circuit element layer (DP-CL) disposed on the first substrate (BL1), a display element layer (DP-OLED) disposed on the circuit element layer (DP-CL), and a cover layer (CL) disposed on the display element layer (DP-OLED). The encapsulation substrate (US) may comprise a second substrate (BL2), a black matrix layer (BM) disposed on the second substrate (BL2), and a color control layer (CCL).

[0070] The circuit element layer (DP-CL) may include a plurality of insulating layers, a semiconductor pattern, a conductive pattern, a signal line, etc. An insulating layer, a semiconductor layer, and a conductive layer are formed on a first substrate (BL1) by methods such as coating or deposition. Subsequently, the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned by photolithography. In this way, the semiconductor pattern, conductive pattern, signal line, etc. included in the circuit element layer (DP-CL) and the display element layer (DP-OLED) are formed.

[0071] The first substrate (BL1) may include a synthetic resin film. Additionally, the first substrate (BL1) may include a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, etc.

[0072] A buffer layer (BFL) is disposed on a first substrate (BL1). The buffer layer (BFL) improves the bonding strength between the first substrate (BL1) and the semiconductor pattern. The buffer layer (BFL) may include a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer may be stacked alternately.

[0073] A semiconductor pattern is disposed on a buffer layer (BFL). The semiconductor pattern may include polysilicon. However, it is not limited thereto, and the semiconductor pattern may include amorphous silicon or metal oxide.

[0074] A semiconductor pattern may include a doped region and a non-doped region. The doped region may be doped with an N-type dopant or a P-type dopant. A P-type transistor includes a doped region doped with a P-type dopant.

[0075] The doped region has greater conductivity than the undoped region and effectively functions as an electrode or signal line. The undoped region effectively corresponds to the active (or channel) of the transistor. In other words, a portion of the semiconductor pattern may be the active of the transistor, another portion may be the source or drain, and yet another portion may be a connecting electrode or a connecting signal line.

[0076] A transistor (T1) is placed on a buffer layer (BFL). The source (S1), active (A1), and drain (D1) of the transistor (T1) are formed from a semiconductor pattern. Figure 4 shows a portion of a connection signal line (SCL) formed from a semiconductor pattern. The connection signal line (SCL) can be connected to the drain (D1) of the transistor (T1) on a plane.

[0077] A first insulating layer (10) to a sixth insulating layer (60) is disposed on a buffer layer (BFL). The first insulating layer (10) to the sixth insulating layer (60) may be an inorganic layer or an organic layer. A gate (G1) is disposed on the first insulating layer (10). An upper electrode (UE) may be disposed on the second insulating layer (20). A first connecting electrode (CNE1) may be disposed on the third insulating layer (30).

[0078] The first connecting electrode (CNE1) can be connected to a connecting signal line (SCL) through a contact hole (CNT-1) penetrating the first to third insulating layers (10 to 30). A second connecting electrode (CNE2) can be disposed on the fifth insulating layer (50). The second connecting electrode (CNE2) can be connected to the first connecting electrode (CNE1) through a contact hole (CNT-2) penetrating the fourth insulating layer (40) and the fifth insulating layer (50).

[0079] A light-emitting element (OLED) is placed on the sixth insulating layer (60). A first electrode (AE) is placed on the sixth insulating layer (60). The first electrode (AE) is connected to a second connecting electrode (CNE2) through a contact hole (CNT-3) that penetrates the sixth insulating layer (60).

[0080] The display element layer (DP-OLED) includes a light-emitting element (OLED) and a pixel defining layer (PDL). For example, the pixel defining layer (PDL) may be an organic layer. The light-emitting element (OLED) includes a first electrode (AE), a hole control layer (HCL), a light-emitting layer (EML), an electron control layer (ECL), and a second electrode (CE).

[0081] A pixel defining film (PDL) is disposed on a sixth insulating layer (60). A display opening (OP) is defined in the pixel defining film (PDL). The display opening (OP) exposes at least a portion of the first electrode (AE). In one embodiment of the present invention, the pixel defining film (PDL) may have a black color. The pixel defining film (PDL) may include a black coloring agent. The pixel defining film (PDL) may include a black dye or a black pigment mixed in a base resin.

[0082] The display panel (DP) can be divided into a light-emitting region (PXA) and a non-light-emitting region (NPXA) adjacent to the light-emitting region (PXA). Practically, the light-emitting region (PXA) can be defined to correspond to the area of ​​the first electrode (AE) exposed by the display opening (OP).

[0083] A hole control layer (HCL) can be placed in common in the emitting region (PXA) and the non-emitting region (NPXA). The hole control layer (HCL) includes a hole transport layer and may further include a hole injection layer. An emitting layer (EML) is placed on the hole control layer (HCL). The emitting layer (EML) can be placed in the region corresponding to the display opening (OP).

[0084] An electronic control layer (ECL) is disposed on the light-emitting layer (EML). The electronic control layer (ECL) includes an electron transport layer and may further include an electron injection layer. A second electrode (CE) is disposed on the electronic control layer (ECL).

[0085] A cover layer (CL) is disposed on the second electrode (CE). The cover layer (CL) may include a plurality of thin films. As in the present embodiment, the cover layer (CL) may include a capping layer and a thin film encapsulation layer.

[0086] The second substrate (BL2) is spaced apart from the cover layer (CL). The second substrate (BL2) may be any one of a glass substrate, a plastic substrate, and a substrate including polyimide.

[0087] The color control layer (CCL) can transmit a first color light or convert the first color light into a second color light or a third color light depending on the color of the light provided by the light-emitting element (OLED). The color control layer (CCL) may include quantum dots. In this case, the first color light may be blue light.

[0088] The black matrix layer (BM) may overlap with the non-luminescent region (NPXA). The black matrix layer (BM) may have a black color. The black matrix layer (BM) may include a light-absorbing material, but is not limited to any one of them.

[0089] The deposition equipment (EA) of the present invention can be used to form a light-emitting layer (EML) containing an organic material among the components included in a light-emitting element (OLED). However, it is not limited thereto, and among the components formed on the base layers (BL1, BL2) of a display panel (DP), the components formed by the deposition process can be formed by the deposition equipment (EA) of the present invention and are not limited to any one embodiment.

[0090] FIG. 5 is a plan view of a deposition area according to one embodiment of the present invention. FIG. 5 explains a method for forming a light-emitting layer (EML, see FIG. 5) on each of the display openings (OP-R, OP-G, OP-B) of the pixel defining film (PDL) shown in FIG. 4.

[0091] As illustrated in FIG. 5, three types of display openings (OP-R, OP-G, OP-B) may be formed in the pixel defining film (PDL). The three types of display openings (OP-R, OP-G, OP-B) may include a first display opening (OP-G), a second display opening (OP-R), and a third display opening (OP-B) distinguished by area.

[0092] The areas of the first display opening (OP-G), the second display opening (OP-R), and the third display opening (OP-B) are proportional to the light-emitting area of ​​the corresponding pixel (or the area of ​​the first electrode). In this embodiment, the first display opening (OP-G) may be a pixel that provides a green color, the second display opening (OP-R) may be a pixel that provides a red color, and the third display opening (OP-B) may be a pixel that provides a blue color.

[0093] Different masks may be used to form the light-emitting layer of the green light-emitting element, the light-emitting layer of the red light-emitting element, and the light-emitting layer of the blue light-emitting element corresponding to the first display opening (OP-G), the second display opening (OP-R), and the third display opening (OP-B), respectively.

[0095] FIG. 6 is a cross-sectional view of a mask cut along I-I' of FIG. 3. Identical or similar reference numerals are used for configurations identical or similar to FIG. 1 to 5, and redundant descriptions are omitted.

[0096] A mask (MS) according to the present invention may include an upper surface (MS-B) in contact with a base substrate (BS, see FIG. 1) and a back surface (MS-U) facing the upper surface (MS-B) and in contact with a frame (SP, see FIG. 1). The mask (MS) may include a base layer (PI) and a metal layer (EL).

[0097] A base layer (PI) may have a first opening (PI-OP) defined therein. The first opening (PI-OP) may consist of a first side (PI-S) that is exposed by penetrating the base layer (PI) in a third direction (D3). The base layer (PI) may include a first surface in contact with a base substrate (BS) and a second surface opposite to the first surface on which the metal layer is disposed. The first surface may substantially be provided as the upper surface (MS-B) of the mask (MS). The first side (PI-S) may be inclined from the first surface. The first opening (PI-OP) may be provided in multiple numbers.

[0098] In the present invention, the base layer (PI) may include an organic material. For example, the base layer (PI) may include at least one of polyimide, polycarbonate, polyethylene naphthalene (PEN), and polyethylene terephthalate (PETE). Accordingly, the base layer (PI) may have flexible properties.

[0099] A second opening (EL-OP) may be defined in the metal layer (EL). The second opening (EL-OP) may consist of a second side (EL-S) exposed by penetrating the metal layer (EL) in a third direction (D3). In cross-section, the second side (EL-S) may be inclined from the second surface of the base layer (PI). The direction in which the second side (EL-S) is inclined may be the same direction as the direction in which the first side (PI-S) is inclined from the first surface. Multiple second openings (EL-OP) may be provided.

[0100] In the present invention, the metal layer (EL) may include a metal. For example, the metal layer (EL) may include any one of aluminum (Al), copper (Cu), and a transparent conductive oxide. Accordingly, the metal layer (EL) may be combined with the base layer (PI) and the magnetic plate (MP).

[0101] A portion (PI-E) of the second surface of the base layer (PI) according to the present invention may be exposed from the metal layer (EL) by a second opening (EL-OP). This may be formed by additionally removing the metal layer (EL) by an additional process of removing the tip (TIP) portion of the metal layer (EL) described later.

[0102] The deposition holes (MS-OP) defined in the mask (MS) can be defined by one first opening (PI-OP) and one second opening (EL-OP) overlapping in the third direction (D3).

[0103] According to the present embodiment, the width of the first opening (PI-OP) in the first direction (D1) may be smaller than the width of the second opening (EL-OP). Additionally, the shapes of the first opening (PI-OP) and the second opening (EL-OP) in cross-section may be trapezoidal.

[0105] FIG. 7 is a cross-sectional view of a mask according to an embodiment of the present invention. Identical or similar reference numerals are used for configurations identical or similar to FIG. 6, and redundant descriptions are omitted.

[0106] A mask (MS-1) according to the present invention may include an upper surface (MS-B) in contact with a base substrate (BS, see FIG. 1) and a back surface (MS-U) facing the upper surface (MS-B) and in contact with a frame (SP, see FIG. 1). The mask (MS-1) may include a base layer (PI), an inorganic layer (BR), and a metal layer (EL).

[0107] A base layer (PI) may have a first opening (PI-OP) defined therein. The first opening (PI-OP) may consist of a first side (PI-S) that is exposed by penetrating the base layer (PI) in a third direction (D3).

[0108] In the present invention, the base layer (PI) may include an organic material. For example, the base layer (PI) may include at least one of polyimide, polycarbonate, polyethylene naphthalene (PEN), and polyethylene terephthalate (PETE). Accordingly, the base layer (PI) may have flexible properties. Accordingly, the base layer (PI) may have flexible properties.

[0109] An inorganic layer (BR) may be placed between the base layer (PI) and the metal layer (EL). The inorganic layer (BR) may be placed between the base layer (PI) and the metal layer (EL) to increase the bonding strength between the base layer (PI) and the metal layer (EL). An inter-opening (BR-OP) may be defined in the inorganic layer (BR). The inter-opening (BR-OP) may consist of an exposed inter-side (BR-S) through which the inorganic layer (BR) penetrates in a third direction (D3). In this embodiment, the inter-side (BR-S) may be aligned with the first side (PI-S) and inclined from the top surface (MS-B).

[0110] A second opening (EL-OP) may be defined in the metal layer (EL). The second opening (EL-OP) may consist of a second side (EL-S) exposed by penetrating the metal layer (EL) in a third direction (D3).

[0111] In the present invention, the metal layer (EL) may include a metal. For example, the metal layer (EL) may include any one of aluminum (Al), copper (Cu), and a transparent conductive oxide. Accordingly, the metal layer (EL) may be combined with the base layer (PI) and the magnetic plate (MP).

[0112] A portion (BR-E) of the inorganic layer (BR) according to the present invention may be exposed from the metal layer (EL) by a second opening (EL-OP).

[0113] The deposition holes (MS-OP) defined in the mask (MS) can be defined by one first opening (PI-OP), one intermediate opening (BR-OP), and one second opening (EL-OP) overlapping in the third direction (D3).

[0114] According to the present embodiment, the width of the inter-opening (BR-OP) in the first direction (D1) may be greater than the width of the first opening (PI-OP) and smaller than the width of the second opening (EL-OP). Additionally, in cross-section, the shape of each of the first opening (PI-OP), the inter-opening (BR-OP), and the second opening (EL-OP) may be a trapezoidal shape.

[0116] FIG. 8a is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 8b is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 8c is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 8d is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 8e is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 9a is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 9b is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. FIG. 9c is a cross-sectional view of a method for manufacturing a mask according to an embodiment of the present invention. Hereinafter, a method for manufacturing a mask according to an embodiment of the present invention will be described with reference to FIG. 8a to 9c.

[0117] Identical or similar reference numerals are used for configurations identical or similar to those described in FIGS. 1 to 6, and redundant descriptions are omitted.

[0118] Referring to FIG. 8a, the mask manufacturing method according to the present invention may include the step of forming an initial base layer (PI-A) on a working substrate (BG). The initial base layer (PI-A) may be formed by applying an organic material onto the working substrate (BG).

[0119] Then, referring to FIG. 8b, the mask manufacturing method according to the present invention may include the step of forming an initial metal layer (EL-A). The initial metal layer (EL-A) may be formed on an initial base layer (PI-A). The initial base layer (PI-A) may be formed by applying any one of aluminum (Al), copper (Cu), and a transparent conductive oxide onto the initial base layer (PI-A).

[0120] Referring to FIGS. 8c and 8d, the mask manufacturing method according to the present invention may include the step of forming an initial opening. The initial opening (EL-OT) can be formed by patterning an initial metal layer (EL-A) through a first photolithography process. At this time, the first photolithography process can form the initial opening (EL-OT) by exposing, developing, and etching the initial metal layer (EL-A) through a first photomask (MK1) equipped with a photo opening (MK-OP) and a first photoresist (PR1).

[0121] Then, referring to FIG. 8e, the mask manufacturing method according to the present invention may include the step of etching an initial base layer to form a base layer in which a first opening is defined.

[0122] A first opening (PI-OP) can be formed by etching an initial base layer (PI-A) using an initial metal layer (EL-A) as a mask. At this time, the etching method can be performed using either a wet etch or a dry etch method.

[0123] Due to a difference in etching rate during the process of forming a first opening (PI-OP) in the base layer (PI), the side of the initial metal layer (EL-A) defining the initial opening (EL-OT) may protrude further in the first direction (D1) than the side of the base layer (PI) defining the first opening (PI-OP). At this time, the side of the initial metal layer (EL-A) protruding more than the side of the base layer (PI) is defined as the tip (TIP) portion, and may act as an obstruction factor to the deposition material being incident on the base substrate (BS) during the deposition process, which may cause a shadowing phenomenon, a deposition defect.

[0124] According to the mask manufacturing method of the present invention, a process of removing the tip (TIP) portion of the initial metal layer (EL-A) may be further included.

[0125] Referring to FIG. 9a and FIG. 9b, a mask manufacturing method according to the present invention may include the step of removing a tip (TIP) portion of an initial metal layer to form a metal layer in which a second opening is defined.

[0126] A second opening (EL-OP) defined in the metal layer (EL) can be formed by patterning the initial metal layer (EL-A), where the initial opening (EL-OT) is defined, through a second photolithography process. At this time, the second photolithography process can form the second opening (EL-OP) by exposing, developing, and etching the initial metal layer (EL-A) through a second photomask (MK2) equipped with a photo opening that overlaps with the initial opening (EL-OT) and a second photoresist (PR2).

[0127] The second opening (EL-OP) can be formed by removing the tip (TIP) portion from the initial metal layer (EL-A). The width of the second opening (EL-OP) in the first direction (D1) may be greater than the maximum width of the first opening (PI-OP). The first opening (PI-OP) overlapping the second opening (EL-OP) in the third direction (D3) may form a deposition hole (MS-OP) of the mask (MS).

[0128] Then, referring to FIG. 9c, a mask (MS) according to the present invention can be manufactured by removing the mask (MK2) from the metal layer (EL) and removing the working substrate (BG) from the base layer (PI).

[0129] The mask manufacturing method according to the present invention can provide a mask manufacturing method with increased deposition efficiency by adding a process of removing a tip portion.

[0131] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as described in the claims set forth below.

[0132] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0134] CH: Chamber PM: Pressurized part YK: York Plate MP: Magnetic Plate MSA: Mask Assembly MS: Mask SP: Frame SP-H: Welding groove BS: Base board ES: Deposition source SP-1, SP-2: Bulkhead sections WB: Welding stick

Claims

Claim 1 A deposition apparatus comprising: a chamber; a deposition source disposed inside the chamber; a frame having a plurality of frame openings defined therein; a mask disposed on the frame having a plurality of deposition holes defined therein; and a welding stick disposed on the mask; and a base substrate disposed on the mask assembly, wherein the frame has a welding groove defined therein along the edge of the frame in the thickness direction of the frame, the welding stick overlaps with the welding groove, and the upper surface of the welding stick and the upper surface of the mask spaced apart from the upper surface of the welding stick provide a flat surface on which the base substrate is disposed. Claim 2 A deposition apparatus according to claim 1, wherein the mask comprises a first surface in contact with the base substrate and a second surface opposite to the first surface, a base layer having first openings defined therein, and a metal layer disposed on the second surface having second openings defined therein, wherein one of the deposition holes is defined by a first opening and a second opening that overlap each other among the first openings and the second openings, and the width of the first opening is smaller than the width of the second opening. Claim 3 A deposition apparatus according to claim 2, wherein a portion of the second surface is exposed from the metal layer by the second opening. Claim 4 A deposition apparatus according to claim 2, wherein the first side of the base layer defining the first opening is inclined from the first side, and the second side of the metal layer defining the second opening is inclined from the second side in the same direction as the first side. Claim 5 A deposition apparatus according to claim 4, characterized in that, in cross-section, each of the first openings and the second openings is of a trapezoidal shape. Claim 6 In claim 2, the welding stick is a deposition facility that is welded to the frame with the mask in between. Claim 7 A deposition apparatus characterized in that, in claim 6, when the welding stick and the frame are welded, the mask among the masks that overlaps with the welding stick is placed inside the welding groove. Claim 8 In claim 2, the deposition apparatus is characterized in that the mask further comprises an inorganic layer disposed between the base layer and the metal layer, with openings defined between them. Claim 9 A deposition apparatus according to claim 8, wherein one of the deposition holes is defined by a first opening, an intermediate opening, and a second opening that overlap each other among the first openings, the intermediate openings, and the second openings, and the width of the intermediate opening is larger than the first opening and smaller than the second opening. Claim 10 In claim 1, the deposition apparatus is characterized by further including a magnetic plate disposed on the mask assembly that forms a magnetic force with the mask. Claim 11 A deposition apparatus according to claim 1, wherein the frame includes a first partition and a second partition extending in directions intersecting each other, and the frame openings are partitioned by the first partition and the second partition. Claim 12 A deposition apparatus according to claim 1, wherein the deposition source comprises an organic material, and the deposition source vaporizes the organic material and sprays it into the frame openings. Claim 13 A deposition apparatus characterized in that, in claim 2, the base layer comprises an organic material, and the metal layer comprises any one of aluminum, copper, and a transparent conductive oxide. Claim 14 A deposition apparatus according to claim 1, wherein the masks are provided in plurality and arranged along a first direction, each extending along a second direction intersecting the first direction, and the welding stick extending in the first direction and arranged to overlap with one end and the end of each of the masks. Claim 15 A method for manufacturing a mask comprising: a step of providing a working substrate having an initial base layer containing an organic material and an initial metal layer formed on the initial base layer and containing a metal; a step of patterning the initial metal layer through a first photolithography process to form an initial opening; a step of etching the initial base layer to form a base layer having a first opening defined that overlaps with the initial opening; and a step of patterning the initial metal layer adjacent to the initial opening through a second photolithography process to form a metal layer having a second opening defined that overlaps with the first opening, wherein in one direction, the width of the first opening is formed to be greater than the width of the initial opening and smaller than the width of the second opening. Claim 16 A method for manufacturing a mask according to claim 15, wherein the base layer comprises a first surface and a second surface facing the first surface and having the metal layer formed thereon, and a portion of the base layer adjacent to the first opening is exposed from the metal layer by the second opening. Claim 17 A method for manufacturing a mask according to claim 16, wherein the first side of the base layer defining the first opening is inclined from the first side, and the second side of the metal layer defining the second opening is inclined from the second side in the same direction as the first side. Claim 18 A method for manufacturing a mask according to claim 17, wherein the first side is a curved surface. Claim 19 A method for manufacturing a mask according to claim 15, wherein the base layer comprises an organic material and the metal layer comprises any one of aluminum, copper, and a transparent conductive oxide. Claim 20 A method for manufacturing a mask according to claim 15, wherein the first opening and the second opening constitute a single deposition hole, and the deposition hole is provided in plurality and has different shapes.

Images