Substrate solution treatment device and substrate solution treatment method

Abstract

A technology advantageous for suppressing the mixing of particles into a processing liquid applied to a substrate is provided. A substrate liquid processing device comprises a supply tank in which a processing liquid is supplied to the inside through a guide line, a pressurizing device for pressurizing the inside of the supply tank, a discharge nozzle for discharging the supplied processing liquid, a supply line connected to the supply tank and the discharge nozzle and which is not provided with an adjustment mechanism for variably restricting the flow path connecting the supply tank and the discharge nozzle, a first drainage line connected to a first branch portion between the supply tank and the discharge nozzle in the supply line, a liquid flow adjustment mechanism provided in the first drainage line for restricting the passage of a processing liquid at a pressure lower than a set pressure, and a control unit for adjusting the set pressure.

Description

Technology Field

[0001] The present disclosure relates to a substrate liquid treatment apparatus and a substrate liquid treatment method. Background Technology

[0002] A substrate liquid treatment device is known in which the incorporation of particles into the treatment liquid is suppressed. In the device of Patent Document 1, since there is no need to interpose a control valve for flow rate control in the branch line, particles that may be generated from such a control valve do not flow in the liquid treatment unit. In the device of Patent Document 2, dust generation inside the constant pressure valve can be suppressed. Prior art literature

[0003] Patent Document 1: Japanese Patent Publication No. 2015-41751 Patent Document 2: Japanese Patent Publication No. 2017-204069 The problem to be solved

[0004] The present disclosure provides a technique advantageous for suppressing the incorporation of particles into a processing solution applied to a substrate. means of solving the problem

[0005] One aspect of the present disclosure relates to a substrate liquid treatment apparatus comprising: a supply tank in which a treatment liquid is supplied to the inside through a guide line; a pressurizing device for pressurizing the inside of the supply tank; a discharge nozzle for discharging the supplied treatment liquid; a supply line connected to the supply tank and the discharge nozzle, which is not provided with an adjustment mechanism for variably restricting the flow path connecting the supply tank and the discharge nozzle; a first drain line connected to a first branch portion between the supply tank and the discharge nozzle in the supply line; a liquid flow adjustment mechanism provided in the first drain line for restricting the passage of a treatment liquid at a pressure lower than a set pressure; and a control unit for adjusting the set pressure. Effects of the invention

[0006] According to the present disclosure, it is advantageous to suppress the incorporation of particles into the processing solution applied to the substrate. Brief explanation of the drawing

[0007] Figure 1 is a diagram showing a schematic of an example of a processing system. Figure 2 is a diagram showing a schematic of an example of a processing unit. Figure 3 is a diagram showing the schematic configuration of an example of a liquid supply circuit for supplying a processing liquid to a discharge nozzle. Figure 4 is a drawing illustrating an example of a storage unit. Figure 5 is a drawing illustrating an example of a storage unit. Figure 6 is a drawing illustrating an example of a storage unit. Figure 7 is a drawing illustrating an example of a storage unit. FIG. 8 is a diagram showing a schematic representation of the first embodiment of a treatment liquid supply system. FIG. 9 is a diagram showing a schematic representation of the first embodiment of a treatment liquid supply system. FIG. 10 is a diagram showing a schematic representation of a first embodiment of a treatment liquid supply system. FIG. 11 is a diagram showing a schematic representation of a first embodiment of a treatment liquid supply system. FIG. 12 is a diagram showing a schematic representation of a second embodiment of a treatment liquid supply system. FIG. 13 is a diagram showing a schematic of a second embodiment of a treatment liquid supply system. FIG. 14 is a partial cross-sectional view illustrating an example of a heating method in the first heating zone of a guide line. FIG. 15 is a partial cross-sectional view illustrating an example of a heating method in the first heating zone of a guide line. FIG. 16 is a partial cross-sectional view illustrating an example of a heating method in the first heating zone of a guide line. FIG. 17 is a partial cross-sectional view illustrating an example of a heating method in the first heating zone of a guide line. FIG. 18 is a schematic diagram illustrating an example of a heating method in the first heating zone of a guide line. FIG. 19 is a schematic diagram illustrating an example of a heating method in the first heating zone of a guide line. FIG. 20 is a schematic diagram illustrating an example of a heating method in the first heating zone of a guide line. FIG. 21 is a diagram showing a schematic representation of a first embodiment of a treatment liquid temperature control system. FIG. 22 is a diagram showing a schematic representation of a second embodiment of a treatment liquid temperature control system. FIG. 23 is a drawing illustrating a stirring element installed inside a supply pipe that constitutes a supply line. Figure 24 is a drawing showing an example of stirring of the processing liquid in the supply tank. FIG. 25 is a drawing showing an example of a supply tank structure capable of suppressing temperature non-uniformity of the processing liquid. FIG. 26 is a drawing showing an example of a supply tank structure capable of suppressing a drop in the temperature of the processing liquid. Specific details for implementing the invention

[0008] FIG. 1 is a schematic diagram showing an example of a processing system (80). The processing system (80) shown in FIG. 1 has an input / output station (91) and a processing station (92). The input / output station (91) includes a placement section (81) having a plurality of carriers (C) and a return section (82) having a first return mechanism (83) and a delivery section (84). A plurality of substrates (W) are received in a horizontal state in each carrier (C). The processing station (92) is provided with a plurality of processing units (10) installed on both sides of a return path (86) and a second return mechanism (85) that moves back and forth along the return path (86).

[0009] The substrate (W) is extracted from the carrier (C) by the first conveying mechanism (83), loaded onto the transfer unit (84), and extracted from the transfer unit (84) by the second conveying mechanism (85). Then, the substrate (W) is brought into the corresponding processing unit (10) by the second conveying mechanism (85), and a predetermined liquid treatment (e.g., chemical treatment) is performed in the corresponding processing unit (10). After that, the substrate (W) is extracted from the corresponding processing unit (10) by the second conveying mechanism (85), loaded onto the transfer unit (84), and then returned to the carrier (C) of the placement unit (81) by the first conveying mechanism (83).

[0010] The processing system (80) is equipped with a control unit (93). The control unit (93) is configured, for example, by a computer and is equipped with an operation processing unit and a memory unit. In the memory unit of the control unit (93), programs and data for various processing performed in the processing system (80) are stored. The operation processing unit of the control unit (93) performs various processing by controlling various mechanisms of the processing system (80) by appropriately reading and executing the programs stored in the memory unit.

[0011] The program and data stored in the memory of the control unit (93) may be recorded on a computer-readable memory medium and installed in the memory from the memory medium. Examples of computer-readable memory media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0012] FIG. 2 is a diagram showing a schematic of an example of a processing unit (10).

[0013] The processing unit (10) comprises a substrate liquid processing device together with a control unit (93) (see FIG. 1) and includes a substrate holding unit (11), a rotary driving unit (12), a liquid supply unit (15), a cup structure (21), an inert gas supply unit (22), and a processing chamber (23). The substrate holding unit (11), the rotary driving unit (12), the liquid supply unit (15), and the cup structure (21) are installed inside the processing chamber (23). The inert gas supply unit (22) supplies an inert gas (e.g., nitrogen) into the processing chamber (23).

[0014] The substrate holding member (11) holds the substrate (W) supplied through the second conveying mechanism (85) (see FIG. 1). The illustrated substrate holding member (11) employs a vacuum method that adsorbs and holds the back side of the substrate (W), but the substrate holding member (11) may hold the substrate (W) by another method (e.g., a mechanical chuck method). The rotary driving member (12) applies rotational power to the substrate holding member (11) to rotate the substrate (W) held in the substrate holding member (11) together with the substrate holding member (11). The illustrated rotary driving member (12) includes a rotary driving shaft that extends along a rotation axis (A1) and has the substrate holding member (11) fixedly attached to its tip, and a rotary driving main body that rotates the rotary driving shaft around the rotation axis (A1). In the example illustrated as described above, at least a portion of a rotating mechanism (13) that rotates the substrate (W) around the rotation axis (A1) is configured by the substrate holding part (11) and the rotation driving part (12).

[0015] The liquid supply unit (15) is equipped with a nozzle drive unit (16), a drive arm (17), and a discharge nozzle (19). The nozzle drive unit (16) is equipped with a pivot drive shaft that extends along a pivot axis (A2) and has a drive arm (17) fixedly attached to its tip, and a pivot drive main body that rotates the pivot drive shaft around the pivot axis (A2). The pivot drive shaft of the nozzle drive unit (16) is attached to one end of the drive arm (17), and a discharge nozzle (19) is attached to a discharge head (18) that constitutes the other end of the drive arm (17). The discharge nozzle (19) moves around the pivot axis (A2) together with the drive arm (17) (including the discharge head (18). In the example illustrated as described above, at least a part of the nozzle moving mechanism that moves the discharge nozzle (19) is configured by the nozzle driving part (16) and the driving arm (17).

[0016] The discharge nozzle (19) discharges the processing liquid supplied through the supply line (see reference numeral “L4” in FIG. 3, etc.) described later. The processing liquid discharged from the discharge nozzle (19) is applied to the substrate (W) held by the substrate holding part (11) and is provided for liquid treatment of the substrate (W). The supply line is connected to the discharge nozzle (19) by passing through the nozzle driving part (16) and the driving arm (17) inside the processing chamber (23). In addition to the discharge nozzle (19), the driving arm (17), which is movably provided, may be equipped with a supply ejector (liquid flow switching mechanism) (see reference numeral “69” in FIG. 12, etc.) described later.

[0017] The specific composition or use of the treatment liquid supplied to the discharge nozzle (19) is not limited. For example, a chemical solution for imparting a change in the characteristics of the substrate (W), a rinse solution for washing the surface of the substrate (W), and a cleaning solution for cleaning the substrate (W) may be used as the treatment liquid. In addition, the number of discharge nozzles (19) in the liquid supply unit (15) is not limited. Although only one discharge nozzle (19) is shown in FIG. 2, the liquid supply unit (15) may be equipped with two or more discharge nozzles (19). For example, a discharge nozzle (19) for discharging a chemical solution, a discharge nozzle (19) for discharging a rinse solution such as pure water (DIW), and a discharge nozzle (19) for discharging a cleaning solution (e.g., IPA) used for cleaning the substrate may be provided in the discharge head (18).

[0018] The cup structure (21) has a ring-shaped planar shape and is provided to surround the substrate (W) held in the substrate holding portion (11). The cup structure (21) receives liquid scattered from the substrate (W) and guides it to a drain duct (not shown), or regulates the flow of gas to prevent the gas surrounding the substrate (W) from spreading. The specific configuration of the cup structure (21) is not limited. For example, the cup structure (21) may have a separate cup mainly for guiding liquid and a cup mainly for regulating the flow of gas.

[0019] The processing unit (10) may further be equipped with other mechanisms not described above. For example, an exhaust control mechanism for discharging gas from within the processing chamber (23) or a drainage control mechanism for discharging liquid that has fallen (sprayed) from the substrate (W) from within the processing chamber (23) may be provided. Additionally, a heating device may be provided to heat the liquid on the substrate (W) to promote liquid treatment of the substrate (W).

[0020] [Fluid Supply Circuit]

[0021] FIG. 3 is a diagram showing a schematic configuration of an example of a liquid supply circuit (30) for supplying a processing liquid (P) to a discharge nozzle (19). The liquid supply circuit (30) is realized by various components of the aforementioned processing unit (10) and other components of the processing system (80).

[0022] The liquid supply circuit (30) shown in FIG. 3 comprises a storage unit (32) connected to a processing liquid source (31) via a storage line (L1), a supply tank (37) connected to the storage unit (32) via a guide line (L2), and a discharge nozzle (19) connected to the supply tank (37) via a supply line (L4).

[0023] The storage unit (32) stores the treatment liquid (P) supplied from the treatment liquid supply source (31) through the storage line (L1). The specific configuration of the storage unit (32) is not limited. For example, the storage unit (32) may have one storage tank capable of storing the treatment liquid (P) or multiple storage tanks (see FIGS. 4 to 7 described later). A storage opening / closing valve (45) is provided in the storage line (L1). By opening and closing the flow path of the storage line (L1) under the control of the control unit (93), the supply of the treatment liquid (P) to the storage unit (32) can be controlled.

[0024] In the guide line (L2), a guide shut-off valve (33) and a guide filter (34) located downstream of the guide shut-off valve (33) are provided. The guide shut-off valve (33) opens and closes the flow path of the guide line (L2) under the control of the control unit (93). The guide filter (34) removes foreign matter from the processing liquid (P) while allowing the processing liquid (P) to pass through. Through the guide line (L2), in which the flow path is opened by the guide shut-off valve (33), the processing liquid (P) is sent from the storage unit (32) to the supply tank (37).

[0025] The method of sending the processing liquid (P) from the storage unit (32) to the supply tank (37) is not limited. For example, it is possible to send the processing liquid (P) from the storage unit (32) to the guide line (L2) by blowing a pressurizing gas (e.g., an inert gas such as nitrogen) into the storage tank of the storage unit (32) (see FIG. 7 described later). In addition, by installing the storage unit (32) and the guide line (L2) above the supply tank (37), it is possible to send the processing liquid (P) from the storage unit (32) to the supply tank (37) using gravity. When using a sending device such as a pump (not shown) that directly sends the processing liquid (P) within the guide line (L2), it is preferable that such a sending device be provided upstream of the guide filter (34). In this case, even if particles are emitted into the processing liquid (P) from the sending device, such particles can be removed from the processing liquid (P) by the guide filter (34).

[0026] A heating zone in which the processing liquid is heated by a heating unit is set in at least one of the guide line (L2) and the supply tank (37). In the example illustrated in FIG. 3, the heating zone is set in both the guide line (L2) and the supply tank (37). That is, a first heating unit (35) is provided near the first heating zone (Z1) of the guide line (L2), and the processing liquid (P) in the first heating zone (Z1) is heated by the first heating unit (35). Additionally, a second heating unit (36) is provided near the second heating zone (Z2) of the supply tank (37), and the processing liquid (P) in the second heating zone (Z2) is heated by the second heating unit (36).

[0027] The heating zone (Z1, Z2) is set downstream of the guide filter (34). The guide filter (34) removes foreign matter from the treatment liquid (P) flowing upstream of the heating zone (Z1, Z2) in the flow path of the treatment liquid (P). As the temperature of the treatment liquid (P) passing through the guide filter (34) increases, there is a tendency for foreign matter to be easily discharged from the guide filter (34) into the treatment liquid (P). In the liquid supply circuit (30) shown in FIG. 3, since the treatment liquid (P) before heating passes through the guide filter (34), the discharge of foreign matter from the guide filter (34) into the treatment liquid (P) can be suppressed. In addition, in the liquid supply circuit (30) shown in FIG. 3, in the flow path of the treatment liquid (P) extending from the guide line (L2) to the discharge nozzle (19), the heating zone (Z1, Z2) and the flow path downstream from the heating zone (Z1, Z2) are not provided with a filter to remove foreign matter from the treatment liquid (P). In this way, by preventing the high-temperature treatment liquid (P) heated in the heating zone (Z1, Z2) from passing through the filter, contamination of the treatment liquid (P) can be prevented.

[0028] A processing liquid (P) is supplied to the inside of the supply tank (37) through a guide line (L2). A pressurizing device (38) is attached to the supply tank (37). The pressurizing device (38) pressurizes the inside of the supply tank (37) and sends the processing liquid (P) from the supply tank (37) to the supply line (L4). The illustrated pressurizing device (38) is connected to the supply tank (37) through a gas line (L3), and can increase the pressure inside the supply tank (37) by supplying a pressurizing gas (e.g., an inert gas such as nitrogen) into the supply tank (37) through the gas line (L3). A pressurizing filter (39) is provided in the part of the gas line (L3) downstream from the pressurizing device (38). The pressurizing filter (39) removes foreign matter from the pressurizing gas while passing the pressurizing gas from the pressurizing device (38) through it. Accordingly, the pressurized gas sent from the pressurizing device (38) to the gas line (L3) is introduced into the supply tank (37) in a clean state after foreign matter is removed by the pressurizing filter (39).

[0029] The supply line (L4) is connected to the supply tank (37) and the discharge nozzle (19). The supply line (L4) is not provided with a control mechanism that variably limits the flow path connecting the supply tank (37) and the discharge nozzle (19). The "control mechanism that variably limits the flow path" mentioned here can be configured by any control mechanism. Typically, a control mechanism such as a valve or pump capable of changing the cross-sectional area of ​​the flow path of the processing liquid may correspond to the "control mechanism that variably limits the flow path." Examples of valves that may correspond to the "control mechanism that variably limits the flow path" include a dispense valve that functions as an opening and closing valve to open and close the flow path, or a back valve for returning the liquid level at the tip of the nozzle to the upstream side. The "control mechanism that variably limits the flow path" may introduce particles such as dust into the liquid within the flow path. In the liquid supply circuit (30) shown in Fig. 3, since the “adjustment mechanism for variably limiting the flow path” is not installed downstream of the guide filter (34), it is possible to prevent particles from being mixed into the processing liquid (P) in the flow path between the guide filter (34) and the discharge nozzle (19).

[0030] A first drainage line (L5) is connected to the first branch section (b1) between the supply tank (37) and the discharge nozzle (19) in the supply line (L4). A liquid flow control mechanism (40) is provided in the first drainage line (L5). The liquid flow control mechanism (40) can control the discharge of the treatment liquid (P) from the discharge nozzle (19) by adjusting the flow of the treatment liquid (P) in the supply line (L4) and the first drainage line (L5). The liquid flow control mechanism (40) can be realized by various configurations, and specific examples of the liquid flow control mechanism (40) will be described later (see FIGS. 8 to 13). The treatment liquid (P) that has passed through the liquid flow control mechanism (40) is sent downstream through the first drainage line (L5) and is returned to the storage unit (32) or discharged into the drain tank (41).

[0031] In the liquid supply circuit (30) (substrate liquid treatment device) having the configuration described above, the inner side of the supply tank (37) is pressurized by the pressurizing device (38), thereby supplying the treatment liquid (P) from the supply tank (37) to the discharge nozzle (19) through the supply line (L4). The substrate liquid treatment method, which performs liquid treatment of the substrate (W) by applying the treatment liquid (P) to the substrate (W), is carried out by the treatment liquid (P) supplied to the discharge nozzle (19) in this manner being discharged from the discharge nozzle (19) toward the substrate (W).

[0032] Next, specific examples of the components of the liquid supply circuit (30) will be described.

[0033] [Retention Unit]

[0034] FIGS. 4 to 7 are drawings illustrating an example of a storage unit (32).

[0035] The storage unit (32) shown in FIGS. 4 to 7 has a plurality of storage tanks (i.e., a first storage tank (47a) and a second storage tank (47b)). The first storage tank (47a) and the second storage tank (47b) are connected to each other through a plurality of circulation lines (i.e., a first circulation line (L7a) and a second circulation line (L7b)).

[0036] The first circulation line (L7a) is a line that guides the treatment liquid (P) from the first storage tank (47a) to the second storage tank (47b). The first circulation line (L7a) is provided with a first circulation shut-off valve (49a) and a first circulation filter (50a). The first circulation shut-off valve (49a) is provided upstream of the first circulation filter (50a) (i.e., towards the first storage tank (47a)) and opens and closes the first circulation line (L7a) under the control of the control unit (93). The first circulation filter (50a) is provided downstream of the first circulation shut-off valve (49a) (i.e., towards the second storage tank (47b)) and removes foreign matter from the treatment liquid (P) while passing it through the first circulation line (L7a).

[0037] The second circulation line (L7b) is a line that guides the treatment liquid (P) from the second storage tank (47b) to the first storage tank (47a). The second circulation line (L7b) is provided with a second circulation shut-off valve (49b) and a second circulation filter (50b). The second circulation shut-off valve (49b) is provided upstream of the second circulation filter (50b) (i.e., towards the second storage tank (47b)) and opens and closes the second circulation line (L7b) under the control of the control unit (93). The second circulation filter (50b) is provided downstream of the second circulation shut-off valve (49b) (i.e., towards the first storage tank (47a)) and removes foreign matter from the treatment liquid (P) while passing it through the second circulation line (L7b).

[0038] A first storage tank (47a) is equipped with a first storage pressurizing unit (48a), and a second storage pressurizing unit (48b) is equipped with a second storage tank (47b). Under the control of the control unit (93), the first storage pressurizing unit (48a) pressurizes the inside of the first storage tank (47a), and the second storage pressurizing unit (48b) pressurizes the inside of the second storage tank (47b). The specific configuration of the first storage pressurizing unit (48a) and the second storage pressurizing unit (48b) is not limited. For example, the first storage pressurizing unit (48a) and the second storage pressurizing unit (48b) may each be equipped with a compressor that supplies pressurizing gas to the inside of the first storage tank (47a) and the second storage tank (47b).

[0039] The storage line (L1) is connected to the first storage tank (47a). The storage line (L1) is provided with a storage shut-off valve (45) and a storage filter (46). The storage shut-off valve (45) is provided upstream of the storage filter (46) (i.e., towards the treatment liquid supply source (31)) and opens and closes the storage line (L1) under the control of the control unit (93). The storage filter (46) is provided downstream of the storage shut-off valve (45) (i.e., towards the first storage tank (47a)) and removes foreign matter from the treatment liquid (P) while passing it through the storage line (L1).

[0040] The guide line (L2) is connected to the first storage tank (47a), and the first storage tank (47a) is connected to the supply tank (37) through the guide line (L2).

[0041] Additionally, the storage unit (32) is provided with other unillustrated devices as needed. For example, in each of the first storage tank (47a) and the second storage tank (47b), a liquid volume measuring device (not illustrated), such as a level sensor, is installed to measure the height and / or amount of the processing liquid (P) stored inside. For example, by arranging multiple sensors that detect the presence or absence of the processing liquid (P) at different heights within each storage tank (47a, 47b), it is possible to measure the height of the processing liquid (P) within each storage tank (47a, 47b). The measurement result of the liquid volume measuring device is sent to the control unit (93).

[0042] A first drain line (L5) (see FIG. 3) may be connected to at least one of the plurality of storage tanks (47a, 47b). In this case, the treatment liquid that has passed through the liquid flow adjustment mechanism (40) flows into at least one of the plurality of storage tanks (47a, 47b) through the first drain line (L5). The first drain line (L5) may be directly connected to at least one of the plurality of storage tanks (47a, 47b) or connected through the storage line (L1). By connecting the first drain line (L5) to a portion of the storage line (L1) upstream of the storage filter (46), the treatment liquid (P) that flows into the storage line (L1) from the first drain line (L5) flows into the first storage tank (47a) after foreign matter is removed by the storage filter (46).

[0043] When a treatment liquid (P) is supplied to a storage unit (32) having the configuration described above, the storage unit (32) is placed in the state shown in FIG. 4. That is, under the control of the control unit (93), the storage line (L1) is opened by the storage opening / closing valve (45), and the first circulation line (L7a), the second circulation line (L7b), and the guide line (L2) are closed by the first circulation opening / closing valve (49a), the second circulation opening / closing valve (49b), and the guide opening / closing valve (33). Accordingly, the treatment liquid (P) is supplied from the treatment liquid supply source (31) to the first storage tank (47a) through the storage line (L1), and the treatment liquid (P) is stored in the first storage tank (47a).

[0044] The control unit (93) monitors the height and / or amount of the processing liquid (P) in the first storage tank (47a) based on the measurement result of the liquid volume measuring device. When the processing liquid (P) in the first storage tank (47a) reaches a predetermined height and / or amount (e.g., about 300 cc to 500 cc), the control unit (93) controls the storage opening / closing valve (45) to close the storage line (L1) and stops the supply of the processing liquid (P) to the first storage tank (47a).

[0045] After that, the treatment liquid (P) is circulated between a plurality of storage tanks (47a, 47b), and foreign matter is removed by the circulation filters (50a, 50b). For example, as shown in FIG. 5, under the control of the control unit (93), the first circulation line (L7a) is opened by the first circulation opening / closing valve (49a), and the second circulation line (L7b) and guide line (L2) are closed by the second circulation opening / closing valve (49b) and the guide opening / closing valve (33). In this state, the first storage pressurizing unit (48a) pressurizes the inside of the first storage tank (47a), thereby allowing the treatment liquid (P) to be sent from the first storage tank (47a) to the second storage tank (47b) through the first circulation line (L7a). Also, as shown in FIG. 6, under the control of the control unit (93), the second circulation line (L7b) is opened by the second circulation shut-off valve (49b), and the first circulation line (L7a) and guide line (L2) are closed by the first circulation shut-off valve (49a) and guide shut-off valve (33). In this state, the second storage pressurizing unit (48b) pressurizes the inside of the second storage tank (47b), thereby allowing the processing liquid (P) to be sent from the second storage tank (47b) to the first storage tank (47a).

[0046] In this way, after foreign matter is removed from the treatment liquid (P) by the circulation filters (50a, 50b), the treatment liquid (P) is sent from the storage unit (32) to the supply tank (37). Specifically, as shown in FIG. 7, under the control of the control unit (93), the guide line (L2) is opened by the guide opening / closing valve (33), and the first circulation line (L7a) and the second circulation line (L7b) are closed by the first circulation opening / closing valve (49a) and the second circulation opening / closing valve (49b). In this state, by pressurizing the inside of the first storage tank (47a) by the first storage pressurizing unit (48a), the treatment liquid (P) can be sent from the first storage tank (47a) to the guide line (L2).

[0047] In the example illustrated in FIGS. 4 to 7 above, the first circulation filter (50a) and the second circulation filter (50b) constitute a “filter for removing foreign matter from a processing liquid flowing through at least one of a plurality of circulation lines.” Additionally, a combination of the first storage pressurizing unit (48a), the second storage pressurizing unit (48b), the first circulation shut-off valve (49a), the second circulation shut-off valve (49b), and the guide shut-off valve (33) constitutes a “circulation control mechanism for circulating a processing liquid between a plurality of storage tanks through a plurality of circulation lines.”

[0048] In conventional substrate liquid treatment devices, foreign substances are removed from the treatment liquid by circulating the treatment liquid using, for example, a bellows pump and performing filtration of the treatment liquid. Meanwhile, according to the storage unit (32) shown in FIGS. 4 to 7 above, foreign substances can be removed from the treatment liquid (P) by circulating the treatment liquid (P) between a plurality of storage tanks (47a, 47b) using, for example, pressurizing gas. Therefore, foreign substances can be properly removed from the treatment liquid (P) by the storage unit (32) with a simple configuration without using a mechanism with a complex structure such as a bellows pump.

[0049] Next, a specific example of a supply system for a treatment liquid (P) from a supply tank (37) to a discharge nozzle (19) will be described. Below, two structural examples of such a treatment liquid supply system (i.e., "first embodiment of the treatment liquid supply system" and "second embodiment of the treatment liquid supply system") will be described.

[0050] [First aspect of the treatment liquid supply system]

[0051] FIGS. 8 to 11 are diagrams illustrating a schematic representation of a first embodiment of a treatment liquid supply system. In FIGS. 8 to 11, some components are omitted from the illustration. For example, in this embodiment, a heating unit for heating the treatment liquid (P) (i.e., the first heating unit (35) and the second heating unit (36) of FIG. 3) is provided, but the heating unit is omitted from the illustration in FIGS. 8 to 11. Furthermore, detailed descriptions of the configuration and operation of each element already described are omitted.

[0052] In addition to the aforementioned guide line (L2), gas line (L3), and supply line (L4), an atmospheric opening line (L9) is connected to the supply tank (37) of the present embodiment. The atmospheric opening line (L9) connects the inside of the supply tank (37) with the surrounding environment (e.g., the atmosphere) of the supply tank (37) and is provided to equalize the pressure inside the supply tank (37) with the environmental pressure (e.g., atmospheric pressure). An atmospheric opening valve (63) is provided in the atmospheric opening line (L9). The atmospheric opening valve (63) opens and closes the flow path of the atmospheric opening line (L9) under the control of the control unit (93). By opening the atmospheric opening line (L9) with the atmospheric opening valve (63), the inside of the supply tank (37) is opened to the surroundings, allowing gas to freely move between the inside of the supply tank (37) and the surroundings through the atmospheric opening line (L9). Meanwhile, by closing the atmospheric opening valve (63) the atmospheric opening line (L9), the inside of the supply tank (37) is blocked from the surroundings, so that gas does not flow between the inside of the supply tank (37) and the surroundings. For example, when the processing liquid (P) is supplied to the discharge nozzle (19) (see FIG. 9 described later), the control unit (93) controls the atmospheric opening valve (63) to close the atmospheric opening line (L9), thereby keeping the inside of the supply tank (37) in a state where it can be efficiently pressurized. Also, when the processing liquid (P) is not supplied to the discharge nozzle (19) (see FIG. 10 and FIG. 11 described later), the control unit (93) controls the atmospheric opening valve (63) to open L9.

[0053] The pressurizing device (38) has a gas supply unit (65) that causes pressurizing gas to flow into a gas line (L3) connected to the inside of a supply tank (37), a pressure adjustment unit (66) that adjusts the pressure of the pressurizing gas flowing through the gas line (L3), and a gas opening / closing valve (67) that opens and closes the flow path of the gas line (L3). The gas supply unit (65) may be driven under the control of a control unit (93) and may, for example, be equipped with a compressor. The pressure adjustment unit (66) may be driven under the control of a control unit (93) and may, for example, be equipped with an electric air regulator. The gas supply unit (65) and the pressure adjustment unit (66) may be stopped from driving under the control of a control unit (93), for example, when the liquid supply circuit (30) is in a standby state. The gas opening / closing valve (67) is driven under the control of the control unit (93) and may be, for example, an electronic valve.

[0054] A liquid volume measuring device (not shown), such as a level sensor, is installed in the supply tank (37) to measure the height and / or amount of the processing liquid (P) stored inside. The measurement result of the liquid volume measuring device is sent to the control unit (93).

[0055] The discharge nozzle (19) is located above the supply tank (37) and the liquid flow control mechanism (40) (specifically, the back pressure valve (42)). The supply tank (37) and the liquid flow control mechanism (40) (the back pressure valve (42)) are positioned below the highest part of the supply line (L4).

[0056] A liquid detection sensor (61) is provided near the supply line (L4). The liquid detection sensor (61) detects the presence or absence of the processing liquid (P) at a first measurement point (M1) located downstream of the first branch section (b1) of the supply line (L4) (i.e., towards the discharge nozzle (19)). The detection method of the liquid detection sensor (61) is not limited. For example, if the supply line (L4) is constructed with a light-transmitting material, the liquid detection sensor (61) may use an optical sensor. Additionally, the liquid detection sensor (61) may use a sensor that measures capacitance or magnetic field at the first measurement point (M1). The liquid detection sensor (61) transmits the detection result to the control unit (93).

[0057] The first branch section (b1) is located between the highest part of the supply line (L4) extending from the supply tank (37) to the discharge nozzle (19) and the supply tank (37). The first measuring point (M1) is located between the highest part of the supply line (L4) extending from the supply tank (37) to the discharge nozzle (19) and the first branch section (b1), and is set at a position lower than the highest part of the supply line (L4).

[0058] A flow meter (62) is provided in the supply line (L4). The flow meter (62) measures the flow rate of the treatment liquid (P) at a second measurement point (M2) located downstream of the first branch section (b1) of the supply line (L4) (i.e., the discharge nozzle (19) side). The flow meter (62) transmits the measurement result to the control unit (93). Based on the measurement result of the flow meter (62), the control unit (93) adjusts the set pressure of the back pressure valve (42), which will be described later.

[0059] In the first drain line (L5), a back pressure valve (42) and a drain opening / closing valve (43) located downstream of the back pressure valve (42) are provided. The drain opening / closing valve (43) opens and closes the flow path of the first drain line (L5) under the control of the control unit (93). The back pressure valve (42) functions as the aforementioned liquid flow adjustment mechanism (40) and restricts the passage of a processing liquid (P) at a pressure lower than the set pressure. The back pressure valve (42) of this example allows a processing liquid (P) at a pressure higher than the set pressure to pass through, while preventing a processing liquid (P) at a pressure lower than the set pressure from passing through. Accordingly, the back pressure valve (42) adjusts the pressure of the processing liquid (P) in the first drain line (L5) (particularly the flow path upstream of the back pressure valve (42)) and the supply line (L4) to a pressure lower than the set pressure.

[0060] The set pressure of the back pressure valve (42) is adjusted by the control unit (93), and the flow state of the processing liquid (P) can be changed by changing the set pressure. For example, when the processing liquid (P) is supplied to the discharge nozzle (19), the control unit (93) adjusts the set pressure of the back pressure valve (42) so that it is greater than the peak head pressure, which is the pressure head at the highest point of the supply line (L4) from the supply tank (37) to the discharge nozzle (19). On the other hand, when the processing liquid (P) is not supplied to the discharge nozzle (19), the control unit (93) adjusts the set pressure of the back pressure valve (42) so that it is lower than the peak head pressure.

[0061] A second drain line (L6) is connected to the second branch section (b2) between the supply tank (37) and the discharge nozzle (19) of the supply line (L4). In the example shown in FIGS. 8 to 11, the second branch section (b2) is set at the same location as the first branch section (b1), but the second branch section (b2) may be provided upstream or downstream of the first branch section (b1). Additionally, the second drain line (L6) may be connected to the supply line (L4) through the first drain line (L5).

[0062] A suction mechanism (53) is provided in the second drainage line (L6). The driving mode of the suction mechanism (53) can be switched between a suction mode, which sucks the flow path of the supply line (L4) through the second drainage line (L6), and a non-suction mode, which does not suck the flow path of the supply line (L4) through the second drainage line (L6). For example, when the processing liquid (P) is not supplied to the discharge nozzle (19), the control unit (93) adjusts the suction mechanism (53) to a suction mode at least temporarily. By doing so, the processing liquid (P) in the supply line (L4) can be quickly moved away from the discharge nozzle (19), thereby preventing the occurrence of unintended problems such as the leakage of the processing liquid (P) from the discharge nozzle (19).

[0063] The suction mechanism (53) of the present example has a mode switching valve (54), a negative pressure tank (55), and a negative pressure regulator (56). The mode switching valve (54) is provided in the second drainage line (L6) and opens and closes the second drainage line (L6) under the control of the control unit (93). One end of the second drainage line (L6) is connected to the supply line (L4) (particularly the second branch section (b2)), and the other end of the second drainage line (L6) is connected to the negative pressure tank (55). The negative pressure regulator (56) adjusts the negative pressure tank (55) to a negative pressure state.

[0064] The illustrated negative pressure regulator (56) has a negative pressure compressor (57), a negative pressure shut-off valve (58), and a negative pressure ejector (59). The negative pressure compressor (57) supplies gas (e.g., an inert gas such as nitrogen) to the negative pressure line (L8) under the control of the control unit (93). The negative pressure shut-off valve (58) is provided between the negative pressure compressor (57) and the negative pressure ejector (59) and opens and closes the negative pressure line (L8) under the control of the control unit (93). The negative pressure ejector (59) can be configured by an aspirator connecting the negative pressure tank (55) and the negative pressure line (L8), and can create a reduced pressure state inside the negative pressure tank (55) by the Venturi effect using the gas flowing in the negative pressure line (L8). The aspirator typically has a T-shaped flow path consisting of a combination of a horizontal flow path and a vertical flow path. The horizontal channel is locally narrowed at the junction of the vertical channel. By allowing fluid (gas from the negative pressure compressor (57) in this example) to flow through the horizontal channel, the fluid velocity increases and the pressure decreases at the junction, and as a result, the fluid in the vertical channel is drawn toward the horizontal channel.

[0065] When the suction device (53) is adjusted to a non-suction mode, the control unit (93) controls the mode switching valve (54) to close the flow path of the second drainage line (L6). Meanwhile, when the suction device (53) is adjusted to a suction mode, the control unit (93) controls the mode switching valve (54) to open the flow path of the second drainage line (L6).

[0066] For example, when adjusting the temperature of the processing liquid (P), the liquid supply circuit (30) is placed in the state shown in FIG. 8 under the control of the control unit (93). That is, the guide line (L2) is opened by the guide opening / closing valve (33), the atmosphere opening line (L9) is closed by the atmosphere opening valve (63), and the gas line (L3) is opened by the gas opening / closing valve (67). In addition, the first drain line (L5) is opened by the drain opening / closing valve (43), and the second drain line (L6) is closed by the mode switching valve (54). In addition, the control unit (93) lowers the set pressure of the back pressure valve (42) to be lower than the peak hydrostatic pressure.

[0067] In this state, pressurizing gas supplied from the gas supply unit (65) to the gas line (L3) is pressure-adjusted by the pressure adjustment unit (66) and then passed through the pressure filter (39) and supplied into the supply tank (37). As a result, the inside of the supply tank (37) is pressurized, and the processing liquid (P) is discharged from the supply tank (37) to the supply line (L4). Meanwhile, the processing liquid (P) is supplied to the supply tank (37) through the guide line (L2) from the storage unit (32) (e.g., the first storage tank (47a) shown in FIGS. 4 to 7). The control unit (93) controls the guide opening / closing valve (33) based on the measurement result of the liquid volume measuring device (not shown) provided in the supply tank (37) to open / close the guide line (L2) and store an appropriate amount of processing liquid (P) in the supply tank (37).

[0068] A portion of the processing liquid (P) introduced from the supply tank (37) into the supply line (L4) is introduced into the first drain line (L5) through the first branch section (b1) and reaches the back pressure valve (42). Since the set pressure of the back pressure valve (42) is adjusted to be lower than the peak hydrostatic pressure, the back pressure valve (42) adjusts the processing liquid (P) in the supply line (L4) to a pressure lower than the peak hydrostatic pressure while passing the processing liquid (P). As a result, the processing liquid (P) in the supply line (L4) can only reach a height position lower than the highest part of the supply line (L4), and the processing liquid (P) is not supplied to the discharge nozzle (19).

[0069] The treatment liquid (P) that has passed through the back pressure valve (42) passes through the first drainage line (L5) and is sent to the storage unit (32) (e.g., the first storage tank (47a) shown in FIGS. 4 to 7). Additionally, the treatment liquid (P) may be sent directly from the first drainage line (L5) to the storage unit (32), or it may be sent from the first drainage line (L5) to the storage unit (32) through a tank or line not shown. The treatment liquid (P) sent from the first drainage line (L5) to the storage unit (32) is returned to the supply tank (37) through the guide line (L2).

[0070] In this way, when the liquid supply circuit (30) takes the state shown in FIG. 8, the processing liquid (P) sent from the supply tank (37) to the supply line (L4) is returned to the supply tank (37) by passing through the first drainage line (L5), the storage unit (32), and the guide line (L2) without being discharged from the discharge nozzle (19). As the processing liquid (P) circulates through the liquid supply circuit (30) in this manner, it is heated in the heating zone (not shown in FIG. 8; see the first heating zone (Z1) and the second heating zone (Z2) of FIG. 3) and gradually increases in temperature as a whole to be adjusted to a desired temperature.

[0071] When the liquid (P) is adjusted to a desired temperature and the liquid (P) is supplied to the discharge nozzle (19) to discharge the liquid (P) from the discharge nozzle (19), the liquid supply circuit (30) is placed in the state shown in FIG. 9 under the control of the control unit (93).

[0072] That is, the control unit (93) sets the set pressure of the back pressure valve (42) to be greater than the peak hydrostatic pressure (preferably higher than the peak hydrostatic pressure). The guide line (L2) is closed by the guide opening / closing valve (33), but the open / closed state of the atmosphere opening line (L9), gas line (L3), first drain line (L5), and second drain line (L6) is set to the same state as shown in FIG. 8. In addition, the pressurizing device (38) (particularly the pressure adjustment unit (66)) pressurizes the inside of the supply tank (37) so that the processing liquid (P) sent from the supply tank (37) to the supply line (L4) has a pressure greater than the peak hydrostatic pressure (preferably higher than the peak hydrostatic pressure).

[0073] Accordingly, the processing liquid (P) in the supply line (L4) is adjusted by the back pressure valve (42) to a pressure equal to the “set pressure above the peak hydrostatic pressure.” As a result, the processing liquid (P) reaches the highest part of the supply line (L4) and is then supplied to the discharge nozzle (19).

[0074] Additionally, the control unit (93) may adjust the set pressure of the back pressure valve (42) based on the measurement result of the flow meter (62). For example, if the control unit (93) determines from the measurement result of the flow meter (62) that the amount of treatment liquid (P) supplied to the discharge nozzle (19) is insufficient, it may increase the set pressure of the back pressure valve (42) to supply a larger amount of treatment liquid (P) to the discharge nozzle (19). Additionally, if the control unit (93) determines from the measurement result of the flow meter (62) that the amount of treatment liquid (P) supplied to the discharge nozzle (19) is excessively large, it may decrease the set pressure of the back pressure valve (42) to reduce the amount of treatment liquid (P) supplied to the discharge nozzle (19).

[0075] In the example shown in FIG. 9, while the processing liquid (P) is being supplied to the discharge nozzle (19), the negative pressure shut-off valve (58) opens the negative pressure line (L8) under the control of the control unit (93), and the negative pressure tank (55) is adjusted to a negative pressure state.

[0076] And, when the supply of the processing liquid (P) to the discharge nozzle (19) is stopped and the discharge of the processing liquid (P) from the discharge nozzle (19) is stopped, the liquid supply circuit (30) is placed in the state shown in FIG. 10 under the control of the control unit (93).

[0077] That is, the control unit (93) sets the set pressure of the back pressure valve (42) lower than the peak hydrostatic pressure. As a result, the back pressure valve (42) adjusts the treatment liquid (P) in the supply line (L4) to a pressure lower than the peak hydrostatic pressure. Consequently, the treatment liquid (P) cannot reach the highest part of the supply line (L4), and the treatment liquid (P) is not supplied to the discharge nozzle (19).

[0078] Additionally, the second drainage line (L6) is opened by the mode switching valve (54) under the control of the control unit (93), and the suction mechanism (53) is adjusted to the suction mode. As a result, the negative pressure tank (55) is connected to the supply line (L4) through the second drainage line (L6), and the processing liquid (P) of the supply line (L4) is sucked into the negative pressure tank (55) through the second drainage line (L6). As a result, the head position of the processing liquid (P) in the supply line (L4) can be quickly moved away from the discharge nozzle (19), making it possible to momentarily stop the discharge of the processing liquid (P) from the discharge nozzle (19). The processing liquid (P) that has flowed into the negative pressure tank (55) is sent to the storage unit (32) through the negative pressure ejector (59) and the negative pressure line (L8).

[0079] The control unit (93) switches the suction mechanism (53), described later, from a suction mode to a non-suction mode according to the detection result of the liquid detection sensor (61). The control unit (93) controls the suction mechanism (53) (particularly the mode switching valve (54)) so that the suction mode is maintained while the detection result of the liquid detection sensor (61) indicates that the processing liquid (P) is present at the first measurement location (M1). Meanwhile, when the detection result of the liquid detection sensor (61) indicates that the processing liquid (P) is not present at the first measurement location (M1), the control unit (93) controls the suction mechanism (53) (particularly the mode switching valve (54)) so that it switches from a suction mode to a non-suction mode. By doing so, the head position of the processing liquid (P) in the supply line (L4) can be reliably moved away from the discharge nozzle (19).

[0080] Additionally, the atmosphere opening line (L9) is opened by the atmosphere opening valve (63), and the gas line (L3) is closed by the gas opening / closing valve (67). By doing so, the pressure inside the supply tank (37) is adjusted to be equal to the pressure around the supply tank (37), and the pressure of the processing liquid (P) from the supply tank (37) to the supply line (L4) can be reduced.

[0081] In addition, the open / closed state of the guide line (L2) and the first drainage line (L5) is set to the same state as shown in FIG. 9.

[0082] And when the liquid supply circuit (30) is kept in a standby state, the liquid supply circuit (30) is placed in the state shown in FIG. 11 under the control of the control unit (93).

[0083] That is, the control unit (93) lowers the set pressure of the back pressure valve (42) to be lower than the peak hydrostatic pressure. The first drain line (L5) is closed by the drain opening / closing valve (43), the atmosphere opening line (L9) is opened by the atmosphere opening valve (63), and the gas line (L3) is closed by the gas opening / closing valve (67). The second drain line (L6) is closed by the mode switching valve (54), and the negative pressure line (L8) is closed by the negative pressure opening / closing valve (58).

[0084] Accordingly, the treatment liquid (P) in the supply tank (37) and supply line (L4) is not supplied to the discharge nozzle (19) and is not circulated. The inside of the supply tank (37) is not pressurized, and the treatment liquid (P) in the supply line (L4) is not discharged through the first drain line (L5) and the second drain line (L6). Therefore, the liquid level of the treatment liquid (P) in the supply line (L4) becomes the same liquid level as the treatment liquid (P) inside the supply tank (37).

[0085] Meanwhile, the guide line (L2) is opened by the guide opening / closing valve (33), and the processing liquid (P) is supplied from the storage unit (32) to the supply tank (37) through the guide line (L2). The control unit (93) monitors the amount of processing liquid (P) stored in the supply tank (37) based on the measurement result of a liquid volume measuring device (not shown) installed in the supply tank (37). Then, when the amount of processing liquid (P) in the supply tank (37) reaches the appropriate amount, the control unit (93) closes the guide line (L2) by the guide opening / closing valve (33) to stop the supply of processing liquid (P) to the supply tank (37).

[0086] In conventional substrate liquid treatment devices, pressure is applied to the treatment liquid even near the discharge nozzle, and the opening and closing of the shut-off valve provided in the supply line is controlled, thereby switching whether or not the treatment liquid is discharged from the discharge nozzle. On the other hand, according to the liquid supply circuit (30) shown in FIGS. 8 to 11, the discharge of the treatment liquid (P) from the discharge nozzle (19) can be switched by changing the set pressure of the back pressure valve (42). Therefore, according to the liquid supply circuit (30) of the present embodiment, it is unnecessary to install a device for applying pressure to the treatment liquid (P) near the discharge nozzle (19) or to install a shut-off valve in the supply line (L4).

[0087] In addition, in conventional substrate liquid treatment devices, the flow rate of the treatment liquid in the supply line is adjusted by a constant pressure valve provided in the supply line to control the amount of treatment liquid supplied to the discharge nozzle. Meanwhile, according to the liquid supply circuit (30) shown in FIGS. 8 to 11, the amount of treatment liquid (P) supplied to the discharge nozzle (19) can be changed by using pressurizing gas sent from the pressurizing device (38) to the supply tank (37). Therefore, according to the liquid supply circuit (30) of the present embodiment, the installation of a constant pressure valve in the supply line (L4) is unnecessary.

[0088] [Second mode of the treatment liquid supply system]

[0089] FIGS. 12 and 13 are diagrams illustrating a schematic representation of a second embodiment of a treatment liquid supply system. In FIGS. 12 and 13, some components are omitted from the illustration. For example, in this embodiment, a heating unit for heating the treatment liquid (P) (i.e., the first heating unit (35) and the second heating unit (36) of FIG. 3) is provided, but is omitted from the illustration in FIGS. 12 and 13. Additionally, detailed descriptions of the configuration and operation of each element already described are omitted.

[0090] The liquid supply circuit (30) of the present embodiment also has the same supply tank (37), pressurizing device (38), discharge nozzle (19), and supply line (L4) as the liquid supply circuit (30) of the first embodiment described above. That is, the supply tank (37) supplies the processing liquid (P) to the inside through the guide line (L2), the pressurizing device (38) pressurizes the inside of the supply tank (37), and the discharge nozzle (19) discharges the supplied processing liquid (P). The supply line (L4) is connected to the supply tank (37) and the discharge nozzle (19), and there is no adjustment mechanism provided to variably limit the flow path connecting the supply tank (37) and the discharge nozzle (19).

[0091] The liquid supply circuit (30) of the present embodiment further comprises a supply ejector (69). The supply ejector (69) is provided in the first branch section (b1) and functions as a liquid flow switching mechanism that switches whether to allow the processing liquid (P) to flow in the section connecting the first branch section (b1) and the discharge nozzle (19) in the supply line (L4) according to the flow of the processing liquid (P) in the first drain line (L5). Specifically, the supply ejector (69) can be configured as an aspirator connecting the discharge nozzle (19), the supply line (L4), and the first drain line (L5). The supply ejector (69) can create a reduced pressure state in the discharge nozzle (19) by means of a Venturi effect using the processing liquid (P) flowing from the supply line (L4) to the first drain line (L5).

[0092] In this way, the first drain line (L5) connected to the first branch section (b1) is connected to the supply line (L4) in the supply ejector (69). The first drain line (L5) is branched into a first branch drain line (L5a) provided with a back pressure valve (42) and a second branch drain line (L5b) provided with a drain opening / closing valve (43). The first branch drain line (L5a) and the second branch drain line (L5b) are connected to a storage unit (32) (e.g., the first storage tank (47a) shown in FIGS. 4 to 7).

[0093] The highest part of the first drainage line (L5) is positioned at the same height as the highest part of the supply line (L4) or at a lower position than the highest part of the supply line (L4). In particular, the first branch drainage line (L5a) and the second branch drainage line (L5b) are positioned at a lower position than the highest part of the supply line (L4).

[0094] The back pressure valve (42) restricts the passage of a processing liquid (P) at a pressure lower than the set pressure, and allows a processing liquid (P) at a pressure higher than the set pressure to pass through, while not allowing a processing liquid (P) at a pressure lower than the set pressure to pass through. The drainage opening / closing valve (43) opens and closes the second branch drainage line (L5b) under the control of the control unit (93).

[0095] The back pressure valve (42) and the drainage opening / closing valve (43) function as a liquid flow control mechanism (40) that adjusts the flow of the treatment liquid (P) in the first drainage line (L5) under the control of the control unit (93). For example, when the second branch drainage line (L5b) is opened by the drainage opening / closing valve (43) (see FIG. 12), the treatment liquid (P) in the first drainage line (L5) is sent to the storage unit (32) through the second branch drainage line (L5b). Therefore, the treatment liquid (P) in the first drainage line (L5) is sent downstream smoothly without the pressure being adjusted. Meanwhile, when the second branch drain line (L5b) is closed by the drain opening / closing valve (43) (see FIG. 13), the back pressure valve (42) inhibits the flow of the treatment liquid (P) in the first drain line (L5) so that the pressure of the treatment liquid (P) in the first drain line (L5) is adjusted to a pressure lower than the set pressure.

[0096] The other configuration is identical to the liquid supply circuit (30) of the first embodiment described above (see FIGS. 8–11). For example, the discharge nozzle (19) is located above the supply tank (37) and the liquid flow control mechanism (40) (specifically, the back pressure valve (42) and the drainage shut-off valve (43)).

[0097] For example, when adjusting the temperature of the processing liquid (P), the liquid supply circuit (30) is placed in the state shown in FIG. 12 under the control of the control unit (93). That is, the guide line (L2) is opened by the guide opening / closing valve (33), the atmosphere opening line (L9) is closed by the atmosphere opening valve (63), the gas line (L3) is opened by the gas opening / closing valve (67), and the second branch drain line (L5b) is opened by the drain opening / closing valve (43).

[0098] In this state, the pressurizing gas supplied from the gas supply unit (65) to the gas line (L3) is pressure-adjusted by the pressure adjustment unit (66) and then passes through the pressure filter (39) and is supplied into the supply tank (37). As a result, the inside of the supply tank (37) is pressurized, and the processing liquid (P) is discharged from the supply tank (37) to the supply line (L4). At this time, the pressurizing device (38) (particularly the pressure adjustment unit (66)) pressurizes the inside of the supply tank (37) so that the processing liquid (P) discharged from the supply tank (37) to the supply line (L4) has a pressure higher than the peak hydrostatic pressure.

[0099] Meanwhile, the processing liquid (P) is supplied to the supply tank (37) through a guide line (L2) from a storage unit (32) (e.g., the first storage tank (47a) shown in FIGS. 4 to 7). The control unit (93) controls the guide opening / closing valve (33) based on the measurement result of a liquid volume measuring device (not shown) provided in the supply tank (37) to open / close the guide line (L2) and store an appropriate amount of processing liquid (P) in the supply tank (37).

[0100] The treatment liquid (P) flowing from the supply tank (37) into the supply line (L4) flows into the first drain line (L5) at the first branch section (b1) and is sent to the storage unit (32) through the second branch drain line (L5b). That is, the treatment liquid (P) in the supply line (L4) flows into the first drain line (L5) with an increased flow rate at the supply ejector (69). Meanwhile, the portion of the supply line (L4) between the first branch section (b1) and the discharge nozzle (19) is depressurized. As a result, the entirety of the treatment liquid (P) in the supply line (L4) flows into the first drain line (L5) and is not supplied to the discharge nozzle (19). Specifically, gas surrounding the discharge nozzle (19) flows into the supply line (L4) through the discharge nozzle (19), and an airflow is generated from the discharge nozzle (19) toward the first branch section (b1).

[0101] The treatment liquid (P) sent from the second branch drain line (L5b) to the storage unit (32) is returned to the supply tank (37) through the guide line (L2). When the liquid supply circuit (30) takes the state shown in FIG. 12, the treatment liquid (P) sent from the supply tank (37) to the supply line (L4) is returned to the supply tank (37) by passing through the first drain line (L5), the storage unit (32), and the guide line (L2) without being discharged from the discharge nozzle (19). As the treatment liquid (P) circulates through the liquid supply circuit (30) in this manner, it is heated in the heating zone (not shown in FIG. 12; see first heating zone (Z1) and second heating zone (Z2) in FIG. 3) and gradually increases in temperature as a whole to be adjusted to a desired temperature.

[0102] When the treatment liquid (P) is adjusted to a desired temperature and then the treatment liquid (P) is supplied to the discharge nozzle (19) to discharge the treatment liquid (P) from the discharge nozzle (19), the liquid supply circuit (30) is placed in the state shown in FIG. 13 under the control of the control unit (93).

[0103] That is, the second branch drain line (L5b) is closed by the drain shut-off valve (43), and the guide line (L2) is closed by the guide shut-off valve (33). The open / closed state of the atmosphere open line (L9) and the gas line (L3) is set to the same state as shown in FIG. 12. And the pressurizing device (38) (specifically the pressure adjustment unit (66)) pressurizes the inside of the supply tank (37) so that the processing liquid (P) sent from the supply tank (37) to the supply line (L4) has a pressure higher than the peak hydrostatic pressure.

[0104] Accordingly, the flow of the processing liquid (P) in the supply line (L4) is inhibited by the back pressure valve (42), and the pressure is adjusted by the back pressure valve (42) to the same pressure as the “set pressure above the peak hydrostatic pressure.” As a result, the processing liquid (P) flows into the supply ejector (69), the portion between the first branch section (b1) of the supply line (L4) and the discharge nozzle (19), and is supplied to the discharge nozzle (19).

[0105] The treatment liquid (P) that flows into the first drainage line (L5) and passes through the back pressure valve (42) is sent to the storage unit (32) through the first branch drainage line (L5a).

[0106] Then, when the supply of the treatment liquid (P) to the discharge nozzle (19) is stopped to stop the discharge of the treatment liquid (P) from the discharge nozzle (19), the gas line (L3) is closed by the gas shut-off valve (67), and the atmospheric open line (L9) is opened by the atmospheric open valve (63). As a result, the treatment liquid (P) in the supply line (L4) is adjusted to a pressure lower than the peak hydrostatic pressure, and as a result, the treatment liquid (P) cannot reach the highest part of the supply line (L4), and the treatment liquid (P) is not supplied to the discharge nozzle (19).

[0107] And when the liquid supply circuit (30) is in a standby state, the gas line (L3) is closed by the gas opening / closing valve (67), the standby opening line (L9) is opened by the standby opening valve (63), and the guide line (L2) is opened by the guide opening / closing valve (33). As a result, the processing liquid (P) in the supply tank (37) and the supply line (L4) is not supplied to the discharge nozzle (19) and is not circulated, but the processing liquid (P) is supplied from the storage unit (32) to the supply tank (37) through the guide line (L2). The control unit (93) monitors the amount of processing liquid (P) stored in the supply tank (37) based on the measurement result of the liquid volume measuring device (not shown) provided in the supply tank (37). Then, the control unit (93) closes the guide line (L2) by the guide opening / closing valve (33) at the timing when the amount of processing liquid (P) in the supply tank (37) reaches an appropriate amount, thereby stopping the supply of processing liquid (P) to the supply tank (37).

[0108] [Heating Zone and Heating Section]

[0109] Next, a specific mode of heating of the treatment liquid (P) in the heating zone (particularly the first heating zone (Z1)) is exemplified.

[0110] FIGS. 14 to 17 are partial cross-sectional views for explaining an example of a heating method in the first heating zone (Z1) of the guide line (L2). The first heating unit (35) can heat the treatment liquid (P) in the first heating zone (Z1) by means of a temperature adjustment liquid (Q) that is hotter than the treatment liquid (P) in the first heating zone (Z1).

[0111] If the guide pipe (71) constituting the guide line (L2) is made of a material (e.g., PFA (polytetrafluoroethylene)) that allows the temperature adjustment liquid (Q) used in the first heating unit (35) to pass through, there is a risk that the temperature adjustment liquid (Q) will be mixed with the treatment liquid (P) in the guide line (L2). To avoid this risk, for example, as shown in FIG. 14, a liquid having the same composition as the treatment liquid (P) flowing through the guide line (L2) may be used as the temperature adjustment liquid (Q) in the first heating unit (35). In this case, even if the temperature adjustment liquid (Q) passes through the guide pipe (71) and enters the guide line (L2), the composition of the treatment liquid (P) flowing through the guide line (L2) does not change, so that the treatment liquid (P) having an appropriate composition can be supplied to the discharge nozzle (19).

[0112] In addition, as shown in FIG. 15, even when the guide pipe (71) is made of a material (e.g., metal) that does not allow the temperature adjustment liquid (Q) (preferably both the treatment liquid (P) and the temperature adjustment liquid (Q) to pass through, the treatment liquid (P) having a suitable composition can be supplied to the discharge nozzle (19).

[0113] Additionally, as shown in FIG. 16, the guide pipe (71) constituting the guide line (L2) may have an inner pipe (71a) and an outer coat (71b) provided on the outside of the inner pipe (71a). In this case, it is preferable that at least one of the inner pipe (71a) and the outer coat (71b) be made of a material that does not allow the treatment liquid (P) to pass through. It is also preferable that at least one of the inner pipe (71a) and the outer coat (71b) be made of a material that does not allow the temperature adjustment liquid (Q) to pass through. For example, if the inner pipe (71a) is made of a material that allows the temperature adjustment liquid (Q) to pass through, it is preferable that the outer coat (71b) be made of a material that does not allow the temperature adjustment liquid (Q) (preferably both the treatment liquid (P) and the temperature adjustment liquid (Q) to pass through).

[0114] In addition, as shown in FIG. 17, by using a liquid with a higher density than the treatment liquid (P) as the temperature adjustment liquid (Q), the temperature adjustment liquid (Q) can be prevented from passing through the guide pipe (71).

[0115] FIGS. 18 to 20 are schematic diagrams for explaining an example of a heating method in the first heating zone (Z1) of a guide line (L2). In FIGS. 18 and 19, a temperature control tank (75) is shown through, and a guide pipe (71) located inside the temperature control tank (75) is shown.

[0116] The first heating zone (Z1) may include a portion having a spiral shape among the guide pipes (71) constituting the guide line (L2). In this case, the first heating unit (35) for heating the treatment liquid (P) in the first heating zone (Z1) can be miniaturized, allowing the treatment liquid (P) to be heated efficiently in a limited space.

[0117] The treatment liquid (P) flowing through the guide line (L2) may be protruded by heating in the first heating zone (Z1). When the treatment liquid (P) is protruded, the pressure within the guide pipe (71) constituting the guide line (L2) increases rapidly, which may cause damage to the guide pipe (71).

[0118] In order to prevent damage to the guide pipe (71) caused by the bumps of such treatment liquid (P), the first heating unit (35) may heat the treatment liquid (P) in the first heating zone (Z1) using a high-temperature temperature-regulating liquid (Q) stored in a temperature-regulating tank (75) as shown in FIG. 18, for example.

[0119] The first heating unit (35) shown in FIG. 18 has a temperature control tank (75), a flow path switching unit (74) connected to the temperature control tank (75) through a control liquid supply line (76), and a gas-liquid discharge line (77) connected to the temperature control tank (75). A guide pipe (71) constituting the guide line (L2) penetrates the temperature control tank (75), and a first heating zone (Z1) including a spiral-shaped portion of the guide pipe (71) is located inside the temperature control tank (75). A flow path switching unit (74) is attached to the control liquid supply line (76) connected to the temperature control tank (75), and a temperature control liquid supply unit (72) and a purge gas supply unit (73) are connected to the flow path switching unit (74). The Euro switching unit (74), under the control of the control unit (93), can selectively introduce the temperature adjusting liquid (Q) supplied from the temperature adjusting liquid supply unit (72) and the purge gas (e.g., an inert gas such as nitrogen) supplied from the purge gas supply unit (73) into the inside of the temperature adjusting tank (75). In this way, each of the temperature adjusting liquid supply unit (72) and the purge gas supply unit (73) can be connected to the adjusting liquid supply line (76) through the Euro switching unit (74). Additionally, the temperature adjusting tank (75) is connected to the temperature adjusting liquid supply unit (72) through the gas-liquid discharge line (77).

[0120] For example, when heating the treatment liquid (P) in the first heating zone (Z1), the flow path switching unit (74), under the control of the control unit (93), sends the high-temperature temperature adjustment liquid (Q) supplied from the temperature adjustment liquid supply unit (72) to the temperature adjustment tank (75) through the adjustment liquid supply line (76). As a result, the treatment liquid (P) is heated by the temperature adjustment liquid (Q) inside the temperature adjustment tank (75) in the portion located inside the temperature adjustment tank (75) within the guide line (L2).

[0121] Meanwhile, when the heating of the treatment liquid (P) in the first heating zone (Z1) is stopped, the flow path switching unit (74), under the control of the control unit (93), sends the purge gas supplied from the purge gas supply unit (73) to the temperature adjustment tank (75) through the adjustment liquid supply line (76). As a result, the temperature adjustment liquid (Q) in the temperature adjustment tank (75) is extruded to the gas-liquid discharge line (77) by the purge gas. The temperature adjustment liquid (Q) discharged from the temperature adjustment tank (75) to the gas-liquid discharge line (77) is sent to the temperature adjustment liquid supply unit (72) through the gas-liquid discharge line (77).

[0122] In this manner, with the temperature adjustment liquid (Q) stored in the temperature adjustment tank (75), the flow path switching section (74) introduces a purge gas into the interior of the temperature adjustment tank (75), thereby rapidly discharging the temperature adjustment liquid (Q) from the temperature adjustment tank (75) to the gas-liquid discharge line (77). By rapidly discharging the temperature adjustment liquid (Q) from the temperature adjustment tank (75) using the purge gas, the heating of the treatment liquid (P) in the first heating zone (Z1) can be rapidly stopped. By doing so, the bumping of the treatment liquid (P) in the guide line (L2) (particularly in the first heating zone (Z1) and the vicinity of the first heating zone (Z1)) can be effectively prevented.

[0123] Additionally, as shown in FIG. 19, a relief line (L10) equipped with a relief valve (87) may be connected to a guide line (L2). While the pressure of the processing liquid (P) in the guide line (L2) is less than the set relief pressure of the relief valve (87), the relief valve (87) closes the relief line (L10). Meanwhile, when the pressure of the processing liquid (P) in the guide line (L2) becomes greater than or equal to the set relief pressure of the relief valve (87), the relief line (L10) is opened by the relief valve (87), and the processing liquid (P) flows out from the guide line (L2) to the relief line (L10). By doing so, even if a bump of the processing liquid (P) occurs in the guide line (L2), the pressure within the guide line (L2) is prevented from becoming excessive, thereby preventing damage to the guide pipe (71).

[0124] In addition, the first heating unit (35) may heat the treatment liquid (P) in the first heating zone (Z1) using an electric heater (88) as shown in FIG. 20 instead of the temperature-regulating liquid (Q) stored in the temperature-regulating tank (75). In the example shown in FIG. 20, the electric heater (88) is positioned to penetrate the spiral-shaped portion of the guide pipe (71). By switching the power supply to the electric heater (88) on and off, the heating and non-heating of the treatment liquid (P) in the first heating zone (Z1) can be switched. From the perspective of preventing the treatment liquid (P) from rising, it is desirable that the temperature of the electric heater (88) decreases in a short time when it is switched from a heated state to a non-heated state. For this reason, it is desirable that the electric heater (88) be a heater with a small heat capacity, and for example, a halogen heater can be used as the electric heater (88).

[0125] [Temperature adjustment of the treatment solution]

[0126] When a large amount of processing liquid (P) is stored in the supply tank (37), it is difficult to maintain the temperature of the processing liquid (P) supplied from the supply tank (37) to the supply line (L4) at a desired temperature. In particular, as the amount of processing liquid (P) stored in the supply tank (37) increases, the temperature of the processing liquid (P) is likely to rise or fall below the desired temperature. Meanwhile, in order to stably perform liquid treatment of the substrate (W), it is desirable that the processing liquid (P) in the supply line (L4) be stably adjusted to the desired temperature.

[0127] In order to adjust the temperature of the treatment liquid (P) in the supply line (L4) to a desired temperature, the treatment liquid (P) stored in the supply tank (37) may be adjusted to a temperature higher than the desired temperature, and the treatment liquid (P) in the supply line (L4) may be adjusted to the desired temperature by adding a low-temperature treatment liquid (P). For example, a cooling liquid supply unit that supplies the low-temperature treatment liquid (P) may be provided in at least one of the supply tank (37) and the supply line (L4).

[0128] FIG. 21 is a diagram showing a schematic representation of a first embodiment of a treatment liquid temperature control system.

[0129] In this embodiment, the temperature of the treatment liquid (P) is adjusted by supplying a treatment liquid (P) at a temperature lower than the desired temperature from the cooling liquid supply unit (101) to the supply tank (37). That is, a cooling liquid supply unit (101) for supplying the low-temperature treatment liquid (P) is provided for the supply tank (37). The cooling liquid supply unit (101) shown in FIG. 21 has a cooling treatment liquid supply section (102), a cooling liquid opening / closing valve (103), a cooling flow meter (108), and a cooling liquid filter (104).

[0130] The cooling treatment liquid supply unit (102) supplies a treatment liquid (P) at a temperature lower than the desired temperature to a cooling liquid line (L11) connected to the inside of the supply tank (37). The treatment liquid (P) supplied by the cooling treatment liquid supply unit (102) to the cooling liquid line (L11) may have a temperature lower than the ambient temperature or may have the same temperature as the ambient temperature.

[0131] The coolant opening / closing valve (103) opens and closes the coolant line (L11) under the control of the control unit (93). When the coolant opening / closing valve (103) closes the coolant line (L11), the low-temperature processing liquid (P) sent from the cooling processing liquid supply unit (102) to the coolant line (L11) is not sent to the supply tank (37). Meanwhile, when the coolant opening / closing valve (103) opens the coolant line (L11), the low-temperature processing liquid (P) sent from the cooling processing liquid supply unit (102) to the coolant line (L11) is sent to the supply tank (37).

[0132] The cooling flow meter (108) measures the flow rate of the low-temperature treatment liquid (P) flowing through the cooling liquid line (L11). The measurement result of the cooling flow meter (108) is sent to the control unit (93). The cooling liquid filter (104) removes foreign matter from the treatment liquid (P) while passing it through the cooling liquid line (L11).

[0133] A liquid temperature measuring sensor (105) and a level sensor (106) are installed in the supply tank (37). The liquid temperature measuring sensor (105) measures the temperature of the processing liquid (P) stored in the supply tank (37). The level sensor (106) measures the height of the liquid level of the processing liquid (P) stored in the supply tank (37). The measurement results of the liquid temperature measuring sensor (105) and the level sensor (106) are sent to the control unit (93).

[0134] In addition to the aforementioned guide line (L2), atmosphere opening line (L9), gas line (L3), coolant line (L11), and supply line (L4), a third drain line (L12) is connected to the supply tank (37). The third drain line (L12) is provided with a temperature control shut-off valve (107) and a drain flow meter (109). The temperature control shut-off valve (107) opens and closes the third drain line (L12) under the control of the control unit (93). The drain flow meter (109) measures the flow rate of the treatment liquid (P) flowing through the third drain line (L12). The measurement result of the drain flow meter (109) is sent to the control unit (93).

[0135] The control unit (93) of the present embodiment controls the second heating unit (36) to heat the treatment liquid (P) stored in the supply tank (37) (i.e., the second heating zone (Z2)) so that the temperature of the treatment liquid (P) stored in the supply tank (37) becomes higher than the desired temperature.

[0136] And when the control unit (93) determines from the measurement result of the liquid temperature measurement sensor (105) that the treatment liquid (P) in the supply tank (37) has a temperature higher than the desired temperature, a predetermined amount of treatment liquid (P) is discharged from the supply tank (37) through the third drain line (L12). That is, the control unit (93) controls the temperature control opening / closing valve (107) to open the third drain line (L12) and discharges the high-temperature treatment liquid (P) from the supply tank (37) into the third drain line (L12). When the control unit (93) determines from the measurement result of the drain flow meter (109) that the amount of high-temperature treatment liquid (P) discharged from the supply tank (37) has reached a predetermined amount, it controls the temperature control opening / closing valve (107) to close the third drain line (L12).

[0137] Meanwhile, a low-temperature processing liquid (P) is supplied from the cooling liquid supply unit (101) to the supply tank (37) through the cooling liquid line (L11). That is, the control unit (93) controls the cooling liquid opening / closing valve (103) to open the cooling liquid line (L11) and supplies the low-temperature processing liquid (P) from the cooling liquid supply unit (101) to the supply tank (37). For example, when the second heating unit (36) heats the processing liquid (P) in the second heating zone (Z2) to a first temperature, the cooling liquid supply unit (101) supplies the processing liquid (P) at a second temperature lower than the first temperature to the supply tank (37). When the control unit (93) determines from the measurement result of the cooling flow meter (108) that the supply amount of low-temperature processing liquid (P) to the supply tank (37) has reached a predetermined amount, it controls the cooling liquid opening / closing valve (103) to close the cooling liquid line (L11).

[0138] In this way, by discharging the high-temperature treatment liquid (P) from the supply tank (37) and supplying the low-temperature treatment liquid (P) to the supply tank (37), the temperature of the treatment liquid (P) sent from the supply tank (37) to the supply line (L4) can be stably adjusted to a desired temperature.

[0139] Additionally, the amount of treatment liquid (P) discharged from the supply tank (37) through the third drain line (L12) may be the same as or different from the amount of treatment liquid (P) supplied to the supply tank (37) through the cooling liquid line (L11). Additionally, the amount of treatment liquid (P) discharged from the supply tank (37) through the third drain line (L12) may be a predetermined fixed amount or an amount that can be determined based on the measurement result of the liquid temperature measurement sensor (105). The amount of treatment liquid (P) supplied to the supply tank (37) through the cooling liquid line (L11) may be a fixed amount, an amount that can be determined based on the amount of treatment liquid (P) discharged from the supply tank (37), or an amount that can be determined based on the measurement result of the liquid temperature measurement sensor (105).

[0140] FIG. 22 is a diagram showing a schematic representation of a second embodiment of a treatment liquid temperature control system.

[0141] In this embodiment, the temperature of the treatment liquid (P) is adjusted by supplying a treatment liquid (P) at a temperature lower than the desired temperature from the cooling liquid supply unit (101) to the supply line (L4). That is, the cooling liquid line (L11) is connected to the supply line (L4) instead of the supply tank (37), and the cooling liquid supply unit (101) supplies the low-temperature treatment liquid (P) to the supply line (L4) through the cooling liquid line (L11).

[0142] The other configuration is the same as the first embodiment described above (see FIG. 21).

[0143] In this embodiment, a low-temperature treatment liquid (P) introduced into the supply line (L4) through a cooling liquid line (L11) is mixed with a high-temperature treatment liquid (P) introduced into the supply line (L4) from a supply tank (37), and the treatment liquid (P) in the supply line (L4) is adjusted to a desired temperature.

[0144] The amount of low-temperature processing liquid (P) supplied from the cooling liquid supply unit (101) to the supply line (L4) is determined based on the temperature and amount of processing liquid (P) flowing from the supply tank (37) to the supply line (L4). The control unit (93) obtains the "temperature of the processing liquid (P) flowing from the supply tank (37) to the supply line (L4)" from the measurement result of the liquid temperature measurement sensor (105), and obtains the "temperature of the processing liquid (P) flowing from the supply tank (37) to the supply line (L4)" from the measurement result of the flow meter (62). Based on the measurement result of the liquid temperature measurement sensor (105) and the measurement result of the flow meter (62), the control unit (93) determines the "amount of low-temperature processing liquid (P) to be supplied from the cooling liquid supply unit (101) to the supply line (L4)." Then, based on the measurement result of the cooling flow meter (108), the amount of low-temperature processing liquid (P) supplied from the cooling liquid supply unit (101) to the supply line (L4) is monitored, and the cooling liquid opening / closing valve (103) is controlled so that the determined amount of low-temperature processing liquid (P) flows into the supply line (L4).

[0145] In addition, to suppress temperature non-uniformity of the treatment liquid (P) in the supply line (L4), it is desirable to stir the treatment liquid (P).

[0146] Specifically, by stirring the treatment liquid (P) in the supply line (L4), temperature non-uniformity of the treatment liquid (P) in the supply line (L4) can be suppressed. For example, as shown in FIG. 23, by installing a stirring body (116) (stirring part) inside the supply pipe (115) constituting the supply line (L4), the treatment liquid (P) is stirred by the stirring body (116) while flowing through the supply line (L4). The specific shape of the stirring body (116) is not limited, and, for example, the stirring body (116) can be formed by a static mixer.

[0147] In addition, by stirring the treatment liquid (P) in the supply tank (37), temperature non-uniformity of the treatment liquid (P) in the supply tank (37) and the supply line (L4) can be suppressed. For example, as shown in FIG. 24, the treatment liquid (P) in the supply tank (37) can be stirred by a pressurizing gas (N) supplied from a pressurizing device (38) through a gas line (L3). In the example shown in FIG. 24, while one end (stirring part) of the gas line (L3) is located in the treatment liquid (P) in the supply tank (37), the pressurizing gas (N) is ejected from that end.

[0148] In addition, temperature non-uniformity of the treatment liquid (P) in the supply line (L4) can be suppressed by reducing the height (i.e., vertical size) of the supply tank (37) or by reducing the width (i.e., horizontal size) of the supply tank (37). For example, as shown in FIG. 25, the height of the supply tank (37) may be reduced and the width increased while providing a second heating section (36) to surround the supply tank (37) from the upward, downward, and horizontal directions. In this case, the portion of the treatment liquid (P) stored in the supply tank (37) that is far from the second heating section (36) can be reduced, thereby preventing uneven heating of the treatment liquid (P).

[0149] In addition, if the temperature of the treatment liquid (P) in the supply tank (37) is prone to changing due to the influence of the ambient temperature, it becomes difficult to stably maintain the temperature of the treatment liquid (P) sent from the supply tank (37) to the supply line (L4) at a desired temperature. Therefore, it is desirable for the supply tank (37) to have a structure in which the temperature of the treatment liquid (P) in the supply tank (37) is less susceptible to the influence of the ambient temperature.

[0150] For example, as shown in FIG. 26, the supply tank (37) may have an insulating section (37c), and heat transfer and heat transfer between the treatment liquid (P) inside the supply tank (37) and the surroundings of the supply tank (37) may be reduced by the insulating section (37c). The supply tank (37) shown in FIG. 26 has an inner structure (37a) in which the treatment liquid (P) is stored on the inside, an outer structure (37b) provided on the outside of the inner structure (37a), and an insulating section (37c) provided between the inner structure (37a) and the outer structure (37b). The insulating section (37c) exhibits a value that makes it difficult to transfer heat, for example, with respect to at least 1 of the thermal conductivity, thermal diffusivity, thermal diffusion coefficient, and heat transfer coefficient, compared to the inner structure (37a). The insulating part (37c) may be composed of any gas, liquid and / or solid, and may be composed of the same gas as the gas (e.g., air) surrounding the supply tank (37). The supply tank (37) shown in FIG. 26 is integrally formed with the second heating part (36), and the second heating part (36) is attached to the inner structure (37a).

[0151] It should be noted that the embodiments disclosed in this specification are merely illustrative in all respects and are not to be interpreted restrictively. The aforementioned embodiments and variations may be omitted, substituted, and modified in various forms without departing from the appended claims and their intent. For example, the aforementioned embodiments and variations may be combined, and embodiments other than those described above may be combined with the aforementioned embodiments or variations.

[0152] Furthermore, the technical categories for embodying the aforementioned technical concept are not limited. For example, it may be applied to other devices of the aforementioned substrate liquid processing device. Additionally, the aforementioned technical concept may be embodied by a computer program for executing one or more sequences (steps) included in the aforementioned substrate liquid processing method on a computer. Furthermore, the aforementioned technical concept may be embodied by a computer-readable, non-transitory recording medium on which such a computer program is recorded.

Claims

Claim 1 A device for supplying a processing liquid supplied from a processing liquid source to a nozzle, comprising a storage line provided with a storage shut-off valve, and a storage unit that supplies the processing liquid from the processing liquid source through the storage line and supplies the processing liquid to the nozzle through a guide line, wherein the storage unit comprises a plurality of storage tanks, a storage pressurizing unit that pressurizes the inside of the plurality of storage tanks, a circulation line that connects the plurality of storage tanks to each other, and a shut-off valve provided in the circulation line, wherein a guide shut-off valve is provided in the guide line, and a circulation control mechanism that circulates the processing liquid between the plurality of storage tanks through the circulation line comprises the storage pressurizing unit, the shut-off valve, and the guide shut-off valve, wherein the plurality of storage tanks include a first storage tank and a second storage tank, and the circulation line includes a first circulation line and a second circulation line connected to the first storage tank and the second storage tank, wherein the processing liquid sent from the processing liquid source through the storage line A device in which a treatment liquid is supplied to the first storage tank, the first circulation line guides the treatment liquid from the first storage tank to the second storage tank, and the second circulation line guides the treatment liquid from the second storage tank to the first storage tank. Claim 2 In claim 1, the device is provided with a circulation filter in the circulation line to remove foreign matter from the processing liquid. Claim 3 In paragraph 1 or 2, the guide line is a device connected to the first storage tank. Claim 4 A method for supplying a treatment liquid supplied from a treatment liquid source to a nozzle comprises a process in which the treatment liquid is supplied from the treatment liquid source to a storage unit through a storage line provided with a storage shut-off valve, and a process in which the treatment liquid is supplied from the storage unit to the nozzle through a guide line. The storage unit comprises a plurality of storage tanks, a storage pressurizing unit that pressurizes the inside of the plurality of storage tanks, a circulation line connecting the plurality of storage tanks to each other, and a shut-off valve provided in the circulation line. A guide shut-off valve is provided in the guide line. A circulation control mechanism for circulating the treatment liquid between the plurality of storage tanks through the circulation line comprises the storage pressurizing unit, the shut-off valve, and the guide shut-off valve. The plurality of storage tanks comprises a first storage tank and a second storage tank. The circulation line comprises a first circulation line and a second circulation line connected to the first storage tank and the second storage tank. The treatment liquid is sent from the treatment liquid source through the storage line. A method in which the above-mentioned treatment liquid is supplied to the first storage tank, the first circulation line guides the treatment liquid from the first storage tank to the second storage tank, and the second circulation line guides the treatment liquid from the second storage tank to the first storage tank. Claim 5 delete

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