Electronic device including pen input device

Abstract

According to one embodiment of the present document, an electronic device comprises a foldable housing including a first housing, a second housing, and a folding portion between the first housing and the second housing, and a pen input device detachably attached to the folding portion, wherein the folding portion comprises a first hinge and a second hinge connecting the first housing and the second housing, and a hinge housing capable of covering the first hinge and the second hinge and forming a portion of the outer surface of the electronic device, and wherein the hinge housing may include a first recess positioned between the first hinge and the second hinge and capable of accommodating the pen input device. Various other embodiments are possible.

Description

Technology Field

[0001] Various embodiments of this document relate to electronic devices including a pen input device. Background Technology

[0003] With the establishment of a 'paperless' environment that is environmentally conscious and allows for more efficient work methods, the use of smart devices is growing, and as we rapidly transition into the mobile era, electronic devices can include pen input devices (e.g., stylus pens). Pen input devices, which were previously required only for specific purposes, are becoming increasingly sophisticated and equipped with many functions, expanding their role as new tools. The problem to be solved

[0005] Due to the slimming or structural characteristics of electronic devices, it may be difficult to secure space for attaching and detaching pen input devices.

[0006] Various embodiments of this document may provide an electronic device including a detachable pen input device.

[0007] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be understood by those skilled in the art to which this invention belongs from the description below. means of solving the problem

[0009] According to one embodiment of the present document, the electronic device comprises a foldable housing including a first housing, a second housing, and a folding portion between the first housing and the second housing, and a pen input device detachably attached to the folding portion, wherein the folding portion comprises a first hinge and a second hinge connecting the first housing and the second housing, and a hinge housing capable of covering the first hinge and the second hinge and forming a portion of the outer surface of the electronic device, and the hinge housing may include a first recess located between the first hinge and the second hinge and capable of accommodating the pen input device. Effects of the invention

[0011] An electronic device including a pen input device according to various embodiments of the present document can be implemented to insert the pen input device into a hinge housing included in the folding part of the electronic device, thereby improving space efficiency or space utilization.

[0012] Furthermore, other effects that can be obtained or predicted by the various embodiments of this document will be disclosed directly or implicitly in the detailed description of the embodiments of this document. For example, various effects predicted according to the various embodiments of this document will be disclosed in the detailed description that follows. Brief explanation of the drawing

[0014] FIG. 1 is a block diagram of an electronic device in a network environment in one embodiment. FIG. 2 is a perspective view relating to an electronic device in an unfolded state in one embodiment. FIG. 3 is a perspective view relating to an electronic device in a folded state in one embodiment. FIG. 4 illustrates an electronic device of an intermediate state in one embodiment. FIG. 5 is an exploded view of a part of an electronic device in one embodiment. FIG. 6 illustrates a part of an electronic device in relation to FIG. 5 in one embodiment. FIG. 7 illustrates a cross-sectional structure for the AA' line in FIG. 2 in one embodiment. FIG. 8 is a partial cross-sectional view relating to a part of an electronic device in relation to FIG. 7 in one embodiment. FIG. 9 illustrates a cross-sectional structure regarding the folded state of an electronic device in relation to FIG. 7 in one embodiment. FIG. 10 illustrates, in one embodiment, a state in which a pen input device is placed in an electronic device and a cross-sectional structure relating thereto. FIG. 11 illustrates a pen input device according to another embodiment. FIG. 12 illustrates, in one embodiment, the state in which the pen input device of FIG. 11 is placed in an electronic device and a cross-sectional structure regarding the same. FIG. 13 illustrates, in another embodiment, the state in which the pen input device of FIG. 11 is placed in an electronic device and a cross-sectional structure relating thereto. FIG. 14 relates to another embodiment that modifies or alters the example of FIG. 13 and illustrates a cross-sectional structure of the part indicated by the reference numeral 'D'. FIGS. 15 and 16 illustrate cross-sectional structures relating to other embodiments that modify or alter the example of FIG. 13. Specific details for implementing the invention

[0015] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0016] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) in one embodiment.

[0017] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0018] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0019] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0020] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0021] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0022] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0023] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0024] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0025] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0026] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0030] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0032] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0034] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0035] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0036] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0037] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., commands or data) with each other.

[0038] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0039] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0040] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., via wire), wirelessly, or through a third component.

[0041] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0042] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0043] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0044] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0045] FIG. 2 is a perspective view relating to an electronic device (2) in a flat or unfolded state in one embodiment. FIG. 3 is a perspective view relating to an electronic device (2) in a folded state in one embodiment. FIG. 4 illustrates an electronic device (2) in an intermediate state in one embodiment.

[0046] Referring to FIGS. 2 and 3, in one embodiment, the electronic device (2) may include a foldable housing (20). The foldable housing (20) may include a first surface (20A) of the electronic device (2) and a second surface (20B) of the electronic device (2) located opposite to the first surface (20A). The foldable housing (20) may include a first side (20C) and a second side (20D) of the electronic device (2) that at least partially surround the space between the first surface (20A) and the second surface (20B). The first surface (20A) may include a first cover area (①), a second cover area (②), and a folding cover area (F) between the first cover area (①) and the second cover area (②). In the unfolded state of the foldable housing (20), the first surface (20A) may be substantially flat, and the first cover area (①), the second cover area (②), and the folding cover area (F) may face substantially the same direction. The second surface (20B) may include a third cover area (③) and a fourth cover area (④). The third cover area (③) may be located on the opposite side of the first cover area (①) of the first surface (20A) and may face in the opposite direction of the first cover area (①). The fourth cover area (④) may be located on the opposite side of the second cover area (②) of the first surface (20A) and may face in the opposite direction of the second cover area (②). In one embodiment, the foldable housing (20) may be implemented as an in-folding structure in which the first surface (20A) folds inward. For example, in the unfolded state of the foldable housing (20) (see FIG. 2), the folding cover area (F) is arranged in a flat plane, and the first cover area (①) and the second cover area (②) can form an angle of about 180 degrees.In the folded state of the foldable housing (20) (see FIG. 3), the folding cover area (F) is arranged in a curved shape, and the first cover area (①) and the second cover area (②) may form an angle different from an angle of about 180 degrees. The folded state may include a fully folded state or an intermediate state. The fully folded state (see FIG. 3) is a maximally folded state in which the first cover area (①) and the second cover area (②) of the first surface (20A) do not come any closer together, for example, the first cover area (①) and the second cover area (②) may form an angle of about 0 degrees to about 10 degrees. In the fully folded state, the first surface (20A) may not be substantially exposed to the outside. The intermediate state (see FIG. 4) may refer to a state between the unfolded state and the fully folded state. The folding cover area (F) of the first side (20A) may be bent more in the fully folded state than in the intermediate state. According to some embodiments, the electronic device (2) may be implemented in an out-folding structure in which the first side (20A) (or screen) is folded outward.

[0047] According to one embodiment, the foldable housing (20) may include a front cover (e.g., window) (201) that forms at least a portion of the first surface (20A). The flexible display (30) may be located in the internal space of the electronic device (2) by overlapping at least a portion with the front cover (201). The front cover (201) may protect the flexible display (30) from the outside and may be substantially transparent. Light output from the flexible display (30) may pass through the front cover (201) and proceed to the outside. The flexible display (30) may include, for example, a first display area (or active area) overlapping with a first cover area (①) of the first surface (20A), a second display area overlapping with a second cover area (②) of the first surface (20A), and a third display area overlapping with a folding cover area (F). The screen may refer to an area capable of displaying an image in a device comprising a flexible display (30) and a front cover (201), and may include, for example, a display area of ​​the flexible display (30) and an area of ​​the front cover (201) superimposed thereon. In some embodiments, the front cover (201) may be formed integrally with the flexible display (30) as a component included in the flexible display (30). The front cover (201) may be implemented in the form of a thin film, such as a film, to have flexibility. The front cover (201) may include, for example, a plastic film (e.g., a polyimide film) or a thin film glass (e.g., ultra-thin glass (UTG)). In some embodiments, the front cover (201) may include a plurality of layers. For example, the front cover (201) may be in the form of a coating layer or protective layer of various polymer materials (e.g., PET (polyester), PI (polyimide), or TPU (thermoplastic polyurethane)) disposed on a plastic film or thin film glass.

[0048] According to one embodiment, the foldable housing (20) may include a first housing (or, a first housing part or a first housing structure) (21), a second housing (or, a second housing part or a second housing structure) (22), and / or a hinge assembly. The first housing (21) and the second housing (22) are connected by a hinge assembly and may be rotatable relative to each other with respect to the folding axis (C) of the foldable housing (20) (e.g., the rotation axis of the hinge assembly). The first housing (21) may include a first cover portion of the front cover (201) located on one side with respect to the folding axis (C), a first rear cover (211) that forms at least a portion of the third cover area (③) of the second surface (20B), and a first side bezel structure (or first side member) (212) that forms a first side (20C) by surrounding at least a portion of the space between the first cover portion and the first rear cover (211). The first cover portion of the front cover (201) may, for example, form a first folding cover area (F1) located on one side with respect to the folding axis (C) among the first cover area (①) and the folding cover area (F). The second housing (22) may include a second cover portion of the front cover (201) located on one side with respect to the folding axis (C), a second rear cover (221) that forms at least a portion of the fourth cover area (④) of the second surface (20B), and a second side bezel structure (or second side member) (222) that forms a second side (20D) by at least partially surrounding the space between the second cover portion and the second rear cover (221). The second cover portion of the front cover (201) may, for example, form a second folding cover area (F2) located on the other side with respect to the folding axis (C) among the second cover area (②) and the folding cover area (F). In the fully folded state of the foldable housing (20), the first side bezel structure (212) and the second side bezel structure (222) may be aligned by overlapping at least partially.The first side bezel structure (212) and / or the second side bezel structure (222) may be formed by, for example, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials. The first side bezel structure (212) and / or the second side bezel structure (222) may include various metallic materials such as, for example, titanium, amorphous alloy, metal-ceramic composite material (e.g., cermet), stainless steel, magnesium, magnesium alloy, aluminum, aluminum alloy, zinc alloy, or copper alloy. The first rear cover (211) and / or the second rear cover (221) may be substantially opaque. The first rear cover (211) and / or the second rear cover (221) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials. The first rear cover (211) or the second rear cover (221) may comprise, for example, a plate of various materials such as transparent glass, ceramic, or polymer, and at least one coating layer disposed on the plate using a coating. As another example, the first rear cover (211) or the second rear cover (221) may comprise a plate of various materials such as transparent glass, ceramic, or polymer, and a film having various visual effects (e.g., a decoration film) attached to the plate. In some embodiments, the first rear cover (211) and the first side bezel structure (212) may be formed integrally and may comprise the same material. In some embodiments, the second rear cover (221) and the second side bezel structure (222) may be formed integrally and may include the same material.

[0049] According to one embodiment, the hinge assembly may include a hinge housing (40). The hinge housing (40) is an element that covers at least one hinge connecting the first housing (21) and the second housing (22), and in some embodiments may be referred to as a hinge cover. When the electronic device (2) is switched from the folded state of FIG. 3 to the unfolded state of FIG. 2, the hinge housing (400) can cover the interior of the electronic device (2) so that it is not exposed on the folding axis (C) side as the gap (G) between the first housing (21) and the second housing (22) opens. As shown in FIG. 2, in the fully unfolded state of the electronic device (2), the gap (G) may be substantially absent, and the hinge housing (40) may be covered by the first housing (21) and the second housing (22) so that it is not exposed to the outside. Although not illustrated, in an intermediate state, the hinge housing (40) may be partially exposed between the first housing (21) and the second housing (22). The hinge housing (40) may be more exposed in the folded state of FIG. 3 than in the intermediate state.

[0050] According to some embodiments, the foldable housing (20) may refer to a structure (e.g., a foldable housing structure, or a foldable housing assembly) that forms at least a portion of a first surface (20A), a second surface (20B), a first side (20C), and a second side (20D). For example, the foldable housing (20) may include a first housing portion, a second housing portion, and a folding portion connected to the first housing portion and the second housing portion. The folding portion may refer to a portion that is more flexible than the first housing portion and the second housing portion and may bend in a folded state of the electronic device (2). The folding portion may include, for example, a hinge assembly. As another example, the folding portion may include a structure in which a plurality of bars are arranged (e.g., a multi-bar structure), but is not limited thereto, may be implemented in various other structures that have bending characteristics while connecting the first housing portion and the second housing portion.

[0051] According to some embodiments, the electronic device (2) may further include a cover member (not shown) disposed on the front cover (201). The cover member may be located, for example, along the edge of the front cover (201) in the screen-periphery area of ​​the front cover (201). The cover member may reduce damage to the front cover (201) by mitigating the impact between the first housing (21) and the second housing (22) when the electronic device (2) is switched from the unfolded state of FIG. 2 to the folded state of FIG. 3. For example, when the electronic device (2) is switched from the unfolded state of FIG. 2 to the folded state of FIG. 3, a part of the cover member located in the first housing (21) and another part of the cover member located in the second housing (22) come into contact, and the first cover area (①) and the second cover area (②) of the front cover (201) may be positioned close together without contact. The cover member may contribute to aesthetics as a bezel surrounding the screen. In some embodiments, the cover member may be omitted due to screen expansion or may be formed as a cushioning member of various forms.

[0052] According to one embodiment, the electronic device (2) may include a display (hereinafter referred to as a sub-display) (310) located inside the first housing (21) adjacent to the first rear cover (211). A portion of the first rear cover (211) may overlap with the sub-display (310) and may be substantially transparent. The electronic device (2) may output an image using the sub-display (310) instead of the flexible display (30) in the folded state of FIG. 3.

[0053] According to one embodiment, the first rear cover (211) may include a first curved area (211a) that is curved from the third cover area (③) toward the first cover area (①) and extends seamlessly. The first curved area (211a) may be formed adjacent to the long edge of the first rear cover (211) which is substantially parallel to the folding axis (C). The sub-display (310) may include a flexible display that can be arranged in a corresponding form.

[0054] According to one embodiment, the second rear cover (221) may include a second curved area (221a) that is curved and seamlessly extended from the fourth cover area (④) toward the second cover area (②). The second curved area (221a) may be formed adjacent to the long edge of the second rear cover (221) that is substantially parallel to the folding axis (C). For example, in the unfolded state (see FIG. 2) or folded state (see FIG. 3) of the electronic device (2), for aesthetic purposes, the first curved area (211a) and the second curved area (221a) may be positioned substantially symmetrically on opposite sides. In some embodiments, the first curved area (211a) or the second curved area (221a) may be omitted.

[0055] The electronic device (2) may be, for example, the electronic device (101) of FIG. 1, or may include at least one of the components included in the electronic device (101) of FIG. 1. In one embodiment, the electronic device (2) may include an input module (e.g., the input module (150) of FIG. 1), an acoustic output module (e.g., the acoustic output module (155) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), or a connection terminal (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (2) may omit at least one of the components or additionally include other components. The location or number of components included in the electronic device (2) may vary and is not limited to the illustrated examples.

[0056] The input module may include, for example, a microphone located inside the electronic device (2), and a microphone hole (301) formed on a second side (20D) corresponding to the microphone. The location or number of the input module including the microphone and the corresponding microphone hole (301) may vary and are not limited to the illustrated example. In some embodiments, the electronic device (2) may include a plurality of microphones capable of detecting the direction of sound.

[0057] The input module may include, for example, key input devices (302). The key input devices (302) may be located, for example, in an opening (not shown) formed in the first side (20C). In some embodiments, the electronic device (2) may not include some or all of the key input devices (302), and the key input devices not included may be implemented as soft keys using a flexible display (30). In some embodiments, the input module may include at least one sensor module.

[0058] The acoustic output module may include, for example, a speaker located inside the electronic device (2), and a speaker hole (303) formed on a first side (20C) corresponding to the speaker. The location or number of the acoustic output module including the speaker and the corresponding speaker hole (303) may vary and are not limited to the illustrated example. In some embodiments, the microphone hole (301) and the speaker hole (303) may be implemented as a single hole. In some embodiments, a piezo speaker with the speaker hole (303) omitted may be implemented. The acoustic output module may include, for example, a call receiver located inside the electronic device (2), and a receiver hole (not shown) formed on a third cover area (③) corresponding to the call receiver.

[0059] The camera module may include, for example, a first camera module (or front camera module) (305) positioned corresponding to a third cover area (③), or a plurality of second camera modules (or rear camera modules) (306) positioned corresponding to a fourth cover area (④). The first camera module (305) and / or the plurality of second camera modules (306) may include one or more lenses, an image sensor, and / or an image signal processor. The position or number of the first camera module (305) or the plurality of second camera modules (306) may vary and is not limited to the illustrated example.

[0060] According to one embodiment, the sub-display (310) may include an opening aligned with the first camera module (305). External light may reach the first camera module (305) through the first rear cover (211) and the opening of the sub-display (310). In some embodiments, the opening of the sub-display (310) may be formed in the shape of a notch depending on the position of the first camera module (305). In some embodiments, the first camera module (305) may be positioned at the bottom of the sub-display (310) and may perform related functions (e.g., image capture) without the position of the first camera module (305) being visually distinguishable (or exposed). For example, the first camera module (305) may be positioned on the back of the sub-display (310) or below or beneath the sub-display (310) and may include a hidden display back camera (UDC (under display camera)). In some embodiments, the first camera module (305) may be positioned aligned with a recess formed on the back surface of the sub-display (310). The first camera module (305) may be positioned overlapping at least a portion of the screen to acquire an image of an external subject without being visually exposed to the outside. In this case, the portion of the sub-display (310) that overlaps at least a portion with the first camera module (305) may include a different pixel structure and / or wiring structure compared to other areas. For example, the portion of the sub-display (310) that overlaps at least a portion with the first camera module (305) may have a different pixel density compared to other areas. The pixel structure and / or wiring structure formed in the portion of the sub-display (310) that overlaps at least a portion with the first camera module (305) may reduce light loss between the outside and the first camera module (305).In some embodiments, pixels may not be placed in some areas of the sub-display (310) that overlap at least partially with the first camera module (305).

[0061] According to one embodiment, a plurality of camera modules (306) may have different attributes (e.g., angle of view) or functions, and may include, for example, dual cameras or triple cameras. A plurality of second camera modules (306) may include a plurality of camera modules including lenses having different angles of view, and the electronic device (2) may control the change of the angle of view of the camera modules performed in the electronic device (2) based on the user's selection. A plurality of second camera modules (306) may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). In some embodiments, the IR camera may be operated as at least part of a sensor module. The electronic device (2) may include a flash (307) as a light source for a plurality of second camera modules (306). The flash (307) may include, for example, a light-emitting diode or a xenon lamp.

[0062] The sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (2) or an external environmental state. The sensor module may include, for example, at least one of a proximity sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor (e.g., a fingerprint sensor, an HRM sensor), a temperature sensor, a humidity sensor, or an illuminance sensor.

[0063] According to one embodiment, the sensor module may include an optical sensor (308) located inside the electronic device (2) corresponding to a third cover area (③). The optical sensor (308) may include, for example, a proximity sensor or an illuminance sensor. The optical sensor (308) may be aligned with an opening formed in the sub-display (310). External light may enter the optical sensor (308) through the first rear cover (211) and the opening of the sub-display (310). In some embodiments, the optical sensor (308) may be positioned at the bottom of the sub-display (310) and may perform related functions without the position of the optical sensor (308) being visually distinguishable (or exposed). For example, the optical sensor (308) may be positioned on the back of the sub-display (310) or below or beneath the sub-display (310). In some embodiments, the optical sensor (308) may be positioned aligned with a recess formed on the back surface of the sub-display (310). The optical sensor (308) may be positioned overlapping at least a portion of the screen to perform a sensing function without being exposed to the outside. In this case, the portion of the sub-display (310) that overlaps at least a portion with the optical sensor (308) may have a different pixel structure and / or wiring structure compared to other areas. For example, the portion of the sub-display (310) that overlaps at least a portion with the optical sensor (308) may have a different pixel density compared to other areas. In some embodiments, the sensor module may include a fingerprint sensor (not shown) located below the sub-display (310). The fingerprint sensor may be implemented in a capacitive, optical, or ultrasonic manner. The pixel structure and / or wiring structure formed in the portion of the sub-display (310) that overlaps at least a portion with the sensor module may reduce the loss when various forms of signals (e.g., light or ultrasound) associated with the sensor module pass between the outside and the sensor module.In some embodiments, multiple pixels may not be placed in some areas of the sub-display (310) that overlap at least partially with the sensor module.

[0064] The connection terminal may include, for example, a connector (e.g., a USB connector) located inside the electronic device (2). The electronic device (2) may include a connector hole (309) formed on a second side (20D) corresponding to the connector. The electronic device (2) may transmit and / or receive power and / or data to and from an external electronic device electrically connected to the connector through the connector hole (309). The location or number of the connector and the corresponding connector hole (309) may vary and are not limited to the illustrated example.

[0065] According to one embodiment, the electronic device (2) may include a detachable pen input device (50) (e.g., an electronic pen, a digital pen, or a stylus pen). The pen input device (50) may be detachably attached to a hinge housing (40). The hinge housing (40) may include a recess, and the pen input device (50) may be fitted into the recess. The pen input device (50) may be detachably attached to a recess of the hinge housing (40) that is exposed to the outside in a folded state (see FIG. 3) or an intermediate state (see FIG. 4) of the electronic device (2). There may be a gap (40a) that a user uses to detach the pen input device (50) from the hinge housing (40). When the pen input device (50) is placed in the recess of the hinge housing (40), a portion of the surface (50a) of the pen input device (50) can form a portion of the outer surface of the electronic device (2) together with the hinge housing (40) in the folded state (see FIG. 3) or intermediate state (see FIG. 4) of the electronic device (2). When the pen input device (50) is placed in the recess of the hinge housing (40), a portion of the surface (50a) of the pen input device (50) can be smoothly connected to the surface of the hinge housing (40) to contribute to aesthetics.

[0066] According to one embodiment, a housing (hereinafter referred to as a pen housing) forming the exterior of a pen input device (50) may comprise the same material as the hinge housing (40). When the pen input device (50) is placed in a recess of the hinge housing (40), the pen housing may form a portion (50a) of the outer surface of the electronic device (2). In some embodiments, the pen housing may comprise a different material than the hinge housing (40). The pen housing or hinge housing may be formed by ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials. In some embodiments, the pen housing or hinge housing (40) may comprise at least one coating layer (or film layer), and the coating layer may comprise various layers, such as a layer for protection from the outside or a layer for visual effects.

[0067] FIG. 5 is an exploded view of a part of an electronic device (2) in one embodiment. FIG. 6 illustrates a part of an electronic device (2) in relation to FIG. 5 in one embodiment.

[0068] Referring to FIGS. 5 and 6, the electronic device (2) may include a first front case (610), a second front case (620), a hinge assembly (630), a first support plate (641), and / or a second support plate (642). The first front case (610) may include a first side bezel structure (212) and a first support structure (or first support member) (611). The first support structure (611) may be located inside the first housing (21) (see FIG. 2) and may be connected to the first side bezel structure (212) or formed integrally with the first side bezel structure (212). The second front case (620) may include a second side bezel structure (222) and a second support structure (or second support member) (612). The second support structure (612) may be located inside the second housing (22) (see FIG. 2) and may be connected to or formed integrally with the second side bezel structure (222). The first support structure (611) and the second support structure (612) may contribute to the durability or rigidity of the electronic device (2) as frame structures located within the electronic device (2) to withstand loads. The first support structure (611) and / or the second support structure (612) may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer). The first support structure (611) is a part in which components such as a display, a printed circuit board, or a battery are placed within the first housing (21), and may be referred to, for example, as a first bracket or a first mounting plate. The second support structure (612) is a part in which components such as a display, a printed circuit board, or a battery are placed within the second housing (22), and may be referred to, for example, as a second bracket or a second mounting plate.In some embodiments, the first support structure (611) or the first front case (610) may be defined as a component of the first housing (21), and the second support structure (612) or the second front case (620) may be defined as a component of the second housing (22).

[0069] According to one embodiment, a hinge assembly (630) (e.g., a folding part) may include a first hinge (631), a second hinge (632), and / or a hinge housing (40). The first front case (610) and the second front case (620) may be rotatable relative to each other with respect to a rotation axis (e.g., the folding axis (C) of FIG. 2) by the first hinge (631) and the second hinge (632). The first hinge (631) and the second hinge (632) may connect the first support structure (611) and the second support structure (612). The first hinge (631) may include, for example, a first part (or, first hinge arm) (631a) coupled to a first support structure (611), a second part (or, second hinge arm) (631b) coupled to a second support structure (612), and a third part (631c) connected to the first part (631a) and the second part (631b). The first part (631a) and the second part (631b) may be rotatably connected to the third part (631c). In one embodiment, the first part (631a), the second part (631b), and the third part (632c) may be kinetically connected using a gear assembly (or gear structure). The gear assembly may include an assembly in which gears, such as circular gears or conical gears, are engaged with each other, for example, and may enable rotation of the first part (631a) and / or the second part (631b) relative to the third part (632c). The folding axis (C) of FIG. 2 may be substantially formed, for example, by the gear assembly. In one embodiment, the gear assembly may contribute to the first part (631a) and the second part (631b) rotating at the same angle in opposite directions relative to the third part (631c) during a state change of the electronic device (2) (e.g., transition between the unfolded state of FIG. 2 and the folded state of FIG. 3). In some embodiments, a hinge implemented including the gear assembly may be referred to as a gear hinge.The second hinge (632) can be implemented substantially identically to the first hinge (631) and may include a first part (632a), a second part (632b), and a third part (632c). The first front case (610) coupled with the first part (631a) of the first hinge (631) and the first part (632a) of the second hinge (632), and the second front case (620) coupled with the second part (631b) of the first hinge (631) and the second part (632b) of the second hinge (632) may be mutually rotatable around the third part (631c) of the first hinge (631) and the third part (632c) of the second hinge (632). The position or number of hinges may vary and is not limited to the illustrated examples.

[0070] According to one embodiment, the first hinge (631) may include a resilient structure for applying elasticity to the rotation of the first part (631a) relative to the third part (631c), or to the rotation of the second part (621b) relative to the third part (631c). The resilient structure may, for example, apply force to the operation of a gear assembly included in the first hinge (631). The resilient structure may be implemented by including, for example, a torsion spring (631d). The second hinge (632) may include a resilient structure implemented substantially identically to the resilient structure included in the first hinge (631). The elastic structure included in the first hinge (631) and the elastic structure included in the second hinge (632) can apply a force that facilitates a change in the state of the electronic device (2) (e.g., transition between the unfolded state of FIG. 2 and the folded state of FIG. 3) (e.g., semi-automatic state change). For example, due to the elastic structure included in the first hinge (631) and the elastic structure included in the second hinge (632), when the first housing (21) and the second housing (22) change from a first state (e.g., the unfolded state of FIG. 2) forming an angle of about 180 degrees to a state forming an angle smaller than a reference angle (e.g., about 90 degrees), they can automatically change to a second state (e.g., the folded state of FIG. 3) forming an angle between about 0 degrees and 10 degrees without any further external force. For example, due to the elastic structure included in the first hinge (631) and the elastic structure included in the second hinge (632), it can automatically return to the first state when the external force applied thereto is released after changing from the first state (e.g., unfolded state) to a state forming an angle greater than a reference angle (e.g., about 90 degrees).For example, due to the elastic structure included in the first hinge (631) and the elastic structure included in the second hinge (632), when the second state (e.g., the folded state of FIG. 3) is changed to a state forming an angle greater than a reference angle (e.g., about 90 degrees), it can be automatically changed to the first state (e.g., the unfolded state of FIG. 2) without any further external force. For example, after the second state (e.g., the folded state) is changed to a state forming an angle less than or equal to the reference angle, if the external force applied thereto is released, it can be automatically returned to the second state.

[0071] According to one embodiment, the hinge housing (40) may be coupled to a third part (631c) of the first hinge (631) and a third part (632c) of the second hinge (632). The first front case (610) may include a first cover member (651), and the second front case (620) may include a second cover member (652). The first cover member (651) may be connected to the first support structure (611) or formed integrally with the first support structure (611). The second cover member (652) may be connected to the second support structure (612) or formed integrally with the second support structure (612). The first cover member (651) and the second cover member (652) may be formed in a curved shape, for example, including a curved portion corresponding to a curved surface included in the hinge housing (40). In some embodiments, the first cover member (651) may be referred to as the first curved member or the first curved cover, and the second cover member (652) may be referred to as the second curved member or the second curved cover. In the unfolded state of the electronic device (2) (see FIG. 2), the first cover member (651) and the second cover member (652) may cover the hinge housing (40), and the hinge housing (40) may not be substantially exposed to the outside. In the folded state of the electronic device (2) (see FIG. 3), the hinge housing (40) may be exposed to the outside between the first cover member (651) and the second cover member (652).

[0072] According to one embodiment, the hinge housing (40) may include a recess for accommodating a pen input device (50) (see FIG. 4). The recess may be formed so as not to interfere with components included in the electronic device (2). For example, the recess may be located between the first hinge (631) and the second hinge (632). A hinge housing (40) including a recess for accommodating a pen input device (50) will be described below with reference to the drawings.

[0073] According to one embodiment, the first support plate (641) may be coupled to the first support structure (611), and the second support plate (642) may be coupled to the second support structure (612). The first support plate (641) and the second support plate (642) may be positioned between the first hinge (631) and the second hinge (632). For example, in the unfolded state of the electronic device (2) (see FIG. 2), the first support plate (641) and the second support plate (642) may form an angle of approximately 180 degrees. For example, in the folded state of the electronic device (2) (see FIG. 3), the first support plate (641) and the second support plate (642) may be positioned substantially parallel while overlapping and spaced apart. At least one electrical path (800) can electrically connect a first printed circuit board located in a first housing (21) (see FIG. 2) and a second printed circuit board located in a second housing (22) (see FIG. 2). Signals (e.g., commands or data) between the first printed circuit board and the second printed circuit board can be transmitted through at least one electrical path (800). At least one electrical path (800) may include, for example, a flexible printed circuit board (FPCB) or a rigid-flexible printed circuit board (e.g., a rigid-flexible printed circuit board (RFPCB)) extending from the first housing (21) to the second housing (22). At least one electrical path (800) may be coupled to a first support plate (641) and a second support plate (642) and may be supported by the first support plate (641) and the second support plate (642). At least one electrical path (800) may include a second part coupled to the first support plate (641), a third part coupled to the second support plate (642), and a first part between the second part and the third part.The first part may be positioned corresponding to the hinge assembly. The first part may be bent and positioned according to a change in the state of the electronic device (2) (e.g., transition between the unfolded state of FIG. 2 and the folded state of FIG. 3).

[0074] FIG. 7 illustrates a cross-sectional structure (700) for the AA' line in FIG. 2 in one embodiment. FIG. 8 is a partial cross-sectional view relating to a part of the electronic device (2) in relation to FIG. 7 in one embodiment. FIG. 9 illustrates a cross-sectional structure (900) relating to a folded state of the electronic device (2) in relation to FIG. 7 in one embodiment.

[0075] Referring to FIGS. 7, 8, and 9, the electronic device (2) may include a display assembly (300), a first support structure (611), a second support structure (612), a first cover member (651), a second cover member (652), a hinge housing (40), an electrical path (800), a first support plate (641), and / or a second support plate (642).

[0076] A display assembly (300) (see cross-sectional structure (701) for the BB' line in FIG. 7) may include, for example, a flexible display (30), a front cover (201), an optically clear adhesive member (702), an electromagnetic induction panel (703), and / or a support sheet (704). The flexible display (30) may be bonded to the front cover (201) using an optically clear adhesive member (702) (e.g., OCA (optical clear adhesive), OCR (optical clear resin), or SVR (super view resin)). The front cover (201) (e.g., a window) may cover the flexible display (30) to protect the flexible display (30) from the outside. The front cover (201) may be implemented in the form of a flexible thin film (e.g., a thin film layer). The front cover (201) may include, for example, a plastic film (e.g., a polyimide film) or a thin film glass (e.g., an ultrathin glass). In some embodiments, the front cover (201) may include a plurality of layers. For example, the front cover (201) may be in the form of various coating layers disposed on a plastic film or thin film glass. For example, the front cover (201) may be in the form of at least one protective layer or coating layer comprising a polymer material (e.g., PET (polyester), PI (polyimide), or TPU (thermoplastic polyurethane)) disposed on a plastic film or thin film glass.

[0077] A flexible display (30) may include, for example, a display panel (31), a base film (32), a lower panel (33), or an optical layer (34). The display panel (31) may be positioned between the optical layer (34) and the base film (32). The base film (32) may be positioned between the display panel (31) and the lower panel (33). The optical layer (34) may be positioned between an optical transparent adhesive member (702) and the display panel (31). An adhesive member (not shown) of various polymers may be disposed between the display panel (31) and the base film (32), between the base film (32) and the lower panel (33), and / or between the display panel (31) and the optical layer (34). The display panel (31) may include, for example, a light-emitting layer (31a), a thin film transistor (TFT) film (31b), and / or an encapsulation layer (e.g., thin-film encapsulation (TFE)) (31c). The light-emitting layer (31a) may include a plurality of pixels implemented as light-emitting elements, such as an OLED or a micro LED. The light-emitting layer (31a) may be placed on the TFT film (31b) via organic evaporation. The TFT film (31b) may be positioned between the light-emitting layer (31a) and the base film (32). The TFT film (31b) may refer to a film structure in which at least one TFT is placed on a flexible substrate (e.g., a PI film) through a series of processes such as deposition, patterning, and etching. At least one TFT can control the current to the light-emitting element of the light-emitting layer (31a) to turn the pixel on or off, or control the brightness of the pixel.At least one TFT may be implemented as, for example, an a-Si (amorphous silicon) TFT, an LCP (liquid crystalline polymer) TFT, an LTPO (low-temperature polycrystalline oxide) TFT, or an LTPS (low-temperature polycrystalline silicon) TFT. The display panel (31) may include a storage capacitor, and the storage capacitor may maintain a voltage signal to a pixel, maintain the voltage applied to the pixel within one frame, or reduce changes in the gate voltage of the TFT due to leakage current during the light emission time. By a routine controlling at least one TFT (e.g., initialization, data write), the storage capacitor may maintain the voltage applied to the pixel at regular time intervals. In one embodiment, the display panel (31) may be implemented based on an OLED, and the encapsulation layer (31c) may cover the light-emitting layer (31a). The light-emitting organic material and electrodes in the OLED may react very sensitively to oxygen and / or moisture and lose their light-emitting properties. The encapsulation layer (31c) can seal the light-emitting layer (31a) to prevent oxygen and / or moisture from penetrating into the OLED. The base film (32) may comprise a flexible film formed of a polymer or plastic, such as polyimide or polyester (PET). The base film (32) may serve to support and protect the display panel (31). In some embodiments, the base film (32) may be referred to as a protective film, a back film, or a back plate.

[0078] The lower panel (33) may include a plurality of layers for various functions. An adhesive member (not shown) of various polymers may be disposed between the plurality of layers included in the lower panel (33). The lower panel (33) may include, for example, a light-blocking layer (33a), a buffer layer (33b), or a lower layer (33c). The light-blocking layer (33a) may be located between the base film (32) and the buffer layer (33b). The buffer layer (33b) may be located between the light-blocking layer (33a) and the lower layer (33c). The light-blocking layer (33a) may block at least some of the light incident from the outside. For example, the light-blocking layer (33a) may include an embo layer. The embo layer may be a black layer containing a bumpy pattern. The buffer layer (33b) may mitigate external shocks applied to the flexible display (30). For example, the buffer layer (33b) may include a sponge layer or a cushion layer. The lower layer (33c) may diffuse, disperse, or dissipate heat generated in the electronic device (2) or the flexible display (30). The lower layer (33c) may absorb or shield electromagnetic waves. The lower layer (33c) may mitigate external shocks applied to the electronic device (2) or the flexible display (30). For example, the lower layer (33c) may include a composite sheet (33d) or a conductive sheet (33e). In one embodiment, the composite sheet (33d) may be a sheet processed by combining layers or sheets of different properties. For example, the composite sheet (33d) may include at least one of polyimide or graphite. The composite sheet (33d) may be replaced with a single sheet comprising one material (e.g., polyimide or graphite). The composite sheet (33d) can be positioned between the buffer layer (33b) and the conductive sheet (33e).The conductive sheet (33e) can serve as a shield for electromagnetic interference (EMI) for the flexible display (30). The conductive sheet (33e) may include various other metallic materials (e.g., copper). In some embodiments, at least a portion of the lower layer (33c) may be a conductive member (e.g., a metal plate) to help reinforce the rigidity of the electronic device (2), shield ambient noise, and dissipate heat emitted from surrounding heat dissipation components (e.g., a display driving circuit (e.g., a DDI)). The conductive member may include, for example, at least one of copper (Cu(copper)), aluminum (Al(aluminum)), stainless steel (SUS), or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). The lower layer (33c) may include various layers for various other functions. According to various embodiments (not shown), at least one additional polymer layer (e.g., a layer including PI, PET, or TPU) may be disposed on the back surface of the display panel (31) in addition to the base film (32). In various embodiments, at least one of the plurality of layers included in the lower panel (33) (e.g., a light-blocking layer (33a), a buffer layer (33b), a composite sheet (33d), and a conductive sheet (33e)) may be omitted. In various embodiments, the arrangement order of the plurality of layers included in the lower panel (33) may be varied and is not limited to the illustrated example.

[0079] The optical layer (34) may include, for example, a polarizing layer (or polarizer) or a retardation layer (or retarder). The polarizing layer and the retardation layer may improve the outdoor visibility of the screen. The optical layer (34) may selectively pass light that vibrates in a certain direction, for example, generated from a light source of the display panel (31). In some embodiments, a single layer combining the polarizing layer and the retardation layer may be provided, and this layer may be defined as a 'circularly polarized layer'. An optically transparent adhesive member (36) may be positioned between the front cover (201) and the optical layer (34). In some embodiments, the polarizing layer (or circularly polarized layer) may be omitted, in which case a black pixel define layer (PDL) and / or a color filter may be included in place of the polarizing layer.

[0080] The display assembly (300) may include a touch detection circuit (e.g., a touch sensor) (not shown). The touch detection circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO). In one embodiment, the touch detection circuit may be placed between the front cover (201) and the optical layer (34) (e.g., add-on type). In another embodiment, the touch detection circuit may be placed between the optical layer (34) and the display panel (31) (e.g., on-cell type). In another embodiment, the display panel (31) may include a touch detection circuit or a touch detection function (e.g., in-cell type). In some embodiments, the display panel (31) may be based on an OLED and may include an encapsulation layer (31c) placed between the light-emitting layer (31a) and the optical layer (34). The encapsulation layer (31c) may serve as a pixel protection layer to protect a plurality of pixels of the light-emitting layer (31a). In one embodiment (not shown), the flexible display (30) may include a conductive pattern, such as a metal mesh (e.g., aluminum metal mesh), as a touch sensing circuit disposed in the encapsulation layer (31c) between the encapsulation layer (31c) and the optical layer (34). For example, in response to the bending of the flexible display (30), the metal mesh may have greater durability than a transparent conductive layer implemented with ITO. In some embodiments, the flexible display (30) may further include a pressure sensor (not shown) capable of measuring the intensity (pressure) of the touch. The plurality of layers included in the display panel (31) or the lower panel (33), their stacking structure or stacking order may vary. The flexible display (30) may be implemented by omitting some of the components or adding other components, depending on the provided form or convergence trend.

[0081] According to one embodiment, an electromagnetic induction panel (e.g., a digitizer) (703) may be positioned between a buffer layer (33b) and a lower layer (33c). In some embodiments, the electromagnetic induction panel (703) may be positioned between a composite sheet (33d) and a conductive sheet (33e) of the lower layer (33c). In some embodiments, the electromagnetic induction panel (703) may be positioned between a light-blocking layer (33a) and a buffer layer (33b). The electromagnetic induction panel (703) may be implemented in a form such as a flexible film or a flexible sheet. The electromagnetic induction panel (703) may be formed, for example, as a flexible printed circuit board. When alternating current is supplied to the electromagnetic induction panel (703), an electromagnetic field may be formed by a plurality of electrode patterns included in the electromagnetic induction panel (703). The pen input device (50) can be implemented using an electromagnetic induction method (e.g., an electromagnetic resonance (EMR) method). The pen input device (50) includes a resonant circuit, and the resonant circuit can be coupled with an electromagnetic induction panel (703). When the pen tip of the pen input device (50) is brought close to the first surface (20A) of the electronic device (2), current can flow through the coil included in the resonant circuit of the pen input device (50) by electromagnetic induction. The coil included in the resonant circuit of the pen input device (50) can be implemented, for example, as a flexible printed circuit board. The pen input device (50) can use energy supplied from the electromagnetic induction panel (703) to generate a signal (e.g., a radio frequency signal) (e.g., a position signal, a pressure signal, and / or an angle signal) regarding user input on the screen and transmit it to the screen (e.g., the electromagnetic induction panel (703)). The electromagnetic induction panel (703) may include a shielding sheet. The shielding sheet may be positioned on the back side of a flexible printed circuit board having a plurality of electrode patterns (e.g., in the illustrated embodiment, the side of the flexible printed circuit board facing the conductive sheet (33e)).The shielding sheet can prevent interference between the components by means of electromagnetic fields generated from the components included in the electronic device (2). By blocking the electromagnetic fields generated from the components, the shielding sheet can ensure that input from the pen input device (50) is accurately transmitted to the coil included in the electromagnetic induction panel (703). In some embodiments, the electromagnetic induction panel (703) may be defined as a part of the flexible display (30). According to some embodiments, the pen input device (50) may be implemented using an active electrical stylus (AES) method or an electric coupled resonance (ECR) method. In this case, the electromagnetic induction panel (703) may be omitted.

[0082] According to various embodiments, a display assembly including a sub-display (310) (see FIG. 2 or 3) may be positioned corresponding to a third cover area (③) and may be implemented to include at least a portion of the display assembly (300). In some embodiments, the display assembly including the sub-display (310) may be implemented by omitting some of the components included in the cross-sectional structure (701) or by adding one or more other components.

[0083] According to one embodiment, the pen input device (50) may include a pen tip sensor. The pen tip sensor may include, for example, a pen tip and may serve as a pointer indicating the position (or coordinates) of the pen input device (50) and as a pen pressure detector detecting pen pressure (or pressure sensitivity) (e.g., the degree of force applied to control the thickness of a line). When user input is performed on the screen of an electronic device (2) using the pen input device (50), the pen tip sensor may indicate the part where the position signal and pen pressure signal are generated on the screen. A processor (e.g., the processor (120) of FIG. 1) may receive the position signal and pen pressure signal generated by the pen tip sensor through the screen to determine the position (coordinates) and pen pressure of the user input on the screen. In one embodiment, the pen tip sensor may generate an angle signal, and the processor may receive the angle signal from the pen tip sensor through the screen to determine the angle of the pen input device relative to the screen. The pen tip sensor can be implemented in various ways capable of generating signals regarding user input on the screen (e.g., position signal, pressure signal, and / or angle signal). Hereinafter, in this document, the part of the electronic device (2) excluding the pen input device (50) may be referred to as a host device for interacting with the pen input device (50) and is not referred to by a separate reference numeral.

[0084] According to one embodiment, a pen tip sensor may be implemented to generate a signal (e.g., position signal, pressure signal, and / or angle signal) regarding user input on the screen of a host device by receiving energy from the screen when user input is performed on the screen of a host device using a pen input device (50). The pen tip sensor may operate by an electromagnetic induction method (e.g., EMR method) and may include, for example, a core (e.g., a magnetic material or ferrite) connected to the pen tip and a coil disposed in the core. When alternating current is supplied to the electromagnetic induction panel (703) of the host device, the electromagnetic induction panel (703) may form a magnetic field on the screen. When the pen tip sensor is brought close to the screen of the host device, current may flow through the coil of the pen tip sensor by electromagnetic induction. A signal (e.g., position signal, pressure signal, and / or angle signal) regarding user input on the screen may be generated in the pen tip sensor using the energy supplied from the electromagnetic induction panel (703).

[0085] According to some embodiments, the pen tip sensor may be implemented to generate an electrostatic signal (e.g., position signal, pressure signal, and / or angle signal) regarding user input on the screen using power from a battery included in the pen input device (50). For example, the pen tip sensor may generate an electrostatic signal regarding user input (e.g., a signal distinct from the user's hand or finger) using power from a battery included in the pen input device (50) (e.g., AES method). In some embodiments, the pen tip sensor may transmit or receive various communication signals, such as the degree of identification regarding the host device, through the screen. In an embodiment where the pen tip sensor generates an electrostatic signal using power from a battery included in the pen input device (50), the electromagnetic induction panel (703) of the host device may be omitted. In various embodiments, the pen tip sensor may be implemented in various other ways to generate a signal regarding user input on the screen (e.g., position signal, pressure signal, and / or angle signal).

[0086] According to one embodiment, when user input is performed on the screen of a host device using a pen input device (50), the pen tip may move to apply pressure to a pressure switch included in the pen input device (50). The pen input device (50) may generate a pressure signal based on a signal detected by the pressure switch. In some embodiments, when user input is performed on the screen of a host device using a pen input device (50), a change in capacitance may occur, and a pressure signal may be generated based on this change in capacitance. The change in capacitance may occur when the pen tip moves.

[0087] According to one embodiment, the pen input device (50) may be equipped with various components that support charging, communication, and / or sensor functions. For example, the pen input device (50) may include various sensor modules such as a wireless communication module (e.g., a Bluetooth communication module) or a motion sensor. In one embodiment, the pen input device (50) may be equipped with a first communication controller configured to perform first wireless communication with a host device through a pen tip sensor. For example, when user input is performed on the screen of a host device using the pen input device (50), the first communication controller may transmit radio frequency signals regarding a position signal, a pressure signal, and / or an angle signal to the screen of the host device through the pen tip sensor.

[0088] When user input is performed on the screen of a host device using a pen input device (50), the pen tip sensor receives a magnetic field coming from the screen of the host device and generates a current, and a first communication controller (e.g., an EMR communication controller) can use the generated current to generate a radio frequency signal related to a position signal, a pen pressure signal, and / or an angle signal through the pen tip sensor and transmit it to the screen of the host device. According to another embodiment, when user input is performed on the screen of a host device using a pen input device (50), the pen tip sensor can receive a signal coming from a touch detection circuit (e.g., a touch screen panel (TSP)) of a flexible display (30) and generate a current. The first communication controller can use the generated current to generate a transmission signal through the pen tip sensor and transmit it to the host device. In some embodiments, the pen tip sensor may be implemented to perform a first wireless communication that receives a signal coming from the screen of the host device to generate a current and uses the generated current to transmit a transmission signal (Tx signal) to the host device. For example, the pen tip sensor can generate current using a signal coming through the electromagnetic induction panel (703) or the touch detection circuit of the flexible display (30), and can transmit a transmission signal to a host device using the generated current.

[0089] According to one embodiment, the pen input device (50) may include at least one antenna and a second communication controller configured to perform second wireless communication with a host device through at least one antenna. The second wireless communication may include short-range communication, for example, Bluetooth Low Energy (BLE) communication or Near Field Communication (NFC). In some embodiments, a signal from a motion sensor included in the pen input device (50) may be transmitted to the host device via the first wireless communication or the second wireless communication.

[0090] According to one embodiment, the pen input device (50) may include a button exposed to the outside. For example, when the button is pressed by an external force, a corresponding signal may be generated. The input device included in the pen input device (50) may be implemented in various other ways. For example, the input device may be implemented based on various user input detection elements, such as a pressure sensor, a touch sensor, or an ultrasonic sensor capable of detecting user input. In various embodiments, the button may include a user input detection element based on a pressure sensor, a touch sensor, an optical sensor, a strain gauge, or a magnetic material.

[0091] According to one embodiment, the pen input device (50) may include a power management controller. The power management controller can charge the battery included in the pen input device (50) by wirelessly receiving power (or a charging signal) from the host device when the pen input device (50) is attached to the hinge housing (40) of the host device. The power management controller can charge the battery included in the pen input device (50) by wirelessly receiving a charging signal from the host device through a pen tip sensor when the pen input device (50) is attached to the host device. For example, when the pen input device (50) is attached to the host device, if a magnetic field flowing through the antenna (e.g., coil) of the host device is applied to the coil of the pen input device (50), an induced current flows in the coil of the pen input device (50), and the power management controller can charge the battery of the pen input device (50) using this induced current.

[0092] According to one embodiment, the support sheet (704) may be attached to the back surface of the lower panel (33) by covering at least a portion of the lower panel (33) of the flexible display (30). The support sheet (704) may contribute to the durability of the display assembly (300) or the flexible display (30). The support sheet (704) may reduce the effect of load or stress on the flexible display (30) that may occur during the transition between the unfolded state of FIG. 2 and the folded state of FIG. 3, for example. The support sheet (704) may be formed from various metallic materials and / or non-metallic materials (e.g., polymers). The support sheet (704) may include, for example, stainless steel. As another example, the support sheet (704) may include engineering plastic. In some embodiments, the support sheet (704) may be implemented integrally with the flexible display (30). In some embodiments, the support sheet (704) may be omitted.

[0093] According to one embodiment, the support sheet (704) may include a lattice structure formed in a portion corresponding to the folding cover area (F) (see FIG. 2). The lattice structure may include, for example, a plurality of openings (or slits). For example, the plurality of openings may be formed periodically, have substantially the same shape, and be arranged repeatedly at regular intervals. The lattice structure may contribute to the flexibility of a portion of the display assembly (300) corresponding to the folding cover area (F). In some embodiments, the support sheet (704) may include a recess pattern (not shown) comprising a plurality of recesses, instead of the lattice structure. In various embodiments, the lattice structure or recess pattern contributing to the flexibility of the flexible display (30) may be further extended to other portions. In some embodiments, the support sheet (704) including the lattice structure or recess pattern, or the corresponding conductive member, may be formed in a plurality of layers.

[0094] According to one embodiment, a part of the display assembly (300) may be placed on one side (611a) of the first support structure (611), and another part of the display assembly (300) may be placed on one side (612a) of the second support structure (612). For example, the display assembly (300) may be combined with the first support structure (611) and the second support structure (612) using a thermal adhesive material, a photoreactive adhesive material, a general adhesive and / or double-sided tape.

[0095] According to one embodiment, a first support plate (641) coupled with a first support structure (611) and a second support plate (642) coupled with a second support structure (612) can support a portion of a display assembly (300) corresponding to a folding cover area (F) in an open state of the electronic device (2) (see FIG. 2).

[0096] According to one embodiment, the host device may include a first printed circuit board (e.g., PCB or PBA) disposed on the other side (611b) of the first support structure (611) between the first support structure (611) and the first rear cover (211) (see FIG. 2). The host device may include a first battery disposed on the other side (611b) of the first support structure (611) between the first support structure (611) and the first rear cover (211) (see FIG. 2).

[0097] According to one embodiment, the host device may include a second printed circuit board (e.g., PCB or PBA) disposed on the other side (612b) of the second support structure (612) between the second support structure (612) and the second rear cover (221) (see FIG. 2). The host device may include a second battery disposed on the other side (612b) of the second support structure (612) between the second support structure (612) and the second rear cover (221) (see FIG. 2).

[0098] According to some embodiments, a first printed circuit board placed on a first support structure (611) or a second printed circuit board placed on a second support structure (612) may include a main PCB, a slave PCB placed partially overlapping with the main PCB, and / or an interposer substrate between the main PCB and the slave PCB.

[0099] According to one embodiment, the electrical path (800) can electrically connect a first printed circuit board placed on a first support structure (611) and a second printed circuit board placed on a second support structure (612). For example, one end (801) of the electrical path (800) may include a first connector for electrically connecting to the first printed circuit board, and the other end (802) of the electrical path (800) may include a second connector for electrically connecting to the second printed circuit board.

[0100] According to one embodiment, the electrical path (800) may include a first portion (811) corresponding to a folding cover area (F), a second portion (812) extending from the first portion (811) to a first housing (21) (see FIG. 2), and a third portion (813) extending from the first portion (811) to a second housing (22) (see FIG. 2). The first portion (811) may be flexible and may be bent and positioned according to a change in the state of the electronic device (2) (e.g., transition between the unfolded state of FIG. 2 and the folded state of FIG. 3). The second portion (812) may be coupled to a first support plate (641) using a first adhesive member (818) of various polymers. The third part (813) can be combined with the second support plate (642) using a second adhesive member (819) of various polymers.

[0101] According to one embodiment, a portion (812a) of the second part (812) that is coupled to the first support plate (641) may be substantially rigid, and another portion of the second part (812) may be flexible. A portion (813a) of the third part (813) that is coupled to the second support plate (642) may be substantially rigid, and another portion of the third part (813) may be flexible. For example, the electrical path (800) may be in a form including a flexible part and a rigid part, or in a form including a plurality of parts having different flexibilities, for example, a flexible printed circuit board (FPCB) or a rigid-flexible printed circuit board (RFPCB).

[0102] According to one embodiment, the hinge housing (40) may include a first recess (401). The first recess (401) may include a recessed space to accommodate a pen input device (50). For example, when the first cover member (651) and the second cover member (652) are positioned so as not to cover the first recess (401), as in the folded state of the electronic device (2) (see FIG. 9), the first recess (401) may be exposed to the outside to enable insertion of the pen input device (50).

[0103] According to one embodiment, the hinge housing (40) may include a second recess (402) separated from the first recess (401). The hinge housing (40) may include a third recess (403) separated from the first recess (401). The second recess (402) and the third recess (403) may be located inside the host device and not exposed to the outside. The hinge housing (40) may include a first wall (411) between the first recess (401) and the second recess (402). The first recess (or first space) (401) and the second recess (or second space) (402) may be separated by the first wall (411). The hinge housing (40) may include a second wall (412) between the first recess (401) and the third recess (403). The first recess (or first space) (401) and the third recess (or third space) (403) may be separated by the second wall (412). The first wall (411) and the second wall (412) may face each other with the first recess (401) in between. The hinge housing (40) may include a third wall (413) connecting the first wall (411) and the second wall (412). When the pen input device (50) is placed in the first recess (401), some area of ​​the lateral surface of the pen input device (50) (e.g., see reference numeral '50a' in FIG. 4) may be exposed to the outside to form the outer surface of the electronic device (2) together with the hinge housing (40), and other area of ​​the lateral surface of the pen input device (50) may face the first wall (411), the second wall (412), and the third wall (413). The pen input device (50) may include a pen shape including a front part containing a pen tip and a rear part extending from the front part. The lateral surface of the pen input device (50) may refer to a surface that, for example, at least partially surrounds the space between the front part and the rear part.The hinge housing (40) may include a fourth wall (414) corresponding to the rear portion of the pen input device (50) and a fifth wall (not shown) corresponding to the front portion of the pen input device (50). The first recess (401) may be formed by the first wall (411), the second wall (412), the third wall (413), the fourth wall (415), and the fifth wall. The shape of the first recess (401) may vary depending on the appearance of the pen input device (50), and accordingly, the first wall (411), the second wall (412), the third wall (413), the fourth wall (415), or the fifth wall may vary and are not limited to the illustrated examples. For example, the connection between the first wall (411) and the third wall (413), or the connection between the second wall (412) and the third wall (413), may be curved.

[0104] According to one embodiment, a first region (ⓐ) of a first part (811) of an electrical path (800) may face a third wall (413) of a hinge housing (40). In some embodiments, the first region (ⓐ) may be bonded to the third wall (413) using an adhesive material. The adhesive material may include, for example, a thermoreactive adhesive material, a photoreactive adhesive material, a general adhesive, and / or double-sided tape.

[0105] According to some embodiments, the first region (ⓐ) of the first part (811) of the electrical path (800) may be substantially rigid.

[0106] According to some embodiments, in the unfolded state of the electronic device (2) (see FIG. 8), the first support plate (641) or the second support plate (642) may be formed so as not to overlap at least partially with the first portion (811) of the electrical path (800). For example, the first support plate (641) or the second support plate (642) may include a notch-shaped opening corresponding to the first portion (811) of the electrical path (800).

[0107] According to one embodiment, the second region (ⓑ) of the first part (811) of the electrical path (800) may be positioned in a form inserted into the second recess (402) in the unfolded state of the electronic device (2) (see FIG. 7 and 8). In the folded state of the electronic device (2) (see FIG. 9), the second region (ⓑ) of the first part (811) of the electrical path (800) may be positioned out of the second recess (402) in correspondence with the positional relationship between the first support plate (641) and the second support plate (642) and in a form different from that in the unfolded state of the electronic device (2). The third region (ⓒ) of the first part (811) of the electrical path (800) may be positioned in a form inserted into the third recess (403) in the unfolded state of the electronic device (2) (see FIG. 7 and 8). In the folded state of the electronic device (2) (see FIG. 9), the third region (ⓒ) of the first part (811) of the electrical path (800) may be positioned outside the third recess (403) in correspondence with the positional relationship of the first support plate (641) and the second support plate (642) and arranged in a different form than in the unfolded state of the electronic device (2).

[0108] According to one embodiment, a first buffer member (641a) may be disposed on the first support plate (641) to reduce the stress effect on the second part (812) of the electrical path (800) during a state change of the electronic device (2) (e.g., transition between an unfolded state and a folded state). A second buffer member (642a) may be disposed on the second support plate (642) to reduce the stress effect on the third part (813) of the electrical path (800) during a state change of the electronic device (2).

[0109] FIG. 10 illustrates, in one embodiment, a state in which a pen input device (50) is placed on an electronic device (2) and a cross-sectional structure (1000) regarding the same.

[0110] Referring to FIG. 10, in one embodiment, the pen input device (50) may include a front portion (1011) including a pen tip (1013) and a rear portion (1012) including an elastic structure. The front portion (1011) may be inserted into a groove structure formed in a first recess (401) of the hinge housing (40). The elastic structure included in the rear portion (1012) may contribute to maintaining the pen input device (50) in a positioned state within the first recess (401) of the hinge housing (40). The elastic structure may contribute to preventing the pen input device (50) from being separated from the first recess (401) of the hinge housing (40) due to unintended external forces (e.g., external impact). The pen input device (50) may include a pen housing (1010) that forms at least a portion of the exterior. The pen housing (1010) may include, for example, a straight, extended tubular housing or a unibody form. The pen housing (1010) may be formed from various materials such as ceramic, polymer, or metal and may be substantially rigid. The pen housing (1010) may be implemented in various other forms. In one embodiment, an elastic structure included in the rear portion (1012) of the pen input device (50) may include an elastic member (e.g., a compression spring) (1020) located within the pen housing (1010), and a pressure member (e.g., a ball) (1030) elastically supported by the elastic member (1020) in correspondence with an opening (not shown) of the pen housing (1010). The pressure member (1030) supported by the elastic member (1020) may elastically contact the fourth wall (814) of the hinge housing (40). A recess that can be fitted with a pressure member (1030) may be formed in the fourth wall (814). The pressure member (1030) elastically presses the fourth wall (814) so ​​that the pen input device (50) is not separated from the first recess (401) due to an unintended external force (e.g., external impact).By applying force so that the pressure member (1030), which is elastically supported by the elastic member (1020), is separated from the fourth wall (814), the pen input device (50) can be separated from the first recess (401).

[0111] FIG. 11 illustrates a pen input device (1100) according to another embodiment.

[0112] Referring to FIG. 11, the pen input device (1100) may be implemented to allow for a reduction in length. In one embodiment, the pen input device (1100) may include a first pen housing (1110) and a second pen housing (1120) that can be retracted into the interior of the first pen housing (1110). A pen tip (1113) may be positioned in the second pen housing (1120). Between the first pen housing (1110) and the second pen housing (1120), a withdrawal holding structure may be included that allows the second pen housing (1120) to be withdrawn from the first pen housing (1110) without separation and maintains the withdrawn state. The withdrawal holding structure may be implemented in various ways, such as a friction structure or a fastening structure between the first pen housing (1110) and the second pen housing (1120). A pen input device (1100) with a retractable length can facilitate securing the first recess (401) (see FIG. 7, 8, or 9) without interference with components around the first recess (40) (e.g., the first hinge (631) and the second hinge (632) of FIG. 5), thereby contributing to space efficiency or space utilization.

[0113] FIG. 12 illustrates, in one embodiment, a state in which the pen input device (1100) of FIG. 11 is placed in an electronic device (2) and a cross-sectional structure (1200) regarding the same.

[0114] Referring to FIG. 12, in one embodiment, the pen input device (1100) may include an elastic member (1130) (e.g., a compression spring) located inside the first pen housing (1110). The elastic member (1130) may elastically support the second pen housing (1120) between the inside of the first pen housing (1110) and the second pen housing (1120). When the pen input device (1100) with the second pen housing (1120) inserted into the interior of the first pen housing (1110) is placed in the first recess (401) of the hinge housing (40), the elastic structure using the elastic member (1130) between the first pen housing (1110) and the second pen housing (1120) can contribute to maintaining the state in which the pen input device (1100) is placed in the first recess (401) of the hinge housing (40).

[0115] FIG. 13 illustrates, in another embodiment, a state in which the pen input device (1100) of FIG. 11 is placed on an electronic device (2) and a cross-sectional structure (1300) relating thereto. FIG. 14 relates to another embodiment that modifies or alters the example of FIG. 13 and illustrates a cross-sectional structure (1400) for the part indicated by the reference numeral 'D'.

[0116] Referring to FIG. 13, in one embodiment, the hinge housing (40) may include a resilient structure (1301) that resiliently supports one side (1101) of the pen input device (1100). The resilient structure (1301) may contribute to maintaining the pen input device (1100) in a positioned in a first recess (401) of the hinge housing (40). The resilient structure (1301) may include, for example, a pressure member (1310) and an elastic member (1320) (e.g., a compression spring). The pressure member (1310) may resiliently support one side (1101) of the pen input device (1100) by the elastic member (1320). In some embodiments, the resilient structure (1301) may be implemented in the hinge housing (40) to resiliently support the other side (1102) of the pen input device (1100). In various embodiments, the elastic structure (1301) can be applied to a hinge housing (40) for a pen input device that is not shortened in length.

[0117] In some embodiments, referring to FIG. 14, the boundary (1401) between the other side (1102) of the pen input device (1100) and the fourth wall (814) of the hinge housing (40) may be formed at an angle so as to interfere with the fourth wall (814) in a direction in which the other side (1102) is separated outward from the first recess (401). The boundary (1401) may contribute to preventing the pen input device (50) from being separated from the first recess (401) of the hinge housing (40) due to unintended external forces (e.g., external impact). In various embodiments, an example of preventing separation of the pen input device (50) using the boundary (1401) may be applied to the example of FIG. 10 or FIG. 12.

[0118] There may be various other ways to reduce the separation of the pen input device (50) from the first recess (401) of the hinge housing (40) due to unintended external forces (e.g., external impact). For example, the pen input device (1100) can be placed in the first recess (401) of the hinge housing (40) by utilizing the attractive force between magnets.

[0119] FIGS. 15 and 16 illustrate cross-sectional structures (1500, 1600) relating to other embodiments that modify or alter the example of FIG. 13.

[0120] Referring to FIG. 15, one side (1101) of the pen input device (1100) may be elastically supported by an elastic structure (1301) included in the hinge housing (40). In one embodiment, a cam assembly (1501) corresponding to the other side (1102) of the pen input device (1100) may be located in the hinge housing (40). The cam assembly (1501) may include, for example, a motor (1510) and a cam (1520) connected to the rotation axis (1511) of the motor (1510). The other side (1102) of the pen input device (1100) may include a guide groove structure (1502) capable of interacting with the cam (1520). When the pen input device (1100) is placed in the first recess (401) of the hinge housing (40), the electronic device (2) (see FIG. 2) can control the motor (1510) to rotate the cam (1520) so that there is interference between the cam (1520) and the groove structure (1502) in a direction in which the other side (1102) of the pen input device (1100) is separated from the first recess (401) outwardly. The interference (e.g., lock state) between the cam (1520) and the guide groove structure (1502) can contribute to preventing the pen input device (1100) from being separated from the first recess (401) due to an unintended external force (e.g., external impact). The electronic device (2) may include a motor driving circuit (e.g., a motor controller or a motor driver) electrically connected to the motor (1510). The motor driving circuit can control the motor (1510) based on a control signal received from a processor (e.g., the processor (120) of FIG. 1). The motor driving circuit may include a motor encoder for detecting the driving state of the motor (1510).The motor encoder may include, for example, a disc coupled to the rotation axis (1511) of the motor (1510), and a detector capable of detecting the rotation direction, rotation angle, rotation amount, rotation speed, rotation acceleration, or rotation angular velocity of the rotation axis by electronically recognizable scales and markings on the disc. The processor may control the motor drive circuit based on instructions stored in memory (e.g., memory (130) of FIG. 1).

[0121] According to one embodiment, a power management controller of a pen input device (1100) can determine whether a wireless charging signal is transmitted from an electronic device (e.g., a host device) (2) (see FIG. 2). When the pen input device (1100) is placed in the first recess (401) of the hinge housing (40), the pen input device (1100) can detect a wireless charging signal from a magnetic field generating device (e.g., a charging coil) of the electronic device (2) through a pen tip sensor. When the electronic device (2) transmits a wireless charging signal to the pen input device (1100) (e.g., when wireless charging is performed), the state in which the pen input device (1100) is placed in the first recess (401) of the hinge housing (40) can be detected.

[0122] According to some embodiments, the state in which the pen input device (1100) is attached to the hinge housing (40) can be detected using at least one sensor included in the electronic device (2) or the pen input device (1100). For example, the pen input device (1100) can be attached to the first recess (401) of the hinge housing (40) using a magnet. Based on the magnetic force detected using at least one sensor included in the pen input device (1100) or the electronic device (2), the state in which the pen input device (1100) is placed in the first recess (401) of the hinge housing (40) can be detected.

[0123] According to one embodiment, when there is a specified user input, the electronic device (2) (see FIG. 2) can control the motor (1510) to rotate the cam (1520) so that there is substantially no interference between the cam (1520) and the guide groove structure (1502) in a direction in which the other side (1102) of the pen input device (1100) is separated from the first recess (401). When there is substantially no interference between the cam (1520) and the guide groove structure (1502) (e.g., unlocked state), an external force can be applied to the other side (1102) of the pen input device (1100) so that the pen input device (1100) is separated from the first recess (401). The specified user input can be detected through various means, such as a screen or a button. In one embodiment, referring to FIG. 16, due to the interaction between the cam (1520) and the guide groove structure (1502), the other end (1102) of the pen input device (1100) may come out of or protrude from the first recess (401), thereby facilitating the separation of the pen input device (1100). When a designated user input is detected in a state where the pen input device (1100) is not exposed to the outside or in a state where it is difficult to separate the pen input device (1100) to the outside (e.g., the unfolded state of FIG. 2), the electronic device (2) may output information regarding the state through an output module (e.g., a screen or speaker) to induce a transition to another state (e.g., the folded state of FIG. 3).

[0124] According to one embodiment of the present document, an electronic device (e.g., the electronic device (2) of FIG. 2) may include a first housing (e.g., the first housing (21) of FIG. 2), a second housing (e.g., the second housing (22) of FIG. 2), and a foldable housing (e.g., the foldable housing (20) of FIG. 2) including a folding portion between the first housing and the second housing. The electronic device may include a pen input device (e.g., the pen input device (50) of FIG. 4) that is detachable from the folding portion. The folding portion may include a first hinge (e.g., the first hinge (631) of FIG. 5) and a second hinge (e.g., the second hinge (632) of FIG. 5) connecting the first housing and the second housing, and a hinge housing (e.g., the hinge housing (40) of FIG. 5) that covers the first hinge and the second hinge and forms a part of the outer surface of the electronic device. The hinge housing may include a first recess (e.g., the first recess (401) of FIG. 7), and the first recess may be located between the first hinge and the second hinge. The pen input device may be inserted into the first recess.

[0125] According to one embodiment of the present document, the pen input device (e.g., pen input device (50) of FIG. 4) placed in the first recess (e.g., first recess (401) of FIG. 7) is not exposed to the outside in the unfolded state of the foldable housing (e.g., foldable housing (20) of FIG. 2), but can be exposed to the outside in the folded state of the foldable housing.

[0126] According to one embodiment of the present document, the hinge housing (e.g., the hinge housing (40) of FIG. 7) may further include a second recess (e.g., the second recess (402) of FIG. 7) located inside the electronic device, separated from the first recess by a first wall (e.g., the first wall (411) of FIG. 7). The hinge housing may further include a third recess (e.g., the third recess (403) of FIG. 7) located inside the electronic device, separated from the second recess by a second wall (e.g., the second wall (412) of FIG. 7). The first wall and the second wall may face each other with the first recess in between.

[0127] According to one embodiment of the present document, the hinge housing (e.g., the hinge housing (40) of FIG. 7) may further include a third wall (e.g., the third wall (413) of FIG. 7) connecting the first wall (e.g., the first wall (411) of FIG. 7) and the second wall (e.g., the second wall (412) of FIG. 7). When the pen input device (e.g., the pen input device (50) of FIG. 4) is placed in the first recess (e.g., the first recess (401) of FIG. 7), the first wall (411), the second wall (412), and the third wall may face the side of the pen input device.

[0128] According to one embodiment of the present document, the electronic device (e.g., the electronic device (2) of FIG. 2) may further include a flexible printed circuit board (e.g., the electrical path (800) of FIG. 7) located within the foldable housing. The flexible printed circuit board may include a first part corresponding to the folding part (e.g., the first part (811) of FIG. 7), a second part (e.g., the second part (812) of FIG. 7) extending from the first part to the first housing (e.g., the first housing (21) of FIG. 2), and a third part (e.g., the third part (813) of FIG. 7) extending from the first part to the second housing (e.g., the second housing (22) of FIG. 2).

[0129] According to one embodiment of the present document, the first region of the first part (e.g., the first region (ⓐ) of FIG. 7) may be positioned facing the third wall (e.g., the third wall (413) of FIG. 7). In the unfolded state of the foldable housing (e.g., the foldable housing (20) of FIG. 2), the second region of the first part (e.g., the second region (ⓑ) of FIG. 7) may be positioned in the second recess (e.g., the second recess (402) of FIG. 7), and the third region of the first part (e.g., the third region (ⓒ) of FIG. 7) may be positioned in the third recess (e.g., the third recess (403) of FIG. 7).

[0130] According to one embodiment of the present document, in a folded state of the foldable housing (e.g., the foldable housing (20) of FIG. 2), the second region (e.g., the second region (ⓑ) of FIG. 9) may be positioned outside the second recess (e.g., the second recess (402) of FIG. 9), and the third region (e.g., the third region (ⓒ) of FIG. 9) may be positioned outside the third recess (e.g., the third recess (403) of FIG. 9).

[0131] According to one embodiment of the present document, the electronic device (e.g., the electronic device (2) of FIG. 2) may further include an adhesive material located between the first region (e.g., the first region (ⓐ) of FIG. 7) and the third wall (e.g., the third wall (413) of FIG. 7).

[0132] According to one embodiment of the present document, the first region (e.g., the first region (ⓐ) of FIG. 7) may be rigid.

[0133] According to one embodiment of the present document, the electronic device (e.g., the electronic device (2) of FIG. 2) may further include a flexible display (e.g., the flexible display (30) of FIG. 7) located within the foldable housing (e.g., the foldable housing (20) of FIG. 2). The foldable housing may include a first surface (e.g., the first surface (20A) of FIG. 2), a second surface located opposite to the first surface (e.g., the second surface (20B) of FIG. 2), and sides (e.g., the first side (20C), the second side (20D) of FIG. 2) surrounding the space between the first surface and the second surface. The flexible display may be visually exposed through the first surface. The foldable housing may be formed such that the first surface folds inward.

[0134] According to one embodiment of the present document, the pen input device (e.g., the pen input device (1100) of FIG. 11) can have its length reduced.

[0135] According to one embodiment of the present document, the electronic device (e.g., the electronic device (2) of FIG. 2) may further include a resilient structure that elastically contacts the pen input device and the hinge housing while positioned in the first recess (e.g., the first recess (401) of FIG. 10, 12, 13, or 15).

[0136] According to one embodiment of the present document, the elastic structure may be located on the pen input device (e.g., see the example of FIG. 10 or the example of FIG. 12).

[0137] According to another embodiment of the present document, the elastic structure may be located in the hinge housing (e.g., see the example of FIG. 13 or the example of FIG. 15).

[0138] According to one embodiment of the present document, the device may further include a device (e.g., a cam assembly (1501) and a guide groove structure (1502) of FIG. 15) that prevents the pen input device from being separated from the first recess when the pen input device is placed in the first recess, and keeps the pen input device in a state where it can be separated from the first recess when user input is detected.

[0139] According to one embodiment of the present document, the pen input device may include an EMR (electromagnetic resonance) method, an AES (active electrical stylus) method, or an ECR (electric coupled resonance) method.

[0140] According to one embodiment of the present document, an electronic device (e.g., the electronic device (2) of FIG. 2) may include a first housing (e.g., the first housing (21) of FIG. 2), a second housing (e.g., the second housing (22) of FIG. 2), and a foldable housing (e.g., the foldable housing (20) of FIG. 2) including a folding portion between the first housing and the second housing. The electronic device may include a pen input device (e.g., the pen input device (50) of FIG. 4) that is detachable from the folding portion. The folding portion (e.g., the hinge assembly (630) of FIG. 5) may include a first hinge (e.g., the first hinge (631) of FIG. 5) and a second hinge (e.g., the second hinge (632) of FIG. 5) connecting the first housing and the second housing, and a hinge housing (e.g., the hinge housing (40) of FIG. 6) that covers the first hinge and the second hinge and can form a part of the outer surface of the electronic device. The hinge housing may include a first recess (e.g., the first recess (401) of FIG. 7) in which the pen input device can be placed, and the first recess (401) may be located between the first hinge and the second hinge. The hinge housing may include a second recess (e.g., the second recess (402) of FIG. 7) separated from the first recess by a first wall (e.g., the first wall (411) of FIG. 7) between them, and the second recess may be located inside the electronic device. The hinge housing may include a third recess (e.g., the third recess (403) of FIG. 7) separated from the first recess by a second wall (e.g., the second wall (412) of FIG. 7) between them, and the third recess may be located inside the electronic device. The first wall and the second wall may face each other with the first recess between them.

[0141] According to one embodiment of the present document, the electronic device (e.g., the electronic device (2) of FIG. 2) may further include a flexible printed circuit board (e.g., the electrical path (800) of FIG. 7) located within the foldable housing. The flexible printed circuit board may include a first part corresponding to the folding part (e.g., the first part (811) of FIG. 7), a second part (e.g., the second part (812) of FIG. 7) extending from the first part to the first housing (e.g., the first housing (21) of FIG. 2), and a third part (e.g., the third part (813) of FIG. 7) extending from the first part to the second housing (e.g., the second housing (22) of FIG. 2).

[0142] According to one embodiment of the present document, the hinge housing (e.g., the hinge housing (40) of FIG. 7) may further include a third wall (e.g., the third wall (413) of FIG. 7) connecting the first wall (e.g., the first wall (411) of FIG. 7) and the second wall (e.g., the second wall (412) of FIG. 7). When the pen input device (e.g., the pen input device (50) of FIG. 4) is placed in the first recess (e.g., the first recess (401) of FIG. 7), the first wall (411), the second wall (412), and the third wall (413) may face the side surface of the pen input device. A first region of the first part (e.g., the first region (ⓐ) of FIG. 7) may be positioned facing the third wall. In the unfolded state of the foldable housing, the second region of the first part (e.g., the second region (ⓑ) of FIG. 7) may be located in the second recess (e.g., the second recess (402) of FIG. 7), and the third region of the first part (e.g., the third region (ⓒ) of FIG. 7) may be located in the third recess (e.g., the third recess (403) of FIG. 7).

[0143] According to one embodiment of the present document, in a folded state of the foldable housing, the second region (e.g., the second region (ⓑ) of FIG. 9) may be positioned outside the second recess (e.g., the second recess (402) of FIG. 9), and the third region (e.g., the third region (ⓒ) of FIG. 9) may be positioned outside the third recess (e.g., the third recess (403) of FIG. 9).

[0144] According to one embodiment of the present document, the pen input device placed in the first recess (e.g., the first recess (401) of FIG. 7) is not exposed to the outside in the unfolded state of the foldable housing, but can be exposed to the outside in the folded state of the foldable housing.

[0145] The embodiments disclosed in this document and drawings are provided merely as specific examples to facilitate the explanation of the technical content according to the embodiments and to aid in understanding the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of the various embodiments of this document should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments, in addition to the embodiments disclosed herein. Explanation of the symbols

[0147] 700: Cross-sectional structure 300: Display assembly 30: Flexible display 703: Electromagnetic Induction Panel 611: First support structure 612: Second support structure 641: First support plate 642: Second support plate 651: First cover part 652: Second cover part 40: Hinge housing 401: First Recess 402: Second Recess 403: Third Recess 800: Electrical path

Claims

Claim 1 An electronic device comprises a foldable housing including a first housing, a second housing, and a folding portion between the first housing and the second housing; An electronic device comprising a pen input device detachably attached to the folding portion, wherein the folding portion comprises a first hinge and a second hinge connecting the first housing and the second housing, and a hinge housing capable of covering the first hinge and the second hinge and forming a portion of the outer surface of the electronic device, wherein the hinge housing comprises a first recess positioned between the first hinge and the second hinge and capable of accommodating the pen input device, and when the pen input device is disposed in the first recess of the hinge housing, a portion of the pen input device is exposed to the outside in the folded state of the foldable housing to form the outer surface of the electronic device together with the hinge housing, and wherein the hinge housing and a portion of the pen input device are not exposed to the outside by the first housing and the second housing in the unfolded state of the foldable housing. Claim 2 delete Claim 3 In claim 1, the hinge housing further comprises: a second recess located inside the electronic device, separated from the first recess by a first wall; and a third recess located inside the electronic device, separated from the second recess by a second wall, wherein the first wall and the second wall face each other with the first recess in between. Claim 4 In claim 3, the hinge housing further comprises a third wall connecting the first wall and the second wall, and when the pen input device is placed in the first recess, the first wall, the second wall, and the third wall face the lateral surface of the pen input device. Claim 5 An electronic device according to claim 4, further comprising a flexible printed circuit board positioned within the foldable housing, wherein the flexible printed circuit board comprises a first portion corresponding to the folding portion, a second portion extending from the first portion to the first housing, and a third portion extending from the first portion to the second housing, wherein a first region of the first portion is positioned facing the third wall, and in the unfolded state of the foldable housing, the second region of the first portion is positioned in the second recess and the third region of the first portion is positioned in the third recess. Claim 6 In claim 5, an electronic device in which, in the folded state of the foldable housing, the second region is positioned outside the second recess and the third region is positioned outside the third recess. Claim 7 An electronic device according to claim 5, further comprising an adhesive material located between the first region and the third wall. Claim 8 In claim 5, the first region is a rigid electronic device. Claim 9 The electronic device according to claim 1 further comprises a flexible display located within the foldable housing, wherein the foldable housing comprises a first surface, a second surface located opposite to the first surface, and a side surrounding the space between the first surface and the second surface, the flexible display being visually exposed through the first surface, and the foldable housing being formed such that the first surface folds inward. Claim 10 In claim 1, the pen input device is an electronic device capable of reducing its length. Claim 11 An electronic device according to claim 1, further comprising a resilient structure that elastically contacts the pen input device disposed in the first recess and the hinge housing. Claim 12 In claim 11, the elastic structure is an electronic device located in the pen input device. Claim 13 In claim 11, the elastic structure is an electronic device located in the hinge housing. Claim 14 An electronic device according to claim 1, further comprising a device that prevents the pen input device from being separated from the first recess when the pen input device is placed in the first recess, and keeps the pen input device in a state where it can be separated from the first recess when user input is detected. Claim 15 In claim 1, the pen input device is an electronic device including an EMR (electro magnetic resonance) method, an AES (active electrical stylus) method, or an ECR (electric coupled resonance) method. Claim 16 An electronic device comprises: a foldable housing including a first housing, a second housing, and a folding portion between the first housing and the second housing; and a pen input device detachably attached to the folding portion, wherein the folding portion includes a first hinge and a second hinge connecting the first housing and the second housing, and a hinge housing capable of covering the first hinge and the second hinge and forming a portion of the outer surface of the electronic device, wherein the hinge housing includes a first recess located between the first hinge and the second hinge and capable of accommodating the pen input device, and a second recess located inside the electronic device, separated from the first recess by a first wall. An electronic device comprising a third recess located inside the electronic device, separated from the second recess by a second wall, wherein the first wall and the second wall face each other with the first recess in between, and when the pen input device is placed in the first recess of the hinge housing, a part of the pen input device is exposed to the outside in the folded state of the foldable housing to form the outer surface of the electronic device together with the hinge housing, and the hinge housing and a part of the pen input device are not exposed to the outside by the first housing and the second housing in the unfolded state of the foldable housing. Claim 17 An electronic device according to claim 16, further comprising a flexible printed circuit board positioned within the foldable housing, wherein the flexible printed circuit board comprises a first portion corresponding to the folding portion, a second portion extending from the first portion to the first housing, and a third portion extending from the first portion to the second housing. Claim 18 In claim 17, the hinge housing further comprises a third wall connecting the first wall and the second wall, and when the pen input device is placed in the first recess, the first wall, the second wall, and the third wall face the lateral surface of the pen input device, and a first region of the first part is positioned facing the third wall, and in the unfolded state of the foldable housing, a second region of the first part is positioned in the second recess, and a third region of the first part is positioned in the third recess, an electronic device. Claim 19 In claim 18, an electronic device in which, in the folded state of the foldable housing, the second region is positioned outside the second recess and the third region is positioned outside the third recess. Claim 20 delete

Images