Method of controlling refrigerator having peltier component and refrigerator using the same

Abstract

A method for controlling a refrigerator including a Peltier element comprises the steps of measuring the internal temperature of the refrigerator with a first temperature sensor, determining whether the internal temperature is higher than a first target control temperature, applying a first voltage to the Peltier element if the internal temperature is higher than or equal to the first target control temperature, and applying a second voltage to the Peltier element if the internal temperature is lower than the first target control temperature, wherein in the step of applying a second voltage to the Peltier element, the second voltage applied to the Peltier element is controlled by PID control using the cooling sink temperature measured by a second temperature sensor installed in the cooling sink of the Peltier element and the cooling sink target temperature.

Description

Technology Field

[0001] The present disclosure relates to a refrigerator using a Peltier element as a cooling device, and more specifically, to a method for controlling a refrigerator equipped with a Peltier element and a refrigerator using the same. Background Technology

[0002] A refrigerator is a device that prevents food from spoiling or deteriorating by cooling food or storing it at low temperatures.

[0003] Such a refrigerator includes a storage space for holding food and a cooling device for cooling the storage space.

[0004] Generally, cooling devices can be classified into refrigeration cycle devices using a refrigeration cycle and Peltier cooling devices using a Peltier element, depending on the method of generating cold air.

[0005] A refrigeration cycle device is a method of obtaining cold air by circulating refrigerant along a closed circuit consisting of a compressor, a condenser, an expansion mechanism, and an evaporator.

[0006] A Peltier cooling device is a method of obtaining cold air by utilizing the Peltier effect. The Peltier effect refers to the phenomenon where, when a potential difference is applied to both sides of an object, heat flows along with the electric current, causing one side to heat up and the other side to cool down.

[0007] Refrigeration cycle devices have higher efficiency compared to Peltier cooling devices, but they have the disadvantage of producing significant noise when operating the compressor.

[0008] On the other hand, while Peltier cooling systems have lower efficiency compared to refrigeration cycle systems, they have the advantage of low noise. Therefore, Peltier cooling systems can be used in cooling systems for central processing units (CPUs), vehicle temperature control seats, small refrigerators, and the like.

[0009] The Peltier cooling device is controlled to turn off the power applied to the Peltier cooling device when the temperature of the refrigerator's storage space reaches the target temperature, and to reapply power to the Peltier cooling device when the temperature of the storage space rises above the target temperature.

[0010] However, if the Peltier cooling device is controlled in the manner described above, there is a problem in that it is not easy to maintain the temperature of the refrigerator's storage space at a constant target temperature because the Peltier cooling device must be turned on and off frequently. The problem to be solved

[0012] The present disclosure was devised in consideration of the above-mentioned problems and relates to a control method for a refrigerator that can rapidly cool the internal temperature of a refrigerator using a Peltier element to a target temperature and maintain the target temperature.

[0013] In addition, the present disclosure relates to a refrigerator using a Peltier element that uses the control method as described above. means of solving the problem

[0014] A method for controlling a refrigerator including a Peltier element according to one embodiment of the present disclosure comprises: a step of measuring the internal temperature of the refrigerator with a first temperature sensor; a step of determining whether the internal temperature is higher than a first target control temperature; a step of applying a first voltage to the Peltier element if the internal temperature is higher than or equal to the first target control temperature; and a step of applying a second voltage to the Peltier element if the internal temperature is lower than the first target control temperature; wherein in the step of applying a second voltage to the Peltier element, the second voltage applied to the Peltier element can be controlled by PID control (Proportional Integral Derivative control) using the cooling sink temperature measured by a second temperature sensor installed in the cooling sink of the Peltier element and the cooling sink target temperature.

[0015] At this time, the first target control temperature can be higher than the internal target temperature by the first margin temperature.

[0016] In addition, the target temperature of the cooling sink can be corrected according to the internal temperature measured by the first temperature sensor.

[0017] Additionally, the method for correcting the cooling sink target temperature may include: a step of measuring the internal temperature with the first temperature sensor at regular intervals; a step of determining whether the currently measured internal temperature is the same as the previous internal temperature measured before the regular interval; a step of maintaining the cooling sink target temperature without correction if the internal temperature is the same as the previous internal temperature; a step of determining whether the internal temperature is lower than the previous internal temperature if the internal temperature is not the same as the previous internal temperature; a step of determining whether the internal temperature is lower than the temperature obtained by subtracting the second margin temperature from the internal target temperature if the internal temperature is lower than the previous internal temperature; a step of raising the cooling sink target temperature by the correction temperature if the internal temperature is lower than the temperature obtained by subtracting the second margin temperature from the internal target temperature; and a step of maintaining the cooling sink target temperature without correction if the internal temperature is greater than or equal to the temperature obtained by subtracting the second margin temperature from the internal target temperature.

[0018] Additionally, a control method for a refrigerator according to one embodiment of the present disclosure may further include: a step of determining whether the internal temperature is higher than the internal temperature plus the second margin temperature if the internal temperature is equal to or higher than the previous internal temperature; a step of lowering the cooling sink target temperature by the correction temperature if the internal temperature is higher than the internal target temperature plus the second margin temperature if the internal temperature is higher; and a step of maintaining the cooling sink target temperature without correction if the internal temperature is less than or equal to the internal target temperature plus the second margin temperature.

[0019] In addition, the above schedule time may be 10 minutes.

[0020] Also, the above second margin temperature may be 0.3℃.

[0021] In addition, the above correction temperature may be 0.3℃.

[0022] In addition, the target temperature of the cooling sink can be set to a temperature obtained by subtracting the subtracted temperature from the target temperature inside the sink, and the subtracted temperature can be 3℃.

[0023] In addition, the first voltage is a full duty voltage, and the second voltage may be lower than the first voltage.

[0024] A refrigerator according to another aspect of the present disclosure comprises: a main body including a receiving space; a cooling device installed in the main body and supplying cold air to the receiving space; a first temperature sensor installed in the receiving space; and a processor for controlling the cooling device; wherein the cooling device comprises: a Peltier element; a cooling sink installed on the low-temperature side of the Peltier element; a cooling fan installed above the cooling sink and supplying air cooled by the cooling sink to the receiving space; a second temperature sensor installed in the cooling sink; a heat dissipation sink installed on the high-temperature side of the Peltier element; and a heat dissipation fan installed below the heat dissipation sink and releasing heat from the heat dissipation sink to the outside of the main body. The system includes a power control unit that controls the voltage supplied to the Peltier element; wherein the processor controls the power control unit to supply a first voltage to the Peltier element when the internal temperature of the receiving space measured by the first temperature sensor is higher than or equal to the first target control temperature, and controls the power control unit to supply a second voltage to the Peltier element when the internal temperature is lower than the first target control temperature, and when supplying the second voltage, the second voltage can be controlled by PID control (Proportional Integral Derivative control) using the temperature of the cooling sink measured by the second temperature sensor and the target temperature of the cooling sink.

[0025] At this time, the processor can correct the cooling sink target temperature according to the internal temperature measured by the first temperature sensor.

[0026] Additionally, when the processor corrects the cooling sink target temperature, it measures the internal temperature of the high-temperature with the first temperature sensor at regular intervals and determines whether the currently measured internal temperature is the same as the previous internal temperature measured before the regular intervals. If the internal temperature is the same as the previous internal temperature, it maintains the cooling sink target temperature without correcting it. If the internal temperature is not the same as the previous internal temperature, it determines whether the internal temperature is lower than the previous internal temperature. If the internal temperature is lower than the previous internal temperature, it determines whether the internal temperature is lower than the temperature obtained by subtracting the second margin temperature from the internal target temperature. If the internal temperature is lower than the temperature obtained by subtracting the second margin temperature from the internal target temperature, it raises the cooling sink target temperature by the corrected temperature. If the internal temperature is greater than or equal to the temperature obtained by subtracting the second margin temperature from the internal target temperature, it maintains the cooling sink target temperature without correcting it.

[0027] Additionally, the processor determines whether the internal temperature is higher than or equal to the previous internal temperature, and if the internal temperature is higher than or equal to the internal target temperature plus the second margin temperature, if the internal temperature is higher than the internal target temperature plus the second margin temperature, it lowers the cooling sink target temperature by the correction temperature, and if the internal temperature is lower than or equal to the internal target temperature plus the second margin temperature, it can maintain the cooling sink target temperature without correction. Brief explanation of the drawing

[0029] FIG. 1 is a cross-sectional view showing a refrigerator according to one embodiment of the present disclosure; FIG. 2 is a perspective view showing a cooling device used in a refrigerator according to one embodiment of the present disclosure; FIG. 3 is a drawing showing a second temperature sensor installed in a cooling sink of a cooling device according to one embodiment of the present disclosure; FIG. 4 is a functional block diagram of a refrigerator according to one embodiment of the present disclosure; FIG. 5 is a flowchart for explaining a method of controlling a refrigerator according to one embodiment of the present disclosure; FIG. 6 is a flowchart for explaining a method for correcting the target temperature of a cooling sink of a refrigerator control method according to one embodiment of the present disclosure; FIG. 7 is a graph showing the change over time of the internal temperature, cooling sink temperature, and cooling sink target temperature of a refrigerator controlled by a control method of a refrigerator according to one embodiment of the present disclosure. Specific details for implementing the invention

[0030] The embodiments described below are provided as examples to aid in understanding the present disclosure, and it should be understood that the present disclosure may be implemented with various modifications different from the embodiments described herein. However, in describing the present disclosure below, detailed descriptions and specific illustrations of related known functions or components are omitted if it is determined that such detailed descriptions would unnecessarily obscure the essence of the present disclosure. Additionally, the attached drawings are not drawn to actual scale to aid in understanding the disclosure, and the dimensions of some components may be exaggerated.

[0031] In this specification, expressions such as “have,” “may have,” “include,” or “may include” indicate the presence of such features (e.g., numerical values, functions, operations, or components such as parts) and do not exclude the presence of additional features.

[0032] The expression "at least one of A or / and B" should be understood as representing either "A" or "B" or "A and B".

[0033] Expressions such as "first," "second," "first," or "second" used in this specification may modify various components regardless of order and / or importance, and are used only to distinguish one component from another and do not limit said components.

[0034] Where it is stated that a component (e.g., Component 1) is "(operatively or communicatively) coupled with / to" or "connected to" another component (e.g., Component 2), it should be understood that the component may be directly connected to the other component or connected through the other component (e.g., Component 3).

[0035] The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "consisting of" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0036] In the present disclosure, a "module" or "part" performs at least one function or operation and may be implemented in hardware or software, or a combination of hardware and software. Additionally, a plurality of "modules" or a plurality of "parts" may be integrated into at least one module and implemented by at least one processor (not shown), except for a "module" or "part" that needs to be implemented in specific hardware.

[0037] In this specification, the term "user" may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

[0038] Hereinafter, a refrigerator according to one embodiment of the present disclosure will be described in detail with reference to the attached drawings.

[0039] FIG. 1 is a cross-sectional view showing a refrigerator according to one embodiment of the present disclosure.

[0040] Referring to FIG. 1, a refrigerator (1) according to one embodiment of the present disclosure may include a main body (10), a cooling device (20), and a processor (80).

[0041] The refrigerator (1) illustrated in FIG. 1 is a wine refrigerator capable of storing multiple wine bottles. However, this is merely an example, and the refrigerator (1) to which the present disclosure can be applied is not limited to a wine refrigerator.

[0042] The main body (10) is formed in a rectangular shape and may include a storage space (11) for storing food. A door (12) capable of opening and closing the storage space (11) may be installed on the front of the main body (10). The interior of the main body (10) is formed to accommodate a plurality of wine bottles.

[0043] The main body (10) may be provided with a cooling channel (13) that guides low-temperature air cooled by a cooling device (20) into a receiving space (11). The cooling channel (13) may be formed to connect the receiving space (11) with the cooling device room (15) where the cooling device (20) is installed.

[0044] Accordingly, the air in the receiving space (11) can be introduced into the cooling room (15) where the cooling device (20) is installed, cooled by the cooling device (20), and then discharged back into the receiving space (11) through the cooling channel (13). The outlet (13a) of the cooling channel (13) can be provided on the upper inner surface of the main body (10).

[0045] The first temperature sensor (71) may be installed in the receiving space (11) of the main body (10). For example, the first temperature sensor (71) may be installed on the inner surface of the main body (10), that is, on the inner surface of the main body (10) that forms the receiving space (11).

[0046] The first temperature sensor (71) can be installed on the inner surface of the main body (10) in which the outlet (13a) of the cooling channel (13) is formed so as to be adjacent to the outlet (13a) of the cooling channel (13).

[0047] The first temperature sensor (71) is formed to measure the temperature of the receiving space (11) of the main body (10), that is, the internal temperature. The first temperature sensor (71) can transmit the measured internal temperature data to the processor (80). That is, the processor (80) can determine the internal temperature from the signal output from the first temperature sensor (71).

[0048] A cooling device (20) is installed in the main body (10) and is formed to supply cold air to the receiving space (11) of the main body (10). The cooling device (20) is formed to cool the air in the receiving space (11) of the main body (10) using a Peltier element (21) and then discharge the cooled air into the receiving space (11).

[0049] The cooling device (20) can be installed in the lower part of the main body (10), that is, in the cooling device room (15) provided below the receiving space.

[0050] FIG. 2 is a perspective view showing a cooling device installed in a refrigerator according to one embodiment of the present disclosure.

[0051] Referring to FIGS. 1 and 2, the cooling device (20) may include a Peltier element (21), a cooling sink (30), and a heat dissipation sink (50).

[0052] The Peltier element (21) may include a low temperature section and a high temperature section, and the temperature difference between the low temperature section and the high temperature section may be determined according to the voltage applied to the Peltier element (21).

[0053] The Peltier element (21) can be installed such that the low-temperature portion faces upward and the high-temperature portion faces downward.

[0054] The perimeter of the Peltier element (21) can be insulated by an insulating member (23) as shown in FIG. 1. The Peltier element (21) and the insulating member (23) partition and isolate the cooling chamber (15) into a low-temperature chamber (16) and a high-temperature chamber (17). Thus, the high-temperature portion of the Peltier element (21) does not affect the low-temperature portion of the Peltier element (21).

[0055] The cooling sink (30) is installed to be in contact with or adjacent to the exposed surface of the low-temperature portion of the Peltier element (21), that is, the low-temperature surface. Thus, the cooling sink (30) is installed above the Peltier element (21). That is, the cooling sink (30) is installed in the low-temperature chamber (16) of the cooling device room (15).

[0056] The cooling sink (30) may include a cooling plate (31) and cooling fins (32).

[0057] The cooling plate (31) can be installed to be in contact with the Peltier element (21). The cooling plate (31) can be in contact with the low-temperature portion of the Peltier element (21) to transfer heat from the low-temperature portion of the Peltier element (21) to the cooling fins (32). The cooling plate (31) can be formed from a material with high thermal conductivity. The cooling plate (31) can be formed in a roughly rectangular shape.

[0058] The cooling fin (32) can be installed to contact the cooling plate (31). The cooling fin (32) can be formed to protrude from one side of the cooling plate (31).

[0059] The cooling fin (32) may be located on the upper part of the cooling plate (31). At least a portion of the cooling fin (32) may be located in the low-temperature chamber (16) within the cooling device room (15), and may cool the air by exchanging heat with the air in the low-temperature chamber (16).

[0060] The cooling fins (32) can be formed in multiple numbers to increase the heat exchange area with the air. The cooling fins (32) are formed in a rectangular shape and are installed at regular intervals perpendicular to the upper surface of the cooling plate (31). Accordingly, air introduced into the low-temperature room (16) by the cooling fan (40) can exchange heat while flowing between the multiple cooling fins (32).

[0061] Air supplied to the cooling sink (30) can be guided by a plurality of cooling fins (32) and flow into the cooling channel (13).

[0062] The heat dissipation sink (50) is installed to be in contact with or adjacent to the exposed surface of the high-temperature portion of the Peltier element (21), i.e., the high-temperature surface. Accordingly, the heat dissipation sink (50) is installed on the lower side of the Peltier element (21). Accordingly, the cooling sink (30) is installed closer to the receiving space (11) of the main body (10) than the heat dissipation sink (50).

[0063] Referring to FIGS. 1 and 2, the cooling device (20) may include a cooling fan (40) that circulates air in the receiving space (11) and a heat dissipation fan (60) that circulates external air.

[0064] A cooling fan (40) is installed above the cooling sink (30) and is configured to circulate air from the receiving space (11) through the cooling sink (30). That is, the cooling fan (40) is installed above the cooling sink (30) in the low-temperature room (16).

[0065] Accordingly, the air in the receiving space (11) can be drawn into the low-temperature room (16) of the cooling unit room (15) by the cooling fan (40), pass through the cooling sink (30), and then be discharged back into the receiving space (11) along the cooling path (13). Thus, the cooling fan (40) can circulate the air in the receiving space (11) of the main body (10) to lower the temperature of the receiving space (11).

[0066] An inlet (41) communicating with the receiving space (11) is provided on the upper surface of the cooling fan (40), that is, on the upper surface of the cooling device room (15). Accordingly, when the cooling fan (40) is operated, air from the receiving space (11) can be introduced into the low-temperature room (16) of the cooling device room (15) through the inlet (41).

[0067] The cooling fan (40) is configured to supply air from the receiving space (11) to the cooling sink (30). Accordingly, when the cooling fan (40) operates, the air from the receiving space (11) flows into the cold room (16) and is supplied to the multiple cooling fins (32) of the cooling sink (30).

[0068] Air introduced by the cooling fan (40) travels along the plurality of cooling fins (32), exchanges heat with the plurality of cooling fins (32) to lower its temperature, and flows into the cooling channel (13). The cold air introduced into the cooling channel (13) is discharged into the receiving space (11) of the main body (10) through the outlet (13a).

[0069] A second temperature sensor (72) may be installed in the cooling sink (30).

[0070] FIG. 3 is a drawing showing a second temperature sensor installed in a cooling sink of a cooling device according to one embodiment of the present disclosure.

[0071] Referring to FIG. 3, the second temperature sensor (72) can be installed on the top of a plurality of cooling fins (32). The second temperature sensor (72) is formed to measure the temperature of the cooling sink (30).

[0072] The second temperature sensor (72) can transmit the measured temperature data of the cooling sink (30) to the PID control unit (82). That is, the PID control unit (82) can determine the temperature of the cooling sink (30) from the signal output from the second temperature sensor (72).

[0073] The heat dissipation sink (50) is installed to be in contact with or adjacent to the exposed surface of the high-temperature portion of the Peltier element (21), that is, the high-temperature surface. Accordingly, the heat dissipation sink (50) is installed on the lower side of the Peltier element (21). That is, the heat dissipation sink (50) is installed in the high-temperature chamber (17) of the cooling device room (15).

[0074] In the present embodiment, a heat dissipation block (55) is installed between the heat dissipation sink (50) and the Peltier element (21). One end of the heat dissipation block (55) is installed to be in contact with the high-temperature surface of the Peltier element (21), and the other end is installed to be in contact with the heat dissipation sink (50). However, this is merely one example, and as another example, the heat dissipation sink (50) may be installed to be in direct contact with the high-temperature surface of the Peltier element (21).

[0075] The heat sink (50) may include a heat sink plate (51) and a heat fin (52).

[0076] A heat sink (51) can be installed to be in contact with a Peltier element (21). The heat sink (51) can be in contact with the high-temperature portion of the Peltier element (21) to transfer heat from the high-temperature portion of the Peltier element (21) to the heat dissipation fins (52). The heat sink (51) can be formed from a material with high thermal conductivity. The heat sink (51) can be formed in a roughly rectangular shape.

[0077] The heat dissipation fin (52) can be installed to contact the heat dissipation plate (51). The heat dissipation fin (52) can be formed to protrude from one side of the heat dissipation plate (51).

[0078] The heat dissipation fin (52) may be located at the bottom of the heat dissipation plate (51). At least a portion of the heat dissipation fin (52) may be located in the high-temperature chamber (17) within the cooling device chamber (15), and the heat dissipation fin (52) may be cooled by exchanging heat with the outside air introduced into the high-temperature chamber (17).

[0079] The heat dissipation fins (52) can be formed in multiple numbers to increase the heat exchange area with the outside air. The heat dissipation fins (52) are formed in a rectangular shape and are installed at regular intervals perpendicular to the lower surface of the heat dissipation plate (51). Accordingly, the outside air introduced by the heat dissipation fan (60) can flow between the multiple heat dissipation fins (52) and exchange heat with the multiple heat dissipation fins (52).

[0080] External air supplied to the heat sink (50) can be guided by a plurality of heat dissipation fins (52) and discharged to the outside of the high-temperature room (17).

[0081] A heat dissipation fan (60) is installed below the heat dissipation sink (50) and is configured to circulate air from outside the refrigerator (1) through the heat dissipation sink (50). That is, the heat dissipation fan (60) is installed below the heat dissipation sink (50) in the high-temperature room (17) of the cooling unit room (15).

[0082] Therefore, external air can be drawn into the high-temperature room (17) by the heat dissipation fan (60), pass through the heat dissipation sink (50), and then be discharged back outside the refrigerator (1). Thus, the heat dissipation fan (60) can draw in external air to lower the temperature of the heat dissipation sink (50). That is, the heat dissipation fan (60) can lower the temperature of the high-temperature part of the Peltier element (21) using external air.

[0083] On one side of the heat dissipation fan (60), that is, on the side of the high-temperature chamber (17) of the cooling device room (15), an inlet (17a) and an outlet (17b) communicating with the outside are provided.

[0084] When the heat dissipation fan (60) is operated, external air is introduced into the high-temperature room (17) through the inlet (17a), passes through the heat dissipation sink (50), and is discharged to the outside of the high-temperature room (17) through the outlet (17b). Therefore, when the heat dissipation fan (60) is operated, the heat dissipation sink (50) of the high-temperature room (17) can be cooled by the external air.

[0085] The heat dissipation fan (60) is formed to supply external air to the heat dissipation sink (50). Accordingly, when the heat dissipation fan (60) operates, external air flows into the high-temperature chamber (17) and is supplied to the plurality of heat dissipation fins (52) of the heat dissipation sink (50).

[0086] External air introduced into the high-temperature chamber (17) by the heat dissipation fan (60) travels along the plurality of heat dissipation fins (52) and exchanges heat with the plurality of heat dissipation fins (52), thereby lowering the temperature of the plurality of heat dissipation fins (52). The air heated by the heat exchange with the plurality of heat dissipation fins (52) is discharged to the outside of the high-temperature chamber (17) through the outlet (17b). Thus, the heat dissipation fan (60) can release heat from the high-temperature portion of the heat dissipation sink (50), that is, the Peltier element (21), to the outside of the cooling device chamber (15), that is, to the outside of the main body (10).

[0087] FIG. 4 is a functional block diagram of a refrigerator according to one embodiment of the present disclosure.

[0088] Referring to FIG. 4, a refrigerator (1) according to one embodiment of the present disclosure may include a processor (80), a power control unit (81), a PID control unit (82), a Peltier element (21), a first temperature sensor (71), and a second temperature sensor (72).

[0089] The processor (80) is configured to control the cooling device (20). For example, the processor (80) can control the cooling device (20) to lower the temperature of the receiving space (11) of the refrigerator (1) to a high target temperature and maintain it at a constant level.

[0090] The processor (80) may be implemented as a digital signal processor (DSP), a microprocessor, or a time controller (TCON) that processes digital signals. However, the processor (80) is not limited thereto and may include at least one of a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a graphics-processing unit (GPU), a communication processor (CP), or an ARM processor, or may be defined by the respective terms.

[0091] Additionally, the processor (80) may be implemented as a System on Chip (SoC) or Large Scale Integration (LSI) with a built-in processing algorithm, or as a Field Programmable Gate Array (FPGA).

[0092] In addition, the processor (80) can perform various functions by executing computer executable instructions stored in memory (83).

[0093] The processor (80) can control the power control unit (81) to adjust the voltage of the power supplied to the Peltier element (21). The processor (80) can adjust the voltage supplied to the Peltier element (21) by controlling the power control unit (81) based on the internal temperature input from the first temperature sensor (71).

[0094] For example, the temperature of the receiving space (11) of the main body (10) measured by the first temperature sensor (71), i.e., the internal temperature (T1), is the first target control temperature (Tt +a) If the above, the processor (80) controls the power control unit (81) to supply a first voltage (V1), for example, a full duty voltage, to the Peltier element (21). That is, if the internal temperature (T1) is equal to or higher than the first target control temperature, the processor can control the power control unit so that a full duty voltage is applied to the Peltier element.

[0095] The internal temperature (T1) measured by the first temperature sensor is the first target control temperature (T t If it is less than +a), the processor (80) can supply a second voltage (V2) to the Peltier element (21). At this time, the processor (80) can control the second voltage (V2) to be PID controlled (Proportional Integral Derivative control) according to the temperature of the cooling sink (30) through the PID control unit (82).

[0096] The power control unit (81) is configured to control the voltage of the power supplied to the Peltier element (21). The power control unit (81) can adjust the voltage supplied to the Peltier element (21) according to a signal from the processor (80). Additionally, the power control unit (81) can adjust the voltage supplied to the Peltier element (21) according to a signal from the PID control unit (82).

[0097] The PID control unit (82) can adjust the voltage of the power supplied to the Peltier element (21) by PID controlling the power control unit (81) using the temperature (T2) of the cooling sink (30) measured by the second temperature sensor (72).

[0098] The PID control unit (82) is formed to control the voltage applied to the Peltier element (21) using the following equation.

[0099]

[0100] In the above formula, the proportional term (P) performs a control action proportional to the magnitude of the error value in the current state.

[0101] The integral term (I) serves to eliminate steady-state error.

[0102] The derivative term (D) acts to brake rapid changes in the output value, thereby reducing overshoot and improving stability.

[0103] In the above formula, the control parameters Kp, Ki, and Kd of the proportional, integral, and derivative terms can be tuned through experimental methods.

[0104] In FIG. 4, the PID control unit (82) is shown as being formed separately from the processor (80), but as another example, the PID control unit (82) may be formed integrally with the processor (80). In other words, the processor (80) may be formed to perform PID control.

[0105] If the internal temperature (T1) of the receiving space (11) measured by the first temperature sensor (71) is lower than the first target control temperature (Tt1), the processor (80) can control the power control unit (81) to supply a second voltage (V2) to the Peltier element (21).

[0106] When supplying a second voltage (V2) to a Peltier element (21), the processor (80) can PID control the second voltage (V2) using a PID control unit (82) and a second temperature sensor (72). For example, the processor (80) can control the second voltage (V2) applied to the Peltier element (21) by PID control using the temperature (T2) of the cooling sink (30) measured by the second temperature sensor (72) and the target temperature (Ts) of the cooling sink, which are measured by the PID control unit (82).

[0107] Accordingly, the processor (80) can control the power control unit (81) to supply a first voltage to the Peltier element (21) if the internal temperature (T1) of the receiving space (11) measured by the first temperature sensor (71) is higher than or equal to the first target control temperature (Tt1), and can control the power control unit (81) to supply a second voltage to the Peltier element (21) if the internal temperature (T1) is lower than the first target control temperature (Tt1). When supplying the second voltage, the processor (80) can control the second voltage using PID control by utilizing the temperature (T2) of the cooling sink (30) measured by the second temperature sensor (72) and the cooling sink target temperature (Ts).

[0108] Additionally, the processor (80) can correct the cooling sink target temperature (Ts) for PID control according to the internal temperature (T1) measured by the first temperature sensor (71).

[0109] For example, when correcting the cooling sink target temperature (Ts), the processor (80) measures the internal temperature (T1) with the first temperature sensor (71) at regular time intervals, determines whether the currently measured internal temperature (T1) is the same as the previous internal temperature (Tc) measured at a regular time earlier, and if the internal temperature (T1) is the same as the previous internal temperature (Tc), the cooling sink target temperature can be maintained without correction.

[0110] If the internal temperature (T1) is not the same as the previous internal temperature (Tc), the processor (80) determines whether the internal temperature (T1) is lower than the previous internal temperature (Tc), and if the internal temperature (T1) is lower than the previous internal temperature (Tc), it can determine whether the internal temperature (T1) is lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt).

[0111] If the internal temperature (T1) is lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), the processor (80) raises the cooling sink target temperature (Ts) by the correction temperature (d), and if the internal temperature (T1) is greater than or equal to the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), the cooling sink target temperature (Ts) can be maintained without correction.

[0112] If the internal temperature (T1) is higher than or equal to the previous internal temperature (Tc), the processor (80) can determine whether the internal temperature (T1) is higher than the internal target temperature (Tt) plus a second margin temperature (c).

[0113] If the internal temperature (T1) is higher than the internal target temperature (Tt) plus a second margin temperature (c), the processor (80) lowers the cooling sink target temperature (Ts) by a correction temperature (d), and if the internal temperature (T1) is lower than or equal to the internal target temperature (Tt) plus a second margin temperature (c), the cooling sink target temperature (Ts) can be maintained without correction.

[0114] The memory (83) can store data, programs, etc., that the processor needs to control the cooling device. For example, the memory can store the internal target temperature (Tt), the cooling sink target temperature (Ts), etc.

[0115] The memory (83) may be implemented as internal memory such as ROM (e.g., EEPROM (electrically erasable programmable read-only memory)), RAM, etc., included in the processor (80). Alternatively, it may be implemented as memory separate from the processor (80).

[0116] The power supply unit (84) is formed to supply power to the Peltier element (21) through the power control unit (81). Additionally, the power supply unit (84) is formed to supply power to the cooling fan (40) and the heat dissipation fan (60).

[0117] The cooling fan (40) and the heat dissipation fan (60) can be turned on / off by the processor (80).

[0118] Hereinafter, with reference to FIG. 5, a control method for a refrigerator (1) according to one embodiment of the present disclosure will be described in detail.

[0119] FIG. 5 is a flowchart for explaining a method of controlling a refrigerator according to one embodiment of the present disclosure.

[0120] Referring to FIG. 5, a control method for a refrigerator according to one embodiment of the present disclosure comprises the steps of: measuring the internal temperature (T1) of the refrigerator (1) with a first temperature sensor (71) (S10); determining whether the internal temperature (T1) is higher than a first target control temperature (Tt1) (S11); if the internal temperature (T1) is higher than or equal to the first target control temperature (Tt1) (T1≥Tt1), supplying a first voltage (V1) to a Peltier element (21) (S13); and if the internal temperature (T1) is lower than the first target control temperature (Tt1) (T1 <Tt1), 펠티어 소자(21)에 제2전압(V2)을 공급하는 단계(S14)를 포함할 수 있다.

[0121] Specifically, the processor (80) first measures the internal temperature (T1) of the refrigerator (1) using a first temperature sensor (71) installed in the receiving space (11) of the main body (10) (S10). Specifically, the processor (80) recognizes the internal temperature (T1) of the refrigerator (1) from the signal output from the first temperature sensor (71).

[0122] Next, the processor (80) determines whether the measured internal temperature (T1) is higher than the first target control temperature (Tt1) (S11). The first target control temperature (Tt1) can be stored in memory (83). The first target control temperature (Tt1) is set higher than the internal target temperature (Tt). That is, the first target control temperature (Tt1) can be set higher than the internal target temperature (Tt) by a first margin temperature (a) (Tt1 = Tt + a). For example, the first margin temperature (a) can be 0.7℃.

[0123] The internal target temperature (Tt) refers to the temperature of the receiving space (11) of the refrigerator body (10) that the processor (80) intends to maintain. That is, the processor (80) can control the cooling device (20) to ensure that the temperature of the receiving space (11) of the refrigerator (1) maintains the internal target temperature (Tt).

[0124] When the internal temperature (T1) is higher than or equal to the first target control temperature (Tt1), the processor (80) supplies a first voltage (V1) to the Peltier element (21) (S13).

[0125] Specifically, if the internal temperature (T1) of the refrigerator (1) measured by the first temperature sensor (71) is greater than or equal to the first target control temperature (Tt1), the processor (80) controls the power control unit (81) to supply a first voltage to the Peltier element (21). That is, if the internal temperature (T1) is greater than or equal to the first target control temperature (Tt1), the power control unit (81) supplies a first voltage to the Peltier element (21).

[0126] At this time, the first voltage may be a full-duty voltage that can be applied by the power supply unit (84). Then, the internal temperature (T1) of the refrigerator (1) can drop below the first target control temperature (Tt1) in a short time.

[0127] When the internal temperature (T1) is lower than the first target control temperature (Tt1), the processor (80) supplies a second voltage (V2) to the Peltier element (21) (S14).

[0128] Specifically, if the internal temperature (T1) of the refrigerator (1) measured by the first temperature sensor (71) is lower than the first target control temperature (Tt1), the processor (80) controls the PID control unit (82) so that the power control unit (81) supplies a second voltage to the Peltier element (21). That is, if the internal temperature (T1) is lower than the first target control temperature, the power control unit (81) supplies a second voltage to the Peltier element (21). The second voltage (V2) may be a voltage lower than the first voltage (V1).

[0129] When the power control unit (81) supplies a second voltage (V2) to the Peltier element (21), the second voltage (V2) can be PID controlled by the PID control unit (82).

[0130] Specifically, the PID control unit (82) can control the second voltage (V2) by PID control using the cooling sink temperature (T2) measured by the second temperature sensor (72) installed in the cooling sink (30) of the Peltier element (21) and the cooling sink target temperature (Ts).

[0131] To do this, the PID control unit (82) first determines whether time has elapsed to correct the cooling sink target temperature (Ts) (S15).

[0132] If time has not elapsed to correct the cooling sink target temperature (Ts), the PID control unit (82) measures the temperature of the cooling sink (30) of the Peltier element (21), i.e., the cooling sink temperature (T2), using the second temperature sensor (72) (S16).

[0133] The second temperature sensor (72) is installed on the top of the cooling sink (30) located above the Peltier element (21), so the temperature of the cooling sink (30) can be measured. Specifically, the PID control unit (82) recognizes the temperature of the cooling sink (30) from the signal output from the second temperature sensor (72).

[0134] Next, the PID control unit (82) calculates the difference between the cooling sink temperature (T2) and the cooling sink target temperature (Ts) (S17).

[0135] The PID control unit (82) uses the difference between the cooling sink temperature (T2) and the cooling sink target temperature (Ts) to PID control the second voltage (V2) supplied to the Peltier element (21), thereby causing the temperature (T2) of the cooling sink (30) to reach the cooling sink target temperature (Ts) and maintain the cooling sink target temperature (Ts).

[0136] Here, the cooling sink target temperature (Ts) refers to the temperature of the cooling sink (30) to be reached by controlling the Peltier element (21). The cooling sink target temperature (Ts) is set lower than the internal target temperature (Tt).

[0137] For example, the cooling sink target temperature (Ts) can be set to a temperature obtained by subtracting the subtracted temperature (b) from the internal target temperature (Tt) (Ts = Tt-b). The subtracted temperature (b) can be appropriately determined according to the configuration of the cooling path (13) of the main body (10), the cooling device (20), etc. For example, the subtracted temperature (b) can be 3°C. In this case, the cooling sink target temperature (Ts) can be set 3°C ​​lower than the internal target temperature (Tt).

[0138] The cooling sink target temperature (Ts) can be stored in memory (83) along with the internal target temperature (Tt). Accordingly, the PID control unit (82) can PID control the voltage input to the Peltier element (21) by calculating the difference between the cooling sink target temperature (Ts) read from memory (83) and the cooling sink temperature (T2) measured by the second temperature sensor (72).

[0139] Meanwhile, if time has elapsed to correct the cooling sink target temperature (Ts), the PID control unit (82) causes the processor (80) to correct the cooling sink target temperature (Ts) (S20).

[0140] A method for the processor (80) to correct the cooling sink target temperature (Ts) is described in detail with reference to FIG. 6.

[0141] FIG. 6 is a flowchart for explaining a method for correcting the target temperature of a cooling sink of a refrigerator control method according to one embodiment of the present disclosure.

[0142] Referring to FIG. 6, the processor (80) measures the internal temperature (T1) with the first temperature sensor (71) at regular time intervals (Δt) (S21). For example, the processor (80) can measure the temperature of the receiving space (11) of the main body (10), i.e., the internal temperature (T1), through the first temperature sensor (71) at 10-minute intervals.

[0143] The processor (80) stores the first internal temperature (T1) measured as the previous internal temperature (Tc) in memory (83). That is, the previous internal temperature (Tc) refers to the internal temperature (T1) measured a certain time (Δt) prior.

[0144] When a certain amount of time (Δt) has elapsed, the processor (80) measures the internal temperature (T1) using the first temperature sensor (71).

[0145] Next, the processor (80) determines whether the currently measured internal temperature (T1) is the same as the internal temperature (Tc) measured a certain time (Δt) ago, i.e., the previous internal temperature (Tc) stored in memory (83) (S22).

[0146] If the measured internal temperature (T1) is the same as the previous internal temperature (Tc) (T1=Tc), the processor (80) maintains the cooling sink target temperature (Ts) without correction (S23).

[0147] However, if the measured internal temperature (T1) is not the same as the previous internal temperature (Tc) (T1≠Tc), the processor (80) determines whether the measured internal temperature (T1) is lower than the previous internal temperature (Tc) (S24).

[0148] If the measured internal temperature (T1) is lower than the previous internal temperature (Tc) (T1 <Tc), 프로세서(80)는 측정한 고내 온도(T1)가 제2목표 제어 온도(Tt2)보다 낮은지 판단한다(S25).

[0149] Here, the second target control temperature (Tt2) refers to the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt) (Tt2 = Tt - c). Accordingly, the processor (80) determines whether the measured internal temperature (T1) is lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), i.e., the second target control temperature (Tt2). This is to determine whether the measured internal temperature (T1) has dropped lower than the internal target temperature (Tt) by more than the second margin temperature (c). For example, the second margin temperature (c) may be 0.3°C.

[0150] If the measured internal temperature (T1) is lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), the processor (80) performs a correction to raise the cooling sink target temperature (Ts) by a certain temperature (S26).

[0151] Specifically, if it is determined that the measured internal temperature (T1) is lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt) (T1 < Tt - c), the processor (80) performs a correction to raise the cooling sink target temperature (Ts) stored in memory (83) by a certain temperature, i.e., a correction temperature (d), and stores it back in memory (83). That is, the corrected cooling sink target temperature (Ts) is set higher than the cooling sink target temperature (Ts) before correction by the correction temperature (d).

[0152] The correction temperature (d) can be appropriately determined according to the performance of the cooling device (20). For example, the correction temperature (d) can be set to 0.3°C. The correction temperature (d) can also be set to be the same as the second margin temperature (c).

[0153] If the measured internal temperature (T1) is greater than or equal to the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), i.e., the second target control temperature (Tt2), the processor (80) maintains the cooling sink target temperature (Ts) stored in memory (83) without correction (S27).

[0154] Meanwhile, if the measured internal temperature (T1) is higher than the previous internal temperature (Tc), the processor (80) determines whether the measured internal temperature (T1) is higher than the third target control temperature (Tt3) (S28).

[0155] Here, the third target control temperature (Tt3) refers to the temperature obtained by adding the second margin temperature (c) to the internal target temperature (Tt) (Tt3 = Tt + c). Accordingly, the processor (80) determines whether the measured internal temperature (T1) is higher than the temperature obtained by adding the second margin temperature (c) to the internal target temperature (Tt), i.e., the third target control temperature (Tt3). This is to determine whether the measured internal temperature (T1) is higher than the internal target temperature (Tt) by more than the second margin temperature (c).

[0156] If the measured internal temperature (T1) is higher than the internal target temperature (Tt) plus the second margin temperature (c), i.e., the third target control temperature (Tt3), the processor (80) performs a correction to lower the cooling sink target temperature (Ts) by a certain temperature (S29).

[0157] Specifically, if it is determined that the measured internal temperature (T1) is higher than the internal target temperature (Tt) plus a second margin temperature (c) (Tt3 > Tt + c), the processor (80) performs a correction to lower the cooling sink target temperature (Ts) stored in memory (83) by a certain temperature, i.e., a correction temperature (d), and stores it back in memory (83). That is, the corrected cooling sink target temperature (Ts) is set lower than the cooling sink target temperature (Ts) before correction by the correction temperature (d).

[0158] If the measured internal temperature (T1) is less than or equal to the internal target temperature (Tt) plus the second margin temperature (c) (Tt1 ≤ Tt + c), the processor (80) maintains the cooling sink target temperature (Ts) stored in memory (83) without correction (S27).

[0159] That is, if it is determined that the measured internal temperature (T1) is less than or equal to the temperature obtained by adding the second margin temperature (c) to the internal target temperature (Tt), i.e., the third target control temperature (Tt3), the processor (80) maintains the cooling sink target temperature (Ts) stored in memory (83) without updating it.

[0160] Hereinafter, with reference to FIG. 7, a cooling sink target temperature (Ts) that is corrected according to a change in the internal temperature (T1) of a refrigerator (1) controlled by a control method of a refrigerator according to one embodiment of the present disclosure will be described in detail.

[0161] FIG. 7 is a graph showing the change over time of the internal temperature, cooling sink temperature, and cooling sink target temperature of a refrigerator controlled by a control method of a refrigerator according to one embodiment of the present disclosure.

[0162] In Fig. 7, the X-axis represents time (t) (minutes), and the Y-axis represents temperature (T) (°C).

[0163] In FIG. 7, the upper graph shows the change over time of the internal temperature (T1) of the receiving space (11) of the main body (10) measured by the first temperature sensor (71). Line ① represents the internal temperature (T1) of the receiving space (11) measured by the first temperature sensor (71), and line ② represents the internal target temperature (Tt).

[0164] In addition, the lower graph in FIG. 7 shows the change over time of the temperature (T2) of the cooling sink (30) of the cooling device (20) measured by the second temperature sensor (72). Line 3 represents the temperature (T2) of the cooling sink (30) measured by the second temperature sensor (72), and line 4 represents the target temperature (Ts) of the cooling sink.

[0165] Referring to FIG. 7, a first voltage is applied to the Peltier element (21) until the internal temperature (T1) reaches the first target control temperature (Tt1). The first voltage may be a full duty voltage that can be applied by the power control unit (82).

[0166] When the internal temperature (T1) reaches the first target control temperature (Tt1) (P1), the voltage input to the Peltier element (21) changes from the first voltage to the second voltage. The second voltage is PID controlled by the PID control unit (82). At this time, the processor (80) stores the internal temperature (T1) of P1 as the previous internal temperature (Tc) in the memory (83).

[0167] After reaching the first target control temperature (Tt1), at P2, after a certain time (Δt), for example, 10 minutes, the processor (80) measures the internal temperature (T1) with the first temperature sensor (71) and compares it with the previous internal temperature (Tc) (internal temperature of P1).

[0168] The internal temperature (T1) in P2 is lower than the previous internal temperature (Tc), but higher than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), i.e., the second target control temperature (Tt2), so the processor (80) maintains the cooling sink target temperature (Ts) of the cooling sink (30) without correcting it.

[0169] At this time, the processor (80) updates the previous internal temperature (Tc) stored in memory (83) to the internal temperature (T1) of P2.

[0170] At P3, after a certain amount of time (Δt) has elapsed, the processor (80) measures the internal temperature (T1) using the first temperature sensor (71) and compares it with the previous internal temperature (Tc) (internal temperature of P2).

[0171] Since the internal temperature (T1) at P3 is higher than the previous internal temperature (Tc) and also higher than the temperature obtained by adding the second margin temperature (c) to the internal target temperature (Tt), i.e., the third target control temperature (Tt3), the processor (80) corrects the cooling sink target temperature (Ts) of the cooling sink (30).

[0172] Specifically, the cooling sink target temperature (Ts) stored in memory (83) is updated to the temperature obtained by subtracting the correction temperature (d) from the existing cooling sink target temperature (Ts). Then, the cooling sink target temperature (Ts) from P3 is lowered by the correction temperature compared to the cooling sink target temperature (Ts) between P1 and P3.

[0173] Additionally, the processor (80) updates the previous internal temperature (Tc) stored in memory (83) to the internal temperature (T1) of P3.

[0174] At P4, after a certain amount of time (Δt) has elapsed again, the processor (80) measures the internal temperature (T1) using the first temperature sensor (71) and compares it with the previous internal temperature (Tc) (internal temperature of P3).

[0175] The internal temperature (T1) in P4 is lower than the previous internal temperature (Tc), but higher than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), i.e., the second target control temperature (Tt2), so the processor (80) maintains the cooling sink target temperature (Ts) of the cooling sink (30) without correcting it.

[0176] At this time, the processor (80) updates the previous internal temperature (Tc) stored in memory (83) to the internal temperature (T1) of P4.

[0177] At P5, after a certain amount of time (Δt) has elapsed again, the processor (80) measures the internal temperature (T1) using the first temperature sensor (71) and compares it with the previous internal temperature (Tc) (internal temperature of P4).

[0178] Since the internal temperature (T1) at P5 is lower than the previous internal temperature (Tc) and lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), i.e., the second target control temperature (Tt2), the processor (80) corrects the cooling sink target temperature (Ts) of the cooling sink (30).

[0179] Specifically, the cooling sink target temperature (Ts) stored in memory (83) is updated to the existing cooling sink target temperature (Ts) plus the correction temperature (d). Then, the cooling sink target temperature (Ts) from P5 becomes higher than the cooling sink target temperature (Ts) between P3 and P5 by the correction temperature.

[0180] Additionally, the processor (80) updates the previous internal temperature (Tc) stored in memory (83) to the internal temperature (T1) of P5.

[0181] At P6, after a certain amount of time (Δt) has elapsed again, the processor (80) measures the internal temperature (T1) with the first temperature sensor (71) and compares it with the previous internal temperature (Tc) (internal temperature of P5).

[0182] Since the internal temperature (T1) in P6 is lower than the previous internal temperature (Tc) and lower than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), the processor (80) corrects the cooling sink target temperature (Ts) of the cooling sink (30).

[0183] Specifically, the cooling sink target temperature (Ts) stored in memory (83) is updated to the existing cooling sink target temperature (Ts) plus the correction temperature (d). Then, the cooling sink target temperature (Ts) from P6 becomes higher than the cooling sink target temperature (Ts) between P5 and P6 by the correction temperature (d).

[0184] Additionally, the processor (80) updates the previous internal temperature (Tc) stored in memory (83) to the internal temperature (T1) of P6.

[0185] At P7, after a certain amount of time (Δt) has elapsed again, the processor (80) measures the internal temperature (T1) using the first temperature sensor (71) and compares it with the previous internal temperature (Tc) (internal temperature of P6).

[0186] Since the internal temperature (T1) in P7 is higher than the previous internal temperature (Tc) and also higher than the temperature obtained by subtracting the second margin temperature (c) from the internal target temperature (Tt), the processor (80) maintains the cooling sink target temperature (Ts) of the cooling sink (30) without correcting it.

[0187] At this time, the processor (80) updates the previous internal temperature (Tc) stored in memory (83) to the internal temperature (T1) of P7.

[0188] As described above, by adjusting the cooling sink target temperature according to the internal temperature according to the control method of a refrigerator according to one embodiment of the present disclosure, the internal temperature of the refrigerator can be rapidly cooled to the internal target temperature and maintained at a constant internal target temperature.

[0189] Meanwhile, the methods according to the various embodiments of the present disclosure described above can be implemented in the form of an application that can be installed on existing electronic devices.

[0190] In addition, the methods according to the various embodiments of the present disclosure described above can be implemented by software upgrades or hardware upgrades alone for existing electronic devices (refrigerators).

[0191] In addition, the various embodiments of the present disclosure described above may also be performed through an embedded server equipped in an electronic device (refrigerator) or through an external server of the electronic device (refrigerator).

[0192] Meanwhile, according to an exemplary embodiment of the present disclosure, the various embodiments described above may be implemented as software comprising instructions stored on a machine-readable storage medium (e.g., a computer). The machine may include an electronic device (refrigerator) according to the disclosed embodiments, which is a device capable of calling instructions stored from the storage medium and operating according to the called instructions. When instructions are executed by a processor, the processor may perform a function corresponding to the instructions directly or by using other components under the control of the processor. Instructions may include code generated or executed by a compiler or an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" means only that the storage medium does not contain a signal and is tangible, and does not distinguish whether data is stored semi-permanently or temporarily on the storage medium.

[0193] Additionally, according to one embodiment of the present disclosure, the method according to the various embodiments described above may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or online through an application store (e.g., Play Store™). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a storage medium such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0194] Additionally, each component (e.g., module or program) according to the various embodiments described above may be composed of a single or multiple entities, and some of the aforementioned sub-components may be omitted, or other sub-components may be further included in the various embodiments. Generally or additionally, some components (e.g., module or program) may be integrated into a single entity to perform the functions performed by each of the respective components prior to integration in the same or similar manner. The operations performed by the module, program, or other components according to the various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or other operations added.

[0195] Although preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above. It is understood that various modifications can be made by those skilled in the art without departing from the essence of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present disclosure. Explanation of the symbols

[0197] 1; Refrigerator 10; Main unit 11; Accommodation space 20; Cooling device 21; Peltier element 30; cooling sink 31; Cooling plate 32; Cooling fins 40; Cooling fan 50; Heat sink 51; Heat sink 52; Heat fins 60; cooling fan 71; first temperature sensor 72; 2nd temperature sensor 80; processor 81; Power control unit 82; PID control unit 83; Memory 84; Power supply

Claims

Claim 1 A method for controlling a refrigerator including a Peltier element, comprising: a step of measuring the internal temperature of the refrigerator using a first temperature sensor; a step of determining whether the internal temperature is higher than a first target control temperature; and a step of applying a first voltage to the Peltier element if the internal temperature is higher than or equal to the first target control temperature. and if the internal temperature is lower than the first target control temperature, a second voltage is applied to the Peltier element; wherein in the step of applying the second voltage to the Peltier element, the second voltage applied to the Peltier element is controlled by PID control (Proportional Integral Derivative control) using the cooling sink temperature and the cooling sink target temperature measured by a second temperature sensor installed on the cooling sink of the Peltier element, and the cooling sink target temperature is corrected according to the internal temperature measured by the first temperature sensor, and the method for correcting the cooling sink target temperature comprises: a step of measuring the internal temperature with the first temperature sensor at a predetermined time interval; a step of determining whether the currently measured internal temperature is the same as the previous internal temperature measured before the predetermined time; a step of maintaining the cooling sink target temperature without correction if the internal temperature is the same as the previous internal temperature; a step of determining whether the internal temperature is lower than the previous internal temperature if the internal temperature is not the same as the previous internal temperature; and the internal temperature is lower than the previous internal temperature A method for controlling a refrigerator, comprising: a step of determining whether the internal temperature is lower than the internal target temperature minus a second margin temperature if the internal temperature is lower; a step of raising the cooling sink target temperature by a correction temperature if the internal temperature is lower than the internal target temperature minus the second margin temperature if the internal temperature is lower; and a step of maintaining the cooling sink target temperature without correction if the internal temperature is greater than or equal to the internal target temperature minus the second margin temperature. Claim 2 A method for controlling a refrigerator according to claim 1, wherein the first target control temperature is higher than the internal target temperature by a first margin temperature. Claim 3 delete Claim 4 delete Claim 5 A method for controlling a refrigerator according to claim 1, further comprising: a step of determining whether the internal temperature is higher than the internal temperature plus the second margin temperature if the internal temperature is equal to or higher than the previous internal temperature; a step of lowering the cooling sink target temperature by the correction temperature if the internal temperature is higher than the internal target temperature plus the second margin temperature if the internal temperature is higher; and a step of maintaining the cooling sink target temperature without correction if the internal temperature is less than or equal to the internal target temperature plus the second margin temperature. Claim 6 A method for controlling a refrigerator according to claim 1, wherein the fixed time is 10 minutes, the second allowance temperature is 0.3℃, and the correction temperature is 0.3℃. Claim 7 delete Claim 8 delete Claim 9 A method for controlling a refrigerator according to claim 1, wherein the cooling sink target temperature is set to a temperature obtained by subtracting the subtracted temperature from the internal target temperature. Claim 10 delete Claim 11 A method for controlling a refrigerator according to claim 1, wherein the first voltage is a full duty voltage and the second voltage is lower than the first voltage. Claim 12 A main body including a receiving space; a cooling device installed in the main body and supplying cold air to the receiving space; a first temperature sensor installed in the receiving space; and a processor for controlling the cooling device; wherein the cooling device comprises: a Peltier element; a cooling sink installed on the low-temperature surface of the Peltier element; a cooling fan installed above the cooling sink and supplying air cooled by the cooling sink to the receiving space; a second temperature sensor installed on the cooling sink; a heat dissipation sink installed on the high-temperature surface of the Peltier element; a heat dissipation fan installed below the heat dissipation sink and releasing heat from the heat dissipation sink to the outside of the main body; and a power control unit for controlling the voltage supplied to the Peltier element.The processor comprises, wherein if the internal temperature of the receiving space measured by the first temperature sensor is higher than or equal to the first target control temperature, the processor controls the power control unit to supply a first voltage to the Peltier element, and if the internal temperature is lower than the first target control temperature, the processor controls the power control unit to supply a second voltage to the Peltier element, and when supplying the second voltage, the processor controls the second voltage using PID control (Proportional Integral Derivative control) using the temperature of the cooling sink measured by the second temperature sensor and the cooling sink target temperature, corrects the cooling sink target temperature according to the internal temperature measured by the first temperature sensor, and when the processor corrects the cooling sink target temperature, the processor measures the internal temperature with the first temperature sensor at regular time intervals and determines whether the currently measured internal temperature is the same as the previous internal temperature measured before the regular time, and if the internal temperature is the same as the previous internal temperature, the processor maintains the cooling sink target temperature without correcting it, and the internal temperature is the previous A refrigerator that, if the internal temperature is not the same as the internal temperature, determines whether the internal temperature is lower than the previous internal temperature; if the internal temperature is lower than the previous internal temperature, determines whether the internal temperature is lower than the internal target temperature minus the second margin temperature; if the internal temperature is lower than the internal target temperature minus the second margin temperature, raises the cooling sink target temperature by the correction temperature; and if the internal temperature is greater than or equal to the internal target temperature minus the second margin temperature, maintains the cooling sink target temperature without correction. Claim 13 delete Claim 14 delete Claim 15 delete

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