Semiconductor module

Abstract

A semiconductor module comprises a module substrate having upper and lower surfaces facing each other, a plurality of semiconductor packages disposed on the upper surface of the module substrate and arranged in a first direction parallel to the upper surface of the module substrate, and a clip structure disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages. The clip structure comprises a body portion disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages, and a coupling portion extending from the body portion across the side of the module substrate onto the lower surface of the module substrate.

Description

Technology Field

[0001] The present invention relates to a semiconductor module, and more specifically, to a semiconductor module comprising memory packages. Background Technology

[0002] The explosive growth of the Internet, artificial intelligence, cloud computing, and high-performance computing (HPC) has led to increased demand for data centers, and immersion cooling is being utilized to efficiently cool the computing hardware that constitutes these centers. Immersion cooling is a method of cooling computing hardware by directly immersing it in a non-conductive liquid, which can reduce the number of cooling components such as heat transfer materials, heat sinks, and fans. Immersion cooling methods include single-phase and two-phase methods. In the case of two-phase immersion cooling, the refrigerant may change from a liquid state to a gaseous state due to heat generated by the computing hardware, which can result in the generation of vapor. While two-phase immersion cooling offers more efficient cooling compared to single-phase immersion cooling, the vapor generated during cooling can compromise the reliability of the semiconductor modules comprising the computing hardware. The problem to be solved

[0003] The technical problem that the present invention aims to solve is to provide a semiconductor module capable of preventing vapor trapping and facilitating heat transfer during ideal liquid immersion cooling.

[0004] Another technical objective of the present invention is to provide a semiconductor module capable of improving reliability. means of solving the problem

[0005] A semiconductor module according to the present invention may include: a module substrate (100) having an upper surface (100a) and a lower surface (100b) facing each other; a plurality of semiconductor packages (200) disposed on the upper surface of the module substrate and arranged in a first direction parallel to the upper surface of the module substrate; and a clip structure (300) disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages. The clip structure may include a body portion (310) disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages; and a coupling portion (320) extending from the body portion across the side of the module substrate onto the lower surface of the module substrate.

[0006] A semiconductor module according to the present invention may include: a module substrate (100) having an upper surface (100a) and a lower surface (100b) facing each other; the module substrate having a first side (100S1) and a second side (100S2) that extend in a first direction and face each other, and a third side (100S3) and a fourth side (100S4) that extend in a second direction and face each other, wherein the first direction and the second direction are parallel to the upper surface of the module substrate and intersect each other; a plurality of semiconductor packages (200) disposed on the upper surface of the module substrate and arranged in the first direction; a plurality of tabs (110) disposed on the upper surface of the module substrate and adjacent to the first side and arranged in the first direction; and a clip structure (300) disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages and the plurality of tabs. The clip structure may include: a body portion (310) disposed on the upper surface of the module substrate and extending in the second direction between the outermost semiconductor package among the plurality of semiconductor packages and the third side of the module substrate; and a coupling portion (320) disposed adjacent to the second side of the module substrate and extending from the body portion across the side of the module substrate onto the lower surface of the module substrate. Effects of the invention

[0007] According to the concept of the present invention, the clip structure can alter the flow of vapor generated during abnormal immersion cooling. Accordingly, the trapping of the vapor, which has a relatively low thermal conductivity, between each of the plurality of semiconductor packages and the module substrate can be suppressed. As a result, heat generated from the plurality of semiconductor packages can be easily transferred to the refrigerant of the abnormal immersion cooling, and accordingly, the reliability of the semiconductor module can be improved.

[0008] Accordingly, a semiconductor module capable of preventing vapor trapping and facilitating heat transfer during abnormal immersion cooling can be provided, and the reliability of the semiconductor module can be improved. Brief explanation of the drawing

[0009] FIG. 1a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 1b is a perspective view showing a first side of the semiconductor module of FIG. 1a, and FIG. 1c is a perspective view showing a second side of the semiconductor module of FIG. 1a. Figure 2 is a cross-sectional view of the semiconductor module of Figure 1a viewed from the second side. Figure 3 is a drawing showing the clip structure of Figure 1a according to the rotation angle. FIG. 4a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 4b is a perspective view showing a first side of the semiconductor module of FIG. 4a, and FIG. 4c is a perspective view showing a second side of the semiconductor module of FIG. 4a. Figure 5 is a cross-sectional view of the semiconductor module of Figure 4a viewed from the second side. FIG. 6a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 6b is a perspective view showing a first side of the semiconductor module of FIG. 6a, and FIG. 6c is a perspective view showing a second side of the semiconductor module of FIG. 6a. FIG. 7 is a cross-sectional view of the semiconductor module of FIG. 6a viewed from the second side. FIG. 8a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 8b is a perspective view showing a first side of the semiconductor module of FIG. 8a, and FIG. 8c is a perspective view showing a second side of the semiconductor module of FIG. 8a. FIG. 9 is a cross-sectional view of the semiconductor module of FIG. 8a viewed from the second side. FIG. 10a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 10b is a perspective view showing a first side of the semiconductor module of FIG. 10a, and FIG. 10c is a perspective view showing a second side of the semiconductor module of FIG. 10a. FIG. 11 is a cross-sectional view of the semiconductor module of FIG. 10a viewed from the second side. FIG. 12a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 12b is a perspective view showing a first side of the semiconductor module of FIG. 12a, and FIG. 12c is a perspective view showing a second side of the semiconductor module of FIG. 12a. FIG. 13 is a cross-sectional view of the semiconductor module of FIG. 12a viewed from the second side. FIG. 14 is a drawing showing a semiconductor module according to some embodiments of the present invention, and is a cross-sectional view taken from the second side of the semiconductor module of FIG. 1a. Figure 15 is a drawing showing the clip structure of Figure 14 according to the rotation angle. FIG. 16 is a drawing showing a semiconductor module according to some embodiments of the present invention, and is a cross-sectional view taken from the second side of the semiconductor module of FIG. 10a. FIG. 17 is a drawing showing a semiconductor module according to some embodiments of the present invention, and is a cross-sectional view taken from the second side of the semiconductor module of FIG. 12a. FIG. 18a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 18b is a perspective view showing a first side of the semiconductor module of FIG. 18a, and FIG. 18c is a perspective view showing a second side of the semiconductor module of FIG. 18a. FIG. 19 is a cross-sectional view of the semiconductor module of FIG. 18a viewed from the second side. FIG. 20 is a drawing showing the clip structure of FIG. 18a according to the rotation angle. Specific details for implementing the invention

[0010] The present invention will be described in detail below by explaining embodiments of the present invention with reference to the attached drawings.

[0011] FIG. 1a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 1b is a perspective view showing a first side of the semiconductor module of FIG. 1a, and FIG. 1c is a perspective view showing a second side of the semiconductor module of FIG. 1a. FIG. 2 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 1a. FIG. 3 is a drawing showing the clip structure of FIG. 1a according to a rotation angle.

[0012] Referring to FIGS. 1a, 1b, 1c and 2, the semiconductor module (1) may include a module substrate (100), a plurality of tabs (110), a plurality of semiconductor packages (200), a clip structure (300), and a plurality of semiconductor elements (400).

[0013] The module substrate (100) may be a printed circuit board (PCB) having a circuit pattern. The module substrate (100) may have an upper surface (100a) and a lower surface (100b) facing each other. The module substrate (100) may have a first side (100S1) and a second side (100S2) that extend in a first direction (D1) and face each other, and a third side (100S3) and a fourth side (100S4) that extend in a second direction (D2) and face each other. The first direction (D1) and the second direction (D2) may be parallel to the upper surface (100a) of the module substrate (100) and may intersect each other (e.g., perpendicular).

[0014] The plurality of tabs (110) may be arranged on the upper surface (100a) of the module substrate (100) and adjacent to the first side (100S1). The plurality of tabs (110) may be arranged in the first direction (D1) on the first side (100S1) of the module substrate (100). The plurality of tabs (110) may include a metal (e.g., copper or aluminum). The function and arrangement of the plurality of tabs (110) may be standardized and, for example, may satisfy JEDEC standard specifications. The plurality of tabs (110) may function as input / output terminals for data signals or as transmission channels for command / address (C / A) signals.

[0015] The plurality of semiconductor packages (200) may be disposed on the upper surface (100a) of the module substrate (100) and may be arranged in the first direction (D1). The plurality of tabs (110) may be spaced apart from the plurality of semiconductor packages (200) along the second direction (D2). The plurality of semiconductor packages (200) may be electrically connected to the plurality of tabs (110) through wiring within the module substrate (100). Accordingly, data signals and command / address signals may be transmitted and received between the plurality of semiconductor packages (200) and the plurality of tabs (110).

[0016] Each of the plurality of semiconductor packages (200) may include a package substrate (220), a semiconductor chip (230), and a molding film (240). The package substrate (220) may, for example, be a printed circuit board (PCB) or a rewiring board. The semiconductor chip (230) may be mounted on the package substrate (220) and may be a memory chip, a logic chip, an application processor (AP) chip, or a system-on-chip (SOC). The molding film (240) may be placed on the package substrate (220) to seal the semiconductor chip (230). The plurality of semiconductor packages (200) may be memory packages, in which case the semiconductor chip (230) may be a memory chip. The semiconductor chip (230) may, for example, include a DRAM, SRAM, SDRAM, or MRAM device.

[0017] Connection terminals (210) may be interposed between each of the package substrates (220) of the plurality of semiconductor packages (200) and the module substrate (100). Each of the plurality of semiconductor packages (200) may be electrically connected to the module substrate (100) (for example, to the wiring within the module substrate (100)) through the connection terminals (210). The connection terminals (210) may include at least one of a pillar, a bump, and a solder ball, and may include a conductive material. Each of the semiconductor chips (230) of the plurality of semiconductor packages (200) may be electrically connected to the module substrate (100) (for example, to the wiring within the module substrate (100)) through the package substrate (220) and the connection terminals (210).

[0018] The plurality of semiconductor devices (400) may be disposed on the upper surface (100a) of the module substrate (100) and may be disposed so as to be horizontally spaced apart from the plurality of semiconductor packages (200). The plurality of semiconductor devices (400) may include active devices or passive devices (e.g., resistors, capacitors, and inductors). The plurality of semiconductor devices (400) may be electrically connected to the plurality of semiconductor packages (200) through the module substrate (100, e.g., the wiring within the module substrate (100)).

[0019] Referring to FIGS. 1a, 1b, 1c, 2 and 3, the clip structure (300) may be disposed on the upper surface (100a) of the module substrate (100) and may be horizontally spaced apart from the plurality of semiconductor packages (200), the plurality of semiconductor elements (400), and the plurality of tabs (110). The plurality of tabs (110) may be spaced apart from the clip structure (300) along the second direction (D2). The clip structure (300) may include a body portion (310) disposed on the upper surface (100a) of the module substrate (100) and horizontally spaced apart from the plurality of semiconductor packages (200), the plurality of semiconductor elements (400), and the plurality of tabs (110), and a coupling portion (320) extending from the body portion (310) across the side (100c) of the module substrate (100) onto the lower surface (100b) of the module substrate (100). The coupling portion (320) of the clip structure (300) may be disposed adjacent to the second side (100S2) of the module substrate (100), and the body portion (310) of the clip structure (300) may be spaced apart from the plurality of tabs (110) along the second direction (D2).

[0020] According to some embodiments, the body portion (310) of the clip structure (300) may be positioned between the outermost semiconductor package (200) among the plurality of semiconductor packages (200) and the third side (100S3) of the module substrate (100). The outermost semiconductor package (200) may be the semiconductor package (200) closest to the third side (100S3) of the module substrate (100) among the plurality of semiconductor packages (200). The body portion (310) may have a bar shape extending in the second direction (D2) between the outermost semiconductor package (200) and the third side (100S3) of the module substrate (100).

[0021] The body portion (310) may have a first side (310S1) facing the outermost semiconductor package (200) and a second side (310S2) facing the first side (310S1). According to some embodiments, the second side (310S2) of the body portion (310) may be curved. When viewed from the second side (100S2) of the module substrate (100), the body portion (310) may have a half-streamline form side wall (300W) as shown in FIG. 2. The body portion (310) may have a height (H) along a third direction (D3) perpendicular to the upper surface (100a) of the module substrate (100), and the height (H) of the body portion (310) may be, for example, 0.01 mm to 100 mm. The maximum height (H) of the body portion (310) may be substantially the same as the height of each of the uppermost surfaces of the plurality of semiconductor packages (200). The body portion (310) may have a width (W) along the first direction (D1), and the width (W) of the body portion (310) may be, for example, 0.01 mm to 200 mm. The body portion (310) may have a length (L) along the second direction (D2), and the length (L) of the body portion (310) may be, for example, 0.01 mm to 200 mm.

[0022] The coupling portion (320) may include a first portion (P1) extending from the side wall (300W) of the body portion (310) onto the upper surface (100a) of the module substrate (100), a second portion (P2) extending from the first portion (P1) onto the side surface (100c) of the module substrate (100), and a third portion (P3) extending from the second portion (P2) onto the lower surface (100b) of the module substrate (100). The module substrate (100) may be fitted between the first portion (P1) and the third portion (P3) of the coupling portion (320), and accordingly, the clip structure (300) may be physically attached to the module substrate (100).

[0023] The clip structure (300) may include a non-conductive material. For example, the clip structure (300) may be formed of plastic, fiber, rubber, sponge, urethane, carbon material, porous material, etc. The clip structure (300) may be electrically or signal-wise separated from the plurality of semiconductor packages (200), the plurality of tabs (110), and the plurality of semiconductor devices (400).

[0024] When the semiconductor module (1) is cooled by a two-phase immersion cooling method, vapor generated according to the state change of the non-conductive refrigerant may be trapped between each of the plurality of semiconductor packages (200) and the module substrate (100). In this case, due to the low thermal conductivity of the vapor, the transfer of heat generated from the plurality of semiconductor packages (200) to the non-conductive refrigerant may be hindered, and accordingly, the reliability of the semiconductor module (1) may be reduced.

[0025] According to the concept of the present invention, the clip structure (300) can change the flow of vapor generated during abnormal liquid immersion cooling. For example, the vapor generated during abnormal liquid immersion cooling can rise along the first direction (D1), and the path of the vapor's movement can be changed by the clip structure (300). Accordingly, the trapping of the vapor between each of the plurality of semiconductor packages (200) and the module substrate (100) can be suppressed, and the non-conductive refrigerant having high thermal conductivity can fill the space between each of the plurality of semiconductor packages (200) and the module substrate (100). As a result, heat generated from the plurality of semiconductor packages (200) can be easily transferred to the non-conductive refrigerant, and accordingly, the reliability of the semiconductor module (1) can be improved. In addition, as the second side (310S2) of the body portion (310) of the clip structure (300) has a curved shape, the fluidity of the non-conductive refrigerant used for ideal liquid immersion cooling can be improved.

[0026] FIG. 4a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 4b is a perspective view showing a first side of the semiconductor module of FIG. 4a, and FIG. 4c is a perspective view showing a second side of the semiconductor module of FIG. 4a. FIG. 5 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 4a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0027] Referring to FIG. 4a, FIG. 4b, FIG. 4c and FIG. 5, the body portion (310) of the clip structure (300) may have a first side (310S1) facing the outermost semiconductor package (200) and a second side (310S2) facing the first side (310S1). According to some embodiments, the second side (310S2) of the body portion (310) may be a curved surface and may have multiple different curvatures. For example, the second side (310S2) of the body portion (310) may be a curved surface having two different curvatures. When viewed from the second side (100S2) of the module substrate (100), the body portion (310) may have a half-dolphin form sidewall (300W), as shown in FIG. 5.

[0028] According to the embodiments, the second side (310S2) of the body portion (310) of the clip structure (300) has a curved shape having a plurality of different curvatures, so that the fluidity of the non-conductive refrigerant used for ideal immersion cooling can be improved.

[0029] FIG. 6a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 6b is a perspective view showing a first side of the semiconductor module of FIG. 6a, and FIG. 6c is a perspective view showing a second side of the semiconductor module of FIG. 6a. FIG. 7 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 6a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0030] Referring to FIGS. 6A, 6B, 6C and FIG. 7, the body portion (310) of the clip structure (300) may have a first side (310S1) facing the outermost semiconductor package (200) and a second side (310S2) facing the first side (310S1). According to some embodiments, the second side (310S2) of the body portion (310) may be an angled surface. When viewed from the second side (100S2) of the module substrate (100), the body portion (310) may have a rectangular side wall (300W), as shown in FIG. 7.

[0031] FIG. 8a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 8b is a perspective view showing a first side of the semiconductor module of FIG. 8a, and FIG. 8c is a perspective view showing a second side of the semiconductor module of FIG. 8a. FIG. 9 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 8a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0032] Referring to FIG. 8a, FIG. 8b, FIG. 8c and FIG. 9, the body portion (310) of the clip structure (300) may have a first side (310S1) facing the outermost semiconductor package (200) and a second side (310S2) facing the first side (310S1). According to some embodiments, the second side (310S2) of the body portion (310) may have a planar shape inclined with respect to the upper surface (100a) of the module substrate (100). When viewed from the second side (100S2) of the module substrate (100), the body portion (310) may have a side wall (300W) of a triangle (e.g., a right triangle), as shown in FIG. 9.

[0033] FIG. 10a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 10b is a perspective view showing a first side of the semiconductor module of FIG. 10a, and FIG. 10c is a perspective view showing a second side of the semiconductor module of FIG. 10a. FIG. 11 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 10a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0034] Referring to FIGS. 10a, 10b, 10c and FIG. 11, the clip structure (300) may be disposed on the upper surface (100a) of the module substrate (100) and may be horizontally spaced apart from the plurality of semiconductor packages (200), the plurality of semiconductor elements (400), and the plurality of tabs (110). The plurality of tabs (110) may be spaced apart from the clip structure (300) along the second direction (D2). The clip structure (300) may include a body portion (310, 330) disposed on the upper surface (100a) of the module substrate (100) and horizontally spaced apart from the plurality of semiconductor packages (200), the plurality of semiconductor elements (400), and the plurality of tabs (110), and a coupling portion (320) extending from the body portion (310, 330) across the side (100c) of the module substrate (100) onto the lower surface (100b) of the module substrate (100). The coupling portion (320) of the clip structure (300) may be disposed adjacent to the second side (100S2) of the module substrate (100), and the body portion (310, 330) of the clip structure (300) may be spaced apart from the plurality of tabs (110) along the second direction (D2).

[0035] According to some embodiments, the body portion (310, 330) of the clip structure (300) may include a first body portion (310) disposed between the outermost semiconductor package (200) among the plurality of semiconductor packages (200) and the third side (100S3) of the module substrate (100), and a second body portion (330) disposed adjacent to the second side (100S2) of the module substrate (100) and extending in the first direction (D1) from one side of the plurality of semiconductor packages (200). The outermost semiconductor package (200) may be the semiconductor package (200) closest to the third side (100S3) of the module substrate (100) among the plurality of semiconductor packages (200). The first body portion (310) may have a bar shape extending in the second direction (D2) between the outermost semiconductor package (200) and the third side (100S3) of the module substrate (100). The second body portion (330) may have a bar shape extending in the first direction (D1) from one side of the plurality of semiconductor packages (200). The first body portion (310) and the second body portion (330) may be connected to each other on the upper surface (100a) of the module substrate (100) and may form an L-shape in a planar view.

[0036] The first body portion (310) may have a first side (310S1) facing the outermost semiconductor package (200) and a second side (310S2) facing the first side (310S1). According to some embodiments, the second side (310S2) of the first body portion (310) may be a curved surface. When viewed from the second side (100S2) of the module substrate (100), the first body portion (310) may have a side wall (310W) in a half-streamline form, as shown in FIG. 11. According to other embodiments, the second side (310S2) of the first body portion (310) may be a curved surface having two different curvatures, as shown in FIG. 5. In this case, when viewed from the second side (100S2) of the module substrate (100), the first body portion (310) may have a half-dolphin form side wall (310W) as shown in FIG. 5. According to other embodiments, the second side (310S2) of the first body portion (310) may be an angled surface as shown in FIG. 7. In this case, when viewed from the second side (100S2) of the module substrate (100), the first body portion (310) may have a rectangular side wall (310W) as shown in FIG. 7. According to other embodiments, the second side (310S2) of the first body portion (310) may have a planar shape inclined with respect to the upper surface (100a) of the module substrate (100), as shown in FIG. 9. In this case, when viewed from the second side (100S2) of the module substrate (100), the first body part (310) may have a side wall (310W) of a triangle (e.g., a right triangle) as illustrated in FIG. 9. The second body part (330) may have a flat plate shape extending in the first direction (D1).

[0037] As described with reference to FIG. 3, the coupling portion (320) may include a first portion (P1) extending from the side wall (300W) of the first body portion (310) onto the upper surface (100a) of the module substrate (100), a second portion (P2) extending from the first portion (P1) onto the side surface (100c) of the module substrate (100), and a third portion (P3) extending from the second portion (P2) onto the lower surface (100b) of the module substrate (100). The module substrate (100) may be fitted between the first portion (P1) and the third portion (P3) of the coupling portion (320), and accordingly, the clip structure (300) may be physically attached to the module substrate (100).

[0038] FIG. 12a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 12b is a perspective view showing a first side of the semiconductor module of FIG. 12a, and FIG. 12c is a perspective view showing a second side of the semiconductor module of FIG. 12a. FIG. 13 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 12a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0039] Referring to FIGS. 12a, 12b, 12c and FIG. 13, the clip structure (300) may be disposed on the upper surface (100a) of the module substrate (100) and may be horizontally spaced apart from the plurality of semiconductor packages (200), the plurality of semiconductor elements (400), and the plurality of tabs (110). The plurality of tabs (110) may be spaced apart from the clip structure (300) along the second direction (D2). The clip structure (300) may include a body portion (310, 330, 340, 350) disposed on the upper surface (100a) of the module substrate (100) and horizontally spaced from the plurality of semiconductor packages (200), the plurality of semiconductor elements (400), and the plurality of tabs (110), and a coupling portion (320A, 320B) extending from the body portion (310, 330, 340, 350) across the side (100c) of the module substrate (100) onto the lower surface (100b) of the module substrate (100). The coupling portions (320A, 320B) of the clip structure (300) may be positioned adjacent to the second side (100S2) of the module substrate (100), and the body portions (310, 330, 340, 350) of the clip structure (300) may be spaced apart from the plurality of tabs (110) along the second direction (D2).

[0040] According to some embodiments, the body portions (310, 330, 340, 350) of the clip structure (300) may include a first body portion (310) disposed between the first outermost semiconductor package (200) among the plurality of semiconductor packages (200) and the third side (100S3) of the module substrate (100), a second body portion (330) disposed adjacent to the second side (100S2) of the module substrate (100) and extending in the first direction (D1) from one side of the plurality of semiconductor packages (200), a third body portion (350) disposed between the second outermost semiconductor package (200) among the plurality of semiconductor packages (200) and the fourth side (100S4) of the module substrate (100), and a fourth body portion (340) disposed between the plurality of semiconductor packages (200). The first outermost semiconductor package (200) may be the semiconductor package (200) closest to the third side (100S3) of the module substrate (100) among the plurality of semiconductor packages (200), and the second outermost semiconductor package (200) may be the semiconductor package (200) closest to the fourth side (100S4) of the module substrate (100) among the plurality of semiconductor packages (200). The first body portion (310) may have a bar shape extending in the second direction (D2) between the first outermost semiconductor package (200) and the third side (100S3) of the module substrate (100). The second body portion (330) may have a bar shape extending in the first direction (D1) from one side of the plurality of semiconductor packages (200). The third body portion (350) may have a shape that extends in the second direction (D2) between the second outermost semiconductor package (200) and the fourth side (100S4) of the module substrate (100).The fourth body portion (340) may have a bar shape extending in the second direction (D2) between the plurality of semiconductor packages (200). The first body portion (310), the second body portion (330), the third body portion (350), and the fourth body portion (340) may be connected to each other on the upper surface (100a) of the module substrate (100) and may form an E shape in planar view.

[0041] The first body portion (310) may have a first side (310S1) facing the first outermost semiconductor package (200) and a second side (310S2) facing the first side (310S1). According to some embodiments, the second side (310S2) of the first body portion (310) may be a curved surface. When viewed from the second side (100S2) of the module substrate (100), the first body portion (310) may have a side wall (310W) in a half-streamline form, as shown in FIG. 13. According to other embodiments, the second side (310S2) of the first body portion (310) may be a curved surface having two different curvatures, as shown in FIG. 5. In this case, when viewed from the second side (100S2) of the module substrate (100), the first body portion (310) may have a half-dolphin form side wall (310W) as shown in FIG. 5. According to other embodiments, the second side (310S2) of the first body portion (310) may be an angled surface as shown in FIG. 7. In this case, when viewed from the second side (100S2) of the module substrate (100), the first body portion (310) may have a rectangular side wall (310W) as shown in FIG. 7. According to other embodiments, the second side (310S2) of the first body portion (310) may have a planar shape inclined with respect to the upper surface (100a) of the module substrate (100), as shown in FIG. 9. In this case, when viewed from the second side (100S2) of the module substrate (100), the first body part (310) may have a side wall (310W) of a triangle (e.g., a right triangle) as shown in FIG. 9.

[0042] The third body portion (350) may have a shape symmetrical to the first body portion (310). Specifically, the third body portion (350) may have a third side (350S3) facing the second outermost semiconductor package (200), and a fourth side (350S4) facing the third side (350S3). According to some embodiments, the fourth side (350S4) of the third body portion (350) may be curved. When viewed from the second side (100S2) of the module substrate (100), the third body portion (350) may have a side wall (350W) in a half-streamline form, as shown in FIG. 13. According to other embodiments, the fourth side (350S4) of the third body part (350) may be a curved surface having two different curvatures, as shown in FIG. 5. In this case, when viewed from the second side (100S2) of the module substrate (100), the third body part (350) may have a half-dolphin form side wall (350W) as shown in FIG. 5. According to yet other embodiments, the fourth side (350S4) of the third body part (350) may be an angled surface, as shown in FIG. 7. In this case, when viewed from the second side (100S2) of the module substrate (100), the third body part (350) may have a rectangular side wall (350W) as shown in FIG. 7. According to other embodiments, the fourth side (350S4) of the third body part (350) may have a planar shape inclined with respect to the upper surface (100a) of the module substrate (100), as shown in FIG. 9. In this case, when viewed from the second side (100S2) of the module substrate (100), the third body part (350) may have a side wall (350W) of a triangle (e.g., a right triangle) as shown in FIG. 9.

[0043] The second body part (330) may have a flat plate shape extending in the first direction (D1), and the fourth body part (340) may have a flat plate shape extending in the second direction (D2).

[0044] The above coupling portions (320A, 320B) may include a first coupling portion (320A) extending from the side wall (310W) of the first body portion (310) across the side (100c) of the module substrate (100) onto the lower surface (100b) of the module substrate (100), and a second coupling portion (320B) extending from the side wall (350W) of the third body portion (350) across the side (100c) of the module substrate (100) onto the lower surface (100b) of the module substrate (100). Each of the first coupling portion (320A) and the second coupling portion (320B) may have substantially the same shape and function as the coupling portion (320) described with reference to FIG. 3.

[0045] FIG. 14 is a drawing showing a semiconductor module according to some embodiments of the present invention, and is a cross-sectional view taken from the second side of the semiconductor module of FIG. 1a. FIG. 15 is a drawing showing the clip structure of FIG. 14 according to a rotation angle. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0046] Referring to FIGS. 1a, 14, and 15, the semiconductor module (1) may include upper semiconductor packages (200a) disposed on the upper surface (100a) of the module substrate (100), and lower semiconductor packages (200b) disposed on the lower surface (100b) of the module substrate (100). The plurality of semiconductor packages (200) shown in FIG. 1a may correspond to the upper semiconductor packages (200a), and the plurality of tabs (110) may be referred to as upper tabs.

[0047] The upper semiconductor packages (200a) may be arranged in the first direction (D1) on the upper surface (100a) of the module substrate (100). The upper tabs (110) may be spaced apart from the upper semiconductor packages (200a) along the second direction (D2). The upper semiconductor packages (200a) may be electrically connected to the upper tabs (110) through wiring within the module substrate (100). Accordingly, data signals and command / address signals may be transmitted and received between the upper semiconductor packages (200a) and the upper tabs (110).

[0048] Each of the upper semiconductor packages (200a) may include an upper package substrate (220a), an upper semiconductor chip (230a), and an upper molding film (240a). The upper package substrate (220a) may be, for example, a printed circuit board (PCB) or a rewiring board. The upper semiconductor chip (230a) may be mounted on the upper package substrate (220a) and may be a memory chip, a logic chip, an application processor (AP) chip, or a system-on-chip (SOC). The upper molding film (240a) may be placed on the upper package substrate (220a) to seal the upper semiconductor chip (230a). The upper semiconductor packages (200a) may be memory packages, in which case the upper semiconductor chip (230a) may be a memory chip. The upper semiconductor chip (230a) may include, for example, a DRAM, SRAM, SDRAM, or MRAM device.

[0049] Upper connection terminals (210a) may be interposed between each upper package substrate (220a) of the upper semiconductor packages (200a) and the module substrate (100). Each of the upper semiconductor packages (200a) may be electrically connected to the module substrate (100) (for example, to the wiring within the module substrate (100)) through the upper connection terminals (210a). The upper connection terminals (210a) may include at least one of a pillar, a bump, and a solder ball, and may include a conductive material. Each of the upper semiconductor chips (230a) of the upper semiconductor packages (200a) may be electrically connected to the module substrate (100) (for example, to the wiring within the module substrate (100)) through the upper package substrate (220a) and the upper connection terminals (210a).

[0050] The lower semiconductor packages (200b) may be arranged in the first direction (D1) on the lower surface (100b) of the module substrate (100). Although not illustrated, lower tabs may be disposed on the lower surface (100b) of the module substrate (100). The lower tabs may be configured substantially identically to the upper tabs (110) and may be spaced apart from the lower semiconductor packages (200b). The lower semiconductor packages (200b) may be electrically connected to the lower tabs through wiring within the module substrate (100). Accordingly, data signals and command / address signals may be transmitted and received between the lower semiconductor packages (200b) and the lower tabs.

[0051] Each of the lower semiconductor packages (200b) may include a lower package substrate (220b), a lower semiconductor chip (230b), and a lower molding film (240b). The lower package substrate (220b) may be, for example, a printed circuit board (PCB) or a rewiring board. The lower semiconductor chip (230b) may be mounted on the lower package substrate (220b) and may be a memory chip, a logic chip, an application processor (AP) chip, or a system-on-chip (SOC). The lower molding film (240b) may be placed on the lower package substrate (220b) to seal the lower semiconductor chip (230b). The lower semiconductor packages (200b) may be memory packages, in which case the lower semiconductor chip (230b) may be a memory chip. The lower semiconductor chip (230b) may include, for example, a DRAM, SRAM, SDRAM, or MRAM device.

[0052] Lower connection terminals (210b) may be interposed between each of the lower package substrates (220b) of the lower semiconductor packages (200b) and the module substrate (100). Each of the lower semiconductor packages (200b) may be electrically connected to the module substrate (100) (for example, to the wiring within the module substrate (100)) through the lower connection terminals (210b). The lower connection terminals (210b) may include at least one of a pillar, a bump, and a solder ball, and may include a conductive material. Each of the lower semiconductor chips (230b) of the lower semiconductor packages (200b) may be electrically connected to the module substrate (100) (for example, to the wiring within the module substrate (100)) through the lower package substrate (220b) and the lower connection terminals (210b).

[0053] The plurality of semiconductor devices (400) may be disposed on the upper surface (100a) of the module substrate (100) and may be disposed so as to be horizontally spaced apart from the upper semiconductor packages (200a). Additionally, the plurality of semiconductor devices (400) may be disposed on the lower surface (100b) of the module substrate (100) and may be disposed so as to be horizontally spaced apart from the lower semiconductor packages (200b).

[0054] The clip structure (300) may include an upper body portion (310a) disposed on the upper surface (100a) of the module substrate (100), a lower body portion (310b) disposed on the lower surface (100b) of the module substrate (100), and a coupling portion (320) extending from the upper body portion (310a) across the side (100c) of the module substrate (100) to the lower body portion (310b). According to some embodiments, the upper body portion (310a) may be configured substantially identically to the body portion (310) described with reference to FIGS. 1a, 1b, 1c and 2. According to other embodiments, the upper body portion (310a) may be configured substantially identically to the body portion (310) described with reference to FIGS. 4a, 4b, 4c and 5, the body portion (310) described with reference to FIGS. 6a, 6b, 6c and 7, or the body portion (310) described with reference to FIGS. 8a, 8b, 8c and 9. The lower body portion (310b) may be configured substantially identically to the upper body portion (310a). The upper body portion (310a) and the lower body portion (310b) may have shapes that are symmetrical to each other.

[0055] The above-mentioned coupling portion (320) may include a first portion (P1) extending from the side wall of the upper body portion (310a) onto the upper surface (100a) of the module substrate (100), a second portion (P2) extending from the first portion (P1) onto the side surface (100c) of the module substrate (100), and a third portion (P3) extending from the side wall of the lower body portion (310b) onto the lower surface (100b) of the module substrate (100). The first to third portions (P1, P2, P3) may be connected to each other and may form a single coupling portion (320). The above module substrate (100) can be fitted between the first part (P1) and the third part (P3) of the coupling part (320), and accordingly, the clip structure (300) can be physically attached to the module substrate (100).

[0056] FIG. 16 is a drawing showing a semiconductor module according to some embodiments of the present invention, and is a cross-sectional view taken from the second side of the semiconductor module of FIG. 10a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIG. 1a, FIG. 14, and FIG. 15 will be mainly explained.

[0057] Referring to FIG. 10a and FIG. 16, the clip structure (300) may include an upper body portion (310a, 330a) disposed on the upper surface (100a) of the module substrate (100), a lower body portion (310b, 330b) disposed on the lower surface (100b) of the module substrate (100), and a coupling portion (320) extending from the upper body portion (310a, 330a) across the side (100c) of the module substrate (100) to the lower body portion (310b, 330b). Each of the upper body portion (310a, 330a) and the lower body portion (310b, 330b) may be configured substantially identically to the body portion (310, 330) described with reference to FIG. 10a, FIG. 10b, FIG. 10c and FIG. 11.

[0058] For example, the upper body portion (310a, 330a) may include a first upper body portion (310a) disposed between the outermost upper semiconductor package (200a) among the upper semiconductor packages (200a) and the third side (100S3) of the module substrate (100), and a second upper body portion (330a) disposed adjacent to the second side (100S2) of the module substrate (100) and extending in the first direction (D1) from one side of the upper semiconductor packages (200a). The outermost upper semiconductor package (200a) may be the upper semiconductor package (200a) closest to the third side (100S3) of the module substrate (100) among the upper semiconductor packages (200a). The first upper body portion (310a) may have a bar shape extending in the second direction (D2) between the outermost upper semiconductor package (200a) and the third side (100S3) of the module substrate (100). The second upper body portion (330a) may have a bar shape extending in the first direction (D1) from one side of the upper semiconductor packages (200a). The first upper body portion (310a) and the second upper body portion (330a) may be connected to each other on the upper surface (100a) of the module substrate (100) and may form an L-shape in planar view.

[0059] The lower body portion (310b, 330b) may be configured substantially identically to the upper body portion (310a, 310a). The upper body portion (310a, 310a) and the lower body portion (310b, 330b) may have shapes that are symmetrical to each other. For example, the lower body portion (310b, 330b) may include a first lower body portion (310b) disposed between the outermost lower semiconductor package (200b) among the lower semiconductor packages (200b) and the third side (100S3) of the module substrate (100), and a second lower body portion (330b) disposed adjacent to the second side (100S2) of the module substrate (100) and extending in the first direction (D1) from one side of the lower semiconductor packages (200b). The outermost lower semiconductor package (200b) may be the lower semiconductor package (200b) closest to the third side (100S3) of the module substrate (100) among the lower semiconductor packages (200b). The first lower body portion (310b) may have a bar shape extending in the second direction (D2) between the outermost lower semiconductor package (200b) and the third side (100S3) of the module substrate (100). The second lower body portion (330b) may have a bar shape extending in the first direction (D1) from one side of the lower semiconductor packages (200b). The first lower body portion (310b) and the second lower body portion (330b) may be connected to each other on the lower surface (100b) of the module substrate (100) and may form an L-shape in a planar view.

[0060] As described with reference to FIG. 15, the above-described coupling portion (320) may include a first portion (P1) extending from the side wall of the first upper body portion (310a) onto the upper surface (100a) of the module substrate (100), a second portion (P2) extending from the first portion (P1) onto the side surface (100c) of the module substrate (100), and a third portion (P3) extending from the side wall of the first lower body portion (310b) onto the lower surface (100b) of the module substrate (100). The first to third portions (P1, P2, P3) may be connected to each other and may form a single coupling portion (320). The above module substrate (100) can be fitted between the first part (P1) and the third part (P3) of the coupling part (320), and accordingly, the clip structure (300) can be physically attached to the module substrate (100).

[0061] FIG. 17 is a drawing showing a semiconductor module according to some embodiments of the present invention, and is a cross-sectional view taken from the second side of the semiconductor module of FIG. 12a. For the sake of simplicity, the differences from the semiconductor module described with reference to FIG. 1a, FIG. 14, and FIG. 15 will be mainly explained.

[0062] Referring to FIG. 12a and FIG. 17, the clip structure (300) may include an upper body portion (310a, 330a, 340a, 350a) disposed on the upper surface (100a) of the module substrate (100), a lower body portion (310b, 330b, 340b, 350b) disposed on the lower surface (100b) of the module substrate (100), and a coupling portion (320A, 320B) extending from the upper body portion (310a, 330a, 340a, 350a) across the side surface (100c) of the module substrate (100) to the lower body portion (310b, 330b, 340b, 350b). Each of the upper body parts (310a, 330a, 340a, 350a) and the lower body parts (310b, 330b, 340b, 350b) may be configured substantially identically to the body parts (310, 330, 340, 350) described with reference to FIG. 12a, FIG. 12b, FIG. 12c and FIG. 13.

[0063] For example, the upper body portions (310a, 330a, 340a, 350a) comprise a first upper body portion (310a) disposed between the first outermost upper semiconductor package (200a) among the upper semiconductor packages (200a) and the third side (100S3) of the module substrate (100), a second upper body portion (330a) disposed adjacent to the second side (100S2) of the module substrate (100) and extending in the first direction (D1) from one side of the upper semiconductor packages (200a), a third upper body portion (350a) disposed between the second outermost upper semiconductor package (200a) among the upper semiconductor packages (200a) and the fourth side (100S4) of the module substrate (100), and a fourth upper body portion disposed between the upper semiconductor packages (200a). It may include a body portion (340a). The first outermost upper semiconductor package (200a) may be the upper semiconductor package (200a) closest to the third side (100S3) of the module substrate (100) among the upper semiconductor packages (200a), and the second outermost upper semiconductor package (200a) may be the upper semiconductor package (200a) closest to the fourth side (100S4) of the module substrate (100) among the upper semiconductor packages (200a). The first upper body portion (310a) may have a bar shape extending in the second direction (D2) between the first outermost upper semiconductor package (200a) and the third side (100S3) of the module substrate (100). The second upper body portion (330a) may have a bar shape extending in the first direction (D1) from one side of the upper semiconductor packages (200a). The third upper body portion (350a) may have a bar shape extending in the second direction (D2) between the second outermost upper semiconductor package (200a) and the fourth side (100S4) of the module substrate (100).The fourth upper body portion (340a) may have a bar shape extending in the second direction (D2) between the upper semiconductor packages (200a). The first upper body portion (310a), the second upper body portion (330a), the third upper body portion (350a) and the fourth upper body portion (340a) may be connected to each other on the upper surface (100a) of the module substrate (100) and may form an E shape in planar view.

[0064] The lower body portions (310b, 330b, 340b, 350b) may be configured substantially identically to the upper body portions (310a, 330a, 340a, 350a). The upper body portions (310a, 330a, 340a, 350a) and the lower body portions (310b, 330b, 340b, 350b) may have shapes that are symmetrical to each other. For example, the lower body portions (310b, 330b, 340b, 350b) include a first lower body portion (310b) disposed between the first outermost lower semiconductor package (200b) among the lower semiconductor packages (200b) and the third side (100S3) of the module substrate (100), a second lower body portion (330b) disposed adjacent to the second side (100S2) of the module substrate (100) and extending in the first direction (D1) from one side of the lower semiconductor packages (200b), and the second outermost lower semiconductor among the lower semiconductor packages (200b). It may include a third lower body portion (350b) disposed between the package (200b) and the fourth side (100S4) of the module substrate (100), and a fourth lower body portion (340b) disposed between the lower semiconductor packages (200b). The first outermost lower semiconductor package (200b) may be the lower semiconductor package (200b) closest to the third side (100S3) of the module substrate (100) among the lower semiconductor packages (200b), and the second outermost lower semiconductor package (200b) may be the lower semiconductor package (200b) closest to the fourth side (100S4) of the module substrate (100) among the lower semiconductor packages (200b). The first lower body portion (310b) may be the first outermost lower semiconductor package (200b) and the third side (100S4) of the module substrate (100). It may have a bar shape extending in the second direction (D2) between the sides (100S3).The second lower body portion (330b) may have a bar shape extending in the first direction (D1) from one side of the lower semiconductor packages (200b). The third lower body portion (350b) may have a bar shape extending in the second direction (D2) between the second outermost lower semiconductor package (200b) and the fourth side (100S4) of the module substrate (100). The fourth lower body portion (340b) may have a bar shape extending in the second direction (D2) between the lower semiconductor packages (200b). The first lower body portion (310b), the second lower body portion (330b), the third lower body portion (350b), and the fourth lower body portion (340b) may be connected to each other on the lower surface (100b) of the module substrate (100) and may form an E shape in planar view.

[0065] The above coupling portions (320A, 320B) may include a first coupling portion (320A) extending from the first upper body portion (310a) across the side (100c) of the module substrate (100) to the first lower body portion (310b), and a second coupling portion (320B) extending from the third upper body portion (350a) across the side (100c) of the module substrate (100) to the third lower body portion (350b). Each of the first coupling portion (320A) and the second coupling portion (320B) may be configured substantially identically to the coupling portion (320) described with reference to FIG. 15.

[0066] FIG. 18a is a plan view of a semiconductor module according to some embodiments of the present invention, FIG. 18b is a perspective view showing a first side of the semiconductor module of FIG. 18a, and FIG. 18c is a perspective view showing a second side of the semiconductor module of FIG. 18a. FIG. 19 is a cross-sectional view viewed from the second side of the semiconductor module of FIG. 18a. FIG. 20 is a drawing showing the clip structure of FIG. 18a according to a rotation angle. For the sake of simplicity, the differences from the semiconductor module described with reference to FIGS. 1a, 1b, 1c, 2, and 3 will be mainly explained.

[0067] Referring to FIGS. 18a, 18b, 18c, 19, and 20, the body portion (310) of the clip structure (300) may have a columnar shape extending in the second direction (D2) between the outermost semiconductor package (200) and the third side (100S3) of the module substrate (100). When viewed from the second side (100S2) of the module substrate (100), the body portion (310) may have a half-streamline form sidewall (300W) as shown in FIG. 19. Additionally, when viewed from the first side (100S1) of the module substrate (100), the body portion (310) may have a half-streamline form sidewall as shown in FIG. 18b.

[0068] The above-mentioned coupling portion (320) may extend from the bottom surface of the body portion (310) across the side (100c) of the module substrate (100) onto the bottom surface (100b) of the module substrate (100). The module substrate (100) may be fitted between the bottom surface of the body portion (310) and a portion of the coupling portion (320) on the bottom surface (100b) of the module substrate (100), and accordingly, the clip structure (300) may be physically attached to the module substrate (100).

[0069] The above description of the embodiments of the present invention provides examples for explaining the present invention. Accordingly, the present invention is not limited to the above embodiments, and it is evident that many modifications and changes are possible within the technical scope of the present invention, such as combining the above embodiments by those skilled in the art.

Claims

Claim 1 A semiconductor module comprising: a module substrate having upper and lower surfaces facing each other; a plurality of semiconductor packages disposed on the upper surface of the module substrate and arranged in a first direction parallel to the upper surface of the module substrate; a clip structure disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages; and a plurality of tabs disposed on the upper surface of the module substrate and arranged in the first direction on a first side of the module substrate, wherein the plurality of tabs are spaced apart from the plurality of semiconductor packages and the clip structure in a second direction, and the second direction is parallel to the upper surface of the module substrate and intersects the first direction, and the clip structure comprises: a body portion disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages; and a coupling portion extending from the body portion across the side of the module substrate onto the lower surface of the module substrate. Claim 2 delete Claim 3 In claim 1, the coupling portion of the clip structure is disposed adjacent to the second side of the module substrate, and the first side and the second side of the module substrate are opposite each other, forming a semiconductor module. Claim 4 A semiconductor module according to claim 1, further comprising a plurality of semiconductor elements disposed on the upper surface of the module substrate, wherein the clip structure is disposed so as to be horizontally spaced apart from the plurality of semiconductor elements. Claim 5 The semiconductor module according to claim 1, wherein each of the plurality of semiconductor packages comprises: a package substrate; a semiconductor chip mounted on the package substrate; and a molding film disposed on the package substrate and covering the semiconductor chip. Claim 6 In claim 1, the clip structure is a semiconductor module electrically or signal-separated from the plurality of semiconductor packages. Claim 7 In claim 1, the body portion of the clip structure has a bar shape extending in the second direction from one side of the outermost semiconductor package among the plurality of semiconductor packages, in a semiconductor module Claim 8 A semiconductor module according to claim 7, wherein the body portion has a first side facing the outermost semiconductor package and a second side facing the first side, and the second side of the body portion has a curved surface, an angled surface, or a planar shape inclined with respect to the upper surface of the module substrate. Claim 9 The semiconductor module according to claim 1, wherein the module substrate has the first side and the second side extending in the first direction and facing each other, and the third side and the fourth side extending in the second direction and facing each other, and the body portion of the clip structure comprises: a first body portion extending in the second direction between the first outermost semiconductor package among the plurality of semiconductor packages and the third side of the module substrate; and a second body portion extending in the first direction from one side of the plurality of semiconductor packages, and the first body portion and the second body portion are connected to each other on the upper surface of the module substrate to form an L-shape. Claim 10 A module substrate having upper and lower surfaces facing each other, wherein the module substrate has a first side and a second side extending in a first direction and facing each other, and a third side and a fourth side extending in a second direction and facing each other, wherein the first direction and the second direction are parallel to the upper surface of the module substrate and intersect each other; a plurality of semiconductor packages disposed on the upper surface of the module substrate and arranged in the first direction; a plurality of tabs disposed on the upper surface of the module substrate and adjacent to the first side and arranged in the first direction; and a clip structure disposed on the upper surface of the module substrate and horizontally spaced apart from the plurality of semiconductor packages and the plurality of tabs, wherein the clip structure comprises: a body portion disposed on the upper surface of the module substrate and extending in the second direction between the outermost semiconductor package among the plurality of semiconductor packages and the third side of the module substrate; A semiconductor module comprising a coupling portion disposed adjacent to the second side of the module substrate and extending from the body portion across the side of the module substrate onto the lower surface of the module substrate.

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