Pattern Fuse, Pattern Fuse Joining Structure and Method for Manufacturing the Same

Abstract

A pattern fuse is disclosed, comprising: a fuse conductive layer formed of a conductive material and having a meltable fuse portion formed therein and pad portions formed at both ends of the fuse portion; a fuse upper coverlay covering the upper portion of the fuse conductive layer; and a fuse lower coverlay covering the lower portion of the fuse conductive layer; wherein the fuse lower coverlay is formed such that the lower portion of the pad portion is exposed to the outside. Accordingly, a pattern fuse is provided that can be commonly applied to substrates of various materials and manufacturing methods, while allowing for more flexible design of circuit specifications and inspection structures.

Description

Technology Field

[0001] The present invention relates to a pattern fuse, a pattern fuse bonding structure, and a method for manufacturing a pattern fuse applicable to a flexible printed circuit board (FPC), etc. Background Technology

[0003] Unless otherwise indicated in this specification, the contents described in this identification item are not prior art for the claims of this application, and are not recognized as prior art simply because they are described in this identification item.

[0004] Pattern fuses protect circuits and components by providing a fuse function to the circuit pattern itself without the need for a separate chip fuse, thereby allowing the pattern to heat up and melt first in the event of an overcurrent or short circuit. For this reason, they have been widely considered as a means to reduce the number of components and mounting height in thin and compact electronic devices.

[0005] Typically, conventional pattern fuses are integrally formed using the same copper foil material and thickness as the general circuit pattern of the FPC, and test points (TPs) for resistance measurement and melting verification are placed at both ends of the fuse circuit. While this integrated structure is advantageous for replacing chip fuses to reduce the number of components and processes, it has a fundamental limitation in that the structure and characteristics of the pattern fuse are strongly dependent on the FPC specifications and layout. Whenever the material, thickness, layer composition, or coverlay structure of the FPC changes, the width, length, shape, and surrounding heat dissipation conditions of the pattern fuse must be redesigned, requiring repeated analysis, prototyping, and evaluation. Consequently, in actual industrial settings where FPC specifications vary slightly by product or customer, this leads to a problem of significantly increased development time and costs.

[0006] There are also significant limitations to application depending on the material and manufacturing method. In Al FPCs using aluminum as a conductor, it is difficult to reliably implement fine circuit widths due to the etching characteristics of aluminum. In die-cutting-based methods such as FDC (Flexible Die Cut), there are constraints on the minimum width achievable during the process, making it difficult to form pattern fuses that are sufficiently fine to cause localized heating and melting in the event of overcurrent. In such cases, pattern fuses cannot be applied, or the width variation increases, leading to greater variation in fuse ratings and reliability issues.

[0007] Furthermore, since the circuit specifications and placement of pattern fuses are dependent on FPC layout rules (wiring width, spacing, layer configuration, etc.), it is difficult to freely perform optimal design based on criteria such as the blowing current and time required for the fuse, heat concentration and dissipation conditions, and reliable opening at specific locations. The location and shape of the fuse are constrained by connector positions, wiring of other signal and power lines, and component placement, resulting in limitations in satisfying the various protection conditions required in actual operating environments. Moreover, while test points placed at both ends of the pattern fuse are necessary for inspection and measurement, they require additional area for separate pads around the fuse, increasing the layout space occupied by a single pattern fuse. This reduces the number of pattern fuses during FPC panel production, thereby lowering material utilization efficiency and panel yield.

[0008] As such, despite the component and process savings achieved by replacing chip fuses with circuit patterns, conventional FPC integrated pattern fuse technology still faces challenges such as the burden of repetitive redesign and remanufacturing due to changes in FPC specifications, implementation limitations in Al FPC and FDC processes, difficulties in optimizing fuse performance due to layout constraints, and increased area and reduced panel yield caused by the placement of test points. Prior art literature

[0010] 1. Patent Document 1: Japanese Patent No. 7704460B2 (Published July 8, 2025) The problem to be solved

[0011] The embodiments of the present invention are devised to solve the above-mentioned problems and aim to provide a pattern fuse, a pattern fuse bonding structure, and a pattern fuse manufacturing method that can be commonly applied to substrates of various materials and manufacturing methods, while allowing for more flexible design of circuit specifications and inspection structures. means of solving the problem

[0013] An embodiment of the present invention provides a pattern fuse that solves the above-mentioned problem by comprising: a fuse conductive layer formed of a conductive material and having a meltable fuse portion formed therein and pad portions formed at both ends of the fuse portion; a fuse upper coverlay covering the upper part of the fuse conductive layer; and a fuse lower coverlay covering the lower part of the fuse conductive layer, wherein the fuse lower coverlay is formed such that the lower part of the pad portion is exposed to the outside.

[0014] It is preferable that the upper coverlay of the fuse further includes a fuse coverlay overlap portion that is formed wider than the area of ​​the pad portion and protrudes laterally from the pad portion.

[0015] It is preferable to further include a fuse fixing hole formed by penetrating the upper coverlay of the fuse, the fuse conductive layer, and the lower coverlay of the fuse.

[0016] It is effective for the above-mentioned fuse fixing hole to be formed to penetrate the above-mentioned pad portion.

[0017] Meanwhile, the present invention provides a pattern fuse bonding structure characterized by comprising: a pattern fuse including a meltable fuse portion; and a substrate including a substrate conductive layer on which the pattern fuse is seated and which is connected to the fuse portion; wherein the pattern fuse is formed of a conductive material and includes a fuse conductive layer having a pad portion formed at both ends of the fuse portion and having the fuse portion formed thereon; a fuse upper coverlay covering the upper part of the fuse conductive layer; and a fuse lower coverlay covering the lower part of the fuse conductive layer; wherein the fuse lower coverlay is formed such that the lower part of the pad portion is exposed to the outside; and the substrate includes: a substrate lower coverlay; a substrate conductive layer formed of a conductive material on the upper surface of the substrate lower coverlay, having a pad overlap portion formed to overlap vertically with the pad portion, and having a coverlay seating portion formed to seat the fuse lower coverlay; and a substrate upper coverlay formed on the upper surface of the substrate conductive layer, such that the pad overlap portion and the coverlay seating portion are exposed.

[0018] It is preferable to further include a solder interposed between the pad portion and the pad overlap portion to increase the electrical conductivity of the pad portion and the pad overlap portion.

[0019] It is effective to further include an inspection portion formed on the upper coverlay of the substrate so that a part of the substrate conductive layer connected to the pad overlap portion is exposed to the outside.

[0020] It is preferable that the above-described substrate further includes a frame supporting the opposite side of the pattern fuse; the pattern fuse further includes a fuse fixing hole formed by penetrating the fuse upper coverlay, the fuse conductive layer, and the fuse lower coverlay; the substrate further includes a substrate fixing hole penetrating the substrate to communicate with the fuse fixing hole; and the frame further includes a main body plate supporting the substrate; and a fusion column portion protruding from the main body plate and penetrating the substrate fixing hole and the fuse fixing hole.

[0021] It is effective for the above substrate to be a flexible circuit board.

[0022] Meanwhile, in another category of the present invention, a method for manufacturing a pattern fuse is provided, characterized by comprising: a step of preparing the pattern fuse and the substrate; a step of applying solder between the pad portion and the pad overlap portion; a solder melting step of applying heat to the applied solder to melt it and combine the pattern fuse and the substrate; a frame assembly step of fitting the substrate fixing hole and the fuse fixing hole into the fusion pillar portion after the solder melting step; and a heat fusion step of fusing the upper end of the fusion pillar portion after the frame assembly step.

[0023] Additionally, in another embodiment, a method for manufacturing a pattern fuse is provided, characterized by comprising: a substrate positioning step of positioning the substrate on the upper surface of the frame by fitting the substrate fixing hole into the fusion column; a solder application step of applying solder to the upper surface of the pad overlap portion after the substrate positioning step; a fuse assembly step of positioning the pattern fuse on the upper surface of the substrate by fitting the fuse fixing hole into the fusion column after the solder application step; and a melting step of applying heat to the fusion column to fuse the upper end of the fusion column and melt the solder after the fuse assembly step. Effects of the invention

[0025] According to the means for solving the problem of the present invention as described above, various effects including the following can be expected. However, the present invention is not required to exhibit all of the following effects to be valid.

[0026] According to the present invention, instead of designing and manufacturing the pattern fuse as an integral with the substrate circuit, the pattern fuse and the substrate are provided as separate components, and then bonded and mounted according to the pattern fuse bonding structure and the pattern fuse manufacturing method. Therefore, even if the substrate specifications, such as FPC thickness, material, and layer configuration, are changed, the same pattern fuse can be utilized as a common component.

[0027] Accordingly, this reduces the burden of redesign, which previously required redesigning the width, length, and shape of pattern fuses and repeating prototyping and evaluation whenever FPC specifications changed. It also has the effect of significantly reducing development time and costs for various model and customer-specific specification changes.

[0028] In addition, for substrates where it was difficult to implement pattern fuses in the past or where rating deviations were large, such as Al FPC or FDC processes, the pattern fuse can be manufactured as a separate component and bonded to the substrate conductive layer, thereby improving the freedom of process selection.

[0029] In the pattern fuse bonding structure, the pad portion of the pattern fuse and the pad overlap portion of the substrate conductive layer are stably electrically and mechanically connected via solder, and since a portion of the substrate conductive layer is exposed to the outside through the inspection portion of the upper coverlay of the substrate, the melting status of the pattern fuse or the connection status can be easily measured without having to provide a separate wide test point.

[0030] In addition, the overall board layout can be miniaturized by reducing the TP pad area that was previously required around the pattern fuse, and when producing the pattern fuse on a panel basis, the number of effective patterns obtainable from one panel can be increased, thereby improving panel yield and material utilization efficiency.

[0031] In addition, the pattern fuse and the substrate are firmly fixed together with the frame as a single unit by means of the fuse fixing hole and the substrate fixing hole that penetrate the substrate and the pattern fuse, and the fusion pillar of the frame that penetrates and is heat-fused. Therefore, even in a flexible circuit board environment, lifting, peeling, and disconnection caused by repeated bending or vibration are suppressed, and the mechanical load concentrated on the solder joint is dispersed, thereby improving the reliability of the bond.

[0032] Furthermore, by melting the solder while simultaneously fusing the fusion pillars, not only can the steps of the manufacturing process be reduced, but the thermal stress applied to the parts can also be reduced. Brief explanation of the drawing

[0034] FIG. 1 is a side view illustrating a pattern fuse joint structure of an embodiment of the present invention. FIG. 2 is a separated side view of FIG. 1. FIG. 3 is a side view of the pattern fuse of FIG. 1. FIG. 4 is a plan view of FIG. 3 FIG. 5 is a bottom view of FIG. 3 FIG. 6 is a side view of the substrate of FIG. 1. FIG. 7 is a plan view of FIG. 6 FIGS. 8 to 10 are cross-sectional views sequentially illustrating a method for manufacturing a pattern fuse according to a first embodiment of the present invention. FIGS. 11 to 13 are cross-sectional views sequentially illustrating a method for manufacturing a pattern fuse according to a second embodiment. Specific details for implementing the invention

[0035] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

[0036] FIG. 1 is a side view illustrating a pattern fuse joint structure of an embodiment of the present invention, FIG. 2 is a separated side view of FIG. 1, FIG. 3 is a side view of the pattern fuse of FIG. 1, FIG. 4 is a top view of FIG. 3, FIG. 5 is a bottom view of FIG. 3, FIG. 6 is a side view of the substrate of FIG. 1, and FIG. 7 is a top view of FIG. 6.

[0037] As illustrated in these drawings, a pattern fuse bonding structure of one embodiment of the present invention comprises a pattern fuse (100) including a meltable fuse portion (121), a substrate (300) on which the pattern fuse (100) is seated and which includes a substrate conductive layer (320) connected to the fuse portion (121), a frame (400) supporting the opposite side of the pattern fuse (100) of the substrate (300), and a solder (200) interposed between the pad portion (122) of the pattern fuse (100) and the pad overlap portion (321) of the substrate (300) to increase the electrical conductivity of the pad portion (122) and the pad overlap portion (321).

[0038] The pattern fuse (100) is formed of a conductive material and includes a fuse conductive layer (120) having a meltable fuse portion (121) formed therein and pad portions (122) formed at both ends of the fuse portion (121), a fuse upper cover layer (110) covering the upper part of the fuse conductive layer (120), and a fuse lower cover layer (130) covering the lower part of the fuse conductive layer (120).

[0039] The fuse conductive layer (120) is formed of a conductive metal material and can typically be formed of copper, aluminum, etc. The fuse portion (121) is formed in a narrow zigzag pattern and is the part that melts and breaks first when a large amount of current flows. The pad portion (122) is formed to have a certain area at both ends of the fuse portion (121).

[0040] The fuse upper coverlay (110) and the fuse lower coverlay (130) are formed from a material used for the coverlays of a general FPCB.

[0041] The fuse lower coverlay (130) is formed so that the lower portion of the pad portion (122) is exposed to the outside, thereby facilitating contact between the lower surface of the pad portion (122) and the corresponding electrode of the substrate (300). That is, compared to the fuse upper coverlay (110), as shown in FIG. 5, the fuse lower coverlay (130) is formed by removing the fuse coverlay overlapping portion (111) and the pad portion (122) in the overlapping area.

[0042] The upper coverlay (110) of the fuse further includes a fuse coverlay overlap portion (111) that is formed wider than the area of ​​the pad portion (122) and protrudes to the side of the pad portion (122).

[0043] Additionally, the pattern fuse (100) may further include a fuse fixing hole (140) formed by penetrating the fuse upper cover layer (110), the fuse conductive layer (120), and the fuse lower cover layer (130). In particular, the fuse fixing hole (140) is formed to penetrate the pad portion (122) so that the fusion column portion (420) penetrates during alignment and fusion of the pattern fuse (100), the substrate (300), and the frame (400), thereby performing a rigid fixing and position maintenance function before and after thermal fusion.

[0044] The substrate (300) includes a substrate lower coverlay (330), a substrate conductive layer (320) formed of a conductive material on the upper surface of the substrate lower coverlay (330) and having a pad overlap portion (321) formed to overlap vertically with the pad portion (122) and a coverlay seating portion (322) formed to allow the fuse lower coverlay (130) to be seated thereon, and a substrate upper coverlay (310) formed on the upper surface of the substrate conductive layer (320) and formed so that the pad overlap portion (321) and the coverlay seating portion (322) are exposed.

[0045] The substrate (300) is formed as a flexible circuit board, and the upper coverlay (310) and the lower coverlay (330) of the substrate are formed from the material of the coverlay used in general flexible circuit boards.

[0046] The pad overlap portion (321) is a part that overlaps with the pad portion (122) of the pattern fuse (100) and is electrically connected. A solder (200) that increases the electrical conductivity of the pad portion (122) and the pad overlap portion (321) may be interposed therein. The solder (200) is interposed between the pad portion (122) and the pad overlap portion (321) to ensure electrical connection between them and assist in mechanical bonding. Various solders generally used when connecting circuits may be used as the solder (200). However, it is not limited to soldering, and conductive adhesives / films, etc., may also be used.

[0047] The coverlay mounting portion (322) is a portion formed by removing the substrate conductive layer (320) so that the fuse lower coverlay (130) of the pattern fuse (100) can be mounted thereon.

[0048] The upper cover layer (310) of the substrate is formed by removing the conductive layer seating portion (312) so that the fuse conductive layer (120) of the pattern fuse (100) can be seated, and includes an inspection portion (311) formed on the upper cover layer (310) so that a part of the substrate conductive layer (320) connected to the pad overlap portion (321) is exposed to the outside.

[0049] The inspection unit (311) serves as a connection terminal that allows the continuity status of the fuse unit (121) to be checked from the outside.

[0050] The substrate (300) further includes a substrate fixing hole (340) that penetrates the substrate (300) to communicate with the fuse fixing hole (140). That is, when the pattern fuse (100) is seated on the substrate (300), the fuse fixing hole (140) and the substrate fixing hole (340) are connected to form a single through hole.

[0051] A frame (400) supporting the opposite side of the pattern fuse (100) of the substrate (300) includes a main body plate (410) supporting the substrate (300) and a fusion column portion (420) protruding from the main body plate (410) and penetrating the substrate fixing hole (340) and the fuse fixing hole (140).

[0052] The frame (400) may simply be a reinforcing plate that supports a substrate, but a frame for other purposes may also be used. That is, a busbar frame within a battery pack or a module frame of a battery pack may be used as the frame (400) of an embodiment of the present invention.

[0053] The above-mentioned fusion pillar (420) is combined with the substrate fixing hole (340) and the fuse fixing hole (140) to precisely fix the relative position of the substrate (300) and the pattern fuse (100), and performs the function of integrating the frame (400), the substrate (300), and the pattern fuse (100) by fusing (thermal fusing) the upper part of the fusion pillar (420). In the present invention, the substrate (300) may be characterized as being a flexible circuit board, so that even when the pattern fuse (100) is attached to the flexible substrate, stable positioning and fusing through the frame (400) are possible.

[0054] Hereinafter, a method for manufacturing a pattern fuse joint structure of one embodiment of the present invention will be described.

[0055] FIGS. 8 to 10 are cross-sectional views sequentially illustrating a method for manufacturing a pattern fuse according to a first embodiment of the present invention.

[0056] The method for manufacturing a pattern fuse according to the first embodiment is carried out based on the above configurations and includes, as a basic process, a step of first preparing the pattern fuse (100) and the substrate (300), a step of applying solder (200) between the pad portion (122) and the pad overlap portion (321) (Fig. 8), a solder melting step (Fig. 9) in which heat is applied to the applied solder (200) to melt it and join the pattern fuse (100) and the substrate (300), a frame assembly step (Fig. 10) in which the substrate fixing hole (340) and the fuse fixing hole (140) are fitted into the fusion pillar portion (420) after the solder melting step, and a heat fusion step (Fig. 10) in which the upper part of the fusion pillar portion (420) is fused after the frame assembly step.

[0057] FIGS. 11 to 13 are cross-sectional views sequentially illustrating a method for manufacturing a pattern fuse according to a second embodiment.

[0058] The method for manufacturing a pattern fuse according to the second embodiment includes a substrate positioning step (Fig. 11) in which the substrate fixing hole (340) is inserted into the fusion pillar (420) to position the substrate (300) on the upper surface of the frame (400); a solder application step (Fig. 12) in which solder (200) is applied to the upper surface of the pad overlap portion (321) after the substrate positioning step; a fuse assembly step (Fig. 13) in which the fuse fixing hole (140) is inserted into the fusion pillar (420) after the solder application step to position the pattern fuse (100) on the upper surface of the substrate (300); and a melting step (Fig. 10) in which heat is applied to the fusion pillar (420) after the fuse assembly step to fuse the upper end of the fusion pillar (420) and melt the solder (200).

[0059] In the second embodiment, the melting of the solder (200) is carried out simultaneously or continuously with the fusion (thermal fusion) of the upper part due to the heat treatment of the fusion pillar (420), so that the electrical connection between the substrate (300) and the pattern fuse (100) and the mechanical fixation by the frame (400) are completed in a single process, thereby having the advantage of simplifying the process compared to the first embodiment.

[0060] As described above, the present invention provides a pattern fuse (100) comprising a meltable fuse portion (121) formed in a fuse conductive layer (120) and pad portions (122) at both ends thereof, a substrate (300), a solder (200), and a frame (400) for mounting and electrically and mechanically joining the same, and a method for manufacturing the same.

[0061] In particular, the fuse lower coverlay (130) is formed so that the lower part of the pad portion (122) is exposed to the outside, thereby facilitating the solder (200) bonding between the pad portion (122) and the pad overlap portion (321) of the substrate conductive layer (320), and is designed so that accurate alignment and integration by thermal fusion are easily achieved through the corresponding bonding of the fuse coverlay overlap portion (111) of the fuse upper coverlay (110), the fuse fixing hole (140), the substrate fixing hole (340), and the fusion pillar portion (420).

[0062] In addition, external inspection of the bonding state is possible through the inspection section (311) formed on the upper coverlay (310) of the substrate, and in an embodiment including a flexible circuit board, a stable bonding structure is provided through support and fusion by the frame (400).

[0063] In other words, according to the present invention, instead of designing and manufacturing the pattern fuse as an integral with the substrate circuit, the pattern fuse and the substrate are provided as separate components, and then bonded and mounted according to the pattern fuse bonding structure and the pattern fuse manufacturing method. Therefore, even if the substrate specifications, such as FPC thickness, material, and layer configuration, are changed, the same pattern fuse can be utilized as a common component.

[0064] Accordingly, this reduces the burden of redesign, which previously required redesigning the width, length, and shape of pattern fuses and repeating prototyping and evaluation whenever FPC specifications changed. It also has the effect of significantly reducing development time and costs for various model and customer-specific specification changes.

[0065] In addition, for substrates where it was previously difficult to implement pattern fuses or where rating deviations were large, such as Al (aluminum) FPC or FDC processes, the pattern fuse can be manufactured as a separate component and bonded to the substrate conductive layer, thereby improving the freedom of process selection.

[0066] In the pattern fuse bonding structure, the pad portion of the pattern fuse and the pad overlap portion of the substrate conductive layer are stably electrically and mechanically connected via solder, and since a portion of the substrate conductive layer is exposed to the outside through the inspection portion of the upper coverlay of the substrate, the melting status of the pattern fuse or the connection status can be easily measured without having to provide a separate wide test point.

[0067] In addition, the overall board layout can be miniaturized by reducing the area of ​​the TP pad (inspection area) that was essential around the conventional pattern fuse, and when producing pattern fuses on a panel basis, the number of effective patterns obtainable from one panel can be increased, thereby improving panel yield and material utilization efficiency.

[0068] In addition, the pattern fuse and the substrate are firmly fixed together with the frame as a single unit by means of the fuse fixing hole and the substrate fixing hole that penetrate the substrate and the pattern fuse, and the fusion pillar of the frame that penetrates and is heat-fused. Therefore, even in a flexible circuit board environment, lifting, peeling, and disconnection caused by repeated bending or vibration are suppressed, and the mechanical load concentrated on the solder joint is dispersed, thereby improving the reliability of the bond.

[0069] Furthermore, by melting the solder while simultaneously fusing the fusion pillars, not only can the steps of the manufacturing process be reduced, but the thermal stress applied to the parts can also be reduced.

[0070] Although preferred embodiments of the present invention have been described illustratively above, the scope of the present invention is not limited to such specific embodiments and can be appropriately modified within the scope described in the claims. Explanation of the symbols

[0072] 100: Pattern fuse 110: Fuse upper coverlay 120: Fuse conductive layer 121: Fuse section 122: Pad section 130: Fuse lower coverlay 140: Fuse fixing hole 200: Solder 300: Substrate 310: Substrate upper coverlay 320: Substrate conductive layer 321: The pad overlap portion 322: Coverlay mounting area 330: Substrate lower coverlay 340: Board fixing hole 400: Frame 410: Main body plate 420: Fusion column part

Claims

Claim 1 delete Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 A pattern fuse (100) comprising a meltable fuse portion (121); and a substrate (300) comprising a substrate conductive layer (320) on which the pattern fuse (100) is seated and which is connected to the fuse portion (121); wherein the pattern fuse (100) is formed of a conductive material and has the fuse portion (121) formed thereon and has a fuse conductive layer (120) comprising pad portions (122) formed at both ends of the fuse portion (121); and a fuse upper coverlay (110) covering the upper portion of the fuse conductive layer (120). A pattern fuse bonding structure comprising: a fuse lower coverlay (130) covering the lower portion of the fuse conductive layer (120); wherein the fuse lower coverlay (130) is formed such that the lower portion of the pad portion (122) is exposed to the outside; and the substrate (300) comprises: a substrate lower coverlay (330); a substrate conductive layer (320) formed of a conductive material on the upper surface of the substrate lower coverlay (330), wherein a pad overlap portion (321) is formed to overlap vertically with the pad portion (122), and a coverlay seating portion (322) is formed to allow the fuse lower coverlay (130) to be seated thereon; and a substrate upper coverlay (310) formed on the upper surface of the substrate conductive layer (320), wherein the pad overlap portion (321) and the coverlay seating portion (322) are exposed. Claim 6 A pattern fuse joint structure characterized by further including, in claim 5, a solder (200) interposed between the pad portion (122) and the pad overlap portion (321) to increase the electrical conductivity of the pad portion (122) and the pad overlap portion (321). Claim 7 A pattern fuse joint structure characterized by further including, in claim 5, an inspection portion (311) formed on the upper coverlay (310) of the substrate such that a portion of the substrate conductive layer (320) connected to the pad overlap portion (321) is exposed to the outside. Claim 8 A pattern fuse bonding structure according to claim 5, further comprising a frame (400) supporting the opposite side of the pattern fuse (100) of the substrate (300); wherein the pattern fuse (100) further comprises a fuse fixing hole (140) formed by penetrating the fuse upper coverlay (110), the fuse conductive layer (120), and the fuse lower coverlay (130); wherein the substrate (300) further comprises a substrate fixing hole (340) penetrating the substrate (300) so as to communicate with the fuse fixing hole (140); and wherein the frame (400) comprises a main body plate (410) supporting the substrate (300); and a fusion column portion (420) protruding from the main body plate (410) and penetrating the substrate fixing hole (340) and the fuse fixing hole (140). Claim 9 A pattern fuse joint structure characterized in that, in claim 8, the substrate (300) is a flexible circuit board. Claim 10 A method for manufacturing a pattern fuse for manufacturing a pattern fuse bonding structure according to claim 8, comprising: a step of preparing the pattern fuse (100) and the substrate (300); a step of applying solder (200) between the pad portion (122) and the pad overlap portion (321); a solder melting step of applying heat to the applied solder (200) to melt it and bond the pattern fuse (100) and the substrate (300); a frame assembly step of fitting the substrate fixing hole (340) and the fuse fixing hole (140) into the fusion pillar portion (420) after the solder melting step; and a heat fusion step of fusing the upper end of the fusion pillar portion (420) after the frame assembly step. Claim 11 A pattern fuse manufacturing method for manufacturing a pattern fuse bonding structure according to claim 8, comprising: a substrate positioning step of positioning the substrate (300) on the upper surface of the frame (400) by inserting the substrate fixing hole (340) into the fusion pillar portion (420); a solder application step of applying solder (200) on the upper surface of the pad overlap portion (321) after the substrate positioning step; a fuse assembly step of positioning the pattern fuse (100) on the upper surface of the substrate (300) by inserting the fuse fixing hole (140) into the fusion pillar portion (420) after the solder application step; and a melting step of applying heat to the fusion pillar portion (420) to fuse the upper end of the fusion pillar portion (420) and melt the solder (200) after the fuse assembly step.

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