Fluid handling system, method and lithography device

Abstract

The present invention relates to a fluid handling system. The fluid handling system comprises a liquid confining structure, wherein the liquid confining structure is configured to confine an immersion liquid in the space between at least a portion of the liquid confining structure and the surface of a substrate. The fluid handling system also comprises a mechanism configured to vibrate a vibrating component in contact with the immersion liquid.

Description

Technology Field

[0001] Cross-reference regarding related applications

[0002] This application claims priority to EP application 19209814.3, filed on November 18, 2019, the contents of which are incorporated herein by reference in their entirety.

[0003] The present invention relates to a fluid handling system and a method for manufacturing a device. The present invention also relates to a lithography device. Background Technology

[0004] A lithography device is a machine configured to apply a desired pattern onto a substrate. A lithography device can be used, for example, in the manufacture of an integrated circuit (IC). A lithography device can project a pattern (often referred to as a "design layout" or "design") of, for example, a patterning device (e.g., a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer). A known lithography device includes a so-called stepper, which irradiates each target portion by exposing the entire pattern onto the target portion at once, and a so-called scanner, which irradiates each target portion by scanning the pattern through a radiation beam in a given direction ("scanning" direction) while simultaneously scanning the substrate in a direction parallel to or anti-parallel to this direction.

[0005] As semiconductor manufacturing processes continue to advance, the dimensions of circuit elements are continuously decreasing in accordance with the trend commonly referred to as "Moore's Law," while the quantity of functional elements, such as transistors, per device has steadily increased over the decades. To keep up with Moore's Law, the semiconductor industry is pursuing technologies that enable the creation of increasingly smaller features. To project patterns onto a substrate, lithography devices can utilize electromagnetic radiation. The wavelength of this radiation determines the minimum size of the features patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0006] During exposure, further improvement in the resolution of smaller features can be achieved by providing an immersion fluid with a relatively high refractive index, such as water, onto the substrate. Since exposure radiation will have a shorter wavelength in a fluid than in a gas, the effect of the immersion fluid is to enable imaging of smaller features. The effect of the immersion fluid can also be considered to increase the effective numerical aperture (NA) of the system and also increase the depth of focus.

[0007] The immersion fluid may be confined to a localized area between the projection system of the lithography device and the substrate by a fluid handling structure. The use of such an immersion fluid can lead to the presence of droplets on the surface of the substrate. These droplets can be problematic because when they strike the meniscus of the immersion fluid, it can lead to the formation of bubbles due to trapped gases within the immersion fluid. Bubbles within the immersion fluid can lead to printed defects on the substrate. The likelihood of such bubbles being introduced can be reduced by decreasing the relative speed of the substrate, but this limits the throughput of the lithography device. The problem to be solved

[0008] The object of the present invention is to provide a fluid handling system and method in which measures are taken to increase throughput and / or reduce defects on a substrate. means of solving the problem

[0009] According to the present invention, a fluid handling system is provided, the fluid handling system comprising: a liquid limiting structure configured to limit an immersion liquid in the space between at least a portion of the liquid limiting structure and the surface of a substrate and having an opening—the opening being formed for the passage of a radiation beam to irradiate the surface of the substrate by passing it through the immersion liquid—; and a mechanism configured to vibrate a vibrating component in contact with the immersion liquid in use at a frequency of about 30 Hz or more and less than 9,500 Hz.

[0010] According to the present invention, a method for manufacturing a device as disclosed in the present specification is also provided.

[0011] According to the present invention, a lithography apparatus as disclosed in the present specification is also provided.

[0012] Further embodiments, features, and advantages of the present invention, as well as the structure and operation of various embodiments, and the features and advantages of the present invention, are described in detail below with reference to the accompanying drawings. Brief explanation of the drawing

[0013] Embodiments of the present invention will now be described merely by way of example with reference to the accompanying schematic drawings, where corresponding reference numerals in the drawings indicate corresponding parts. Figure 1 illustrates a schematic overview of a lithography apparatus. FIGS. 2a, FIGS. 2b, and FIGS. 2c each illustrate two different versions of a fluid handling system in cross-section, having different features shown on the left and right sides, which can be extended around a complete circumference. FIGS. 3a, FIGS. 3b, FIGS. 3c, and FIGS. 3d each illustrate, in cross-section, a variation of the system of the first embodiment of the present invention having two different versions of a fluid handling system having different features shown on the left and right sides that can be extended around a complete circumference. FIG. 4 illustrates a cross-sectional view of a variation of a system of the first embodiment of the present invention having two different versions of a fluid handling system having different features shown on the left and right sides that can be extended around a complete circumference. FIGS. 5A and FIGS. 5B illustrate variations of the system of the first embodiment. FIG. 6 illustrates a system of a second embodiment of the present invention in cross-section having two different versions of a fluid handling system having different features shown on the left and right sides that can be extended around a complete circumference. FIG. 7 illustrates a system of a third embodiment of the present invention in cross-section having two different versions of a fluid handling system having different features shown on the left and right sides that can be extended around a complete circumference. The features shown in the drawings are not necessarily scaled, and the depicted sizes and / or arrangements are not limited. It will be understood that the drawings include optional features that may not be essential to the invention. Furthermore, not all features of the device are depicted in each of the drawings, and the drawings may show only some of the components related to describing a particular feature. Specific details for implementing the invention

[0014] In this document, the terms “radiation” and “beam” are used to include all types of electromagnetic radiation, including ultraviolet radiation (e.g., having wavelengths of 365, 248, 193, 157, or 126 nm).

[0015] The terms “reticle,” “mask,” or “patterning device” as used herein may be broadly interpreted to refer to a comprehensive patterning device that can be used to impart a patterned cross-section corresponding to a pattern to be formed on a target portion of a substrate to an incident radiation beam. The term “light valve” may also be used herein. In addition to typical masks (transmissive or reflective, binary, phase-shifting, hybrid, etc.), other examples of such patterning devices include programmable mirror arrays and programmable LCD arrays.

[0016] Figure 1 schematically illustrates a lithography apparatus. The lithography device comprises an illumination system (also referred to as an illuminator) (IL) configured to adjust a radiation beam (B) (e.g., UV radiation or DUV radiation), a mask support (e.g., a mask table) (MT) connected to a first positioner (PM) configured to support a patterning device (e.g., a mask) (MA) and to accurately position the patterning device (MA) according to specific parameters, a substrate support (e.g., a wafer table) (WT) connected to a second positioner (PW) configured to hold a substrate (e.g., a resist-coated wafer) (W) and to accurately position the substrate support (WT) according to specific parameters, and a projection system (e.g., a refractive projection lens system) (PS) configured to project a pattern imparted to the radiation beam (B) by the patterning device (MA) onto a target portion (C) of the substrate (W) (e.g., including one or more dies).

[0017] When in operation, the illumination system (IL) receives a radiation beam (B) from a radiation source (SO), for example, through a beam delivery system (BD). The illumination system (IL) may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components, or any combination thereof, to direct, shape, and / or control the radiation. The illuminator (IL) may also be used to adjust the radiation beam (B) so that it has a desired spatial and angular intensity distribution in its cross-section in the plane of the patterning device (MA).

[0018] As used herein, the term "projection system" (PS) should be broadly interpreted to include various types of projection systems, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic, and / or electrostatic optical systems, and / or any combination thereof, suitable for the exposure radiation being used and / or other factors such as the use of immersion liquids or vacuum. Any use of the term "projection lens" in this specification may be considered synonymous with the more general term "projection system" (PS).

[0019] The lithography apparatus may be of a type in which at least a portion of the substrate (W) can be covered with a liquid having a relatively high refractive index, such as water, to fill the immersion space (11) between the projection system (PS) and the substrate (W)—this is also referred to as immersion lithography. More information regarding immersion techniques is provided in U.S. Patent No. 6,952,253, which is incorporated herein by reference.

[0020] The lithography device may be of a type having two or more substrate supports (WT) (also called a “double stage”). In such a “multi-stage” machine, the substrate supports (WT) may be used simultaneously, and / or a preparation step for subsequent exposure of the substrate (W) may be performed on a substrate (W) located on one of the substrate supports (WT), while another substrate (W) on another substrate support (WT) is used to expose a pattern on the other substrate (W).

[0021] In addition to the substrate support (WT), the lithography device may include a measurement stage (not shown in the drawing). The measurement stage is arranged to hold a sensor and / or a cleaning device. The sensor may be arranged to measure the characteristics of the projection system (PS) or the characteristics of the radiation beam (B). The measurement stage may hold multiple sensors. The cleaning device may be arranged to clean a part of the lithography device, for example, a part of the projection system (PS) or a part of the system providing the immersion liquid. When the substrate support (WT) is separated from the projection system (PS), the measurement stage may move under the projection system (PS).

[0022] When operated, a radiation beam (B) is incident on a patterning device, such as a mask (MA), which is held on a mask support (MT), and is patterned by a pattern (design layout) present on the patterning device (MA). The radiation beam (B) crossing the mask (MA) passes through a projection system (PS), and the projection system focuses the beam onto a target portion (C) of a substrate (W). With the help of a second positioner (PW) and a position measurement system (IF), the substrate support (WT) can be moved precisely, for example, to position different target portions (C) within the path of the radiation beam (B) in a focused and aligned position. Likewise, a first positioner (PM) and possibly another position sensor (not clearly shown in FIG. 1) can be used to accurately position the patterning device (MA) with respect to the path of the radiation beam (B). The patterning device (MA) and the substrate (W) can be aligned using mask alignment marks (M1, M2) and substrate alignment marks (P1, P2). As illustrated, the substrate alignment marks (P1, P2) occupy dedicated target portions, but they can be located in the space between target portions. When the substrate alignment marks (P1, P2) are located between target portions (C), they are known as scribe-lane alignment marks.

[0023] To clarify the present invention, a Cartesian coordinate system is used. The Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of the three axes is orthogonal to the other two axes. Rotation around the x-axis is referred to as an Rx-rotation. Rotation around the y-axis is referred to as a Ry-rotation. Rotation around the z-axis is referred to as a Rz-rotation. The x-axis and the y-axis define the horizontal plane, whereas the z-axis is the vertical direction. The Cartesian coordinate system does not limit the present invention and is used merely for clarification. Instead, another coordinate system, such as a cylindrical coordinate system, may be used to clarify the present invention. The orientation of the Cartesian coordinate system may differ, for example, such that the z-axis has a component along the horizontal plane.

[0024] Immersion technology has been introduced into lithography systems to enable improved resolution of smaller features. In an immersion lithography device, a liquid layer of immersion liquid having a relatively high refractive index is interposed in an immersion space (11) between the device's projection system (PS) (through which a patterned beam is projected toward the substrate (W)) and the substrate (W). The immersion liquid covers at least a portion of the substrate (W) under the final element of the projection system (PS). Thus, at least a portion of the substrate (W) undergoing exposure is immersed in the immersion liquid.

[0025] In commercial immersion lithography, the immersion liquid is water. Typically, the water is high-purity distilled water, such as ultrapure water (UPW), which is commonly used in semiconductor manufacturing plants. In an immersion system, the UPW is often purified and may undergo additional processing steps before being supplied to the immersion space (11) as the immersion liquid. In addition to water, other liquids with a high refractive index, such as hydrocarbons like fluorohydrocarbons; and / or aqueous solutions may be used as the immersion liquid. Additionally, other fluids other than liquids are being envisioned for use in immersion lithography.

[0026] In this specification, reference to local immersion is made in this description, in which, during use, the immersion liquid is confined to an immersion space (11) between the final element (100) and the surface facing the final element (100). The opposing surface is the surface of the substrate (W) or the surface of the support stage (or substrate support (WT)) that is coplanar with the surface of the substrate (W). (Note that unless otherwise clearly stated, reference to the surface of the substrate (W) in the following context also additionally or alternatively refers to the surface of the substrate support (WT); and vice versa.) A fluid handling structure (12) existing between the projection system (PS) and the substrate support (WT) is used to confine the immersion liquid to the immersion space (11). The immersion space (11) filled with the immersion liquid is smaller than the top surface of the substrate (W) in plane, and the immersion space (11) is kept substantially fixed relative to the projection system (PS), while the substrate (W) and the substrate support (WT) move from below.

[0027] Other immersion systems, such as unrestricted immersion systems (so-called "all-wet" immersion systems) and bath immersion systems, are being envisioned. In an unrestricted immersion system, the immersion liquid covers more than the surface below the final element (100). The liquid outside the immersion space (11) exists as a thin liquid film. The liquid can cover the entire surface of the substrate (W) or even the substrate (W) and the substrate support (WT) that is coplanar with the substrate (W). In a bath-type system, the substrate (W) is completely immersed in a bath of immersion liquid.

[0028] The fluid handling structure (12) is a structure that supplies immersion liquid to the immersion space (11), removes immersion liquid from the immersion space (11), and thereby confines the immersion liquid to the immersion space (11). It includes a feature that is part of a fluid supply system. An array disclosed in PCT patent application publication WO99 / 49504 is an early fluid handling structure comprising a pipe that supplies or retrieves immersion liquid from the immersion space (11) and operates according to the relative movement of the stage under the projection system (PS). In a more recent design, to partially define the immersion space (11), the fluid handling structure extends along at least a portion of the boundary of the immersion space (11) between the final element (100) of the projection system (PS) and the substrate support (WT) or substrate (W).

[0029] The fluid handling structure (12) may select different functions. Each function may be obtained from a corresponding feature that enables the fluid handling structure (12) to achieve that function. The fluid handling structure (12) may be referred to by a plurality of different terms, each of which refers to a function such as a barrier member, a seal member, a fluid supply system, a fluid removal system, a liquid restriction structure, etc.

[0030] As a barrier member, the fluid handling structure (12) is a barrier to the flow of immersion liquid from the immersion space (11). As a liquid confinement structure, the structure confines the immersion liquid to the immersion space (11). As a seal member, the sealing feature of the fluid handling structure forms a seal to confine the immersion liquid to the immersion space (11). The sealing feature may include additional gas flow from an opening in the surface of the seal member, such as a gas knife.

[0031] In an embodiment, the fluid handling structure (12) can supply an immersion fluid and thus can be a fluid supply system.

[0032] In an embodiment, the fluid handling structure (12) can restrict the immersion fluid at least partially, and thus can be a fluid restriction system.

[0033] In an embodiment, the fluid handling structure (12) can provide a barrier to the immersed fluid and thereby can be a barrier member such as a fluid limiting structure.

[0034] In an embodiment, the fluid handling structure (12) may generate or utilize a flow of gas to help control, for example, the flow and / or position of the immersion fluid.

[0035] The flow of gas can form a seal to restrict the immersion fluid, and thus the fluid handling structure (12) can be referred to as a seal member; and such a seal member can be a fluid restriction structure.

[0036] In the embodiment, the immersion liquid is used as the immersion fluid. In that case, the fluid handling structure (12) may be a liquid handling system. Referring to the description mentioned above, the reference to the feature defined for the fluid in this paragraph may be understood to include the feature defined for the liquid.

[0037] A lithography device has a projection system (PS). During the exposure of a substrate (W), the projection system (PS) projects a beam of patterned radiation onto the substrate (W). To reach the substrate (W), the path of the radiation beam (B) passes from the projection system (PS) through an immersion liquid limited by a fluid handling structure (12) between the projection system (PS) and the substrate (W). The projection system (PS) has a lens element, which is the final element in the beam's path, and this lens element is in contact with the immersion liquid. This lens element in contact with the immersion liquid may be referred to as the "final lens element" or "final element." The final element (100) is at least partially surrounded by the fluid handling structure (12). The fluid handling structure (12) may limit the immersion liquid below the final element (100) and above the opposing surface.

[0038] FIGS. 2A, FIGS. 2B, and FIGS. 2C illustrate different features that may exist in variations of the fluid handling structure (12). Unless otherwise described, this design may share some of the same features as FIGS. 2A, FIGS. 2B, and FIGS. 2C. The features described herein may be selected individually or in combination as shown or as needed. The drawings illustrate different versions of a fluid handling system having different features shown on the left and right sides, and these features may extend around a full circumference. Thus, for example, a fluid handling system may have the same features extending around a full circumference. For example, a fluid handling system may have only the features on the left side of FIG. 2A, or the right side of FIG. 2A, or the left side of FIG. 2B, or the right side of FIG. 2B, or the left side of FIG. 2C, or the right side of FIG. 2C. Alternatively, the fluid handling system may have any combination of features from these drawings at different locations around the circumference. The fluid handling system may include a fluid handling structure (12) as described in the variation below.

[0039] FIG. 2a shows a fluid handling structure (12) around the bottom surface of the final element (100). The final element (100) has an inverted truncated cone shape. The truncated cone shape has a flat bottom surface and a conical surface. The truncated cone shape protrudes from the flat surface and has a bottom flat surface. The bottom flat surface is the optically active part of the bottom surface of the final element (100) through which a radiation beam (B) can pass. The final element (100) may have a coating part (30). The fluid handling structure (12) surrounds at least a portion of the truncated cone shape. The fluid handling structure (12) has an inner surface facing the conical surface of the truncated cone shape. The inner surface and the conical surface may have complementary shapes. The top surface of the fluid handling structure (12) may be substantially flat. The fluid handling structure (12) may fit into the truncated cone shape of the final element (100). The lowest surface of the fluid handling structure (12) may be substantially flat, and in use, the lowest surface may be parallel to the opposing surface of the substrate support (WT) and / or the substrate (W). Thus, the lowest surface of the fluid handling structure (12) may be referred to as the surface facing the surface of the substrate (W). The distance between the lowest surface and the opposing surface may be within the range of 30 to 500 micrometers, preferably within the range of 80 to 200 micrometers.

[0040] The fluid handling structure (12) extends closer to the opposing surfaces of the substrate (W) and the substrate support (WT) than to the final element (100). Thus, an immersion space (11) is defined between the inner surface of the fluid handling structure (12), the flat surface of the truncated conical portion, and the opposing surface. During use, the immersion space (11) is filled with an immersion liquid. The immersion liquid fills at least a portion of the buffer space between the complementary surfaces of the final element (100) and the fluid handling structure (12), and at least a portion of the space between the complementary inner surface and the conical surface in the embodiment.

[0041] Immersion liquid is supplied to the immersion space (11) through an opening formed on the surface of the fluid handling structure (12). Immersion liquid may be supplied through a supply opening (20) on the inner surface of the fluid handling structure (12). Alternatively or additionally, immersion liquid is supplied from a lower supply opening (23) formed on the lowest surface of the fluid handling structure (12). The lower supply opening (23) may surround the path of the radiation beam (B) and may be formed as a series of openings in an array or a single slit. Immersion liquid is supplied to fill the immersion space (11) so that the flow through the immersion space (11) below the projection system (PS) is laminar. The supply of immersion liquid from the lower supply opening (23) additionally prevents the inflow of bubbles into the immersion space (11). This supply of immersion liquid can serve as a liquid seal.

[0042] The immersion liquid can be recovered from a recovery opening (21) formed on the inner surface. Recovery of the immersion liquid through the recovery opening (21) may be due to the application of under pressure; recovery through the recovery opening (21) may be a result of the velocity of the immersion liquid flow through the immersion space (11); or recovery may be a result of both. When viewed in planar view, the recovery opening (21) may be located on the opposite side of the supply opening (20). Additionally or alternatively, the immersion liquid may be recovered through an overflow recovery (24) located on the uppermost surface of the fluid handling structure (12). The supply opening (20) and the recovery opening (21) may change their function (i.e., the direction of the liquid flow is reversed). This allows the direction of the flow to change according to the relative motion between the fluid handling structure (12) and the substrate (W).

[0043] Additionally or alternatively, the immersion liquid may be recovered from beneath the fluid handling structure (12) through a recovery opening (25) formed on the lowest surface of the fluid handling structure. The recovery opening (25) may serve to maintain the meniscus (33) of the immersion liquid in the fluid handling structure (12). The meniscus (33) is formed between the fluid handling structure (12) and the opposing surface and also serves as a boundary between the liquid space and the gaseous external environment. The recovery opening (25) may be a porous plate capable of recovering the immersion liquid as a single-phase flow. The recovery opening on the lowest surface may be a series of pinning openings (32) through which the immersion liquid is recovered. The pinning openings (32) may recover the immersion liquid as a two-phase flow.

[0044] Optionally, the gas knife opening (26) is radially outward with respect to the inner surface of the fluid handling structure (12). Gas can be supplied at a high speed through the gas knife opening (26) to help confine the immersion liquid in the immersion space (11). The supplied gas can be humidified, which may substantially contain carbon dioxide. To recover the gas supplied through the gas knife opening (26), a gas recovery opening (28) is radially outward from the gas knife opening (26).

[0045] An additional opening, for example, an opening open to the atmosphere, a gas source, or a vacuum, may be present on the lowest surface of the fluid handling structure (12), that is, on the surface of the fluid handling structure (12) facing the substrate (W). An example of such an optional additional opening (50) is shown by a dashed line on the right side of FIG. 2a. As shown, the additional opening (50) may be a supply or extraction member, which is indicated by a double-sided arrow. For example, if configured as a supply member, the additional opening (50) may be connected to a liquid supply member or a gas supply member, as in any of the supply members. Alternatively, if configured as an extraction member, the additional opening (50) may be used to extract fluid and may also be connected, for example, to the atmosphere, a gas source, or a vacuum. For example, at least one additional opening (50) may exist between the gas knife opening (26) and the gas recovery opening (28), and / or between the pinning opening (32) and the gas knife opening (26).

[0046] Two different versions of the fluid handling structure (12) on the left and right of FIG. 2a pin the meniscus (33). The version of the fluid handling structure (12) on the right of FIG. 2a can pin the meniscus (33) in a substantially fixed position relative to the final element (100) due to the fixed position of the pinning opening (32). The version of the fluid handling structure (12) on the left of FIG. 2a can pin the meniscus (33) below the retrieval opening (25), so that the meniscus (33) can move along the length and / or width of the retrieval opening (25). In order to direct the radiation beam (B) under exposure to the full side of the substrate (W), the substrate support (WT) supporting the substrate (W) is moved relative to the projection system (PS). To maximize the output of the substrate (W) exposed by the lithography device, the substrate support (WT) (and thus the substrate (W)) is moved as quickly as possible. However, there is a critical relative speed (often referred to as the critical scan speed), and above this speed, the meniscus (33) between the fluid handling structure (12) and the substrate (W) becomes unstable. An unstable meniscus (33) is at greater risk of losing the immersion liquid, for example, in the form of one or more droplets. Furthermore, especially when a limited immersion liquid crosses the edge of the substrate (W), the unstable meniscus (33) is at greater risk of containing gas bubbles within the immersion liquid.

[0047] Droplets present on the surface of the substrate (W) can apply a thermal load and may also be a cause of defects. Droplets can evaporate and leave a drying stain, transport contaminants such as particles, collide with a larger body of immersion liquid and introduce bubbles of gas into the larger body of immersion liquid, and evaporate and apply a thermal load to the surface where the droplet is located. If the surface is associated with the positioning of components of the lithography device relative to the substrate (W) being imaged, this thermal load may be a cause of distortion and / or a source of positioning errors. Therefore, the formation of droplets on the surface is undesirable. To prevent the formation of such droplets, the speed of the substrate support (WT) is thus limited to a critical scan rate at which the meniscus (33) is stably maintained. This limits the throughput of the lithography device.

[0048] The left side of the fluid handling system of FIG. 2a may include a spring (60). The spring (60) may be an adjustable passive spring configured to apply a biasing force to the fluid handling structure (12) in the direction of the substrate (W). Thus, the spring (60) may be used to control the height of the fluid handling structure (12) above the substrate (W). Such an adjustable passive spring is described in its entirety in US 7,199,874, incorporated herein by reference. For example, other bias devices using electromagnetic force may also be suitable. Although the spring (60) is shown on the left side of FIG. 2a, it is optional and does not need to be included in other features of the left side of FIG. 2a. The spring (60) is not visible in any of the other drawings, but may be included in other variations of the fluid handling system described in relation to FIG. 2a, FIG. 2b, FIG. 2c, FIG. 3a, FIG. 3b, FIG. 3c, FIG. 3d, FIG. 4, FIG. 5a, FIG. 5b, FIG. 6 and / or FIG. 7.

[0049] FIG. 2b shows two different versions of the fluid handling structure (12) on its left and right sides, which allow for the movement of the meniscus (33) relative to the final element (100). The meniscus (33) can move in the direction of the moving substrate (W). This reduces the relative speed between the meniscus (33) and the moving substrate (W), which can result in improved stability of the meniscus (33) and a reduced risk of breakage. To allow for faster movement of the substrate (W) under the projection system (PS), the speed of the substrate (W) where the meniscus (33) breaks is increased. Throughput is therefore increased.

[0050] The features shown in FIG. 2b that are common to FIG. 2a share the same reference numerals. The fluid handling structure (12) has an inner surface complementary to a truncated conical surface. The lowest surface of the fluid handling structure (12) is closer to the opposite surface than the lowest flat surface of the truncated conical shape.

[0051] The immersion liquid is supplied to the immersion space (11) through a supply opening (34) formed on the inner surface of the fluid handling structure (12). The supply opening (34) is positioned toward the lowest part of the inner surface, possibly below the lowest surface of a truncated cone shape. The supply opening (34) is positioned around the inner surface, spaced apart from the path of the radiation beam (B).

[0052] The immersion liquid is recovered from the immersion space (11) through a recovery opening (25) located on the lowest surface of the fluid handling structure (12). As the opposing surface moves down the fluid handling structure (12), the meniscus (33) may move over the surface of the recovery opening (25) in the same direction as the movement of the opposing surface. The recovery opening (25) may be formed of a porous member. The immersion liquid may be recovered in a single phase. The immersion liquid may be recovered as a two-phase flow. The two-phase flow is received in a chamber (35) within the fluid handling structure (12) where the flow is separated into liquid and gas. The liquid and gas are recovered from the chamber (35) through separate channels (36, 38).

[0053] The inner periphery (39) of the lowermost surface of the fluid handling structure (12) extends far from the inner surface into the immersion space (11) to form a plate (40). The inner periphery (39) forms a small hole that can be sized to match the shape and size of the radiation beam (B). The plate (40) can serve to isolate the immersion liquid on both sides thereof. The supplied immersion liquid flows inward through the inner hole toward the hole, and then flows radially outward from under the plate (40) toward the recovery opening (25).

[0054] The fluid handling structure (12) may consist of two parts: an inner part (12a) and an outer part (12b), as shown on the right side of FIG. 2b. The inner part (12a) and the outer part (12b) may move relative to each other in a plane parallel to the opposing surfaces. The inner part (12a) may have a supply opening (34) and an overflow recovery section (24). The outer part (12b) may have a plate (40) and a recovery opening (25). The inner part (12a) may have an intermediate recovery section (42) for recovering immersion liquid flowing between the inner part (12a) and the outer part (12b).

[0055] Accordingly, the two different versions of the fluid handling structure of FIG. 2b allow the meniscus (33) to move in the same direction as the substrate (W), enabling faster scan speeds and increased throughput of the lithography device. However, in the fluid handling structure (12) on the left side of FIG. 2b, the speed of movement of the meniscus (33) over the surface of the recovery opening (25) may be slow. The fluid handling structure (12) on the right side of FIG. 2b allows for faster movement of the meniscus (33) by moving the outer part (12b) relative to the inner part (12a) and the final element (100). However, it may be difficult to control the intermediate recovery part (42) to ensure that sufficient immersion liquid is provided between the inner part (12a) and the outer part (12b) to prevent contact between them.

[0056] FIG. 2c shows two different versions of the fluid handling structure (12) on its left and right sides, which can be used to secure the meniscus (33) of the immersion liquid to the fluid handling structure (12) as described above in relation to FIG. 2a and / or FIG. 2b. Features common to FIG. 2a and / or FIG. 2b shown in FIG. 2c share the same reference numerals.

[0057] The fluid handling structure (12) has an inner surface that complements the truncated cone-shaped conical surface. The lowest surface of the fluid handling structure (12) is closer to the opposite surface than the lowest flat surface of the truncated cone shape. Immersion liquid delivered through an opening formed on the surface of the fluid handling structure (12) is supplied to the immersion space (11). Immersion liquid can be supplied through a supply opening (34) located on the inner surface of the fluid structure (12). Alternatively or additionally, immersion liquid can be supplied through a supply opening (20) located on the inner surface of the fluid structure (12). Alternatively or additionally, immersion liquid is supplied through a lower supply opening (23). The immersion liquid can be recovered through an extraction member, for example, through a recovery opening (21) formed on the inner surface and / or overflow recovery section (24) and / or through one or more openings on the surface of the fluid handling structure (12) as described below.

[0058] Two different versions of the fluid handling structure (12) on the left and right of FIG. 2c secure the meniscus (33). The version of the fluid handling structure (12) on the right of FIG. 2c can secure the meniscus (33) in a substantially fixed position relative to the final element (100) due to the fixed position of the recovery opening (32a). The version of the fluid handling structure (12) on the left of FIG. 2c can secure the meniscus (33) below the recovery opening (25), so that the meniscus (33) can move along the length and / or width of the recovery opening (25).

[0059] As described above in relation to FIG. 2b, the inner periphery of the lowest surface of the fluid handling structure (12) may extend away from the inner surface and into the immersion space (11) to form a plate (40), as shown on the left. As described above, this may form a small hole and may also isolate the immersion liquid from both sides and / or allow the immersion liquid to flow inward toward the hole through the inner hole, and then flow radially outward toward the recovery opening (25) under the plate (40). This feature is shown on the left side of FIG. 2c, but is optional in combination with other features shown. Preferably, as shown on the left side, the immersion liquid is supplied into the immersion space (11) through a supply opening (34) formed on the inner surface of the fluid handling structure (12). The supply opening (34) is positioned toward the lowest part of the inner surface, possibly below the truncated cone-shaped lowest surface. Supply openings (34) are spaced apart from the path of the radiation beam (B) and located around the inner surface. Alternatively or additionally, the immersion liquid may be supplied through a supply opening (20) located on the inner surface of the fluid structure (12). Alternatively or additionally, the immersion liquid is supplied through a lower supply opening (23). While the supply opening (34) is the preferred liquid supply, any combination of the supply opening (34), the supply opening (20), and / or the lower supply opening (23) may be provided.

[0060] As shown on the left side of FIG. 2c, the fluid handling system may include a fluid handling structure (12) and an additional device (300) as described above. The fluid handling structure (12) may have an extraction member, e.g., a recovery opening (25), and a liquid supply opening, e.g., a lower supply opening (23). It will be understood that the fluid handling structure (12), in combination with the additional device (300), may include any configuration as disclosed in relation to the left side of FIG. 2a, the right side of FIG. 2a, the left side of FIG. 2b, the right side of FIG. 2b, or the right side of FIG. 2c (as described below).

[0061] The additional device (300) may otherwise be referred to as a droplet catcher. The additional device (300) is provided to reduce the generation of liquid on the surface of the substrate (W) after the fluid handling structure (12) moves over the surface. The additional device (300) may include a liquid supply member (301) and at least one extraction member (302). The at least one extraction member (302) may be formed in a shape that surrounds the at least one supply member (301) in a plane. The at least one liquid supply member (301) may be configured to provide additional liquid to the space (311) between at least a portion of the additional device (300) and the surface of the substrate (W). The additional device (300) may be configured to recover at least a portion of the liquid through the at least one extraction member (302). An additional device (300) can be used to combine any liquid remaining on the surface of the substrate (W) with the liquid in the space (311), and then the additional device (300) can be used to extract the liquid so that the amount of liquid remaining on the surface of the substrate (W) is reduced.

[0062] The additional device (300) is shown in FIG. 2c as a device separate from the fluid handling structure (12). The additional device (300) may be located adjacent to the fluid handling structure (12). Alternatively, the additional device (300) may be part of the fluid handling structure (12), i.e., integrated therewith (however, as shown in FIG. 3d, any array may be selected).

[0063] The third device (300) can be configured to provide liquid separated from the liquid provided by the fluid handling structure (12) to the space (311).

[0064] Additionally or alternatively, the fluid handling structure (12) may have components as shown on the right side of FIG. 2c. More specifically, the fluid handling structure (12) may include at least one liquid supply member, two extraction members (e.g., recovery openings (32a and 32b)), and two gas supply members (e.g., gas supply openings (27a and 27b)) formed on the surface of the fluid handling structure (12). The at least one liquid supply member may be the same as the lower supply opening (23) on the lowest surface of the fluid handling structure (12) described above, or the supply opening (20) or liquid supply opening (34) formed on the inner surface of the fluid handling structure (12) described in relation to the left side of FIG. 2b. The liquid supply member, extraction members, and gas supply members may be formed on the surface of the fluid handling structure (12). Specifically, these components can be formed on the surface of the fluid handling structure (12) facing the substrate (W), that is, on the lowest surface of the fluid handling structure (12).

[0065] At least one of the two extraction members may include a porous material (37) within it. The porous material (37) may be provided within an opening, for example, a recovery opening (32a), whereby the fluid handling structure (12) can extract fluid from below the fluid handling structure (12) through this recovery opening and also recover the immersion liquid as a single-phase flow. The other of the two extraction members, for example, the recovery opening (32b), can recover the immersion fluid as a dual-phase extractor.

[0066] Specifically, the fluid handling structure (12) may include a liquid supply member (e.g., a lower supply opening (23)), a first extraction member (e.g., a recovery opening (32a)) is radially outward of the liquid supply member, a first gas supply member (e.g., a gas supply opening (27a)) is radially outward of the first extraction member, a second extraction member (e.g., a recovery opening (32b)) is radially outward of the first gas supply member, and a second gas supply member (e.g., a gas supply opening (27ba)) is radially outward of the second extraction member. Similar to FIG. 2a, additional openings open to, for example, the atmosphere, a gas source, or a vacuum may be present on the lowest surface of the fluid handling structure (12) as previously described (in relation to the fluid handling structure (12)).

[0067] For example, at least one additional opening (not shown) may be provided on the lowest surface of the fluid handling structure (12). The additional opening is optional. The additional opening may be arranged between the first extraction member (e.g., recovery opening (32a)) and the first gas supply member (e.g., gas supply opening (27a)) as described in the arrangement above. Alternatively or additionally, the additional opening may be arranged between the second extraction member (e.g., recovery opening (32b)) and the second gas supply member (e.g., gas supply opening (27b)) as described in the arrangement above. The additional opening may be the same as the additional opening (50) described above.

[0068] Optionally, the fluid handling structure (12) includes a recess (29). The recess (29) may be provided between the recovery opening (32a) and the recovery opening (32b) or between the gas supply opening (27a) and the recovery opening (32b). The shape of the recess (29) may be uniform around the fluid handling structure (12) and may also optionally include an inclined surface. In the case of the recess (29) provided between the recovery opening (32a) and the recovery opening (32b), the gas supply opening (27b) may be provided on the inclined surface as shown in FIG. 2c. In the case of a recess (29) provided between a supply opening (27a) and a recovery opening (32b), the gas supply opening (27b) may be provided on a portion of the lowest surface of the fluid handling structure (12) parallel to the inclined surface or the surface of the substrate (W). Alternatively, the shape of the recess (29) may be changed around the circumference of the fluid handling structure (12). By changing the shape of the recess (29), the effect of the gas supplied from the gas supply member on the fluid under the fluid handling structure (12) may be changed.

[0069] FIGS. 2a through 2c illustrate examples of different configurations that may be used as part of a fluid handling system. It will be understood that while the examples provided above refer to specific extraction and recovery members, it is not necessary to use the exact type of extraction and / or recovery member. In some cases, different terms may be used to indicate the location of the member, but the same functional features may be provided. Examples of extraction members mentioned above include a recovery opening (21), an overflow recovery section (24), a recovery opening (25) (possibly including a porous plate and / or chamber (35)), a gas recovery opening (28), a pinning opening (32), a recovery opening (32a), a recovery opening (32b), and / or an intermediate recovery section (42). Examples of the supply member mentioned above include a supply opening (20), a lower supply opening (23), a gas knife opening (26), a gas supply opening (27a), a gas supply opening (27b), and / or a supply opening (34). Generally, an extraction member used to extract / recover a fluid, liquid, or gas is interchangeable with at least any of other examples that extract / recover the fluid, liquid, or gas, respectively. Similarly, a supply member used to supply a fluid, liquid, or gas is interchangeable with at least any of other examples used that supply the fluid, liquid, or gas, respectively. An extraction member can extract / recover the fluid, liquid, or gas from the space by being connected to an under pressure that draws the fluid, liquid, or gas into the extraction member. A supply member can supply the fluid, liquid, or gas to the space by being connected to an associated supply member.

[0070] As previously explained, while the use of immersion fluids is advantageous for improving the resolution of smaller features on a substrate, there are also problems with the use of immersion fluids regarding defects introduced into the substrate.

[0071] Generally, when an immersion liquid is used, droplets of the immersion liquid may remain on the surface of the substrate (W). The meniscus (33) at the edge of the immersion liquid may collide with any droplet on the surface of the substrate (W). When a droplet strikes the meniscus (33), gas may be trapped within the immersion liquid. This causes bubbles within the immersion liquid. The formation of bubbles within the immersion liquid can lead to defects on the substrate (W). As described above, the probability of bubble formation can be reduced by decreasing the relative velocity between the substrate (W) and the fluid handling structure (12). However, this reduces the throughput of the lithography device.

[0072] Experiments were conducted to observe the formation of such bubbles. It was observed that a droplet asymmetrically deformed upon impact with the meniscus (33) is less likely to form a bubble. Generally, this is thought to be because the contact between the meniscus (33) and the asymmetrically deformed droplet allows gas to escape rather than be trapped, and thus no bubble is formed or a much smaller volume is trapped. Therefore, it is determined that it would be advantageous to influence the contact between the droplet and the meniscus (33) during impact.

[0073] The present invention should help reduce the impact of at least one bubble-related problem. The present invention includes various embodiments in which the meniscus is agitated to have a non-flat surface, thereby affecting the contact between the droplet and the meniscus (33) during impact. The meniscus (33) having a non-flat surface increases the opportunity for gas to escape when the droplet impacts the meniscus (33). This reduces bubble formation in the immersion liquid and / or allows a higher relative speed between the substrate (W) and the immersion head without generating more bubbles. Thus, defects can be reduced and / or throughput can be increased.

[0074] In the present invention, a vibratory motion is applied to an immersion liquid to excite the vibration of the meniscus (33) of the immersion liquid. By adjusting the frequency of the vibration, it is possible to adjust the interaction between the droplet and the meniscus (33), that is, to influence whether the droplet bounces off the meniscus or combines with it. This principle is described in the academic paper including “Drops Bouncing on a Vibrating Bath.” Journal of the Fluid Mechanics 727 (July 28, 2013): 582-611. © 2013 Cambridge University Press, which is incorporated herein by reference in its entirety.

[0075] The present invention provides a fluid handling system comprising a liquid limiting structure and a mechanism. Variations of the liquid limiting structure (112) and the mechanism (200) are shown across FIGS. 3a through 7. The liquid limiting structure (112) may be a fluid handling structure (12) as described in any of the above embodiments and / or variations, for example, as shown and / or described in relation to the left or right side of FIG. 2a and / or FIG. 2b and / or FIG. 2c. The liquid limiting structure (112) may include a body (113) as described in more detail below.

[0076] The liquid limiting structure (112) is configured to limit an immersion liquid in a space (111) between at least a portion of the liquid limiting structure (112) and the surface (400) of the substrate (W). The liquid limiting structure (112) can control the immersion liquid by supplying the liquid to the space (111) and by removing it from the space (111). Thus, the immersion liquid can be limited to the space (111). The immersion liquid can be supplied by at least one liquid supply member of the liquid limiting structure (112). The at least one liquid supply member may be any suitable supply member capable of supplying liquid, for example, a lower supply opening (23). The immersion liquid can be removed by at least one liquid extraction member of the liquid limiting structure (112). The at least one extraction member may be any suitable extraction member capable of extracting liquid, for example, a pinning opening (32).

[0077] The liquid confinement structure (112) has a hole (10) formed inside for the passage of a radiation beam (B) to irradiate the surface (400) of the substrate (W) by passing it through the immersion liquid. In other words, the substrate (W) can be irradiated by the radiation beam (B) traveling through the immersion liquid and the hole (10) of the liquid confinement structure (112). A space (111) may be located between the liquid confinement structure (112) and the surface (400) of the substrate (W). Thus, the space (111) may be identical to the immersion space (11) described above. As described above, the space (111) may be located between the final element (100) and the surface (400) of the substrate (W) facing the final element (100). The opposing surface is the surface (400) of the substrate (W) or the surface of the support stage (or substrate support (WT)) that is coplanar with the surface of the substrate (W). (References to the surface (400) of the substrate (W) in the following text refer to the surface of the substrate support (WT) additionally or alternatively, unless otherwise explicitly stated. The space (111) may be defined by the liquid limiting structure (112) and the substrate (W). Thus, as in the embodiments and variations above, the space (111) may be formed by the liquid limiting structure (112) and the substrate (W). The space (111) may be further defined by the final element (100) of the projection system (PS). The space (111) may be filled with an immersion liquid by the liquid limiting structure (112).

[0078] The mechanism (200) is part of a fluid handling system. The mechanism (200) is configured to vibrate a vibrating component (210). The vibrating component (210) is a physical object that is vibrated by the mechanism (200). The vibrating component (210) may be part of a fluid handling system, that is, the fluid handling system may include the vibrating component (210). The vibrating component (210) comes into contact with the immersion liquid being used. In other words, when the immersion liquid is in space (111) as it is being used, the immersion liquid will come into physical contact with the vibrating component (210). For example, the vibrating component (210) may be submerged in the immersion liquid and / or may form an edge of the part of the fluid handling system being used to confine the immersion liquid. As long as at least a portion of the vibrating component (210) comes into contact with the immersion liquid and induces vibration within the immersion liquid, the vibrating component (210) may be positioned in the meniscus (33) of the immersion liquid.

[0079] The vibration component (210) can be manufactured from any suitable material. For example, the vibration component (210) can be formed from the same material as the body (113) of the liquid confinement structure (112). Other materials suitable for the body (113) may be used instead, that is, the vibration component (210) can be formed from a different material than the body (113). For example, the vibration component (210) can be formed from a metal, for example, stainless steel.

[0080] As described above, the frequency of the vibration can be selected to adjust the shape of the meniscus (33) and, accordingly, will affect the interaction between the meniscus (33) and the droplet during collision. The vibration of the meniscus (33) induces the formation of waves characterized by the dispersion relationship between the wavelength and the frequency of the vibration (which may otherwise be referred to as the oscillation frequency). Thus, the frequency of the vibration affects the wavelength of the waves formed along the meniscus (33). As the mechanism (200) is configured to vibrate the vibration component (210), the frequency of the vibration of the vibration component (210) is greater than 0. The mechanism (200) is configured to vibrate the vibration component (210) at a frequency of about 30 Hz or higher. The mechanism (200) is configured to vibrate the vibration component (210) at a frequency of less than 9,500 Hz.

[0081] Preferably, the frequency is greater than or equal to approximately 30 Hz as described above. The frequency may be greater than or equal to approximately 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, or 500 Hz. Preferably, the frequency is less than approximately 9,500 Hz. The frequency may be approximately 9,000, 8,000, 7,000, 6,000, 5,000, 4,000, 3,000, 2,000, 1,500, 1,400, 1,300, 1,200, 1,100, 1,000, 900, 800, 700, 600, 500, 400, 300, 200, or 100 Hz or less.

[0082] Preferably, the frequency range is about 60 Hz or more and less than about 9,500 Hz, or preferably, the frequency range is about 100 Hz or more and about 2,000 Hz or less, or more preferably, the frequency range is about 500 Hz or more and about 1,500 Hz or less.

[0083] The vibrating component (210) can preferably be moved in any direction by the mechanism (200). Preferably, the vibrating component (210) is moved by the mechanism (200) in a substantially horizontal plane. The substantially horizontal plane corresponds to the XY plane as shown in the drawing. The vibrating component (210) can be translated in at least one linear direction in the XY plane, and / or the vibrating component can be rotated about the RZ axis. Vibrating the vibrating component (210) in this way can be advantageous for vibration in other directions because it can reduce disturbance to other components.

[0084] As described, the mechanism (200) is used to vibrate the vibration mechanism (210). The mechanism (200) may include any suitable actuator, for example, a piezoelectric actuator, a Lorentz actuator, a magnetostrictive actuator, or a reluctance actuator. The mechanism (200) may be any suitable actuator currently known or later developed for this purpose.

[0085] In the first embodiment, at least a portion of the liquid limiting structure (112) is vibrated by the mechanism (200). For example, the liquid limiting structure (112) may include a body (113) and a vibrating component (210), as shown in FIGS. 3A, 3B, 3C, and 3D. FIGS. 3A, 3B, 3C, and 3D are intended to show a vibration mechanism combined with a liquid handling structure (112) that may have any or all of the features described above in relation to the fluid handling structure (12) of FIGS. 2A, 2B, and / or FIGS. 2C.

[0086] The mechanism (200) may be configured to vibrate the vibration component (210) against the body (113). The vibration component (210) may define space (111) by forming a barrier at the edge of the immersion liquid. Thus, the vibration component (210) may form edge contact of the liquid confinement structure (112) with the immersion liquid. It may be desirable to provide the vibration component (210) as a separate element from the body (113), as operating a smaller mass may reduce disturbance forces in the fluid handling system and device as a whole. The vibration component (210) may be located inside the body (213) or adjacent to the body. The vibration component (210) may be located within a recess of the body (113), as shown in FIGS. 3A, 3B, 3C, and 3D. The vibration component (210) can be of any suitable shape.

[0087] The vibration component (210) can be connected to the body (213) through at least a mechanism (200), that is, the vibration component (210) and the body (113) can be connected through at least a mechanism (200). FIGS. 3a, 3b, 3c, and 3d show a mechanism (200) connected to the uppermost part of the vibration component (210), but the mechanism (200) can be attached to the vibration component (210) at any suitable location. The vibration component (210) and the body (113) can additionally be connected by some form of holding means, for example, through at least one spring (214) attached to the vibration component (210) and the body (113). FIGS. 3A, FIGS. 3B, FIGS. 3C, and FIGS. 3D show a spring (214) connected to a side portion of the vibration component (210), but the spring (214) can be attached to the vibration component (210) at any suitable location.

[0088] As shown in FIGS. 3a, 3b, 3c and 3d, the vibrating component (210) may be located radially inward of any liquid supply member and / or any liquid extraction member. Alternatively, the vibrating component (210) may be located between any one of the liquid supply members and / or any liquid extraction member.

[0089] For example, with respect to the left side of FIG. 3a, the vibrating component (210) may be positioned adjacent to the recovery opening (25), for example, a porous material. The vibrating component (210) may be positioned between the liquid supply opening (e.g., lower supply opening (23)) and the liquid extraction opening (e.g., recovery opening (25)). For example, with respect to the right side of FIG. 3a and FIG. 3b, the vibrating component (210) may be positioned between the liquid supply opening (e.g., lower supply opening (23)) and the liquid extraction opening (e.g., pinning opening (32)). For example, with respect to the left side of FIG. 3b, the vibrating component (210) may be positioned adjacent to the recovery opening (25), for example, a porous material. The vibrating component (210) can be located between the liquid supply opening (e.g., lower supply opening (23)) and the liquid extraction opening (e.g., recovery opening (25)).

[0090] For example, with respect to the left side of FIG. 3c, the vibrating component (210) may be located radially inward of the liquid extraction opening (e.g., recovery opening (25)). With respect to the left side of FIG. 3c, the vibrating component (210) may be located within the chamber (35) (as long as the vibrating component (210) can come into direct contact with the immersion liquid). With respect to the left side of FIG. 3c, it is noted that the vibrating mechanism (210) may form part of the plate (40) or replace part of the plate. For example, with respect to the right side of FIG. 3c, the vibrating component (210) may be located radially inward of the liquid extraction opening (e.g., intermediate recovery section (42)). With respect to the right side of FIG. 3c, it is noted that the liquid confinement structure (112) may have an inner part (112a) (corresponding to the inner part (12a) of FIG. 2b described above) and an outer part (112b) (corresponding to the outer part (12b) of FIG. 2b described above). Accordingly, the body (113) may be formed with a first body element (113a) forming the inner part (112a) and a second body element (113b) forming the outer part (112b). Optionally, the first body element (113a) and the second body element (113b) are connected to each other. Preferably, the coupling allows the first body element (113a) to move relative to the second body element (113b), for example, through an elastic connection. The vibration mechanism (210) may form at least a portion of the inner part (112a) as illustrated on the right side of FIG. 3c. Additionally or alternatively, the vibration mechanism (210) may form at least a portion of the outer part (112b). For example, with respect to the right side of FIG. 3c, the vibration mechanism (210) may form a portion of the plate (40) or replace a portion of the plate (40). In this case, the vibration component (210) may be located radially inward of the liquid extraction opening (e.g., the recovery opening (25)).

[0091] For example, with respect to the left side of FIG. 3d, the vibrating component (210) may be located adjacent to the recovery opening (25), for example, a porous material. The vibrating component (210) may be located between the liquid supply opening (e.g., lower supply opening (23)) and the liquid extraction opening (e.g., recovery opening (25)). For example, with respect to the right side of FIG. 3d, the vibrating component (210) may be located between the liquid supply opening (e.g., lower supply opening (23)) and the liquid extraction opening (e.g., recovery opening (32a)).

[0092] As shown in FIGS. 3A, 3B, 3C, and 3D, there may be a single (i.e., only one) vibration component (210). Alternatively, there may be multiple vibration components (210). These may be located at any or all of the locations described above in relation to FIGS. 3A, 3B, 3C, and 3D at different locations of the liquid confinement structure (112).

[0093] In this embodiment, the body (113) of the liquid limiting structure (112) can be vibrated, that is, the liquid limiting structure (112) can be moved as a whole, as shown in FIG. 4. In this case, the body (113) is a vibrating component. In this case, substantially the entire liquid limiting structure (112) can be moved by the mechanism (200). Implementing the vibration of the entire liquid limiting structure (112) can be relatively simple. However, vibrating the body (113) of the liquid limiting structure (112) is more likely to introduce an disturbance force to the substrate (W) and / or components of the lithography device, for example, the substrate support (WT).

[0094] In FIG. 4, the mechanism (200) is attached to the top of the liquid limiting structure (112), but the mechanism (200) may be attached to any suitable part of the liquid limiting structure (112). In this case, the mechanism (200) may advantageously be located outside the immersion liquid. The mechanism (200) may be attached to a non-moving part of the lithography device, such as a support frame (not shown). As described above in relation to FIG. 3a, 3b, 3c and 3d, a retaining means (not shown) may also be provided between the body (113) of the liquid limiting structure (112) and the non-moving part of the lithography device.

[0095] It will be understood that FIG. 4 illustrates a modified example in which the entire body (113) of the liquid limiting structure (112) vibrates. FIG. 4 illustrates a feature of the liquid limiting structure (112) corresponding to FIG. 3a, but the liquid limiting structure (112) may have a feature as shown in FIG. 3b, FIG. 3c, or FIG. 3d, that is, the liquid limiting structure (112) may have any of the features of the fluid handling structure (12) of FIG. 2a, FIG. 2b, and FIG. 2c.

[0096] In the first embodiment, the body (113) of the liquid-restricting structure (112) may be formed by a plurality of segments, for example, a first body element (113a) and a second body element (113b). Optionally, the first body element (113a) and the second body element (113b) are connected to each other. Preferably, the connection allows the first body element (113a) to move toward the second body element (113b), for example, through an elastic connection.

[0097] Such variations are shown in FIGS. 5a and 5b. In this case, the first body element (113a) and the second body element (113b) may each be vibration components. The mechanism may include a first mechanism (200a) and a second mechanism (200b). In this case, the first mechanism (200a) may be configured to vibrate the first body element (113a) (which acts as the first vibration component), and the second mechanism (200b) may be configured to vibrate the second body element (113b) (which acts as the second vibration component). The first mechanism (200a) and the second mechanism (200b) may be configured to vibrate the first body element (113a) and / or the second body element (113b) at the frequency described above, respectively.

[0098] Providing the liquid limiting structure (112) in multiple segments is advantageous because it allows for more control over the vibration of the body (113), and, for example, the first body element (113a) and the second body element (113b) can vibrate at different frequencies simultaneously.

[0099] For example, the liquid limiting structure (112) may have a longitudinal axis (LX). Planarly, the body (113) may be separated into a first body element (113a) and a second body element (113b) along the longitudinal axis (LX). Thus, the gap between the first body element (113a) and the second body element (113b) may cross the longitudinal axis (LX). The first body element (113a) may form the front portion of the liquid limiting structure (112), and the second body element (113b) may form the rear portion of the liquid limiting structure (112). This is shown in FIG. 5a, which is a drawing of the lower surface of the liquid limiting structure (112). As shown in FIG. 5a, the substrate (W) can be moved relative to the liquid limiting structure (112) in a direction substantially parallel to the longitudinal axis (LX) of the liquid limiting structure (112). Thus, the first body element (113a) in FIG. 5a may be the front part of the liquid limiting structure (112) and the second body element (113b) may be the rear part of the liquid limiting structure (112). Of course, the body (113) can be formed by the first body element (113a) and the second body element (113b) using various shapes, for example, the gap between the first body element (113a) and the second body element (113b) can be formed along the longitudinal axis (LX) or substantially parallel to the longitudinal axis.

[0100] The vibration of the first body element (113a) and the second body element (113b) can be controlled to produce better coherence of droplets in the meniscus (33) at the front of the liquid limiting structure (112) compared to the rear of the liquid limiting structure (112). This can be advantageous because it can reduce the introduction of bubbles at the front of the liquid limiting structure (112), which may be more likely to cause defects in the substrate (W).

[0101] In FIG. 5a, the first mechanism (200a) and the second mechanism (200b) are shown from the sides of the first body element (113a) and the second body element (113b), respectively, but the first mechanism (200a) and the second mechanism (200b) may be positioned at any suitable location. The shape of the liquid restriction structure (112), the formation and shape of the lower supply opening (23), and the formation and shape of the pinning openings (32) as shown in FIG. 5a are merely examples, and any shape / shape may be used. Any additional or alternative liquid supply opening and / or liquid extraction opening may be provided.

[0102] As shown in FIG. 5b, the first body element (113a) may be the internal part (112a) as described above, and the second body element (113b) may be the external part (112b) as described above. In FIG. 5b, only the right side of the fluid handling system is shown.

[0103] The first mechanism (200a) and the second mechanism (200b) may each be provided on any suitable surface of the first body element (113a) and the second body element (113b). In this case, the first mechanism (200a) and the second mechanism (200b) may be located outside the immersion liquid. The first mechanism (200a) and the second mechanism (200b) may be attached to a non-moving part of the lithography device, such as a support frame (not shown). The first mechanism (200a) and the second mechanism (200b) may be attached to the same non-moving part. As described above in relation to FIGS. 3a, 3b, 3c and 3d, a retaining means (not shown) may be provided between the first body element (113a) and / or the second body element (113b) and the non-moving part of the lithography device.

[0104] It will be understood that FIGS. 5A and 5B illustrate variations in which individual parts of the body (113) of the liquid confinement structure (112) vibrate. Only one of the parts of the body (113) may vibrate. At least one part of the body (113) may remain stationary, while at least one other part of the body (113) vibrates. Although FIGS. 5A and 5B illustrate features of the liquid confinement structure (112) corresponding to FIGS. 3A, the liquid confinement structure (112) may have features as shown in FIGS. 3B, FIGS. 3C, or FIGS. 3D, that is, the liquid confinement structure (112) may have any of the features of the fluid handling structure (12) of FIGS. 2A, FIGS. 2B, and / or FIGS. 2C.

[0105] In the second embodiment, the vibrating component (210) is located outside the liquid confinement structure (112). Variations of the second embodiment are shown on the left and right sides of FIG. 6. The vibrating component (210) may come into contact with the immersion fluid through a liquid connection. In this embodiment, the fluid handling system further includes a passage (220) connected to the vibrating component (210) so that the vibrating component (210) comes into contact with the immersion fluid through the passage (220). The passage (220) may be filled with the immersion fluid in use. In other words, the vibrating component (210) comes into contact with the immersion fluid passing through the passage (220) and moving into the space (111).

[0106] The passage (220) may include a first opening (221a) at the first end (220a) and a second opening (221b) at the second end (220b). The passage (220) may be coupled to a vibration component (210) at the first end (220a). Depending on the respective shapes of the first end (220a) and the vibration component (210), the first end (220a) may be connected to the vibration component (210) via a housing (240). However, if the vibration component (210) is fitted directly into the first end (220a), this may not be used. The passage (220) may come into contact with an immersion liquid at the second end (220b). For example, as shown on the left side of FIG. 6, the second opening (221b) may be positioned to be submerged in the immersion liquid in use. The passage (220) may be connected to the liquid limiting structure (112) if desired, or may form part of the liquid limiting structure. Thus, for example, the passage (220) may be formed at least partially as part of the liquid limiting structure (112). In this case, as shown on the right side of FIG. 6, the second opening (221b) may be formed at the edge of the liquid limiting structure (112) that comes into contact with the immersion liquid in use.

[0107] As shown in FIG. 6, the housing (240) may include an additional opening (222) that can be used to remove gas from the passage (220) to ensure it is filled with an immersion liquid. Preferably, the additional opening (222) is located adjacent to the vibrating component (210) to remove any gas and maintain contact between the immersion liquid and the vibrating component (210). The additional opening (222) may additionally or alternatively be located on the passage (220).

[0108] Since the immersion liquid is incompressible, the location of the vibration source may be outside the liquid limiting structure (112), while still providing the vibration described above to the immersion liquid. Providing the vibration component (210) outside the liquid limiting structure (112), as in the second embodiment, is advantageous because it provides more design freedom as there is no need to provide the mechanism (200) and / or vibration component (210) inside the liquid limiting structure (112), as part of the liquid limiting structure, or attached to the liquid limiting structure. This can provide additional options for the mechanism (200) as there will be fewer size constraints.

[0109] It will be understood that FIG. 6 illustrates a variation of a second embodiment in which the vibration component (210) is located outside the liquid confinement structure (112). FIG. 6 illustrates a feature of the liquid confinement structure (112) corresponding to FIG. 3a, but the vibration component (210) described in relation to the left or right side of FIG. 6 may have a liquid confinement structure having a feature as shown in any of FIG. 3a, FIG. 3b, FIG. 3c, or FIG. 3d, that is, the liquid confinement structure (112) may have any of the features of the fluid handling structure (12) of FIG. 2a, FIG. 2b, and / or FIG. 2c.

[0110] In a third embodiment, the vibrating component (210) includes a membrane (230). The membrane (230) may be formed of any suitable material. For example, the membrane (230) may be a metal, for example, stainless steel or nickel. The membrane (230) may be formed on the surface of the liquid limiting structure (112), which comes into contact with the immersion liquid in use. Preferably, the surface of the liquid limiting structure (112) containing the membrane (230) is the surface facing the substrate (W), which may otherwise be referred to as the lowest surface of the liquid limiting structure (112). However, the membrane (230) does not need to be located on this surface. The membrane (230) may be provided on any other suitable surface of the liquid limiting structure (112). The membrane (230) is advantageous because it can keep the immersion liquid away from the mechanism (200), that is, the membrane (230) can act as a liquid separation feature. The membrane (230) may be advantageous in providing a larger surface area in contact with the immersion liquid than when using the vibration mechanism (210) without the membrane (230).

[0111] In this case, as shown in FIG. 7, the membrane (230) and the mechanism (200) may be located within the recess of the body (113) of the liquid-restricting structure (112).

[0112] As described in relation to the vibration component (210) of the first embodiment, the membrane (230) may be positioned on the liquid limiting structure (112) at any suitable location. For example, FIG. 7 shows a membrane (230) positioned radially inward of any liquid supply member and liquid extraction member, and the membrane (230) may be provided between any of the liquid supply members and / or liquid extraction members.

[0113] It will be understood that FIG. 7 illustrates a variation of the third embodiment in which the vibrating component (210) is a membrane (230). Although FIG. 7 illustrates a feature of the liquid limiting structure (112) corresponding to FIG. 3a, the membrane (230) may have a liquid limiting structure (112) having a feature as shown in any of FIG. 3a, FIG. 3b, FIG. 3c, or FIG. 3d, that is, the liquid limiting structure may have any of the features of the fluid handling structure (12) of FIG. 2a, FIG. 2b, and / or FIG. 2c.

[0114] The membrane (230) can be replaced with a bellows, preferably a metal bellows. In this case, the vibrating component (210) is in contact with the bellows and can move the bellows. The bellows is in contact with the immersion liquid and can provide vibration to the immersion liquid. This can provide similar advantages to the use of the membrane (230) and can further increase the contact area with the immersion liquid. In particular, the bellows can separate the mechanism (200) from the immersion liquid. For example, the bellows may be identical or similar to those produced by Servometer®. For example, the bellows may have a wall thickness of about 10 µm.

[0115] It will also be understood that the first, second, and third embodiments all relate to different variations of the vibrating component (210) used to vibrate the immersion liquid. Some or all of these embodiments may be combined, for example, to vibrate at least a part of the body (113) of the liquid confinement structure (112) as well as the membrane (230). In other words, the variations described in the first, second, and / or third embodiments may be combined, for example, by providing any one of the fluid handling structures (12) described in relation to FIG. 2a, FIG. 2b, and / or FIG. 2c or any one of the liquid confinement structures (112) described in relation to FIG. 3a, FIG. 3b, FIG. 3c, or FIG. 3d to a plurality of vibrating components and / or mechanisms.

[0116] The present invention may provide a lithography device. The lithography device may have any or all of the other features or components of the lithography device as described above. For example, the lithography device may optionally include at least one of a source (SO), an illumination system (IL), a projection system (PS), a substrate table (WT), etc.

[0117] Specifically, the lithography device may include a projection system configured to project a radiation beam (B) toward an area of ​​the surface of the substrate (W). The lithography device may further include a fluid handling system as described in any of the embodiments and variations above.

[0118] The lithography device may include an actuator configured to move a substrate (W) relative to a fluid handling system. Thus, the actuator may be used to control the position of the substrate (W) (or alternatively, the position of the fluid handling system). The actuator may be or may include a substrate support (e.g., a substrate table) (WT) configured to hold the substrate (W) and / or a second positioner (PW) configured to accurately position the substrate support (WT).

[0119] While specific references may be made in this specification regarding the use of lithography devices in the manufacture of ICs, it should be understood that the lithography devices described herein may have other applications. Possible other applications include the manufacture of integrated optical systems, guide and detection patterns for magnetic domain memory, flat panel displays, liquid crystal displays (LCDs), thin film magnetic heads, etc.

[0120] Where context permits, embodiments of the present invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the present invention may also be implemented by instructions stored in a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include read-only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagated signals (e.g., carrier waves, infrared signals, digital signals, etc.). Additionally, firmware, software, routines, and instructions may be described herein as performing specific operations. However, it must be recognized that this description is merely for convenience, and that this operation is actually attributed to computing devices, processors, controllers, or other devices executing firmware, software, routines, instructions, etc., and that doing so enables actuators or other devices to interact with the material world.

[0121] Although specific references to embodiments of the invention may be made in the context of lithography devices in this specification, embodiments of the invention may be used in other devices. Embodiments of the invention may form part of any device that measures or processes objects, such as a mask inspection device, a measuring device, or a wafer (or other substrate) or a mask (or other patterning device). This device may generally be referred to as a lithography tool. Such lithography tools may use atmospheric (non-vacuum) conditions.

[0122] Although specific references to the use of embodiments of the present invention in the context of optical lithography may be made above, it will be recognized that the present invention is not limited to optical lithography where the context permits.

[0123] Although specific embodiments of the present invention have been described above, it will be recognized that the invention may be practiced differently from as described. The above description is for illustrative purposes only and is not limiting. Accordingly, it will be apparent to those skilled in the art that modifications to the invention as described may be made without departing from the scope of the claims set forth below.

Claims

Claim 1 A fluid handling system comprising: a liquid confining structure configured to confine an immersion liquid in the space between at least a portion of the liquid confining structure and the surface of a substrate, thereby forming a meniscus at the interface between the immersion liquid and a gaseous environment outside the confined immersion liquid, said liquid confining structure having an opening—said to be formed for the passage of a radiation beam to irradiate the surface of the substrate by passing it through the immersion liquid—; and a mechanism configured to vibrate a vibrating component in contact with the immersion liquid in use at a frequency of 30 Hz or more and less than 9,500 Hz to change the shape of the surface of said meniscus. Claim 2 A fluid handling system according to claim 1, wherein the liquid limiting structure comprises a body, and the vibration component is the body of the liquid limiting structure such that the mechanism is configured to vibrate the body; or the liquid limiting structure comprises a body, and the mechanism is configured to vibrate the vibration component with respect to the body of the liquid limiting structure; or the mechanism comprises a first mechanism and a second mechanism, and the liquid limiting structure comprises a body formed by a first body element and a second body element, wherein the first mechanism is configured to vibrate the first body element and the second mechanism is configured to vibrate the second body element. Claim 3 A fluid handling system according to claim 2, wherein the vibration component and the body are connected to each other; or the liquid limiting structure has a longitudinal axis, and in a plane the body is separated into the first body element and the second body element along the longitudinal axis; or the liquid limiting structure has a longitudinal axis, and in a plane the body is separated into the first body element and the second body element along the longitudinal axis; or the first body element forms the internal part of the liquid limiting structure and the second body element forms the external part of the liquid limiting structure. Claim 4 In paragraph 3, the first body element forms an internal portion of the liquid restriction structure and the second body element forms an external portion of the liquid restriction structure; or the first body element and the second body element are connected to each other in a fluid handling system. Claim 5 The fluid handling system according to claim 1, wherein the vibrating component is located outside the liquid limiting structure, and the fluid handling system further comprises the passage connected to the vibrating component so that the vibrating component comes into contact with the immersion liquid through a passage filled with the immersion liquid in use; or the fluid handling system comprising a membrane formed on the surface of the liquid limiting structure that comes into contact with the immersion liquid in use. Claim 6 In claim 5, the surface faces the substrate and the membrane is a fluid handling system located on the surface. Claim 7 In any one of claims 1 to 6, the frequency is 60 Hz or higher; or the vibrating component is moved by the mechanism in a substantially horizontal plane; or the mechanism comprises a piezoelectric actuator, a Lorentz actuator, a magnetostrictive actuator, or a reluctance actuator; or the liquid confinement structure comprises at least one liquid supply member configured to provide an immersion liquid to the space and at least one extraction member configured to remove the immersion liquid from the space, forming a fluid handling system. Claim 8 In claim 7, the at least one liquid supply member comprises a liquid supply opening formed on the inner surface of the liquid limiting structure; or the at least one liquid supply member comprises a liquid supply opening formed on the surface of the liquid limiting structure facing the surface of the substrate; or the liquid limiting structure comprises two extraction members and two gas supply members, wherein the at least one liquid supply member, the two extraction members and the two gas supply members are formed on the surface of the liquid limiting structure facing the surface of the substrate, forming a fluid handling system. Claim 9 In claim 8, the first extraction member among the extraction members is radially outward of the at least one liquid supply member, the first gas supply member among the two gas supply members is radially outward of the first extraction member among the extraction members, the second extraction member among the extraction members is radially outward of the first gas supply member among the two gas supply members, and the second gas supply member among the two gas supply members is radially outward of the second extraction member among the two extraction members; or at least one of the two extraction members comprises a porous material inside; or further comprises at least one additional opening on the surface of the liquid limiting structure facing the surface of the substrate, wherein the at least one additional opening is arranged between the first extraction member among the two extraction members and the first gas supply member among the two gas supply members or between the second extraction member among the two extraction members and the second gas supply member among the two gas supply members; Or the surface of the liquid limiting structure comprises a concave portion, optionally the concave portion has an inclined surface; or the vibrating component is arranged radially inward of the at least one liquid supply member or between the at least one liquid supply member and the first extraction member among the extraction members in a fluid handling system. Claim 10 In any one of claims 1 to 6, the liquid limiting structure comprises at least one liquid supply member configured to provide an immersion liquid in the space, at least two extraction members, and at least one gas supply member, wherein the liquid supply member, the at least two extraction members, and the gas supply member are formed on the surface of the liquid limiting structure facing the surface of the substrate; or the at least one extraction member of the liquid limiting structure comprises a chamber on the surface of the liquid limiting structure facing the surface of the substrate and a porous material within the chamber, wherein the at least one extraction member comprises a first channel configured to extract liquid from the chamber and a second channel configured to extract gas from the chamber; or the liquid limiting structure comprises an inner portion and an outer portion, wherein the at least one liquid supply member of the liquid limiting structure is formed in the inner portion, wherein the inner portion comprises a first extraction member and the outer portion comprises a second extraction member; A fluid handling system further comprising an additional device including at least one additional liquid supply member and at least one additional extraction member, wherein the at least one additional liquid supply member is configured to provide liquid to an additional space between at least a portion of the additional device and the surface of the substrate, and the additional device is configured to recover at least a portion of the liquid through the at least one additional extraction member. Claim 11 In claim 10, in a plane, the first extraction member among the at least two extraction members is radially outward of the gas supply member, and the gas supply member is radially outward of the second extraction member among the at least two extraction members, and the second extraction member among the at least one extraction member is radially outward of the liquid supply member; or the vibrating component is located within the chamber; or the outer portion comprises a plate located between the inner portion and the substrate, the plate is configured to isolate the immersion liquid on both sides of the plate, the surface of the inner portion facing the plate comprises the first extraction member, and the surface of the plate facing the substrate comprises the second extraction member; or the additional device is part of the liquid limiting structure or a fluid handling system located adjacent to the liquid limiting structure. Claim 12 In claim 11, the fluid handling system further comprises at least one additional opening within the surface of the liquid limiting structure facing the surface of the substrate, wherein the at least one additional opening is arranged between the first extraction member of the two extraction members and the gas supply member or between the gas supply member and the second extraction member of the two extraction members; or the vibrating component is arranged between the at least one gas supply member and the second extraction member of the at least one extraction member; or at least one of the at least two extraction members comprises a porous material inside. Claim 13 In paragraph 12, the porous material is provided to the innermost extraction member in the radial direction; or the vibrating component is a fluid handling system arranged adjacent to the porous material. Claim 14 In claim 11, the first extraction member or the second extraction member comprises a porous material configured to recover the immersion liquid in a single-phase flow; or the vibrating component forms at least a portion of the internal part or at least a portion of the external part of a fluid handling system. Claim 15 A lithography apparatus comprising: a projection system configured to project a radiation beam toward the surface of a substrate; and a fluid handling system according to any one of claims 1 to 6.

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