Substrate holding apparatus, exposure apparatus, and article manufacturing method

KR103020460B1Active Publication Date: 2026-09-16CANON KK
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
KR1020240045109
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-04-28
Filing Date
2024-04-03
Publication Date
2026-09-16
Estimated Expiration
2044-04-03

Smart Images

  • Figure 112024036962400-PAT00013_ABST
    Figure 112024036962400-PAT00013_ABST
Patent Text Reader

Abstract

A substrate holding support device provided in an exposure device for exposing a substrate, comprising a base for holding and supporting the substrate, a lifting part capable of being raised and lowered through an opening of the base, a shielding part for shielding the opening, and a driving part for driving the shielding part, wherein the driving part positions the shielding part at a position where the shielding part shields the opening while the substrate is being exposed.
Need to check novelty before this filing date? Find Prior Art

Description

Technology Field

[0001] The present invention relates to a substrate holding support device, an exposure device, and a method for manufacturing an article. Background Technology

[0002] When manufacturing devices such as semiconductor devices or liquid crystal display devices using photolithography technology, an exposure device is used to project a pattern from a mask onto a substrate via a projection optical system to transfer the pattern. The device manufacturing process includes a process of applying a resist to a substrate, a process of transferring a pattern onto the substrate by exposure, and a process of developing the substrate on which the pattern has been transferred. Generally, the processes of applying a resist to a substrate and developing the substrate on which the pattern has been transferred are performed using a coater or developer, which is different from the exposure device that transfers the pattern onto the substrate by exposure.

[0003] In this manner, during the device manufacturing process, the device is manufactured while transferring substrates between different devices. Each device is provided with a substrate holding and supporting device for holding and supporting the substrate by means of adsorption or the like, and for transferring the substrate. Generally, the substrate holding and supporting device includes a base for holding and supporting the substrate and a substrate lifting mechanism, such as a lift pin for lifting and lowering the substrate.

[0004] Here, a gap is created between the base provided at the bottom of the substrate and the substrate lifting mechanism. Consequently, the substrate has an area where the base or the substrate lifting mechanism is positioned at the bottom and an area where they are not positioned. Recently, it has become common practice to manufacture devices using transparent substrates through which exposure light passes. When exposure is performed on a transparent substrate, the exposure light transmitted through the substrate is reflected by the base or the substrate lifting mechanism, and the reflected light sensitizes the resist coated on the substrate. Due to the gap provided in the base, a difference in the amount of light irradiated onto the resist may occur, which may result in non-uniformity of exposure on the substrate. Patent Document 1 discloses a method for reducing the difference in the amount of light irradiated onto the resist by providing a reflective member with a higher reflectivity than the base at the bottom of the gap. Prior art literature

[0005] Japanese Patent Publication No. 2019-211755 The problem to be solved

[0006] The method of Patent Document 1 is based on the premise that the reflectance of the substrate lifting mechanism is equal to the reflectance of the base. However, selecting the material of the base or the substrate lifting mechanism to prevent exposure non-uniformity may reduce the degree of freedom of design.

[0007] Accordingly, the present invention aims to provide a substrate holding support device that is advantageous for reducing exposure non-uniformity. means of solving the problem

[0008] To achieve the above objective, a substrate holding support device as one aspect of the present invention is a substrate holding support device provided in an exposure device for exposing a substrate, and comprises a base for holding and supporting the substrate, a lifting part capable of being raised and lowered through an opening of the base, a shielding part for shielding the opening, and a driving part for driving the shielding part, wherein the driving part is characterized by positioning the shielding part at a position where the shielding part shields the opening while the substrate is being exposed.

[0009] Further features of the present invention will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Effects of the invention

[0010] According to the present invention, a substrate holding support device advantageous for reducing exposure non-uniformity can be provided. Brief explanation of the drawing

[0011] Figure 1 is a schematic diagram of an exposure apparatus. Figure 2 is a schematic diagram of a substrate holding support device. Figure 3 is a drawing illustrating an example of an expectation in a substrate holding support mechanism. Figure 4 is a drawing illustrating an example of an expectation in a substrate holding support mechanism. Figure 5 is a drawing illustrating an example of an expectation in a substrate holding support mechanism. Figure 6 is a schematic diagram explaining the mechanism of exposure non-uniformity. Figure 7 is a diagram illustrating the relationship between the wavelength of light and the transmittance in a photosensitive material. FIG. 8 is a drawing illustrating the configuration of a substrate holding support device in a first embodiment. FIG. 9 is a drawing illustrating the configuration of a substrate holding support device in a second embodiment. Figure 10 is a flowchart of a method for manufacturing an article. Specific details for implementing the invention

[0012] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings. In addition, in each drawing, the same reference numerals are used for identical components, and redundant descriptions are omitted.

[0013] <First Embodiment>

[0014] The substrate holding support device in this embodiment is suitable for holding and supporting transparent substrates such as sapphire substrates or glass substrates. Sapphire substrates can be used as substrates for LED (Light Emitting Diode) elements, etc. Glass substrates can be used as substrates for liquid crystal panels, etc.

[0015] FIG. 1 is a schematic diagram illustrating the configuration of an exposure device (1) as one aspect of the present embodiment. The exposure device (1) is used to form a pattern on a substrate. The exposure device (1) includes a light source device (100) including an exposure light source (110), an illumination optical system (200) that illuminates a disc (310), and a disc stage (300) that holds and supports the disc (310). Additionally, the exposure device (1) includes a projection optical system (400) that projects an image of the pattern of the disc (310) onto a substrate (510) held and supported on a substrate holding and supporting device (500).

[0016] As a light source (110), a high-pressure mercury lamp or an excimer laser may be used. In addition, as a general exposure light, g-lines (wavelength approximately 436 nm) or near-ultraviolet light with a wavelength range of 100 nm to 400 nm may be used. For example, g-lines or i-lines (wavelength approximately 365 nm) of an ultra-high-pressure mercury lamp, KrF excimer laser light (wavelength approximately 248 nm), ArF excimer laser light (wavelength approximately 193 nm), F2 laser light (wavelength approximately 157 nm) may be used.

[0017] Light irradiated from a light source (110) is guided to a plate (310) through an optical system (210) included in an illumination optical system (200). A projection optical system (400) includes an optical system (410) and an aperture diaphragm (420) and projects a pattern of the plate (310) onto a substrate (510) at a predetermined projection magnification. A photosensitive material (resist) having sensitivity to light of a specific wavelength is coated on the substrate (510), so that when an image of the pattern of the plate (310) is projected onto the resist, a latent image pattern is formed on the resist.

[0018] The substrate (510) is held and supported by a substrate holding support device (500). The substrate holding support device (500) holds and supports the substrate (510) by means of vacuum adsorption or electrostatic adsorption using an adsorption pad not shown. The detailed configuration of the substrate holding support device (500) will be described later.

[0019] In this embodiment, the exposure device (1) is a scanning type exposure device (scanner) that transfers a pattern of the original plate (310) to the substrate (510) while scanning the original plate (310) and the substrate (510) in a scanning direction in sync with each other. Hereinafter, the vertical direction is defined as the Z-axis direction, the scanning direction of the substrate (510) within a plane perpendicular to the Z-axis direction is defined as the Y-axis direction, and the non-scanning direction perpendicular to the Z-axis direction and the Y-axis direction is defined as the X-axis direction.

[0020] The amount of light (exposure amount) projected onto the substrate (510) by the projection optical system (400) is an important factor in determining the line width of the pattern, and by exposing the resist on the substrate (510) with an appropriate amount of exposure, it becomes possible to form a pattern with high precision. For example, when the same pattern is repeatedly formed in the pattern forming area on the substrate (510), it is desirable to perform exposure so that exposure non-uniformity does not occur across the entire pattern forming area. Although it is possible to reduce the non-uniformity of the amount of exposure projected onto the substrate (510) by devising the configuration of the illumination optical system (200) or the projection optical system (400), so-called flare light may be irradiated onto the resist on the substrate (510), causing non-uniformity in the amount of light incident on the resist. Here, among the light that passes through the original plate (310), the light that passes through the optical system (410) included in the projection optical system (400) and the aperture of the aperture diaphragm (420) and is irradiated onto the resist on the substrate (510) is called normal light, and the light other than this normal light is flare light.

[0021] (Regarding the occurrence of exposure non-uniformity)

[0022] Using FIGS. 2 to 6, the causes of exposure non-uniformity in the exposure apparatus will be explained. FIG. 2 is a schematic diagram illustrating a substrate holding support device (500). FIG. 2 (A) is a diagram illustrating a state in which a substrate (510) is held and supported by the substrate holding support device (500). Additionally, the substrate lifting mechanism (522) is housed in the opening of the base (521). FIG. 2 (B) is a diagram illustrating a state in which the substrate (510) is lifted in the Z-axis direction by the substrate lifting mechanism (522). The substrate (510), while separated from the substrate holding support device (500) by the substrate lifting mechanism (522), can be transported by a substrate transport device, such as a transport robot not shown.

[0023] In FIG. 2 (A), the substrate holding support device (500) vacuum-adsorbs the substrate (510) using an adsorption pad not shown, which is positioned between the base (521) and the substrate (510). The adsorption pad is provided on the upper surface of the base (521). Furthermore, the method of holding and supporting the substrate (510) is not limited to vacuum adsorption, but may be configured to hold and support the substrate (510) by, for example, electrostatic adsorption. When exposure is performed on the substrate (510), the substrate (510) is held and supported by the base (521), as shown in FIG. 2 (A).

[0024] The substrate lifting mechanism (522) includes a lifting part (522B) that is movable in the Z-axis direction and driven in the Z-axis direction, and a contact part (522C) that contacts the substrate (510). In particular, the surface of the contact part (522C) that contacts the substrate (510) is referred to as the upper surface (522A). Since the contact part (522C) contacts the substrate (510), the material of the contact part (522C) can be determined by considering that it is difficult to cause scratches on the substrate (510) or to be difficult to wear out due to contact with the substrate (510). For example, the contact part (522C) may include a resin material having wear resistance.

[0025] Next, the arrangement relationship between the support (521) and the substrate lifting mechanism (522) will be explained using FIGS. 3 to 5. FIG. 3 illustrates an example in which the support (521) constituting the substrate holding support device (500) in the XY plane is divided into a plurality (eight in FIG. 3) of substrate holding support members, and an opening is provided between each substrate holding support member. Substrate holding support members (521a, b, c, d) are arranged on the positive side of the Y-axis direction, and substrate lifting mechanisms (522a, b, c) are provided in their openings. Additionally, substrate holding support members (521e, f, g, h) are arranged on the negative side of the Y-axis direction, and substrate lifting mechanisms (522d, e, f) are provided in their openings. FIG. 3 shows an example in which a lift bar is arranged as the substrate lifting mechanism.

[0026] In FIG. 4, the support (521) is divided into substrate holding support parts (521a', b', c', d'). A substrate lifting part (522a', b', c', d') is provided in each of the substrate holding support parts. Additionally, a substrate lifting mechanism (522e') is provided in the opening between the substrate holding support parts (521a' and 521b'), and a substrate lifting mechanism (522f') is provided in the opening between the substrate holding support parts (521c' and 521d'). FIG. 4 shows an example in which a lift bar is arranged as a substrate lifting mechanism.

[0027] In FIG. 5, the base (521) is divided into substrate holding support parts (521a'', b'', c'', d'', e'', f''). Each substrate holding support part is provided with an opening (through hole), and a substrate lifting mechanism (522) (lift pin) that moves inside the through hole in the Z-axis direction is installed. As such, the substrate lifting mechanism (522) may be of the lift bar type shown in FIG. 3 or FIG. 4, or may be of the lift pin type shown in FIG. 5. In any case, the substrate lifting mechanism constituting the substrate lifting mechanism (522) is positioned in the opening provided in the base (521). And as described using FIG. 3 to FIG. 5, an opening is provided between the substrate holding support parts or between the substrate holding support part and the substrate lifting mechanism, and the exposure light passing through this opening may be a cause of exposure non-uniformity.

[0028] Next, the mechanism by which exposure non-uniformity occurs is explained using FIG. 6. FIG. 6 is an enlarged view of the substrate holding support device (500) of FIG. 2. FIG. 6 illustrates an aspect in which exposure light is irradiated onto a resist (511) coated on a substrate (510). A light ray (10) incident on the resist (511) from the space above the stand (521) passes through the resist (511) and the substrate (510) and is reflected on the upper surface (521A) of the stand (521). A light ray (12) incident on the resist (511) from the space above the substrate lifting mechanism (522) passes through the resist (511) and the substrate (510) and is reflected from the upper part of the substrate lifting mechanism (522). Meanwhile, a light ray (11) incident on the resist (511) from the upper part of the opening between the support (521) and the substrate lifting mechanism (522) passes through the resist (511) and the substrate (510).

[0029] Here, a portion of the exposure light incident on the resist (511) is absorbed by the resist (511). Depending on the wavelength of the exposure light or the optical properties of the resist (511), the absorption rate or transmittance of the light varies. The transmittance of the exposure light to the resist is calculated as follows.

[0030] First, if light is treated as a one-dimensional plane wave propagating in the Z direction, the amplitude E(Z, t) of the plane wave at time t is,

[0031] E(Z, t)=E0exp[i(kZ-ωt)]

[0032] It is expressed as follows. k is the wavenumber, and ω is the frequency. Using the complex refractive index N, the frequency ω is,

[0033]

[0034] It is represented as such, and the amplitude E(Z, t) can be expressed as follows.

[0035]

[0036] Also, from ω=2πc / λ

[0037]

[0038] It becomes.

[0039] In addition, since the light energy I(Z, t) is obtained from the norm of the square of the amplitude E(Z, t) or the square of the norm of the amplitude E(Z, t),

[0040]

[0041] It is displayed as.

[0042] Here, if we calculate the light transmittance T,

[0043]

[0044] It becomes.

[0045] According to the transmittance T calculated in this way, the light rays passing through the resist (511) pass through the substrate (510) and reach the upper part of the stand (521) or the substrate lifting mechanism (522). FIG. 7 is a diagram illustrating an example of the relationship between the wavelength and transmittance of light in a specific resist (photosensitive material). In an exposure device using a mercury lamp, i-line (wavelength approximately 365 nm), h-line (wavelength approximately 405 nm), g-line (wavelength approximately 436 nm), etc., are used as exposure light. In FIG. 7, the transmittance for the i-line is denoted as Ti, the transmittance for the h-line as Th, and the transmittance for the g-line as Tg. As shown in FIG. 7, it can be seen that the transmittance value differs for each wavelength.

[0046] Light reaching the upper part of the device (521) or the substrate lifting mechanism (522) is reflected by specular reflection and diffuse reflection on the reflective surface. Specular reflection is a reflection in which the angle of reflection is determined by the angle of light incident on the reflective surface, and generally, the angle of incidence and the angle of reflection of the light are equal. Diffuse reflection is a reflection that does not depend on the angle of incidence of light incident on the reflective surface, and the intensity of the light reflected at an angle θ from the perpendicular of the reflective surface depends on cosθ. Diffuse reflection is also called Lambertian reflection.

[0047] Light that is specularly reflected or diffusely reflected from the upper surface of the base (521) or the substrate lifting mechanism (522) can pass through the substrate (510) and then be incident on the resist (511) as flare light. Meanwhile, the light shown as a ray (11) in FIG. 6 is incident on the opening between the base (521) and the substrate lifting mechanism (522), and most of it is attenuated without being incident on the resist (511) again.

[0048] As described above, on the substrate (510), there are areas where a lot of flare light is generated and areas where almost no flare light is generated. As described above, flare light is generated according to the reflection characteristics of the upper surface of the base (521) or the substrate lifting mechanism (522), and it is difficult to sufficiently reduce the flare light. Since the amount of flare light incident on the resist (511) differs for each area on the substrate (510), exposure non-uniformity occurs as a result.

[0049] (Regarding the method for reducing exposure non-uniformity in the present embodiment)

[0050] Next, a method for reducing exposure non-uniformity using FIG. 8 will be described. FIG. 8 is a drawing illustrating the detailed configuration of the AA cross-section of FIG. 5. A substrate holding support device (500) has a base (521), a substrate lifting mechanism (522) (lifting part), a shutter (600) (shielding part), a rack (601), a gear (602), a rack (603), and a spring (604) (elastic member). The rack (601) may include a first uneven part (601a). The substrate lifting mechanism (522) is provided below the opening of the base (521) and is configured to be able to be raised and lowered through the opening of the base (521) (configured to cross the opening by rising). The gear (602) may be composed of a plurality of gears and may include gears (602a to 602c). The gear (602) may be single. The rack (603) may include a second uneven portion (603a). The gear (602) is a member that drives the shutter (600) in the X direction (or Y direction) in conjunction with the driving of the substrate lifting mechanism (522) in the Z direction, and is also referred to as a driving part.

[0051] In FIG. 8, the aforementioned exposure non-uniformity can be reduced by providing a shutter (600) at the bottom of the base (521) to block an opening (through hole) provided in the base (521). Additionally, the opening may be a space between the walls of the base. The upper surface of the shutter (600) has a reflectance such that the difference between the amount of light reflected by the upper surface of the base (521A) and reaching the first resist area above the base (521) and the amount of light reflected by the upper surface of the shutter (600) and reaching the second resist area above the shutter (600) is reduced. At this time, the reflectance is set so that the difference in the amount of light is reduced compared to the case where the shutter (600) is not positioned to block the opening. In addition, when the shutter (600) closes the opening, the exposure light is not incident on the substrate lifting mechanism (522), so the material can be selected without considering the reflectivity of the substrate lifting mechanism (522).

[0052] The operation of the shutter (600) is described below. The shutter (600) needs to reduce exposure non-uniformity by closing the opening during exposure, and when moving the substrate (510) in and out, it needs to open a through hole so that the substrate lifting mechanism (522) can be driven in the Z-axis direction. Figure 8 (A) is a diagram showing the state of the shutter (600) and the substrate lifting mechanism (522) during the exposure operation. The substrate lifting mechanism (522) is in a standby state at the bottom of the stand (521), and the shutter (600) is positioned in a second position to close (block) the opening. The second position is preferably a position where the shutter (600) completely closes the opening, but it is sufficient if it is a position where the opening is closed (blocked) by more than half.

[0053] Figure 8 (A) is typically a state in which a substrate (510) is exposed, and the driving unit places the shutter (600) (shielding unit) at a position where the shutter (600) covers the opening while the substrate (510) is being exposed.

[0054] In this embodiment, the shutter (600) can be driven by the driving force generated in the driving unit in conjunction with the lifting of the substrate lifting mechanism (522). For example, the substrate lifting mechanism (522) and the shutter (600) may be connected by a rack (601) and a gear (602) installed on the substrate lifting mechanism (522), and a rack (603) installed on the shutter (600) side. At this time, the configuration is such that the driving force of the substrate lifting mechanism (522) is transmitted to the shutter (600). The shutter (600) is configured to receive force in the direction (-X direction) that closes the opening by means of a spring (604), but as described above, by connecting the rack and the pin, the uneven surface of the lower part of the shutter (600) is engaged with the rack (603), thereby positioning the shutter (600).

[0055] In this embodiment, the driving unit may include a gear (602a) (first gear) arranged in a catch-and-tightened portion (601a) provided in the substrate lifting mechanism (522) (lifting unit). It may also include a gear (602c) (second gear) arranged in a catch-and-tightened portion (603a) provided in the rack (603) of the shutter (600) (shielding unit). Furthermore, the shutter (600) (shielding unit) is driven by the driving force generated in conjunction with the lifting of the substrate lifting mechanism (522) through the gear (602a), gear (602b), and gear (602c). Additionally, the configuration of the actuator not illustrated for lifting the substrate lifting mechanism (522) is not specified, but may be, for example, an air cylinder or a linear motor.

[0056] FIG. 8 (B) is a diagram illustrating the state of the shutter (600) and the substrate lifting mechanism (522) when the substrate (510) is being moved in and out (i.e., the state in which no exposure operation is being performed). The substrate lifting mechanism (522) is driven in the Z-axis direction from the state shown in FIG. 8 (A). The driving force of the substrate lifting mechanism (522) is transmitted from the rack (601) to the gear (602) and rack (603), and the shutter (600) is driven in the -X direction. That is, the gear (602) (driving part) drives the shutter (600) from a position that blocks the opening to a position that does not block it, in conjunction with the rise of the substrate lifting mechanism (522). By doing so, the substrate lifting mechanism (522) can hold and support (raise from the stand (521)) the substrate (510) without interfering with the shutter (600).

[0057] In Fig. 8 (B), the spring (604) is in a contracted state, and the shutter (600) is in a stopped state by receiving force in the -X direction, so that the shutter (600) is positioned in a first position. The first position is preferably a position where the shutter (600) does not block the opening at all, but it may also be a position where the amount of blocking the opening is less than half so as not to interfere with the substrate lifting mechanism (522) in a raised state. The shutter (600) can maintain and support the open state of the opening without receiving power from the substrate lifting mechanism (522). In addition, the spring (604) and the actuator that raises the substrate lifting mechanism (522) can be configured so that the force of the spring (604) is smaller than the driving force of the actuator that raises the substrate lifting mechanism (522) which is not shown.

[0058] When the substrate lifting mechanism (522) descends to a standby position from the state of (B) in FIG. 8, the rack (601) and the gear (602) engage at the position where the substrate lifting mechanism (522) has descended to a position where it does not interfere even when the shutter (600) is driven in the direction (X direction) to close the opening. Then, the shutter (600) is driven in the direction of closure to close the opening. That is, the gear (602) (driving unit) drives the shutter (600) from a position where the opening is not covered to a position where it is covered, in conjunction with the descent of the substrate lifting mechanism (522). FIG. 8 (B) is typically a state in which the substrate (510) is received by the substrate lifting mechanism (522) after being transported by an external transport hand, and the driving unit places the shutter (600) at a position where the shutter (600) (covering unit) does not cover the opening. This is to prevent the shutter (600) from interfering with the substrate lifting mechanism (522). If the shutter (600) (shielding part) is positioned to cover the opening while the substrate lifting mechanism (522) is raised, the substrate lifting mechanism (522) and the shutter (600) will interfere with each other.

[0059] In this embodiment, the driving unit drives the shutter (600) so that when the substrate lifting mechanism (522) (lifting unit) is in a raised state, the shutter (600) (shielding unit) is positioned in a first position where the shutter (600) (shielding unit) does not shield the opening. Additionally, when the substrate lifting mechanism (522) (lifting unit) is in a lowered state, the shutter (600) (shielding unit) is positioned in a second position where the shutter (600) (shielding unit) shields the opening. The state in which the substrate lifting mechanism (522) (lifting unit) is raised is typically a state in which the upper surface of the substrate lifting mechanism (522) is higher than the upper surface of the base (521). The state in which the substrate lifting mechanism (522) (lifting unit) is lowered is typically a state in which the upper surface of the substrate lifting mechanism (522) is lower than the upper surface of the base (521).

[0060] In this embodiment, the substrate lifting mechanism (522) may have a circular lift pin on the surface that holds and supports the substrate, or a bar-shaped lift bar on the surface that holds and supports the substrate. Additionally, although the above description describes a form in which a rack and a pin are used as the driving unit, the shutter (600) may be driven by the control unit depending on the position of the substrate lifting mechanism (522). In this embodiment, the shutter (600) is driven in a horizontal direction.

[0061] Additionally, the upper surface (reflective surface) of the shutter (600) may be a uniform reflective surface, or the reflectance may be set to further reduce exposure non-uniformity. For example, the shutter (600) may be designed so that the reflectance at the end of the shutter (600) is greater than the reflectance at the center of the shutter (600). This design takes into account diffuse reflection, and is designed so that the exposure light reflected by the shutter (600) is reduced near the end of the opening compared to the center of the opening. That is, the opening is the space between the walls of the base (521), and when the shutter (600) is placed in a second position, the first part of the shutter (600) may be designed so that the reflectance of the second part of the shutter (600), which is closer to the wall than the first part, is lower.

[0062] From the above, by providing a shutter (600) with adjusted reflectance at the opening of the expectation (521), the difference in light intensity in each area that occurs when the substrate lifting mechanism (522) is exposed can be reduced, thereby effectively reducing exposure non-uniformity.

[0063] <Second Embodiment>

[0064] In this embodiment, an example is described in which the upper surface of the shutter is at a height position equivalent to the upper surface of the base. Furthermore, the basic configuration of the substrate holding support device is omitted from the description as it is the same as that of the first embodiment. Additionally, matters not mentioned in this embodiment shall follow the first embodiment. Furthermore, the position at a height equivalent to the base may be, for example, a position within 30 mm.

[0065] The shutter (600) of the present embodiment will be described with reference to FIG. 9. FIG. 9 is a cross-sectional view AA of FIG. 5. FIG. 9 (A) is a diagram illustrating the state of the shutter (600) and the substrate lifting mechanism (522) during an exposure operation, and FIG. 9 (B) is a diagram illustrating the state of the shutter (600) and the substrate lifting mechanism (522) when the substrate (510) is loaded and loaded. In the present embodiment, the shutter (600) is characterized by having two axes of actuators in the Z-axis direction and the X-axis direction. In addition, the shape of the shutter (600) may be configured to embed (block) the opening. Furthermore, by providing two axes of actuators, it becomes possible for the upper surface of the shutter (600) and the upper surface of the stand (521) to be positioned at the same height. As a result, although the driving of the shutter (600) becomes more complex compared to the first embodiment, it becomes easier to reduce exposure non-uniformity compared to the first embodiment. In addition, since there is a risk that the upper surface of the shutter (600) may come into contact with the substrate (510), it is desirable for the shutter (600) to have a reflectivity equal to that of the base (521) and, in addition, to have a wear resistance equal to that of the base (521). In addition, the reflectivity equal to that may be, for example, a reflectivity of 3% or less. In addition, the shutter (600) may be driven along one axis in the inclined direction. That is, in this embodiment, the shutter (600) can be driven in a direction including a horizontal component.

[0066] <Effective form of method of manufacturing an article>

[0067] The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, or optical elements. FIG. 10 is a flowchart of the method for manufacturing an article according to the present embodiment. The method for manufacturing an article according to the present embodiment includes a process (exposure process, step S11) of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the exposure device (1) to obtain an exposed substrate. In addition, the method includes a process (development process, step S12) of developing the substrate exposed in this process to obtain a developed substrate. Furthermore, the manufacturing method includes other well-known processes (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing process, step S13). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0068] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof. The scope of application of the present invention may, for example, be a substrate holding support device of a substrate processing device of a device involving exposure (electron beam lithography device, inspection device, UV curing device, etc.). Explanation of the symbols

[0069] 500: Substrate holding support device 510: Substrate 521: Expectation 522: Board lifting mechanism (lifting unit) 600: Shutter (shield) 602: Gear (drive unit)

Claims

Claim 1 A substrate holding support device provided in an exposure device for exposing a substrate, comprising a base for holding and supporting the substrate, a lifting part capable of being raised and lowered through an opening of the base, a shielding part that shields the opening, and a driving part that drives the shielding part, wherein the driving part drives the shielding part in a direction including a horizontal component so as to be positioned from a position where the shielding part does not shield the opening to a position where the shielding part shields the opening in conjunction with the lowering of the lifting part. Claim 2 A substrate holding support device according to claim 1, wherein the driving unit places the shielding unit at a first position where the shielding unit does not shield the opening when the upper surface of the lifting unit is higher than the upper surface of the support, and places the shielding unit at a second position where the shielding unit shields the opening while the substrate is being exposed. Claim 3 A substrate holding support device according to paragraph 2, wherein the driving unit places the shielding unit at the second position when the upper surface of the lifting unit is lower than the upper surface of the support. Claim 4 A substrate holding support device according to claim 1, wherein the shielding part is driven by a driving force generated in the driving part in conjunction with the lifting of the lifting part. Claim 5 A substrate holding support device according to claim 4, wherein the driving unit comprises a first gear disposed in a first protrusion portion provided in the lifting unit and a second gear disposed in a second protrusion portion provided in the shielding unit, and the shielding unit is driven by a driving force generated in conjunction with the lifting of the lifting unit through the first gear and the second gear. Claim 6 A substrate holding support device according to claim 1, wherein the lifting member is characterized in that the surface holding and supporting the substrate is a circular lift pin. Claim 7 A substrate holding support device according to claim 1, wherein the lifting member is characterized in that the surface holding and supporting the substrate is a bar-shaped lift bar. Claim 8 A substrate holding support device according to paragraph 2, wherein the opening is a space between the wall surfaces of the above-mentioned structure, and the shielding portion is characterized in that, when the shielding portion is positioned at the second position, the first portion of the shielding portion has a lower reflectivity than the second portion of the shielding portion which is closer to the wall surface than the first portion. Claim 9 A substrate holding support device according to paragraph 2, wherein the second position is a position where the upper surface of the shielding part is approximately the same as the upper surface of the support. Claim 10 A substrate holding support device according to claim 9, characterized in that the reflectance of the upper surface of the shielding part is the same degree of reflectance as the upper surface of the support. Claim 11 A substrate holding support device according to paragraph 2, wherein the second position is characterized in that the upper surface of the shielding part is lower than the upper surface of the support. Claim 12 A substrate holding support device according to claim 11, characterized in that the reflectance of the upper surface of the shielding part is higher than the reflectance of the upper surface of the support. Claim 13 A substrate holding support device according to claim 2, wherein the reflectance of the upper surface of the shielding part is such that the difference between the amount of light reflected by the upper surface of the shielding part and reaching the first resist area above the shielding part when the shielding part is positioned at the second position is smaller compared to the case where the shielding part is not positioned at the second position. Claim 14 A substrate holding support device according to claim 1, characterized in that it has an elastic member that applies force in a direction including a horizontal direction to the shielding portion. Claim 15 A substrate holding support device according to claim 1, wherein the driving unit positions the shielding unit at a position where the shielding unit shields the opening while the substrate is being exposed. Claim 16 An exposure device for exposing an image of a pattern of a disc to a substrate, characterized by having a substrate holding support device described in any one of claims 1 to 15, and a projection optical system for projecting the pattern of the disc onto the substrate held and supported by the substrate holding support device. Claim 17 A method for manufacturing an article characterized by comprising an exposure process of obtaining an exposed substrate by exposing a substrate using an exposure device described in claim 16, and a development process of obtaining a developed substrate by developing the exposed substrate, and manufacturing an article from the developed substrate. Claim 18 delete

Citation Information

Patent Citations

  • Substrate processing device and mounting table

    JP2021097162A

  • Work stage and exposure device using work stage

    JP2012151407A

  • Substrate holding device

    JP2015088589A

  • The apparatus for chucking a substrate and the substrate processing apparatus comprising that

    KR1020160032501A

  • JP05516232B1