Circuit board, lighting apparatus and vehicle lamp having thereof

Abstract

A circuit board according to an embodiment comprises: an insulating layer; a first circuit pattern layer disposed on the upper surface of the insulating layer; a first protective layer disposed on the upper surface of the insulating layer and including a first groove portion that overlaps perpendicularly with a first electrode of the first circuit pattern layer; a second circuit pattern layer disposed on the lower surface of the insulating layer and including a second groove portion that overlaps perpendicularly with a second electrode of the second circuit pattern layer; an adhesive layer disposed on the lower surface of the second protective layer; and a heat dissipation portion attached to the adhesive layer, wherein the heat dissipation portion comprises a metal layer including a third groove portion, and the third groove portion has a slope in which the width gradually decreases as it moves from the lower surface of the metal layer toward the upper surface.

Description

Technology Field

[0001] The embodiment relates to a circuit board, and more specifically to a circuit board with improved heat dissipation characteristics, a lighting device, and a vehicle lamp including the same. Background Technology

[0002] LED (Light Emitted Diode) devices are components that convert electrical signals into infrared rays or light using the properties of compound semiconductors. Unlike fluorescent lamps, they do not use harmful substances such as mercury, resulting in fewer causes of environmental pollution, and offer the advantage of a longer lifespan compared to conventional light sources. Furthermore, compared to conventional light sources, they consume less power and offer superior visibility and reduced glare due to their high color temperature.

[0003] Accordingly, current lighting devices are evolving from a form that uses traditional light sources such as conventional incandescent bulbs or fluorescent lamps to a form that uses the aforementioned LED elements as light sources, and in particular, a lighting device that performs a surface light emission function by using a light guide plate, as disclosed in Korean Patent Publication No. 10-2012-0009209, is provided.

[0004] The aforementioned conventional lighting device is structured such that a flat light guide plate is placed on a substrate, and a plurality of side-type LEDs are arranged in an array on the side of the light guide plate. Here, the light guide plate is a type of molded plastic lens that performs the function of supplying uniform light emitted from the LEDs. Therefore, although such a light guide plate is used as an essential component in conventional lighting devices, it has limitations in reducing the overall thickness of the product due to the thickness of the light guide plate itself. Furthermore, because the material of the light guide plate lacks flexibility, it is difficult to apply to curved sections, and consequently, it contains problems such as difficulty in product design and design modification.

[0005] In addition, it contained the problem of reduced luminous efficiency due to light loss caused by some light being emitted from the side of the light guide plate, and also contained the problem of changes in LED characteristics (e.g., changes in luminous intensity and wavelength) as the temperature of the LED increased during light emission.

[0006] Meanwhile, conventional lighting devices have a heat dissipation structure for heat dissipation, and a heat sink is bonded to the lower part of the substrate.

[0007] However, the above lighting device is utilized for various purposes and accordingly has a bending structure.

[0008] Therefore, it is difficult to bond the heat sink to the lower part of the bent lighting device, and due to the trade-off between the bonding strength and thermal conductivity of the bonding layer, it is difficult to improve both the bonding strength and thermal conductivity between the lighting device and the bonding layer.

[0009] Accordingly, there is a need for a new heat dissipation structure that can improve thermal conductivity while enhancing the bonding strength of the heat sink. The problem to be solved

[0010] The embodiment aims to provide a circuit board of a new structure, a lighting device, and a vehicle lamp including the same.

[0011] In addition, the embodiment aims to provide a circuit board capable of improving heat dissipation characteristics, a lighting device, and a vehicle lamp including the same.

[0012] In addition, the embodiment aims to provide a circuit board, a lighting device, and a vehicle lamp including the same that can improve the bonding strength between a substrate part and a heat dissipation part.

[0013] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the proposed embodiments belong from the description below. means of solving the problem

[0014] A circuit board according to an embodiment comprises: an insulating layer; a first circuit pattern layer disposed on the upper surface of the insulating layer; a first protective layer disposed on the upper surface of the insulating layer and including a first groove portion that overlaps perpendicularly with a first electrode of the first circuit pattern layer; a second circuit pattern layer disposed on the lower surface of the insulating layer and including a second groove portion that overlaps perpendicularly with a second electrode of the second circuit pattern layer; an adhesive layer disposed on the lower surface of the second protective layer; and a heat dissipation portion attached to the adhesive layer, wherein the heat dissipation portion comprises a metal layer including a third groove portion, and the third groove portion has a slope in which the width gradually decreases as it moves from the lower surface of the metal layer toward the upper surface.

[0015] In addition, the third groove is formed in multiple numbers on the lower surface of the metal layer of the heat dissipation part, spaced apart in at least one of the longitudinal and width directions.

[0016] In addition, the spacing between the plurality of third grooves is 2.0 mm or more.

[0017] In addition, the width of the third groove satisfies the range of 50㎛ to 400㎛.

[0018] In addition, the thickness of the metal layer of the heat dissipation part satisfies the range of 1 mm to 5 mm.

[0019] In addition, the depth of the third groove satisfies a range of 50% to 90% of the thickness of the metal layer of the heat dissipation part.

[0020] In addition, the metal layer of the heat dissipation portion includes an open portion that overlaps vertically with the second groove portion of the second protective layer.

[0021] Additionally, the second circuit pattern layer includes a third electrode, the second protective layer includes a fourth groove portion that overlaps vertically with the third electrode, and the adhesive layer includes a first portion that overlaps vertically with the second protective layer and a second portion that overlaps vertically with the fourth groove portion of the second protective layer.

[0022] In addition, the thickness of the first portion of the adhesive layer is smaller than the thickness of the second portion of the adhesive layer.

[0023] In addition, the first portion of the adhesive layer is in contact with the second protective layer, and the second portion of the adhesive layer is in contact with the third electrode, and the planar area of ​​the first portion of the adhesive layer is larger than the planar area of ​​the second portion of the adhesive layer.

[0024] In addition, the third groove portion of the second protective layer is formed in multiple numbers and overlaps vertically with one third electrode, and has a dot shape that is spaced apart from each other. Effects of the invention

[0025] The circuit board of the embodiment includes an adhesive layer disposed on the lower surface of a second protective layer and a heat dissipation portion attached to the circuit board through the adhesive layer. That is, the heat dissipation portion is attached before a chip is placed on the circuit board. At this time, the circuit board has a structure that is bent to fit the application product. Furthermore, the heat dissipation portion is attached to the circuit board before the circuit board is bent. Accordingly, in the embodiment, the attachment strength of the heat dissipation portion attached to the circuit board can be improved, and furthermore, the heat dissipation characteristics of the circuit board can be improved.

[0026] In addition, the heat dissipation portion includes a groove on its lower surface. The groove has a slope in which its width gradually decreases from the lower surface toward the upper surface. For example, in an embodiment, the heat dissipation portion including the groove is formed by etching a metal layer. By including the groove in the heat dissipation portion in this way, the bending of the heat dissipation portion together with the circuit board can be facilitated, thereby improving product reliability. Furthermore, in an embodiment, instead of using a conventional heat sink as is, the heat dissipation portion is formed by etching the metal layer to form a groove. Consequently, the position, width, depth, and spacing of the groove can be easily adjusted to match the shape of the product to which the circuit board is applied, thereby increasing product satisfaction and ensuring freedom in product design.

[0027] Meanwhile, the circuit board includes a second circuit pattern layer disposed on the lower surface of the insulating layer. Furthermore, the second protective layer includes a groove that overlaps vertically with the second circuit pattern layer, and the adhesive layer may be disposed within the groove of the second protective layer. Additionally, the heat dissipation portion may be connected to the second circuit pattern layer through the adhesive layer. Through this, in the embodiment, heat transferred to the second circuit pattern layer can be efficiently released to the outside, thereby further enhancing heat dissipation characteristics.

[0028] Meanwhile, the groove portion of the second protective layer in the embodiment may have a dot shape. For example, the second protective layer may include a plurality of mutually spaced groove portions that overlap perpendicularly with a second electrode of one of the second circuit pattern layers. Furthermore, the adhesive layer has a structure in which it is disposed within each of the dot-shaped groove portions of the second protective layer. In this case, the larger the width of the groove portion of the second protective layer, the larger the adhesion area between the adhesive layer and the heat dissipation portion, and the heat dissipation characteristics can be improved accordingly. However, the adhesive layer may have a higher adhesion strength with the second protective layer than with the second circuit pattern layer. For example, the adhesion strength between the adhesive layer and the second circuit pattern layer is lower than the adhesion strength between the adhesive layer and the second protective layer. Accordingly, in the embodiment, the adhesive layer is configured to partially contact the second protective layer and partially contact the second circuit pattern layer. Through this, in the embodiment, the adhesion strength between the circuit board of the heat dissipation portion and the adhesive layer can be further enhanced, and the heat dissipation characteristics can be further improved.

[0029] Furthermore, in the embodiment, the flatness of the circuit board can be further improved. For example, if the groove portion of the second protective layer has a full shape that completely opens the second electrode of the second circuit pattern layer, when the heat dissipation portion is attached, an issue of indentation occurs in the area where the groove portion of the second protective layer is formed, and a flatness problem may occur as a result. In contrast, in the embodiment, by making the groove portion of the second protective layer (160) have a dot or point shape rather than a full shape, the bending that occurs when the heat dissipation portion (180) is attached can be minimized, and the flatness of the circuit board can be increased accordingly.

[0030] In addition, in the embodiment, the heat dissipation member is used to improve the heat dissipation characteristics of the circuit board and can shield EMI noise transmitted downward through the second circuit pattern layer, thereby reducing the electrical resistance between the second circuit pattern layer and the heat dissipation member and further improving the overall electrical reliability of the circuit board. Brief explanation of the drawing

[0031] FIG. 1 is a drawing showing a circuit board according to a first embodiment. Figure 2 is an enlarged view of the heat dissipation section of Figure 1. FIG. 3 is a drawing showing a circuit board according to a second embodiment. Figure 4 is a bottom view of the circuit board of Figure 3 before the adhesive layer and heat dissipation part are placed. Figure 5 is a bottom view of the circuit board of Figure 3 after the heat dissipation part has been placed. FIG. 6 is a drawing showing a circuit board according to a third embodiment. Figure 7 is a bottom view of the circuit board of Figure 6 before the adhesive layer and heat dissipation part are placed. Figure 8 is a bottom view of the circuit board of Figure 6 after the heat dissipation part has been placed. FIG. 9 is a drawing showing a lighting device according to the first embodiment. FIG. 10 is a drawing showing a lighting device according to a second embodiment. FIG. 11 is a plan view of a vehicle with a vehicle lamp having a lighting device according to an embodiment. FIG. 12 is a drawing showing a lighting device disclosed in an embodiment or a vehicle lamp having a lighting device. Specific details for implementing the invention

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0033] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0034] Furthermore, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning generally understood by those skilled in the art to which the present invention pertains, unless explicitly and specifically defined otherwise. Terms commonly used, such as those defined in advance, may be interpreted by considering their meaning in the context of the relevant technology. Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0035] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C. Additionally, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention.

[0036] These terms are intended merely to distinguish a component from other components and are not to limit the nature, order, or sequence of said component. Furthermore, where it is stated that a component is 'connected,' 'combined,' or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected,' 'combined,' or 'joined' due to another component located between the component and the other component.

[0037] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0039] Prior to the description of the present invention, the present invention provides a substrate capable of mounting at least one chip. Herein, the chip may be a chip related to a camera device, or alternatively, a chip related to a lighting device. For example, the chip may refer to an image sensor included in a camera device. For example, the chip may refer to a driver element included in a camera device. For example, the chip may refer to a light-emitting element included in a lighting device. Preferably, the embodiment provides a circuit board that is applicable to automotive lighting and can improve heat dissipation characteristics and bonding properties. Accordingly, the circuit board of the embodiment is described below as being applied to a lighting module and a lighting device including the same. However, the embodiment is not limited thereto, and the circuit board may be used as a substrate for other electronic devices other than lighting devices. The above electronic devices may include smartphones, personal digital assistants, digital video cameras, digital still cameras, network systems, computers, monitors, tablets, laptops, netbooks, televisions, video games, smartwatches, automotive devices, etc. However, they are not limited to these, and it goes without saying that they may be any other electronic devices that process data in addition to these.

[0041] FIG. 1 is a drawing showing a circuit board according to a first embodiment, and FIG. 2 is an enlarged view of the heat dissipation part of FIG. 1.

[0042] Hereinafter, a circuit board according to an embodiment will be described in detail with reference to FIG. 1 and FIG. 2.

[0043] The circuit board includes an insulating layer (110), a first circuit pattern layer (120), a second circuit pattern layer (130), a through electrode (140), a first protective layer (150), a second protective layer (160), an adhesive layer (170), and a heat dissipation portion (180).

[0044] The insulating layer (110) may have a single-layer structure or, alternatively, a multiple-layer structure. Specifically, in FIG. 1, the insulating layer (110) is shown as having a single-layer structure, but is not limited thereto. For example, the circuit board of the embodiment may have a layer structure of two or more layers based on the number of insulating layers.

[0045] For example, if the insulating layer (110) has a plurality of layer structures, the upper surface of the insulating layer (110) in FIG. 1 may refer to the upper surface of the uppermost insulating layer positioned at the top among the plurality of insulating layers. For example, if the insulating layer (110) has a plurality of layer structures, the lower surface of the insulating layer (110) in FIG. 1 may refer to the lower surface of the lowest insulating layer positioned at the bottom among the plurality of insulating layers.

[0046] The insulating layer (110) is a substrate on which an electrical circuit capable of changing wiring is organized, and may include a printed circuit board and an insulating substrate made of an insulating material capable of forming circuit patterns on its surface.

[0047] For example, the insulating layer (110) may be rigid or flexible. For example, the insulating layer (110) may include glass or plastic. Specifically, the insulating layer (110) may include chemically strengthened / semi-strengthened glass such as soda lime glass or aluminosilicate glass, or strengthened or flexible plastic such as polyimide (PI), polyethylene terephthalate (PET), propylene glycol (PPG) polycarbonate (PC), or sapphire.

[0048] Additionally, the insulating layer (110) may include an optically isotropic film. For example, the insulating layer (110) may include COC (Cyclic Olefin Copolymer), COP (Cyclic Olefin Polymer), optically isotropic polycarbonate (PC), or optically isotropic polymethyl methacrylate (PMMA).

[0049] Additionally, the insulating layer (110) may be formed from a material including an inorganic filler and an insulating resin. For example, as a material constituting the insulating layer (110), a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, and a resin containing reinforcing materials such as inorganic fillers such as silica and alumina may be used, specifically ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine), PID (Photo Imagable Dielectric Resin), BT, etc.

[0050] Additionally, the insulating layer (110) may be bent while having a partially curved surface. That is, the insulating layer (110) may be bent while having a partially flat surface and a partially curved surface. Specifically, the insulating layer (110) may be bent or curved with a curved end or a surface including random curvature.

[0051] Preferably, the circuit board of the embodiment can be bent or curved according to the external shape of the applied product.

[0052] Accordingly, the circuit board may be a flexible circuit board. Accordingly, it is preferable that the insulating layer (110) be formed of a polyimide having flexible properties.

[0053] The above insulating layer (110) can be divided into multiple regions.

[0054] For example, the upper surface of the insulating layer (110) may be divided into a first region (R1) and a second region (R2). The first region (R1) of the insulating layer (110) may correspond to a chip mounting area. In one embodiment, the first region (R1) of the insulating layer (110) may refer to an area where a light source (not shown) is placed. And, the second region (R2) of the insulating layer (110) may refer to the remaining area excluding the first region (R1). For example, the upper surface of the insulating layer (110) may include a plurality of first regions (R1) that are spaced apart from each other in the width direction and / or length direction so that a plurality of light sources are placed. And, the second region (R2) may refer to an area between the plurality of first regions (R1).

[0055] The lower surface of the insulating layer (110) may include a third region (R3) and a fourth region (R4). The third region (R3) of the insulating layer (110) may refer to an area where a heat dissipation member (180), described below, is placed. For example, the third region (R3) of the insulating layer (110) may refer to an area where a heat sink, described below, is placed. For example, the third region (R3) of the insulating layer (110) may refer to an area where a heat dissipation metal layer, described below, is placed. Preferably, the third region (R3) of the insulating layer (110) may refer to an area that overlaps vertically with the heat dissipation member (180), described below. The fourth region (R4) of the insulating layer (110) may refer to an area other than the third region (R3). The fourth region (R4) of the insulating layer (110) may refer to an area where the heat dissipation part (180) is not placed. For example, the fourth region (R4) of the insulating layer (110) may be an area that does not overlap vertically with the heat dissipation part (180). For example, the fourth region (R4) of the insulating layer (110) may refer to an area where a connector (not shown) connecting the circuit board of the embodiment and an external board is placed. Furthermore, as will be explained below, the heat dissipation part (180) may not be placed in the fourth region (R4) of the insulating layer (110). For example, the heat dissipation part (180) may have an open portion formed corresponding to the area where the connector is placed.

[0056] A circuit pattern layer can be placed on the surface of the insulating layer (110).

[0057] For example, a first circuit pattern layer (120) may be disposed on the upper surface of the insulating layer (110). For example, a second circuit pattern layer (130) may be disposed on the lower surface of the insulating layer (110).

[0058] The first circuit pattern layer (120) and the second circuit pattern layer (130) are wirings that transmit electrical signals and can be formed of a metal material with high electrical conductivity.

[0059] To this end, the first circuit pattern layer (120) and the second circuit pattern layer (130) may be formed from at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu) and zinc (Zn).

[0060] Additionally, the first circuit pattern layer (120) and the second circuit pattern layer (130) may be formed from a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which has excellent bonding strength. Preferably, the first circuit pattern layer (120) and the second circuit pattern layer (130) may be formed from copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0061] Additionally, at least one of the first circuit pattern layer (120) and the second circuit pattern layer (130) may have a surface treatment layer (not shown) formed on its surface. The surface treatment layer may be a layer for enhancing bonding with a chip (not shown) mounted on the circuit board.

[0062] The first circuit pattern layer (120) and the second circuit pattern layer (130) can be manufactured using conventional printed circuit board manufacturing processes such as the additive process, subtractive process, MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process), and a detailed description is omitted here.

[0063] The first circuit pattern layer (120) and the second circuit pattern layer (130) each include a trace and an electrode.

[0064] The above electrode may also be referred to as a pad. For example, the above electrode may correspond to a mounting pad on which a chip is mounted. For example, the above electrode may correspond to a terminal pad on which a connector connecting the circuit board and an external board (e.g., a main board of a vehicle) is placed.

[0065] For example, the first circuit pattern layer (120) may include a first electrode. And, the second circuit pattern layer (130) may include a second electrode.

[0066] Preferably, the first circuit pattern layer (120) may include a plurality of first electrodes. For example, the first circuit pattern layer (120) may include a plurality of first electrodes on which a plurality of chips are each mounted.

[0067] Additionally, the plurality of first electrodes may be divided into a plurality of first sub-electrodes. For example, the plurality of first sub-electrodes may include a first-1 sub-electrode and a first-2 sub-electrode. The first-1 sub-electrode may be connected to the positive terminal of the chip. Furthermore, the first-2 sub-electrode may be connected to the negative terminal of the chip.

[0068] In one embodiment, each of the first electrodes may include three sub-electrodes. One of the three sub-electrodes may be connected to either the positive terminal or the negative terminal of the chip. And, the remaining two of the three sub-electrodes may be connected to the other of the positive terminal and the negative terminal of the chip.

[0069] At this time, the two sub-electrodes may be common electrodes that are commonly connected to a plurality of chips. For example, instead of one chip being placed on the two sub-electrodes, the structure may have two chips being commonly placed.

[0070] For example, when the first to third chips are arranged in the longitudinal direction, the negative or positive terminals of the first chip and the second chip may be commonly arranged on one of the two sub-electrodes. Additionally, the negative or positive terminals of the second chip and the third chip may be commonly arranged on the other of the two sub-electrodes.

[0071] Meanwhile, the second circuit pattern layer (130) may include a second electrode. The second circuit pattern layer (130) may include a second electrode that is electrically connected to the first electrode of the first circuit pattern layer (120). For example, the second circuit pattern layer (130) may include a second-1 sub-electrode connected to the first-1 sub-electrode of the first electrode and a second-2 sub-electrode connected to the first-2 sub-electrode of the first electrode.

[0072] Meanwhile, a through electrode (140) may be disposed in the insulating layer (110). The through electrode (140) can electrically connect the first electrode of the first circuit pattern layer (120) disposed on the upper surface of the insulating layer (110) and the second electrode of the second circuit pattern layer (130) disposed on the lower surface of the insulating layer (110).

[0073] The through electrode (140) may also be a via disposed within the insulating layer (110). The through electrode (140) may be formed in multiple numbers within the insulating layer (110), spaced apart in the longitudinal or width direction. For example, the through electrode (140) may be intended to connect multiple mutually adjacent first electrodes.

[0074] That is, some of the sub-electrodes of each of the plurality of first electrodes can be directly connected to each other through the traces of the first circuit pattern layer (120). Additionally, other parts of the sub-electrodes of each of the plurality of first electrodes can be interconnected through the through electrode (140) and the second electrode.

[0075] The above-mentioned penetrating electrode (140) can be formed by forming a penetrating hole (not shown) that penetrates the insulating layer (110) and filling the inside of the formed penetrating hole with a metal material.

[0076] The above through hole may be formed by any one of mechanical, laser, and chemical processing methods. When the above through hole is formed by mechanical processing, methods such as milling, drilling, and routing may be used; when it is formed by laser processing, UV or CO2 laser methods may be used; and when it is formed by chemical processing, the insulating layer may be opened using a chemical containing aminosilanes, ketones, etc.

[0077] When the through hole is formed, the inside of the through hole can be filled with a conductive material to form the through electrode (140). The through electrode (140) may be formed from any one of the metal materials selected from copper (Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd). Additionally, the filling of the conductive material may be performed using any one of electroless plating, electroplating, screen printing, sputtering, evaporation, inkjetting, and dispensing, or a combination thereof.

[0078] Meanwhile, if the circuit board of the embodiment has a multilayer structure, the insulating layer may be formed into a plurality of layers.

[0079] In addition, when the insulating layer is formed in multiple layers, a circuit pattern layer may be formed on the surface of each of the multiple insulating layers. Also, when the insulating layer is formed in multiple layers, a through electrode may be formed within each of the multiple insulating layers.

[0080] Additionally, when the insulating layer is formed in multiple layers, the first circuit pattern layer (120) may refer to a circuit pattern layer placed on the upper surface of the uppermost insulating layer among the multiple insulating layers. Additionally, when the insulating layer is formed in multiple layers, the second circuit pattern layer (130) may refer to a circuit pattern layer placed on the lower surface of the lowest insulating layer among the multiple insulating layers.

[0081] The above circuit board includes a protective layer.

[0082] The above protective layer may include a first protective layer (150) disposed on the upper surface of the insulating layer (110) and a second protective layer (160) disposed on the lower surface of the insulating layer (110).

[0083] The first protective layer (150) may include a groove (151) that overlaps vertically with the first electrode of the first circuit pattern layer (120) disposed on the upper surface of the insulating layer (110). For example, the first protective layer (150) may include a groove (151) that overlaps vertically with the first region (R1) on the upper surface of the insulating layer (110). The groove (151) may expose the upper surface of the first electrode corresponding to the pad on which the chip is to be mounted on the upper surface of the first circuit pattern layer (120).

[0084] The second protective layer (160) may include a groove (161) that overlaps vertically with the second electrode of the second circuit pattern layer (130) disposed on the lower surface of the insulating layer (110). For example, the second protective layer (160) may include a groove (161) that overlaps vertically with the fourth region (R4) on the lower surface of the insulating layer (110). For example, the second protective layer (160) may expose the lower surface of the second electrode corresponding to the region where the connector is to be disposed on the lower surface of the second circuit pattern layer (130).

[0085] The first protective layer (150) and the second protective layer (160) may include an insulating material.

[0086] For example, the first protective layer (150) and the second protective layer (160) may include various materials that can be heated and cured after being applied to protect the surfaces of the first circuit pattern layer (120) and the second circuit pattern layer (130).

[0087] For example, the first protective layer (150) and the second protective layer (160) may be resist layers. For example, the first protective layer (150) and the second protective layer (160) may be solder resist layers containing organic polymer materials. For example, the first protective layer (150) and the second protective layer (160) may include an epoxy acrylate-based resin. In detail, the first protective layer (150) and the second protective layer (160) may include a resin, a curing agent, a photoinitiator, a pigment, a solvent, a filler, an additive, an acrylic-based monomer, etc. However, the examples are not limited thereto, and it goes without saying that the protective layer (140) may be any one of a photosolder resist layer, a cover-lay, and a polymer material.

[0088] An adhesive layer (170) may be disposed on the lower surface of the second protective layer (160).

[0089] The adhesive layer (170) may be vertically overlapped with the second protective layer (160). The adhesive layer (170) may not be vertically overlapped with the groove (161) of the second protective layer (160). For example, the adhesive layer (170) may include an open portion (not shown) that is vertically overlapped with the groove (161) of the second protective layer (160). Accordingly, the area of ​​the adhesive layer (170) in the first embodiment may be the same as the area of ​​the lower surface of the second protective layer (160). Meanwhile, the present disclosure is not limited thereto, and the adhesive layer (170) may include an open portion (not shown) that is vertically overlapped with the groove (161) of the second protective layer (160) and has a width wider than the width of the groove (161). In this case, the area of ​​the adhesive layer (170) may be smaller than the area of ​​the lower surface of the second protective layer (160).

[0090] Specifically, in the first embodiment, the adhesive layer (170) does not come into contact with the second circuit pattern layer (130). For example, the adhesive layer (170) may come into contact only with the lower surface of the second protective layer (160). The adhesive layer (170) may be an adhesive member containing an adhesive component. As an example, the adhesive layer (170) may be PSA (CBF-800), but is not limited thereto. However, the embodiment is not limited thereto, and the adhesive layer (170) may be composed of an adhesive member containing epoxy or an organic material.

[0091] A heat dissipation member (180) may be disposed below the adhesive layer (170). The heat dissipation member (180) may be bonded to the lower part of the second protective layer (160) through the adhesive layer (170).

[0092] The heat dissipation portion (180) may be a metal layer containing a metal material having excellent thermal conductivity. For example, the heat dissipation portion (180) may be a metal layer containing aluminum. However, the embodiments are not limited thereto, and the heat dissipation portion (180) may be formed of other metal materials having excellent thermal conductivity in addition to aluminum.

[0093] The heat dissipation portion (180) may include an open portion (182) that overlaps vertically with the fourth region (R4) of the insulating layer (110). For example, the heat dissipation portion (180) may include an open portion (182) that overlaps vertically with the region where the connector is placed. The open portion (182) of the heat dissipation portion (180) may refer to the region where the connector is placed. Alternatively, the heat dissipation portion (180) may include an open portion (182) that overlaps vertically with the open portion of the adhesive layer (170).

[0094] The heat dissipation portion (180) may include a groove portion (181). For example, the heat dissipation portion (180) may include an upper surface in contact with the lower surface of the adhesive layer (170) and a lower surface opposite to the upper surface.

[0095] Additionally, the heat dissipation portion (180) may include a groove (181) formed from the lower surface toward the upper surface. The depth of the groove (181) of the heat dissipation portion (180) may be smaller than the thickness of the heat dissipation portion (180). Thus, the groove (181) of the heat dissipation portion (180) does not penetrate the heat dissipation portion (180). The groove (181) of the heat dissipation portion (180) may have a shape in which the width is the same, decreases, or increases from the lower surface toward the upper surface of the heat dissipation portion (180). For example, the cross-section from the lower surface toward the upper surface of the groove (181) of the heat dissipation portion (180) may have a shape such as a square, triangle, or trapezoid. Meanwhile, in the present disclosure, the shape of the groove (181) of the heat dissipation portion (180) is not limited to the examples described above and may have various shapes.

[0096] A plurality of grooves (181) spaced apart from each other in the length direction and width direction may be formed on the lower surface of the heat dissipation part (180).

[0097] The above groove (181) can enable bending of the heat dissipation part (180). That is, the circuit board in the embodiment is applied to a lighting device that includes a bending area. In addition, in the embodiment, bending of the heat dissipation part (180) is also performed along with bending of the circuit board. To this end, in the embodiment, a groove (181) is formed on the lower surface of the heat dissipation part (180) and extends toward the upper surface of the heat dissipation part (180). In addition, the heat dissipation part (180) may have a structure that allows bending around the groove (181).

[0098] Specifically, referring to FIG. 2, a plurality of mutually spaced grooves (181) are formed on the lower surface of the heat dissipation portion (180). At this time, the width (W1) of the plurality of grooves (181) may satisfy a range of 50 μm to 400 μm. For example, the width (W1) of the plurality of grooves (181) may satisfy a range of 80 μm to 350 μm. For example, the width (W1) of the plurality of grooves (181) may satisfy a range of 100 μm to 300 μm. At this time, the upper width and lower width of the grooves (181) may be the same or different from each other. When the upper width and lower width of the grooves (181) are different from each other, the width (W1) may mean any one of the minimum width, maximum width, intermediate width, and average width in the entire area of ​​the grooves (181). Meanwhile, the present disclosure is not limited thereto, and the width (W1) may mean any one of the width values ​​in the entire area of ​​the groove (181).

[0099] If the width (W1) of the plurality of grooves (181) is smaller than 50 μm, the bendability of the heat dissipation portion (180) is reduced, and accordingly, it may be difficult to apply the circuit board to products having various shapes (e.g., lighting devices). If the width (W1) of the plurality of grooves (181) is larger than 400 μm, as the area occupied by the grooves (181) in the total area of ​​the heat dissipation portion (180) increases, there is a problem that the heat dissipation characteristics of the circuit board by the heat dissipation portion (180) are reduced. In addition, if the width (W1) of the grooves (181) is larger than 400 μm, the bendability of the heat dissipation portion (180) becomes too large, and accordingly, a problem may occur in which the strength of the circuit board is reduced. Furthermore, if the width (W1) of the above-mentioned groove (181) is greater than 400 μm, there may be a problem in that it is difficult to form the bending shape of the above-mentioned heat dissipation part (180) into a desired shape.

[0100] Meanwhile, the spacing (W2) between the plurality of grooves (181) may be 2.0 mm or more. For example, the spacing (W2) between the plurality of grooves (181) may be 2.2 mm or more. For example, the spacing (W2) between the plurality of grooves (181) may be 2.5 mm or more.

[0101] Preferably, the spacing (W2) between the plurality of grooves (181) may have a range between 2.0 mm and 10 mm. For example, the spacing (W2) between the plurality of grooves (181) may satisfy a range between 2.2 mm and 8 mm. For example, the spacing (W2) between the plurality of grooves (181) may satisfy a range between 2.5 mm and 7.5 mm.

[0102] If the spacing (W2) between the plurality of grooves (181) is smaller than 2.0 mm, the area occupied by the grooves (181) in the heat dissipation portion (180) may increase, and accordingly, the heat dissipation characteristics of the circuit board by the heat dissipation portion (180) may decrease, the strength of the circuit board may decrease, or it may be difficult to form the heat dissipation portion (180) into a desired bending shape. In addition, if the spacing (W2) between the plurality of grooves (181) is larger than 10 mm, the elasticity of the heat dissipation portion (180) decreases, and accordingly, there is a problem that the bendability of the heat dissipation portion (180) decreases. For example, if the spacing (W2) between the multiple grooves (181) is greater than 10 mm, a lot of force may be required to bend the circuit board into a desired bending shape by the heat dissipation part (180), and furthermore, there is a problem that damage occurs to the circuit board due to the reduced bendability of the heat dissipation part (180).

[0103] Meanwhile, the above spacing (W2) may refer to the width of the area where the groove (181) is not formed on the lower surface of the heat dissipation part (180). For example, the above spacing (W2) may refer to the distance between adjacent grooves (181). For example, the above spacing (W2) may refer to the distance between the inner walls facing each other in adjacent grooves (181). For example, the groove (181) may include an adjacent first groove and a second groove. And, the first inner wall of the first groove and the second inner wall of the second groove may be located adjacent to each other. In this case, the spacing (W2) may refer to the horizontal distance between the lower end of the first inner wall and the lower end of the second inner wall. However, the embodiments are not limited thereto. For example, the above spacing (W2) may refer to the horizontal distance between the upper end of the first inner wall and the upper end of the second inner wall. For example, the above spacing (W2) may refer to the horizontal distance between any point between the upper end and the lower end of the first inner wall and any point between the upper end and the lower end of the second inner wall.

[0104] Meanwhile, the thickness (T1) of the heat dissipation part (180) may satisfy a range of 1 mm to 5 mm. For example, the thickness (T1) of the heat dissipation part (180) may satisfy a range of 1.2 mm to 4.5 mm. For example, the thickness (T1) of the heat dissipation part (180) may satisfy a range of 1.5 mm to 4.0 mm.

[0105] If the thickness (T1) of the heat dissipation portion (180) is less than 1 mm, the effect of improving the heat dissipation characteristics of the circuit board by the heat dissipation portion (180) may be insufficient. Additionally, if the thickness (T1) of the heat dissipation portion (180) is greater than 5 mm, the overall thickness of the circuit board may increase as the thickness of the heat dissipation portion (180) increases. Furthermore, if the thickness (T1) of the heat dissipation portion (180) is greater than 5 mm, the depth of the groove portion (181) must also increase accordingly, and thus the time required to form the groove portion (181) in the heat dissipation portion (180) may increase.

[0106] The depth (T2) of the above-mentioned groove (181) can be determined by the thickness (T1) of the above-mentioned heat dissipation portion (180).

[0107] Preferably, the depth (T2) of the groove (181) may satisfy a range between 50% and 90% of the thickness (T1) of the heat dissipation portion (180). For example, the depth (T2) of the groove (181) may satisfy a range between 60% and 80% of the thickness (T1) of the heat dissipation portion (180). For example, the depth (T2) of the groove (181) may satisfy a range between 65% and 75% of the thickness (T1) of the heat dissipation portion (180).

[0108] If the depth (T2) of the above-mentioned groove (181) is less than 50% of the thickness (T1) of the above-mentioned heat dissipation portion (180), the bendability of the above-mentioned heat dissipation portion (180) is reduced, and accordingly, it may be difficult to form a circuit board including the above-mentioned heat dissipation portion (180) into a desired bending shape.

[0109] Additionally, if the depth (T2) of the groove (181) is greater than 90% of the thickness (T1) of the heat dissipation portion (180), damage to the circuit board may occur during the process of forming the groove (181). For example, if the depth (T2) of the groove (181) is greater than 90% of the thickness (T1) of the heat dissipation portion (180), a groove may also be formed in the adhesive layer (170) due to process deviations during the process of forming the groove (181), and consequently, a problem may arise in which the bonding performance of the heat dissipation portion (180) is reduced. Additionally, if the depth (T2) of the groove (181) is greater than 90% of the thickness (T1) of the heat dissipation portion (180), damage may be applied to the second circuit pattern layer (130) during the process of forming the groove (181), and consequently, electrical reliability problems such as the second circuit pattern layer (130) being delaminated may occur.

[0110] Meanwhile, the above-mentioned groove (181) can be formed by attaching a metal layer to the lower part of the second protective layer (160) using the adhesive layer (170) and performing a process of etching the metal layer.

[0111] For example, the heat dissipation portion (180) can be formed by etching the metal layer instead of using a heat sink applied to a general substrate.

[0112] That is, the heat dissipation portion (180) must be bent to fit the shape of the product to which the circuit pattern layer (120) is applied. In addition, the groove portion (181) formed in the heat dissipation portion (180) enables the bending of the heat dissipation portion (180). Accordingly, in the embodiment, the position of the groove portion (181), the depth (T2) of the groove portion (181), the width of the groove portion (181), and the spacing between the plurality of groove portions can be adjusted to fit the shape of the product to which the circuit board is applied.

[0113] Accordingly, the groove (181) may have a slope. For example, the groove (181) may have a slope with respect to the upper or lower surface of the heat dissipation portion (180). Preferably, the groove (181) may have a slope in which the width gradually decreases as it moves from the lower surface of the heat dissipation portion (180) toward the upper surface.

[0114] Meanwhile, the present disclosure is not limited thereto, and according to the embodiment, the groove (181) of the heat dissipation part (180) may have a width that is the same from the lower surface to the upper surface, or may have a slope in which the width increases.

[0116] The circuit board of the embodiment includes an adhesive layer disposed on the lower surface of a second protective layer and a heat dissipation portion attached to the circuit board through the adhesive layer. That is, the heat dissipation portion is attached before a chip is placed on the circuit board. At this time, the circuit board has a structure that is bent to fit the application product. Furthermore, the heat dissipation portion is attached to the circuit board before the circuit board is bent. Accordingly, in the embodiment, the attachment strength of the heat dissipation portion attached to the circuit board can be improved, and furthermore, the heat dissipation characteristics of the circuit board can be improved.

[0117] In addition, the heat dissipation portion includes a groove on its lower surface. The groove has a slope in which its width gradually decreases from the lower surface toward the upper surface. For example, in an embodiment, the heat dissipation portion including the groove is formed by etching a metal layer. By including the groove in the heat dissipation portion in this way, the bending of the heat dissipation portion together with the circuit board can be facilitated, thereby improving product reliability. Furthermore, in an embodiment, instead of using a conventional heat sink as is, the heat dissipation portion is formed by etching the metal layer to form a groove. Consequently, the position, width, depth, and spacing of the groove can be easily adjusted to match the shape of the product to which the circuit board is applied, thereby increasing product satisfaction and ensuring freedom in product design.

[0119] Hereinafter, with reference to the circuit board of FIG. 1, a circuit board of an additional embodiment distinct from it will be described.

[0120] FIG. 3 is a drawing showing a circuit board according to a second embodiment, FIG. 4 is a bottom view of the circuit board of FIG. 3 before the adhesive layer and the heat dissipation part are arranged, and FIG. 5 is a bottom view of the circuit board of FIG. 3 after the heat dissipation part is arranged.

[0121] In FIG. 1, the groove (161) of the second protective layer (160) of the circuit board is formed only in the area that overlaps with the fourth region (R4) of the insulating layer (110). Accordingly, the adhesive layer (170) in the circuit board of the first embodiment comes into contact only with the second protective layer (160).

[0122] Alternatively, the second protective layer (160A) of the circuit board in the second embodiment may further include a groove (162A) that overlaps vertically with the adhesive layer (170A).

[0123] The groove (162A) of the second protective layer (160A) may be vertically overlapped with the third region (R3) of the insulating layer (110). Accordingly, the third region (R3) may be divided into multiple regions based on the groove (162A) of the second protective layer (160A).

[0124] For example, the third region (R3) may include a third-1 region (R3-1) that overlaps vertically with the groove (162A) of the second protective layer (160A), and a third-2 region (R3-2) excluding the third-1 region (R3-1).

[0125] The adhesive layer (170A) may be disposed on the lower surface of the second protective layer (160A) and within the groove (162A). For example, the adhesive layer (170A) may include a first portion that overlaps vertically with the second protective layer (160A) and a second portion that overlaps vertically with the groove (162A) of the second protective layer (160A).

[0126] Specifically, as illustrated in FIG. 4, a second circuit pattern layer (130) is disposed on the lower surface of the insulating layer (110). At this time, the second circuit pattern layer (130) includes at least one second electrode. The second electrode may refer to an electrode connected to the positive terminal of the chip, or alternatively, an electrode connected to the negative terminal of the chip. Preferably, the second electrode can function as a ground. Through this, it is preferable that the second electrode be connected to the negative terminal of the chip.

[0127] Meanwhile, in the second embodiment, the groove (162A) of the second protective layer (160A) may overlap vertically with the second electrode. In this case, in the second embodiment, one groove (162A) may be formed in the area of ​​the second protective layer (160A) that overlaps vertically with one second electrode. For example, the groove (162A) of the second protective layer (160A) in the second embodiment may have a full shape.

[0128] Meanwhile, as illustrated in FIG. 5, the adhesive layer (170A) is positioned below the second protective layer (160A). For example, the adhesive layer (170A) is positioned on the lower surface of the second protective layer (160A) and within the groove (162A) of the second protective layer (160A).

[0129] Specifically, the adhesive layer (170A) may include a first portion (170A-1) disposed on the lower surface of the second protective layer (160A). The first portion (170A-1) of the adhesive layer (170A) may overlap vertically with the second protective layer (160A). For example, the first portion (170A-1) of the adhesive layer (170A) may overlap vertically with the third-2 region (R3-2).

[0130] Additionally, the adhesive layer (170A) may include a second portion (170A-2) that overlaps vertically with the groove (162A) of the second protective layer (160A). The second portion (170A-2) of the adhesive layer (170A) may be placed within the groove (162A) of the second protective layer (160A). Accordingly, the second portion (170A-2) of the adhesive layer (170A) may come into contact with the lower surface (130A) of the second electrode that overlaps vertically with the groove (162A).

[0131] Meanwhile, at least a portion of the second portion (170A-2) of the adhesive layer (170A) may be disposed within the groove (162A) of the second protective layer (160A), and the remaining portion may have a structure protruding downward from the lower surface of the second protective layer (160A).

[0132] Accordingly, the thicknesses of the first portion (170A-1) and the second portion (170A-2) of the adhesive layer (170A) in the second embodiment may differ from each other. For example, the second portion (170A-2) of the adhesive layer (170A) in the second embodiment may be larger than the thickness of the first portion (170A-1). Preferably, the second portion (170A-2) of the adhesive layer (170A) may be larger than the thickness of the first portion (170A-1) by the depth of the groove portion (162A) of the second protective layer (160A).

[0133] According to the second embodiment as described above, at least a portion of the adhesive layer (170A) is disposed within the groove (162A) of the second protective layer (160A). By doing so, the contact area between the adhesive layer (170A) and the circuit board can be increased in the second embodiment. For example, in the second embodiment, the contact area can be increased by the thickness of the inner wall of the groove (162A) of the second protective layer (160A) compared to the first embodiment.

[0134] Furthermore, in the second embodiment, the second portion (170A-2) of the adhesive layer (170A) has a structure in which it contacts the second electrode of the second circuit pattern layer (130). At this time, the adhesive layer (170A) is characterized by having a higher thermal conductivity than the second protective layer (160A). Through this, in the embodiment, as the second portion (170A-2) of the adhesive layer (170A) has a structure in which it directly contacts the second electrode of the second circuit pattern layer (130), the heat transferred through the second electrode can be released more efficiently through the heat dissipation unit (180), thereby further improving the heat dissipation characteristics.

[0135] Meanwhile, although it was stated that the second circuit pattern layer includes a second electrode, it may be divided into a second electrode and a third electrode depending on the location.

[0136] For example, an electrode that overlaps vertically with the groove (161) of the second protective layer among the second circuit pattern layers may be called a second electrode, and an electrode that overlaps vertically with the groove (162A) of the second protective layer may be called a third electrode.

[0138] The circuit board of the embodiment includes an adhesive layer disposed on the lower surface of a second protective layer and a heat dissipation portion attached to the circuit board through the adhesive layer. That is, the heat dissipation portion is attached before a chip is placed on the circuit board. At this time, the circuit board has a structure that is bent to fit the application product. Furthermore, the heat dissipation portion is attached to the circuit board before the circuit board is bent. Accordingly, in the embodiment, the attachment strength of the heat dissipation portion attached to the circuit board can be improved, and furthermore, the heat dissipation characteristics of the circuit board can be improved.

[0139] In addition, the heat dissipation portion includes a groove on the lower surface. The groove has a slope in which its width gradually decreases as it moves from the lower surface toward the upper surface. For example, in an embodiment, the heat dissipation portion including the groove is formed by etching a metal layer. By including the groove in the heat dissipation portion in this way, the bending of the heat dissipation portion together with the circuit board can be easily performed, thereby improving product reliability. Meanwhile, the present disclosure is not limited thereto, and depending on the embodiment, the groove (181) may have a width that is constant or a slope in which the width increases from the lower surface toward the upper surface. Furthermore, in an embodiment, instead of using a conventional heat sink as is, the heat dissipation portion is formed by etching the metal layer to form a groove. This allows the position, width, depth, and spacing of the groove to be easily adjusted to match the shape of the product to which the circuit board is applied, thereby increasing product satisfaction and securing product design freedom.

[0140] Meanwhile, the circuit board includes a second circuit pattern layer disposed on the lower surface of the insulating layer. Furthermore, the second protective layer includes a groove that overlaps vertically with the second circuit pattern layer, and the adhesive layer may be disposed within the groove of the second protective layer. Additionally, the heat dissipation portion may be connected to the second circuit pattern layer through the adhesive layer. Through this, in the embodiment, heat transferred to the second circuit pattern layer can be efficiently released to the outside, thereby further enhancing heat dissipation characteristics.

[0142] FIG. 6 is a drawing showing a circuit board according to a third embodiment, FIG. 7 is a bottom view of the circuit board of FIG. 6 before the adhesive layer and the heat dissipation part are arranged, and FIG. 8 is a bottom view of the circuit board of FIG. 6 after the heat dissipation part is arranged.

[0143] In FIG. 1, the groove (161) of the second protective layer (160) of the circuit board is formed only in the area that overlaps with the fourth region (R4) of the insulating layer (110). Accordingly, the adhesive layer (170) in the circuit board of the first embodiment comes into contact only with the second protective layer (160).

[0144] Alternatively, the second protective layer (160A) of the circuit board in the second embodiment may further include a groove (162A) that overlaps vertically with the adhesive layer (170A). In this case, the second protective layer (160A) in the second embodiment has a full groove (162A) formed in an area that overlaps vertically with one second electrode.

[0145] Alternatively, the second protective layer (160B) in the third embodiment includes a groove (162B) formed in an area that overlaps vertically with the adhesive layer (170B). Additionally, the groove (162B) of the second protective layer (160B) in the third embodiment may have a dot or dot shape.

[0146] The groove (162B) of the second protective layer (160B) may be vertically overlapped with the third region (R3) of the insulating layer (110). Accordingly, the third region (R3) may be divided into multiple regions based on the groove (162B) of the second protective layer (160B).

[0147] For example, the third region (R3) may include a third-1 region (R3-1) that overlaps vertically with the groove (162B) of the second protective layer (160B), and a third-2 region (R3-2) excluding the third-1 region (R3-1). In this case, in the second embodiment, one third-1 region (R3-1) is formed based on one electrode. Alternatively, in the third embodiment, a plurality of third-1 regions (R3-1) may be formed spaced apart from each other based on one electrode.

[0148] The adhesive layer (170B) may be disposed on the lower surface of the second protective layer (160B) and within the groove (162B). For example, the adhesive layer (170B) may include a first portion that overlaps vertically with the second protective layer (160B) and a second portion that overlaps vertically with the groove (162B) of the second protective layer (160B).

[0149] Specifically, as illustrated in FIG. 7, a second circuit pattern layer (130) is disposed on the lower surface of the insulating layer (110). At this time, the second circuit pattern layer (130) includes at least one second electrode. The second electrode may refer to an electrode connected to the positive terminal of the chip, or alternatively, an electrode connected to the negative terminal of the chip. Preferably, the second electrode may function as a ground. Through this, it is preferable that the second electrode be connected to the negative terminal of the chip.

[0150] Meanwhile, in the third embodiment, the groove portion (162B) of the second protective layer (160B) may overlap vertically with the second electrode. In this case, the second protective layer (160B) in the third embodiment may have a plurality of mutually spaced groove portions (162B) formed in the area that overlaps vertically with one second electrode. For example, the groove portion (162B) of the second protective layer (160B) in the third embodiment may have a dot shape.

[0151] Meanwhile, as illustrated in FIG. 8, the adhesive layer (170B) is positioned below the second protective layer (160B). For example, the adhesive layer (170B) is positioned on the lower surface of the second protective layer (160B) and within a plurality of grooves (162B) of the second protective layer (160B).

[0152] Specifically, the adhesive layer (170B) may include a first portion (170B-1) disposed on the lower surface of the second protective layer (160B). The first portion (170B-1) of the adhesive layer (170B) may overlap vertically with the second protective layer (160B). For example, the first portion (170B-1) of the adhesive layer (170B) may overlap vertically with the third-2 region (R3-2).

[0153] Additionally, the adhesive layer (170B) may include a plurality of second portions (170B-2) that overlap vertically with the groove portion (162B) of the second protective layer (160B). The second portions (170B-2) of the adhesive layer (170B) may be placed within the groove portion (162B) of the second protective layer (160B). Accordingly, the second portions (170B-2) of the adhesive layer (170B) may come into contact with the lower surface (130B) of the second electrode that overlaps vertically with the groove portion (162B). At this time, the planar area of ​​the first portion (170A-1) of the adhesive layer (170B) may be larger than the planar area of ​​the second portion (170A-2). For example, in the adhesive layer (170B), the area of ​​the portion in contact with the second protective layer (160B) may be larger than the area of ​​the portion in contact with the second circuit pattern layer. Through this, the adhesive strength of the adhesive layer in the embodiment can be further improved.

[0154] Meanwhile, at least a portion of the second portion (170B-2) of the adhesive layer (170B) may be disposed within the groove (162B) of the second protective layer (160B), and the remaining portion may have a structure protruding downward from the lower surface of the second protective layer (160B).

[0155] Accordingly, the thicknesses of the first portion (170B-1) and the second portion (170B-2) of the adhesive layer (170B) may differ from each other. For example, the second portion (170B-2) of the adhesive layer (170B) in the second embodiment may be larger than the thickness of the first portion (170B-1). Preferably, the second portion (170B-2) of the adhesive layer (170B) may be larger than the thickness of the first portion (170B-1) by the number and depth of the grooves (162B) of the second protective layer (160B).

[0156] According to the third embodiment as described above, at least a portion of the adhesive layer (170B) is disposed within a plurality of dot-shaped grooves (162B) of the second protective layer (160B). By doing so, the contact area between the adhesive layer (170B) and the circuit board can be increased in the third embodiment. For example, in the third embodiment, the contact area can be increased by the thickness of the inner wall of the grooves (162B) of the second protective layer (160B) compared to the first and second embodiments.

[0157] Furthermore, in the third embodiment, the second portion (170B-2) of the adhesive layer (170B) has a structure in which it contacts the second electrode of the second circuit pattern layer (130). At this time, the adhesive layer (170B) is characterized by having a higher thermal conductivity than the second protective layer (160B). Through this, in the embodiment, as the second portion (170B-2) of the adhesive layer (170B) has a structure in which it directly contacts the second electrode of the second circuit pattern layer (130), the heat transferred through the second electrode can be released more efficiently through the heat dissipation unit (180), thereby further improving the heat dissipation characteristics.

[0159] Meanwhile, in the third embodiment, the bonding strength of the heat dissipation portion (180) can be further improved compared to the second embodiment. This can be determined by the shape of the groove portion (162B) of the second protective layer (160B). For example, the groove portion (162B) of the second protective layer (160B) is formed in multiple numbers in an area that overlaps vertically with one second electrode.

[0160] Specifically, the grooves (162B) of the second protective layer (160B) are formed in multiple numbers in an area that overlaps vertically with one second electrode.

[0161] Accordingly, in the third embodiment, the contact area between the adhesive layer (170B) and the second protective layer (160B) may be larger than the contact area between the adhesive layer and the second protective layer in the second embodiment.

[0162] For example, the planar area of ​​the second groove portion of the second protective layer in the second embodiment is larger than the planar area of ​​the second groove portion of the second protective layer in the third embodiment. Accordingly, the contact area between the second electrode and the adhesive layer in the second embodiment is larger than the contact area between the second electrode and the adhesive layer in the third embodiment. Additionally, the contact area between the second protective layer and the adhesive layer in the second embodiment is smaller than the contact area between the second protective layer and the adhesive layer in the third embodiment.

[0163] Accordingly, in the third embodiment, compared to the second embodiment, the bonding strength between the circuit board and the heat dissipation part (180) can be further improved by increasing the contact area between the adhesive layer (170B) and the second protective layer (160B).

[0164] For example, the adhesive layer (170B) has a first adhesive strength with the second protective layer (160B) and a second adhesive strength with the second electrode of the second circuit pattern layer (130). At this time, the first adhesive strength is greater than the second adhesive strength.

[0165] For example, the adhesive layer (170B) has greater adhesion when in contact with the second protective layer (160B) than when in contact with the second electrode of the second circuit pattern layer (130).

[0166] The first adhesive strength and second adhesive strength mentioned above are explained as shown in Table 1 below.

[0167] 170℃30kgF / cm 2 , 60min adhesive member Peel Strength Before reflow After reflow kgF / cm Second protective layer 1.1 1.12 Second electrode 0.93 0.8

[0168] That is, referring to Table 1, the adhesive layer (170B) and the second protective layer (160B) have a peel strength of 1.1 kgF / cm before reflow and a peel strength of 1.12 kgF / cm after reflow. In contrast, the adhesive layer (170B) and the second electrode of the second circuit pattern layer (130) have a peel strength of 0.93 kgF / cm and a peel strength of 0.8 kgF / cm after reflow. Accordingly, in the embodiment, the groove (162B) of the second protective layer (160B) is configured to partially open rather than completely open one second electrode, thereby allowing the adhesive layer (170B) to have more contact with the second protective layer (160B) than with the second electrode, thereby improving the bonding strength for the adhesive layer (170B).

[0170] The circuit board of the embodiment includes an adhesive layer disposed on the lower surface of a second protective layer and a heat dissipation portion attached to the circuit board through the adhesive layer. That is, the heat dissipation portion is attached before a chip is placed on the circuit board. At this time, the circuit board has a structure that is bent to fit the application product. Furthermore, the heat dissipation portion is attached to the circuit board before the circuit board is bent. Accordingly, in the embodiment, the attachment strength of the heat dissipation portion attached to the circuit board can be improved, and furthermore, the heat dissipation characteristics of the circuit board can be improved.

[0171] In addition, the heat dissipation portion includes a groove on its lower surface. The groove has a slope in which its width gradually decreases from the lower surface toward the upper surface. For example, in an embodiment, the heat dissipation portion including the groove is formed by etching a metal layer. By including the groove in the heat dissipation portion in this way, the bending of the heat dissipation portion together with the circuit board can be facilitated, thereby improving product reliability. Furthermore, in an embodiment, instead of using a conventional heat sink as is, the heat dissipation portion is formed by etching the metal layer to form a groove. Consequently, the position, width, depth, and spacing of the groove can be easily adjusted to match the shape of the product to which the circuit board is applied, thereby increasing product satisfaction and ensuring freedom in product design.

[0172] Meanwhile, the circuit board includes a second circuit pattern layer disposed on the lower surface of the insulating layer. Furthermore, the second protective layer includes a groove that overlaps vertically with the second circuit pattern layer, and the adhesive layer may be disposed within the groove of the second protective layer. Additionally, the heat dissipation portion may be connected to the second circuit pattern layer through the adhesive layer. Through this, in the embodiment, heat transferred to the second circuit pattern layer can be efficiently released to the outside, thereby further enhancing heat dissipation characteristics.

[0173] Meanwhile, the groove portion of the second protective layer in the embodiment may have a dot shape. For example, the second protective layer may include a plurality of mutually spaced groove portions that overlap perpendicularly with a second electrode of one of the second circuit pattern layers. Furthermore, the adhesive layer has a structure in which it is disposed within each of the dot-shaped groove portions of the second protective layer. In this case, the larger the width of the groove portion of the second protective layer, the larger the adhesion area between the adhesive layer and the heat dissipation portion, and the heat dissipation characteristics can be improved accordingly. However, the adhesive layer may have a higher adhesion strength with the second protective layer than with the second circuit pattern layer. For example, the adhesion strength between the adhesive layer and the second circuit pattern layer is lower than the adhesion strength between the adhesive layer and the second protective layer. Accordingly, in the embodiment, the adhesive layer is configured to partially contact the second protective layer and partially contact the second circuit pattern layer. Through this, in the embodiment, the adhesion strength between the circuit board of the heat dissipation portion and the adhesive layer can be further enhanced, and the heat dissipation characteristics can be further improved.

[0174] Furthermore, in the embodiment, the flatness of the circuit board can be further improved. For example, if the groove portion of the second protective layer has a full shape that completely opens the second electrode of the second circuit pattern layer, when the heat dissipation portion is attached, an issue of indentation occurs in the area where the groove portion of the second protective layer is formed, and a flatness problem may occur as a result. In contrast, in the embodiment, by making the groove portion of the second protective layer (160) have a dot or point shape rather than a full shape, the bending that occurs when the heat dissipation portion (180) is attached can be minimized, and the flatness of the circuit board can be increased accordingly.

[0175] In addition, in the embodiment, the heat dissipation member is used to improve the heat dissipation characteristics of the circuit board and can shield EMI noise transmitted downward through the second circuit pattern layer, thereby reducing the electrical resistance between the second circuit pattern layer and the heat dissipation member and further improving the overall electrical reliability of the circuit board.

[0177] Hereinafter, a lighting device including the circuit board of FIGS. 1 to 8 and a vehicle lamp including the same will be described.

[0179] FIG. 9 is a drawing showing a lighting device according to a first embodiment, and FIG. 10 is a drawing showing a lighting device according to a second embodiment.

[0180] Referring to FIG. 9, the lighting device includes a circuit board.

[0181] The circuit board may be illustrated in any one of FIGS. 1 to 8. Preferably, the circuit board may be the circuit board of the first embodiment illustrated in FIG. 1, the circuit board of the second embodiment illustrated in FIG. 3, or the circuit board of the third embodiment illustrated in FIG. 6.

[0182] The lighting device described above includes the circuit board, and can improve brightness and illuminance by removing the existing light guide plate and replacing it with a resin layer. The lighting device according to the present invention can be applied to various lamp devices requiring lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can be applied to headlights, vehicle interior lighting, door sills, taillights, etc. Additionally, the lighting device of the present invention can be applied to the field of backlight units for liquid crystal displays, and furthermore, it can be applied to all lighting-related fields that are currently developed and commercialized or that can be realized through future technological advancements.

[0183] Referring to FIG. 9, the lighting device may include a connection part (210) disposed on a first electrode of a first circuit pattern layer of a circuit board, a light-emitting part (220) mounted on the circuit board through the connection part (210), a reflective film (230) disposed on a first protective layer (150) of the circuit board, a resin layer (240) disposed on the circuit board covering the light-emitting part (220) and the reflective film (230), and an optical plate (250) disposed on the resin layer (240).

[0184] The above connection portion (210) may be for mounting a light-emitting portion (220) on the circuit pattern layer (120). For example, the above connection portion (210) may be a solder ball, but is not limited thereto.

[0185] The light-emitting unit (220) can emit a point light source, a line light source, or a surface light source. The point light source can emit light in a point shape from a light source or light-emitting element having an OLED or an LED. The line light source can be applied to various lamp devices requiring lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can be applied to headlights, vehicle interior lighting, door sills, rear lights, etc. Additionally, the lighting device of the present invention can be applied to the field of backlight units applied to liquid crystal display devices, and it can also be applied to all lighting-related fields that are currently developed and commercialized or that can be implemented according to future technological advancements.

[0186] A reflective film (230) is disposed on the circuit board. For example, the reflective film (230) may be selectively disposed on an area of ​​the upper part of the circuit board that does not overlap vertically with the light-emitting part (220). For example, the reflective film (230) may be formed on a second area (R2) of the circuit board.

[0187] The above-mentioned reflective film (230) may include a material with high reflection efficiency. The above-mentioned reflective film (230) can reduce light loss by reflecting light irradiated from the light-emitting part (220) to one side (e.g., the upper surface) of the resin layer (240) and preventing light from being exposed to the other side (e.g., the lower surface) of the resin layer (240). Such a reflective film (230) may also be referred to as a reflective sheet. The above-mentioned reflective film (230) may be formed by including a synthetic resin containing dispersed white pigment to implement characteristics that promote light reflection and dispersion.

[0188] For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, potassium carbonate, etc. may be used as white oxide pigments, and polyethyl terephthalate, polyethylene naphthalate, acrylic resin, polycarbonate, polystyrene, polyolefin, cellulose-based acetate, weather-resistant vinyl chloride, etc. may be used as synthetic resins, but are not limited thereto.

[0189] Meanwhile, although not shown in the drawing, a reflection pattern (not shown) may be formed on the reflection film (230). The reflection pattern is placed on the surface of the reflection film (230) and may serve to scatter and disperse incident light. For example, the reflection pattern may be formed by printing a reflection ink containing any one of TiO2, CaCO3, BaSO4, Al2O3, Silicon, and PS (Polystyrene) on the surface of the reflection film (230), but is not limited thereto.

[0190] In addition, the structure of the reflection pattern may be a plurality of protruding patterns and may be regular or irregular. To enhance the light scattering effect, the reflection pattern may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof, but is not limited thereto. For example, the cross-sectional shape of the reflection pattern may be formed in a structure having various shapes such as polygons like triangles and squares, semicircles, or sine waves, and the shape viewed from above the reflection pattern may be a polygon (e.g., a hexagon), a circle, an ellipse, or a semicircle.

[0191] A resin layer (240) is disposed on the circuit board. The resin layer (240) may be disposed to cover the light-emitting part (220) and the reflective film (230).

[0192] The above resin layer (240) may be composed of a high heat-resistant UV-curing resin containing an oligomer. In this case, the content of the oligomer may be 40 to 50 parts by weight. Additionally, the UV-curing resin may be urethane acrylate, but is not limited thereto; at least one material among epoxy acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylate, and silicon acrylate may be used. In particular, when urethane acrylate is used as the oligomer, different physical properties can be simultaneously achieved by mixing and using two types of urethane acrylate. For example, isocyanates are used in the process of synthesizing urethane acrylate, and the physical properties of urethane acrylate (such as yellowing resistance, weather resistance, and chemical resistance) are determined by the isocyanates.At this time, one type of urethane acrylate is implemented as a urethane acrylate type-isocyanate such that the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 37% (hereinafter referred to as the 'first oligomer'), and another type of urethane acrylate is implemented as a urethane acrylate type-isocyanate such that the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 30-50% or 25-35% (hereinafter referred to as the 'second oligomer') to form an oligomer according to the embodiment. According to this, the first oligomer and the second oligomer, each having different physical properties depending on the NCO% adjustment, can be obtained, and by mixing them, an oligomer forming a resin layer (40) can be formed. At this time, the weight ratio of the first oligomer in the oligomer can be implemented in the range of 15 to 20, and the weight ratio of the second oligomer can be implemented in the range of 25 to 35.

[0193] Meanwhile, the resin layer (240) may additionally comprise at least one of a monomer and a photoinitiator. In this case, the monomer content may be 65 to 90 parts by weight, and more specifically, it may be composed of a mixture comprising 35 to 45 parts by weight of IBOA (isobornyl acrylate), 10 to 15 parts by weight of 2-HEMA (2-hydroxyethyl methacrylate), and 15 to 20 parts by weight of 2-HBA (2-hydroxybutyl acrylate). In addition, the photoinitiator (e.g., 1-hydroxycyclohexyl phenyl-ketone, Diphenyl) and Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide, etc.) may be composed of 0.5 to 1 part by weight.

[0194] Additionally, the resin layer (240) may be made of a thermosetting resin having high heat resistance. Specifically, the resin layer (240) may be made of a thermosetting resin comprising at least one of a polyester polyol resin, an acrylic polyol resin, and a hydrocarbon-based and / or ester-based solvent. This thermosetting resin may further include a thermosetting agent to improve film strength. In the case of a polyester polyol resin, the content of the polyester polyol resin may be 9 to 30% of the total weight of the thermosetting resin. In the case of an acrylic polyol resin, the content of the acrylic polyol may be 20 to 40% of the total weight of the thermosetting resin. In the case of a hydrocarbon-based and / or ester-based solvent, the content of the hydrocarbon-based and / or ester-based solvent may be 30 to 70% of the total weight of the thermosetting resin. In the case of a thermosetting agent, the content of the thermosetting resin may be 1 to 10% of the total weight. When a resin layer (40) is formed with a material as described above, heat resistance is enhanced, so that even if it is used in a lighting device that emits high-temperature heat, the decrease in brightness due to heat can be minimized, thereby providing a highly reliable lighting device.

[0195] The resin layer (240) may include a diffusion material (241) having a hollow (or void) formed inside, and the diffusion material (241) may be in a form mixed or diffused with the resin forming the resin layer (240), and may serve to improve light reflection and diffusion characteristics.

[0196] For example, light emitted from the light-emitting part (220) into the interior of the resin layer (240) is reflected and transmitted by the hollow of the diffusing material (241), thereby diffusing and concentrating the light within the resin layer (240), and the diffusing and concentrating light can be emitted to one side (e.g., the upper surface) of the resin layer (240). At this time, the reflectance and diffusion rate of the light are increased by the diffusing material (41), thereby improving the amount and uniformity of the emitted light supplied to the upper surface of the resin layer (240), and thus improving the brightness of the lighting device.

[0197] The content of the above-mentioned diffusion material (241) can be appropriately adjusted to obtain a desired light diffusion effect. Specifically, it can be adjusted in the range of 0.01 to 0.3% relative to the total weight of the resin layer (240), but is not limited thereto. The diffusion material (241) may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al2O3, and acrylic, and the particle size of the diffusion material (41) may be 1㎛ to 20㎛, but is not limited thereto. Meanwhile, although not shown in the drawing, a light reflecting member (not shown) may be formed on the side of the resin layer (240), and thereby guides the light emitted from the light-emitting part (220) to be emitted to the upper region of the resin layer (240), thereby preventing the light from being emitted to the outside through the side of the resin layer (240). Such light-reflecting members may be composed of a material with excellent light reflectivity, such as white resist, and additionally may be composed of a synthetic resin containing dispersed white pigment or a synthetic resin containing dispersed metal particles with excellent light-reflecting properties. In this case, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc., may be used as the white pigment, and if metal powder is included, Ag powder with excellent reflectivity may be included. Furthermore, it is possible to additionally include a separate fluorescent whitening agent.

[0198] The lighting device may include an optical plate (250) disposed on the resin layer (240).

[0199] The optical plate (250) is capable of inducing and diffusing light irradiated from the light-emitting unit (220). To this end, the optical plate (250) may have a flat plate structure, or alternatively, a folded structure including a curved surface. The optical plate (250) may include optical beads inside. Such an optical plate (250) may generally be formed of acrylic resin, but is not limited thereto.

[0200] In addition, it may be made of materials capable of performing light diffusion functions, such as polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET), polycarbonate, and high-transparency plastics such as resin. The optical bead (B) may be formed from any one material selected from CaCO3, Ca3(SO4)2, BaSO4, TiO2, SiO2, and organic beads (methacrylate styrene). In this case, the optical bead may be included in an amount of 5% or less relative to the total weight of the resin constituting the optical plate, and it is possible to implement not only one type of optical bead but also a combination of two or more types of optical beads. The optical bead may be composed of a particle size of 50 μm or less.

[0201] Meanwhile, referring to FIG. 10, the optical plate (250) may be composed of a plurality of sheets.

[0202] For example, the optical plate (250) may include a first optical sheet (251), a second optical sheet (252), an adhesive sheet (253), and an optical pattern (260).

[0203] A first optical sheet (251) is placed on a resin layer (240), and a second optical sheet (252) is placed on the first optical sheet (251). The second optical sheet (252) may include a material with excellent light transmittance, and may include PET as an example, but is not limited thereto.

[0204] Additionally, an adhesive sheet (253) is placed between the first optical sheet (251) and the second optical sheet (252). The adhesive sheet (253) may be placed between the first optical sheet (251) and the second optical sheet (252) to attach the second optical sheet (252) to the first optical sheet (251).

[0205] The optical pattern (260) may be placed on either the upper surface of the first optical sheet (251) or the lower surface of the second optical sheet (252). The optical pattern (260) may be attached to at least one surface of the upper surface of the first optical sheet (251) or the lower surface of the second optical sheet (252) by means of an adhesive sheet (253). The optical pattern (260) may be a light-blocking pattern to prevent the concentration of light emitted from the light-emitting part (220). The optical pattern (260) may be superimposed perpendicularly with the light-emitting part (220).

[0207] FIG. 11 is a plan view of a vehicle having a vehicle lamp having a lighting device according to an embodiment, and FIG. 12 is a drawing showing a vehicle lamp having a lighting device or a lighting device disclosed in an embodiment.

[0208] Referring to FIGS. 11 and 12, the front lamp (850) of a moving body or vehicle (900) may include one or more lighting modules, and by individually controlling the driving timing of these lighting modules, it may provide not only the function of a normal headlight but also additional functions such as a welcome light or a celebration effect when the driver opens the vehicle door. The lamp may be applied as a daytime running light, high beam, low beam, fog light, or turn signal.

[0209] In a vehicle (900), the taillight (800) may be configured with a plurality of lamp units (810, 812, 814, 816) supported by a housing (801). For example, the lamp units (810, 812, 814, 816) may include a first lamp unit (810) configured on the outside, a second lamp unit (814) configured around the inner circumference of the first lamp unit (810), and third and fourth lamp units (814, 816) configured respectively on the inside of the second lamp unit (814). The first to fourth lamp units (810, 812, 814, 816) may optionally be equipped with the lighting device disclosed in the embodiment, and a red lens cover or a white lens cover may be configured on the outside of the lighting device to provide lighting characteristics for the lamp units (810, 812, 814, 816). The lighting device disclosed in the embodiment applied to the above lamp units (810, 812, 814, 816) can emit surface light with a uniform distribution.

[0210] The first and second lamp units (810, 812) may be provided with at least one of a curved shape, a straight shape, an angular shape, an inclined shape, or a planar shape, or a structure mixed thereof. The first and second lamp units (810, 812) may be arranged in one or multiple units in each tail light. The first lamp unit (810) may be provided as a tail light, the second lamp unit (812) may be provided as a brake light, the third lamp unit (814) may be provided as a reverse light, and the fourth lamp unit (816) may be provided as a turn signal lamp.

[0211] The circuit board of the embodiment includes an adhesive layer disposed on the lower surface of a second protective layer and a heat dissipation portion attached to the circuit board through the adhesive layer. That is, the heat dissipation portion is attached before a chip is placed on the circuit board. At this time, the circuit board has a structure that is bent to fit the application product. Furthermore, the heat dissipation portion is attached to the circuit board before the circuit board is bent. Accordingly, in the embodiment, the attachment strength of the heat dissipation portion attached to the circuit board can be improved, and furthermore, the heat dissipation characteristics of the circuit board can be improved.

[0212] In addition, the heat dissipation portion includes a groove on its lower surface. The groove has a slope in which its width gradually decreases from the lower surface toward the upper surface. For example, in an embodiment, the heat dissipation portion including the groove is formed by etching a metal layer. By including the groove in the heat dissipation portion in this way, the bending of the heat dissipation portion together with the circuit board can be facilitated, thereby improving product reliability. Furthermore, in an embodiment, instead of using a conventional heat sink as is, the heat dissipation portion is formed by etching the metal layer to form a groove. Consequently, the position, width, depth, and spacing of the groove can be easily adjusted to match the shape of the product to which the circuit board is applied, thereby increasing product satisfaction and ensuring freedom in product design.

[0213] Meanwhile, the circuit board includes a second circuit pattern layer disposed on the lower surface of the insulating layer. Furthermore, the second protective layer includes a groove that overlaps vertically with the second circuit pattern layer, and the adhesive layer may be disposed within the groove of the second protective layer. Additionally, the heat dissipation portion may be connected to the second circuit pattern layer through the adhesive layer. Through this, in the embodiment, heat transferred to the second circuit pattern layer can be efficiently released to the outside, thereby further enhancing heat dissipation characteristics.

[0214] Meanwhile, the groove portion of the second protective layer in the embodiment may have a dot shape. For example, the second protective layer may include a plurality of mutually spaced groove portions that overlap perpendicularly with a second electrode of one of the second circuit pattern layers. Furthermore, the adhesive layer has a structure in which it is disposed within each of the dot-shaped groove portions of the second protective layer. In this case, the larger the width of the groove portion of the second protective layer, the larger the adhesion area between the adhesive layer and the heat dissipation portion, and the heat dissipation characteristics can be improved accordingly. However, the adhesive layer may have a higher adhesion strength with the second protective layer than with the second circuit pattern layer. For example, the adhesion strength between the adhesive layer and the second circuit pattern layer is lower than the adhesion strength between the adhesive layer and the second protective layer. Accordingly, in the embodiment, the adhesive layer is configured to partially contact the second protective layer and partially contact the second circuit pattern layer. Through this, in the embodiment, the adhesion strength between the circuit board of the heat dissipation portion and the adhesive layer can be further enhanced, and the heat dissipation characteristics can be further improved.

[0215] Furthermore, in the embodiment, the flatness of the circuit board can be further improved. For example, if the groove portion of the second protective layer has a full shape that completely opens the second electrode of the second circuit pattern layer, when the heat dissipation portion is attached, an issue of indentation occurs in the area where the groove portion of the second protective layer is formed, and a flatness problem may occur as a result. In contrast, in the embodiment, by making the groove portion of the second protective layer (160) have a dot or point shape rather than a full shape, the bending that occurs when the heat dissipation portion (180) is attached can be minimized, and the flatness of the circuit board can be increased accordingly.

[0216] In addition, in the embodiment, the heat dissipation member is used to improve the heat dissipation characteristics of the circuit board and can shield EMI noise transmitted downward through the second circuit pattern layer, thereby reducing the electrical resistance between the second circuit pattern layer and the heat dissipation member and further improving the overall electrical reliability of the circuit board.

[0217] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0218] Furthermore, although the invention has been described above with reference to embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be modified and implemented. Differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

Claim 1 Insulating layer; a first circuit pattern layer disposed on the upper surface of the insulating layer; a first protective layer disposed on the upper surface of the insulating layer and including a first groove portion that overlaps perpendicularly with a first electrode of the first circuit pattern layer; a second circuit pattern layer disposed on the lower surface of the insulating layer; a second protective layer disposed on the lower surface of the insulating layer and including a second groove portion that overlaps perpendicularly with a second electrode of the second circuit pattern layer; and an adhesive layer disposed on the lower surface of the second protective layer. A circuit board comprising a heat dissipation portion attached to the adhesive layer, wherein the heat dissipation portion comprises a metal layer having a third groove portion having a slope in which the width gradually decreases as it moves from the lower surface toward the upper surface, the second circuit pattern layer comprises a third electrode, the second protective layer comprises a plurality of fourth groove portions having a dot shape that overlaps perpendicularly with one third electrode and exposes the lower surface of the one third electrode at different positions and is spaced apart from each other, and the adhesive layer comprises a first portion that overlaps perpendicularly with the second protective layer and is in direct contact with the lower surface of the second protective layer, and a plurality of second portions that overlap perpendicularly with the plurality of fourth groove portions of the second protective layer and are in direct contact with the lower surface of the one third electrode at different positions. Claim 2 In claim 1, the circuit board, wherein the third groove portion is formed in plurality on the lower surface of the metal layer of the heat dissipation portion, spaced apart in at least one of the longitudinal direction and the width direction. Claim 3 A circuit board according to paragraph 2, wherein the spacing between the plurality of third grooves is 2.0 mm or more. Claim 4 A circuit board according to paragraph 2, wherein the width of the third groove satisfies the range of 50㎛ to 400㎛. Claim 5 A circuit board according to any one of claims 1 to 4, wherein the thickness of the metal layer of the heat dissipation part satisfies the range of 1 mm to 5 mm. Claim 6 A circuit board according to any one of claims 1 to 4, wherein the depth of the third groove satisfies a range of 50% to 90% of the thickness of the metal layer of the heat dissipation portion. Claim 7 A circuit board according to any one of claims 1 to 4, wherein the metal layer of the heat dissipation portion includes an open portion that overlaps vertically with the second groove portion of the second protective layer. Claim 8 delete Claim 9 A circuit board according to claim 1, wherein the thickness of the first portion of the adhesive layer is smaller than the thickness of the second portion of the adhesive layer. Claim 10 In claim 9, the planar area of ​​the first portion of the adhesive layer is larger than the planar area of ​​the second portion of the adhesive layer, the circuit board. Claim 11 delete Claim 12 A lighting device comprising: a circuit board described in claim 1; a reflective film disposed on the upper surface of a first protective layer of the circuit board; a light-emitting part mounted on the first electrode of the circuit board; a resin layer disposed on the circuit board and covering the light-emitting part and the reflective film; and an optical plate disposed on the resin layer. Claim 13 A vehicle lamp comprising at least one of a taillight, a turn signal, a reverse light, a brake light, and a daytime running light, wherein the lamp has a lighting device according to claim 12.

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