Semiconductor carrier storage system, semiconductor manufacturing system including the same and semiconductor manufacturing method using the same

Abstract

A semiconductor carrier storage system is provided, comprising: a plurality of storage ports for receiving semiconductor carriers; a shuttle rail extending horizontally next to the plurality of storage ports; an internal transport shuttle moving along the shuttle rail and transporting semiconductor carriers to each of the plurality of storage ports; and an upper transport port receiving semiconductor carriers from an OHT (Overhead Hoist Transport); wherein the internal transport shuttle comprises: a shuttle body coupled to the shuttle rail; a transport wheel connecting the shuttle body and the shuttle rail; a gripper for gripping semiconductor carriers; and a hoist extending vertically between the shuttle body and the gripper to vertically move the gripper.

Description

Technology Field

[0001] The present invention relates to a semiconductor carrier storage system, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same. More specifically, the invention relates to a semiconductor carrier storage system capable of improving space utilization, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same. Background Technology

[0002] The manufacturing of semiconductor devices can be performed through various processes. For example, the manufacturing of semiconductor devices may involve photolithography, deposition, and etching processes on semiconductor wafers. During these various processes, it may be necessary to move semiconductor devices from one piece of equipment to another. Automated Guided Vehicles (AGVs) or Overhead Hoist Transports (OHTs) may be used to transport semiconductor devices. OHTs can transport semiconductor devices by moving along rails positioned above the semiconductor equipment. Semiconductor carriers may be used for the transfer of semiconductor wafers. Semiconductor carriers may need to be stored for a certain period between processes. The problem to be solved

[0003] The problem that the present invention aims to solve is to provide a semiconductor carrier storage system capable of storing semiconductor carriers by utilizing various types of idle space within a semiconductor process line, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same.

[0004] The problem that the present invention aims to solve is to provide a semiconductor carrier storage system capable of picking up and storing semiconductor carriers transported via various paths, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same.

[0005] The problem that the present invention aims to solve is to provide a semiconductor carrier storage system capable of reducing costs, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same.

[0006] The problem that the present invention aims to solve is to provide a semiconductor carrier storage system capable of storing a large amount while shortening the transfer time of semiconductor carriers, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same.

[0007] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0008] To achieve the above-mentioned problem, a semiconductor carrier storage system according to one embodiment of the present invention comprises: a plurality of storage ports for receiving semiconductor carriers; a shuttle rail extending horizontally next to the plurality of storage ports; an internal transport shuttle moving along the shuttle rail and transporting semiconductor carriers to each of the plurality of storage ports; and an upper transport port receiving semiconductor carriers from an OHT (Overhead Hoist Transport); wherein the internal transport shuttle may include: a shuttle body coupled to the shuttle rail; a transport wheel connecting the shuttle body and the shuttle rail; a gripper for gripping semiconductor carriers; and a hoist extending vertically between the shuttle body and the gripper to vertically move the gripper.

[0009] To achieve the above-mentioned problem, a semiconductor manufacturing system according to one embodiment of the present invention comprises: a semiconductor process chamber; a transfer system for transferring a semiconductor carrier to the semiconductor process chamber; and a semiconductor carrier storage system for storing the semiconductor carrier transferred from the transfer system; wherein the semiconductor carrier storage system may include: a plurality of storage ports for receiving semiconductor carriers; a shuttle rail next to the plurality of storage ports; an internal transfer shuttle that moves along the shuttle rail and transfers the semiconductor carrier to the storage ports; an upper transfer port spaced horizontally apart from the plurality of storage ports and receiving the semiconductor carrier from the transfer system; and a lower transfer port located below the plurality of storage ports and receiving the semiconductor carrier from the transfer system.

[0010] To achieve the above-mentioned problem, a semiconductor manufacturing method according to one embodiment of the present invention comprises: a transfer system picking up a semiconductor carrier from a semiconductor process chamber; the transfer system loading the semiconductor carrier onto a semiconductor carrier storage system; an internal transfer shuttle of the semiconductor carrier storage system picking up the semiconductor carrier; and the internal transfer shuttle moving along a shuttle rail to place the semiconductor carrier on a storage port of the semiconductor carrier storage system; wherein the internal transfer shuttle picking up the semiconductor carrier may include: a gripper descending from a shuttle body by a hoist of the internal transfer shuttle; the descended gripper grasping the semiconductor carrier; and the gripper grasping the semiconductor carrier rising.

[0011] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0012] According to the semiconductor carrier storage system of the present invention, the semiconductor manufacturing system including the same, and the semiconductor manufacturing method using the same, semiconductor carriers can be stored by utilizing various types of idle spaces within a semiconductor process line.

[0013] According to the semiconductor carrier storage system of the present invention, the semiconductor manufacturing system including the same, and the semiconductor manufacturing method using the same, semiconductor carriers transported via various paths can be picked up and stored.

[0014] According to the semiconductor carrier storage system of the present invention, the semiconductor manufacturing system including the same, and the semiconductor manufacturing method using the same, costs can be reduced.

[0015] According to the semiconductor carrier storage system of the present invention, the semiconductor manufacturing system including the same, and the semiconductor manufacturing method using the same, a large amount can be stored while reducing the transfer time of the semiconductor carrier.

[0016] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0017] FIG. 1 is a plan view showing a semiconductor manufacturing system according to embodiments of the present invention. FIG. 2 is a plan view showing a semiconductor carrier storage system according to embodiments of the present invention. FIG. 3 is a perspective view showing a semiconductor carrier storage system according to embodiments of the present invention. FIG. 4 is a perspective view showing an internal return shuttle according to embodiments of the present invention. FIG. 5 is a front view showing a semiconductor carrier storage system according to embodiments of the present invention. FIG. 6 is a flowchart illustrating a semiconductor manufacturing method according to embodiments of the present invention. FIGS. 7 to 18 are drawings sequentially illustrating a semiconductor manufacturing method according to the flowchart of FIG. 6. FIG. 19 is a plan view showing a semiconductor carrier storage system according to embodiments of the present invention. Specific details for implementing the invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. Throughout the entire specification, the same reference numerals may refer to the same components.

[0020] FIG. 1 is a plan view showing a semiconductor manufacturing system according to embodiments of the present invention.

[0021] In the following, D1 may be referred to as the first direction, D2 intersecting the first direction (D1) as the second direction, and D3 intersecting each of the first direction (D1) and the second direction (D2) as the third direction. The first direction (D1) may also be referred to as the vertical direction. Additionally, the second direction (D2) and the third direction (D3) may each be referred to as the horizontal direction.

[0022] Referring to FIG. 1, a semiconductor manufacturing system (MS) may be provided. The semiconductor manufacturing system (MS) may be a system that performs a process for manufacturing a semiconductor device. The semiconductor manufacturing system (MS) may include a semiconductor process chamber (PC), a transfer system (TS), and a semiconductor carrier storage system (CS).

[0023] A semiconductor process chamber (PC) may be a chamber that performs a process on a semiconductor substrate. The semiconductor substrate may include, but is not limited to, a silicon (Si) wafer. The semiconductor process chamber (PC) may perform various processes on the semiconductor substrate. For example, the semiconductor process chamber (PC) may perform a deposition process, an etching process, a photolithography process, a cleaning process, and / or a polishing process on the semiconductor substrate. Multiple semiconductor process chambers (PC) may be provided. For example, as shown in FIG. 1, the semiconductor process chamber (PC) may include a first process chamber (PC1) and a second process chamber (PC2). The process performed in the first process chamber (PC1) and the process performed in the second process chamber (PC2) may be different from each other. A semiconductor substrate that has completed the process in the first process chamber (PC1) may be transferred to the second process chamber (PC2).

[0024] A transfer system (TS) can transfer a semiconductor substrate between multiple semiconductor process chambers (PC). The semiconductor substrate can be transferred while inserted into a semiconductor carrier (SC, see FIG. 2). That is, the transfer system (TS) can transfer the semiconductor carrier. The transfer system (TS) may include an upper transfer device (UT) and a lower transfer device (LT).

[0025] An upper transfer device (UT) may be installed on the ceiling. More specifically, a portion of the upper transfer device (UT) may be coupled to the ceiling of the space where the semiconductor manufacturing system (MS) is located. The upper transfer device (UT) may include a transfer rail (TR) and an OHT (H). The transfer rail (TR) may connect multiple semiconductor process chambers (PC) to each other. For example, as shown in FIG. 1, the transfer rail (TR) may connect a first process chamber (PC1) and a second process chamber (PC2). More specifically, one end of the transfer rail (TR) may be connected to a first port (CP1) of the first process chamber (PC1), and the other end of the transfer system (TS) may be connected to a second port (CP2) of the second process chamber (PC2). An OHT (Overhead Hoist Transport, H) may be coupled to the transfer rail (TR). The OHT (H) may move along the transfer rail (TR). OHT(H) can pick up a semiconductor carrier placed on the first port (CP1). The semiconductor carrier may refer to a FOUP (Front Opening Unified Pod) and / or a cassette, but is not limited thereto. OHT(H) can move along a transfer rail (TR) while holding the semiconductor carrier. OHT(H) can load the semiconductor carrier onto a semiconductor carrier storage system (CS). Additionally, OHT(H) can pick up a semiconductor carrier from the semiconductor carrier storage system (CS). OHT(H) can load the picked-up semiconductor carrier onto the second port (CP2).

[0026] The lower transfer device (LT) may be located on the floor. More specifically, the lower transfer device (LT) is located on the floor of the space where the semiconductor manufacturing system (MS) is located and can move along the floor. The lower transfer device (LT) may include, but is not limited to, an Automated Guided Vehicle (AGV) and / or an Autonomous Mobile Robot (AMR). For convenience, the lower transfer device (LT) will be illustrated below as being an AGV.

[0027] A semiconductor carrier storage system (CS) can store semiconductor carriers. More specifically, the semiconductor carrier storage system (CS) can store semiconductor carriers transferred from a transfer system (TS) for a certain period of time. To this end, the semiconductor carrier storage system (CS) can be connected to the transfer system (TS). More detailed information regarding the semiconductor carrier storage system (CS) will be described later with reference to FIGS. 2 to 5.

[0029] FIG. 2 is a plan view showing a semiconductor carrier storage system according to embodiments of the present invention, and FIG. 3 is a perspective view showing a semiconductor carrier storage system according to embodiments of the present invention.

[0030] Referring to FIGS. 2 and 3, the semiconductor carrier storage system (CS) may include a storage port (SP), a shuttle rail (3), an internal transfer shuttle (1), an internal transfer device (5), a lower plate (7), an upper transfer port (UP), and a lower transfer port (LP).

[0031] The storage port (SP) can accommodate a semiconductor carrier (SC). For example, a semiconductor carrier (SC) may be placed on the storage port (SP). The storage port (SP) may include a configuration capable of supporting the semiconductor carrier (SC). For example, the storage port (SP) may have a plate shape that supports the semiconductor carrier (SC), as illustrated in FIG. 3. Alternatively, the storage port (SP) may have a bar shape that supports the semiconductor carrier (SC). Alternatively, the storage port (SP) may be provided in a shape different from this. Although not illustrated, the storage port (SP) may include a separate structure capable of being coupled with the semiconductor carrier (SC). For example, the storage port (SP) may include a projection and / or clamp structure capable of being coupled with the bottom surface and / or side surface of the semiconductor carrier (SC). However, it is not limited thereto, and the storage port (SP) may include other configurations for supporting the semiconductor carrier (SC). As illustrated in FIG. 3, the storage port (SP) can be coupled to the ceiling by the first support member (SM1). The storage port (SP) can be supported by the ceiling. That is, the storage port (SP) can be installed on the ceiling and spaced upward from the floor. However, it is not limited thereto, and the storage port (SP) may also be supported by the lower plate (7).

[0032] Multiple storage ports (SP) may be provided. Multiple storage ports (SP) may be arranged horizontally relative to each other. For example, multiple storage ports (SP) arranged in a second direction (D2) may form a row. Multiple rows formed by multiple storage ports (SP) arranged in the second direction (D2) may be provided. For example, a first row (R1), a second row (R2), a third row (not labeled), and a fourth row (R4) may be provided. The second row (R2) and the fourth row (R4) may be spaced apart horizontally relative to each other. The first row (R1) and the second row (R2) may be spaced apart vertically relative to each other. For example, the second row (R2) may be located on the first row (R1). That is, some of the multiple storage ports (SP) may be spaced apart vertically relative to each other. For convenience, it has been described above as providing four rows, but this is not limited thereto. In the following, unless there are special circumstances, storage ports (SP) for convenience will be described in the singular.

[0033] The shuttle rail (3) may be located next to a plurality of storage ports (SP). The shuttle rail (3) may be extended in a horizontal direction. For example, the shuttle rail (3) may be extended in a second direction (D2) along the arrangement of the plurality of storage ports (SP). The shuttle rail (3) may guide the movement of the internal transport shuttle (1). The shuttle rail (3) may be spaced apart from the transport rail (TR). That is, the shuttle rail (3) may not be connected to the transport rail (TR). In addition, the shape of the shuttle rail (3) may be different from the shape of the transport rail (TR). That is, the shuttle rail (3) and the transport rail (TR) may be different types of rails.

[0034] The internal transfer shuttle (1) can be coupled to the shuttle rail (3). The internal transfer shuttle (1) can move along the shuttle rail (3). The internal transfer shuttle (1) can pick up a semiconductor carrier (SC). The internal transfer shuttle (1) can transport the picked-up semiconductor carrier (SC). For example, the internal transfer shuttle (1) can pick up a semiconductor carrier (SC) on the upper transfer port (UP) and / or lower transfer port (LP) and transport it to the storage port (SP). The internal transfer shuttle (1) may be of the hoist type. Details regarding this will be described later.

[0035] The lower plate (7) may be located below the storage port (SP). For example, the lower plate (7) may be spaced downward from the storage port (SP). The lower plate (7) may extend in a second direction (D2) and a third direction (D3) to cover the entirety of the multiple storage ports (SP) in a planar view. A worker may step onto the lower plate (7). More specifically, if maintenance is required on the storage port (SP), the worker may step onto the lower plate (7) to perform the work. By the lower plate (7), the semiconductor carrier storage system (CS) on the lower plate (7) may be separated from other spaces. As illustrated in FIG. 3, the lower plate (7) may be attached to the ceiling by a second support member (SM2). The lower plate (7) may be supported by the ceiling. That is, the lower plate (7) may be installed on the ceiling and spaced upward from the floor.

[0036] The lower plate (7) may provide a carrier transfer hole (7h). The carrier transfer hole (7h) may penetrate the lower plate (7) vertically. The carrier transfer hole (7h) may be larger than the semiconductor carrier (SC). More specifically, from a planar perspective, the area of ​​the carrier transfer hole (7h) may be larger than the area of ​​the semiconductor carrier (SC). Thus, the semiconductor carrier (SC) may pass through the carrier transfer hole (7h). The carrier transfer hole (7h) may be located on the lower transfer port (LP). More specifically, the carrier transfer hole (7h) may be located at a position spaced upward from the lower transfer port (LP). That is, from a planar perspective, the carrier transfer hole (7h) may overlap with the lower transfer port (LP).

[0037] The upper transfer port (UP) may be spaced apart from the storage port (SP). For example, the upper transfer port (UP) may be spaced horizontally apart from the storage port (SP). The upper transfer port (UP) may receive a semiconductor carrier (SC) from the OHT (H). To this end, a portion of the upper transfer port (UP) may be located under the transfer rail (TR). The upper transfer port (UP) may include a configuration capable of supporting the semiconductor carrier (SC) loaded from the OHT (H). For example, the upper transfer port (UP) may have a plate shape that supports the semiconductor carrier (SC), as shown in FIG. 3. Alternatively, the upper transfer port (UP) may have a bar shape that supports the semiconductor carrier (SC). Alternatively, the upper transfer port (UP) may be provided in a shape different from this. As shown in FIG. 3, the upper transfer port (UP) may be coupled to the lower plate (7). That is, the lower plate (7) can support the upper transfer port (UP). However, it is not limited to this, and the upper transfer port (UP) may be attached to the ceiling.

[0038] The lower transfer port (LP) may be located below the storage port (SP). For example, the lower transfer port (LP) may be spaced downward from the storage port (SP). More specifically, the lower transfer port (LP) may be located below the lower plate (7). The lower transfer port (LP) may be located on the floor. The lower transfer port (LP) may receive a semiconductor carrier (SC) from the lower transfer device (LT). The lower transfer port (LP) may be located under one side of the shuttle rail (3). Thus, an internal transfer shuttle (1) moving along the shuttle rail (3) may be placed on the lower transfer port (LP). The internal transfer shuttle (1) may pick up the semiconductor carrier (SC) on the lower transfer port (LP). The lower transfer port (LP) may be located under the carrier transfer hole (7h). That is, the carrier transfer hole (7h) may be located at a position spaced upward from the lower transfer port (LP). Accordingly, the semiconductor carrier (SC) on the lower transfer port (LP) can pass through the carrier movement hole (7h) when picked up by the internal transfer shuttle (1). The lower transfer port (LP) may be provided in a form capable of supporting the semiconductor carrier (SC). For example, the lower transfer port (LP) may be provided in the form of a support that supports the semiconductor carrier (SC), as shown in FIG. 3. One side of the lower transfer port (LP) may be open to receive the semiconductor carrier (SC) from the lower transfer device (LT). At least a portion of the upper surface of the lower transfer port (LP) may be open to receive the semiconductor carrier (SC) from the internal transfer shuttle (1). However, it is not limited thereto, and the lower transfer device (LT) may be provided in a different form.

[0039] The internal transfer device (5) can transfer the semiconductor carrier (SC) in a horizontal direction. To this end, one side of the internal transfer device (5) may be connected to an upper transfer port (UP). The other side of the internal transfer device (5) may be located under the shuttle rail (3). For example, one side of the internal transfer device (5) may be coupled to the upper transfer port (UP). The internal transfer device (5) may include various configurations capable of transferring the semiconductor carrier (SC). For example, the internal transfer device (5) may have a rail shape as shown in FIG. 3. Alternatively, the internal transfer device (5) may have a shape such as a conveyor belt. In this case, the internal transfer device (5) may be extended in a horizontal direction. However, it is not limited thereto.

[0041] FIG. 4 is a perspective view showing an internal transport shuttle according to embodiments of the present invention, and FIG. 5 is a front view showing a semiconductor carrier storage system according to embodiments of the present invention.

[0042] Referring to FIG. 4, the internal return shuttle (1) may include a shuttle body (11), a transfer wheel (13), a horizontal slider (15), a hoist (17), and a gripper (19).

[0043] The shuttle body (11) can be coupled to the shuttle rail (3). The shuttle body (11) can support the gripper (19). The gripper (19) can move up and down relative to the shuttle body (11).

[0044] A transfer wheel (13) may be positioned on a shuttle rail (3). The transfer wheel (13) may connect the shuttle body (11) and the shuttle rail (3). That is, the shuttle body (11) may be coupled to the shuttle rail (3) by the transfer wheel (13). The transfer wheel (13) may support the shuttle body (11). That is, the load of the shuttle body (11) may be transferred to the shuttle rail (3) by the transfer wheel (13). The shuttle body (11) may be moved in such a way that the transfer wheel (13) moves on the shuttle rail (3). Thus, if the shuttle rail (3) extends in a curve, the shuttle body (11) may also move in a curve along the shuttle rail (3). Multiple transfer wheels (13) may be provided. For example, as shown in FIG. 4, four transfer wheels (13) may be provided, but are not limited thereto. For convenience, the transfer wheel (13) will be described as a single unit below.

[0045] The hoist (17) may extend vertically between the shuttle body (11) and the gripper (19). The hoist (17) may have the form of a flexible string and / or rope. By the hoist (17), the gripper (19) may be connected to the shuttle body (11). That is, a load such as that of the gripper (19) may be transferred to the shuttle body (11) by the hoist (17). When the hoist (17) rises or falls, the gripper (19) may rise or fall. To this end, a winder or the like for winding the hoist (17) may be provided within the shuttle body (11). Additionally, an actuator such as a motor that provides power to the hoist (17) may be provided within the shuttle body (11). Multiple hoists (17) may be provided. However, for convenience, the hoist (17) will be described in the singular below.

[0046] The horizontal slider (15) can move the gripper (19) in a horizontal direction. To do this, the horizontal slider (15) can be extended or shortened in a horizontal direction. The horizontal slider (15) can be positioned under the hoist (17). For example, the horizontal slider (15) can be positioned between the hoist (17) and the gripper (19). Details regarding the horizontal slider (15) will be described later.

[0047] The gripper (19) can be coupled under the hoist (17). The gripper (19) can grasp a semiconductor carrier (SC). That is, the semiconductor carrier (SC) can be optionally coupled under the gripper (19). The gripper (19) may include various configurations for grasping the semiconductor carrier (SC). For example, the gripper (19) may include a clamp structure (not shown) for grasping the semiconductor carrier (SC). Alternatively, the gripper (19) may grasp the semiconductor carrier (SC) using electromagnetic force. Alternatively, the gripper (19) may grasp the semiconductor carrier (SC) in other ways. The gripper (19) grasping the semiconductor carrier (SC) can move up and down. More specifically, the gripper (19) grasping the semiconductor carrier (SC) can be raised or lowered by the hoist (17). For example, as illustrated in FIG. 5, the gripper (19) may descend to grasp a semiconductor carrier (SC) on an internal transfer device (5). Alternatively, the gripper (19) may descend to grasp a semiconductor carrier (SC) on a lower transfer port (LP). More details regarding the gripper (19) will be described later.

[0049] FIG. 6 is a flowchart illustrating a semiconductor manufacturing method according to embodiments of the present invention.

[0050] Referring to FIG. 6, a semiconductor manufacturing method (S) may be provided. The semiconductor manufacturing method (S) may be a method of manufacturing a semiconductor using a semiconductor manufacturing system (MS, see FIG. 1) described with reference to FIG. 1 to 5. The semiconductor manufacturing method (S) may include performing a substrate processing process (S1), transporting a semiconductor carrier loaded with a substrate (S2), and storing the semiconductor carrier (S3).

[0051] Transporting a semiconductor carrier loaded with a substrate (S2) may include the transport system picking up the semiconductor carrier from a semiconductor process chamber (S21) and loading the semiconductor carrier onto a semiconductor carrier storage system (S22).

[0052] The transfer system picking up a semiconductor carrier from a semiconductor process chamber (S21) may include an upper transfer device picking up a semiconductor carrier (S211) and a lower transfer device picking up a semiconductor carrier (S212).

[0053] Storing the semiconductor carrier (S3) may include an internal return shuttle picking up the semiconductor carrier (S31) and placing the semiconductor carrier on a storage port (S32).

[0054] Hereinafter, with reference to FIGS. 7 to 18, each step of the semiconductor manufacturing method (S) of FIG. 6 will be described in detail.

[0056] FIGS. 7 to 18 are drawings sequentially illustrating a semiconductor manufacturing method according to the flowchart of FIG. 6.

[0057] Referring to FIGS. 7 and FIGS. 6, performing a substrate processing process (S1) may include performing a processing process on a semiconductor substrate within a semiconductor process chamber (PC). Depending on the type of semiconductor process chamber (PC), various processes may be performed. For example, a deposition process, an etching process, a photolithography process, a cleaning process, and / or a polishing process may be performed on a semiconductor substrate within a first process chamber (PC1). A semiconductor substrate that has completed the processing process within the first process chamber (PC1) may be inserted into a semiconductor carrier (SC) on a first port (CP1).

[0058] The upper transfer device picking up the semiconductor carrier (S211) may include the OHT (H) picking up the semiconductor carrier (SC) on the first port (CP1). The OHT (H) that picked up the semiconductor carrier (SC) can move along the transfer rail (TR).

[0059] Referring to FIGS. 8, 9 and 6, loading a semiconductor carrier onto a semiconductor carrier storage system (S22) may include the OHT (H) moving along a transfer rail (TR) to place a semiconductor carrier (SC) onto a semiconductor carrier storage system (CS). More specifically, the OHT (H) that picked up the semiconductor carrier (SC) may load the semiconductor carrier (SC) onto an upper transfer port (UP).

[0060] Referring to FIGS. 10, 11 and 6, the internal transfer shuttle picking up the semiconductor carrier (S31) may include placing the semiconductor carrier (SC) under the shuttle rail (3). This process may be performed by an internal transfer device (5). More specifically, the semiconductor carrier (SC) placed on the upper transfer port (UP) by the OHT (H) may be moved horizontally by the internal transfer device (5) and placed under the shuttle rail (3). The internal transfer shuttle (1) may pick up the semiconductor carrier (SC) under the shuttle rail (3). More specifically, first, the gripper (19) may be lowered by the hoist (17). The gripper (19) may move away from the shuttle body (11). The gripper (19) may grasp the semiconductor carrier (SC). Afterward, the gripper (19) that has grasped the semiconductor carrier (SC) may be raised by the hoist (17).

[0061] Referring to FIGS. 12, 13, 14, 15 and 6, placing a semiconductor carrier on a storage port (S32) may include an internal return shuttle (1) that has picked up the semiconductor carrier (SC) moving along a shuttle rail (3). The internal return shuttle (1) may move to the vicinity of a storage port (SP) where the picked-up semiconductor carrier (SC) is to be placed.

[0062] In this process, a portion of the storage port (SP) may be moved. For example, as illustrated in FIG. 13, if a semiconductor carrier (SC) is to be placed in an empty storage port (SP) of the second column (R2), a semiconductor carrier placed in a storage port (SP) of the fourth column (R4) may be an obstruction. In this case, a portion of the storage port (SP) within the fourth column (R4) may be moved. To this end, a storage transfer device (not shown) may be further provided. The storage transfer device may be located below the storage port (SP). The storage transfer device may move the storage port (SP) of the second column (R2) and / or the fourth column (R4) in a horizontal direction. Accordingly, the semiconductor carrier (SC) on the second column (R2) and / or the fourth column (R4) may be moved in a horizontal direction. For example, as illustrated in FIG. 13, a portion of the semiconductor carrier (SC) on the fourth column (R4) may be moved in a second direction (D2). Accordingly, the storage port (SP) of the second column (R2) can be accessed.

[0063] The internal return shuttle (1) can place a semiconductor carrier (SC) on a storage port (SP). At this time, a horizontal slider (15) can be extended in a horizontal direction. By means of the horizontal slider (15), a gripper (19) holding the semiconductor carrier (SC) can move in a horizontal direction. The semiconductor carrier (SC) fixed to the gripper (19) can be placed on the storage port (SP) to be placed. Subsequently, the gripper (19) can descend to place the semiconductor carrier (SC) on the storage port (SP).

[0064] Referring to FIG. 16 and FIG. 6, the lower transfer device picking up a semiconductor carrier (S212) may include the lower transfer device (LT) picking up a semiconductor carrier (SC) from the first port (CP1). The lower transfer device (LT) that picked up the semiconductor carrier (SC) may move to a semiconductor carrier storage system (CS) as shown in FIG. 16.

[0065] Referring to FIG. 17 and FIG. 6, loading a semiconductor carrier onto a semiconductor carrier storage system (S22) may include a lower transfer device (LT) that picks up the semiconductor carrier (SC) loading the semiconductor carrier (SC) into a lower transfer port (LP, see FIG. 15).

[0066] Referring to FIG. 18 and FIG. 6, the internal transfer shuttle picking up the semiconductor carrier (S31) may include the gripper (19, see FIG. 11) being lowered by the hoist (17) to grasp the semiconductor carrier (SC) on the lower transfer port (LP). At this time, the hoist (17) and the gripper (19) may pass through the carrier transfer hole (7h). After the gripper (19) grasps the semiconductor carrier (SC) on the lower transfer port (LP), the gripper (19) may rise. During this process, the semiconductor carrier (SC) may pass through the carrier transfer hole (7h).

[0067] According to exemplary embodiments of the present invention, a semiconductor carrier storage system, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same, semiconductor carriers can be stored using a separate shuttle rail independent of the transfer rail used by the OHT. Therefore, the semiconductor carrier storage system can be installed at a desired location regardless of the existing OHT and transfer rail. Consequently, idle space within the semiconductor manufacturing line can be utilized. Furthermore, costs can be reduced by using a separate internal transfer shuttle and shuttle rail instead of the existing OHT and transfer rail. Moreover, since the semiconductor carrier is picked up using a separate internal transfer shuttle and placed on a storage port, the movement time of the OHT can be avoided. Accordingly, a large amount of semiconductor carriers can be rapidly transported and stored.

[0068] According to exemplary embodiments of the present invention, a semiconductor carrier storage system, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same, an internal transport shuttle can move on a shuttle rail via a transport wheel. Therefore, even if the shuttle rail is curved, the internal transport shuttle can move along it.

[0069] According to exemplary embodiments of the present invention, a semiconductor carrier storage system, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same, an internal transport shuttle can pick up a semiconductor carrier using a hoist. Therefore, semiconductor carriers located below can also be easily picked up. For example, not only semiconductor carriers on an upper transport port transported by an OHT, but also semiconductor carriers on a lower transport port transported by an AGV, etc., can be picked up. That is, semiconductor carriers transported via various paths can be quickly picked up and stored by a single internal transport shuttle.

[0071] FIG. 19 is a plan view showing a semiconductor carrier storage system according to embodiments of the present invention.

[0072] In the following, descriptions of content that is substantially the same or similar as those described with reference to FIGS. 1 to 18 may be omitted.

[0073] Referring to FIG. 19, a semiconductor carrier storage system (CSa) may be provided. However, unlike the description with reference to FIG. 2, the shuttle rail (3a) of the semiconductor carrier storage system (CSa) may have a curved shape that forms a curve in a planar view. That is, the shuttle rail (3a) may include a curved section (3ax).

[0074] Multiple storage ports (SP) can be arranged to curve along the shuttle rail (3a). More specifically, multiple storage ports (SP) can be arranged to form a curve in a planar view.

[0075] Although the shuttle rail (3a) has been depicted above as having a shape that is bent vertically only once, it is not limited thereto. That is, the shuttle rail (3a) may have a circular shape from a planar perspective. Alternatively, the shuttle rail (3a) may have other shapes. Accordingly, multiple storage ports (SP) can also be arranged in various ways.

[0076] According to exemplary embodiments of the present invention, a semiconductor carrier storage system, a semiconductor manufacturing system including the same, and a semiconductor manufacturing method using the same, a plurality of storage ports can be arranged to form a curve in a planar view. Additionally, the shuttle rail can also have a curved shape. Since the internal transport shuttle is coupled to the shuttle rail through a transport wheel, the internal transport shuttle can move smoothly along the shuttle rail even when the shuttle rail has a curved shape. Accordingly, smooth internal transport is possible even if the plurality of storage ports are arranged in various forms. Therefore, the plurality of storage ports can be flexibly arranged according to the shape of the idle space. That is, the semiconductor carrier storage system can be installed even when the idle space is narrow. Accordingly, space utilization can be improved.

[0078] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0079] MS: Semiconductor Manufacturing System PC: Semiconductor process chamber TS: Transfer System UT: Upper transfer device TR: Transfer rail H: OHT LT: Lower transfer device CS: Semiconductor Carrier Storage System 1: Internal return shuttle 11: Shuttle body 13: Transfer wheel 15: Horizontal slider 17: Hoist 19: Gripper 3: Shuttle Rail 5: Internal transfer device 7: Lower plate 7h: Carrier transfer hole UP: Upper transfer port LP: Lower transfer port SC: Semiconductor Carrier SP: Storage Port

Claims

Claim 1 A semiconductor carrier storage system comprising: a plurality of storage ports for accommodating semiconductor carriers; a shuttle rail extending horizontally next to the plurality of storage ports; an internal transport shuttle moving along the shuttle rail and transporting semiconductor carriers to each of the plurality of storage ports; and an upper transport port receiving semiconductor carriers from an Overhead Hoist Transport (OHT); wherein the internal transport shuttle comprises: a shuttle body coupled to the shuttle rail; a transport wheel connecting the shuttle body and the shuttle rail; a gripper for gripping semiconductor carriers; and a hoist extending vertically between the shuttle body and the gripper to vertically move the gripper; wherein the plurality of storage ports are arranged to form a curve in a planar view, and the shuttle rail includes a section that bends while forming a curve along the plurality of storage ports. Claim 2 In claim 1, the plurality of storage ports are arranged in a horizontal direction in a semiconductor carrier storage system. Claim 3 delete Claim 4 A semiconductor carrier storage system according to claim 1, wherein the plurality of storage ports form: a first column in which a portion of the plurality of storage ports is arranged horizontally; and a second column in which another portion of the plurality of storage ports is arranged horizontally, wherein the second column is located on the first column. Claim 5 A semiconductor carrier storage system according to claim 4, further comprising a storage transfer device for moving the semiconductor carrier stored in the second column in a horizontal direction. Claim 6 A semiconductor carrier storage system according to claim 1, further comprising an internal transfer device, wherein the upper transfer port and the shuttle rail are spaced apart in a horizontal direction, one side of the internal transfer device is connected to the upper transfer port, and the other side of the internal transfer device is located under the shuttle rail, so that the internal transfer device transfers a semiconductor carrier on the upper transfer port to under the shuttle rail. Claim 7 A semiconductor manufacturing system comprising: a semiconductor process chamber; a transfer system for transferring a semiconductor carrier to the semiconductor process chamber; and a semiconductor carrier storage system for storing the semiconductor carrier transferred from the transfer system; wherein the semiconductor carrier storage system comprises: a plurality of storage ports for receiving semiconductor carriers; a shuttle rail next to the plurality of storage ports; an internal transfer shuttle that moves along the shuttle rail and transfers the semiconductor carrier to the storage ports; an upper transfer port spaced horizontally apart from the plurality of storage ports and receiving the semiconductor carrier from the transfer system; and a lower transfer port located below the plurality of storage ports and receiving the semiconductor carrier from the transfer system; wherein the plurality of storage ports are arranged to form a curve in a planar view, and the shuttle rail includes a section that bends while forming a curve along the plurality of storage ports. Claim 8 In claim 7, the transfer system comprises: an upper transfer device coupled to the ceiling; and a lower transfer device located on the floor; wherein the upper transfer device comprises: a transfer rail spaced apart from the shuttle rail; and an OHT coupled to the transfer rail and moving along the transfer rail; and the upper transfer port is located under the transfer rail to receive a semiconductor carrier from the OHT, forming a semiconductor manufacturing system. Claim 9 In claim 8, the lower transfer device includes an AGV (Automated Guided Vehicle) or an AMR (Autonomous mobile robot), wherein the lower transfer port is located on the floor and receives a semiconductor carrier from the AGV or the AMR, forming a semiconductor manufacturing system. Claim 10 A semiconductor manufacturing method comprising: a transfer system picking up a semiconductor carrier from a semiconductor process chamber; the transfer system loading the semiconductor carrier onto a semiconductor carrier storage system; an internal transfer shuttle of the semiconductor carrier storage system picking up the semiconductor carrier; and the internal transfer shuttle moving along a shuttle rail to place the semiconductor carrier onto a storage port of the semiconductor carrier storage system; wherein the internal transfer shuttle picking up the semiconductor carrier comprises: a gripper descending from a shuttle body by a hoist of the internal transfer shuttle; the descended gripper grasping the semiconductor carrier; and the gripper grasping the semiconductor carrier rising, wherein the storage system includes a plurality of storage ports, the plurality of storage ports are arranged to form a curve in a planar view, and the shuttle rail includes a section that bends while forming a curve along the plurality of storage ports.

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