Stage for a decapping system with Y-axis dual motion and R-axis rotation control

Abstract

A stage for a decaps system equipped with dual Y-axis movement and R-axis rotation control is disclosed. The stage for a decaps system equipped with dual Y-axis movement and R-axis rotation control according to the present invention comprises: a Y-axis driving unit coupled to a system body of the decaps system and driving a sample holding unit coupled to a sample member in the Y-axis direction; and an R-axis driving unit coupled to the Y-axis driving unit and rotating the sample holding unit, wherein the Y-axis driving unit comprises a first Y-axis driving unit and a second Y-axis driving unit that move the sample holding unit in the Y-axis direction at different speeds.

Description

Technology Field

[0001] The present invention relates to a decapping system, and more specifically, to a stage for a decapping system equipped with dual Y-axis movement and R-axis rotation control that allows the sample to be uniformly polished with high precision by moving the sample along a dual Y-axis and rotating it along an R-axis during the decapping operation. Background Technology

[0002] In the semiconductor and display fields, reverse engineering, monitoring, and defect analysis are performed on specific samples that have undergone the process to improve process yield and for research and development.

[0003] To achieve this, uniform de-capping (de-processing, hereinafter referred to as 'de-capping') is essential for the fine thin film layers formed in each process. During this process, chemical mechanical polishing (CMP) with nano-level precision is performed while maintaining uniform flatness. Unlike wafers or flat-panel displays on the process line, this nano-de-capping operation is carried out on fragmented square-shaped semiconductor or display samples.

[0004] The CMP process is carried out by placing a sample on a polishing wheel and a polishing pad and using a slurry (chemical polishing liquid) to remove material from the sample surface. In this process, high-precision planarization is achieved through a combination of chemical reactions and mechanical friction. The main components of CMP include the polishing pad, slurry, sample stage, and pressure control device.

[0005] The polishing pad contacts the sample to provide mechanical friction and serves to absorb and distribute the slurry. The physical properties and design of the polishing pad have a direct impact on the polishing quality.

[0006] Slurries help remove material from the surface of a sample through chemical reactions during the polishing process. Generally, slurries consist of components such as oxidizers, abrasives, and stabilizers, and the polishing speed and surface quality vary depending on the slurry composition.

[0007] The sample stage is a device that fixes the sample and controls its relative movement with respect to the polishing pad, enhancing polishing uniformity through rotational and translational motion.

[0008] The pressure control device controls the pressure between the sample and the polishing pad to adjust the polishing speed and uniformity.

[0009] The CMP process achieves the surface quality required in various semiconductor manufacturing processes through the interaction of these components.

[0010] While the existing CMP process is an essential technology in semiconductor manufacturing, it has the following technical limitations and problems.

[0011] Dishing is a phenomenon in which the surface becomes concave due to excessive material removal within a patterned area, while erosion is a phenomenon in which more material is removed in areas with high pattern density. Due to such non-uniform removal, it is impossible to obtain a precision polished surface for verifying the semiconductor state, making it difficult to determine the accurate manufacturing state and thus degrading the quality of the decapping.

[0012] Edge overpolishing is a problem in which thickness non-uniformity occurs due to excessive polishing at the edges of a sample. This can adversely affect the electrical characteristics of the wafer edges.

[0013] Meanwhile, conventional sample stages feature a structure with translational motion along the X and Y axes and rotational motion along the Z axis. In this case, the X-axis allows only adjustment of the center position. In particular, the Y-axis performs only simple reciprocating motion, which leads to dishing in localized areas and makes it impossible to partially control uneven polishing surfaces.

[0014] The aforementioned technical configuration is provided as background technology to aid in understanding the present invention and does not constitute prior art widely known in the technical field to which the present invention belongs. Prior art literature

[0015] Korean Published Patent Application No. 2024-0140823 (Tokyo Seimitsu Co., Ltd.). September 24, 2024. The problem to be solved

[0016] Although various technologies have been developed to improve the existing decapping process, the following limitations still exist.

[0017] Existing stages provide only simple rotation and lack the technology to control complex double motion. Precise control of the sample stage is essential to ensure polishing uniformity.

[0018] The present invention aims to provide technical improvements to solve the aforementioned problems and enhance the precision, efficiency, and quality of the decapping process. In particular, it provides a stage for a decapping system equipped with dual Y-axis movement and R-axis rotation control, which can reduce dishing and edge overpolishing and provide a new CMP polishing control technology by implementing double motion control of the sample stage. means of solving the problem

[0019] According to one aspect of the present invention, a stage for a decap system may be provided, comprising: a Y-axis driving unit coupled to a system body of a decap system and driving a sample holding unit coupled to a sample member in the Y-axis direction; and an R-axis driving unit coupled to the Y-axis driving unit and rotating the sample holding unit in the R-axis direction, wherein the Y-axis driving unit comprises a first Y-axis driving unit and a second Y-axis driving unit that move the sample holding unit in the Y-axis direction at different speeds.

[0020] The first Y-axis drive unit moves the sample holding unit in the Y-axis direction more slowly than the second Y-axis drive unit, thereby enabling uniform polishing of the entire upper surface area of ​​the sample member.

[0021] The second Y-axis drive unit can move the sample holding unit in the Y-axis direction faster than the first Y-axis drive unit to uniformly polish a local area of ​​the upper surface of the sample member.

[0022] The second Y-axis drive unit can move the sample holding unit in the Y-axis direction at a speed 2 to 10 times faster than the first Y-axis drive unit.

[0023] The first Y-axis drive unit can move the second Y-axis drive unit in the Y-axis direction, and the second Y-axis drive unit can move the R-axis drive unit in the Y-axis direction.

[0024] The reciprocating range of the sample member reciprocating by the second Y-axis drive unit may be narrower than the reciprocating range of the sample member reciprocating by the first Y-axis drive unit.

[0025] The first Y-axis drive unit is coupled to the system body, and the second Y-axis drive unit is coupled to the upper part of the first Y-axis drive unit and can move in the Y-axis direction.

[0026] The R-axis drive unit is coupled to the upper part of the second Y-axis drive unit and moves in the Y-axis direction together with the Y-axis drive unit, and the sample holding unit is coupled to the upper part of the R-axis drive unit and can move in the Y-axis direction together with the R-axis drive unit.

[0027] The above decap system further includes a polishing device unit equipped with a polishing pad for polishing the sample member, and at least one of the first Y-axis driving unit and the second Y-axis driving unit can move the sample holding unit to align the center of the sample member with the polishing position of the polishing pad.

[0028] The above decap system includes a polishing device equipped with a polishing pad for polishing the sample member, and the R-axis drive unit can rotate the sample holding unit in the same direction as the rotation direction of the polishing pad.

[0029] The above R-axis drive unit can rotate the sample holding unit slower than the rotation speed of the polishing pad.

[0030] The above decap system includes a drain bath coupled to the R-axis drive unit, into which the slurry used in the sample holding unit is collected, and the drain bath moves together with the second Y-axis drive unit when the first Y-axis drive unit is driven, and the drain bath can move together with the R-axis drive unit when the second Y-axis drive unit is driven.

[0031] When the sample holding unit is rotated by the operation of the above R-axis drive unit, the drain bath may not rotate.

[0032] The first Y-axis drive unit and the second Y-axis drive unit can reciprocate the sample holding unit. Effects of the invention

[0033] Embodiments of the present invention can uniformly polish a sample with high precision by moving a sample holding unit, to which a sample member is coupled by a first Y-axis driving unit and a second Y-axis driving unit, at different speeds in the Y-axis direction.

[0034] In addition, by reciprocating the sample holding unit, to which the sample member is coupled by the first Y-axis drive unit, more slowly than the second Y-axis drive unit and by widening the reciprocating range compared to the second Y-axis drive unit, uneven wear, bending, and edge overpolishing of the sample member can be improved, thereby enabling uniform polishing of the specimen member.

[0035] Furthermore, by the second Y-axis drive unit reciprocating the sample holding unit, to which the sample member is attached, faster than the first Y-axis drive unit and narrowing the reciprocating range, the localized dishing phenomenon of the sample member can be eliminated, thereby allowing the specimen member to be polished uniformly. Brief explanation of the drawing

[0036] FIG. 1 is a schematic diagram illustrating a stage for a decapping system equipped with dual Y-axis movement and R-axis rotation control according to one embodiment of the present invention, and a state in which the stage for the decapping system is coupled to a sample holding unit and a drain bath. FIG. 2 is a schematic diagram illustrating a decap system to which the present embodiment is applied. Figure 3 is a schematic internal perspective view of Figure 2. Fig. 4 is a rear perspective view of Fig. 3. FIG. 5 is a perspective view schematically illustrating the area of ​​the stage for the decap system shown in FIG. 3. Fig. 6 is a schematic front view of Fig. 1. Fig. 7 is a schematic bottom perspective view of Fig. 1. FIG. 8 is a perspective view showing the drain bath connecting plate connecting the R-axis drive motor and the drain bath shown in FIG. 7 excluded. Figure 9 is a drawing showing the drain bath excluded from Figure 8. FIG. 10 is a schematic diagram showing the sample holder unit connected to the R-axis drive unit, with the Y-axis drive unit, holder plate, and plate wall shown in FIG. 9 excluded. FIG. 11 illustrates the movement of the second Y-axis drive unit, the R-axis drive unit, and the drain bath by the operation of the first Y-axis drive unit shown in FIG. 1, where FIG. 11 (a) shows the state before movement, and FIG. 11 (b) shows the second Y-axis drive unit, the R-axis drive unit, and the drain bath moved in the direction of the arrow shown in FIG. 11 (a). FIG. 12 illustrates the R-axis drive unit and drain bath being moved by the operation of the second Y-axis drive unit shown in FIG. 1, where FIG. 12 (a) shows the state before movement, and FIG. 12 (b) shows the R-axis drive unit and drain bath being moved in the direction of the arrow shown in FIG. 12 (a). FIG. 13 is a diagram showing the usage state of the present embodiment, schematically illustrating that the sample holding unit is moved in a specific direction by the Y-axis driving unit to adjust the polishing position of the sample member and the polishing pad coupled to the sample holder part. FIG. 14 is a schematic diagram illustrating the state of polishing a sample member with a polishing pad as a subsequent state diagram of FIG. 13. FIG. 15 is an enlarged view of the area of ​​the sample holder portion shown in FIG. 14. Specific details for implementing the invention

[0037] In order to fully understand the present invention, the operational advantages of the present invention, and the objectives achieved by the implementation of the present invention, reference must be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described therein.

[0038] The present invention will be described in detail below by explaining preferred embodiments of the invention with reference to the attached drawings. Identical reference numerals in each drawing indicate identical components.

[0039] FIG. 1 is a schematic diagram illustrating a stage for a decapping system having dual Y-axis movement and R-axis rotation control according to one embodiment of the present invention, and a state in which the stage for the decapping system is coupled to a sample holding unit and a drain bath; FIG. 2 is a schematic diagram illustrating a decapping system to which the present embodiment is applied; FIG. 3 is a schematic internal perspective view of FIG. 2; FIG. 4 is a rear perspective view of FIG. 3; and FIG. 5 is a schematic perspective view illustrating the area of ​​the stage for the decapping system shown in FIG. 3.

[0040] Also, FIG. 6 is a schematic front view of FIG. 1, FIG. 7 is a schematic bottom perspective view of FIG. 1, FIG. 8 is a perspective view showing the drain connecting plate connecting the R-axis drive motor and the drain bath shown in FIG. 7 excluded, FIG. 9 is a drawing showing the drain bath excluded from FIG. 8, and FIG. 10 is a schematic drawing showing the sample holder part connected to the R-axis drive part with the Y-axis drive part, holder plate, and plate wall shown in FIG. 9 excluded.

[0041] Furthermore, FIG. 11 illustrates the movement of the second Y-axis drive unit, the R-axis drive unit, and the drain bath by the operation of the first Y-axis drive unit shown in FIG. 1, where FIG. 11 (a) shows the state before movement, and FIG. 11 (b) shows the second Y-axis drive unit, the R-axis drive unit, and the drain bath moved in the direction of the arrow shown in FIG. 11 (a). FIG. 12 illustrates the movement of the R-axis drive unit and the drain bath by the operation of the second Y-axis drive unit shown in FIG. 1, where FIG. 12 (a) shows the state before movement, and FIG. 12 (b) shows the R-axis drive unit and the drain bath moved in the direction of the arrow shown in FIG. 12 (a). FIG. 13 is a diagram showing the usage state of the present embodiment, schematically illustrating that the sample holding unit is moved in a specific direction by the Y-axis drive unit to adjust the polishing position of the sample member coupled to the sample holder and the polishing pad. FIG. 14 FIG. 13 is a schematic diagram illustrating the state of polishing a sample member with a polishing pad as a subsequent state diagram, and FIG. 15 is an enlarged view of the area of ​​the sample holder part shown in FIG. 14.

[0042] As illustrated in these drawings, the stage (1) for a decapping system having dual Y-axis movement and R-axis rotation control according to the present embodiment includes a Y-axis driving unit (100) coupled to the system body (10) of the decapping system and driving a sample holding unit (30) coupled to a sample member (20) in the Y-axis direction, and an R-axis driving unit (200) coupled to the Y-axis driving unit (100) and rotating the sample holding unit (30).

[0043] The Y-axis driving unit (100) can uniformly polish the sample with high precision by moving the sample holding unit (30), to which the sample member (20) is attached, at different speeds in the Y-axis direction.

[0044] In this embodiment, the Y-axis driving unit (100) includes a first Y-axis driving part (110) as shown in FIG. 1, and a second Y-axis driving part (120) coupled to the upper part of the first Y-axis driving part (110) to move back and forth in the Y-axis direction.

[0045] The first Y-axis drive unit (110) of the Y-axis drive unit (100) can reciprocate the sample holding unit (30) to which the sample member (20) is attached in the Y-axis direction more slowly than the second Y-axis drive unit (120), and by widening the reciprocating range compared to the second Y-axis drive unit (120), the entire upper surface area of ​​the sample member (20) can be polished. As a result, uneven wear, bending, and edge overpolishing of the sample member (20) can be improved, and the specimen member can be polished uniformly.

[0046] In this embodiment, the first Y-axis drive unit (110) includes, as shown in FIG. 1, a first Y-axis body (111), a first Y-axis drive motor (112) coupled to the first Y-axis body (111), and a first Y-axis moving body (113) positioned on the upper part of the first Y-axis body (111) and connected to the first Y-axis drive motor (112) to reciprocate in the Y-axis direction.

[0047] In this embodiment, the first Y-axis body (111) can be coupled to the upper part of the main body base plate (11), as shown in FIGS. 3 and 5.

[0048] In this embodiment, the first Y-axis drive motor (112) may be a stepping motor.

[0049] In this embodiment, the first Y-axis moving body (113) is connected to the first Y-axis driving motor (112) by a ball screw and can reciprocate in the Y-axis direction. In this embodiment, the second Y-axis driving unit (120) is coupled to the first Y-axis moving body (113) as shown in FIG. 1 and can reciprocate in the Y-axis direction like the first Y-axis moving body (113). In this embodiment, the first Y-axis moving body (113) can be moved within a predetermined reciprocating range by limiting the moving distance by a sensor, such as a limit switch, provided on the first Y-axis body (111).

[0050] The second Y-axis drive unit (120) of the Y-axis drive unit (100) can uniformly polish the specimen member by eliminating local area dishing phenomena of the specimen member (20) by reciprocating the specimen holding unit (30) to which the specimen member (20) is attached faster than the first Y-axis drive unit (110) and by narrowing the reciprocating range.

[0051] In this embodiment, the second Y-axis drive unit (120) includes, as shown in FIG. 1, a second Y-axis body (121) coupled to the first Y-axis moving body (113), a second Y-axis drive motor (122) coupled to the second Y-axis body (121), and a second Y-axis moving body (123) positioned on the upper part of the second Y-axis body (121) and connected to the second Y-axis drive motor (122) to reciprocate in the Y-axis direction.

[0052] In this embodiment, the second Y-axis body (121) is coupled to the upper part of the first Y-axis moving body (113) as shown in FIG. 12, so that it can move in the Y-axis direction like the first Y-axis moving body (113) when the first Y-axis driving motor (112) is operated. FIG. 11 (a) is the state before the first Y-axis driving motor (112) is operated, and FIG. 11 (b) is the state in which the second Y-axis driving unit (120), the R-axis driving unit (200), and the drain bath (40) are moved in the direction of the arrow shown in FIG. 11 (a) due to the operation of the first Y-axis driving motor (112). In this embodiment, the second Y-axis driving unit (120) can be moved back and forth in the Y-axis direction with respect to FIG. 11. As a result, the R-axis driving unit (200) coupled to the second Y-axis driving unit (120) can also be moved back and forth in the Y-axis direction.

[0053] In this embodiment, the second Y-axis drive motor (122) may be a stepping motor operated by pneumatic pressure.

[0054] In this embodiment, the second Y-axis moving body (123) is connected to the second Y-axis driving motor (122) by a ball screw and can reciprocate in the Y-axis direction. In this embodiment, the R-axis driving unit (200) is coupled to the second Y-axis moving body (123) as shown in FIG. 1 and can reciprocate in the Y-axis direction like the second Y-axis moving body (123). FIG. 12 (a) is the state before the operation of the second Y-axis driving motor (122), and FIG. 12 (b) shows that the R-axis driving unit (200) and the drain bath (40) can be moved in the direction of the arrow shown in FIG. 12 (a) by the operation of the second Y-axis driving motor (122). At this time, the sample holding unit (30) coupled to the R-axis driving unit (200) can also be moved in the Y-axis direction like the R-axis driving unit (200). In this embodiment, the R-axis drive unit (200) can be reciprocated in the Y-axis direction with respect to FIG. 12. As a result, the sample holding unit (30) and the drain bath (40) coupled to the R-axis drive unit (200) can also be reciprocated in the Y-axis direction.

[0055] In this embodiment, the second Y-axis moving body (123) can be moved within a predetermined reciprocating range by limiting the moving distance by a sensor, such as a limit switch, provided in the second Y-axis body (121).

[0056] In this embodiment, the second Y-axis drive unit (120) can reciprocate the sample holding unit (30) in the Y-axis direction at a speed 2 to 10 times faster than the first Y-axis drive unit (110).

[0057] As shown in FIG. 6, the R-axis drive unit (200) is coupled to the second Y-axis moving body (123) of the second Y-axis drive unit (120) and can reciprocate in the Y-axis direction when the second Y-axis drive motor (122) is operated.

[0058] In addition, in this embodiment, a sample holding unit (30) and a drain bath (40) are combined on the upper part of the R-axis drive unit (200), and the sample holding unit (30) and the drain bath (40) can be reciprocated together with the R-axis drive unit (200).

[0059] Furthermore, in this embodiment, the sample holding unit (30), to which the sample member (20) is detachably coupled, is connected to the R-axis drive unit (200) and can be rotated clockwise or counterclockwise. However, the drain bath (40) is fixedly coupled to the R-axis drive unit (200) and does not rotate.

[0060] In addition, when the first Y-axis drive unit (110) is operated in this embodiment, as described above, the second Y-axis drive unit (120), the R-axis drive unit (200), the sample holding unit (30), and the drain bath (40) can be moved back and forth together in the Y-axis direction. In addition, when the second Y-axis drive unit (120) is operated in this embodiment, as described above, the R-axis drive unit (200), the sample holding unit (30), and the drain bath can be moved back and forth together in the Y-axis direction.

[0061] In this embodiment, the R-axis drive unit (200) includes, as shown in FIG. 7, an R-axis body (210) in which the lower part is coupled to the second Y-axis moving body (123) and the upper part is coupled to the drain bath (40), an R-axis drive motor (220) coupled to the R-axis body (210), and as shown in FIG. 10, a power transmission unit (230) in which the lower part is coupled to the R-axis body (210) and the upper part is coupled to the sample holder unit (31) to transmit the rotational force of the R-axis drive motor (220) to the sample holder unit (31) to rotate the sample holder unit (31).

[0062] The R-axis body (210) of the R-axis drive unit (200) can be coupled to the second Y-axis moving body (123) through a plurality of R-axis fastening members (211) as shown in FIG. 7.

[0063] In this embodiment, a bath connecting plate (50) can be connected to the upper part of the R-axis body (210) by an R-axis fastening member (211), as shown in FIG. 7. In this embodiment, the bath connecting plate (50) can support the bottom portion of the drain bath (40) and can be fitted into the bottom portion of the drain bath (40) by means of a protrusion and a groove, or connected by a screw or bolt.

[0064] The R-axis drive motor (220) of the R-axis drive unit (200) is coupled to the R-axis body (210) as shown in FIG. 7 and can provide power to rotate the sample holding unit (30) in a clockwise or counterclockwise direction.

[0065] In this embodiment, the R-axis drive motor (220) may be provided as a stepping motor.

[0066] As shown in FIG. 10, the lower part of the power transmission part (230) of the R-axis drive part (200) is installed on the R-axis body (210), and the upper part is coupled with the sample holder part (31) so that power transmitted from the R-axis drive motor (220) is transmitted to the sample holder part (31) to rotate the sample holder part (31) in the R-axis direction.

[0067] In this embodiment, one side of the power transmission unit (230) is connected to the R-axis drive motor (220), and the other side is coupled to the sample holder unit (31), so that the rotational force of the second Y-axis drive motor (122) transmitted in the Y-axis direction is converted in the R-axis direction to rotate the sample holder unit (31). In addition, in this embodiment, a holder plate (32) is coupled to the upper part of the power transmission unit (230), so that the holder plate (32) can rotate together with the sample holder unit (31). In this embodiment, a plate wall (33) is provided at the edge of the holder plate (32), so that the plate wall (33) can rotate together with the holder plate (32). In this embodiment, the sample holding unit (30) may include the sample holder unit (31), the holder plate (32), and the plate wall (33).

[0068] In this embodiment, the power transmission unit (230) may use known power transmission means such as a bevel gear.

[0069] Meanwhile, in this embodiment, the rotational speed of the sample holder part (31) rotated by the R-axis drive part (200) can be rotated at a slower speed than the polishing pad (62) coupled to the polishing body (61) of the polishing device (60).

[0070] In this embodiment, the R-axis drive unit (200) can rotate the sample holder unit (31) in a clockwise or counterclockwise direction.

[0071] The operation of the present embodiment is described below.

[0072] First, to adjust the polishing position of the sample member (20) and the polishing pad (62) coupled to the sample holder part (31), the sample holding unit (30) can be moved in a specific direction by the Y-axis driving unit (100). At this time, the sample holding unit (30) can be moved to the polishing position by at least one of the first Y-axis driving unit (110) and the second Y-axis driving unit (120).

[0073] When the polishing position of the sample member (20) is set, the sample member (20) is polished with a polishing pad (62) as shown in FIG. 14. At this time, the polishing pad (62) can be raised and lowered by the pad Z-axis drive motor (63) shown in FIG. 4.

[0074] In this embodiment, when there is uneven wear, bending, or edge overpolishing of the sample member (20), the sample holding unit (30) to which the sample member (20) is attached is reciprocated slowly by the first Y-axis drive unit (110) compared to the second Y-axis drive unit (120), and the reciprocating range is widened compared to the second Y-axis drive unit (120), thereby allowing the sample member (20) to be polished uniformly. In this case, the sample member (20) can be reciprocated in the Y-axis direction by the first Y-axis drive unit (110) and rotated by the R-axis drive unit (200). Additionally, the polishing pad (62) can be rotated in the same direction as the rotation direction of the sample member (20) and can be rotated at a speed faster than the rotation speed of the sample member (20). For reference, the second Y-axis drive unit (120) may not be operated when the first Y-axis drive unit (110) is operated.

[0075] In this embodiment, when there is a localized dishing phenomenon in the sample member (20), the sample holding unit (30) to which the sample member (20) is attached is reciprocated faster than the first Y-axis drive unit (110) by the second Y-axis drive unit (120), and the reciprocating range is narrowed, thereby allowing the sample member (20) to be polished uniformly. In this case, the sample member (20) can be reciprocated in the Y-axis direction by the second Y-axis drive unit (120) and rotated by the R-axis drive unit (200). Additionally, the polishing pad (62) can be rotated in the same direction as the rotation direction of the sample member (20) and can be rotated at a speed faster than the rotation speed of the sample member (20). For reference, the first Y-axis drive unit (110) may not be operated when the second Y-axis drive unit (120) is operated.

[0076] In this embodiment, the polishing pad (62) on which the polishing operation of the sample member (20) is completed is moved to the cleaning and bath section (70) shown in FIG. 3 by the pad X-axis drive motor (64) and can be received in the cleaning and bath section (70), and at this time, the slurry adhering to the polishing pad (62) can be washed in the cleaning and bath section (70).

[0077] In this embodiment, the aforementioned polishing process can be viewed on a display monitor (14) attached to the main body (11). For reference, a wheel member (13) is provided on the main body (11).

[0078] As such, it is obvious to those skilled in the art that the present invention is not limited to the described embodiments and can be modified and varied in various ways without departing from the spirit and scope of the invention. Accordingly, such modified or varied embodiments should be deemed to fall within the scope of the claims of the present invention. Explanation of the symbols

[0079] 1 : Stage for decapsulation system 100 : Y-axis drive unit 110: 1st Y-axis drive unit 111 : 1st Y-axis body 112 : 1st Y-axis drive motor 113 : 1st Y-axis moving body 120 : 2nd Y-axis drive unit 121 : 2nd Y-axis body 122 : 2nd Y-axis drive motor 123 : 2nd Y-axis moving body 200 : R-axis drive unit 210 : R-axis body 211 : R-axis fastening member 220 : R-axis drive motor 230 : Power transmission unit 10 : System Main Body 11: Main body 12: Main body base plate 13: Wheel missing 14 : Display Monitor 20: Sample component 30: Sample holding unit 31: Sample holder section 32 : Holder Plate 33 : Plate wall 40 : Drain Bath 50 : Bass connecting plate 60: Grinding device 61: Grinding body 62: Polishing pad 63 : Pad Z-axis drive motor 64 : Pad X-axis drive motor 70: Cleaning and Bath

Claims

Claim 1 A stage for a decap system, comprising: a Y-axis drive unit coupled to the main body of the decap system and driving a sample holding unit coupled to a sample member in the Y-axis direction during a polishing process; and an R-axis drive unit coupled to the Y-axis drive unit and rotating the sample holding unit in the R-axis direction during a polishing process, wherein the Y-axis drive unit includes a first Y-axis drive unit and a second Y-axis drive unit that move the sample holding unit in the Y-axis direction at different speeds and reciprocating ranges, wherein the first Y-axis drive unit reciprocates the second Y-axis drive unit in the Y-axis direction, and the second Y-axis drive unit reciprocates the R-axis drive unit in the Y-axis direction, wherein the first Y-axis drive unit moves the sample holding unit in the Y-axis direction slower than the second Y-axis drive unit to uniformly polish the entire upper surface area of ​​the sample member, and the second Y-axis drive unit moves the sample holding unit in the Y-axis direction faster than the first Y-axis drive unit to uniformly polish a local area of ​​the upper surface of the sample member. Claim 2 delete Claim 3 delete Claim 4 A stage for a decap system according to claim 1, wherein the second Y-axis drive unit moves the sample holding unit in the Y-axis direction at a speed 2 to 10 times faster than the first Y-axis drive unit. Claim 5 delete Claim 6 A stage for a decap system according to claim 1, wherein the reciprocating range of the sample member reciprocating by the second Y-axis drive unit is narrower than the reciprocating range of the sample member reciprocating by the first Y-axis drive unit. Claim 7 A stage for a decab system according to claim 1, wherein the first Y-axis drive unit is coupled to the system body and the second Y-axis drive unit is coupled to the upper part of the first Y-axis drive unit and moves in the Y-axis direction. Claim 8 A stage for a decap system according to claim 1, wherein the R-axis drive unit is coupled to the upper part of the second Y-axis drive unit and moves in the Y-axis direction together with the Y-axis drive unit, and the sample holding unit is coupled to the upper part of the R-axis drive unit and moves in the Y-axis direction together with the R-axis drive unit. Claim 9 The decapping system according to claim 1 further comprises a polishing device part equipped with a polishing pad for polishing the sample member, and at least one of the first Y-axis driving part and the second Y-axis driving part is a stage for the decapping system that moves the sample holding unit to align the center of the sample member with the polishing position of the polishing pad. Claim 10 In claim 1, the decapping system comprises a polishing device equipped with a polishing pad for polishing the sample member, and the R-axis drive unit rotates the sample holding unit in the same direction as the rotation direction of the polishing pad, for a stage for the decapping system. Claim 11 In claim 10, the R-axis drive unit rotates the sample holding unit slower than the rotational speed of the polishing pad, for a stage for a decapping system. Claim 12 A stage for a decapping system according to claim 1, wherein the decapping system comprises a drain bath coupled to the R-axis drive unit and in which the slurry used in the sample holding unit is collected, the drain bath moves together with the second Y-axis drive unit when the first Y-axis drive unit is driven, and the drain bath moves together with the R-axis drive unit when the second Y-axis drive unit is driven. Claim 13 A stage for a decapping system according to claim 12, wherein the drain bath is not rotated when the sample holding unit is rotated by the operation of the R-axis drive unit. Claim 14 In claim 1, the first Y-axis driving unit and the second Y-axis driving unit are a stage for a decapping system that reciprocates the sample holding unit.

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