Die transfer module and die bonding apparatus including the same

Abstract

A die bonding device is disclosed. The die bonding device includes a die transfer module for picking up and transferring a die to be picked up from among the dies attached to a dicing tape, and a die bonding module for bonding the die transferred by the die transfer module onto a substrate. The die transfer module includes a picker for picking up the die, a collet mounted on the lower part of the picker, and a picker drive unit for moving the picker in vertical and horizontal directions. The collet includes an adsorption area having a vacuum hole for vacuum adsorbing the die, and a diaphragm having a ring shape surrounding the adsorption area and for pressurizing surrounding dies located around the die.

Description

Technology Field

[0001] Embodiments of the present invention relate to a die transfer module and a die bonding device including the same. More specifically, the invention relates to a die transfer module for picking up and transferring dies individualized by a dicing process and a die bonding device for bonding said dies onto a substrate. Background Technology

[0002] Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed can be divided into a plurality of dies through a dicing process, and the dies divided through the dicing process can be bonded onto a substrate such as a lead frame, a printed circuit board, or a semiconductor wafer through a die bonding process.

[0003] An apparatus for performing the above die bonding process may include a die transfer module for picking up and transferring dies from a wafer divided into dies, and a die bonding module for attaching the transferred dies onto a substrate. The die transfer module may include a stage unit for supporting the wafer, a die ejector for selectively separating dies from the wafer supported by the stage unit, and a picker for picking up dies from the wafer and transferring them to the die bonding module. The die bonding module may include a substrate stage for supporting the substrate and a bonding head for vacuum adsorbing the dies and bonding them onto the substrate.

[0004] Meanwhile, when picking up the die using the above picker, a problem may arise in which dies adjacent to the die are damaged during the process of picking up the die. Specifically, when the die is lifted while being vacuum-adsorbed by the above picker, the edge portions of the adjacent dies may be lifted together, causing bending of the adjacent dies, and thereby the adjacent dies may be damaged. Prior art literature

[0005] Republic of Korea Published Patent Application No. 10-2019-0054293 (Publication Date: May 22, 2019) Republic of Korea Published Patent Application No. 10-2020-0050646 (Publication Date: May 12, 2020) The problem to be solved

[0006] The embodiments of the present invention aim to provide a die transfer module capable of preventing damage to adjacent dies during the process of picking up a die, and a die bonding device including the same. means of solving the problem

[0007] A die transfer module according to one aspect of the present invention for achieving the above objective comprises a picker for picking up a die to be picked up from a dicing tape to which dies are attached, a collet mounted on the lower part of the picker, and a picker driving unit for moving the picker in vertical and horizontal directions, wherein the collet may include an adsorption area having a vacuum hole for vacuum adsorbing the die, and a diaphragm having a ring shape surrounding the adsorption area for pressurizing surrounding dies located around the die.

[0008] According to some embodiments of the present invention, the adsorption region may have a size equal to or smaller than that of the die.

[0009] According to some embodiments of the present invention, the adsorption region may protrude from the lower surface of the collet with a predetermined thickness.

[0010] According to some embodiments of the present invention, a ring-shaped channel may be provided at the lower edge portion of the collet, and the diaphragm may be disposed within the channel.

[0011] According to some embodiments of the present invention, the collet may include an upper pad mounted on the lower part of the picker and a lower pad mounted on the lower part of the upper pad and having the adsorption area.

[0012] According to some embodiments of the present invention, the upper pad may have a recess into which the lower pad is inserted, and the channel may be defined by the inner surface of the recess and the outer surface of the lower pad.

[0013] According to some embodiments of the present invention, the diaphragm may include fixing members disposed between the upper pad and the lower pad.

[0014] According to some embodiments of the present invention, the upper pad may be provided with an air hole for supplying air into the diaphragm so that the diaphragm expands.

[0015] According to some embodiments of the present invention, the die transfer module may further include an air supply unit for supplying air inside the diaphragm so that the surrounding dies are pressurized by the diaphragm while the die is picked up by the picker.

[0016] According to some embodiments of the present invention, the die transfer module may further include a die ejector disposed below the dicing tape to raise the die and separate the die from the dicing tape.

[0017] According to some embodiments of the present invention, the picker driving unit may lower the picker so that the adsorption area of ​​the collet is in close contact with the upper surface of the die, and then raise the picker together with the die while the die is raised by the die ejector.

[0018] According to some embodiments of the present invention, the die transfer module may further include an air supply unit that supplies air into the diaphragm so that the surrounding dies are pressurized by the diaphragm while the die is raised by the die ejector.

[0019] According to some embodiments of the present invention, after the die is raised by the die ejector, the picker drive unit raises the picker a second time to pick up the die, and the air supply unit can supply the air a second time into the diaphragm from the start of the second raising of the picker until the die is completely separated from the dicing tape.

[0020] A die bonding device according to one embodiment of the present invention may include a die transfer module for picking up and transferring a die to be picked up from a dicing tape to which dies are attached, and a die bonding module for bonding the die transferred by the die transfer module onto a substrate. The die transfer module may include a picker for picking up the die, a collet mounted on the lower part of the picker, and a picker driving unit for moving the picker in vertical and horizontal directions. The collet may include an adsorption area having a vacuum hole for vacuum adsorbing the die, and a diaphragm having a ring shape surrounding the adsorption area and for pressurizing surrounding dies located around the die. Effects of the invention

[0021] According to embodiments of the present invention as described above, while the picker picks up the die, the surrounding dies located around the die can be pressed by the diaphragm, thereby preventing deformation of the surrounding dies while picking up the die. Consequently, damage to the surrounding dies can be sufficiently prevented while picking up the die. Brief explanation of the drawing

[0022] FIG. 1 is a schematic plan view for illustrating a die bonding apparatus according to one embodiment of the present invention. FIG. 2 is a schematic enlarged front view illustrating the die transfer module shown in FIG. 1. Figure 3 is a schematic cross-sectional view illustrating the picker shown in Figure 2. Figure 4 is a schematic exploded cross-sectional view illustrating the collet shown in Figure 3. FIG. 5 is a schematic cross-sectional view illustrating the combined state of the upper pad and the lower pad shown in FIG. 4. FIGS. 6 to 8 are schematic diagrams for explaining a method of picking up a die using the picker shown in FIG. 3. Specific details for implementing the invention

[0023] Hereinafter, embodiments of the present invention are described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below and may be embodied in various other forms. The following embodiments are provided not so as to fully complete the present invention, but rather to sufficiently convey the scope of the present invention to those skilled in the art.

[0024] In embodiments of the present invention, where one element is described as being disposed on or connected to another element, the element may be directly disposed on or connected to the other element, and other elements may be interposed between them. Alternatively, where one element is described as being directly disposed on or connected to another element, there may not be any other elements between them. Terms such as first, second, third, etc., may be used to describe various items such as various elements, compositions, regions, layers, and / or parts, but said items will not be limited by these terms.

[0025] The technical terms used in the embodiments of the present invention are used solely for the purpose of describing specific embodiments and are not intended to limit the invention. Furthermore, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning as understood by a person skilled in the art with ordinary knowledge in the technical field of the present invention. Such terms, such as those defined in ordinary dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the description of the present invention, and shall not be interpreted by ideal or overly superficial intuition unless explicitly limited.

[0026] Embodiments of the present invention are described with reference to schematic drawings of ideal embodiments of the present invention. Accordingly, variations from the shapes in the drawings, such as variations in manufacturing methods and / or tolerances, are readily expected. Therefore, embodiments of the present invention are not described as being limited to specific shapes of the regions described in the drawings, but include variations in shapes; the elements described in the drawings are entirely schematic, and their shapes are not intended to describe the exact shapes of the elements, nor are they intended to limit the scope of the present invention.

[0027] FIG. 1 is a schematic plan view for explaining a die bonding device according to one embodiment of the present invention, and FIG. 2 is a schematic front view for explaining a die transfer module shown in FIG. 1.

[0028] Referring to FIGS. 1 and 2, a die transfer module (100) according to one embodiment of the present invention and a die bonding device (10) including the same can be used to bond individualized dies (22) by a dicing process in a semiconductor device manufacturing process onto a substrate (30), such as a lead frame, a printed circuit board, etc.

[0029] The die bonding device (10) may include a die transfer module (100) for picking up and transferring a die (22) from a wafer (20) containing the dies (22), and a die bonding module (200) for bonding the die (22) picked up by the die transfer module (100) onto the substrate (30). As an example, the die transfer module (100) may pick up the die (22) and transfer it onto a die stage (110), and the die bonding module (200) may pick up the die (22) on the die stage (110) and bond it onto the substrate (30).

[0030] The wafer (20) may include a dicing tape (24) to which the dies (22) are attached, and a mount frame (26) in the shape of a roughly circular ring to which the dicing tape (24) is mounted. As an example, the dicing tape (24) may be attached to the lower surface of the mount frame (26), and the dies (22) may be attached to the upper surface of the dicing tape (24).

[0031] The die transfer module (100) may include a wafer stage (120) for supporting the wafer (20). On the wafer stage (120), a support ring (122) for supporting the dicing tape (24), a clamp (124) for gripping the mount frame (26), and a clamp drive unit (126) for moving the clamp (124) in a vertical direction may be disposed. Specifically, as illustrated, the support ring (122) may support the dicing tape (24) between the dies (22) and the mount frame (26), and the clamp drive unit (126) may extend the dicing tape (24) by lowering the clamp gripping the mount frame (26).

[0032] A die ejector (102) for selectively separating the dies (22) from the dicing tape (24) may be disposed below the dicing tape (24) supported by the support ring (122). The die ejector (102) may include an ejector unit capable of vacuum adsorbing the lower surface of the dicing tape (24) and separating the die (22) from the dicing tape (24) by raising the die (22) to be picked up among the dies (22). As an example, the ejector unit may include ejector pins (104; see FIG. 7) for raising the die (22).

[0033] The die transfer module (100) may include a picker (130) for picking up a die (22) separated from the dicing tape (24) by the die ejector (102) and a picker drive unit (132) for moving the picker (130) in vertical and horizontal directions. The die stage (110) may be positioned spaced apart from the wafer stage (120) in a horizontal direction, and the die (22) picked up by the picker (130) may be transferred onto the die stage (110) by the picker drive unit (132). Additionally, a camera unit (140) for detecting a die (22) to be picked up among the dies (22) may be positioned on the upper part of the wafer stage (130).

[0034] The die bonding device (10) may include a stage drive unit for moving the wafer stage (120) in a horizontal direction. The stage drive unit may adjust the position of the wafer stage (120) so that the die (22) to be picked up among the dies (22) is positioned on the die ejector (102).

[0035] Additionally, as illustrated in FIG. 1, the die bonding device (10) may include a cassette load port (42) on which a cassette (40) for storing the wafer (20) is placed, a wafer transfer unit (44) for transferring the wafer (20) from the cassette (40) onto the wafer stage (120), and wafer guide rails (46) for guiding the transfer of the wafer (20). Specifically, the stage drive unit may move the wafer stage (120) to be adjacent to the end of the wafer guide rails (46), and then the wafer transfer unit (44) may move the wafer (20) from the cassette (40) onto the wafer stage (120). Although not illustrated in detail, the wafer transfer unit (44) may include a gripper for gripping the mount frame (26) and a gripper drive unit for moving the gripper in a horizontal direction.

[0036] The die bonding module (200) can pick up the die (22) transferred onto the die stage (110) and bond it onto the substrate (30). As an example, the die bonding module (200) may include a bonding head (210) for picking up the die (22), a head driving unit (212) for moving the bonding head (210) in vertical and horizontal directions, and a substrate stage (220) for supporting the substrate (30). Although not illustrated, the bonding head (210) may include a vacuum hole for vacuum adsorbing the die (22) and a bonding tool (not illustrated) for pressing the die (22) onto the substrate (30), and the substrate stage (220) may include a heater (not illustrated) for heating the substrate (30) to a preset bonding temperature.

[0037] The above substrate (30) can be supplied from the first magazine (50) and can be stored in the second magazine (60) after the die bonding process is completed. As an example, the die bonding device (10) may include a first magazine handling unit (52) for handling the first magazine (50) and a second magazine handling unit (62) for handling the second magazine (60). Additionally, the die bonding device (10) may include a first magazine load port (54) on which the first magazine (50) is placed, a second magazine load port (64) on which the second magazine (60) is placed, a first magazine transfer unit (56) for transferring the first magazine (50) between the first magazine load port (54) and the first magazine handling unit (52), and a second magazine transfer unit (66) for transferring the second magazine (60) between the second magazine load port (64) and the second magazine handling unit (62).

[0038] Additionally, the die bonding device (10) may include a substrate transfer unit (70) for transferring the substrate (30) from the first magazine (50) onto the substrate stage (220), adjusting the position of the substrate (30) on the substrate stage (220), and transferring the substrate (30) to the second magazine (60) after the die bonding process is completed. The above substrate transfer unit (70) may include substrate guide rails (72) for guiding the transfer of the substrate (30), grippers (74) for gripping the substrate (30), gripper driving units (76) for moving the grippers (74), a first pusher (78) for moving the substrate (30) onto the substrate guide rails (72), and a second pusher (80) for moving the substrate (30) onto the substrate guide rails (72) into the interior of the second magazine (60).

[0039] FIG. 3 is a schematic cross-sectional view illustrating the picker illustrated in FIG. 2, FIG. 4 is a schematic exploded cross-sectional view illustrating the collet illustrated in FIG. 3, and FIG. 5 is a schematic cross-sectional view illustrating the combined state of the upper pad and the lower pad illustrated in FIG. 4.

[0040] Referring to FIGS. 3 to 5, according to one embodiment of the present invention, a collet (150) may be mounted on the lower part of the picker (130), and the collet (150) may include an adsorption area (154) having a vacuum hole (152) for vacuum adsorbing the die (22), and a diaphragm (180) having a ring shape surrounding the adsorption area (154) and for pressurizing surrounding dies (22A; see FIG. 6) located around the die (22). As an example, the adsorption area (154) may have the same size as the die (22) or may have a size slightly smaller than the die (22). In particular, the adsorption area (154) may protrude from the lower surface of the collet (150) with a predetermined thickness, and the adsorption area (154) may be provided with a vacuum hole (152) for vacuum adsorbing the die (22). Additionally, a ring-shaped channel (156) may be provided at the lower edge portion of the collet (150), and the diaphragm (180) may be placed within the channel (156).

[0041] Specifically, a ring-shaped channel (156) may be provided at the lower edge portion of the collet (150). As an example, the collet (150) may include an upper pad (160) mounted on the lower portion of the picker (130) and a lower pad (170) mounted on the lower portion of the upper pad (160) and having an adsorption area (154) for vacuum adsorbing the die (22). For example, the upper pad (160) may have a roughly square plate shape and may have a recess (162) into which the lower pad (170) is inserted. The lower pad (170) may have a roughly square plate shape inserted into the recess (162), and the channel (156) may be defined by the inner surface of the recess (162) and the outer surface of the lower pad (170).

[0042] The channel (156) may be configured in the shape of a square ring, and the diaphragm (180) may be mounted inside the channel (156) so as to be expandable downward. For example, the diaphragm (180) may be provided with fixing members (182) positioned between the upper pad (160) and the lower pad (170), and a groove (164) into which the fixing members (182) are inserted and a stepped portion (172) may be provided, respectively, at the inner surface portion of the recess (162) and the upper surface edge portion of the lower pad (170). Additionally, the upper pad (160) may be provided with an air hole (166) communicating with the channel (156) to supply air to the interior of the diaphragm (180). Meanwhile, the vacuum hole (152) of the above collet (150) may be formed to penetrate the upper pad (160) and the lower pad (170), and the picker (130) may be provided with a second air hole (134) connected to the air hole (166) and a second vacuum hole (136) connected to the vacuum hole (152).

[0043] The die transfer module (100) may include a vacuum supply unit (190) connected to the second vacuum hole (136) of the picker (130) and an air supply unit (192) connected to the second air hole (134). For example, the vacuum supply unit (190) may provide vacuum pressure to the vacuum hole (152) to pick up the die (22) and may be configured using a vacuum pump or a vacuum ejector and a valve, etc. The air supply unit (192) is used to supply air through the air hole (166) so that the diaphragm (180) can expand downward and may be configured using an air pump and a valve, etc.

[0044] FIGS. 6 to 8 are schematic diagrams for explaining a method of picking up a die using the picker shown in FIG. 3.

[0045] Referring to FIGS. 6 through 8, according to one embodiment of the present invention, air may be supplied into the diaphragm (180) so that the surrounding dies (22A) are pressurized by the diaphragm (180) while the die (22) is picked up by the picker (130). For example, as shown in FIG. 6, the picker drive unit (132) may lower the picker (130) so that the adsorption area (154) of the collet (150) is in close contact with the upper surface of the die (22), and the vacuum supply unit (190) may provide vacuum pressure through the vacuum hole (152) so that the die (22) is vacuum adsorbed onto the adsorption area (154). Subsequently, as shown in FIG. 7, the die (22) may be raised by the ejector pins (104) of the die ejector (102). At this time, the picker drive unit (132) can raise the picker (130) together with the raising of the die (22) by the die ejector (102), and the air supply unit (192) can supply air into the diaphragm (180) so that the surrounding dies (22A) are pressurized by the diaphragm (180) while the die (22) is raised by the die ejector (102). That is, the surrounding dies (22A) can be pressurized by the diaphragm (180) so that they do not rise together with the die (22) while the die (22) is raised, thereby preventing damage to the surrounding dies (22A) while picking up the die (22).

[0046] Furthermore, the picker drive unit (132) can raise the picker (130) a second time to pick up the die (22) after the die (22) is raised by the die ejector (102) as shown in FIG. 8, and the air supply unit (192) can supply the air a second time into the diaphragm (180) from the start of the second raising of the picker (130) until the die (22) is completely separated from the dicing tape (24). Although the raising of the picker (130), the second raising, and the supply of air and the second supply are described separately above, the raising of the picker (130) and the supply of air can be performed continuously without interruption.

[0047] According to embodiments of the present invention as described above, while the picker (130) picks up the die (22), the surrounding dies (22A) located around the die (22) can be pressed by the diaphragm (180), thereby preventing deformation of the surrounding dies (22A) while picking up the die (22). Consequently, damage to the surrounding dies (22A) while picking up the die (22) can be sufficiently prevented.

[0048] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the following claims. Explanation of the symbols

[0049] 10: Die bonding device 20: Wafer 22 : Die 22A : Peripheral Die 24: Dicing Tape 100: Die Transfer Module 102: Die ejector 104: Ejector pin 110: Die stage 120: Wafer stage 130 : Picker 132 : Picker drive unit 140 : Camera unit 150 : Collet 152 : Vacuum hole 154 : Adsorption area 156 : Channel 160 : Upper pad 162 : Recess 166 : Air hole 170 : Lower pad 180 : Diaphragm 182: Fixed member 190: Vacuum supply part 192: Air supply unit 200: Die bonding module 210: Bonding head 212: Head drive unit 220 : Substrate stage

Claims

Claim 1 A die transfer module comprising: a picker for picking up a die to be picked up from a dicing tape to which dies are attached; a collet mounted on the lower part of the picker; and a picker drive unit for moving the picker in vertical and horizontal directions, wherein the collet comprises an adsorption area having a vacuum hole for vacuum adsorbing the die, and a diaphragm having a ring shape surrounding the adsorption area for pressurizing surrounding dies located around the die, wherein a ring-shaped channel is provided at the edge portion of the lower surface of the collet, and the diaphragm is disposed within the channel, and the diaphragm expands and pressurizes surrounding dies when air is supplied to it. Claim 2 A die transfer module according to claim 1, wherein the adsorption area has a size equal to or smaller than that of the die. Claim 3 A die transfer module according to claim 1, characterized in that the adsorption area protrudes from the lower surface of the collet with a predetermined thickness. Claim 4 delete Claim 5 A die transfer module according to claim 1, wherein the collet comprises an upper pad mounted on the lower part of the picker and a lower pad mounted on the lower part of the upper pad and having the adsorption area. Claim 6 A die transfer module according to claim 5, wherein the upper pad has a recess into which the lower pad is inserted, and the channel is defined by the inner surface of the recess and the outer surface of the lower pad. Claim 7 A die transfer module according to claim 6, wherein the diaphragm comprises fixing members disposed between the upper pad and the lower pad. Claim 8 A die transfer module according to claim 5, characterized in that the upper pad is provided with an air hole for supplying air inside the diaphragm to expand the diaphragm. Claim 9 A die transfer module according to claim 1, further comprising an air supply unit for supplying air inside the diaphragm so that the surrounding dies are pressurized by the diaphragm while the die is picked up by the picker. Claim 10 A die transfer module according to claim 1, further comprising a die ejector disposed below the dicing tape and for raising the die to separate the die from the dicing tape. Claim 11 A die transfer module according to claim 10, wherein the picker driving unit lowers the picker so that the adsorption area of ​​the collet is in close contact with the upper surface of the die, and then raises the picker together with the die while the die is raised by the die ejector. Claim 12 A die transfer module according to claim 11, further comprising an air supply unit that supplies air into the diaphragm so that the surrounding dies are pressurized by the diaphragm while the die is raised by the die ejector. Claim 13 A die transfer module according to claim 12, wherein after the die is raised by the die ejector, the picker drive unit raises the picker a second time to pick up the die, and the air supply unit supplies the air a second time into the diaphragm from the start of the second raising of the picker until the die is completely separated from the dicing tape. Claim 14 A die bonding device comprising: a die transfer module for picking up and transferring a die to be picked up from a dicing tape to which dies are attached; and a die bonding module for bonding the die transferred by the die transfer module onto a substrate, wherein the die transfer module comprises a picker for picking up the die, a collet mounted on the lower part of the picker, and a picker driving unit for moving the picker in vertical and horizontal directions, wherein the collet comprises an adsorption area having a vacuum hole for vacuum adsorbing the die, and a diaphragm having a ring shape surrounding the adsorption area for pressurizing surrounding dies located around the die, wherein a ring-shaped channel is provided at the edge portion of the lower surface of the collet, and the diaphragm is disposed within the channel, and the diaphragm expands and pressurizes surrounding dies when air is supplied to the inside.

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