Substrate processing apparatus

Abstract

The present disclosure relates to a substrate processing apparatus, wherein a substrate processing apparatus according to one embodiment comprises a stick substrate manufacturing unit configured to manufacture a stick substrate comprising any one of the plurality of rows by segmenting a mother substrate in which a plurality of element parts are arranged to form a plurality of rows, and a unit substrate manufacturing unit configured to receive the stick substrate from the stick substrate manufacturing unit and to manufacture a plurality of unit substrates each comprising a single element part by simultaneously segmenting the plurality of stick substrates.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus, and more specifically, to an apparatus for processing a substrate. Background Technology

[0002] Various components are used in recent information processing devices, such as computers, liquid crystal devices, home appliances, and vehicles. The above components may include circuits for performing specific functions.

[0003] The size of the device may vary, and considering production efficiency, a plurality of devices may be formed on a substrate larger than the device, and then the substrate may be segmented to manufacture a plurality of devices.

[0004] Depending on the size of the substrate containing multiple elements, a processing process of the substrate, including processes such as transfer and segmentation of the substrate, may be performed several times to manufacture the elements.

[0005] Efficiently performing the processing of such substrates to improve the productivity of the device and effectively enhance the quality of the device is an important task in this technical field. The problem to be solved

[0006] The embodiments aim to provide a substrate processing apparatus that can effectively improve the productivity of a unit substrate forming a device.

[0007] The embodiments aim to provide a substrate processing apparatus capable of efficiently performing a plurality of processing steps for producing a device.

[0008] The embodiments aim to provide a substrate processing apparatus in which the processing process of the substrate can be efficiently linked.

[0009] The embodiments aim to provide a substrate processing apparatus capable of effectively preventing damage to a device portion formed on a substrate. means of solving the problem

[0010] A substrate processing device according to one embodiment includes a stick substrate manufacturing unit and a unit substrate manufacturing unit. The stick substrate manufacturing unit is configured to manufacture a stick substrate comprising any one of the plurality of rows by segmenting a mother substrate in which a plurality of element units are arranged to form a plurality of rows.

[0011] The unit substrate manufacturing unit receives the stick substrate from the stick substrate manufacturing unit and is configured to simultaneously segment a plurality of stick substrates to manufacture a plurality of unit substrates each containing a single component.

[0012] The above stick substrate manufacturing unit may be configured to manufacture a dummy-removed mosquito substrate by removing a dummy area from the edge of the above mosquito substrate, and to manufacture the stick substrate by segmenting the dummy-removed mosquito substrate.

[0013] The above stick substrate manufacturing unit may include a substrate moving table arranged to allow the substrate to be placed and moved, and a substrate segmenting unit arranged to segment the substrate provided through the substrate moving table.

[0014] The above mosquito board segmentation unit may include a first mosquito board segmentation unit configured to manufacture a dummy removal type mosquito board by segmenting a dummy area at the edge of the mosquito board of the mosquito board moving table, and a second mosquito board segmentation unit configured to manufacture the stick board by receiving and segmenting the dummy removal type mosquito board manufactured in the first mosquito board segmentation unit.

[0015] The above-described mosquito plate moving table can rotate around a rotation axis extended in a direction penetrating the mosquito plate so that each of the plurality of sides of the mosquito plate faces the first mosquito plate segment.

[0016] The first mosquito plate segmentation part can segment a dummy area on one side facing the first mosquito plate segmentation part from the mosquito plate of the mosquito plate moving table.

[0017] The first mosquito plate segmentation part may include a first mosquito plate segmentation table in which the dummy area of ​​the mosquito plate is placed through the movement of the mosquito plate moving table, and a first mosquito plate fixing part for fixing the mosquito plate to the mosquito plate moving table and the first mosquito plate segmentation table.

[0018] The first mosquito plate segmentation table can segment the dummy area by forming a rotational displacement with respect to the mosquito plate movement table.

[0019] The above mosquito plate moving table can be moved from the first mosquito plate segment to the second mosquito plate segment to provide the dummy removal type mosquito plate to the second mosquito plate segment.

[0020] The above-described mosquito plate moving table may include a receiving groove that is recessed on the upper surface facing the mosquito plate and extends along the thermal direction of the plurality of element parts.

[0021] The above-mentioned mosquito plate moving table can be rotated so that the extension direction of the receiving groove faces the second mosquito plate segment, thereby moving to the second mosquito plate segment.

[0022] The second mosquito plate segmentation unit may include a mosquito plate transfer unit that picks and transfers the dummy-removing type mosquito plate of the mosquito plate transfer table, a second mosquito plate first segmentation table on which a portion of the dummy-removing type mosquito plate transferred through the mosquito plate transfer unit is placed, a second mosquito plate second segmentation table on which the remainder of the dummy-removing type mosquito plate transferred through the mosquito plate transfer unit is placed, and a second mosquito plate fixing unit that fixes the dummy-removing type mosquito plate to the second mosquito plate first segmentation table and the second mosquito plate second segmentation table.

[0023] The second segment table of the second mosquito board can manufacture the stick substrate by forming a rotational displacement with respect to the first segment table of the second mosquito board to segment the dummy removal type mosquito board.

[0024] The above unit substrate manufacturing unit may include a plurality of stick substrate segmenting units that manufacture the unit substrate by segmenting the stick substrate, and a plurality of picking units that each pick the stick substrate manufactured in the stick substrate manufacturing unit, and a stick substrate transfer unit that simultaneously transfers the plurality of stick substrates to the plurality of stick substrate segmenting units.

[0025] One embodiment may further include a first base plate manufacturing unit configured to manufacture a second base plate by segmenting a first base plate, and a second base plate manufacturing unit configured to manufacture the base plate by segmenting the second base plate.

[0026] The first substrate manufacturing unit may include a first circular substrate moving table on which the first circular substrate is placed and movable, and a first circular substrate segmenting unit on which the first circular substrate is segmented through the movement of the first circular substrate moving table.

[0027] The first circular substrate segmentation part may be configured to segment and remove a dummy region from the edge of the first circular substrate, and to manufacture the second circular substrate by segmenting the dummy-removed first circular substrate from which the dummy region has been removed.

[0028] The first circular substrate moving table can rotate around a rotation axis extended in a direction penetrating the first circular substrate so that each of the plurality of sides of the first circular substrate faces the first circular substrate segment.

[0029] The first circular substrate segmentation part can segment a dummy area on one side facing the first circular substrate segmentation part from the first circular substrate of the first circular substrate moving table.

[0030] The first circular substrate segmentation part may include a first circular substrate segmentation table in which the dummy area of ​​the first circular substrate is placed through the movement of the first circular substrate moving table, and a first circular substrate fixing part for fixing the first circular substrate to the first circular substrate moving table and the first circular substrate segmentation table.

[0031] The first circular substrate segmentation table can segment the dummy area by forming a rotational displacement relative to the first circular substrate movement table.

[0032] It may further include a first circular substrate transfer unit that transfers a dummy-removed first circular substrate, from which the dummy region has been removed, from the first circular substrate transfer table, places a part of the dummy-removed first circular substrate on the first circular substrate transfer table, and places the remainder of the dummy-removed first circular substrate on the first circular substrate segmentation table.

[0033] The first circular substrate segmentation table can manufacture the second circular substrate by segmenting the dummy-removing first circular substrate by forming a rotational displacement with respect to the first circular substrate movement table.

[0034] The second circular substrate manufacturing unit above is a second circular substrate delivery unit that picks and delivers the second circular substrate manufactured in the first circular substrate manufacturing unit,

[0035] It may include a second circular substrate moving table arranged to allow the second circular substrate, which is delivered through the second circular substrate delivery unit, to be placed and moved, and a second circular substrate segmenting unit arranged to manufacture the mother substrate by segmenting the second circular substrate provided through the movement of the second circular substrate moving table.

[0036] The second circular substrate moving table may be arranged to move along a first direction. It may move to the second circular substrate delivery unit and receive the second circular substrate in a second direction that crosses the first direction.

[0037] It can move to the second circular substrate segmentation unit and provide the second circular substrate to the second circular substrate segmentation unit in the first direction, and receive the mother substrate from the second circular substrate segmentation unit. It can move to the stick substrate manufacturing unit and provide the mother substrate to the stick substrate manufacturing unit.

[0038] The second circular substrate moving table includes a plurality of receiving grooves that are recessed on the upper surface where the second circular substrate is placed and extend along the second direction, and the second circular substrate transfer unit can transfer the second circular substrate to the second circular substrate moving table along the second direction.

[0039] The second substrate manufacturing unit may further include side protrusions that are located on both sides of the second circular substrate moving table with respect to the first direction and selectively protrude with respect to the upper surface of the second circular substrate moving table.

[0040] The above side protrusion may not protrude during the process in which the second circular substrate is transferred from the second circular substrate transfer part to the second circular substrate moving table.

[0041] The above side protrusion can protrude during the process in which the second circular substrate is transferred from the second circular substrate moving table to the second circular substrate segmenting part, thereby raising the plurality of elements of the second circular substrate upwards to the upper portion of the plurality of receiving grooves. Effects of the invention

[0042] The embodiments can provide a substrate processing apparatus that can effectively improve the productivity of a unit substrate forming a device.

[0043] The embodiments can provide a substrate processing apparatus capable of efficiently performing a plurality of processing steps for producing a device.

[0044] The embodiments can provide a substrate processing apparatus in which the substrate processing process can be efficiently linked.

[0045] The embodiments can provide a substrate processing device capable of effectively preventing damage to a device portion formed on a substrate. Brief explanation of the drawing

[0046] FIG. 1 is a drawing showing substrates handled in a substrate processing device according to one embodiment. FIG. 2 is a drawing showing a substrate processing apparatus according to one embodiment. Figure 3 is a drawing showing the first mosquito board manufacturing section of one embodiment. Figure 4 is a drawing showing the moving table of the first mosquito board manufacturing unit moved to the segmented unit. Figure 5 is a diagram showing the process of removing a dummy region of the first circular substrate from the first circular substrate segment. FIG. 6 is a drawing showing the hinge portion and the rotational force providing portion of the segment in one embodiment. FIG. 7 is a diagram showing a substrate being transferred from a first table to a second table in one embodiment. Figure 8 is a diagram showing the device portion and contactable area of ​​the substrate. FIG. 9 is a drawing showing a substrate placed on a table having a transfer groove formed therein in one embodiment. Figure 10 is a drawing showing the substrate floating from the table in Figure 9. FIG. 11 is a diagram showing the process of transferring a substrate from a first table to a second table through a transfer unit in one embodiment. FIG. 12 is a diagram showing the process of segmenting substrates placed on the first table and the second table in one embodiment. FIG. 13 is a drawing showing the support part and the repulsive force providing part of the segment in one embodiment. FIG. 14 is a drawing showing the protruding and non-protruding states of the support member in one embodiment. FIG. 15 is a drawing showing a fixing part provided in a segmented part of one embodiment. FIG. 16 is a diagram showing the area where the fixed part of the substrate contacts in one embodiment. FIG. 17 is a drawing showing the second mosquito board manufacturing section of one embodiment. FIG. 18 is a diagram showing the state in which a substrate is transferred from the first substrate manufacturing unit to the second substrate manufacturing unit. FIG. 19 is a drawing showing the moving table of the second substrate manufacturing unit moving to the second circular substrate segmentation unit. FIG. 20 is a drawing showing the protruding and non-protruding states of the side protrusions provided on the moving table of the second substrate manufacturing unit. FIG. 21 is a diagram showing the position of the substrate in the protruding and non-protruding states of the side protrusion, respectively. FIG. 22 is a diagram showing the process of transferring a substrate from a moving table to a first table and a second table through a transfer unit in one embodiment. FIG. 23 is a diagram showing the process of transferring the parent substrates of the second circular substrate segmentation part to the second circular substrate transfer table in one embodiment. FIG. 24 is a diagram showing the moving table of the second substrate manufacturing unit in one embodiment being moved to the stick substrate manufacturing unit. FIG. 25 is a drawing showing a stick substrate manufacturing section of one embodiment. FIG. 26 is a diagram showing the transfer of a base plate from a second base plate manufacturing unit to a stick base plate manufacturing unit in one embodiment. FIG. 27 is a diagram showing the moving table of the stick substrate manufacturing unit in one embodiment being moved to the first segment. FIG. 28 is a diagram showing the process of segmenting a dummy area of ​​a mosquito plate in the first mosquito plate segmentation part of one embodiment. FIG. 29 is a drawing showing the moving table of the stick substrate manufacturing unit in one embodiment being moved to the second segment. FIG. 30 is a diagram showing a mother substrate placed on a moving table of a stick substrate manufacturing unit in one embodiment being transferred to a second segmented unit through a transfer unit. FIG. 31 is a diagram showing the stick substrate being segmented from the mother substrate at the second segmentation part of the stick substrate manufacturing part in one embodiment. FIG. 32 is a drawing showing a unit substrate manufacturing section of one embodiment. FIG. 33 is a diagram showing the stick substrate transfer section of the unit substrate manufacturing section in one embodiment. FIG. 34 is a diagram showing the stick substrate transfer section of the unit substrate manufacturing section in one embodiment. FIG. 35 is a diagram showing the stick substrate segmentation part of the unit substrate manufacturing part in one embodiment. FIG. 36 is a diagram showing the unit substrate transfer section of the unit substrate manufacturing section in one embodiment. Specific details for implementing the invention

[0047] Below, with reference to the attached drawings, one embodiment is described in detail so that a person skilled in the art to which this disclosure pertains can easily implement it.

[0048] However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present disclosure in the drawings, parts unrelated to the description have been omitted, and similar parts throughout the specification have been given similar reference numerals.

[0049] In this specification, redundant descriptions of identical components are omitted.

[0050] Furthermore, when a component is described in this specification as being 'connected' or 'connected' to another component, it should be understood that it may be directly connected to or connected to the other component, or that there may be other components in between. On the other hand, when a component is described in this specification as being 'directly connected' or 'directly connected' to another component, it should be understood that there are no other components in between.

[0051] Furthermore, the terms used in this specification are used merely to describe specific embodiments and are not intended to limit the disclosure.

[0052] Additionally, in this specification, singular expressions may include plural expressions unless the context clearly indicates otherwise.

[0053] Furthermore, in this specification, terms such as 'comprising' or 'having' are intended merely to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not excluding in advance the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0054] Additionally, in this specification, the term "and / or" includes a combination of the plurality of described items or any of the plurality of described items. In this specification, "A or B" may include "A," "B," or "both A and B."

[0055] FIG. 1 is a drawing showing the type of substrate (90) according to one embodiment.

[0056] The substrate (90) may include at least one component part (97). The component part (97) may be a portion of the substrate (90) on which a circuit capable of performing a specific function is formed. In one embodiment, the substrate (90) may be of various types, and the types of substrates (90) may be classified according to their relative sizes.

[0057] In one embodiment, the substrate (90) may undergo a processing process including a transfer process, a segmentation process, etc. The substrate (90) may include a first circular substrate (91), and the first circular substrate (91) may include a first circular substrate (91) before dummy removal including a dummy region (99) and a first circular substrate (91a) after the dummy region (99) has been removed.

[0058] Here, the dummy region (99) can be defined as the remaining area of ​​the substrate (90) where the component part (97) is not formed. The component part (97) of the substrate (90) is sensitive to damage caused by contact, etc., so contact with other objects may be restricted, and the dummy region (99) allows contact with other objects and may be provided at the edge of the substrate (90).

[0059] In one embodiment, the dummy area (99) is provided at the edge of the substrate (90) to ensure ease of handling, such as transporting the substrate (90). The shape of the substrate (90) can be varied. The substrate (90) may be approximately rectangular. The dummy area (99) of the substrate (90) may exist on each side of the edge of the approximately rectangular substrate (90), and during the processing of the substrate (90), the dummy area (99) may be removed in a manner such as segmentation during an appropriate process.

[0060] The first circular substrate (91) may include a plurality of element parts (97). The element parts (97) may be arranged in various ways. For example, the element parts (97) may be arranged in a grid shape forming a plurality of columns (M) and rows (N).

[0061] In one embodiment, a first circular substrate (91) may be segmented to produce a plurality of second circular substrates (92). That is, the first circular substrate (91) may be in a form that includes a plurality of unsegmented second circular substrates (92). For example, as shown in FIG. 1, a first circular substrate (91) may be segmented to produce a pair of second circular substrates (92). The second circular substrate (92) may include a plurality of element parts (97) forming a plurality of columns (M) and a plurality of rows (N).

[0062] The shapes of the first circular substrate (91) and the second circular substrate (92) may vary. For example, the first circular substrate (91) may be approximately square, and the second circular substrate (92) may be approximately rectangular, with the central side of the first circular substrate (91) being segmented during manufacturing.

[0063] A second circular substrate (92) may be segmented to manufacture a plurality of mother substrates (93). That is, the second circular substrate (92) may be in a form that includes a plurality of unsegmented mother substrates (93). For example, as shown in FIG. 1, a second circular substrate (92) may be segmented to manufacture a pair of mother substrates (93). The mother substrate (93) may include a plurality of element parts (97) forming a plurality of columns (M) and a plurality of rows (N).

[0064] The shapes of the second circular substrate (92) and the mother substrate (93) may vary. For example, the second circular substrate (92) may be approximately rectangular, and the mother substrate (93) may be approximately square, with the central side of the second circular substrate (92) being segmented during manufacturing.

[0065] A dummy area (99) may be provided on the edge of the base plate (93). For example, the first circular base plate (91) and the second circular base plate (92) may include the base plate (93) including the dummy area (99) on the edge in an unsegmented state, and the base plate (93) with the dummy area (99) located on the edge may be provided through the segmentation process of the first circular base plate (91) and the second circular base plate (92). The base plate (93) may include a base plate (93) before dummy removal including the dummy area (99) and a dummy-removed base plate (93a) in which the dummy area (99) has been removed.

[0066] In one embodiment, a mother substrate (93) may be segmented to manufacture a plurality of stick substrates (94). That is, the mother substrate (93) may be in a form that includes a plurality of unsegmented stick substrates (94). The stick substrate (94) may include a plurality of columns and a single row formed by element parts (97), or a single column and a plurality of rows. For example, the element parts (97) of the stick substrate (94) may be arranged in a line.

[0067] In one embodiment, a stick substrate (94) may be segmented to manufacture a plurality of unit substrates (95). That is, the stick substrate (94) may be in a form that includes a plurality of unsegmented unit substrates (95). Each unit substrate (95) may include a single component part (97). A single unit substrate (95) may correspond to a single component. The unit substrate (95) may be used as a component itself, or, if necessary, completed as a component for individual handling and individual use through a post-processing process such as packaging.

[0068] As described above, in one embodiment, the substrate (90) may include at least some of a first circular substrate (91), a second circular substrate (92), a mother substrate (93), a stick substrate (94), and a unit substrate (95). Meanwhile, in one embodiment, if necessary, the processing of at least some of the first circular substrate (91) and the second circular substrate (92) may be omitted, and the unit substrate (95) may be manufactured by processing starting from the mother substrate (93). In one embodiment, the substrate (90) may further include an additional substrate (90) form that includes a plurality of first circular substrates (91) in an unsegmented state.

[0069] FIG. 2 illustrates a substrate (90) processing device (1) according to one embodiment. The substrate (90) processing device (1) can perform processing processes including transfer, segmentation, etc. of the substrate (90).

[0070] One embodiment includes at least one table (200). A substrate (90) may be placed on the table (200). A substrate (90) having a plurality of element parts (97) arranged side by side may be positioned on one side (203) of the table (200). The substrate (90) placed on the table (200) may undergo processing steps such as segmentation or transfer.

[0071] The table (200) may include a moving table (230) that moves along one direction and a segmenting table (250) arranged to segment a substrate (90). The moving table (230) may include at least one of a first circular substrate moving table (231), a second circular substrate moving table (232), and a mother substrate moving table (233) to be described later. The segmenting table (250) may include at least one of a first circular substrate segmenting table (251), a second circular substrate segmenting table (252), a first mother substrate segmenting table (254), and a second mother substrate segmenting table (255).

[0072] One embodiment may include at least one segmentation part (300). The segmentation part (300) may be provided to segment a substrate (90) placed on the table (200). The segmentation part (300) may include at least one of the first circular substrate segmentation part (330), the second circular substrate segmentation part (340), the first mother substrate segmentation part (350a), the second mother substrate segmentation part (350b), and the stick substrate segmentation part (360) to be described later.

[0073] One embodiment may perform a processing process of a substrate (90) by moving or segmenting the substrate (90) through the table (200) and the segmenting part (300).

[0074] Meanwhile, a substrate (90) processing device (1) according to one embodiment may include at least one substrate (90) manufacturing unit. The substrate (90) manufacturing unit may include at least one of the table (200) and the segmentation unit (300).

[0075] In one embodiment, the substrate (90) manufacturing unit may include at least one of a first mother substrate manufacturing unit (10), a second mother substrate manufacturing unit (20), a stick substrate manufacturing unit (30), and a unit substrate manufacturing unit (40). One embodiment may include a transfer unit (100) for transferring substrates (90) between the substrate (90) manufacturing units.

[0076] The above-mentioned delivery unit (100) may include at least one of the second circular substrate delivery unit (140), mother substrate delivery unit (150), stick substrate delivery unit (160), and unit substrate delivery unit (170) to be described later.

[0077] Multiple substrate (90) manufacturing units can be arranged in various ways. For example, a first mother substrate manufacturing unit (10) can be connected to a second mother substrate manufacturing unit (20) on one side, the second mother substrate manufacturing unit (20) can be connected to a stick substrate manufacturing unit (30) on one side, and the stick substrate manufacturing unit (30) can be connected to a unit substrate manufacturing unit (40) on one side. The connection between the substrate (90) manufacturing units can be defined based on the transfer relationship of the substrate (90).

[0078] Meanwhile, in one embodiment, a plurality of substrate (90) manufacturing units can be configured in various ways considering space utilization and the production efficiency of the device.

[0079] For example, as illustrated in FIG. 2, the first base plate manufacturing unit (10) can transport the base plate (90) along the second direction (Y) and can transfer the second circular base plate (92) to the second base plate manufacturing unit (20) along the second direction (Y). The second base plate manufacturing unit (20) can transport the base plate (90) along the first direction (X) and can transfer the base plate (93) to the stick base plate manufacturing unit (30) along the first direction (X).

[0080] The stick substrate manufacturing unit (30) can transport the substrate (90) along the first direction (X) and transfer the stick substrate (94) to the unit substrate manufacturing unit (40) along the second direction (Y). The unit substrate manufacturing unit (40) can transport the stick substrate (94) along the second direction (Y) and produce the unit substrate (95).

[0081] Each substrate (90) manufacturing unit may include a transfer unit (400). The transfer unit (400) may pick up the substrate (90) and transfer it to one side (203) of the table (200) or transfer it to the outside from the table (200). The transfer unit (400) may include at least one of the first circular substrate transfer unit (430), the second circular substrate transfer unit (440), the mother substrate transfer unit (450), and the stick substrate transfer unit (460) to be described later.

[0082] Meanwhile, the first base plate manufacturing unit (10) can manufacture a second circular plate (92) by transporting and segmenting the first circular plate (91), the second base plate manufacturing unit (20) can manufacture a base plate (93) by transporting and segmenting the second circular plate (92), the stick plate manufacturing unit (30) can manufacture a stick plate (94) by transporting and segmenting the base plate (93), and the unit plate manufacturing unit (40) can manufacture a unit plate (95) by transporting and segmenting the stick plate (94).

[0083] However, in one embodiment, at least one of the processing steps for the first circular substrate (91) and the second circular substrate (92) may be omitted as needed. For example, if the second circular substrate (92) instead of the first circular substrate (91) is provided to the first substrate manufacturing unit (10), the first substrate manufacturing unit (10) may simply transfer the second circular substrate (92) to the second substrate manufacturing unit (20). Additionally, if the substrate (93) is provided to the first substrate manufacturing unit (10), the first substrate manufacturing unit (10) and the second substrate manufacturing unit (20) may each simply transfer the substrate (93) to the stick substrate manufacturing unit (30).

[0084] That is, in one embodiment, the processing of the substrate (90) does not necessarily have to start from the first circular substrate (91), and may start from the second circular substrate (92), mother substrate (93), stick substrate (94), etc., as needed.

[0085] Meanwhile, FIG. 3 illustrates a first substrate manufacturing unit (10) according to one embodiment. The first substrate manufacturing unit (10) may be configured to manufacture a second circular substrate (92) by segmenting a first circular substrate (91).

[0086] Among the tables (200) of the substrate (90) processing device (1) according to one embodiment, the moving table (230) may include a first circular substrate moving table (231) of the first mother substrate manufacturing unit (10). The first circular substrate moving table (231) may be provided so that the first circular substrate (91) is placed thereon and can be moved. The first circular substrate moving table (231) may be moved along one direction. The one direction may correspond to the second direction (Y) described above.

[0087] A segmentation unit (300) of a substrate (90) processing device according to one embodiment may include a first circular substrate segmentation unit (330) of a first mother substrate manufacturing unit (10). The first circular substrate segmentation unit (330) may be provided to segment the first circular substrate (91) provided through the movement of the first circular substrate moving table (231).

[0088] In one embodiment, the segment table (250) among the table (200) may include a first circular substrate segment table (251) of the first parent substrate segment section (350a). At least a portion of the substrate (90) may be disposed on the first circular substrate segment table (251) and segmented.

[0089] In one embodiment, the segmentation part (300) may include a fixing part (310) for fixing the substrate (90). For example, the first circular substrate segmentation part (330) of the first mother substrate manufacturing part (10) may include a first circular substrate fixing part (311).

[0090] The fixing part (310) can fix the substrate (90) to the table (200). For example, the first circular substrate fixing part (311) can fix the first circular substrate (91) to the first circular substrate segment table (251).

[0091] In one embodiment, the method of segmenting the substrate (90) of the segmenting unit (300) may vary. For example, the segmenting unit (300) may segment the substrate (90) by rotating it to bend and break a part of the substrate (90) or by applying a cutter to the substrate (90).

[0092] A transfer unit (400) of a substrate (90) processing device (1) according to one embodiment may include a first circular substrate transfer unit (430) of a first mother substrate manufacturing unit (10). The first circular substrate transfer unit (430) may pick up a substrate (90), i.e., a first circular substrate (91), of a first circular substrate moving table (231) located adjacent to the first circular substrate segmenting unit (330) and transfer it to the first circular substrate segmenting unit (330).

[0093] The method of picking the substrate (90) of the transfer unit (400) can be varied. For example, the transfer unit (400) can pick the substrate (90) using a robot arm or pick the substrate (90) through a vacuum suction method.

[0094] Meanwhile, in one embodiment, the substrate (90) manufacturing unit may include a delivery unit (100) for transporting and delivering the substrate (90) manufactured by segmenting by the segmenting unit (300). For example, the first mother substrate manufacturing unit (10) may include a second circular substrate delivery unit (140) for picking up the second circular substrate (92) manufactured by the first circular substrate segmenting unit (330) and delivering it to the second mother substrate manufacturing unit (20), etc.

[0095] A substrate (90) processing device (1) according to one embodiment moves the substrate (90) through a moving table (230), transfers at least a portion of the substrate (90) of the moving table (230) to a segmenting section (300) through a transfer section (400), and a fixing section (310) of the segmenting section (300) fixes at least a portion of the substrate (90) to a segmenting table (250), and can transfer the segmented substrate (90) from the segmenting table (250) through a transfer section (100).

[0096] FIG. 4 illustrates the first circular substrate moving table (231) being moved to the first circular substrate segment (330) to remove the dummy area (99) of the first circular substrate (91).

[0097] In one embodiment, the table (200) may be moved along one direction. For example, the first circular substrate moving table (231) may be moved along the aforementioned second direction (Y). In one embodiment, the moving table (230) may be moved along a rail extending along one direction.

[0098] The first circular substrate moving table (231) can move to the first circular substrate segmentation section (330) with the first circular substrate (91) placed before dummy removal, in which the dummy area (99) exists.

[0099] In one embodiment, the segmentation part (300) can segment the substrate (90) in one direction. For example, the first circular substrate segmentation part (330) can segment the first circular substrate (91) by splitting it in the first direction (X). The first circular substrate (91) may be approximately rectangular, and a dummy area (99) may exist on each side.

[0100] In one embodiment, the table (200) may be provided to be rotatable around a rotation axis that penetrates the one surface (203) on which the substrate (90) is placed. For example, the first circular substrate moving table (231) may be rotatable around a rotation axis that extends in a direction penetrating the first circular substrate (91) so that each of the plurality of sides of the first circular substrate (91) faces the first circular substrate segment (330).

[0101] The first circular substrate segmentation part (330) can segment a dummy area (99) on one side facing the first circular substrate segmentation part (330) from the first circular substrate (91) of the first circular substrate moving table (231).

[0102] That is, in one embodiment, the moving table (230) is rotated so that each side of the substrate (90) faces the segmented portion (300), and the segmented portion (300) can segment and remove a dummy area (99) on one side of the substrate (90) facing the segmented portion (300).

[0103] One embodiment may include a dummy collection unit (70), and the dummy area (99) removed from the substrate (90) may be collected in the dummy collection unit (70). For example, in the first mother substrate manufacturing unit (10), the first circular substrate segmentation unit (330) may segment and remove the dummy area (99) of the first circular substrate (91), and the dummy area (99) removed from the first circular substrate (91) may be delivered to the dummy collection unit (70) through a separate delivery means.

[0104] For example, the first substrate manufacturing unit (10) can pick up the dummy area (99) separated from the first circular substrate (91) by the aforementioned second circular substrate delivery unit (140) and deliver it to the dummy collection unit (70).

[0105] Meanwhile, FIG. 5 illustrates the process of segmenting a dummy region (99) in a first circular substrate (91). With reference to FIG. 5, the segmentation process of a substrate (90) of a substrate (90) processing device (1) according to one embodiment will be described. Unless otherwise noted, the characteristics of the segmentation process described herein can be commonly applied to the substrate (90) segmentation process described later.

[0106] First, in one embodiment, the table (200) may include a first table (201) and a second table (202). The first table (201) and the second table (202) are defined in one embodiment for convenience of explaining the transfer process or segmentation process of the substrate (90), and may be two adjacent tables (200). The first table (201) and the second table (202) may each be a moving table (230) or a segmentation table (250).

[0107] FIG. 5(a) illustrates a configuration in which a portion of the substrate (90) is placed on the first table (201) and the remainder of the substrate (90) is placed on the second table (202). The second table (202) may be placed parallel to the first table (201) along one direction. The one direction may be a direction that crosses the width direction of the substrate (90).

[0108] Figure 5(b) shows that a portion of the substrate (90) is fixed to the first table (201) by the fixing part (310) and the remainder of the substrate (90) is fixed to the second table (202).

[0109] As shown in FIG. 5 (a), the fixing part (310) can fix the substrate (90) to the first table (201) and the second table (202) respectively by moving toward the first table (201) and the second table (202) and pressing the substrate (90) when the remaining portion of the substrate (90) is placed on the second table (202). That is, the fixing part (310) can fix the substrate (90) by pressing it toward the first table (201) or the second table (202).

[0110] Figure 5(c) illustrates a second table (202) fixed to the remainder of the substrate (90) forming a rotational displacement relative to the first table (201) to segment the remainder of the substrate (90) from a part of the substrate (90). Here, the remainder of the substrate (90) may be a dummy region (99) of the substrate (90).

[0111] The second table (202) can be rotated around a hinge axis (213) that is parallel to one side (203) of the substrate (90) and crosses the direction of movement of the substrate (90), and the substrate (90) can be segmented by forming a rotational displacement relative to the first table (201) through said rotation. Here, the extension direction of the hinge axis (213) may be the width direction of the substrate (90).

[0112] One embodiment may include a control unit (500). The control unit (500) may control the operation of the first table (201), the second table (202), and the fixed unit (310). For example, the control unit (500) may control the movement of the first table (201) so that the first table (201) and the second table (202) are adjacent to each other.

[0113] The control unit (500) can control the position of the fixing unit (310) so that a part and the remainder of the substrate (90) are fixed to the first table (201) and the second table (202), respectively. The control unit (500) can control the rotation of the second table (202) so that the second table (202) is rotated relative to the first table (201) to segment the part and the remainder of the substrate (90).

[0114] If the above segmentation process is correlated with the process of segmenting and removing the dummy area (99) of the first circular substrate (91) in the first substrate manufacturing unit (10), it is as follows.

[0115] The first substrate manufacturing unit (10) may move the first circular substrate moving table (231) on which the first circular substrate (91) is placed to the first circular substrate segmenting table (251) of the first circular substrate segmenting unit (330) in order to remove the dummy area (99) of the first circular substrate (91). The first circular substrate moving table (231) may correspond to the first table (201) described above.

[0116] As the first circular substrate moving table (231) moves adjacent to the first circular substrate segment table (251), the dummy area (99) of the first circular substrate (91) can be positioned on the first circular substrate segment table (251).

[0117] That is, the dummy area (99) of the first circular substrate (91) can be placed on the first circular substrate segmentation table (251) by moving the first circular substrate moving table (231). However, if necessary, the dummy area (99) may be transferred onto the first circular substrate segmentation table (251) using the first circular substrate transfer unit (430).

[0118] The first circular substrate segmentation part (330) may include a first circular substrate fixing part (311), and the first circular substrate fixing part (311) may fix the first circular substrate (91) to the first circular substrate moving table (231) and the first circular substrate segmentation table (251).

[0119] The first circular substrate segmentation table (251) can segment the dummy area (99) by forming a rotational displacement relative to the first circular substrate movement table (231). The first circular substrate segmentation table (251) may correspond to the second table (202) described above.

[0120] The dummy area (99) of the first circular substrate (91) segmented by the rotation of the first circular substrate segmentation table (251) can be transferred to the dummy collection unit (70) by the second circular substrate transfer unit (140). When the dummy area (99) is removed, the first circular substrate fixing unit (311) can be moved away from the substrate (90) again.

[0121] When a dummy region (99) is removed from one of the multiple sides of the first circular substrate (91), the moving table (230) of the first circular substrate (91) can be rotated so that another of the multiple sides faces the first circular substrate segment (330), and when the dummy region (99) is removed from all of the multiple sides, a dummy-removed first circular substrate (91a) exists on the first circular substrate moving table (231).

[0122] Meanwhile, FIG. 6 shows a table module (210) according to one embodiment.

[0123] In one embodiment, each table module (210) may be provided with a table (200). For example, a first table (201) may be provided in the first table module (211), and a second table (202) may be provided in the second table module (212).

[0124] The second table module (212) may be configured so that the second table (202) rotates around the hinge axis (213). That is, the second table (202) can rotate around the hinge axis (213). When the first table (201) and the second table (202) are arranged along one direction, the hinge axis (213) may be in the other direction crossing the one direction. The hinge axis (213) may extend parallel to the width direction of the substrate (90).

[0125] The fixing part (310) may include a first fixing part (310a) and a second fixing part (310b). The first fixing part (310a) may fix a part of the substrate (90) to the first table (201), and the second fixing part (310b) may fix the remainder of the substrate (90) to the second table (202). The first fixing part (310a) may be provided in the first table module (211), and the second fixing part (310b) may be provided in the second table module (212). The second fixing part (310b) may rotate together with the second table (202).

[0126] The second table module (212) may include a rotational force providing part (215) for rotating the second table (202). One side of the second table (202) may face the first table (201), and the other side may be connected to the rotational force providing part (215).

[0127] The rotational force providing unit (215) is provided in the form of a motor or hydraulic cylinder that consumes power and can rotate the other side of the second table (202) relative to one side of the second table (202).

[0128] In one embodiment, the hinge axis (213) may be provided to have a variable position. For example, the hinge axis (213) of the second table (202) may be provided to have an adjustable distance from the substrate (90).

[0129] In the process of segmenting the substrate (90) through the rotation of the second table (202), the quality of segmentation, such as the state of the segmented cross-section, may vary depending on the rotation center position of the second table (202). Taking this into consideration, in one embodiment, the position of the hinge axis (213) may be configured to be adjustable.

[0130] Meanwhile, FIG. 7 shows the dummy removal type first circular substrate (91a) being transferred to the first circular substrate segmentation table (251) of the first circular substrate segmentation part (330), and FIG. 8 shows the element part (97) and contactable area (98) of the substrate (90).

[0131] The first circular substrate segmentation part (330) may be configured to segment and remove a dummy region (99) from the edge of the first circular substrate (91), and to segment the dummy-removed first circular substrate (91a) from which the dummy region (99) has been removed to manufacture the second circular substrate (92).

[0132] For the segmentation of the dummy-removing type first circular substrate (91a), at least a portion of the first circular substrate (91) can be transferred through the first circular substrate transfer unit (430) to the first circular substrate segmentation table (251) of the first circular substrate segmentation unit (330).

[0133] Meanwhile, the plurality of element parts (97) provided on the substrate (90) have circuits formed thereon, and contact with other objects is very limited to prevent damage. On the other hand, the plurality of element parts (97) on the substrate (90) can be arranged to form at least one column (M) and at least one row (N), and the plurality of element parts (97) are spaced apart so that there is an area without circuits, and this area can be defined as a contactable area (98) where contact with other objects is possible.

[0134] In one embodiment, a receiving groove (220) may be formed on one surface (203) of the table (200) facing the substrate (90). The receiving groove (220) may be recessed on the one surface (203) of the table (200) and may extend along the arrangement direction of the plurality of element parts (97). The receiving groove (220) may be recessed on the upper surface facing the substrate (90) and may extend along the one direction.

[0135] The arrangement direction of the above-mentioned element part (97) may be the column direction or the row direction of the element part (97). The row direction may be the aforementioned first direction (X), and the column direction may be the aforementioned second direction (Y). The receiving groove (220) may be extended in either the first direction (X) or the second direction (Y).

[0136] The receiving groove (220) can provide a space for receiving a component part (97) on a substrate (90) placed on a table (200). For example, the component part (97) is positioned within the receiving groove (220) so as not to come into direct contact with one side (203) of the table (200), thereby preventing unintended damage.

[0137] In one embodiment, a plurality of element parts (97) of a substrate (90) may form a plurality of rows (M), and the receiving grooves (220) may be provided in a plurality to face each of the plurality of rows (M) of the plurality of element parts (97). Accordingly, the element parts (97) present on the substrate (90) may not come into direct contact with the table (200) as a whole.

[0138] The receiving groove (220) may extend along the entire table (200) parallel to the arrangement direction of the element parts (97). The receiving groove (220) may be open in the arrangement direction at the edge of the table (200). Accordingly, even when the substrate (90) is transported so as to be completely removed from the table (200), the situation in which the element parts (97) come into contact with the table (200) can be prevented.

[0139] Meanwhile, a gas injection unit (225) may be provided in the table (200) according to one embodiment. The gas injection unit (225) is provided on the one surface (203) of the table (200) and can float the substrate (90) by discharging gas onto the one surface (203).

[0140] In a state where gas is discharged by the gas injection unit (225), the transfer unit (400) according to one embodiment can transfer the substrate (90) so that the plurality of element units (97) move along the receiving groove (220).

[0141] For example, in one embodiment, the first table (201) and the second table (202) adjacent to each other among the tables (200) may each include the receiving groove (220) and the gas injection part (225). The receiving groove (220) of the first table (201) and the receiving groove (220) of the second table (202) may be arranged side by side in one direction, for example, along the column direction in which the element parts (97) are arranged.

[0142] FIG. 9 is a drawing showing a state in which a substrate (90) is placed on one side (203) of a table (200), such as the upper surface of the table (200), while the gas injection unit (225) is not operating, and FIG. 10 is a drawing showing a substrate (90) floating from the table (200) while the gas injection unit (225) is operating.

[0143] FIGS. 9 and 10 schematically show a cross-section in which the table (200) is cut along the row direction of the substrate (90), such as the width direction of the substrate (90), with the receiving groove (220) extended along the column direction of the element parts (97).

[0144] In the table (200), the recessed surface (221) of the receiving groove (220) may be spaced apart from the element portion (97) of the substrate (90). For example, the depth of the recess of the receiving groove (220) may be greater than the protrusion height of the element portion (97) relative to the substrate (90).

[0145] Additionally, the width of the receiving groove (220) may be greater than the width of the element part (97). Accordingly, direct contact between the element parts (97) received in the receiving groove (220) and the table (200) can be prevented in the width direction.

[0146] Between the receiving grooves (220) in the table (200), a supporting surface (222) may be positioned so as to protrude toward the substrate (90) beyond the recessed surface (221) of the receiving groove (220) to support the substrate (90).

[0147] The support surface (222) can support the contactable area (98) between the plurality of element parts (97) on the substrate (90). Accordingly, the table (200) can stably support the substrate (90) without contact with the element parts (97).

[0148] Meanwhile, even if only the contactable area (98) of the substrate (90) is supported through the support surface (222), friction or vibration between the support surface (222) and the contactable area (98) of the substrate (90) during the transfer process of the substrate (90) through the transfer unit (400), etc., may affect the circuit of the component part (97) or damage the substrate (90) itself.

[0149] Considering this, in one embodiment, gas can be sprayed toward the substrate (90) through the gas injection unit (225) during the transfer process of the substrate (90) to make the substrate (90) float.

[0150] The above gas injection unit (225) may include a gas hole (226) formed on one surface (203) of the table (200) to inject gas. The number and shape of the gas injection unit (225) may vary.

[0151] Additionally, the gas hole (226) may be located within the receiving groove (220). The gas hole (226) may be located in the recessed surface (221) of the receiving groove (220). Accordingly, the supporting surface (222) of the substrate (90) can be secured by the supporting surface (222), and a space for forming positive pressure to float the substrate (90) through the injection of gas can be effectively secured.

[0152] For example, the gas injection unit (225) can indirectly float the gas injection unit (225) through positive pressure formed in the space inside the receiving groove (220) in addition to the flow energy of the gas directed toward the substrate (90), so that stable floating of the substrate (90) can be achieved.

[0153] The support surface (222) of the table (200) supports the substrate (90) when the operation of the gas injection unit (225) is stopped, and can be spaced apart from the substrate (90) when the gas injection unit (225) is operated.

[0154] When a receiving groove (220) and a gas injection unit (225) are provided on the upper surface of the table (200), the element units (97) may be floated so as to be positioned above the receiving groove (220) in the operating state of the gas injection unit (225), but the substrate (90) does not necessarily need to be floated enough for the element units (97) to move outside the receiving groove (220), and a part of the element units (97) may be positioned inside the receiving groove (220).

[0155] In one embodiment, the gas injection unit (225) may be configured to inject gas during the transfer process of the substrate (90) and to inhale gas while the substrate (90) is in a seated state to fix the substrate (90) to the table (200).

[0156] For example, in one embodiment, the control unit (500) may be provided to control the operation of the gas injection unit (225), and may operate the gas injection unit (225) to float the substrate (90) during the process of transferring the substrate (90) to the table (200), and may stop the operation of the gas injection unit (225) or operate the gas injection unit (225) to suck in gas to fix the substrate (90) to the table (200) when the substrate (90) is seated on the table (200).

[0157] FIG. 11 illustrates the process of transferring a substrate (90) from a first table (201) to a second table (202) according to one embodiment. With reference to FIG. 11, the substrate (90) transfer process of the substrate (90) processing device (1) according to one embodiment will be described. Unless otherwise noted, the characteristics of the transfer process described herein can be commonly applied to the substrate (90) transfer process described later.

[0158] The first table (201) and the second table (202) are defined for convenience of explaining the transfer process of the substrate (90) as described above, and may be two adjacent tables (200). The first table (201) and the second table (202) may each be a moving table (230) or a segmented table (250).

[0159] FIG. 11 (a) illustrates a first table (201) positioned adjacent to a second table (202). A substrate (90) is placed on the first table (201). The position of the first table (201) may be fixed, but it may be provided to be movable while the substrate (90) is placed thereon. For example, the first table (201) may be moved adjacent to the second table (202) while the substrate (90) is placed thereon.

[0160] Figure 11 (b) shows the state in which the gas injection unit (225) of the first table (201) is operated so that the substrate (90) is floating away from the first table (201).

[0161] In one embodiment, the first table (201) and the second table (202) may each include the receiving groove (220) and the gas injection unit (225), and the gas injection unit (225) may operate during the process of transferring the substrate (90) from the first table (201) to the second table (202) to float the substrate (90).

[0162] Figure 11 (c) shows the transfer unit (400) moving toward the substrate (90) and picking up the substrate (90) which is floating on the first table (201).

[0163] The transfer unit (400) may be positioned above the first table (201) and descend toward the first table (201) to pick a substrate (90) that is floating on the first table (201). The transfer unit (400) may include at least one picking unit (401), and the picking unit (401) may pick the substrate (90) by adsorbing and fixing the substrate (90).

[0164] Figure 11 (d) shows the transfer unit (400) moving toward the second table (202) and at least a portion of the substrate (90) being transferred to the second table (202).

[0165] The transfer unit (400) can transfer at least a portion of the substrate (90) of the first table (201) to the second table (202) while the first table (201) is positioned adjacent to the second table (202).

[0166] The transfer unit (400) can pick and transfer the substrate (90) of the first table (201) while the first table (201) is moved adjacent to the second table (202), thereby placing a portion of the substrate (90) on the first table (201) and placing the remainder of the substrate (90) on the second table (202).

[0167] The transfer groove of the first table (201) and the transfer groove of the second table (202) can be arranged parallel to each other along one direction, and the gas injection part (225) of the second table (202) can operate together with the first table (201) during the transfer process of the substrate (90).

[0168] The transfer unit (400) can transfer the substrate (90) so that the component parts (97) of the substrate (90) move along the transfer groove of the first table (201) and the transfer groove of the second table (202). The substrate (90) can maintain a floating state on the second table (202) as well as on the first table (201).

[0169] A position guide (490) may be used to guide the transfer position of the substrate (90) during the process of transferring the substrate (90) from the first table (201) to the second table (202). The transfer unit (400) can transfer the substrate (90) to the correct position by transferring the substrate (90) so that the substrate (90) comes into contact with the position guide (490) located on the second table (202) side.

[0170] In one embodiment, the position guide (490) may be provided in various shapes and types and may be applied as needed during the transfer process of various substrates (90) described later.

[0171] One embodiment may include a control unit (500), and the control unit (500) may be configured to control the gas injection unit (225) and the transfer unit (400). For example, the control unit (500) may control the transfer unit (400) to transfer the substrate (90) while controlling the gas injection unit (225) so that the substrate (90) floats.

[0172] When the above-described transfer process of the substrate (90) is applied to the process of transferring the dummy-removing type first circular substrate (91a) from the first circular substrate transfer table (231) to the first circular substrate segmentation table (251) in the first mother substrate manufacturing unit (10), it is as follows. Here, the first circular substrate transfer table (231) may correspond to the aforementioned first table (201), and the first circular substrate segmentation table (251) may correspond to the aforementioned second table (202).

[0173] First, after removing the dummy area (99) of the first circular substrate (91) by rotating through the rotation axis (208a), the first circular substrate moving table (231) can move toward the first circular substrate segmenting table (251) in a rotated state such that the extension direction of the transfer groove is toward the first circular substrate segmenting table (251).

[0174] When the first circular substrate moving table (231) on which the dummy removal type first circular substrate (91a) is placed is positioned adjacent to the first circular substrate segmenting table (251), the gas injection unit (225) of the first circular substrate moving table (231) and the first circular substrate segmenting table (251) can be operated to inject gas. The dummy removal type first circular substrate (91a) can be floated from the first circular substrate moving table (231).

[0175] When the above dummy removal type first circular substrate (91a) is floating on the first circular substrate moving table (231), the first circular substrate transfer unit (430) moves toward the first circular substrate (91) and can adsorb and pick the first circular substrate (91) through the picking unit (401).

[0176] For example, the first circular substrate transfer unit (430) can transfer the dummy-removed first circular substrate (91a) from the first circular substrate transfer table (231) in which the dummy area (99) has been removed, place a part of the dummy-removed first circular substrate (91a) on the first circular substrate transfer table (231), and place the remainder of the dummy-removed first circular substrate (91a) on the first circular substrate segment table (251).

[0177] Meanwhile, FIG. 12 illustrates a process of manufacturing a second circular substrate (92) by segmenting a first circular substrate (91) placed on a first circular substrate moving table (231) and a first circular substrate segmenting table (251). Here, the first circular substrate moving table (231) may correspond to the first table (201), and the first circular substrate segmenting table (251) may correspond to the second table (202).

[0178] Figure 12(a) shows a dummy-removing type first circular substrate (91a) placed on a first circular substrate moving table (231) and a first circular substrate segmenting table (251). At this time, the gas injection unit (225) may not operate or may operate to suck in gas so that the first circular substrate (91) can be fixed to the table (200).

[0179] Figure 12(b) shows a support member (320) provided between the first circular substrate moving table (231) and the first circular substrate segmenting table (251) rising to support the contactable area (98) of the first circular substrate (91).

[0180] Specifically, one embodiment may further include a support member (320), the support member (320) being positioned between the first table (201) and the second table (202) and protruding toward the substrate (90) to support a segmented region defined between the part and the remainder of the substrate (90).

[0181] The above support member (320) can be positioned so as not to protrude onto one side (203) of the table (200) during the substrate (90) transfer process between the first table (201) and the second table (202), and can be raised to support the segmented area of ​​the substrate (90) during the substrate (90) segmentation process.

[0182] The support member (320) may also be applied as needed during the segmentation process of the dummy region (99) of the aforementioned substrate (90). A detailed description of the support member (320) will be provided later.

[0183] Figure 12 (c) shows a configuration in which the segmented area of ​​the dummy-removing type first circular substrate (91a) is supported by the support member (320), and the first circular substrate fixing member (311) moves toward the dummy-removing type first circular substrate (91a) to fix a part of the dummy-removing type first circular substrate (91a) to the first circular substrate moving table (231) and fix the remainder of the dummy-removing type first circular substrate (91a) to the first circular substrate segmenting table (251).

[0184] The first circular substrate fixing part (311) can fix at least a portion of the segmented area of ​​the dummy-removing type first circular substrate (91a) to the support part (320) by pressing it.

[0185] The first circular substrate fixing part (311) may include a first circular substrate first fixing part (311a) and a first circular substrate second fixing part (311b), the first circular substrate first fixing part (311a) fixes a part of the dummy removal type first circular substrate (91a) to the first circular substrate moving table (231), and the first circular substrate second fixing part (311b) fixes the remainder of the dummy removal type second circular substrate (92) to the first circular substrate segmenting table (251).

[0186] In FIG. 12 (d), the dummy removal type first circular substrate (91a) is fixed to the first circular substrate moving table (231) and the first circular substrate segmenting table (251) by the first circular substrate fixing part (311), and the first circular substrate segmenting table (251) forms a rotational displacement with respect to the first circular substrate moving table (231) to segment the dummy removal type first circular substrate (91a).

[0187] At this time, a second circular substrate (92) can be manufactured by segmenting the first circular substrate (91a) of the dummy removal type. For example, after the rotational displacement of the first circular substrate segmentation table (251) is formed, the second circular substrate (92), formed by segmenting the first circular substrate (91), can be placed on the first circular substrate moving table (231) and the first circular substrate segmentation table (251), respectively.

[0188] Meanwhile, one embodiment may include a control unit (500) and can control the first circular substrate fixing unit (311) and the first circular substrate segmentation table (251).

[0189] The control unit (500) can control the position of the first circular substrate fixing unit (311) so that the first circular substrate fixing unit (311) fixes the dummy removal type first circular substrate (91a) while the first circular substrate moving table (231) is adjacent to the first circular substrate segmenting table (251).

[0190] The control unit (500) can control the rotational displacement of the first circular substrate segmentation table (251) so that the first circular substrate segmentation table (251) rotates while the dummy-removing type first circular substrate (91a) is fixed, thereby segmenting the dummy-removing type first circular substrate (91a) to manufacture the second circular substrate (92).

[0191] Meanwhile, FIG. 13 shows a support member (320) and a repulsive force providing member (214) located between the first table (201) and the second table (202).

[0192] The first table (201) and the second table (202) may each include an opposing surface (205) facing each other. At least one of the opposing surface (206) of the first table (201) and the opposing surface (207) of the second table (202) may be arranged so that the distance (L) between them increases as they move further away from the substrate (90).

[0193] For example, in one embodiment, the substrate (90) may be positioned on the upper surface of the first table (201) and the second table (202). The distance (L) between the opposing surface (206) facing the second table (202) from the first table (201) and the opposing surface (207) facing the first table (201) from the second table (202) may increase as it faces downward. For example, the opposing surfaces (205) may be inclined so that they move further apart from each other as they face downward.

[0194] Accordingly, a space that widens toward the downward direction can be formed between the opposing surfaces (205) of the first table (201) and the second table (202). The second table (202) can be rotated so that the opposite side of the first table (201) moves downward, thereby segmenting the substrate (90). Interference with the first table (201) during the rotation of the second table (202) can be suppressed by the space between the opposing surfaces (205).

[0195] Meanwhile, the support member (320) may be positioned between the opposing surface (206) of the first table (201) and the opposing surface (207) of the second table (202). The support member (320) may be adjusted to protrude from one surface (203) of each of the first table (201) and the second table (202), such as the upper surface where the substrate (90) is supported. That is, the support member (320) may optionally protrude upward from the table (200).

[0196] The support member (320) can be moved upward between the first table (201) and the second table (202) to support the segmented area of ​​the substrate (90). The segmented area of ​​the substrate (90) can be defined as a certain area including (c) of the segmented line among the contactable area (98) of the substrate (90) and as an area that comes into contact with the support member (320).

[0197] As previously explained, in one embodiment, each table (200) may be provided with a transfer groove, and accordingly, the substrate (90) may be prevented from coming into direct contact with the table (200) during the process of transferring the component parts (97) from the table (200).

[0198] However, during the segmentation process of the substrate (90), the segmentation area of ​​the substrate (90) does not undergo direct contact and support in the area facing the receiving groove (220), but may be supported in multiple areas spaced apart by the support surface (222) on one side (203) of the substrate (90) along the width direction of the substrate (90), for example, the row direction of the element parts (97). Therefore, the entire segmentation area may not be stably supported, which may be disadvantageous in terms of constant propagation of cracks, formation of a stable segmentation line (c), and quality of the segmentation cross-section.

[0199] Accordingly, in one embodiment, a support member (320) is provided between the first table (201) and the second table (202) so that the entire segmented area of ​​the substrate (90) can be stably supported regardless of the presence of the receiving groove (220).

[0200] For example, the support member (320) may be positioned below the upper surface of the table (200) so as not to hinder the transfer of the substrate (90), such as the movement of the component members (97) through the transfer groove during the transfer process of the substrate (90). At this time, the upper end of the support member (320) may be positioned below the recessed surface (221) of the receiving groove (220).

[0201] However, during the segmentation process of the substrate (90), the support member (320) rises to support the segmented area of ​​the substrate (90), thereby enabling a stable support structure even for the segmented area that is not supported by the receiving groove (220).

[0202] The support member (320) may extend along the entire substrate (90) in the width direction of the substrate (90), for example, in the row direction of the element members (97), or in any one of the aforementioned first direction (X) and second direction (Y). The support member (320) may extend along the entire substrate (90) in a direction that crosses the arrangement direction of the element members (97) or the extension direction of the receiving groove (220).

[0203] Meanwhile, the support member (320) may include a first support member (320a) and a second support member (320b). The first support member (320a) may be provided in the first table module (211), and the second support member (320b) may be provided in the second table module (212). The second support member (320b) may be provided in the second table module (212) and rotate together with the second table (202). That is, the second support member (320b) may form a rotational displacement with respect to the first table (201) together with the second table (202).

[0204] The opposing surfaces facing each other in the first support member (320a) and the second support member (320b) may become further apart as they move downward. Accordingly, a space that widens as it moves downward may be formed between the first support member (320a) and the second support member (320b), and contact interference between the second support member (320b) and the first support member (320a) may be prevented by said space when the second support member (320b) rotates.

[0205] Meanwhile, one embodiment may further include a repulsive force providing part (214). The repulsive force providing part (214) is provided in at least one of the first table (201) and the second table (202), and can induce the crack in the substrate (90) by providing a repulsive force between the first table (201) and the second table (202) during the rotation process of the second table (202).

[0206] In one embodiment, the substrate (90) can be segmented through the formation of rotational displacement between the first table (201) and the second table (202). Specifically, the second table (202) can be rotated in the direction in which the substrate (90) is bent, and a crack may occur in the substrate (90) due to the bending. The substrate (90) may be segmented at (c) of the segmentation line within the segmentation area due to the occurrence and propagation of the crack.

[0207] The repulsion providing part (214) can promote or induce the occurrence and propagation of the crack by providing a repulsion between the first table (201) and the second table (202) during the rotation process of the second table (202). The propagation speed of the crack is improved by the repulsion providing part (214), so the quality of the segmented cross-section can be improved.

[0208] The repulsive force providing part (214) may be provided in various types and forms. For example, in one embodiment, the repulsive force providing part (214) may be provided in the second table module (212) as a hydraulic cylinder that pulls the second table (202) away from the first table (201).

[0209] However, as needed, the repulsion providing part (214) may be provided in the first table module (211), or may be provided in each of the first table module (211) and the second table module (212).

[0210] Meanwhile, FIG. 14 illustrates the non-protruding state and the protruding state of the support member (320), respectively. FIG. 14 is a cross-sectional view of the first table (201) or the second table (202) cut in a direction that crosses the extension direction of the receiving groove (220). FIG. 14 (a) illustrates the non-protruding state of the support member (320), and FIG. 14 (b) illustrates the protruding state of the support member (320).

[0211] As previously explained, the support member (320) may be provided such that the protrusion length of the first table (201) and the second table (202) is variable.

[0212] The above support member (320) has a protruding length that is minimized during the transfer process in which the substrate (90) is transferred to at least one of the first table (201) and the second table (202), and can have a protruding length that is maximized during the segmentation process of the substrate (90).

[0213] In FIG. 14 (a) and FIG. 14 (b), the end position of the support member (320) is indicated by a dotted line. The support member (320) may be in a non-protruding state during the transfer process of the substrate (90), with a minimum protruding length. In the non-protruding state, the upper end of the support member (320) may be positioned below the recessed surface (221) of the receiving groove (220).

[0214] The support member (320) may be in a protruding state during the segmentation process of the substrate (90), with the protruding length being at its maximum. In the protruding state, the upper end of the support member (320) may be positioned above the recessed surface (221) of the receiving groove (220) and may be approximately the same as the support surface (222) defined on one side (203) of the table (200).

[0215] FIG. 15 shows a fixing part (310) provided in a segmented part (300) in one embodiment, and FIG. 16 shows a fixing area in which the fixing part (310) contacts a substrate (90).

[0216] Referring to FIGS. 15 and 16, in one embodiment, the fixing part (310) may be provided to fix a substrate (90) to each of the two adjacent tables (200), a first table (201) and a second table (202).

[0217] The fixed part (310) may have a spaced-apart state spaced upward from the upper surface of the table (200) and a fixed state that moves toward the upper surface of the table (200) to press and fix the substrate (90).

[0218] In the above separated state, the substrate (90) can be transferred between the first table (201) and the second table (202) through the spaced gap between the fixed part (310) and the table (200). In the above fixed state, the fixed part (310) can press and fix the substrate (90) to the first table (201) and the second table (202). If a support part (320) is provided, the fixed part (310) can press and fix the substrate (90) to the support part (320) between the first table (201) and the second table (202).

[0219] The fixing part (310) may be provided in the form of a clamp that presses and fixes the substrate (90) to the table (200). The fixing part (310) may include a first fixing part (310a) and a second fixing part (310b), the first fixing part (310a) may be provided in the first table module (211), and the second fixing part (310b) may be provided in the second table module (212).

[0220] The first fixing part (310a) and the second fixing part (310b) may each be provided with a pressure pad at their respective ends facing each other, which contacts the substrate (90) and applies pressure to the substrate (90). Through the pressure pad, the substrate (90) can be stably pressed and fixed while reducing the contact area with the substrate (90).

[0221] The second table (202) can be rotated around a hinge axis (213) that extends along the first direction (X), the width direction of the substrate (90), or the row direction formed by the element parts (97) of the substrate (90). The second fixed part (310b) can form rotational displacement together with the second table (202).

[0222] A segment line (c) extending along the first direction (X) can be formed on the substrate (90) by the rotation of the second table (202), and a part of the substrate (90) and the remainder can be segmented by the segment line (c).

[0223] Meanwhile, in one embodiment, the fixing part (310) may be positioned on one side with respect to the first direction (X). For example, in one embodiment, the fixing part (310) may fix one end of the substrate (90) with respect to the first direction (X), for example, the width direction of the substrate (90). Accordingly, when the second table (202) is rotated, the one end of the substrate (90) fixed by the fixing part (310) is segmented, and the entire substrate (90) may be segmented along the width direction by a crack propagating from the one end.

[0224] The segment line (c) formed between the first table (201) and the second table (202) of the substrate (90) may be located within the contactable area (98) of the substrate (90). The fixing part (310) may fix the substrate (90) by contacting the contactable area (98) between the plurality of element parts (97) provided on the substrate (90).

[0225] FIG. 16 schematically shows the fixing area of ​​the fixing part (310) projected onto the contactable area (98) of the substrate (90). The fixing area can be defined as the contact area between the pressure pad of the aforementioned fixing part (310) and the substrate (90).

[0226] The above fixing part (310) may contact the substrate (90) between a pair of adjacent element parts (97) along one direction, for example, the second direction (Y), among the plurality of element parts (97) of the substrate (90). The pair of element parts (97) may be located at the outermost side of the substrate (90) with respect to the width direction, for example, the first direction (X). The above fixing part (310) may fix the above end of the substrate (90) by pressing it against the aforementioned support part (320).

[0227] In one embodiment, the fixing part (310) is positioned on one side so that when the second table (202) rotates, the one end of the substrate (90) can be directly segmented by the fixing of the fixing part (310), and a crack can be propagated along the first direction (X) from the fixing area by the fixing part (310) to form a segmentation line (c).

[0228] In one embodiment, the contact area between the fixing part (310) and the substrate (90) is reduced by segmenting the substrate (90) through the propagation of a crack over the entire area of ​​the substrate (90), thereby preventing unintended damage caused by an unnecessary increase in the contact area, and furthermore, a segmented cross-section is formed using the propagation of a crack, so that the quality of the segmented cross-section can be improved.

[0229] As described above, the segmentation method using crack propagation can be more advantageous for improving segmentation quality when the base material, which is the base material on which the component part (97) is formed in the substrate (90), is a high-hardness material.

[0230] For example, in one embodiment, the substrate (90) may be a glass substrate (90) in which the base is made of a glass material, and accordingly, the segmentation quality and segmentation efficiency of the substrate (90) may be improved by using the one-sided fixing part (310) according to one embodiment. However, the base material is not necessarily limited to a glass material and may be various materials as needed.

[0231] Meanwhile, Figure 17 shows the second mosquito board manufacturing section (20).

[0232] The second base plate manufacturing unit (20) may be configured to manufacture the base plate (93) by segmenting the second circular base plate (92). The second base plate manufacturing unit (20) may include a second circular base plate moving table (232). The second circular base plate moving table (232) may be one of the moving tables (230) among the tables (200) described above.

[0233] The second circular substrate moving table (232) can be moved along one direction. For example, the second circular substrate moving table (232) can be arranged to move along the first direction (X).

[0234] The second base plate manufacturing unit (20) may include a second circular base plate segmentation unit (340), and the second circular base plate segmentation unit (340) may be configured to manufacture the base plate (93) by segmenting the second circular base plate (92) provided through the movement of the second circular base plate moving table (232).

[0235] Meanwhile, in the second base plate manufacturing unit (20), the second circular substrate moving table (232) can be used as a transfer medium for each substrate (90). For example, the second base plate manufacturing unit (20) may be provided to receive and segment the second circular substrate (92) manufactured in the first base plate manufacturing unit (10). The second circular substrate moving table (232) may be positioned to move in the first direction (X) and face the first circular substrate segmenting unit (330) in the second direction (Y). The second circular substrate moving table (232) may be positioned to face the first circular substrate segmenting table (251).

[0236] The second circular substrate transfer table (232) can move to the second circular substrate transfer unit (140) and receive the second circular substrate (92) in the second direction (Y) that crosses the first direction (X). The second circular substrate transfer unit (140) may be located between the first circular substrate segmentation unit (330) and the second circular substrate transfer table (232), or may be provided in the first circular substrate segmentation unit (330).

[0237] The second circular substrate moving table (232) can move to the second circular substrate segment (340) while the second circular substrate (92) is placed therein and provide the second circular substrate (92) to the second circular substrate segment (340) in the first direction (X).

[0238] The second circular substrate segmentation unit (340) can segment the second circular substrate (92) to manufacture a plurality of parent substrates (93), and the second circular substrate moving table (232) can receive the parent substrates (93) from the second circular substrate segmentation unit (340).

[0239] The second circular substrate moving table (232) on which the base plate (93) is placed can move to the stick substrate manufacturing unit (30) and provide the base plate (93) to the stick substrate manufacturing unit (30).

[0240] FIG. 17 illustrates a second circular substrate moving table (232) moving along a first direction (X) so as to face a first circular substrate segmenting table (251) in order to receive a second circular substrate (92) from a first substrate manufacturing unit (10) according to one embodiment.

[0241] Meanwhile, FIG. 18 illustrates the transfer of a second circular substrate (92) placed on a first circular substrate segment table (251) to a second circular substrate transfer table (232).

[0242] As described above, the second circular substrate moving table (232) can be positioned to face the first circular substrate segmenting table (251) by moving along the first direction (X). The second circular substrate delivery unit (140) can pick the second circular substrate (92) manufactured in the first mother substrate manufacturing unit (10) and deliver it to the second circular substrate moving table (232).

[0243] The second circular substrate delivery unit (140) can move along the second direction (Y), and thus can deliver the second circular substrate (92) on the first circular substrate segment table (251) to the second circular substrate transfer table (232) in the second direction (Y). Additionally, the second circular substrate (92) placed on the first circular substrate transfer table (231) can be transferred to the first circular substrate segment table (251) by the first circular substrate transfer unit (430), and the second circular substrate delivery unit (140) can pick up the transferred second circular substrate (92) and deliver it to the second circular substrate transfer table (232).

[0244] In one embodiment, the second circular substrate moving table (232) moves toward the first circular substrate segmenting section (330) to receive the second circular substrate (92), thereby improving the degree of freedom of arrangement between the first parent substrate manufacturing section (10) and the second parent substrate manufacturing section (20).

[0245] In addition, the substrate (90) can be efficiently transferred even if the movement directions of the second circular substrate transfer unit (140) and the second circular substrate moving table (232) are different, and the design freedom can be improved as it is not necessary to design the movement directions of the second circular substrate transfer unit (140) and the second circular substrate moving table (232) in two directions.

[0246] Meanwhile, in one embodiment, the second circular substrate moving table (232) may include a plurality of receiving grooves (220) that are recessed on the upper surface where the second circular substrate (92) is placed and extend along the second direction (Y) in order to receive the substrate (90) from the first circular substrate (91) transfer unit (100) along one direction, for example, the second direction (Y).

[0247] The second circular substrate transfer unit (140) can transfer the second circular substrate (92) to the second circular substrate transfer table (232) along the second direction (Y). However, the first direction (X) and the second direction (Y) are defined arbitrarily for convenience of explanation and can be set in various directions as needed.

[0248] The second circular substrate transfer table (232) may include a gas injection unit (225) together with the transfer groove. Accordingly, during the process in which the second circular substrate (92) is transferred to the second circular substrate transfer table (232) by the second circular substrate transfer unit (140), the gas injection unit (225) of the first circular substrate segmentation table (251) and the second circular substrate transfer table (232) may be operated to inject gas.

[0249] FIG. 19 shows the second circular substrate moving table (232) moved to the second circular substrate segment (340).

[0250] As described above, the second circular substrate moving table (232) can move to the second circular substrate segmenting section (340) after receiving the second circular substrate (92) from the first circular substrate segmenting section (330) through the second circular substrate delivery section (140).

[0251] In one embodiment, the second circular substrate moving table (232) can be moved along a first direction (X) and can receive the second circular substrate (92) along a second direction (Y) from the first circular substrate segment (330). To this end, the second circular substrate moving table (232) may include a receiving groove (220) extending in the second direction (Y).

[0252] However, in the process where the second circular substrate moving table (232) moves along the first direction (X) to transfer the second circular substrate (92) to the second circular substrate segmenting section (340), the second circular substrate segmenting table (252) of the second circular substrate segmenting section (340) may receive the second circular substrate (92) along the first direction (X). To this end, the second circular substrate segmenting table (252) may include a receiving groove (220) and a gas injection section (225) extended along the first direction (X).

[0253] That is, in one embodiment, the second circular substrate (92) can be transferred in the second direction (Y) in addition to the first direction (X) in the second circular substrate transfer table (232).

[0254] Meanwhile, FIG. 20 shows a table (200) with side protrusions (217) provided on both sides according to one embodiment, and FIG. 21 shows a substrate (90) whose height changes depending on whether the side protrusions (217) protrude.

[0255] Figure 20 (a) shows a non-protruding table (200) in which the side protrusion (217) is not protruding, and Figure 20 (b) shows a protruding table (200) in which the side protrusion (217) is protruding.

[0256] FIG. 21(a) shows the arrangement of the substrate (90) on the table (200) in a non-protruding state of the side protrusion (217) as in FIG. 20(a), and FIG. 21(b) shows the arrangement of the substrate (90) on the table (200) in a protruding state of the side protrusion (217) as in FIG. 20(b). FIG. 21(a) and FIG. 21(b) schematically show a cross-section of a table (200) having a receiving groove (220) and a side protrusion (217) extended in the second direction (Y), cut along the first direction (X).

[0257] In one embodiment, the table (200) may include a receiving groove (220) extending in a first direction (X), and the side protrusions (217) may be provided on both sides of the table (200) with respect to the first direction (X).

[0258] The side protrusion (217) may be provided such that the protrusion length relative to the one surface (203) on which the substrate (90) is placed on the table (200) is variable. The side protrusion (217) may selectively change whether it protrudes relative to the one surface (203) of the table (200). The side protrusion (217) may be located on both sides of the table (200) based on the extension direction of the receiving groove (220) and may be provided to selectively protrude relative to the one surface (203) of the table (200).

[0259] For example, the side protrusion (217) is provided to move along the vertical direction of the table (200), and can be lowered in the non-protruding state and raised in the protruding state.

[0260] In the non-protruding state, the upper end of the side protrusion (217) may be positioned below the recessed surface (221) of the receiving groove (220) of the table (200). In the protruding state, the upper end of the side protrusion (217) may be positioned above the support surface (222) of the table (200). In the protruding state, the upper end of the side protrusion (217) may support the contactable area (98) of the substrate (90). In the protruding state of the side protrusion (217), the component part (97) of the substrate (90) may be positioned above the support surface (222) of the table (200).

[0261] When the above-mentioned side protrusion (217) is protruded, the element portion (97) of the substrate (90) can be separated from the one surface (203) of the table (200). Accordingly, even if the substrate (90) is moved from the table (200) in a direction that crosses the extension direction of the receiving groove (220), the element portion (97) of the substrate (90) may not come into contact with the one surface (203) of the table (200), such as the receiving groove (220).

[0262] In one embodiment, the side protrusion (217) is provided on the table (200), so that the substrate (90) can be transported from the table (200) in a first direction (X) and a second direction (Y), respectively. For example, the transport unit (400) can transport the substrate (90) in the extension direction of the receiving groove (220) when the side protrusion (217) is not protruding, and transport the substrate (90) in a direction across the extension direction when the side protrusion (217) is protruding.

[0263] Specifically, the table (200) can transport the substrate (90) along the extension direction of the receiving groove (220) so that the component part (97) of the substrate (90) does not come into contact with one side (203) of the table (200) through the aforementioned receiving groove (220). However, if the substrate (90) is transported in a direction that crosses the extension direction, the component part (97) may get caught between the receiving grooves (220) and be damaged.

[0264] Meanwhile, when the side protrusion (217) of the table (200) is in a protruding state, the substrate (90) cannot be moved in the extension direction of the receiving groove (220) because it is blocked by the side protrusion (217), but the element part (97) can be moved in a direction across the extension direction because it is spaced above the receiving groove (220) by the side protrusion (217).

[0265] For example, when the receiving groove (220) is extended in the first direction (X), the substrate (90) can be transported in the second direction (Y) when the side protrusion (217) protrudes. When the side protrusion (217) protrudes, it can have the same effect as forming an additional large receiving groove (220) on top of the existing receiving groove (220), where the upper end of the side protrusion (217) supports the substrate (90).

[0266] In one embodiment, the substrate (90) can be transported from the table (200) in the first direction (X) and the second direction (Y), respectively, using the side protrusion (217).

[0267] In one embodiment, the second substrate manufacturing unit (20) may include side protrusions (217) that are positioned on both sides of the second circular substrate moving table (232) with respect to the first direction (X) and selectively protrude with respect to the upper surface of the second circular substrate moving table (232).

[0268] The above side protrusion (217) does not protrude during the process in which the second circular substrate (92) is transferred from the second circular substrate transfer section (140) to the second circular substrate transfer table (232), but protrudes during the process in which the second circular substrate (92) is transferred from the second circular substrate transfer table (232) to the second circular substrate segmentation section (340), thereby allowing the plurality of elements of the second circular substrate (92) to rise above the plurality of receiving grooves (220).

[0269] Accordingly, when the second circular substrate moving table (232) faces the second circular substrate transfer section (140), the side protrusion (217) is in a non-protruding state, and each receiving groove (220) of the first circular substrate segmenting table (251) and the second circular substrate moving table (232) is extended along the second direction (Y), so that the second circular substrate (92) can be transported along the receiving groove (220).

[0270] Additionally, when the second circular substrate moving table (232) faces the second circular substrate segment (340), the side protrusion (217) corresponds to a protruding state, and the second circular substrate segment table (252) includes a receiving groove (220) extending along the first direction (X), and the second circular substrate (92) of the second circular substrate moving table (232) can be transported along the transport groove of the second circular substrate segment table (252) while in a state raised by the side protrusion (217).

[0271] Meanwhile, FIG. 22 illustrates a second circular substrate (92) being transferred to and segmented by a second circular substrate segmenting section (340) according to one embodiment. FIG. 22 (a) illustrates a second circular substrate moving table (232) on which the second circular substrate (92) is placed being moved to face the second circular substrate segmenting section (340), and FIG. 22 (b) illustrates a second circular substrate (92) being transferred from the second circular substrate moving table (232) to the second circular substrate segmenting table (252).

[0272] Referring to FIG. 22, the transfer process of a substrate (90) in one embodiment, with the first table (201), second table (202), and moving table (230) provided, is described as follows.

[0273] First, in one embodiment, the table (200) may include the first table (201) and the second table (202) and may be arranged adjacent to each other. Here, the first table (201) and the second table (202) may be segmented tables (250), but are not necessarily limited thereto, and may be moving tables (230) as needed.

[0274] The first table (201) and the second table (202) may be positioned adjacent to each other and fixed in place, and the movable table (230) may be provided to be movable while the substrate (90) is positioned. The movable table (230) may be moved adjacent to the first table (201). The movable table (230) may be positioned on one side of the first table (201), and the second table (202) may be positioned on the other side.

[0275] The transfer unit (400) can pick and transfer the substrate (90) of the moving table (230) while the moving table (230) is positioned adjacent to the first table (201), thereby placing a part of the substrate (90) on the first table (201) and transferring the remainder of the substrate (90) to the second table (202).

[0276] However, if necessary, the transfer unit (400) may transfer the substrate (90) such that the first part of the substrate (90) is positioned on the moving table (230), the second part of the substrate (90) is positioned on the first table (201), and the third part is positioned on the second table (202).

[0277] The transfer process of the substrate (90) using the three tables (200) as described above is explained through the second circular substrate segmentation part (340) as follows.

[0278] The second circular substrate segmentation unit (340) may include a second circular substrate transfer unit (440) and a second circular substrate segmentation table (252), and the second circular substrate segmentation table (252) may include a second circular substrate first segmentation table (252a) and a second circular substrate second segmentation table (252b).

[0279] Here, the second circular substrate moving table (232) may correspond to the moving table (230) described above, the transfer unit (400) may correspond to the second circular substrate transfer unit (440), the second circular substrate first segment table (252a) may correspond to the first table (201), and the second circular substrate second segment table (252b) may correspond to the second table (202).

[0280] The second circular substrate moving table (232) can move to be adjacent to the second circular substrate segmenting table (252) with the second circular substrate (92) placed thereon. In this state, the second circular substrate transfer unit (440) can pick the second circular substrate (92) of the second circular substrate moving table (232).

[0281] The second circular substrate transfer unit (440) can transfer the picked second circular substrate (92) to the second circular substrate segment table (252). At this time, a part of the second circular substrate (92) may be positioned on the second circular substrate first segment table (252a), and the remainder of the second circular substrate (92) may be positioned on the second circular substrate second segment table (252b).

[0282] FIG. 23 illustrates the process in which a second circular substrate (92) placed on a second circular substrate first segment table (252a) and a second circular substrate second segment table (252b) is segmented, and a mother substrate (93) manufactured by the segmentation of the second circular substrate (92) is transferred to a second circular substrate transfer table (232).

[0283] FIG. 23(a) illustrates the second circular substrate (92) being segmented at the second circular substrate first segment table (252a) and the second circular substrate second segment table (252b). Referring to FIG. 23(a), the segmentation process of the substrate (90) using the moving table (230), the first table (201), and the second table (202) in one embodiment is described as follows.

[0284] A substrate (90) transferred from a moving table (230) to a first table (201) and a second table (202) via a transfer unit (400) can be fixed to the first table (201) and the second table (202) by a fixing unit (310), and the substrate (90) can be segmented by the second table (202) forming a rotational displacement relative to the first table (201).

[0285] The above segmentation process is explained by corresponding it to the second circular substrate segmentation part (340) as follows.

[0286] The second circular substrate (92), which is transferred from the second circular substrate moving table (232) to the second circular substrate first segment table (252a) and the second circular substrate second segment table (252b) through the second circular substrate transfer unit (440), can be fixed to the second circular substrate first segment table (252a) and the second circular substrate first segment table (252a) by the second circular substrate (92) fixing unit (310).

[0287] Although the second circular substrate (92) fixing part (310) is not shown in FIG. 22, it can be understood by reflecting the characteristics of the aforementioned fixing part (310), such as the characteristics of the first circular substrate fixing part (311). In addition, the second circular substrate segmenting table (252) may include the aforementioned support part (320).

[0288] The second circular substrate second segment table (252b) can form a rotational displacement based on the second circular substrate first segment table (252a). Accordingly, the second circular substrate (92) is segmented and a plurality of mother substrates (93) can be manufactured.

[0289] Figure 23(b) illustrates the mother boards (93) of the second circular substrate segmentation unit (340) being transferred to the second circular substrate transfer table (232). In one embodiment, when the segmentation process of the second circular substrate (92) is completed, the mother boards (93) located at the second circular substrate first segmentation table (252a) and the second circular substrate second segmentation table (252b), respectively, can be picked and transferred by the second circular substrate transfer unit (440) and transferred back to the second circular substrate transfer table (232).

[0290] FIG. 24 shows the second circular substrate moving table (232) moving toward the stick substrate manufacturing unit (30).

[0291] The second circular substrate moving table (232) can be moved along the first direction (X) toward the substrate moving table (233) of the substrate (93) manufacturing section while the substrates (93) manufactured in the second circular substrate segmenting section (340) are arranged.

[0292] Accordingly, in one embodiment, the second circular substrate segmentation part (340) and the stick substrate manufacturing part (30) may be spaced apart from each other, thereby improving the degree of freedom in arrangement between the components, and the mother substrate (93) can be transferred to the stick substrate manufacturing part (30) via the second circular substrate moving table (232) without the need for a separate transfer means, thus simplifying the design.

[0293] Meanwhile, FIG. 25 shows a stick substrate manufacturing unit (30) according to one embodiment.

[0294] A stick substrate manufacturing unit (30) may be configured to manufacture a stick substrate (94) comprising any one of the plurality of rows by segmenting a mother substrate (93) in which a plurality of element units (97) are arranged to form a plurality of rows.

[0295] The above stick substrate manufacturing unit (30) may include a base plate moving table (233) and a base plate segmenting unit (350). The base plate moving table (233) may be provided so that the base plate (93) can be placed and moved.

[0296] The mosquito plate segmentation part (350) may be provided to segment the mosquito plate (93) provided through the mosquito plate moving table (233). The mosquito plate segmentation part (350) may include a first mosquito plate segmentation part (350a) and a second mosquito plate segmentation part (350b).

[0297] The mosquito plate moving table (233) may be configured to be movable along one direction. For example, the mosquito plate moving table (233) may be configured to be movable in a second direction (Y). The mosquito plate moving table (233) may include the aforementioned receiving groove (220) and gas injection part (225), and may be configured to be rotatable around a rotation axis (208b) extending in a direction penetrating the mosquito plate (93).

[0298] The stick substrate manufacturing unit (30) may include a dummy collection unit (70) in which a dummy area (99) removed from the mother substrate (93) is collected.

[0299] FIG. 26 illustrates, according to one embodiment, the mother plate (93) of the second circular substrate transfer table (232) being transferred to the mother plate transfer table (233).

[0300] The second circular substrate moving table (232) can be moved toward the mother substrate moving table (233), and the mother substrate moving table (233) can be moved toward the second circular substrate moving table (232). One side of the movement path of the second circular substrate moving table (232) can be positioned adjacent to one side of the movement path of the mother substrate moving table (233).

[0301] The movement directions of the second circular substrate moving table (232) and the parent substrate moving table (233) may vary. For example, the second circular substrate moving table (232) may move along the first direction (X), and the parent substrate moving table (233) may move along the second direction (Y).

[0302] The receiving groove (220) of the second circular substrate moving table (232) may be extended along the first direction (X), and the extension direction of the receiving groove (220) of the parent substrate moving table (233) located adjacent to the second circular substrate moving table (232) may be parallel to the first direction (X). In this case, the parent substrate (93) may be transferred from the second circular substrate moving table (232) to the parent substrate moving table (233) along the receiving groove (220).

[0303] However, if the receiving groove (220) of the second circular substrate moving table (232) is extended along the second direction (Y) and is positioned adjacent to the mother substrate moving table (233) along the first direction (X), the side protrusion (217) provided on the second circular substrate moving table (232) protrudes, thereby allowing the mother substrate (93) to be transferred from the second circular substrate moving table (232) to the mother substrate moving table (233) along the first direction (X).

[0304] The stick substrate manufacturing unit (30) may include a base substrate transfer unit (150). The base substrate transfer unit (150) can pick the base substrate (93) of the second circular substrate transfer table (232) and transfer it to the base substrate transfer table (233).

[0305] The substrate transfer unit (150) can be moved along the first direction (X), and can transfer the substrate (93) from the second circular substrate transfer table (232) to the substrate transfer table (233) along the first direction (X).

[0306] FIG. 27 illustrates the mother board moving table (233) of the stick board manufacturing unit (30) being moved to the first mother board segmenting unit (350a).

[0307] In one embodiment, the stick substrate manufacturing unit (30) may be configured to manufacture a dummy-removing type substrate (93a) by removing a dummy area (99) from the edge of the base substrate (93), and to manufacture the stick substrate (94) by segmenting the dummy-removing type substrate (93a).

[0308] The first mosquito board segmentation part (350a) can be provided to manufacture a dummy removal type mosquito board (93a) by segmenting the dummy area (99) at the edge of the mosquito board (93) of the mosquito board moving table (233).

[0309] After receiving the mosquito plate (93) through the mosquito plate delivery unit (150), the mosquito plate transfer table (233) can move to the first mosquito plate segmentation unit (350a) and provide the mosquito plate (93) before dummy removal to the first mosquito plate segmentation unit (350a).

[0310] The above-mentioned mosquito plate moving table (233) can rotate such that each of the plurality of sides of the mosquito plate (93) faces the first mosquito plate segment (350a) around a rotation axis (208b) that extends in a direction penetrating the mosquito plate (93).

[0311] The first mosquito plate segmentation part (350a) can segment a dummy area (99) on one side facing the first mosquito plate segmentation part (350a) from the mosquito plate (93) of the mosquito plate moving table (233).

[0312] FIG. 28 illustrates a dummy area (99) being segmented in the mosquito plate (93) before dummy removal in the first mosquito plate segmentation part (350a) according to one embodiment.

[0313] The first mosquito board segmentation part (350a) above may include a first mosquito board segmentation table (254), and the dummy area (99) of the mosquito board (93) can be arranged through the movement of the mosquito board movement table (233) in the first mosquito board segmentation table (254). Here, the mosquito board movement table (233) may correspond to the first table (201) described above, and the first mosquito board segmentation table (254) may correspond to the second table (202).

[0314] By moving the above mosquito board moving table (233), the dummy area (99) on one side of the mosquito board (93) among the dummy areas (99) of the mosquito board (93) can be positioned on the first mosquito board segment table (254).

[0315] The first mosquito plate segmentation part (350a) may include a first mosquito plate fixing part (313). The first mosquito plate fixing part (313) can fix the mosquito plate (93) to the mosquito plate moving table (233) and the first mosquito plate segmentation table (254).

[0316] The first mosquito plate fixing part (313) may include a first mosquito plate first fixing part (313a) and a first mosquito plate second fixing part (313b). The first mosquito plate first fixing part (313a) fixes a part of the mosquito plate (93) to the mosquito plate moving table (233), and the first mosquito plate second fixing part (313b) fixes the remainder of the mosquito plate (93), that is, the dummy area (99) of the mosquito plate (93), to the first mosquito plate segmenting table (254).

[0317] The first mosquito board segmentation table (254) can segment the dummy area (99) by forming a rotational displacement relative to the mosquito board moving table (233). When all the dummy areas (99) located on each side of the mosquito board (93) are removed from the first mosquito board segmentation section (350a) through the movement and rotation of the mosquito board moving table (233), the process of segmenting the dummy areas (99) of the mosquito board (93) is terminated, and a dummy-removing type mosquito board (93a) can be placed on the mosquito board moving table (233).

[0318] FIG. 29 illustrates the mosquito plate moving table (233) being moved to the second mosquito plate segment (350b).

[0319] In one embodiment, the mosquito board segmentation part (350) may include a second mosquito board segmentation part (350b), and the second mosquito board segmentation part (350b) may be provided to receive the dummy removal type mosquito board (93a) manufactured in the first mosquito board segmentation part (350a) and segment it to manufacture the stick board (94).

[0320] The above mosquito board moving table (233) can be moved from the first mosquito board segment (350a) to the second mosquito board segment (350b) to provide the dummy removal type mosquito board (93a) to the second mosquito board segment (350b).

[0321] That is, in one embodiment, the mosquito board moving table (233) can move to the first mosquito board segment (350a) to provide the mosquito board (93), and with the dummy removal type mosquito board (93a) with the dummy area (99) removed placed thereon, it can move from the first mosquito board segment (350a) to the second mosquito board segment (350b) to provide the dummy removal type mosquito board (93a) to the second mosquito board segment (350b).

[0322] In one embodiment, the mosquito plate (93) or the dummy removal type mosquito plate (93a) can be transported through the mosquito plate transport table (233), so the degree of freedom in the arrangement of the mosquito plate transport unit (150), the first mosquito plate segmentation unit (350a), and the second mosquito plate segmentation unit (350b) can be increased, and the design complexity can be improved as a separate substrate (90) transport means is not required.

[0323] Meanwhile, the above-mentioned mosquito plate moving table (233) may include a receiving groove (220) that is recessed on the upper surface facing the mosquito plate (93) and extends along the column direction of the plurality of element parts (97).

[0324] The above-mentioned mosquito plate moving table (233) can be moved to the second mosquito plate segment (350b) by rotating the extension direction of the receiving groove (220) so that it faces the second mosquito plate segment (350b). For example, the mosquito plate moving table (233) can move along the second direction (Y) and can be moved to the second mosquito plate segment (350b) while rotated so that the extension direction of the receiving groove (220) is parallel to the first direction (X).

[0325] FIG. 30 illustrates a mosquito plate (93) being transferred from a mosquito plate moving table (233) to a second mosquito plate segment (350b) according to one embodiment.

[0326] The second mosquito board segmentation part (350b) above may include a mosquito board transfer part (450). The mosquito board transfer part (450) can pick up and transfer the dummy removal type mosquito board (93a) of the mosquito board transfer table (233).

[0327] The second mosquito plate segmentation part (350b) may include a second mosquito plate segmentation table (255), and the second mosquito plate segmentation table (255) may include a second mosquito plate first segmentation table (255a) and a second mosquito plate second segmentation table (255b).

[0328] A portion of the dummy removal type mosquito plate (93a) transferred through the mosquito plate transfer unit (450) may be placed on the second mosquito plate first segment table (255a), and the remainder of the dummy removal type mosquito plate (93a) transferred through the mosquito plate transfer unit (450) may be placed on the second mosquito plate second segment table (255b).

[0329] The second mosquito plate segment table (255) may include a receiving groove (220) extending toward the mosquito plate moving table (233). For example, the second mosquito plate first segment table (255a) and the second mosquito plate second segment table (255b) may each include a receiving groove (220) extending in the first direction (X).

[0330] The mosquito board moving table (233) may be positioned adjacent to the second mosquito board first segment table (255a) along the first direction (X). The mosquito board moving table (233) may be located on one side of the second mosquito board first segment table (255a), and the second mosquito board second segment table (255b) may be located on the other side.

[0331] The second mosquito board transfer unit (450) can transfer a dummy removal type mosquito board (93a) located on the mosquito board transfer table (233) to place a part of the dummy removal type mosquito board (93a) on the second mosquito board first segment table (255a) and place the remainder of the mosquito board (93) on the second mosquito board second segment table (255b). In this case, the second mosquito board first segment table (255a) may correspond to the aforementioned first table (201), and the second mosquito board second segment table (255b) may correspond to the aforementioned second table (202).

[0332] FIG. 31 illustrates the dummy removal type mosquito plate (93a) being segmented at the second mosquito plate segmentation part (350b).

[0333] The second mosquito board segment (350b) may include a second mosquito board fixing part (314), and the second mosquito board fixing part (314) may fix the dummy removal type mosquito board (93a) to the second mosquito board first segment table (255a) and the second mosquito board second segment table (255b).

[0334] The second mosquito plate fixing part (314) may include a second mosquito plate first fixing part (314a) that fixes a part of the dummy removal type mosquito plate (93a) to the second mosquito plate first segment table (255a), and a second mosquito plate second fixing part (314b) that fixes the remainder of the dummy removal type mosquito plate (93a) to the second mosquito plate second segment table (255b).

[0335] The second mosquito board second segment table (255b) can manufacture the stick board (94) by forming a rotational displacement with respect to the second mosquito board first segment table (255a) to segment the dummy removal type mosquito board (93a).

[0336] The remainder of the dummy removal type mosquito board (93a) located on the second mosquito board second segment table (255b) may correspond to a stick board (94). The stick board (94) may be arranged so that a plurality of element parts (97) form a single row.

[0337] When the second mosquito board transfer unit (450) finishes one mosquito board (93) segmentation process and one stick board (94) is manufactured, it can transfer the mosquito board (93) of the second mosquito board first segmentation table (255a) again and position the part of the mosquito board (93) corresponding to the stick board (94) on the second mosquito board second segmentation table (255b).

[0338] The second mosquito board segmentation unit (350b) can perform a segmentation process of the mosquito board (93) to correspond to the number of rows of element parts (97) included in the dummy removal type mosquito board (93a). For example, if there are n rows of element parts (97) in the mosquito board (93), the second mosquito board segmentation unit (350b) can perform n-1 segmentation processes to manufacture n stick boards (94) from one mosquito board (93).

[0339] FIG. 32 illustrates a unit substrate manufacturing unit (40) according to one embodiment.

[0340] The unit substrate manufacturing unit (40) receives the stick substrate (94) from the stick substrate manufacturing unit (30) and may be configured to simultaneously segment a plurality of the stick substrates (94) to manufacture a plurality of unit substrates (95) each containing a single element part (97).

[0341] The unit substrate manufacturing unit (40) is connected to the stick substrate manufacturing unit (30) to receive the stick substrate (94). The unit substrate manufacturing unit (40) is connected to the second parent substrate segmentation unit (350b) to receive the stick substrate (94) manufactured by the second parent substrate segmentation unit (350b).

[0342] Specifically, a stick substrate supply position (SP) where a manufactured stick substrate (94) is located can be defined in the second base substrate segmentation section (350b). The unit substrate manufacturing section (40) can receive the stick substrate (94) located at the stick substrate supply position (SP) and transfer it to a stick substrate placement position (LP) for manufacturing a unit substrate (95).

[0343] In one embodiment, the unit substrate manufacturing unit (40) may have a plurality of stick substrate placement positions (LP), and accordingly, the stick substrates (94) delivered from the stick substrate manufacturing unit (30) may each be delivered to different stick substrate placement positions (LP).

[0344] The unit substrate manufacturing unit (40) may include a stick substrate transfer unit (460) for transferring a stick substrate (94). The stick substrate transfer unit (460) may be provided in multiple units as needed. Additionally, the unit substrate manufacturing unit (40) may include a stick substrate segmentation unit (360) for manufacturing a unit substrate (95) by segmenting the stick substrate (94) transferred through the stick substrate transfer unit (460). The stick substrate segmentation unit (360) may be provided in multiple units as needed.

[0345] The unit substrate manufacturing unit (40) may include a unit substrate delivery unit (170) that picks and transports the unit substrate (95) manufactured in the stick substrate segmentation unit (360).

[0346] FIG. 33 illustrates the stick substrate delivery section (160) of the unit substrate manufacturing section (40).

[0347] The stick substrate delivery unit (160) may include a picking unit for picking the stick substrate (94), and the picking unit may move along one direction. The stick substrate delivery unit (160) may pick and deliver the stick substrate (94) manufactured in the second parent substrate segmentation unit (350b).

[0348] A stick substrate supply position (SP) described above may be defined in the second parent substrate segmentation section (350b), and the stick substrate supply position (SP) may be defined on the second parent substrate second segmentation table (255b). The stick substrate delivery section (160) may move to the stick substrate supply position (SP) to pick the stick substrate (94), and move along one direction to position the stick substrate (94) at the stick substrate placement position (LP).

[0349] There may be multiple stick substrate placement positions (LP). Multiple stick substrate placement positions (LP) may be arranged along the direction of movement of the stick substrate delivery unit (160). Multiple stick substrate placement positions (LP) may be positioned parallel to the stick substrate supply position (SP) along the direction of movement.

[0350] The unit substrate manufacturing unit (40) may include a stick substrate placement table (234). The stick substrate placement position (LP) may be defined in the stick substrate placement table (234). The stick substrate placement table (234) may be provided in multiple numbers.

[0351] In FIG. 33, four stick substrate supply positions (SP) are shown according to one embodiment, but in one embodiment, the number of stick substrate supply positions (SP), as well as the stick substrate transfer unit (460) and the stick substrate segmentation unit (360), can be determined in various ways as needed.

[0352] FIG. 34 illustrates the stick substrate transfer unit (460) of the stick substrate manufacturing unit (30).

[0353] The stick substrate transfer unit (460) may include a picking unit (461) for picking the stick substrate (94). The picking unit (461) may be moved along one direction. The transfer direction of the stick substrate transfer unit (460) and the transfer direction of the stick substrate delivery unit (160) may be different from each other.

[0354] For example, in one embodiment, the stick substrate delivery unit (160) can transport the stick substrate (94) along the first direction (X), and the stick substrate transport unit (460) can transport the stick substrate (94) along the second direction (Y).

[0355] The stick substrate delivery unit (160) can transfer the stick substrate (94) from the stick substrate supply position (SP) to the stick substrate placement position (LP), and the stick substrate transfer unit (460) can transfer the stick substrate (94) from the stick substrate placement position (LP) to the stick substrate segmentation unit (360).

[0356] The stick substrate transfer unit (460) is equipped with a plurality of picking units (461) that each pick the stick substrate (94) manufactured in the stick substrate manufacturing unit (30), so that a plurality of stick substrates (94) can be transferred simultaneously to the plurality of stick substrate segmenting units (360).

[0357] Additionally, the stick substrate segmentation unit (360) may be provided in multiple units to segment each of the plurality of stick substrates (94). In one embodiment, the stick substrate transfer unit (460) is positioned between a pair of stick substrate (94) transfer paths to pick a pair of stick substrates (94) together and transfer them to a pair of stick substrate segmentation units (360). The number of picking units (461) of the stick substrate transfer unit (460) and the number of stick substrate transfer units (460) may be determined by considering the number of stick substrate segmentation units (360).

[0358] FIG. 35 schematically illustrates the stick substrate segmentation section (360) of the unit substrate manufacturing section (40).

[0359] The stick substrate segmentation unit (360) may include a stick substrate segmentation table (256), and the stick substrate segmentation table (256) may include a stick substrate first segmentation table (256a) corresponding to the aforementioned first table (201) and a stick substrate second segmentation table (256b) corresponding to the aforementioned second table (202). The stick substrate transfer unit (460) may transfer the stick substrate (94) such that a part of the stick substrate (94) is positioned on the stick substrate first segmentation table (256a) and the remainder of the stick substrate (94) is positioned on the stick substrate second segmentation table (256b).

[0360] The stick substrate segmentation part (360) may include a stick substrate fixing part (315), and the stick substrate fixing part (315) may include a stick substrate first fixing part (315a) that fixes the said part of the stick substrate (94) to a stick substrate first segmentation table (256a) and a stick substrate second fixing part (315b) that fixes the said remainder of the stick substrate (94) to a stick substrate second segmentation table (256b).

[0361] The second segment table (256b) of the stick substrate can segment the stick substrate (94) by forming a rotational displacement relative to the first segment table (256a) of the stick substrate. The remainder of the stick substrate (94) located on the second segment table (256b) of the stick substrate can correspond to the unit substrate (95).

[0362] A stick substrate (94) may include a plurality of element parts (97) forming a single row, and a unit substrate (95) may include any one of the plurality of element parts (97) included in the stick substrate (94). One element part (97) of the stick substrate (94) may be placed on the second segment table (256b) of the stick substrate, and the remainder of the stick substrate (94) having the one element part (97) may be segmented to form the unit substrate (95).

[0363] In one embodiment, the stick substrate segmentation unit (360) may be provided in multiple numbers, and each of the multiple stick substrate segmentation units (360) may segment the stick substrate (94) to manufacture the unit substrate (95). That is, in one embodiment, the unit substrate manufacturing unit (40) may manufacture multiple elements simultaneously.

[0364] FIG. 36 illustrates the unit substrate delivery unit (170) of the unit substrate manufacturing unit (40).

[0365] The unit substrate transfer unit (170) can pick and transport the unit substrate (95) manufactured in the stick substrate segmentation unit (360). The unit substrate (95) can be transported to a storage unit for the unit substrate (95) by the unit substrate transfer unit (170).

[0366] The unit substrate transfer unit (170) may include a plurality of picking units (171) for picking unit substrates (95). Accordingly, a plurality of unit substrates (95) manufactured through a plurality of stick substrate segmenting units (360) may be transported together by the unit substrate transfer unit (170) including the plurality of picking units (171).

[0367] Although the present disclosure has been illustrated and described in relation to specific embodiments, it will be obvious to those skilled in the art that the present disclosure may be modified and changed in various ways without departing from the technical spirit of the present disclosure as provided by the following claims. Explanation of the symbols

[0368] 1 : Substrate processing device 10 : First parent substrate manufacturing unit 20: 2nd Motherboard Manufacturing Department 30: Stick Board Manufacturing Department 40: Unit Board Manufacturing Department 70: Dummy Collection Department 90 : Substrate 91 : First circular substrate 92: Second circular substrate 93: Mother substrate 94 : Stick board 95 : Unit board 97 : Component part 98 : Contactable area 99 : Dummy area 100 : Transfer section 140: Second circular substrate transfer unit 150: Mother substrate transfer unit 160: Stick board transfer unit 170: Unit board transfer unit 200 : Table 201 : Table 1 202 : Table 2 210 : Table Module 211 : 1st Table Module 212 : 2nd Table Module 213 : Hinge axis 214 : Repulsion force providing part 215 : Rotational force providing part 217 : Side protrusion 220 : Receiving groove 225 : Gas injection part 230 : Moving table 231 : 1st circular substrate moving table 232 : Second circular board moving table 233 : Mother board moving table 234 : Stick board placement table 250 : Segmentation table 250a : First segment table 250b : Second segment table 251 : 1st circular substrate segmentation table 252 : 2nd circular substrate segmentation table 254 : 1st mosquito plate segmentation table 255 : 2nd mosquito plate segmentation table 256 : Stick substrate segmentation table 300 : Segmentation part 310: Fixing part 311: First circular substrate fixing part 312: Second circular substrate fixing part 313: First parent substrate fixing part 314: Second base plate fixing part 315: Stick base plate fixing part 320 : Support part 330 : First circular substrate segment part 340: Second circular substrate segment 350: Mother substrate segment 360 : Stick substrate segmentation section 400 : Transfer section 430: 1st circular substrate transfer unit 440: 2nd circular substrate transfer unit 450: Motherboard transfer unit 460: Stick board transfer unit 490 : Position guide 500 : Control unit

Claims

Claim 1 A substrate processing device comprising: a first mother substrate manufacturing unit configured to manufacture a second mother substrate by segmenting a first circular substrate; a second mother substrate manufacturing unit configured to manufacture a mother substrate in which a plurality of element parts are arranged to form a plurality of rows by segmenting the second circular substrate; a stick substrate manufacturing unit configured to manufacture a stick substrate including any one of the plurality of rows by segmenting the mother substrate; and a unit substrate manufacturing unit configured to receive the stick substrate from the stick substrate manufacturing unit and to manufacture a plurality of unit substrates each including a single element part by segmenting a plurality of stick substrates simultaneously; wherein the first mother substrate manufacturing unit comprises: a first circular substrate moving table configured to allow the first circular substrate to be placed and moved; and a first circular substrate segmenting unit configured to segment the first circular substrate provided through the movement of the first circular substrate moving table. Claim 2 A substrate processing device configured such that, in claim 1, the stick substrate manufacturing unit removes a dummy area from the edge of the mother substrate to manufacture a dummy-removed mother substrate, and segments the dummy-removed mother substrate to manufacture the stick substrate. Claim 3 A substrate processing apparatus according to claim 1, wherein the stick substrate manufacturing unit comprises: a substrate moving table on which the substrate is placed and movable; and a substrate segmenting unit on which the substrate provided through the substrate moving table is segmented. Claim 4 In paragraph 3, the substrate processing apparatus comprises: a first substrate segmenting unit configured to manufacture a dummy removal type substrate by segmenting a dummy area at the edge of the substrate of the substrate moving table; and a second substrate segmenting unit configured to manufacture the stick substrate by receiving and segmenting the dummy removal type substrate manufactured in the first substrate segmenting unit. Claim 5 In claim 4, the substrate moving table rotates such that each of the plurality of sides of the substrate faces the first substrate segmentation section around a rotation axis extended in a direction penetrating the substrate, and the first substrate segmentation section segments a dummy area on one side of the substrate of the substrate moving table facing the first substrate segmentation section. Claim 6 In claim 4, the first mosquito plate segmentation unit comprises: a first mosquito plate segmentation table in which the dummy area of ​​the mosquito plate is arranged through the movement of the mosquito plate moving table; and a first mosquito plate fixing unit for fixing the mosquito plate to the mosquito plate moving table and the first mosquito plate segmentation table; and the first mosquito plate segmentation table forms a rotational displacement relative to the mosquito plate moving table to segment the dummy area, thereby forming a substrate processing device. Claim 7 In paragraph 4, the substrate processing device wherein the substrate moving table moves from the first substrate segment to the second substrate segment and provides the dummy removal type substrate to the second substrate segment. Claim 8 A substrate processing device according to claim 7, wherein the above-mentioned substrate moving table includes a receiving groove that is recessed on the upper surface facing the substrate and extends along the thermal direction of the plurality of element parts, and the above-mentioned substrate moving table is rotated so that the extension direction of the receiving groove faces the second substrate segment part and moves to the second substrate segment part. Claim 9 In claim 4, the second substrate segmentation unit comprises: a substrate transfer unit that picks and transfers the dummy-removing type substrate of the substrate transfer table; a second substrate first segmentation table on which a portion of the dummy-removing type substrate transferred through the substrate transfer unit is placed; a second substrate second segmentation table on which the remainder of the dummy-removing type substrate transferred through the substrate transfer unit is placed; and a second substrate fixing unit that fixes the dummy-removing type substrate to the second substrate first segmentation table and the second substrate second segmentation table; wherein the second substrate second segmentation table forms a rotational displacement with respect to the second substrate first segmentation table to segment the dummy-removing type substrate, thereby manufacturing the stick substrate. Claim 10 A substrate processing apparatus according to claim 1, wherein the unit substrate manufacturing unit comprises: a plurality of stick substrate segmenting units that segment the stick substrate to manufacture the unit substrate; and a stick substrate transfer unit that is equipped with a plurality of picking units that each pick the stick substrate manufactured in the stick substrate manufacturing unit and transfers the plurality of stick substrates simultaneously to the plurality of stick substrate segmenting units. Claim 11 delete Claim 12 delete Claim 13 A substrate processing device configured in accordance with claim 1, wherein the first circular substrate segmenting part segments and removes a dummy region from the edge of the first circular substrate, and segments the dummy-removed first circular substrate from which the dummy region has been removed to manufacture the second circular substrate. Claim 14 A substrate processing device according to claim 1, wherein the first circular substrate moving table rotates such that each of the plurality of sides of the first circular substrate faces the first circular substrate segmentation section around a rotation axis extended in a direction penetrating the first circular substrate, and the first circular substrate segmentation section segments a dummy area on one side of the first circular substrate of the first circular substrate moving table facing the first circular substrate segmentation section. Claim 15 In claim 1, the first circular substrate segmentation unit comprises: a first circular substrate segmentation table in which a dummy area of ​​the first circular substrate edge is arranged through the movement of the first circular substrate moving table; and a first circular substrate fixing unit for fixing the first circular substrate to the first circular substrate moving table and the first circular substrate segmentation table; and the first circular substrate segmentation table forms a rotational displacement relative to the first circular substrate moving table to segment the dummy area, thereby forming a substrate processing device. Claim 16 A substrate processing apparatus according to claim 15, further comprising: a first circular substrate transfer unit that transfers a dummy-removed first circular substrate from the first circular substrate transfer table, wherein a portion of the dummy-removed first circular substrate is placed on the first circular substrate transfer table and the remainder of the dummy-removed first circular substrate is placed on the first circular substrate segmentation table; wherein the first circular substrate segmentation table forms a rotational displacement relative to the first circular substrate transfer table to segment the dummy-removed first circular substrate, thereby manufacturing the second circular substrate. Claim 17 A substrate processing apparatus according to claim 1, wherein the second substrate manufacturing unit comprises: a second circular substrate delivery unit for picking and delivering the second circular substrate manufactured in the first substrate manufacturing unit; a second circular substrate moving table on which the second circular substrate delivered through the second circular substrate delivery unit is arranged and movable; and a second circular substrate segmenting unit on which the second circular substrate provided through the movement of the second circular substrate moving table is segmented to manufacture the substrate. Claim 18 A substrate processing device according to claim 17, wherein the second circular substrate moving table is arranged to move along a first direction, moves to the second circular substrate delivery unit to receive the second circular substrate in a second direction crossing the first direction, moves to the second circular substrate segmenting unit to provide the second circular substrate in the first direction to the second circular substrate segmenting unit, receives the mother substrate from the second circular substrate segmenting unit, and moves to the stick substrate manufacturing unit to provide the mother substrate to the stick substrate manufacturing unit. Claim 19 In claim 18, the second circular substrate moving table comprises a plurality of receiving grooves that are recessed on the upper surface where the second circular substrate is placed and extend along the second direction, and the second circular substrate transfer unit transfers the second circular substrate to the second circular substrate moving table along the second direction, forming a substrate processing device. Claim 20 In claim 19, the second substrate manufacturing unit further comprises side protrusions that are positioned on both sides of the second circular substrate moving table with respect to the first direction and selectively protrude with respect to the upper surface of the second circular substrate moving table; wherein the side protrusions do not protrude during the process in which the second circular substrate is transferred from the second circular substrate transfer unit to the second circular substrate moving table, but protrude during the process in which the second circular substrate is transferred from the second circular substrate moving table to the second circular substrate segmenting unit, thereby raising the plurality of elements of the second circular substrate upwards to the upper portion of the plurality of receiving grooves.

Images