Card connector

Abstract

In a card connector (10) that contacts a card (not shown), A plate-shaped base portion (100B) formed of resin; (i) a contact (100T-C) that contacts the card and (ii) a terminal part (100T) having a frame (100T-F) that is connected to the contact and surrounds the contact Includes, The frame (100T-F) of the terminal portion (100T) is fixed to the base portion (100B) by integral molding, and The lowest end surface of the frame (100T-F) and the lowest end surface of the base part (100B) are on the same surface, A card connector (10) is provided.

Description

Technology Field

[0001] The present invention relates to a card connector. More specifically, the present invention relates to the structure of a card connector (card socket) into which a card, such as a memory card or a SIM (Subscriber Identification Module) card, is inserted and electrically connected. Background Technology

[0002] Generally, a mobile communication system for a portable terminal is a system that enables a call between a sender and a receiver when a response is received from a specific portable terminal after transmitting a call message containing the unique number of the portable terminal through the base station's call channel to call the portable terminal.

[0003] However, these portable terminals have undergone many changes and advancements in recent years thanks to the rapid development of the electronics and telecommunications industries. As a result, not only voice calls resulting from the simple transmission and reception of communication signals are being made, but the latest functions such as games, VOD (Video On Demand), electronic dictionaries, MP3 players, photos, and image capture are being added. Furthermore, it has become possible to conduct financial, stock, e-commerce, and various banking transactions after undergoing a user authentication process using the aforementioned mobile communication terminals.

[0004] Here, in order to perform financial, stock, e-commerce, and various banking transactions using the aforementioned portable terminal, a Subscriber Authentication Module (SIM) card containing user information is installed in the portable terminal and used.

[0005] Cards such as memory cards and SIM cards are becoming smaller while retaining the same or additional functions. For example, there is a transition from micro SIM cards to the smaller nano SIM cards.

[0006] A SIM card is a card containing authorization information for using roaming services of a mobile communication terminal or personal information about the user, that is, subscriber information for user identification or authentication. It is configured so that even if a user inserts the SIM card into a portable terminal other than their own mobile communication terminal to use mobile phone services, they can continue to use various information previously used without inconvenience.

[0007] Accordingly, the portable terminal is provided with a connector for mounting the above-mentioned SIM card. This SIM card connector is classified into a method of securing the SIM card using a separate fixing device after contacting it, and a method of mounting the SIM card by a sliding method by providing a cover on the connector.

[0008] Typically, when circuit boards are interconnected, two connectors are used to connect each board via methods such as soldering. These two connectors can be connected to each other; one is a plug connector, and the other is a socket connector (also known as a receptacle connector). Although card connectors may differ somewhat in structure from these typical plug and socket connectors, they are fundamentally trending toward miniaturization and low-profile designs in line with the trend of miniaturization in electronic devices. However, there are currently certain limitations to miniaturizing and reducing the profile of card connectors by simply reducing the pitch or decreasing the size of components.

[0009] Meanwhile, as card connectors have become smaller, it has become more difficult to ensure their durability than before. This is because the components are smaller, making them more susceptible to breakage or deformation from even small forces. The problem to be solved

[0010] The technical problem that the present invention aims to solve is to obtain a miniaturized card connector without reducing the fixing force to the card and / or substrate or its own rigidity.

[0011] The technical problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0012] According to the present invention, in a card connector that contacts a card,

[0013] A plate-shaped base portion formed of resin;

[0014] (i) a contact that contacts the card and (ii) a terminal part having a frame connected to the contact and surrounding the contact.

[0015] Includes,

[0016] The frame of the above terminal part is fixed to the above base part by integral molding, and

[0017] The lowest surface of the above frame and the lowest surface of the above base part are on the same surface,

[0018] A card connector is provided.

[0019] Preferably, the lower surface of the frame is exposed on the lower surface of the base portion.

[0020] Preferably, the terminal portion is,

[0021] (iii) A fixing part formed by bending upward from the side of the above frame

[0022] Includes more.

[0023] Preferably, the fixed part is embedded in the base part. Effects of the invention

[0024] According to the present invention, it is possible to make the thickness of the base portion (100B) thinner compared to comparative examples, etc.

[0025] In the comparative example of FIG. 7b, the terminal portion is mostly composed of contacts (C), and there is a path (frame not shown) connected to the end portion (E). For example, the frame of the comparative example may occupy an area identical or similar to that of the frame (100T-F) of the present invention, but based on the exposed area, the frame (100T-F) of the present invention is larger than the frame (not shown) of the comparative example. Referring to FIG. 3c and the like, the present invention has a structure of "mold-contact (more precisely, frame)" from the top, and more strictly speaking, has a structure of "mold-contact (more precisely, frame)-SMT lead" from the top. An SMT lead is a Surface Mount Technology lead, referring to a lead portion for surface mounting. On the other hand, the comparative example has a structure of "mold-contact (more precisely, frame)-mold" from the top, and more strictly speaking, has a structure of "mold-contact (more precisely, frame)-mold-SMT lead" from the top. In other words, the comparative example inevitably has an additional thickness equivalent to the lower mold, which is absent in the present invention. In other words, the present invention can reduce the thickness equivalent to the lower mold compared to the comparative example.

[0026] In the structure of the comparative example, if the frame (not shown) is modified to simply be exposed at the bottom of the base part (B), it is difficult for the frame (not shown) to be firmly fixed to the base part (B). In other words, there is a possibility that the frame (not shown) may fall off downwards. Therefore, in the comparative example, a mold member (i.e., the base part (B)) must also exist below the frame (not shown).

[0027] In other words, in the present invention, the structure of 'base part (100B)-frame (100T-F) (frame (100T-F) is exposed)' is sufficient (wherein the possibility of detachment is prevented by the fixing part (100T-L)),

[0028] In the comparative example, since the frame (not shown) and the base part (B) are sandwiched from above and below, that is, the structure of 'base part (B)-frame (not shown)-base part (B)', at least the thickness of the lower base part (B) is required.

[0029] This is a significant difference in configuration and effect in the current situation where card connectors (10) are increasingly required to be lighter and lighter as time goes by.

[0030] Meanwhile, as mentioned above, there is room to view that the possibility of the contact (100T-C) detaching increases (fixing force weakens) as much as the mold thickness is reduced compared to the comparative example (i.e., as much as the thickness of the base part (100B) is reduced). However, in the present invention, the terminal part (100T) is provided with a fixing part (100T-L), and by configuring the fixing part (100T-L) to be embedded in the base part (100B), such weakening of the fixing force can be prevented.

[0031] The effects according to the present invention are not limited to those exemplified above, and various other effects are included in this specification. Brief explanation of the drawing

[0032] FIG. 1 is a drawing showing an example of a card connector (10) according to the present invention. FIG. 2 illustrates the upper structure (200) and the lower structure (100) of the card connector (10) of FIG. 1 separately. FIGS. 3a to 3c separately show the lower structure (100) of the card connector (10) of the present invention. Figure 4 shows the lower structure (100) shown in Figure 3a from a different angle. Figure 5 shows a cross-sectional view cut along the line AA' of Figure 4. Figure 6 is a card connector (10) of Figure 1 viewed from a different angle. FIGS. 7a and FIGS. 7b show comparative examples compared to the present invention. Specific details for implementing the invention

[0033] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0034] FIG. 1 is a drawing showing an example of a card connector (10) according to the present invention.

[0035] Figure 1 shows the upper structure (200) and lower structure (100) of a card connector (10).

[0036] In the following description, the distinction between the upper and lower parts is for convenience of explanation, and it is sufficient to interpret it as meaning that they are positioned facing each other. That is, the upper structure (200) does not necessarily have to be on top and the lower structure (100) on the bottom, but for ease of understanding, in the following drawings, the +Z direction is referred to as the upper direction (upper) and the -Z direction as the lower direction (lower).

[0037] The card connector (10) is also called a card socket (10), and a card (SIM card, memory card, etc.) is inserted into the receiving portion, which is the space between the upper structure (200) and the lower structure (100).

[0038] Figure 1 is intended to show the approximate appearance of the upper structure (200) at the top and the lower structure (100) at the bottom being combined, and the structure of each part of the card connector (10) will be explained again in Figure 2, etc.

[0039] FIG. 2 illustrates the upper structure (200) and lower structure (100) separately in the card connector (10) of FIG. 1.

[0040] The actual card connector (10) according to the present invention is as shown in FIG. 1, but for convenience of explanation, if the upper structure (200) and the lower structure (100) are separated by a vertical gap, it is shown as in FIG. 2.

[0041] The upper structure (200) includes a cover (200S) (or shield), a base part (200B), and a terminal part (200T). These are also referred to as the upper cover (200S) (or upper shield), the upper base part (200B), and the upper terminal part (200T), respectively. The upper terminal part (200T) includes an upper contact (200T-C).

[0042] Although it may be somewhat difficult to distinguish between the upper cover (200S) and the upper base part (200B) based solely on the illustration in Fig. 2, the upper base part (200B) has a shape roughly similar to (not necessarily identical to) the lower base part (100B) described later, and surrounds the upper terminal part (200T) by means such as molding, and the structure is such that the upper cover (200S) surrounds the upper base part (200B) (which has a shape roughly similar to the lower base part (100B)).

[0043] The drawing symbol (200B) partially exposed in FIG. 2 does not represent the entire upper base portion (200B) as depicted, but rather a single upper base portion (200B) widely existing below the upper cover (200S) (in a shape similar to that of the lower base portion (100B). That is, the drawing symbol (200B) partially exposed in FIG. 2 shows a partially exposed form in which multiple protrusions of a single upper base portion (200B) are fitted into multiple openings of the upper cover (200S).

[0044] At the bottom of Fig. 2, the lower structure (100) of the card connector (10) (card socket) is shown separately.

[0045] The lower structure (100) includes a base part (100B) and a terminal part (100T).

[0046] Although a separate cover (shield) is not shown for the lower structure (100), if necessary, the lower structure (100) may be covered by an unillustrated lower cover (or lower shield). Although not limited to this, the area covered by the unillustrated lower cover (or lower shield) may be the lower side of the lower structure (100) in FIG. 2.

[0047] The base portion (100B) and terminal portion (100T) of the lower structure (100) are also referred to as the lower base portion (100B) and lower contact portion (100T). The lower terminal portion (100T) includes a lower contact (100T-C).

[0048] The lower base portion (100B) may be called a SIM block insulation base, and may be a resin mold portion formed by, for example, molding. It may be formed from an insulator including resin and epoxy, but is not limited thereto.

[0049] The lower terminal portion (100T) may be called a SIM block SH contact, and as a signal terminal, it is preferably made of a metal material, but is not limited thereto, for example, copper, or a copper alloy with gold plating (nickel under layer).

[0050] For example, the contact (100T-C) of the terminal section (100T) may be composed of four PINs that allow a current of 0.3A, or it may be a terminal that allows a current exceeding 0.3A, for example, up to 5A to function as a power terminal. However, the number of PINs being four is an example. For reference, in the example of FIG. 2, the number of contacts (100T-C) (e.g., signal terminals) is six.

[0051] When a SIM card (or memory card) is inserted, the SIM card is fixed and electrically contacted by the elasticity provided by the upper terminal part (200T) and / or the lower terminal part (100T). The upper terminal part (200T) and / or the lower terminal part (100T) can function, for example, as a signal terminal.

[0052] The following description focuses on the lower structure (100), and such description may also be applied to the upper structure (200) as needed, provided that it is not incompatible with the nature or structure thereof.

[0053] FIGS. 3a to 3c separately show the lower structure (100) of the card connector (10) of the present invention.

[0054] FIG. 3a is a top view of the lower structure (100), and

[0055] FIG. 3b is a view from above with the base portion (100B) removed from the lower structure (100), and

[0056] Fig. 3c shows the lower structure (100) viewed from below.

[0057] Although it is difficult to determine the mutual arrangement relationship between the base part (100B) and the terminal part (100T) by looking only at FIG. 3a, if FIG. 3b is also considered, it can be seen that the terminal part (100T) shown in FIG. 3a is not the entire appearance of the base part (100B), and that the frame (100T-F) is covered by the upper base (100B).

[0058] Preferably, the frame (100T-F) (lower frame) and the contact (100T-C) (lower contact) are connected as a single member, and most of the frame (100T-F) is covered by the base portion (100B) (lower base portion).

[0059] However, according to FIG. 3c viewed from below, it can be seen that the frame (100T-F) is exposed.

[0060] That is, the upper part of the frame (100T-F) is covered by the base part (100B), and the lower part is exposed. In other words, it can be said that the lower surface of the frame (100T-F) is exposed from the lower surface of the base part (100B).

[0061] And, preferably, the lowest surface of the frame (100T-F) and the lowest surface of the base part (100B) are located on the same plane.

[0062] Additionally, the terminal portion (100T) has a contact (100T-C) and a frame (100T-F), as well as a fixed portion (100T-L) formed integrally. The fixed portion (100T-L) is a member formed by bending upward from the side of the frame (100T-F) and is embedded in the base portion (100B).

[0063] FIGS. 3a and 3b are viewed from above, and the contact (100T-C) is convex above the ground based on the drawing. FIG. 3c is viewed from below, and the contact (100T-C) is convex below the ground based on the drawing.

[0064] Figure 4 shows the lower structure (100) shown in Figure 3a from a different angle.

[0065] What was explained in Figs. 3a to 3c applies to Fig. 4 as well.

[0066] In FIG. 4, the frame (100T-F) is shown somewhat differently from FIG. 3a, but FIG. 4 is illustrated so that the frame (100T-F) located below the upper surface of the base part (100B) is visible for the convenience of explaining the structure. That is, FIG. 3a and FIG. 4 illustrate the same structure (top view and top perspective view, respectively), but for example, FIG. 3a assumes that the base part (100B) is made of an opaque material, while FIG. 4 assumes that the base part (100B) is made of a transparent material. Rather than whether the base part (100B) is transparent or opaque being important, FIG. 4 can be understood as being shown to make it easier to understand the structure in three dimensions. Although not limited to this, the base part (100B) is typically made of an opaque resin.

[0067] To summarize the above using FIG. 4, in a card connector (10) that contacts a card (not shown), in particular, the lower structure (100) is,

[0068] A plate-shaped base part (100B) formed from resin,

[0069] A terminal part (100T) having a frame (100T-F) that is connected to a contact (100T-C) that contacts a card (not shown) and surrounds the contact (100T-C).

[0070] Includes

[0071] The frame (100T-F) of the terminal part (100T) is fixed to the base part (100B) by integral molding.

[0072] The lowest surface of the frame (100T-F) and the lowest surface of the base part (100B) are on the same plane. That is, the lower surface of the base part (100B) shown in FIG. 3c (the surface visible in FIG. 3c) and the lower surface of the frame (100T-F) (the surface visible in FIG. 3c) are located on the same plane.

[0073] And, the lower surface of the frame (100T-F) is exposed on the lower surface of the base part (100B). This can be seen in FIG. 3c.

[0074] Additionally, the terminal portion (100T) further has a fixed portion (100T-L) formed by bending upward from the side of the frame (100T-F).

[0075] In addition, this fixed part (100T-L) is embedded in the base part (100B).

[0076] The side shape or buried aspect of the fixed part (100T-L) will be described later in FIG. 5.

[0077] Figure 5 shows a cross-sectional view cut along the line AA' of Figure 4.

[0078] In the cross-section of FIG. 5, a fixing part (100T-L), a frame (100T-F), and a contact (100T-C) included in the terminal part (100T) are shown. It is preferable that these fixing part (100T-L), the frame (100T-F), and the contact (100T-C) are formed integrally. Also, the frame (100T-F) is shown covered by a base part (100B).

[0079] In addition, as previously mentioned, it can be seen in FIG. 5 that the bottom surface of the frame (100T-F) and the bottom surface of the base part (100B) are on the same plane. That is, the bottom surface of the base part (100B) shown in FIG. 3c (the surface visible in FIG. 3c) and the bottom surface of the frame (100T-F) (the surface visible in FIG. 3c) are located on the same plane as shown in FIG. 5.

[0080] Also, in FIG. 5, it can be seen that the lower surface of the frame (100T-F) is exposed from the lower surface of the base part (100B), and the upper surface of the frame (100T-F) is covered by the base part (100B). In FIG. 3a, 3b, 5, etc., almost the entire upper surface of the frame (100T-F) is shown as being covered by the base part (100B), but this is not limited thereto, and it is acceptable to have more exposed parts depending on design needs (e.g., the exposed portion based on area is within about 10%).

[0081] In addition, it can be seen in FIG. 5 that the fixed portion (100T-L) of the terminal portion (100T) is formed by bending upward from the side of the frame (100T-F).

[0082] In addition, it can be seen in FIG. 5 that this fixed part (100T-L) is embedded (buried) in the base part (100B).

[0083] For reference, in FIG. 5, the uppermost part of the fixing part (100T-L) is below the uppermost surface of the base part (100B). If the uppermost part of the fixing part (100T-L) protrudes further above the uppermost surface of the base part (100B), the fixing force by the fixing part (100T-L) is weakened and there is a risk of an electrical short circuit, so it is not desirable.

[0084] Figure 6 is a card connector (10) of Figure 1 viewed from a different angle.

[0085] As described in FIGS. 1 and FIGS. 2, etc., the upper structure (200) and the lower structure (100) are combined to form a card connector (10) (card socket).

[0086] A card (not shown) is inserted into the receiving portion, which is the space between the terminal portions (100T, 200T), and the card (not shown) electrically contacts the contact (200T-C) of the upper terminal portion (200T) and / or the contact (100T-C) of the lower terminal portion (100T) to input and output signals. It is preferable that the card (not shown) be inserted into the receiving portion while resting on a tray (not shown).

[0087] FIGS. 7a and FIGS. 7b show comparative examples compared to the present invention.

[0088] Figure 7a, which is a top view of the lower structure of the comparative example, may not appear to differ significantly from Figure 3a, which is a top view of the lower structure (100) of the present invention, in appearance.

[0089] Meanwhile, Fig. 7b, which is a bottom view of the lower structure of the comparative example, is different in appearance from Fig. 3c, which is a bottom view of the lower structure (100) of the present invention.

[0090] That is, in the present invention (Fig. 3c, etc.), a frame (100T-F) exists, and the frame (100T-F) is exposed on the lower surface of the base part (100B), but

[0091] In the comparative example (Fig. 7b, etc.), the frame itself exists but is not exposed when viewed from the bottom.

[0092] That is, in the comparative example (Figs. 7a and 7b), there may be a frame (not shown) that appears similar to the present invention as an electrical path from the contact (C) to the end (E), but unlike the comparative example shown in Figs. 3b and 3c of the present invention, the frame is not exposed around the contact (C), or even if the frame is exposed, it is exposed only to a minimum extent.

[0093] The difference is not only whether the frame (100T-F) is exposed, but according to the present invention, it is possible to make the thickness of the base part (100B) thinner compared to the comparative example.

[0094] In the comparative example of FIG. 7b, the terminal portion is mostly composed of contacts (C), and there is a path (frame not shown) connected to the end portion (E). For example, the frame of the comparative example may occupy an area identical or similar to that of the frame (100T-F) of the present invention, but based on the exposed area, the frame (100T-F) of the present invention is larger than the frame (not shown) of the comparative example. Referring to FIG. 3c and the like, the present invention has a structure of "mold-contact (more precisely, frame)" from the top, and to be more strictly expressed, it has a structure of "mold-contact (more precisely, frame)-SMT lead" from the top. An SMT lead is a Surface Mount Technology lead, which refers to a lead portion for surface mounting.

[0095] On the other hand, the comparative example has a structure of "mold-contact (specifically frame)-mold" from top to bottom, and to be more precise, has a structure of "mold-contact (specifically frame)-mold-SMT lead" from top to bottom.

[0096] In other words, the comparative example inevitably has an additional thickness equivalent to the lower mold that does not exist in the present invention. In other words, the present invention can reduce the thickness equivalent to the lower mold compared to the comparative example. As a result of the absence of the lower mold, the lower part of the frame (100T-F) is exposed. Of course, if the lower mold is simply removed from the comparative example, there is a problem with fixing the frame (100T-F), so additional structures such as the aforementioned fixing part (100T-L) are required.

[0097] Thus, compared to the comparative example, the present invention can make the thickness of the mold (i.e., base part (100B)) thinner by exposing the terminal part (100T) more (i.e., exposing the frame (100T-F)) due to the difference in the exposed area of ​​the frame (100T-F), etc.

[0098] In the comparative example, even though a frame (not shown) exists, the lower mold (i.e., part of the base part (B)) must support the frame (not shown); accordingly, in the comparative example, a mold member (i.e., base part (B)) must also exist below the frame (not shown).

[0099] As mentioned above, in the present invention, the structure of 'base part (100B)-frame (100T-F) (frame (100T-F) is exposed)' is sufficient (for reference, in the aforementioned part, the 'base part (100B)' of the present invention was also referred to as 'mold' or 'mold rib'),

[0100] In the comparative example, since the structure must be such that the frame (not shown) is sandwiched between the base part (B) from above and below, that is, the structure of 'base part (B)-frame (not shown)-base part (B)', at least an additional thickness equal to that of the lower base part (B) is required (for reference, in the aforementioned section, the 'base part (B)' of the comparative example was also referred to as 'mold' or 'mold rib').

[0101] This is a significant difference in configuration and effect in the current situation where card connectors (10) are increasingly required to be lighter and lighter as time goes by.

[0102] Meanwhile, as previously mentioned, since there is room to view that the possibility of the contact (100T-C) becoming detached (fixing force weakened) has increased as much as the mold thickness has been reduced compared to the comparative example (i.e., as much as the thickness of the base part (100B) has been reduced), in order to prevent this, it is desirable for the terminal part (100T) to be equipped with the aforementioned fixing part (100T-L) and to embed it in the base part (100B).

[0103] And, the details described for the lower structure (100) may be applied to the upper structure (200) as long as they do not contradict the nature or structure, and may be completely different structures.

[0104] Additionally, it is desirable to have both an upper structure (200) and a lower structure (100), but as for the upper structure (200), there may be a plate-shaped member that serves as a cover (200S) and / or a base part (200B), and the member that serves as a terminal part (200T) may be omitted. Of course, at least one of the lower terminal part (100T) and the upper terminal part (200T) must exist.

[0105] Although embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the above embodiments and can be manufactured in various different forms. Furthermore, those skilled in the art will understand that the present invention can be implemented in other specific forms without altering the technical concept or essential features of the invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0106] 10: Card connector (card socket) 100: Substructure (of the card connector (10)) 100B: (Lower) Base part 100T: (Lower) Terminal Section 100T-C: (Lower) Contact 100T-F: (Lower) Frame 100T-L: (Lower) Fixing part 200: Upper structure (of the card connector (10)) 200B: (Upper) Base section 200T: (Upper) Terminal Section 200T-C: (Upper) Contact 200S: (Upper) Cover (Shield) B: Base part of the comparative example C: Contact part of the comparative example E: End of comparative example

Claims

Claim 1 A card connector that contacts a card, comprising: a plate-shaped base portion formed of resin; (i) a contact that contacts the card; (ii) a frame connected to the contact and surrounding the periphery of the contact; and (iii) a terminal portion having a fixing portion that extends from the side of the frame and is formed by being bent obliquely upward toward the outer side in the width direction of the card connector without standing upright; wherein the frame and the fixing portion of the terminal portion are fixed to the base portion by integral molding, the lowest end surface of the frame and the lowest end surface of the base portion are on the same surface, and the fixing portion is embedded in the base portion so as not to be exposed on the upper and lower surfaces of the base portion. Claim 2 In claim 1, the lower surface of the frame is exposed from the lower surface of the base part, a card connector. Claim 3 delete Claim 4 delete Claim 5 delete

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