Substrate processing apparatus

Abstract

(Problem) In a substrate processing apparatus that floats a substrate and conveys the substrate in a predetermined conveying direction while supplying a processing liquid, such as a resist liquid, to the upper surface of the substrate, the apparatus responds quickly and at low cost to changes in the substrate size in the conveying direction. (Solution) In the present invention, the upstream floating stage is arranged with a first floating plate group and a second floating plate group in the conveying direction. Among them, the second floating plate group is configured to be freely detachable from the first floating plate group. For example, if the second floating plate group is formed adjacent to the first floating plate group, a relatively long substrate in the conveying direction can be processed as a substrate to be processed. On the other hand, if the second floating plate group is separated from the first floating plate group, a relatively short substrate in the conveying direction can be processed as a substrate to be processed.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus that supplies a processing liquid, such as a resist liquid, to the upper surface of a substrate while levitating and transporting the substrate. The substrate includes, for example, a glass substrate for a liquid crystal display device, a substrate for an organic EL, a substrate for a semiconductor package such as a FOWLP (fan out wafer level package) substrate, a semiconductor substrate, a glass substrate for a photomask, a substrate for a color filter, a substrate for a recording disk, a substrate for a solar cell, a substrate for electronic paper, a substrate for a precision electronic device, a rectangular glass substrate, and a flexible substrate for a film liquid crystal. Background Technology

[0002] In manufacturing processes for liquid crystal display devices, etc., a coating device is used to supply a processing liquid, such as a resist liquid, to the surface of a substrate and to apply the processing liquid to the substrate. For example, Japanese Patent Publication No. 2024-30264 discloses a substrate processing device that uniformly applies a processing liquid to the upper surface of a substrate by supplying a processing liquid, such as a resist liquid, in a strip shape from a slit nozzle while conveying the substrate in a floating state. The problem to be solved

[0003] In the substrate processing apparatus described in Japanese Patent Publication No. 2024-30264, the levitation stage section for levitating and transporting a substrate is divided into three stages. More specifically, the levitation stage section has a coating stage formed in a position opposite to a slit nozzle, an upstream levitation stage positioned upstream of the coating stage in the direction of substrate transport, and a downstream levitation stage positioned downstream of the coating stage in the direction of transport. Among these stages, the upstream levitation stage, in particular, was designed for each substrate size in the transport direction. Due to such specialized design, the number of design labors increases, and manufacturing costs also increase.

[0004] The present invention has been made in consideration of the above problem, and aims to provide a substrate processing apparatus that supplies a processing liquid, such as a resist liquid, to the upper surface of said substrate while floating the substrate and conveying the substrate in a predetermined conveying direction, and to respond quickly and at low cost to changes in the substrate size in the conveying direction. means of solving the problem

[0005] The present invention relates to a substrate processing apparatus that supplies a processing liquid from a nozzle to the upper surface of a substrate while conveying the substrate floating on a buoyancy stage portion in a predetermined conveying direction, wherein the buoyancy stage portion comprises a coating stage formed at a position opposite to the nozzle, an upstream buoyancy stage disposed upstream of the coating stage in the conveying direction, and a downstream buoyancy stage disposed downstream of the coating stage in the conveying direction, and the upstream buoyancy stage comprises a first buoyancy plate group disposed adjacent to the upstream side of the coating stage in the conveying direction, wherein at least one first buoyancy plate for floating a substrate is arranged in the conveying direction, and a second buoyancy plate group formed to be freely detachable adjacent to the upstream side of the first buoyancy plate group in the conveying direction, wherein at least one second buoyancy plate for floating a substrate is arranged in the conveying direction, and a first substrate conveying process in which the second buoyancy plate group is separated from the upstream buoyancy stage and the substrate is conveyed to the coating stage using only the first buoyancy plate group, and the It is characterized by being able to switch the second substrate transport to the coating stage by placing the second floating plate group adjacent to the first floating plate group and transporting the substrate to the second floating plate group and the first floating plate group.

[0006] In the invention configured as described above, the upstream floating stage is arranged with a first floating plate group and a second floating plate group in the conveying direction. Among them, the second floating plate group is configured to be freely detachable from the first floating plate group. For example, if the second floating plate group is formed adjacent to the first floating plate group, a relatively long substrate in the conveying direction can be processed as a substrate to be processed. On the other hand, if the second floating plate group is separated from the first floating plate group, a relatively short substrate in the conveying direction can be processed as a substrate to be processed. Effects of the invention

[0007] As described above, according to the present invention, in a substrate processing apparatus that supplies a processing liquid, such as a resist liquid, to the upper surface of a substrate while floating the substrate and conveying the substrate in a predetermined conveying direction, it is possible to respond quickly and at low cost to changes in the substrate size in the conveying direction. Brief explanation of the drawing

[0008] FIG. 1 is a schematic diagram showing the overall configuration of one embodiment of a substrate processing device related to the present invention. Figure 2 is a drawing showing a floating stage section suitable for a large-size substrate. Figure 3 is a drawing showing a floating stage suitable for a small-sized substrate. FIG. 4 is a side view showing a floating stage portion suitable for a full-size substrate in a second embodiment of a substrate processing apparatus related to the present invention. FIG. 5 is a side view showing a floating stage portion suitable for a half-size substrate in a second embodiment of a substrate processing apparatus related to the present invention. FIG. 6 is a plan view schematically showing the configuration of the first floating plate group and the second floating plate group for each substrate size in the third embodiment of the substrate processing apparatus related to the present invention. FIG. 7 is a side view showing a floating stage portion suitable for a full-size substrate in a fourth embodiment of a substrate processing apparatus related to the present invention. Specific details for implementing the invention

[0009] FIG. 1 is a schematic diagram showing the overall configuration of an embodiment of a substrate processing device related to the present invention. This substrate processing device (1) is a slit coater that applies a processing liquid to the upper surface of a substrate (S) that is transported in a horizontal position from the left side to the right side of FIG. 1. In addition, in order to clarify the arrangement relationship of each part of the device in each of the following drawings, the transport direction of the substrate (S) is designated as the "X direction," the horizontal direction from the left side to the right side of FIG. 1 is referred to as the "+X direction," and the opposite direction is referred to as the "-X direction." Furthermore, among the horizontal direction Y that is orthogonal to the X direction, the front side of the device is referred to as the "-Y direction," and the rear side of the device is referred to as the "+Y direction." Additionally, the upward and downward directions in the vertical direction Z are referred to as the "+Z direction" and the "-Z direction," respectively.

[0010] First, an overview of the configuration and operation of the substrate processing device (1) is described using FIG. 1. In addition, the basic configuration and operating principle of the substrate processing device (1) are common to those described in Japanese Patent Publication No. 2024-30264. Therefore, in this specification, detailed descriptions may be omitted for each configuration of the substrate processing device (1) that can be applied identically to that described in the said known document, and for which the structure can be easily understood from the description.

[0011] In the substrate processing device (1), an input conveyor (100), an input transfer and placement section (2), a floating stage section (3), an output transfer and placement section (4), and an output conveyor (110) are arranged in close proximity in this order along the conveying direction (Dt) (+X direction) of the substrate (S), and as described in detail below, a conveying path of the substrate (S) extending in an approximately horizontal direction is formed by these. Also, in the following description, when indicating positional relationships in relation to the conveying direction (Dt) of the substrate (S), the "upstream side in the conveying direction (Dt) of the substrate (S)" may be simply abbreviated as "upstream side," and the "downstream side in the conveying direction (Dt) of the substrate (S)" may be simply abbreviated as "downstream side." In this example, when viewed from a reference position, the (-X) side corresponds to the "upstream side" and the (+X) side corresponds to the "downstream side."

[0012] A substrate (S) to be processed is brought into the input conveyor (100) from the left side of FIG. 1. The input conveyor (100) is equipped with a roller conveyor (101) and a rotary drive mechanism (102) that rotates it, and as the roller conveyor (101) rotates, the substrate (S) is conveyed in a horizontal position downstream, that is, in the (+X) direction. The input transfer and placement unit (2) is equipped with a roller conveyor (21) and a rotary / lift drive mechanism (22) that has the function of rotating it and the function of lifting it. As the roller conveyor (21) rotates, the substrate (S) is additionally conveyed in the (+X) direction. In addition, as the roller conveyor (21) is lifted, the vertical position of the substrate (S) is changed. By the input transfer and placement unit (2) configured in this way, the substrate (S) is transferred and placed from the input conveyor (100) to the floating stage unit (3).

[0013] The levitation stage section (3) is provided with a flat stage divided into three sections along the substrate transport direction (Dt). That is, the levitation stage section (3) is provided with an upstream levitation stage (31), a coating stage (32), and a downstream levitation stage (33), and the upper surfaces of each of these stages form a part of the same plane. On the upper surfaces of each of the upstream levitation stage (31) and the downstream levitation stage (33), a plurality of ejection holes are formed in a matrix shape to eject compressed air supplied from a levitation control mechanism (35), and the substrate (S) is pushed up by the ejected airflow and levitized. In this way, the lower surface of the substrate (S) is supported in a horizontal position while separated from the upper surface of the stage. The distance between the lower surface of the substrate (S) and the upper surface of the stage, in other words, the amount of levitation, can be, for example, 10 micrometers to 500 micrometers.

[0014] Meanwhile, on the upper surface of the coating stage (32), an ejection hole for ejecting compressed air and a suction hole for sucking air between the lower surface of the substrate (S) and the upper surface of the stage are alternately arranged. By controlling the amount of compressed air ejected from the ejection hole and the amount of air sucked from the suction hole by the levitation control mechanism (35), the distance between the lower surface of the substrate (S) and the upper surface of the coating stage (32) is precisely controlled. Accordingly, the vertical position of the upper surface of the substrate (S) passing over the coating stage (32) is controlled to a specified value. As for the specific configuration of the levitation stage part (3), for example, that described in Japanese Patent Publication No. 5346643 may be applied. However, in this embodiment, in order to accommodate substrates (S) of different sizes in the conveying direction (Dt), the upstream levitation stage (31) has a configuration different from that of Japanese Patent Publication No. 2024-30264. This point will be described in detail later.

[0015] Additionally, in the upstream floating stage (31), a lift pin is formed and arranged, which is not shown in the drawing, and in the floating stage part (3), a lift pin driving mechanism (34) for raising and lowering this lift pin is formed.

[0016] A substrate (S) introduced to the floating stage section (3) through the input transfer section (2) is propelled in the (+X) direction by the rotation of the roller conveyor (21) and is conveyed onto the upstream floating stage (31). The upstream floating stage (31), the coating stage (32), and the downstream floating stage (33) support the substrate (S) in a floating state, but do not have the function of moving the substrate (S) in a horizontal direction. The conveyance of the substrate (S) in the floating stage section (3) is carried out by a substrate conveying section (5) positioned below the upstream floating stage (31), the coating stage (32), and the downstream floating stage (33).

[0017] The substrate transport unit (5) is equipped with a chuck mechanism (51) that supports the substrate (S) from below by partially contacting the periphery edge portion of the lower surface of the substrate (S), and an adsorption / driving control mechanism (52) that has the function of adsorbing and maintaining the substrate (S) by applying negative pressure to an adsorption pad (513) formed on a holding member (512) of the chuck mechanism (51) and the function of reciprocating the chuck mechanism (51) in the X direction. When the chuck mechanism (51) maintains the substrate (S), the lower surface of the substrate (S) is located at a position higher than the upper surface of each stage of the floating stage unit (3). Therefore, the substrate (S) maintains an overall horizontal posture by the buoyancy applied from the floating stage unit (3) while the periphery edge portion is adsorbed and maintained by the chuck mechanism (51).

[0018] A chuck mechanism (51) holds a substrate (S) brought from the input transfer storage unit (2) to the floating stage unit (3), and in this state, the chuck mechanism (51) moves in the (+X) direction. Accordingly, the substrate (S) is conveyed from above the upstream floating stage (31) to above the downstream floating stage (33) via above the coating stage (32). The conveyed substrate (S) is delivered to the output transfer storage unit (4) located on the (+X) side of the downstream floating stage (33). That is, the substrate (S) conveyed from above the upstream floating stage (31) to above the coating stage (32) corresponds to an example of an unprocessed substrate, and the substrate (S) conveyed from above the coating stage (32) to above the downstream floating stage (33) corresponds to an example of a processed substrate.

[0019] For each stage of the floating stage section (3), the downstream floating stage (33) is capable of being raised and lowered between a lower position where its upper surface position is lower than the upper surface position of the chuck mechanism (51) and an upper position where its upper surface position is higher than the upper surface position of the chuck mechanism (51). For this purpose, the downstream floating stage (33) is supported by a lifting drive mechanism (36). The lifting drive mechanism (36) raises and lowers the downstream floating stage (33) according to a control command from the control unit (9) and positions it at a predetermined height according to the progress of the processing.

[0020] The output transfer and placement unit (4) is equipped with a roller conveyor (41) and a rotation and lifting drive mechanism (42) having the function of rotating and lowering it. As the roller conveyor (41) rotates, a propulsive force in the (+X) direction is applied to the substrate (S), and the substrate (S) is further transported along the transport direction (Dt). Additionally, as the roller conveyor (41) is raised and lowered, the vertical position of the substrate (S) is changed. By the output transfer and placement unit (4), the substrate (S) is transferred and placed on the output conveyor (110) from above the downstream floating stage (33).

[0021] The output conveyor (110) is equipped with a roller conveyor (111) and a rotary drive mechanism (112) that rotates it, and as the roller conveyor (111) rotates, the substrate (S) is additionally conveyed in the (+X) direction and finally discharged out of the substrate processing device (1). Also, the input conveyor (100) and the output conveyor (110) may be formed as part of the configuration of the substrate processing device (1), but may also be separate from the substrate processing device (1). Also, for example, a substrate discharge mechanism of another unit formed on the upstream side of the substrate processing device (1) may be used as the input conveyor (100). Also, a substrate receiving mechanism of another unit formed on the downstream side of the substrate processing device (1) may be used as the output conveyor (110).

[0022] In this way, an application unit (7) for applying a processing liquid to the upper surface of the substrate (S) is disposed on the return path of the substrate (S) being returned. The application unit (7) has a nozzle (71) which is a slit nozzle. A processing liquid is supplied to the nozzle (71) from a processing liquid supply unit not shown, and the processing liquid is discharged from a discharge port that opens downward at the bottom of the nozzle.

[0023] The nozzle (71) is positioned to move in the X and Z directions by the positioning mechanism (79) of the coating unit (7). By the positioning mechanism (79), the nozzle (71) is positioned at a coating position (a position indicated by a dotted line) above the coating stage (32). A processing liquid is discharged from the nozzle (71) positioned at the coating position and applied to a substrate (S) that is being transported between the coating stage (32) and the nozzle. In this way, the application of the processing liquid to the substrate (S) is achieved.

[0024] Above the return path of the substrate (S), a maintenance unit (8) for performing maintenance on the nozzle (71) is formed. The maintenance unit (8) is equipped with a cleaning liquid reservoir (82) formed within the bat (80), a nozzle cleaner (81), and a maintenance control mechanism (89) for controlling the operation of the cleaning liquid reservoir (82) and the nozzle cleaner (81).

[0025] When the nozzle (71) is in the position above the nozzle cleaner (81) indicated by the solid line (cleaning position), the processing liquid attached around the discharge port of the nozzle (71) is removed by the nozzle cleaner (81). By performing a cleaning process on the nozzle (71) before moving it to the application position in this way, the discharge of the processing liquid at the application position can be stabilized from the initial stage.

[0026] Additionally, the positioning mechanism (79) can position the nozzle (71) at a position (waiting position) where the lower end of the nozzle comes into contact with the cleaning liquid stored in the cleaning liquid reservoir (82). When the coating process using the nozzle (71) is not performed, the nozzle (71) is positioned at this waiting position. Additionally, the configuration may be such that the lower end of the nozzle is cleaned by applying ultrasonic waves to the cleaning liquid.

[0027] In addition, the substrate processing device (1) has a control unit (9) formed therein for controlling the operation of each part of the device. The control unit (9) is equipped with a storage means for storing a predetermined control program or various data, a computation means such as a CPU that executes a predetermined operation in each part of the device by executing the control program, and an interface means responsible for exchanging information with a user or an external device.

[0028] Next, the configuration of the levitation stage section (3) will be explained with reference to FIGS. 2 and FIG. 3. FIG. 2 is a drawing showing a levitation stage section suitable for a large-size substrate. FIG. 3 is a drawing showing a levitation stage section suitable for a small-size substrate. Here, "small-size substrate" refers to a substrate having a first length (Lh) in the conveying direction (Dt), and "large-size substrate" refers to a substrate having the same width (W) as the small-size substrate, while having a second length (Lf) that is longer than the first length (Lh) in the conveying direction (Dt). A top view of the levitation stage section (3) is shown at the top of FIGS. 2 and FIG. 3, and a side view of the levitation stage section (3) is shown at the bottom. As can be seen from these drawings, in this embodiment, the substrate (Sh) is half the size of the substrate (Sf) in the conveying direction (Dt). Therefore, in order to distinguish between large-size substrates and small-size substrates, they are sometimes referred to as "full-size substrate (Sf)" and "half-size substrate (Sh)," respectively. On the other hand, when the two are not distinguished, they are referred to as "substrate (S)."

[0029] In this embodiment, since it is suitable for both a full-size substrate (Sf) and a half-size substrate (Sh), the upstream floating stage (31) has a different configuration from the upstream floating stage described in Japanese Patent Publication No. 2024-30264. More specifically, as shown in FIGS. 2 and 3, the upstream floating stage (31) has a first floating plate group (311) arranged adjacent to the upstream side of the coating stage (32) in the conveying direction (Dt), and a second floating plate group (312) formed to be freely detachable adjacent to the upstream side of the first floating plate group (311) in the conveying direction (Dt). The first floating plate group (311) is formed in a substantially gapless contact state with the coating stage (32) (in FIG. 2 and FIG. 3, a slight gap is formed for the convenience of illustration to distinguish between the two). The step difference between the upper surface of the first floating plate group (311) and the upper surface of the coating stage (32) is less than tens of μm. Also, as shown in FIG. 2, when the second floating plate group (312) is placed adjacent to the first floating plate group (311), the two are formed in a substantially gapless contact state (in FIG. 2, a slight gap is formed for the convenience of illustration to distinguish between the two). Accordingly, the application of the processing liquid at the coating stage (32) is performed with high precision, and the untreated substrate (S) before the application of the processing liquid is smoothly conveyed from the upstream floating stage (31) to the coating stage (32).

[0030] Likewise, both the coating stage (32) and the downstream floating stage (33) are formed in a contact state with substantially no gap, and the step difference between the two is less than tens of μm. Accordingly, the coating of the treatment liquid at the coating stage (32) is performed with high precision, and the substrate coated with the treatment liquid (equivalent to the “processed substrate” of the present invention) is smoothly conveyed from the coating stage (32) to the downstream floating stage (33).

[0031] In this embodiment, the first floating plate group (311) is composed of one first floating plate (313), and the second floating plate group (312) is composed of one second floating plate (314), and both the first floating plate (313) and the second floating plate (314) have a flat size suitable for floating a half-size substrate (Sh), namely (first length (Lh) × width (W)). When performing a coating process on a full-size substrate (Sf), the upstream floating stage (31) has the first floating plate (313) and the second floating plate (314) arranged in the conveying direction (Dt), as shown in FIG. 2, and the full-size substrate (Sf) is floated. Meanwhile, when performing a coating process on a half-size substrate (Sh), as shown in FIG. 3, the second floating plate (314) is separated, and the upstream floating stage (31) floats the half-size substrate (Sh) using only the first floating plate (313).

[0032] Additionally, the buoyancy stage section (3) has the following configuration to position the upstream buoyancy stage (31), the coating stage (32), and the downstream buoyancy stage (33) with the precision described above. When the coating process is performed on a full-size substrate (Sf), three supports (371 to 373) are used in the buoyancy stage section (3), as shown in FIG. 2. On the other hand, when the coating process is performed on a half-size substrate (Sh), the support (371) is separated together with the second buoyancy plate (314) and the frame section (381), as shown in FIG. 3, and only supports (372 to 373) are used. Also, in this embodiment, the total conveying direction length of the entire buoyancy plate constituting the upstream buoyancy stage (31) matches the full-size substrate (Sf) or the half-size substrate (Sh), but may be inconsistent in relation to the adjacent roller conveyor (21). For example, the total conveying direction length, including the downstream roller among the multiple rollers constituting the roller conveyor (21) and the entire floating plate constituting the upstream floating stage (31), may be configured to match the full-size substrate (Sf) or the half-size substrate (Sh). The same applies to the embodiments described later.

[0033] A frame portion (381) is formed on the upper surface of the support member (371). On the upper surface of this frame portion (381), a plurality of adjustment bolts (39) are formed upright, and their upper ends support the second floating plate (314) (second floating plate group (312)) from below. Then, by rotating the threaded portion of each adjustment bolt (39), the height or horizontality of the second floating plate (314) in the vertical direction Z can be adjusted. This adjustment by the adjustment bolts (39) is also the same for the frame portion to be described later.

[0034] The support member (372) supports the first floating plate (313) (first floating plate group (311)) through the frame part (382), supports the coating stage (32) through the precision stone (383), and supports a part of the downstream floating stage (33) through the frame part (384).

[0035] More specifically, as shown in FIGS. 2 and 3, a precision stone (383) is formed in the coating support area (RC) on the upper surface of the support (372), and a coating stage (32) is mounted on the upper surface of the precision stone (383). The precision stone (383) is a precision-processed rectangular stone. The precision stone (383) is formed, for example, from granite. The size of the precision stone (383) is such that, for example, when a glass substrate of 2160 mm × 2460 mm (G8) is used as a full-size substrate (Sf), the width (length in the Y direction) is 2000 mm, the length (length in the X direction) is 500 mm, and the height (length in the Z direction) is 300 mm. Additionally, the width of the precision stone (383) can be set to an appropriate value according to the size of the substrate (S) to be processed. Each face of the rectangular body of the precision stone (383) is finished by high-precision surface finishing. In particular, the flatness of the upper surface of the precision stone (383) is 3 μm or more and 10 μm or less (5 μm in this embodiment).

[0036] A frame portion (382) is formed in an upstream support area (RU) on the upper surface of the support member (372) that is upstream of the coating support area (RC), and a first floating plate (313) is supported by a plurality of adjustment bolts (39) formed by being erected from the upper surface of the frame portion (382). Additionally, a frame portion (384) is formed in a downstream support area (RD) on the upper surface of the support member (372) that is downstream of the coating support area (RC), and an upstream end of a downstream floating stage (33) is supported by a plurality of adjustment bolts (39) formed by being erected from the upper surface of the frame portion (384).

[0037] On the upper surface of the support (373), a frame section (385, 386) is formed. On the upper surface of these frame sections (384, 385), a plurality of adjustment bolts (39) are formed and erected, and their upper ends support the central part and the downstream end of the downstream floating stage (33).

[0038] The floating stage section (3) configured in this manner is divided into a first block (B1) composed of a support (371), a frame section (381), and a second floating plate (314) (second floating plate group (312)), and a second block (B2) excluding the first block (B1). And, as shown in FIG. 2, by combining the first block (B1) with the second block (B2), the floating stage section (3) can apply a processing liquid to a full-size substrate (Sf). Meanwhile, as shown in FIG. 3, the floating stage section (3) composed only of the second block (B2) can apply a processing liquid to a half-size substrate (Sh). Accordingly, the substrate processing device (1) equipped with the floating stage section (3) has versatility that can be applied to either a full-size substrate (Sf) or a half-size substrate (Sh). As a result, it is possible to respond quickly and at low cost to changes in substrate size in the return direction (Dt).

[0039] In addition, the design work can be reduced by standardizing the first buoyancy plate (313) and the second buoyancy plate (314), and the device cost can also be reduced.

[0040] In addition, in the above embodiment, the upstream floating stage (31) is composed of a first floating plate group (311) and a second floating plate group (312) that are divided from each other in the conveying direction (Dt). In a conventional device, the upstream floating stage (31) is composed of a single floating plate. Therefore, in order to accommodate, for example, a glass substrate of 2160 mm × 2460 mm (G8), it is necessary to prepare a stage material having a flat size corresponding to the floating plate, and there was a situation where it was difficult to obtain the material. In contrast, in the first embodiment, since the upstream floating stage (31) is divided into two parts, the first floating plate group (311) and the second floating plate group (312), the availability of the stage material can be improved. From this perspective, the downstream floating stage (33) may also be divided into two parts in the same way as the upstream floating stage (31).

[0041] In addition, in the above embodiment, a frame portion (382) is formed adjacent to the coating stage (32) on a support (372) corresponding to an example of the “coating support” of the present invention. Thus, the following functional effects are obtained. Since the coating process is performed on the coating stage (32), it is necessary to maintain the step difference between the upper surface of the first floating plate group (311) and the upper surface of the coating stage (32) at a level of several tens of μm or less, as described above. To satisfy this, it is preferable that the first floating plate group (311) and the coating stage (32) be supported by the same support (372) rather than being supported by different supports. In this embodiment, the frame portion (382) corresponds to an example of the “first frame portion” of the present invention.

[0042] However, in the first embodiment above, the first floating plate group (311) and the second floating plate group (312) are each composed of a single first floating plate (313) and a single second floating plate (314), but the number of constituent plates is not limited to "1" and is arbitrary. For example, as shown in FIGS. 4 and 5, the number of constituent plates of the first floating plate group (311) may be set to "2" (second embodiment).

[0043] FIG. 4 is a side view showing a levitation stage section suitable for a full-size substrate in a second embodiment of a substrate processing apparatus related to the present invention. FIG. 5 is a side view showing a levitation stage section suitable for a half-size substrate in a second embodiment of a substrate processing apparatus related to the present invention. In the second embodiment, the first levitation plate (315) constituting the first levitation plate group (311) has a planar size suitable for levitating a quarter-size substrate (Sq), and the first levitation plate group (311) is formed by arranging two first levitation plates (315) in the conveying direction (Dt). Here, "quarter-size substrate (Sq)" refers to a substrate having a planar size of (length (Lq) × width (W)) when the length (Lq) is half the length of a half-size substrate (Sh) in the conveying direction (Dt), as shown in column (c) of FIG. 6, which will be explained later. In summary, when a coating process is performed on a full-size substrate (Sf), the upstream buoyancy stage (31) aligns two first buoyancy plates (315) and a second buoyancy plate (314) in the return direction (Dt), as shown in FIG. 4, and floats the full-size substrate (Sf). Meanwhile, when a coating process is performed on a half-size substrate (Sh), as shown in FIG. 5, the second buoyancy plate (314) is separated, and the upstream buoyancy stage (31) floats the half-size substrate (Sh) using two first buoyancy plates (315).

[0044] In this way, the same functional effect as in the first embodiment is obtained in the second embodiment as well. Furthermore, in the second embodiment, since the first floating plate group (311) is divided into two first floating plates (315), the availability of stage material is further improved. In this regard, the second floating plate group (312) and the downstream floating stage (33) may also be divided into multiple parts, just like the first floating plate group (311).

[0045] In addition, in the second embodiment, by forming a frame portion (382) for each first floating plate (315), the upstream floating stage (31) can be configured in three types of patterns (third embodiment).

[0046] FIG. 6 is a plan view schematically showing the configuration of the first floating plate group and the second floating plate group for each substrate size in a third embodiment of a substrate processing apparatus related to the present invention. The three types of patterns are as follows:

[0047] · Full-size pattern described in column (a) of Fig. 6 … 2 sheets of first floating plate (315) + second floating plate (314),

[0048] · Half-size pattern described in column (b) of Fig. 6 … 2 sheets of first buoyancy plates (315),

[0049] · Quarter size pattern described in column (c) of Fig. 6 … 1 first wound plate (315),

[0050] It is prepared, and a pattern can be selected according to the substrate size to perform the coating process.

[0051] FIG. 7 is a side view showing a levitation stage portion suitable for a full-size substrate in a fourth embodiment of a substrate processing apparatus related to the present invention. The main difference between the fourth embodiment and the first embodiment is that the downstream levitation stage (33) is divided into two parts, just like the upstream levitation stage (31). Also, since the other configurations are the same as the first embodiment, the same reference numerals are used for identical configurations, and the description of the configuration is omitted.

[0052] The downstream flotation stage (33) is composed of a third flotation plate group (331) (having a third flotation plate group (333)) and a fourth flotation plate group (332) (having a fourth flotation plate group (334)) that are divided from each other in the return direction (Dt). In a conventional device, the downstream flotation stage (33) is composed of a single flotation plate. Therefore, there was a situation where it was difficult to obtain materials, just like on the upstream flotation stage side. In contrast, in the fourth embodiment, the downstream flotation stage (33) is divided into two parts, the third flotation plate group (331) and the fourth flotation plate group (332), so the availability of stage materials can be improved.

[0053] Additionally, as shown in FIG. 7, the third floating plate group (331) has a frame portion (384) formed in the downstream support area (RD) of the support (372) and is supported by a plurality of adjustment bolts (39) formed by being erected from the upper surface of the frame portion (384). In short, in the fourth embodiment, since the first floating plate group (311), the coating stage (32), and the third floating plate group (331) are supported by the same support (372), the step difference between the upper surface of the third floating plate group (331) and the upper surface of the coating stage (32) can be easily maintained at tens of μm or less. Thus, in the fourth embodiment, the frame portion (384) corresponds to an example of the "second frame portion" of the present invention.

[0054] In addition, in the above embodiment, a frame portion (382, 384) is formed adjacent to the coating stage (32) on a support (372) corresponding to an example of the “coating support” of the present invention. Thus, the following functional effects are obtained. Since the coating process is performed on the coating stage (32), it is necessary to maintain the step difference between the upper surface of the first floating plate group (311) and the upper surface of the coating stage (32) at a level of several tens of μm or less, as described above. The same applies to the step difference between the upper surface of the coating stage (32) and the upper surface of the downstream floating stage (33). To satisfy these requirements, it is preferable to form a frame portion (382) supporting the first floating plate group (311) and a frame portion (384) supporting the downstream floating stage (33) on the upper surface of the support (372) for supporting the coating stage (32), as in the present embodiment.

[0055] Furthermore, the present invention is not limited to the above embodiments, and various modifications can be made to the above description without departing from the spirit thereof. In the above embodiments, a full-size substrate (Sf) and a half-size substrate (Sh) having a length relationship of 2:1 in the conveying direction (Dt) are exemplified as the "large-size substrate" and "small-size substrate" of the present invention, but the combination of the "large-size substrate" and the "small-size substrate" is not limited to this and is optional as long as the width (W) is of the same dimension.

[0056] In addition, in the above embodiment, the present invention is applied to a substrate processing device that supplies and coats a processing liquid to the upper surface of a substrate, but the present invention can also be applied to a substrate processing device that supplies a processing liquid to the upper surface of a substrate for purposes other than coating.

[0057] The present invention can be applied to a substrate processing apparatus that supplies a processing liquid, such as a resist liquid, to the upper surface of a substrate while floating and transporting the substrate. Explanation of the symbols

[0058] 1 : Substrate processing device 3: Injury Stage Section 31: Upstream Elevation Stage 32: Coating stage 33: Downstream Elevation Stage 71 : Nozzle 311: 1st Wounded Plate Group 312: 2nd Wounded Plate Group 313, 315: 1st Wound Plate 314: Second Injury Plate 331: 3rd Wounded Plate Group 332: 4th Wounded Plate Group 372 : Support 382 : Frame section (1st frame section) 384 : Frame section (2nd frame section) Dt: Return direction RC: Application support area RD: Downstream support zone RU: Upstream support area S: Substrate Sf: Full-size substrate Sh: Half-size substrate Sq: Quarter-size board

Claims

Claim 1 A substrate processing apparatus that supplies a processing liquid from a nozzle to the upper surface of a substrate while conveying the substrate floating on a floating stage portion in a predetermined conveying direction, wherein the floating stage portion comprises a coating stage formed at a position opposite to the nozzle, an upstream floating stage disposed upstream of the coating stage in the conveying direction, and a downstream floating stage disposed downstream of the coating stage in the conveying direction; wherein the upstream floating stage comprises a first floating plate group disposed adjacent to the upstream side of the coating stage in the conveying direction, wherein at least one first floating plate for floating the substrate is arranged in the conveying direction, and a second floating plate group disposed adjacent to the upstream side of the first floating plate group in the conveying direction, wherein at least one second floating plate for floating the substrate is arranged in the conveying direction, and a second floating plate group formed to be freely detachable adjacent to the upstream side of the first floating plate group in the conveying direction, wherein, depending on the size of the substrate in the conveying direction, the second floating plate group is separated from the upstream floating stage and the first floating A substrate processing apparatus configured to switch between a first substrate transport in which the substrate is transported to the coating stage using only a plate group, and a second substrate transport in which the substrate is transported to the coating stage using the second floating plate group and the first floating plate group by placing the second floating plate group adjacent to the first floating plate group. Claim 2 A substrate processing apparatus according to claim 1, wherein, among a small-size substrate having a first length in the conveying direction and a large-size substrate having a second length longer than the first length, the small-size substrate is used as the substrate, and when the processing liquid is supplied, the first floating plate group is configured such that the length in the conveying direction is the first length, and the second floating plate group is separated from the upstream floating stage. Claim 3 A substrate processing apparatus according to claim 2, wherein when the processing liquid is supplied using the large-size substrate as the substrate, the second floating plate group is arranged adjacent to the first floating plate group, and the length in the conveying direction connecting the first floating plate group and the second floating plate group is configured to be the second length. Claim 4 A substrate processing apparatus according to any one of claims 1 to 3, comprising a coating support having a coating support area on its upper surface that supports the coating stage, wherein the upstream floating stage is formed in an upstream support area on the upstream side of the coating support area in the conveying direction on the upper surface of the coating support, and has a first frame portion that maintains the first floating plate group on its upper surface. Claim 5 A substrate processing apparatus according to any one of claims 1 to 3, wherein the downstream floating stage comprises: a group of third floating plates arranged in the conveying direction such that at least one third floating plate for floating a processed substrate supplied with the processing liquid is arranged adjacent to the downstream side of the coating stage in the conveying direction; and a group of fourth floating plates formed to be freely detachable adjacent to the downstream side of the group of third floating plates in the conveying direction such that at least one fourth floating plate for floating a processed substrate is arranged in the conveying direction. Claim 6 A substrate processing apparatus according to claim 5, comprising a coating support having a coating support area on its upper surface that supports the coating stage, wherein the upstream floating stage is formed in an upstream support area on the upstream side of the coating support area in the conveying direction on the upper surface of the coating support and has a first frame portion that maintains the first floating plate group on its upper surface, and the downstream floating stage is formed in a downstream support area on the downstream side of the coating support area in the conveying direction on the upper surface of the coating support and has a second frame portion that maintains the third floating plate group on its upper surface.

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