Substrate processing apparatus

Abstract

A linear electrical machine comprises a frame having a level reference plane and an array of electromagnets connected to the frame to form a drive plane at a predetermined height relative to the level reference plane. The array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets forms at least one drive line within the drive plane, and each of the electromagnets is coupled to an alternating current source that supplies power to each electromagnet. At least one reaction platen of a paramagnetic, diamagnetic, or nonmagnetic conductive material is arranged to cooperate with the electromagnets of the array of electromagnets so that the excitation of the electromagnets by the alternating current generates a levitation force and a thrust force for the reaction platen, which controllably levitates and propels the reaction platen along the at least one drive line in a controlled position relative to the drive plane.

Description

Technology Field

[0001] Cross-reference regarding related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 62 / 979,195 filed on February 20, 2020, the entire disclosure of which is incorporated herein by reference.

[0004] Exemplary embodiments generally relate to substrate processing equipment, and more specifically, to substrate transfer of substrate processing equipment. Background Technology

[0005] Semiconductor automation generally involves a series of building blocks required to support the implementation of processes in semiconductor chip manufacturing to ultimately achieve a predetermined level of quality and reproducibility. One element of semiconductor automation is a wafer (also referred to as a substrate) handler that transports substrates or wafers between load locks and process modules and / or between process modules (e.g., in the case of a sequential process tool architecture).

[0006] Generally, wafer handlers comprise a robotic manipulator with rotary or prismatic joints and individual linkage-based mechanisms driven by actuators located away from the end effector of the robotic manipulator, where the end effector either contacts or otherwise interfaces with the wafer. The design of such conventional manipulators typically involves the use of bearings in a vacuum environment at different parts of the manipulator structure, typically at the mechanical interfaces between the individual arm links of the manipulator. The use of bearings in a vacuum environment generally carries the potential for lubricating gas release, particle generation, and frictional fluctuations during bearing operation in a vacuum environment while handling wafers at high temperatures (e.g., exceeding 400°C). Furthermore, wafer handlers are typically mounted on vacuum cluster tools, and their mechanical stroke is limited by the design of the associated arm link length. Consequently, conventional wafer handlers operating in a vacuum are not suitable for "long" vacuum cluster tools, such as the "linear tool configuration" known in the industry.

[0007] In the case of linear tool configurations, "long reach" manipulators with long arm link lengths and articulated end effectors are typically employed to transport wafers between the linear tool's load locks and process modules. These long reach manipulators generally feature mechanical designs characterized by low natural frequencies, an increased number of actuators, undesirable arm link deflection, mechanical positioning hysteresis, high sensitivity to thermal expansion, expensive bearings, limited ability to level the end effectors with the wafer holding station, and limited motion throughput. Additionally, linear tool configurations are scalable in the sense that the end user can extend the length of the linear tool while minimizing the impact on existing automation. Another desirable feature of linear tools is the ability to inspect the linear tool (e.g., perform scheduled maintenance on the wafer handler) with minimal interruption to tool operation.

[0008] As an alternative to the wafer handler mentioned above, a magnetic levitation wafer conveyor may be employed, wherein an alternating current magnetic levitation device is provided for levitating and transporting a conductive floating body or a paramagnetic or non-magnetic metal material over an alternating current electromagnet line. The alternating current magnetic levitation device generally comprises a single-phase alternating current source having a first frequency for levitating the floating body, a three-phase alternating current source having a second frequency for transporting the floating body, an adder for adding alternating current to the two current sources, and a supply circuit for supplying the added alternating current to the alternating current electromagnet line. The floating body can be stopped at a desired position by efficient transport.

[0009] Additionally, FIGS. 33-36 shows an example of an inductive repulsion type magnetic levitation mechanism. In FIGS. 33-36, reference numeral 01 represents an alternating current electromagnet, and reference numeral 02 represents a floating body to be transported. Lightweight and highly conductive materials, such as aluminum, are suitable for the floating body (02). The object to be transported is usually placed on the floating body (02). In FIGS. 33-36, when a single-phase alternating current, represented by reference numeral 04 in FIG. 35, is supplied to the alternating current electromagnets (01), an alternating current magnetic field is generated for the electromagnets. Because the floating body is present within the magnetic field, an alternating current called an eddy current is generated within the aluminum material forming the floating body.

[0010] The magnetic field generated by the eddy currents repels the magnetic field generated by the electromagnets. Therefore, due to this repulsion, a floating force, indicated as F1 in FIGS. 33 and 34, acts on the floating body. When the three-phase alternating current, indicated by reference numerals 05, 06, and 07 in FIG. 36, is supplied to the three-phase electromagnets (03) of FIGS. 33 and 34, a moving force, indicated as F2 in FIGS. 33 and 34, acts on the floating body (02), causing the floating body (02) to move.

[0011] A linear electrical machine according to one or more aspects of the disclosed embodiments is:

[0012] Frame with a level reference plane;

[0013] An array of electromagnets connected to the frame to form a drive plane at a predetermined height with respect to the level reference plane, wherein the array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets forms at least one drive line within the drive plane, and each of the electromagnets is coupled to an alternating current power source that supplies power to each electromagnet;

[0014] A reaction platen of at least one paramagnetic, diamagnetic, or nonmagnetic conductive material, wherein the excitation of the electromagnets by an alternating current generates a levitation force and a propulsion force for the reaction platen, thereby controllingly levitating and propelling the reaction platen along the at least one driving line in a controlled position relative to the driving plane; and

[0015] A controller operably coupled to an array of electromagnets and an alternating current power source, wherein the controller is configured to sequentially excite the electromagnets with a multiphase alternating current so that each reaction platen is levitized and propelled with up to 6 degrees of freedom, including at least one of attitude control and yaw control, by a common set of electromagnets, and each of the electromagnets generates both levitation force and propulsion force for the reaction platen to control the reaction platen with up to 6 degrees of freedom, including at least one of the reaction platen attitude and reaction platen yaw, from the excitation of a common multiphase alternating current having a single common frequency per phase.

[0016] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture, in which the reaction platen is lifted and propelled to move the array of electromagnets along the at least one driving line from a first predetermined position relative to the frame to a second different predetermined position relative to the frame.

[0017] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture and a reaction platen yaw, in a state where the reaction platen is levitating and stationary relative to the array of electromagnets at a predetermined position along the at least one driving line relative to the frame.

[0018] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets over the entire reaction platen to impart a controlled yaw moment to the reaction platen, which yawing the reaction platen around a yaw axis substantially perpendicular to the driving plane from a first predetermined orientation with respect to the frame to a second different predetermined orientation with respect to the frame.

[0019] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets to impart a moment couple to the reaction platen that executes a controlled yaw of the reaction platen in order to perform at least one of positioning and centering of a wafer payload on the reaction platen for a predetermined wafer holding position of the frame.

[0020] According to one or more aspects of the disclosed embodiments, the controller controls differential levitation forces generated by an array of electromagnets to impart differential levitation forces across the entire reaction platen that realize a controlled inclination of the reaction platen relative to the driving plane, which controls a predetermined reaction platen attitude at at least one of the reaction platen pitch and the reaction platen roll.

[0021] According to one or more aspects of the disclosed embodiments, the controller controls the levitation forces generated by the array of electromagnets to realize a predetermined bias attitude of the reaction platen with respect to the driving plane, which imparts a bias reaction force to the payload supported by the reaction platen payload seating surface from the reaction platen payload seating surface in a direction opposite to the payload inertia force arising from the acceleration of the reaction platen along the driving plane.

[0022] According to one or more aspects of the disclosed embodiments, the linear electric machine is configured to detect the position of the reaction platen distributed in the frame along the driving plane and further comprises position feedback sensors communicably coupled to the controller to register the detected position of the reaction platen, and the controller is configured to sequentially excite the electromagnets of the array of electromagnets corresponding to the detected position.

[0023] According to one or more aspects of the disclosed embodiments, the controller is configured to determine the acceleration of the reaction platen along the driving plane from at least a change in a detected position, and to control the bias attitude of the reaction platen in response to the determined acceleration to provide a predetermined bias attitude that opposes the payload inertial force arising from the acceleration of the reaction platen.

[0024] According to one or more aspects of the disclosed embodiments, the controller controls the excitation of the electromagnets of the array of electromagnets to set the reaction platen to bias the reaction platen against an inertial force that tends to displace the payload seated on the reaction platen along the seat between the payload and the reaction platen.

[0025] An electromagnetic conveyor substrate transfer device according to one or more aspects of the disclosed embodiments is:

[0026] A chamber configured to hold an atmosphere sealed inside, wherein the chamber has a level reference plane and at least one substrate passage opening, and the substrate is transferred in and out of the chamber through the opening;

[0027] An array of electromagnets connected to the chamber to form a drive plane at a predetermined height with respect to the level reference plane, wherein the array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets forms at least one drive line within the drive plane, the electromagnets within the series of electromagnets are grouped into at least one multiphase actuator unit, and each of the at least one multiphase actuator unit is coupled to a multiphase AC power source;

[0028] At least one reaction platen of a paramagnetic, diamagnetic, or nonmagnetic conductive material, wherein the excitation of the electromagnets by an alternating current generates a levitation force and a thrust force for the reaction platen, thereby controllingly levitating and thrusting the reaction platen along the at least one driving line in a controlled position relative to the driving plane; and

[0029] A controller operably coupled to an array of electromagnets and an alternating current power source, wherein the controller is configured to sequentially excite the electromagnets with a multiphase alternating current so that a reaction platen is lifted and propelled, and each alternating current phase of the multiphase alternating current is dynamically allocated between each electromagnet such that the alternating current phase of each electromagnet of the electromagnet group of the at least one multiphase actuator unit changes from a first alternating current phase to a second alternating current phase, thereby virtually moving the electromagnet group and virtually moving the at least one multiphase actuator unit formed by the electromagnet group through dynamic phase allocation along the drive line; the controller includes

[0030] According to one or more aspects of the disclosed embodiments, the reaction platen is lifted and propelled with up to 6 degrees of freedom, including at least one of attitude and yaw control, by the at least one multi-phase actuator unit that moves virtually.

[0031] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture, in which the reaction platen is lifted and propelled to move relative to the array of electromagnets along the at least one driving line from a first predetermined position relative to the chamber to a second different predetermined position relative to the chamber.

[0032] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture and a reaction platen yaw, in a state where the reaction platen is levitating and stationary relative to the array of electromagnets at a predetermined position along the at least one driving line relative to the chamber.

[0033] According to one or more aspects of the disclosed embodiments, the dynamic phase assignment is controlled so that the at least one multi-phase actuator unit, which is virtually moving, moves virtually along the drive line in substantially corresponding to the movement of the reaction platen along the drive line from the propulsion by the at least one multi-phase actuator unit that is virtually moving.

[0034] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets over the entire reaction platen to impart a controlled yaw moment to the reaction platen, which yawing the reaction platen about a yaw axis substantially perpendicular to the driving plane from a first predetermined orientation with respect to the chamber to a second different predetermined orientation with respect to the chamber.

[0035] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets to impart a moment couple to the reaction platen that executes a controlled yaw of the reaction platen in order to perform at least one of positioning and centering of a wafer payload on the reaction platen for a predetermined wafer holding position of the chamber.

[0036] According to one or more aspects of the disclosed embodiments, the controller controls differential levitation forces generated by an array of electromagnets to impart differential levitation forces across the entire reaction platen that realize a controlled inclination of the reaction platen relative to the driving plane, which controls a predetermined reaction platen attitude at at least one of the reaction platen pitch and the reaction platen roll.

[0037] According to one or more aspects of the disclosed embodiments, the controller controls the levitation forces generated by the array of electromagnets to realize a predetermined bias attitude of the reaction platen with respect to the driving plane, which imparts a bias reaction force to the payload supported by the reaction platen payload seating surface from the reaction platen payload seating surface in a direction opposite to the payload inertia force arising from the acceleration of the reaction platen along the driving plane.

[0038] According to one or more aspects of the disclosed embodiments, the electromagnetic conveyor substrate transfer device is configured to detect the position of the reaction platen distributed in the chamber along the driving plane and further comprises position feedback sensors communicably coupled to the controller so as to register the detected position of the reaction platen, and the controller is configured to sequentially excite the electromagnets of the array of electromagnets corresponding to the detected position.

[0039] According to one or more aspects of the disclosed embodiments, the controller is configured to determine the acceleration of the reaction platen along the driving plane from at least a change in a detected position, and to control the bias attitude of the reaction platen in response to the determined acceleration to provide a predetermined bias attitude that opposes the payload inertial force arising from the acceleration of the reaction platen.

[0040] According to one or more aspects of the disclosed embodiments, the controller controls the excitation of the electromagnets of the array of electromagnets to set the reaction platen to bias the reaction platen against an inertial force that tends to displace the payload seated on the reaction platen along the seat between the payload and the reaction platen.

[0041] According to one or more aspects of the disclosed embodiments, the dynamic phase assignment is controlled such that each electromagnet powered by the multiphase alternating current exhibits a substantially steady-state multiphase distribution across each electromagnet of the at least one multiphase actuator unit that moves virtually with respect to the reaction platen.

[0042] A method for a linear electric machine according to one or more aspects of the disclosed embodiments is provided. The method comprises:

[0043] A step of providing a frame having a level reference plane to the above linear electric machine;

[0044] A step of forming a driving plane with an array of electromagnets connected to the above frame, wherein the driving plane is located at a predetermined height with respect to the level reference plane, and the array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets forms at least one driving line within the driving plane, and each of the electromagnets is coupled to an alternating current power source that supplies power to each electromagnet;

[0045] The step of providing at least one reaction platen of a paramagnetic, diamagnetic, or nonmagnetic conductive material arranged to cooperate with the electromagnets of the array of electromagnets; and

[0046] The method includes the step of exciting the electromagnets with alternating current to generate levitation and propulsion forces for the reaction platen, thereby controllingly levitating and propulsing the reaction platen along the at least one drive line in a controlled posture with respect to the drive plane;

[0047] The electromagnets are sequentially excited by a multiphase alternating current by a controller operably coupled to an array of the electromagnets and the alternating current power source, so that each reaction platen is levitized and propelled by a common set of the electromagnets with up to 6 degrees of freedom, including at least one of attitude control and yaw control, and each of the electromagnets generates both levitation and propulsion forces for the reaction platen to control the reaction platen with up to 6 degrees of freedom, including at least one of the reaction platen attitude and reaction platen yaw, from the excitation of a common multiphase alternating current having a single common frequency per phase.

[0048] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture, in which the reaction platen is lifted and propelled to move the array of electromagnets along the at least one driving line from a first predetermined position relative to the frame to a second different predetermined position relative to the frame.

[0049] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture and a reaction platen yaw, in a state where the reaction platen is levitating and stationary relative to the array of electromagnets at a predetermined position along the at least one driving line relative to the frame.

[0050] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets over the entire reaction platen to impart a controlled yaw moment to the reaction platen, which yawing the reaction platen around a yaw axis substantially perpendicular to the driving plane from a first predetermined orientation with respect to the frame to a second different predetermined orientation with respect to the frame.

[0051] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets to impart a moment couple to the reaction platen that executes a controlled yaw of the reaction platen in order to perform at least one of positioning and centering of a wafer payload on the reaction platen for a predetermined wafer holding position of the frame.

[0052] According to one or more aspects of the disclosed embodiments, the controller controls differential levitation forces generated by an array of electromagnets to impart differential levitation forces across the entire reaction platen that realize a controlled inclination of the reaction platen relative to the driving plane, which controls a predetermined reaction platen attitude at at least one of the reaction platen pitch and the reaction platen roll.

[0053] According to one or more aspects of the disclosed embodiments, the controller controls the levitation forces generated by the array of electromagnets to realize a predetermined bias attitude of the reaction platen with respect to the driving plane, which imparts a bias reaction force to the payload supported by the reaction platen payload seating surface from the reaction platen payload seating surface in a direction opposite to the payload inertia force arising from the acceleration of the reaction platen along the driving plane.

[0054] According to one or more aspects of the disclosed embodiments, the method further comprises the step of detecting the position of the reaction platen along the driving plane using position feedback sensors distributed in the frame, wherein the position feedback sensors are communicably coupled to the controller so as to register the detected position of the reaction platen, and the controller sequentially excites the electromagnets of the array of electromagnets corresponding to the detected position.

[0055] According to one or more aspects of the disclosed embodiments, the controller determines the acceleration of the reaction platen along the driving plane from at least a change in the detected position, and in response to the determined acceleration, controls the bias attitude of the reaction platen to provide a predetermined bias attitude to counteract the payload inertial force arising from the acceleration of the reaction platen.

[0056] According to one or more aspects of the disclosed embodiments, the controller controls the excitation of the electromagnets of the array of electromagnets to set the reaction platen to bias the reaction platen against an inertial force that tends to displace the payload seated on the reaction platen along the seat between the payload and the reaction platen.

[0057] A method for an electromagnetic conveyor substrate transfer device according to one or more aspects of the disclosed embodiments is provided. The method comprises:

[0058] A step of providing a chamber configured to hold an atmosphere sealed inside the above-described electromagnetic substrate transfer device, wherein the chamber has a level reference plane and at least one substrate passage opening, and the substrate is transferred in and out of the chamber through the opening;

[0059] A step of forming a driving plane with an array of electromagnets connected to the chamber, wherein the driving plane is located at a predetermined height with respect to the level reference plane, and the array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets forms at least one driving line within the driving plane, and the electromagnets within the series of electromagnets are grouped into at least one multiphase actuator unit, and each of the at least one multiphase actuator unit is coupled to a multiphase AC power source;

[0060] The step of providing at least one reaction platen of a paramagnetic, diamagnetic, or non-magnetic conductive material arranged to cooperate with the electromagnets of the at least one multi-phase actuator unit; and

[0061] The method includes the step of exciting the electromagnets with alternating current to generate levitation and propulsion forces for the reaction platen, thereby controllingly levitating and propulsing the reaction platen along the at least one drive line in a controlled posture with respect to the drive plane;

[0062] The electromagnets are sequentially excited by a multiphase alternating current to cause a reaction platen to rise and be propelled by a controller operably coupled to an array of electromagnets and an alternating current power source, and each alternating current phase of the multiphase alternating current is dynamically allocated between each electromagnet such that the alternating current phase of each electromagnet of the electromagnet group of the at least one multiphase actuator unit changes from a first alternating current phase to a second alternating current phase, so that the electromagnet group is virtually moved and the at least one multiphase actuator unit formed by the electromagnet group is virtually moved through dynamic phase allocation along the driving line.

[0063] According to one or more aspects of the disclosed embodiments, the reaction platen is lifted and propelled with up to 6 degrees of freedom, including at least one of attitude and yaw control, by the at least one multi-phase actuator unit that moves virtually.

[0064] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture, in which the reaction platen is lifted and propelled to move relative to the array of electromagnets along the at least one driving line from a first predetermined position relative to the chamber to a second different predetermined position relative to the chamber.

[0065] According to one or more aspects of the disclosed embodiments, the controller controls up to 6 degrees of freedom generated by the array of electromagnets, including at least a reaction platen posture and a reaction platen yaw, in a state where the reaction platen is levitating and stationary relative to the array of electromagnets at a predetermined position along the at least one driving line relative to the chamber.

[0066] According to one or more aspects of the disclosed embodiments, the dynamic phase assignment is controlled so that the at least one multi-phase actuator unit, which is virtually moving, moves virtually along the drive line in substantially corresponding to the movement of the reaction platen along the drive line from the propulsion by the at least one multi-phase actuator unit that is virtually moving.

[0067] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets over the entire reaction platen to impart a controlled yaw moment to the reaction platen, which yawing the reaction platen about a yaw axis substantially perpendicular to the driving plane from a first predetermined orientation with respect to the chamber to a second different predetermined orientation with respect to the chamber.

[0068] According to one or more aspects of the disclosed embodiments, the controller controls the thrust forces generated by the array of electromagnets to impart a moment couple to the reaction platen that executes a controlled yaw of the reaction platen in order to perform at least one of positioning and centering of a wafer payload on the reaction platen for a predetermined wafer holding position of the chamber.

[0069] According to one or more aspects of the disclosed embodiments, the controller controls differential levitation forces generated by an array of electromagnets to impart differential levitation forces across the entire reaction platen that realize a controlled inclination of the reaction platen relative to the driving plane, which controls a predetermined reaction platen attitude at at least one of the reaction platen pitch and the reaction platen roll.

[0070] According to one or more aspects of the disclosed embodiments, the controller controls the levitation forces generated by the array of electromagnets to realize a predetermined bias attitude of the reaction platen with respect to the driving plane, which imparts a bias reaction force to the payload supported by the reaction platen payload seating surface from the reaction platen payload seating surface in a direction opposite to the payload inertia force arising from the acceleration of the reaction platen along the driving plane.

[0071] According to one or more aspects of the disclosed embodiments, the method further comprises the step of detecting the position of the reaction platen along the driving plane by position feedback sensors distributed in the chamber, wherein the position feedback sensors are communicably coupled to the controller so as to register the detected position of the reaction platen, and the controller is configured to sequentially excite the electromagnets of the array of electromagnets corresponding to the detected position.

[0072] According to one or more aspects of the disclosed embodiments, the controller determines the acceleration of the reaction platen along the driving plane from at least a change in the detected position, and in response to the determined acceleration, controls the bias attitude of the reaction platen to provide a predetermined bias attitude to counteract the payload inertial force arising from the acceleration of the reaction platen.

[0073] According to one or more aspects of the disclosed embodiments, the controller controls the excitation of the electromagnets of the array of electromagnets to set the reaction platen to bias the reaction platen against an inertial force that tends to displace the payload seated on the reaction platen along the seat between the payload and the reaction platen.

[0074] According to one or more aspects of the disclosed embodiments, the dynamic phase assignment is controlled such that each electromagnet powered by the multiphase alternating current exhibits a substantially steady-state multiphase distribution across each electromagnet of the at least one multiphase actuator unit that moves virtually with respect to the reaction platen. Brief explanation of the drawing

[0075] The aforementioned aspects and other features of the disclosed embodiments are described in the following description in conjunction with the accompanying drawings. FIG. 1a is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 1b is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 2 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 3 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 4 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 5 is a schematic plan view of a substrate processing system including aspects of a disclosed embodiment; FIG. 6 is an exemplary substrate handler motion of the substrate processing apparatus described herein according to aspects of the disclosed embodiment; FIG. 7 is a schematic plan view of a substrate processing system including aspects of a disclosed embodiment; FIG. 8 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 8a is a schematic perspective view of a portion of a substrate handler according to aspects of a disclosed embodiment; FIG. 9 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 10 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 10a is a schematic perspective view of a portion of the substrate handler of FIG. 10 according to aspects of the disclosed embodiment; FIG. 11 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 11a is a schematic perspective view of a portion of the substrate handler of FIG. 11 according to aspects of the disclosed embodiment; FIG. 12a is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 12b is a schematic elevation view of the substrate processing apparatus of FIG. 12a according to aspects of the disclosed embodiment; FIG. 13a is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 13b is a schematic elevation view of the substrate processing apparatus of FIG. 13a according to aspects of the disclosed embodiment; FIG. 14 is a schematic plan view of a substrate processing apparatus including sides of a disclosed embodiment; FIG. 14a is a schematic plan view of a portion of the substrate processing apparatus of FIG. 14 according to aspects of the disclosed embodiment; FIG. 14b is a schematic elevation view of a substrate transfer cart according to the sides of a disclosed embodiment; FIG. 14c is a schematic plan view of the substrate transfer cart of FIG. 14b according to aspects of the disclosed embodiment; FIG. 15a is a front view of a substrate handler according to the sides of a disclosed embodiment; FIG. 15b is a schematic side view of the substrate handler of FIG. 15a according to aspects of the disclosed embodiment; FIG. 15c is a schematic plan view of the substrate handler of FIG. 15a according to aspects of the disclosed embodiment; FIG. 16a is a schematic plan view of a substrate handler according to aspects of a disclosed embodiment; FIG. 16b is a schematic side view of the substrate handler of FIG. 16a according to aspects of the disclosed embodiment; FIG. 16c is a schematic plan view of a portion of a substrate processing apparatus including the substrate handler of FIG. 16a according to aspects of the disclosed embodiment; FIG. 17 is a schematic diagram of an exemplary actuator control system network according to aspects of the disclosed embodiment; FIG. 18 is a partial schematic diagram of a sensor control system network according to aspects of a disclosed embodiment; FIG. 19 is a schematic diagram of an exemplary sensor control system network according to aspects of the disclosed embodiment; FIG. 20 is a partial schematic diagram of the sensor control system network of FIG. 19 according to aspects of the disclosed embodiment; FIG. 21 is a schematic diagram of exemplary motion control of a substrate handler according to aspects of the disclosed embodiment; FIG. 21a is a schematic perspective view of a substrate handler motion according to aspects of a disclosed embodiment; FIG. 22 is a free-body vision diagram for the maximum allowable acceleration by a conventional substrate transfer device; FIG. 23 is a free-body visualization diagram illustrating the effect of the pitch angle on the acceleration of a substrate handler for substrate sliding according to aspects of the disclosed embodiment; FIG. 24 is a free-body sight diagram of a substrate illustrating the effect of the pitch angle on substrate slippage in the absence of friction, according to aspects of the disclosed embodiment; FIG. 24a is an exemplary graph illustrating the propulsion acceleration with respect to the pitch angle in relation to substrate slippage in the absence of friction, according to aspects of the disclosed embodiment; FIG. 25a is a free-body sight diagram of a substrate illustrating the effect of the pitch angle on substrate slippage when friction is present, according to aspects of the disclosed embodiment; FIG. 25b is a free-body sight diagram of a substrate illustrating the effect of the pitch angle on substrate slippage when friction is present, according to aspects of the disclosed embodiment; FIG. 26 is an exemplary graph illustrating acceleration limits with respect to the pitch angle in relation to substrate slippage when friction is present, according to aspects of the disclosed embodiment; FIG. 27 is a schematic elevation view of a substrate handler illustrating pitch control of the substrate handler according to aspects of the disclosed embodiment; FIG. 28 is a schematic elevation view of one substrate handler passing next to another substrate handler inside a transfer chamber according to the sides of the disclosed embodiment; FIG. 29 is a schematic elevation view of one substrate handler passing next to another substrate handler inside a transfer chamber according to the sides of the disclosed embodiment; FIG. 30 is a partial schematic diagram of an actuator control system network showing dynamic phase assignment according to aspects of the disclosed embodiment; FIGS. 31a and 31b illustrate tilt control of a platen using a conventional linear drive system and static phase control; FIGS. 32a and 32b illustrate tilt control of a portion of a substrate handler using an actuator control system network having dynamic phase assignment and a virtual multi-phase actuator unit according to aspects of the disclosed embodiment; FIG. 32c illustrates electrical phase angle control by an actuator control system network for realizing independent propulsion and lifting control of a substrate handler according to aspects of the disclosed embodiment; FIG. 33 is a schematic front view of a conventional transfer device; FIG. 34 is a schematic plan view of a conventional transfer device of FIG. 33; FIG. 35 is a diagram showing the waveform of the floating current in the conventional transfer device of FIG. 33; FIG. 36 is a diagram showing the waveforms of three alternating currents for transfer in the conventional transfer device of FIG. 33; FIG. 37 is a schematic plan view of a conventional substrate processing apparatus; FIG. 38 is a schematic plan view of a conventional substrate processing apparatus; FIG. 39 is a schematic diagram of a cluster control architecture according to aspects of a disclosed embodiment; FIG. 40a is a schematic diagram of a PVT frame according to aspects of a disclosed embodiment; FIG. 40b is a schematic diagram of a PVT-FG frame according to aspects of a disclosed embodiment; FIG. 41 is a flowchart of an exemplary method according to aspects of the disclosed embodiment; FIG. 42 is a flowchart of an exemplary method according to aspects of the disclosed embodiment. Specific details for implementing the invention

[0076] FIGS. 1-14 illustrates exemplary substrate processing apparatuses (100, 100A, 200, 300, 400, 500, 800, 900, 1200, 1300) according to aspects of the disclosed embodiments. Although aspects of the disclosed embodiments will be described with reference to the drawings, it should be understood that aspects of the disclosed embodiments may be implemented in many forms. Additionally, any suitable size, shape, or type of elements or materials may be used.

[0077] Based on the problems and limitations of the conventional substrate processing device mentioned above, it is desirable to have a new and innovative substrate handler and an associated control framework configured to operate in a vacuum environment without bearings and lubricants, to perform substrate transfer over an scalable distance without affecting the substrate handler design, to transfer substrates at a higher acceleration than the conventional solutions mentioned above (without requiring a new end effector material), and to operate multiple substrate handlers in a cooperative manner to avoid collisions and reduce the footprint of the substrate transfer device.

[0078] Referring to FIGS. 15a-15c, the wafer handler (1500) is part of a linear electric machine (1599) (which will be described in more detail here and is also referred to as an electromagnetic conveyor substrate transfer device) included in the substrate processing device of FIGS. 1-14. The wafer handler (1500) comprises a paramagnetic platen (1510) (also referred to as a reaction platen) (e.g., made of copper, aluminum, or other suitable diamagnetic or non-magnetic material capable of inducing eddy currents), and this base (1510) is formed to perform at least bidirectional linear induction propulsion and independent rotation of the base (1510) along the direction of linear tracks (1550) formed by at least one linear induction motor stator (1560). The wafer handler (1500) also includes an end effector (1520) that is firmly attached to a base (1510) and configured to stably hold a substrate for transport across each chamber of the substrate processing device. The wafer handler (1500) is controlled by an actuator and sensor control unit as described herein so that the configuration of the wafer handler (1500) does not depend on the stroke distances that the wafer handler (1500) can cover (or can extend). The independence of the wafer handler configuration (1500) is realized by using a network of actuators (1700) and sensors (2000) physically distributed along at least the length of the substrate processing device described herein (e.g., along the length of the transport chamber (118)) (shown and described in more detail in connection with FIGS. 17-20 and 39).In aspects of the disclosed embodiments, the actuators (1700) and sensors (2000) are not connected to any specific substrate handler (1500); rather, the same actuators (1700) and sensors (2000) can control multiple substrate handlers (1500) simultaneously (which are common to multiple substrate handlers (1500)), and this reduces the cost of ownership of the substrate handlers (1500) because the substrate handlers (1500) can be added to or removed from the substrate processing unit without the addition of additional actuators and sensors. Simultaneous control of a plurality of substrate handlers (1500) with common actuators (1700) and sensors (2000) is performed by a control system according to aspects of the disclosed embodiment (described in more detail below), and the control system is configured to dynamically assign the excitation phase of each actuator coil unit (also called an electromagnet) of the common actuators (1700) between different excitation phases in such a way that it provides a continuity of force vectors for performing wafer handler motion in three-dimensional space by controlling up to 6 degrees of freedom from the common (set) actuators (1700). As described herein, the simultaneously controlled substrate handlers (1500) can have their roll, pitch, and / or yaw controlled, so that two or more independently operated substrate handlers (1500) can reduce the distance between the substrate handlers (1500) by tilting each of the substrate handlers (1500) (or at least one of the substrate handlers (1500)) along a rotation axis substantially parallel to the direction of motion thrust (see, for example, FIG. 29).

[0079] As mentioned above, conventional robotic manipulators with articulated links require substantially different mechanical designs because the required stroke of the manipulators increases to reach a greater number of process modules, which can increase the cost of the robotic manipulators and shorten their service life. In contrast to conventional substrate handling systems, aspects of the disclosed embodiments are significantly scalable compared to existing generally accepted substrate handling solutions (such as those described above) without adding complexity and reliability issues due to an increased number of mechanical elements. Aspects of the disclosed embodiments also yield substantially higher substrate throughput compared to conventional substrate handling solutions. As described herein, aspects of the disclosed embodiments include an innovative motion sensing control framework that tilts the substrate holding surface of the substrate handler end effector toward the direction of travel to provide higher acceleration compared to conventional substrate handling solutions while maintaining contact between the wafer and the end effector without slippage.

[0080] As described in more detail herein, aspects of the disclosed embodiments provide a magnetic levitation substrate transfer device based on linear induction technology configured to provide lift, lateral stabilization, and thrust to a substrate handler. Aspects of the disclosed embodiments also provide linear induction motor stators that operate on independently controlled linear tracks and / or form arched or rotary paths over a two-dimensional region inclined in a direction between an orthogonal or substantially parallel direction and a substantially orthogonal direction. Aspects of the disclosed embodiments provide a coil controller configured to generate alternating current at a defined frequency and amplitude for each phase of each linear induction motor stator associated with each linear track (1550). The thrust provided by the linear tracks is controlled to rotate the base (1510) independently of the linear movement of the base along the tracks, wherein the thrust creates a moment load around the rotation axis of the base (1510).

[0081] Aspects of the disclosed embodiments include a control system configured to track the position of the base (1510) and control the phase currents of the independent linear tracks (1550) in order to control the motion of the base (1510) along the desired propulsion direction along the independent linear tracks (1550). The control system according to the aspects of the disclosed embodiments also provides motion of the base (1510) in the lift direction while maintaining lateral stabilization of the base (1510). The above control system is configured to generate propulsion by linear tracks (1550) to control the roll, pitch, and yaw of the substrate handler (1500), wherein the roll, pitch, and yaw motions of the substrate handler (1500) may be employed to maximize substrate production throughput by adjusting the tilt of the substrate handler (1500) according to the desired acceleration of the substrate handler (1500) in the direction of linear and / or rotational motion (e.g., see FIG. 21) to increase the acceleration threshold along the direction of thrust of the substrate handler (1500).

[0082] Aspects of the disclosed embodiments include a sensor processing unit (1850) (see FIG. 18), which may be part of a sensor and control network, such as EtherCat® (Ethernet for control automation technology, referred to as ECat in FIG. 18), EtherNet® (referred to as ENet in FIG. 18), or other suitable sensor and control network. The sensor processing unit includes general-purpose sensor and processing hardware (including non-transient computer program code or software) configured to interface with multiple sensor technologies, such as a camera (1810), a CCD array (1811), an accelerometer (1812), a temperature sensor (1813), a proximity or distance sensor (1814), a magnetic sensor (1815), a vibration sensor (1816), or any other suitable sensor.

[0083] Referring to FIG. 1a, a schematic plan view of a substrate processing device (100) including aspects of the disclosed embodiment is shown. The substrate processing device (100) is connected to an environment front end module (EFEM) (114) having a plurality of load ports (112) as shown in FIG. 1a. The load ports (112) may support a plurality of substrate storage canisters (171), such as a conventional FOUP canister, for example, but any other suitable type may be provided. The EFEM (114) communicates with the processing device through load locks (116) connected to the processing device, as described in more detail below. The above EFEM (114) (which may be open to the atmosphere) has a substrate transfer device (not shown—but similar to the linear electromechanical device (1599) described herein in some aspects) capable of transferring substrates from load ports (112) to load locks (116). The above EFEM (114) may further include substrate alignment capability, batch handling capability, substrate and carrier identification capability, etc. In other aspects, the load locks (116) may interface directly with the load ports (112), such as when the load locks have batch handling capability or when the load locks have the capability to transfer wafers directly from the FOUP to the load lock. Some examples of such devices are disclosed in U.S. Patent Nos. 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,644,925, 5,954,472, 6,120,229, and 6,869,263, all of which are incorporated herein by reference in their entirety. In other aspects, other load lock options may be provided.

[0084] Referring still to FIG. 1a, the processing device (100) may be used to process semiconductor substrates (e.g., wafers of 200 mm, 300 mm, 450 mm, or other suitable sizes), flat panel display panels, or any other desired type of substrate, and generally comprises a transfer chamber (118) (which maintains a sealed atmosphere inside on one side), processing modules (120), and at least one substrate transfer device or linear electric machine (1599). The substrate transfer device (1599) is integrated with the chamber (118) on the illustrated side or coupled to the chamber in any suitable manner as described herein. On this side, the processing modules (120) are mounted on both sides of the chamber (118). On other sides, the processing modules (120) may be mounted on one side of the chamber (118), for example, as shown in FIG. 2. In the aspect illustrated in FIG. 1a, the processing modules (120) are mounted facing each other in rows (Y1, Y2) or vertical planes. In other aspects, the processing modules (120) may be arranged staggeredly on opposite sides of the transfer chamber (118) or stacked vertically relative to each other. Referring also to FIG. 15a-15c, the transfer device (1599) has a substrate handler (1500) that moves within the chamber (118) to transfer substrates between the load locks (116) and the processing chambers (120). In the illustrated aspect, only one substrate handler (1500) is provided; however, in other aspects, more than one substrate handler may be provided.As illustrated in FIG. 1a, the transfer chamber (118) (which maintains a vacuum or inert atmosphere or simply a clean environment or a combination thereof) has a configuration and employs a novel substrate transfer device (1599) that allows processing modules (120) to be mounted in the chamber (118) in a Cartesian arrangement having processing modules (120) arranged in substantially parallel vertical planes or rows. This allows the processing device (100) to have a more compact footprint than comparable conventional processing devices as described herein. Furthermore, the transfer chamber (118) may be provided to have any desired length to add any desired number of processing modules (120) to increase throughput (i.e., the length may be extended), as described in more detail below. The transfer chamber (118) can also support any desired number of transfer devices (1599) within it and allow the transfer devices (1599) to reach any desired processing chamber (120) coupled to the transfer chamber (118) without interfering with each other. This effectively separates the throughput of the processing device (100) from the handling capability of the transfer device (1599), and thus the throughput of the processing device (100) becomes a limitation of processing rather than a limitation of handling. Accordingly, throughput can be increased as desired by adding a handling capability corresponding to the processing modules (120) to the same platform.

[0085] Referring still to FIG. 1a, the transfer chamber (118) has a general rectangular shape on this side, but on other sides, the chamber may have any other suitable shape. The chamber (118) has a slander shape (i.e., a length much longer than its width) and forms a generally linear transfer path for the transfer device (1599) inside. The chamber (118) has longitudinal side walls (118S). The side walls (118S) have through-formed transfer openings or ports (118O) (also referred to as substrate passing openings). The transfer ports (118O) are large enough to allow substrates to pass through the ports (which can be sealed via valves) into or out of the transfer chamber (118). As illustrated in FIG. 1a, the processing modules (120) are mounted outside the side walls (118S) such that, in this aspect, each processing module (120) is aligned with the corresponding transfer port (118O) within the transfer chamber (118). As can be understood, each processing module (120) may be sealed against the sides (118S) of the chamber (118) around the periphery of the corresponding transfer opening to maintain a vacuum within the transfer chamber. Each processing module (120) may have a valve controlled by any suitable means to close the transfer port if desired. The transfer ports (118O) may be located within the same horizontal plane. Thus, the processing modules on the chamber are also aligned within the same horizontal plane. In other aspects, the transfer ports (118O) may be positioned within different horizontal planes. As illustrated in FIG. 1a, in this aspect, load locks (116) are mounted on the chamber sides (118S) at two foremost transfer ports (118O). This allows the load locks (116) to be adjacent to the EFEM (14) located in front of the processing device.In other aspects, the load locks (116) may be located at any other transfer ports (118O) on the transfer chamber (118), for example, as shown in FIG. 2. The hexahedral shape of the transfer chamber (118) allows the length of the chamber to be selected as desired to accommodate any number of rows of processing modules (120) (for example, see FIG. 1b, 3, 4-7 showing other aspects in which the length of the transfer chamber (118) is configured to accommodate any number of processing modules (120).

[0086] As described above, the side transfer chamber (118) illustrated in FIG. 1a has a substrate transfer device (1599) having a single substrate handler (1500). The transfer device (1599) is integrated with the chamber (118) to translate the substrate handler (1500) back and forth within the chamber (118) between the front (118F) and the rear (118R). The substrate handler (1500) of the substrate transfer device (1599) has at least one end effector (1520) for holding one or more substrates.

[0087] It should be understood that the transfer device (1599) illustrated in FIG. 1a is a typical transfer device and includes a substrate handler (1500) magnetically supported by linear tracks (1550). The transfer device (1599) will be described in more detail below. The transfer chamber (118) may form a frame having a level reference plane (1299) (e.g., forming a wafer transfer plane (1290) or a corresponding (e.g., substantially parallel) – see FIG. 12b), and the linear tracks (1550) may be mounted on the side walls (118S) or bottom of the transfer chamber (118) and may extend the length of the chamber (118). This allows the substrate handler (1500) to traverse the length of the chamber (118). As described in more detail below, the linear tracks (1550) of FIG. 1a each comprise an array (1700) of electromagnets or actuators, which is also referred to herein as a network of actuators (e.g., forming at least one linear induction motor stator (1560)) as in FIG. 14a, 15b, 15b, 16b, 16c, and 17, and is connected to a transfer chamber (118) to form a driving plane (1598) at a predetermined height (H) relative to a reference plane (1299). The array (1700) of the electromagnets is arranged such that a series of electromagnets (1700) form at least one drive line within a drive plane (1598), and each of the electromagnets (1700A-1700n) (see FIG. 15b) is coupled to an alternating current (AC) power source (1585) that supplies power to each electromagnet (1700A-1700n). Here, the alternating current power source is, in one aspect, a three-phase alternating current power source.As mentioned above (see FIG. 15a), the base or reaction platen (1510) is formed of a paramagnetic, diamagnetic, or nonmagnetic conductive material arranged to cooperate with the electromagnets (1700A-1700n) of an array of electromagnets (1700), so that the excitation of the electromagnets (1700A-1700n) by alternating current from an alternating current power source (1585) generates an excitation force (FZ) and a thrust force (FP) (see FIG. 21) on the base (1510), and this excitation force and thrust force controllably levitate and propel the base (1510) along at least one drive line (177-180) (e.g., see FIG. 1-8) in a controlled position relative to the drive plane (1598).

[0088] FIG. 1b shows another side of the substrate processing device (100A), which is generally similar to the device (100). In this side, the transfer chamber (118) has two substrate handlers (1500A, 1500B) that are operated independently by an array of electromagnets (1700) (as in FIG. 16c). The substrate handlers (1500A, 1500B) are substantially identical to the substrate handler (1500) of the previously described side. Both of the substrate handlers (1500A, 1500B) can be supported by a common array of electromagnets (1700) as previously described. The base (1510) of each substrate handler (1500A, 1500B) can be driven by at least one linear induction motor stator (1560) identical to that described herein by individually controlling each coil element or electromagnet (1700A-1700n) (as in FIG. 15b). Thus, as can be seen, the end effector (1520) of each substrate handler (1500) can be moved independently in linear motion and / or rotation using at least one linear induction motor stator (1560). However, in this aspect, the substrate handlers (1500A, 1500B) cannot pass each other within the transfer chamber (118) because the transfer chamber (118) contains only one drive line (177) (compared to a transfer chamber having a number of substantially parallel drive lines as shown in FIG. 8-10). Accordingly, the processing modules (120) are arranged along the length of the transfer chamber (118) so that the substrate can be transferred to be processed within the processing modules in an order that avoids interference between the substrate handlers (1500A, 1500B). For example, the processing modules for coating may be located before the heating modules, and the cooling modules and etching modules may be located last.

[0089] However, referring to FIG. 8-10, the transfer chamber (118) may have any suitable width to provide two or more substantially parallel drive lines (177, 178) extending along at least a portion of the longitudinal length of the transfer chamber (118) so that two substrate handlers (1500A, 1500B) pass adjacent to each other (similar to a side rail or bypass rail). In the sides illustrated in FIG. 8-10, the transfer device (1599) has two drive lines (177, 178), but in other sides, any suitable number of substantially parallel longitudinally extending drive lines may be provided.

[0090] According to some aspects of the disclosed embodiments, the array of electromagnets (1700) (or at least part thereof) may also be used as a heater for a wafer handler, such as when it is desirable to remove wafer vapor (e.g., gas) or potentially preheat a wafer / substrate picked from a load port while en route to a processing module, or otherwise reduce the thermal gradient between the wafer in the processing module and the end effector of the wafer handler (e.g., to control heating of the wafer handler to a desired predetermined temperature for a desired predetermined time). Heating of the wafer handler may be performed by a reaction platen during transfer or by a reaction platen held in a fixed position at a predetermined place / location. Still, according to some aspects of the disclosed embodiments, the array of electromagnets (1700) (or at least part thereof) may also be used as a heater when it is desirable for the transfer chamber (118) to be heated for gas removal, such as when removing water vapor. Controlled heating of the transfer chamber (118) to a predetermined temperature for a predetermined time may be achieved by a fixed reaction platen. The controlled heating of the transfer chamber (118) may facilitate thermal scanning by appropriate thermal sensors / infrared sensors of the transfer chamber (118) to confirm the presence of the reaction platen inside the transfer chamber (118) and map its location, for example, during a cold start or power cut of the transfer chamber (118) and the drive unit.

[0091] Now, referring to FIGS. 4 and 5, other substrate processing apparatuses (400, 500) according to other aspects of the disclosed embodiment are illustrated. As illustrated in FIGS. 4 and 5, the transfer chamber(s) (118, 118A, 118B, 118C) are elongated to accommodate additional processing modules (120) in these aspects. The apparatus illustrated in FIG. 4 has 12 processing modules (120) connected to the transfer chamber (118). The processing apparatus (500) of FIG. 5 is illustrated as having two transfer chambers (118A, 118B) joined together by a bridging chamber (118C), said bridging chamber (118C) provides for the movement of substrate handlers (1500) between the transfer chambers (118A, 118B). Here, each transfer chamber (118A, 118B) of FIG. 5 has 24 processing modules (120) connected thereto. The number of processing modules (120) shown in these aspects is merely exemplary, and the substrate processing device may have any other number of processing modules (120) as previously described. The processing modules (120) are arranged along the sides of each transfer chamber (118A, 118B) in a Cartesian arrangement similar to that previously discussed in these aspects. However, in these aspects, the number of columns of processing modules (120) has been greatly increased (e.g., 6 columns in the device of FIG. 4, and 12 columns in each of the devices of FIG. 5). In the aspect shown in FIG. 4, the EFEM may be removed, and the load ports (112) may be directly coupled to the load locks (116). The transfer chambers of the substrate processing apparatus (400, 500) of FIGS. 4 and 5 may have multiple substrate handlers (1500) to handle substrates between the load locks (116) and the processing chambers (120). The number of substrate handlers (1500) shown is merely an example, and more or fewer devices may be used.The substrate transfer device (1599) (parts thereof shown in FIGS. 4 and 5) is generally similar to the previously described one, which includes linear tracks (1550) and substrate handler(s) (1500) in these aspects. In the aspects shown in FIGS. 4 and 5, only a single longitudinal drive line (e.g., drive line (177, 178, 179)) is shown within each chamber (118, 118A, 118B, 118C), but it should be understood that in other aspects, multiple drive lines may extend longitudinally along each chamber (118, 118A, 118B, 118C) in a manner substantially similar to that shown in FIGS. 8-10. As can be understood, as in other substrate processing devices (100, 100A, 200, 300, 800, 900, 1200, 1300) described herein, the substrate processing device (400, 500) has a controller (199) for controlling the movement of one or more substrate handlers (1500) of the substrate transfer device (1599).

[0092] Referring still to FIG. 5, the transfer chambers (118A, 118B) can be directly coupled to a tool (300) (e.g., a stocker, a photolithography cell, or other suitable processing tool) in this case, and substrates are transferred to the tool (300) through the chamber (118C) and removed from the tool (300).

[0093] As can be seen from FIGS. 1b, 3 and 4-5, the transfer chamber (118) may extend as desired throughout the entire processing facility (P) (Fig. 5, and an example thereof shown in FIG. 7). As shown in FIG. 5 and as described in more detail below, the transfer chamber (generally referred to as the transfer chamber (118)) may connect and communicate with various sections or bays (118P1-118P4) within the processing facility (P), such as, for example, storage, lithography tools, metal deposition tools, or any other suitable tool bays. The bays interconnected by the transfer chamber (118) may also be configured as process bays or processes (118P1, 118P3). Each bay has the desired tools (e.g., lithography, metal deposition, heat absorption, cleaning) to perform a given manufacturing process on a semiconductor workpiece. In any case, the transfer chamber (118) has processing modules (120) corresponding to various tools of equipment bays that are communically connected as previously described, in order to allow the transfer of semiconductor workpieces between the chamber (118) and the processing modules (120). Accordingly, the transfer chamber (118) corresponds to the environments of the various processing modules connected to the transfer chamber and, along its entire length, to atmosphere, vacuum, ultra-high vacuum (e.g., 10 -5 It may include Torr), inert gas, or any other different environmental conditions.

[0094] Accordingly, a section (118P1) of the chamber within a given process or bay or part of a bay may have, for example, one environmental condition (e.g., atmosphere), and other sections (118P2, 118P3) of the chamber (118) may have different environmental conditions. As previously mentioned, sections (118P1-118P4) of the chamber (118) having different internal environments may be located within different bays of the facility or all may be within a single bay of the facility. FIG. 5 shows a chamber (118) having four sections (118P-118P4) having different environments only for exemplary purposes. The chamber (118) may have as many sections having as many different environments as desired in this respect.

[0095] As illustrated in FIG. 5, substrate handlers (1500) within the transfer chamber (118) can move between sections (118P1-118P4) of the chamber (118) having different environments within them. Thus, as can be seen from FIG. 5, each of the substrate handlers (1500) can move a semiconductor workpiece in a single picking operation from a tool in one process or bay of the processing facility to another tool having a different environment in a different process or bay of the processing facility. For example, a substrate handler (1500A) can pick a substrate within a processing module (301), which may be an atmospheric module, lithography, etching, or any other desired processing module within section (118P1) of the transfer chamber (118). Next, the substrate handler (1500A) may move from section (118P1) of the chamber (118) to section (118P3) along a drive line (177) (or a drive line substantially parallel thereto if one or more drive lines are provided) (e.g., if other substrate handlers (1500) are controlled in any suitable manner to avoid interference with the substrate handler (1500A). In section (118P3), the substrate handler (1500A) may place a substrate within a processing module (302), which may be any desired processing module.

[0096] As can be seen from FIG. 5, the transfer chamber (118) may be modular, having as many connected chamber modules as desired to form the chamber (118) (for example, the chamber (118) is formed by three chamber sections (118A, 118B, 118C), wherein each chamber section (118A, 118B, 118C) may also include one or more chamber modules joined together in any suitable manner). Referring also to FIG. 1a, the modules may include inner walls (118I) similar to the walls (118F, 118R) of FIG. 1a to separate the sections (118P1-118P4) of the chamber (118). The inner walls (18I) may include slot valves, or any other suitable valve that allows one section (118P1-118P4) of the chamber to communicate with one or more adjacent sections. The slot valves (118V) may be sized to allow one or more substrate handlers (1500) to move from one section (118P1-118P4) to another section through the valves (18V). In this way, the substrate handlers (1500) can move anywhere throughout the chamber (118). The valves (118V) may be closed to isolate the sections (118P1-1184) of the chamber (118) so that different sections may contain heterogeneous environments as previously described. Additionally, the inner walls (118I) of the chamber modules may be arranged to form load locks (see section (118P4)) as illustrated in FIG. 5. The above load locks (118P4) (only one is shown in FIG. 5 for exemplary purposes) can be placed in the chamber (118) as desired and can hold any number of substrate handlers (1500) inside.

[0097] In the aspect illustrated in FIG. 5, the processes inside the chamber sections (118A and 118B) may be the same processes, e.g., etching, where a processing unit (500) including a tool (300) (e.g., a stocker) can process substrates without any associated material handling overhead involved in transferring FOUPS from the stocker to individual processing modules (120) via an automated material handling system and transferring individual wafers to individual processing modules (120) via an EFEM. Instead, a robot inside the stocker transfers the FOUPS (171) directly to load ports (three load ports per chamber section are illustrated, but more or fewer may be provided depending on throughput requirements), where wafers are moved in batches to load locks and sent to individual processing module(s) according to the desired process and / or required throughput. The chamber sections (118A, 118B) or the stoker (300) may further have the measurement capability, sorting capability, material identification capability, testing capability, inspection capability, etc. required to effectively process and test substrates.

[0098] In the aspect of the disclosed embodiment illustrated in FIG. 5, more or fewer chamber sections (118A and 118B) having different processes, e.g., etching, CMP, copper deposition, PVD, CVD, etc., may be provided, wherein the chamber sections (118A, 118B, etc.) may be combined with a tool (300), e.g., a photolithography cell, to process substrates without the associated material handling overhead of transferring FOUPs from a stocker to individual process tool bays and lithography bays via an automated material handling system and transferring individual wafers to individual processing tools via an EFEM. Instead, automation within the lithography cell transfers FOUPS, substrates, or materials directly to load ports (112) (again, three load ports per chamber section / process type are illustrated, but more or fewer load ports may be provided depending on throughput requirements), where the substrates are sent to individual processes according to the desired process and / or required throughput. An example of such an alternative is illustrated in FIG. 7. In this way, the device of FIG. 5 processes substrates with lower cost, smaller footprint, and fewer WIPs (compared to the conventional processing systems described herein), and consequently, there are significant advantages to the manufacturing plant operator with lower inventory, faster turnover, and higher levels of contamination control when considering the time to process a single carrier lot (or "hot lot"). The chamber sections (118A, 118B) (each of which may be referred to as a tool or tool section) or the tool or cell (300) may further possess the metrology, processing, sorting, material identification, testing, inspection, etc. required to effectively process and test substrates. As can be seen from FIG. 5, the chamber sections (118A, 118B) and the tool (300) may be combined to share a common control environment (e.g., an inert atmosphere or a vacuum).This ensures that the substrates are maintained within a controlled environment from the tool (300) and throughout the substrate processing device (500). This eliminates the use of special environmental control of the FOUP, as in conventional substrate processing devices such as those shown in FIG. 37 and 38.

[0099] Referring to FIG. 7, an exemplary manufacturing facility layout (601) including aspects of the disclosed embodiment illustrated in FIG. 5 is shown. Wafer handlers (406) are similar to wafer handlers (1500) and transfer substrates or wafers through transfer chambers (602, 604, 606, 608, 610, 612, 614, 616, 618, 620, 624, 626) through process steps within the manufacturing facility (601). Process steps may include epitaxial silicon (630), dielectric deposition (632), photolithography (634), etching (636), ion implantation (638), rapid thermal processing (640), metrology (642), dielectric deposition (644), etching (646), metal deposition (648), electroplating (650), and chemical mechanical polishing (652). In other aspects, more or fewer processes, such as etching, metal deposition, heating, and cooling operations, may be included in the same order or mixed. As previously mentioned, wafer handlers (406) may transport a single wafer or multiple wafers, and may have a transport capability such as, for example, the ability to pick processed wafers and place unprocessed wafers in the same module. Wafer handlers (406) may move through isolation valves (654) for direct transfer from tool to tool or bay to bay, or transfer from process to process. The valves (654) may be sealed valves or simply conductance type valves depending on the pressure difference or difference of gas species on either side of the given valve (654). In this way, wafers or substrates can be transferred from one process step to the next step in a single handling step or "one touch." Consequently, contamination due to handling is minimized.Examples of such pressure or species differences may be, for instance, clean air on one side and nitrogen on the other, or one side at a coarse pressure vacuum level and the other at a high vacuum level, or one side at a vacuum and the other at nitrogen. Load locks (656), similar to the chamber (118P4) of FIG. 5, may be used for transitions between one environment and another, for example, between vacuum and nitrogen or argon. In other aspects, other pressures or species may be provided in any number of combinations. Load locks (656) may transfer a single wafer handler or multiple wafer handlers in a manner substantially similar to that described herein, provided that a single drive line or multiple substantially parallel and / or orthogonal drive lines are provided. Alternatively, substrate(s) may be transferred onto shelves (not shown) or into the load lock (656) where it is not desirable for the wafer handler (406) to pass through the valve. Additional features (658), such as alignment modules, measurement modules, cleaning modules, processing modules (e.g., etching, deposition, polishing, etc.), heat control modules, etc., may be integrated within the load lock (656) or transfer chambers. Service ports (660) may be provided to remove wafer handlers (406) or wafers from the tool. Wafer or carrier stockers (662, 664) may be provided to store wafers and to buffer or test them. In other aspects, for example, if the cart is directed directly to the lithography tool, stockers (662, 664) may not be provided. Another example is when an indexer or wafer storage module (666) is provided in the tool set. A recirculation unit (668) may be provided to circulate and / or filter air or gas species within any given section, such as the tool section (612).The recirculation unit (668) may have gas purge, particle filters, chemical filters, temperature control, humidity control, or other features to control the gas species being processed. Within a given tool section, more or fewer recirculation and / or filter or control units may be provided. Isolation stages (670) may be provided to isolate wafer handlers (406) and / or wafers from different processes or tool sections that cannot be cross-contaminated. Load locks or interconnects (672) may be provided to change the orientation or direction of the wafer handler (406) so that the wafer handler (406) can pick or place a workpiece within the general workspace without changing its orientation. Any suitable combination of process sequences or configurations may be provided in other aspects or methods.

[0100] Now, referring to FIG. 6, the controller (199) controls the thrust generated by the array of electromagnets (1700) across the base (1510) to impose a controlled yaw moment on the base, thereby yawing the base (1510) from a first predetermined orientation (such as when the end effector (1520) is substantially aligned with the drive line (177)) to a second different predetermined orientation (such as when the end effector extends into the processing module (120)) about the frame of the chamber (118) around a yaw axis (e.g., rotation axis (777)) that is substantially perpendicular to the drive plane (1598). As can be seen, the yawing of the base (1510) can be performed in conjunction with the propulsion motion of the base (1510) (e.g., when a single drive line is provided within the chamber (118)) or with the base at a predetermined position (e.g., when the base (1510) is rotating while maintaining a substantially stationary state along the X and Y axes). In one aspect, referring together with FIG. 15c, the controller (199) controls the thrusts (e.g., FXright, FXleft) generated by the array of electromagnets (1700) to impart a moment couple to the base (1510) (as shown in FIG. 15c along with the movement of the substrate handler (1500) along the X-axis), thereby executing a controlled yaw of the base (1510) to perform at least one of positioning and centering of the substrate (also referred to as wafer payload or payload) relative to the base (1510) in relation to a predetermined substrate holding position (e.g., load lock, processing module, etc.) of the frame of the chamber (118).As can be seen, pitch (rotation around the Y-axis) and roll (rotation around the X-axis) (see FIG. 15a and 15b) control can be performed by a controller (199) (controlling lift forces (FZ) across the reaction platen) simultaneously with a yaw motion that counteracts dynamic moment coupling and maintains a substantially flat yaw of the wafer holder / reaction platen in the wafer transfer plane.

[0101] In the case where a single drive line (177) is provided within each transfer chamber (as shown in FIG. 1a, 1b, 2, 4 and 5) or where a plurality of substantially parallel longitudinal drive lines (177, 178) are provided (see FIG. 8), in the case of access to the processing module, e.g., the processing module (120A) from the drive line (178) closest to the processing module (120A), the controller (199) is configured to drive the base (1510) simultaneously in two or more of yaw, pitch, roll and thrust (as described herein) to pick and place substrates from any suitable substrate holding stations (e.g., load locks (116), processing modules (120), etc.). For example, the controller (199) is configured to power actuators (1700) as described herein so that the base moves along the drive line (177) and rotates around the base rotation axis (777), thereby allowing the substrate mounting surface (1520A) of the substrate handler (1520) to enter the processing module (120) or other suitable holding station, where the substrate (S) moves along a substantially straight path (790) in a predetermined wafer / substrate transfer plane. Referring to FIG. 8-11, in other aspects where a plurality of longitudinal drive lines (177, 178) are provided within the transfer chamber (118), the base (1510) may be rotated so as to be aligned with the desired / determined substrate holding station before the substrate handler (1520) enters the substrate holding station. For example, the base (1510) may be located at the intersection between the drive lines (178 and 179A), where the drive line (179) provides the extension and retraction of the substrate handler into the substrate holding station (120BH) of the processing module (120B) (for example, in a direction of propulsion substantially orthogonal to the direction of propulsion along the drive lines (177, 178) (or any suitable angle of propulsion that enables access to the processing module).The base (1510) can be rotated around a rotation axis (777) so that the substrate handler (1520) is aligned with the substrate holding station (120BH), and the base can move along a drive line (179A) to move or extend the substrate handler (1520) into the substrate holding station (120BH) for picking / placing substrate(s).

[0102] Referring to FIGS. 14 and 14a-14c, although the substrate handler (1500) is described as including an end effector (1520), in other aspects, one or more substrate handlers may be configured as a cart (1500C) configured to support one or more substrates on a base (1510). For example, the base (1510) may include one or more substrate supports (1431-1433) configured to reliably hold a substrate (e.g., from a bottom or edge grip), thereby enabling substrate handlers (1500, 1500A, 1500B) or substrate transport devices within a load or other substrate holding station to transport the substrate(s) to and from the substrate supports (1431-1433). In one aspect, the substrate supports (1431-1433) may be configured to substantially center one or more substrates on the base (1510) such that the center of the substrate(s) substantially coincides with the rotation axis (777) of the base (i.e., the supports are self-centering supports, which may be passive supports or actuated from a suitable power source applied to the reaction platen (e.g., piezoelectrically). In some aspects, one or more of the carts (1500C) may include a substrate support rack (1440) for stacking and holding two or more substrates, wherein each rack level includes individual substrate supports (1431-1433, 1431A-1433A). Referring to FIG. 14 and 14a, the carts (1500C) may provide an interface between substrate handlers (1500A, 1500B) and load locks (116), wherein a transfer device (116R) of the load lock (e.g., SCARA arm, linear sliding arm, etc.) transfers substrate(s) to the cart (1500C) and the substrate handlers (1500A, 1500B) pick substrates from the cart, and vice versa.In other aspects, where the processing module (120) includes a transfer device (120R) (e.g., a SCARA arm, a linear sliding arm, etc.), carts (1500C) may be employed to transfer substrate(s) to or from the processing module (120). Although the base (1510) of the carts (1500C) (and substrate handlers (1500, 1500A, 1500B)) is depicted as having a circular shape when viewed from above (see FIG. 14c), in other aspects, the base (1510) may have any suitable shape (e.g., square, rectangular, circular, etc. when viewed from above) that interfaces in a different way with the array of electromagnets (1700) to perform one or more of linear propulsion, lifting, yaw, pitch, roll, and rotational control of the base (1510).

[0103] Referring to FIGS. 12a, 12b, 13a, and 13b, the transfer chamber (118) has been described above as a longitudinally extended chamber forming part of a linear processing tool, but in other aspects, the transfer chamber may have a cluster tool configuration. For example, referring to FIGS. 12a and 12b, the transfer chamber (118T1) has a substantially square configuration (however, in other aspects, the transfer chamber may have any suitable shape such as a hexagon, octagon, etc.). In this aspect, the electromechanical machine (1599R) (substantially similar to the linear electromechanical machine (1599)) is configured as a side-by-side transfer device comprising at least two side-by-side substrate handlers (1500A, 1500B) substantially similar to the substrate handler (1500) described herein. The array of electromagnets (1700) is configured to move the substrate handlers (1500A, 1500B) in this aspect so that the substrate handlers (1500A, 1500B) rotate around a common rotation axis (1277) (such an axis is similar to, for example, the θ axis of a conventional SCARA type robot) to change the "extension and retraction" direction of the parallel transfer device (note that the terms extension and retraction are used for convenience, and extension and retraction are performed by the linear propulsion motion of the substrate handlers (1500, 1500A, 1500B) along each drive line). For example, the array of electromagnets (1700) has an arrangement forming drive lines (177, 178, 179, 180). Here, the drive lines (177, 178) are spaced apart from each other and are substantially parallel to each other so as to be substantially aligned with each transfer opening (1180A, 1180F and 1180B, 1180E). The drive lines (179, 180) are substantially orthogonal to the drive lines (177, 178), spaced apart from each other, and are substantially parallel to each other so as to be substantially aligned with each transfer opening (1180C, 1180H and 1180D, 1180G).The above drive lines may be of any suitable pattern (e.g., arcs or curved segments having a constant or varying radius) and direction, and the following description is for illustrative purposes. Electromagnets (1700A-1700N) (shown in FIG. 12a but not numbered for clarity of the drawing) provide at least linear propulsion of substrate handlers (1500A, 1500B) through transfer openings (1180A-1180H). In this aspect, the array of electromagnets (1700) also includes electromagnet sub-arrays (1231-1234) that execute rotation of substrate handlers (1500A, 1500B) around a common axis of rotation (1277) with electromagnets forming drive lines (177-180), under the control of the controller (199). Alternatively, the electromagnets may form a sufficiently dense and sufficiently large grid that is not specifically designated for propulsion or rotation and may perform their function based on the position of the base (1510) and the control law of the controller (199). As can be understood, the substrate handlers (1500A, 1500B) may rotate simultaneously around a common rotation axis (1277), but the extension and retraction of the substrate handlers (1500A, 1500B) may be independent of the extension and retraction of the other substrate handler (1500A, 1500B). Generally, the motions of the substrate handlers (1500A, 1500B) are independent of each other, and the complexity of the motion may range from 1 degree of freedom to 6 degrees of freedom.

[0104] Referring to FIG. 12b, in one aspect, the electric machine (1599R) comprises multiple transfer levels (1220A, 1220B) one stacked on top of the other. In this aspect, each level (1220A, 1220B) is formed by each level support (1221) having each reference plane (1299R) substantially parallel to the level reference plane (1299) of the transfer chamber (118T1) frame. Each level support (1221) comprises an array (1700) of electromagnets substantially similar to those shown in FIG. 12a to linearly drive parallel substrate handlers (1500A, 1500B) along drive lines (177-180) and to rotate the parallel substrate handlers (1500A, 1500B) around a common rotation axis (1277) (e.g., with full 6 degrees of freedom control). Each level support (1221) is connected to a common Z-axis drive (1211) that moves the level supports (1221) and the substrate handlers (1500A, 1500B) above them in the Z direction to align the end effectors (1520) of the substrate handlers (1500A, 1500B) on each level support (1221) with the substrate transfer plane (1290) of the transfer openings (1180) of the transfer chamber (118T1). The Z-axis drive (1211) may be any suitable linear actuator, such as a screw drive, an electromagnetic drive, a pneumatic drive, a hydraulic drive, etc.

[0105] In another aspect, referring to FIGS. 13a and 13b, the transfer chamber (118T2) has a substantially hexagonal configuration (however, in other aspects, the transfer chamber may have any suitable shape as described herein). In this aspect, the electric machine (1599R) (substantially similar to the linear electric machine (1599) of FIG. 15c) is configured as a radial transfer device comprising a substrate handler (1500) having a double-ended / double-sided end effector (1520D) as described herein (however, in other aspects, a single-ended / single-sided end effector may be employed). In this aspect, an array of electromagnets (1700) is configured to rotate the substrate handler (1500) around a rotation axis (1377) (such an axis is similar to, for example, the θ axis of a conventional SCARA type robot) to change the direction of “extension and retraction” (note that the terms extension and retraction are used for convenience, and extension and retraction are performed by the linear propulsion motion of the substrate handler (1500) along each drive line), and is configured to linearly propel the substrate handler (1500) to extend through the transfer openings (1180A-1180F). For example, an array of electromagnets (1700) has an arrangement forming radially offset drive lines (177, 178, 179), wherein the angle (α) between adjacent drive lines depends on the number of sides / facets of the transfer chamber (118T2) where the transfer openings (1180A-1180F) are located. The electromagnets (1700A-1700N) (shown in FIG. 12a but not numbered for clarity of drawing) provide linear propulsion of the substrate handler (1500) through at least the transfer openings (1180A-1180H) and rotation of the substrate handler (1500) around the rotation axis (1377) by full 6 degrees of freedom control to maintain linear propulsion and rotation in a desired position in pitch and roll.

[0106] Referring to FIG. 13b, in one aspect, the electric machine (1599R) comprises multiple transfer levels (1320A, 1320B) which are stacked one on top of the other in a manner substantially similar to that described above in relation to FIG. 12b. For example, each level (1320A, 1320B) is formed by each level support (1321) having each reference plane (1299R) substantially parallel to the level reference plane (1299) of the transfer chamber (118T1) frame. Each level support (1321) comprises an array (1700) of electromagnets substantially similar to that shown in FIG. 13a to drive the substrate handler (1500) linearly (along the drive lines (177-179)) and rotate it (around the axis (1377)). Each level support (1321) is coupled to a common Z-axis drive (1311) (substantively similar to the Z-axis drive (1211)) that moves the level supports (1321) and the substrate handler (1500) above them in the Z direction to align each of the end effectors (1520D) of the substrate handler (1500) on each level support (1221) with the substrate transfer plane (1390) of the transfer openings (1180) of the transfer chamber (118T2).

[0107] Referring to FIGS. 12b and 13b, the vertical motion provided by the Z-axis actuator (1211) can be used to enable a wafer handler (1220A or 1220B) to perform wafer handoff operations, such as picking from or placing wafers on a wafer processing station. The supports (1221, 1321) may include a single module (level) for the purpose of providing additional lifting capability to the wafer handler (1220A, 1220B) to achieve a larger vertical stroke during the wafer handoff operation. For example, in the case of processing modules or load locks having more than one stacked wafer slot, it would be advantageous to have a vertical lift device such as the Z-axis actuator (1211, 1311) so that each of the stacked wafer slots can be reached without increasing the applied levitation power provided by the electromechanical device (1599R).

[0108] Referring to FIGS. 12a and 12b, the vertical lift device (or Z-axis actuator) (1211) and the level (1221) have, in other aspects, dual (or more) separate and independently operable devices, for example, one for each wafer handler (1520). This can provide the ability to perform independent vertical strokes for different wafer handlers capable of accessing different slots of at least two independent stations (e.g., processing modules, load locks, etc.).

[0109] Now, with reference to FIGS. 15a, 15b, 15c, 16a, 16b, and 16c, a linear electric machine (1599) will be described in more detail (it should be noted again that the electric machine (1599R) is substantially similar to the linear electric machine (1599). Generally, the linear electric machine (1599) comprises a structure (1500) without magnets and any moving parts such as bearings, rotary or prism joints, metal bands, pulleys, steel cables or belts. As mentioned above, the base (1510) is formed of a paramagnetic material, a diamagnetic material, or a non-magnetic conductive material. The base (1510) may have any suitable shape and size to cooperate with the electromagnets (1700A-1700n) of the array of electromagnets (1700) to stably transport substrates (S) in the manner described herein. In one aspect, as illustrated in FIGS. 9 and 11-16c, the base (1510) is illustrated in a truncated cone shape, wherein the tapered side (1510TS) of the truncated cone (1510FR) faces the array of electromagnets (1700) (however, other suitable shapes may also be used). Here, the tapered side (1510TS) of the truncated cone shape has an angle (λ) (see FIG. 15b) between approximately 50° and approximately 60° with respect to the planar surface of the truncated cone (1510FR); in other aspects, the angle (λ) may be greater than approximately 60° or less than approximately 50°. In other aspects, the base may have a frusto-pyramidal shape as illustrated in FIGS. 8, 8A, and 10. Here, each side (1510TSP) of the frustum (1510FRP) has an angle (λ) (see FIG. 8b) between approximately 50° and approximately 60° with respect to the planar surface of the frustum (1510FRP); on other sides, the angle (λ) may be greater than approximately 60° or less than approximately 50°.Although the truncated pyramid shape is depicted as having four sides, in other aspects, the truncated pyramid shape may have any suitable number of sides, such as six or eight sides, or may have rounded or curved sides. In other aspects, the base (1510) may not have a truncated pyramid shape and may include a planar shape having a suitable and asymmetrical contour and size so as to be properly controlled by the electromagnets (1700).

[0110] The above end effector (1520, 1520D) may be substantially similar to conventional end effectors; however, as described herein, the end effector is rigidly coupled to the base (1510). For example, the end effector may be a single-sided / single-end end effector (see end effector (1520)) having a single substrate holding position (1520A), or a double-sided / double-end end effector (see end effector (1520D)) having two longitudinally spaced substrate holding positions (1520A, 1520B), and may be a parallel configuration in which a plurality of substrate holding positions are arranged side by side (e.g., laterally spaced) and supported from a common base to extend through parallel substrate transfer openings, or a stacked configuration in which a plurality of substrate holding positions are arranged so that one is stacked at another position and supported from a common base to extend through vertically arranged substrate transfer openings, but in other aspects, the end effector may have any suitable configuration. The end effector (1520, 1520D) may be made of a material that can withstand high temperatures, has low mass density, has low thermal expansion, has low thermal conductivity, and has low gas emission. A suitable material for constructing the end effector (1520, 1520D) is alumina oxide (Al2O3), but any suitable material may be used.

[0111] In one aspect, the end effector (1520, 1520D) is coupled to the base (1510) by a substantially rigid and unarticulated stanchion (1510S) to set the end effector (1520, 1520D) to an appropriate nominal height (H2) relative to the level reference plane (1299), for example. The substrate handler (1500) is moved in space (at least 3 degrees of freedom) using the electrodynamic levitation principle as described herein. Actuating elements (e.g., actuators (1700)) as illustrated in FIGS. 15a-15c, 16b, and 16c include independently controlled coils or electromagnets (1700A-1700n) (also referred to herein as coil segments) that generate a desired magnetic field inducing thrust and lift vectors from the base (1510).

[0112] In some aspects, referring to FIGS. 10, 10a, 11 and 11a, a plurality of substrate handlers may be overlapped relative to each other to move linearly along drive lines (177-180) as a single unit with end effectors (1520) of the overlapped substrate handlers, one stacked on top of the other. For example, referring to FIGS. 10 and 10a, the overlapped bases (1510FP) (which may be rotationally symmetric, rotationally symmetric, e.g., frustum, or bi-symmetrical, e.g., truncated pyramid, or cross-sections of the channel shape shown in FIG. 10a) are configured such that one base (1510FP) can be inserted into another base (1510FP) to stack the bases (1510FP) in a manner similar to cups stacked inside one another. The base (1510FP) may be configured such that the vertical space between the end effectors (1520) is substantially the same as the vertical space between the stacked substrate holding stations (e.g., when the end effectors (1520) are substantially the same height as the level reference plane (1299)) in order to provide simultaneous picking and placement of substrates by the stacked end effectors (1520) when stacked. The stacking of the bases (1510FP) provides, in one aspect, independent vertical or Z-axis movement of at least one of the bases (1510FP) (and each substrate handler (1500A, 1500B)) according to the levitation force generated by the array of electromagnets (1700). In this example, the top substrate handler (1500B) may be moved along the Z-axis independently of the bottom substrate handler (1500A); However, when the top substrate handler (1500B) is raised from the bottom substrate handler (1500A), the bottom substrate handler (1500A) can also be moved in the Z-axis direction independently of the top substrate handler (1500B).Here, the left-right symmetrical bases interlock with each other, and the rotation of the substrate handlers (1500A, 1500B) is linked by the shape of the substrate handlers (1510FP) so that the substrate handlers (1500A, 1500B) rotate together. The stackable configuration of the bases (1510FP) provides stacking of any suitable number of substrate handlers, one on top of the other (in this example, two are shown stacked on top of the other, but in other aspects, more than two substrate handlers may be stacked on top of the other).

[0113] Referring to FIGS. 11 and 11a, the rotationally symmetric bases (1510FC) can be stacked one on top of the other, moved in the direction of propulsion, and moved relative to each other along the Z-axis in a manner substantially similar to that described above with respect to the truncated-pyramid base (1510FP). However, in this aspect, the rotationally symmetric shape of the base (1510FC) does not interlock with one another and provides independent rotation of each substrate handler (1500A, 1500B) around the substrate handler rotation axis relative to the other substrate handler (1500A, 1500B). The independent rotation of the substrate handlers (1500A, 1500B) having a truncated base enables rapid replacement of substrates from a single substrate holding station, such as where the end effector (1520) of the substrate handler (1500A) is aligned with the substrate holding station (120BH) to pick the substrate (S1), where the end effector (1520) of the substrate handler (1500B) is rotated to a position that does not extend into the substrate holding station (120BH). When the substrate (S1) is removed from the substrate holding station (120BH) by the substrate handler (1500A), the end effector (1520) of the substrate handler (1500B) may be aligned with the substrate holding station (120BH) to place the substrate (S2) on the substrate holding station (120BH), while the end effector (1520) of the substrate handler (1500A) may be rotated to a position that does not enter the substrate holding station (120BH). As can be understood, the substrate handlers (1500A, 1500B) may be moved along the Z-axis to accommodate the stacked height of the end effectors relative to the height of the substrate holding station (120BH). Symmetric bases (rotation around one or more axes) are depicted, but in other aspects, one or more bases may be asymmetric or lack any axis of symmetry.

[0114] As described herein, linear propulsion is generally provided by two parallel linear tracks (1550) (which may be a single track) of independently controlled electromagnets (1700A-1700n). A plurality of electromagnets (1700A-1700n) are spaced apart from each other according to the dimensions of the base (1510) to control all six degrees of freedom (roll, pitch, yaw, and translation in each of the X, Y, and Z directions) of the substrate handler in space. For example, as illustrated in FIG. 15b, the electromagnets (1700A-1700n) may be spaced apart from each other so that two or more electromagnets (1700A-1700n) of each parallel linear track (1550) (cooperating to form a motor actuator (primary) (1701) and to form a motor in conjunction with the base (secondary) (1510)) are always positioned below the base (15100) in the direction of motion of the base in order to stably levitate and propel the base (1510) (as can be understood, FIGs. 15a and 15b are provided to schematically illustrate a representative configuration of the system and to generally show an exemplary representation of the interrelationship between the base (1510) and the electromagnets (1700A-1700n), and are not intended as a limitation in any way). The size, number, and spacing (e.g., pitch) of the electromagnets (1700A-1700n) in both the X-axis and Y-axis may vary as the size and shape of the base (1510) change with respect to the electromagnets (1700A-1700n). In one aspect, as illustrated in FIG. 8, the array of electromagnets (1700) may also include stabilization tracks (1550S) positioned laterally outside the tracks (1550). The stabilization tracks may be substantially similar to the tracks (1550) and are configured to provide additional stabilization of the base (1510) by generating additional lift and / or thrust acting on the base (1510) (e.g., in addition to the lift and thrust generated by the electromagnets of the parallel linear tracks (1550)).Consequently, the substrate handler (1500) can move along the direction of the tracks (1550) (i.e., the direction of propulsion) while changing direction of one or more of roll, pitch, and yaw. According to the principle of magnetic induction, the electromagnets (1700A-1700n) are similar to the "primary" and the base (1510) corresponds to the "secondary" in which current is induced by the eddy current effect.

[0115] FIG. 17 shows an actuator control system network (1799) according to aspects of the disclosed embodiment configured to perform individual control of each electromagnet (1700A-1700n) to provide the desired force components and degrees of freedom described and illustrated with respect to FIG. 15a-16c. In one aspect, the actuator control system is configured such that the electromagnets (1700A-1700n) form motor actuator units (collectively referred to as motor actuators), and each motor actuator unit has m electromagnets / coils cooperating to form a motor (wherein m is a dynamically selectable number of two or more electromagnets forming one or more of the motor actuator units as further described below). Accordingly, the actuator control system network (1799) is a scalable motion control system having a cluster architecture having at least a master controller (1760) and distributed local drive controllers (1750A-1750n), as described in more detail below. In this respect, groups of electromagnets (1700G1-1700Gn) are coupled to each local drive controller (1750A-1750n) configured to control the current of the electromagnets (1700A-1700n) within each group of electromagnets (1700G1-1700Gn). The above local drive controllers (1750A-1750n) may be "slaves" in a network connected to a master controller (1760) configured to define a desired force (e.g., thrust and lift) for each individual electromagnet (1700A-1700n) to execute a desired motion of the substrate handler (1500) in space.As described herein, the electromagnets (1700A-1700n) may be physical electromagnets / coils, and they may be dynamically configured with respect to the "phase" definition of each coil in relation to the "phase" definition of other electromagnets / coils of a given motor actuator unit, so that even if the physical electromagnets / coils are fixed (e.g., static), as described in more detail below, the position of a given actuator unit can be considered to move in effect with the base propulsion. This provides continuity of desired force vectors for motion control of the substrate handler.

[0116] According to aspects of the disclosed embodiment, and with reference to FIGS. 18 and 19, position feedback sensors (2000) are distributed on the frame of the chamber (118). The sensors (2000) are configured to detect the position of the base (1510) along the driving plane (1598) and are communicably coupled to the controller (199) so that the controller (199) registers the detected position of the base (1510), and the controller (199) is configured to sequentially excite the electromagnets (1700A-1700n) of the array of electromagnets (1700) corresponding to the detected position in the manner described herein.

[0117] FIGS. 18 and 19 illustrate a sensor control system network (1899) according to aspects of the disclosed embodiment, which is configured to provide positional feedback of a substrate handler (1500) in space with respect to the frame of a transfer chamber (118), for example. The sensor control system network (1899) may be a scalable sensor control system having a cluster architecture having at least a master controller (1760) and distributed local sensor controllers (1850A-1850n), as described in more detail below. In this aspect, groups of sensors (1800G1-1800Gn) are coupled to individual local sensor controllers (1850A-1850n) (also referred to herein as sensor processing units) configured as "slaves" in a network connected to the master controller (1760) (or another suitable master controller communicating with the master controller (1760)). Each of the above local sensor controllers (1850A-1850n) includes a central processing unit (1851) and associated hardware interfaces (1852) capable of supporting different types of sensor technologies as described herein. The local sensor controllers (1850A-1850n) may be integrated into real-time networks such as EtherCat and / or non-real-time networks such as Ethernet. The sensors (2000) are distributed along the propulsion path of the substrate handler (e.g., drive lines (177-180)) to detect the location / position of the substrate handler within the space for, for example, the frame of the transfer chamber (118).

[0118] FIG. 20 illustrates a sensor array (2001) comprising sensors (2000A-2000n) distributed with respect to a substrate handler (1500) base (1510), showing the relationship between the sensors (2000A-2000n) that provide continuous feedback of the characteristic dimensions of the base (1510) and the position of the substrate handler (1500). As illustrated in FIG. 20, the sensors (2000A-2000n) are arranged at a predetermined interval or sensor pitch (Ps), wherein the sensor spacing (Δ) is provided between adjacent sensors (2000A-2000n). Each sensor (2000A-2000n) has a length (Ls) capable of providing a predetermined detection range, and the base (1510) has a length (Lb). The relationship between these characteristics for providing continuous feedback is as follows:

[0119] Ls / 2 > Ps-Ls ≥ Ps < (3 / 2)Ls [2]

[0120] Here, the length (Lb) of the base (1510) is as follows:

[0121] Lb = nPs + Ls / 2 (where n= 1, 2, 3, ...) [3]

[0122] According to aspects of the disclosed embodiments, each sensor (2000A-2000n) includes any suitable device(s) capable of measuring longitudinal displacement and / or air gap between the substrate handler (1500) base (1510) and a floor reference surface, such as a level reference plane (1299) (see, for example, FIG. 15a). A master controller (1760) is configured to track the position of the substrate handler (1500) by instructing which local sensor controllers (1850A-1850n) should actively report feedback from the appropriate sensors (1700A-1700n). The combination of the actuator control system network (1799) and the sensor control system network (1899) forms a motion control infrastructure for the six degrees of freedom of the substrate handler (1500) as illustrated in FIG. 15a-16c.

[0123] Referring to FIG. 39, a control system network (3999) having a cluster architecture representing the actuator control system network (1799) and the sensor control system network (1899) will be described. In the example illustrated in FIG. 39, there are three drive lines (177, 179A, 179B), and each of the three drive lines has an array of individual electromagnets forming individual tracks (1550A-1550F) (illustrated as linear, but may be arched). For example, the drive line (177) is formed by tracks (1550A, 1550B) having electromagnets (177ER1-177ERn and 177EL1-177ELn). The drive line (179A) is formed by tracks (1550C and 1550D) having electromagnets (179AER1-179AERn and 179AEL1-179AELn). The drive line (179B) is formed by tracks (1550E and 1550F) having electromagnets (179BER1-179BERn and 179BEL1-179BELn). The configuration of the electric machine shown in FIG. 39 is exemplary and may have any other suitable configuration.

[0124] In FIG. 39, the control system network includes a master controller (1760), cluster controllers (3950A-3950C) and local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB). The local controller (1750DL) corresponds to a drive line (177), the local controller (1750DLA) corresponds to a drive line (179A), and the local controller (1750DLB) corresponds to a drive line (179B). Since each of the local controllers (1750DL, 1750DLA, 1750DLB) is substantially similar to the distributed local drive controllers (1750A-1750n), each drive line (177, 179A, 179B) includes a distributed array of local drive controllers (1750A-1750n) as described above in relation to FIG. 17 to control each group (1700G1-1700Gn) of electromagnets (1700A-1700n). Similarly, the local controller (1850DL) corresponds to the drive line (177), the local controller (1850DLA) corresponds to the drive line (179A), and the local controller (1850DLB) corresponds to the drive line (179B). Since each of the local controller(s) (1850DL, 1850DLA, 1850DLB) is substantially similar to the distributed local sensor controllers (1850A-1850n), each drive line (177, 179A, 179B) includes a distributed array of local sensor controllers (1850A-1850n) as described above in relation to FIG. 18 to control each group (1800G1-1800Gn) of sensors (2000A-2000n).

[0125] In one aspect, as illustrated in FIG. 39, each of the local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) is connected to each cluster controller (3950A-3950C) (e.g., via wireless and / or wired connections). For example, each of the local controllers (1750DL, 1850DL) of the drive line (177) is coupled to the cluster controller (3950B), each of the local controllers (1750DLA, 1850DLA) of the drive line (179A) is coupled to the cluster controller (3950A), and each of the local controllers (17550DLB, 17850DLB) of the drive line (179B) is coupled to the cluster controller (3950C). In other aspects, local controllers may be directly connected to the master controller (1760) as shown in FIG. 17 and 19 (e.g., via a wireless or wired connection). In yet other aspects, local controllers may be connected to both the master controller (1760) and each cluster controller (3950A-3950C) (e.g., via a wireless or wired connection) to provide redundant failsafe control of the local controllers.

[0126] Each of the cluster controllers (3950A-3950C) is connected to the master controller (1760) (e.g., via a wireless or wired connection). Each of the master controller (1760), the cluster controllers (3950A-3950C), and the local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) includes any suitable processors and non-transient computer program code to execute motion control of the board handlers (1500) as described herein. The master controller (1760) supervises the overall operation of the control system network (3999), and each of the cluster controllers (3950A-3950C) supervises the operation of each local controller (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB), and each local controller (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) is used to drive electromagnets and / or provide position feedback (of the substrate handler (1500)) corresponding to each drive line (177, 179A, 179B).

[0127] The cluster architecture provides the functions of a central control network and, if necessary, a distributed control network within the network topology. The architecture disclosed herein is advantageous because clusters can be distributed where needed within the network and can provide highly centralized control within the clusters managed by each cluster controller (3950A-3950C). Network traffic associated with highly centralized control is generally limited within each cluster, and local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) can be located near the electromagnets or sensors they control to reduce problems related to power and signal cables. Additionally, the cluster architecture allows for direct control of local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) by the master controller (1760) if necessary. Furthermore, since extreme network traffic is generally confined within the cluster and the clusters allow for a high level of control, the architecture can accommodate a large number of clusters. Thus, the architecture provides a high level of scalability and an efficient distribution of controllers. Although the cluster control architecture has been described above, it should be noted that the cluster architecture is merely an example of a suitable control architecture, and any suitable control architecture may be used.

[0128] In another aspect of the disclosed embodiment, the local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) illustrated in FIG. 39 may be directly connected to a master controller (1760). In this aspect, the master controller software is responsible for some aspects of real-time control of wafer handler motion (e.g., the master controller is configured to control these aspects), and the local controllers are responsible for all low-level feedback and operational aspects of the control architecture (e.g., configured for these feedback and operational aspects).

[0129] Referring still to FIG. 39 and FIG. 15a-16c together, according to aspects of the disclosed embodiment, the processor (3901) of the master controller (1760) is programmed with a dynamic model (3910) of a base (1510) with and without a payload (e.g., substrate(s)(S)) thereon (e.g., the dynamic model is stored in any suitable memory (3902) accessible by the processor (3901). The processor (3901) is also programmed with a dynamic model (3911) of the frictional force (μ) between the substrate (S) and the end effector (1520). The form factor (3912) of the mechanical and electronic devices for the base (1510) (e.g., the number of electromagnets, the spacing between electromagnets, the number of drive lines and their respective directions, the propulsion-to-lift relationship, etc.) is also stored in memory (3902) and accessible by the processor (3901).

[0130] The master controller (1760) is programmed or configured to determine the kinematic motion of the base (1510) from the initial substrate handler pose to the final substrate handler pose. The master controller (1760) is also programmed or configured to determine the kinematics of the attitude / yaw control (three degrees of freedom—pitch, roll, yaw) associated with the determined kinematic motion. In one aspect, the kinematics of the kinematic motion and the attitude / yaw are determined using one or more of the dynamic model (3910), dynamic model (3911), and form factor (3912) in combination with a predetermined substrate processing recipe (e.g., when and where the substrate should be transported and what process should be performed on the substrate).

[0131] One method for controlling machines such as the electric machines described here is to calculate the trajectories for each of the thrust (along the X and / or Y axes), rise (along the Z axis), roll, pitch, and yaw. These trajectories can be conveniently defined by a series of position, velocity, and time values ​​grouped into frames referred to as PVT frames.

[0132] FIG. 40a shows an exemplary PVT frame (4005). The PVT frame (4005) includes position data (4010), velocity data (4015), and time data (4020), which may include a start position (X,Y,Z), an end position (X,Y,Z), and an attitude (roll, pitch, yaw). In one aspect, the data is in a binary format grouped together into one or more bytes. In another aspect, the position data (4010), velocity data (4015), and time data (4020) each occupy 4 bytes (in other aspects, the position data (4010), velocity data (4015), and time data (4020) each occupy more or fewer than 4 bytes). The PVT frame (4005) may optionally include header information (4025) and trailing information (4030), both of which may include identification, parity, error correction, or other types of data. The PVT frame (4005) may include additional data of varying lengths or amounts between the header, location, velocity, time, and trailing data. It should be noted that the PVT frame (4005) is not limited to any specific length. In other aspects, the PVT frame is reduced to only a PT frame or a P frame. Communication from the master controller (1760) to the cluster / local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) may include sets of different values ​​peripherally related to the desired motion, for example, these values ​​may be frequency, phase offset, current values ​​of the electromagnets / coils being controlled, and / or voltage values. The master controller (1760) implements the desired algorithmic transformation and calculates and streams these quantities through the motion network (effectively for all coils through the hierarchy of cluster and local controllers).

[0133] A feature of aspects of the disclosed embodiment is that these series of values ​​are used as inputs to a dynamic model (3910, 3911) of a controlled electric machine to calculate the theoretical lift and thrust to be applied by predetermined electromagnets (1700A-1700n) so that the base (1510) follows a desired trajectory. Additionally, a feature of aspects of the disclosed embodiment is that elements of the dynamic model (3910, 3911) are used to scale the feedback control signals used for each electromagnet under the control of local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB).

[0134] The lift, thrust, and scaling terms can advantageously explain the non-linearities and dynamic cross-coupled between the individual drive lines (177, 179A, 179B). The lift and thrust may be referred to as feedforward terms here, and the scaling term may be referred to as gain terms.

[0135] Using the electric machine (1599) illustrated in FIG. 39 (see FIG. 15a-16c as well) as an example, the master controller (1760) can generate a trajectory for each drive line (177, 179A, 179B) on which the substrate handler (1500) travels in terms of commanded position, velocity, and acceleration. By using one or more inverse kinematic models of the base (1510) and / or friction force (μ), the master controller (1760) can utilize the trajectory information to generate corresponding feedforward and gain terms. These terms can be grouped together with trajectory information in frames specific to each drive line (177, 179A, 179B), referred to as PVT-FG frames. FIG. 40b illustrates an exemplary PVT-FG frame (4095). The PVT-FG frame (4095) includes an optional header (4025) similar to the PVT frame (4005), position data (4010), velocity data (4015), time data (4020), and optional trailing information (4030). Additionally, the PVT-FG frame (4095) includes at least one feedforward term (4050) and at least one gain term (4060). The data may be in a binary format grouped together into one or more bytes. In one aspect of the PVT-FG frame (4095), the position data (4010), velocity data (4015), time data (4020), feedforward term (4050), and gain term (460) each occupy 4 bytes (in other aspects, they may each occupy more or fewer than 4 bytes). Similar to the PVT frame (4005), the PVT-FG frame (4095) may contain different data of varying lengths or amounts distributed among various terms.

[0136] PVT-FG frames (or PVT frames in other aspects) may be distributed throughout the control system network (3999). Cluster controllers (3950A-3950C) may receive data and interpolate between two consecutive frames to obtain instantaneous position, velocity, feedforward term and gain value, and may utilize this information to execute control of the substrate handler (1500). For example, each cluster controller (3950A-3950C) generates thrust (Fx) (thrust along the X-axis), thrust (Fy) (thrust along the Y-axis), and lift (Fz) (along the Z-axis) by employing PVT-FG frames (or PVT frames in some aspects) or other suitable information / commands from the master controller (1760) to perform one or more of leveling, thrust, and three-degree-of-freedom attitude control (e.g., roll, pitch, yaw) of the substrate handler (1500) and its base (1510). In some aspects, the form factor (3912) of the mechanical electronic devices may be programmed at the cluster controller (3950A-3950C) level, rather than being programmed within the master controller (1760) or in addition thereto, where the form factor is used to establish lift-to-propulsion relationship(s) and is used together with the data provided by the master controller (1760) to generate the aforementioned lift and propulsion forces. In other aspects, cluster controllers (3950A-3950C) and local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) can receive corresponding data from the master controller (1760) and can utilize the data to control electromagnets (1700A-1700n) and to control the movement of a board handler (1500) along one or more of the drive lines (177, 179A, 179B).

[0137] Cluster controllers (3950A-3950C) (or alternatively local controllers (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB)) command modulation of electromagnets (1700A-1700n), and these commands are transmitted to and received by each local controller (1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) to execute one or more of dynamic phase assignment and the creation of virtual multiphase motor actuator units described in more detail herein.

[0138] FIG. 21 illustrates exemplary controlled motion(s) of a substrate handler (1500) according to aspects of the disclosed embodiment with respect to increased substrate handler throughput while transporting a substrate (S). Here, the controller (199) uses levitation forces (e.g., FZ) generated by an array of electromagnets (1700). T , FZ L By controlling the base (1510), differential levitation forces (shown in FIG. 21) are applied across the base (1510), which executes a controlled tilt (e.g., e+ or e-) of the base (1510) relative to the driving plane (1598) and controls a reaction platen attitude predetermined by at least one of pitch (shown in FIG. 15b, 21 and 27) and roll (shown in FIG. 15a).

[0139] In one aspect, the controller (199) generates levitation forces (e.g., FZ) by an array (1700) of electromagnets of motor actuator units (virtually moving). T , FZ LBy controlling the base (1510) with respect to the driving plane (1598), a predetermined bias attitude (BA+ or BA-) of the base (1510) is executed, which imparts a bias reaction force (F2) (Fig. 23) to the substrate (S) supported by the base mounting surface from the base payload mounting surface (e.g., the substrate mounting surface (1520SS) of the end effector (1520) (Fig. 23, 25a, 25b) or the mounting surface formed by the substrate supports (1431-1433) of the cart (1500C), in a direction opposing the payload inertia force generated by the acceleration of the reaction platen along the driving plane (1598). The controller (199) determines the acceleration of the base (1510) (and its substrate handler) along the drive plane (1598) from the change in position of the base (1510) detected by at least the sensor (2000), and controls the bias attitude of the base (1510) in response to the determined acceleration to provide a predetermined bias attitude to counteract the payload inertial force caused by the acceleration of the base (1510). In other aspects, the controller (199) may apply a predetermined acceleration from a commanded trajectory for bias attitude control. Here, the controller (199) controls the excitation of the electromagnets (1700A-1700n) of the virtually moving motor actuator units of the array of electromagnets (1700) to set a bias position (BA+ or BA-) to bias the base (1510) against inertial forces that tend to displace the substrate (S) placed on the base (1510) along the seat between the substrate (S) and the base (1510) (e.g., on the end effector (1520) or the substrate supports (1431-1433)) (e.g., see FIG. 23, 25a, 25b).

[0140] As an example of counteracting the payload inertial force, starting from the left side of FIG. 21, a substrate handler (1500) (which may be any substrate handler described herein) is shown at the starting point of motion in the direction (2122) of FIG. 21. As the substrate handler begins to move, a set of thrust vectors (FP) and lift vectors (FZ) is generated by a control system (e.g., an actuator control system network (1799) and a sensor control system network (1899) which may be part of the controller (199)) to cause the substrate handler (1500) to accelerate in the direction of motion by an increased pitch angle (e+) (e.g., the end effector (1520) is tilted clockwise). To realize the increased pitch angle (e+), the lift vectors (FZ) are trailing lift vectors (FZ T The magnitude of ) is the leading lift vector (FZ L It is generated to be larger than the magnitude of (wherein, leading and trailing are relative to the direction of motion). When the substrate handler reaches approximately the midpoint toward the end of the motion (e.g., when the acceleration of the substrate handler (1500) is substantially zero), the pitch angle (e+) is reduced in magnitude so that the tilted direction of the end effector (1520) is reversed from clockwise to zero (e.g., substantially parallel to the level reference plane (1299) - the trailing lift vector (FZT) and the leading lift vector (FZL) are substantially the same). At this point in the trajectory, the motion of the substrate handler (1500) begins a deceleration phase in which the pitch angle (e-) is reduced so that the end effector (1520) tilts counterclockwise. To realize the reduced pitch angle (e-), the lift vectors (FZ) are the trailing lift vector (FZ T The magnitude of ) is the leading lift vector (FZ LIt is created to be smaller than the size of ). As the substrate handler (1500) reaches the final destination, the pitch angle (e-) is increased to 0 so that the tilted direction of the end effector (1520) is substantially parallel to the level reference plane (1299) as at the start of the motion.

[0141] As can be understood, meanwhile, the pitch of the end effector is increased or decreased in consideration of the acceleration and deceleration of the substrate handler (1500) with substantially no slippage of the substrate (S) relative to the end effector while moving substantially along a straight / linear path (e.g., along the drive line (177-180)), and in other aspects, the roll (r) and / or pitch (e) of the substrate handler (1500) may be increased or decreased to provide a higher rotational acceleration of the substrate handler (1500) (e.g., centered on one or more of the axes (777, 1277, 1377) in a manner substantially similar to that described above in relation to linear motion) (see FIG. 21a - this is the lift vector (FZ left ) is the lift vector (FZ right (Illuminating rolling in the rotational direction of the end effector by roll control as shown in Fig. 15a when it is greater than ).

[0142] The motion control illustrated in FIG. 21 executes substantially faster substrate motion transfer compared to conventional substrate transfer where the end effector is parallel to the wafer transfer plane throughout the end effector motion (e.g., provides higher acceleration without substantial slippage of the substrate relative to the end effector). As an example, if the pitch angle (e) in FIG. 21 is set to zero during the entire motion (as in conventional substrate transfer), the maximum allowable propulsion acceleration is limited by the static friction coefficient (μ) between the contact surfaces of the substrate (S) and the end effector (1520). This is illustrated in FIG. 22, which constitutes a typical use case of conventional substrate transfer where the substrate (S) is held by the rear surface in contact with the end effector. As can be seen in FIG. 22, the maximum acceleration applied to the substrate (S) before wafer slippage occurs is μg. Here, "g" is the acceleration due to gravity (approx. 9.8 m / s²). 2 ), μ is the coefficient of friction, M is the mass of the substrate, W is the weight of the substrate, and N is the normal force.

[0143] FIG. 23 illustrates a case where a substrate (S) (with mass m) is carried by a substrate handler (1500) (with mass M) at a pitch angle (e) while the substrate handler (1500) is accelerated in the X direction. The force diagram in FIG. 23 illustrates the dynamics of motion of the substrate (S) and the substrate handler (1500). In FIG. 23, the substrate handler (1500) is accelerated along the propulsion direction (X) with acceleration (a). Consequently, the force in the substrate handler is denoted by the variable (Fl). The acceleration (a) along the X direction affects the (vertical) reaction force (N) on the substrate (S) in such a way that it yields a resultant wafer force (F2) when the weight (W) of the substrate is added. It is possible to relate the angle (e) and acceleration (a) to the end effector (1520) of the substrate handler (1500) in such a way that the substrate (S) does not substantially slip. To substantially prevent wafer slippage, two situations can be considered for clarity. First, it is assumed that there is no friction between the substrate and the end effector (1520). FIG. 24 illustrates a free body diagram of the substrate (S) on the end effector (1520) when there is no friction (μ). As can be seen in FIG. 24, despite the absence of friction (μ), the acceleration (a) can be determined in terms of the pitch angle (e) such that the substrate mass (m) moves along the X direction. This relationship is expressed by the following equation [4]:

[0144] a = g tan e [4]

[0145] Here, g is the acceleration due to gravity (9.8 m / s²). 2FIG. 24a illustrates wafer sliding regions in terms of pitch angle (e). Note that when the pitch angle (e) is substantially zero, the substrate (S) will slide against the end effector (1520) in the absence of friction (μ). The curve illustrated in FIG. 24a represents the desired pitch angle "e" to maintain the substrate (S) moving along the X direction with acceleration "a" without sliding. Alternatively, the same curve in FIG. 24a can be interpreted as the required acceleration "a" of the substrate handler (1500) to prevent the substrate (S) from sliding while moving along the X direction with pitch angle "e". Deviating from the curve illustrated in FIG. 24a will cause the substrate (S) to slide "downhill" or "uphill" (here, the terms downhill and uphill are used for convenience in relation to pitch) against the end effector (1520) depending on the acceleration value.

[0146] FIGS. 25a and 25b illustrate the effect of a non-zero static friction coefficient (μ) on the relationship between acceleration (a) and pitch angle (e). For example, FIG. 25a illustrates the minimum propulsion acceleration before the substrate (S) slides against the end effector (1520). In this case, the direction of the friction force is "upward" to substantially prevent the wafer mass (m) from sliding "downward" (again, with respect to the direction of the pitch). Here, the "slowest" expected acceleration to prevent wafer sliding is calculated as follows:

[0147] a min = [-μ + tan e] / [l + μ tan e] [5]

[0148] FIG. 25b illustrates the case for the maximum (e.g., fastest) expected propulsion acceleration (a) before the substrate (S) slides against the end effector (1520). In this case, the direction of the frictional force is directed "downward" to substantially prevent the wafer mass (m) from sliding "upward" (again with respect to the direction of the pitch). Here, the "fastest" expected acceleration is calculated as follows:

[0149] a max = [μ + tan e] / [1 - μ tan e] [6]

[0150] Consequently, when a non-zero static friction coefficient (μ) exists, the propulsion acceleration (a) must be within the following limits to prevent slippage of the substrate (S) for a given pitch angle.

[0151] a min < a < a max [7]

[0152] FIG. 26 provides an example of the dependency between acceleration (a) and pitch angle (e) for a static friction coefficient (μ) of approximately 0.1, which is a typical value for substrate handlers used in high-temperature applications. The curve of FIG. 24a is repeated in FIG. 26 when μ is approximately 0. The region between the upper and lower curves (where μ is approximately 0.1) represents a non-slippage region (e.g., an acceleration region for a given pitch angle where substrate slippage against the end effector does not substantially occur). Regions outside this area may have wafer slippage in the upward or downward direction with respect to the substrate handler tilt (i.e., pitch angle (e)). In the example of FIG. 26, the maximum acceleration with a pitch angle of substantially 0 is approximately 0.1g, which is the fastest acceleration that a conventional substrate handler can provide for typical high-temperature applications. When the pitch angle (e) is set to approximately 16 degrees, the substrate can be transported with an acceleration of up to 0.4g using the same end effector material (as in conventional substrate handlers), which constitutes a substantial improvement in throughput compared to conventional substrate handlers. The pitch angle (e) can be set according to a predetermined acceleration to maximize throughput, as shown in FIG. 21.

[0153] FIG. 27 illustrates active control of the orientation of the substrate handler (1500) in roll, pitch, and yaw in relation to the leveling of the substrate handler (1500) for a substrate station such as a processing module (120). Mechanical deflection makes it difficult to enter and exit processing module openings (2780) with a height (H3) that becomes progressively smaller due to the need to optimize the processing module (120) process time. It should be noted that conventional substrate transport generally suffers from the inherent possibility of mechanical deflection due to the presence of articulated links with bearings that add weight and reduce stiffness, and that it may not be realistic to compensate for end effector orientation when the wafer passes through the processing module opening (2780). In such cases, it is becoming increasingly difficult to comply with more restrictive mechanical deflection constraints. Aspects of the disclosed embodiment provide a solution for mechanical deflection that dynamically compensates for any mechanical deflection by controlling the orientation of the substrate handler in space with respect to a level reference plane (e.g., by adjusting roll, pitch, and yaw angles as described herein), thereby allowing the substrate to pass through the processing module opening (2780) substantially without contact between the substrate (S) and the opening (2780) and substantially without contact between the end effector (1520) and the opening (2780).

[0154] FIGS. 15a-16c illustrate the controlled adjustment of the roll and yaw angles of the substrate handler (1500) in addition to the pitch angle by local drive controller(s) (1750A-1750n) and local sensor controller(s) (1850A-1850n). Referring also to FIG. 27, the controlled adjustment of each of the roll, yaw, and pitch angles (e.g., by differentially changing at least the lift vectors acting on the base (1510) as described herein) realizes leveling of the position of the substrate handler (1500) at any suitable substrate holding station, such as a processing module (120), so that the plane (2770) of the substrate (S) (and the end effector (1520) on which the substrate (S) is supported) is substantially the same as the plane (1771) formed by the substrate support surface (1760) of the substrate holding station (120). In some aspects, the roll, yaw, and pitch angles are adjusted independently of each other. Additionally, the controlled adjustment of the substrate handler (1500) orientation angles (e.g., roll, pitch, and yaw) provides, for example, compensation for mechanical deflection of the end effector (1520) caused by the weight of the substrate loading and the substrate handler (1500) structure.

[0155] Referring to FIGS. 8-11, 28 and 29, as described above, in some aspects, a number of drive lines (177, 178) are extended longitudinally along the length of the transfer chamber (118) so that one substrate handler (1500) passes next to another substrate handler along the longitudinal direction of the transfer chamber (118). FIG. 28 illustrates the passage of two substrate handlers (1500A, 1500B) passing each other, with substrate handlers (1500A) moving along the inbound track (1550A) and substrate handler (1500B) moving along the outbound track (1550B). Here, each of the substrate handlers (1500A, 1500B) has roll, pitch, and yaw angles so that the plane (2770) of the end effector (1520) (and the substrate (S) held thereon) is substantially parallel to the level reference plane (1299) (i.e., leveled). Here, when the end effectors (1520) are horizontal, the transfer chamber (118) has a lateral width (W1). However, according to aspects of the disclosed embodiment, the width of the transfer chamber (118) may be minimized or reduced from the lateral width (W1) to the lateral width (W2) by adjusting one or more of their roll, pitch, and yaw as the substrate handlers (1500A, 1500B) pass each other along the length of the transfer chamber (118). For example, as illustrated in FIG. 29, the roll angle of each substrate handler (1500A, 1500B) can be adjusted to a predetermined angle (β) with respect to the level reference plane (1299) for a period during which the two substrate handlers (1500A, 1500B) would otherwise occupy the same space, in order to avoid contact between the substrate handlers (1500A, 1500B) when the substrate handlers (1500A, 1500B) pass each other. The predetermined roll angle (β) may depend on the end effector configuration (e.g., so that the substrate (S) does not slide against the end effector).As can be understood, it is advantageous to control the roll, pitch, and / or yaw angles of each substrate handler (1500) to reduce the footprint of the transfer chamber (118) accommodating wafer handling automation, wherein the reduced footprint increases the tool density on at least the manufacturing facility floor and reduces the pump-down time of the transfer chamber, which can increase throughput.

[0156] Now, referring to FIGS. 17 and 30, exemplary control of an array of electromagnets (1700) will be described, in which dynamic phase allocation is employed. As described herein, a controller (199) (which is a cluster or master controller described herein in one aspect—see FIG. 39) is operably coupled to an array of electromagnets (1700) and an AC power source (1585) (the power source may be any suitable type and may be DC if the controller drive circuit modulates DC to the desired frequency / phase for as many AC power phases as desired), and the base (1510) of a substrate handler (1500) is configured to sequentially excite the electromagnets (1700A-1700n) with a multiphase AC so that they are propelled by at least one of attitude control and yaw control by a common set of electromagnets (1700A-1700n) (e.g., electromagnets of each drive line (177-180)). As mentioned above, the controller (199) is configured to sequentially excite electromagnets (1700A-1700n) that cooperate with multi-phase alternating current excitation to form motor actuator units (1701) corresponding to the position of the base (1510) detected by the sensor (2000). The number (n) of electromagnets (1700A-1700n) of each motor actuator unit (1701) (an integer greater than or equal to 3 in this example, but greater than or equal to 2 in other aspects), as well as the (static) position of each n electromagnet (1700A-1700n) of each motor actuator unit (1701), can be dynamically selected by the controller (199) to execute the lifting and propulsion (secondary) of the base (1510) at any given time throughout the operation of the motor actuator.Each of the electromagnets (1700A-1700n) generates both levitation and thrust forces individually controllable for the base (1510) to control the base (1510) with at least one of attitude and yaw in a levitating state, from excitation by a common multi-phase alternating current having a single common frequency per phase. The common single frequency per phase of each phase (here, each phase A, B, C) can be selectively varied from different desired excitation frequencies so that the levitation and thrust forces generated by the motor operating unit (1701) enable substantially independent control of the base (1510) with each of up to six independent degrees of freedom. In one aspect, the controller (199) controls the roll, pitch, and yaw angles generated by an array of electromagnets (1700A-1700n) arranged within each motor actuator unit (1701), including the position of at least a lifted and propelled base (1510) to move along at least one drive line (177-180) from a first predetermined position (P1) (see FIG. 1b) relative to the frame of the chamber (118) to a second different predetermined position (P2) (see FIG. 1b) relative to the frame of the chamber (118) relative to the array of electromagnets (1700). In one aspect, the controller (199) controls the roll, pitch, and yaw angles generated by the array of electromagnets (1700), including the position of the base (1510) and the yaw of the base (1510), while the base (1510) is lifted and stationary relative to the array of electromagnets (1700) at least one driving line (177-180) along at least one driving line (177-180) relative to the frame of the chamber (118).

[0157] FIGS. 32a and 32b illustrate an example in which each electromagnet (or coil unit) (1700A-1700n) is grouped to form a motor actuator unit (1701) having a dynamically selected number of electromagnets, for example, three electromagnets (n=3) and three corresponding phases (m=3), and the electrical angle between the phases (see FIG. 17) of 120° is also dynamically associated with three different phases (A, B, C) such that the association of each phase (A, B, C) and the corresponding static electromagnets (1700A-1700n) matches the dynamic state of the motor actuator unit (1701). Accordingly, by the electromagnets of the motor actuator unit (1701) that propel the base (1510) (e.g., along the direction (3100)), each phase (A, B, C) is changed or moved from one static electromagnet to another (i.e., by rolling the designation or assignment of each phase to a series of electromagnets (1700A-1700n)) to generate a virtual (motion) multi-phase actuator unit (3000, 3000tP1, 3000tP2) of the linear electric machine (1599) and electric machine (1599R) respectively, which proceeds in the direction (3100) of motion, and this motion is the motion of the base (1510) generated by the excitation of the electromagnets (1700A-1700n) corresponding to the virtual motion multi-phase actuator unit (3000, 3000tP1, 3000tP2) and Corresponding. This dynamic relationship or association that generates a virtual motion multi-phase actuator unit (3000, 3000tP1, 3000tP2) between coil units and phases will be referred to as "dynamic phase allocation" for convenience, wherein the virtual motion of a representative virtual motion multi-phase actuator unit (3000, 3000tP1, 3000tP2) executing the propulsion of the base (1510) is schematically illustrated in FIG. 30 (see FIG. 17).Here, the virtual motion multiphase actuator unit (or "MAU" (3000) of FIG. 17) has three dynamically selected electromagnets and associated phases (A, B, C) shown at the initial (representative) position P=0 at time t=t0. Each excitation of the electromagnets of the virtual motion multiphase actuator unit (3000) generates a thrust that moves the platen / base (1510) between t1 and t2 (see FIG. 32a-32b). Here, as illustrated, at P=0 and t=t0, the electromagnets (1700A-1700C) are grouped to form the virtual motion multiphase actuator unit (3000) and are each associated with phases (A, B, C). In conjunction with the generation of thrusts (Fx), each of the electromagnets (1700A-1700C) of the virtual motion multiphase actuator unit (3000) Here, lift forces (Fy) are generated separately controllable with a variable height controlled for the platen / base (1510), which simultaneously perform propulsion and control of the rise and tilt of the platen / base (1510) (see FIG. 32a-32b). As can be understood, at time t=t0 and position P=0, under the effect of lift forces (Fy) and thrust forces (Fx) imparted by each electromagnet (1700A-1700C) of the virtual motion multi-phase actuator unit (3000), the platen / base (1510) moves with a predetermined rise and tilt (relative to the transfer chamber and the static electromagnets (1700A-1700C)).In order to maintain the steady-state tilt of the platen / base (1510) during motion away from the group of electromagnets (1700A-1700C) (forming the virtual motion multi-phase actuator unit (3000) at P=0 and T=T0), the controller (199) and circuit (3050) of each electromagnet (1700A-1700n) of the array of electromagnets dynamically "moves" (or assigns) each phase (A, B, C) (from the initial virtual motion multi-phase actuator unit (3000) at P=0 and t=T0) to the corresponding electromagnets (1700B-1700D) forming the virtual motion multi-phase actuator unit (3000tP1) placed at position P=1 at time t=T1, corresponding to the movement of the platen / base (1510) at time t=T1 and position P=1, to the corresponding electromagnets (1700B-1700D) that form the virtual motion multi-phase actuator unit (3000tP1) placed at position P=1 at time t=T1. It is configured to “change” and subsequently dynamically “move” (or “change”) the assignment of each phase (A, B, C) (from the virtual motion multiphase actuator unit (3000tP1) at P=1 and t=t1) to the corresponding electromagnets (1700C-1700E) forming the virtual motion multiphase actuator unit (3000tP2) placed at position P=2 at time t=t2, corresponding to the movement of the platen / base (1510) at time t=t2 and position P=2. The dynamic phase assignment is repeated throughout the motion of the platen / base (1510) so that the phase distribution for the platen and the excitation by each phase (here, A, B, C) of the platen / base (1510) maintain a substantially steady state throughout the motion of the platen / base (1510).

[0158] A virtual multi-phase actuator unit (3000, 3000tP1, 3000tP2) may include a series of electromagnets (1700A-1700n) of an array of electromagnets (1700) coupled to at least a multi-phase AC power source (1585) forming at least one driving line (177-180) within a driving plane (1598), and the electromagnets (1700A-1700n) within the series of electromagnets (1700A-1700n) are dynamically grouped into at least one multi-phase actuator unit (DLIM1, DLIM2, DLIM3), each of at least one multi-phase actuator unit (DLIM1, DLIM2, DLIM3) is coupled to at least a multi-phase AC power source (1585). In this case, when starting the propulsion (executing base / secondary motion) by the corresponding groups of electromagnets of the motor operating unit at the initial position (P=0, t=0), the formation of the phases (A, B, C) and the associated "motors" (e.g., DLIM1, DLIM2, DLIM3) is changed in space and time (Pi, ti) to maintain substantially steady-state force vectors (FZ1, FZ2, FX1, FX2) applied to the base (1510) over the entire range of motion as described above, which provides the desired substantially steady state or constant tilted direction of the substrate handler (1500) over the entire range of motion. As mentioned herein, an exemplary actuator control system network (1799) configured to execute dynamic phase assignment is described in relation to FIG. 17.As illustrated in FIGS. 32a and 32b, dynamic phase assignment is controlled by a controller (199) such that each electromagnet (1700A-1700n), grouped into corresponding motor actuator units (as described herein) powered by a multiphase alternating current (A, B, C), exhibits a substantially steady-state multiphase distribution across each electromagnet (1700A-1700n) of at least one multiphase actuator unit (DLIM1, DLIM2, DLIM3) that moves virtually with respect to the base (1510) (indicated by the front portion (3110) and the rear portion (3111)). Note that the phase currents (A, B, C) are depicted within each electromagnet (1700A-1700n) and that the phase current distribution across at least one multi-phase actuator unit (DLIM1, DLIM2, DLIM3) is maintained in a constant or steady state with respect to the base (1510) (for example, as an example of a steady state, note that throughout the movement of the base (1510) and at least one (virtually moving) multi-phase actuator unit (DLIM1, DLIM2, DLIM3) in the direction (3100), the phase current (A) is maintained at the rear end of the rear portion (3111), the phase current (C) is maintained at the front end of the rear portion (3111), and the phase current (B) is maintained at the center of the rear portion (3111).

[0159] To explain dynamic phase assignment in more detail, FIG. 30 illustrates electromagnets (1700A, 1700B, 1700C) each defined as phases (A, B, C) (Fig. 30 and 32a) at time t1, which generate spatial force vector(s) that provide individually controllable lift and thrust for a predetermined substrate handler (1500) (i.e., a wafer handler identified by sensors (2000) and selected for movement by a controller (199)).

[0160] As the substrate handler (1500) moves in space (e.g., along a drive line associated with an array of electromagnets (1700)), at time t2, the electromagnets (1700B, 1700C, 1700D) each become phases (A, B, C) (Figs. 30 and 32b). As the substrate handler (1500) continues to move along the drive line (in this example, in the direction (3100) as shown in Figs. 32a, 32b, and 32c), at time t3, the phases (A, B, C) each become associated with the electromagnets (1700C, 1700D, 1700E). This dynamic phase assignment enables continuous spatial and temporal control of force vectors that maintain the propulsion, ascent, and orientation of the predetermined substrate handler (1500). In one aspect, an AC power source (1585) is coupled to each of the electromagnets (1700A-1700n) of an array of electromagnets (1700) through any suitable signal conditioning circuit (3050) that may include current amplification power supply units (3011) or any other suitable signal processing. Phase (A, B, C) currents are transmitted to each of the local drive controllers (1750A-1750n), which, under the control of the master controller (1760) or in response to a command from the master controller (1760), provide a specific current among the phase (A, B, C) currents to each electromagnet in the manner described above to perform dynamic phase assignment.

[0161] As described herein, the base (1510) (Fig. 16b) of the substrate handler works in cooperation with the electromagnets (1700A-1700n) of at least one multi-phase actuator unit (Fig. 32b) (DLIM, DLIM2, DLIM3) so that the excitation of the electromagnets (1700A-1700n) by alternating current generates levitation and thrust forces on the base (1510), and these levitation and thrust forces controllably levitate and propel the base (1510) along at least one drive line (177-180) in a controlled position relative to the drive plane (1598). A controller (199) (which in some aspects includes any controller dependent on the master controller, such as at least the master controller (1760) and local drive controllers (1750A-1750n), but in other aspects the controller may have any suitable configuration) is operably coupled to an AC power source (1585) and an array of electromagnets (1700). The AC power source (1585) may include any suitable associated circuit (3050), through which the AC power source (1585) is connected to the array of electromagnets (1700). The AC power source (1585) is controlled by other suitable controllers, such as local drive controllers or the master controller (1760). General control parameters for the AC power source include signal amplitude, signal frequency, and phase displacement relative to the reference coil unit. Other types of control parameters may also be defined. As used here, the "phases" (A, B, C) illustrated in FIG. 30 are similar to specific coils of a multiphase electric motor; however, each of the phase definitions (e.g., A, B, C in FIG. 30) is not physically connected to any specific coil.

[0162] In comparison with conventional technology, when a segmented linear induction motor with static phase assignment is used with its own dedicated control unit, it will be difficult to perform angle / tilt control when the board handler transitions from one segment to the next. FIGS. 31a and 31b illustrate this problem of maintaining pitch control across a static segmented linear induction motor. FIG. 31a shows a base (1510) or a secondary front section (3110) and rear section (3111) having induced forces along the Z-axis and X-axis. A first motor segment (SLIM1) with phases (A, B, and C) generates forces (Fzl and Fxl) that raise and propel the rear section (3111) of the base. A second motor segment (SLIM2) uses each of the phases (A, B, and C) to generate forces (Fz2 and Fx2) for the front section (3110) of the base. As the base moves in the direction (3100), the front and rear portions (3110, 3111) of the base will transition to the next linear induction motor segments. This is illustrated in FIG. 31b. At this position, the rear portion (3111) of the base overlaps with phases B and C of SLIMI and phase A of SLIM2. At the same time, the front portion (3110) of the base overlaps with phases B and C of SLIM2 and phase A of SLIM3. Consequently, for example, since the SLIM2 phases are shared by both the front and rear portions (3110, 3111) of the base, it is impossible to maintain the same required forces (Fz1, Fx1, Fz2, Fx2).

[0163] As previously described, and now referring to FIG. 32c in one aspect, controlling thrust and lift simultaneously and individually (whereby thrust and lift are controlled completely individually so that each control can be considered independent of each other even though the thrust and lift are executed by a common multi-phase alternating current having a single common frequency per phase, and the common frequency per phase is selectively variable from different desired frequencies) can be realized by a variation of the dynamic phase assignment described herein, wherein one or more dynamic linear motors (DLIM) may include n selectable phases associated with electromagnets forming a virtual motion multi-phase actuator unit, where n may be an integer greater than 3. The number n of electromagnets forming the virtual motion multi-phase actuator unit may be dynamically selected to realize different movements of the platen / base (1510), for example, according to the kinematic characteristics of the desired movement. Here, the excitation frequency commonly applied to each phase of the virtual motion multi-phase actuator unit is selected by the controller (199) to generate the desired kinematic performance and control of the platen / base (1510). Here, the phase control algorithm maintains the same electrical phase angle difference between the phases (e.g., electromagnets of the motor), as illustrated in FIG. 32c. The electrical phase difference is calculated for a reference phase or for each phase. The electrical phase angle difference (φ) between the phases may range from approximately -180 degrees to approximately 180 degrees, where a value of approximately 0 degrees corresponds to no thrust, while positive and negative values ​​provide thrust in the positive and negative directions, respectively. The number of electromagnets in each dynamic linear motor varies depending on the value of the electrical phase angle difference (φ). Here, as illustrated in FIG. 32c, the boundary between DLIM1 (illustrated with 6 electromagnets for exemplary purposes) and DLIM2 is dynamic.In another aspect of dynamic linear motor electromagnet / phase assignment, it is not necessary to power all electromagnets of the dynamic linear motor simultaneously. Referring to DLIM 1, only m electromagnets (m=4 in this example) (where m is the number of electromagnets covered by the base (or secondary)) of all n electromagnets (n=6 in this example) of the dynamic linear motor (DLIM1) are powered to perform the lifting and propulsion of the base (1510), while other electromagnets among the n electromagnets of the dynamic linear motor (DLIM1) may be powered off.

[0164] Now, with reference, for example, to FIGS. 1a-11, 15a-15c, 17, 28, 29, 30 and 41, an exemplary method for a linear electric machine (1599) will be described according to one or more aspects of the disclosed embodiment. In this method, the linear electric machine (1599) is provided with a frame (Fig. 41, block 4100), wherein the frame has a level reference plane (1299). A driving plane (1598) is formed in an array of an array (1700) of electromagnets connected to the frame (Fig. 41, block 4110). The driving plane (1598) is located at a predetermined height (H) with respect to the level reference plane (1299). An array of electromagnets (1700) is arranged such that a series of electromagnets of the array of electromagnets forms at least one driving line (177, 178) within a driving plane (1598), and each of the electromagnets (1700A-1700n) (see FIG. 15b) is coupled to an alternating current (AC) power source (1585) that supplies power to each electromagnet (1700A-1700n). At least one reaction platen (1510) is provided (Fig. 41, block 4120), wherein the at least one reaction platen (1510) is a paramagnetic, diamagnetic, or non-magnetic conductive material positioned to cooperate with the electromagnets (1700A-1700n) of the array of electromagnets (1700). Electromagnets (1700A-1700n) are excited by alternating current to generate levitation and propulsion forces (FZ, FP) (Fig. 41, Block 4130) for a reaction platen (1510) that controllably levitize and propel the reaction platen (1510) in a controlled position relative to the drive plane (1598) along at least one drive line.In a method for a linear electric machine (1599), electromagnets (1700A-1700n) are sequentially excited by a multi-phase alternating current using a controller (199) operably coupled to an array of electromagnets (1700) and an alternating current power source (1585), so that each reaction platen (1510) is levitated and propelled by a common set of electromagnets (1700A-1700n) with up to 6 degrees of freedom, including at least one of attitude control and yaw control, and each electromagnet generates both levitation force and propulsion force (FZ, FP) for the reaction platen (1510) from the excitation of a common multi-phase alternating current having a single common frequency per phase, thereby controlling the reaction platen (1510) with up to 6 degrees of freedom, including at least one of reaction platen attitude and reaction platen yaw, while the reaction platen (1510) is levitated.

[0165] Now, with reference, for example, to FIGS. 1a-11, 15a-15c, 17, 28, 29, 30, and 42, a method for an electromagnetic conveyor substrate transfer device (1599) will be described according to one or more aspects of the disclosed embodiment. In this method, the electromagnetic conveyor substrate transfer device (1599) is provided with a chamber (118) configured to hold an atmosphere sealed inside (Fig. 42, block 4200), the chamber having a level reference plane (1299) and at least one substrate passage opening (1180) for transfer, and the substrate is transferred in and out of the chamber (118) through said opening (1180). The driving plane (1598) is formed by an array (1700) of electromagnets connected to the chamber (118) (Fig. 42, block 4210). The driving plane (1598) is located at a predetermined height (H) relative to the level reference plane (1299). An array of electromagnets (1700) is arranged such that a series of electromagnets (1700A-1700n) of the array of electromagnets (1700) forms at least one driving line (177, 178) within the driving plane (1598), and the electromagnets (1700A-1700n) within the series of electromagnets (1700A-1700n) are grouped into at least one multi-phase actuator unit, and each of the at least one multi-phase actuator unit is coupled to a multi-phase alternating current (AC) power source (1585). At least one reaction platen (1510) is provided (Fig. 42, block 4220), wherein the at least one reaction platen (1510) is a paramagnetic, diamagnetic, or nonmagnetic conductive material arranged to cooperate with the electromagnets (1700A-1700n) of at least one multi-mount actuator unit. The electromagnets (1700A-1700n) are excited by alternating current to generate levitation and propulsion forces (FZ, FP) (Fig. 42, block 4230) for the reaction platen (1510) to controllably levitate and propel the reaction platen (1510) in a controlled position relative to the drive plane (1598) along at least one drive line (177, 178).The electromagnets (1700A-1700n) are sequentially excited by a multi-phase alternating current using a controller (199) operably coupled to an array of electromagnets (1700) and an alternating current power source (1585), thereby causing the reaction platen (1510) to levitize and propel, and the alternating current phase of each electromagnet (1700A-1700n) of the electromagnet group of at least one multi-phase actuator unit is dynamically assigned between each electromagnet (1700A-1700n) such that the alternating current phase of each electromagnet (1700A-1700n) changes from a first alternating current phase to a second different alternating current phase, so that the electromagnet group is virtually moved and the at least one multi-phase actuator unit formed by the electromagnet group is virtually moved along the drive line (177, 178) through dynamic phase assignment.

[0166] It should be understood that the foregoing description is merely illustrative of aspects of the present disclosure. Various alternatives and modifications may be devised by those skilled in the art without departing from the aspects of the present disclosure. Accordingly, the aspects of the present disclosure are intended to encompass all such alternatives, modifications, and changes that fall within the scope of any claims appended herein. Furthermore, the mere fact that different features are cited in different dependent or independent claims does not imply that a combination of such features cannot be used advantageously, and such combination remains within the scope of the aspects of the present disclosure.

Claims

Claim 1 A linear electrical substrate transporting machine, wherein the linear electrical substrate transporting machine comprises: a semiconductor substrate transport vacuum chamber having a plurality of transport ports, wherein each of the transport ports is configured to be connected to a respective processing chamber, and wherein the semiconductor substrate transport vacuum chamber comprises a frame having a level reference plane and can be sealed from an external environment in a vacuum state; an array of electromagnets connected to the frame to form a drive plane at a predetermined height with respect to the level reference plane, wherein the array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets form at least one drive line within the drive plane, and each of the electromagnets is connected to a power source that supplies power to each electromagnet; and a substrate handler having a substrate holding station for stably holding a semiconductor substrate at a holding position on a substrate handler, wherein the substrate handler comprises at least one reaction platen of a conductive material, wherein the reaction platen is excitation of a plurality of electromagnets to the substrate A substrate handler arranged to cooperate with the electromagnets of an array of electromagnets to generate a levitation force and a propulsion force for the at least one reaction platen, which controlsably levitizes and propels the handler along the at least one driving line in a controlled posture with respect to the driving plane, and to transport a semiconductor substrate held on the substrate handler to be transported through the semiconductor substrate transfer vacuum chamber by the movement of the reaction platen;A linear electric substrate transfer machine comprising: a controller operably coupled to an array of electromagnets and a power source and configured to individually excite the plurality of electromagnets with an electric current to control the six degrees of freedom of each reaction platen; wherein the controller is configured to calculate a trajectory for propulsion and levitation through the semiconductor substrate transfer vacuum chamber and an attitude along said trajectory for the substrate holding station of the substrate handler, said trajectory and attitude are described by control in combination of at least two of the six degrees of freedom based at least partially on the weight of the semiconductor substrate and the maximum acceleration of the semiconductor substrate, and through feedback control of the plurality of electromagnets, the controller controls the substrate holding station trajectory and the attitude along said trajectory in real time in combination of at least two of the six degrees of freedom as the substrate handler moves along the at least one drive line to transfer the semiconductor substrate through the transfer vacuum chamber, and said six degrees of freedom are x, y, z, roll, pitch, and yaw. Claim 2 A linear electric substrate transfer machine according to claim 1, wherein the holding position is located above the substrate handler, and the controller monitors and controls the position and movement of the substrate handler when the semiconductor substrate is transported and moved by controlling the 6 degrees of freedom of the substrate handler generated by the array of electromagnets to move the semiconductor substrate from a first known position relative to the frame to a second different position relative to the frame. Claim 3 A linear electric substrate transfer machine according to claim 1, wherein the controller controls the six degrees of freedom of the substrate handler generated by the array of electromagnets, such that when the substrate handler and the semiconductor substrate move from a first known position to a second different position, the controller controls at least one of the yaw or roll of the substrate handler to bias the semiconductor substrate so as not to slide relative to the substrate holding station and calculates the tilt of the substrate holding station and the direction of movement of the semiconductor substrate. Claim 4 A linear electric substrate transfer machine according to claim 1, wherein the controller considers the coefficient of friction between the substrate handler and the semiconductor substrate when calculating the critical acceleration of the substrate handler. Claim 5 A linear electric substrate transfer machine according to claim 1, wherein the controller controls the driving forces generated by the array of electromagnets across the substrate handler to impart a controlled yaw moment to the substrate handler to yawing the substrate handler about a yaw axis substantially perpendicular to the driving plane from a first predetermined orientation with respect to the frame to a second different predetermined orientation with respect to the frame, or to impart a moment couple to the substrate handler to perform a controlled yaw of the substrate handler to perform at least one of positioning and centering of a substrate payload on the substrate handler with respect to a predetermined substrate holding position of the frame. Claim 6 A linear electric substrate transfer machine according to claim 1, wherein the controller controls differential levitation forces generated by an array of electromagnets to impart differential levitation forces across the entire at least one reaction platen, thereby realizing a controlled inclination of the substrate handler with respect to the driving plane, which controls a predetermined substrate handler attitude at at least one of the substrate handler pitch and the substrate handler roll. Claim 7 A linear electric substrate transfer machine according to claim 1, wherein the controller controls levitation forces generated by an array of electromagnets to realize a predetermined bias attitude of the substrate handler with respect to the driving plane, which imparts a bias reaction force to the payload supported by the substrate holding station from the substrate handler payload seating surface in a direction opposite to the payload inertia force arising from the acceleration of the substrate handler along the driving plane. Claim 8 In claim 7, the linear electric substrate transfer machine further comprises a plurality of position feedback sensors distributed in the frame, each of the position feedback sensors configured to detect the position of the substrate handler along the driving plane and is communicably coupled to the controller so as to register the detected position of the substrate handler, and the controller configured to sequentially excite the electromagnets of the array of electromagnets corresponding to the detected position. Claim 9 A linear electric substrate transfer machine according to claim 8, wherein the controller is configured to determine the acceleration of the substrate handler along the driving plane from at least a change in a detected position, and to control the bias posture of the substrate handler in response to the determined acceleration to provide a predetermined bias posture that counteracts the payload inertial force generated by the at least one reaction platen. Claim 10 A linear electric substrate transfer machine according to claim 1, wherein the controller controls the excitation of the electromagnets of the array of electromagnets to set the substrate handler position to bias the substrate handler against an inertial force that tends to displace the semiconductor substrate seated on the substrate holding station. Claim 11 A linear electric substrate transfer machine according to claim 10, wherein the linear electric substrate transfer machine includes at least one sensor that detects position information of the substrate handler without being based on a magnetic field, and the controller controls the substrate handler with 6 degrees of freedom using the position information. Claim 12 In claim 10, the linear electric substrate transfer machine comprises at least one camera for detecting position information of the substrate handler, and the position information is provided to the controller. Claim 13 A linear electric substrate transfer machine according to claim 1, wherein the controller controls the substrate handler such that, while transferring a semiconductor substrate into the processing chamber through the transfer ports of the plurality of transfer ports, at least a portion of the substrate handler transferring the substrate moves from the semiconductor substrate transfer vacuum chamber into the processing chamber through the transfer ports, but the base portion of the substrate handler does not move into the processing chamber. Claim 14 A linear electric substrate transfer machine according to claim 1, wherein the controller controls the substrate handler such that at least a portion of the substrate holding station arranged to transport the substrate moves from the processing chamber into the semiconductor substrate transfer vacuum chamber through the transfer ports of the plurality of transfer ports, but the base of the substrate handler does not move into the processing chamber. Claim 15 In claim 1, the substrate handler is a linear electrical substrate transfer machine having self-centering supports for semiconductor substrates. Claim 16 A linear electric substrate transfer machine according to claim 1, wherein each of the transfer ports is connected to a respective processing chamber. Claim 17 A linear electric substrate transfer machine according to claim 1, wherein the substrate holding station is substantially common with the at least one reaction platen forming the base. Claim 18 A linear electric substrate transfer machine according to claim 1, wherein the semiconductor substrate transfer vacuum chamber comprises two separate transfer chambers connected to each other by isolation stages. Claim 19 A linear electric substrate transfer machine, wherein the semiconductor substrate is a photolithography cell in claim 1. Claim 20 A step of providing a linear electrical substrate transfer machine, wherein the linear electrical substrate transfer machine comprises: a semiconductor substrate transfer vacuum chamber having a plurality of transfer ports, wherein each of the transfer ports is configured to be connected to a respective processing chamber, and wherein the semiconductor substrate transfer vacuum chamber comprises a frame having a level reference plane and can be sealed from an external environment in a vacuum state; an array of electromagnets connected to the frame to form a drive plane at a predetermined height with respect to the level reference plane, wherein the array of electromagnets is arranged such that a series of electromagnets of the array of electromagnets forms at least one drive line within the drive plane, and each of the electromagnets is connected to a power source that supplies power to each electromagnet; and a substrate handler having a substrate holding station for stably holding a semiconductor substrate at a holding position on a substrate handler, wherein the substrate handler comprises at least one reaction platen of a conductive material, wherein the reaction platen is excitation of a plurality of electromagnets such that the substrate handler is connected to the drive plane A substrate handler arranged to cooperate with the electromagnets of an array of electromagnets to generate a levitation force and a propulsion force for the at least one reaction platen that is controllably levitized and propelled along the at least one drive line in a controlled posture, and transporting a semiconductor substrate held on the substrate handler to be transported through the semiconductor substrate transfer vacuum chamber by the movement of the substrate handler; and a controller operably coupled to the array of electromagnets and the power source and configured to individually excite the plurality of electromagnets with an electric current to control the six degrees of freedom of the substrate handler; comprising the step;A method comprising the step of calculating, by means of the controller, a trajectory for propulsion and levitation through the semiconductor substrate transfer vacuum chamber and an attitude along the trajectory for a substrate holding station of the substrate handler, wherein the trajectory and attitude are described by control in combination of at least two of the six degrees of freedom based at least partially on the weight of the semiconductor substrate and the frictional force between the semiconductor substrate and the substrate holding station, and wherein, through feedback control of the plurality of electromagnets, the controller controls the substrate holding station trajectory and the attitude along the trajectory in real time in combination of at least two of the six degrees of freedom when the substrate holding station moves along the at least one drive line to transfer the semiconductor substrate through the transfer vacuum chamber; wherein the six degrees of freedom are x, y, z, roll, pitch, and yaw. Claim 21 In claim 20, the controller monitors and controls the position and movement of the substrate handler when the semiconductor substrate is transported and moved by controlling the 6 degrees of freedom of the substrate handler generated by the array of electromagnets to move the semiconductor substrate from a first known position relative to the frame to a second different position relative to the frame. Claim 22 A method of claim 20, wherein the controller controls the six degrees of freedom of the substrate handler generated by the array of electromagnets, such that, in a state where the substrate handler and the semiconductor substrate are moving from a first known position to a second different position, the controller controls at least one of the yaw or roll of the substrate handler to bias the semiconductor substrate so as not to slide relative to the substrate holding station, thereby calculating the tilt of the substrate handler and the direction of movement of the substrate holding station. Claim 23 In paragraph 20, the method wherein the controller considers the coefficient of friction between the substrate handler and the semiconductor substrate when calculating the critical acceleration of the substrate handler. Claim 24 In claim 20, the controller controls the thrust forces generated by the array of electromagnets over the entire at least one reaction platen, to impart a controlled yaw moment to the substrate handler to yawing the substrate handler around a yaw axis substantially perpendicular to the driving plane from a first predetermined orientation with respect to the frame to a second different predetermined orientation with respect to the frame, or to impart a moment couple to the substrate handler to perform a controlled yaw of the substrate handler to perform at least one of positioning and centering of a substrate payload on the substrate handler with respect to a predetermined substrate holding position of the frame. Claim 25 In claim 20, the controller controls differential levitation forces generated by an array of electromagnets to impart differential levitation forces across the entire substrate handler that realize a controlled inclination of the substrate handler with respect to the driving plane, controlling a predetermined substrate handler attitude at at least one of the substrate handler pitch and the substrate handler roll. Claim 26 In claim 20, the controller controls levitation forces generated by an array of electromagnets to realize a predetermined bias attitude of the substrate handler with respect to the driving plane, which imparts a bias reaction force to the payload supported by the substrate holding station from the substrate holding station in a direction opposite to the payload inertia force arising from the acceleration of the at least one reaction platen along the driving plane. Claim 27 In claim 20, the controller controls the excitation of the electromagnets of the array of electromagnets to set the substrate handler position to bias the substrate handler against an inertial force that tends to displace the semiconductor substrate mounted on the substrate holding station. Claim 28 A method according to claim 20, wherein the controller controls the substrate handler such that, while transporting a semiconductor substrate into the processing chamber through the transfer ports of the plurality of transfer ports, at least a portion of the substrate handler transporting the substrate moves from the semiconductor substrate transfer vacuum chamber into the processing chamber through the transfer ports, but the base of the substrate handler does not move into the processing chamber. Claim 29 In claim 20, the controller controls the substrate handler such that the substrate holding station arranged to transport the substrate moves from the processing chamber into the semiconductor substrate transfer vacuum chamber through the transfer ports of the plurality of transfer ports, but the base of the substrate handler does not move into the processing chamber. Claim 30 A linear electric substrate transfer machine according to claim 1, wherein the transfer vacuum chamber optionally has a variable length, the chamber is formed of a plurality of transfer chamber modules, and the variable length is selected by connecting the transfer chamber module to the plurality of transfer chamber modules or by removing the transfer chamber module from the plurality of transfer chamber modules, thereby realizing an extension or reduction of the travel length of the at least one reaction platen, semiconductor substrate carrier, and semiconductor substrate.

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